M316612 •八、新型說明： • 【新型所屬之技術領域】 本新型係有關於一種免風扇散熱之系統模組，特別係 有關一種直接具有散熱單元以及利用對流原理達到散熱功 效的糸統模組。 【先前技術】 馨現有的系統模組，通常包括一殼體及一設於該殼體内 部的電路模組。其中，電路模組由一主機板與複數設置於 主機板上的電子元件如中央處理器、硬碟、記憶體，或lc 等所組成。 由於電子元件工作時會產生熱能，於是，在系統模組 對應電子元件的適當位置處會開設通風孔與裝設風扇，用 以散熱，避免電子元件過熱導致系統模組當機、運作不正 常。 # 然而’習知利用風扇散熱的系統模組，其具有以下缺 失，導致其應用性較為不佳： (1) 風扇的生產成本高。 (2) 風扇的空間佔有率大，導致系統模組内部的空間 利用性低。 (3) 風扇運作時，極易產生噪音。 (4 )風扇使用一段時間之後，易有故障之虞。 【新型内容】 M316612 因此’本新型之目的，即在提供一種生產成本低且應 用性佳的免風扇散熱之系統模組。 本新型之另一目的，即在提供一種其裝置内部空間利 用性鬲的免風扇散熱之系統模組。 本新型之又一目的，即在提供一種具有不會產生噪音 且無故障之虞的散熱單元之免風扇散熱之系統模組。 根據上述目的’本新型免風扇散熱之系統模組包括一 殼體單元、一電路模組，以及一散熱單元。殼體單元包括 互相組接在一起並相配合界定一容置空間的一前殼體，與 一由高導熱性金屬所製成的後蓋體。電路模組容設於殼體 單元的容置空間，該電路模組包括一電路板，及至少一設 置於電路板上並與電路板形成電連接且面對後蓋體的發熱 元件。散熱單元包括至少一絕緣導熱件及至少一散熱件。 絕緣導熱件貼設於後蓋體的内面，並對應於發熱元件的位 置’用以傳導發熱元件所發出的熱能至後蓋體。散熱件係 一體地形成於後蓋體遠離發熱元件的一面，且形狀概呈鰭 片狀。 前述的後蓋體，其底側及頂側分別設有一第一鏤空部 及一第二鏤空部，該二鏤空部與該容置空間相通；且該電 路模組進一步包括有至少一訊號傳輸件彼插置於該電路板 上並與該電路板形成電連接，及至少一支架彼組設於該殼 體單元的内側並貫穿具有穿槽供該訊號傳輸件穿容，而該 支架設有至少一貫穿的通孔，且該通孔與該第一鏤空部及 該第二鏤空部相通。 M316612 係包括多數個貫穿該後蓋體頂側 前述的第二鏤空部 的穿孔。 别述的絕緣導熱件係為撓性體。 一記憶 前述的發熱元件可為一中央處理器、一硬碟 體，或一 ic。 前述的後蓋體包括第-蓋件及第二蓋件。該第一蓋件 係與：殼體相互組設，並具有一貫穿的第三鏤空部；而該M316612 • Eight, new description: • [New technical field] This new type is related to a fanless system module, especially for a system that directly has a heat dissipation unit and uses the convection principle to achieve heat dissipation. [Prior Art] A prior art system module generally includes a housing and a circuit module disposed inside the housing. The circuit module is composed of a motherboard and a plurality of electronic components such as a central processing unit, a hard disk, a memory, or an lc disposed on the motherboard. Since the electronic components generate heat during operation, a vent hole and a fan are installed at appropriate positions of the corresponding electronic components of the system module to dissipate heat to prevent the system components from being overwhelmed and malfunctioning due to overheating of the electronic components. # However, the system module that uses the fan to dissipate heat has the following defects, which leads to poor applicability: (1) The production cost of the fan is high. (2) The space occupied by the fan is large, resulting in low space utilization inside the system module. (3) Noise is extremely likely to occur when the fan is in operation. (4) After the fan has been used for a period of time, it is prone to failure. [New content] M316612 Therefore, the purpose of the present invention is to provide a system module for fanless heat dissipation with low production cost and good application. Another object of the present invention is to provide a system for fanless heat dissipation of the internal space utilization of the device. A further object of the present invention is to provide a system module for fanless heat dissipation of a heat dissipating unit having no noise and no trouble. According to the above object, the novel fanless heat dissipation system module comprises a housing unit, a circuit module, and a heat dissipation unit. The housing unit includes a front housing that is assembled to each other and cooperates to define an accommodation space, and a rear cover body made of a highly thermally conductive metal. The circuit module is disposed in the accommodating space of the housing unit. The circuit module includes a circuit board and at least one heat generating component disposed on the circuit board and electrically connected to the circuit board and facing the rear cover body. The heat dissipating unit comprises at least one insulating heat conducting member and at least one heat dissipating member. The insulating heat conducting member is attached to the inner surface of the rear cover body and corresponds to the position of the heat generating component to conduct heat energy from the heat generating component to the rear cover. The heat dissipating member is integrally formed on a side of the rear cover body away from the heat generating component, and has a shape of a fin. The rear cover body has a first hollow portion and a second hollow portion respectively disposed on the bottom side and the top side, wherein the two hollow portions are in communication with the receiving space; and the circuit module further includes at least one signal transmitting member Inserted on the circuit board and electrically connected to the circuit board, and at least one bracket is disposed on the inner side of the housing unit and has a through slot for the signal transmission member to be received, and the bracket is provided with at least a through hole, and the through hole communicates with the first hollow portion and the second hollow portion. M316612 includes a plurality of perforations extending through the aforementioned second hollow portion on the top side of the back cover. The insulating heat conductive member described above is a flexible body. A memory The aforementioned heating element can be a central processing unit, a hard disk, or an ic. The aforementioned rear cover body includes a first cover member and a second cover member. The first cover member is assembled with the housing and has a third hollow portion extending therethrough;
第-盍件則係可拆離地裝設在該第三鏤空部，並封閉該鎮 空部。 前述的第一蓋件更具有至少一定位槽彼凹設於該第三 鐘空部的一側部’而該第二蓋件則具有至少一限位卡榫彼 與該定位槽相對應組合。 前述的後蓋體，其内面凸設有至少一限抵平台，該限 抵平台係對應於該發熱元件的位置，且該絕緣導熱件係介 於該限抵平台與該發熱元件之間。 • 前述的限抵平台與該後蓋體為不同體，該後蓋體係組 没於该後蓋體的内面，並凸出於該内面。 前述的絕緣導熱件可介於該限抵平台與該後蓋體之 間。 前述的後蓋體，其周邊的適當位置開設有複數散熱孔。 前述的系統模組進一步包括一顯示模組，該系統 模組及該顯示模組係架設於一座體上。 【實施方式】 M316612 - 有關本新型之前述及其他技術内容、特點與功效，在 -以下配合參考圖式之一個較佳實施例的詳細說明中，將可 清楚的呈現。 參閱第1圖至第3圖，為本新型免風扇散熱之系統模 組一較佳實施例。該系統模組2包括一殼體單元3、一電路 模組4、以及一散熱單元5。 殼體單元3包括互相組接在一起並相配合界定一容置 空間31的一前殼體32，與一由高導熱性金屬（如鋁、銅、 或其合金）所製成的後蓋體33。 參閱第2圖至第5圖，電路模組4容設於殼體單元3 的容置空間31中，並包括一電路板41、及至少一設置於 電路板41上並與電路板41形成電連接且面對後蓋體d的 發熱元件42。该電路模組4進一步包括，至少一插置於電 路板41上並與電路板形成電連接41的訊號傳輸件43，以 及一組设於殼體單元3後蓋體33内面側供訊號傳輸件43 φ 穿容束設的支架44。在此處，界定後蓋體33於面對發熱 單元42之面為該後蓋體33的内面331 ;而後蓋體33於遠 離發熱單元42之面則為該後蓋體33的背面332。另在本 實施例中，發熱元件42的數目係為五個，其分別為中央處 理器42a、硬碟42b、記憶體42c、以及IC 42d及42e。 支架44具有沿上下方向貫穿的穿槽441，其數量、形 狀對應訊號傳輸件43，用以束設訊號傳輸件43。本實施例 的訊號傳輸件43可為通用串列匯流排（universal Serial Bus ’ USB )、AV端子、或為PS2埠等。支架44還具有多 M316612 數個沿上下方向貫穿的通孔442，該通孔與下述 空部34及第二鏤空孔35相通。 、 此外，在本實施例中，爲便於更換硬碟42b及記憶體 42c’該等硬碟42b及記憶體仏皆設計以可拆離的方式插 設於電路板41上；對應地，後蓋體33可包括—第一蓋件 333及-第二蓋件334。其中，第—蓋件如與前殼體^ 相互組設，並具有一貫穿之第三鎮空部335彼對應於硬碟 42b及記憶體42e的位置：而第二蓋件334則可拆離地裝 設在第-蓋件333的第三鏤空部奶，並 部奶。在實施上，第-蓋件333還具有至少―凹弟^第工 二鏤空部335 -側部的定位槽336，而第二蓋件叫則且 有至少-與定位槽336相對應組合的限 二 使該等蓋件333、334連接在一起，並槿^禪〜37用以 ^疼並構成後蓋體33。藉 此，如使用者欲裝卸硬碟42b或記憶體42 ， 二蓋件334的限位卡榫337自第二將第 ^ 盍件333的定位槽330 分離，即可方便地裝卸硬碟似或記憶體42c。 本新型免風扇散熱之系統模組主要是運用對流原理以 及熱傳導原理’而達到散熱功效。其中，對流原理係藉由 在後蓋體33的第-蓋件333底側貫穿形成一第一鎮空部 34’ u及在第—蓋件333頂側（即第_鏤空部_相對上 方）貝穿形成一第二鏤空部35。在本實施例中，第二鎮空 部35係由多數個間隔排列於第—蓋件如頂側的穿孔351 ::成。據此’當發熱元件42運作而發熱時，其將與鄰近 、工乳進行熱交換’熱空氣會上升而自位於上方的第二鏤 M316612 空部35排出’同時冷空氣將自位於下方的第一鏤空部34 經由支架44的通孔442補充進人容置空間η内，並再與 發熱元件42進行熱交換。如是對流循環，將可達到散熱功 效。 …熱傳導原理則是藉-散熱單元5達到散熱功效。散熱 =兀5包括六個用以將發熱騎42所產生的熱能傳導至後 蓋體33的絕料熱件5卜及二個心將自後蓋體η吸收 的熱能逸散於空氣中的散熱件52。 該等絕緣導熱件51的其中四個係分別對應地貼設於 中央處理器42a、記憶體42c、IC42d及仏與後蓋體33 之間，另外二個絕緣導埶株s彳 豕导…、仵51則係對應地間隔貼設於硬碟 42b與後蓋體33之間。在本實施例中，絕緣導熱件η係 由具絕緣及導熱性能的撓性體（如釋）所製成，並以如 雙面膠的黏固方式黏貼於後蓋體33與發熱元件42之門 又，在本實施财，爲節省材料成本，料導熱件51_ 設成適當面積後，再分別對應貼設於各發熱元件42 .缺， 絕緣導熱# 51的數目亦可因裁設面積的不同而改變實施 數目，並不以本實施例所揭露者為限。 散熱件52的形狀概呈‘鰭片狀’並分別__體地形成於後 蓋體33之第-蓋件333與第二蓋件334的背面（遠離電路 模組4的一面）。 精由散熱早7L 5配合後蓋體33及電路模組4的機構設 計’當發熱it件42運作而產生熱能時，熱能將會經絕緣導 熱件51傳導至後蓋體33及散熱件52，進而逸散於空氣中， M316612 達到散熱的效果。 又，後蓋體33之周邊的適當位置更可開設複數個散熱 孔53，依此，發熱元件42所產生的熱能還能同時經由散 熱孔53逸散於空氣中，提高散熱效果。 配合參閱第6圖，爲了加強絕緣導熱件5丨與後蓋體 33及發熱元件42的貼合度，後蓋體33的内面331凸設有 至少一限抵平纟338,且限抵平台338係對應於發熱單元 42的位置，用以使絕緣導熱件51更緊密地貼設於限抵平 台338與發熱元件42之間。在本實施例中，限抵平台338 的數量為三個，並分別凸設於對應中央處理器 及42e的位置處，然限抵平台338的數量可依設計需求而 增設或減少。 又請參閱第7圖所示，限抵平台338與後蓋體”可為 不同體，因此，限抵平台3 3 8係另行組設於後蓋體3 3的内 面’並令該限抵平台凸出於該後蓋體33的㈣。該限抵平 台338的大小及厚度，可取決於發熱元件42的熱量而定。 依此結構，限抵平台338可特別另行選自導熱係數更為優 良的材質，使得發熱元件42的熱能更能迅速地傳導至後蓋 體33，提高散熱效率。 另請參閱第8圖所示，在限抵平台338與後蓋體33 為不同體然後在予以組設的情況下，亦可將絕緣導熱件$】 貼設介於限抵平台338與後蓋體33之間，而以高導熱的限 抵平台338直接接觸於發熱元件42，並吸收其熱能，再經 由絕緣導熱件51傳導至後蓋體33。 M316612 - 又請參閱第1圖所示，系統模組2進一步包括有一顯 *示模組6，且该系統模組2及該顯示模組6係架設於一座 體1上，以方便觀視該顯示模組6。 歸納上述，由於本新型免風扇散熱之系統模組不需額 外組裝散熱單元，而是藉第一鏤空部經由通孔與第二鏤空 部的對流式機構設計，以及以概呈鰭片狀的散熱件一體地 幵> 成於後蓋體背面的方式，並搭配絕緣導熱件傳導發熱元 φ 件產生的熱能，進而達到散熱效果，其生產成本低且不會 有噪音及故障之虞。此外，絕緣導熱件的空間佔有率小， 可供使用者有效運用殼體單元内的容置空間，其空間利用 性佳。又’本新型免風扇散熱之系統模組更可設計限抵平 台，以使絕緣導熱件緊密地貼設於發熱元件及後蓋體之 間，或使絕緣導熱件緊密地貼設於與發熱元件接觸的限抵 平台與後蓋體之間，加強散熱效果，應用性佳。所以可確 實達到本新型之創作目的。 φ 本新型雖已藉上述較佳實施例加以詳細說明，惟以上 所述者，僅為本新型的較佳實施例而已，當不能以此限定 本新型實施的範圍，即大凡依本新型申請專利範圍及新型 說明内容所作之簡單的等效變化與修飾，皆仍屬本新型專 利涵蓋的範圍内。 【圖式簡單說明】 第1圖係繪示一立體組合圖，說明本新型免風扇散熱 之系統模組一較佳實施例，並顯示該系統模組架設於一座 12 M316612 - 體上的外觀狀態； . 第2圖係繪示一立體圖，說明該系統模組較佳實施例 的外觀圖； 第3圖係繪示一立體分解圖，說明該系模組較佳實施 例的一殼體單元、一電路模組，及一散熱單元； 第4圖係繪示一立體分解圖，說明該系統模組較佳實 施例的三個限抵平台； 籲 第5圖係繪示一部分立體組合圖，說明該系統模組較 佳實施例之一第二蓋件與一第一蓋件分離後的配置關係； 以及 第6圖係繪示一剖面側視示意圖，說明該系統模組較 佳實施例之其中一限抵平台、對應的一絕緣導熱件，及一 中央處理器間的相對組設關係。 第7圖係繪示一剖面側視示意圖，說明該系統模組較 佳實施例其中一限抵平台的另一實施例。 φ 第8圖係繪示一剖面側視示意圖，說明該系統模組較 佳實施例其中一限抵平台的又一實施例。 【主要元件符號說明】 1.座體 2 ·糸統模、組 3·殼體單元 31.容置空間 32·前殼體 13 M316612 33. 後蓋體 331. 内面 332. 背面 333. 第一蓋件 334. 第二蓋件 335. 第三鏤空部 3 3 6.定位槽 337.限位卡榫 3 3 8.限抵平台 34. 第一鏤空部 35. 第二鏤空部 351.穿孔 4.電路模組 41. 電路板 42. 發熱元件 42a.中央處理器 4 2 b.硬碟The first member is detachably mounted to the third hollow portion and closes the hollow portion. The first cover member further has at least one positioning groove recessed in a side portion of the third clock portion, and the second cover member has at least one limit card and a corresponding combination with the positioning groove. The rear cover body has at least one limiting platform protruding from the inner surface thereof, the limiting platform corresponding to the position of the heating element, and the insulating heat conducting member is disposed between the limiting platform and the heating element. • The aforementioned offset platform is different from the rear cover body, and the rear cover system group is not on the inner surface of the rear cover body and protrudes from the inner surface. The aforementioned insulating and heat conducting member may be interposed between the limiting platform and the back cover. In the foregoing rear cover body, a plurality of heat dissipation holes are opened at appropriate positions around the periphery. The system module further includes a display module, and the system module and the display module are mounted on a body. [Embodiment] The above-mentioned and other technical contents, features and effects of the present invention will be apparent from the following detailed description of a preferred embodiment of the accompanying drawings. Referring to Figures 1 to 3, a preferred embodiment of the novel fanless heat dissipation system module is shown. The system module 2 includes a housing unit 3, a circuit module 4, and a heat dissipation unit 5. The housing unit 3 includes a front housing 32 that is assembled with each other and cooperates to define an accommodation space 31, and a rear cover body made of a highly thermally conductive metal such as aluminum, copper, or an alloy thereof. 33. Referring to FIG. 2 to FIG. 5 , the circuit module 4 is disposed in the accommodating space 31 of the housing unit 3 and includes a circuit board 41 and at least one disposed on the circuit board 41 and electrically formed with the circuit board 41 . A heating element 42 that connects and faces the back cover d. The circuit module 4 further includes at least one signal transmission member 43 interposed on the circuit board 41 and electrically connected to the circuit board 41, and a set of signal transmission members disposed on the inner surface of the rear cover body 33 of the housing unit 3 43 φ The bracket 44 that is worn. Here, the inner surface 331 defining the rear cover 33 facing the heat generating unit 42 is the inner surface 331 of the rear cover 33; and the rear cover 33 is the rear surface 332 of the rear cover 33 on the surface away from the heat generating unit 42. Further, in the present embodiment, the number of the heat generating elements 42 is five, which are the central processor 42a, the hard disk 42b, the memory 42c, and the ICs 42d and 42e, respectively. The bracket 44 has a through slot 441 extending in the up and down direction, and the number and shape correspond to the signal transmitting member 43 for splicing the signal transmitting member 43. The signal transmitting member 43 of this embodiment may be a universal serial bus (USB), an AV terminal, or a PS2 port or the like. The bracket 44 further has a plurality of M316612 through holes 442 extending in the up and down direction, and the through holes communicate with the hollow portion 34 and the second hollow hole 35 described below. In addition, in the embodiment, in order to facilitate the replacement of the hard disk 42b and the memory 42c', the hard disk 42b and the memory device are designed to be detachably inserted into the circuit board 41; correspondingly, the back cover The body 33 can include a first cover member 333 and a second cover member 334. Wherein, the first cover member is disposed with the front housing ^, and has a third hollow portion 335 which corresponds to the position of the hard disk 42b and the memory 42e: and the second cover member 334 is detachable The third hollow portion of the first cover member 333 is milked and combined with milk. In practice, the first cover member 333 further has a positioning groove 336 at least a side portion of the recessed portion 335, and the second cover member has at least a limit corresponding to the positioning groove 336. Second, the cover members 333, 334 are connected together, and the 〜 禅 〜 37 is used to make the back cover 33. Therefore, if the user wants to load or unload the hard disk 42b or the memory 42, the limit card 337 of the second cover member 334 is separated from the positioning groove 330 of the second member 333, so that the hard disk can be easily loaded or unloaded. Memory 42c. The system module for fan-free heat dissipation mainly uses the principle of convection and the principle of heat conduction to achieve heat dissipation. The convection principle is formed by forming a first hollow portion 34'u on the bottom side of the first cover member 333 of the rear cover body 33 and on the top side of the first cover member 333 (ie, the first _ hollow portion _ is relatively above) The shell wear forms a second hollow portion 35. In the present embodiment, the second hollow portion 35 is formed by a plurality of perforations 351 :: spaced apart from the top side of the first cover member. According to this, when the heating element 42 operates and heats up, it will exchange heat with the adjacent, working milk. The hot air will rise and exit from the second 镂M316612 vacant portion 35 located above. At the same time, the cold air will be from the lower part. A hollow portion 34 is replenished into the accommodating space η via the through hole 442 of the bracket 44, and is then exchanged with the heat generating element 42. In the case of a convection cycle, heat dissipation can be achieved. The principle of heat conduction is to use the heat dissipation unit 5 to achieve heat dissipation. The heat dissipation=兀5 includes six heat-dissipating members 5 for transferring the heat energy generated by the heat-generating rider 42 to the rear cover body 33, and the heat dissipation of the heat absorbed by the two hearts from the back cover body η in the air. Item 52. Four of the insulating heat-conducting members 51 are respectively attached between the central processing unit 42a, the memory 42c, the IC 42d, and the rear cover 33, and the other two insulating guides s... The crucible 51 is attached between the hard disk 42b and the rear cover 33 at a corresponding interval. In this embodiment, the insulating and heat conducting member η is made of a flexible body (in terms of release) having insulation and thermal conductivity, and is adhered to the back cover 33 and the heating element 42 by adhesion such as double-sided tape. In addition, in the implementation of the present invention, in order to save the material cost, the heat conducting member 51_ is set to an appropriate area, and then respectively attached to each of the heating elements 42. The number of insulating heat conduction # 51 may also vary depending on the cutting area. The number of implementations is not limited to those disclosed in this embodiment. The heat dissipating member 52 has a shape of "fin" and is formed on the back surface of the first cover member 333 and the second cover member 334 of the rear cover member 33 (away from the side of the circuit module 4). The heat dissipation energy is transmitted to the rear cover body 33 and the heat sink 52 through the insulating heat conductor 51 when the heat generating element 42 is operated to generate heat energy. Then escape in the air, M316612 achieves the effect of heat dissipation. Further, a plurality of heat dissipation holes 53 can be formed at appropriate positions on the periphery of the rear cover body 33. Accordingly, the heat energy generated by the heat generating component 42 can be simultaneously dissipated into the air via the heat dissipation holes 53, thereby improving the heat dissipation effect. Referring to FIG. 6 , in order to strengthen the adhesion between the insulating and heat conducting member 5 丨 and the rear cover 33 and the heating element 42 , the inner surface 331 of the rear cover 33 protrudes from at least one of the gussets 338 and is limited to the platform 338 . Corresponding to the position of the heat generating unit 42, the insulating heat conducting member 51 is more closely attached between the resisting platform 338 and the heat generating component 42. In this embodiment, the number of the offset platforms 338 is three and is respectively located at the positions corresponding to the central processing unit and 42e. However, the number of the limited access platforms 338 can be increased or decreased according to design requirements. Please also refer to FIG. 7 , the restriction platform 338 and the rear cover body may be different bodies. Therefore, the restriction platform 3 3 8 is separately assembled on the inner surface of the rear cover body 3 3 and the limit is fixed to the platform. The size and thickness of the abutment platform 338 may depend on the heat of the heating element 42. According to this structure, the limiting platform 338 may be particularly selected from the group consisting of better thermal conductivity. The material is such that the heat energy of the heating element 42 is more quickly transmitted to the rear cover 33, thereby improving the heat dissipation efficiency. Referring to FIG. 8, the restriction platform 338 and the rear cover 33 are different bodies and then grouped. In the case of the arrangement, the insulating and heat-conducting member can be placed between the abutting platform 338 and the rear cover body 33, and the high thermal conductivity-restricting platform 338 directly contacts the heating element 42 and absorbs the heat energy. The module module 2 further includes a display module 6 and the system module 2 and the display module 6 The system is erected on the body 1 to facilitate viewing of the display module 6. The novel fan-free heat dissipation system module does not need to additionally assemble the heat dissipation unit, but is designed by the convection mechanism of the first hollow portion through the through hole and the second hollow portion, and integrally formed by the fin-shaped heat dissipation member. > In the way of the back of the back cover, and with the heat conduction of the heat-conducting element, the heat generated by the heat-generating element φ is obtained, thereby achieving the heat-dissipating effect, and the production cost is low and there is no noise or malfunction. Moreover, the insulating heat-conducting member The space occupancy rate is small, and the user can effectively utilize the accommodating space in the housing unit, and the space utilization is good. The system module of the novel fanless heat dissipation system can be designed to be limited to the platform, so that the insulating and heat conducting parts are tight. The grounding device is disposed between the heating element and the rear cover body, or the insulating heat conducting member is closely attached between the limiting platform and the rear cover body which are in contact with the heating element, thereby enhancing the heat dissipation effect and having good applicability. The purpose of the novel is φ. The present invention has been described in detail by the above preferred embodiments, but the above is only a preferred embodiment of the present invention, and cannot be limited thereto. The scope of the present invention, that is, the simple equivalent changes and modifications made by the present invention in accordance with the scope of the new patent application and the new description are still within the scope of the present patent. [Simplified illustration] Figure 1 A three-dimensional combination diagram is shown to illustrate a preferred embodiment of the fanless heat dissipation system module, and shows the appearance of the system module mounted on a 12 M316612 - body; Fig. 2 is a perspective view, FIG. 3 is a perspective view showing a housing unit, a circuit module, and a heat dissipation unit of the preferred embodiment of the system module; 4 is an exploded perspective view showing three limited-restricted platforms of the preferred embodiment of the system module; FIG. 5 is a partial perspective view showing a preferred embodiment of the system module. The arrangement relationship between the two cover members and the first cover member; and FIG. 6 is a cross-sectional side view showing one of the preferred embodiments of the system module, and a corresponding one of the insulating and heat conducting members And one Relative set-up relationship between central processors. Figure 7 is a cross-sectional side elevational view showing another embodiment of a preferred embodiment of the system module that is limited to the platform. Fig. 8 is a side elevational view showing a cross-sectional side view of another embodiment of the preferred embodiment of the system module. [Description of main component symbols] 1. Seat 2 · System module, group 3 · Housing unit 31. Housing space 32 · Front housing 13 M316612 33. Rear cover 331. Inner surface 332. Back 333. First cover 334. Second cover member 335. Third hollow portion 3 3 6. Positioning groove 337. Limiting pin 榫 3 3 8. Limiting the platform 34. First hollow portion 35. Second hollow portion 351. Perforation 4. Circuit Module 41. circuit board 42. heating element 42a. central processing unit 4 2 b. hard disk
42c.記憶體 42d. 1C 42e. IC 4 3.訊號傳輸件 44.支架 441. 穿槽 442. 通孔 M316612 5. 散熱單元 51.絕緣導熱件 5 2.散熱件 5 3.散熱孔 6. 顯示模組42c. Memory 42d. 1C 42e. IC 4 3. Signal transmission member 44. Bracket 441. Through slot 442. Through hole M316612 5. Heat dissipating unit 51. Insulating heat conducting member 5 2. Heat sink 5 3. Cooling hole 6. Display Module