WO2019179061A1 - 解决小型阻容元件立碑的载板设计、封装方法及载板 - Google Patents

解决小型阻容元件立碑的载板设计、封装方法及载板 Download PDF

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WO2019179061A1
WO2019179061A1 PCT/CN2018/104479 CN2018104479W WO2019179061A1 WO 2019179061 A1 WO2019179061 A1 WO 2019179061A1 CN 2018104479 W CN2018104479 W CN 2018104479W WO 2019179061 A1 WO2019179061 A1 WO 2019179061A1
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Prior art keywords
small
carrier board
carrier
component
pad
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PCT/CN2018/104479
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English (en)
French (fr)
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吴现伟
龙华
郭嘉帅
郑瑞
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深圳飞骧科技有限公司
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Publication of WO2019179061A1 publication Critical patent/WO2019179061A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the field of packaging RC components, in particular to a carrier board design, a packaging method and a carrier board for solving a small RC component.
  • the development of the semiconductor industry tends to be highly integrated and high-density.
  • the internal components tend to be ultra-small and ultra-thin.
  • the current packaged RC components are also smaller and lighter.
  • the main method for improving the phenomenon of tombstoning in the prior art is usually controlled during the surface mount technology patch process: replacing the multi-temperature zone furnace, controlling the furnace temperature, changing the hot air reflow mode in the furnace, replacing the thermal conductivity and the thickness uniformity.
  • these control methods have the following disadvantages: high cost, often need to replace more advanced and expensive equipment to improve; control process is complicated; human and material resources are expensive.
  • the inventor proposes to propose a carrier board design, a packaging method and a carrier board for solving the small RC component tombstone, which can more effectively solve the problem of small RC component patching, thereby reducing the cost loss of the packaging material and improving the finished product. Rate; in addition, it can also enhance the contact area between components and carrier board, improve channel signal consistency, and extend product life cycle.
  • the present invention intends to provide a carrier board design, a packaging method and a carrier board for solving the small RC component tombstone, from the problem source design end Change the size of the carrier pad, so that the solder wetted to the solder material tends to reduce the suction force at both ends of the resistive capacitor and reduce the length of the lever, and more directly and effectively solve the small RC component patch.
  • Tombstone problem In order to solve the problem of small volume and weight of small RC components such as 01005, the tombstone problem on the carrier board, the present invention intends to provide a carrier board design, a packaging method and a carrier board for solving the small RC component tombstone, from the problem source design end Change the size of the carrier pad, so that the solder wetted to the solder material tends to reduce the suction force at both ends of the resistive capacitor and reduce the length of the lever, and more directly and effectively solve the small RC component patch.
  • the invention provides a carrier board design and packaging method for solving a small RC component tombstone, characterized in that the method comprises the following steps:
  • Step S1 measuring the length, width and height of the small RC component
  • Step S2 setting a new window size of the carrier pad
  • Step S3 preparing a carrier according to the window opening structure
  • Step S4 preparing a solder paste printing stencil according to the opening of the pad, and the size of the stencil opening window is consistent with the size of the opening of the carrier pad;
  • Step S5 solder paste printing, printing screen aligning carrier plate opening window, printing solder paste
  • Step S6 the RC component is mounted, the carrier board and the stencil are combined to form a solder paste, and the small RC component is mounted on the glazing surface of the carrier pad;
  • Step S7 the reflow oven is reflowed and re-solidified, and the soldering zone is liquefied and reflowed by heating in the heating zone and the heating zone, and the cooling zone is re-solidified, and the end metal of the RC component and the carrier pad are connected in a reflow process to make them electrically connected to each other. And fixing the RC component;
  • step S8 the subsequent process of encapsulation is completed.
  • the small RC element has a size of 0.4 mm in length, 0.2 mm in width, and 0.2 mm in height.
  • the method is also applicable to the improvement of the old carrier board, and the step S2 is further included before the step S2: measuring the old capacitor board on the old capacitor board, the old design dimension of the window opening should be 0.175 mm, and the width is 0.175mm.
  • step S2 the newly set window size of the set carrier pad is such that the carrier pad length is 0.145 mm and the pad width is 0.185 mm.
  • step S7 the manner of reflow heating includes hot air or infrared heating.
  • step S8 the step of inspecting the tombstone problem is further included, and the welding effect is confirmed under the microscope after the component is mounted.
  • the invention also provides a carrier board for solving the monument of a small RC component, characterized in that the carrier board comprises a carrier board and a small RC component, wherein:
  • the small RC element has a pad length of 0.145 mm and a pad width of 0.185 mm.
  • the small RC element includes one or more of a small resistor or a small capacitor.
  • the size of the small RC element is 0.4 mm long, 0.2 mm wide, and 0.2 mm high.
  • the carrier board comprises a carrier board and a PCB
  • the material is a metal plate or a copper clad plate.
  • the invention provides a carrier board design, a packaging method and a carrier board for solving the small resistive element tombstone, changing the pad design, reducing the length of the lever, and absorbing the tensile force of the tin material to the sides of the wide side of the resisting capacity, which can be more direct Effectively solve the problem of small-resistance and small-capacitance RC components, not only improve the application success rate of small RC components, but also improve the design and manufacturing yield of the carrier board, reduce the material cost loss, and have good Application prospects; in addition, it can enhance the contact area between components and carrier board, improve the channel signal consistency, and extend the product life cycle.
  • Figure 1 is a schematic flow diagram of the process of the present invention.
  • FIG. 2 is a schematic diagram of a small RC pad that does not solve the tombstone problem.
  • FIG 3 is a schematic view of a small RC pad of the present invention.
  • FIG. 4 is a schematic side view of a long side of a small RC packaging method of the present invention.
  • FIG. 5 is a long side cross-sectional view showing a small RC packaging method in which the tombstoning problem is not solved.
  • FIG. 6 is a schematic long side cross-sectional view showing a method of packaging a small RC component of the present invention.
  • FIG. 7 is a schematic side view of a wide side of a small RC packaging method that does not solve the tombstone problem.
  • Fig. 8 is a schematic side view showing the wide side of the small-sized RC packaging method of the present invention.
  • FIG. 1 is a schematic flow chart of the method of the present invention.
  • Step S1 measuring the length, width and height of the small RC component, for example, 01005 chip RC component, 0.4 mm long, 0.2 mm wide, and 0.2 mm high.
  • the chip RC component 01005 is an English unit, and is replaced by a 430 RC resistor.
  • the resistive material only the end metal at both ends of the element is combined with the tin material to form a weld.
  • the capillary effect and the wettability characteristic of the molten solder will remain unchanged, only the carrier.
  • the pad size structure dominates the molten solder creepage distribution.
  • the method is suitable for new applications of small RC components, and is also suitable for retrofitting small RC pads on old carrier boards that have been applied with small RC components.
  • FIG. 2 is a small RC pad that does not solve the tombstone problem.
  • Schematic diagram As shown in FIG. 2, the conventional single-sided pad opening window size is usually 0.175 mm*0.175 mm, and the old carrier board having the design size can be modified according to the S2 step.
  • step S2 the newly opened window size of the carrier pad is set.
  • FIG. 3 is a schematic view of a small resistive-capacitor pad of the present invention, as shown in FIG. 3, according to which a new window size of the carrier pad is set, and a carrier is formed according to the pad window structure, the setting carrier
  • the newly opened window has a pad length of 0.145 mm and a pad width of 0.185 mm.
  • the newly opened window size of the carrier pad is set.
  • the length of the carrier pad is 0.145 mm, and the pad width is 0.185 mm.
  • the carrier is fabricated according to the pad opening structure.
  • the old carrier board has a tombstone problem, and the old carrier board is modified with a pad.
  • the original length of the carrier pad is changed from 0.175 mm to 0.145 mm, and the original pad size is 0.175.
  • the mm was changed to 0.185 mm, and the carrier was fabricated according to the pad window structure.
  • increasing the width of the carrier pad facilitates the soldering of the solder to the sides and reduces the length of the carrier pad, which is beneficial to reduce the capillary effect, and the tin material tends to both ends of the RC element, and the purpose is to reduce the length of the lever.
  • step S3 the carrier is fabricated according to the pad window structure.
  • the surface of the small component of the carrier has a surface treatment process mainly including deposition of anti-oxidation OSP, chemical nickel palladium gold, and electroplated nickel gold on the surface of the carrier.
  • the difference is mainly cost selection, capillary effect on the pad surface, and special Three aspects of design space utilization.
  • the surface treatment of the carrier pad is usually chemical nickel palladium gold or electroplated nickel gold; there is also a need for a bond wire type flip chip in the packaging industry, and the surface resistive pad of the carrier is deposited with an anti-oxidation OSP. And electroplated nickel gold processing form. PCB pad surface treatments typically use a cheaper deposited anti-oxidation OSP.
  • the cost of OSP is lower than that of chemical nickel-palladium gold than electroplated nickel gold, which mainly depends on material cost and production process.
  • the PCB process on the process has no carrier-type package soldering wire and the process technology after re-processing. Usually, after the RC component is placed, the re-flow soldering is completed by one-time reflow, and the OSP pre-evaporation problem does not occur at this time.
  • the chemical nickel-palladium is equivalent to the electroplated nickel-gold compared with the OSP, which mainly depends on the pad oxidation resistance.
  • the copper of the carrier substrate is easily oxidized and loses the capillary effect, and the package resistive package is flip-chip mounted.
  • the OSP process is not recommended for the products.
  • the OSP on the surface of the carrier is gradually volatilized by the flux and the heating environment.
  • the carrier copper is exposed and oxidized after the wafer is vaporized by the OSP.
  • Metal copper and tin have good wettability, but copper oxide or cuprous oxide has poor wettability with solder, which will cause the capillary loss of the carrier pad to cause a problem of soldering.
  • OSP is higher than the chemical nickel palladium gold and electroplated nickel gold process design, mainly depending on the prevention of capillary effect on the surface of the fenestration of the pad.
  • the chemical nickel palladium gold and electroplated nickel gold need to be flipped on the corresponding carrier plate.
  • a green oil barrier is added around the pad to prevent the tin element from spreading on the surface of the pad due to capillary action, so that the tin material is separated from the flip chip.
  • the OSP process is gradually volatilized during the de-heating process of the flux and reflow soldering, and the solder is simultaneously wet-welded. The whole process is relatively fast, and the copper metal exposure of the PCB pad is not easily oxidized.
  • the surface treatment of the carrier pad is treated by a chemical nickel-palladium gold process.
  • the PCB pad surface treatment adopts a deposition anti-oxidation OSP process.
  • step S4 a solder paste printing screen is prepared according to the window opening of the solder, and the size of the screen opening of the screen is consistent with the size of the window opening of the carrier.
  • Step S5 solder paste printing, printing screen aligning the carrier plate to open the window, printing solder paste.
  • FIG. 4 is a schematic side view of a long side of a small RC packaging method of the present invention.
  • FIG. 5 is a long side cross-sectional view showing a small RC packaging method in which the tombstoning problem is not solved.
  • 6 is a schematic long side cross-sectional view showing a method of packaging a small RC component of the present invention.
  • FIG. 7 is a schematic side view of a wide side of a small RC packaging method that does not solve the tombstone problem.
  • Fig. 8 is a schematic side view showing the wide side of the small-sized RC packaging method of the present invention.
  • shortening the metal length of the carrier pad at both ends of the resistive capacitance can effectively reduce the capillary effect of the tin material, and the tin material tends to flow toward the long end of the resistive capacity; Widening the width of the wide side of the resistive capacity corresponds to the width of the carrier pad, so that the tin material tends to block the sides of the wide side.
  • This design change can make the original tin concentrate on both ends of the long side of the resisting capacity and go to the sides of the wide side to effectively reduce the length of the lever.
  • step S6 the RC component is mounted, the carrier board and the stencil are combined to form a solder paste, and the small RC component is mounted on the glazing surface of the carrier pad.
  • Step S7 the reflow oven is reflowed and re-solidified, and the soldering zone is liquefied and reflowed by heating in the heating zone and the heating zone, and the cooling zone is re-solidified, and the end metal of the RC component and the carrier pad are connected in a reflow process to make them electrically connected to each other.
  • the reflow heating method includes hot air or infrared heating.
  • step S8 after the component is mounted, the welding effect is confirmed under the microscope, and the problem of the tombstoning is checked, and after confirming that there is no tombstone problem, the subsequent process of packaging is completed.
  • a carrier board for solving a small RC component, the carrier board comprising a carrier board and a small RC component, wherein: the pad length of the small RC component on the carrier board is 0.145mm, pad width is 0.185mm.
  • the small RC component includes one or more of a small RC resistor or a small RC capacitor.
  • the length, width and height of the element of the small RC element should be: length 0.4 mm, width 0.2 mm, height 0.2 mm.
  • the carrier board comprises a carrier board and a circuit board PCB, and the material is a metal plate or a copper clad plate.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

解决小型阻容元件立碑的载板设计、封装方法及载板。所述方法包括以下步骤：小型阻容元件长、宽、高尺寸测量(S1)；设定载板焊盘新开窗尺寸(S2)；依据焊盘开窗结构制作载板(S3)；依据焊盘开窗制作锡膏印刷网板，网板开窗尺寸与载板焊盘开窗尺寸保持一致(S4)；锡膏印刷，印刷网板对位载板开窗，印刷锡膏(S5)；阻容元件贴装，将载板与网板结合印刷锡膏成型，将小型阻容元件安装在载板焊盘开窗表面(S6)；回流焊炉回流再固化，升温区及保温区加热将锡膏液化回流，降温区再固化成型，回流焊过程连接阻容元件的端极金属与载板焊盘，使之相互导通且固定阻容元件(S7)；完成封装后续流程(S8)。更直接有效地解决小型阻容元件立碑问题；提高了载板产品良率及生命周期可靠性。

Description

解决小型阻容元件立碑的载板设计、封装方法及载板 技术领域
本发明涉及封装阻容元件焊接领域，具体涉及解决小型阻容元件立碑的载板设计、封装方法及载板。
背景技术
半导体行业发展趋向于高集成、高密度，内部元件趋向于超小化、超薄化，当前封装阻容元件焊接类产品选用阻容元件也越来越小、越来越轻。
目前半导体封装商用小型阻容元件使用已经越来越普遍，但在载板上封装阻容贴片过程中，随着元件体积越来越小，重量越来越轻，因载板层压层数较少，覆铜量低，复合材料热膨胀系数差异造成的涨缩或翘曲、金属材料热应力造成的形变、载板绿油开窗偏移、贴片设备精度偏差、锡膏回流阻容沉落侧滑偏移等问题导致贴片阻容偏向长边一侧，如杠杆原理一般两端挂锡吸拉力不平衡导致阻容立碑问题。常常会出现贴片元件的一端离开焊盘表面，元件呈倾斜或直立，其状如石碑，称为立碑。
现有技术中改善立碑现象的主要方法通常是在表面贴装技术贴片过程中加以控制：更换多温区炉、控制炉温、改变炉内热风回流方式、更换导热性与厚度均匀性好的载板、更换均匀性好的锡膏等。但是这些控制方法存在以下缺点：成本高，往往需要更换更先进且价值昂贵的设备才能有所改善；控制流程复杂；人力物力耗费严重。
发明人拟提出一种解决小型阻容元件立碑的载板设计、封装方法及载板，可以更有效地解决小型阻容元器件贴片立碑问题，从而降低封装材料成本损失，提高成品良率；此外，还可以增强元器件与载板接触面 积，提高通路信号一致性，并延长产品使用周期。
发明内容
为解决小型阻容元件如01005体积和重量过小，在载板上的立碑问题，本发明拟提供解决小型阻容元件立碑的载板设计、封装方法及载板，从问题源头设计端改变载板焊盘尺寸，使锡料润湿爬胶趋赴于阻容元件的宽边两侧减小阻容两端吸拉力，降低杠杆长度，更直接有效地解决小型阻容元器件贴片立碑问题。
本发明提供一种解决小型阻容元件立碑的载板设计、封装方法，其特征在于，该方法包括以下步骤：
步骤S1，小型阻容元件长、宽、高尺寸测量；
步骤S2，设定载板焊盘新开窗尺寸；
步骤S3，依据焊盘开窗结构制作载板；
步骤S4，依据焊盘开窗制作锡膏印刷网板，网板开窗尺寸与载板焊盘开窗尺寸保持一致；
步骤S5，锡膏印刷，印刷网板对位载板开窗，印刷锡膏；
步骤S6，阻容元件贴装，将载板与网板结合印刷锡膏成型，将小型阻容元件安装在载板焊盘开窗表面；
步骤S7，回流焊炉回流再固化，升温区及保温区加热将锡膏液化回流，降温区再固化成型，回流焊过程连接阻容元件的端极金属与载板焊盘，使之相互导通且固定阻容元件；
步骤S8，完成封装后续流程。
进一步地，所述小型阻容元件尺寸为长0.4mm，宽0.2mm，高0.2mm。
进一步地，该方法也适用于对旧的载板进行改进，这时步骤S2之前还包括步骤：测量旧载板上阻容元件焊盘开窗旧的设计尺寸应为长度 为0.175mm，宽度为0.175mm。
进一步地，步骤S2中，所述设定载板焊盘新开窗尺寸为，载板焊盘长度为0.145mm，焊盘宽度为0.185mm。
进一步地，步骤S7中，所述回流焊加热的方式包括热风或红外加热。
进一步地，在步骤S8前还包括立碑问题检验步骤，将元件贴装完成后在显微镜下确认焊接效果。
本发明也提供一种解决小型阻容元件立碑的载板，其特征在于，所述载板包括载板、小型阻容元件，其中：
所述载板上所述小型阻容元件的焊盘长度为0.145mm，焊盘宽度为0.185mm。
进一步地，所述小型阻容元件包括小型电阻或小型电容中的一种或一种以上。
进一步地，所述小型阻容元件的尺寸为：长0.4mm，宽0.2mm，高0.2mm。
进一步地，所述载板包括载板、PCB，材质为金属板、覆铜板的一种。
本发明取得了以下有益效果：
本发明提供的解决小型阻容元件立碑的载板设计、封装方法及载板，改变焊盘设计，降低杠杆长度，并将锡料吸拉力趋赴于阻容宽边两侧，可以更直接有效地解决小型阻容小型阻容元器件贴片立碑问题，不仅提高了小型阻容元件的应用成功率，而且提高了载板的设计制造产品良率，降低了材料成本损失，有良好的应用前景；此外，还可以增强元器件与载板接触面积，提高通路信号一致性，并延长了产品生命周期。
附图说明
图1是本发明的方法流程示意图。
图2是未解决立碑问题的小型阻容元件焊盘的示意图。
图3是本发明的小型阻容元件焊盘的示意图。
图4是本发明的小型阻容元件封装方法的长边侧面示意图。
图5是未解决立碑问题的小型阻容元件封装方法的长边剖面示意图。
图6是本发明的小型阻容元件封装方法的长边剖面示意图。
图7是未解决立碑问题的小型阻容元件封装方法的宽边侧面示意图。
图8是本发明的小型阻容元件封装方法的宽边侧面示意图。
具体实施方式
以下结合附图和实施例，对本发明的具体实施方式进行更加详细的说明，以便本领域技术人员可由本说明书所公开的内容能够更好地理解本发明的方案及其各个方面的优点。然而，以下描述的具体实施方式和实施例仅是说明的目的，而不是对本发明的限制。本发明可通过其他不同的具体实施例加以施行或应用，本说明书中的各项细节也可基于不同观点与应用，在不悖离本发明的构思下进行各种修改与变更。另外，本发明的附图仅为简单示意说明，并非依实际尺寸的描绘，事先声明。以下的实施方式将进一步详细说明本发明的相关技术内容，但所公开的内容并非用以限制本发明的保护范围。
一种解决小型阻容元件立碑的载板设计、封装方法。如图1所示，图1是本发明的方法流程示意图。
步骤S1，小型阻容元件长、宽、高尺寸测量，例如，01005贴片阻容元件，长0.4mm，宽0.2mm，高0.2mm。贴片阻容元件01005是英制单位，换成公制是0402的贴片阻容元件。
根据阻容材料结构可知，只有元件两端端极金属与锡料结合形成焊缝，在原材料及工艺一定状态下，毛细管效应和熔融锡料爬胶润湿度特性将保持不变，唯有载板焊盘尺寸结构主导熔融锡料爬胶分布。
本方法适应于小型阻容元件的新应用，也适用于对已经应用了小型阻容元件的旧的载板上小型阻容元件焊盘的改造。
如果是旧载板小型阻容元件的焊盘的改造，就需要先测量载板阻容元件焊盘绿油开窗的旧设计尺寸；图2是未解决立碑问题的小型阻容元件焊盘的示意图。如图2所示，传统单侧焊盘开窗尺寸通常为0.175mm*0.175mm，可以按照S2步骤，将具有该设计尺寸的旧载板进行修改设计。
步骤S2，设定载板焊盘新开窗尺寸。
图3是本发明的小型阻容元件焊盘的示意图，如图3所示，据此设定载板焊盘新开窗尺寸，依据焊盘开窗结构制作载板，所述设定载板焊盘新开窗尺寸为，载板焊盘长度为0.145mm，焊盘宽度为0.185mm。
本发明一个实施例，设定载板焊盘新开窗尺寸，载板焊盘长度为0.145mm，焊盘宽度为0.185mm，依据焊盘开窗结构制作载板。
本发明另一个实施例，旧的载板出现了立碑问题，对旧的载板进行焊盘修改，将载板焊盘尺寸中原长度0.175mm变更为0.145mm，将原焊盘尺寸中宽度0.175mm变更为0.185mm，依据焊盘开窗结构制作载板。
实施例中，增加载板焊盘宽度，利于锡料趋向两侧爬胶，减小载板焊盘长度，利于降低毛细管效应导致锡料趋向阻容元件两端，目的都是降低杠杆长度。
步骤S3，依据焊盘开窗结构制作载板。
所述载板上小型元件的焊盘，表面处理工艺主要包含载板表面沉积防氧化OSP、化学镍钯金、电镀镍金三种，区别主要是成本选择，焊盘表面毛细管效应活性，及特殊设计空间利用率三个方面。
因键合线工艺特性，载板焊盘表面处理通常为化学镍钯金或电镀镍金；封装业内也存在不需要键合线类倒装产品，载板阻容焊盘使用表面沉积防氧化OSP及电镀镍金处理形式。PCB焊盘表面处理通常选用价格更便宜的沉积防氧化OSP。
成本上OSP低于化学镍钯金低于电镀镍金，主要取决材料成本及制作工艺。工艺制程上PCB贴装没有载板类封装焊线及再加工后制程工艺，通常贴装阻容元件后一次性回流焊完成整套贴装，此时不会出现OSP提前挥发问题。
焊盘毛细管效应活性上，化学镍钯金等同于电镀镍金高于OSP，主要取决焊盘防氧化能力，载板基材线路铜易被氧化失去毛细管效应活性，封装阻容贴装加倒装类产品不推荐OSP工艺，阻容贴装后载板表面OSP因助焊剂及加热环境逐步挥发，再进行晶元倒装时载板对应晶元焊盘OSP挥发后焊盘金属铜暴露并被氧化，金属铜与锡料润湿焊接性良好，但氧化铜或氧化亚铜与焊料润湿性很差，会使载板焊盘失去毛细管效应导致虚焊问题。
空间利用率上，OSP高于化学镍钯金和电镀镍金工艺设计，主要取决于防止毛细管效应在焊盘开窗表面扩散，化学镍钯金和电镀镍金需在晶元倒装对应载板焊盘四周加入绿油阻隔，防止晶元锡料因毛细管效应均摊在焊盘表面，使锡料与倒装晶元脱离。OSP工艺因助焊剂及回流焊解热过程中逐步挥发且锡料同步润湿焊接，整个过程速度相对较快，PCB焊盘铜金属暴露不易被氧化。
本发明一个实施例，为了焊盘有好的毛细管效应活性，避免虚焊，载板焊盘表面处理采用化学镍钯金处理工艺。
本发明另一个实施例，为了节省成本及提高空间利用率，PCB焊盘表面处理采用沉积防氧化OSP处理工艺。
步骤S4，依据焊盘开窗制作锡膏印刷网板，网板开窗尺寸与载板焊盘开窗尺寸保持一致。
步骤S5锡膏印刷，印刷网板对位载板开窗，印刷锡膏。
图4是本发明的小型阻容元件封装方法的长边侧面示意图。图5是未解决立碑问题的小型阻容元件封装方法的长边剖面示意图。图6是本发明的小型阻容元件封装方法的长边剖面示意图。图7是未解决立碑问题的小型阻容元件封装方法的宽边侧面示意图。图8是本发明的小型阻容元件封装方法的宽边侧面示意图。
根据图4-图8可见，与旧的设计方法相比，缩短阻容两端对应载板焊盘金属长度，可以有效减少锡料毛细管效应使锡料趋赴流向阻容长边两端；并加宽阻容宽边两端对应载板焊盘宽度，使锡料趋赴于阻容宽边两侧。此设计变更可使原锡料聚集于阻容长边两端趋赴爬胶到宽边两侧，即有效缩短杠杆长度。
步骤S6，阻容元件贴装，将载板与网板结合印刷锡膏成型，将小型阻容元件安装在载板焊盘开窗表面。
步骤S7，回流焊炉回流再固化，升温区及保温区加热将锡膏液化回流，降温区再固化成型，回流焊过程连接阻容元件的端极金属与载板焊盘，使之相互导通且固定阻容元件，所述回流焊加热的方式包括热风或红外加热。
步骤S8，将元件贴装完成后在显微镜下确认焊接效果，检验有无立碑问题，确认无立碑问题后，完成封装后续流程。
在本发明中还提供一种解决小型阻容元件立碑的载板，所述载板包括载板、小型阻容元件，其中：所述载板上所述小型阻容元件的焊盘长度为0.145mm，焊盘宽度为0.185mm。
所述小型阻容元件包括小型阻容电阻或小型阻容电容中的一种或一种以上。所述小型阻容元件的元件的长宽高应为：长0.4mm，宽0.2mm，高0.2mm。所述载板包括载板、电路板PCB，材质为金属板、覆铜板的一种。
需要说明的是，以上参照附图所描述的各个实施例仅用以说明本发明而非限制本发明的范围，本领域的普通技术人员应当理解，在不脱离 本发明的精神和范围的前提下对本发明进行的修改或者等同替换，均应涵盖在本发明的范围之内。此外，除上下文另有所指外，以单数形式出现的词包括复数形式，反之亦然。另外，除非特别说明，那么任何实施例的全部或一部分可结合任何其它实施例的全部或一部分来使用。

Claims (10)

  1. 一种解决小型阻容元件立碑的载板设计、封装方法，其特征在于，该方法包括以下步骤：
    步骤S1，小型阻容元件长、宽、高尺寸测量；
    步骤S2，设定载板焊盘新开窗尺寸；
    步骤S3，依据焊盘开窗结构制作载板；
    步骤S4，依据焊盘开窗制作锡膏印刷网板，网板开窗尺寸与载板焊盘开窗尺寸保持一致；
    步骤S5，锡膏印刷，印刷网板对位载板开窗，印刷锡膏；
    步骤S6，阻容元件贴装，将载板与网板结合印刷锡膏成型，将小型阻容元件安装在载板焊盘开窗表面；
    步骤S7，回流焊炉回流再固化，升温区及保温区加热将锡膏液化回流，降温区再固化成型，回流焊过程连接阻容元件的端极金属与载板焊盘，使之相互导通且固定阻容元件；
    步骤S8，完成封装后续流程。
  2. 根据权利要求1所述的解决小型阻容元件立碑的载板设计、封装方法，其特征在于，所述小型阻容元件尺寸为长0.4mm，宽0.2mm，高0.2mm。
  3. 根据权利要求1所述的解决小型阻容元件立碑的载板设计、封装方法，其特征在于，该方法也适用于对旧的载板进行改进，这时步骤S2之前还包括步骤：测量旧载板上阻容元件焊盘开窗旧的设计尺寸应为长度为0.175mm，宽度为0.175mm。
  4. 根据权利要求3所述的解决小型阻容元件立碑的载板设计、封装方法，其特征在于，步骤S2中，所述设定载板焊盘新开窗尺寸为，载板焊盘长度为0.145mm，焊盘宽度为0.185mm。
  5. 根据权利要求1所述的解决小型阻容元件立碑的载板设计、封装方法，其特征在于，步骤S7中，所述回流焊加热的方式包括热风或红外加热。
  6. 根据权利要求1所述的解决小型阻容元件立碑的载板设计、封装方法，其特征在于，在步骤S8前还包括立碑问题检验步骤，将元件贴装完成后在显微镜下确认焊接效果。
  7. 一种解决小型阻容元件立碑的载板，其特征在于，所述载板包括载板、小型阻容元件，其中：所述载板上所述小型阻容元件的焊盘长度为0.145mm，焊盘宽度为0.185mm。
  8. 根据权利要求7所述的包含小型阻容元件的载板，其特征在于，所述小型阻容元件包括小型电阻或小型电容中的一种或一种以上。
  9. 根据权利要求8所述的包含小型阻容元件的载板，其特征在于，所述小型阻容元件的尺寸为：长0.4mm，宽0.2mm，高0.2mm。
  10. 根据权利要求7所述的包含小型阻容元件的载板，其特征在于，所述载板包括载板、PCB，材质为金属板、覆铜板的一种。
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