WO2020051901A1 - Dispositif électronique pliable - Google Patents

Dispositif électronique pliable Download PDF

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Publication number
WO2020051901A1
WO2020051901A1 PCT/CN2018/105811 CN2018105811W WO2020051901A1 WO 2020051901 A1 WO2020051901 A1 WO 2020051901A1 CN 2018105811 W CN2018105811 W CN 2018105811W WO 2020051901 A1 WO2020051901 A1 WO 2020051901A1
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WO
WIPO (PCT)
Prior art keywords
sub
electronic device
foldable electronic
middle frame
heat
Prior art date
Application number
PCT/CN2018/105811
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English (en)
Chinese (zh)
Inventor
刘景�
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to PCT/CN2018/105811 priority Critical patent/WO2020051901A1/fr
Priority to CN201880094136.XA priority patent/CN112673717A/zh
Publication of WO2020051901A1 publication Critical patent/WO2020051901A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present application relates to the field of electronic equipment, and in particular, to a foldable electronic device.
  • the motherboard of an electronic device in the related art generally dissipates heat through the rear cover of the electronic device.
  • the proportion of the rear cover corresponding to the motherboard covers a small proportion of the total area of the rear cover.
  • the temperature of the corresponding back cover is high, which affects the user experience.
  • the present application provides a foldable electronic device with better heat dissipation performance.
  • the foldable electronic device includes a middle frame component, a circuit board component, a back cover component, and a flexible thermally conductive member.
  • the middle frame component includes a first child middle frame and a second child middle frame.
  • the back cover assembly includes a first sub back cover and a second sub back cover respectively covering the first sub middle frame and the second sub middle frame.
  • the circuit board assembly is located between the first sub middle frame and the first sub back cover.
  • the flexible heat-conducting member is thermally connected to the circuit board assembly, the first sub-back cover and the second sub-back cover.
  • the foldable electronic device uses a flexible thermally conductive member to thermally connect the first sub-rear cover and the second sub-rear cover.
  • the flexible thermally conductive member can conduct heat generated by the circuit board assembly to the first sub-rear cover and the second sub-conductor at the same time.
  • the back cover increases the area of heat dissipation, which is conducive to uniform heat dissipation.
  • the back cover assembly dissipates heat to the outside air of the foldable electronic device through heat radiation and natural convection heat dissipation, thereby achieving the purpose of uniform heat dissipation of the circuit board assembly through the entire back cover assembly, and avoiding the local temperature of the back cover assembly Too high.
  • FIG. 1 is a schematic diagram of a foldable electronic device according to an embodiment of the present application.
  • FIG. 2 is an exploded perspective view of a foldable electronic device according to an embodiment of the present application.
  • FIG. 3 is a schematic perspective view of a foldable electronic device according to an embodiment of the present application when it is flattened;
  • FIG. 4 is a schematic cross-sectional view of the foldable electronic device of FIG. 3;
  • FIG. 5 is a schematic perspective view of a foldable electronic device according to an embodiment of the present application when it is folded;
  • FIG. 6 is a schematic cross-sectional view of the foldable electronic device of FIG. 5;
  • FIG. 7 is a schematic perspective view of a middle frame assembly according to an embodiment of the present application.
  • FIG. 8 is a schematic perspective view of a circuit board assembly according to an embodiment of the present application.
  • FIG. 9 is a schematic perspective view of a back cover assembly according to an embodiment of the present application.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality" is two or more, unless specifically defined otherwise.
  • the "first" or “under” of the second feature may include the first and second features in direct contact, and may also include the first and second features. Not directly, but through another characteristic contact between them.
  • the first feature is “above”, “above”, and “above” the second feature, including that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature, including the fact that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature is less horizontal than the second feature.
  • the present application provides a foldable electronic device 100.
  • the foldable electronic device 100 of the present application includes, but is not limited to, smart terminals and display devices such as flexible smart phones, foldable smart computers, and wearable smart products. It should be noted that the shape of the foldable electronic device 100 can be set according to specific conditions, for example, it can be rectangular parallelepiped.
  • a foldable electronic device 100 includes a flexible thermally conductive member 10, a middle frame assembly 20, a circuit board assembly 30, and a back cover assembly 40.
  • the middle frame assembly 20 includes a first sub middle frame 22 and a second sub middle frame 26, and a connecting member 24 connecting the first sub middle frame 22 and the second sub middle frame 26.
  • the rear cover assembly 40 includes a first sub-back cover 42 and a second sub-back cover 46 respectively covering the first sub-mid frame 22 and the second sub-mid frame 26.
  • the circuit board assembly 30 is located between the first sub middle frame 22 and the first sub back cover 42.
  • the flexible heat conducting member 10 connects the circuit board assembly 30 and the first sub-back cover 42, and the flexible heat conducting member 10 extends from the first sub-back cover 42 to the second sub-back cover 46 across the connecting member 24 and fits on the second sub-back cover 46 on.
  • the foldable electronic device 100 uses a flexible thermally conductive member 10 to connect the first sub-rear cover 42 and the second sub-rear cover 46.
  • the flexible thermally conductive member 10 can conduct heat generated by the circuit board assembly 30 to the flexible thermally conductive member 10 first Then, it is conducted to the first sub-rear cover 42 and the second sub-rear cover 44 through the flexible heat-conducting member 10, which increases the heat dissipation area and facilitates uniform heat dissipation.
  • the rear cover assembly 40 dissipates heat to the outside air of the foldable electronic device 10 through heat radiation and natural convection heat dissipation, thereby achieving the purpose of uniform heat dissipation of the circuit board assembly 30 through the integrated rear cover assembly 40, avoiding the rear cover.
  • the local temperature of the module 40 is too high.
  • first sub-middle frame 22 connection member and the second sub-middle frame 26 may both be made of a metal material. In this way, the first sub-middle frame 22 and the second sub-middle frame 26 have higher strength to support the foldable electronic device 100 and have better heat conduction effect to facilitate heat dissipation.
  • the first sub-back cover 42 corresponds to the first sub-middle frame 22, and the second sub-back cover 46 corresponds to the second sub-middle frame 26.
  • the connecting member 24 divides the foldable electronic device 100 into a first part and a second part.
  • the first part Including the first sub-middle frame 22, the first sub-back cover 42, the second part includes the second sub-middle frame 26 and the second sub-back cover 46, and the connecting member 24 connects the first part and the second part, and the first part and the second part It can be bent and flattened by the connecting member 24.
  • the connecting member 24 may be a hinge, and the first sub-middle frame 22 and the second sub-middle frame 26 may be connected to the connecting member 24 by welding or screwing.
  • the connecting member 24 is made of a metal material, so that the connecting member 24 has higher strength and better thermal conductivity.
  • the connecting member 24 may also be a structure having a certain bending ability, such as a component made of plastic, polymer material, and metal material.
  • the first sub-back cover 42 may be made of 3D glass material, plastic material or graphene plastic material
  • the second sub-back cover 46 may be made of 3D glass material, plastic material or graphene plastic material.
  • the 3D glass material has good thermal conductivity, and has the advantages of lightness, transparency, cleanness, anti-fingerprint, anti-glare, rigidity, scratch resistance, good weather resistance, etc.
  • the 3D appearance of this shape makes the molded product more beautiful and differentiated, so that the first sub-back 42 and the second sub-back 46 have better strength and aesthetics;
  • graphene can be uniformly mixed with silica gel to form a graphene silica gel material.
  • the graphene silica gel material has a large improvement in elastic modulus and fracture toughness, and has other characteristics such as higher heat Conductivity, better thermal stability, anti-sulfurization, moisture and chemical stability, etc., can improve the performance of the first sub-back 42 and the second sub-back 46, extend the service life, and further beautify the foldable The appearance of the electronic device 100 and the user's sense of experience are enhanced.
  • first sub-back 42 and the second sub-back 46 are not limited to the above-mentioned 3D glass material, plastic material, and graphene plastic material, and may be specifically selected in the specific implementation.
  • the flexible thermally conductive member 10 includes a first thermally conductive layer 12 and a second thermally conductive layer 14 disposed in a stack.
  • the second thermally conductive layer 14 is disposed on the rear cover assembly 40, and the first thermally conductive layer 12 is disposed on a side of the second thermally conductive layer 14 away from the rear cover assembly 40.
  • the first thermally conductive layer 12 is attached to the connecting member 24 and the circuit board assembly 30, and the second thermally conductive layer 14 is attached to the first sub-back 42 and the second sub-back 46.
  • the strength of the first thermally conductive layer 12 is greater than the strength of the second thermally conductive layer 14.
  • the second heat-conducting layer 14 and the first heat-conducting layer 12 are stacked, which can better protect the second heat-conducting layer 14 from being damaged.
  • the first thermally conductive layer 12 is attached to the connecting member 24 and the circuit board assembly 30, and the second thermally conductive layer 14 is attached to the first sub-back 42 and the second sub-back 46, which can improve the flexible thermal conductive member 10 and each component.
  • the contact area between them is not only beneficial for the circuit board assembly 30 to conduct and dissipate heat through the flexible heat-conducting member 10, but also for improving the tightness and connection stability of the internal structure of the foldable electronic device 10.
  • the orthographic area of the first thermally conductive layer 12 on the second thermally conductive layer 14 covers the second thermally conductive layer 14.
  • the size of the first thermally conductive layer 12 may be consistent with the size of the second thermally conductive layer 14, or the size of the first thermally conductive layer 12 is slightly larger than that of the second thermally conductive layer 14, so that the first thermally conductive layer 12 can be sufficiently separated.
  • the second heat-conducting layer 14 and the battery 50, the connecting member 24 and the circuit board assembly 30 reduce abrasion of the second heat-conducting layer 14.
  • the first thermally conductive layer 12 is made of a metal
  • the second thermally conductive layer 14 is made of a graphene material or a graphite material.
  • the first thermally conductive layer 12 and the second thermally conductive layer 14 have better thermal conductivity.
  • the first heat-conducting layer 12 may be made of a metal steel sheet, so that the first heat-conducting layer 12 can increase the strength of the flexible heat-conducting member 10 and further increase the strength of the foldable electronic device 100.
  • a graphene material such as a graphene film and a graphite material such as a graphite sheet.
  • Graphene materials and graphite materials have the advantages of stable structure, high strength, high toughness and flexibility, excellent electrical and thermal conductivity, and good thermal shock resistance, that is, graphite can withstand when used at normal temperature. The temperature changes drastically without causing damage. When the temperature changes suddenly, the volume of graphite does not change much, no cracks occur, and a better second thermally conductive layer 14 can be formed.
  • first heat-conducting layer 12 is not limited to being made of a metal material
  • second heat-conducting layer 14 is not limited to being made of the above-mentioned graphene materials and graphite materials, and an appropriate material may be specifically selected in the specific implementation embodiment.
  • the thermal conductivity of the second thermally conductive layer 14 be greater than the thermal conductivity of the first thermally conductive layer 12.
  • the first sub-back cover 42 includes a first inner surface 424 that fits the flexible heat-conducting member 10.
  • the second sub-back cover 46 includes a second inner surface 464 attached to the flexible heat-conducting member 10.
  • the second heat-conducting plate 14 is closely connected to the first inner surface 424 and the second inner surface 464.
  • the area where the flexible heat-conducting member 10 is attached to the first inner surface 424 is larger than two thirds of the total area of the first inner surface 424.
  • the area where the flexible heat-conducting member 10 is attached to the second inner surface 464 is larger than two thirds of the total area of the second inner surface 464.
  • the ratio of the bonding area of the above-mentioned flexible heat-conducting member 10 to the area of the first inner surface 424 and the second inner surface 464 is moderate, so that the flexible heat-conducting member 10 can be better connected with the first sub-back 42 and the second sub-back 46 Laminating heat dissipation also saves the use of materials for the flexible heat conducting member 10.
  • the flexible heat conductive member 10 can cover the first inner surface 424 and the second inner surface 464 over the entire surface to increase the contact area between the flexible heat conductive member 10 and the first sub-back cover 42 and the second sub-back cover 46. It is helpful for heat conduction, and further improves the heat radiation effect of the flexible thermal conductive member 10.
  • the attaching ratio of the flexible heat-conducting member 10 to the first inner surface 424 and the second inner surface 464 is not limited to the above-mentioned ratios, and may be selected specifically in specific implementations.
  • the foldable electronic device 100 includes a battery 50.
  • the battery 50 is disposed between the second sub-middle frame 26 and the second sub-back cover 46 and is fixedly connected to the flexible heat conducting member 10. 50 is located on the other side of the connecting member 24 facing away from the circuit board assembly 30.
  • the flexible heat-conducting member 10 is located between the battery 50 and the second sub-back cover 46, and the battery 50 is connected to the second sub-back 46 through the flexible heat-conducting member 10.
  • the rear cover 46 dissipates heat.
  • the heating power of the circuit board assembly 30 is large and generates a large amount of heat.
  • the heat generated by the battery 50 is smaller than that of the circuit board assembly 30.
  • the heat generated by the flexible heat conducting member circuit board assembly 30 can be conducted to the connecting member through the flexible heat conducting member 10 24 and the second sub-back 46 corresponding to the battery 50 to evenly dissipate heat and avoid high temperature of the first sub-back 42 corresponding to the circuit board assembly 30.
  • the first thermally conductive layer 12 is fixedly disposed with the battery 50, the connecting member 24, and the circuit board assembly 30, and the second thermally conductive layer 14 is fixedly disposed with the back cover assembly 40.
  • the first heat conductive layer 12 is fixedly connected to the battery 50, the connecting member 24, and the circuit board assembly 30. It can be understood that the battery 50, the connecting member 24, and the circuit board assembly 30 are connected to each other through the first heat conducting layer 12, and the circuit board assembly can be connected on the one hand
  • the heat of 30 is averaged to the battery 50 and the connecting member 24, and then the heat is conducted to the second thermally conductive layer 14 to dissipate the heat through the back cover assembly 40.
  • the first thermally conductive layer 12 can carry the battery 50 and the connecting member 24 And the circuit board assembly 30 to improve the stability of the foldable electronic device 100.
  • the foldable electronic device 100 can be switched between an unfolded state and a folded state, and the bending angle of the foldable electronic device 100 is 0 ° -180 °.
  • the foldable electronic device 100 when the folding angle of the foldable electronic device 100 is 0 °, the foldable electronic device 100 is in a flat state. As shown in FIGS. 5 and 6, when the folding angle of the foldable electronic device 100 is approximately 180 °, the first sub-middle frame 22 and the second sub-middle frame 26 substantially overlap. At this time, the circuit board assembly 30 and the battery 50 The smaller the distance between them, the heat dissipation between the circuit board assembly 30 and the battery 50 may affect each other, which causes the heat dissipation difficulty of the foldable electronic device 100 to increase.
  • the flexible heat-conducting member 10 is provided to quickly dissipate heat from the back cover assembly 40 facing away from the first sub-middle frame 22 and the second sub-middle frame 26 to ensure that the temperature and usage of the foldable electronic device 100 are normal.
  • the first sub-middle frame 22 and the second sub-middle frame 26 are close to each other when the foldable electronic device 100 is bent, and away from each other when the foldable electronic device 100 is unfolded.
  • the rear cover assembly 40 and the flexible heat-conducting member 10 are located outside the foldable electronic device 100 relative to the middle frame assembly 20, so that even if the foldable electronic device 100 is bent and the circuit board assembly 30 is It is close to the battery 50.
  • the first sub-middle frame 22 and the second sub-middle frame 26 are combined with the flexible heat dissipation component 10 and the rear cover component 30 located on the outside, and can dissipate the heat generated by the circuit board assembly 30 and the heat generated by the battery 50. Out.
  • the first sub-middle frame 22 and the second sub-middle frame 26 are far from each other, and the heat generated by the circuit board assembly 30 and the battery 50 can be dissipated from the side of the rear cover assembly 30, and can Scattering from the side of the middle frame assembly 20 facilitates heat dissipation and prevents the foldable electronic device 100 from overheating.
  • the first sub-back 42 and the second sub-back 46 are close to each other, and the distance between the first sub-back 42 and the second sub-back 46 It is larger than the distance between the first middle frame 22 and the second middle frame 26.
  • the back cover assembly 40 is located outside the foldable electronic device 100 relative to the middle frame assembly 20. In this way, when the foldable electronic device 100 is bent, this is more conducive to heat dissipation.
  • the circuit board assembly 30 includes a first chip 31, a first shield cover 32, a first heat conductor 33 and a mainboard 34.
  • the first chip 31 is disposed on the motherboard 34.
  • the first shielding cover 32 covers the first chip 31, or in other words, the first chip 31 is housed in the first shielding cover 32.
  • the side of the first shielding cover 32 away from the main board 34 is adhered to the flexible thermal conductive member 10.
  • the first heat-conducting body 33 is housed in the first shielding case 32 and connects the first shielding case 32 and the first chip 31.
  • the first chip 31 and the first heat conductor 33 are stacked and housed in the first shielding cover 32.
  • the arrangement of the first shield cover 32 can increase the heat dissipation area of the motherboard 34 and protect the first chip 31.
  • the heat dissipation between the first chip 31 and the other components in the foldable electronic device 100 does not affect each other, which can improve the heat dissipation efficiency.
  • the arrangement of the first heat conductor 33 can improve the efficiency of heat conduction between the first chip 31 and the first shield cover 32.
  • the first chip 31 may be, for example, a central processing unit (CPU), an image processing unit (GPU), a digital signal processor (DSP), a modem (Modem), navigation positioning, multimedia, and other chips or processing modules.
  • the main board 34 may be a printed circuit board (PCB) and is electrically connected to the battery 50 through a wire.
  • the first chip 31 is electrically disposed on the main board 34.
  • the circuit board assembly 30 further includes a second chip 35, a second shielding cover 36, and a second heat conductor 37.
  • the second chip 35 and the first chip 31 are respectively disposed on opposite sides of the main board 34.
  • the second shielding cover 36 houses the second chip 35, or the second chip 35 is housed in the second shielding cover 36.
  • the side of the second shield cover 36 away from the main plate 34 is attached to the first sub-middle frame 22.
  • the second heat-conducting body 37 is housed in the second shielding case 36 and connects the second shielding case 36 and the second chip 35.
  • the second chip 35 and the second heat conducting body 37 are stacked and housed in the second shielding cover 36, and the heat generated by the second chip 35 can be conducted to the first sub-middle frame 22 and dissipated.
  • the second shielding cover 32 can be used for protecting the second chip 35.
  • the second chip 35 may be, for example, a central processing unit (CPU), an image processing unit (GPU), a digital signal processor (DSP), a modem (Modem), navigation positioning, multimedia and other chips or processing modules.
  • the chip 35 is electrically disposed on the motherboard 34. Furthermore, the function of the second chip 35 is different from that of the first chip 36.
  • the thermal conductor includes a first thermal conductor 33 and a second thermal conductor 37, and the materials used for the first thermal conductor 33 and the second thermal conductor 37 both include thermal silica gel.
  • thermally conductive silica gel is a thermally conductive compound, which has relatively high thermal conductivity and thermal conductivity, resistance to cold and heat alternation, aging resistance, and electrical insulation, and has excellent moisture resistance, shock resistance, corona resistance, and leakage resistance. , Wider use temperature, resistance to chemical media, lower consistency and better use stability. As well as good construction performance, it has good adhesion to most metal and non-metal materials, and can have a good adhesion and protection effect on the first chip 31 and the second chip 35, and improve the safety of the circuit board assembly 30 It can further ensure the safety and service life of the foldable electronic device 100.
  • the foldable electronic device 100 includes a flexible support assembly 60 and a flexible display screen 70 disposed on the flexible support assembly 60.
  • the flexible support assembly 60 is disposed on the middle frame assembly 20.
  • the flexible support assembly 60 includes a first support plate 62 and a second support plate 64 stacked on the first support plate 62.
  • the first support plate 62 is fixed on the middle frame assembly 20.
  • the flexible display screen 70 is fixed on the second support plate 64.
  • the flexible support assembly 60 is disposed on the middle frame assembly 20.
  • the flexible support assembly 60 can be used to carry the flexible display 70 to space the flexible display 70 and the middle frame assembly 20 to prevent the flexible display 70 from being affected by the middle frame assembly.
  • 20 A direct pulling force during deformation to protect the flexible display 70 from damage.
  • the first sub-middle frame 22 and the second sub-middle frame 26 are disposed at the upper edge of the connecting member 26.
  • the first sub-middle frame 22, the connecting member 24 and the second sub-middle frame 26 are formed.
  • a third accommodation space 222 and a fourth accommodation space 262 are formed in the first sub-middle frame 22 and a second sub-middle frame 24, respectively.
  • the third accommodation space 222 and the fourth accommodation space 262 are flexible.
  • the flexible support assembly 60 and the flexible display screen 70 are relatively stably disposed in the middle frame assembly 20, and can form a regular and beautiful foldable electronic device 100.
  • the first support plate 62 is made of a metal material
  • the second support plate 64 is made of a liquid metal material.
  • the rear cover assembly 40 includes a cover 44 connecting the first sub-back 42 and the second sub-back 46, and the cover 44 covers a portion of the flexible heat-conducting member 10 corresponding to the connection member 24.
  • the foldable electronic device 100 can be switched between bending and flattening, and the bending and flattening of the foldable electronic device 100 is realized by the deformation of the connection member 24.
  • the exposed connection member 24 may pinch the user's hand, and the exposed connection member 24 is also easily damaged by the external environment, such as water vapor, impurities, and the like.
  • the connecting member 24 is a metal hinge, the influence is more significant.
  • a cover 44 is provided to connect the first sub-rear cover 42 and the second sub-rear cover 46 to cover the connection member 24, thereby protecting the connection member 24.
  • the cover 44 is made of a silicone material, a graphene silicone material, a polymer material, or a metal material.
  • PI polyimide
  • the polyimide has excellent heat resistance, excellent mechanical properties, good chemical stability, humidity and heat resistance, good radiation resistance, and good
  • the polyimide has the characteristics of low temperature resistance, low expansion coefficient, flame retardancy and good biocompatibility, which can better isolate water and gas entering the foldable electronic device 100.
  • the internal and better heat dissipation can increase the strength of the back cover assembly 40 and further increase the strength of the foldable electronic device 100.
  • the cover 44 connects the first sub-back 42 and the second sub-back 46, and the heat conducted to the first sub-back 42 can be conducted to the second sub-back 46 and the second sub-back 46 through the cover 44.
  • the heat can be conducted to the first sub-back cover 42 through the cover 44.
  • the cover 44 is made of a graphene silicone material with high thermal conductivity and strength, which can improve the performance and heat dissipation of the back cover member 40, so that the circuit board component 30 can achieve uniform heat distribution through the entire back cover member 40.
  • the purpose of heat dissipation is to prevent the local temperature of the back cover member 40 from being too high.
  • the covering member 44 is not limited to the above-mentioned silicon material, graphene silicon material, polymer material, or metal material, and may be specifically selected in specific implementation embodiments.
  • the cover 44 is made of a graphene silica gel material with excellent heat dissipation performance.
  • the first sub-middle frame 22 and the first sub-back cover 42 are connected to form a first accommodation space 422, and the second sub-middle frame 26 and the second sub-back cover 46 are connected.
  • a second accommodation space 462 is formed together.
  • the first sub-back cover 42 and the second sub-back cover 46 are connected by a cover 44 and form a continuous plane.
  • the combination of the first accommodating space 422, the above-mentioned plane and the second accommodating space 462 can carry the remaining components of the foldable electronic device 100.
  • the flexible thermal conductive member 10 can be attached to the above-mentioned plane, and the circuit board assembly 30 and the battery 50
  • the first accommodating space 422 and the second accommodating space 462 are respectively accommodated, and the middle frame assembly 20 is carried on the side wall of the peripheral edge of the back cover assembly 40, so that a more stable connection can be formed, and the space of the back cover assembly 40 can be increased.
  • the utilization rate improves the integration of the foldable electronic device 100.
  • the middle frame assembly 20 and the back cover assembly 40 respectively form two heat dissipation paths, that is, the middle frame assembly 20 and the back cover assembly 40 can dissipate the heat of the circuit board assembly 30 and the battery 50 through two different directions.
  • the first sub-middle frame 22, the second sub-middle frame 26, the first sub-back cover 42 and the second sub-back cover 46 all serve as main heat dissipation paths for heat dissipation. Since the heat of the circuit board assembly 30 is higher than that of the battery 50, the heat of the circuit board assembly 30 can be conducted to the first sub-middle frame 22 and the first sub-frame 22 through the second heat conductor 37 and the second heat shield 36 in order. The heat of the middle frame 22 can be conducted to the second sub-middle frame 26 through the flexible support assembly 60 to achieve uniform temperature heat dissipation.
  • the heat of the circuit board assembly 30 can also be conducted to the flexible heat conducting member 10 through the first heat conductor 33 and the first heat shield 32 in sequence.
  • the heat transmitted to the flexible heat conducting member 10 can be dissipated through the first back cover 42. It can be conducted to the second back cover 46 for uniform temperature heat dissipation.
  • the foldable electronic device 100 when the foldable electronic device 100 is in a folded state, the first sub-middle frame 22 and the second sub-middle frame 26 are close to each other or even come into contact with each other, and there is less space for radiating heat to the outside and lower heat dissipation efficiency. Therefore, in the folded state, heat is mainly dissipated through another heat dissipation path, that is, through the rear cover assembly 40 still located on the outside.
  • One part of the heat of the circuit board assembly 30 is conducted to the first sub-back 42 through the flexible heat-conducting member 10 and dissipated, and the other part is conducted to the second sub-back 46 through the flexible heat-conducting member 10.
  • the heat of the passed circuit board assembly 30 is dissipated through the second sub-back cover 46.
  • the covering member 44 connects the first covering member 42 and the second covering member 46.
  • the heat conducted to the first covering member 42 can be conducted to the second covering member 46 through the covering member 44 and the heat transmitted to the second covering member 46 can be It is conducted to the first cover 42 through the cover 44. Since the covering member 44 covers a portion of the flexible heat dissipation member 10 corresponding to the connecting member 24, the heat conducted to the flexible heat dissipation member 10 can also be directly radiated through the covering member 44. To ensure overall heat dissipation efficiency.
  • the flexible thermally conductive member 10 may also include only the second thermally conductive layer 14, that is, the second thermally conductive layer 14 simultaneously performs the thermally conductive function and the supporting function. At this time, the first thermally conductive layer 12 may be omitted.
  • the heat of the battery 50 and the circuit board assembly 30 can also be dissipated as a heat dissipation path. That is, the first sub-middle frame 22, the second sub-middle frame 26, the flexible heat-conducting member 10, the first sub-back cover 42 and the second sub-back cover 46 can further transfer heat to the connecting member 24, and then radiate to the outside through the connecting member 24 To further improve the cooling effect.
  • the flexible display screen 70 of the foldable electronic device 100 belongs to a form of inversion, that is, after the foldable electronic device 100 is folded, the flexible display screen 70 is located inside the fold, and the back cover assembly 40 is located outside the fold.
  • the foldable electronic device 100 of the present application is not limited to the form of inversion, and the foldable electronic device 100 that is turned out can also be applied.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Telephone Set Structure (AREA)

Abstract

L'invention concerne un dispositif électronique pliable (100), comprenant un organe thermiquement conducteur (10) flexible, un ensemble d'armatures centrales (20), un ensemble de cartes de circuits imprimés (30), et un ensemble de couvercles arrière (40). L'ensemble d'armatures centrales (20) comprend une première sous-armature centrale (22) et une deuxième sous-armature centrale (26) ; l'ensemble de couvercles arrière (40) comprend un premier sous-couvercle arrière (42) et un deuxième sous-couvercle arrière (46) recouvrant respectivement la première sous-armature centrale (22) et la deuxième sous-armature centrale (26) ; l'ensemble de cartes de circuits imprimés (30) est situé entre la première sous-armature centrale (22) et le premier sous-couvercle arrière (42) ; l'organe thermiquement conducteur (10) flexible est connecté thermiquement à l'ensemble de cartes de circuits imprimés (30), au premier sous-couvercle arrière (42), et au deuxième sous-couvercle arrière (46).
PCT/CN2018/105811 2018-09-14 2018-09-14 Dispositif électronique pliable WO2020051901A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2018/105811 WO2020051901A1 (fr) 2018-09-14 2018-09-14 Dispositif électronique pliable
CN201880094136.XA CN112673717A (zh) 2018-09-14 2018-09-14 可折叠电子装置

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103576779A (zh) * 2013-10-29 2014-02-12 昆山市大久电子有限公司 一种柔性电脑外壳
CN106413336A (zh) * 2015-07-28 2017-02-15 东莞钱锋特殊胶粘制品有限公司 移动电子装置的散热缓冲屏蔽复合结构
CN206042151U (zh) * 2016-08-24 2017-03-22 深圳市启悦光电有限公司 一种小型摄像机
CN206506813U (zh) * 2016-11-30 2017-09-19 珠海市魅族科技有限公司 电子装置
WO2018094877A1 (fr) * 2016-11-25 2018-05-31 华为技术有限公司 Panneau de dissipation de chaleur, dispositif de dissipation de chaleur et appareil électronique

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102413323B1 (ko) * 2015-02-06 2022-06-27 엘지전자 주식회사 이동 단말기
CN106304817B (zh) * 2015-06-04 2019-01-18 宏碁股份有限公司 电子装置
CN104981134A (zh) * 2015-07-14 2015-10-14 广东欧珀移动通信有限公司 一种电子装置
CN206472427U (zh) * 2016-09-28 2017-09-05 华为技术有限公司 电子设备散热结构及电子设备
CN206490708U (zh) * 2017-03-09 2017-09-12 广东欧珀移动通信有限公司 移动终端
CN207252078U (zh) * 2017-09-22 2018-04-17 广东欧珀移动通信有限公司 玻璃后盖及电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103576779A (zh) * 2013-10-29 2014-02-12 昆山市大久电子有限公司 一种柔性电脑外壳
CN106413336A (zh) * 2015-07-28 2017-02-15 东莞钱锋特殊胶粘制品有限公司 移动电子装置的散热缓冲屏蔽复合结构
CN206042151U (zh) * 2016-08-24 2017-03-22 深圳市启悦光电有限公司 一种小型摄像机
WO2018094877A1 (fr) * 2016-11-25 2018-05-31 华为技术有限公司 Panneau de dissipation de chaleur, dispositif de dissipation de chaleur et appareil électronique
CN206506813U (zh) * 2016-11-30 2017-09-19 珠海市魅族科技有限公司 电子装置

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