WO2019174062A1 - 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法 - Google Patents

电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法 Download PDF

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Publication number
WO2019174062A1
WO2019174062A1 PCT/CN2018/079966 CN2018079966W WO2019174062A1 WO 2019174062 A1 WO2019174062 A1 WO 2019174062A1 CN 2018079966 W CN2018079966 W CN 2018079966W WO 2019174062 A1 WO2019174062 A1 WO 2019174062A1
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Prior art keywords
layer
shielding
shielding layer
film
film layer
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PCT/CN2018/079966
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English (en)
French (fr)
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苏陟
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广州方邦电子股份有限公司
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Priority to US16/067,315 priority Critical patent/US11272646B2/en
Priority to KR1020187021668A priority patent/KR102098965B1/ko
Priority to JP2019543812A priority patent/JP2020516052A/ja
Publication of WO2019174062A1 publication Critical patent/WO2019174062A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

Definitions

  • the invention relates to the field of electronics, and in particular to a method for preparing an electromagnetic shielding film, a circuit board and an electromagnetic shielding film.
  • Electromagnetic Interference Shielding With the integration of functions such as mobile phones, the internal components are rapidly high-speed and high-speed. For example, in addition to the original audio transmission function, the camera function has become a necessary function, and WLAN (Wireless Local Area Networks) GPS (Global Positioning System) and Internet access functions have become popular, and with the integration of future sensing components, the trend of high-speed and high-speed components is even more inevitable. Under the drive of high frequency and high speed. The induced electromagnetic interference inside and outside the component, the attenuation of the signal during transmission, and the insertion loss and jitter problems are becoming more serious.
  • EMI Shielding Electromagnetic Interference Shielding
  • the shielding film commonly used in existing circuit boards includes a shielding layer and a film layer, wherein the shielding layer mainly forms a rough surface on the flat metal surface, and the rough surface is used to pierce the film layer during pressing, thereby Contact with the formation of the board.
  • the shield layer is grounded by the rough surface to pierce the film layer and the ground layer of the circuit board during pressing. Because during the pressing process, only the concave portion of the rough surface of the shielding layer can hold the rubber, the amount of the adhesive is small, and the explosion phenomenon is easily caused, thereby causing the grounding failure, and the interference charge cannot be derived.
  • the object of the embodiments of the present invention is to provide a method for preparing an electromagnetic shielding film, a circuit board and an electromagnetic shielding film, which can effectively solve the problem that the amount of glue in the prior art is insufficient, and the puncture force of the high-temperature blasting phenomenon is strong, and the peeling strength is high. There will be no blasting.
  • an embodiment of the present invention provides an electromagnetic shielding film including a shielding layer and a film layer, the shielding layer including opposing first and second surfaces; and the second surface is undulating non-flat a surface of the undulating non-flat surface is further formed with convex conductor particles; and the second surface of the shielding layer is provided with the film layer.
  • the conductor particles have a height of from 0.1 ⁇ m to 30 ⁇ m.
  • the thickness of the shielding layer is from 0.1 ⁇ m to 45 ⁇ m, and the thickness of the film layer is from 1 ⁇ m to 80 ⁇ m.
  • the undulating non-flat surface of the shield layer includes a plurality of protrusions and recesses; and the conductor particles are concentratedly distributed on the protrusions.
  • the film layer includes an adhesive layer containing conductive particles.
  • the film layer includes an adhesive layer containing no conductive particles.
  • the shielding layer includes one or more of a metal shielding layer, a carbon nanotube shielding layer, a ferrite shielding layer, and a graphene shielding layer.
  • the metal shielding layer comprises a single metal shielding layer and/or an alloy shielding layer; wherein the single metal shielding layer is made of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and It is made of any one of gold materials made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold.
  • the electromagnetic shielding film further includes a protective film layer, and the first surface of the shielding layer is formed with the protective film layer.
  • the electromagnetic shielding film provided by the embodiment of the present invention has a second surface of the shielding layer which is an undulating non-flat surface, and a convex conductor particle is formed on the undulating non-flat surface.
  • the shielding layer can be smoothly pierced through the film layer during the pressing process, and has the advantages of reliable grounding and strong practicability.
  • the present invention further provides a circuit board, comprising: a printed circuit board and the electromagnetic shielding film according to any one of the above, wherein the electromagnetic shielding film is pressed with the printed circuit board through a film layer thereof; Conductor particles on the second surface of the shielding layer pierce the film layer and extend to the formation of the printed wiring board.
  • the circuit board provided by the embodiment of the present invention adopts the electromagnetic shielding film according to any one of the above, the rubber film of the electromagnetic shielding film will be glued during the pressing process.
  • the amount of the adhesive is increased, and the blasting phenomenon is not easy to occur; at the same time, the undulating non-flat surface has a certain height of the conductor particles, and the shielding layer can be ensured during the pressing process. Smooth piercing of the film layer for reliable grounding and practicality.
  • the embodiment of the invention further provides a method for preparing an electromagnetic shielding film, comprising the steps of:
  • shielding layer comprises an opposite first surface and a second surface, the second surface is an undulating non-flat surface
  • the shield layer is formed in the following manner in step S1:
  • forming the shielding layer on the protective film layer/the peelable layer with the carrier is specifically:
  • a shielding layer on the flat surface or non-flat surface of the protective film layer/carrier-attached peelable layer by physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating, and Surface treatment of the shielding layer by one or more processes in mixed plating; or
  • a shielding layer having a certain degree of undulation is formed on the non-flat surface of the protective film layer/carrier-attached peelable layer.
  • step S2 the forming of the conductor particles on the undulating non-flat surface of the shielding layer is specifically:
  • Conductor particles are formed on the undulating non-flat surface of the shield layer by one or more processes of physical buffing, electroless plating, physical vapor deposition, chemical vapor deposition, evaporative plating, sputter plating, electroplating, and hybrid plating.
  • forming a film layer on the second surface of the shielding layer in the step S3 is specifically:
  • a film layer is directly coated on the second surface of the shielding layer to form the film layer on the second surface of the shielding layer.
  • the electromagnetic shielding film provided by the embodiment of the present invention is formed by forming conductor particles on the undulating non-flat surface of the shielding layer, and then forming a film on the second surface of the shielding layer.
  • the layer can form the electromagnetic shielding film according to any one of the above items, and the undulating non-flat surface has a certain height of the conductor particles, which can ensure the shielding layer penetrates the film layer smoothly during the pressing process, thereby realizing reliable grounding and practical Strong.
  • Figure 1 is a schematic view showing the structure of an electromagnetic shielding film in Embodiment 1 of the present invention.
  • Fig. 2 is a schematic view showing the structure of another electromagnetic shielding film in the first embodiment of the present invention.
  • Embodiment 3 is a schematic view showing the structure of an electromagnetic shielding film in Embodiment 2 of the present invention.
  • FIG. 4 is a schematic structural view of a circuit board in Embodiment 3 of the present invention.
  • Figure 5 is an electron micrograph of a circuit board in Embodiment 3 of the present invention.
  • Figure 6 is an electron micrograph of another circuit board in Embodiment 3 of the present invention.
  • Figure 7 is a schematic structural view of a circuit board in Embodiment 4 of the present invention.
  • Figure 8 is an electron micrograph of a circuit board in Embodiment 4 of the present invention.
  • Figure 9 is an electron micrograph of another circuit board in Embodiment 4 of the present invention.
  • FIG. 10 is a schematic flow chart of a method for preparing an electromagnetic shielding film according to Embodiment 5 of the present invention.
  • Embodiment 1 is a schematic structural view of an electromagnetic shielding film according to Embodiment 1 of the present invention.
  • the electromagnetic shielding film comprises a shielding layer 1 and a film layer 2, the shielding layer 1 includes opposing first surface 11 and second surface 12; the second surface 12 is undulating non-flat surface a surface of the undulating non-flat surface 12 is further formed with convex conductor particles 121; the second surface 12 of the shielding layer is provided with the film layer 2; the film layer 2 comprises no conductive particles Adhesive layer.
  • the shield layer 1 may be formed first, and then the conductor particles 121 may be formed on the second surface 12 of the shield layer 1 by other processes.
  • the shield layer 1 and the conductor particles 121 may be a unitary structure formed by a single molding process.
  • the conductor particles 121 may exist at a certain distance from the outer surface of the film layer 2, or may contact the outer surface of the film layer 2 or extend out of the outer surface of the film layer 2.
  • the outer surface of the film layer 2 may be a flat surface without undulations, or may be a undulating uneven surface.
  • the first surface 11 of the shielding layer 1 may be any shape surface, for example, may be a flat surface, or may be an undulating non-flat surface as shown in FIG. 1 that cooperates with the second surface 12, Or other rough surfaces.
  • the drawings of the present invention are exemplified only by the undulating non-flat surfaces of the first surface 11 and the second surface 12, and any other shape of the first surface is within the scope of the present invention.
  • the shape of the conductor particles 121 shown in FIG. 1 is merely exemplary, and the conductor particles 121 may also be cluster-shaped, ice-hanging, stalactite-like, due to differences in process means and parameters. Other shapes such as dendrites. Further, the conductor particles 121 in the present invention are not limited by the drawings and the above-described shapes, and any conductor particles having a puncture and a conductive function are all within the scope of the present invention.
  • the second surface 12 is an undulating non-flat surface, including a plurality of convex portions 123 and concave portions 122.
  • the conductive particles 121 are preferably distributed on the convex portions 122, and the shielding layer 1 is pressed. It is easier to pierce the film layer 2 during the process, thereby achieving a more reliable grounding and improving the quality of the electromagnetic shielding.
  • the film layer 2 will press the glue at the conductor particles 121 of the convex portion 122 of the second surface during the pressing process.
  • the amount of glue is prevented from being small, which is easy to cause a blasting phenomenon, thereby causing a grounding failure phenomenon; at the same time, the undulating non-flat surface has a certain height of the conductor particles 121, which can be in the squeezing process.
  • the shielding layer 1 is ensured to pierce the film layer 2 smoothly, and the utility model is strong.
  • the adhesive film layer 2 is an adhesive layer containing no conductive particles, thereby reducing the insertion loss of the circuit board during use, improving the shielding performance and improving the bending property of the circuit board.
  • the conductor particles 121 have a height of 0.1 ⁇ m to 30 ⁇ m.
  • the shielding layer 1 has a thickness of 0.1 ⁇ m to 45 ⁇ m, and the adhesive film layer 2 has a thickness of 1 ⁇ m to 80 ⁇ m.
  • the material used for the film layer 2 is selected from the group consisting of modified epoxy resins, acrylic resins, modified rubbers, and modified thermoplastic polyimides. It can be understood that, in order to ensure that the shielding layer 1 has good electrical conductivity, the shielding layer 1 comprises one or more of a metal shielding layer, a carbon nanotube shielding layer, a ferrite shielding layer and a graphene shielding layer. .
  • the metal shielding layer comprises a single metal shielding layer and/or an alloy shielding layer; wherein the single metal shielding layer is made of any of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
  • a material is made of the alloy shielding layer made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold.
  • the thickness of the shielding layer 1 is the distance D1 between the highest point of the first surface 11 of the shielding layer 1 and the lowest point of the second surface.
  • the thickness of the film layer 2 is the distance D2 between the highest point and the lowest point of the film layer 2.
  • the undulation of the second surface ie, the distance between the highest point and the lowest point of the second surface
  • the undulation of the second surface is set within the above range to enhance shielding
  • the puncture function of the layer ensures that the interfering charge in the shielding layer 1 is smoothly introduced into the ground, and the accumulation of interfering charges is avoided to form an interference source.
  • the thickness of the film layer and the sum of the undulation of the second surface and the height of the conductor particles satisfy a proportional relationship of 0.5 to 2 to ensure sufficient puncture strength and capacity, specifically embodied as
  • the sum of the thickness of the film layer relative to the undulation of the second surface and the height of the conductor particles is too small, so that the amount of glue is insufficient to cause a blasting phenomenon, and on the other hand, the undulation of the second surface is prevented.
  • the sum of the heights of the conductor particles and the thickness of the film layer is too small to cause insufficient puncture strength to cause a grounding failure phenomenon.
  • the conductor particles 121 include one or more of metal particles, carbon nanotube particles, and ferrite particles. Further, the metal particles include single metal particles and/or alloy particles; wherein the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold. The alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold. It should be noted that the conductor particles 121 may be the same as or different from the material of the shielding layer 1.
  • the electromagnetic shielding film further includes a protective film layer, and the protective layer is provided on a side of the shielding layer 1 adjacent to the first surface 11.
  • the protective film layer serves as a protection to ensure that the shielding layer 1 is not scratched and damaged during use, and the shielding effectiveness of the shielding layer 1 is maintained.
  • the protective film layer comprises a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed by curing the epoxy resin ink, a film layer formed by curing the polyurethane ink, and a modified acrylic resin.
  • the shielding layer of the drawing of the embodiment may be a single layer structure or a multilayer structure.
  • the shielding layer of the drawing of the present embodiment may be arranged in a grid shape, a foamed shape or the like according to actual production and application requirements.
  • FIG. 3 is a schematic structural diagram of an electromagnetic shielding film according to Embodiment 2 of the present invention.
  • the electromagnetic shielding film includes a shielding layer 1 and a film layer 2, the shielding layer 1 includes opposing first surface 11 and second surface 12; the second surface 12 is undulating non-flat surface a surface of the undulating non-flat surface 12 is further formed with convex conductor particles 121; the second surface 12 of the shielding layer 1 is provided with the film layer 2, and the film layer 2 comprises conductive particles 21 adhesive layer.
  • the shield layer 1 may be formed first, and then the conductor particles 121 may be formed on the second surface 12 of the shield layer 1 by other processes.
  • the shield layer 1 and the conductor particles 121 may be a unitary structure formed by a single molding process.
  • the conductor particles 121 may exist at a certain distance from the outer surface of the film layer 2, or may contact the outer surface of the film layer 2 or protrude from the outer surface of the film layer 2.
  • the outer surface of the film layer 2 may be a flat surface without undulations, or may be a undulating uneven surface.
  • the first surface 11 may be any shape of surface, for example, may be a flat surface, or may be an undulating non-flat surface matching the second surface 12 as shown in FIG. 3, or other rough surface. .
  • the drawings of the present invention are exemplified only by the undulating non-flat surfaces of the first surface 11 and the second surface 12, and any other shape of the first surface is within the scope of the present invention.
  • the shape of the conductor particles 121 as shown in FIG. 3 is merely exemplary, and the conductor particles 121 may also be cluster-shaped, ice-hanging, stalactite-like, due to differences in process means and parameters. Other shapes such as dendrites. Further, the conductor particles 121 in the present invention are not limited by the drawings and the above-described shapes, and any conductor particles having a puncture and a conductive function are within the scope of the present invention.
  • the undulating non-flat surface comprises a plurality of protrusions 122 and recesses 123; the conductor particles 121 are preferably distributed on the protrusions 122, and the shielding layer 1 is further pressed during the pressing process. It is easy to pierce the film layer 2, thereby achieving grounding and improving the quality of the electromagnetic shielding.
  • the conductive particles 21 may be conductive particles 21 separated from each other, or may be a large particle conductive particles 21 agglomerated; when the conductive particles 21 are conductive particles 21 separated from each other, the conductive particles 21 may be further improved.
  • the area of electrical contact increases the uniformity of electrical contact; and when the conductive particles 21 are agglomerated large-particle conductive particles 21, the puncture strength can be increased.
  • the adhesive film layer 2 of the electromagnetic shielding film provided in the embodiment includes an adhesive layer containing the conductive particles 21, and the conductive particles 21 and the undulating non-flat surface 12 are convex.
  • the conductor particles 121 cooperate with the puncture film layer 2, which cooperates with the shielding layer 1 to achieve a more reliable piercing grounding, which quickly introduces disturbing charges into the formation of the wiring board.
  • the conductor particles 121 have a height of 0.1 ⁇ m to 30 ⁇ m.
  • the shielding layer 1 has a thickness of 0.1 ⁇ m to 45 ⁇ m
  • the adhesive film layer 2 has a thickness of 1 ⁇ m to 80 ⁇ m.
  • the material used for the film layer 2 is selected from the group consisting of modified epoxy resins, acrylic resins, modified rubbers, and modified thermoplastic polyimides.
  • the thickness of the shielding layer 1 is the distance between the highest point of the first surface 11 of the shielding layer 1 and the lowest point of the second surface, and the thickness of the film layer 2 is the glue. The distance between the highest point and the lowest point of the film layer 2.
  • the shielding layer 1 includes one or more of a metal shielding layer, a carbon nanotube shielding layer, a ferrite shielding layer, and a graphene shielding layer.
  • the metal shielding layer is a single metal shielding layer and/or an alloy shielding layer; wherein the single metal shielding layer is made of any of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
  • a material is made of the alloy shielding layer made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold.
  • the undulation of the second surface ie, the distance between the highest point and the lowest point of the second surface
  • the undulation of the second surface is set within the above range to enhance shielding
  • the puncture function of the layer ensures that the interfering charge in the shielding layer 1 is smoothly introduced into the ground, and the accumulation of interfering charges is avoided to form an interference source.
  • the thickness of the film layer and the sum of the undulation of the second surface and the height of the conductor particles satisfy a proportional relationship of 0.5 to 2 to ensure sufficient puncture strength and capacity, specifically embodied as
  • the sum of the thickness of the film layer relative to the undulation of the second surface and the height of the conductor particles is too small, so that the amount of glue is insufficient to cause a blasting phenomenon, and on the other hand, the undulation of the second surface is prevented.
  • the sum of the heights of the conductor particles and the thickness of the film layer is too small to cause insufficient puncture strength to cause a grounding failure phenomenon.
  • the conductor particles 121 include one or more of metal particles, carbon nanotube particles, and ferrite particles. Further, the metal particles include single metal particles and/or alloy particles; wherein the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold. The alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold. It should be noted that the conductor particles 121 may be the same as or different from the material of the shielding layer 1.
  • the electromagnetic shielding film further comprises a protective film layer
  • the protective film layer is located on a side of the shielding layer 1 close to the first surface 11, the protective film layer serves as a protection to ensure the shielding Layer 1 is not scratched and damaged during use, maintaining high shielding effectiveness of shield layer 1.
  • the protective film layer comprises a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed by curing the epoxy resin ink, a film layer formed by curing the polyurethane ink, and a modified acrylic resin.
  • the shielding layer of the drawing of the embodiment may be a single layer structure or a multilayer structure.
  • the shielding layer of the drawing of the present embodiment may be arranged in a grid shape, a foamed shape or the like according to actual production and application requirements.
  • the circuit board includes a printed circuit board 3 and an electromagnetic shielding film
  • the electromagnetic shielding film includes a shielding layer 1 and a film layer 2
  • the shielding layer 1 includes opposing first surface 11 and second surface 12
  • the second surface 12 is an undulating non-flat surface
  • the undulating non-flat surface 12 is further formed with a convex shape
  • Conductor particles 121 the second surface 12 of the shielding layer 1 is provided with a film layer 2
  • the film layer 2 comprises an adhesive layer containing no conductive particles
  • the electromagnetic shielding film passes through the film layer 2
  • the printed wiring board 3 is pressed in phase; the conductor particles 121 on the second surface 12 of the shielding layer 1 pierce the film layer 2 and extend to the ground layer of the printed wiring board 3.
  • the shield layer 1 may be formed first, and then the conductor particles 121 may be formed on the second surface 12 of the shield layer 1 by other processes.
  • the shield layer 1 and the conductor particles 121 may be a unitary structure formed by a single molding process.
  • the conductor particles 121 may exist at a certain distance from the outer surface of the film layer 2, or may contact the outer surface of the film layer 2 or protrude from the outer surface of the film layer 2.
  • the outer surface of the film layer 2 may be a flat surface without undulations, or may be a undulating uneven surface.
  • the first surface 11 may be any shape of surface, for example, may be a flat surface, or may be an undulating non-flat surface matching the second surface 12 as shown in FIG. 4, or other rough surface. .
  • the drawings of the present invention are exemplified only by the undulating non-flat surfaces of the first surface 11 and the second surface 12, and any other shape of the first surface is within the scope of the present invention.
  • the shape of the conductor particles 121 as shown in FIG. 4 is merely exemplary, and the conductor particles 121 may also be cluster-shaped, ice-hanging, stalactite-like or due to differences in process means and parameters. Other shapes such as dendrites. Further, the conductor particles 121 in the present invention are not limited by the drawings and the above-described shapes, and any conductor particles having a puncture and a conductive function are within the scope of the present invention.
  • the undulating non-flat surface comprises a plurality of protrusions 122 and recesses 123; the conductor particles 121 are preferably distributed on the protrusions 122, and the shielding layer 1 is further pressed during the pressing process. It is easy to pierce the film layer 2, thereby achieving more reliable grounding and improving the quality of the electromagnetic shielding.
  • the printed wiring board 3 is one of a flexible single-sided, a flexible double-sided, a flexible multilayer board, and a rigid-flex board.
  • the film layer 2 is pierced by the conductor particles 121 of the shielding layer 1 so that at least a portion of the second surface 12 and the ground layer of the printed wiring board 3 are connected, thereby The interference charge in the shielding layer 1 is introduced into the ground, and the accumulation of interference charges is avoided to form an interference source, which affects the normal operation of the circuit board.
  • the adhesive film layer 2 is an adhesive layer containing no conductive particles, thereby reducing the insertion loss of the circuit board during use, improving the shielding performance and improving the bending property of the circuit board.
  • the conductor particles 121 have a height of 0.1 ⁇ m to 30 ⁇ m.
  • the shielding layer 1 has a thickness of 0.1 ⁇ m to 45 ⁇ m, and the adhesive film layer 2 has a thickness of 1 ⁇ m to 80 ⁇ m.
  • the material used for the film layer 2 is selected from the group consisting of modified epoxy resins, acrylic resins, modified rubbers, and modified thermoplastic polyimides.
  • the shielding layer 1 includes one or more of a metal shielding layer, a carbon nanotube shielding layer, a ferrite shielding layer, and a graphene shielding layer.
  • the metal shielding layer comprises a single metal shielding layer and/or an alloy shielding layer; wherein the single metal shielding layer is made of any of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
  • a material is made of the alloy shielding layer made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold.
  • the alloy shield layer is made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold.
  • the thickness of the shielding layer 1 is the distance between the highest point of the first surface 11 of the shielding layer 1 and the lowest point of the second surface
  • the thickness of the film layer 2 is The distance between the highest point and the lowest point of the film layer 2 is described.
  • the undulation of the second surface ie, the distance between the highest point and the lowest point of the second surface
  • the undulation of the second surface is set within the above range to enhance shielding
  • the puncture function of the layer ensures that the interfering charge in the shielding layer 1 is smoothly introduced into the ground, and the accumulation of interfering charges is avoided to form an interference source.
  • FIG. 6 is an electron micrograph of another circuit board according to an embodiment of the present invention.
  • the second surface of the shielding layer in FIGS. 5 and 6 has different undulations, and the undulation of the second surface in FIG. 5 is greater than the undulation of the second surface in FIG.
  • conductor particles of a certain height are grown on the second surface of the shielding layer on both circuit boards, and the puncture strength can be enhanced to achieve reliable grounding.
  • the thickness of the film layer and the sum of the undulation of the second surface and the height of the conductor particles satisfy a proportional relationship of 0.5 to 2 to ensure sufficient puncture strength and capacity, specifically embodied as
  • the sum of the thickness of the film layer relative to the undulation of the second surface and the height of the conductor particles is too small, so that the amount of glue is insufficient to cause a blasting phenomenon, and on the other hand, the undulation of the second surface is prevented.
  • the sum of the heights of the conductor particles and the thickness of the film layer is too small to cause insufficient puncture strength to cause a grounding failure phenomenon.
  • the conductor particles 121 include one or more of metal particles, carbon nanotube particles, and ferrite particles. Further, the metal particles include single metal particles and/or alloy particles; wherein the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold. The alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold. It should be noted that the conductor particles 121 may be the same as or different from the material of the shielding layer 1.
  • the electromagnetic shielding film further includes a protective film layer
  • the protective film layer is located on a side of the shielding layer 1 adjacent to the first surface 11, the protective film layer and the first layer of the shielding layer 1
  • the surface 11 is adhered, and the protective film layer serves as a protection to ensure that the shielding layer 1 is not scratched and damaged during use, and the shielding effectiveness of the shielding layer 1 is maintained.
  • the protective film layer comprises a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed by curing the epoxy resin ink, a film layer formed by curing the polyurethane ink, and a modified acrylic resin.
  • the shielding layer of the drawing of the embodiment may be a single layer structure or a multilayer structure.
  • the shielding layer of the drawing of the present embodiment may be arranged in a grid shape, a foamed shape or the like according to actual production and application requirements.
  • FIG. 7 and FIG. 8 is a schematic structural view and an electron micrograph of a circuit board according to Embodiment 4 of the present invention
  • the circuit board includes a printed circuit board 3 and an electromagnetic shielding film
  • the electromagnetic shielding film includes a shielding layer 1 and a film layer 2
  • the shielding layer 1 includes opposing first surface 11 and second surface 12
  • the second surface 12 is an undulating non-flat surface
  • the undulating non-flat surface 12 is further formed with a convex shape
  • Conductor particles 121 the second surface 12 of the shielding layer 1 is provided with the film layer 2
  • the film layer 2 comprises an adhesive layer containing conductive particles 21
  • the electromagnetic shielding film passes through the film layer 2
  • the printed wiring board 3 is pressed together; the conductor particles 121 on the second surface 12 of the shielding layer 1 pierce the film layer 2 and extend to the ground layer of the printed wiring board 3.
  • the shield layer 1 may be formed first, and then the conductor particles 121 may be formed on the second surface 12 of the shield layer 1 by other processes.
  • the shield layer 1 and the conductor particles 121 may be a unitary structure formed by a single molding process.
  • the conductor particles 121 may exist at a certain distance from the outer surface of the film layer 2, or may contact the outer surface of the film layer 2 or protrude from the outer surface of the film layer 2.
  • the outer surface of the film layer 2 may be a flat surface without undulations, or may be a undulating uneven surface.
  • the first surface 11 may be any shape of surface, for example, may be a flat surface, or may be an undulating non-flat surface matching the second surface 12 as shown in FIG. 5, or other rough surface. .
  • the drawings of the present invention are exemplified only by the undulating non-flat surfaces of the first surface 11 and the second surface 12, and any other shape of the first surface is within the scope of the present invention.
  • the shape of the conductor particles 121 as shown in FIG. 7 is merely exemplary, and the conductor particles 121 may also be cluster-like, ice-hanging, stalactite-like, due to differences in process means and parameters. Other shapes such as dendrites. Further, the conductor particles 121 in the present invention are not limited by the drawings and the above-described shapes, and any conductor particles having a puncture and a conductive function are within the scope of the present invention.
  • the undulating non-flat surface comprises a plurality of protrusions 122 and recesses 123; the conductor particles 121 are preferably distributed on the protrusions 122, and the shielding layer 1 is further pressed during the pressing process. It is easy to pierce the film layer 2, thereby achieving more reliable grounding and improving the quality of the electromagnetic shielding.
  • the conductive particles 21 may be conductive particles separated from each other, or may be a large particle conductive particles agglomerated; when the conductive particles 21 are separated conductive particles, the electrical contact may be further improved. The area; and when the conductive particles 21 are agglomerated large-particle conductive particles, the puncture strength can be increased.
  • the printed wiring board 3 is one of a flexible single-sided, a flexible double-sided, a flexible multilayer board, and a rigid-flex board.
  • the film layer 2 is pierced by the conductor particles 121 of the shielding layer 1 during the pressing process, so that at least a portion of the second surface 12 is connected to the formation of the printed wiring board 3, thereby
  • the interference charge in the shielding layer 1 is introduced into the ground, and the accumulation of interference charges is avoided to form an interference source, which affects the normal operation of the circuit board.
  • the adhesive layer 2 of the electromagnetic shielding film is an adhesive layer containing the conductive particles 21, and the conductive particles 21 cooperate with the convex conductive particles 121 on the undulating non-flat surface 12 to pierce the adhesive layer. 2. It cooperates with the shielding layer 1 to achieve a more reliable piercing grounding, and the interference charge is quickly introduced into the formation of the wiring board.
  • the conductor particles 121 have a height of 0.1 ⁇ m to 30 ⁇ m.
  • the shielding layer 1 has a thickness of 0.1 ⁇ m to 45 ⁇ m, and the adhesive film layer 2 has a thickness of 1 ⁇ m to 80 ⁇ m.
  • the material used for the film layer 2 is selected from the group consisting of modified epoxy resins, acrylic resins, modified rubbers, and modified thermoplastic polyimides.
  • the shielding layer 1 includes one or more of a metal shielding layer, a carbon nanotube shielding layer, a ferrite shielding layer, and a graphene shielding layer.
  • the metal shielding layer is a single metal shielding layer and/or an alloy shielding layer; wherein the single metal shielding layer is made of any of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
  • a material is made of the alloy shielding layer made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold.
  • the thickness of the shielding layer 1 is the distance between the highest point of the first surface 11 of the shielding layer 1 and the lowest point of the second surface
  • the thickness of the film layer 2 is The distance between the highest point and the lowest point of the film layer 2 is described.
  • the undulation of the second surface ie, the distance between the highest point and the lowest point of the second surface
  • the undulation of the second surface is set within the above range to enhance shielding
  • the puncture function of the layer ensures that the interfering charge in the shielding layer 1 is smoothly introduced into the ground, and the accumulation of interfering charges is avoided to form an interference source.
  • FIG. 9 is an electron micrograph of another circuit board according to an embodiment of the present invention. As can be seen, the second surface of the shield layer of Figures 8 and 9 has different undulations, and the undulation of the second surface of Figure 8 is greater than the undulation of the second surface of Figure 9.
  • conductor particles of a certain height are grown on the second surface of the shielding layer on both circuit boards, and the puncture strength can be enhanced to achieve reliable grounding.
  • the thickness of the film layer and the sum of the undulation of the second surface and the height of the conductor particles satisfy a proportional relationship of 0.5 to 2 to ensure sufficient puncture strength and capacity, specifically embodied as
  • the sum of the thickness of the film layer relative to the undulation of the second surface and the height of the conductor particles is too small, so that the amount of glue is insufficient to cause a blasting phenomenon, and on the other hand, the undulation of the second surface is prevented.
  • the sum of the heights of the conductor particles and the thickness of the film layer is too small to cause insufficient puncture strength to cause a grounding failure phenomenon.
  • the conductor particles 121 include one or more of metal particles, carbon nanotube particles, or ferrite particles. Further, the metal particles include single metal particles and/or alloy particles; wherein the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold. The alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold. It should be noted that the conductor particles 121 may be the same as or different from the material of the shielding layer 1.
  • the electromagnetic shielding film further includes a protective film layer
  • the protective film layer is located on a side of the shielding layer 1 adjacent to the first surface 11, and the first surface 11 of the shielding layer 1 is provided with the
  • the protective film layer functions as a protective layer to ensure that the shielding layer 1 is not scratched and damaged during use, and the shielding effectiveness of the shielding layer 1 is maintained.
  • the protective film layer comprises a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed by curing the epoxy resin ink, a film layer formed by curing the polyurethane ink, and a modified acrylic resin.
  • the shielding layer of the drawing of the embodiment may be a single layer structure or a multilayer structure.
  • the shielding layer of the drawing of the present embodiment may be arranged in a grid shape, a foamed shape or the like according to actual production and application requirements.
  • FIG. 10 is a schematic flow chart of a method for preparing an electromagnetic shielding film according to Embodiment 5 of the present invention.
  • the method is applicable to the preparation of any of the above electromagnetic shielding films, including the steps:
  • shielding layer comprises an opposite first surface and a second surface, the second surface is an undulating non-flat surface
  • step S2 the undulation of the shielding layer is non-flattened by one or more processes of physical roughing, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, and sputtering plating, electroplating, and mixed plating.
  • the surface forms conductor particles.
  • step S3 in addition to directly coating a film layer on the second surface of the shielding layer to form a film layer on the second surface of the shielding layer, a film layer may also be coated on the release film. And then transferring the film laminate to the second surface of the shielding layer to form a film layer on the second surface of the shielding layer.
  • the shielding layer can be formed in the following two ways:
  • Mode (2) forming a shielding layer on a surface of the peelable layer with a carrier, forming a protective film layer on the surface of the shielding layer, and peeling off the peelable layer with the carrier; wherein, the first surface of the shielding layer Bonding to the protective film layer.
  • the second surface of the shielding layer may be an undulating non-flat surface by two ways:
  • Mode i forming a shielding layer on a flat surface or a non-flat surface of the protective film layer by physical roughing, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating, and mixed plating Surface treatment of the shielding layer by one or more processes;
  • the mode i When the mode i is employed, one or more of the above physical roughing, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating, and mixed plating are employed regardless of the surface state of the protective film layer. Performing a surface treatment on the shielding layer, wherein the second surface is an undulating non-flat surface;
  • Mode ii forming a shielding layer having a certain degree of undulation on the non-flat surface of the protective film layer;
  • the size and proportion of the filler can be controlled to control the degree of undulation of the protective film layer when preparing the protective film layer, so that the protective film layer has a certain degree of undulation of non-flat surface, and then the protective film layer A shielding layer is formed on the non-flat surface such that the shielding layer has a certain degree of undulation, and the second surface is an undulating non-flat surface.
  • the second surface of the shielding layer may be an undulating non-flat surface by two ways:
  • Mode iii forming a shielding layer on a flat surface or a non-flat surface of the peelable layer with a carrier by physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating, and mixing Surface treatment of the shielding layer by one or more processes in plating;
  • the mode iii is employed, regardless of the surface state of the peelable layer with the carrier, the above physical roughing, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating, and mixed plating are employed.
  • the surface of the shielding layer is surface treated by one or more processes, wherein the second surface is an undulating non-flat surface;
  • Mode iv forming a shielding layer having a certain degree of undulation on the non-flat surface of the peelable layer of the carrier;
  • the second surface is Rugged non-flat surface.
  • the embodiments of the present invention provide a method for preparing an electromagnetic shielding film, a circuit board, and an electromagnetic shielding film, wherein the electromagnetic shielding film includes a shielding layer and a film layer, and the shielding layer includes a relative a surface and a second surface, the second surface is an undulating non-flat surface, the undulating non-flat surface is further formed with convex conductor particles, and the second surface of the shielding layer is provided with the film a layer, wherein the film layer of the electromagnetic shielding film presses the glue substance into the concave portion of the second surface during the pressing process, the amount of glue is increased, and the explosion phenomenon is not easy to occur;
  • the non-flat surface has a certain height of conductor particles, which can ensure that the shielding layer penetrates the film layer smoothly during the pressing process, achieving reliable grounding and strong practicability.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
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  • Carbon And Carbon Compounds (AREA)
  • Adhesive Tapes (AREA)

Abstract

一种电磁屏蔽膜、包括所述电磁屏蔽膜的线路板以及电磁屏蔽膜的制备方法，其中，所述电磁屏蔽膜包括屏蔽层（1）和胶膜层（2），所述屏蔽层（1）包括相对的第一表面（11）和第二表面（12），所述第二表面（12）为起伏的非平整表面，所述起伏的非平整表面上还形成有凸状的导体颗粒（121），所述屏蔽层（1）的第二表面（12）设有所述胶膜层（2），则所述电磁屏蔽膜的胶膜层（2）在压合过程中会将胶类物质挤压到所述第二表面（12）的凹部（123）中，容胶量增大，不容易出现爆板现象；同时，起伏的非平整表面又有一定高度的导体颗粒（121），可在压合过程中保证屏蔽层（1）顺利刺穿胶膜层（2），实现可靠接地，实用性强。

Description

电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法 技术领域
本发明涉及电子领域，尤其涉及一种电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法。
背景技术
随着电子工业的迅速发展，电子产品进一步向小型化，轻量化，组装高密度化发展，极大地推动挠性电路板的发展，从而实现元件装置和导线连接一体化。挠性电路板可广泛应用于手机、液晶显示、通信和航天等行业。
在国际市场的推动下，功能挠性电路板在挠性电路板市场中占主导地位，而评价功能挠性电路板性能的一项重要指标是电磁屏蔽((Electromagnetic Interference Shielding，简称EMI Shielding)。随着手机等通讯设备功能的整合，其内部组件急剧高频高速化。例如：手机功能除了原有的音频传播功能外，照相功能已成为必要功能，且WLAN(Wireless Local Area Networks，无线局域网)、GPS(Global Positioning System，全球定位系统)以及上网功能已普及，再加上未来的感测组件的整合，组件急剧高频高速化的趋势更加不可避免。在高频及高速化的驱动下所引发的组件内部及外部的电磁干扰、信号在传输中衰减以及插入损耗和抖动问题逐渐严重。
目前，现有线路板常用的屏蔽膜包括屏蔽层和胶膜层，其中屏蔽层主要是通过在平整的金属表面上形成粗糙表面，该粗糙表面用于在压合时刺穿胶膜层，从而与线路板的地层接触。对于上述结构，屏蔽层依靠粗糙表面在压合时刺穿胶膜层和线路板的地层接地导通。由于在压合过程中，仅屏蔽层的粗糙面的凹处可以容胶，容胶量较小，容易造成爆板现象，进而导致接地失效，无法将干扰电荷导出。
发明内容
本发明实施例的目的是提供一种电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法，能有效解决现有技术容胶量不足而容易导致高温爆板现象刺穿力度强，剥离强度高，不会发生爆板现象。
为实现上述目的，本发明实施例提供了一种电磁屏蔽膜，包括屏蔽层和胶膜层，所述屏蔽层包括相对的第一表面和第二表面；所述第二表面为起伏的非平整表面，所述起伏的非平整表 面上还形成有凸状的导体颗粒；所述屏蔽层的第二表面设有所述胶膜层。
作为上述方案的改进，所述导体颗粒的高度为0.1μm-30μm。
作为上述方案的改进，所述屏蔽层的厚度为0.1μm-45μm，所述胶膜层的厚度为1μm-80μm。
作为上述方案的改进，所述屏蔽层的起伏状的非平整表面包括若干凸部和凹部；所述导体颗粒集中分布于所述凸部上。
作为上述方案的改进，所述胶膜层包括含有导电粒子的黏着层。
作为上述方案的改进，所述胶膜层包括不含导电粒子的黏着层。
作为上述方案的改进，所述屏蔽层包括金属屏蔽层、碳纳米管屏蔽层、铁氧体屏蔽层和石墨烯屏蔽层中的一种或多种。
作为上述方案的改进，所述金属屏蔽层包括单金属屏蔽层和/或合金屏蔽层；其中，所述单金属屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。
作为上述方案的改进，所述电磁屏蔽膜还包括保护膜层，所述屏蔽层的第一表面形成有所述保护膜层。
与现有技术相比，本发明实施例所提供的电磁屏蔽膜，其屏蔽层的第二表面为起伏的非平整表面，并且在所述起伏的非平整表面上还形成有凸状的导体颗粒，可在压合过程中保证屏蔽层顺利刺穿胶膜层，具有接地可靠、实用性强的优点。
本发明实施还提供一种线路板，所述线路板包括印刷线路板和上述任意一项所述的电磁屏蔽膜，所述电磁屏蔽膜通过其胶膜层与所述印刷线路板相压合；所述屏蔽层的第二表面上的导体颗粒刺穿所述胶膜层，并延伸至所述印刷线路板的地层。
与现有技术相比，本发明实施例所提供的线路板，通过采用了上述任一项所述的电磁屏蔽膜，则所述电磁屏蔽膜的胶膜层在压合过程中会将胶类物质挤压到所述第二表面的凹部中，容胶量增大，不容易出现爆板现象；同时，起伏的非平整表面又有一定高度的导体颗粒，可在压合过程中保证屏蔽层顺利刺穿胶膜层，实现可靠的接地，实用性强。
本发明实施例还对应提供了一种电磁屏蔽膜的制备方法，包括步骤：
S1、形成屏蔽层；其中，所述屏蔽层包括相对的第一表面和第二表面，所述第二表面为起伏的非平整表面；
S2、在所述屏蔽层的起伏的非平整表面上形成导体颗粒；
S3、在所述屏蔽层的第二表面上形成胶膜层。
作为上述方案的改进，在步骤S1中通过以下方式形成所述屏蔽层：
在载体膜上形成保护膜层，在所述保护膜层上形成屏蔽层；其中，所述第一表面与所述保护膜层贴合；或
在带载体的可剥离层表面形成屏蔽层，在所述屏蔽层上形成保护膜层，将所述带载体的可剥离层剥离；其中，所述屏蔽层的第一表面与所述保护膜层贴合。
作为上述方案的改进，在所述保护膜层/带载体的可剥离层上形成屏蔽层具体为：
在所述保护膜层/带载体的可剥离层的平整表面或非平整表面上形成屏蔽层，通过物理打毛、化学镀、物理气相沉积、化学气相沉积、蒸发镀、溅射镀、电镀和混合镀中的一种或多种工艺对所述屏蔽层进行表面处理；或，
在所述保护膜层/带载体的可剥离层的非平整表面上形成具有一定起伏度的屏蔽层。
作为上述方案的改进，步骤S2中，所述在屏蔽层的起伏的非平整表面上形成导体颗粒具体为：
通过物理打毛、化学镀、物理气相沉积、化学气相沉积、蒸发镀、溅射镀、电镀和混合镀中的一种或多种工艺在所述屏蔽层的起伏的非平整表面形成导体颗粒。
作为上述方案的改进，步骤S3中所述在所述屏蔽层的第二表面上形成胶膜层具体为：
在离型膜上涂布胶膜层，然后将所述胶膜层压合转移至所述屏蔽层的第二表面从而在所述屏蔽层的第二表面上形成所述胶膜层；或
直接在所述屏蔽层的第二表面涂布胶膜层从而在所述屏蔽层的第二表面上形成所述胶膜层。
与现有技术相比，本发明实施例所提供的电磁屏蔽膜的制备方法，通过在屏蔽层的起伏的非平整表面上形成导体颗粒，然后在所述屏蔽层的第二表面上形成胶膜层，可形成上述任一项所述的电磁屏蔽膜，起伏的非平整表面又有一定高度的导体颗粒，可在压合过程中保证屏蔽层顺利刺穿胶膜层，实现可靠的接地，实用性强。
附图说明
图1是本发明实施例1中一种电磁屏蔽膜的结构示意图。
图2是本发明实施例1中另一种电磁屏蔽膜的结构示意图。
图3是本发明实施例2中一种电磁屏蔽膜的结构示意图。
图4是本发明实施例3中一种线路板的结构示意图。
图5是本发明实施例3中一种线路板的电镜图。
图6是本发明实施例3中另一种线路板的电镜图。
图7是本发明实施例4中一种线路板的结构示意图。
图8是本发明实施例4中一种线路板的电镜图。
图9是本发明实施例4中另一种线路板的电镜图。
图10为本发明实施例5提供的电磁屏蔽膜制备方法的流程示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
参见图1，为本发明实施例1中一种电磁屏蔽膜的结构示意图。
如图1所示，所述电磁屏蔽膜包括屏蔽层1和胶膜层2，所述屏蔽层1包括相对的第一表面11和第二表面12；所述第二表面12为起伏的非平整表面，所述起伏的非平整表面12上还形成有凸状的导体颗粒121；所述屏蔽层的第二表面12设有所述胶膜层2；所述胶膜层2包括不含导电粒子的黏着层。
在具体实施当中，如图1所示，可以先形成屏蔽层1，然后再通过其他工艺在屏蔽层1的第二表面12形成导体颗粒121。当然，如图2所示，屏蔽层1和导体颗粒121可以是通过一次成型工艺形成的整体结构。
优选地，所述导体颗粒121可与所述胶膜层2的外表面存在一定的距离，也可与所述胶膜层2的外表面相接触或延伸出所述胶膜层2的外表面。此外，所述胶膜层2的外表面可以为无起伏的平整表面，也可以是平缓起伏的不平整表面。
所述屏蔽层1的第一表面11可以是任何形状的表面，例如，可以为平整表面，也可以为如图1所示的与所述第二表面12相配合的起伏状的非平整表面，或者其他粗糙面。本发明附图仅以第一表面11与第二表面12相配合的起伏状的非平整表面进行举例说明，其他任何形状的第一表面都在本发明的保护范围之内。
需要说明的是，如图1所示的导体颗粒121的形状仅仅是示例性的，由于工艺手段及参数 上的差异，所述导体颗粒121还可以为团簇状、挂冰状、钟乳石状、树枝状等其他形状。此外，本发明中的导体颗粒121并不受图示及上述形状的限制，只要是具有刺穿及导电功能的导体颗粒，均在本发明的保护范围之内。
具体的，第二表面12为起伏状的非平整表面，包括若干凸部123和凹部122；所述导体颗粒121优选为集中分布于所述凸部122上，则所述屏蔽层1在压合过程中更容易刺穿胶膜层2，从而实现更可靠的接地，提高电磁屏蔽的质量。
基于上述结构，由于所述屏蔽层1的第二表面12为起伏的非平整表面，胶膜层2在压合过程中会将第二表面的凸部122的导体颗粒121处的胶，挤压到所述第二表面的凹部123中，避免容胶量小而容易造成爆板现象，进而导致接地失效现象；同时，起伏的非平整表面又有一定高度的导体颗粒121，可在压合过程中保证屏蔽层1顺利刺穿胶膜层2，实用性强。且所述胶膜层2为不含导电粒子的黏着层，则可降低使用过程中线路板的插入损耗，提高屏蔽效能的同时改善线路板的弯折性。
优选地，所述导体颗粒121的高度为0.1μm-30μm。
所述屏蔽层1的厚度为0.1μm-45μm，所述胶膜层2的厚度为1μm-80μm。所述胶膜层2所用材料选自以下几种：改性环氧树脂类、丙烯酸类、改性橡胶类、改性热塑性聚酰亚胺类。可以理解的，为了保证所述屏蔽层1具有良好的导电性，所述屏蔽层1包括金属屏蔽层、碳纳米管屏蔽层、铁氧体屏蔽层和石墨烯屏蔽层中的一种或多种。此外，所述金属屏蔽层包括单金属屏蔽层和/或合金屏蔽层；其中，所述单金属屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。需要说明的是，如图1所示，其中，所述屏蔽层1的厚度为所述屏蔽层1的第一表面11的最高点和所述第二表面的最低点之间的距离D1，所述胶膜层2的厚度为所述胶膜层2的最高点和最低点之间的距离D2。
优选地，所述第二表面的起伏度(即第二表面的最高点和最低点之间的距离)为0.1μm～30μm，将第二表面的起伏度设定在上述范围内，可增强屏蔽层的刺穿功能，保证屏蔽层1中的干扰电荷顺利导入地中，避免了干扰电荷的积聚而形成干扰源。
优选地，所述胶膜层的厚度与所述第二表面的起伏度和所述导体颗粒的高度的和满足比例关系0.5～2，以保证足够的刺穿强度和容胶量，具体体现为：一方面防止胶膜层的厚度相对于第二表面的起伏度和所述导体颗粒的高度的和过小而导致容胶量不足进而导致爆板现象，另一方面防止第二表面的起伏度和所述导体颗粒的高度的和相对于胶膜层的厚度过小而导致刺穿强度不足而导致接地失效现象产生。
导体颗粒121包括金属颗粒、碳纳米管颗粒和铁氧体颗粒中的一种或多种。此外，所述金属颗粒包括单金属颗粒和/或合金颗粒；其中，所述单金属颗粒由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金颗粒由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。需要说明的是，导体颗粒121可以与跟屏蔽层1的材料相同，也可以不相同。
优选地，所述电磁屏蔽膜还包括保护膜层，所述屏蔽层1靠近所述第一表面11的一侧设有所述保护膜层。所述保护膜层起到保护作用从而保证所述屏蔽层1在使用过程中不被划伤破损，维持屏蔽层1的高屏蔽效能。所述保护膜层包括PPS薄膜层、PEN薄膜层、聚酯薄膜层、聚酰亚胺薄膜层、环氧树脂油墨固化后形成的膜层、聚氨酯油墨固化后形成的膜层、改性丙烯酸树脂固化后形成的膜层或聚酰亚胺树脂固化后形成的膜层。
需要说明的是，本实施例附图的屏蔽层可为单层结构，也可以为多层结构。另外，根据实际生产和应用的需要，本实施例附图的屏蔽层可设置为网格状、发泡状等。
参见图3，为本发明实施例2提供的一种电磁屏蔽膜的结构示意图。
如图3所示，所述电磁屏蔽膜包括屏蔽层1和胶膜层2，所述屏蔽层1包括相对的第一表面11和第二表面12；所述第二表面12为起伏的非平整表面，所述起伏的非平整表面12上还形成有凸状的导体颗粒121；所述屏蔽层1的第二表面12设有所述胶膜层2，所述胶膜层2包括含有导电粒子21的黏着层。在具体实施当中，如图3所示，可以先形成屏蔽层1，然后再通过其他工艺在屏蔽层1的第二表面12形成导体颗粒121。当然，屏蔽层1和导体颗粒121可以是通过一次成型工艺形成的整体结构。
优选地，所述导体颗粒121可与所述胶膜层2的外表面存在一定的距离，也可与所述胶膜层2的外表面相接触或伸出所述胶膜层2的外表面。此外，所述胶膜层2的外表面可以为无起伏的平整表面，也可以为平缓起伏的不平整表面。
所述第一表面11可以是任何形状的表面，例如，可以为平整表面，也可以为如图3所示的与所述第二表面12相配合的起伏状的非平整表面，或者其他粗糙面。本发明附图仅以第一表面11与第二表面12相配合的起伏状的非平整表面进行举例说明，其他任何形状的第一表面都在本发明的保护范围之内。
需要说明的是，如图3所示的导体颗粒121的形状仅仅是示例性的，由于工艺手段及参数上的差异，所述导体颗粒121还可以为团簇状、挂冰状、钟乳石状、树枝状等其他形状。此外，本发明中的导体颗粒121并不受图示及上述形状的限制，只要具有刺穿及导电功能的导体颗粒，均在本发明的保护范围之内。
可以理解的，所述起伏状的非平整表面包括若干凸部122和凹部123；所述导体颗粒121优选为集中分布于所述凸部122上，则所述屏蔽层1在压合过程中更容易刺穿胶膜层2，从而实现接地，提高电磁屏蔽的质量。
需要说明的是，所述导电粒子21可以为相互分离的导电粒子21，也可以为团聚而成的大颗粒导电粒子21；当所述导电粒子21为相互分离的导电粒子21时，可进一步提高电气接触的面积，提高电气接触的均匀度；而当所述导电粒子21为团聚而成的大颗粒导电粒子21，可增加刺穿强度。
与实施例1相比，本实施例提供的电磁屏蔽膜的胶膜层2包括含有导电粒子21的黏着层，则所述导电粒子21与所述起伏状的非平整表面12上的凸状的导体颗粒121协同刺穿胶膜层2，其与所述屏蔽层1相配合，实现更加可靠的刺穿接地，将干扰电荷迅速导入线路板的地层中。
优选地，所述导体颗粒121的高度为0.1μm-30μm。
所述屏蔽层1的厚度为0.1μm-45μm，所述胶膜层2的厚度为1μm-80μm。所述胶膜层2所用材料选自以下几种：改性环氧树脂类、丙烯酸类、改性橡胶类、改性热塑性聚酰亚胺类。其中，所述屏蔽层1的厚度为所述屏蔽层1的第一表面11的最高点和所述第二表面的最低点之间的距离值，所述胶膜层2的厚度为所述胶膜层2最高点和最低点之间的距离。此外，为了保证所述屏蔽层1具有良好的导电性，所述屏蔽层1包括金属屏蔽层、碳纳米管屏蔽层、铁氧体屏蔽层和石墨烯屏蔽层中的一种或多种。此外，所述金属屏蔽层为单金属屏蔽层和/或合金屏蔽层；其中，所述单金属屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。
优选地，所述第二表面的起伏度(即第二表面的最高点和最低点之间的距离)为0.1μm～30μm，将第二表面的起伏度设定在上述范围内，可增强屏蔽层的刺穿功能，保证屏蔽层1中的干扰电荷顺利导入地中，避免了干扰电荷的积聚而形成干扰源。
优选地，所述胶膜层的厚度与所述第二表面的起伏度和所述导体颗粒的高度的和满足比例关系0.5～2，以保证足够的刺穿强度和容胶量，具体体现为：一方面防止胶膜层的厚度相对于第二表面的起伏度和所述导体颗粒的高度的和过小而导致容胶量不足进而导致爆板现象，另一方面防止第二表面的起伏度和所述导体颗粒的高度的和相对于胶膜层的厚度过小而导致刺穿强度不足而导致接地失效现象产生。
导体颗粒121包括金属颗粒、碳纳米管颗粒和铁氧体颗粒中的一种或多种。此外，所述金属颗粒包括单金属颗粒和/或合金颗粒；其中，所述单金属颗粒由铝、钛、锌、铁、镍、铬、 钴、铜、银和金中的任意一种材料制成，所述合金颗粒由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。需要说明的是，导体颗粒121可与跟屏蔽层1的材料相同，也可不相同。
优选地，所述电磁屏蔽膜还包括保护膜层，所述保护膜层位于所述屏蔽层1靠近所述第一表面11的一侧，所述保护膜层起到保护作用从而保证所述屏蔽层1在使用过程中不被划伤破损，维持屏蔽层1的高屏蔽效能。所述保护膜层包括PPS薄膜层、PEN薄膜层、聚酯薄膜层、聚酰亚胺薄膜层、环氧树脂油墨固化后形成的膜层、聚氨酯油墨固化后形成的膜层、改性丙烯酸树脂固化后形成的膜层或聚酰亚胺树脂固化后形成的膜层。
需要说明的是，本实施例附图的屏蔽层可为单层结构，也可以为多层结构。另外，根据实际生产和应用的需要，本实施例附图的屏蔽层可设置为网格状、发泡状等。
参见图4和图5，为本发明实施例3提供的一种线路板的结构示意图和电镜图，所述线路板包括印刷线路板3和电磁屏蔽膜，所述电磁屏蔽膜包括屏蔽层1和胶膜层2，所述屏蔽层1包括相对的第一表面11和第二表面12；所述第二表面12为起伏的非平整表面，所述起伏的非平整表面12上还形成有凸状的导体颗粒121；所述屏蔽层1的第二表面12设有胶膜层2，所述胶膜层2包括不含导电粒子的黏着层；所述电磁屏蔽膜通过其胶膜层2与所述印刷线路板3相压合；所述屏蔽层1的第二表面上12的导体颗粒121刺穿所述胶膜层2，并延伸至所述印刷线路板3的地层。在具体实施当中，如图4所示，可以先形成屏蔽层1，然后再通过其他工艺在屏蔽层1的第二表面12形成导体颗粒121。当然，屏蔽层1和导体颗粒121可以是通过一次成型工艺形成的整体结构。
优选地，所述导体颗粒121可与所述胶膜层2的外表面存在一定的距离，也可与所述胶膜层2的外表面相接触或伸出所述胶膜层2的外表面。此外，所述胶膜层2的外表面可以为无起伏的平整表面，也可以为平缓起伏的不平整表面。
所述第一表面11可以是任何形状的表面，例如，可以为平整表面，也可以为如图4所示的与所述第二表面12相配合的起伏状的非平整表面，或者其他粗糙面。本发明附图仅以第一表面11与第二表面12相配合的起伏状的非平整表面进行举例说明，其他任何形状的第一表面都在本发明的保护范围之内。
需要说明的是，如图4所示的导体颗粒121的形状仅仅是示例性的，由于工艺手段及参数上的差异，所述导体颗粒121还可以为团簇状、挂冰状、钟乳石状或树枝状等其他形状。此外，本发明中的导体颗粒121并不受图示及上述形状的限制，只要具有刺穿及导电功能的导体颗粒，均在本发明的保护范围之内。
可以理解的，所述起伏状的非平整表面包括若干凸部122和凹部123；所述导体颗粒121优选为集中分布于所述凸部122上，则所述屏蔽层1在压合过程中更容易刺穿胶膜层2，从而实现更可靠的接地，提高电磁屏蔽的质量。
优选地，所述印刷线路板3为挠性单面、挠性双面、挠性多层板、刚挠结合板中的一种。
通过上述结构，在压合过程中，利用所述屏蔽层1的导体颗粒121将胶膜层2刺穿，使所述第二表面12的至少一部分和所述印刷线路板3的地层连接，从而实现将屏蔽层1中的干扰电荷导入地中，避免了干扰电荷的积聚而形成干扰源，影响线路板的正常工作。且所述胶膜层2为不含导电粒子的黏着层，则可降低使用过程中线路板的插入损耗，提高屏蔽效能的同时改善线路板的弯折性。
优选地，所述导体颗粒121的高度为0.1μm-30μm。
所述屏蔽层1的厚度为0.1μm-45μm，所述胶膜层2的厚度为1μm-80μm。所述胶膜层2所用材料选自以下几种：改性环氧树脂类、丙烯酸类、改性橡胶类、改性热塑性聚酰亚胺类。此外，为了保证所述屏蔽层1具有良好的导电性，所述屏蔽层1包括金属屏蔽层、碳纳米管屏蔽层、铁氧体屏蔽层和石墨烯屏蔽层中的一种或多种。此外，所述金属屏蔽层包括单金属屏蔽层和/或合金屏蔽层；其中，所述单金属屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。合金屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。需要说明的是，所述屏蔽层1的厚度为所述屏蔽层1的第一表面11的最高点和所述第二表面的最低点之间的距离，所述胶膜层2的厚度为所述胶膜层2的最高点和最低点之间的距离。
优选地，所述第二表面的起伏度(即第二表面的最高点和最低点之间的距离)为0.1μm～30μm，将第二表面的起伏度设定在上述范围内，可增强屏蔽层的刺穿功能，保证屏蔽层1中的干扰电荷顺利导入地中，避免了干扰电荷的积聚而形成干扰源。如图6所示，为本发明实施例另一线路板的电镜图。由图可知，图5和图6中屏蔽层的第二表面具有不同的起伏度，且图5中第二表面的起伏度大于图6中第二表面的起伏度。但是，两种线路板上屏蔽层的第二表面上均生长有一定高度的导体颗粒，均能获得增强刺穿强度，实现可靠接地的效果。
优选地，所述胶膜层的厚度与所述第二表面的起伏度和所述导体颗粒的高度的和满足比例关系0.5～2，以保证足够的刺穿强度和容胶量，具体体现为：一方面防止胶膜层的厚度相对于第二表面的起伏度和所述导体颗粒的高度的和过小而导致容胶量不足进而导致爆板现象，另一方面防止第二表面的起伏度和所述导体颗粒的高度的和相对于胶膜层的厚度过小而导致刺穿 强度不足而导致接地失效现象产生。
导体颗粒121包括金属颗粒、碳纳米管颗粒和铁氧体颗粒中的一种或多种。此外，所述金属颗粒包括单金属颗粒和/或合金颗粒；其中，所述单金属颗粒由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金颗粒由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。需要说明的是，导体颗粒121可与跟屏蔽层1的材料相同，也可不相同。
优选地，所述电磁屏蔽膜还包括保护膜层，所述保护膜层位于所述屏蔽层1靠近所述第一表面11的一侧，所述保护膜层与所述屏蔽层1的第一表面11贴合，所述保护膜层起到保护作用从而保证所述屏蔽层1在使用过程中不被划伤破损，维持屏蔽层1的高屏蔽效能。所述保护膜层包括PPS薄膜层、PEN薄膜层、聚酯薄膜层、聚酰亚胺薄膜层、环氧树脂油墨固化后形成的膜层、聚氨酯油墨固化后形成的膜层、改性丙烯酸树脂固化后形成的膜层或聚酰亚胺树脂固化后形成的膜层。
需要说明的是，本实施例附图的屏蔽层可为单层结构，也可以为多层结构。另外，根据实际生产和应用的需要，本实施例附图的屏蔽层可设置为网格状、发泡状等。
参见图7和图8，为本发明实施例4提供的一种线路板的结构示意图和电镜图，所述线路板包括印刷线路板3和电磁屏蔽膜，所述电磁屏蔽膜包括屏蔽层1和胶膜层2，所述屏蔽层1包括相对的第一表面11和第二表面12；所述第二表面12为起伏的非平整表面，所述起伏的非平整表面12上还形成有凸状的导体颗粒121；所述屏蔽层1的第二表面12设有所述胶膜层2，所述胶膜层2包括含有导电粒子21的黏着层；所述电磁屏蔽膜通过其胶膜层2与所述印刷线路板3相压合；所述屏蔽层1的第二表面上12的导体颗粒121刺穿所述胶膜层2，并延伸至所述印刷线路板3的地层。在具体实施当中，如图7所示，可以先形成屏蔽层1，然后再通过其他工艺在屏蔽层1的第二表面12形成导体颗粒121。当然，屏蔽层1和导体颗粒121可以是通过一次成型工艺形成的整体结构。
优选地，所述导体颗粒121可与所述胶膜层2的外表面存在一定的距离，也可与所述胶膜层2的外表面相接触或伸出所述胶膜层2的外表面。此外，所述胶膜层2的外表面可以为无起伏的平整表面，也可以为平缓起伏的不平整表面。
所述第一表面11可以是任何形状的表面，例如，可以为平整表面，也可以为如图5所示的与所述第二表面12相配合的起伏状的非平整表面，或者其他粗糙面。本发明附图仅以第一表面11与第二表面12相配合的起伏状的非平整表面进行举例说明，其他任何形状的第一表面都在本发明的保护范围之内。
需要说明的是，如图7所示的导体颗粒121的形状仅仅是示例性的，由于工艺手段及参数上的差异，所述导体颗粒121还可以为团簇状、挂冰状、钟乳石状、树枝状等其他形状。此外，本发明中的导体颗粒121并不受图示及上述形状的限制，只要具有刺穿及导电功能的导体颗粒，均在本发明的保护范围之内。
可以理解的，所述起伏状的非平整表面包括若干凸部122和凹部123；所述导体颗粒121优选为集中分布于所述凸部122上，则所述屏蔽层1在压合过程中更容易刺穿胶膜层2，从而实现更可靠的接地，提高电磁屏蔽的质量。
需要说明的是，所述导电粒子21可以为相互分离的导电粒子，也可以为团聚而成的大颗粒导电粒子；当所述导电粒子21为相互分离的导电粒子时，可进一步提高电气接触的面积；而当所述导电粒子21为团聚而成的大颗粒导电粒子，可增加刺穿强度。
优选地，所述印刷线路板3为挠性单面、挠性双面、挠性多层板、刚挠结合板中的一种。
通过上述结构，在压合过程中，利用所述屏蔽层1的导体颗粒121将胶膜层2刺穿，从而所述第二表面12的至少一部分和所述印刷线路板3的地层连接，从而实现屏蔽层1中的干扰电荷导入地中，避免了干扰电荷的积聚而形成干扰源，影响线路板的正常工作。且所述电磁屏蔽膜的胶膜层2为含有导电粒子21的黏着层，则所述导电粒子21与所述起伏状的非平整表面12上的凸状的导体颗粒121协同刺穿胶膜层2，其与所述屏蔽层1相配合，实现更加可靠的刺穿接地，将干扰电荷迅速导入所述接线板的地层中。
优选地，所述导体颗粒121的高度为0.1μm-30μm。
所述屏蔽层1的厚度为0.1μm-45μm，所述胶膜层2的厚度为1μm-80μm。所述胶膜层2所用材料选自以下几种：改性环氧树脂类、丙烯酸类、改性橡胶类、改性热塑性聚酰亚胺类。此外，为了保证所述屏蔽层1具有良好的导电性，所述屏蔽层1包括金属屏蔽层、碳纳米管屏蔽层、铁氧体屏蔽层和石墨烯屏蔽层中的一种或多种。此外，所述金属屏蔽层为单金属屏蔽层和/或合金屏蔽层；其中，所述单金属屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。需要说明的是，所述屏蔽层1的厚度为所述屏蔽层1的第一表面11的最高点和所述第二表面的最低点之间的距离，所述胶膜层2的厚度为所述胶膜层2的最高点和最低点之间的距离。优选地，所述第二表面的起伏度(即第二表面的最高点和最低点之间的距离)为0.1μm～30μm，将第二表面的起伏度设定在上述范围内，可增强屏蔽层的刺穿功能，保证屏蔽层1中的干扰电荷顺利导入地中，避免了干扰电荷的积聚而形成干扰源。如图9所示，为本发明实施例另一线路板的电镜图。由图可知，图8和图9中屏蔽层的第二表面具 有不同的起伏度，且图8中第二表面的起伏度大于图9中第二表面的起伏度。但是，两种线路板上屏蔽层的第二表面上均生长有一定高度的导体颗粒，均能获得增强刺穿强度，实现可靠接地的效果。
优选地，所述胶膜层的厚度与所述第二表面的起伏度和所述导体颗粒的高度的和满足比例关系0.5～2，以保证足够的刺穿强度和容胶量，具体体现为：一方面防止胶膜层的厚度相对于第二表面的起伏度和所述导体颗粒的高度的和过小而导致容胶量不足进而导致爆板现象，另一方面防止第二表面的起伏度和所述导体颗粒的高度的和相对于胶膜层的厚度过小而导致刺穿强度不足而导致接地失效现象产生。
导体颗粒121包括金属颗粒、碳纳米管颗粒或铁氧体颗粒中的一种或多种。此外，所述金属颗粒包括单金属颗粒和/或合金颗粒；其中，所述单金属颗粒由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金颗粒由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种或两种以上的材料制成。需要说明的是，导体颗粒121可与跟屏蔽层1的材料相同，也可不相同。优选地，所述电磁屏蔽膜还包括保护膜层，所述保护膜层位于所述屏蔽层1靠近所述第一表面11的一侧，所述屏蔽层1的第一表面11设有所述保护膜层，所述保护膜层起到保护作用从而保证所述屏蔽层1在使用过程中不被划伤破损，维持屏蔽层1的高屏蔽效能。所述保护膜层包括PPS薄膜层、PEN薄膜层、聚酯薄膜层、聚酰亚胺薄膜层、环氧树脂油墨固化后形成的膜层、聚氨酯油墨固化后形成的膜层、改性丙烯酸树脂固化后形成的膜层或聚酰亚胺树脂固化后形成的膜层。
需要说明的是，本实施例附图的屏蔽层可为单层结构，也可以为多层结构。另外，根据实际生产和应用的需要，本实施例附图的屏蔽层可设置为网格状、发泡状等。
参见图10，为本发明实施例5提供的电磁屏蔽膜制备方法的流程示意图，该方法适用于上述任一项电磁屏蔽膜的制备，包括步骤：
S1、形成屏蔽层；其中，所述屏蔽层包括相对的第一表面和第二表面，所述第二表面为起伏的非平整表面；
S2、在所述屏蔽层的起伏的非平整表面上形成导体颗粒；
在步骤S2中，通过物理打毛、化学镀、物理气相沉积、化学气相沉积、蒸发镀和溅射镀、电镀和混合镀中的一种或多种工艺在所述屏蔽层的起伏的非平整表面形成导体颗粒。
S3、在所述屏蔽层的第二表面上形成胶膜层。
在步骤S3中，除了可以直接在所述屏蔽层的第二表面涂布胶膜层从而在所述屏蔽层的第二表面上形成胶膜层，还可以在离型膜上涂布胶膜层，然后将所述胶膜层压合转移至所述屏蔽 层的第二表面从而在所述屏蔽层的第二表面上形成胶膜层。
步骤S1中，可通过以下两种方式形成所述屏蔽层：
方式(1)：在载体膜上形成保护膜层，在所述保护膜层上形成屏蔽层；其中，所述第一表面与所述保护膜层贴合；
方式(2)：在带载体的可剥离层表面上形成屏蔽层，在所述屏蔽层表面形成保护膜层，将所述带载体的可剥离层剥离；其中，所述屏蔽层的第一表面与所述保护膜层贴合。
当采用方式(1)形成所述屏蔽层时，可通过以下两种方式使所述屏蔽层的第二表面为起伏的非平整表面：
方式i：在所述保护膜层的平整表面或非平整表面上形成屏蔽层，通过物理打毛、化学镀、物理气相沉积、化学气相沉积、蒸发镀、溅射镀、电镀和混合镀中的一种或多种工艺对所述屏蔽层进行表面处理；
当采用方式i时，不管保护膜层的表面状态，都采用上述物理打毛、化学镀、物理气相沉积、化学气相沉积、蒸发镀、溅射镀、电镀和混合镀中的一种或多种工艺对所述屏蔽层进行表面处理，则所述第二表面为起伏的非平整表面；
方式ii：在所述保护膜层的非平整表面上形成具有一定起伏度的屏蔽层；
当采用方式ii时，可在制备保护膜层时控制填料的尺寸和比例控制保护膜层的起伏度，从而使得所述保护膜层具有一定起伏度的非平整表面，再在所述保护膜层的非平整表面上形成屏蔽层，从而使得所述屏蔽层具有一定的起伏度，则所述第二表面为起伏的非平整表面。
当采用方式(2)形成所述屏蔽层时，可通过以下两种方式使所述屏蔽层的第二表面为起伏的非平整表面：
方式iii：在所述带载体的可剥离层的平整表面或非平整表面上形成屏蔽层，通过物理打毛、化学镀、物理气相沉积、化学气相沉积、蒸发镀、溅射镀、电镀和混合镀中的一种或多种工艺对所述屏蔽层进行表面处理；
当采用方式iii时，不管所述带载体的可剥离层的表面状态，都采用上述物理打毛、化学镀、物理气相沉积、化学气相沉积、蒸发镀、溅射镀、电镀和混合镀的一种或多种工艺对所述屏蔽层进行表面处理，则所述第二表面为起伏的非平整表面；
方式iv：在所述带载体的可剥离层的非平整表面上形成具有一定起伏度的屏蔽层；
当采用方式iv时，控制带载体的可剥离层的表面起伏度，从而使得在所述带载体的可剥离层的非平整表面上形成屏蔽层具有一定的起伏度，则所述第二表面为起伏的非平整表面。
综上所述，本发明实施例提供了一种电磁屏蔽膜、线路板和电磁屏蔽膜的制备方法，其中， 所述电磁屏蔽膜包括屏蔽层和胶膜层，所述屏蔽层包括相对的第一表面和第二表面，所述第二表面为起伏的非平整表面，所述起伏的非平整表面上还形成有凸状的导体颗粒，所述屏蔽层的第二表面设有所述胶膜层，则所述电磁屏蔽膜的胶膜层在压合过程中会将胶类物质挤压到所述第二表面的凹部中，容胶量增大，不容易出现爆板现象；同时，起伏的非平整表面又有一定高度的导体颗粒，可在压合过程中保证屏蔽层顺利刺穿胶膜层，实现可靠接地，实用性强。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (15)

  1. 一种电磁屏蔽膜，其特征在于，包括屏蔽层和胶膜层，所述屏蔽层包括相对的第一表面和第二表面；所述第二表面为起伏的非平整表面，所述起伏的非平整表面上还形成有凸状的导体颗粒；所述屏蔽层的第二表面设有所述胶膜层。
  2. 如权利要求1所述的电磁屏蔽膜，其特征在于，所述导体颗粒的高度为0.1μm-30μm。
  3. 如权利要求2所述的电磁屏蔽膜，其特征在于，所述屏蔽层的厚度为0.1μm-45μm，所述胶膜层的厚度为1μm-80μm。
  4. 如权利要求1所述的电磁屏蔽膜，其特征在于，所述屏蔽层的起伏状的非平整表面包括若干凸部和凹部；所述导体颗粒集中分布于所述凸部上。
  5. 如权利要求1所述的电磁屏蔽膜，其特征在于，所述胶膜层包括含有导电粒子的黏着层。
  6. 如权利要求1所述的电磁屏蔽膜，其特征在于，所述胶膜层包括不含导电粒子的黏着层。
  7. 如权利要求1至6任一项所述的电磁屏蔽膜，其特征在于，所述屏蔽层包括金属屏蔽层、碳纳米管屏蔽层、铁氧体屏蔽层和石墨烯屏蔽层中的一种或多种。
  8. 如权利要求7所述的电磁屏蔽膜，其特征在于，所述金属屏蔽层包括单金属屏蔽层和/或合金屏蔽层；其中，所述单金属屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意一种材料制成，所述合金屏蔽层由铝、钛、锌、铁、镍、铬、钴、铜、银和金中的任意两种 或两种以上的材料制成。
  9. 如权利要求1至6任一项所述的电磁屏蔽膜，其特征在于，所述电磁屏蔽膜还包括保护膜层，所述屏蔽层的第一表面形成有所述保护膜层。
  10. 一种线路板，其特征在于，包括印刷线路板和权利要求1至9任意一项所述的电磁屏蔽膜，所述电磁屏蔽膜通过其胶膜层与所述印刷线路板相压合；所述屏蔽层的第二表面上的导体颗粒刺穿所述胶膜层，并延伸至所述印刷线路板的地层。
  11. 一种电磁屏蔽膜的制备方法，其特征在于，适用于制备权利要求1至10任一项所述的电磁屏蔽膜，包括步骤：
    S1、形成屏蔽层；其中，所述屏蔽层包括相对的第一表面和第二表面，所述第二表面为起伏的非平整表面；
    S2、在所述屏蔽层的起伏的非平整表面上形成导体颗粒；
    S3、在所述屏蔽层的第二表面上形成胶膜层。
  12. 如权利要求11所述的电磁屏蔽膜的制备方法，其特征在于，步骤S1中通过以下方式形成所述屏蔽层：
    在载体膜上形成保护膜层，在所述保护膜层上形成屏蔽层；其中，所述第一表面与所述保护膜层贴合；或
    在带载体的可剥离层表面形成屏蔽层，在所述屏蔽层上形成保护膜层，将所述带载体的可剥离层剥离；其中，所述屏蔽层的第一表面与所述保护膜层贴合。
  13. 如权利要求12所述的电磁屏蔽膜的制备方法，其特征在于，在所述保护膜层/带载体的可剥离层上形成屏蔽层具体为：
    在所述保护膜层/带载体的可剥离层的平整表面或非平整表面上形成屏蔽层，通过物理打 毛、化学镀、物理气相沉积、化学气相沉积、蒸发镀、溅射镀、电镀和混合镀中的一种或多种工艺对所述屏蔽层进行表面处理；或，
    在所述保护膜层/带载体的可剥离层的非平整表面上形成具有一定起伏度的屏蔽层。
  14. 如权利要求11至13任一项所述的电磁屏蔽膜的制备方法，其特征在于，步骤S2中，所述在屏蔽层的起伏的非平整表面上形成导体颗粒具体为：
    通过物理打毛、化学镀、物理气相沉积、化学气相沉积、蒸发镀、溅射镀、电镀和混合镀中的一种或多种工艺在所述屏蔽层的起伏的非平整表面形成导体颗粒。
  15. 如权利要求11所述的电磁屏蔽膜的制备方法，其特征在于，步骤S3中所述在所述屏蔽层的第二表面上形成胶膜层具体为：
    在离型膜上涂布胶膜层，然后将所述胶膜层压合转移至所述屏蔽层的第二表面从而在所述屏蔽层的第二表面上形成所述胶膜层；或
    直接在所述屏蔽层的第二表面涂布胶膜层从而在所述屏蔽层的第二表面上形成所述胶膜层。
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