WO2020063712A1 - Led显示单元组及显示面板 - Google Patents

Led显示单元组及显示面板 Download PDF

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Publication number
WO2020063712A1
WO2020063712A1 PCT/CN2019/108030 CN2019108030W WO2020063712A1 WO 2020063712 A1 WO2020063712 A1 WO 2020063712A1 CN 2019108030 W CN2019108030 W CN 2019108030W WO 2020063712 A1 WO2020063712 A1 WO 2020063712A1
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WO
WIPO (PCT)
Prior art keywords
led light
light emitting
pole
display unit
unit group
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Application number
PCT/CN2019/108030
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English (en)
French (fr)
Inventor
顾峰
刘传标
秦快
范凯亮
Original Assignee
佛山市国星光电股份有限公司
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Application filed by 佛山市国星光电股份有限公司 filed Critical 佛山市国星光电股份有限公司
Priority to KR1020217009709A priority Critical patent/KR102495024B1/ko
Priority to US17/281,433 priority patent/US12100690B2/en
Publication of WO2020063712A1 publication Critical patent/WO2020063712A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment

Definitions

  • the embodiments of the present application relate to LED display technologies, such as an LED display unit group and a display panel.
  • LED light-emitting diode
  • LCDs liquid crystal displays
  • DLP digital light processing
  • indoor small-pitch LED display pixel unit density requirements are getting higher and higher, that is, the pixel unit pitch is getting smaller and smaller.
  • FIG. 1 is a front wiring diagram of a related art light emitting unit.
  • each light emitting unit includes an insulating substrate 10 and four metal pads. , One anode pin, three cathode pins, and three color chips of red, green, and blue.
  • the three LED chips are fixed on the first die-bonding pad 11, the second die-bonding pad 12, and the third die, respectively.
  • the anodes of the three LED chips are connected to the common anode pad 14, and are connected to the anode pins on the back of the insulating substrate 10 through metal vias; the cathodes of the three LED chips are connected to their respective cathodes.
  • the LED chips on the second die-bonding pad 12 and the third die-bonding pad 13 are vertical chips, and the cathode is directly fixed to the second die-bonding pad 12 and the third die-bonding through a conductive material, respectively.
  • the second die-bonding pad 12 and the third die-bonding pad 13 are simultaneously used as the cathode pads of the two chips thereon, and a part of the first die-bonding pad 11 is used as the cathode pads of the chip thereon,
  • the three cathode pads are respectively connected to three cathode pins on the back of the insulating substrate through metal vias. It can be seen from FIG.
  • the area of the die-bonding pad set to fix the LED chip is relatively large, and the four metal pads and metal traces occupy most of the area of the front surface of the insulating substrate 10.
  • the reduction in size will lead to an increase in line resistance; at the same time, due to the high density of light-emitting units on the display panel and the excessive number of pins, it is difficult to control the design and layout of circuit circuits by the PCB board factory in the subsequent panel manufacturing process, resulting in a high degree of complexity. Poor stability. Therefore, it is difficult to reduce the size of the light emitting unit. Therefore, it is difficult for the light emitting unit using the related technology to realize an LED display with a pixel unit pitch of 1.0 mm or less.
  • the present application provides an LED display unit group and a display panel, which avoids the situation that the structure of the light emitting unit in the related art cannot reduce the size of the display unit. On the premise of ensuring reliability and low cost, LEDs with a pixel unit pitch of 1.0 mm or less are realized. Display.
  • an embodiment of the present application provides an LED display unit group including an insulating substrate, a front circuit board on a front surface of the insulating substrate, and a back circuit board on a back surface of the insulating substrate.
  • Metal vias on the back circuit board; the front circuit board is divided into 2m rows and 2n columns of pixel areas.
  • Each pixel area includes a first A pole pad, a second A pole pad, and a third A Electrode pads, three LED light emitting chips of different light emitting colors, and B pole pads corresponding to the three LED light emitting chips of different light emitting colors; wherein the three LED light emitting chips of different light emitting colors are first LEDs, respectively Light-emitting chip, second LED light-emitting chip, and third LED light-emitting chip, each of said LED light-emitting chips includes A and B poles with opposite polarities, n is a positive integer greater than or equal to 1, and m is a greater than or equal to 1.
  • the A poles of the three LED light emitting chips are electrically connected to the corresponding A pole pads; the B poles of the three LED light emitting chips are electrically connected to the corresponding B pole pads; the pixels in the same column region All LED chips emitting a corresponding electrode pad electrically connected to B; the same row in a pixel region, LED chips emitting the same light emission color corresponding to the A electrode pads are electrically connected.
  • the thickness of the front circuit board is 0.1 mm-0.3 mm.
  • the back circuit board includes 6m A-pole pins and 2n common B-pole pins; in the same pixel area, the A-pole pads corresponding to the LED light-emitting chips of the same light-emitting color are electrically connected to the The A pole pins corresponding to the same light emitting color LED light emitting chip in the row pixel area are electrically connected; in the same column pixel area, the B pole pads corresponding to all the LED light emitting chips are electrically connected, and a total of B corresponding to the pixel area in the column The pole pins are electrically connected.
  • the B-pole pads corresponding to the three LED light-emitting chips are different parts of the first metal pad, and the B-poles of the three LED light-emitting chips are respectively corresponding to the corresponding first metal pad.
  • the different parts are electrically connected.
  • the B pole pads corresponding to all the LED light emitting chips are different parts of the second metal pad, and the B poles of all the LED light emitting chips are different from the corresponding second metal pads, respectively. Partial electrical connection.
  • the A-pole pads corresponding to the LED light-emitting chips of the same emission color are different parts of the third metal pad, and the third metal pads are arranged along the row direction.
  • the second metal pad is directly connected to the common B-pole pin corresponding to the pixel region of the column through a metal via.
  • the third metal pad is directly electrically connected to the corresponding A-pole pin through a metal via, or extends to the back circuit board through the metal via, and is connected to the corresponding The A pole pin is electrically connected.
  • the front surface of the insulating substrate is provided with a first identification mark for position identification.
  • an ink layer is provided in at least one of the adjacent pixel regions and the adjacent pixel regions.
  • the three LED light emitting chips with different light emitting colors include a red LED light emitting chip, a green LED light emitting chip, and a blue LED light emitting chip.
  • an insulating layer is provided on the back of the insulating substrate, and the insulating layer covers the back metal traces of the back circuit board and metal vias electrically connected to the metal traces.
  • a second identification mark is provided on the back of the insulating substrate to identify the polarity of the pins.
  • the insulating layer includes two different-colored insulating materials, and the dividing line between the two different-colored insulating materials divides the insulating layer into two different-color portions to form a second identification mark.
  • an embodiment of the present invention further provides a display panel including the LED display unit group according to any one of the first aspect of the present invention.
  • 1 is a front wiring diagram of a light emitting unit in the related art
  • FIG. 2 is a front view of an LED display unit group according to an embodiment of the present application.
  • FIG. 3 is a schematic circuit structure diagram of an LED display unit group according to an embodiment of the present application.
  • FIG. 4 is a wiring diagram of a front circuit board in an LED display unit group according to an embodiment of the present application.
  • FIG. 5 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application.
  • FIG. 6 is a wiring diagram of a rear circuit board of the LED display unit group in FIG. 5;
  • FIG. 7 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application.
  • FIG. 8 is a wiring diagram of a rear circuit board of the LED display unit group in FIG. 7;
  • FIG. 9 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application.
  • FIG. 10 is a wiring diagram of a rear circuit board of the LED display unit group in FIG. 9;
  • FIG. 11 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application.
  • FIG. 12 is a wiring diagram of a rear circuit board of the LED display unit group in FIG. 11;
  • FIG. 13 is a top view of an LED light emitting unit group according to an embodiment of the present application.
  • orientation words such as "up, down, top, and bottom" are usually used for the directions shown in the drawings or for vertical, vertical, or The description of the positional relationship of the components in the direction of gravity.
  • FIG. 2 is a front view of an LED display unit group according to an embodiment of the present application.
  • the LED display unit group includes an insulating substrate 100 and The front wiring board 200 on the front of the substrate and the back wiring board 300 on the back of the insulating substrate.
  • the insulating substrate 100 is provided with metal vias for connecting the front wiring board 200 and the back wiring board 300.
  • the front circuit board is divided into 2m rows and 2n columns of pixel areas, where n and m are both positive integers greater than or equal to 1.
  • n and m are both positive integers greater than or equal to 1.
  • the LED light emitting chips may all be flip-chip LED chips, including A pole and B pole; the polarities of A pole and B pole are opposite, and A pole and B pole are located on the side opposite to the light emitting side of the LED light emitting chip.
  • the A pole and the B pole of the light emitting chip are respectively fixed on the A pole pad and the B pole pad through a conductive material.
  • the anode of the A chip and the cathode of the B chip are described as examples.
  • the corresponding A pole pads are anode pads and the B pole pads are Cathode pad.
  • FIG. 3 is a schematic diagram of a circuit structure of an LED display unit group according to an embodiment of the present application.
  • each pixel area includes three LED light emitting chips of different light emitting colors, which are sequentially the first LED light emitting chip. 101.
  • the cathodes of all the LED light emitting chips in the two pixel regions are connected together.
  • the anodes of two first LED light emitting chips 101 are connected together; the anodes of two second LED light emitting chips 102 are connected together; and the anodes of two third LED light emitting chips 103 are connected together.
  • FIG. 4 is a wiring diagram of a front circuit board in an LED display unit group according to an embodiment of the present application.
  • the LED display unit group includes four pixel areas P arranged in an array, and each pixel area P includes a first anode pad 201, a second anode pad 202, a third anode pad 203, and a first metal pad 204, and three LED light emitting chips of different light emitting colors, which are the first LEDs, respectively.
  • the light emitting chip 101, the second LED light emitting chip 102, and the third LED light emitting chip 103 are the first LEDs, respectively.
  • the anodes of the three LED light emitting chips are electrically connected to the corresponding anode pads respectively, that is, the anode of the first LED light emitting chip 101 is fixed on the first anode pad 201 by a conductive material, and the second LED emits light.
  • the anode of the chip 102 is fixed to the second anode pad 202 by a conductive material, and the anode of the third LED light emitting chip 103 is fixed to the third anode pad 203 by a conductive material; the cathodes of the three LED light emitting chips are all connected to the first metal pad 204 is electrically connected, that is, the cathode pads corresponding to the three LED light emitting chips are different parts of the first metal pad 204, and the cathodes of the three LED light emitting chips are respectively fixed to different parts of the corresponding first metal pad 204 through conductive materials. .
  • the cathode pads may also be in the form of three separate cathode pads electrically connected. In each pixel area, the cathodes of the three LED light emitting chips are electrically connected to the corresponding cathode pads, respectively. The three cathode pads are electrically connected.
  • the common cathode pads corresponding to all the LED light-emitting chips in the same column of pixel areas are electrically connected and connected to the common cathode pins corresponding to the pixel units in the column; in the same row of pixel areas, the anode welding corresponding to the same light-emitting color LED light-emitting chips
  • the panel is electrically connected, and is electrically connected to the corresponding anode pin of the same LED light emitting chip in the row of pixel units.
  • the common cathode pads corresponding to all the LED light-emitting chips in a certain pixel region may be electrically connected to the common cathode pins corresponding to the pixel units in the column; in a pixel region of a row, the The anode pad corresponding to the LED light emitting chip is electrically connected to the anode pin corresponding to the LED light emitting chip of the same light emitting color in the row of pixel units.
  • four separate light-emitting units require 16 pins.
  • a display unit group includes four light-emitting units, but the number of pins is greatly reduced.
  • the LED display unit group provided in the embodiment of the present application packages 2m ⁇ 2n pixel areas together to form a display unit group.
  • Each pixel area includes a first A-pole pad, a second A-pole pad, and a third A pole pads, and three LED light emitting chips with different light emitting colors, and B pole pads corresponding to three LED light emitting chips with different light emitting colors, and the B pole pads corresponding to all LED light emitting chips in the same pixel region.
  • Connection; in the pixel area of the same row the A pole pads of the same light emitting color LED chip are electrically connected.
  • the thickness of the front circuit board is 0.1-0.3 mm.
  • the front circuit board is formed by etching the metal foil located on the front surface of the insulating substrate. Because the metal foil is thick, the accuracy of the line width of the etched circuit board is poor, and it is applied to small-pitch display screens (for example, the pixel pitch is less than 1.0mm). When the display unit is displayed, it is easy to cause the line string and the improper position of the solid crystal to cause the LED light-emitting chip to be firmly fixed.
  • the surface of the metal foil is etched to reduce the thickness of the metal foil; after the metal vias are drilled and electroplated with copper to form metal vias, the metal foil is etched again Surface, reducing copper thickness.
  • the accuracy of etching can be improved.
  • the accuracy of the line width of the front circuit board after etching is high, and the thickness of the front circuit board formed after etching is 0.1-0.3 mm. In the related art, the thickness of the front circuit board is 0.3-0.5 mm.
  • FIG. 5 is a wiring diagram of a front circuit board in another LED display unit group provided by an embodiment of the present application.
  • the cathodes corresponding to all LED light-emitting chips The pads are different parts of the second metal pad 205, and the cathodes of all the LED light emitting chips are electrically connected to different parts of the corresponding second metal pad 205, respectively.
  • the second metal pads 205 are elongated and distributed along the column direction. In each pixel region, three anode pads are arranged parallel to the second metal pad 205 in the column direction, and are located on the same side of the second metal pad 205.
  • the cathodes of all the first LED light-emitting chips 101, the second LED light-emitting chips 102, and the third LED light-emitting chips 103 in the same pixel region are fixed at different positions of the corresponding second metal pads 205 through conductive materials.
  • the anodes of the first LED light emitting chip 101, the second LED light emitting chip 102, and the third LED light emitting chip 103 are fixed to the first anode pad 201, the second anode pad 202, and the third electrode by a conductive material, respectively.
  • all the cathode pads are arranged in a “1” shape along the column direction. Side edge area, the anode pad is located between the two columns of cathode pads.
  • FIG. 6 is a wiring diagram of the rear circuit board of the LED display unit group in FIG. 5.
  • the rear circuit board includes 6 anode pins and 2 common cathode pins.
  • the first anode pads 201 of the two pixel areas are electrically connected and electrically connected to the first anode pins corresponding to the corresponding row of pixel areas;
  • the second anode pads 202 of the two pixel areas are electrically connected.
  • And is electrically connected to the second anode pin corresponding to the corresponding row pixel area;
  • the third anode pad 203 of the two pixel areas is electrically connected, and is electrically connected to the third anode pin corresponding to the corresponding row pixel area.
  • the second metal pads 205 in each column of pixel regions are directly connected to the common cathode pins corresponding to the corresponding column of pixel regions through metal vias.
  • the anode pads of two LED light-emitting chips of the same light emission color are different parts of the third metal pad, and the third metal pad is along the row direction.
  • the third metal pad is in a strip shape or an approximately strip shape and is arranged along the row direction.
  • the two first anode pads 201 are two ends of the third metal pad.
  • the second anode pad 202 and the third anode pad 203 are similar to the first anode pad 201, and are not described herein again.
  • the third metal pad is electrically connected directly to the corresponding anode pin through a metal via, or extends to the back circuit board through the metal via, and is electrically connected to the corresponding anode pin through a metal trace on the back circuit board.
  • the third metal pad where the two first anode pads 201 are located passes through a metal via located in the middle of the third metal pad.
  • the first anode pin 311 directly corresponding to the pixel region of the row is electrically connected; the third metal pad where the two second anode pads 202 are located extends through the metal via to the back circuit board 300 and passes through the back circuit board 300
  • the first metal trace 341 is electrically connected to the second anode pin 312 corresponding to the pixel region of the row; the third metal pad where the two third anode pads 203 are extended to the back circuit board 300 through metal vias, and
  • the second metal trace 342 on the rear circuit board 300 is electrically connected to the third anode pin 313 corresponding to the pixel region of the row.
  • the third metal pads where the two first anode pads 201 are located extend to the back circuit board 300 through metal vias, and pass through the third metal trace 343 on the back circuit board 300 to the row.
  • the first anode pin 321 corresponding to the pixel area is electrically connected;
  • the third metal pad where the two second anode pads 202 are located extends to the back circuit board 300 through a metal via, and passes through the fourth metal on the back circuit board 300
  • the trace 344 is electrically connected to the second anode pin 322 corresponding to the pixel region of the row;
  • the third metal pad where the two third anode pads 203 are located is directly connected to the third metal pad through a metal via in the middle of the third metal pad.
  • the first anode pin 323 corresponding to the row pixel region is electrically connected.
  • the second metal pads 205 where all the cathode pads are located are directly connected to the common cathode pins 331 corresponding to the pixel regions of the column through metal vias; in the second column of pixel regions, all the cathode pads are electrically connected.
  • the second metal pad 205 is directly connected to the common cathode pin 332 corresponding to the pixel region of the column through a metal via.
  • the eight pins are evenly distributed along the edge region of the back circuit board 300, and the two common cathode pins 331 and 332 are respectively located in the areas where two opposite corners of the back circuit board 300 are located.
  • FIG. 7 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application
  • FIG. 8 is a wiring diagram of a rear circuit board in the LED display unit group in FIG. 7.
  • the two ends of the third metal pad fix the position of the LED light emitting chip, that is, the anode pads 201, 202, and 203 are slightly larger than other areas, or are bent at a certain angle to facilitate the fixing of the LED light emitting chip.
  • FIG. 9 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application.
  • FIG. 10 is a wiring diagram of a back circuit board in the LED display unit group in FIG. 9. Referring to FIGS. 9 and 10, The metal vias on the second metal pad 205 are located in the middle of the second metal pad 205.
  • the second metal pad 205 is electrically connected directly to the common cathode pin through the metal via, and the two common cathode pins 331 and 332 are located
  • the edge region of the back circuit board is located on the bisector of two rows of pixel regions, and is arranged symmetrically with respect to the column bisector of the pixel regions.
  • FIG. 11 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application
  • FIG. 12 is a wiring diagram of a rear circuit board in the LED display unit group in FIG. 11.
  • the first anode pads 201 of the two first LED light emitting chips 101 are different parts of the same metal pad, and the metal pads are passed through the metal.
  • the holes are directly connected to the corresponding first anode pins 311; the second anode pads 202 of the two second LED light emitting chips 102 respectively extend to the back circuit board through metal vias, and pass through the fifth metal on the back circuit board.
  • the line 345 is electrically connected to the corresponding second anode pin 312; the third anode pads 203 of the two third LED light-emitting chips 103 respectively extend to the back circuit board through metal vias, and are routed through the sixth metal on the back circuit board.
  • the line 346 is electrically connected to the corresponding third anode pin 313.
  • the first anode pads 201 of the two first LED light emitting chips 101 respectively extend to the back circuit board through metal vias, and the seventh metal trace 347 on the back circuit board and the corresponding first
  • the anode pin 321 is electrically connected;
  • the second anode pads 202 of the two second LED light emitting chips 102 respectively extend to the back circuit board through metal vias, and the eighth metal trace 348 on the back circuit board and the corresponding second
  • the anode pins 322 are electrically connected;
  • the third anode pads 203 of the two third LED light emitting chips 103 are different parts of the same metal pad, and the metal pads are directly electrically connected to the corresponding third anode pins 323 through metal vias. .
  • the second metal pads 205 where all the cathode pads are located are directly connected to the common cathode pins 331 corresponding to the pixel regions of the column through metal vias; in the second column of pixel regions, all the cathode pads are electrically connected.
  • the second metal pad 205 is directly connected to the common cathode pin 332 corresponding to the pixel region of the column through a metal via.
  • the front surface of the insulating substrate 100 is provided with a first identification mark 110 for position identification, and the first identification mark 110 may be located on the insulation substrate 100. Some edge area of the front.
  • a clamping tool to fix the insulating substrate including the circuit board at a certain position. For example, after the first identification mark is fixed to the right, the fixed crystal position is avoided. Something went wrong.
  • the first identification mark 110 is set to quickly identify whether the position of the insulating substrate is correct.
  • FIG. 13 is a plan view of an LED light emitting unit group provided in an embodiment of the present application.
  • an ink layer 120 is provided between adjacent row pixel regions and adjacent column pixel regions.
  • the ink can be black ink or other inks with darker colors, which are formed by inkjet printing technology to improve the contrast of the surface of the device, thereby improving the degree of fidelity of display colors.
  • an ink layer may be provided only between pixel regions of adjacent rows or an ink layer may be provided only between pixel regions of adjacent columns.
  • the metal via is filled with a first insulating material, and the first insulating material does not exceed the upper and lower surfaces of the insulating substrate.
  • the first insulating material includes resin or green oil.
  • the first insulating material does not exceed the upper and lower surfaces of the insulating substrate.
  • the three LED light emitting chips with different light emitting colors are a red LED light emitting chip, a green LED light emitting chip, and a blue LED light emitting chip.
  • the first LED light-emitting chip, the second LED light-emitting chip, and the third LED light-emitting chip can be red, green, and blue LED light-emitting chips, respectively; they can also be blue, green, and Red LED light-emitting chip; other arrangements are also possible, which are not limited in this application.
  • an insulating layer is provided on the back of the insulating substrate 100, and the insulating layer covers the back metal traces of the back circuit board and metal vias electrically connected to the back metal traces.
  • the material of the insulation layer includes white oil, resin, or green oil, etc., for the purpose of insulation and protection.
  • a second identification mark is provided on the back of the insulating substrate 100 for identifying the polarity of the pins.
  • the insulating layer includes two different colors of insulating materials 401 and 402, such as white oil and green oil. The dividing line of the two different colors of insulating materials 401 and 402 divides the insulating layer into two different colors. Partly, a second identification mark for identifying the polarity of the pin is formed.
  • an insulating layer (such as white oil) may be coated on the insulating substrate 100 to cover the back metal traces on the back circuit board and metal vias electrically connected to the back metal traces.
  • an insulating material such as green oil
  • an insulating material such as green oil
  • Half of the surface is coated with green oil, and the dividing line between white oil and green oil divides the back of the LED display unit group into two parts with different colors to form identification marks as shown in FIGS. 6, 8 and 10.
  • An embodiment of the present application further provides a display panel including the LED display unit group described in any of the foregoing embodiments of the present application.

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Abstract

一种LED显示单元组，包括绝缘基板（100）、正面线路板（200）和背面线路板（300），绝缘基板（100）上设有用于连接正面线路板（200）与背面线路板（300）的金属过孔；正面线路板（200）划分成2m行、2n列阵列排布的像素区域（P），每个像素区域（P）包括三个A极焊盘（201，202，203），三个不同发光颜色的LED发光芯片（101，102，103），以及与三个不同发光颜色的LED发光芯片（101，102，103）对应的B极焊盘（205）；每个像素区域（P）中，三个LED发光芯片（101，102，103）的A极分别与对应的A极焊盘（201，202，203）电连接；三个LED发光芯片（101，102，103）的B极分别与对应的B极焊盘电（205）连接；同一列像素区域（P）中所有LED发光芯片（101，102，103）对应的B极焊盘（205）电连接；同一行像素区域（P）中，相同发光颜色的LED发光芯片（101，102，103）对应的A极焊盘（201，202，203）电连接。

Description

LED显示单元组及显示面板
本申请要求在2018年9月30日提交中国专利局、申请号为201811162175.7的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及LED显示技术，例如一种LED显示单元组及显示面板。
背景技术
随着室内显示应用技术不断提高，室内小间距发光二极管(Light Emitting Diode，LED)显示屏成为未来主要的技术拓展空间，为取代液晶显示器(Liquid Crystal Display，LCD)、数字光处理(Digital Light Processing，DLP)室内高清显示产品，室内小间距LED显示屏的像素单元密度要求越来越高，即要求像素单元间距越来越小。
LED显示屏由阵列排布的多个独立的LED发光单元构成，图1是相关技术的发光单元的正面布线图，如图1所示，每个发光单元包括绝缘基板10、四个金属焊盘、一个阳极引脚、三个阴极引脚和红、绿、蓝三种颜色的LED芯片，三个LED芯片分别固定在第一固晶焊盘11、第二固晶焊盘12和第三固晶焊盘13上，三个LED芯片的阳极连接到共阳极焊盘14上，并通过金属过孔与绝缘基板10背面的阳极引脚连接；三个LED芯片的阴极分别连接至各自的阴极焊盘，并与各自的阴极引脚连接。在图1中，第二固晶焊盘12和第三固晶焊盘13上的LED芯片为垂直型芯片，分别通过导电材料直接将阴极固定在第二固晶焊盘12和第三固晶焊盘13上，第二固晶焊盘12和第三固晶焊盘13同时作为其上两个芯片的阴极焊盘，第一固晶焊盘11的一部分作为其上芯片的阴极焊盘，三个阴极焊盘分别通过金属过孔与绝缘基板背面的三个阴极引脚连接。从图1中可以看出，设置为固定LED芯片的固晶焊盘面积较大，四个金属焊盘和金属走线占据了绝缘基板10正面的绝大部分面积，焊盘和金属走线的尺寸缩小将导致线阻增加；同时由于显示面板上发光单元密集度高，引脚数量过多，导致后续面板制作过程中，PCB板厂对电路线路的设计排布难以控制，复杂程度高，导致稳定性差。因此发光单元的尺寸难以缩小，因此，采用相关技术的发光单元难以实现像素单元间距1.0mm以下的LED显示屏。
发明内容
本申请提供一种LED显示单元组及显示面板，避免了相关技术中的发光单元结构无法缩小显示单元尺寸的情况，在保证可靠性和低成本的前提下，实现像素单元间距1.0mm以下的LED显示屏。
第一方面，本申请实施例提供了一种LED显示单元组，包括绝缘基板、位于绝缘基板正面的正面线路板和位于绝缘基板背面的背面线路板，绝缘基板上设有用于连接正面线路板与背面线路板的金属过孔；正面线路板划分成2m行、2n列阵列排布的像素区域，每个像素区域包括一个第一A极焊盘、一个第二A极焊盘和一个第三A极焊盘，三个不同发光颜色的LED发光芯片，以及与所述三个不同发光颜色的LED发光芯片对应的B极焊盘；其中，三个不同发光颜色的LED发光芯片分别为第一LED发光芯片、第二LED发光芯片和第三LED发光芯片，每个所述LED发光芯片包括极性相反的A极和B极，n为大于或等于1的正整数，m为大于或等于1的正整数；每个像素区域中，三个LED发光芯片的A极分别与对应的A极焊盘电连接；三个LED发光芯片的B极分别与对应的B极焊盘电连接；同一列像素区域中所有LED发光芯片对应的B极焊盘电连接；同一行像素区域中，相同发光颜色的LED发光芯片对应的A极焊盘电连接。
在一实施例中，正面线路板的厚度为0.1mm-0.3mm。
在一实施例中，背面线路板包括6m个A极引脚和2n个共B极引脚；同一行像素区域中，相同发光颜色的LED发光芯片对应的A极焊盘电连接，并与该行像素区域中该相同发光颜色的LED发光芯片对应的A极引脚电连接；同一列像素区域中，所有LED发光芯片对应的B极焊盘电连接，并与该列像素区域对应的共B极引脚电连接。
在一实施例中，每个像素区域中，三个LED发光芯片对应的B极焊盘为第一金属焊盘的不同部分，三个LED发光芯片的B极分别与对应的第一金属焊盘的不同部分电连接。
在一实施例中，同一列像素区域中，所有LED发光芯片对应的B极焊盘为第二金属焊盘的不同部分，所有LED发光芯片的B极分别与对应的第二金属焊盘的不同部分电连接。
在一实施例中，n＝1，m＝1；同一列像素区域中，所有B极焊盘沿列方向呈“1”字型排布，两列B极焊盘分别位于正面线路板上相对两侧的边缘区域，A 极焊盘位于两列B极焊盘之间。
在一实施例中，同一行像素区域中，相同发光颜色的LED发光芯片对应的A极焊盘为第三金属焊盘的不同部分，第三金属焊盘沿行方向排布。
在一实施例中，第二金属焊盘通过金属过孔直接与该列像素区域对应的共B极引脚电连接。
在一实施例中，第三金属焊盘通过金属过孔直接与对应的A极引脚电连接，或通过金属过孔延伸至背面线路板，并通过背面线路板上的金属走线与对应的A极引脚电连接。
在一实施例中，绝缘基板正面设有用于位置识别的第一识别标记。
在一实施例中，相邻行像素区域之间和相邻列像素区域之间中的至少之一设有油墨层。
在一实施例中，三个不同发光颜色的LED发光芯片包括红色LED发光芯片、绿色LED发光芯片和蓝色LED发光芯片。
在一实施例中，绝缘基板的背面设有绝缘层，绝缘层覆盖背面线路板的背面金属走线和与所述金属走线电连接的金属过孔。
在一实施例中，绝缘基板背面设置有用于识别引脚极性的第二识别标记。
在一实施例中，绝缘层包括两种不同颜色的绝缘材料，两种不同颜色的绝缘材料的分界线将绝缘层分成两个颜色不同的部分，形成第二识别标记。
第二方面，本发明实施例还提供了一种显示面板，包括本发明第一方面任任意所述的LED显示单元组。
附图说明
图1是相关技术中的发光单元的正面布线图；
图2为本申请一实施例提供的一种LED显示单元组的前视图；
图3为本申请一实施例提供的一种LED显示单元组的电路结构示意图；
图4为本申请一实施例提供的一种LED显示单元组中正面线路板的布线图；
图5为本申请一实施例提供的另一种LED显示单元组中正面线路板的布线图；
图6为图5中LED显示单元组的背面线路板的布线图；
图7为本申请一实施例提供的又一种LED显示单元组中正面线路板的布线图；
图8为图7中LED显示单元组的背面线路板的布线图；
图9为本申请一实施例提供的又一种LED显示单元组中正面线路板的布线图；
图10为图9中LED显示单元组的背面线路板的布线图；
图11为本申请一实施例提供的又一种LED显示单元组中正面线路板的布线图；
图12为图11中LED显示单元组的背面线路板的布线图；
图13为本申请一实施例提供的一种LED发光单元组的俯视图。
具体实施方式
在本申请实施例中，在未作相反说明的情况下，使用的方位词如“上、下、顶、底”通常是针对附图所示的方向而言的或者是针对竖直、垂直或重力方向上而言的各部件相互位置关系描述用词。
本申请实施例提供一种LED显示单元组，图2为本申请一实施例提供的一种LED显示单元组的前视图，如图2所示，该LED显示单元组包括绝缘基板100、位于绝缘基板正面的正面线路板200和位于绝缘基板背面的背面线路板300，绝缘基板100上设有用于连接正面线路板200与背面线路板300的金属过孔。
正面线路板划分成2m行、2n列阵列排布的像素区域，其中，n和m均为大于或等于1的正整数，示例性的，在本实施例中以m＝1，n＝1为例，对本申请的方案进行说明。示例性的，LED发光芯片可以均为倒装LED芯片，包括A极和B极；A极和B极的极性相反，A极和B极位于与LED发光芯片发光侧相对的一侧，LED发光芯片的A极和B极通过导电材料分别固定在A极焊盘和B极焊盘上。由于采用倒装芯片，无需连接发光芯片电极和焊盘的键合线，简化了工艺制程，降低了成本。在本实施例中及后续的实施例中，以A极为LED芯片的阳极，B极为LED芯片的阴极为例，对本申请进行说明，相应的A极焊盘为阳极焊盘，B极焊盘为阴极焊盘。
图3为本申请一实施例提供的一种LED显示单元组的电路结构示意图，如图3所示，每个像素区域包括三个不同发光颜色的LED发光芯片，依次分别为第一LED发光芯片101、第二LED发光芯片102和第三LED发光芯片103。每列像素区域中，2个像素区域中的所有LED发光芯片的阴极连接在一起。每行像素区域中，2个第一LED发光芯片101的阳极连接在一起；2个第二LED发 光芯片102的阳极连接在一起；2个第三LED发光芯片103的阳极连接在一起。
图4为本申请一实施例提供的一种LED显示单元组中正面线路板的布线图，如图4所示，该LED显示单元组包括四个阵列排布的像素区域P，每个像素区域P包括一个第一阳极焊盘201、一个第二阳极焊盘202、一个第三阳极焊盘203和一个第一金属焊盘204，以及三个不同发光颜色的LED发光芯片，分别为第一LED发光芯片101、第二LED发光芯片102和第三LED发光芯片103。
每个像素区域中，三个LED发光芯片的阳极分别与对应的阳极焊盘电连接，即：第一LED发光芯片101的阳极通过导电材料固定在第一阳极焊盘201上，第二LED发光芯片102的阳极通过导电材料固定在第二阳极焊盘202，第三LED发光芯片103的阳极通过导电材料固定在第三阳极焊盘203；三个LED发光芯片的阴极均与第一金属焊盘204电连接，即三个LED发光芯片对应的阴极焊盘为第一金属焊盘204的不同部分，三个LED发光芯片的阴极分别通过导电材料固定在对应的第一金属焊盘204的不同部分。需要说明的是，该实施例中，阴极焊盘也可以是三个电连接的单独的阴极焊盘形式，每个像素区域中，三个LED发光芯片的阴极分别与对应的阴极焊盘电连接，三个阴极焊盘电连接。
同一列像素区域中所有LED发光芯片对应的共阴极焊盘电连接，并与该列像素单元对应的共阴极引脚电连接；同一行像素区域中，相同发光颜色的LED发光芯片对应的阳极焊盘电连接，并与该行像素单元中该相同发光颜色的LED发光芯片对应阳极引脚电连接。示例性的，可以是其中某一列像素区域中所有LED发光芯片对应的共阴极焊盘电连接，并与该列像素单元对应的共阴极引脚电连接；某一行像素区域中，相同发光颜色的LED发光芯片对应的阳极焊盘电连接，并与该行像素单元中该相同发光颜色的LED发光芯片对应阳极引脚电连接。相关技术中4个单独的发光单元需要16个引脚，而本申请实施例中，一个显示单元组包括4个发光单元，但引脚数量大大减少。
本申请实施例提供的LED显示单元组，将2m×2n个像素区域一起封装，形成一个显示单元组，每个像素区域包括第一A极焊盘、一个第二A极焊盘和一个第三A极焊盘，以及三个不同发光颜色的LED发光芯片，以及与三个不同发光颜色的LED发光芯片对应的B极焊盘，同一列像素区域中所有LED发光芯片对应的B极焊盘电连接；同一行像素区域中，相同发光颜色的LED发光芯片对应的A极焊盘电连接，在后续形成显示面板时，引脚数量减少，简化了PCB线路板的电路设计，在保证可靠性和低成本的前提下，实现像素单元间距1.0mm 以下的LED显示屏。
在一实施例中，正面线路板的厚度为0.1-0.3mm。正面线路板由位于绝缘基板正面的金属箔刻蚀形成，由于该金属箔较厚，刻蚀后的线路板线宽的精度较差，应用到小间距显示屏(例如像素间距1.0mm以下)的显示单元时，容易出现线路串线，以及出现固晶位置不正导致LED发光芯片固定不牢靠的情况。在本申请实施例中，金属箔在进行刻蚀形成正面线路板之前，蚀刻金属箔表面，降低金属箔的厚度；在经过钻孔、电镀铜沉铜形成金属过孔后，再次刻蚀金属箔表面，降低铜厚。如此，在后续刻蚀形成金属线路的过程中，能够提高刻蚀精度，刻蚀后的正面线路板的线宽精度高，刻蚀后形成的正面线路板厚度为0.1-0.3mm。而相关技术中，正面线路板的厚度为0.3-0.5mm。
图5为本申请一实施例提供的另一种LED显示单元组中正面线路板的布线图，如图5所示，在一实施例中，同一列像素区域中，所有LED发光芯片对应的阴极焊盘为第二金属焊盘205的不同部分，所有LED发光芯片的阴极分别与对应的第二金属焊盘205的不同部分电连接。该第二金属焊盘焊盘205呈长条状，沿列方向分布。每个像素区域中，三个阳极焊盘沿列方向与第二金属焊盘205平行排布，且位于第二金属焊盘205的同一侧。
同一列像素区域中所有第一LED发光芯片101、第二LED发光芯片102和第三LED发光芯片103的阴极通过导电材料固定在对应的第二金属焊盘205不同的位置。每个像素区域中，第一LED发光芯片101、第二LED发光芯片102和第三LED发光芯片103的阳极分别通过导电材料固定在第一阳极焊盘201、第二阳极焊盘202和第三阳极焊盘203上。
在一实施例中，如图4和图5所示，同一列像素区域中，所有阴极焊盘沿列方向呈“1”字型排布，两列阴极焊盘分别位于正面线路板上相对两侧的边缘区域，阳极焊盘位于两列阴极焊盘之间。如此的焊盘布置方式，使得LED发光芯片和焊盘的排布紧凑，减少显示单元组的尺寸。
图6为图5中LED显示单元组的背面线路板的布线图，在一实施例中，如图5和图6所示，背面线路板包括6个阳极引脚和2个共阴极引脚。每行像素区域中，2个像素区域的第一阳极焊盘201电连接，并与对应行像素区域对应的第一阳极引脚电连接；2个像素区域的第二阳极焊盘202电连接，并与对应行像素区域对应的第二阳极引脚电连接；2个像素区域的第三阳极焊盘203电连接，并与对应行像素区域对应的第三阳极引脚电连接。每列像素区域中的第二金属 焊盘205通过金属过孔直接与对应列像素区域对应的共阴极引脚电连接。
在一实施例中，参考图4和图5，同一行像素区域中，两个相同发光颜色的LED发光芯片的阳极焊盘为第三金属焊盘的不同部分，第三金属焊盘沿行方向排布。以第一行像素区域为例，第三金属焊盘呈长条状或近似长条状，沿行方向布置，两个第一阳极焊盘201为第三金属焊盘的两个端部。第二阳极焊盘202和第三阳极焊盘203与第一阳极焊盘201类似，在此不再赘述。
第三金属焊盘通过金属过孔直接与对应的阳极引脚电连接，或通过金属过孔延伸至背面线路板，并通过背面线路板上的金属走线与对应的阳极引脚电连接。在一实施例中，如图5和图6所示，第一行像素区域中，两个第一阳极焊盘201所在的第三金属焊盘通过位于该第三金属焊盘中间的金属过孔直接与该行像素区域对应的第一阳极引脚311电连接；两个第二阳极焊盘202所在的第三金属焊盘通过金属过孔延伸至背面线路板300，并通过背面线路板300上的第一金属走线341与该行像素区域对应的第二阳极引脚312电连接；两个第三阳极焊盘203所在的第三金属焊盘通过金属过孔延伸至背面线路板300，并通过背面线路板300上的第二金属走线342与该行像素区域对应的第三阳极引脚313电连接。第二行像素区域中，两个第一阳极焊盘201所在的第三金属焊盘通过金属过孔延伸至背面线路板300，并通过背面线路板300上的第三金属走线343与该行像素区域对应的第一阳极引脚321电连接；两个第二阳极焊盘202所在的第三金属焊盘通过金属过孔延伸至背面线路板300，并通过背面线路板300上的第四金属走线344与该行像素区域对应的第二阳极引脚322电连接；两个第三阳极焊盘203所在的第三金属焊盘通过位于该第三金属焊盘中间的金属过孔直接与该行像素区域对应的第一阳极引脚323电连接。第一列像素区域中，所有阴极焊盘所在的第二金属焊盘205通过金属过孔直接与该列像素区域对应的共阴极引脚331电连接；第二列像素区域中，所有阴极焊盘所在的第二金属焊盘205通过金属过孔直接与该列像素区域对应的共阴极引脚332电连接。8个引脚沿背面线路板300的边缘区域均匀分布，两个共阴极引脚331和332分别位于背面线路板300相对的两个角所在的区域。
需要说明的是，上述实施例中阳极焊盘所在的金属焊盘也可以是近似长条状，每个引脚的位置也可根据金属过孔的位置不同而相应变化。图7为本申请一实施例提供的又一种LED显示单元组中正面线路板的布线图，图8为图7中LED显示单元组的背面线路板的布线图。如图7所示，第三金属焊盘的两端固 定LED发光芯片的位置，即阳极焊盘201、202和203比其他区域稍大，或弯曲一定的角度，便于LED发光芯片的固定。金属焊盘上设置金属过孔的位置可以比其他区域稍大，方便钻孔。如图7和图8所示，由于第二金属焊盘205上金属过孔的位置变化，从而共阴极引脚331和332的位置由其中两个对角所在的区域变为另外两个对角所在的区域，进而导致阳极引脚312和322的位置变化。图9为本申请一实施例提供的又一种LED显示单元组中正面线路板的布线图，图10为图9中LED显示单元组的背面线路板的布线图，参考图9和图10，第二金属焊盘205上的金属过孔位于第二金属焊盘205的中间位置，第二金属焊盘205通过金属过孔直接与共阴极引脚电连接，两个共阴极引脚331和332位于背面线路板的边缘区域，位于两行像素区域的平分线上，且关于像素区域的列平分线对称设置。
图11为本申请一实施例提供的又一种LED显示单元组中正面线路板的布线图，图12为图11中LED显示单元组的背面线路板的布线图。在一实施例中，在该实施例中，第一行像素区域中，两个第一LED发光芯片101的第一阳极焊盘201为同一金属焊盘的不同部分，该金属焊盘通过金属过孔直接与对应的第一阳极引脚311电连接；两个第二LED发光芯片102的第二阳极焊盘202分别通过金属过孔延伸至背面线路板，通过背面线路板上的第五金属走线345与对应的第二阳极引脚312电连接；两个第三LED发光芯片103的第三阳极焊盘203分别通过金属过孔延伸至背面线路板，通过背面线路板上的第六金属走线346与对应的第三阳极引脚313电连接。
第二行像素区域中，两个第一LED发光芯片101的第一阳极焊盘201分别通过金属过孔延伸至背面线路板，通过背面线路板上的第七金属走线347与对应的第一阳极引脚321电连接；两个第二LED发光芯片102的第二阳极焊盘202分别通过金属过孔延伸至背面线路板，通过背面线路板上的第八金属走线348与对应的第二阳极引脚322电连接；两个第三LED发光芯片103的第三阳极焊盘203为同一金属焊盘的不同部分，金属焊盘通过金属过孔直接与对应的第三阳极引脚323电连接。
第一列像素区域中，所有阴极焊盘所在的第二金属焊盘205通过金属过孔直接与该列像素区域对应的共阴极引脚331电连接；第二列像素区域中，所有阴极焊盘所在的第二金属焊盘205通过金属过孔直接与该列像素区域对应的共阴极引脚332电连接。
在一实施例中，参考图4、5、9和11，在上述实施例中，绝缘基板100的正面设有用于位置识别的第一识别标记110，该第一识别标记110可以位于绝缘基板100正面的某一边缘区域。在将LED发光芯片固定到正面线路板200上的过程中，需要采用夹持工具将包括线路板的绝缘基板以一定的位置固定，例如固定后第一识别标记统一朝向正右，避免固晶位置出错。第一识别标记110设置为快速识别绝缘基板的位置是否正确。
图13为本申请实施例提供的一种LED发光单元组的俯视图，如图13所示，在一实施例中，相邻行像素区域之间和相邻列像素区域之间设有油墨层120，该油墨可以为黑色油墨或其他颜色较深的油墨，采用喷墨打印技术形成，提高器件表面的对比度，进而提高显示色彩逼真程度。此外，在一些实施例中，可以仅在相邻行像素区域之间设置油墨层或者仅在相邻列像素区域之间设置油墨层。
在一实施例中，金属过孔内填充有第一绝缘材料，第一绝缘材料不超出绝缘基板的上下表面。第一绝缘材料包括树脂或绿油，第一绝缘材料的不超出绝缘基板的上下表面，这样填充的好处在于在后面器件封装的时候，增大封装材料与绝缘基板100的接触面积，从而加强封装材料与绝缘基板100的结合力，提高密封性能。
在一实施例中，三个不同发光颜色的LED发光芯片为红色LED发光芯片、绿色LED发光芯片和蓝色LED发光芯片。为适应PCB板上不同的走线需求，第一LED发光芯片、第二LED发光芯片和第三LED发光芯片可以分别是红色、绿色和蓝色LED发光芯片；也可以分别是蓝色、绿色和红色LED发光芯片；也可以是其他排列方式，本申请在此不做限定。
在一实施例中，绝缘基板100的背面设有绝缘层，绝缘层覆盖背面线路板的背面金属走线和与背面金属走线的电连接的金属过孔。绝缘层的材料包括白油、树脂或绿油等，起到绝缘和保护作用。
在一实施例中，绝缘基板100背面设置有用于识别引脚极性的第二识别标记。在本申请实施例中，绝缘层包括两种不同颜色的绝缘材料401和402，例如白油和绿油，两种不同颜色的绝缘材料401和402的分界线将绝缘层分成两个颜色不同的部分，形成用于识别引脚极性的第二识别标记。在本申请另一实施例中，可以先在绝缘基板100上涂布一层绝缘层(例如白油)，覆盖背面线路板的背面金属走线和与背面金属走线的电连接的金属过孔，然后在绝缘层表面涂布一种与绝缘层颜色差异较大的绝缘材料(例如绿油)，其形状可以是三角形或 其他具有识别引脚极性的形状；也可以在绝缘层(白油)表面的一半区域涂布绿油，白油和绿油的分界线将LED显示单元组的背面分成两个颜色不同的部分，形成如图6、8和10所示的识别标记。
本申请实施例还提供了一种显示面板，包括本申请上述实施例中任意所述的LED显示单元组。

Claims (16)

  1. 一种LED显示单元组，包括绝缘基板、位于所述绝缘基板正面的正面线路板和位于所述绝缘基板背面的背面线路板，所述绝缘基板上设有用于连接所述正面线路板与背面线路板的金属过孔；
    所述正面线路板划分成2m行、2n列阵列排布的像素区域，每个像素区域包括一个第一A极焊盘、一个第二A极焊盘和一个第三A极焊盘，三个不同发光颜色的LED发光芯片，以及与所述三个不同发光颜色的LED发光芯片对应的B极焊盘；其中，三个不同发光颜色的LED发光芯片分别为第一LED发光芯片、第二LED发光芯片和第三LED发光芯片，每个所述LED发光芯片包括极性相反的A极和B极，n为大于或等于1的正整数，m为大于或等于1的正整数；
    每个像素区域中，三个LED发光芯片的A极分别与对应的A极焊盘电连接；三个LED发光芯片的B极分别与对应的B极焊盘电连接；
    同一列像素区域中所有LED发光芯片对应的B极焊盘电连接；
    同一行像素区域中，相同发光颜色的LED发光芯片对应的A极焊盘电连接。
  2. 根据权利要求1所述的LED显示单元组，其中，所述正面线路板的厚度为0.1mm-0.3mm。
  3. 根据权利要求1所述的LED显示单元组，其中，所述背面线路板包括6m个A极引脚和2n个共B极引脚；
    同一行像素区域中，相同发光颜色的LED发光芯片对应的A极焊盘电连接，并与该行像素区域中该相同发光颜色的LED发光芯片对应的A极引脚电连接；
    同一列像素区域中，所有LED发光芯片对应的B极焊盘电连接，并与该列像素区域对应的共B极引脚电连接。
  4. 根据权利要求3所述的LED显示单元组，其中，每个所述像素区域中，三个LED发光芯片对应的B极焊盘为第一金属焊盘的不同部分，三个LED发光芯片的B极分别与对应的第一金属焊盘的不同部分电连接。
  5. 根据权利要求3所述的LED显示单元组，其中，同一列像素区域中，所有LED发光芯片对应的B极焊盘为第二金属焊盘的不同部分，所有LED发光芯片的B极分别与对应的第二金属焊盘的不同部分电连接。
  6. 根据权利要求4或5所述LED显示单元组，其中，n＝1，m＝1；
    同一列像素区域中，所有B极焊盘沿列方向呈“1”字型排布，两列B极焊盘分别位于所述正面线路板上相对两侧的边缘区域，所述A极焊盘位于所述两列B极焊盘之间。
  7. 根据权利要求6所述LED显示单元组，其中，同一行像素区域中，相同发光颜色的LED发光芯片对应的A极焊盘为第三金属焊盘的不同部分，所述第三金属焊盘沿行方向排布。
  8. 根据权利要求5所述LED显示单元组，其中，所述第二金属焊盘通过金属过孔直接与该列像素区域对应的共B极引脚电连接。
  9. 根据权利要求7所述LED显示单元组，其中，所述第三金属焊盘通过金属过孔直接与对应的A极引脚电连接，或通过金属过孔延伸至背面线路板，并通过背面线路板上的金属走线与对应的A极引脚电连接。
  10. 根据权利要求1所述的LED显示单元组，其中，所述绝缘基板正面设有用于位置识别的第一识别标记。
  11. 根据权利要求1所述的LED显示单元组，其中，相邻行像素区域之间和相邻列像素区域之间中的至少之一设有油墨层。
  12. 根据权利要求1所述LED显示单元组，其中，所述三个不同发光颜色的LED发光芯片包括红色LED发光芯片、绿色LED发光芯片和蓝色LED发光芯片。
  13. 根据权利要求3所述LED显示单元组，其中，所述绝缘基板的背面设有绝缘层，所述绝缘层覆盖所述背面线路板背面金属走线和与所述背面金属走线电连接的金属过孔。
  14. 根据权利要求13所述LED显示单元组，其中，所述绝缘基板背面设置有用于识别所述引脚极性的第二识别标记。
  15. 根据权利要求14所述LED显示单元组，其中，所述绝缘层包括两种不同颜色的绝缘材料，两种不同颜色的绝缘材料的分界线将所述绝缘层分成两个颜色不同的部分，形成所述第二识别标记。
  16. 一种显示面板，包括权利要求1-15任一项所述的LED显示单元组。
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CN115236910B (zh) * 2022-09-23 2023-01-31 惠科股份有限公司 显示面板及显示装置
CN219677275U (zh) * 2023-03-29 2023-09-12 佛山市国星光电股份有限公司 一种led显示器件及led显示面板以及切分单元组
CN116598297B (zh) * 2023-04-25 2024-03-08 深圳市迈龙迪科技有限公司 一种阻断MinLedRGB芯片光色串扰的集成显示单元及制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6784458B1 (en) * 2003-04-14 2004-08-31 Harvatek Corp. Random partitionable dot matrix LED display
US20100259920A1 (en) * 2009-04-08 2010-10-14 Aussmak Optoelectronics Corp. Light emitting apparatus
CN204102897U (zh) * 2014-08-25 2015-01-14 深圳市奥蕾达科技有限公司 新型cob显示屏封装焊盘结构
CN207425855U (zh) * 2017-08-22 2018-05-29 山东晶泰星光电科技有限公司 一种四连体8引脚型rgb-led封装模组及其显示屏
CN108511431A (zh) * 2018-05-21 2018-09-07 佛山市国星光电股份有限公司 一种led显示单元组及显示面板
CN207925040U (zh) * 2018-01-08 2018-09-28 利亚德光电股份有限公司 发光二极管的连接电路
CN108598071A (zh) * 2018-06-28 2018-09-28 山西高科华兴电子科技有限公司 一种top结构的三基色led模组器件及其制作方法
CN109147584A (zh) * 2018-08-10 2019-01-04 佛山市国星光电股份有限公司 一种led显示单元组及显示面板
CN209015627U (zh) * 2018-08-10 2019-06-21 佛山市国星光电股份有限公司 一种led显示单元组及显示面板

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100786071B1 (ko) 2003-12-08 2007-12-18 엘지전자 주식회사 유기 ｅｌ 소자 및 그의 제조방법
KR200430821Y1 (ko) * 2006-08-29 2006-11-13 송재열 발광다이오드램프 구성체 발열장치
KR20090036743A (ko) * 2007-10-10 2009-04-15 엘지디스플레이 주식회사 유기전계발광소자 및 그 제조방법
JP2010232454A (ja) * 2009-03-27 2010-10-14 Fujifilm Corp 基板とその位置決め方法、光電変換素子とその製造方法及び製造装置、及び太陽電池
CN201708151U (zh) * 2010-01-29 2011-01-12 旭丽电子(广州)有限公司 晶片式发光二极管封装结构
EP2626901A1 (en) 2012-02-10 2013-08-14 Oki Data Corporation Semiconductor light emitting apparatus, image displaying apparatus, mobile terminal, head-up display apparatus, image projector, head-mounted display apparatus, and image forming apparatus
US9613911B2 (en) * 2013-02-06 2017-04-04 The Board Of Trustees Of The University Of Illinois Self-similar and fractal design for stretchable electronics
CN203826384U (zh) * 2014-02-08 2014-09-10 惠州科锐半导体照明有限公司 固态发射器面板
KR20150139660A (ko) * 2014-06-03 2015-12-14 삼성전자주식회사 전자소자 패키지
CN104409620A (zh) * 2014-12-17 2015-03-11 木林森股份有限公司 一种小尺寸led灯珠组及灯珠
CN204927335U (zh) * 2015-08-26 2015-12-30 佛山市国星光电股份有限公司 一种led全彩显示阵列
KR101897007B1 (ko) * 2016-11-08 2018-09-12 주식회사 올릭스 엘이디 패키지
JP6170232B1 (ja) * 2016-08-11 2017-07-26 ルーメンス カンパニー リミテッド Ｌｅｄチップグループのアレイを含むディスプレイモジュール及びその製造方法
CN206497891U (zh) * 2016-11-25 2017-09-15 杭州美卡乐光电有限公司 Led模组和led封装组件
JP6799627B2 (ja) * 2018-02-26 2020-12-16 山東捷潤弘光電科技有限公司 Ｒｇｂ−ｌｅｄパッケージモジュール及びそのディスプレイ
CN108598070B (zh) 2018-06-25 2023-07-18 江苏罗化新材料有限公司 一种双芯片的芯片级led封装结构及其制作方法
CN112639936A (zh) * 2018-09-04 2021-04-09 Ａｇｃ株式会社 透明显示装置、带透明显示装置的玻璃板、带透明显示装置的夹层玻璃以及移动体

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6784458B1 (en) * 2003-04-14 2004-08-31 Harvatek Corp. Random partitionable dot matrix LED display
US20100259920A1 (en) * 2009-04-08 2010-10-14 Aussmak Optoelectronics Corp. Light emitting apparatus
CN204102897U (zh) * 2014-08-25 2015-01-14 深圳市奥蕾达科技有限公司 新型cob显示屏封装焊盘结构
CN207425855U (zh) * 2017-08-22 2018-05-29 山东晶泰星光电科技有限公司 一种四连体8引脚型rgb-led封装模组及其显示屏
CN207925040U (zh) * 2018-01-08 2018-09-28 利亚德光电股份有限公司 发光二极管的连接电路
CN108511431A (zh) * 2018-05-21 2018-09-07 佛山市国星光电股份有限公司 一种led显示单元组及显示面板
CN108598071A (zh) * 2018-06-28 2018-09-28 山西高科华兴电子科技有限公司 一种top结构的三基色led模组器件及其制作方法
CN109147584A (zh) * 2018-08-10 2019-01-04 佛山市国星光电股份有限公司 一种led显示单元组及显示面板
CN209015627U (zh) * 2018-08-10 2019-06-21 佛山市国星光电股份有限公司 一种led显示单元组及显示面板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3945573A1 (en) * 2020-07-27 2022-02-02 Oki Electric Industry Co., Ltd. Light-emitting device, light-emitting display, and image display device
CN113506520A (zh) * 2021-06-22 2021-10-15 安徽精卓光显技术有限责任公司 一种无边缘布线的led透明显示屏及其生产方法

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