WO2019176074A1 - エポキシ樹脂、エポキシ樹脂組成物、樹脂シート、bステージシート、cステージシート、硬化物、樹脂付金属箔、金属基板、及びパワー半導体装置 - Google Patents
エポキシ樹脂、エポキシ樹脂組成物、樹脂シート、bステージシート、cステージシート、硬化物、樹脂付金属箔、金属基板、及びパワー半導体装置 Download PDFInfo
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- WO2019176074A1 WO2019176074A1 PCT/JP2018/010347 JP2018010347W WO2019176074A1 WO 2019176074 A1 WO2019176074 A1 WO 2019176074A1 JP 2018010347 W JP2018010347 W JP 2018010347W WO 2019176074 A1 WO2019176074 A1 WO 2019176074A1
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- Prior art keywords
- group
- epoxy resin
- resin composition
- epoxy
- compound
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 248
- 239000000203 mixture Substances 0.000 title claims abstract description 141
- 229920005989 resin Polymers 0.000 title claims description 92
- 239000011347 resin Substances 0.000 title claims description 92
- 229910052751 metal Inorganic materials 0.000 title claims description 67
- 239000002184 metal Substances 0.000 title claims description 67
- 239000011888 foil Substances 0.000 title claims description 36
- 239000004065 semiconductor Substances 0.000 title claims description 31
- 239000000758 substrate Substances 0.000 title description 18
- -1 siloxane structure Chemical group 0.000 claims abstract description 112
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 56
- 239000000945 filler Substances 0.000 claims description 95
- 239000011342 resin composition Substances 0.000 claims description 85
- 239000004593 Epoxy Substances 0.000 claims description 66
- 150000001875 compounds Chemical class 0.000 claims description 63
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 55
- 125000003700 epoxy group Chemical group 0.000 claims description 44
- 125000004432 carbon atom Chemical group C* 0.000 claims description 35
- 125000000217 alkyl group Chemical group 0.000 claims description 26
- 125000001931 aliphatic group Chemical group 0.000 claims description 24
- 125000000524 functional group Chemical group 0.000 claims description 15
- 229910052801 chlorine Inorganic materials 0.000 claims description 12
- 125000001309 chloro group Chemical group Cl* 0.000 claims description 12
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 11
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 11
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims description 11
- 125000003545 alkoxy group Chemical group 0.000 claims description 11
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 11
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- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 11
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 11
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- 125000000962 organic group Chemical group 0.000 claims description 8
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- 238000000034 method Methods 0.000 description 27
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- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 6
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
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- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 4
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- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- MOMKYJPSVWEWPM-UHFFFAOYSA-N 4-(chloromethyl)-2-(4-methylphenyl)-1,3-thiazole Chemical compound C1=CC(C)=CC=C1C1=NC(CCl)=CS1 MOMKYJPSVWEWPM-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- ZOTKGMAKADCEDH-UHFFFAOYSA-N 5-triethoxysilylpentane-1,3-diamine Chemical compound CCO[Si](OCC)(OCC)CCC(N)CCN ZOTKGMAKADCEDH-UHFFFAOYSA-N 0.000 description 1
- 238000007088 Archimedes method Methods 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
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- WETWJCDKMRHUPV-UHFFFAOYSA-N acetyl chloride Chemical compound CC(Cl)=O WETWJCDKMRHUPV-UHFFFAOYSA-N 0.000 description 1
- 239000012346 acetyl chloride Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
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- 239000012790 adhesive layer Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
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- 238000004458 analytical method Methods 0.000 description 1
- 150000008064 anhydrides Chemical group 0.000 description 1
- 125000005577 anthracene group Chemical group 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- DMLAVOWQYNRWNQ-UHFFFAOYSA-N azobenzene Chemical group C1=CC=CC=C1N=NC1=CC=CC=C1 DMLAVOWQYNRWNQ-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- IEPIYXWWJPPIEM-UHFFFAOYSA-N benzene-1,3-diol;benzene-1,4-diol Chemical compound OC1=CC=C(O)C=C1.OC1=CC=CC(O)=C1 IEPIYXWWJPPIEM-UHFFFAOYSA-N 0.000 description 1
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- 239000004305 biphenyl Substances 0.000 description 1
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- 125000006267 biphenyl group Chemical group 0.000 description 1
- BEVHTMLFDWFAQF-UHFFFAOYSA-N butyl(triphenyl)phosphanium Chemical compound C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCC)C1=CC=CC=C1 BEVHTMLFDWFAQF-UHFFFAOYSA-N 0.000 description 1
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- 125000005708 carbonyloxy group Chemical group [*:2]OC([*:1])=O 0.000 description 1
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- 230000008859 change Effects 0.000 description 1
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- DQZKGSRJOUYVPL-UHFFFAOYSA-N cyclohexyl benzoate Chemical group C=1C=CC=CC=1C(=O)OC1CCCCC1 DQZKGSRJOUYVPL-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
- CRGRWBQSZSQVIE-UHFFFAOYSA-N diazomethylbenzene Chemical compound [N-]=[N+]=CC1=CC=CC=C1 CRGRWBQSZSQVIE-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000012156 elution solvent Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000009878 intermolecular interaction Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- PKXSNWGPLBAAJQ-UHFFFAOYSA-N naphthalene-1,3-diamine Chemical compound C1=CC=CC2=CC(N)=CC(N)=C21 PKXSNWGPLBAAJQ-UHFFFAOYSA-N 0.000 description 1
- OKBVMLGZPNDWJK-UHFFFAOYSA-N naphthalene-1,4-diamine Chemical compound C1=CC=C2C(N)=CC=C(N)C2=C1 OKBVMLGZPNDWJK-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- FCJSHPDYVMKCHI-UHFFFAOYSA-N phenyl benzoate Chemical group C=1C=CC=CC=1C(=O)OC1=CC=CC=C1 FCJSHPDYVMKCHI-UHFFFAOYSA-N 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- ZZOBOWAIBKQKQW-UHFFFAOYSA-M potassium;acetyl chloride;hydroxide Chemical compound [OH-].[K+].CC(Cl)=O ZZOBOWAIBKQKQW-UHFFFAOYSA-M 0.000 description 1
- 238000003918 potentiometric titration Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000019983 sodium metaphosphate Nutrition 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical group C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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- 238000001308 synthesis method Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 1
- XKFPGUWSSPXXMF-UHFFFAOYSA-N tributyl(methyl)phosphanium Chemical compound CCCC[P+](C)(CCCC)CCCC XKFPGUWSSPXXMF-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
- C08G59/3281—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Definitions
- the present invention relates to an epoxy resin, an epoxy resin composition, a resin sheet, a B stage sheet, a C stage sheet, a cured product, a metal foil with resin, a metal substrate, and a power semiconductor device.
- thermosetting resin examples include a cured product of a thermosetting resin from the viewpoint of electrical insulation and heat resistance.
- thermal conductivity of a cured product of a thermosetting resin is low, which is one of the major factors that hinder heat dissipation. Therefore, development of a cured product of a thermosetting resin having high thermal conductivity is desired.
- thermosetting resin having high thermal conductivity for example, a cured product of an epoxy resin composition having a mesogenic structure in the molecular structure has been proposed (see, for example, Patent Documents 1 to 3).
- thermosetting resin peels from the electronic component device.
- the epoxy resin is excellent in thermal conductivity and can achieve low elasticity, an epoxy resin composition using the epoxy resin, an epoxy resin composition, a resin sheet, B It is an object to provide a stage sheet, a C stage sheet, a cured product, a metal foil with resin, a metal substrate, and a power semiconductor device.
- the means for solving the above problems include the following embodiments.
- ⁇ 1> An epoxy resin having a mesogenic structure and a siloxane structure.
- X represents a single bond or at least one linking group selected from the group (I) consisting of the following divalent groups, and each Y independently represents 1 to 8 carbon atoms.
- each Y independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an aliphatic alkoxy group having 1 to 8 carbon atoms, a fluorine atom, a chlorine atom, or a bromine atom.
- n independently represents an integer of 0 to 4
- k represents an integer of 0 to 7
- ⁇ 5> The epoxy resin according to ⁇ 3> or ⁇ 4>, wherein the epoxy compound includes an epoxy compound represented by the following general formula (2).
- X represents a single bond or at least one linking group selected from the group (I) consisting of the following divalent groups
- each Y independently represents 1 to 8 carbon atoms.
- each Y independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an aliphatic alkoxy group having 1 to 8 carbon atoms, a fluorine atom, a chlorine atom, or a bromine atom.
- ⁇ 6> The epoxy resin according to any one of ⁇ 1> to ⁇ 5>, wherein the siloxane structure includes a structural unit derived from a siloxane compound having a functional group capable of reacting with an epoxy group.
- ⁇ 7> The epoxy resin according to ⁇ 6>, wherein the siloxane compound has two functional groups.
- ⁇ 8> The epoxy resin according to ⁇ 6> or ⁇ 7>, wherein the siloxane compound includes at least one compound having a structural unit represented by the following general formulas (3-1) to (3-3).
- R 1 to R 3 each independently represents an alkyl group or a phenyl group
- Y 1 to Y 3 each independently represent an amino group, a carboxyl group
- X 1 to X 3 each independently represent a divalent organic group
- a portion enclosed in parentheses represents a structural unit, Have one or more inside.
- Mw weight average molecular weight
- ⁇ 10> The ratio according to any one of ⁇ 1> to ⁇ 9>, wherein a ratio of the mesogen structure to the siloxane structure (mesogen structure: siloxane structure) is 10: 1 to 10:30 on a mass basis.
- Epoxy resin. ⁇ 11> The epoxy resin according to any one of ⁇ 1> to ⁇ 10>, which exhibits a liquid crystal phase.
- An epoxy resin composition comprising the epoxy resin according to any one of ⁇ 1> to ⁇ 11> and a curing agent.
- ⁇ 13> The epoxy resin composition according to ⁇ 12>, further containing a filler.
- ⁇ 14> The epoxy resin composition according to ⁇ 13>, wherein the filler content is 45% by volume to 90% by volume with respect to the total solid content of the epoxy resin composition.
- ⁇ 15> The epoxy resin composition according to any one of ⁇ 12> to ⁇ 14>, which can form a higher order structure.
- ⁇ 16> A resin sheet having a resin composition layer containing the epoxy resin composition according to any one of ⁇ 12> to ⁇ 15>.
- ⁇ 17> A B-stage sheet having a semi-cured resin composition layer containing a semi-cured product of the epoxy resin composition according to any one of ⁇ 12> to ⁇ 15>.
- ⁇ 18> The B stage sheet according to ⁇ 17>, wherein the semi-cured resin composition layer includes a higher order structure.
- ⁇ 21> A cured product of the epoxy resin composition according to any one of ⁇ 12> to ⁇ 15>.
- ⁇ 23> a metal foil, and a semi-cured resin composition layer containing the semi-cured product of the epoxy resin composition according to any one of ⁇ 12> to ⁇ 15> disposed on the metal foil.
- Metal foil with resin Metal foil with resin.
- ⁇ 24> a metal support, a cured resin composition layer comprising a cured product of the epoxy resin composition according to any one of ⁇ 12> to ⁇ 15> disposed on the metal support, and the curing A metal substrate comprising: a metal foil disposed on the resin composition layer.
- a cured resin composition layer comprising a cured product of the epoxy resin composition according to claim 1.
- an epoxy resin that is excellent in thermal conductivity and can be reduced in elasticity when cured is obtained, an epoxy resin composition using the epoxy resin, an epoxy resin composition, a resin sheet, B A stage sheet, a C stage sheet, a cured product, a metal foil with resin, a metal substrate, and a power semiconductor device can be provided.
- the term “process” includes a process that is independent of other processes and includes the process if the purpose of the process is achieved even if it cannot be clearly distinguished from the other processes.
- numerical ranges indicated using “to” include numerical values described before and after “to” as the minimum value and the maximum value, respectively.
- the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical description.
- the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples.
- each component may contain a plurality of corresponding substances.
- the content or content of each component is the total content or content of the multiple types of substances present in the composition unless otherwise specified.
- a plurality of particles corresponding to each component may be included.
- the particle diameter of each component means a value for a mixture of the plurality of particles present in the composition unless otherwise specified.
- the term “layer” refers to a case where the layer is formed only in a part of the region in addition to the case where the layer is formed over the entire region. included.
- the term “lamination” indicates that layers are stacked, and two or more layers may be combined, or two or more layers may be detachable.
- Epoxy resin has a mesogenic structure and a siloxane structure.
- an epoxy resin having a mesogenic structure and a siloxane structure may be abbreviated as “epoxy resin”.
- the epoxy resin having such a configuration is excellent in thermal conductivity and can be reduced in elasticity when cured. The reason is not clear, but can be considered as follows.
- An epoxy resin having a mesogenic structure has a property of exhibiting liquid crystallinity by stacking molecules in a cured product. As a result, since phonon scattering is suppressed, the thermal conductivity is excellent.
- a siloxane compound is a material having low elasticity. The reason is due to the length of the bond distance of the siloxane bond, the bond angle, and the like. The bond length of the siloxane bond is 1.64 mm, which is longer than the bond distance of carbon bond of 1.54 mm. Further, the bond angle of the carbon bond is 110 °, whereas the bond angle of the siloxane bond is as wide as 134 °. Therefore, the siloxane bond is easy to move compared to the carbon bond, and as a result, the siloxane compound is less elastic than the organic compound containing the carbon bond.
- the epoxy resin and the siloxane compound are inferior in compatibility.
- a mixture of an epoxy resin and a siloxane compound is inferior in dispersibility and cannot fully exhibit the respective advantages.
- a compound having a mesogenic structure has extremely low compatibility because of its high orientation.
- the epoxy resin of the present disclosure has both a mesogenic structure and a siloxane structure in one molecule. Thereby, it is considered that compatibility problems can be avoided, and both excellent thermal conductivity and low elasticity can be achieved.
- the mesogenic structure refers to a structure that facilitates the expression of crystallinity or liquid crystallinity in a cured product by the action of intermolecular interaction.
- Specific examples include a biphenyl group, a terphenyl group, a phenylbenzoate group, a cyclohexylbenzoate group, an azobenzene group, a stilbene group, an anthracene group, a derivative thereof, and a group in which these are connected by an azomethine group, an ester group, or the like.
- Examples of the mesogenic structure include a structure represented by the general formula (1).
- X represents at least one linking group selected from the group consisting of a single bond or the following divalent group (I).
- Y is independently an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an aliphatic alkoxy group having 1 to 8 carbon atoms, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group, or acetyl.
- n independently represents an integer of 0 to 4. * Indicates a linking position in the molecule.
- each Y independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an aliphatic alkoxy group having 1 to 8 carbon atoms, a fluorine atom, a chlorine atom, a bromine atom, An iodine atom, a cyano group, a nitro group, or an acetyl group is shown.
- n independently represents an integer of 0 to 4
- k represents an integer of 0 to 7
- m represents an integer of 0 to 8
- l represents an integer of 0 to 12.
- the connecting direction of the bond of each divalent group may be any.
- X in the general formula (1) is preferably at least one linking group selected from the group (II) consisting of the following divalent groups.
- Y, n, k, m and l in the group (II) consisting of a divalent group are the same as Y, n, k, m and l in the group (I) consisting of a divalent group, respectively. Is the same.
- Y in the group (I) consisting of the general formula (1) and the divalent group is each independently an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an aliphatic alkoxy group having 1 to 4 carbon atoms, a fluorine atom, It is preferably a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group, or an acetyl group, more preferably a methyl group, an ethyl group, a methoxy group, an ethoxy group, or a chlorine atom, and a methyl group or ethyl More preferably, it is a group.
- N in the group (I) consisting of the general formula (1) and the divalent group are each independently preferably an integer of 0 to 2, and more preferably 0 or 1.
- k is preferably an integer of 0 to 3, and more preferably 0 or 1.
- m is preferably an integer of 0 to 4, and more preferably 0 or 1.
- l is preferably an integer of 0 to 4, more preferably 0 or 1.
- the mesogenic structure preferably has a structure in which three or more 6-membered cyclic groups are connected in a straight chain form from the viewpoint of easily forming a higher order structure and further improving the thermal conductivity of the cured product.
- the number of 6-membered cyclic groups connected in a straight chain is preferably 3 or more, and more preferably 3 or 4 from the viewpoint of moldability.
- the 6-membered cyclic group connected to the straight chain contained in the mesogen structure may be a 6-membered cyclic group derived from an aromatic ring such as benzene, or a 6-membered cyclic group derived from an aliphatic ring such as cyclohexane or cyclohexene. It may be. Among them, at least one is preferably a 6-membered ring group derived from an aromatic ring, and one of the 6-membered ring groups connected in a straight chain included in the structure is a 6-membered ring group derived from an aliphatic ring. More preferably, the remaining rings are all 6-membered ring groups derived from aromatic rings.
- the mesogenic structure contained in the epoxy resin may be one type alone or two or more types.
- a siloxane structure refers to a structure having —O—Si—O—.
- the remaining two bonds of Si are each independently bonded to a siloxane structure or an organic group (R).
- Examples of the siloxane structure include D unit (R 2 SiO 2/2 ), T unit (RSiO 3/2 ), and Q unit (SiO 4/2 ). From the viewpoint of suppressing an increase in viscosity of the resulting epoxy resin, it is preferable that at least a D unit (R 2 SiO 2/2 ) is included.
- the content of D units in the total siloxane structure is preferably 90% by mass or more, more preferably 95% by mass, and further preferably 100% by mass.
- Examples of the organic group bonded to Si include groups having an alkyl group, a phenyl group, an epoxy group, an amino group, a carboxyl group, a hydroxyl group, a mercapto group, an isocyanate group, and the like. These organic groups may have a substituent. Among these organic groups, at least one selected from the group consisting of an alkyl group and a phenyl group is preferable, and at least one selected from the group consisting of a methyl group and a phenyl group is more preferable.
- the siloxane structure contained in the epoxy resin may be one type alone or two or more types.
- the epoxy resin of the present disclosure is a polyfunctional epoxy resin having three or more epoxy groups, whether it is a monofunctional epoxy resin having one epoxy group or a bifunctional epoxy resin having two epoxy groups. May be.
- the epoxy group may be bonded to the siloxane structure or may be bonded to the mesogenic structure, and is preferably bonded to the mesogenic structure.
- the epoxy group may be directly bonded to at least one selected from the group consisting of a siloxane structure and a mesogenic structure, or may be bonded via a linking group. Examples of the linking group include an alkylene group, an oxygen atom, a carbonyloxy group, and combinations thereof.
- At least one selected from the group consisting of an epoxy group and an epoxy-containing group having an epoxy group and a linking group is bonded to a mesogenic structure.
- the epoxy-containing group include a glycidyl group, a glycidyloxy group, and an epoxycyclohexyl group.
- the epoxy resin may be linear or branched, and is preferably linear from the viewpoint of suppressing an increase in viscosity.
- the linear epoxy resin has a siloxane structure and a mesogen structure in the main chain.
- the branched epoxy resin may have a siloxane structure as a main chain and a mesogen structure in a side chain, or may have a mesogen structure as a main chain and a siloxane structure in a side chain. More preferably, the epoxy resin has a siloxane structure and a mesogenic structure in the main chain, and at least a part of the mesogenic structure has at least one selected from the group consisting of an epoxy group and an epoxy-containing group.
- the siloxane structure and the mesogen structure in the epoxy resin may be directly connected or connected via a connecting group, preferably connected via a connecting group.
- Examples of the linking group between the siloxane structure and the mesogen structure include a divalent group generated by a reaction between at least one selected from the group consisting of an epoxy group and an epoxy-containing group and a functional group capable of reacting with the epoxy group. It is done.
- Examples of the functional group capable of reacting with an epoxy group include a functional group containing active hydrogen, and examples thereof include an amino group, a carboxyl group, an acid anhydride group, a hydroxyl group, an epoxy group, a mercapto group, and an isocyanate group.
- the ratio of the mesogen structure to the siloxane structure (mesogen structure: siloxane structure) in the epoxy resin is preferably 10: 1 to 10:30, preferably 10: 3 to 10:20, based on mass. It is preferably 10: 4 to 10:15.
- the ratio of the mesogenic structure to the siloxane structure in the epoxy resin can be measured by NMR, MALDI-TOF-MS, or the like.
- the epoxy equivalent of the epoxy resin is preferably 250 g / eq to 4000 g / eq, more preferably 250 g / eq to 2000 g / eq, and still more preferably 300 g / eq to 1000 g / eq.
- the epoxy equivalent of the epoxy resin is measured by a perchloric acid titration method.
- the weight average molecular weight (Mw) in the gel permeation chromatography (GPC) measurement of the epoxy resin is preferably 500 to 10,000 from the viewpoint of achieving both the fluidity of the epoxy resin composition and the thermal conductivity of the cured product. It is more preferably 500 to 8000, and further preferably 600 to 5000. In the present disclosure, the weight average molecular weight (Mw) is measured by gel permeation chromatography (GPC method).
- a commercially available apparatus can be used for the measurement by gel permeation chromatography.
- pump L-6000 (Hitachi, Ltd.)
- column TSKgel G4000HR + G3000HR + G2000XL (Tosoh Corporation)
- detector differential refractometer RI-8020 (Tosoh Corporation)
- elution solvent tetrahydrofuran (for chromatography) No stabilizer, Wako Pure Chemical Industries, Ltd.) is used, and a resin sample dissolved in tetrahydrofuran to a concentration of 5 mg / cm 3 is measured as a sample under a flow rate of 1.0 cm 2 / min. .
- a calibration curve is created using a polystyrene standard sample, and the weight average molecular weight (Mw) of the epoxy resin is calculated using a polystyrene equivalent value.
- the epoxy resin of the present disclosure forms a higher order structure in the cured product.
- the higher order structure means a structure including a higher order structure in which constituent elements are arranged to form a micro ordered structure, and corresponds to, for example, a crystal phase and a liquid crystal phase.
- the presence or absence of such a higher order structure can be determined by a polarizing microscope. That is, in the observation in the crossed Nicols state, it can be distinguished by seeing interference fringes due to depolarization.
- the liquid crystal phase includes a nematic structure and a smectic structure.
- the nematic structure is a liquid crystal structure in which the molecular long axis is oriented in a uniform direction and has only an alignment order.
- the smectic structure has a one-dimensional positional order in addition to the orientation order, and has a layered structure. The order is higher in the smectic structure than in the nematic structure.
- the epoxy resin of this indication will not be specifically limited if it can be manufactured so that it may have a mesogen structure, a siloxane structure, and an epoxy group in a molecule
- the epoxy resin of the present disclosure includes an epoxy compound having a mesogenic structure (hereinafter also referred to as “mesogen-containing epoxy compound”) and a siloxane compound having a functional group capable of reacting with an epoxy group (hereinafter referred to as “reactive siloxane compound”). Can also be obtained by reacting.
- mesogen-containing epoxy compound an epoxy compound having a mesogenic structure
- reactive siloxane compound siloxane compound having a functional group capable of reacting with an epoxy group
- the mesogen-containing epoxy compound has a mesogen structure and an epoxy group.
- the epoxy group in the mesogen-containing epoxy compound may be an epoxy-containing group.
- the “mesogen structure” and “epoxy-containing group” in the mesogen-containing epoxy compound are the same as those described in the above mesogen structure.
- the mesogen-containing epoxy compound preferably has two or more epoxy groups, and preferably has two from the viewpoint that the resulting epoxy resin becomes linear.
- Examples of the mesogen-containing epoxy compound include an epoxy compound represented by the general formula (2).
- X, Y and n are the same as X, Y and n in the mesogenic structure represented by the above general formula (1), respectively, and the same applies to the preferred range.
- the epoxy compound represented by the general formula (2) can be produced by a known method.
- the epoxy compound represented by the general formula (2) can be obtained by a production method described in Japanese Patent No. 4619770, Japanese Patent Application Laid-Open No. 2011-98952, Japanese Patent No. 5471975, and the like.
- the reactive siloxane compound has a “siloxane structure” and a “functional group capable of reacting with an epoxy group”.
- the “siloxane structure” in the reactive siloxane compound is the same as that described in the above siloxane structure.
- the reactive siloxane compound preferably has two or more functional groups capable of reacting with an epoxy group, and has two functional groups capable of reacting with an epoxy group from the viewpoint of obtaining a linear epoxy resin. Is preferred.
- Examples of the reactive siloxane compound include compounds having structural units represented by the following general formulas (3-1) to (3-3).
- R 1 to R 3 each independently represents an alkyl group or a phenyl group
- Y 1 to Y 3 each independently represent an amino group, a carboxyl group, an acid An anhydride group, a hydroxyl group, an epoxy group, an isocyanate group, or a mercapto group
- X 1 to X 3 each independently represent a divalent organic group
- a part enclosed in parentheses represents a structural unit, 1 or more.
- Examples of the alkyl group represented by R 1 to R 3 include a methyl group, an ethyl group, and a propyl group, and a methyl group is preferable.
- the alkyl group and phenyl group represented by R 1 to R 3 may each have a substituent.
- Examples of the divalent organic group represented by X 1 to X 3 include an alkylene group, a phenylene group, an alkyleneoxyalkyl group, and combinations thereof.
- the alkylene group, phenylene group, and alkyleneoxyalkyl group may have a substituent.
- the alkylene group represented by X 1 to X 3 preferably has 1 to 6 carbon atoms, and preferably 1 to 3 carbon atoms.
- the number of carbon atoms of the alkylene group in the alkyleneoxyalkyl group represented by X 1 to X 3 is preferably 1 to 6, and more preferably 1 to 3.
- the carbon number of the alkyl group in the alkyleneoxyalkyl group represented by X 1 to X 3 is preferably 1 to 6, and more preferably 1 to 3.
- Y 1 to Y 3 are preferably a carboxyl group, an amino group or a hydroxyl group, more preferably an amino group or a phenolic hydroxyl group, and even more preferably a phenolic hydroxyl group.
- the reactive siloxane compound is a compound having the structural unit represented by the general formula (3-1). It is preferable. Since the compound having the structural unit represented by the general formula (3-1) has a functional group at the terminal, the resulting epoxy resin tends to be linear and tends to suppress an increase in viscosity.
- the weight average molecular weight (Mw) of the reactive siloxane compound is preferably 200 to 5000, more preferably 300 to 3500, and more preferably 500 to 2000 from the viewpoints of mixing and reactivity with the mesogen-containing epoxy compound. More preferably.
- Examples of commercially available siloxane diamines in which Y 1 and Y 2 in the general formula (3-1) are amino groups include “KF-8010” (amine equivalent 430) and “X-22-161A” (amine equivalent). 800), “X-22-161B” (amine equivalent 1500), “KF-8012” (amine equivalent 2200), “KF-8008” (amine equivalent 5700), “X-22-9409” (amine equivalent 700) "X-22-1660B-3” (amine equivalent 2200) (above, Shin-Etsu Chemical Co., Ltd., trade name), "XF42-C5379” (amine equivalent 740) (Momentive Performance Materials Japan GK, Trade name), “BY-16-853U” (amine equivalent 460), “BY-16-853” (amine equivalent 650), and “BY 16-853B "(amine equivalent 2200) (above, Dow Corning Toray Co., Ltd., trade name) and the like.
- siloxane diamines “KF-8010” (amine equivalent 430), “X-22-161A” (amine equivalent 800), “BY—” have low amine equivalents from the viewpoint of solubility in epoxy resins and solvents. 16-853U “(amine equivalent 460) and” BY-16-853 "(amine equivalent 650) are preferred.
- Y 1 and Y 2 in the general formula (3-1) are phenolic hydroxyl groups are, for example, “X-22-1876” (hydroxyl value: 120 KOHmg / g), “KF-2201” as commercially available products. (Hydroxyl value: 35 KOHmg / g), “X-22-1822” (Hydroxyl value: 20 KOHmg / g) (Shin-Etsu Chemical Co., Ltd., trade name), and “BY16-752A” (Hydroxyl value: 30 KOHmg / g) , Toray Dow Corning Co., Ltd., trade name).
- compounds in which Y 1 and Y 2 in the general formula (3-1) are alcoholic hydroxyl groups are, for example, “X-22-160AS” (hydroxyl value: 112 KOHmg / g), “KF— "6001" (hydroxyl value: 62 KOHmg / g), “KF-6002” (hydroxyl value: 35 KOHmg / g), “KF-6003” (hydroxyl value: 20 KOHmg / g), and "X-22-4015” (hydroxyl value) : 27 KOH mg / g) (Shin-Etsu Chemical Co., Ltd., trade name).
- a compound in which Y 1 and Y 2 in the general formula (3-1) are carboxyl groups is, for example, “X-22-162AS” (carboxyl equivalent: 420 g / eq, “X-22— 162A "(carboxyl equivalent: 865 g / eq) (above, Shin-Etsu Chemical Co., Ltd., trade name).
- the mesogen-containing epoxy compound and the reactive siloxane compound can be reacted in a solvent.
- the solvent used in this reaction is not particularly limited, and for example, it is preferable to use at least one selected from cyclohexanone, toluene, xylene, and mesitylene.
- a solvent may be used individually by 1 type and may use 2 or more types together.
- the amount of the solvent used is preferably 25 parts by mass to 1000 parts by mass, and more preferably 50 parts by mass to 500 parts by mass with respect to 100 parts by mass of the total amount of the mesogen-containing epoxy compound and the reactive siloxane compound. .
- the amount of the solvent used is 25 parts by mass to 1000 parts by mass, the solubility is sufficient and the reaction time tends to be prolonged.
- a curing catalyst can be used for this reaction.
- the type of the curing catalyst is not particularly limited, and an appropriate one can be selected from the viewpoint of reaction rate, reaction temperature, storage stability, and the like.
- Specific examples of the curing catalyst include imidazole compounds, organic phosphorus compounds, tertiary amines, and quaternary ammonium salts. These may be used alone or in combination of two or more.
- an organic phosphine compound an organic phosphine compound containing maleic anhydride, a quinone compound (1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, etc.), diazophenylmethane, phenol resin A compound having intramolecular polarization formed by adding a compound having a ⁇ bond such as, and the like; and a complex of an organic phosphine compound and an organic boron compound (tetraphenylborate, tetra-p-tolylborate, tetra-n-butylborate, etc.
- organic phosphine compound examples include triphenylphosphine, diphenyl (p-tolyl) phosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, tris (alkylalkoxyphenyl) phosphine, and tris (dialkylphenyl).
- Phosphine tris (trialkylphenyl) phosphine, tris (tetraalkylphenyl) phosphine, tris (dialkoxyphenyl) phosphine, tris (trialkoxyphenyl) phosphine, tris (tetraalkoxyphenyl) phosphine, trialkylphosphine, dialkylarylphosphine, Examples thereof include alkyl diaryl phosphine.
- the amount of the curing catalyst is not particularly limited.
- reaction rate and storage stability it is preferably 0.1% by mass to 3% by mass, and preferably 0.2% by mass to 1.5% by mass with respect to the total mass of the mesogen-containing epoxy compound and reactive siloxane compound % Is more preferable.
- the reaction temperature and reaction time between the mesogen-containing epoxy compound and the reactive siloxane compound are preferably set as appropriate according to the type of mesogen-containing epoxy compound and reactive siloxane compound to be used.
- the reaction temperature can be 70 ° C. to 150 ° C., preferably 100 ° C. to 130 ° C.
- the reaction time can be 0.1 to 10 hours, and preferably 1 to 6 hours.
- the ratio of the number of equivalents of the epoxy group of the mesogen-containing epoxy compound to the number of equivalents of the functional group capable of reacting with the epoxy group of the reactive siloxane compound is 1.1 to 10.5 is preferable, and 1.8 to 5.2 is more preferable.
- the blending ratio of the mesogen-containing epoxy compound and the reactive siloxane compound is preferably 10: 1 to 10:30 on a mass basis, and is 10: 3 to 10:20 It is preferably 10: 4 to 10:15.
- the ratio of the mesogenic structure to the siloxane structure in the epoxy resin can be measured by NMR, MALDI-TOF-MS, or the like.
- the epoxy resin composition of the present disclosure contains the epoxy resin of the present disclosure and a curing agent.
- the epoxy resin composition of the present disclosure has excellent thermal conductivity and low elasticity when used as a cured product.
- the epoxy resin composition of this indication may contain other ingredients in addition to the above-mentioned ingredients if needed.
- a filler, a curing catalyst, a silane coupling agent, a solvent, a mold release agent, a stress relaxation agent, a reinforcing material, an elastomer, a dispersing agent, an anti-settling agent and the like may further be contained.
- the epoxy resin composition of the present disclosure contains the epoxy resin of the present disclosure, a higher order structure can be formed.
- the epoxy resin composition of the present disclosure can be used as, for example, a sealing material or a molding material.
- Epoxy resin The epoxy resin contained in the epoxy resin composition is the above-described epoxy resin.
- the content of the epoxy resin contained in the epoxy resin composition is preferably 5% by mass to 30% by mass, more preferably 7% by mass to 28% by mass, and 10% by mass to 25% by mass. More preferably.
- the curing agent is not particularly limited as long as it is a compound capable of curing reaction with an epoxy resin, and a commonly used curing agent can be appropriately selected and used.
- Specific examples of the curing agent include an acid anhydride curing agent, an amine curing agent, a phenol curing agent, a mercaptan curing agent, and the like.
- One of these curing agents may be used alone, or two or more thereof may be used in combination.
- the amine curing agent As the amine curing agent, those usually used as a curing agent for epoxy resins can be used without particular limitation, and commercially available ones may be used. Among these, from the viewpoint of curability, the amine curing agent is preferably a polyfunctional curing agent having two or more functional groups, and from the viewpoint of thermal conductivity, a polyfunctional having a rigid skeleton such as an aromatic ring. More preferably, it is a curing agent.
- bifunctional amine curing agent examples include 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenylsulfone, 4,4′-diamino-3,3.
- Examples include '-dimethoxybiphenyl, 4,4'-diaminophenyl benzoate, 1,5-diaminonaphthalene, 1,3-diaminonaphthalene, 1,4-diaminonaphthalene, 1,8-diaminonaphthalene and the like.
- thermo conductivity it is preferably at least one selected from the group consisting of 4,4′-diaminodiphenylmethane, 1,5-diaminonaphthalene and 4,4′-diaminodiphenylsulfone, More preferred is 5-diaminonaphthalene.
- phenol and a novolac phenol resin can be used.
- phenolic curing agents include monofunctional compounds such as phenol, o-cresol, m-cresol, and p-cresol; bifunctional compounds such as catechol, resorcinol, and hydroquinone; 1,2,3-trihydroxybenzene, 1 , 2,4-trihydroxybenzene, 1,3,5-trihydroxybenzene and the like trifunctional compounds.
- the curing agent a phenol novolac resin obtained by connecting these phenolic curing agents with a methylene chain or the like to form a novolak can be used.
- the phenol novolak resin include resins obtained by novolacizing one phenol compound such as cresol novolak resin, catechol novolak resin, resorcinol novolak resin, hydroquinone novolak resin; catechol resorcinol novolak resin, resorcinol hydroquinone novolak resin, etc. Examples thereof include resins obtained by novolacizing two or more phenol compounds.
- the phenol novolak resin is a structure represented by at least one selected from the group consisting of the following general formula (II-1) and the following general formula (II-2) It is preferable to include a compound having a unit.
- R 21 and R 24 each independently represents an alkyl group, an aryl group or an aralkyl group.
- R 22 , R 23 , R 25 and R 26 each independently represent a hydrogen atom, an alkyl group, an aryl group or an aralkyl group.
- m21 and m22 each independently represents an integer of 0-2.
- n21 and n22 each independently represents an integer of 1 to 7.
- the alkyl group may be linear, branched or cyclic.
- the aryl group may have a structure containing a hetero atom in the aromatic ring. In this case, a heteroaryl group in which the total number of heteroatoms and carbon atoms is 6 to 12 is preferable.
- the alkylene group in the aralkyl group may be linear, branched, or cyclic.
- the aryl group in the aralkyl group may have a structure containing a hetero atom in the aromatic ring. In this case, a heteroaryl group in which the total number of heteroatoms and carbon atoms is 6 to 12 is preferable.
- R 21 and R 24 each independently represents an alkyl group, an aryl group, or an aralkyl group. These alkyl group, aryl group, and aralkyl group may further have a substituent. Examples of the substituent include an alkyl group (except when R 21 and R 24 are alkyl groups), an aryl group, a halogen atom, and a hydroxyl group.
- m21 and m22 each independently represents an integer of 0 to 2, and when m21 or m22 is 2, two R 21 or R 24 may be the same or different.
- m21 and m22 are each independently preferably 0 or 1, and more preferably 0.
- n21 and n22 are the numbers of structural units represented by the general formula (II-1) and general formula (II-2) contained in the phenol novolac resin, and each independently represents an integer of 1 to 7.
- R 22 , R 23 , R 25 and R 26 each independently represent a hydrogen atom, an alkyl group, an aryl group or an aralkyl group.
- the alkyl group, aryl group and aralkyl group represented by R 22 , R 23 , R 25 and R 26 may further have a substituent. Examples of the substituent include an alkyl group (provided that R 22 , R 23 , R 25 and R 26 are alkyl groups), an aryl group, a halogen atom, a hydroxyl group and the like.
- R 22 , R 23 , R 25 and R 26 are each independently a hydrogen atom, an alkyl group, from the viewpoint of storage stability and thermal conductivity, Alternatively, it is preferably an aryl group, more preferably a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an aryl group having 6 to 12 carbon atoms, and further preferably a hydrogen atom. Further, from the viewpoint of heat resistance, at least one of R 22 and R 23 is preferably an aryl group, more preferably an aryl group having 6 to 12 carbon atoms.
- R 25 and R 26 is preferably an aryl group, and more preferably an aryl group having 6 to 12 carbon atoms.
- the aryl group may have a structure containing a hetero atom in the aromatic ring. In this case, a heteroaryl group in which the total number of heteroatoms and carbon atoms is 6 to 12 is preferable.
- the phenolic curing agent may contain one type of compound having the structural unit represented by the general formula (II-1) or the general formula (II-2), or may contain two or more types in combination. . Preferably, it contains at least one compound having a structural unit derived from resorcinol represented by the general formula (II-1).
- the compound having the structural unit represented by the general formula (II-1) may further include at least one kind of partial structure derived from a phenol compound other than resorcinol.
- examples of the partial structure derived from a phenol compound other than resorcinol include phenol, cresol, catechol, hydroquinone, 1,2,3-trihydroxybenzene, 1,2,4-trihydroxy. Examples thereof include partial structures derived from benzene and 1,3,5-trihydroxybenzene. The partial structures derived from these may be included singly or in combination of two or more.
- the compound having the structural unit represented by the general formula (II-2) may include at least one partial structure derived from a phenol compound other than catechol.
- examples of the partial structure derived from a phenol compound other than catechol include, for example, phenol, cresol, resorcinol, hydroquinone, 1,2,3-trihydroxybenzene, 1,2,4-trihydroxy Examples thereof include partial structures derived from benzene and 1,3,5-trihydroxybenzene. The partial structures derived from these may be included singly or in combination of two or more.
- the partial structure derived from the phenol compound means a monovalent or divalent group constituted by removing one or two hydrogen atoms from the benzene ring portion of the phenol compound.
- the position where the hydrogen atom is removed is not particularly limited.
- the content of the partial structure derived from resorcinol is not particularly limited. From the viewpoint of the elastic modulus, the content of the partial structure derived from resorcinol is preferably 55% by mass or more with respect to the total mass of the compound having the structural unit represented by the general formula (II-1), and the glass transition temperature ( From the viewpoint of Tg) and the linear expansion coefficient, it is more preferably 80% by mass or more, and from the viewpoint of thermal conductivity, it is more preferably 90% by mass or more.
- the phenol novolac resin more preferably includes a novolak resin having a partial structure represented by at least one selected from the group consisting of the following general formulas (III-1) to (III-4).
- n31 to n34 each independently represent a positive integer and represent the number of each structural unit contained.
- Ar 31 to Ar 34 each independently represent a group represented by the following general formula (III-a) or a group represented by the following general formula (III-b).
- R 31 and R 34 each independently represent a hydrogen atom or a hydroxyl group.
- R 32 and R 33 each independently represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.
- a curing agent having a partial structure represented by at least one of general formula (III-1) to general formula (III-4) can be generated as a by-product by a production method in which a divalent phenol compound is novolakized. It is a thing.
- the partial structures represented by the general formulas (III-1) to (III-4) may be included as the main chain skeleton of the compound, or may be included as a part of the side chain. Furthermore, each structural unit constituting the partial structure represented by any one of the general formulas (III-1) to (III-4) may be included randomly or regularly. It may be included or may be included in a block shape. Further, in the general formulas (III-1) to (III-4), the substitution position of the hydroxyl group is not particularly limited as long as it is on the aromatic ring.
- a plurality of Ar 31 to Ar 34 may all be the same atomic group or include two or more atomic groups. Also good. Ar 31 to Ar 34 each independently represent a group represented by any one of general formula (III-a) and general formula (III-b).
- R 31 and R 34 are each independently a hydrogen atom or a hydroxyl group, but are preferably a hydroxyl group from the viewpoint of thermal conductivity. Further, the substitution positions of R 31 and R 34 are not particularly limited.
- R 32 and R 33 each independently represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.
- alkyl group having 1 to 8 carbon atoms in R 32 and R 33 include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, and an n-pentyl group. , N-hexyl group, n-heptyl group, and n-octyl group.
- substitution positions of R 32 and R 33 in the general formula (III-a) are not particularly limited.
- Ar 31 to Ar 34 in the general formulas (III-1) to (III-4) are groups derived from dihydroxybenzene (in the general formula (III-a), from the viewpoint of achieving better thermal conductivity.
- One type is preferable.
- group derived from dihydroxybenzene means a divalent group formed by removing two hydrogen atoms from the aromatic ring portion of dihydroxybenzene, and the position at which the hydrogen atom is removed is not particularly limited. Further, the “group derived from dihydroxynaphthalene” has the same meaning.
- Ar 31 to Ar 34 are preferably each independently a group derived from dihydroxybenzene, such as 1,2-dihydroxybenzene (catechol). More preferably, it is at least one selected from the group consisting of a group derived from and a group derived from 1,3-dihydroxybenzene (resorcinol).
- Ar 31 to Ar 34 preferably include at least a group derived from resorcinol from the viewpoint of particularly improving thermal conductivity.
- the structural unit to which n31 to n34 is attached preferably contains a group derived from resorcinol.
- the compound having a partial structure represented by at least one selected from the group consisting of general formula (III-1) to general formula (III-4) includes a structural unit containing a group derived from resorcinol, resorcinol
- the content of the structural unit containing a group derived from is in the total mass of the compound having a structure represented by at least one of general formula (III-1) to general formula (III-4) from the viewpoint of elastic modulus. Is preferably 55% by mass or more, more preferably 80% by mass or more from the viewpoint of Tg and linear expansion coefficient, and further preferably 90% by mass or more from the viewpoint of thermal conductivity.
- the total value of mx and nx (mx + nx) is preferably 20 or less, more preferably 15 or less, and further preferably 10 or less from the viewpoint of fluidity. Note that the lower limit of the total value of mx and nx is not particularly limited.
- Mx and nx indicate the number of structural units and indicate how much the corresponding structural units are added in the molecule. Therefore, an integer value is shown for a single molecule. Note that mx and nx in (mx / nx) and (mx + nx) indicate rational numbers that are average values in the case of an assembly of a plurality of types of molecules.
- Phenol novolac resins having a partial structure represented by at least one selected from the group consisting of general formula (III-1) to general formula (III-4) are particularly those in which Ar 31 to Ar 34 are substituted or unsubstituted.
- the synthesis is easy and a curing agent having a low melting point can be obtained as compared with a novolak phenol resin or the like. There is a tendency. Therefore, by including such a phenol resin as a curing agent, there are advantages such as easy manufacture and handling of the resin composition.
- Whether or not the phenol novolac resin has a partial structure represented by any one of the general formulas (III-1) to (III-4) is determined by field desorption ionization mass spectrometry (FD-MS).
- the fragment component can be determined by whether or not a component corresponding to the partial structure represented by any one of the general formulas (III-1) to (III-4) is included.
- the molecular weight of the phenol novolac resin having a partial structure represented by at least one selected from the group consisting of general formula (III-1) to general formula (III-4) is not particularly limited. From the viewpoint of fluidity, the number average molecular weight (Mn) is preferably 2000 or less, more preferably 1500 or less, and even more preferably 350 to 1500. The weight average molecular weight (Mw) is preferably 2000 or less, more preferably 1500 or less, and further preferably 400 to 1500.
- the hydroxyl equivalent of the phenol novolac resin having a partial structure represented by at least one selected from the group consisting of general formula (III-1) to general formula (III-4) is not particularly limited. From the viewpoint of the crosslinking density involved in heat resistance, the hydroxyl group equivalent is preferably 45 g / eq to 150 g / eq on average, more preferably 50 g / eq to 120 g / eq, and 55 g / eq to 120 g / eq. More preferably, it is eq. In the present disclosure, the hydroxyl equivalent refers to a value measured in accordance with JIS K0070: 1992.
- the phenol novolac resin may contain a monomer that is a phenol compound constituting the phenol novolac resin.
- the content of the monomer that is a phenol compound constituting the phenol novolac resin (hereinafter also referred to as “monomer content”) is not particularly limited. From the viewpoint of thermal conductivity and moldability, the monomer content in the phenol novolac resin is preferably 5% by mass to 80% by mass, more preferably 15% by mass to 60% by mass, and 20% by mass. More preferably, it is ⁇ 50 mass%.
- the monomer content is 80% by mass or less, the amount of monomers that do not contribute to crosslinking decreases during the curing reaction, and the high molecular weight material that contributes to crosslinking occupies a large amount. It is formed and the thermal conductivity tends to be improved.
- the monomer content is 5% by mass or more, since it is easy to flow during molding, the adhesion with the filler contained as necessary is further improved, and more excellent thermal conductivity and heat resistance. Tend to be achieved.
- the content of the curing agent in the resin composition is not particularly limited.
- the curing agent is an amine curing agent
- the number of equivalents of epoxy groups is preferably 0.5 to 2.0, and more preferably 0.8 to 1.2.
- the ratio of the number of phenolic hydroxyl group equivalents (phenolic hydroxyl group equivalent number) of the phenolic curing agent and the number of epoxy group equivalents of the epoxy resin (equivalent phenolic hydroxyl group) Number / equivalent number of epoxy groups) is preferably 0.5 to 2.0, more preferably 0.8 to 1.2.
- the resin composition may contain a curing accelerator.
- a curing agent and a curing accelerator in combination, the epoxy resin can be further sufficiently cured.
- the kind and content of the curing accelerator are not particularly limited, and an appropriate one can be selected from the viewpoints of reaction rate, reaction temperature, and storage property.
- the curing accelerator include imidazole compounds, tertiary amine compounds, organic phosphine compounds, complexes of organic phosphine compounds and organic boron compounds, and the like.
- it is preferably at least one selected from the group consisting of an organic phosphine compound and a complex of an organic phosphine compound and an organic boron compound.
- organic phosphine compound examples include triphenylphosphine, diphenyl (p-tolyl) phosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, tris (alkylalkoxyphenyl) phosphine, and tris (dialkylphenyl).
- Phosphine tris (trialkylphenyl) phosphine, tris (tetraalkylphenyl) phosphine, tris (dialkoxyphenyl) phosphine, tris (trialkoxyphenyl) phosphine, tris (tetraalkoxyphenyl) phosphine, trialkylphosphine, dialkylarylphosphine, Examples thereof include alkyl diaryl phosphine.
- an organic phosphine compound and an organic boron compound include tetraphenylphosphonium / tetraphenylborate, tetraphenylphosphonium / tetra-p-tolylborate, tetrabutylphosphonium / tetraphenylborate, and tetraphenylphosphonium.
- One of these curing accelerators may be used alone, or two or more thereof may be used in combination.
- the blending ratio can be appropriately set according to the properties (flexibility, etc.) of the resulting cured product.
- the content of the curing accelerator in the resin composition is not particularly limited.
- the content of the curing accelerator is preferably 0.2% by mass to 3.0% by mass of the total mass of the epoxy resin and the curing agent used as necessary. More preferably, the content is from mass% to 2.0 mass%, and further preferably from 0.4 mass% to 1.5 mass%.
- the epoxy resin composition may contain a filler.
- the thermal conductivity of the obtained cured product is improved.
- Epoxy resins having a mesogenic structure tend to form higher order structures with high ordering centering on fillers in the cured product, and the thermal conductivity of the cured product tends to be remarkably improved (for example, International Publication No. WO2013). / 065159). This is considered because the filler functions as an efficient heat conduction path in the cured epoxy resin having a higher order structure.
- a higher-order structure centering on the filler is formed is determined by, for example, using a polarizing microscope (with a cured product (thickness: about 1 mm) sandwiched between slide glasses ( For example, it can be judged by observing with Olympus Corporation BX51). At this time, an interference pattern is observed around the filler in the region where the filler exists.
- the above observation is preferably performed in a state where the analyzer is rotated by 60 ° with respect to the polarizer, not in the crossed Nicol state.
- the area where no interference pattern is observed that is, the area where the cured product does not form a higher order structure
- the region where no interference pattern is observed becomes a dark field and cannot be distinguished from the filler part.
- the content of the filler in the epoxy resin composition is not particularly limited. From the viewpoint of moldability of the epoxy resin composition and handleability of the epoxy resin sheet, the filler content in the total solid content of the epoxy resin composition is preferably 45% to 90% by volume, and the cured product From the viewpoint of the thermal conductivity of the resin, it is more preferably 45% by volume to 85% by volume, and the thixotropic property of the epoxy resin composition when the epoxy resin composition is formed using a varnish-like epoxy resin composition. From the viewpoint, it is more preferably 50% by volume to 78% by volume.
- the volume-based content of the filler contained in the total solid content of the epoxy resin composition is measured, for example, as follows. First, the mass (Wc) of the epoxy resin composition at 25 ° C. is measured, and this is heated in air at 400 ° C. for 2 hours and then at 700 ° C. for 3 hours to decompose and burn the resin component and remove it. Thereafter, the mass (Wf) of the remaining filler at 25 ° C. is measured. Next, the density (df) of the filler at 25 ° C. is obtained using an electronic hydrometer or a specific gravity bottle. Next, the density (dc) of the epoxy resin composition at 25 ° C. is measured by the same method.
- the volume (Vc) of the epoxy resin composition and the volume (Vf) of the remaining filler are obtained, and the volume of the remaining filler is divided by the volume of the epoxy resin composition as shown in (Formula 1).
- the volume ratio (Vr) is obtained.
- Vc Volume of the epoxy resin composition (cm 3 )
- Wc mass of epoxy resin composition
- dc Density of epoxy resin composition (g / cm 3 )
- Vf Volume of filler (cm 3 )
- Wf Mass of filler
- df density of the filler (g / cm 3 )
- Vr Volume ratio of filler (%)
- standard of the filler contained in an epoxy resin composition is not specifically limited.
- the filler content is preferably 1 part by mass to 99 parts by mass, and more preferably 40 parts by mass to 95 parts by mass.
- the amount is 60 to 90 parts by mass.
- the type of filler is not particularly limited. Examples thereof include alumina, silica, magnesium oxide, aluminum nitride, boron nitride, and silicon nitride.
- a filler may be used individually by 1 type, or may use 2 or more types together.
- the filler is preferably nitride such as boron nitride, silicon nitride, aluminum nitride, more preferably at least one of boron nitride and aluminum nitride, and boron nitride from the viewpoint of electrical insulation. Is more preferable.
- the type of filler contained in the epoxy resin composition can be confirmed by, for example, energy dispersive X-ray analysis (EDX).
- EDX energy dispersive X-ray analysis
- the filler may exhibit a particle size distribution having a single peak or may exhibit a particle size distribution having two or more peaks. From the viewpoint of the filling rate of the filler in the epoxy resin composition, it is preferable to exhibit a particle size distribution having two or more peaks.
- the filler having a particle size distribution having two or more peaks may be obtained by combining two or more fillers having different particle sizes.
- the filler When the filler exhibits a particle size distribution having two or more peaks, it has a first peak existing in the range of 0.1 ⁇ m to 0.8 ⁇ m and a second peak present in the range of 20 ⁇ m to 60 ⁇ m. Is preferred.
- a first filler having an average particle diameter of 0.1 ⁇ m to 0.8 ⁇ m and a second filler having an average particle diameter of 20 ⁇ m to 60 ⁇ m are used in combination. Is preferred.
- the filling rate of the filler is further improved, and the thermal conductivity of the cured product tends to be further improved.
- the average particle diameter of the second filler is preferably 30 ⁇ m to 50 ⁇ m, and the average particle diameter of the first filler is 1/150 to 1 of the average particle diameter of the second filler. / 8 is preferable.
- the particle size distribution of the filler refers to a volume cumulative particle size distribution measured using a laser diffraction method.
- the average particle diameter of a filler says the particle diameter from which volume cumulative particle size distribution measured using a laser diffraction method will be 50%.
- the particle size distribution measurement using the laser diffraction method can be performed using a laser diffraction / scattering particle size distribution measuring apparatus (for example, trade name: LS13 of Beckman Coulter, Inc.).
- the filler dispersion used for the measurement can be obtained, for example, by putting the filler into a 0.1% by mass sodium metaphosphate aqueous solution, ultrasonically dispersing it, and adjusting the concentration to an appropriate light amount in terms of sensitivity of the apparatus.
- the second filler is preferably a nitride filler.
- the first filler may be a nitride filler or other filler.
- alumina is used.
- aluminum nitride is used.
- alumina As a filler, and more preferable to include ⁇ -alumina.
- examples of alumina include ⁇ -alumina, ⁇ -alumina, and ⁇ -alumina. From the viewpoint of thermal conductivity, it is preferable to include only ⁇ -alumina.
- the shape of alumina as the filler is preferably particulate.
- the shape of the alumina can be confirmed by a scanning electron microscope (SEM).
- SEM scanning electron microscope
- the presence of ⁇ -alumina in the alumina can be confirmed by an X-ray diffraction spectrum.
- the presence of ⁇ -alumina can be confirmed using a peak peculiar to ⁇ -alumina as an index.
- the content of ⁇ -alumina in alumina as a filler is preferably 80% by volume or more, more preferably 90% by volume or more, and more preferably 100% by volume of the total volume of alumina from the viewpoint of thermal conductivity and fluidity. % Is more preferable.
- the higher the ⁇ -alumina content the higher the formation of higher-order structures by the mesogen-containing epoxy compound, and the more likely the cured product is to have better thermal conductivity.
- the content of ⁇ -alumina in alumina as a filler can be confirmed by an X-ray diffraction spectrum.
- ⁇ -alumina as a filler may have a single peak or a plurality of peaks when a particle size distribution curve is drawn with the particle diameter on the horizontal axis and the frequency on the vertical axis. Also good.
- ⁇ -alumina as a filler has a single peak when a particle size distribution curve is drawn, the particle size when the volume accumulation from the small particle size side of ⁇ -alumina is 50%.
- a certain average particle diameter (D50) is preferably from 0.1 ⁇ m to 50 ⁇ m, more preferably from 0.1 ⁇ m to 30 ⁇ m, from the viewpoint of thermal conductivity.
- the crystal form of boron nitride may be any of hexagonal, cubic and rhombohedral, and hexagonal because the particle diameter can be easily controlled. Crystals are preferred. Moreover, you may use together 2 or more types of boron nitride from which a crystal form differs.
- the nitride filler is pulverized or agglomerated from the viewpoint of the thermal conductivity of the cured product and the viscosity when a varnish-like epoxy resin composition is used when forming the epoxy resin composition. It is preferable that it is processed.
- the particle shape of the nitride filler include round shapes, spherical shapes, and flake shapes.
- the nitride filler may be aggregated particles in which these particles are aggregated.
- the ratio of the major axis to the minor axis is a round shape or a spherical shape of 3 or less, more preferably a round shape having an aspect ratio of 2 or less. Or it is a spherical shape, and a spherical shape is more preferable.
- the aspect ratio of the particles means a value obtained by imaging particles using an electron microscope or the like, measuring the major axis and minor axis of each particle, and calculating the arithmetic average of the ratio of the major axis to the minor axis. .
- the major axis of the particle means the length of the circumscribed rectangle of the particle, and the minor axis of the particle means the width of the circumscribed rectangle of the particle.
- the term “spherical particles” means that the aspect ratio is 1.5 or less.
- agglomerated hexagonal boron nitride particles are preferable. Since the agglomerated hexagonal boron nitride particles have many gaps, the particles are easily crushed and deformed by applying pressure to the particles. Therefore, even if the filler content is lowered to reduce the viscosity of the varnish-like epoxy resin composition, the substantial filler content can be increased by compressing the epoxy resin composition with a press or the like. become. From the viewpoint of easy formation of a heat conduction path by contact between fillers having high thermal conductivity, the particle shape of the filler is more rounded or flake shaped than the spherical shape, and the number of particle contact points increases. Although considered to be preferable, spherical particles are preferable from the viewpoint of filler filling property, thixotropic property of the epoxy resin composition and viscosity.
- the volume average particle diameter (D50) of the nitride filler is not particularly limited. It is preferably 100 ⁇ m or less from the viewpoint of moldability of the epoxy resin composition, more preferably 20 ⁇ m to 100 ⁇ m from the viewpoint of thermal conductivity of the cured product and thixotropy of the varnish-like epoxy resin composition, From the viewpoint of electrical insulation of the cured product, it is more preferably 20 ⁇ m to 60 ⁇ m.
- the ratio of the nitride filler in the filler is not particularly limited. In one embodiment, from the viewpoint of electrical insulation of the cured product, it is preferably 10% by volume to 100% by volume of the entire filler, and from the viewpoint of thixotropy of the varnish-like epoxy resin composition, 20% by volume to It is more preferably 98% by volume, and further preferably 30% by volume to 95% by volume from the viewpoint of the thermal conductivity of the cured product. Further, in other embodiments, the proportion of the nitride filler in the filler is preferably 50% by volume to 98% by volume of the whole filler, and from the viewpoint of filling properties, it is 60% by volume to 95% by volume. Is more preferable, and from the viewpoint of the thermal conductivity of the cured product, it is more preferably 65% by volume to 95% by volume.
- the epoxy resin composition may contain a silane coupling agent.
- the thermal conductivity and insulation reliability of the cured product tend to be further improved. This is because, for example, the silane coupling agent forms a covalent bond between the filler surface and the surrounding resin (corresponding to the binder agent), improves the thermal conductivity, and prevents moisture from entering. It can be considered that the insulation reliability is improved.
- the silane coupling agent may exist in the state which coat
- the type of silane coupling agent is not particularly limited, and a commercially available product may be used.
- an epoxy group, an amino group, a mercapto group, a ureido group or a hydroxyl group is added to the terminal. It is preferable to use a silane coupling agent.
- silane coupling agent examples include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropylmethyldimethoxysilane.
- silane coupling agent oligomers Hitachi Chemical Techno Service Co., Ltd.
- SC-6000KS2 silane coupling agent oligomers
- the content of the silane coupling agent in the epoxy resin composition is not particularly limited.
- the content of the silane coupling agent is preferably 0.01% by mass to 0.2% by mass, and 0.03% by mass to 0.1% by mass of the total mass of the resin and the curing agent used as necessary. % Is more preferable.
- the solvent is not particularly limited as long as it does not inhibit the curing reaction of the epoxy resin composition, and a commonly used organic solvent can be appropriately selected and used.
- the resin sheet of this indication has a resin composition layer containing the epoxy resin composition of this indication.
- the resin composition layer may be one layer or two or more layers.
- the resin sheet of the present disclosure may further include a release film as necessary.
- the resin sheet is, for example, a varnish-like epoxy resin composition (hereinafter also referred to as “resin varnish”) prepared by adding an organic solvent such as methyl ethyl ketone or cyclohexanone to the epoxy resin composition, and a release film such as a PET film. It can manufacture by drying after giving on top.
- the resin varnish can be applied by a known method. Specific examples include methods such as comma coating, die coating, lip coating, and gravure coating. As a method for applying a resin varnish for forming a resin composition layer with a predetermined thickness, a comma coating method for passing an object to be coated between gaps, a die coating method for applying a resin varnish with a flow rate adjusted from a nozzle, etc. Apply. For example, when the thickness of the resin composition layer before drying is 50 ⁇ m to 500 ⁇ m, it is preferable to use a comma coating method.
- the drying method is not particularly limited as long as at least a part of the organic solvent contained in the resin varnish can be removed, and can be appropriately selected from commonly used drying methods.
- the resin sheet has a first resin composition layer containing an epoxy resin composition and a second resin composition layer containing an epoxy resin composition laminated on the first resin composition layer.
- the resin sheet is preferably a laminate of a first resin composition layer formed from an epoxy resin composition and a second resin composition layer formed from an epoxy resin composition.
- the epoxy resin compositions forming the first resin composition layer and the second resin composition layer may have the same composition or different compositions. It is preferable that the epoxy resin composition which forms a 1st resin composition layer and a 2nd resin composition layer is the same composition from a heat conductive viewpoint.
- the resin sheet is a laminate
- the first resin composition layer and the second resin composition layer formed from the epoxy resin composition are overlaid. With such a configuration, the withstand voltage tends to be further improved.
- the probability of occurrence of pinholes or voids in the resin sheet manufacturing method is not high, but by overlapping two resin composition layers, the probability of overlap of thin portions becomes the square, and the number of pinholes or voids is zero. It will approach. Since the dielectric breakdown occurs at a place where the insulation is weakest, it can be considered that the effect of further improving the withstand voltage can be obtained by overlapping the two resin composition layers. Furthermore, it can be considered that by overlapping the two resin composition layers, the contact probability between the fillers is improved, and the effect of improving the thermal conductivity is also produced.
- the method for producing a resin sheet includes a step of obtaining a laminate by stacking a second resin composition layer formed from an epoxy resin composition on a first resin composition layer formed from an epoxy resin composition, It is preferable to include a step of subjecting the obtained laminate to a heat and pressure treatment. With such a manufacturing method, the withstand voltage tends to be further improved.
- the density of the resin sheet is not particularly limited, and is usually 3.0 g / cm 3 to 3.4 g / cm 3 . Considering the compatibility between flexibility and thermal conductivity, the density of the resin sheet is preferably 3.0 g / cm 3 to 3.3 g / cm 3 , and preferably 3.1 g / cm 3 to 3.3 g / cm 3 . More preferably.
- the density of a resin sheet can be adjusted with the compounding quantity of an inorganic filler, for example.
- the density of the resin sheet refers to an average value of the densities of all the resin composition layers when the resin sheet has two or more resin composition layers.
- the release film is contained in the resin sheet, it means the density of the resin composition layer excluding the release film.
- the thickness of the resin sheet is not particularly limited and can be appropriately selected according to the purpose.
- the thickness of the resin sheet can be 10 ⁇ m to 350 ⁇ m, and is preferably 50 ⁇ m to 300 ⁇ m from the viewpoints of thermal conductivity, suppression of delamination against thermal stress, electrical insulation, and sheet flexibility.
- Resin sheet hardly undergoes curing reaction. For this reason, although it has flexibility, its flexibility as a sheet is poor. Therefore, in a state in which a support (an object to be imparted) such as a PET film is removed, the sheet self-supporting property is poor and handling may be difficult. Therefore, it is preferable that the resin sheet is further heat-treated until the resin composition constituting the resin sheet is in a semi-cured state.
- the resin sheet obtained by drying the resin composition is also referred to as an A stage sheet.
- a semi-cured resin sheet obtained by further heat-treating the A-stage sheet is also referred to as a B-stage sheet
- a cured sheet obtained by further heat-treating the A-stage sheet or the B-stage sheet is also referred to as a C-stage sheet.
- a stage, B stage, and C stage refer to the provisions of JIS K6900: 1994.
- the B stage sheet of the present disclosure has a semi-cured resin composition layer including a semi-cured product of the epoxy resin composition of the present disclosure.
- the B stage sheet can be manufactured, for example, by a manufacturing method including a step of heat-treating the resin sheet to the B stage state. By forming the resin sheet by heat treatment, it is excellent in thermal conductivity, delamination against thermal stress is suppressed, and is excellent in flexibility and usable time as a B stage sheet.
- the B-stage sheet is a semi-cured product when the resin composition layer has a temperature of 10 4 Pa ⁇ s to 10 5 Pa ⁇ s at room temperature (25 ° C.) and 10 2 Pa ⁇ s to 10 3 Pa at 100 ° C. -It means a state that is s.
- the viscosity is measured by dynamic viscoelasticity measurement (frequency 1 Hz, load 40 g, temperature increase rate 3 ° C./min).
- the conditions for heat-treating the resin sheet are not particularly limited as long as the resin composition layer can be semi-cured to the B stage state, and can be appropriately selected according to the configuration of the epoxy resin composition.
- a heat treatment method selected from hot vacuum press, hot roll laminating, etc. is preferred for the purpose of eliminating voids in the resin composition layer generated when the epoxy resin composition is applied.
- seat can be manufactured efficiently.
- the resin composition layer is heated and pressurized under reduced pressure (eg, 1 MPa) at a temperature of 50 ° C. to 180 ° C. for 1 second to 3 minutes with a press pressure of 1 MPa to 30 MPa. It can be semi-cured to the B stage state.
- the thickness of the B stage sheet can be appropriately selected according to the purpose.
- the thickness may be 10 ⁇ m to 350 ⁇ m, and is preferably 50 ⁇ m to 300 ⁇ m from the viewpoints of thermal conductivity, suppression of peeling against thermal stress, electrical insulation, and flexibility.
- seat can also be produced by heat-pressing, laminating
- the C stage sheet of the present disclosure has a cured resin composition layer including a cured product of the epoxy resin composition of the present disclosure.
- the C stage sheet can be manufactured, for example, by a manufacturing method including a step of heat-treating a resin sheet or a B stage sheet to a C stage state.
- the conditions for heat-treating the resin sheet or the B-stage sheet are not particularly limited as long as the resin composition layer or the semi-cured resin composition layer can be cured to the C-stage state, and are appropriately selected according to the configuration of the epoxy resin composition. can do.
- the heat treatment is preferably performed by a heat treatment method such as a hot vacuum press from the viewpoint of suppressing the generation of voids in the C stage sheet and improving the voltage resistance of the C stage sheet.
- the resin composition layer or the semi-cured resin composition layer is cured in a C stage state by performing a heat press treatment at a heating temperature of 100 ° C. to 250 ° C. for 1 minute to 30 minutes and 1 MPa to 20 MPa. Can do.
- the heating temperature is preferably 130 ° C to 230 ° C, and more preferably 150 ° C to 220 ° C.
- the thickness of the C stage sheet can be appropriately selected according to the purpose, and can be, for example, 50 ⁇ m to 350 ⁇ m. From the viewpoints of thermal conductivity, suppression of peeling against thermal stress, electrical insulation, and sheet flexibility. Therefore, the thickness is preferably 60 ⁇ m to 300 ⁇ m.
- seat can also be produced by heat-pressing in the state which laminated
- the C stage sheet has a storage elastic modulus at 25 ° C. of preferably 10 GPa or less, more preferably 7 GPa or less in a dynamic viscoelasticity measurement tensile test based on JIS K 7244-1: 1998. preferable.
- the storage elastic modulus of the C stage sheet is measured by cutting a C stage sheet having a thickness of 200 ⁇ m into a 30 mm ⁇ 5 mm square, and then using a dynamic viscoelasticity measuring apparatus (for example, RSA III manufactured by TA Instruments).
- the tensile mode the distance between chucks: 20 mm, the frequency: 10 Hz, the measurement temperature range: 20 ° C. to 300 ° C., the heating rate: 5 ° C./min, and the temperature 25 ° C.
- the cured product of the present disclosure is a cured product of the epoxy resin composition of the present disclosure.
- curing an epoxy resin composition The method used normally can be selected suitably.
- a cured product of the epoxy resin composition can be obtained by heat-treating the epoxy resin composition.
- limiting in particular as a method of heat-processing an epoxy resin composition there is no restriction
- the temperature range of heat processing can be suitably selected according to the kind of epoxy resin and hardening
- limiting in particular as time of heat processing According to the shape of cured
- the cured product preferably has a storage elastic modulus at 25 ° C. of 10 GPa or less, more preferably 7 GPa or less in a dynamic viscoelasticity measurement tensile test according to JIS K 7244-1: 1998. .
- the storage elastic modulus of the cured product is measured by cutting a C stage sheet having a thickness of 200 ⁇ m into a 30 mm ⁇ 5 mm square, and then using a dynamic viscoelasticity measuring apparatus (for example, RSA III manufactured by TA Instruments). Mode, distance between chucks: 20 mm, frequency: 10 Hz, measurement temperature range: 20 ° C. to 300 ° C., temperature rising rate: 5 ° C./min, temperature 25 ° C.
- the metal foil with a resin of the present disclosure includes a metal foil and a semi-cured resin composition layer including a semi-cured product of the epoxy resin composition of the present disclosure disposed on the metal foil.
- the resin-coated metal foil of the present disclosure is excellent in thermal conductivity, and delamination against thermal stress is suppressed.
- the semi-cured resin composition layer is obtained by heat-treating the epoxy resin composition so as to be in a B stage state.
- the metal foil examples include gold foil, copper foil, and aluminum foil, and copper foil is generally used.
- the thickness of the metal foil is, for example, 1 ⁇ m to 35 ⁇ m, and is preferably 20 ⁇ m or less from the viewpoint of flexibility.
- the metal foil is a three-layer composite foil in which nickel, nickel-phosphorus alloy, nickel-tin alloy, nickel-iron alloy, lead, lead-tin alloy, etc. are used as intermediate layers and copper layers are provided on both sides. And a two-layer composite foil in which an aluminum foil and a copper foil are combined.
- the thickness of one copper layer is 0.5 ⁇ m to 15 ⁇ m and the thickness of the other copper layer is 10 ⁇ m to 300 ⁇ m.
- the metal foil with resin is formed by, for example, forming a resin composition layer (resin sheet) by applying an epoxy resin composition (preferably, resin varnish) on the metal foil and drying it, and then heat-treating the resin composition layer. It can be manufactured by placing the layer in a B-stage state.
- the method for forming the resin composition layer is as described above.
- the production conditions for the resin-attached metal foil are not particularly limited.
- the drying temperature is not particularly limited and is preferably about 80 to 180 ° C.
- the drying time can be appropriately selected in consideration of the gelation time of the resin varnish.
- the application amount of the resin varnish is preferably applied so that the thickness of the resin composition layer after drying is 50 ⁇ m to 350 ⁇ m, and more preferably 60 ⁇ m to 300 ⁇ m.
- the resin composition layer after drying becomes a B stage state by further heat treatment.
- the heat treatment conditions for the resin composition layer are the same as the heat treatment conditions for the B-stage sheet.
- the metal substrate of the present disclosure is disposed on the metal support, a cured resin composition layer including a cured product of the epoxy resin composition of the present disclosure disposed on the metal support, and the cured resin composition layer.
- a metal foil By disposing a cured resin composition layer containing a cured product of the epoxy resin composition of the present disclosure between the metal support and the metal foil, thermal conductivity is improved, and peeling against thermal stress is suppressed.
- the material, thickness, etc. of the metal support can be appropriately selected according to the purpose. Specifically, a metal such as aluminum or iron can be used and the thickness can be set to 0.5 mm to 5 mm.
- the metal foil in the metal substrate can be the same as the metal foil described in the metal foil with resin, and the preferred embodiment is also the same.
- the metal substrate of this indication can be manufactured as follows, for example.
- a resin composition layer is formed by applying and drying an epoxy resin composition on a metal support, and a metal foil is further disposed on the resin composition layer, and the resin is heat treated and pressurized.
- the composition layer can be cured to produce a metal substrate.
- a method for applying and drying the resin composition layer on the metal support a method similar to the method described for the metal foil with resin can be used.
- the resin composition layer is subjected to heat treatment and pressure treatment.
- a semi-cured product can be cured to produce a metal substrate.
- the power semiconductor device includes a semiconductor module having a metal plate, a solder layer, and a semiconductor chip in this order, a heat radiating member, and the Poxy according to the present disclosure disposed between the metal plate and the heat radiating member of the semiconductor module.
- only the semiconductor module portion may be sealed with a sealing material or the like, or the entire power semiconductor module may be molded with a molding resin or the like.
- FIG. 1 is a schematic cross-sectional view showing an example of the configuration of a power semiconductor device.
- a cured product 102 of an epoxy resin composition is disposed between a metal plate 106 and a heat dissipation base substrate 104 in a semiconductor module having a metal plate 106, a solder layer 110, and a semiconductor chip 108 in this order. These parts are sealed with a sealing material 114.
- FIG. 2 is a schematic sectional view showing another example of the configuration of the power semiconductor device.
- a cured product 102 of an epoxy resin composition is disposed between a metal plate 106 and a heat dissipation base substrate 104 in a semiconductor module having a metal plate 106, a solder layer 110, and a semiconductor chip 108 in this order, and the semiconductor module.
- the heat dissipation base substrate 104 are molded with a mold resin 112.
- the cured product of the epoxy resin composition of the present disclosure can be used as a heat-dissipating adhesive layer between the semiconductor module and the heat-dissipating base substrate as shown in FIG. Further, even when the entire power semiconductor device is molded as shown in FIG. 2, it can be used as a heat dissipation material between the heat dissipation base substrate and the metal plate.
- Epoxy resin 2 biphenyl type epoxy compound (Mitsubishi Chemical Corporation; trade name YL6121H, mesogen-containing epoxy compound 2), and siloxane compound having a hydroxyl group at the terminal (Shin-Etsu Chemical Co., Ltd .; trade name X-22-1876)
- Epoxy resin 7 a mesogen-containing epoxy compound 1 and a siloxane compound having a carboxyl group at the terminal (Shin-Etsu Chemical Co., Ltd .; trade name X-22-162AS, carboxy equivalent: 420 g / eq, weight average molecular weight: 800) Reaction product.
- Epoxy resin 8 Reaction between mesogen-containing epoxy compound 1 and a siloxane compound having a hydroxyl group at the terminal (Shin-Etsu Chemical Co., Ltd .; trade name X-22-1875, hydroxyl group equivalent: 965 g / eq, weight average molecular weight: 1500)
- the weight average molecular weight (Mw) of the obtained epoxy resin 1 was measured by the following method. The analysis was performed using high performance liquid chromatography (Hitachi, Ltd., trade name: L6000) and a data analyzer (Shimadzu Corporation, trade name: C-R4A). As analytical GPC columns, Tosoh Corporation G2000HXL, G3000HXL and G4000HR (trade names) were used. The sample concentration was 5 mg / cm 3 , tetrahydrofuran was used for the mobile phase, and the measurement was performed at a flow rate of 1.0 mL / min. A calibration curve was prepared using a polystyrene standard sample, and Mw was calculated as a polystyrene conversion value using the calibration curve. As a result of the measurement, the weight average molecular weight (Mw) of the epoxy resin 1 was 1700.
- Epoxy equivalent of epoxy resin 1 was 460.
- Epoxy resins 2 to 9 were synthesized by changing the mesogen-containing epoxy compound and the siloxane compound used in Synthesis Example 1 as shown in Table 1 below. In the same manner as in Synthesis Example 1, the weight average molecular weights (Mw) and epoxy equivalents of the epoxy resins 2 to 9 were measured.
- the reaction mixture was concentrated under reduced pressure for 20 minutes to remove water and the like in the system to obtain the target phenol novolac resin CRN. Further, when the structure of the obtained CRN was confirmed by FD-MS (field desorption ionization mass spectrometry), all the partial structures represented by the general formulas (III-1) to (III-4) were confirmed. Existence was confirmed.
- the number average molecular weight (Mn) and the weight average molecular weight (Mw) were measured by the same method as the measurement of the number average molecular weight (Mn) of the epoxy resin.
- the hydroxyl equivalent was measured as follows.
- the hydroxyl equivalent was measured by acetyl chloride-potassium hydroxide titration method.
- the determination of the titration end point was performed by potentiometric titration instead of the coloring method using an indicator because the solution color was dark.
- the hydroxyl group of the measurement resin was acetylated with acetyl chloride in a pyridine solution, the excess reagent was decomposed with water, and the resulting acetic acid was titrated with a potassium hydroxide / methanol solution.
- the obtained CRN was a novolak resin containing 35% by mass of a monomer component (resorcinol) as a low molecular diluent, having a hydroxyl group equivalent of 62 g / eq, a number average molecular weight of 422, and a weight average molecular weight of 564.
- a monomer component resorcinol
- TPP Triphenylphosphine [Wako Pure Chemical Industries, Ltd., trade name]
- KBM-573 N-phenyl-3-aminopropyltrimethoxysilane [Silane coupling agent, Shin-Etsu Chemical Co., Ltd., trade name]
- Example 1> (Preparation of resin composition) 31.86% by mass of epoxy resin 1 containing 50% by mass of cyclohexanone, 3.79% by mass of MEHC-7403H as a curing agent, 0.84% by mass of CRN, and 0.16% by mass of TPP as a curing accelerator And 43.9% by mass of HP-40 as a filler, 5.44% by mass of AA-04, 0.05% by mass of KBM-573 as an additive, and 13.87% by mass of CHN as a solvent.
- the varnish-like epoxy resin composition was prepared.
- the density of boron nitride (HP-40) is 2.20 g / cm 3
- the density of alumina (AA-04) is 3.98 g / cm 3
- the density of the mixture of epoxy resin 1 and curing agent (CRN) is 1. It was 56 volume% when the ratio of the filler with respect to the total volume of the total solid of an epoxy resin composition was computed as .20g / cm ⁇ 3 >.
- the copper foil of the cured product of the epoxy resin composition with copper foil obtained above was removed by etching to obtain a cured product (C stage sheet) of the sheet-like epoxy resin composition.
- the thickness of the obtained C stage sheet was measured at 9 points using a micrometer (Mitutoyo Co., Ltd., Micrometer IP65), and the arithmetic average value was determined to be 200 ⁇ m.
- the obtained C stage sheet was cut into a 10 mm square and used as a sample.
- the sample was blackened with graphite spray, and then the thermal diffusivity was evaluated by a xenon flash method (trade name of NETZSCH: LFA447 nanoflash). From the product of this value, the density measured by the Archimedes method, and the specific heat measured by DSC (Differential Scanning Calorimeter; trade name of Perkin Elmer: DSC Pyris 1), the heat conduction in the thickness direction of the C stage sheet The rate was determined.
- Examples 2 to 9 Replacing the epoxy resin 1 with the epoxy resins 2 to 9, respectively, the ratio of the number of equivalents of epoxy groups of the epoxy resin to the number of equivalents of hydroxyl groups of the curing agent (number of equivalents of epoxy groups: number of equivalents of hydroxyl groups) is 1: 1.
- Epoxy resin compositions 2 to 9 were prepared in the same manner as in Example 1, except that the addition amount of the curing agent was changed.
- a cured product (C stage sheet) of a sheet-like epoxy resin composition was produced in the same manner as in Example 1 except that the epoxy resin composition 1 was replaced with the epoxy resin compositions 2 to 9 obtained above. And evaluated in the same manner as described above. The results are shown in Table 2.
- ⁇ Comparative example 2> Replacing the epoxy resin 1 with an epoxy compound having no mesogenic structure (polyfunctional epoxy resin, Mitsubishi Chemical Corporation, trade name 1032-H60, epoxy equivalent: 170 g / eq) and curing the number of equivalents of epoxy groups of the epoxy resin
- an epoxy compound having no mesogenic structure polyfunctional epoxy resin, Mitsubishi Chemical Corporation, trade name 1032-H60, epoxy equivalent: 170 g / eq
- Composition C2 was prepared.
- a comparative C stage sheet was prepared in the same manner as in Example 1 except that the epoxy resin composition 1 was replaced with the epoxy resin composition C2 obtained above, and evaluated in the same manner as described above. The results are shown in Table 2.
- Comparative Example 1 using an epoxy resin having a mesogenic structure but not having a siloxane structure is compared with Comparative Example 2 using an epoxy resin having neither a mesogenic structure nor a siloxane structure. Excellent thermal conductivity.
- Comparative Example 1 had a higher elastic modulus than Examples 1 to 9 using an epoxy resin having a mesogenic structure and a siloxane structure.
- Examples 1 to 9 using an epoxy resin having a mesogenic structure and a siloxane structure excellent thermal conductivity comparable to that of Comparative Example 1 using an epoxy resin having a mesogenic structure but not a siloxane structure. was demonstrated.
- 102 Cured product of epoxy resin composition
- 104 heat dissipation base substrate
- 106 metal plate
- 108 semiconductor chip
- 110 solder layer
- 112 mold resin
- 114 sealing material
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Abstract
Description
<2> 前記メソゲン構造は、下記一般式(1)で表される構造を含む<1>に記載のエポキシ樹脂。
[一般式(1)中、Xは、単結合又は下記2価の基からなる群(I)より選択される少なくとも1種の連結基を示し、Yは、それぞれ独立に、炭素数1~8の脂肪族炭化水素基、炭素数1~8の脂肪族アルコキシ基、フッ素原子、塩素原子、臭素原子、ヨウ素原子、シアノ基、ニトロ基、又はアセチル基を示し、nは、各々独立に0~4の整数を示し、*は、分子中における連結位置を示す。]
[2価の基からなる群(I)中、Yはそれぞれ独立に、炭素数1~8の脂肪族炭化水素基、炭素数1~8の脂肪族アルコキシ基、フッ素原子、塩素原子、臭素原子、ヨウ素原子、シアノ基、ニトロ基、又はアセチル基を示し、nは、各々独立に0~4の整数を示し、kは、0~7の整数を示し、mは、0~8の整数を示し、lは0~12の整数を示す。]
<3> 前記メソゲン構造は、メソゲン構造とエポキシ基とを有するエポキシ化合物に由来する構造単位を含む<1>又は<2>に記載のエポキシ樹脂。
<4> 前記エポキシ化合物は、前記エポキシ基を2個有する<3>に記載のエポキシ樹脂。
<5> 前記エポキシ化合物は、下記一般式(2)で表されるエポキシ化合物を含む<3>又は<4>に記載のエポキシ樹脂。
[一般式(2)中、Xは、単結合又は下記2価の基からなる群(I)より選択される少なくとも1種の連結基を示し、Yは、それぞれ独立に、炭素数1~8の脂肪族炭化水素基、炭素数1~8の脂肪族アルコキシ基、フッ素原子、塩素原子、臭素原子、ヨウ素原子、シアノ基、ニトロ基、又はアセチル基を示し、nは、各々独立に0~4の整数を示す。]
[2価の基からなる群(I)中、Yはそれぞれ独立に、炭素数1~8の脂肪族炭化水素基、炭素数1~8の脂肪族アルコキシ基、フッ素原子、塩素原子、臭素原子、ヨウ素原子、シアノ基、ニトロ基、又はアセチル基を示し、nは、各々独立に0~4の整数を示し、kは、0~7の整数を示し、mは、0~8の整数を示し、lは0~12の整数を示す。]
<6> 前記シロキサン構造は、エポキシ基と反応可能な官能基を有するシロキサン化合物に由来する構造単位を含む<1>~<5>のいずれか1項に記載のエポキシ樹脂。
<7> 前記シロキサン化合物は、前記官能基を2個有する<6>に記載のエポキシ樹脂。
<8> 前記シロキサン化合物は、下記一般式(3-1)~(3-3)で表される構造単位を有する化合物の少なくとも1種を含む<6>又は<7>に記載のエポキシ樹脂。
<9> 前記シロキサン化合物は、重量平均分子量(Mw)が200~5000である<6>~<8>のいずれか1項に記載のエポキシ樹脂。
<10> 前記メソゲン構造と前記シロキサン構造との比率(メソゲン構造:シロキサン構造)が、質量基準で、10:1~10:30である<1>~<9>のいずれか1項に記載のエポキシ樹脂。
<11> 液晶相を示す<1>~<10>のいずれか1項に記載のエポキシ樹脂。
<12> <1>~<11>のいずれか1項に記載のエポキシ樹脂と、硬化剤とを含有するエポキシ樹脂組成物。
<13> フィラーをさらに含有する<12>に記載のエポキシ樹脂組成物。
<14> 前記フィラーの含有率が、エポキシ樹脂組成物の全固形分の全体に対して、45体積%~90体積%である、<13>に記載のエポキシ樹脂組成物。
<15> 高次構造を形成可能な<12>~<14>のいずれか1項に記載のエポキシ樹脂組成物。
<16> <12>~<15>のいずれか1項に記載のエポキシ樹脂組成物を含む樹脂組成物層を有する樹脂シート。
<17> <12>~<15>のいずれか1項に記載のエポキシ樹脂組成物の半硬化物を含む半硬化樹脂組成物層を有するBステージシート。
<18> 前記半硬化樹脂組成物層が、高次構造を含む<17>に記載のBステージシート。
<19> <12>~<15>のいずれか1項に記載のエポキシ樹脂組成物の硬化物を含む硬化樹脂組成物層を有するCステージシート。
<20> 前記硬化樹脂組成物層が、高次構造を含む<19>に記載のCステージシート。
<21> <12>~<15>のいずれか1項に記載のエポキシ樹脂組成物の硬化物。
<22> 高次構造を含む<21>に記載の硬化物。
<23> 金属箔と、前記金属箔上に配置される<12>~<15>のいずれか1項に記載のエポキシ樹脂組成物の半硬化物を含む半硬化樹脂組成物層と、を備える樹脂付金属箔。
<24> 金属支持体と、前記金属支持体上に配置される<12>~<15>のいずれか1項に記載のエポキシ樹脂組成物の硬化物を含む硬化樹脂組成物層と、前記硬化樹脂組成物層上に配置される金属箔と、を備える金属基板。
<25> 金属板、はんだ層及び半導体チップをこの順に有する半導体モジュールと、放熱部材と、前記半導体モジュールの前記金属板と前記放熱部材との間に配置される<12>~<15>のいずれか1項に記載のエポキシ樹脂組成物の硬化物を含む硬化樹脂組成物層と、を備えるパワー半導体装置。
本開示において「~」を用いて示された数値範囲には、「~」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
本開示中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本開示中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
本開示において各成分は該当する物質を複数種含んでいてもよい。組成物中に各成分に該当する物質が複数種存在する場合、各成分の含有率又は含有量は、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率又は含有量を意味する。
本開示において各成分に該当する粒子は複数種含んでいてもよい。組成物中に各成分に該当する粒子が複数種存在する場合、各成分の粒子径は、特に断らない限り、組成物中に存在する当該複数種の粒子の混合物についての値を意味する。
本開示において「層」との語には、当該層が存在する領域を観察したときに、当該領域の全体に形成されている場合に加え、当該領域の一部にのみ形成されている場合も含まれる。
本開示において「積層」との語は、層を積み重ねることを示し、二以上の層が結合されていてもよく、二以上の層が着脱可能であってもよい。
本開示のエポキシ樹脂は、メソゲン構造とシロキサン構造とを有する。以下、メソゲン構造とシロキサン構造を有するエポキシ樹脂を、「エポキシ樹脂」と略称する場合がある。このような構成を有するエポキシ樹脂は、硬化物としたときに、熱伝導性に優れ、かつ低弾性化を図ることが可能である。その理由は明らかではないが以下のように考えることができる。
また、シロキサン化合物は、弾性の低い材料である。その理由は、シロキサン結合の結合距離の長さ、結合角度等に起因する。シロキサン結合の結合距離は1.64Åであり、炭素結合の結合距離の1.54Åに比べて長い。また、炭素結合の結合角度が110°であるのに対して、シロキサン結合の結合角度は134°と広くなっている。したがって、炭素結合に比べてシロキサン結合は動きやすく、その結果、炭素結合を含む有機化合物に比べてシロキサン化合物は低弾性となる。
上記2価の基からなる群(I)において、各2価の基の結合手の連結方向はいずれであってもよい。
エポキシ樹脂に含まれるシロキサン構造は、1種単独であっても、2種以上であってもよい。
エポキシ基は、シロキサン構造に結合していても、メソゲン構造に結合していてもよく、メソゲン構造に結合していることが好ましい。エポキシ基は、シロキサン構造及びメソゲン構造からなる群より選択される少なくとも1種に、直接結合していても、連結基を介して結合していてもよい。連結基としては、アルキレン基、酸素原子、カルボニルオキシ基、及びこれらの組み合わせが挙げられる。エポキシ基、並びにエポキシ基及び連結基を有するエポキシ含有基からなる群より選択される少なくとも1種が、メソゲン構造に結合していることが好ましい。エポキシ含有基としては、グリシジル基、グリシジルオキシ基、エポキシシクロヘキシル基等が挙げられる。
直鎖状のエポキシ樹脂は、主鎖にシロキサン構造とメソゲン構造とを有している。分岐状のエポキシ樹脂は、シロキサン構造を主鎖とし側鎖にメソゲン構造を有していても、メソゲン構造を主鎖とし側鎖にシロキサン構造を有していてもよい。
エポキシ樹脂は、主鎖にシロキサン構造とメソゲン構造とを有し、このメソゲン構造の少なくとも一部がエポキシ基及びエポキシ含有基からなる群より選択される少なくとも1種を有することがより好ましい。
エポキシ樹脂における、メソゲン構造とシロキサン構造との比率は、NMR、MALDI-TOF-MS等によって測定することができる。
本開示において、エポキシ樹脂のエポキシ当量は、過塩素酸滴定法により測定する。
本開示において、重量平均分子量(Mw)は、ゲル浸透クロマトグラフ法(GPC法)により測定する。
また、ポリスチレン標準サンプルを用いて検量線を作成し、ポリスチレン換算値でエポキシ樹脂の重量平均分子量(Mw)を計算する。
本開示のエポキシ樹脂は、分子内に、メソゲン構造とシロキサン構造とエポキシ基とを有するように製造できれば、特に限定されない。
例えば、本開示のエポキシ樹脂は、メソゲン構造を有するエポキシ化合物(以下、「メソゲン含有エポキシ化合物」ともいう)と、エポキシ基と反応可能な官能基を有するシロキサン化合物(以下、「反応性シロキサン化合物」ともいう)とを反応させることで得ることができる。メソゲン含有エポキシ化合物及び反応性シロキサン化合物は、それぞれ1種単独で用いても、2種以上を併用してもよい。
メソゲン含有エポキシ化合物は、エポキシ基を2個以上することが好ましく、得られるエポキシ樹脂が直鎖状となる観点からは、2個有することが好ましい。
R1~R3で表されるアルキル基としては、メチル基、エチル基、プロピル基等が挙げられ、メチル基であることが好ましい。
R1~R3で表されるアルキル基及びフェニル基は、それぞれ置換基を有していてもよい。
X1~X3で表されるアルキレンオキシアルキル基におけるアルキレン基の炭素数は、1~6であることが好ましく、1~3であることが好ましい。X1~X3で表されるアルキレンオキシアルキル基におけるアルキル基の炭素数は、1~6であることが好ましく、1~3であることが好ましい。
硬化触媒の量は特に制限されない。反応速度及び貯蔵安定性の観点から、メソゲン含有エポキシ化合物と反応性シロキサン化合物の合計質量に対し、0.1質量%~3質量%であることが好ましく、0.2質量%~1.5質量%であることがより好ましい。
エポキシ樹脂における、メソゲン構造とシロキサン構造との比率は、NMR、MALDI-TOF-MS等によって測定することができる。
本開示のエポキシ樹脂組成物は、本開示のエポキシ樹脂と硬化剤とを含有する。本開示のエポキシ樹脂組成物は、硬化物としたときに、熱伝導性に優れ、低弾性である。本開示のエポキシ樹脂組成物は、必要に応じて、上記成分に加えてその他の成分を含んでいてもよい。その他の成分としては、フィラー、硬化触媒、シランカップリング剤、溶剤、離型剤、応力緩和剤、補強材、エラストマ、分散剤、沈降防止剤等をさらに含有していてもよい。
エポキシ樹脂組成物に含まれるエポキシ樹脂は、上述のエポキシ樹脂である。
エポキシ樹脂組成物に含まれるエポキシ樹脂の含有率は、5質量%~30質量%であることが好ましく、7質量%~28質量%であることがより好ましく、10質量%~25質量%であることがさらに好ましい。
硬化剤は、エポキシ樹脂と硬化反応が可能な化合物であれば特に制限されず、通常用いられる硬化剤を適宜選択して用いることができる。硬化剤の具体例としては、酸無水物系硬化剤、アミン系硬化剤、フェノール系硬化剤、メルカプタン系硬化剤等が挙げられる。これらの硬化剤は、1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
中でも耐熱性の観点から、硬化剤としては、アミン系硬化剤及びフェノール系硬化剤からなる群より選択される少なくとも1種を用いることが好ましく、さらに、保存安定性の観点から、フェノール系硬化剤の少なくとも1種を用いることがより好ましい。
中でも、熱伝導率の観点から、4,4’-ジアミノジフェニルメタン及び1,5-ジアミノナフタレン及び4,4’-ジアミノジフェニルスルホンからなる群より選択される少なくとも1種であることが好ましく、1,5-ジアミノナフタレンであることがより好ましい。
フェノール系硬化剤としては、フェノール、o-クレゾール、m-クレゾール、p-クレゾール等の単官能の化合物;カテコール、レゾルシノール、ヒドロキノン等の2官能の化合物;1,2,3-トリヒドロキシベンゼン、1,2,4-トリヒドロキシベンゼン、1,3,5-トリヒドロキシベンゼン等の3官能の化合物などが挙げられる。また、硬化剤としては、これらフェノール系硬化剤をメチレン鎖等で連結してノボラック化したフェノールノボラック樹脂を用いることができる。
アリール基は、芳香族環にヘテロ原子を含む構造であってもよい。この場合、ヘテロ原子と炭素原子の合計数が6~12となるヘテロアリール基であることが好ましい。
アラルキル基におけるアルキレン基は、直鎖状、分岐鎖状、及び環状のいずれであってもよい。アラルキル基におけるアリール基は、芳香族環にヘテロ原子を含む構造であってもよい。この場合、ヘテロ原子と炭素原子の合計数が6~12となるヘテロアリール基であることが好ましい。
m21及びm22はそれぞれ独立に、0~2の整数を示し、m21又はm22が2の場合、2つのR21又はR24は同一であっても異なっていてもよい。m21及びm22は、それぞれ独立に、0又は1であることが好ましく、0であることがより好ましい。
n21及びn22はフェノールノボラック樹脂に含まれる一般式(II-1)及び一般式(II-2)で表される構造単位の数であり、それぞれ独立に、1~7の整数を示す。
R22、R23、R25及びR26で表されるアルキル基、アリール基、及びアラルキル基は、さらに置換基を有していてもよい。置換基としては、アルキル基(但し、R22、R23、R25及びR26が、アルキル基の場合を除く)、アリール基、ハロゲン原子、水酸基等を挙げることができる。
さらに、耐熱性の観点から、R22及びR23の少なくとも一方はアリール基であることが好ましく、炭素数6~12であるアリール基であることがより好ましい。また、R25及びR26の少なくとも一方は、同様にアリール基であることが好ましく、炭素数6~12であるアリール基であることがより好ましい。
なお、上記アリール基は芳香族環にヘテロ原子を含む構造であってもよい。この場合、ヘテロ原子と炭素原子の合計数が6~12となるヘテロアリール基であることが好ましい。
また、一般式(II-2)で表される構造単位を有する化合物は、カテコール以外のフェノール化合物に由来する部分構造の少なくとも1種を含んでいてもよい。一般式(II-2)において、カテコール以外のフェノール化合物に由来する部分構造としては、例えば、フェノール、クレゾール、レゾルシノール、ヒドロキノン、1,2,3-トリヒドロキシベンゼン、1,2,4-トリヒドロキシベンゼン、及び1,3,5-トリヒドロキシベンゼンに由来する部分構造が挙げられる。これらに由来する部分構造は、1種単独で含んでも、2種以上を組み合わせて含んでいてもよい。
なお、フェノールノボラック樹脂が一般式(III-1)~一般式(III-4)のいずれかで表される部分構造を有するか否かは、電界脱離イオン化質量分析法(FD-MS)によって、そのフラグメント成分として、一般式(III-1)~一般式(III-4)のいずれかで表される部分構造に相当する成分が含まれるか否かによって判断することができる。
樹脂組成物は、硬化促進剤を含んでもよい。硬化剤と硬化促進剤とを併用することで、エポキシ樹脂をさらに十分に硬化させることができる。硬化促進剤の種類及び含有率は特に制限されず、反応速度、反応温度及び保管性の観点から、適切なものを選択することができる。
これら硬化促進剤は、1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
エポキシ樹脂組成物は、フィラーを含んでいてもよい。エポキシ樹脂組成物がフィラーを含むことで、得られる硬化物の熱伝導性が向上する。メソゲン構造を有するエポキシ樹脂は、硬化物中で、フィラーを中心とした高い秩序性を有する高次構造を形成し、硬化物の熱伝導性が著しく向上する傾向にある(例えば、国際公開第WO2013/065159号公報を参照)。これは、高次構造を形成したエポキシ樹脂の硬化物において、フィラーが効率的な熱伝導パスとして機能するためと考えられている。
Vc=Wc/dc
Vf=Wf/df
Vr(%)=(Vf/Vc)×100
Wc:エポキシ樹脂組成物の質量(g)
dc:エポキシ樹脂組成物の密度(g/cm3)
Vf:フィラーの体積(cm3)
Wf:フィラーの質量(g)
df:フィラーの密度(g/cm3)
Vr:フィラーの体積比率(%)
→低質量%側にシフトさせました。
フィラーとしてのα-アルミナが粒度分布曲線を描いたときに単一のピークを有する場合、α-アルミナの体積累積粒度分布の小粒径側からの体積累積が50%となるときの粒子径である平均粒子径(D50)は、熱伝導性の観点から、0.1μm~50μmであることが好ましく、0.1μm~30μmであることがより好ましい。
また、フィラーに占める窒化物フィラーの割合は、その他の態様では、フィラー全体の50体積%~98体積%であることが好ましく、充填性の観点からは、60体積%~95体積%であることがより好ましく、硬化物の熱伝導性の観点からは、65体積%~95体積%であることがさらに好ましい。
エポキシ樹脂組成物は、シランカップリング剤を含んでいてもよい。エポキシ樹脂組成物がシランカップリング剤を含むことで、硬化物の熱伝導性と絶縁信頼性がより向上する傾向にある。これは例えば、シランカップリング剤は、フィラーの表面とその周りを取り囲む樹脂との間で共有結合を形成する役割(バインダ剤に相当)、熱伝導率の向上、及び水分の侵入を妨げることによって絶縁信頼性を向上させる働きを果たすと考えることができる。
溶剤としては、エポキシ樹脂組成物の硬化反応を阻害しないものであれば特に制限はなく、通常用いられる有機溶剤を適宜選択して用いることができる。
本開示の樹脂シートは、本開示のエポキシ樹脂組成物を含む樹脂組成物層を有する。樹脂組成物層は1層であっても2層以上であってもよい。本開示の樹脂シートは、必要に応じて離型フィルムをさらに有していてもよい。
樹脂シートは、例えば、メチルエチルケトン、シクロヘキサノン等の有機溶剤をエポキシ樹脂組成物に添加して調製されるワニス状のエポキシ樹脂組成物(以下、「樹脂ワニス」ともいう)をPETフィルム等の離型フィルム上に付与後、乾燥することで製造することができる。
本開示において、樹脂シートの密度は、樹脂シートが2層以上の樹脂組成物層を有する場合、全ての樹脂組成物層の密度の平均値をいう。また、樹脂シートに離型フィルムが含まれている場合、離型フィルムを除いた樹脂組成物層の密度をいう。
本開示のBステージシートは、本開示のエポキシ樹脂組成物の半硬化物を含む半硬化樹脂組成物層を有する。
Bステージシートは、例えば、樹脂シートをBステージ状態まで熱処理する工程を含む製造方法で製造できる。
樹脂シートを熱処理して形成されることで、熱伝導性に優れ、熱応力に対する剥離が抑制され、Bステージシートとしての可とう性及び可使時間に優れる。
具体的には、例えば、減圧下(例えば、1MPa)、温度50℃~180℃で、1秒間~3分間、1MPa~30MPaのプレス圧で加熱及び加圧処理することで、樹脂組成物層をBステージ状態に半硬化させることができる。
本開示のCステージシートは、本開示のエポキシ樹脂組成物の硬化物を含む硬化樹脂組成物層を有する。
Cステージシートは、例えば、樹脂シート又はBステージシートをCステージ状態まで熱処理する工程を含む製造方法により製造することができる。
樹脂シート又はBステージシートを熱処理する条件は、樹脂組成物層又は半硬化樹脂組成物層をCステージ状態にまで硬化することができれば特に制限されず、エポキシ樹脂組成物の構成に応じて適宜選択することができる。熱処理には、Cステージシート中のボイドの発生を抑制し、Cステージシートの耐電圧性を向上させる観点から、熱真空プレス等の熱処理方法により行うことが好ましい。これにより平坦なCステージシートを効率よく製造することができる。
具体的には例えば、加熱温度100℃~250℃で、1分間~30分間、1MPa~20MPaで加熱プレス処理することで樹脂組成物層又は半硬化樹脂組成物層をCステージ状態に硬化することができる。加熱温度は130℃~230℃であることが好ましく、150℃~220℃であることがより好ましい。
Cステージシートの貯蔵弾性率の測定は、厚み200μmのCステージシートを30mm×5mm角に切り出した後、動的粘弾性測定装置(例えば、TAインスツルメント社製、RSA III)を用いて、引張モード、チャック間距離:20mm、周波数:10Hz、測定温度範囲:20℃~300℃、昇温速度:5℃/分、温度25℃の条件で行う。
本開示の硬化物は、本開示のエポキシ樹脂組成物の硬化物である。エポキシ樹脂組成物を硬化する方法としては、特に制限はなく、通常用いられる方法を適宜選択することができる。例えば、エポキシ樹脂組成物を熱処理することでエポキシ樹脂組成物の硬化物が得られる。
エポキシ樹脂組成物を熱処理する方法としては特に制限はなく、また加熱条件についても特に制限はない。熱処理の温度範囲は、エポキシ樹脂組成物を構成するエポキシ樹脂及び硬化剤の種類に応じて適宜選択することができる。また、熱処理の時間としては、特に制限はなく、硬化物の形状、厚み等に応じて適宜選択される。
硬化物の貯蔵弾性率の測定は、厚み200μmのCステージシートを30mm×5mm角に切り出した後、動的粘弾性測定装置(例えば、TAインスツルメント社製、RSA III)を用いて、引張モード、チャック間距離:20mm、周波数:10Hz、測定温度範囲:20℃~300℃、昇温速度:5℃/分、温度25℃の条件で行う。
本開示の樹脂付金属箔は、金属箔と、前記金属箔上に配置される本開示のエポキシ樹脂組成物の半硬化物を含む半硬化樹脂組成物層と、を備える。本開示のエポキシ樹脂組成物の半硬化物を含む半硬化樹脂組成物層を有することで、本開示の樹脂付金属箔は、熱伝導性に優れ、熱応力に対する剥離が抑制される。
半硬化樹脂組成物層はエポキシ樹脂組成物をBステージ状態になるように熱処理して得られるものである。
金属箔の厚みとしては、例えば、1μm~35μmが挙げられ、可とう性の観点から、20μm以下であることが好ましい。
また、金属箔としては、ニッケル、ニッケル-リン合金、ニッケル-スズ合金、ニッケル-鉄合金、鉛、鉛-スズ合金等を中間層とし、この両面に銅層を設けた3層構造の複合箔、アルミニウム箔と銅箔とを複合した2層構造の複合箔などが挙げられる。中間層の両面に銅層を設けた3層構造の複合箔では、一方の銅層の厚さを0.5μm~15μmとし、他方の銅層の厚さを10μm~300μmとすることが好ましい。
乾燥後の樹脂組成物層は、さらに熱処理されることでBステージ状態になる。樹脂組成物層を熱処理する条件は、Bステージシートにおける熱処理条件と同様である。
本開示の金属基板は、金属支持体と、前記金属支持体上に配置される本開示のエポキシ樹脂組成物の硬化物を含む硬化樹脂組成物層と、前記硬化樹脂組成物層上に配置される金属箔と、を備える。
金属支持体と金属箔との間に、本開示のエポキシ樹脂組成物の硬化物を含む硬化樹脂組成物層を配置することで、熱伝導性が向上し、熱応力に対する剥離が抑制される。
金属支持体上に、エポキシ樹脂組成物を付与し乾燥することで樹脂組成物層を形成し、さらに樹脂組成物層上に金属箔を配置して、これを熱処理及び加圧処理することで樹脂組成物層を硬化して、金属基板を製造することができる。金属支持体上に樹脂組成物層を付与し乾燥する方法としては、樹脂付金属箔で説明した方法と同様の方法を用いることができる。
また、金属支持体上に、樹脂付金属箔を樹脂組成物層の半硬化物が金属支持体に対向するように貼り合わせた後、これを熱処理及び加圧処理することで樹脂組成物層の半硬化物を硬化して、金属基板を製造することもできる。
本開示のパワー半導体装置は、金属板、はんだ層及び半導体チップをこの順に有する半導体モジュールと、放熱部材と、前記半導体モジュールの前記金属板と前記放熱部材との間に配置される本開示のポキシ樹脂組成物の硬化物を含む硬化樹脂組成物層と、を備える。
パワー半導体装置は、半導体モジュール部分のみが封止材等で封止されていても、パワー半導体モジュール全体がモールド樹脂等でモールドされていてもよい。以下、パワー半導体装置の例を、図面を用いて説明する。
以下に、エポキシ樹脂組成物の調製に用いた材料とその略号を示す。
・エポキシ樹脂1:4-{4-(2,3-エポキシプロポキシ)フェニル}シクロヘキシル=4-(2,3-エポキシプロポキシ)ベンゾエート(エポキシ当量:212g/eq、特開2011-74366号公報に記載の方法により製造したもの、下記化学式、メソゲン含有エポキシ化合物1)と、末端に水酸基を有するシロキサン樹脂(信越化学工業株式会社;商品名X-22-1876、水酸基当量:487、重量平均分子量:700)との反応生成物(仕込み当量比:メソゲン含有エポキシ化合物1:X-22-1876=10:2.5)
・エポキシ樹脂3:1-{(3-メチル-4-オキシラニルメトキシ)フェニル}-4-4-(4-オキシラニルメトキシフェニル)-1-シクロヘキセン(エポキシ当量:201g/eq、下記化学式、メソゲン含有エポキシ化合物3)と、末端に水酸基を有するシロキサン化合物(X-22-1876)との反応生成物(仕込み当量比:メソゲン含有エポキシ化合物3:X-22-1876=10:2.5)
(仕込み当量比:メソゲン含有エポキシ化合物1:KF105=10:2.5)
・エポキシ樹脂7:メソゲン含有エポキシ化合物1と、末端にカルボキシル基を有するシロキサン化合物(信越化学工業株式会社;商品名X-22-162AS、カルボキシ当量:420g/eq、重量平均分子量:800)との反応生成物。(仕込み当量比:メソゲン含有エポキシ化合物1:X-22-162AS=10:2.5)
・エポキシ樹脂8:メソゲン含有エポキシ化合物1と、末端に水酸基を有するシロキサン化合物(信越化学工業株式会社;商品名X-22-1875、水酸基当量:965g/eq、重量平均分子量:1500)との反応生成物(仕込み当量比:メソゲン含有エポキシ化合物1:X-22-1875=10:2.5)
・エポキシ樹脂9:メソゲン含有エポキシ化合物1と、末端に水酸基を有するシロキサン化合物(X-22-1876)との反応生成物(仕込み当量比:メソゲン含有エポキシ化合物1:X-22-1876=10:7.5)
温度計、撹拌装置、還流冷却管の付いた加熱及び冷却可能な容積0.5リットルの反応容器に、末端に水酸基を有するシロキサン化合物(X-22-1876):33.0g、メソゲン含有エポキシ化合物1:60.0g、及びシクロヘキサノン:93.0gを投入した。
高速液体クロマトグラフィー(株式会社日立製作所、商品名:L6000)及びデータ解析装置(株式会社島津製作所、商品名:C-R4A)を用いて行った。分析用GPCカラムは東ソー株式会社のG2000HXL、G3000HXL及びG4000HR(以上、商品名)を使用した。試料濃度は5mg/cm3、移動相にはテトラヒドロフランを用い、流速1.0mL/minで測定を行った。ポリスチレン標準サンプルを用いて検量線を作成し、それを用いてポリスチレン換算値でMwを計算した。
測定の結果、エポキシ樹脂1の重量平均分子量(Mw)は、1700であった。
合成例1において用いたメソゲン含有エポキシ化合物とシロキサン化合物を下記表1のように変えて、エポキシ樹脂2~9を合成した。合成例1と同様の方法で、エポキシ樹脂2~9の重量平均分子量(Mw)及びエポキシ当量を測定した。
・AA-04[アルミナ粒子、住友化学株式会社、D50:0.4μm]
・HP-40[窒化ホウ素粒子、水島合金鉄株式会社、D50:40μm]
・MEHC-7403H[高耐熱・難燃性フェノール樹脂、明和化成株式会社、水酸基当量:136g/eq]
・CRN[カテコールレゾルシノールノボラック樹脂(質量基準の仕込み比:カテコール/レゾルシノール=5/95)、シクロヘキサノン50質量%含有]
撹拌機、冷却器及び温度計を備えた3Lのセパラブルフラスコに、レゾルシノール627g、カテコール33g、37質量%ホルムアルデヒド水溶液316.2g、シュウ酸15g、水300gを入れ、オイルバスで加温しながら100℃に昇温した。104℃前後で還流し、還流温度で4時間反応を続けた。その後、水を留去しながらフラスコ内の温度を170℃に昇温した。170℃を保持しながら8時間反応を続けた。反応後、減圧下20分間濃縮を行い、系内の水等を除去し、目的物であるフェノールノボラック樹脂CRNを得た。
また、得られたCRNについて、FD-MS(電界脱離イオン化質量分析法)により構造を確認したところ、一般式(III-1)~一般式(III-4)で表される部分構造すべての存在が確認できた。
水酸基当量は、塩化アセチル-水酸化カリウム滴定法により測定した。なお、滴定終点の判断は溶液の色が暗色のため、指示薬による呈色法ではなく、電位差滴定によって行った。具体的には、測定樹脂の水酸基をピリジン溶液中で塩化アセチルによりアセチル化した後に、過剰の試薬を水で分解し、生成した酢酸を水酸化カリウム/メタノール溶液で滴定した。
・TPP:トリフェニルホスフィン[和光純薬工業株式会社、商品名]
・KBM-573:N-フェニル-3-アミノプロピルトリメトキシシラン[シランカップリング剤、信越化学工業株式会社、商品名]
・CHN:シクロヘキサノン
・PETフィルム[帝人フィルムソリューション株式会社、商品名:A53、厚さ50μm]
・銅箔[古河電気工業株式会社、厚さ:105μm、GTSグレード]
(樹脂組成物の調製)
シクロヘキサノン50質量%含有のエポキシ樹脂1を31.86質量%と、硬化剤としてMEHC-7403Hを3.79質量%、CRNを0.84質量%と、硬化促進剤としてTPPを0.16質量%と、フィラーとしてHP-40を43.99質量%と、AA-04を5.44質量%と、添加剤としてKBM-573を0.05質量%と、溶剤としてCHNを13.87質量%と、を混合し、ワニス状のエポキシ樹脂組成物を調製した。
ワニス状のエポキシ樹脂組成物を、アプリケーターを用いてPETフィルム上に塗布した後、120℃で10分間乾燥させた。その後、真空プレスにて、熱間加圧(プレス温度:80℃、真空度:1kPa、プレス圧:10MPa、加圧時間:3分)を行い、Bステージシートを得た。
上記で得られたBステージシートのPETフィルムを剥がした後、2枚の銅箔で、銅箔のマット面がそれぞれ半硬化樹脂組成物層に対向するようにして挟み、真空プレスにて、真空熱圧着(プレス温度:150℃、真空度:1kPa、プレス圧:5MPa、加圧時間:30分)した。その後、大気圧条件下、150℃で2時間、210℃で4時間加熱し、銅箔付エポキシ樹脂組成物の硬化物を得た。
(高次構造(液晶相)の確認)
合成したエポキシ樹脂1を10℃/分で加熱しながら、状態変化を偏光顕微鏡(オリンパス株式会社、製品名「BS51」)にて観察(倍率:100倍)した。クロスニコル状態での観察において、エポキシ樹脂が流動性を有し、かつ偏光解消による透過光が肉眼で観察される温度領域が存在することが確認されれば、液晶相を示すと判断した。
尚、ここでの流動性を有する状態とは、物体を静置したときにその自重及びそれと同等の外部応力によって塑性変形を引き起こす状態と定義する。また、偏光解消による透過光が肉眼で観測される状態とは、クロスニコル状態の暗視野部分と偏光解消を引き起こした部分の変化を肉眼にて一般的な当業者の過半数が認識できる状態をいう。
上記で得られた銅箔付エポキシ樹脂組成物の硬化物の銅箔をエッチングして取り除き、シート状のエポキシ樹脂組成物の硬化物(Cステージシート)を得た。得られたCステージシートの厚みを、マイクロメーター(株式会社ミツトヨ、マイクロメーター IP65)を用いて9点測定し、その算術平均値を求めたところ、200μmであった。
得られたCステージシートを30mm×5mm角に切り出した後、動的粘弾性測定装置(TAインスツルメント社製、RSA III)を用いて、引張モード、チャック間距離:20mm、周波数:10Hz、測定温度範囲:20℃~300℃、昇温速度:5℃/分、温度25℃の条件で、JIS K 7244-1:1998に準拠して、動的粘弾性を測定した。
エポキシ樹脂1をエポキシ樹脂2~9にそれぞれ代え、エポキシ樹脂のエポキシ基の当量数と硬化剤の水酸基の当量数の比(エポキシ基の当量数:水酸基の当量数)が1:1となるように硬化剤の添加量を変更した以外は、実施例1と同様の方法で、エポキシ樹脂組成物2~9を調製した。
エポキシ樹脂組成物1を上記で得られたエポキシ樹脂組成物2~9に代えた以外は、実施例1と同様の方法で、シート状のエポキシ樹脂組成物の硬化物(Cステージシート)を作製し、上記と同様にして評価した。その結果を表2に示す。
エポキシ樹脂1を、メソゲン含有エポキシ化合物1に代え、エポキシ樹脂のエポキシ基の当量数と硬化剤の水酸基の当量数の比(エポキシ基の当量数:水酸基の当量数)が1:1となるように硬化剤の添加量を変更した以外は、実施例1と同様の方法で、エポキシ樹脂組成物C1を調製した。
エポキシ樹脂組成物1を上記で得られたエポキシ樹脂組成物C1に代えた以外は、実施例1と同様の方法で、比較のCステージシートを作製し、上記と同様にして評価した。その結果を表2に示す。
エポキシ樹脂1を、メソゲン構造を有しないエポキシ化合物(多官能型エポキシ樹脂、三菱ケミカル株式会社、商品名1032-H60、エポキシ当量:170g/eq)に代え、エポキシ樹脂のエポキシ基の当量数と硬化剤の水酸基の当量数の比(エポキシ基の当量数:水酸基の当量数)が1:1となるように硬化剤の添加量を変更した以外は、実施例1と同様の方法で、エポキシ樹脂組成物C2を調製した。
エポキシ樹脂組成物1を上記で得られたエポキシ樹脂組成物C2に代えた以外は、実施例1と同様の方法で、比較のCステージシートを作製し、上記と同様にして評価した。その結果を表2に示す。
しかしながら、比較例1は、メソゲン構造とシロキサン構造とを有するエポキシ樹脂を用いた実施例1~9に比べると、弾性率が高くなっていた。
また、メソゲン構造とシロキサン構造とを有するエポキシ樹脂を用いた実施例1~9では、メソゲン構造を有するがシロキサン構造を有さないエポキシ樹脂を用いた比較例1と同程度の優れた熱伝導性が発揮されていた。
Claims (25)
- メソゲン構造とシロキサン構造とを有するエポキシ樹脂。
- 前記メソゲン構造は、下記一般式(1)で表される構造を含む請求項1に記載のエポキシ樹脂。
[一般式(1)中、Xは、単結合又は下記2価の基からなる群(I)より選択される少なくとも1種の連結基を示し、Yは、それぞれ独立に、炭素数1~8の脂肪族炭化水素基、炭素数1~8の脂肪族アルコキシ基、フッ素原子、塩素原子、臭素原子、ヨウ素原子、シアノ基、ニトロ基、又はアセチル基を示し、nは、各々独立に0~4の整数を示し、*は、分子中における連結位置を示す。]
[2価の基からなる群(I)中、Yはそれぞれ独立に、炭素数1~8の脂肪族炭化水素基、炭素数1~8の脂肪族アルコキシ基、フッ素原子、塩素原子、臭素原子、ヨウ素原子、シアノ基、ニトロ基、又はアセチル基を示し、nは、各々独立に0~4の整数を示し、kは、0~7の整数を示し、mは、0~8の整数を示し、lは0~12の整数を示す。] - 前記メソゲン構造は、メソゲン構造とエポキシ基とを有するエポキシ化合物に由来する構造単位を含む請求項1又は請求項2に記載のエポキシ樹脂。
- 前記エポキシ化合物は、前記エポキシ基を2個有する請求項3に記載のエポキシ樹脂。
- 前記エポキシ化合物は、下記一般式(2)で表されるエポキシ化合物を含む請求項3又は請求項4に記載のエポキシ樹脂。
[一般式(2)中、Xは、単結合又は下記2価の基からなる群(I)より選択される少なくとも1種の連結基を示し、Yは、それぞれ独立に、炭素数1~8の脂肪族炭化水素基、炭素数1~8の脂肪族アルコキシ基、フッ素原子、塩素原子、臭素原子、ヨウ素原子、シアノ基、ニトロ基、又はアセチル基を示し、nは、各々独立に0~4の整数を示す。]
[2価の基からなる群(I)中、Yはそれぞれ独立に、炭素数1~8の脂肪族炭化水素基、炭素数1~8の脂肪族アルコキシ基、フッ素原子、塩素原子、臭素原子、ヨウ素原子、シアノ基、ニトロ基、又はアセチル基を示し、nは、各々独立に0~4の整数を示し、kは、0~7の整数を示し、mは、0~8の整数を示し、lは0~12の整数を示す。] - 前記シロキサン構造は、エポキシ基と反応可能な官能基を有するシロキサン化合物に由来する構造単位を含む請求項1~請求項5のいずれか1項に記載のエポキシ樹脂。
- 前記シロキサン化合物は、前記官能基を2個有する請求項6に記載のエポキシ樹脂。
- 前記シロキサン化合物は、重量平均分子量(Mw)が200~5000である請求項6~請求項8のいずれか1項に記載のエポキシ樹脂。
- 前記メソゲン構造と前記シロキサン構造との比率(メソゲン構造:シロキサン構造)が、質量基準で、10:1~10:30である請求項1~請求項9のいずれか1項に記載のエポキシ樹脂。
- 液晶相を示す請求項1~請求項10のいずれか1項に記載のエポキシ樹脂。
- 請求項1~請求項11のいずれか1項に記載のエポキシ樹脂と、硬化剤とを含有するエポキシ樹脂組成物。
- フィラーをさらに含有する請求項12に記載のエポキシ樹脂組成物。
- 前記フィラーの含有率が、エポキシ樹脂組成物の全固形分の全体に対して、45体積%~90体積%である、請求項13に記載のエポキシ樹脂組成物。
- 高次構造を形成可能な請求項12~請求項14のいずれか1項に記載のエポキシ樹脂組成物。
- 請求項12~請求項15のいずれか1項に記載のエポキシ樹脂組成物を含む樹脂組成物層を有する樹脂シート。
- 請求項12~請求項15のいずれか1項に記載のエポキシ樹脂組成物の半硬化物を含む半硬化樹脂組成物層を有するBステージシート。
- 前記半硬化樹脂組成物層が、高次構造を含む請求項17に記載のBステージシート。
- 請求項12~請求項15のいずれか1項に記載のエポキシ樹脂組成物の硬化物を含む硬化樹脂組成物層を有するCステージシート。
- 前記硬化樹脂組成物層が、高次構造を含む請求項19に記載のCステージシート。
- 請求項12~請求項15のいずれか1項に記載のエポキシ樹脂組成物の硬化物。
- 高次構造を含む請求項21に記載の硬化物。
- 金属箔と、前記金属箔上に配置される請求項12~請求項15のいずれか1項に記載のエポキシ樹脂組成物の半硬化物を含む半硬化樹脂組成物層と、を備える樹脂付金属箔。
- 金属支持体と、前記金属支持体上に配置される請求項12~請求項15のいずれか1項に記載のエポキシ樹脂組成物の硬化物を含む硬化樹脂組成物層と、前記硬化樹脂組成物層上に配置される金属箔と、を備える金属基板。
- 金属板、はんだ層及び半導体チップをこの順に有する半導体モジュールと、放熱部材と、前記半導体モジュールの前記金属板と前記放熱部材との間に配置される請求項12~請求項15のいずれか1項に記載のエポキシ樹脂組成物の硬化物を含む硬化樹脂組成物層と、を備えるパワー半導体装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2018/010347 WO2019176074A1 (ja) | 2018-03-15 | 2018-03-15 | エポキシ樹脂、エポキシ樹脂組成物、樹脂シート、bステージシート、cステージシート、硬化物、樹脂付金属箔、金属基板、及びパワー半導体装置 |
KR1020207026226A KR102539817B1 (ko) | 2018-03-15 | 2018-03-15 | 에폭시 수지, 에폭시 수지 조성물, 수지 시트, b 스테이지 시트, c 스테이지 시트, 경화물, 수지가 부착된 금속박, 금속 기판, 및 파워 반도체 장치 |
JP2020506071A JP7115538B2 (ja) | 2018-03-15 | 2018-03-15 | エポキシ樹脂、エポキシ樹脂組成物、樹脂シート、bステージシート、cステージシート、硬化物、樹脂付金属箔、金属基板、及びパワー半導体装置 |
US16/980,652 US11795293B2 (en) | 2018-03-15 | 2018-03-15 | Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device |
EP18909808.0A EP3766911A4 (en) | 2018-03-15 | 2018-03-15 | EPOXY RESIN, EPOXY RESIN COMPOSITION, RESIN FOIL, B-PHASE FOIL, C-PHASE FOIL, CURED PRODUCT, METAL FOIL WITH RESIN, METAL SUBSTRATE AND POWER SEMICONDUCTOR COMPONENT |
TW108108697A TW201938627A (zh) | 2018-03-15 | 2019-03-14 | 環氧樹脂、環氧樹脂組成物、樹脂片、b階片、c階片、硬化物、帶樹脂金屬箔、金屬基板及功率半導體裝置 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021091814A (ja) * | 2019-12-11 | 2021-06-17 | 味の素株式会社 | 樹脂組成物 |
WO2021206038A1 (ja) * | 2020-04-08 | 2021-10-14 | 三菱ケミカル株式会社 | 樹脂組成物層の製造方法、該製造方法で得られた樹脂組成物層及び該樹脂組成物層を含む複合成形体 |
WO2022191328A1 (ja) * | 2021-03-12 | 2022-09-15 | 株式会社カネカ | フィルムおよびその製造方法、積層フィルム、ならびにディスプレイ |
WO2023074236A1 (ja) | 2021-10-29 | 2023-05-04 | 信越化学工業株式会社 | ポリオルガノシロキサン及びその製造方法 |
JP7493178B2 (ja) | 2020-05-13 | 2024-05-31 | パナソニックIpマネジメント株式会社 | 樹脂シートの製造方法、及び金属張積層板の製造方法 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5138010A (en) * | 1990-06-25 | 1992-08-11 | University Of Colorado Foundation, Inc. | Fast switching polysiloxane ferroelectric liquid crystals |
JPH09118673A (ja) * | 1995-08-03 | 1997-05-06 | Cornell Res Found Inc | 液晶エポキシモノマーおよび液晶エポキシ樹脂 |
JP3759208B2 (ja) | 1995-08-24 | 2006-03-22 | キンセイマテック株式会社 | アルミナ粒子の製造方法 |
JP4118691B2 (ja) | 2001-05-18 | 2008-07-16 | 株式会社日立製作所 | 熱硬化性樹脂硬化物 |
JP2008214599A (ja) * | 2007-02-05 | 2008-09-18 | Asahi Kasei Corp | 液晶性エポキシ樹脂およびその組成物 |
JP4619770B2 (ja) | 2003-12-24 | 2011-01-26 | 住友化学株式会社 | エポキシ化合物および該エポキシ化合物を硬化せしめてなるエポキシ樹脂硬化物 |
JP2011084557A (ja) | 2009-09-17 | 2011-04-28 | Sumitomo Chemical Co Ltd | ジエポキシ化合物、該化合物を含む組成物及び該組成物を硬化して得られる硬化物 |
JP2011098952A (ja) | 2009-10-06 | 2011-05-19 | Sumitomo Chemical Co Ltd | ジエポキシ化合物の製造方法 |
WO2013065159A1 (ja) | 2011-11-02 | 2013-05-10 | 日立化成株式会社 | 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板及びプリント配線板 |
JP5471975B2 (ja) | 2009-09-03 | 2014-04-16 | 住友化学株式会社 | ジエポキシ化合物、該化合物を含む組成物及び該組成物を硬化して得られる硬化物 |
JP2015048400A (ja) * | 2013-08-30 | 2015-03-16 | 学校法人 関西大学 | エポキシ樹脂、エポキシ樹脂組成物およびエポキシ樹脂の製造方法 |
JP2018003008A (ja) * | 2016-06-23 | 2018-01-11 | ニッタ株式会社 | 感温性樹脂、感温性粘着剤および感温性粘着剤組成物 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070116938A1 (en) * | 2004-03-09 | 2007-05-24 | Masayuki Tobita | Polymer composite formed article, printed wiring board using the formed article, and methods of producing them |
JP4678450B2 (ja) | 2008-01-30 | 2011-04-27 | Jsr株式会社 | 液晶配向剤、液晶配向膜および液晶表示素子 |
JP5495799B2 (ja) * | 2008-02-15 | 2014-05-21 | 旭化成イーマテリアルズ株式会社 | 樹脂組成物 |
WO2011040416A1 (ja) * | 2009-09-29 | 2011-04-07 | 日立化成工業株式会社 | 樹脂組成物、樹脂シート、ならびに、樹脂硬化物およびその製造方法 |
US20120244351A1 (en) * | 2009-09-29 | 2012-09-27 | Hideyuki Katagi | Multilayer resin sheet and method for producing the same, method for producing cured multilayer resin sheet, and highly thermally conductive resin sheet laminate and method for producing the same |
CN103189418B (zh) | 2010-08-06 | 2015-08-12 | 日立化成株式会社 | 相容性树脂的制造方法、热固化性树脂组合物、预浸料及层叠板 |
JP5659783B2 (ja) * | 2010-12-27 | 2015-01-28 | 宇部興産株式会社 | フレキシブル配線板の実装方法及びポリイミドシロキサン樹脂組成物 |
JP6119610B2 (ja) * | 2011-11-02 | 2017-04-26 | 日立化成株式会社 | エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、樹脂シート、プリプレグ、積層板、金属基板、配線板、半硬化エポキシ樹脂組成物の製造方法及び硬化エポキシ樹脂組成物の製造方法 |
JP6309898B2 (ja) * | 2012-01-16 | 2018-04-11 | ダウ シリコーンズ コーポレーション | 光学物品及び形成方法 |
KR20140098706A (ko) * | 2013-01-31 | 2014-08-08 | 닛토덴코 가부시키가이샤 | 에폭시 조성물 및 에폭시 수지 성형품 |
WO2015148318A1 (en) * | 2014-03-27 | 2015-10-01 | 3M Innovative Properties Company | Filled polydiorganosiloxane-containing compositions, and methods of using same |
JP6375140B2 (ja) * | 2014-04-30 | 2018-08-15 | 日東電工株式会社 | 熱伝導性ポリマー組成物及び熱伝導性成形体 |
EP2960713B1 (en) * | 2014-06-27 | 2017-06-28 | LG Electronics Inc. | Backlight unit and display device having the same |
KR101581762B1 (ko) * | 2014-06-27 | 2016-01-04 | 엘지전자 주식회사 | 백라이트유닛 및 이를 구비하는 디스플레이 장치 |
EP3283294A1 (en) * | 2015-04-16 | 2018-02-21 | 3M Innovative Properties Company | Quantum dot article with thiol-epoxy matrix |
US11840600B2 (en) * | 2017-08-30 | 2023-12-12 | Resonac Corporation | Cured epoxy resin material, epoxy resin composition, molded article, and composite material |
-
2018
- 2018-03-15 WO PCT/JP2018/010347 patent/WO2019176074A1/ja active Application Filing
- 2018-03-15 US US16/980,652 patent/US11795293B2/en active Active
- 2018-03-15 KR KR1020207026226A patent/KR102539817B1/ko active IP Right Grant
- 2018-03-15 EP EP18909808.0A patent/EP3766911A4/en active Pending
- 2018-03-15 JP JP2020506071A patent/JP7115538B2/ja active Active
-
2019
- 2019-03-14 TW TW108108697A patent/TW201938627A/zh unknown
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5138010A (en) * | 1990-06-25 | 1992-08-11 | University Of Colorado Foundation, Inc. | Fast switching polysiloxane ferroelectric liquid crystals |
JPH09118673A (ja) * | 1995-08-03 | 1997-05-06 | Cornell Res Found Inc | 液晶エポキシモノマーおよび液晶エポキシ樹脂 |
JP3759208B2 (ja) | 1995-08-24 | 2006-03-22 | キンセイマテック株式会社 | アルミナ粒子の製造方法 |
JP4118691B2 (ja) | 2001-05-18 | 2008-07-16 | 株式会社日立製作所 | 熱硬化性樹脂硬化物 |
JP4619770B2 (ja) | 2003-12-24 | 2011-01-26 | 住友化学株式会社 | エポキシ化合物および該エポキシ化合物を硬化せしめてなるエポキシ樹脂硬化物 |
JP2008214599A (ja) * | 2007-02-05 | 2008-09-18 | Asahi Kasei Corp | 液晶性エポキシ樹脂およびその組成物 |
JP5471975B2 (ja) | 2009-09-03 | 2014-04-16 | 住友化学株式会社 | ジエポキシ化合物、該化合物を含む組成物及び該組成物を硬化して得られる硬化物 |
JP2011084557A (ja) | 2009-09-17 | 2011-04-28 | Sumitomo Chemical Co Ltd | ジエポキシ化合物、該化合物を含む組成物及び該組成物を硬化して得られる硬化物 |
JP2011098952A (ja) | 2009-10-06 | 2011-05-19 | Sumitomo Chemical Co Ltd | ジエポキシ化合物の製造方法 |
WO2013065159A1 (ja) | 2011-11-02 | 2013-05-10 | 日立化成株式会社 | 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板及びプリント配線板 |
JP2015048400A (ja) * | 2013-08-30 | 2015-03-16 | 学校法人 関西大学 | エポキシ樹脂、エポキシ樹脂組成物およびエポキシ樹脂の製造方法 |
JP2018003008A (ja) * | 2016-06-23 | 2018-01-11 | ニッタ株式会社 | 感温性樹脂、感温性粘着剤および感温性粘着剤組成物 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021091814A (ja) * | 2019-12-11 | 2021-06-17 | 味の素株式会社 | 樹脂組成物 |
JP7298466B2 (ja) | 2019-12-11 | 2023-06-27 | 味の素株式会社 | 樹脂組成物 |
WO2021206038A1 (ja) * | 2020-04-08 | 2021-10-14 | 三菱ケミカル株式会社 | 樹脂組成物層の製造方法、該製造方法で得られた樹脂組成物層及び該樹脂組成物層を含む複合成形体 |
JP7493178B2 (ja) | 2020-05-13 | 2024-05-31 | パナソニックIpマネジメント株式会社 | 樹脂シートの製造方法、及び金属張積層板の製造方法 |
WO2022191328A1 (ja) * | 2021-03-12 | 2022-09-15 | 株式会社カネカ | フィルムおよびその製造方法、積層フィルム、ならびにディスプレイ |
WO2023074236A1 (ja) | 2021-10-29 | 2023-05-04 | 信越化学工業株式会社 | ポリオルガノシロキサン及びその製造方法 |
KR20240089068A (ko) | 2021-10-29 | 2024-06-20 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 폴리오가노실록산 및 그의 제조방법 |
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JP7115538B2 (ja) | 2022-08-09 |
EP3766911A4 (en) | 2021-03-10 |
KR20200132869A (ko) | 2020-11-25 |
KR102539817B1 (ko) | 2023-06-07 |
JPWO2019176074A1 (ja) | 2021-04-08 |
EP3766911A1 (en) | 2021-01-20 |
TW201938627A (zh) | 2019-10-01 |
US20210016546A1 (en) | 2021-01-21 |
US11795293B2 (en) | 2023-10-24 |
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