WO2019240217A1 - Film stratifié et procédé de fabrication de structure stratifiée - Google Patents

Film stratifié et procédé de fabrication de structure stratifiée Download PDF

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Publication number
WO2019240217A1
WO2019240217A1 PCT/JP2019/023465 JP2019023465W WO2019240217A1 WO 2019240217 A1 WO2019240217 A1 WO 2019240217A1 JP 2019023465 W JP2019023465 W JP 2019023465W WO 2019240217 A1 WO2019240217 A1 WO 2019240217A1
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WIPO (PCT)
Prior art keywords
resin layer
insulating resin
base film
film
laminated
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Application number
PCT/JP2019/023465
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English (en)
Japanese (ja)
Inventor
達史 林
貴至 西村
奨 馬場
Original Assignee
積水化学工業株式会社
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Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to JP2019554574A priority Critical patent/JP7132242B2/ja
Publication of WO2019240217A1 publication Critical patent/WO2019240217A1/fr
Priority to JP2022134212A priority patent/JP7344357B2/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits

Definitions

  • the present invention relates to a laminated film including a base film and an insulating resin layer. Moreover, this invention relates to the manufacturing method of the laminated structure using the said laminated
  • a resin composition is used in order to form an insulating layer for insulating inner layers or to form an insulating layer located in a surface layer portion.
  • a laminated film including a base film and an insulating resin layer is used in order to form the insulating layer.
  • the insulating resin layer is obtained by forming the resin composition into a film.
  • the insulating resin layer is cured or precured to form an insulating layer (cured material layer or precured material layer). Thereafter, the base film may be peeled off from the cured or precured insulating resin layer.
  • Patent Documents 1 and 2 An example of such a manufacturing method is described in Patent Documents 1 and 2 below.
  • a blind via having a top diameter of 100 ⁇ m or less is obtained by irradiating a carbon dioxide laser on the insulating layer from above the plastic film in a state where the insulating layer and the plastic film are laminated on both sides or one side of the circuit board.
  • a method for manufacturing a multilayer printed wiring board comprising a step of forming a substrate is disclosed.
  • the insulating layer contains 35% by mass or more of an inorganic filler.
  • Patent Document 2 discloses a circuit board manufacturing method including the following steps (A) to (F).
  • B A step of thermosetting the resin composition layer to form an insulating layer, wherein the adhesion strength between the insulating layer and the plastic film support is 2 gf / cm to 18 gf / cm.
  • C A step of forming a via hole having a top diameter of 40 ⁇ m or less in the insulating layer by irradiating a laser on the plastic film support.
  • D The process of performing a desmear process.
  • E The process of peeling a plastic film support body.
  • F A step of forming a conductor layer on the surface of the insulating layer.
  • the insulating resin layer is cured in a state where the base film and the insulating resin layer are laminated.
  • the base film may spontaneously peel from the insulating resin layer during curing.
  • unevenness of curing may occur in the insulating resin layer.
  • the base film and the insulating resin layer cannot be peeled off satisfactorily. The film may tear.
  • the object of the present invention is to suppress natural peeling from the insulating resin layer of the base film during curing, and to suppress poor peeling of the base film when peeling the base film from the insulating resin layer after curing. It is providing the laminated
  • multilayer film which can be performed. Another object of the present invention is to provide a method for producing a laminated structure using the laminated film.
  • a base film and an insulating resin layer laminated on the surface of the base film are provided, and at one end of the laminated film, the base relative to the end surface of the insulating resin layer is provided.
  • the peel strength of the base film with respect to the insulating resin layer is Xgf / cm, and the distance of the base film protruding on the one end side is Ymm,
  • a laminated film in which Y / X is 0.5 or more and 15 or less is provided.
  • the X is 0.3 or more and 9 or less.
  • the Y is 0.5 or more and 20 or less.
  • the base film has a thickness of 25 ⁇ m or more.
  • the arithmetic average roughness Ra of the surface of the base film on the insulating resin layer side is 5 nm or more and less than 400 nm.
  • the insulating resin layer includes an epoxy compound, an inorganic filler, and a curing agent.
  • the curing agent contains a phenol compound, a cyanate compound, a maleimide compound, or an active ester compound.
  • end surfaces of the base film and the insulating resin layer are aligned on the other end side opposite to the one end of the laminated film, or the one end of the laminated film.
  • the end face of the base film protrudes outward from the end face of the insulating resin layer on both the side and the other end opposite to the one end, and the base film protrudes on the other end side. Is smaller than the distance of the base film protruding from the one end side.
  • the minimum melt viscosity in the temperature region of 60 ° C. or higher and 180 ° C. or lower of the insulating resin layer is 5 mPa ⁇ s or higher.
  • the insulating resin layer is suitably used for forming an insulating layer in a multilayer printed wiring board.
  • a surface of the insulating resin layer opposite to the base film is disposed.
  • the insulating resin layer is irradiated with a laser from the substrate film side in a lamination process in which the metal layer is laminated on the lamination target member.
  • a via hole forming step of forming a via hole is a step of forming a via hole.
  • a curing step of curing the insulating resin layer is provided between the laminating step and the via hole forming step.
  • the laminated film according to the present invention includes a base film and an insulating resin layer laminated on the surface of the base film.
  • the end face of the base film protrudes most outward from the end face of the insulating resin layer.
  • Y / X is 0. .5 or more and 15 or less.
  • the laminated film according to the present invention has the above-described configuration, natural peeling from the insulating resin layer of the base film during curing can be suppressed, and the base film is peeled from the insulating resin layer after curing. When it does, the peeling defect of a base film can be suppressed.
  • FIG. 1 is a cross-sectional view showing a laminated film according to the first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing a laminated film according to the second embodiment of the present invention.
  • the laminated film according to the present invention includes a base film and an insulating resin layer laminated on the surface of the base film.
  • the laminated film according to the present invention has the following configuration (0).
  • the end surface of the base film protrudes most outwardly with respect to the end surface of the insulating resin layer. (Hereafter, it may be described as a laminated film (0))
  • the laminated film according to the present invention has the largest protruding distance on one end side among all ends.
  • the peel strength of the base film with respect to the insulating resin layer is Xgf / cm
  • the distance of the base film protruding on the one end side is Ymm
  • Y / X Y
  • the ratio of X to X is 0.5 or more and 15 or less.
  • the distance Y is the distance protruding most.
  • the laminated film according to the present invention has the above-described configuration, natural peeling from the insulating resin layer of the base film during curing can be suppressed, and the base film is peeled from the insulating resin layer after curing. When it does, the peeling defect of a base film can be suppressed. In the laminated film according to the present invention, tearing of the base film can be suppressed when the base film is peeled from the insulating resin layer after curing.
  • the time of pre-curing and after pre-curing are also included.
  • the base film since one end side of the base film protrudes, the base film can be peeled from the insulating resin layer from one end side after curing.
  • the laminated film according to the present invention has the above-described configuration, natural peeling from the insulating resin layer of the base film at the time of preliminary curing can be suppressed, and the base film is insulated from the insulating resin layer after preliminary curing. When peeling from the substrate film, poor peeling of the base film can be suppressed.
  • the laminated film according to the present invention since the laminated film according to the present invention has the above-described configuration, it suppresses natural peeling from the insulating resin layer of the base film during transportation of the substrate or during laser irradiation for forming a via hole. Can do.
  • Examples of the configuration included in the configuration (0) include the following configuration (1) and the following configuration (2).
  • the laminated film according to the present invention may have the following configuration (1) or the following configuration (2).
  • the laminated film according to the present invention may have the following configuration (1) or may have the following configuration (2).
  • the end face of the base film protrudes most outwardly with respect to the end face of the insulating resin layer.
  • end surfaces of the base film and the insulating resin layer are aligned.
  • the end surface of the base film protrudes most outward from the end surface of the insulating resin layer.
  • the end face of the base film protrudes outward from the end face of the insulating resin layer.
  • the distance that the base film protrudes on the other end side is equal to or less than the distance that the base film protrudes on the one end side.
  • the one end and the other end are ends on opposite sides of the laminated film.
  • the protruding distance of the base film on the other end side is the same as the protruding distance of the base film on the one end side, or the base film on the one end side. Is smaller than the protruding distance.
  • the base film When the end faces of the base film and the insulating resin layer are aligned at all ends of the laminated film, that is, in the case of a conventional laminated film, the base film is likely to be naturally separated from the insulating resin layer during curing. Moreover, in the case of the conventional laminated
  • a laminated film Of (1) and laminated film (2), laminated film (1) is preferred.
  • the laminated film (2) preferably has the following configuration (2A).
  • the end face of the base film protrudes most outward from the end face of the insulating resin layer.
  • the end face of the base film protrudes outward from the end face of the insulating resin layer.
  • the distance that the base film protrudes on the other end side is smaller than the distance that the base film protrudes on the one end side.
  • the peel strength of the base film with respect to the insulating resin layer is Xgf / cm, and the distance of the base film protruding on the one end side is Ymm. Therefore, in the laminated films (2) and (2A), Y indicates the larger distance among the distances at which the end surfaces of the base film protrude outward from the end surfaces of the insulating resin layer.
  • Y / X (X of Y Ratio) to 0.5 to 15.
  • the base film is likely to spontaneously peel from the insulating resin layer during curing.
  • Y / X exceeds 15, when the base film is peeled from the insulating resin layer after curing, the base film and the insulating resin layer cannot be peeled well, and the base film is easily torn.
  • X is preferably 0.7 or more, more preferably 1.0 or more, preferably 13 or less, more preferably 11 or less.
  • X is , Preferably 0.3 or more, preferably 9 or less.
  • the above Y is , Preferably 0.5 or more, preferably 20 or less.
  • the peel strength (that is, X) of the base film with respect to the insulating resin layer is preferably 0.3 gf / cm or more, more preferably 0.5 gf / cm or more, preferably 9 gf / cm or less, more preferably 7 gf / cm. cm or less.
  • the peel strength is equal to or higher than the lower limit, natural peeling from the insulating resin layer of the base film during substrate transportation can be suppressed, and insulation of the base film can be achieved even during laser irradiation for forming via holes. Spontaneous peeling from the resin layer can be suppressed.
  • the peel strength is not more than the above upper limit, the peel strength can be increased, and the roughness after desmear treatment can be suppressed from increasing.
  • the peel strength of the base film with respect to the insulating resin layer can be measured using a tensile tester (“AG-5000B” manufactured by Shimadzu Corporation) under a crosshead speed of 5 mm / min.
  • the distance (that is, Y) that the base film protrudes on the one end side is preferably 0.5 mm or more, more preferably 1 mm or more, preferably 20 mm or less, more preferably 15 mm or less.
  • the base film can be satisfactorily peeled from the insulating resin layer after curing using an auto peeling device. Cracking or cracking of the insulating resin layer can be suppressed when slitting one end or the other end of the laminated film during production.
  • the distance that the base film protrudes on the one end side is not more than the above upper limit, natural peeling from the insulating resin layer of the base film during transport of the laminated film can be suppressed, and the manufacturing cost can be suppressed. be able to.
  • a protective film is preferably laminated on the surface of the insulating resin layer opposite to the base film side.
  • the base film and the insulating resin layer may be used as a method of protruding the end face of the base film outward from the end face of the insulating resin layer on one end side of the laminated films (0) and (1).
  • stacking with is mentioned.
  • the following method may be mentioned as a method for aligning the end surfaces of the base material, the insulating resin layer, and the protective film on the other end side opposite to the one end of the laminated film (1).
  • Examples of a method for reducing the distance of the base film on the other end side of the laminated film (2A) to be smaller than the distance of the base film on the one end side include the following methods. .
  • a method of slitting the base film of the base film and the insulating resin layer A method of slitting a base film and a protective film among the base film, the insulating resin layer, and the protective film.
  • the method for producing a laminated film according to the present invention preferably has the following configuration (A) or (B).
  • Manufacturing method (A), (B) is a manufacturing method of laminated
  • Manufacturing method (A) is a manufacturing method of laminated film (1)
  • manufacturing method (B) is a manufacturing method of laminated film (2).
  • the method for producing the laminated film (1) preferably includes the following configuration (A). It is preferable that the manufacturing method of a laminated film (2) is provided with the following structures (B).
  • the manufacturing method of a laminated film (1) arrange
  • the first step is provided.
  • the production method of the laminated film (1) preferably includes a second step of disposing a protective film on the surface of the insulating resin layer opposite to the base film side.
  • the manufacturing method of a laminated film (1) the laminated film (1) with which the end surface of the said base film and the said insulating resin layer has gathered in the other end side opposite to the said one end of a laminated film is obtained.
  • the manufacturing method of a laminated film (2) arrange
  • the first step is provided. In this first step, the end face of the base film protrudes outwardly on the surface of the base film with respect to both end faces of one end side of the insulating resin layer and the other end side opposite to the one end. It is preferable to dispose an insulating resin layer. It is preferable that the manufacturing method of a laminated film (2) is equipped with the 2nd process which arrange
  • the end face of the base film protrudes outward with respect to the end face of the insulating resin layer on both the one end side of the laminated film and the other end side opposite to the one end.
  • a laminated film (2) is obtained.
  • a laminated film (2) is obtained in which the distance that the base film protrudes on the other end side is smaller than the distance that the base film protrudes on the one end side.
  • the base film, the insulating resin layer, and the protection are provided on the other end side opposite to the one end of the insulating resin layer after the second step. It is preferable to further include a third step of aligning the end surface with the film.
  • the base film, the insulating resin layer, and the protective film on the other end side opposite to the one end of the insulating resin layer. You may align the end face.
  • the base film protrudes on the other end side. It is preferable to further include a third step of making the distance that is smaller than the distance that the base film protrudes on the one end side.
  • the distance of the base film on the other end side of the laminated film (2) is defined as the distance of the base film on the one end side. From the viewpoint of making it even smaller than the protruding distance, it is preferable to perform the following slits.
  • the insulating resin layer is preferably slit. In the third step, it is preferable to slit the base film, the insulating resin layer, and the protective film.
  • an adherend such as a metal layer (for example, a laminate of a substrate and metal wiring) is generally laminated on the surface of the insulating resin layer.
  • the protective film is peeled off when the insulating resin layer is used in the laminated film.
  • an adherend such as a metal layer (for example, a laminate of a substrate and metal wiring) is laminated on the surface of the insulating resin layer after the protective film is peeled off.
  • FIG. 1 is a cross-sectional view showing a laminated film according to the first embodiment of the present invention.
  • FIG. 1 is a cross-sectional view showing the laminated film (1).
  • the laminated film 1 has one end 1a and the other end 1b opposite to the one end 1a.
  • One end 1a and the other end 1b of the laminated film 1 are end portions on both sides facing each other.
  • the laminated film 1 includes a base film 2 and an insulating resin layer 3.
  • the insulating resin layer 3 is laminated on the first surface 2 a of the base film 2.
  • the dimension of the base film 2 is larger than the dimension of the insulating resin layer 3 in the direction connecting the one end 1 a and the other end 1 b of the laminated film 1.
  • the size of the insulating resin layer 3 is smaller than the size of the base film 2.
  • the end surface of the base film 2 protrudes outward from the end surface of the insulating resin layer 3.
  • the end surfaces of the base film 2 and the insulating resin layer 3 are not aligned.
  • the protruding distance of the base film 2 is Ymm.
  • the end surfaces of the base film 2 and the insulating resin layer 3 are aligned.
  • FIG. 2 is a cross-sectional view showing a laminated film according to the second embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing the laminated film (2).
  • the laminated film 1A has one end 1Aa and the other end 1Ab opposite to the one end 1Aa.
  • One end 1Aa and the other end 1Ab of the laminated film 1A are opposite ends on opposite sides.
  • the laminated film 1A includes a base film 2A and an insulating resin layer 3A.
  • the insulating resin layer 3 is laminated on the first surface 2Aa of the base film 2A.
  • the dimension of the base film 2A is larger than the dimension of the insulating resin layer 3A.
  • the size of the insulating resin layer 3A is smaller than the size of the base film 2A.
  • the end surface of the base film 2A protrudes outward from the end surface of the insulating resin layer 3A.
  • the end surfaces of the base film 2A and the insulating resin layer 3A are not aligned.
  • the end surface of the base film 2A protrudes outward from the end surface of the insulating resin layer 3A.
  • the end surfaces of the base film 2A and the insulating resin layer 3A are not aligned.
  • the distance that the base film 2A protrudes on the other end 1Ab side of the laminated film 1A is smaller than the distance that the base film 2A protrudes on the one end 1Aa side.
  • the protruding distance of the base film 2A is Ymm.
  • the laminated film preferably has an MD (Machine Direction) direction and a TD (Transverse Direction) direction.
  • the MD direction is the flow direction of the laminated film during production of the laminated film, for example, the length direction.
  • the TD direction is a direction perpendicular to the flow direction of the laminated film during production of the laminated film, and is a direction perpendicular to the thickness direction of the laminated film.
  • the TD direction is the width direction. It is preferable that the said one end and the said other end of the said laminated
  • the dimension of the base film is W 1 mm
  • the dimension of the insulating resin layer is W 2 mm.
  • W 1 is usually larger than W 2 .
  • the laminated film according to the present invention usually satisfies W 1 > W 2 .
  • W 2 / W 1 (ratio of insulating resin layer dimension to base film dimension) is preferably 0.9 or more, more preferably 0.92 or more, and further preferably 0.94 or more. Particularly preferably, it is 0.96 or more.
  • W 2 / W 1 (ratio of the size of the insulating resin layer to the size of the base film) is preferably 0.999 or less, more preferably 0.998 or less, and even more preferably 0.997 or less. Particularly preferably, it is 0.996 or less.
  • the base film can be satisfactorily peeled from the insulating resin layer after curing using an auto peeling device, and at the time of producing the laminated film, one end of the laminated film or When the other end is slit, cracking or cracking of the insulating resin layer can be suppressed.
  • W 2 / W 1 is less than or equal to the above upper limit, natural peeling from the insulating resin layer of the base film during conveyance of the laminated film can be suppressed, and the base film can be used efficiently. Cost can be reduced.
  • Base film examples of the base film include metal foil, polyester resin films such as polyethylene terephthalate film and polybutylene terephthalate film, olefin resin films such as polyethylene film and polypropylene film, and polyimide film.
  • the surface of the base film may be subjected to a release treatment as necessary.
  • the base film may be a metal foil or a resin film.
  • the base film is preferably a resin film.
  • the metal foil is preferably a copper foil.
  • the base film is preferably subjected to a release treatment.
  • the release treatment is preferably a non-silicone transfer release treatment.
  • the silicone non-migrating mold release process means a mold release process that does not contain silicone or a mold release process that is processed so that silicone does not migrate to the insulating resin layer side.
  • the thickness of the base film is preferably 25 ⁇ m or more, more preferably 30 ⁇ m or more, preferably 75 ⁇ m or less. Preferably it is 50 micrometers or less. From the viewpoint of further suppressing natural peeling, the thickness of the substrate film is preferably 75 ⁇ m or less, more preferably 50 ⁇ m or less. From the viewpoint of further suppressing the peeling failure, the thickness of the base film is preferably 25 ⁇ m or more.
  • the arithmetic average roughness Ra of the surface of the base film on the insulating resin layer side is preferably 5 nm or more, more preferably 10 nm or more, preferably 400 nm or less, more preferably less than 400 nm, still more preferably 300 nm or less.
  • the arithmetic average roughness is not less than the above lower limit and not more than the above upper limit, the natural peeling from the insulating resin layer of the base film during curing is further suppressed, and the base film is peeled from the insulating resin layer after curing. Moreover, the peeling defect of a base film can be further suppressed.
  • the arithmetic average roughness Ra is measured using a non-contact type surface roughness meter in a VSI contact mode and a measurement range of 95.6 ⁇ m ⁇ 71.7 ⁇ m with a 50 ⁇ lens.
  • the insulating resin layer is laminated on the surface of the base film. It is preferable that the said insulating resin layer contains the epoxy compound mentioned later, the inorganic filler mentioned later, and the hardening
  • the insulating resin layer preferably contains an epoxy compound.
  • a conventionally well-known epoxy compound can be used as said epoxy compound.
  • the epoxy compound refers to an organic compound having at least one epoxy group. As for the said epoxy compound, only 1 type may be used and 2 or more types may be used together.
  • epoxy compounds examples include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, and naphthalene type epoxy compounds.
  • examples thereof include an epoxy compound and an epoxy compound having a triazine nucleus in the skeleton.
  • the epoxy compound preferably has an aromatic skeleton, more preferably a biphenyl skeleton, and further preferably a biphenyl type epoxy compound. preferable.
  • the content of the epoxy compound in the insulating resin layer 100% by weight is preferably 10% by weight or more, more preferably 20% by weight or more.
  • it is 70 weight% or less, More preferably, it is 65 weight% or less, More preferably, it is 60 weight% or less, Most preferably, it is 55 weight% or less.
  • the molecular weight of the epoxy compound is more preferably 1000 or less.
  • the inorganic filler can be uniformly present.
  • the molecular weight of the epoxy compound and the molecular weight of the curing agent described later mean the molecular weight that can be calculated from the structural formula when the epoxy compound or the curing agent is not a polymer and when the structural formula of the epoxy compound or the curing agent can be specified. To do. Moreover, when an epoxy compound or a hardening
  • the insulating resin layer preferably contains an inorganic filler.
  • the use of the inorganic filler reduces the dimensional change due to heat of the cured product. Furthermore, the surface roughness of the surface of the cured product is further reduced, and the adhesive strength between the cured product and the metal layer is increased.
  • the base film when the insulating resin layer contains an inorganic filler, the base film may be naturally peeled from the insulating resin layer at the time of curing, and when the base film is peeled from the insulating resin layer after curing, The base film and the insulating resin layer cannot be peeled well, and the base film is easily torn.
  • the laminated film according to the present invention even when the insulating resin layer contains an inorganic filler, natural peeling from the insulating resin layer of the base film during curing is further suppressed, and the base film is insulated after curing. When peeling from a layer, the peeling defect of a base film can be suppressed further.
  • examples of the inorganic filler include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.
  • the inorganic filler is preferably silica or alumina, more preferably silica, and still more preferably fused silica.
  • silica the coefficient of thermal expansion of the cured product is further reduced, the surface roughness of the surface of the cured product is effectively reduced, and the adhesive strength between the cured product and the metal layer is effectively increased.
  • the shape of silica is preferably spherical.
  • the inorganic filler is spherical silica from the viewpoint of promoting the curing of the resin, effectively increasing the glass transition temperature of the cured product, and effectively reducing the thermal linear expansion coefficient of the cured product. It is preferable.
  • the average particle size of the inorganic filler is preferably 10 nm or more, more preferably 50 nm or more, still more preferably 100 nm or more, preferably 5 ⁇ m or less, more preferably 3 ⁇ m or less, still more preferably 1 ⁇ m or less, and particularly preferably 0.5 ⁇ m. It is as follows. The adhesive strength of hardened
  • the median diameter (d50) value of 50% is adopted as the average particle diameter of the inorganic filler.
  • the average particle size can be measured using a laser diffraction / scattering particle size distribution measuring apparatus.
  • the average particle diameter of the said inorganic filler is measured with the whole inorganic filler contained in the said insulating resin layer. You may measure the average particle diameter of an inorganic filler using the resin composition or inorganic filler used in order to obtain the said insulating resin layer.
  • the inorganic filler is preferably spherical and more preferably spherical silica. In this case, the surface roughness of the surface of the cured product is effectively reduced, and the adhesive strength between the cured product and the metal layer is effectively increased.
  • the aspect ratio of the inorganic filler is preferably 2 or less, more preferably 1.5 or less.
  • the inorganic filler is preferably surface-treated, more preferably a surface-treated product with a coupling agent, and still more preferably a surface-treated product with a silane coupling agent.
  • the surface roughness of the surface of the roughened cured product is further reduced, the adhesive strength between the cured product and the metal layer is further increased, and finer wiring is formed on the surface of the cured product, and more Better inter-wiring insulation reliability and interlayer insulation reliability can be imparted to the cured product.
  • Examples of the coupling agent include silane coupling agents, titanium coupling agents, and aluminum coupling agents.
  • Examples of the silane coupling agent include methacryl silane, acrylic silane, amino silane, imidazole silane, vinyl silane, and epoxy silane.
  • the content of the inorganic filler is preferably 30% by weight or more, more preferably 40% by weight or more, still more preferably 50% by weight or more, and particularly preferably 60% by weight or more. Preferably it is 70 weight% or more. In 100% by weight of the insulating resin layer, the content of the inorganic filler is preferably 90% by weight or less, more preferably 85% by weight or less, still more preferably 83% by weight or less, and particularly preferably 80% by weight or less. .
  • the content of the inorganic filler is not less than the above lower limit and not more than the above upper limit, the surface roughness of the surface of the cured product is further reduced, the adhesive strength between the cured product and the metal layer is further increased, and curing is performed. Finer wiring is formed on the surface of the object. Furthermore, if it is content of this inorganic filler, it is also possible to make smear removal property favorable simultaneously with making the thermal expansion coefficient of hardened
  • the insulating resin layer preferably contains a curing agent.
  • curing agent is not specifically limited.
  • a conventionally known curing agent can be used.
  • curing agent only 1 type may be used and 2 or more types may be used together.
  • cyanate compound cyanate curing agent
  • phenol compound phenol curing agent
  • amine compound amine curing agent
  • thiol compound thiol curing agent
  • imidazole compound phosphine compound
  • acid anhydride dicyandiamide
  • examples thereof include a carbodiimide compound (carbodiimide curing agent), a maleimide compound (maleimide curing agent), and an active ester compound.
  • the curing agent preferably has a functional group capable of reacting with the epoxy group of the epoxy compound.
  • the curing agent preferably contains a cyanate compound, a phenol compound, a maleimide compound, an active ester compound, or a carbodiimide compound. From the viewpoint of further suppressing the natural peeling from the insulating resin layer of the base film during curing, and further suppressing the peeling failure of the base film when peeling the base film from the insulating resin layer after curing.
  • a phenolic compound, a cyanate compound, a maleimide compound, or an active ester compound Preferably contains a phenolic compound, a cyanate compound, a maleimide compound, or an active ester compound.
  • the curing agent may contain a phenol compound, a cyanate compound, or an active ester compound.
  • the cyanate compound may be a cyanate ester compound (cyanate ester curing agent).
  • the cyanate ester compound include novolac-type cyanate ester resins, bisphenol-type cyanate ester resins, and prepolymers in which these are partially trimerized.
  • novolak-type cyanate ester resin a phenol novolak-type cyanate ester resin, an alkylphenol-type cyanate ester resin, etc. are mentioned.
  • the bisphenol type cyanate ester resin include bisphenol A type cyanate ester resin, bisphenol E type cyanate ester resin, and tetramethylbisphenol F type cyanate ester resin.
  • cyanate ester compounds Commercially available products of the above-mentioned cyanate ester compounds include phenol novolac type cyanate ester resins (Lonza Japan “PT-30” and “PT-60”), and prepolymers (Lonza Japan) in which bisphenol type cyanate ester resins are trimmed. "BA-230S”, “BA-3000S”, “BTP-1000S” and “BTP-6020S”) manufactured by the company.
  • phenol compound examples include novolak type phenol, biphenol type phenol, naphthalene type phenol, dicyclopentadiene type phenol, aralkyl type phenol, and dicyclopentadiene type phenol.
  • phenol compounds Commercially available products of the above-mentioned phenol compounds include novolak-type phenols (“TD-2091” manufactured by DIC), biphenyl novolac-type phenols (“MEH-7851” manufactured by Meiwa Kasei Co., Ltd.), and aralkyl-type phenol compounds (“MEH manufactured by Meiwa Kasei Co., Ltd.). -7800 "), and phenols having an aminotriazine skeleton (“ LA1356 “and” LA3018-50P "manufactured by DIC).
  • the active ester compound refers to a compound containing at least one ester bond in the structure and having an aromatic ring bonded to both sides of the ester bond.
  • the active ester compound is obtained, for example, by a condensation reaction between a carboxylic acid compound or thiocarboxylic acid compound and a hydroxy compound or thiol compound.
  • Examples of the active ester compound include a compound represented by the following formula (1).
  • X1 and X2 each represent a group containing an aromatic ring.
  • the group containing an aromatic ring include a benzene ring which may have a substituent and a naphthalene ring which may have a substituent.
  • a hydrocarbon group is mentioned as said substituent.
  • the carbon number of the hydrocarbon group is preferably 12 or less, more preferably 6 or less, and still more preferably 4 or less.
  • a combination of a benzene ring which may have a substituent and a benzene ring which may have a substituent a combination of a benzene ring which may have a substituent and a benzene ring which may have a substituent, a benzene ring which may have a substituent and a substitution
  • the combination with the naphthalene ring which may have a group is mentioned.
  • examples of the combination of X1 and X2 include a combination of a naphthalene ring which may have a substituent and a naphthalene ring which may have a substituent.
  • the active ester compound is not particularly limited.
  • Examples of commercially available active ester compounds include “HPC-8000-65T”, “EXB9416-70BK”, “EXB8100-65T”, and “EXB-8000L-65MT” manufactured by DIC.
  • the carbodiimide compound has a structural unit represented by the following formula (2).
  • the right end and the left end are binding sites with other groups.
  • X is an alkylene group, a group having a substituent bonded to an alkylene group, a cycloalkylene group, a group having a substituent bonded to a cycloalkylene group, an arylene group, or a substituent bonded to an arylene group.
  • X may be the same and may differ.
  • At least one X is an alkylene group, a group in which a substituent is bonded to an alkylene group, a cycloalkylene group, or a group in which a substituent is bonded to a cycloalkylene group.
  • carbodiimide compounds include “Carbodilite V-02B”, “Carbodilite V-03”, “Carbodilite V-04K”, “Carbodilite V-07”, “Carbodilite V-09”, “Carbodilite” manufactured by Nisshinbo Chemical Co., Ltd. 10M-SP ”and“ Carbodilite 10M-SP (revised) ”,“ STABAXOL P ”,“ STABAXOL P400 ”, and“ HIKAZIL 510 ”manufactured by Rhein Chemie.
  • a conventionally known maleimide compound can be used as the maleimide compound.
  • the said maleimide compound only 1 type may be used and 2 or more types may be used together.
  • the maleimide compound may be a bismaleimide compound.
  • maleimide compound examples include N-phenylmaleimide and N-alkylbismaleimide.
  • the maleimide compound preferably has a skeleton derived from a diamine compound other than dimer amine or a triamine compound other than trimer triamine.
  • the maleimide compound may or may not have an aromatic ring.
  • the maleimide compound preferably has an aromatic ring.
  • a nitrogen atom in the maleimide skeleton and an aromatic ring are preferably bonded.
  • the content of the maleimide compound in 100% by weight of the component excluding the solvent in the insulating resin layer is preferably 0.5% by weight or more, more preferably It is 1% by weight or more, preferably 15% by weight or less, more preferably 10% by weight or less.
  • the content of the maleimide compound in 100% by weight of the component excluding the inorganic filler and the solvent in the insulating resin layer is preferably 2.5% by weight or more, more preferably 5% by weight or more, and still more preferably 7.5%. % By weight or more, preferably 50% by weight or less, more preferably 35% by weight or less.
  • the thermal dimensional stability of the cured product can be further enhanced.
  • the molecular weight of the maleimide compound is preferably 500 or more, more preferably 1000 or more, preferably less than 30000, more preferably less than 20000.
  • the molecular weight of the maleimide compound means a molecular weight that can be calculated from the structural formula when the maleimide compound is not a polymer and when the structural formula of the maleimide compound can be specified. Moreover, the molecular weight of the said maleimide compound shows the weight average molecular weight in polystyrene conversion measured by gel permeation chromatography (GPC), when the said maleimide compound is a polymer.
  • GPC gel permeation chromatography
  • maleimide compound Commercially available products of the maleimide compound include, for example, “BMI-4000” and “BMI-5100” manufactured by Daiwa Kasei Kogyo Co., Ltd., and Designer Molecules Inc. “BMI-3000” manufactured by the company can be mentioned.
  • the molecular weight of the curing agent is preferably 1000 or less. In this case, when the insulating resin layer is laminated on the base film, the inorganic filler can be uniformly present.
  • the total content of the epoxy compound and the curing agent is preferably 75% by weight or more, more preferably 80% by weight or more, preferably It is 99 weight% or less, More preferably, it is 97 weight% or less.
  • the total content of the epoxy compound and the curing agent is not less than the above lower limit and not more than the above upper limit, an even better cured product can be obtained and the melt viscosity can be adjusted. Good. Further, it is possible to prevent the insulating resin layer from spreading into unintended areas during the curing process. Furthermore, the dimensional change by the heat
  • the melt viscosity does not become too low, and the insulating film tends to become difficult to wet excessively in unintended areas during the curing process. is there. Further, if the total content of the epoxy compound and the curing agent is not more than the above upper limit, it becomes easy to embed the holes or irregularities of the circuit board, and the inorganic filler tends not to exist unevenly. is there.
  • the content of the curing agent is preferably 30% by weight or more, more preferably 40% by weight or more, and preferably 70% by weight or less. More preferably, it is 60% by weight or less.
  • the content of the curing agent is not less than the above lower limit and not more than the above upper limit, a better cured product is obtained, and the dielectric loss tangent is effectively reduced.
  • the insulating resin layer preferably contains a thermoplastic resin.
  • the thermoplastic resin include polyimide resin, polyvinyl acetal resin, and phenoxy resin.
  • the said thermoplastic resin only 1 type may be used and 2 or more types may be used together.
  • the thermoplastic resin is preferably a phenoxy resin from the viewpoint of effectively reducing the dielectric loss tangent and effectively improving the adhesion of the metal wiring.
  • the phenoxy resin By using the phenoxy resin, it is possible to suppress the deterioration of the embedding property of the insulating resin layer with respect to the hole or the unevenness of the circuit board and the unevenness of the inorganic filler.
  • the melt viscosity can be adjusted by using a phenoxy resin, the dispersibility of the inorganic filler is improved, and the insulating resin layer is difficult to wet and spread in an unintended region during the curing process.
  • the phenoxy resin is not particularly limited. A conventionally known phenoxy resin can be used as the phenoxy resin. As for the said phenoxy resin, only 1 type may be used and 2 or more types may be used together.
  • phenoxy resins examples include phenoxy resins having a skeleton such as a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a biphenyl skeleton, a novolak skeleton, a naphthalene skeleton, and an imide skeleton.
  • phenoxy resins examples include “YP50”, “YP55” and “YP70” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and “1256B40”, “4250”, “4256H40” manufactured by Mitsubishi Chemical Corporation, “ 4275 “,” YX6954BH30 “,” YX8100BH30 “, and the like.
  • the weight average molecular weight of the thermoplastic resin is preferably 5000 or more, more preferably 10,000 or more, preferably 100,000 or less, more preferably 50000 or less.
  • the weight average molecular weight of the thermoplastic resin indicates a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).
  • the contents of the thermoplastic resin and the phenoxy resin are not particularly limited.
  • the content of the thermoplastic resin (the content of the phenoxy resin when the thermoplastic resin is a phenoxy resin) is preferably 1% by weight or more More preferably, it is 5% by weight or more, preferably 30% by weight or less, more preferably 15% by weight or less.
  • the content of the thermoplastic resin is not less than the above lower limit and not more than the above upper limit, the embedding property of the insulating resin layer with respect to the holes or irregularities of the circuit board is improved.
  • the content of the thermoplastic resin is not less than the above lower limit, the formation of the insulating resin layer is further facilitated, and an even better insulating layer is obtained.
  • the content of the thermoplastic resin is not more than the above upper limit, the thermal expansion coefficient of the cured product is further reduced. The surface roughness of the surface of the cured product is further reduced, and the adhesive strength between the cured product and the metal layer is further increased.
  • the insulating resin layer preferably contains a curing accelerator.
  • the curing rate is further increased.
  • the crosslinked structure in the cured product becomes uniform, the number of unreacted functional groups decreases, and as a result, the crosslinking density increases.
  • the said hardening accelerator is not specifically limited, A conventionally well-known hardening accelerator can be used. As for the said hardening accelerator, only 1 type may be used and 2 or more types may be used together.
  • curing accelerator examples include imidazole compounds, phosphorus compounds, amine compounds, and organometallic compounds.
  • imidazole compound examples include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl- 2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-un Decylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2 ' -Mechi Imidazolyl- (1 ′)]-
  • Examples of the phosphorus compound include triphenylphosphine.
  • Examples of the amine compound include diethylamine, triethylamine, diethylenetetramine, triethylenetetramine and 4,4-dimethylaminopyridine.
  • organometallic compound examples include zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), and trisacetylacetonate cobalt (III).
  • the content of the curing accelerator is not particularly limited. In 100% by weight of the component excluding the inorganic filler in the insulating resin layer, the content of the curing accelerator is preferably 0.005% by weight or more, more preferably 0.01% by weight or more, preferably 5% by weight or less. More preferably, it is 3% by weight or less.
  • the content of the curing accelerator is not less than the above lower limit and not more than the above upper limit, the insulating resin layer is efficiently cured. If content of the said hardening accelerator is a more preferable range, the storage stability of an insulating resin layer will become still higher, and a much better hardened
  • the insulating resin layer does not contain or contains a solvent. Moreover, the said solvent may be used in order to obtain the slurry containing the said inorganic filler. As for the said solvent, only 1 type may be used and 2 or more types may be used together.
  • Examples of the solvent include acetone, methanol, ethanol, butanol, 2-propanol, 2-methoxyethanol, 2-ethoxyethanol, 1-methoxy-2-propanol, 2-acetoxy-1-methoxypropane, toluene, xylene, methyl ethyl ketone, Examples thereof include N, N-dimethylformamide, methyl isobutyl ketone, N-methyl-pyrrolidone, n-hexane, cyclohexane, cyclohexanone and naphtha which is a mixture.
  • the boiling point of the solvent is preferably 200 ° C. or lower, more preferably 180 ° C. or lower.
  • the content of the solvent in the insulating resin layer is not particularly limited. The content of the solvent can be appropriately changed to such an extent that the layer shape of the insulating resin layer can be maintained.
  • the insulating resin layer has a leveling agent, a flame retardant, a coupling agent, a colorant, an antioxidant, an ultraviolet degradation inhibitor, You may add other thermosetting resins other than an antifoamer, a thickener, a thixotropic agent, and an epoxy compound.
  • Examples of the coupling agent include silane coupling agents, titanium coupling agents, and aluminum coupling agents.
  • Examples of the silane coupling agent include vinyl silane, amino silane, imidazole silane, and epoxy silane.
  • thermosetting resins examples include polyphenylene ether resins, divinyl benzyl ether resins, polyarylate resins, diallyl phthalate resins, polyimide resins, benzoxazine resins, benzoxazole resins, and acrylate resins.
  • Examples of the method for obtaining the insulating resin layer include the following methods.
  • An extrusion molding method in which a material for forming an insulating resin layer is melt-kneaded using an extruder, extruded, and then formed into a film shape by a T die or a circular die.
  • a casting molding method in which a material for forming an insulating resin layer containing a solvent is cast into a film.
  • the material for forming an insulating resin layer can be laminated
  • the extrusion molding method or the casting molding method is preferable because it can cope with the reduction in thickness.
  • the film includes a sheet.
  • the material for forming the insulating resin layer is formed into a film and is a B-stage film by, for example, heating and drying at 50 ° C. to 150 ° C. for 1 to 10 minutes so that curing by heat does not proceed excessively.
  • An insulating resin layer can be obtained.
  • the film-like insulating resin layer that can be obtained by the drying process as described above is referred to as a B-stage film.
  • the B-stage film is in a semi-cured state.
  • the semi-cured product is not completely cured and curing can proceed further.
  • the insulating resin layer is preferably a B stage film.
  • the minimum melt viscosity in the temperature region of 60 ° C. or higher and 180 ° C. or lower of the insulating resin layer (or B stage film when the insulating resin layer is a B stage film) is preferably 5 mPa ⁇ s or more, preferably 10 mPa ⁇ s. That's it.
  • the minimum melt viscosity in the temperature region of 60 ° C. or higher and 180 ° C. or lower of the insulating resin layer (when the insulating resin layer is a B stage film) may be 200 mPa ⁇ s or less, It may be 150 mPa ⁇ s or less, 100 mPa ⁇ s or less, or 75 mPa ⁇ s or less.
  • the temperature at the minimum melt viscosity is preferably 140 ° C. or lower, more preferably 130 ° C. or lower.
  • the temperature at the minimum melt viscosity is equal to or lower than the above upper limit, natural peeling accompanying shrinkage of the base film can be effectively suppressed.
  • the minimum melt viscosity was measured using a Rheometer device (for example, “AR-2000” manufactured by TA Instruments) at a frequency of 6.28 rad / sec, a starting temperature of 60 ° C., a heating rate of 5 ° C./min, and a strain of 21. It is obtained by measuring dynamic viscoelasticity under the condition of 8%.
  • the thickness of the insulating resin layer is , Preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, preferably 200 ⁇ m or less, more preferably 100 ⁇ m or less.
  • a protective film is preferably laminated on the surface of the insulating resin layer opposite to the base film side.
  • the protective film material examples include polyolefins such as polypropylene and polyethylene, and polyethylene terephthalate.
  • the material of the protective film is preferably polyolefin, and more preferably polypropylene.
  • the thickness of the protective film is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, preferably 75 ⁇ m or less, more preferably 60 ⁇ m or less.
  • the laminated film according to the present invention is suitably used for forming an insulating layer in a multilayer printed wiring board.
  • the insulating resin layer is suitably used for forming an insulating layer in a multilayer printed wiring board.
  • An insulating layer can be formed by the insulating resin layer of the laminated film according to the present invention.
  • a multilayer printed wiring board including a circuit board, a plurality of insulating layers stacked on the circuit board, and a metal layer disposed between the plurality of insulating layers may be mentioned. At least one of the insulating layers is formed by the insulating resin layer. The insulating layer in contact with the circuit board may be formed by the insulating resin layer. An insulating layer disposed between two insulating layers may be formed of the insulating resin layer. The insulating layer farthest from the circuit board may be formed by the insulating resin layer. Among the plurality of insulating layers, a metal layer may be disposed on the outer surface of the insulating layer away from the circuit board.
  • the manufacturing method of the laminated structure which concerns on this invention is the opposite side to the said base film of the said insulating resin layer in the state by which the said base film and the said insulating resin layer were laminated
  • a via hole is formed by irradiating the insulating resin layer with a laser from the base film side in a state where the base film and the insulating resin layer are laminated. Forming step.
  • the above-described laminated film is used, and the above-mentioned base film and the above-mentioned insulating resin layer are laminated, and the above-mentioned base film of the above-mentioned insulating resin layer is opposite to the above-mentioned base film.
  • the above-mentioned base film of the above-mentioned insulating resin layer is opposite to the above-mentioned base film.
  • the protective film is peeled off, and the surface of the insulating resin layer exposed by peeling is laminated on a lamination target member having a metal layer on the surface.
  • the laminating step is preferably performed by laminating.
  • the temperature during lamination is preferably 80 ° C. or higher, and preferably 120 ° C. or lower.
  • the manufacturing method of the laminated structure which concerns on this invention is equipped with the hardening process which hardens the said insulating resin layer.
  • the insulating resin layer is cured to form a cured product.
  • the curing of the insulating resin layer in the curing step may be preliminary curing.
  • the cured product includes a precured product that can be further cured.
  • the insulating resin layer may be precured to obtain a B stage film.
  • the curing step is preferably performed by heating.
  • the heating temperature is preferably 130 ° C. or higher, preferably 200 ° C. or lower.
  • the heating time is preferably 30 minutes or longer, preferably 120 minutes or shorter.
  • the cured product is preferably roughened.
  • the cured product Prior to the roughening treatment, the cured product is preferably subjected to a swelling treatment.
  • the cured product is preferably subjected to a swelling treatment after the preliminary curing and before the roughening treatment, and is further cured after the roughening treatment.
  • the cured product is not necessarily subjected to the swelling treatment.
  • the swelling treatment method for example, a method of treating a cured product with an aqueous solution or an organic solvent dispersion solution of a compound mainly composed of ethylene glycol or the like is used.
  • the swelling liquid used for the swelling treatment generally contains an alkali as a pH adjuster or the like.
  • the swelling liquid preferably contains sodium hydroxide.
  • the swelling treatment is carried out by treating the cured product with a 40 wt% ethylene glycol aqueous solution at a treatment temperature of 30 ° C. to 85 ° C. for 1 minute to 30 minutes.
  • the swelling treatment temperature is preferably in the range of 50 ° C to 85 ° C. When the temperature of the swelling treatment is too low, it takes a long time for the swelling treatment, and the adhesive strength between the cured product and the metal layer tends to be low.
  • a chemical oxidant such as a manganese compound, a chromium compound, or a persulfate compound is used.
  • chemical oxidizers are used as an aqueous solution or an organic solvent dispersion after water or an organic solvent is added.
  • the roughening liquid used for the roughening treatment generally contains an alkali as a pH adjuster or the like.
  • the roughening solution preferably contains sodium hydroxide.
  • Examples of the manganese compound include potassium permanganate and sodium permanganate.
  • Examples of the chromium compound include potassium dichromate and anhydrous potassium chromate.
  • Examples of the persulfate compound include sodium persulfate, potassium persulfate, and ammonium persulfate.
  • the arithmetic average roughness Ra of the surface of the cured product is preferably 5 nm or more, more preferably 10 nm or more, preferably 400 nm or less, more preferably less than 400 nm, even more preferably 300 nm or less, still more preferably less than 300 nm, particularly preferably Preferably it is less than 200 nm, most preferably less than 150 nm.
  • the adhesive strength between the cured product and the metal layer is increased, and further finer wiring is formed on the surface of the insulating layer. Furthermore, conductor loss can be suppressed and signal loss can be suppressed low.
  • a laser beam is irradiated to the insulating resin layer from the base film side in a state where the base film and the insulating resin layer are laminated to form a via hole.
  • Examples of the laser used in the via hole forming step include a CO 2 laser and a UV laser.
  • the laser is preferably a CO 2 laser.
  • a UV laser it is preferable to use a polyethylene naphthalate (PEN) film and a film containing an ultraviolet absorber.
  • the diameter of the via hole to be formed is not particularly limited, but is preferably 80 ⁇ m or less.
  • the diameter of the via hole may be 10 ⁇ m or more, 30 ⁇ m or more, or 60 ⁇ m or more.
  • the manufacturing method of the laminated structure which concerns on this invention is equipped with the process (desmear process) of removing the smear inside the said via hole by a desmear process after the said via hole formation process.
  • the desmear process it is possible to effectively remove smear, which is a resin residue derived from the resin component formed in the via hole formation process.
  • a chemical oxidant such as a manganese compound, a chromium compound, or a persulfate compound is used.
  • chemical oxidizers are used as an aqueous solution or an organic solvent dispersion after water or an organic solvent is added.
  • the desmear treatment liquid used in the desmear process generally contains an alkali.
  • the desmear treatment liquid preferably contains sodium hydroxide.
  • the desmear process may also serve as a roughening process for roughening the surface of the insulating resin layer.
  • the manufacturing method of the laminated structure which concerns on this invention is equipped with the process (peeling process) which peels the said base film from the said insulating resin layer after the said desmear process.
  • the above peeling process is preferably performed using an auto peeling apparatus.
  • the manufacturing method of the laminated structure according to the present invention further includes a plating step of forming a metal layer by plating on the surface of the insulating resin layer exposed by peeling after the peeling step, and an insulating resin layer after the plating step. It is preferable to provide each step of the main curing step for curing.
  • Base film Base film A (polyethylene terephthalate (PET) film (“25X” manufactured by Lintec), thickness 25 ⁇ m, width 550 mm, arithmetic average roughness Ra 30 nm on the surface of the insulating resin layer side)
  • Base film B polyethylene terephthalate (PET) film (“386501” manufactured by Lintec Corporation), thickness 38 ⁇ m, width 550 mm, arithmetic average roughness Ra 30 nm on the surface of the insulating resin layer side)
  • Base film C polyethylene terephthalate (PET) film (“PLD386502” manufactured by Lintec Corporation), thickness 38 ⁇ m, width 550 mm, arithmetic average roughness Ra 7 nm on the surface of the insulating resin layer side)
  • the arithmetic average roughness was measured using a non-contact type surface roughness meter (“WYKO NT3300” manufactured by BECOL Instruments Co., Ltd.) with a VSI contact mode and a 50 ⁇ lens with a measurement range of 95.6 ⁇ m ⁇ 71.7 ⁇ m. Note that the arithmetic average roughness with the threshold set to 1%, the median filter (Window: Size5), and the tilt corrected condition was measured at 10 measurement points selected at random, and the average value of the measured values was adopted. .
  • a material for forming the insulating resin layer was prepared as follows.
  • Material for forming insulating resin layer A 69.3 parts by weight of cyclohexanone slurry (solid content: 70% by weight) of vinylsilane-treated silica (“SOC2” manufactured by Admatechs) was prepared. To this slurry, 5.6 parts by weight of a biphenyl type epoxy compound (“NC3000H” manufactured by Nippon Kayaku Co., Ltd.), 5.3 parts by weight of a bisphenol F type epoxy compound (“830S” manufactured by DIC), and a fluorene type epoxy compound ( 2.0 parts by weight of “OGSOL PG-100” manufactured by Osaka Gas Chemical Co., Ltd. was added.
  • a biphenyl type epoxy compound (“NC3000H” manufactured by Nippon Kayaku Co., Ltd.)
  • a bisphenol F type epoxy compound 830S” manufactured by DIC
  • fluorene type epoxy compound 2.0 parts by weight of “OGSOL PG-100” manufactured by Osaka Gas Chemical Co., Ltd.
  • a methyl ethyl ketone and cyclohexanone mixed solution (solid content 30% by weight) of bisphenolacetophenone skeleton phenoxy resin (“YX6954” manufactured by Mitsubishi Chemical Corporation) was prepared. 3.6 parts by weight of the mixed solution (solid content 30% by weight), 0.3 part by weight of 2-ethyl-4-methylimidazole (“2E4MZ” manufactured by Shikoku Kasei Kogyo Co., Ltd.), and a leveling agent (manufactured by Enomoto Kasei Co., Ltd.) LS-480 ”) and 0.1 parts by weight were further added. Stirring was performed at 1200 rpm for 30 minutes to obtain a material (varnish) for forming the insulating resin layer A.
  • Material for forming insulating resin layer B A material for forming the insulating resin layer A except that the active ester curing agent (“HPC-8000-65T” manufactured by DIC) is changed to a phenol novolac curing agent (“MEH7851-H” manufactured by Meiwa Kasei Co., Ltd.) Similarly, a material (varnish) for forming the insulating resin layer B was obtained.
  • HPC-8000-65T manufactured by DIC
  • MEH7851-H phenol novolac curing agent
  • Example 1 The step of disposing an insulating resin layer on the surface of the base film: Using a die coater, a material (varnish) for forming the obtained insulating resin layer A is applied on the base film A with a width of 510 mm except for a range of 20 mm from both ends in the width direction of the base material. After the process, the solvent was evaporated by drying at an average temperature of 100 ° C. for 3 minutes. Thus, the insulating resin layer A having a thickness of 40 ⁇ m and a width of 510 mm was formed on the base film A to obtain a laminate.
  • a slitter is provided at a position 30 mm inward from one end (other end) in the width direction of the obtained laminate, and 18 mm inward from an end (one end) opposite to the other end.
  • the laminated film whose distance (Y) which the end surface of the base film protrudes with respect to the end surface of an insulating resin layer is 2 mm in the one end side was obtained.
  • Tables 1 to 3 show the types of base film, the type of insulating resin layer, and the distance (Y) that the end face of the base film protrudes from the end face of the insulating resin layer on one end side of the laminated film as shown in Tables 1 to 3
  • a laminated film was obtained in the same manner as in Example 1 except that.
  • Insulating resin layer A minimum melt viscosity 98 mPa ⁇ s, minimum melt viscosity temperature 137 ° C.
  • Insulating resin layer B minimum melt viscosity 50 mPa ⁇ s, minimum melt viscosity temperature 128 ° C.
  • a CCL substrate (“E679FG” manufactured by Hitachi Chemical Co., Ltd.) of 340 mm ⁇ 510 mm in which an inner layer circuit was formed by etching was prepared. Both surfaces of the CCL substrate were immersed in a copper surface roughening agent (“MEC etch bond CZ-8101” manufactured by MEC) to roughen the copper surface.
  • MEC etch bond CZ-8101 manufactured by MEC
  • the obtained laminated film was cut out to 325 mm ⁇ 502 mm, set on both sides of the CCL substrate from the resin film side, and using the diaphragm type vacuum laminator (“MVLP-500” manufactured by Meiki Seisakusho), the CCL substrate
  • MVLP-500 diaphragm type vacuum laminator
  • the uncured laminated sample A was obtained. Lamination was performed by reducing the pressure for 20 seconds, pressing the pressure at 13 hPa or less at 100 ° C. for 20 seconds, and further pressing at 100 ° C. and a pressure of 0.8 MPa for 40 seconds.
  • Curing process The insulating resin layer was heated at a heating temperature of 180 ° C. for 30 minutes to pre-cure the insulating resin layer.
  • the base film and insulating resin layer (B stage film) are laminated and pre-cured, and then the insulating resin layer is irradiated with a CO 2 laser (“LC-4KF212” manufactured by Hitachi Via Mechanics) from the base film side.
  • a CO 2 laser (“LC-4KF212” manufactured by Hitachi Via Mechanics) from the base film side.
  • the via hole penetrating the base film and the insulating resin layer was formed so that the upper end diameter of the via hole was 60 ⁇ m.
  • the irradiation conditions of the CO 2 laser were as follows.
  • Machining mode Burst Period 0.100ms Pulse width 0.018ms Number of pulses 3 shot Aperture 3.5mm 2nd aperture 28mm Power 3.3W
  • the peeling step the presence or absence of tearing of the base film was confirmed visually.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Film stratifié dans lequel il est possible de supprimer le décollement spontané d'un film de matériau de base d'une couche de résine isolante pendant le durcissement, et dans lequel il est possible de supprimer les défauts de décollement dans le film de matériau de base lorsque le film de matériau de base est décollé de la couche de résine isolante après durcissement. Le film stratifié selon la présente invention comprend un film de matériau de base et une couche de résine isolante stratifiée sur la surface avers du film de matériau de base, le film stratifié étant tel que : au niveau d'un premier côté d'extrémité du film stratifié, une surface d'extrémité du film de matériau de base fait saillie le plus loin vers l'extérieur par rapport à une surface d'extrémité de la couche de résine isolante ; et Y/X fait de 0,5 à 15, où X gf/cm est la résistance au décollement du film de matériau de base par rapport à la couche de résine isolante, et Y mm est la distance de laquelle le film de matériau de base fait saillie au niveau du premier côté d'extrémité.
PCT/JP2019/023465 2018-06-14 2019-06-13 Film stratifié et procédé de fabrication de structure stratifiée WO2019240217A1 (fr)

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JP2022134212A JP7344357B2 (ja) 2018-06-14 2022-08-25 積層フィルム及び積層構造体の製造方法

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WO2024038701A1 (fr) * 2022-08-17 2024-02-22 株式会社ダイセル Stratifié et procédé de fabrication de stratifié

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JP2002011820A (ja) * 2000-04-28 2002-01-15 Achilles Corp 養生用シート体
JP2010094983A (ja) * 2008-09-16 2010-04-30 Toyobo Co Ltd 積層ポリイミドフィルム
JP2011176362A (ja) * 2007-07-09 2011-09-08 Sumitomo Bakelite Co Ltd 回路基板用の樹脂シートおよびその製造方法
JP2015211085A (ja) * 2014-04-24 2015-11-24 味の素株式会社 回路基板の製造方法
WO2016143484A1 (fr) * 2015-03-12 2016-09-15 三井金属鉱業株式会社 Feuille métallique avec support, et procédé de fabrication pour carte de câblage

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JP5607780B2 (ja) 2013-03-28 2014-10-15 株式会社カネカ グラファイト複合フィルム
JP6664092B2 (ja) 2015-10-07 2020-03-13 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板及びプリント配線板

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JP2002011820A (ja) * 2000-04-28 2002-01-15 Achilles Corp 養生用シート体
JP2011176362A (ja) * 2007-07-09 2011-09-08 Sumitomo Bakelite Co Ltd 回路基板用の樹脂シートおよびその製造方法
JP2010094983A (ja) * 2008-09-16 2010-04-30 Toyobo Co Ltd 積層ポリイミドフィルム
JP2015211085A (ja) * 2014-04-24 2015-11-24 味の素株式会社 回路基板の製造方法
WO2016143484A1 (fr) * 2015-03-12 2016-09-15 三井金属鉱業株式会社 Feuille métallique avec support, et procédé de fabrication pour carte de câblage

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024038701A1 (fr) * 2022-08-17 2024-02-22 株式会社ダイセル Stratifié et procédé de fabrication de stratifié

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JP2022172221A (ja) 2022-11-15
JPWO2019240217A1 (ja) 2021-05-06
JP7132242B2 (ja) 2022-09-06
TW202000472A (zh) 2020-01-01

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