WO2020000967A1 - 一种全封闭式引线框架及其封装结构 - Google Patents

一种全封闭式引线框架及其封装结构 Download PDF

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Publication number
WO2020000967A1
WO2020000967A1 PCT/CN2018/124567 CN2018124567W WO2020000967A1 WO 2020000967 A1 WO2020000967 A1 WO 2020000967A1 CN 2018124567 W CN2018124567 W CN 2018124567W WO 2020000967 A1 WO2020000967 A1 WO 2020000967A1
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Prior art keywords
lead frame
base island
pin
rib
packaging structure
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PCT/CN2018/124567
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English (en)
French (fr)
Inventor
程刚
薛雷
郑路方
吴明虎
周刚
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长电科技（宿迁）有限公司
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Publication of WO2020000967A1 publication Critical patent/WO2020000967A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames

Definitions

  • the invention relates to a fully enclosed lead frame and a packaging structure thereof, and belongs to the technical field of semiconductor packaging.
  • An existing lead frame (see FIG. 1) has a base island connected to a rib in the lead frame by a pin in the middle as a support for the base island, and the pins on both sides of the middle pin are symmetrically arranged for wiring. As the input / output of the discrete device, the pins are connected through the middle rib. It has the following disadvantages:
  • This traditional lead frame base island suspension design uses only one pin to connect the ribs in the lead frame as a support for the base island, and it is easy to tilt its head;
  • the conventional encapsulation mold for the lead frame needs to have a rack 13 (see FIG. 2) for the pins, and the plastic material in the cavity 12a is blocked from flowing into the non-encapsulated area through the rack.
  • a rack 13 see FIG. 2
  • the pins are thin, it will lead to flashing of the parts near the plastic package, which will bring a lot of trouble to the subsequent production. If electrolytic flashing is used, the product will be damaged. The impact of quality and productivity; if the frame pins are thick or the step tolerance is large, the die presser will cause the product to be scrapped when the mold is closed.
  • the technical problem to be solved by the present invention is to provide a fully-enclosed lead frame and its packaging structure aiming at the above-mentioned prior art, which have no presser foot, flash material, and crooked head during the process, and the process is simple and controllable, and can be solved Some common problems on the production line.
  • a fully-enclosed lead frame which includes a wire frame, the wire frame includes an upper rib and a lower rib, and a plurality of vertical bars are arranged between the upper rib and the lower rib.
  • a row of lead frames is provided between two adjacent vertical bars.
  • Each lead frame unit includes a middle bar.
  • the middle bar is provided with a middle pin and a side pin.
  • the upper and lower ends of the middle bar are respectively connected with the upper bar and The lower ribs are connected, and the middle pins and the side pins are connected with the vertical ribs.
  • a base island is provided on the middle pin, and a closed slotted area is provided on the periphery of the base island.
  • a single or multiple connecting bars are arranged in the closed slotted area on the side, and the base island is connected to the wire frame through the single or multiple connecting bars on the left and right sides.
  • the size of the closed slotted area is slightly larger than the cavity area of the encapsulation mold.
  • a fully enclosed lead frame packaging structure includes pins and a base island.
  • a chip is disposed on the base island, and the chip and the pins are connected by a metal wire.
  • the base island, the chip, and a portion The periphery of the pins is covered with a plastic sealing material, and the plastic sealing material is provided with a plastic sealing material protection ring.
  • the thickness of the plastic sealing material protection ring is the same as that of the lead frame.
  • the base island of the lead frame of the present invention is surrounded by a wire frame, and the left and right edges of the base island are connected to the wire frame by a plurality of reinforcing bars, which can solve the insufficient strength of the existing base island structure, and it is easy to tilt the head in the assembly process and cause scrap. problem;
  • the encapsulation mold of the present invention does not need to open racks, and the space reserved around the base island does not affect the appearance of the product, which can reduce the internal impact of the product from external vibrations and improve product reliability;
  • FIG. 1 is a schematic structural diagram of a conventional lead frame.
  • FIG. 2 is a schematic structural diagram of a conventional lead frame encapsulation mold.
  • FIG. 3 is a schematic structural diagram of a fully enclosed lead frame according to the present invention.
  • FIG. 4 is a schematic structural diagram of a lead frame unit in FIG. 3.
  • FIG. 5 is a schematic structural view of a part of a fully enclosed lead frame encapsulation mold according to the invention.
  • FIG. 6 is a schematic diagram of a fully enclosed lead frame packaging structure according to the present invention.
  • a fully-enclosed lead frame in the present invention includes a wire frame 6 including an upper rib 61 and a lower rib 62, and the upper rib 61 and the lower rib 62 A plurality of vertical ribs 63 are arranged between them, and a row of lead frame units 7 is disposed between two adjacent vertical ribs 63.
  • the lead frame unit 7 includes a middle rib 4, and the middle ribs 4 are provided with middle pins 2 and sides.
  • a base island 1 is provided with a closed slotted area 8 on the periphery of the base island 1, and a single or a plurality of connecting ribs 9 are provided in the closed slotted area 8 on the left and right sides of the base island 1.
  • the base island 1 passes through Single or multiple connecting bars 9 on the left and right sides are connected to the wire frame 6;
  • a supporting mold for a fully enclosed lead frame in the present invention does not need to open a rack on the encapsulation mold. It only needs to open a cavity 12 b provided with a base island and an inner pin. Press the wire frame and the middle ribs outside the closed slotted area 8 to form the encapsulation area, so the mold will not crush the pins during encapsulation, there is no flash after encapsulation, and no flashing is required for plating to ensure product quality and Reliability, which simplifies the process.
  • the size of the closed slotted area 8 is slightly larger than the size of the cavity 12b area of the encapsulation mold, so after the encapsulation, the encapsulation material protection ring 11 is formed around the encapsulation material 10;
  • a package structure of a fully-enclosed lead frame in the present invention includes a middle pin 2 and a side pin 3.
  • the middle pin 2 is provided with a base island 1, and the base island 1 is provided with a chip, and the chip and the side pin 3 are connected by a metal wire.
  • the base island 1, the chip, and a part of the side pin 3 are covered with a plastic sealing material 10 on the periphery, and the plastic sealing material 10 is provided on the periphery.
  • plastic sealing material protection ring 11 With plastic sealing material protection ring 11;
  • the thickness of the plastic sealing ring 11 is the same as that of the lead frame.
  • the present invention also includes other embodiments. Any technical solution formed by equivalent transformation or equivalent replacement shall fall within the protection scope of the claims of the present invention.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

一种全封闭式引线框架及其封装结构，它包括线架（6），线架（6）包括上边筋（61）和下边筋（62），上边筋（61）和下边筋（62）之间设置有多条竖筋（63），相邻两个竖筋（63）之间设置有一列引线框架单元（7），每个引线框架单元（7）包括中筋（4），中筋（4）上设置有中间引脚（2）和侧引脚（3），中间引脚（2）上设置有基岛（1），基岛（1）外围设置有一个封闭开槽区域（8），基岛（1）通过左右两侧的单个或多个连筋（9）与线架（6）相连接。该全封闭式引线框架及其封装结构，其在工艺过程中无压脚、溢料、歪头，且工艺较简单可控，能够解决目前产线上一些常见的问题。

Description

一种全封闭式引线框架及其封装结构 技术领域
本发明涉及一种全封闭式引线框架及其封装结构，属于半导体封装技术领域。
背景技术
现有的一种引线框架(参见图1)，其基岛靠中间的一只引脚连接引线框架中筋，作为对基岛的支撑，中间引脚的两侧管脚对称设置，用于打线，作为分立器件的输入/出端，引脚间通过中筋相连。其存在以下缺点：
1、这种传统的引线框架基岛悬空设计，仅靠一只引脚连接引线框架中筋，作为对基岛的支撑，容易歪头；
2、这种传统的引线框架配套的包封模具需要为引脚开设齿条13(见图2)，通过齿条阻挡型腔12a内塑封料流入非包封区域。然而，由于框架引脚尺寸和模具尺寸都存在公差，如果引脚细的话会导致引脚靠近塑封的部位产生溢料，对后道生产带来很多麻烦，如果使用电解去飞边等会对产品品质产能影响；框架引脚粗或者步距公差大的话，会导致合模时模具压脚导致产品报废。
发明内容
本发明所要解决的技术问题是针对上述现有技术提供一种全封闭式引线框架及其封装结构，其在工艺过程中无压脚、溢料、歪头，且工艺较简单可控，能够解决目前产线上一些常见的问题。
本发明解决上述问题所采用的技术方案为：一种全封闭式引线框架，它包括线架，所述线架包括上边筋和下边筋，所述上边筋和下边筋之间设置有多条竖筋，相邻两个竖筋之间设置有一列引线框架单元，每个引线框架单元包括中筋，所述中筋上设置有中间引脚和侧引脚，所述中筋上下两端分别与上边筋和下边筋相连接，所述中间引脚和侧引脚与竖筋相连接，所述中间引脚上设置有基岛，所述基岛外围设置有一个封闭开槽区域，所述基岛左右两侧的封闭开槽区域内设置有单个或多个连筋，所述基岛通过左右两侧的单个或多个连筋与线架相连接。
优选的，所述封闭开槽区域尺寸略大于包封模具型腔区域。
一种全封闭式引线框架的封装结构，它包括引脚和基岛，所述基岛上设置有芯片， 所述芯片和引脚之间通过金属线相连接，所述基岛、芯片和部分引脚外围包覆有塑封料，所述塑封料外围设置有塑封料保护圈。
优选的，所述塑封料保护圈的厚度与引线框架厚度相同。
与现有技术相比，本发明的优点在于：
1、本发明引线框架的基岛周围围绕有线架，基岛左右边缘通过复数个连筋与线架相连，可解决现有框架基岛结构强度不够，在组装工艺中容易歪头而导致报废的问题；
2、本发明的包封模具无需开齿条，基岛四周预留空间不影响产品外观，可以减少产品内部受外部震动影响，提高产品可靠性；
3、本发明包封后无溢料，不需要电镀去飞边，保证产品质量及可靠性，可简化制程。
附图说明
图1为现有的一种引线框架的结构示意图。
图2为现有的一种引线框架包封模具部分结构示意图。
图3为本发明一种全封闭式引线框架的结构示意图。
图4为图3中引线框架单元的结构示意图。
图5为发明一种全封闭式引线框架包封模具部分结构示意图。
图6为本发明一种全封闭式引线框架封装结构的示意图。
其中：
基岛1
中间引脚2
侧引脚3
中筋4
边筋5
线架6
引线框架单元7
封闭开槽区域8
连筋9
塑封料10
保护圈11
型腔12a、12b
齿条13。
具体实施方式
以下结合附图实施例对本发明作进一步详细描述。
如图3、图4所示，本发明中的一种全封闭式引线框架，它包括线架6，所述线架6包括上边筋61和下边筋62，所述上边筋61和下边筋62之间设置有多条竖筋63，相邻两条竖筋63之间设置有一列引线框架单元7，所述引线框架单元7包括中筋4，所述中筋4上设置有中间引脚2和侧引脚3，所述中筋4上下两端分别与上边筋61和下边筋62相连接，所述中间引脚2和侧引脚3与竖筋63相连接，所述中间引脚2上设置有基岛1，所述基岛1外围设置有一个封闭开槽区域8，所述基岛1左右两侧的封闭开槽区域8内设置有单个或多个连筋9，所述基岛1通过左右两侧的单个或多个连筋9与线架6相连接；
如图5所示，本发明中一种全封闭式引线框架的配套模具，其包封模具上无需开齿条，其仅需开设置容基岛和内引脚的型腔12b，其通过模具压住封闭开槽区域8外的线架和中筋来形成包封区域，所以其包封时模具不会压伤引脚，包封后无溢料，不需要电镀去飞边，保证产品质量及可靠性，可简化制程。
所述封闭开槽区域8尺寸略大于包封模具的型腔12b区域尺寸，所以在包封后会在塑封料10外围形成有塑封料保护圈11；
如图6所示，本发明中的一种全封闭式引线框架的封装结构，它包括中间引脚2和侧引脚3，所述中间引脚2上设置有基岛1，所述基岛1上设置有芯片，所述芯片和侧引脚3之间通过金属线相连接，所述基岛1、芯片和部分侧引脚3外围包覆有塑封料10，所述塑封料10外围设置有塑封料保护圈11；
所述塑封料保护圈11的厚度与引线框架的厚度相同。
除上述实施例外，本发明还包括有其他实施方式，凡采用等同变换或者等效替换方式形成的技术方案，均应落入本发明权利要求的保护范围之内。

Claims (4)

  1. 一种全封闭式引线框架，其特征在于：它包括线架(6)，所述线架(6)包括上边筋(61)和下边筋(62)，所述上边筋(61)和下边筋(62)之间设置有多条竖筋(63)，相邻两个竖筋(63)之间设置有一列引线框架单元(7)，每个引线框架单元(7)包括中筋(4)，所述中筋(4)上设置有中间引脚(2)和侧引脚(3)，所述中筋(4)上下两端分别与上边筋(61)和下边筋(62)相连接，所述中间引脚(2)和侧引脚(3)与竖筋(63)相连接，所述中间引脚(2)上设置有基岛(1)，所述基岛(1)外围设置有一个封闭开槽区域(8)，所述基岛(1)左右两侧的封闭开槽区域(8)内设置有单个或多个连筋(9)，所述基岛(1)通过左右两侧的单个或多个连筋(9)与线架(6)相连接。
  2. 根据权利要求1所述的一种全封闭式引线框架，其特征在于：所述封闭开槽区域(8)尺寸略大于包封型腔(12b)区域尺寸。
  3. 一种全封闭式引线框架的封装结构，其特征在于：它包括引脚和基岛，所述基岛上设置有芯片，所述芯片和引脚之间通过金属线相连接，所述基岛、芯片和部分引脚外围包覆有塑封料(10)，所述塑封料(10)外围设置有塑封料保护圈(11)。
  4. 根据权利要求3所述的一种全封闭式引线框架的封装结构，其特征在于：所述塑封料保护圈(11)的厚度与引线框架厚度相同。
PCT/CN2018/124567 2018-06-28 2018-12-28 一种全封闭式引线框架及其封装结构 WO2020000967A1 (zh)

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CN108831873A (zh) * 2018-06-28 2018-11-16 长电科技（宿迁）有限公司 一种全封闭式引线框架及其封装结构

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