CN202025795U - Directly-conductive and heat-dissipating LED and electronic device made by combining same - Google Patents
Directly-conductive and heat-dissipating LED and electronic device made by combining same Download PDFInfo
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- CN202025795U CN202025795U CN2011200472358U CN201120047235U CN202025795U CN 202025795 U CN202025795 U CN 202025795U CN 2011200472358 U CN2011200472358 U CN 2011200472358U CN 201120047235 U CN201120047235 U CN 201120047235U CN 202025795 U CN202025795 U CN 202025795U
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- placement section
- type cooling
- metal material
- base material
- radiating part
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility module discloses a directly-conductive and heat-dissipating LED and an electronic device made by combining the same. The directly-conductive and heat-dissipating LED comprises a substrate, a first metal material, a second metal material, at least one luminous wafer and a packaging part, wherein the first and second materials are wrapped in the substrate; a placement part and a heat dissipating part are formed on the first metal material without being wrapped by the substrate, and are respectively arranged on two surfaces of the substrate; an electrical connecting part is formed on the second metal material without being wrapped by the substrate; the electrical connecting part and the placement part are arranged in an adjacent manner and are separated by at least one separating strip; and the luminous wafer is arranged on the placement part and is in routing connection with the electrical connecting part. Accordingly, the directly-conductive mode is adopted in the LED, heat quantity generated by the lighted luminous wafer is transmitted to the heat dissipating part via the placement part to realize heat dissipation, so that the heat dissipating efficiency is greatly upgraded.
Description
Technical field
This case is relevant with the back light source structure field of display, particularly about a kind of as the large-sized monitor backlight, and can significantly promote the direct leading type cooling LED structure of radiating effect, and the applied electronic installation of making in conjunction with this direct leading type cooling LED of large scale display module.
Background technology
The LCD volume is compact, is used in various demonstrations field in recent years in a large number, and replaces the display of conventional cathode ray tube gradually.
LCD mainly is divided into Liquid Crystal Module and backlight module (being called backlight again) two parts, and this backlight module is arranged at the back side of this Liquid Crystal Module, because the liquid crystal molecule of this Liquid Crystal Module itself is not luminous, must be dependent on this backlight module so produce the required light of image, be one of important key that determines with this backlight module this LCD image quality.
It is that (another is light-emitting diode (light-emittingdiode, LED) backlight module to cathode fluorescent tube for Cold CathodeFluorescent Lamp, CCFL) backlight module that the most normal at present adopted backlight module type has two: one.Because the CCFL backlight module has that the fluorescent tube volume is little, surface temperature is low, brightness is high, and be easy to be processed into different shape advantages such as (as: straight tube shape, L shaped, U type, annulars etc.).Start because of the LED manufacturing technology significantly promotes in another kind of LED-backlit source, and when being applied to LCD and volume is significantly reduced, and the brightness of LED is better than the CCFL fluorescent tube, longer service life.Moreover, CCFL backlight and LED-backlit source are applied to the color representation power aspect of display, and the LED-backlit source outclass the CCFL backlight, and the CCFL backlight originally just has the problem of colorimetric purity, so color range is performed poor, cause display aspect gray scale and color transition, to be not so good as traditional CRT monitor.Test according to reality, adopt the CCFL backlight can only realize 78% NTSC (NationalTelevision Standards Committee, National Television System Committee) color area, and using the LED-backlit source can obtain to surpass 100% NTSC color area like a cork, GuLEDBei Guangyuan has significant advantage.
So, at as: large-scale electronic installations such as the display of desktop computer, LCD TV or electronic board, use large-sized monitor or be spliced, so employed LED-backlit source relative area also strengthens by a plurality of large-sized monitors.And this kind LED-backlit source is spliced by a plurality of luminescence units, this each luminescence unit by the good base material coated with conductive metal of insulation effect after, the rim of a cup structure that formation exposes so that a luminescent wafer is arranged on this rim of a cup, coats this rim of a cup with encapsulating material more at last and forms.Because this luminescence unit can produce heat when shinny, and along with the heat that increase produced of power output also improves, the problem that heat then can cause heat to decline as the words of not dispersing in good time, the brightness of this luminescent wafer is affected, be how to promote the shinny effect of this luminescence unit, and the radiating effect when taking into account it and using, be the target of people in the industry's ongoing effort always.
Therefore, this creator provides a kind of direct leading type cooling LED structure, and can be applicable on large-sized display module to use as backlight, with one first metal material through modes such as machining or chemical processes, after it is located at a base material, and be formed with a placement section and a radiating part that is coated, and this radiating part is positioned at the outside of this base material, and with respect to the position of this placement section, one luminescent wafer is located on this placement section and is connected with other one second metal material routing of side, when this luminescent wafer of driving is shinny, the heat that it produced can be directly conducted to this radiating part by this placement section, significantly promoted the radiating effect when using,, also be not easy to take place the heat phenomenon that declines with respect to when long-time the use.
Summary of the invention
One purpose of this creation aims to provide a kind of direct leading type cooling LED, in order to do the backlight purposes that is applied to the large scale display module, and can significantly promote radiating effect when using, to reduce the heat chance that phenomenon produces that declines.
For reaching above-mentioned purpose, the direct leading type cooling LED of this creation, as the employed backlight of a large scale display module, and this backlight is straight-down negative or the setting of side entering type aspect compared to a display floater, it comprises: a base material, have one first accommodation space and at least one second accommodation space, this first accommodation space and this second accommodation space are separated by at least one parting bead, and a periphery of this base material is provided with a ring barricade; One first metal material is located in this first accommodation space and is formed with a placement section and a radiating part, and this placement section and this radiating part are not coated and be divided into its two by this base material, and this placement section is corresponding to the position of this radiating part; At least one second metal material is located at this second accommodation space and is formed with a power part, and this power part do not coated by this base material and with this placement section near be provided with; At least one luminescent wafer is located at this placement section and is connected with this power part routing, and the heat that is produced when this luminescent wafer is shinny is directly conducted to this radiating part by this placement section and disperses; And an encapsulation, fill and be located in this base material, for coating this luminescent wafer in it.
In view of the above, this creation is when lighting use, the heat that this luminescent wafer sent, can directly see through this placement section and conduct to this radiating part, so that heat is dispersed fast to the external world, for the backlight that is used in the large scale display module, not only can significantly promote the stability when using, and can help to reduce the heat that is taken place when this luminescent wafer the uses phenomenon that declines.
Wherein, this first metal material has one first electric pin, and this second metal material has one second electric pin, and this first electric pin and this second electric pin and this radiating part are located at the same one side of this base material, so that install and use.
Moreover, this creates the advantage when implementing for further exposure, and with this second metal material during with polymorphic enforcement, wherein, these second metal materials all have one second electric pin, and these second electric pins and this radiating part are located at the same one side of this base material, and these power parts of these second metal materials are arranged at two sides of this placement section respectively.Moreover, be polymorphic luminescent wafer when having many electrodes as this luminescent wafer, and these electrodes are electrically connected with these power parts respectively.Again or when this luminescent wafer during with polymorphic enforcement, and these luminescent wafers have pair of electrodes respectively, and these electrodes are electrically connected with these power parts respectively.And the heat that can this polymorphic luminescent wafer and this a plurality of luminescent wafer be produced by this placement section of this creation is directly conducted to this radiating part and disperses fast, and helps to keep the optimum state when using.
Wherein, in order to reduce manufacturing cost, this first metal material punch forming of this placement section of this creation and this radiating part and making, and make this placement section form recessed brilliant cup-shaped attitude, and this radiating part is to should placement section and form the projection form of protrusion, the property made height, manufacturing speed reach advantages such as die cost is lower soon because punch forming has again, so can effectively reduce manufacturing cost.
In addition, for the fully scope of application and the place of the direct leading type cooling LED of this creation, it is mainly used in the electronic installation with large scale display module, to use as its backlight, those electronic installations are the display or a LCD TV of a desktop computer or are an e-advertising billboard etc.
The useful technique effect that the utility model reaches is: the diode utilization of this creation is the mode of conduction directly, and the heat that this luminescent wafer is produced when shinny connects by this placement section and conducts to this radiating part and disperse, significantly to promote its radiating efficiency.The applied electronic installation of making in conjunction with this direct leading type cooling LED of large scale display module can obtain best display effect.
Description of drawings
Fig. 1 creates the structural representation of first embodiment for this;
Fig. 2 creates the section radiating state schematic diagram of first embodiment for this;
Fig. 3 creates the structural representation in the second embodiment front for this;
Fig. 4 creates the structural representation of the second embodiment reverse side for this;
Fig. 5 implements the structural representation in aspect front for this another kind of creating second embodiment;
Fig. 6 implements the structural representation of aspect reverse side for this another kind of creating second embodiment.
Description of reference numerals
First embodiment
1-direct leading type cooling LED; The 11-base material; 111-first accommodation space; 112-second accommodation space; The 113-parting bead; 114-encircles barricade; 12-first metal material; The 121-placement section; The 122-radiating part; 123-first electric pin; 13-second metal material; The 131-power part; 132-second electric pin; The 14-luminescent wafer; The 15-encapsulation.
Second embodiment
2-direct leading type cooling LED; The 21-base material; The 211-parting bead; 22-first metal material; The 221-placement section; The 222-radiating part; 23-second metal material; The 231-power part; 232-second electric pin; The 24-luminescent wafer; The 241-electrode; The 25-encapsulation.
Embodiment
For making the auditor can know the content of understanding this creation, it is graphic sincerely to arrange in pairs or groups in the following instructions, please consult.
See also Fig. 1,2, for this creates structural representation and the section radiating state schematic diagram thereof of first embodiment.As shown in FIG., the direct leading type cooling LED 1 of this creation, mainly as the employed backlight of a large scale display module, and this backlight is straight-down negative or the setting of side entering type aspect compared to a display floater, and this direct leading type cooling LED 1 comprises a base material 11, one first metal material 12, one second metal material 13, a luminescent wafer 14 and an encapsulation 15.
Wherein this base material 11 is selected the good plastic material of insulation effect for use and is made, its these base material 11 inside have one first accommodation space 111 and one second accommodation space 112, this first accommodation space 111 and this second accommodation space 112 are separated by a parting bead 113, and are provided with a ring barricade 114 in a periphery of this base material 11.
This first metal material 12 is located in this first accommodation space 111 and is formed with a placement section 121 and a radiating part 122, this placement section 121 and this radiating part 122 not coat by this base material 11 and be divided into its two, this placement section 121 is positioned at this base material 11 inside, this radiating part 122 is positioned at the outside of this base material 11, and this placement section 121 is corresponding to the position of this radiating part 122.Moreover this first metal material 12 also has one first electric pin 123, and this first electric pin 123 and this radiating part 122 are located at the same one side of this base material 11.In addition, this placement section 121 and 122 these first metal material, 12 punch formings of this radiating part and make, and make this placement section 121 form recessed brilliant cup-shaped attitude, and 122 pairs of this radiating parts should placement section 121 and form the projection form of protruding.
This second metal material 13 is located at this second accommodation space 112 and is formed with a power part 131, and this power part 131 do not coated by this base material 11 and with this placement section 121 neighbour settings.Moreover this second metal material 13 has one second electric pin 132, and same and this radiating part 122 of this second electric pin 132 is located at the same one side of this base material 11, and this first electric pin 123 and this second electric pin 132 are divided into this base material 11 2 sides.
This luminescent wafer 14 is located at this placement section 121 and is connected with these power part 131 routings, and the heat that this luminescent wafer 14 is produced when shinny is directly conducted to this radiating part 122 by this placement section 121 and disperses.
This encapsulation 15 is filled and is located in this ring barricade 114 of this base material 11, for coating this luminescent wafer 14 in it.
Moreover, see also Fig. 3,4, for this creates the structural representation of the second embodiment positive and negative.As shown in FIG., the direct leading type cooling LED 2 of this second embodiment has comprised a base material 21, one first metal material 22, a plurality of second metal material 23, a plurality of luminescent wafer 24 and an encapsulation 25 equally.Identical compared to first example structure, only these second metal materials 23 of this second embodiment are with polymorphic enforcement, and these second metal materials 23 have a power part 231 and one second electric pin 232 respectively, these power parts 231 are arranged at two sides of a placement section 221 of this first metal material 22 respectively, be spaced from each other by a parting bead 211 between these power parts 231 and this placement section 221, these second electric pins 232 are located at the same one side of this base material 21 with a radiating part 222 of this first metal material 22.Moreover and after these luminescent wafers 24 are located at this placement section 221, and these luminescent wafers 24 have pair of electrodes 241 respectively, and these electrodes 241 are connected with these power part 231 routings respectively again.See also Fig. 5,6 again, implement the structural representation of aspect positive and negative for this another kind of creating second embodiment.Wherein this luminescent wafer 24 is separated with these power parts 231 by a plurality of parting beads 211, and this luminescent wafer 24 is positioned on this placement section 221 for polymorphic luminescent wafer 24, when this polymorphic luminescent wafer 24 has many electrodes 241, and these electrodes 241 are electrically connected with these power parts 231 respectively.When it uses, will these a plurality of luminescent wafers 24 and the heat that produced of this polymorphic luminescent wafer 24 by this placement section 221, be directly conducted to this radiating part 222 and disperse fast.
To sum up, in view of the above, this direct leading type cooling LED 1,2 of this creation is when lighting use, these luminescent wafer 14,24 heats that sent, can directly see through this placement section 121,221 and conduct to this radiating part 122,222, so that heat is dispersed fast to the external world, for the backlight that is used in the large scale display module, the stability when using not only can be significantly promoted, and the heat that is taken place when this luminescent wafer 14,24 the uses phenomenon that declines can be helped to reduce.In addition, this direct leading type cooling LED 1,2 of this creation can be applicable to have in the electronic installation of large scale display module, to use as backlight, those electronic installations are the display or a LCD TV of a desktop computer or are e-advertising billboard etc., and can obtain best display effect.
More than be illustrative to description of the present utility model, and nonrestrictive, other are as the material of this base material, shape or size etc., or the material of this metal material or quantity etc., or be the material selected for use of this luminescent wafer or quantity etc., also all among the category of this case; Those skilled in the art is understood, and the spirit and the interior of scope that limit in claim can carry out many modifications, variation or equivalence to it, but they all will fall in the protection range of the present utility model.
Claims (10)
1. a direct leading type cooling LED is characterized in that, as the employed backlight of a large scale display module, and this backlight is straight-down negative or the setting of side entering type aspect compared to a display floater, and it comprises:
One base material has one first accommodation space and at least one second accommodation space, and this first accommodation space and this second accommodation space are separated by at least one parting bead, and a periphery of this base material is provided with a ring barricade;
One first metal material is located in this first accommodation space and is formed with a placement section and a radiating part, and this placement section and this radiating part are not coated and be divided into its two by this base material, and this placement section is corresponding to the position of this radiating part;
At least one second metal material is located at this second accommodation space and is formed with a power part, and this power part do not coated by this base material and with this placement section near be provided with;
At least one luminescent wafer is located at this placement section and is connected with this power part routing, and the heat that is produced when this luminescent wafer is shinny is directly conducted to this radiating part by this placement section and disperses; And
One encapsulation is filled and is located in this base material, for coating this luminescent wafer in it.
2. direct leading type cooling LED as claimed in claim 1, it is characterized in that, this first metal material has one first electric pin, and this second metal material has one second electric pin, and this first electric pin and this second electric pin and this radiating part are located at the same one side of this this base material.
3. direct leading type cooling LED as claimed in claim 1, it is characterized in that, when this second metal material during with polymorphic enforcement, wherein, these second metal materials all have one second electric pin, and these second electric pins and this radiating part are located at the same one side of this base material.
4. direct leading type cooling LED as claimed in claim 3 is characterized in that, these power parts of these second metal materials are arranged at two sides of this placement section respectively.
5. direct leading type cooling LED as claimed in claim 4 is characterized in that, this luminescent wafer is that the polymorphic luminescent wafer has many electrodes, and these electrodes are electrically connected with these power parts respectively.
6. direct leading type cooling LED as claimed in claim 4 is characterized in that, when this luminescent wafer during with polymorphic enforcement, wherein, these luminescent wafers have pair of electrodes respectively, and these electrodes are electrically connected with these power parts respectively.
7. direct leading type cooling LED as claimed in claim 1, it is characterized in that, this first metal material punch forming of this placement section and this radiating part and making, this placement section forms recessed brilliant cup-shaped attitude, and this radiating part is to should placement section and form the projection form of protrusion.
8. wherein each described direct leading type cooling LED and the applied electronic installation of large scale display module made of combination such as claim 1 to 7, it is characterized in that: this electronic installation is the display of a desktop computer.
9. wherein each described direct leading type cooling LED and the applied electronic installation of large scale display module made of combination such as claim 1 to 7, it is characterized in that: this electronic installation is a LCD TV.
10. wherein each described direct leading type cooling LED and the applied electronic installation of large scale display module made of combination such as claim 1 to 7, it is characterized in that: this electronic installation is an e-advertising billboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200472358U CN202025795U (en) | 2011-02-24 | 2011-02-24 | Directly-conductive and heat-dissipating LED and electronic device made by combining same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200472358U CN202025795U (en) | 2011-02-24 | 2011-02-24 | Directly-conductive and heat-dissipating LED and electronic device made by combining same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202025795U true CN202025795U (en) | 2011-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200472358U Expired - Lifetime CN202025795U (en) | 2011-02-24 | 2011-02-24 | Directly-conductive and heat-dissipating LED and electronic device made by combining same |
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| Country | Link |
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| CN (1) | CN202025795U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110022666A (en) * | 2013-11-22 | 2019-07-16 | 奇鋐科技股份有限公司 | Portable electric device heat-sink unit |
| US10788869B2 (en) | 2013-12-11 | 2020-09-29 | Asia Vital Components Co., Ltd. | Heat-conducting case unit for handheld electronic device |
-
2011
- 2011-02-24 CN CN2011200472358U patent/CN202025795U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110022666A (en) * | 2013-11-22 | 2019-07-16 | 奇鋐科技股份有限公司 | Portable electric device heat-sink unit |
| US10788869B2 (en) | 2013-12-11 | 2020-09-29 | Asia Vital Components Co., Ltd. | Heat-conducting case unit for handheld electronic device |
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| C14 | Grant of patent or utility model | ||
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| CX01 | Expiry of patent term | ||
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Granted publication date: 20111102 |