WO2019235001A1 - 鉛フリーはんだ合金、ソルダペースト、電子回路実装基板及び電子制御装置 - Google Patents

鉛フリーはんだ合金、ソルダペースト、電子回路実装基板及び電子制御装置 Download PDF

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Publication number
WO2019235001A1
WO2019235001A1 PCT/JP2019/007717 JP2019007717W WO2019235001A1 WO 2019235001 A1 WO2019235001 A1 WO 2019235001A1 JP 2019007717 W JP2019007717 W JP 2019007717W WO 2019235001 A1 WO2019235001 A1 WO 2019235001A1
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WIPO (PCT)
Prior art keywords
mass
lead
less
solder alloy
free solder
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PCT/JP2019/007717
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English (en)
French (fr)
Japanese (ja)
Inventor
正也 新井
健 中野
司 勝山
裕里加 宗川
大輔 丸山
貴則 嶋崎
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株式会社タムラ製作所
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Application filed by 株式会社タムラ製作所 filed Critical 株式会社タムラ製作所
Priority to KR1020197007401A priority Critical patent/KR102673125B1/ko
Publication of WO2019235001A1 publication Critical patent/WO2019235001A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Definitions

  • the present invention relates to a lead-free solder alloy, a solder paste, an electronic circuit mounting board, and an electronic control device.
  • solder joining method using a solder alloy as a method for joining an electronic component to a conductor pattern formed on an electronic circuit board such as a printed wiring board or a module board.
  • this solder alloy used lead.
  • lead-free solder alloy that does not contain lead is becoming common in recent years.
  • solder alloy for example, Sn—Cu, Sn—Ag—Cu, Sn—Bi and Sn—Zn solder alloys are well known.
  • consumer electronic devices such as televisions and mobile phones are soldered using Sn-3Ag-0.5Cu solder alloy (a solder joint is formed using Sn-3Ag-0.5Cu solder alloy).
  • an electronic circuit mounting board is used.
  • the lead-free solder alloy is somewhat inferior in solderability as compared with the lead-containing solder alloy.
  • the solderability problem has been overcome by improving the flux and soldering apparatus, the Sn-3Ag-0.5Cu solder is used in a device that is placed in a relatively mild environment such as a consumer electronic device. Even with solder bonding using an alloy, a certain degree of reliability of the electronic circuit mounting board can be maintained.
  • the mounted electronic circuit board can be exposed to extremely harsh environments that are subject to severe temperature differences (eg, ⁇ 30 ° C. to 115 ° C., ⁇ 40 ° C. to 125 ° C.) and vibration loads.
  • the board before the conductor pattern formation is A board that is formed and can be electrically connected to an electronic component, and a board part that does not include an electronic component among electronic circuit mounting boards on which the electronic component is mounted.
  • the strain due to the difference in linear expansion coefficient from "the board portion of the electronic circuit mounting board on which the electronic component is mounted” that does not include the electronic component) and the stress due to the thermal displacement of the solder joint are generated. These are easy to apply and cause a large load on the solder joint. And the load repeatedly given to a solder joint part in the use process of a car causes the plastic deformation of a solder joint part many times, and can become a cause of crack generation of a solder joint part.
  • Bi When Bi is added to the solder alloy, Bi enters the lattice of the atomic arrangement of the solder alloy and substitutes Sn to distort the atomic arrangement of the lattice. As a result, the Sn matrix is strengthened and the alloy strength is improved, so that a certain improvement in the crack growth suppressing effect in the bulk portion of the solder joint portion is expected.
  • a lead-free solder alloy that has been strengthened by the addition of Bi has the demerit that extensibility deteriorates and brittleness increases. This is presumably because the addition of Bi makes it difficult for slip deformation in a specific crystal orientation to occur.
  • the suppression of crack propagation at the solder joint in an environment with a severe temperature difference is still one of the important issues particularly in the on-vehicle electronic control device and the on-vehicle electronic circuit mounting substrate used therefor. Yes. However, if the Bi content is suppressed in order to suppress the brittle fracture, the crack growth suppressing effect is lowered, and if the content is increased, the brittle fracture is likely to occur. In addition, when In is added to a solder alloy together with Bi to increase the strength of the solder alloy, since In is an easily oxidizable alloy element, depending on its content or combination with other alloy elements, etc. There is a problem that voids are easily generated in the solder joints, and that cracks caused by the voids and their progress are likely to occur.
  • the present invention solves the above-mentioned problems, and provides a lead-free solder alloy, a solder paste, and an electronic circuit that can achieve both crack growth suppression effect of solder joints and resistance to impact accompanied by high-speed deformation in an environment with a severe temperature difference It is an object of the present invention to provide a mounting board and an electronic control device.
  • the lead-free solder alloy according to the present invention comprises 2% by mass to 4% by mass of Ag, 0.3% by mass to 1% by mass Cu, and 1.5% by mass to less than 3% by mass. It contains Bi and 1% by mass or more and less than 3% by mass of In, with the remainder being made of Sn.
  • the Bi content is 2% by mass or more and less than 3% by mass
  • the In content is 2% by mass or more and less than 3% by mass.
  • the Bi content is 2% by mass or more and 2.8% by mass or less
  • the In content is 2% by mass or more and 2.8% by mass or less. Its features.
  • the Bi content is 2.3 mass% or more and 2.8 mass% or less
  • the In content is 2.3 mass% or more and 2.8 mass% or less. It is the feature.
  • the Ag content is 2.5% by mass or more and 3.5% by mass or less.
  • the content of Cu is 0.4% by mass or more and 0.8% by mass or less.
  • the lead-free solder alloy according to the present invention in the configuration described in any one of (1) to (6) above, further includes at least one of Ni and Co in a total of 0.001% by mass or more. It is characterized by containing 10% by mass or less.
  • the lead-free solder alloy according to the present invention in the configuration described in any one of (1) to (7) above, further includes at least one of Fe, Mn, Cr, and Mo in total 0.001 mass. % To 0.05% by mass or less.
  • the lead-free solder alloy according to the present invention is the structure described in any one of (1) to (8) above, and at least one of P, Ga, and Ge is further 0.001% by mass or more in total. It is characterized by containing 0.05 mass% or less.
  • the solder paste according to the present invention is a powdered lead-free solder alloy, the lead-free solder alloy according to any one of (1) to (9), a base resin, a thixotropic agent, It is characterized by having a flux containing an activator and a solvent.
  • An electronic circuit mounting board according to the present invention has a solder joint formed by using the lead-free solder alloy described in any one of (1) to (9).
  • An electronic control device includes the electronic circuit mounting board described in (11) above.
  • the lead-free solder alloy and solder paste of the present invention can achieve both the effect of suppressing the crack growth of the solder joint and the resistance to impact accompanied by high-speed deformation under an environment where the temperature difference is severe.
  • the electronic circuit mounting board and the electronic control device having such a solder joint portion can exhibit high reliability even in a severe environment with a severe temperature difference, and particularly the in-vehicle electronic circuit mounting board and the in-vehicle electronic It can be suitably used for a control device.
  • a general chip component mounting board is used from the chip component side using an X-ray transmission device. Photo taken.
  • the lead-free solder alloy of this embodiment can contain 2 mass% or more and 4 mass% or less of Ag. By adding Ag to the lead-free solder alloy within this range, it is possible to precipitate the Ag 3 Sn compound in its Sn grain boundary and impart mechanical strength, as well as thermal shock resistance, thermal fatigue characteristics and high speed. It is possible to exhibit resistance to impact accompanied by deformation.
  • the Ag content is 2% by mass or more and 3.8% by mass or less, the mechanical strength and the strength, ductility, and cost balance of the lead-free solder alloy are improved while improving the stretchability of the lead-free solder alloy. It is possible to improve the resistance to impact accompanied by high-speed deformation.
  • the particularly preferable Ag content is 2.5% by mass or more and 3.5% by mass or less.
  • the lead-free solder alloy of this embodiment can contain 0.3 mass% or more and 1 mass% or less of Cu.
  • Cu By adding Cu to the lead-free solder alloy within this range, an effect of preventing copper erosion to the Cu land of the conductor pattern (electronic circuit) on the substrate is exhibited and Cu 6 Sn 5 compound is added to the Sn grain boundary. Precipitation can improve the thermal shock resistance of the lead-free solder alloy. Moreover, the heat-resistant fatigue characteristics of the solder joint part formed using this can be improved without inhibiting the stretchability of the lead-free solder alloy.
  • More preferable Cu content is 0.4 mass% or more and 0.8 mass% or less, and particularly preferable content is 0.5 mass% or more and 0.8 mass% or less.
  • the lead-free solder alloy of this embodiment can contain Bi.
  • Bi When Bi is added to a lead-free solder alloy, a part of the Sn crystal lattice is replaced with Bi, and distortion occurs in the crystal lattice.
  • the metal structure of the solder joint formed using such a lead-free solder alloy can be strengthened by solid solution and the Young's modulus can be increased. Therefore, even when the solder joint is subjected to external stress due to temperature difference over a long period of time, deformation of the solder joint can be suppressed and good external stress resistance can be exhibited.
  • the mechanical strength and thermal shock resistance of the lead-free solder alloy are improved by setting the Bi content to 1.5 mass% or more and less than 3 mass%, and solder joining It is possible to obtain solid solution strengthening of the metal composition of the part, and to exhibit good ductility and resistance to impact accompanied by high-speed deformation.
  • the Bi content is 3% by mass or more, a solder joint formed using the Bi is likely to break due to an impact accompanied by high-speed deformation.
  • the lead-free solder alloy can be strengthened (crack progress suppressing effect) and the resistance to impact with high-speed deformation can be improved, and the balance between the two can be further exhibited.
  • the more preferable content of Bi is 2% by mass or more and 2.8% by mass or less, and the particularly preferable content thereof is 2.3% by mass or more and 2.8% by mass or less.
  • the lead-free solder alloy of this embodiment can contain 1% by mass or more and less than 3% by mass of In.
  • the solder structure of the lead-free solder alloy can be polycrystallized to cancel anisotropy. Therefore, the embrittlement phenomenon in a specific crystal orientation in a lead-free solder alloy can be suppressed, and even when an impact accompanied by high-speed deformation is applied to a solder joint formed using this, the occurrence of breakage is prevented. Can be suppressed.
  • the In content is 3% by mass or more, voids are likely to be generated in a solder joint portion formed using the solder paste, and the crack growth suppressing effect may be hindered.
  • the preferable content of In is 2% by mass or more and less than 3% by mass, the more preferable content is 2% by mass or more and 2.8% by mass or less, and the particularly preferable content is 2.3% by mass or more and 2. It is 8 mass% or less.
  • the crack of the solder joint portion in an environment with a severe temperature difference is achieved by balancing the contents of Bi and In, and other alloy elements and these contents. It is possible to achieve both the effect of suppressing the progress and the resistance to impact accompanied by high-speed deformation, or the effect of suppressing the void at the soldered joint.
  • the lead-free solder alloy of this embodiment preferably contains 2% by mass or more and less than 3% by mass of Bi and 2% by mass or more and less than 3% by mass of In, and preferably 2% by mass or more and less than 3% by mass of Bi. It is more preferable to contain 2% by mass to 2.8% by mass of In, and 2.3% by mass to 2.8% by mass of Bi and 2.3% by mass to 2.8% by mass of In. It is particularly preferable to contain.
  • the lead-free solder alloy of this embodiment can contain 0.001% by mass or more and 0.10% by mass or less of at least one of Ni and Co. By adding at least one of Ni and Co to the lead-free solder alloy within this range, it is possible to improve the crack growth suppressing effect of the solder joint while suppressing the generation of voids.
  • the lead-free solder alloy of this embodiment can contain 0.001% by mass or more and 0.05% by mass or less of at least one of Fe, Mn, Cr, and Mo in total. By adding at least one of Fe, Mn, Cr, and Mo within this range, it is possible to improve the crack growth suppressing effect of the solder joint portion while suppressing the generation of voids.
  • the lead-free solder alloy of this embodiment can contain 0.001% by mass or more and 0.05% by mass or less of at least one of P, Ga, and Ge in total. By adding at least one of P, Ga and Ge within this range, it is possible to prevent oxidation of the lead-free solder alloy while suppressing the generation of voids.
  • the lead-free solder alloy of this embodiment contains other components (elements) such as Cd, Tl, Se, Au, Ti, Si, Al, Mg, Zn, and the like as long as the effect is not hindered. be able to.
  • the lead-free solder alloy of this embodiment naturally includes unavoidable impurities.
  • the remainder of the lead-free solder alloy of this embodiment is made of Sn.
  • solder joint portion of this embodiment any method may be used as long as the solder joint portion can be formed, such as a flow method, mounting with a solder ball, and a reflow method using a solder paste. Of these, a reflow method using solder paste is particularly preferred.
  • solder paste Such a solder paste is produced by, for example, kneading the powdered lead-free solder alloy and flux into a paste.
  • a flux for example, a flux containing a base resin, a thixotropic agent, an activator, and a solvent is used.
  • the base resin examples include rosin resins including rosin derivatives such as rosin such as tall oil rosin, gum rosin and wood rosin, hydrogenated rosin, polymerized rosin, heterogeneous rosin, acrylic acid modified rosin and maleic acid modified rosin; Acid, methacrylic acid, various esters of acrylic acid, various esters of methacrylic acid, crotonic acid, itaconic acid, maleic acid, maleic anhydride, maleic acid ester, maleic anhydride ester, acrylonitrile, methacrylonitrile, acrylamide, methacrylic acid
  • acrylic resins obtained by polymerizing at least one monomer such as amide, vinyl chloride, vinyl acetate; epoxy resins; phenol resins.
  • rosin resins particularly hydrogenated acid-modified rosin obtained by hydrogenating acid-modified rosin, are preferably used.
  • a combined use of a hydrogenated acid-modified rosin and an acrylic resin is also preferred.
  • the acid value of the base resin is preferably 10 mgKOH / g or more and 250 mgKOH / g or less. Moreover, it is preferable that the compounding quantity of the said base resin is 10 to 90 mass% with respect to the flux whole quantity.
  • thixotropic agent examples include hydrogenated castor oil, fatty acid amides, and oxy fatty acids. These can be used alone or in combination.
  • the blending amount of the thixotropic agent is preferably 3% by mass or more and 15% by mass or less with respect to the total amount of the flux.
  • an amine salt such as an organic amine hydrogen halide salt, an organic acid, an organic acid salt, an organic amine salt, or the like
  • an amine salt such as an organic amine hydrogen halide salt, an organic acid, an organic acid salt, an organic amine salt, or the like
  • diphenylguanidine hydrobromide, cyclohexylamine hydrobromide, diethylamine salt, acid salt, succinic acid, adipic acid, sebacic acid, malonic acid, dodecanedioic acid and the like can be mentioned. These can be used alone or in combination.
  • the blending amount of the activator is preferably 5% by mass or more and 15% by mass or less with respect to the total amount of the flux.
  • the solvent for example, isopropyl alcohol, ethanol, acetone, toluene, xylene, ethyl acetate, ethyl cellosolve, butyl cellosolve, glycol ether, diethylene glycol monohexyl ether, or the like can be used. These can be used alone or in combination.
  • the amount of the solvent is preferably 20% by mass or more and 40% by mass or less based on the total amount of the flux.
  • ⁇ An antioxidant may be added to the flux for the purpose of suppressing oxidation of the lead-free solder alloy.
  • the antioxidant include hindered phenolic antioxidants, phenolic antioxidants, bisphenolic antioxidants, and polymer-type antioxidants. Among these, a hindered phenol antioxidant is particularly preferably used. These can be used alone or in combination.
  • the blending amount of the antioxidant is not particularly limited, but generally it is preferably about 0.5% by mass or more and about 5% by mass or less based on the total amount of the flux.
  • Additives such as halogens, matting agents, antifoaming agents and inorganic fillers may be added to the flux.
  • the blending amount of the additive is preferably 10% by mass or less with respect to the total amount of the flux.
  • these more preferable compounding quantities are 5 mass% or less with respect to the flux whole quantity.
  • the compounding ratio of the lead-free solder alloy powder and the flux is preferably 65:35 to 95: 5 in the ratio of solder alloy: flux.
  • a more preferred blending ratio is 85:15 to 93: 7, and a particularly preferred blending ratio is 87:13 to 92: 8.
  • the particle diameter of the alloy powder is preferably 1 ⁇ m or more and 40 ⁇ m or less, more preferably 5 ⁇ m or more and 35 ⁇ m or less, and particularly preferably 10 ⁇ m or more and 30 ⁇ m or less.
  • solder joint part of this embodiment is formed by, for example, printing the solder paste at a predetermined position on the substrate and performing reflowing at a temperature of, for example, 220 ° C to 250 ° C. This reflow forms a solder residue and a flux residue derived from the flux on the substrate.
  • An electronic circuit mounting board having such a solder joint is formed by using, for example, a mask having a predetermined pattern by forming electrodes and insulating layers at predetermined positions on the board. This solder paste is printed, an electronic component conforming to the pattern is mounted at a predetermined position, and this is reflowed.
  • solder joint is formed on the electrode, and the solder joint electrically joins the electrode and the electronic component. And on the said board
  • solder joint part concerning this embodiment can exhibit the favorable crack progress inhibitory effect, and also has the tolerance to the impact accompanied by high-speed deformation. Therefore, an electronic circuit mounting board having such a solder joint can be suitably used for an electronic circuit mounting board that is required to have high reliability, such as an in-vehicle electronic circuit mounting board.
  • a highly reliable electronic control device is manufactured by incorporating such an electronic circuit mounting board. And such an electronic control apparatus can be used suitably for the vehicle-mounted electronic control apparatus by which especially high reliability is calculated
  • solder crack test The following tools were prepared. A chip component having a size of 3.2 mm ⁇ 1.6 mm A solder resist having a pattern capable of mounting the chip component of the size and an electrode connecting the chip component (1.6 mm ⁇ 1.0 mm, gap between Cu electrodes) : 150 mm thick metal mask having the above pattern, each solder paste is printed on the printed wiring board using the metal mask, and each of the 10 chip components is mounted. did. Thereafter, each of the printed wiring boards is heated using a reflow furnace (product name: TNP-538EM, manufactured by Tamura Corporation), and each of them has a solder joint for electrically joining the electrode and each chip component. An electronic circuit mounting board was produced.
  • a reflow furnace product name: TNP-538EM, manufactured by Tamura Corporation
  • the reflow conditions at this time are: preheating from 170 ° C. to 190 ° C. for 110 seconds, peak temperature of 245 ° C., time of 200 ° C. or higher for 65 seconds, time of 220 ° C. or higher for 45 seconds, peak temperature to 200 ° C.
  • the cooling rate was 3 ° C. to 8 ° C./second, and the oxygen concentration was set to 1,500 ⁇ 500 ppm.
  • a liquid tank type thermal shock test apparatus product name: ETAC WINTECH LT80, manufactured by Enomoto Kasei Co., Ltd.
  • each electronic circuit mounting substrate is set to a condition of ⁇ 40 ° C. (5 minutes) to 125 ° C. (5 minutes).
  • the “crack rate” is an index for determining how many cracks actually occur with respect to the assumed crack length.
  • Crack rate (%) (total length of cracks / total length of assumed line cracks) x 100 Of the solder joints formed under the two electrodes of each chip component, the one with the longer crack length was used as the target for calculating the crack rate of the chip component.
  • the “total length of cracks” is the sum of the lengths of a plurality of cracks generated at each solder joint to be evaluated (calculated) on each test substrate.
  • the “assumed total crack length” is the total length of the expected crack propagation paths (cracks that have reached complete fracture) in each solder joint to be evaluated (calculated) in each test substrate.
  • the jig is abutted against the side of the chip part and parallel to each electronic circuit mounting board at a predetermined shear rate.
  • the maximum test force was calculated and this value was taken as the shear strength.
  • the shear height in the measurement was 1 ⁇ 4 or less of the component height, and the shear rate was 100 mm / min.
  • an average value (total of calculated share strengths ⁇ 5 (number of chip components)) was calculated and evaluated based on the following criteria for the measured share strength of each electronic circuit mounting board. The results are shown in Tables 3 and 4.
  • ⁇ Average value of share strength is 7.0N or more
  • Average value of share strength is 6.5N or more and less than 7.0N
  • Average value of share strength is less than 6.5N
  • the reflow conditions at this time are: preheating from 170 ° C. to 190 ° C. for 110 seconds, peak temperature of 245 ° C., time of 200 ° C. or higher for 65 seconds, time of 220 ° C. or higher for 45 seconds, peak temperature to 200 ° C.
  • the cooling rate was 3 ° C. to 8 ° C./second, and the oxygen concentration was set to 1,500 ⁇ 500 ppm.
  • the surface state of each test substrate was observed with an X-ray transmission device (product name: SMX-160E, manufactured by Shimadzu Corporation), and the area under each chip component electrode on each test substrate (enclosed by the broken line in FIG. 1).
  • under-electrode area The ratio of the total area of voids generated in the area (a), hereinafter referred to as “under-electrode area”) to the land area (void area ratio of under-electrode area: total void area of under-electrode area / land area ⁇ 100) ) And the ratio of the total area of voids generated in the area where the fillet is formed (area (b) surrounded by the broken line in FIG. 1, hereinafter referred to as “fillet area”) to the land area (void area of the fillet area) Rate: total void area of fillet region / land area ⁇ 100) was measured and calculated.
  • the solder joint formed using the lead-free solder alloy according to the example exhibits an effect of suppressing crack growth even in an environment where the temperature difference is severe, and at the same time has resistance to impact accompanied by high-speed deformation.
  • a “liquid tank type” thermal shock test apparatus is used as described above.
  • This liquid tank-type thermal shock test apparatus alternates test substrates in two liquid tanks (set at -40 ° C and 125 ° C in the above (1) Solder crack test), which can quickly transfer the test substrate. It is immersed and gives a rapid temperature change to the test substrate. This is a very severe test content compared to other test conditions (for example, “air tank type”). And the lead-free solder alloy which concerns on an Example can exhibit the crack growth inhibitory effect also under such very severe conditions.
  • JIS standard C60068-2-21 does not specify the shear rate, but for example, the conditions of the shear test of other metals (the method of tensile shear test and bending of thin clad steel) (Test method: JIS standard Z2288, etc.) specifies a shear (tensile) speed of 1 mm to 5 mm / min. Usually, a shear test is performed within this range. On the other hand, in the above (2) high-speed shear test, the test is performed under the condition of “100 mm / min”, which is at least 20 times the normal shear rate. And the lead-free solder alloy which concerns on an Example can exhibit the tolerance with respect to the impact accompanying a high-speed deformation also under such severe conditions.
  • the lead-free solder alloy according to this example can exhibit a void suppressing effect in both the “under-electrode region” and the “fillet region” in the solder joint formed by using this, and the copper corrosion It turns out that a crack suppression effect can be demonstrated.
  • the electronic circuit mounting board and the electronic control device having the solder joint portion formed by using the lead-free solder alloy according to the present invention can exhibit high reliability even in a severe environment with a severe temperature difference.
  • it can be suitably used for a vehicle-mounted electronic mounting substrate and a vehicle-mounted electronic control device.

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PCT/JP2019/007717 2018-06-04 2019-02-27 鉛フリーはんだ合金、ソルダペースト、電子回路実装基板及び電子制御装置 WO2019235001A1 (ja)

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