CN206584923U - 一种矩阵式排列的微电子封装引线框架 - Google Patents
一种矩阵式排列的微电子封装引线框架 Download PDFInfo
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- CN206584923U CN206584923U CN201720343175.1U CN201720343175U CN206584923U CN 206584923 U CN206584923 U CN 206584923U CN 201720343175 U CN201720343175 U CN 201720343175U CN 206584923 U CN206584923 U CN 206584923U
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- 238000004377 microelectronic Methods 0.000 title claims abstract description 30
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 26
- 239000011159 matrix material Substances 0.000 title claims abstract description 16
- 210000003205 muscle Anatomy 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 23
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 238000005538 encapsulation Methods 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000012858 packaging process Methods 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 5
- 230000001413 cellular effect Effects 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000000295 complement effect Effects 0.000 claims description 3
- 238000007667 floating Methods 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 15
- 238000005516 engineering process Methods 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 2
- 238000011161 development Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2020000967A1 (zh) * | 2018-06-28 | 2020-01-02 | 长电科技(宿迁)有限公司 | 一种全封闭式引线框架及其封装结构 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2020000967A1 (zh) * | 2018-06-28 | 2020-01-02 | 长电科技(宿迁)有限公司 | 一种全封闭式引线框架及其封装结构 |
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GR01 | Patent grant | ||
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CP03 | Change of name, title or address |
Address after: 247099 Factory Building No. 9, Phase 4, Electronic Information Industry Park, Economic and Technological Development Zone, Chizhou City, Anhui Province Patentee after: Anhui Xianjie Electronics Co.,Ltd. Address before: 522021 Within Yuhu Renhe Industrial Park, Airport Economic Zone, Jieyang City, Guangdong Province Patentee before: GUANGDONG XIANJIE ELECTRONIC CO.,LTD. |
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Denomination of utility model: A Matrix Arranged Lead Frame for Microelectronic Packaging Effective date of registration: 20231007 Granted publication date: 20171024 Pledgee: Agricultural Bank of China Limited by Share Ltd. Chizhou branch Pledgor: Anhui Xianjie Electronics Co.,Ltd. Registration number: Y2023980060145 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |