WO2020042335A1 - 一种显示面板和显示装置 - Google Patents

一种显示面板和显示装置 Download PDF

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Publication number
WO2020042335A1
WO2020042335A1 PCT/CN2018/113320 CN2018113320W WO2020042335A1 WO 2020042335 A1 WO2020042335 A1 WO 2020042335A1 CN 2018113320 W CN2018113320 W CN 2018113320W WO 2020042335 A1 WO2020042335 A1 WO 2020042335A1
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WO
WIPO (PCT)
Prior art keywords
main body
side portion
attached
heat dissipation
dissipation structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/113320
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English (en)
French (fr)
Inventor
王明良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
Original Assignee
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HKC Co Ltd, Chongqing HKC Optoelectronics Technology Co Ltd filed Critical HKC Co Ltd
Priority to US16/327,315 priority Critical patent/US11432441B2/en
Publication of WO2020042335A1 publication Critical patent/WO2020042335A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections

Definitions

  • the present application relates to the field of display technology, and more particularly, to a display panel and a display device.
  • the liquid crystal display has many advantages such as a thin body, power saving, and no radiation, and has been widely used.
  • Most of the liquid crystal displays on the market are backlit liquid crystal displays, which include a liquid crystal panel and a backlight module.
  • the working principle of a liquid crystal panel is to place liquid crystal molecules in two parallel glass substrates, and apply a driving voltage to the two glass substrates to control the rotation direction of the liquid crystal molecules so as to refract the light of the backlight module to generate a picture.
  • the data driver chip (source driver) is a high-efficiency integrated circuit chip and is vulnerable to The breakdown caused by the external static electricity, because the data driver chip (source driver) includes many electronic components, and electronic components due to their internal resistance, will generate heat in the working state, so the data driver chip is also a high-heat component, Need auxiliary heat dissipation.
  • the top and bottom of the data driver chip are affixed with thermal aluminum foil.
  • the surface of the data driver chip thermal driver
  • the aluminum foil will deform unevenly, which will affect the data driver chip (source). driver).
  • the purpose of this application is to provide a display panel and a device to solve how to dissipate heat better.
  • a display panel includes:
  • a printed circuit board electrically connected to the main board
  • a data driving chip provided on the printed circuit board
  • Heat dissipation structure to dissipate heat from the data driving chip
  • the heat dissipation structure is attached to an upper surface of the data driving chip away from the printed circuit board, and at least one side edge or a corner of the upper surface is not attached with the heat dissipation structure.
  • the shape of the upper surface is rectangular, and the upper surface includes four right-angled sides and four right-angles formed by the intersection of the four sides; the four right-angled sides and the four right-angled sides are not attached to the Thermal structure.
  • the shape of the upper surface is rectangular, and the upper surface includes four right-angled edges and four right-angles formed by the intersection of the four edges; the four right-angled edges and the four right-angled edges may or may not be completely attached. There is the heat dissipation structure.
  • the heat dissipation structure includes a main body, and the main body is attached to a center position of the upper surface, and the main body is not attached to four of the right angles and four of the right angle sides.
  • the heat dissipation structure further includes a first side portion and a second side portion, and the first end portion and the second end portion are respectively disposed on both sides of the main body; the first side portion and A second side portion is attached to the upper surface, and an end portion of the first side portion and the second side portion away from the main body is attached at right angle sides of both sides of the data driving chip.
  • the upper surface is set as a rectangle
  • the shape of the main body is set as a rectangle.
  • the long side of the main body is parallel to the long side of the upper surface
  • the short side of the main body is parallel to the upper surface.
  • the long sides of the first and second side portions are parallel to the long side of the upper surface;
  • the short side corresponds to the short side of the upper surface.
  • the first side portion, the main body, and the second side portion are an integrated structure.
  • the heat dissipation structure is an aluminum foil heat sink.
  • the present application also discloses a display panel.
  • the display panel includes:
  • a printed circuit board electrically connected to the main board
  • a data driving chip provided on the printed circuit board
  • Heat dissipation structure to dissipate heat from the data driving chip
  • the heat dissipation structure is attached to an upper surface of the data driving chip away from the printed circuit board, and at least one side edge or a vertex of the upper surface is not attached with the heat dissipation structure;
  • the heat dissipation structure includes a main body attached to a center position of the upper surface, and the main body is not attached to four of the right angles and four of the right angle sides;
  • the heat dissipation structure further includes a first side portion and a second side portion, and the first end portion and the second end portion are respectively disposed on both sides of the main body; the first side portion and the second side portion
  • the upper surface is attached, and the end portions of the first side portion and the second side portion away from the main body are attached at right angle sides of both sides of the data driving chip;
  • the upper surface is provided as a rectangle,
  • the shape of the main body is set as a rectangle, a long side of the main body is parallel to the long side of the upper surface, and a short side of the main body is parallel to the short side of the upper surface and the lower surface;
  • the long sides of the first and second sides are parallel to the long sides of the upper surface, and the short sides of the first and second sides are opposite to the short sides of the upper surface.
  • the first side portion, the main body and the second side portion are an integrated structure.
  • the display device includes a display panel.
  • the display panel includes:
  • a printed circuit board electrically connected to the main board
  • a data driving chip provided on the printed circuit board
  • Heat dissipation structure to dissipate heat from the data driving chip
  • the heat dissipation structure is attached to an upper surface of the data driving chip away from the printed circuit board, and at least one side edge or a vertex of the upper surface is not attached with the heat dissipation structure;
  • the shape of the upper surface is rectangular, and the upper surface includes four right-angled sides and four right-angles formed by the intersection of the four sides; the four right-angled sides and the four right-angled sides are not attached to the Thermal structure.
  • the shape of the upper surface is rectangular, and the upper surface includes four right-angled edges and four right-angles formed by the intersection of the four edges; the four right-angled edges and the four right-angled edges may or may not be completely attached. There is the heat dissipation structure.
  • the heat dissipation structure includes a main body, and the main body is attached to a center position of the upper surface, and the main body is not attached to four of the right angles and four of the right angle sides.
  • the heat dissipation structure further includes a first side portion and a second side portion, and the first end portion and the second end portion are respectively disposed on both sides of the main body; the first side portion and A second side portion is attached to the upper surface, and an end portion of the first side portion and the second side portion away from the main body is attached at right angle sides of both sides of the data driving chip.
  • the upper surface is set as a rectangle
  • the shape of the main body is set as a rectangle.
  • the long side of the main body is parallel to the long side of the upper surface
  • the short side of the main body is parallel to the upper surface.
  • the long sides of the first and second side portions are parallel to the long side of the upper surface;
  • the short side corresponds to the short side of the upper surface.
  • the first side portion, the main body, and the second side portion are an integrated structure.
  • the heat dissipation structure is an aluminum foil heat sink.
  • the current manufacturers generally attach a heat sink on the upper surface of the data drive chip to dissipate heat. Because the data drive chip has a certain thickness, after the heat sink is attached, the heat sink bends at the corners of the data drive chip. It is folded, and then the unevenness of the heat sink affixed occurs, which causes the surface of the heat sink to be uneven and affects the heat dissipation effect of the aluminum foil.
  • a heat dissipation structure is attached to the upper surface of the data driving chip away from the printed circuit board, and at least one side edge or a vertex of the upper surface is not attached with the heat dissipation structure.
  • the data-driven chip fits well and effectively conducts heat generated during the operation of the data chip to ensure the stable operation of the data chip.
  • FIG. 1 is a schematic diagram of a heat dissipation structure attached to a data driving chip according to an embodiment of the present application
  • FIG. 2 is a schematic diagram of a heat dissipation structure attached to a data driving chip according to an embodiment of the present application
  • FIG. 3 is a schematic diagram of another heat dissipation structure attached to a data driving chip according to an embodiment of the present application
  • FIG. 4 is a schematic structural diagram of a display device according to an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a display panel according to an embodiment of the present application.
  • orientation or positional relationship indicated by “” is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplified description. It does not indicate or imply that the device or element referred to must have a specific orientation, The azimuth structure and operation cannot be understood as a limitation on the present application; unless clearly defined otherwise, the terms “installation”, “connected”, and “connected” should be understood in a broad sense.
  • it can be a fixed connection, or it can be Disassembly connection, or integral connection; it can be mechanical or electrical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements.
  • first and second are used for descriptive purposes only and cannot be interpreted as indicating or implying relative importance Or implicitly indicate the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • a display panel 20 and a display device 10 according to an embodiment of the present application are described below with reference to FIGS. 1 to 5.
  • the display panel 20 includes:
  • a printed circuit board 50 electrically connected to the main board 40;
  • the data driving chip 60 is disposed on the printed circuit board 50;
  • the heat dissipation structure 70 is attached to the upper surface 61 of the data driving chip 60 away from the printed circuit board 50, and at least one side edge or one vertex of the upper surface 61 is not attached to the upper surface 61. Heat dissipation structure 70.
  • a heat sink to the upper surface 61 of the data drive chip 60 to dissipate heat. Since the data drive chip 60 has a certain thickness, after the heat sink is attached, heat will occur at the corners of the data drive chip 60 The sheet is bent, and then the unevenness of the heat sink is attached, which causes the surface of the heat sink to be uneven and affects the heat dissipation effect of the aluminum foil.
  • a heat dissipation structure 70 is attached to the upper surface 61 of the data driving chip 60 away from the printed circuit board 50, and at least one side or a top corner of the upper surface 61 is not attached with the heat dissipation. Structure 70.
  • the heat dissipation structure 70 is attached to the upper surface 61 of the data driving chip 60 and will not be attached to the right-angle 612 edge 611, thereby avoiding the unevenness of the heat dissipation structure 70, and the surface after the attachment can be effectively maintained flat.
  • the heat dissipating structure 70 can be well attached to the data driving chip 60, and effectively conducts heat generated during the operation of the data chip to ensure the stable operation of the data chip.
  • the difference from the above embodiment is that the shape of the upper surface 61 is rectangular, and the upper surface 61 includes four right-angle 612 sides 611 and four sides two by two. Four right angles 612 formed by the intersection; the four right angles 612 sides 611 and the four right angles 612 are not attached with the heat dissipation structure 70; the heat dissipation structure 70 includes a main body 71, and the main body 71 is attached to the The center position of the upper surface 61, and the main body 71 is not attached to the four right angles 612 and the four right angles 612 sides 611; the heat dissipation structure 70 further includes a first side portion 72 and a second side portion 73, The first end portion and the second end portion are correspondingly disposed on both sides of the main body 71; the first side portion 72 and the second side portion 73 are disposed on the upper surface 61, and the first The end portions of the side portion 72 and the second side portion 73
  • the upper surface 61 is provided in a rectangular shape.
  • the shape is set as a rectangle, and the long side of the main body 71 is parallel to the long side of the upper surface 61, and the main body
  • the short sides of 71 are parallel to the short sides of the upper surface 61 and the lower surface; the long sides of the first and second side portions 72 and 73 are parallel to the long sides of the upper surface 61.
  • the short sides of the first side portion 72 and the second side portion 73 are parallel to the short sides of the upper surface 61.
  • the four right-angled edges 612 of the upper surface 61 of the data driving chip 60 and the four right-angled edges 612 are attached to the heat dissipation structure 70 with or incompletely attached.
  • the right-angle 612 side 611 and right-angle 612 positions of the chip prevent the heat dissipation structure 70 from bending to cause deformation of its structure, and thus cannot be well connected at the corners of the data chip, and cannot effectively conduct the heat generated by the data driving chip 60 when working.
  • the material of the heat dissipation structure 70 can be reduced, and the production cost can be reduced.
  • the first side portion 72 and the second side portion 73 are provided on both sides of the main body 71, which can increase the area where the heat dissipation structure 70 contacts the data driving surface, and the heat dissipation structure 70 can conduct more data on the driving chip 60.
  • the first side portion 72 and the second side portion 73 are attached to the right-angle 612 sides 611 on both sides of the interactive chip.
  • the first side portion 72 and the second side portion 73 can be attached to the driving chip because they do not need to be bent too much.
  • the attachment strength of the heat dissipation structure 70 is strengthened to prevent the heat dissipation structure 70 from falling off after being subjected to an external force.
  • the long and short sides of the main body 71 are respectively parallel to the long and short sides of the upper surface 61; the long and short sides of the first side 72 and the second side 73 are also respectively parallel to the upper surface 61
  • the long side and the short side should be parallel, so that when attaching the heat dissipation structure 70 to the upper surface 61, the short side can be attached according to the corresponding long side of the heat dissipation structure 70 and the data driving chip 60.
  • the function of indicating the attaching direction ensures that the wrong direction is not attached during the attaching process.
  • the shape of the upper surface 61 is rectangular, and the upper surface 61 includes four right-angle 612 sides 611 and four right-angles 612 formed by the intersection of the four sides; the four right-angle 612 sides 611 and the The four right angles 612 may or may not be completely attached to the heat dissipation structure 70.
  • the four right-angle 612 sides 611 of the upper surface 61 of the data driving chip 60 and the four right-angle 612 are attached to the heat dissipation structure 70 with or incompletely attached.
  • the heat dissipation structure 70 is not attached to the data
  • the right-angle 612 side 611 and right-angle 612 positions of the chip can prevent the heat dissipation structure 70 from bending to cause deformation of its structure, which can no longer connect well to the corners of the data chip, and cannot effectively conduct the heat generated by the data driving chip 60 when it works.
  • the material of the heat dissipation structure 70 can be reduced, and the production cost can be reduced.
  • the first side portion 72, the main body 71, and the second side portion 73 are an integrated structure.
  • the first side portion 72, the main body 71, and the second side portion 73 are an integrated structure, which increases the attachment area of the heat dissipation structure 70, reduces external forces acting on the heat dissipation structure, and makes the heat dissipation structure 70, especially the unit of the main body 71, a unit.
  • the external force received in the area becomes smaller, reducing the possibility of the heat dissipation structure 70, especially the main body 71, falling off.
  • the thickness is reduced, and then the main body 71 and the side portions are prevented from being separately formed on the assembly paste. Attach possible misalignment of the connection.
  • the material of the heat dissipation structure 70 is aluminum foil.
  • a third side portion 80 and a fourth side portion 90 corresponding to positions are provided on the long side of the main body 71.
  • the contact surface price of the heat dissipation structure 70 and the data driving chip 60 increases, and the area of the heat dissipation structure 70 that can conduct heat increases, which further increases Heat dissipation efficiency of the heat dissipation structure 70.
  • the third side portion 80 and the fourth side portion 90 can provide support on both sides of the main body 71 to prevent the main body 71 from falling off easily due to external force.
  • aluminum foil is a highly efficient heat transfer material
  • aluminum foil is plastic, which is an ideal material for heat dissipation of electronic components.
  • FIG. 2 and FIG. 2 are different from the foregoing embodiment in that:
  • a display panel 20 includes:
  • a printed circuit board 50 electrically connected to the main board 40;
  • the data driving chip 60 is disposed on the printed circuit board 50;
  • the heat dissipation structure 70 is attached to the upper surface 61 of the data driving chip 60 away from the printed circuit board 50, and at least one side edge or one vertex of the upper surface 61 is not attached to the upper surface 61.
  • the heat dissipation structure 70 is an aluminum foil heat sink, and includes a main body 71 attached to a center position of the upper surface 61, and the main body 71 is not attached to four of the right angles 612 and four of the right angles. 612 sides 611;
  • the heat dissipation structure 70 includes a main body 71 attached to a center position of the upper surface 61, and the main body 71 is not attached to four of the right angles 612 and four sides of the right angles 612; 611
  • the heat dissipation structure 70 further includes a first side portion 72 and a second side portion 73, and the first end portion and the second end portion are respectively disposed on both sides of the main body 71; the first side portions 72 and The second side portion 73 is provided at a right angle 612 attached to the upper surface 61, and the ends of the first side portion 72 and the second side portion 73 away from the main body 71 are attached to both sides of the data driving chip 60.
  • the upper surface 61 is set as a rectangle
  • the shape of the main body 71 is set as a rectangle
  • the long side of the main body 71 is parallel to the long side of the upper surface 61
  • the short side of the main body 71 Corresponding to the short sides of the upper surface 61 and the lower surface; the long sides of the first side portion 72 and the second side portion 73 are parallel to the long side of the upper surface 61;
  • the short sides of the one side portion 72 and the second side portion 73 are parallel to the short sides of the upper surface 61; the first side portion 72, the main body 71, and the second side portion 73 Integral structure;
  • the heat dissipation structure 70 is an aluminum foil heat sink.
  • the aluminum foil is an efficient heat transfer material and a rational material for heat dissipation of electronic components.
  • the aluminum foil heat sink includes a first side portion 72, a main body 71, and a second side portion 73.
  • the main body 71 is attached to the center position of the upper surface 61 of the data driving chip 60 and the main body 71 is not attached to the four right angles 612 and four right angles 612 sides 611 of the upper surface 61.
  • the main heat generated when the center position of the data driving chip 60 is Position, at which heat conduction from the data driving chip 60 is affixed.
  • the surface of the main body 71 after being affixed will not be bent, which will cause deformation of the aluminum foil heat sink, and finally affect the aluminum foil heat sink and the data drive chip 60. Lamination, can not conduct heat efficiently, causing the data drive chip 60 to work stably at high temperatures;
  • the long and short sides of the main body 71 are parallel to the long and short sides of the upper surface 61 respectively;
  • the first side 72 and the second side The long and short sides of the portion 73 are also parallel to the long and short sides of the upper surface 61, so that when attaching the heat dissipation structure 70 to the upper surface 61, the chip 60 can be driven according to the heat dissipation structure 70 and the data
  • the corresponding long side and short side are affixed, which can indicate the direction of the affixation, and ensure that the wrong direction is not attached during the affixation process;
  • the first side portion 72, the main body 71, and the second side portion 73 are an integrated structure.
  • the attachment area of the heat dissipation structure 70 is increased, and when an external force is applied, the external force received by the heat dissipation structure 70, particularly the unit 71 portion of the main unit, becomes smaller, and the possibility of the heat dissipation structure 70, especially the body 71 portion falling off, is reduced.
  • the thickness is reduced, and then the main body 71 and the side portions are prevented from being separately formed on the assembly paste. Attach possible misalignment of the connection.
  • a display device 10 includes a display panel 20, and the display panel 20 includes:
  • a printed circuit board 50 electrically connected to the main board 40;
  • the data driving chip 60 is disposed on the printed circuit board 50;
  • the heat dissipation structure 70 is attached to the upper surface 61 of the data driving chip 60 away from the printed circuit board 50, and at least one side edge or one vertex of the upper surface 61 is not attached to the upper surface 61.
  • a heat sink to the upper surface 61 of the data drive chip 60 to dissipate heat. Since the data drive chip 60 has a certain thickness, after the heat sink is attached, heat will occur at the corners of the data drive chip 60 The sheet is bent, and then the unevenness of the heat sink is attached, which causes the surface of the heat sink to be uneven and affects the heat dissipation effect of the aluminum foil.
  • a heat dissipation structure 70 is attached to the upper surface 61 of the data driving chip 60 away from the printed circuit board 50, and at least one side or a top corner of the upper surface 61 is not attached with the heat dissipation. Structure 70.
  • the heat dissipation structure 70 is attached to the upper surface 61 of the data driving chip 60 and will not be attached to the right-angle 612 edge 611, thereby avoiding the unevenness of the heat dissipation structure 70, and the surface after the attachment can be effectively maintained flat.
  • the heat dissipating structure 70 can be well attached to the data driving chip 60, and effectively conducts heat generated during the operation of the data chip to ensure the stable operation of the data chip.
  • the technical solution of the present application can be widely used in various display panels, such as TN-type display panels (all names are Twisted Nematic, that is, twisted nematic panels), IPS-type display panels (In-Plane Switching, plane conversion), and VA-type displays Panels (Multi-domain Vertical Alignment), of course, can also be other types of display panels, such as organic light-emitting display panels (organic light-emitting diodes, referred to as OLED display panels), can apply the above scheme.
  • TN-type display panels all names are Twisted Nematic, that is, twisted nematic panels
  • IPS-type display panels In-Plane Switching, plane conversion
  • VA-type displays Panels Multi-domain Vertical Alignment
  • OLED display panels organic light-emitting diodes

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  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请公开了一种显示面板(20)和显示装置(10)。显示面板(10)包括散热结构(70)，对数据驱动芯片(60)进行散热；散热结构(70)贴附在数据驱动芯片(60)远离印制电路板(50)的上表面(61)，上表面(61)的至少一条侧边或一个顶角不贴附有散热结构(70)。

Description

一种显示面板和显示装置
本申请要求于2018年8月29日提交中国专利局、申请号为CN201821399095.9、发明名称为“一种显示面板和显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，更具体的说，涉及一种显示面板和显示装置。
背景技术
这里的陈述仅提供与本申请有关的背景信息，而不必然地构成现有技术。
液晶显示器具有机身薄、省电和无辐射等众多优点，得到了广泛的应用。市场上的液晶显示器大部分为背光型液晶显示器，其包括液晶面板及背光模组(Backlight Module)。液晶面板的工作原理是在两片平行的玻璃基板当中放置液晶分子，并在两片玻璃基板上施加驱动电压来控制液晶分子的旋转方向，以将背光模组的光线折射出来产生画面。
如今随着电视的大尺寸化、高解析度和高帧频率的发展，数据驱动芯片(source driver)起到到了主要的作用，数据驱动芯片(source driver)是一种高效集成电路芯片，易受外界静电的影响而击穿损坏，因为数据驱动芯片(source driver)包括许多电子元器件，而电子元器件由于自身内阻，在工作状态下会产生热量，所以数据驱动芯片也是高发热的元件，需要辅助进行散热。
数据驱动芯片(source driver)的上下面都贴散热铝箔，可是由于数据驱动芯片(source driver)表面贴附散热铝箔时会出现贴附不平的情况，导致铝箔发生形变，进而影响数据驱动芯片(source driver)的散热效果。
技术解决方案
本申请所的目的在于提供一种显示面板和装置，以解决如何对自身进行更 好的散热。
本申请的目的是通过以下技术方案来实现的：
一种显示面板，所述显示面板包括：
主板；
印制电路板，与所述主板电性连接；
数据驱动芯片，设置在所述印制电路板上；以及；
散热结构，对数据驱动芯片进行散热；
其中，所述散热结构贴附在所述数据驱动芯片远离所述印制电路板的上表面，且所述上表面的至少一条侧边或一个顶角不贴附有所述散热结构。
可选的，所述上表面的形状为矩形，所述上表面包括四条直角边以及四条边两两交汇形成的四个直角；所述四条直角边和所述四个直角不贴附有所述散热结构。
可选的，所述上表面的形状为矩形，所述上表面包括四条直角边以及四条边两两交汇形成的四个直角；所述四条直角边和所述四个直角有或不完全贴附有所述散热结构。
可选的，所述散热结构包括主体，所述主体贴附与所述上表面的中心位置，且所述主体不贴附于四个所述直角和四条所述直角边。
可选的，所述散热结构还包括第一侧部和第二侧部，所述第一端部和第二端部分别对应设置在所述主体的两侧边；所述第一侧部和第二侧部设置贴附在所述上表面，且第一侧部和第二侧部远离所述主体的端部贴附在所述数据驱动芯片的两侧的直角边处。
可选的，所述上表面设置为矩形，所述主体的形状设置为矩形，所述主体的长边与所述上表面的长边相对应平行，所述主体的短边与所述上表面和所述下表面的短边相对应平行；所述第一侧部和第二侧部的长边与所述上表面的长边相对应平行，所述第一侧部和第二侧部的短边与所述的上表面的短边相对应平行。
可选的，所述第一侧部、主体和第二侧部为一体结构。
可选的，所述散热结构为铝箔散热片。
本申请还公开了，一种显示面板，所述显示面板包括：
主板；
印制电路板，与所述主板电性连接；
数据驱动芯片，设置在所述印制电路板上；以及；
散热结构，对数据驱动芯片进行散热；
其中，所述散热结构贴附在所述数据驱动芯片远离所述印制电路板的上表面，且所述上表面的至少一条侧边或一个顶角不贴附有所述散热结构；
所述散热结构包括主体，所述主体贴附于所述上表面的中心位置，且所述主体不贴附于四个所述直角和四条所述直角边；
所述散热结构还包括第一侧部和第二侧部，所述第一端部和第二端部分别对应设置在所述主体的两侧边；所述第一侧部和第二侧部设置贴附在所述上表面，且第一侧部和第二侧部远离所述主体的端部贴附在所述数据驱动芯片的两侧的直角边处；所述上表面设置为矩形，所述主体的形状设置为矩形，所述主体的长边与所述上表面的长边相对应平行，所述主体的短边与所述上表面和所述下表面的短边相对应平行；所述第一侧部和第二侧部的长边与所述上表面的长边相对应平行，所述第一侧部和第二侧部的短边与所述的上表面的短边相对应平行；所述第一侧部、主体和第二侧部为一体结构。
本申请公开了一种显示装置，所述显示装置包括显示面板，所述显示面板包括：
主板；
印制电路板，与所述主板电性连接；
数据驱动芯片，设置在所述印制电路板上；以及
散热结构，对数据驱动芯片进行散热；
其中，所述散热结构贴附在所述数据驱动芯片远离所述印制电路板的上表面，且所述上表面的至少一条侧边或一个顶角不贴附有所述散热结构；
以及驱动所述显示面板的驱动电路。
可选的，所述上表面的形状为矩形，所述上表面包括四条直角边以及四条边两两交汇形成的四个直角；所述四条直角边和所述四个直角不贴附有所述散热结构。
可选的，所述上表面的形状为矩形，所述上表面包括四条直角边以及四条边两两交汇形成的四个直角；所述四条直角边和所述四个直角有或不完全贴附有所述散热结构。
可选的，所述散热结构包括主体，所述主体贴附与所述上表面的中心位置，且所述主体不贴附于四个所述直角和四条所述直角边。
可选的，所述散热结构还包括第一侧部和第二侧部，所述第一端部和第二端部分别对应设置在所述主体的两侧边；所述第一侧部和第二侧部设置贴附在所述上表面，且第一侧部和第二侧部远离所述主体的端部贴附在所述数据驱动芯片的两侧的直角边处。
可选的，所述上表面设置为矩形，所述主体的形状设置为矩形，所述主体的长边与所述上表面的长边相对应平行，所述主体的短边与所述上表面和所述下表面的短边相对应平行；所述第一侧部和第二侧部的长边与所述上表面的长边相对应平行，所述第一侧部和第二侧部的短边与所述的上表面的短边相对应平行。
可选的，所述第一侧部、主体和第二侧部为一体结构。
可选的，所述散热结构为铝箔散热片。现在的厂家一般在数据驱动芯片的上表面上贴附散热片进行散热，由于数据驱动芯片是具有一定厚度的，所以散热片在贴附后，在数据驱动芯片的边角处会出现散热片弯折的情况，继而出现散热片贴附不平的情况发生，导致散热贴附后表面不平整且影响了铝箔的散热效果。本方案中散热结构贴附在所述数据驱动芯片远离所述印制电路板的上表面，且所述上表面的至少一条侧边或一个顶角不贴附有所述散热结构。这样保证散热结构贴附在数据驱动芯片的上表面且不会贴附在直角边上，进而避免散热结构出现贴附不平的情况发生，可以有效保持贴附后的表面平整，另外散热结构可与数据驱动芯片良好贴合， 有效传导数据芯片工作时所产生的热量，保证数据芯片的稳定工作。
附图说明
图1是本申请实施例散热结构贴附在数据驱动芯片上的示意图；
图2是本申请实施例一种散热结构贴附在数据驱动芯片上的示意图；
图3是本申请实施例另一种散热结构贴附在数据驱动芯片上的示意图；
图4是本申请实施例显示装置结构示意图；
图5是本申请实施例示例的显示面板结构示意图。
本申请的实施方式
需要说明的是，这里所使用的术语仅仅是为了描述具体实施例而不意图限制示例性实施例。
例如，术语“中心”、“横向”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制；除非另有明确的限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义；术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，单数形式“一个”、“一项”还意图包括复数；“多个”的含义是两个或两个以上。这里所使用的术语“包括”和/或“包含”规定所陈述的特征、整数、步骤、操作、单元和/或组件的存在，而不排除存在或添加一个或更多其他特征、整数、 步骤、操作、单元、组件和/或其组合。
下面结合附图和较佳的实施例对本申请作进一步说明。
现在流行的是在数据驱动芯片60(source driver)的上下面都贴散热铝箔，可是由于数据驱动芯片60(source driver)表面贴附散热铝箔时会出现贴附不平的情况，导致铝箔发生形变，进而影响数据驱动芯片60(source driver)的散热效果。
下面参考图1至图5描述本申请实施例的一种显示面板20和显示装置10。
参考图1，所述显示面板20包括：
主板40；
印制电路板50，与所述主板40电性连接；
数据驱动芯片60，设置在所述印制电路板50上；以及；
散热结构70，对数据驱动芯片60进行散热；
其中，所述散热结构70贴附在所述数据驱动芯片60远离所述印制电路板50的上表面61，且所述上表面61的至少一条侧边或一个顶角不贴附有所述散热结构70。
厂家一般在数据驱动芯片60的上表面61上贴附散热片进行散热，由于数据驱动芯片60是具有一定厚度的，所以散热片在贴附后，在数据驱动芯片60的边角处会出现散热片弯折的情况，继而出现散热片贴附不平的情况发生，导致散热贴附后表面不平整且影响了铝箔的散热效果。本方案中散热结构70贴附在所述数据驱动芯片60远离所述印制电路板50的上表面61，且所述上表面61的至少一条侧边或一个顶角不贴附有所述散热结构70。这样保证散热结构70贴附在数据驱动芯片60的上表面61且不会贴附在直角612边611上，进而避免散热结构70出现贴附不平的情况发生，可以有效保持贴附后的表面平整，另外散热结构70可与数据驱动芯片60良好贴合，有效传导数据芯片工作时所产生的热量，保证数据芯片的稳定工作。
作为本申请的另一实施例，参考图2、图3，与上述实施例不同的在于，所 述上表面61的形状为矩形，所述上表面61包括四条直角612边611以及四条边两两交汇形成的四个直角612；所述四条直角612边611和所述四个直角612不贴附有所述散热结构70；所述散热结构70包括主体71，所述主体71贴附与所述上表面61的中心位置，且所述主体71不贴附于四个所述直角612和四条所述直角612边611；所述散热结构70还包括第一侧部72和第二侧部73，所述第一端部和第二端部分别对应设置在所述主体71的两侧边；所述第一侧部72和第二侧部73设置贴附在所述上表面61，且第一侧部72和第二侧部73远离所述主体71的端部贴附在所述数据驱动芯片60的两侧的直角612边611处；所述上表面61设置为矩形，所述主体71的形状设置为矩形，所述主体71的长边与所述上表面61的长边相对应平行，所述主体71的短边与所述上表面61和所述下表面的短边相对应平行；所述第一侧部72和第二侧部73的长边与所述上表面61的长边相对应平行，所述第一侧部72和第二侧部73的短边与所述的上表面61的短边相对应平行。
本方案中，数据驱动芯片60上表面61的四条直角612边611和所述四个直角612有或不完全贴附有所述散热结构70，一方面在，可以保证散热结构70不贴在数据芯片的直角612边611和直角612位置，避免散热结构70弯折而造成自身结构的形变，进而无法在数据芯片的边角处良好连接，无法有效的传导数据驱动芯片60工作时所产生的热量。另一方面，可以在制作散热结构70的材料，减少生产成本。
本方案中，在主体71两侧边设置第一侧部72和第二侧部73，可以增大散热结构70与数据驱动表面接触的面积，进而散热结构70可以传导更多数据驱动芯片60上所产生的热量。同时第一侧部72和第二侧部73贴在互动芯片两侧的直角612边611处，第一侧部72和第二侧部73因为不需要弯折过多即可贴合在驱动芯片的两侧，加强了散热结构70的贴附强度，避免散热结构70遭受外力后脱落。
本方案中，主体71的长边、短边分别与上表面61的长边、短边相对应平行；第一侧部72，第二侧部73的长边、短边也分别与上表面61的长边，短边相对应平行，这样在将散热结构70往上表面61贴附时，可以根据散热结构70与数据 驱动芯片60的对应的长边，短边进行贴附，这样可以起到指示贴附方向的作用，保证在贴附过程不会贴错方向。
本实施例可选的，所述上表面61的形状为矩形，所述上表面61包括四条直角612边611以及四条边两两交汇形成的四个直角612；所述四条直角612边611和所述四个直角612有或不完全贴附有所述散热结构70。
本方案中，数据驱动芯片60上表面61的四条直角612边611和所述四个直角612有或不完全贴附有所述散热结构70，一方面在，可以保证散热结构70不贴在数据芯片的直角612边611和直角612位置，避免散热结构70弯折而造成自身结构的形变，进而无法再数据芯片的边角处良好连接，无法有效的传导数据驱动芯片60工作时所产生的热量。另一方面，可以在制作散热结构70的材料，减少生产成本。
本实施例可选的，所述第一侧部72、主体71和第二侧部73为一体结构。
本方案中，第一侧部72、主体71和第二侧部73为一体结构，增加了散热结构70的贴附面积，减少作用在散热结构的外力，使得散热结构70特别是主体71部分单位面积收到的外力变小，减小散热结构70特别是主体71部分脱落的可能。另外，相较于第一侧部72和第二侧部73直接连接并横跨在主体71上形成两层铝箔的方式，减少了厚度，然后又避免了主体71和侧部独立成型在组装贴附可能出现的连接错位。
本实施例可选的，散热结构70材料为铝箔。
另外，在主体71的长边侧设置位置相对应的第三侧部80和第四侧部90。
本方案中，主体71设置有第三侧部80和第四侧部90后，散热结构70与数据驱动芯片60的接触面价增加，散热结构70的能传导热量的面积增大，进而提高了散热结构70的散热效率。另外，在散热结构70贴附后，第三侧部80和第四侧部90能给主体71提供两侧的支撑，防止主体71遭受外力不易脱落。
本方案中，铝箔是一种高效传热材料，而且铝箔可塑强，是对电子元器件散热的理想材料。
作为本申请的另一实施例，参考图2、图2与上述实施例不同的在于，
一种显示面板20，所述显示面板20包括：
主板40；
印制电路板50，与所述主板40电性连接；
数据驱动芯片60，设置在所述印制电路板50上；
散热结构70，对数据驱动芯片60进行散热；
其中，所述散热结构70贴附在所述数据驱动芯片60远离所述印制电路板50的上表面61，且所述上表面61的至少一条侧边或一个顶角不贴附有所述散热结构70；
所述散热结构70为铝箔散热片，包括主体71，所述主体71贴附与所述上表面61的中心位置，且所述主体71不贴附于四个所述直角612和四条所述直角612边611；
所述散热结构70包括主体71，所述主体71贴附与所述上表面61的中心位置，且所述主体71不贴附于四个所述直角612和四条所述直角612边611；所述散热结构70还包括第一侧部72和第二侧部73，所述第一端部和第二端部分别对应设置在所述主体71的两侧边；所述第一侧部72和第二侧部73设置贴附在所述上表面61，且第一侧部72和第二侧部73远离所述主体71的端部贴附在所述数据驱动芯片60的两侧的直角612边611处；所述上表面61设置为矩形，所述主体71的形状设置为矩形，所述主体71的长边与所述上表面61的长边相对应平行，所述主体71的短边与所述上表面61和所述下表面的短边相对应平行；所述第一侧部72和第二侧部73的长边与所述上表面61的长边相对应平行，所述第一侧部72和第二侧部73的短边与所述的上表面61的短边相对应平行；所述第一侧部72、主体71和第二侧部73为一体结构；
本方案中，散热结构70为铝箔散热片，铝箔是一种高效传热的材料，是对电子元器件散热的理性材料，铝箔散热片包括第一侧部72，主体71，第二侧部73，主体71贴附在数据驱动芯片60上表面61的中心位置且主体71不贴附于上表面61 的四个直角612和四条直角612边611，数据驱动芯片60的中心位置时主要的产热位置，在此位置贴附有高效传导数据驱动芯片60的热量，另外，主体71贴附后表面平整不会出现弯折进而导致铝箔散热片的形变，最终影响铝箔散热片与数据驱动芯片60的贴合，不能高效传导热量，导致数据驱动芯片60高温不能稳定工作；主体71的长边、短边分别与上表面61的长边、短边相对应平行；第一侧部72，第二侧部73的长边、短边也分别与上表面61的长边，短边相对应平行，这样在将散热结构70往上表面61贴附时，可以根据散热结构70与数据驱动芯片60的对应的长边，短边进行贴附，这样可以起到指示贴附方向的作用，保证在贴附过程不会贴错方向；第一侧部72、主体71和第二侧部73为一体结构，增加了散热结构70的贴附面积，减少在外力作用时时，散热结构70特别是主体71部分单位面积收到的外力变小，减小散热结构70特别是主体71部分脱落的可能。另外，相较于第一侧部72和第二侧部73直接连接并横跨在主体71上形成两层铝箔的方式，减少了厚度，然后又避免了主体71和侧部独立成型在组装贴附可能出现的连接错位。
作为本申请的另一实施例，参考图2、图4，与上述实施例不同的在于，
一种显示装置10，包括显示面板20，所述显示面板20包括：
主板40；
印制电路板50，与所述主板40电性连接；
数据驱动芯片60，设置在所述印制电路板50上；
散热结构70，对数据驱动芯片60进行散热；
其中，所述散热结构70贴附在所述数据驱动芯片60远离所述印制电路板50的上表面61，且所述上表面61的至少一条侧边或一个顶角不贴附有所述散热结构70，以及驱动所述显示面板20的驱动电路30。
厂家一般在数据驱动芯片60的上表面61上贴附散热片进行散热，由于数据驱动芯片60是具有一定厚度的，所以散热片在贴附后，在数据驱动芯片60的边角处会出现散热片弯折的情况，继而出现散热片贴附不平的情况发生，导致散热贴附后表面不平整且影响了铝箔的散热效果。本方案中散热结构70贴附在所述数据 驱动芯片60远离所述印制电路板50的上表面61，且所述上表面61的至少一条侧边或一个顶角不贴附有所述散热结构70。这样保证散热结构70贴附在数据驱动芯片60的上表面61且不会贴附在直角612边611上，进而避免散热结构70出现贴附不平的情况发生，可以有效保持贴附后的表面平整，另外散热结构70可与数据驱动芯片60良好贴合，有效传导数据芯片工作时所产生的热量，保证数据芯片的稳定工作。
本申请的技术方案可以广泛用于各种显示面板，如TN型显示面板(全称为Twisted Nematic，即扭曲向列型面板)、IPS型显示面板(In-Plane Switching，平面转换)、VA型显示面板(Multi-domain Vertical Alignment，多象限垂直配向技术)，当然，也可以是其他类型的显示面板，如有机发光显示面板(organic light-emitting diode，简称OLED显示面板)，均可适用上述方案。
以上内容是结合具体的优选实施方式对本申请所作的进一步详细说明，不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本申请的保护范围。

Claims (17)

  1. 一种显示面板，所述显示面板包括：
    主板；
    印制电路板，与所述主板电性连接；
    数据驱动芯片，设置在所述印制电路板上；以及；
    散热结构，对数据驱动芯片进行散热；
    其中，所述散热结构贴附在所述数据驱动芯片远离所述印制电路板的上表面，且所述上表面的至少一条侧边或一个顶角不贴附有所述散热结构。
  2. 如权利要求1所述一种显示面板，其中，所述上表面的形状为矩形，所述上表面包括四条直角边以及四条边两两交汇形成的四个直角；所述四条直角边和所述四个直角不贴附有所述散热结构。
  3. 如权利要求1所述一种显示面板，其中，所述上表面的形状为矩形，所述上表面包括四条直角边以及四条边两两交汇形成的四个直角；所述四条直角边和所述四个直角有或不完全贴附有所述散热结构。
  4. 如权利要求1所述一种显示面板，其中，所述散热结构包括主体，所述主体贴附与所述上表面的中心位置，且所述主体不贴附于四个所述直角和四条所述直角边。
  5. 如权利要求4所述一种显示面板，其中，所述散热结构还包括第一侧部和第二侧部，所述第一端部和第二端部分别对应设置在所述主体的两侧边；所述第一侧部和第二侧部设置贴附在所述上表面，且第一侧部和第二侧部远离所述主体的端部贴附在所述数据驱动芯片的两侧的直角边处。
  6. 如权利要求5所述一种显示面板，其中，所述上表面设置为矩形，所述主体的形状设置为矩形，所述主体的长边与所述上表面的长边相对应平行，所述主体的短边与所述上表面和所述下表面的短边相对应平行；所述第一侧部和第二侧部的长边与所述上表面的长边相对应平行，所述第一侧部和第二侧部的短边与所述的上表面的短边相对应平行。
  7. 如权利要求5所述一种显示面板，其中，所述第一侧部、主体和第二侧部为一体结构。
  8. 如权利要求1所述一种显示面板，其中，所述散热结构为铝箔散热片。
  9. 一种显示面板，所述显示面板包括：
    主板；
    印制电路板，与所述主板电性连接；
    数据驱动芯片，设置在所述印制电路板上；以及；
    散热结构，对数据驱动芯片进行散热；
    其中，所述散热结构贴附在所述数据驱动芯片远离所述印制电路板的上表面，且所述上表面的至少一条侧边或一个顶角不贴附有所述散热结构；
    所述散热结构包括主体，所述主体贴附于所述上表面的中心位置，且所述主体不贴附于四个所述直角和四条所述直角边；
    所述散热结构还包括第一侧部和第二侧部，所述第一端部和第二端部分别对应设置在所述主体的两侧边；所述第一侧部和第二侧部设置贴附在所述上表面，且第一侧部和第二侧部远离所述主体的端部贴附在所述数据驱动芯片的两侧的直角边处；所述上表面设置为矩形，所述主体的形状设置为矩形，所述主体的长边与所述上表面的长边相对应平行，所述主体的短边与所述上表面和所述下表面的短边相对应平行；所述第一侧部和第二侧部的长边与所述上表面的长边相对应平行，所述第一侧部和第二侧部的短边与所述的上表面的短边相对应平行；所述第一侧部、主体和第二侧部为一体结构。
  10. 一种显示装置，所述显示装置包括显示面板，所述显示面板包括：
    主板；
    印制电路板，与所述主板电性连接；
    数据驱动芯片，设置在所述印制电路板上；
    散热结构，对数据驱动芯片进行散热；
    其中，所述散热结构贴附在所述数据驱动芯片远离所述印制电路板的上表面，且所述上表面的至少一条侧边或一个顶角不贴附有所述散热结构；
    以及驱动所述显示面板的驱动电路。
  11. 如权利要求10所述一种显示装置，其中，所述上表面的形状为矩形，所述上表面包括四条直角边以及四条边两两交汇形成的四个直角；所述四条直角边和所述四个直角不贴附有所述散热结构。
  12. 如权利要求10所述一种显示装置，其中，所述上表面的形状为矩形，所述上表面包括四条直角边以及四条边两两交汇形成的四个直角；所述四条直角边和所述四个直角有或不完全贴附有所述散热结构。
  13. 如权利要求10所述一种显示装置，其中，所述散热结构包括主体，所述主体贴附与所述上表面的中心位置，且所述主体不贴附于四个所述直角和四条所述直角边。
  14. 如权利要求13所述一种显示装置，其中，所述散热结构还包括第一侧部和第二侧部，所述第一端部和第二端部分别对应设置在所述主体的两侧边；所述第一侧部和第二侧部设置贴附在所述上表面，且第一侧部和第二侧部远离所述主体的端部贴附在所述数据驱动芯片的两侧的直角边处。
  15. 如权利要求14所述一种显示装置，其中，所述上表面设置为矩形，所述主体的形状设置为矩形，所述主体的长边与所述上表面的长边相对应平行，所述主体的短边与所述上表面和所述下表面的短边相对应平行；所述第一侧部和第二侧部的长边与所述上表面的长边相对应平行，所述第一侧部和第二侧部的短边与所述的上表面的短边相对应平行。
  16. 如权利要求14所述一种显示装置，其中，所述第一侧部、主体和第二侧部为一体结构。
  17. 如权利要求10所述一种显示装置，其中，所述散热结构为铝箔散热片。
PCT/CN2018/113320 2018-08-29 2018-11-01 一种显示面板和显示装置 Ceased WO2020042335A1 (zh)

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