WO2019235001A1 - Alliage de brasage sans plomb, carte de circuit électronique et dispositif de commande électronique - Google Patents

Alliage de brasage sans plomb, carte de circuit électronique et dispositif de commande électronique Download PDF

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Publication number
WO2019235001A1
WO2019235001A1 PCT/JP2019/007717 JP2019007717W WO2019235001A1 WO 2019235001 A1 WO2019235001 A1 WO 2019235001A1 JP 2019007717 W JP2019007717 W JP 2019007717W WO 2019235001 A1 WO2019235001 A1 WO 2019235001A1
Authority
WO
WIPO (PCT)
Prior art keywords
mass
lead
less
solder alloy
free solder
Prior art date
Application number
PCT/JP2019/007717
Other languages
English (en)
Japanese (ja)
Inventor
正也 新井
健 中野
司 勝山
裕里加 宗川
大輔 丸山
貴則 嶋崎
Original Assignee
株式会社タムラ製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社タムラ製作所 filed Critical 株式会社タムラ製作所
Priority to KR1020197007401A priority Critical patent/KR20210015600A/ko
Publication of WO2019235001A1 publication Critical patent/WO2019235001A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Abstract

L'invention concerne : un alliage de brasage sans plomb, qui est un moyen qui peut obtenir à la fois un effet de prévention de propagation de fissuration et une résistance à un impact associé à une déformation à grande vitesse au niveau d'une partie de joint de soudure dans un environnement où la différence de température est extrême, et qui peut être utilisé de manière appropriée en particulier dans un substrat monté électronique et embarqué dans un véhicule et un dispositif de commande électronique embarqué, l'alliage de brasage sans plomb étant caractérisé en ce qu'il contient 2 à 4 % en masse inclus d'Ag, 0,3 à 1 % en masse inclus de Cu, 1,5 % en masse ou plus et moins de 3 % en masse de Bi, et 1 % en masse ou plus et moins de 3 % en masse d'in, le reste étant constitué de Sn ; une pâte à braser ; un substrat monté sur un circuit électronique ; et un dispositif de commande électronique.
PCT/JP2019/007717 2018-06-04 2019-02-27 Alliage de brasage sans plomb, carte de circuit électronique et dispositif de commande électronique WO2019235001A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020197007401A KR20210015600A (ko) 2018-06-04 2019-02-27 납 프리 땜납 합금, 솔더 페이스트, 전자 회로 실장 기판 및 전자 제어 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018107086A JP6796108B2 (ja) 2018-06-04 2018-06-04 鉛フリーはんだ合金、ソルダペースト、電子回路実装基板及び電子制御装置
JP2018-107086 2018-06-04

Publications (1)

Publication Number Publication Date
WO2019235001A1 true WO2019235001A1 (fr) 2019-12-12

Family

ID=68770396

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/007717 WO2019235001A1 (fr) 2018-06-04 2019-02-27 Alliage de brasage sans plomb, carte de circuit électronique et dispositif de commande électronique

Country Status (3)

Country Link
JP (1) JP6796108B2 (fr)
KR (1) KR20210015600A (fr)
WO (1) WO2019235001A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116000497A (zh) * 2021-10-22 2023-04-25 千住金属工业株式会社 软钎料合金、焊膏、焊料球、预成型软钎料和钎焊接头

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000018536A1 (fr) * 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Materiau de brasage et dispositif electrique/electronique utilisant celui-ci
JP2001168519A (ja) * 1999-12-03 2001-06-22 Hitachi Ltd 混載実装構造体及び混載実装方法並びに電子機器
JP2014037005A (ja) * 2012-07-19 2014-02-27 Harima Chemicals Inc はんだ合金、ソルダペーストおよび電子回路基板
JP2015205345A (ja) * 2015-04-20 2015-11-19 千住金属工業株式会社 面実装部品のはんだ付け方法および面実装部品
JP2016010818A (ja) * 2015-03-24 2016-01-21 株式会社タムラ製作所 鉛フリーはんだ合金含有ソルダペースト組成物、はんだ接合体構造および電子回路基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3643008B2 (ja) 1996-02-09 2005-04-27 松下電器産業株式会社 はんだ付け方法
JPH09326554A (ja) 1996-06-06 1997-12-16 Matsushita Electric Ind Co Ltd 電子部品接合用電極のはんだ合金及びはんだ付け方法
JP3363393B2 (ja) 1998-12-21 2003-01-08 千住金属工業株式会社 鉛フリーはんだ合金
US8845826B2 (en) 2007-07-13 2014-09-30 Senju Metal Industry Co., Ltd. Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder
JP4612661B2 (ja) 2007-09-13 2011-01-12 パナソニック株式会社 電子部品のはんだ付け方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000018536A1 (fr) * 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Materiau de brasage et dispositif electrique/electronique utilisant celui-ci
JP2001168519A (ja) * 1999-12-03 2001-06-22 Hitachi Ltd 混載実装構造体及び混載実装方法並びに電子機器
JP2014037005A (ja) * 2012-07-19 2014-02-27 Harima Chemicals Inc はんだ合金、ソルダペーストおよび電子回路基板
JP2016010818A (ja) * 2015-03-24 2016-01-21 株式会社タムラ製作所 鉛フリーはんだ合金含有ソルダペースト組成物、はんだ接合体構造および電子回路基板
JP2015205345A (ja) * 2015-04-20 2015-11-19 千住金属工業株式会社 面実装部品のはんだ付け方法および面実装部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116000497A (zh) * 2021-10-22 2023-04-25 千住金属工业株式会社 软钎料合金、焊膏、焊料球、预成型软钎料和钎焊接头

Also Published As

Publication number Publication date
JP2019209350A (ja) 2019-12-12
JP6796108B2 (ja) 2020-12-02
KR20210015600A (ko) 2021-02-10

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