WO2020051904A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2020051904A1
WO2020051904A1 PCT/CN2018/105815 CN2018105815W WO2020051904A1 WO 2020051904 A1 WO2020051904 A1 WO 2020051904A1 CN 2018105815 W CN2018105815 W CN 2018105815W WO 2020051904 A1 WO2020051904 A1 WO 2020051904A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
heat
heat sink
conductive layer
thermally conductive
Prior art date
Application number
PCT/CN2018/105815
Other languages
English (en)
Chinese (zh)
Inventor
刘景�
陈松亚
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201880094134.0A priority Critical patent/CN112639671A/zh
Priority to PCT/CN2018/105815 priority patent/WO2020051904A1/fr
Priority to CN201880094124.7A priority patent/CN112640395A/zh
Priority to PCT/CN2018/113954 priority patent/WO2020052028A1/fr
Priority to CN201880094171.1A priority patent/CN112640597A/zh
Priority to PCT/CN2018/114071 priority patent/WO2020052030A1/fr
Publication of WO2020051904A1 publication Critical patent/WO2020051904A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to the field of consumer electronics technology, and more particularly, to an electronic device.
  • An electronic device in the related art such as a mobile phone, includes a first part and a second part.
  • the first part is provided with a motherboard
  • the second part is provided with a battery.
  • the heat generated by the motherboard heat is radiated through the back cover of the first part and the natural convection heat is dissipated, while the heat generated by the battery is heat radiated through the back cover of the second part and the natural convection heat is radiated.
  • the first part and the second part are two separate areas, and the first part cannot transfer heat to the second part to form uniform temperature and heat dissipation, which easily causes the surface temperature of the rear cover of the first part to be higher. This in turn affects the user experience.
  • the invention provides an electronic device.
  • An electronic device includes a first part, a second part, and a flexible heat-conducting layer.
  • the first part includes a first heat sink and a motherboard component, and the motherboard component is thermally connected to one side of the first heat sink.
  • the second part includes a second heat sink and a battery part, the battery part is thermally connected to one side of the second heat sink, and the flexible thermally conductive layer is thermally connected to the first heat sink and the first heat sink. Two heat sinks.
  • the flexible heat conductive layer is thermally connected to the first heat sink and the second heat sink, so that the heat of the motherboard components can be transferred to the second heat sink through the first heat sink and the flexible heat conduction layer for heat dissipation.
  • the heat of the battery component can also be transferred to the first heat sink for heat dissipation through the second heat sink and the flexible heat-conducting layer.
  • FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention.
  • FIG. 2 is a schematic perspective view of an electronic device according to an embodiment of the present invention when it is flattened;
  • FIG. 3 is a schematic perspective view of an electronic device according to an embodiment of the present invention when folded;
  • FIG. 4 is a schematic exploded perspective view of a part of a structure of an electronic device during flattening according to an embodiment of the present invention
  • FIG. 5 is an exploded perspective view of another part of the structure of the electronic device during flattening according to an embodiment of the present invention from another perspective;
  • FIG. 6 is a schematic exploded perspective view of an electronic device according to an embodiment of the present invention when it is flattened;
  • FIG. 7 is another perspective exploded view of the electronic device according to the embodiment of the present invention when it is flattened;
  • FIG. 8 is an exploded perspective view of a part of a structure of an electronic device during flattening according to an embodiment of the present invention.
  • FIG. 9 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention when it is flattened;
  • FIG. 10 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention when it is folded.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
  • the features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “plurality” is two or more, unless specifically defined otherwise.
  • the terms “installation”, “connected”, and “connected” should be understood in a broad sense unless otherwise specified and limited. For example, they may be fixed connections or removable. Connected, or integrated. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
  • the electronic device 100 may be a flexible folding electronic device, such as a flexible folding mobile phone or a flexible folding tablet computer.
  • the electronic device 100 includes a first portion 10, a second portion 20, and a flexible thermally conductive layer 30.
  • the first portion 10 includes a first heat sink 11 and a main board member 12.
  • the motherboard component 12 is thermally connected to one side of the first heat sink 11.
  • the second portion 20 includes a second heat sink 21 and a battery component 22.
  • the battery component 22 is thermally connected to one side of the second heat sink 21.
  • the flexible thermally conductive layer 30 thermally connects the first heat sink 11 and the second heat sink 21. In this way, since the flexible heat conducting layer 30 is thermally connected to the first heat sink 11 and the second heat sink 21, the heat of the motherboard component 12 can be transferred to the second heat sink 21 via the first heat sink 11 and the flexible heat conducting layer 30 for heat dissipation.
  • the heat of the battery component 22 can also be transferred to the first heat sink 11 via the second heat sink 21 and the flexible heat-conducting layer 30 for heat dissipation.
  • the amount of heat generated by the motherboard component 12 or the battery component 22 is large, due to the large heat dissipation area, heat can be better dissipated, thereby preventing local overheating of the electronic device 100, thereby improving the user experience.
  • the flexible heat-conducting layer 30 can transfer heat from the area of the motherboard component 12 to the area of the battery component 22, achieving a better uniform temperature effect.
  • the shape of the electronic device 100 can be set according to specific conditions, for example, it can be rectangular parallelepiped.
  • the electronic device 100 can switch between an unfolded state and a folded state.
  • the electronic device 100 is bent to approximately 180 degrees (as shown in FIGS. 3 and 10)
  • the first portion 10 and the second portion 20 substantially overlap, and the distance between the main board component 12 and the battery component 22 is small. If the flexible heat-conducting layer 30 is not provided, heat dissipation between each other will be affected.
  • a flexible heat conducting layer 30 is provided on the other side of the first heat sink 11 and the other side of the second heat sink 21, and the flexible heat conducting layer 30 can increase the heat dissipation area of the motherboard component 12 and the battery component 22. , Which is conducive to heat dissipation.
  • the first heat radiating body 11 and the second heat radiating body 21 have a large heat radiation area
  • the first heat radiating body 11 can be made into a plate shape
  • the second heat radiating body 21 can be made into a plate shape.
  • the first heat radiating body 11 and the second heat radiating body 21 can be spaced, which is more conducive to heat dissipation.
  • the first heat sink 11 and the second heat sink 21 are close to each other when the electronic device 100 is bent, and are far away from each other when the electronic device 100 is unfolded. In this way, even when the main board part 12 and the battery part 22 are close to each other when the electronic device 100 is bent, the first heat sink 11 and the second heat sink 21 combined with the flexible heat conductive layer 30 can generate heat even if the heat generated by the main board part 12 and the battery part 22 The heat is released, and when the electronic device 100 is deployed, the first heat sink 11 and the second heat sink 21 are away from each other, which facilitates heat dissipation.
  • the flexible heat-conducting layer 30 is used to transfer the heat of the first heat sink 11 to the second heat sink 21 for dissipation. In this way, the heat generated by the motherboard component 12 can be dissipated in time, and then the heat can be evenly distributed.
  • the flexible thermal conductive layer 30 is located on the opposite side of the first heat sink 11 from the main board component 12 and the battery component 22. In this way, the flexible heat-conducting layer 30 and the first heat-dissipating body 11 are in full contact, so that the heat generated by the motherboard component 12 can be fully dissipated to the flexible heat-conducting layer 30 through the first heat-dissipating body 11, and then the purpose of balanced heat dissipation is achieved.
  • the electronic device 100 includes a hinge assembly 40.
  • the hinge assembly 40 connects the first portion 10 and the second portion 20.
  • the hinge assembly 40, the first heat sink 11, and the second heat sink 21 are disposed on the same side of the flexible heat conductive layer 30. As such, the hinge assembly 40 can achieve relative rotation of the first portion 10 and the second portion 20.
  • the entire hinge assembly 40 is bendable.
  • the first part 10 and the second part 20 are symmetrically disposed on both sides of the hinge assembly 40.
  • the first part 10 and the second part 20 can be switched between the unfolded state and the folded state around the hinge assembly 40.
  • the flexible thermally conductive layer 30 covers the hinge assembly 40 and is thermally connected to the hinge assembly 40. In this way, the flexible thermally conductive layer 30 has a larger thermally conductive area and can further dissipate the heat of the hinge assembly 40.
  • the electronic device 100 includes a support plate 31 attached to the flexible thermally conductive layer 30.
  • the support plate 31 is located between the hinge assembly 40 and the flexible thermally conductive layer 30.
  • the support plate 31 has a certain supporting effect on the flexible heat-conducting layer 30, and at the same time, the support plate 31 separates the hinge assembly 40 from the flexible heat-conducting layer 30, so that the hinge assembly 40 can be prevented from wearing the flexible heat-conducting layer 30 when being bent, thereby conducting heat transfer to the flexible
  • the layer 30 has a protective effect.
  • the first heat radiating body 11 and the second heat radiating body 21 are provided on one side of the support plate 31.
  • the flexible thermally conductive layer 30 is disposed on the other side of the support plate 31.
  • the heat dissipating body with a higher temperature among the first heat dissipating body 11 and the second heat dissipating body 21 can conduct heat from the support plate 31 to the flexible heat conducting layer 30, and the flexible heat conducting layer 30 can conduct heat to the first heat dissipating body 11 and
  • the lower-temperature heat-radiating body in the second heat-radiating body 21 achieves uniform temperature heat dissipation.
  • the orthographic projection area of the support plate 31 on the flexible heat-conducting layer 30 basically covers the flexible heat-conducting layer 30 (the size of the support plate 31 may be consistent with the size of the flexible heat-conducting layer 30, or the size of the support plate 31 is slightly larger than the flexible heat-conducting layer 30 Layer 30), so that the support plate 31 can completely separate the flexible thermally conductive layer 30 and the hinge assembly 40.
  • the flexible thermally conductive layer 30 is a graphene material or a graphite material.
  • the support plate 31 is made of metal. In this way, the heat conducting effect of the flexible heat conducting layer 30 and the supporting plate 31 is better.
  • the support plate 31 may be made of a metal steel sheet.
  • the first heat sink 11 is formed with a first groove 111.
  • the second heat sink 21 is formed with a second groove 211.
  • the first groove 111 and the second groove 211 together form a receiving groove 110.
  • the flexible heat-conducting layer 30 is partially or completely contained in the receiving groove 110. In this way, the arrangement of the receiving groove 110 improves the installation stability of the flexible thermally conductive layer 30 and increases the contact area between the first and second heat sinks 11 and 21 and the flexible thermally conductive layer 30.
  • the support plate 31 and the flexible heat-conducting layer 30 are sequentially stacked and attached to the receiving groove 110.
  • the shape of the support plate 31 matches the shape of the flexible thermally conductive layer 30.
  • the support plate 31 is located between the flexible heat conductive layer 30 and the bottom wall of the receiving groove 110.
  • the flexible thermally conductive layer 30 is completely contained in the receiving groove 110, and the thickness of the flexible thermally conductive layer 30 is less than the depth of the receiving groove 110, so that the receiving groove 110 can also accommodate other components.
  • the hinge assembly 40 includes a bendable hinge body 41 and two bendable connecting members 42 provided on the hinge body 41.
  • the hinge body 41 connects the first portion 10 and the second portion 20.
  • a first notch 43 is provided on one side of the first groove 111
  • a second notch 44 is provided on one side of the second groove 211.
  • the top surface of the hinge body 41 is substantially coplanar with the bottom surface of the first groove 111 and the bottom surface of the second groove 211.
  • the two connecting members 42 are oppositely disposed on both sides of the top surface of the hinge body 41 near the edge.
  • the connecting member 42 connects the edge of the first notch 43 and the edge of the second notch 44, that is, the connecting member 42 can connect the first heat sink 11 and ⁇ ⁇ ⁇ 21 ⁇ The second heat sink 21.
  • the support plate 31 and the flexible thermally conductive layer 30 are both located above the two connecting members 42 on the side away from the hinge body 41.
  • the motherboard component 12 includes a motherboard 121 and a first chip portion 122.
  • the first chip portion 122 includes a first shield cover 1221 and a first chip 1222.
  • the first chip 1222 and the first shielding cover 1221 are disposed on the main board 121.
  • the first shielding cover 1221 covers the first chip 1222 and is thermally connected to the first chip 1222.
  • the first shield cover 1221 is thermally connected to the first heat sink 11. In this way, the heat generated by the first chip 1222 can be conducted to the first heat sink 11 and dissipated by the first shield 1221.
  • the first shielding cover 1221 may be used to protect the first chip 1222.
  • the first chip portion 122 includes a first thermally conductive layer 1223.
  • the first thermally conductive layer 1223 thermally connects the first shielding cover 1221 and the first chip 1222 in a thermally conductive manner.
  • the first thermally conductive layer 1223 improves the efficiency of thermal conduction between the first chip 1222 and the first shield 1221.
  • the first thermally conductive layer 1223 may be, for example, a thermally conductive silicon gel or a thermally conductive silicone grease.
  • the motherboard component 12 includes a second chip portion 123.
  • the second chip portion 123 includes a second shield cover 1231 and a second chip 1232.
  • the second chip 1232 and the second shield cover 1231 are disposed on a side of the main board 121 facing away from the first chip portion 122.
  • the second shielding cover 1231 covers the second chip 1232 and is thermally connected to the second chip 1232.
  • the second shield cover 1231 increases the heat dissipation area of the motherboard component 12 and protects the second chip 1232. The heat dissipation between the first chip portion 122 and the second chip portion 123 does not affect each other, and the heat dissipation efficiency is improved.
  • the second chip portion 123 includes a second thermally conductive layer 1233.
  • the second thermally conductive layer 1233 is thermally connected to the second shielding cover 1231 and the second chip 1232.
  • the second heat-conducting layer 1233 improves the efficiency of heat conduction between the second chip 1232 and the second shield cover 1231.
  • the second thermally conductive layer 1233 may be, for example, a thermally conductive silicone gel or a thermally conductive silicone grease.
  • the first portion 10 includes a thermally conductive first cover 13.
  • the first cover 13 and the first heat sink 11 are connected and together form a first mounting cavity 130.
  • the motherboard component 12 is housed in the first mounting cavity 130.
  • the second shield cover 1231 is thermally connected to the first cover 13. In this way, the first cover 13 not only increases the heat dissipation area of the motherboard component 12, but also protects the motherboard component 12.
  • the first portion 10 includes a third thermally conductive layer 14.
  • the third thermally conductive layer 14 thermally connects the second shielding cover 1231 and the first cover 13. As such, the third thermally conductive layer 14 improves the efficiency of thermal conduction between the second shield cover 1231 and the first cover 13.
  • the third thermally conductive layer 14 may be, for example, a graphite sheet.
  • the second portion 20 includes a thermally conductive second cover 23.
  • the second cover 23 and the second heat sink 21 are connected and together form a second mounting cavity 230.
  • the battery component 22 is located in the second mounting cavity 230.
  • the battery component 22 is thermally connected to the second cover 23. In this way, the second cover 23 is provided to increase the heat radiation area of the battery component 22 and protect the battery component 22.
  • the first cover 13 and the second cover 23 are close to each other, and the distance between the first cover 13 and the second cover 23 is smaller than that of the first heat sink 11 and the second heat sink. The distance between the bodies 21. In this way, when the electronic device 100 is bent, this is more conducive to the dissipation of heat.
  • the second portion 20 includes a fourth thermally conductive layer 24.
  • the fourth thermally conductive layer 24 thermally connects the battery component 22 and the second cover 23. As such, the fourth thermally conductive layer 24 improves the efficiency of heat conduction between the battery component 22 and the second cover 23.
  • the fourth thermally conductive layer 24 may be, for example, a graphite sheet.
  • the electronic device 100 includes a flexible screen assembly 50.
  • the flexible screen assembly 50 is installed on a side of the flexible heat conductive layer 30 facing away from the first portion 10 and the second portion 20. In this way, this facilitates the heat dissipation of the flexible screen assembly 50.
  • the flexible thermally conductive layer 30 is located between the flexible screen assembly 50 and the support plate 31.
  • the flexible screen assembly 50 includes a support frame 51 and a flexible display screen 52.
  • the support frame 51 is disposed on a side of the flexible heat conductive layer 30 facing away from the first portion 10 and the second portion 20.
  • the flexible display screen 52 is disposed on a side of the support frame 51 facing away from the flexible thermal conductive layer 30.
  • the supporting frame 51 can improve the overall stability of the flexible screen assembly 50.
  • the support frame 51 is a liquid metal support frame.
  • the first cover 13 and the second cover 23 respectively form two heat dissipation paths, that is, the first cover 13 can dissipate the heat of the motherboard component 12, and the second cover 23 can dissipate the heat of the battery component 22.
  • the first cover 13 and the second cover 23 do not affect each other, and each emits heat.
  • the first cover 13 and the second cover 23 are close to each other or even come into contact with each other, and there is less space for emitting heat to the outside, and the heat dissipation efficiency is lower.
  • the first cover 13 and the second cover 23 are made of a non-thermally conductive material such as plastic, the heat emission is further affected.
  • heat is mainly dissipated through another heat dissipation path, that is, through a heat sink that is still located on the outside.
  • the heat of the motherboard component 12 is homogenized to the second heat sink 21 of the battery component 22 through the thermally conductive component.
  • the heat of the battery component 22 and the heat transferred from the motherboard component 12 is dissipated through the second heat radiator 21, and the heat of the 12 motherboard components is simultaneously Dissipation is performed by the first heat radiating body 11 to ensure the overall heat dissipation efficiency.
  • the first cover 13, the second cover 23, the first heat sink 11, and the second heat sink 21 all serve as main heat dissipation paths for heat dissipation.
  • the thermally conductive component may also include only the flexible thermally conductive layer 30, that is, the flexible thermally conductive layer 30 simultaneously performs the thermally conductive function and the supporting function, and the support plate 31 may be omitted at this time.
  • the hinge assembly 40 when the hinge assembly 40 is made of a metal material, it can also be used as a heat dissipation path to dissipate the heat of the battery component 22 and the motherboard component 12. That is, the first cover 13, the second cover 23, the heat-conducting component, the first heat sink 11, and the second heat sink 21 can further transfer heat to the hinge assembly 40, and then dissipate the heat through the hinge assembly 40 to further improve the heat dissipation effect.
  • the "first" or “down” of the second feature may include the first and second features in direct contact, and may also include the first and second features. Not directly, but through another characteristic contact between them.
  • the first feature is “above”, “above”, and “above” the second feature, including that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature, including the fact that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature is less horizontal than the second feature.

Abstract

La présente invention concerne un dispositif électronique (100) comprenant une première partie (10), une seconde partie (20) et une couche de conduction thermique souple (30). La première partie (10) comprend un premier dissipateur thermique (11) et un composant de carte mère (12), le composant de carte mère (12) étant relié de manière conductive thermiquement à un côté du premier dissipateur thermique (11) ; la seconde partie (20) comprend un second dissipateur thermique (21) et un composant de batterie (22), le composant de batterie (22) étant relié de manière conductive thermiquement à un côté du second dissipateur thermique (21) ; et la couche de conduction thermique souple (30) étant reliée de manière conductive thermiquement au premier dissipateur thermique (11) et au second dissipateur thermique (21). Comme la couche de conduction thermique souple (30) est reliée de manière conductive thermiquement au premier dissipateur thermique (11) et au second dissipateur thermique (21), la chaleur du composant de carte mère (12) peut être transférée au second dissipateur thermique (21) au moyen du premier dissipateur thermique (11) et de la couche de conduction thermique souple (30) pour la dissipation thermique, et de même, la chaleur du composant de batterie (22) peut également être transférée au premier dissipateur thermique (11) au moyen du second dissipateur thermique (21) et de la couche de conduction thermique flexible (30) pour la dissipation thermique. Lorsque la quantité de chaleur générée par le composant de carte mère (12) ou le composant de batterie (22) est importante, la chaleur peut être mieux dissipée en raison de la grande surface de dissipation de chaleur, ce qui permet d'éviter une surchauffe localisée du dispositif électronique (100), ce qui permet d'améliorer l'expérience de l'utilisateur.
PCT/CN2018/105815 2018-09-14 2018-09-14 Dispositif électronique WO2020051904A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201880094134.0A CN112639671A (zh) 2018-09-14 2018-09-14 电子装置
PCT/CN2018/105815 WO2020051904A1 (fr) 2018-09-14 2018-09-14 Dispositif électronique
CN201880094124.7A CN112640395A (zh) 2018-09-14 2018-11-05 柔性电子装置
PCT/CN2018/113954 WO2020052028A1 (fr) 2018-09-14 2018-11-05 Dispositif électronique flexible
CN201880094171.1A CN112640597A (zh) 2018-09-14 2018-11-06 柔性电子装置
PCT/CN2018/114071 WO2020052030A1 (fr) 2018-09-14 2018-11-06 Dispositif électronique souple

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/105815 WO2020051904A1 (fr) 2018-09-14 2018-09-14 Dispositif électronique

Publications (1)

Publication Number Publication Date
WO2020051904A1 true WO2020051904A1 (fr) 2020-03-19

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PCT/CN2018/105815 WO2020051904A1 (fr) 2018-09-14 2018-09-14 Dispositif électronique
PCT/CN2018/113954 WO2020052028A1 (fr) 2018-09-14 2018-11-05 Dispositif électronique flexible
PCT/CN2018/114071 WO2020052030A1 (fr) 2018-09-14 2018-11-06 Dispositif électronique souple

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PCT/CN2018/113954 WO2020052028A1 (fr) 2018-09-14 2018-11-05 Dispositif électronique flexible
PCT/CN2018/114071 WO2020052030A1 (fr) 2018-09-14 2018-11-06 Dispositif électronique souple

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CN (3) CN112639671A (fr)
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