WO2019244962A1 - Fe-Ni系合金薄板 - Google Patents

Fe-Ni系合金薄板 Download PDF

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Publication number
WO2019244962A1
WO2019244962A1 PCT/JP2019/024406 JP2019024406W WO2019244962A1 WO 2019244962 A1 WO2019244962 A1 WO 2019244962A1 JP 2019024406 W JP2019024406 W JP 2019024406W WO 2019244962 A1 WO2019244962 A1 WO 2019244962A1
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Prior art keywords
thin plate
phase
less
based alloy
alloy thin
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Ceased
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PCT/JP2019/024406
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English (en)
French (fr)
Japanese (ja)
Inventor
章博 大森
英樹 森
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Proterial Ltd
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Hitachi Metals Ltd
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Priority to JP2020525787A priority Critical patent/JP7294336B2/ja
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    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/46Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C38/00Ferrous alloys, e.g. steel alloys
    • C22C38/08Ferrous alloys, e.g. steel alloys containing nickel
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C38/00Ferrous alloys, e.g. steel alloys
    • C22C38/10Ferrous alloys, e.g. steel alloys containing cobalt

Definitions

  • the present invention relates to an Fe—Ni-based alloy thin plate.
  • Patent Document 1 in order to improve the etching accuracy, cold rolling and annealing are respectively performed once or more on a hot-rolled sheet, and the cold rolling rate of the cold rolling before final recrystallization annealing is 90% or more, A method for producing an Fe—Ni-based thin plate containing 30 to 34% Ni, characterized in that the final recrystallization annealing is performed at an annealing temperature of 850 ° C. or higher and a final cooling pressure ratio of 30% or lower. .
  • Patent Document 2 discloses that in order to obtain good etching properties and high strength, a cold rolling reduction of 85% or more and annealing at 700 ° C. or more are performed at least once, and then a rolling reduction not exceeding the cold rolling reduction. A cold masking process and annealing at a temperature not exceeding 850 ° C. are performed in this order, and a method for producing a shadow mask material containing 30 to 40% of Ni is disclosed.
  • the Fe-Ni-based alloy thin plate containing 30 to 40% of Ni as described above may be incorporated into a substrate on which electronic components are mounted due to its excellent low thermal expansion characteristics.
  • Fe—Ni-based alloy thin plates are required to be further thinner, have higher strength, and have improved heat radiation characteristics.
  • the thinner the plate thickness the smaller the cross-sectional area, the lower the heat emission efficiency, and the worse the heat dissipation tends to be.
  • an object of the present invention is to provide a thin Fe—Ni-based alloy thin plate having a thickness of 0.5 mm or less and having high strength and good heat dissipation as compared with conventional ones. is there.
  • One embodiment of the present invention is that in mass%, Ni + Co: 1.0% or more and less than 30.0% (Co is 0 to 6.0%), Si: 0.5% or less, and Mn: 1.0%
  • the remainder is Fe—Ni-based alloy thin plate having a thickness of 0.5 mm or less, composed of Fe and impurities, and the structure of the Fe—Ni-based alloy thin plate has an ⁇ -phase having an ⁇ -phase of 10% or more.
  • the above-mentioned tissue is an ⁇ -single-phase tissue.
  • the thin plate has a 0.2% proof stress of 750 MPa or more and a Young's modulus of 145 GPa or more.
  • the present invention it is possible to provide a thin Fe—Ni-based alloy thin plate having a thickness of 0.5 mm or less and a high strength and good heat dissipation as compared with conventional ones. .
  • a numerical range represented by using “to” means a range including numerical values described before and after “to” as a lower limit and an upper limit.
  • the term "step” is used not only for an independent step but also for the case where the intended purpose of the step is achieved even if it cannot be clearly distinguished from other steps. included. First, an embodiment relating to an Fe—Ni-based alloy thin plate of the present invention will be described.
  • Ni + Co 1.0% or more and less than 30.0% (Co is 0 to 6.0%) by mass%, Si: 0.5% or less, Mn: 1.0% or less, and the balance Has a composition consisting of Fe and impurities.
  • the Fe—Ni-based alloy having the composition specified in the present invention has a composition necessary for exhibiting desired heat dissipation. [Ni + Co: 1.0% or more and less than 30.0% (Co is 0 to 6.0%)] In the present embodiment, the Ni content is 1.0% or more and less than 30.0%.
  • the thin plate of the present embodiment can have a composite structure of ⁇ phase and ⁇ phase, which will be described later, and can have higher strength than a ⁇ phase single phase thin plate. is there. Further, since the electric resistance is lowered, improvement in heat dissipation can be expected. If the Ni content is less than 1.0%, the composition becomes close to pure iron, so that rust is likely to occur and the toughness tends to decrease, which is not preferable.
  • a preferred lower limit of Ni is 3.0%, a more preferred lower limit of Ni is 5.0%, a further preferred lower limit of Ni is 7.0%, and a still more preferred lower limit of Ni is 8.0%, A particularly preferred lower limit of Ni is 8.5%, and a most preferred lower limit of Ni is 9.0%.
  • the structure of the Fe—Ni-based alloy thin plate of the present embodiment is usually an ⁇ -single-phase structure.
  • the Ni content was increased from the lower limit of the Ni content, and when the Ni content reached about 20%, the structure of the Fe—Ni alloy thin plate was changed from the ⁇ single phase structure to the ⁇ phase and the ⁇ phase. To a dual-phase organization.
  • the Ni content is further increased, when the Ni content reaches around 30.0%, the above-described multiphase structure of the ⁇ phase and the ⁇ phase is turned into a ⁇ phase single phase. Transition.
  • the structure of the thin plate is a single phase of ⁇ phase, the strength and heat dissipation tend to decrease.
  • the Ni content is less than 30.0%.
  • a preferred upper limit of Ni is 27.0%.
  • a part of Ni can be replaced with Co in order to adjust the thermal expansion characteristic and to have high strength.
  • the upper limit of Co is preferably set to 6.0% in order to easily impart the above-described effects to the material. More preferably, the upper limit of Co is set to 6.0% and the content is set to be lower than the Ni content.
  • Si and Mn are usually contained in Fe—Ni-based alloys in trace amounts for the purpose of deoxidation. However, if they are contained excessively, segregation is likely to occur. % Or less.
  • the lower limits of Si and Mn are not particularly limited. For example, Si can be set to 0.05% and Mn can be set to 0.05%.
  • Elements other than the above elements can be substantially Fe and unavoidable impurities, but may include elements other than the elements described in this specification as long as the effects of the present invention are not impaired. For example, there is C as an element contained as an impurity and an element which needs to be particularly restricted.
  • the upper limit of C is set to 0.05 so as not to suppress the inhibition of the etching property. It is better to limit to%.
  • S may be contained at 0.020% or less and B may be contained at 0.0050% or less. One of S and B may be used, or both may be contained. S has an effect of improving press punching properties as a free-cutting element, and B has an effect of improving hot workability.
  • FeThe Fe—Ni-based alloy thin plate of the present embodiment has a composite structure of ⁇ phase and ⁇ phase or ⁇ phase single phase structure, and the ⁇ phase is formed in a volume ratio of 10% or more. As a result, a thin plate having higher strength than that of a single ⁇ phase can be obtained.
  • the upper limit of the ⁇ phase is not particularly limited, and the amount of the ⁇ phase can be appropriately adjusted according to the use.
  • the ⁇ phase also includes a martensite single phase structure, a ferrite single phase structure, and a ferrite-martensite double phase structure. In the case of a martensite single-phase structure, it is preferable that a cubic martensite phase having good workability is contained.
  • the structure of the Fe—Ni-based alloy thin plate be an ⁇ -phase single-phase structure.
  • the volume ratio of the ⁇ phase in the present embodiment can be obtained from the peak intensity areas of the ⁇ phase and the ⁇ phase by using, for example, X-ray diffraction.
  • the Fe—Ni-based alloy thin plate of the present embodiment has an electric resistivity of 65 ⁇ 10 ⁇ 8 ⁇ ⁇ m or less. Thereby, even when applied to a lead frame or a substrate of an electronic component, heat is hardly generated, and excellent heat dissipation can be exhibited.
  • a preferable electric resistivity is 60 ⁇ 10 ⁇ 8 ⁇ ⁇ m or less, a more preferable electric resistivity is 55 ⁇ 10 ⁇ 8 ⁇ ⁇ m or less, a more preferable electric resistivity is 50 ⁇ 10 ⁇ 8 ⁇ ⁇ m or less, and a particularly preferable electric resistance.
  • the resistivity is 45 ⁇ 10 ⁇ 8 ⁇ ⁇ m or less.
  • the electric resistivity of this embodiment can be adjusted by adjusting the composition and applying a manufacturing method as described later.
  • the Fe—Ni-based alloy thin plate of the present embodiment preferably has a hardness of 250 HV or more. It is more preferably at least 270 HV, further preferably at least 300 HV.
  • the upper limit is not particularly limited, but if it is too hard, it is difficult to manufacture, so it can be set to, for example, 600 HV.
  • the Fe—Ni-based alloy thin plate of the present embodiment preferably has a 0.2% proof stress of 750 MPa or more. By having this characteristic, it is difficult for the thin plate to be bent when it is bent and elongated, and a high-strength Fe—Ni alloy thin plate can be obtained. It is more preferably at least 760 MPa, further preferably at least 780 MPa. In order to achieve the above 0.2% proof stress, the tensile strength is preferably 780 MPa or more. More preferably, it is 800 MPa or more. Further, the Fe—Ni-based alloy thin plate of the present embodiment preferably has a Young's modulus of 145 GPa or more.
  • a more preferred Young's modulus is 150 GPa or more, and a still more preferred Young's modulus is 160 GPa or more, and particularly preferably 170 GPa or more.
  • the thickness of the thin plate of the present embodiment is 0.5 mm or less in order to cope with various uses. Accordingly, the Fe—Ni-based alloy thin plate of the present embodiment can easily cope with the increase in the number of pins when it is used for a lead frame, for example, and when it is used for a metal mask, it can cope with high definition by etching. It is possible. In addition, when applied to a substrate of an electronic component, it is possible to meet various demands such as a demand for a reduction in size and height.
  • the preferred upper limit of the thickness is 0.2 mm. A more preferred upper limit is 0.15 mm, a still more preferred upper limit is 0.1 mm, and a particularly preferred upper limit is 0.08 mm.
  • the lower limit is not particularly limited, but if the material is too thin, a change in shape tends to easily occur. Therefore, the lower limit can be set to 0.02 mm. It is particularly preferable that the Fe—Ni-based alloy thin plate of the present invention has a wide width (for example, a plate width of 500 to 1200 mm).
  • the thin plate in the present embodiment includes a steel strip wound in a coil shape and a rectangular thin plate manufactured by cutting the steel strip. In the case of a rectangular thin plate, “plate width” indicates a short side.
  • the hot-rolled material used in the present embodiment has a thickness of 2 mm or more. If the thickness of the hot-rolled material is less than 2 mm, there is a possibility that cold rolling with a reduction rate of 50% or more specified in the present embodiment cannot be performed. In addition, if the thickness of the hot-rolled material is reduced to less than 2 mm, special rolling equipment may be required. Therefore, in this embodiment, the thickness of the hot-rolled material is set to 2 mm or more.
  • This hot-rolled material has an oxide layer formed on the surface, and the thickness of the hot-rolled material is the thickness including the oxide layer.
  • the above-mentioned hot rolled material is used as a material for cold rolling. Since an oxidized layer is formed on the hot-rolled material, it is preferable that the oxidized layer is mechanically or chemically removed, for example. The edges may be cut using a slitter so that defects such as cracks do not occur from the edges of the cold-rolled material during the cold rolling. By performing such processing, a material for cold rolling can be obtained.
  • the cold rolling is performed on the material for cold rolling at a draft of 50% or more.
  • This cold rolling may be a rolling process in a plurality of passes, and the rolling reduction in that case is the total rolling reduction.
  • This cold rolling is performed before the recrystallization annealing step.
  • the rolling reduction is too low, the number of cold rolling and annealing steps until the sheet thickness is adjusted to a desired value increases, and the cost increases.
  • the preferred rolling reduction is 60% or more.
  • a more preferred reduction is 70% or more, a still more preferred reduction is 80% or more, and a particularly preferred reduction is 85% or more.
  • the upper limit of the rolling reduction is not particularly defined, if the rolling reduction exceeds 99%, the cost may be increased due to an excessive rolling time, so it is realistic to set the upper limit to 99%.
  • recrystallization annealing is performed on the cold-rolled material at a temperature of 800 ° C. or higher.
  • the strain of the rolled material (thin plate) which has been hardened by strong pressure can be removed and softened, and the desired final thickness and characteristics can be imparted by final cold rolling.
  • the annealing temperature is lower than 800 ° C., the material may not be sufficiently softened.
  • the upper limit of the annealing temperature is not particularly limited, but if it is too high, desired characteristics may not be obtained.
  • the annealing furnace used in the recrystallization annealing of the present embodiment has a soaking zone having a constant set temperature and a cooling zone formed after the soaking zone and set at a temperature lower than the set temperature of the soaking zone.
  • This cooling zone may be formed so as to be about 10% of the entire length of the annealing furnace. Preferably, it is formed about 20%, more preferably about 30%, further preferably about 40%.
  • the set temperature of the cooling zone is 0.05 T (° C.) or more and less than 0.9 T (° C.) with respect to the set temperature T (° C.) of the soaking zone.
  • the temperature can be reduced continuously or stepwise.
  • the time (holding time) during which the thin plate enters the annealing furnace is adjusted to 0.1 minute or more.
  • the holding time is adjusted to 0.1 to 3.0 minutes in order to adjust the structure mainly to the ⁇ phase without lowering the production efficiency. I do. If the holding time is less than 0.1 minute, the distortion may not be sufficiently removed. If the time exceeds 3.0 minutes, the cost may increase due to fluctuations in the properties of the alloy thin plate and an increase in the annealing time. More preferably, the lower limit of the holding time is 0.2 minutes.
  • the upper limit of the holding time is more preferably 2.0 minutes, further preferably 1.5 minutes, particularly preferably 1.0 minute, with the aim of further reducing the cost. Most preferably, it is 6 minutes.
  • This recrystallization annealing can be performed by continuously passing a cold-rolled rolled material (thin plate) through an annealing furnace set at a desired temperature. For example, it can be performed by a method in which a cold-rolled rolled material is pulled out from a rolled state, passed through an annealing furnace, and wound up in a roll form.
  • the recrystallization annealing step may be performed at least once, and may be performed a plurality of times.
  • the above-described recrystallized and annealed annealed material can be subjected to final cold rolling in which the rolling reduction is adjusted in accordance with required characteristics.
  • the rolling reduction can be adjusted to less than 50% (preferably 45% or less, more preferably 40% or less).
  • the rolling reduction can be 50% or more (preferably 60% or more, more preferably 70% or more).
  • the tension before rolling in the final cold rolling is 200 to 500 MPa
  • the tension after rolling is 100 to 200 MPa
  • the rolling speed is 250 m / min or less.
  • a more preferable lower limit of the rolling front tension is 250 MPa, and a more preferable upper limit of the rolling front tension is 400 MPa.
  • a more preferred lower limit of the rolling back tension is 120 MPa, and a more preferred upper limit of the rolling back tension is 180 MPa.
  • the lower limit of the rolling speed is not particularly limited, but is preferably about 100 m / min in consideration of workability. In the manufacturing method of the present embodiment, it is preferable that the final cold rolling is performed in one pass in order to obtain desired characteristics while suppressing defects on the surface of the thin plate.
  • heat treatment it is preferable not to perform heat treatment after the final cold rolling described above.
  • This heat treatment is, for example, strain relief annealing performed at a temperature lower than the recrystallization temperature.
  • strain relief annealing performed at a temperature lower than the recrystallization temperature.
  • Table 1 shows the chemical compositions of the prepared hot-rolled materials of the present invention and comparative examples.
  • the hot-rolled material was subjected to chemical polishing and mechanical polishing to remove an oxide layer on the surface of the hot-rolled material to prepare a material for cold rolling.
  • the above-mentioned material for cold rolling was subjected to intermediate cold rolling, recrystallization annealing, and final cold rolling to prepare Fe—Ni-based thin sheets of the present invention and comparative examples.
  • test pieces were sampled from the Fe-Ni-based alloy sheet after the final cold rolling, and the tensile strength, 0.2% proof stress, Young's modulus, and electrical resistivity were measured.
  • the test results are summarized in Table 2.
  • the tensile strength, 0.2% proof stress, and Young's modulus were determined according to the method specified in JIS-Z2241.
  • the electric resistivity was measured with a resistance measuring instrument capable of measuring four terminals with the distance between the measurement electrodes set to 50 mm. As a result, the sample No. In Examples 1 to 4 of the present invention, it was confirmed that the tensile strength, 0.2% proof stress, Young's modulus, and electrical resistivity were all good values.
  • the sample No. In Nos. 11 to 13 it was confirmed that the tensile strength, 0.2% proof stress, and Young's modulus were all lower than those of the examples of the present invention. Further, the volume ratio of the ⁇ phase of the present invention examples (samples Nos. 1 to 4) was 10% or more. The structures 1, 2, and 3 were substantially an ⁇ -phase single phase. Then, the sample No.
  • the electrical resistivity of 1 to 4 was 65 ⁇ 10 ⁇ 8 ⁇ ⁇ m or less. On the other hand, in Comparative Examples (Nos. 11 to 13), the electric resistivity exceeded 65 ⁇ 10 ⁇ 8 ⁇ ⁇ m. Then, it was confirmed that the ⁇ phase was mainly contained, and it was substantially a ⁇ phase single phase.
  • sample no. 1 shows the results of XRD measurement of Sample No. 1.
  • 13 shows the XRD measurement results.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
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  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
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  • Crystallography & Structural Chemistry (AREA)
  • Heat Treatment Of Sheet Steel (AREA)
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PCT/JP2019/024406 2018-06-20 2019-06-20 Fe-Ni系合金薄板 Ceased WO2019244962A1 (ja)

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JP2018116928 2018-06-20
JP2018161674 2018-08-30
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JP2018-226543 2018-12-03
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021220352A1 (ja) * 2020-04-27 2021-11-04 新報国マテリアル株式会社 低熱膨張鋳物及びその製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05271876A (ja) * 1992-03-24 1993-10-19 Hitachi Metals Ltd 高強度リードフレーム材料およびその製造方法
JPH07216510A (ja) * 1994-02-04 1995-08-15 Hitachi Metals Ltd 高強度リードフレーム材料およびその製造方法
JPH1161251A (ja) * 1997-08-11 1999-03-05 Nisshin Steel Co Ltd 熱間加工性に優れたFe−Ni合金板の製造方法
JP2002004007A (ja) * 2000-04-21 2002-01-09 Nippon Yakin Kogyo Co Ltd Fe−Ni合金冷延板およびFe−Ni合金の精錬方法
JP2003073779A (ja) * 2001-08-27 2003-03-12 Nippon Yakin Kogyo Co Ltd 高清浄シャドウマスク用Fe−Ni合金板およびその製造方法
JP2010214447A (ja) * 2009-03-18 2010-09-30 Hitachi Metals Ltd エッチング加工用素材の製造方法及びエッチング加工用素材
JP2017064763A (ja) * 2015-09-30 2017-04-06 日立金属株式会社 Fe−Ni系合金薄板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000265250A (ja) * 1999-03-17 2000-09-26 Toyo Kohan Co Ltd 低熱膨張性Fe−Ni合金板、それを用いたシャドウマスク及びカラー受像管

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05271876A (ja) * 1992-03-24 1993-10-19 Hitachi Metals Ltd 高強度リードフレーム材料およびその製造方法
JPH07216510A (ja) * 1994-02-04 1995-08-15 Hitachi Metals Ltd 高強度リードフレーム材料およびその製造方法
JPH1161251A (ja) * 1997-08-11 1999-03-05 Nisshin Steel Co Ltd 熱間加工性に優れたFe−Ni合金板の製造方法
JP2002004007A (ja) * 2000-04-21 2002-01-09 Nippon Yakin Kogyo Co Ltd Fe−Ni合金冷延板およびFe−Ni合金の精錬方法
JP2003073779A (ja) * 2001-08-27 2003-03-12 Nippon Yakin Kogyo Co Ltd 高清浄シャドウマスク用Fe−Ni合金板およびその製造方法
JP2010214447A (ja) * 2009-03-18 2010-09-30 Hitachi Metals Ltd エッチング加工用素材の製造方法及びエッチング加工用素材
JP2017064763A (ja) * 2015-09-30 2017-04-06 日立金属株式会社 Fe−Ni系合金薄板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021220352A1 (ja) * 2020-04-27 2021-11-04 新報国マテリアル株式会社 低熱膨張鋳物及びその製造方法
US12421565B2 (en) 2020-04-27 2025-09-23 Shinhokoku Material Corp. Low thermal expansion cast steel and method of production of same

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