TW200944882A - Back panel structure of backlight module - Google Patents

Back panel structure of backlight module Download PDF

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Publication number
TW200944882A
TW200944882A TW97115703A TW97115703A TW200944882A TW 200944882 A TW200944882 A TW 200944882A TW 97115703 A TW97115703 A TW 97115703A TW 97115703 A TW97115703 A TW 97115703A TW 200944882 A TW200944882 A TW 200944882A
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Taiwan
Prior art keywords
circuit board
backlight module
printed circuit
backplane structure
backplane
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TW97115703A
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Chinese (zh)
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TWI369538B (en
Inventor
Shih-Tao Lai
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Century Display Shenxhen Co
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Priority to TW97115703A priority Critical patent/TW200944882A/en
Publication of TW200944882A publication Critical patent/TW200944882A/en
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Publication of TWI369538B publication Critical patent/TWI369538B/zh

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Abstract

The present invention discloses a back panel structure of backlight module, which includes: a frame; a back panel disposed inside the frame while the back panel has at least one all-through positioning hole and positioning part; a driver circuit board installed with a fixing hole located at the relative position of the positioning hole of the back panel; and a first fixing element and a second fixing element which respectively correspond to the back panel, fixing hole and the fixing part of driver circuit board so that the back panel and driver circuit board are combined and fixed in the frame. The present invention enhances the insulation effect of the driver circuit board and reduces occurrence of shorting of electronic components, lowers the material cost and assembling time.

Description

200944882 九、發明說明: 【發明所屬之技術領域】 本發明係«-種背光肋裝置,且制是_—種背光模組之 背板結構。 【先前技術】 由於液晶面板不是自發級_示裝置,必鋪助外部光源達到 顯示效果,-般的液晶面板幾乎採用背光模組,而背光模組主要提供 液晶面板均勻、高亮度的光線來源,基本原理係將常用的點或線型光 ❿源’透過簡潔有效光轉化成高亮度且均一輝度的面光源產品。 而近年隨著平面顯示器產業的進步,液晶顯示器製造技術的提 昇’雖然帶動平面顯示器成本的下降,但產品的利潤也隨著生產技術 的成熟順勢導致大量生產而降低。是以,必須在產品各部分的設計上 追求精簡,以維持在保有應有的功能之下省略構件以降低成本。其中, 在大尺寸及低價格的趨勢下,背光模組在考量輕量化、薄型化、低耗 電、南亮度及降低成本的市場要求,為保持在未來市場的競爭力,開 發與設計新型的背光模組及射出成型的新製作技術,是努力的方向及 重要課題。 Q 在平面顯示器的成本結構中,背光模組占有16%,次於彩色濾光 片及驅動丨C’占第三位,由於背光模組的技術門檻低於其它關鍵零組 件,並且屬於勞力集中生產和製造管理要求高的產業,因此背光模組 生產可降低的成本的重要課題之一。 請同時參閱第1、2與第3圖所示,係習知背光模組結構之侧視圖, 其有一金屬背板10 ’金屬背板10 —侧設有一驅動電路板11 (source driver IC ; COF) ’驅動電路板11連結一印刷電路板(prjnted circuit board,PCB) 12 ’而金屬背板1〇另一側則依序設有導光板15與由 彩色濾光片14與玻璃基板13所組成之液晶面板,而一塑膠框16置 於金屬背板10與玻璃基板13之前後端之間使其各元件組合後能固定 5 200944882 於一鐵框17中。上述作法係將金屬背板1〇利用沖磨形成凸點(火山 口狀)18,再利用此凸點18作為固定印刷電路板12,而印刷電路板 12會有許多孔洞(via),因此金屬背板與印刷電路板12固定的地 方會有短路的可能,故一般會用絕緣橡膠19貼覆在金屬背板1〇與凸 點18上以利絕緣。因此,對於製作的流程上來說,係相當地繁複且必 須耗費較高的製程與材料成本。 基於上述之習知技術可知,本發明係提出一種背光模組之背板結 構,以解決習知技術所遭遇之困難。 ^ 【發明内容】 本發明之主要目的,係提出一種背光模組之背板結構,其係藉由 塑膠框形成凸點取代背板凸點,達到保護背光模組與@定印刷電路板。 本發明之另一目的,係提出一種背光模組之背板結構,其係藉由 背板結構與塑膠框的固定達到絕緣功效同時降低材料成本與組裝工 時。 為達上述之目的,本發明提供一種背光模組之背板結構,此背光 模組之背板結構係包括有··一框架;一背板,置於此框架内,其具有 至少一貫穿之定位孔及至少一定位部;一驅動電路板,此驅動電路板 Q之一端相對於此背板之定位部位置設有貫穿此驅動電路板之固定孔; 第一固定元件’其係對應此背板一端與其所設置之定位孔,及一第 一固定元件’其係分別對應此背板之定位部與與驅動電路板之固定 孔。透過第一與第二固定元件與其所對應的固定孔、定位部的固定而 將背板與驅動電路結合於一起而固定於此框架中。 底下藉由具體實施例配合所附的圖式詳加說明,當更容易暸解本 發明之目的、技術内容、特點及其所達成之功效。 【實施方式】 為了為達到節省成本目的,驅動電路板的長度減短已是趨勢,順 勢著印刷電路板與鐵框的距離需要縮短,因此印刷電路板與塑膠框的 6 200944882 距離也相對變短。是以,本發_提出—射絲組之背板結構 以下將詳細揭露本發明之實施態樣,並同時佐以圖式來輔助說明。 請先參考第4圖所示’其係為本發明第—種背光模组之背板結構 20之側面剖視不意圖’圖示尹本發明背光模組之背板結構2〇包含 -框架21,本實補以框架21為-雌為說_ ;—背板22 22為金屬材質’係置於框架21巾,此背板22具有至少一貫穿之定位 孔23及至少一定位部231,其中,定位孔23可為方形或圓形等形狀, 本實施例以圓形為說明例,而定值部231則為一螺絲孔;一驅動電路 ❹板24 ’此驅動電路板24具有-積體電路控制晶片(|C) 241與一印 刷電路板(Printed circuit board,PCB) 242,此印刷電路板242可 為一軟性電路板,而積體電路控制晶片241係為軟板承載晶片封裝 (Chipon Flex’COF),此印刷電路板242具有第一表面42彳與第二 表面422 ’印刷電路板242 —端相對於背板22之定位部231位置設 有貫穿之固定孔243 ; —第一固定元件26,其係對應背板22之定位 孔23,一第二固定元件28,其係用以分別對應背板22之定位部231 與印刷電路板242之固定孔243,其中,第一固定元件26係為塑膠框, 而第二固定元件28為螺件。如圖所示,背板22與驅動電路板24之 ❹印刷電路板242係藉由第一固定元件26形成一凸點261,此凸點261 係配合定位孔23之形狀形成方形或圓形之造型(後續文中輔以圖示說 明之)’並由此背板22正面穿過定位孔23至頂住此印刷電路板242 之第二表面422之相對定位部231之另一端,在透過第二固定元件28 穿入印刷電路板242之固定孔243並鎖固於定位部231中,使背板 22與印刷電路板242相互結合。請同時參考第5與第6圖,第5圖為 當凸點261與定位孔23為圓形時之印刷電路板242正面示意圖,而 第6圖則是凸點216與定位孔23形成方形時之印刷電路板242正面 示意圖。 而為了避免背板22與印刷電路板242接合的地方會有短路的情 7 200944882 況發生’則可進一步在背板22與印刷電路板242間增設一絕緣橡膠 29的貼覆’以利絕緣。在完成背板22與驅動電路板24之印刷電路板 242結合後,框架21内之背板22由内依序組裝導光板291與由彩色 據光片293及玻璃基板292所組成之液晶面板,而完成本發明背光模 組之背板結構20的組裝。 請接續參考第7圖所示,其係為本發明第二種背光模組之背板結 構30之側面剖視示意圖’圖示中本發明背光模組之背板結構3〇包含 有一框架31,本實施例以框架31為一鐵框為說明例;一背板32,背 ❹板32為金屬材質,係置於框架中,此背板32具有至少一定位部 321,定位部321係為一螺絲孔;一驅動電路板34,此驅動電路板34 具有一積體電路控制晶片(IC) 341與一印刷電路板(printed circuit board,PCB) 342 ’此印刷電路板342可為一軟性電路板,而積體電 路控制晶片341係為軟板承載晶片封裝(chipon Flex,COF),此印 刷電路板342具有第一表面423與第二表面424,印刷電路板342 — 端相對於背板32之定位部321位置設有貫穿之固定孔343; —第一固 定元件36,其係對應背板32之第二表面424,一第二固定元件38, 其係用以分別對應背板32之定位部321與此印刷電路板342之固定 ❹孔343,其中,第一固定元件36係為一塑膠框,而二固定元件38為 螺件。如圖所示’背板32與驅動電路板44之印刷電路板342係藉由 第一固定元件36形成一凸點361,此凸點361可形成方形或圓形之造 型(後績文中輔以圖示說明之),藉此凸點361穿過背板32使背板32 前端接觸凸點361且凸點361頂住印刷電路板342之第二表面424 之相對定位部321之另一端,再透過第二固定元件38穿入此印刷電 路板342之固定孔343並鎖固於定位部321中,使背板32與印刷電 路板342相互結合。請同時參考第8與第9圖,第8圖為凸點361形 成方形時之印刷電路板342正面示意圖;而第9圖則是凸點361形成 方形時之印刷電路板342正面示意圖。另外,凸點361形成方形形狀 8 200944882 的實施方式中,可將凸點361設計為完全能夠支撐印刷電路板342的 長度設計,達到更穩固的固定效果,即如10圖所示。 而為了避免背板32與印刷電路板342接合的地方會有短路的情 況發生,則可進一步在背板32與印刷電路板342間增設一絕緣橡膠 39的貼覆’以利絕緣❹在完成背板32與驅動電路板34之印刷電路板 342結合後,框架31内之背板32由内依序組裝導光板391與由彩色 濾光片393及玻璃基板392所組成之液晶面板,而完成本發明背光模 組之背板結構30的組裝。藉由前述實施方式可知,本發明所揭露之背 光模組之背板結構,不但可保有現有技術之功效甚至更好的固定方 式,同時更能減少組裝時的製造流程與單位材料的成本,以提高生產 者的競爭力。 以上所述係藉由實施例說明本發明之特點,其目的在使熟習該技 術者能暸解本發明之内容並據以實施,而非限定本發明之專利範圍, 故,凡其他未脫離本發明所揭示之精神所完成之等效修飾或修改,仍 應包含在以下所述之申請專利範圍中。 【圖式簡單說明】 第1圖為習知的背光模組結構之側視圖。200944882 IX. Description of the Invention: [Technical Field of the Invention] The present invention is a backlight rib device and is a back plate structure of a backlight module. [Prior Art] Since the liquid crystal panel is not a self-leveling device, it must help the external light source to achieve the display effect. The general liquid crystal panel uses almost the backlight module, and the backlight module mainly provides a uniform and high-brightness light source of the liquid crystal panel. The basic principle is to convert a commonly used point or line diaphragm source into a high-brightness and uniform brightness surface light source product through simple and effective light. In recent years, with the advancement of the flat panel display industry, the improvement of liquid crystal display manufacturing technology has driven down the cost of flat panel displays, but the profit of products has also decreased due to the maturity of production technology and mass production. Therefore, it is necessary to pursue streamlining in the design of each part of the product in order to maintain the function of omitting the components to reduce the cost while maintaining the function. Among them, in the trend of large size and low price, the backlight module considers the market requirements of lightweight, thin, low power consumption, south brightness and cost reduction, in order to maintain competitiveness in the future market, develop and design new types. The backlight module and the new production technology of injection molding are the direction and important issues of the effort. Q In the cost structure of the flat panel display, the backlight module occupies 16%, which is the third color after the color filter and the driving 丨C'. Because the technical threshold of the backlight module is lower than other key components, and it belongs to labor concentration. Production and manufacturing management require high industries, so backlight modules produce one of the important topics that can reduce costs. Please also refer to the first, second and third figures, which are side views of a conventional backlight module structure, which has a metal back plate 10 'metal back plate 10 - side is provided with a driving circuit board 11 (source driver IC; COF The 'drive circuit board 11 is connected to a prjnted circuit board (PCB) 12' and the metal back board 1 is provided with a light guide plate 15 and a color filter 14 and a glass substrate 13 on the other side. The liquid crystal panel, and a plastic frame 16 is placed between the metal back plate 10 and the front end of the glass substrate 13 so that the components can be combined to fix the 5 200944882 in an iron frame 17. In the above method, the metal back plate 1 is punched to form a bump (crater shape) 18, and the bump 18 is used as the fixed printed circuit board 12, and the printed circuit board 12 has many vias, so the metal There is a possibility of short circuit between the back plate and the printed circuit board 12. Therefore, the insulating rubber 19 is generally applied to the metal back plate 1 and the bumps 18 for insulation. Therefore, the process flow is quite complicated and requires high process and material costs. Based on the above-mentioned prior art, the present invention provides a backplane structure of a backlight module to solve the difficulties encountered by the prior art. SUMMARY OF THE INVENTION The main purpose of the present invention is to provide a backplane structure of a backlight module, which is formed by forming bumps on the plastic frame instead of bumps on the backplane to protect the backlight module and the @fixed printed circuit board. Another object of the present invention is to provide a backplane structure of a backlight module, which is insulated by the fixing of the backplane structure and the plastic frame while reducing material cost and assembly man-hour. In order to achieve the above object, the present invention provides a backplane structure of a backlight module, the backplane structure of the backlight module includes a frame, and a backplane disposed in the frame, having at least one through a positioning hole and at least one positioning portion; a driving circuit board, one end of the driving circuit board Q is provided with a fixing hole penetrating the driving circuit board at a position of the positioning portion of the backing board; the first fixing component 'corresponds to the back One end of the plate and the positioning hole provided therein, and a first fixing element respectively correspond to the positioning portion of the back plate and the fixing hole of the driving circuit board. The back plate and the driving circuit are coupled to each other by fixing the first and second fixing members to their corresponding fixing holes and positioning portions. The purpose, technical contents, features, and effects achieved by the present invention will become more apparent from the detailed description of the embodiments and the accompanying drawings. [Embodiment] In order to achieve cost-saving, the length of the driving circuit board is shortened. The distance between the printed circuit board and the iron frame needs to be shortened, so the distance between the printed circuit board and the plastic frame 6 200944882 is relatively short. . Therefore, the embodiment of the present invention will be described in detail below with reference to the accompanying drawings. Please refer to FIG. 4, which is a side view of the backplane structure 20 of the backlight module of the present invention. The back panel structure of the backlight module of the invention is included. The present invention is made up of the frame 21 as a female _; the back plate 22 22 is made of a metal material, which is placed on the frame 21, and the back plate 22 has at least one positioning hole 23 and at least one positioning portion 231, wherein The positioning hole 23 may be in the shape of a square or a circle. In this embodiment, a circular shape is taken as an example, and the fixed value portion 231 is a screw hole; and a driving circuit board 24 'the driving circuit board 24 has an integrated body The circuit control chip (|C) 241 and a printed circuit board (PCB) 242, the printed circuit board 242 can be a flexible circuit board, and the integrated circuit control chip 241 is a flexible board carrier chip package (Chipon Flex'COF), the printed circuit board 242 has a first surface 42A and a second surface 422'. The printed circuit board 242 is provided with a through hole 243 at a position relative to the positioning portion 231 of the back plate 22; The component 26 is corresponding to the positioning hole 23 of the back plate 22, and a second fixing component 28 The fixing elements 243 are respectively corresponding to the positioning portion 231 of the backboard 22 and the fixing hole 243 of the printed circuit board 242, wherein the first fixing component 26 is a plastic frame and the second fixing component 28 is a screw. As shown in the figure, the printed circuit board 242 between the backboard 22 and the driving circuit board 24 is formed with a bump 261 by the first fixing member 26, and the bump 261 is formed into a square or a circular shape in accordance with the shape of the positioning hole 23. Shape (subsequently illustrated by the illustration) 'and thus the front side of the back plate 22 passes through the positioning hole 23 to the other end of the opposite positioning portion 231 of the second surface 422 of the printed circuit board 242, through the second The fixing member 28 penetrates into the fixing hole 243 of the printed circuit board 242 and is locked in the positioning portion 231 to bond the back plate 22 and the printed circuit board 242 to each other. Please refer to FIG. 5 and FIG. 6 at the same time. FIG. 5 is a front view of the printed circuit board 242 when the bump 261 and the positioning hole 23 are circular, and FIG. 6 is a case where the bump 216 and the positioning hole 23 form a square. The front side of the printed circuit board 242 is schematic. In order to avoid a short circuit in the place where the backboard 22 and the printed circuit board 242 are joined, a "attachment of insulating rubber 29" may be further added between the backboard 22 and the printed circuit board 242 to facilitate insulation. After the backing plate 22 is combined with the printed circuit board 242 of the driving circuit board 24, the backing plate 22 in the frame 21 is assembled with the light guiding plate 291 and the liquid crystal panel composed of the color light-emitting sheet 293 and the glass substrate 292. The assembly of the backplane structure 20 of the backlight module of the present invention is completed. Please refer to FIG. 7 , which is a side cross-sectional view of the backplane structure 30 of the second backlight module of the present invention. The back panel structure 3 of the backlight module of the present invention includes a frame 31. In this embodiment, the frame 31 is an iron frame as an example; a back plate 32 is made of a metal material and is placed in the frame. The back plate 32 has at least one positioning portion 321 , and the positioning portion 321 is a a drive hole 34; the drive circuit board 34 has an integrated circuit control chip (IC) 341 and a printed circuit board (PCB) 342 '. The printed circuit board 342 can be a flexible circuit board. The integrated circuit control chip 341 is a chip-on-chip package (chipon Flex, COF) having a first surface 423 and a second surface 424, and the printed circuit board 342 is opposite to the back plate 32. The positioning portion 321 is provided with a through hole 343; a first fixing member 36 corresponding to the second surface 424 of the back plate 32, and a second fixing member 38 for respectively corresponding to the positioning portion of the back plate 32. 321 and the fixed pupil 343 of the printed circuit board 342 The first fixing member 36 is a plastic frame, and the two fixing members 38 are screw members. As shown, the backing plate 32 and the printed circuit board 342 of the driving circuit board 44 form a bump 361 by the first fixing member 36. The bump 361 can form a square or a circular shape. As illustrated, the bump 361 passes through the backing plate 32 such that the front end of the backing plate 32 contacts the bump 361 and the bump 361 bears against the other end of the opposite positioning portion 321 of the second surface 424 of the printed circuit board 342. The fixing hole 343 of the printed circuit board 342 is inserted through the second fixing member 38 and locked in the positioning portion 321 to bond the back plate 32 and the printed circuit board 342 to each other. Please refer to FIGS. 8 and 9 at the same time. FIG. 8 is a front view of the printed circuit board 342 when the bumps 361 are square, and FIG. 9 is a front view of the printed circuit board 342 when the bumps 361 are square. In addition, the bumps 361 form a square shape. In the embodiment of 200944882, the bumps 361 can be designed to fully support the length design of the printed circuit board 342 for a more stable fixing effect, as shown in FIG. In order to avoid a short circuit in the place where the backplane 32 and the printed circuit board 342 are joined, an overlay of an insulating rubber 39 may be further added between the backboard 32 and the printed circuit board 342 to facilitate the insulation. After the board 32 is combined with the printed circuit board 342 of the driving circuit board 34, the back board 32 in the frame 31 is assembled with the light guiding board 391 and the liquid crystal panel composed of the color filter 393 and the glass substrate 392. The assembly of the backplane structure 30 of the backlight module is invented. It can be seen from the foregoing embodiments that the backplane structure of the backlight module disclosed in the present invention can not only maintain the efficacy of the prior art but also better the fixing manner, and at the same time, can reduce the manufacturing process and the cost of the unit material during assembly. Improve the competitiveness of producers. The above description of the present invention is intended to be illustrative of the invention, and is intended to be understood by those skilled in the art Equivalent modifications or modifications made by the spirit of the invention should still be included in the scope of the claims described below. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view of a conventional backlight module structure.

第2圖為f知的背光模減構巾的背板與印刷電路板結合示意圖。 第3圖為習知的背光模組結構中的印刷電路板之圓形支撐點示意圖。 第4圖為本發明之第—種背絲組之背板結構之側面剖視示意圖。 第5囷本發明之第—種背光模狀背板結構之_第— 刷電路板之正面示意圖。 第6圖本發日狀第-種背光模組之f板結構之方形第-固定元件與印 刷電路板之正面示意圖。 第7圖為本發明之第二種背光模組之背板結構之侧面舰示意圖。 第8圖為本發明之第二種背光歡之她賴之圓形第—蚊元件與 印刷電路板之正面示意圓。 、 9 200944882 第9圖為本發明之第二種背光模組之背板結構之方形第— 印刷電路板之正面示意圖。 固定元件與 第10圖為本發明之第二種背光模組之背板結構之方形第—固 另一設計態樣與印刷電路板之正面示意圖。 70 【主要元件符號說明】Fig. 2 is a schematic view showing the combination of the back plate of the backlight mode subtractive tissue and the printed circuit board. FIG. 3 is a schematic diagram of a circular support point of a printed circuit board in a conventional backlight module structure. Fig. 4 is a side cross-sectional view showing the structure of the back sheet of the first type of back yarn group of the present invention. In the fifth aspect of the present invention, a front view of the first brush circuit board of the backlight type backplane structure is shown. Fig. 6 is a front elevational view showing the square-fixed component and the printed circuit board of the f-plate structure of the first-type backlight module. FIG. 7 is a schematic side view of the backplane structure of the second backlight module of the present invention. Fig. 8 is a front schematic circle of the circular-mosquito element and the printed circuit board of the second type of backlighting of the present invention. 9 200944882 FIG. 9 is a front view of a square-printed circuit board of a backplane structure of a second type of backlight module of the present invention. The fixed component and the tenth figure are the square first solid structure of the back plate structure of the second backlight module of the present invention, and the front view of the other design aspect and the printed circuit board. 70 [Main component symbol description]

1〇金屬背板 12印刷電路板 14彩色濾光片 16塑膠框 18凸點 20背光模皴之背板結構 22背板 231定位部 241積體電路控制晶片 421第一表面 243固定孔 261凸點 29絕緣橡膠 292玻璃基板 30背光模組之背板結構 32背板 11驅動電路板 13玻璃基板 15導光板 17框架 19絕緣橡膠 21框架 23定位孔 24驅動電路板 242印刷電路板 422第二表面 26第一固定元件 28第二固定元件 291導光板 293彩色濾光片 31框架 321定位部 341積鱧電路控制晶片 423第一表面 343固定孔 361凸點 39絕緣橡膠 34驅動電路板 342印刷電路板 424第二表面 36第一固定元件 38第二固定元件 391導光板 200944882 392玻璃基板 393彩色濾光片1 〇 metal back plate 12 printed circuit board 14 color filter 16 plastic frame 18 bump 20 backlight module back plate structure 22 back plate 231 positioning portion 241 integrated circuit control wafer 421 first surface 243 fixing hole 261 bump 29Insulating Rubber 292 Glass Substrate 30 Backlight Module Backing Plate Structure 32 Backing Plate 11 Driving Circuit Board 13 Glass Substrate 15 Light Guide Plate 17 Frame 19 Insulating Rubber 21 Frame 23 Positioning Hole 24 Driving Circuit Board 242 Printed Circuit Board 422 Second Surface 26 First fixing member 28 second fixing member 291 light guide plate 293 color filter 31 frame 321 positioning portion 341 accumulation circuit control wafer 423 first surface 343 fixing hole 361 bump 39 insulating rubber 34 driving circuit board 342 printed circuit board 424 Second surface 36 first fixing element 38 second fixing element 391 light guide plate 200944882 392 glass substrate 393 color filter

1111

Claims (1)

200944882 十、申請專利範圍: 1’ 種奇光模組之背板結構,其係包括: 一框架; 一背板’置於該框架内,其具有至少一貫穿之定位孔及至少一定位 部; 一驅動電路板,該驅動電路板之一端相對於該背板之該定位部位置 設有貫穿該驅動電路板之固定孔;以及 ❹200944882 X. Patent application scope: 1' Backplane structure of a strange light module, comprising: a frame; a backing plate is disposed in the frame, and has at least one positioning hole and at least one positioning portion; a driving circuit board, wherein one end of the driving circuit board is provided with a fixing hole penetrating the driving circuit board with respect to the positioning portion of the backing board; and 一第一固定元件,其係對應該背板之定位孔,一第二固定元件,其 係分別對應該背板之定位部與該驅動電路板之固定孔。 2·如申請專利範圍第1項所述之背光模組之背板結構,其中該驅動電 路板具有一積體電路控制晶片(IC)與一印刷電路板(prtnted drcuit board ’ PCB),該印刷電路板具有第一表面與第二表面。 3. 如申請專利範圍第1項所述之背光模組之背板結構,其令該定位孔 可為方形或圓形等形狀。 4. 如申請專利範圍第1項所述之背光模組之背板結構,其中該第一固 定元件為一塑膠框。 5·如申請專利範圍第4項所述之背光模組之背板結構,其中該塑膠框 係形成一凸點。 ~ 6.如申請專利範圍第5項所述之背光模組之背板結構,其中該凸點可 依據該定位孔形狀而形成圓形或方形之凸點。 Χ ' 7·如申請專利範圍第i項所述之背光模組之背板結構,其中該第二 定元件為一螺件。 ' A _ 8·如申請專利範圍第1項所述之背光模組之背板結構,其中該定位 係為一螺絲孔,供該第二固定元件鎖固。 ' 9.如申請專利範圍第2項所述之背光模組之背板結構,其中該 該印刷電路板係藉由該第一固定元件由該背板正面穿過^定位二 至頂住該印刷電路板之第二表面之相對該定位部之另一 12 .200944882 二固定元件穿入該印刷電路板之該固定孔並鎖固於該定位部中,使 該背板與該印刷電路板相互結合。 10. 如申請專利範圍第9項所述之背光模組之背板結構,其中該背板與 該印刷電路板間更可設置一絕緣裝置’以避免該印刷電路板短路的 發生。 11. 如申請專利範圍第10項所述之背光模之組背板結構,其中該絕緣 裝置可為一絕緣橡膠。 12. 如申請專利範圍第2項所述之背光模組之背板結構,其中該印刷電 0 路板為一軟性電路板。 13. 如申請專利範圍第2項所述之背光模組背板結構,其中該積體電路 控制晶片為軟板承載晶片封裝(Chip on Flex,COF)。 14·如申請專利範圍第1項所述之背光模組之背板結構,其中該框架可 為金屬或塑膠材質。 15·如申請專利範圍第1項所述之背光模組之背板結構,其中該背板可 為金屬材質。 16· 一種背光模組之背板結構,其係包括: 一框架; Q 一背板’置於該框架内,其具有至少一定位部; 一驅動電路板’該媒動電路板之一端相對於該背板之該定位部位置 設有貫穿該驅動電路板之固定孔;以及 一第一固定元件,其係對應該背板前端與該驅動電路板之表面,一 第二固定元件’其係分別對應該背板之定位部與該驅動電路板之 固定孔。 17·如申請專利範圍第16項所述之背光模組之背板結構,其中該驅動 電路板具有一積體電路控制晶片(IC)與一印刷電路板(p「jnted circuit board,PCB) ’該印刷電路板具有第一表面與第二表面。 18.如申請專利範圍第16項所述之背光模組之背板結構,其中該第一 13 .200944882 固定元件為一塑膠框。 19.如申請專利範圍第18項所述之背光模組之背板 框係形成一凸點。 丹〒膠 2〇.如申請專利範圍第19項所述之背光模組之背板結構,其中 可依據該定位孔形狀而形成圓形或方形之凸點。 Λ ’ 21.如申請專利範圍第彳6項所述之背光模組之背板結 一 固定元件為一螺件。 ❹ ❹ 22·如申請專利範圍第16項所述之背光模組之背板結構,其中該 部係為一螺絲孔,供該第二固定元件鎖固。 、^ 23·如申請專利範圍第17項所述之背光模組之背板結構其中該 與該印刷電路板係藉由該第-固定元件穿過該背板 印刷電路板之第二表面之相對該定轉之另一端,而該第二 件穿入該印刷電路板之該固定孔並鎖固於該定位部中 該印刷電路_互結合。 ^貫扳與 24·如申請專利範圍第23項所述之背光模組之背板結構其十該背板 與該印刷電路板間更可設置-絕緣裝置,以避免該印刷電路g短路 的發生。 25.如申請專利範圍帛24項所述之背光模之組背板、结構,其中該 裝置可為一絕緣橡膠。 、 26·如申請專利範圍第17項所述之背光模组之背板結構,其令該 電路板為一軟性電路板。 27. 如申請專利範圍第17項所述之背光模組背板結構,其中該積體電 路控制aa片為軟板承載晶片封裝(Chip on Flex,cop)。 28. 如申請專利範圍第彳6項所述之背光模組之背板結構其令該框架 可為金屬或塑膠材質。 ^ y' 29. 如申請專利範圍第16項所述之背光模組之背板結構,其中該背板 可為金屬材質。A first fixing member is a positioning hole corresponding to the back plate, and a second fixing member respectively corresponds to a fixing portion of the positioning portion of the back plate and the driving circuit board. 2. The backplane structure of a backlight module according to claim 1, wherein the driving circuit board has an integrated circuit control chip (IC) and a printed circuit board (prtnted drcuit board 'PCB), the printing The circuit board has a first surface and a second surface. 3. The backplane structure of the backlight module of claim 1, wherein the positioning hole can be square or circular. 4. The backplane structure of the backlight module of claim 1, wherein the first fixing component is a plastic frame. 5. The backplane structure of the backlight module of claim 4, wherein the plastic frame forms a bump. The backplane structure of the backlight module of claim 5, wherein the bump forms a circular or square bump according to the shape of the positioning hole. The backplane structure of the backlight module of claim i, wherein the second component is a screw. The backplane structure of the backlight module of claim 1, wherein the positioning is a screw hole for locking the second fixing component. 9. The backplane structure of the backlight module of claim 2, wherein the printed circuit board is supported by the first fixing component from the front side of the backplane to the top of the printing The second surface of the circuit board is opposite to the positioning portion of the other 12 . 200944882. The fixing component penetrates the fixing hole of the printed circuit board and is locked in the positioning portion, so that the back plate and the printed circuit board are combined with each other. . 10. The backplane structure of the backlight module of claim 9, wherein an insulating device is disposed between the backplane and the printed circuit board to avoid short circuiting of the printed circuit board. 11. The backlight assembly of a backlight module according to claim 10, wherein the insulating device is an insulating rubber. 12. The backplane structure of the backlight module of claim 2, wherein the printed circuit board is a flexible circuit board. 13. The backlight module backplane structure of claim 2, wherein the integrated circuit control chip is a chip-on-chip package (Chip on Flex, COF). 14. The backplane structure of the backlight module of claim 1, wherein the frame is made of metal or plastic. The backplane structure of the backlight module of claim 1, wherein the backboard is made of metal. A backplane structure of a backlight module, comprising: a frame; a Q-back plate is disposed in the frame, and has at least one positioning portion; a driving circuit board 'one end of the media circuit board relative to The positioning portion of the backboard is provided with a fixing hole penetrating the driving circuit board; and a first fixing component is opposite to the front end of the backboard and the surface of the driving circuit board, and a second fixing component is respectively A fixing hole corresponding to the positioning portion of the back plate and the driving circuit board. The backplane structure of the backlight module of claim 16, wherein the driver circuit board has an integrated circuit control chip (IC) and a printed circuit board (p"jnted circuit board (PCB)" The printed circuit board has a first surface and a second surface. 18. The backplane structure of the backlight module of claim 16, wherein the first 13.200944882 fixing component is a plastic frame. The backplane frame of the backlight module described in claim 18 is formed into a bump. The tantalum plate structure of the backlight module according to claim 19, wherein the back plate structure can be Positioning the hole shape to form a circular or square bump. Λ ' 21. The back plate of the backlight module described in claim 6 is a screw member. ❹ ❹ 22·If applying for a patent The backplane structure of the backlight module of claim 16, wherein the portion is a screw hole for locking the second fixing component. 23, the backlight module according to claim 17 a backplane structure in which the printed circuit board is Passing the first fixing member through the second surface of the backplane printed circuit board opposite to the other end of the fixed rotation, and the second member penetrates the fixing hole of the printed circuit board and is locked in the positioning portion The printed circuit is _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The occurrence of a short circuit of the printed circuit g. 25. The back sheet and structure of the backlight module according to claim 24, wherein the device may be an insulating rubber. 26) as described in claim 17 The backplane structure of the backlight module, wherein the circuit board is a flexible circuit board. 27. The backlight module backplane structure according to claim 17, wherein the integrated circuit controls the aa chip as a soft board. A chip-on-package (Chip on Flex, cop). 28. The backplane structure of the backlight module as described in claim 6 of the patent application is such that the frame can be made of metal or plastic. ^ y' 29. Backplane structure of backlight module according to item 16 of the scope Wherein the backing plate may be a metal material.
TW97115703A 2008-04-29 2008-04-29 Back panel structure of backlight module TW200944882A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102878495A (en) * 2012-10-12 2013-01-16 北京京东方光电科技有限公司 Backlight and manufacturing method and display device for backlight
TWI401490B (en) * 2009-12-24 2013-07-11 Au Optronics Corp Backlight module and display device using the same
US10203449B2 (en) 2013-10-25 2019-02-12 Radiant Opto-Electronics Corporation Light assembly, backlight module and liquid crystal display

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401490B (en) * 2009-12-24 2013-07-11 Au Optronics Corp Backlight module and display device using the same
CN102878495A (en) * 2012-10-12 2013-01-16 北京京东方光电科技有限公司 Backlight and manufacturing method and display device for backlight
US10203449B2 (en) 2013-10-25 2019-02-12 Radiant Opto-Electronics Corporation Light assembly, backlight module and liquid crystal display

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