WO2019172336A1 - 発光素子搭載用基板および発光装置 - Google Patents
発光素子搭載用基板および発光装置 Download PDFInfo
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- WO2019172336A1 WO2019172336A1 PCT/JP2019/008944 JP2019008944W WO2019172336A1 WO 2019172336 A1 WO2019172336 A1 WO 2019172336A1 JP 2019008944 W JP2019008944 W JP 2019008944W WO 2019172336 A1 WO2019172336 A1 WO 2019172336A1
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- conductor
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- 239000000758 substrate Substances 0.000 title claims abstract description 174
- 239000004020 conductor Substances 0.000 claims abstract description 409
- 239000000919 ceramic Substances 0.000 claims abstract description 15
- 230000004048 modification Effects 0.000 description 46
- 238000012986 modification Methods 0.000 description 46
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 239000010408 film Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000011104 metalized film Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- ZXGIFJXRQHZCGJ-UHFFFAOYSA-N erbium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Er+3].[Er+3] ZXGIFJXRQHZCGJ-UHFFFAOYSA-N 0.000 description 1
- VQCBHWLJZDBHOS-UHFFFAOYSA-N erbium(III) oxide Inorganic materials O=[Er]O[Er]=O VQCBHWLJZDBHOS-UHFFFAOYSA-N 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0239—Combinations of electrical or optical elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Definitions
- the wiring portion 14a includes the wiring connected in the order of the first via conductor 17a, the first conductor 15a, and the second via conductor 18a, the first via conductor 17a, the first conductor 15a, and the third via.
- the sealing metal film 13 is provided on the front surface 10a of the substrate 10 so as to surround the element terminals 11a and 11b.
- the sealing metal film 13 is a part to which the cap 40 is joined when the cap 40 is provided so as to cover the light emitting element 30 mounted on the element terminal 11a.
- the second conductor 16a is wider than the first conductor 15a, the stress generated between the first conductor 15a and the second conductor 16a and the substrate 10 is further reduced. be able to. Therefore, according to the embodiment, the reliability of the light emitting element mounting substrate A2 can be further improved. This is because when the heat radiating member is made of metal, the ratio of the metal having a thermal expansion coefficient close to the heat radiating member in the substrate 10 is increased.
- a light emitting element mounting substrate A5 shown in FIG. 5 is a fourth modification of the embodiment, and FIG. 5 is a diagram corresponding to FIG. 1B.
- Modification 4 shown in FIG. 5 the configurations of the first conductor 15a, the second conductor 16a, and the second via conductor 18a are different from those of Modification 3 described above.
- a green sheet 70 processed in advance into a predetermined shape is prepared.
- conductor patterns 71 a and 71 b are printed on the upper surface of the green sheet 70.
- the conductor pattern 71a is formed at a position corresponding to the via conductors 61a, 61c, 61e provided on the green sheet 60, and the conductor pattern 71b corresponds to the via conductors 61b, 61d, 61f provided on the green sheet 60. It is formed in the position to do.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Structure Of Printed Boards (AREA)
- Semiconductor Lasers (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
最初に、実施形態に係る発光素子搭載用基板A1の概要について、図1A~図1Eを参照しながら説明する。図1Aに示すように、実施形態に係る発光素子搭載用基板A1は、セラミックスで構成される平板状の基板10を備える。また、かかる基板10のおもて面10aには、金属で構成される素子用端子11a、11bが設けられる。また、基板10には、電源用端子12a、12bが設けられる。なお、この場合、図1Aには、素子用端子11a、11bおよび電源用端子12a、12bを基板10のおもて面10aに設けた構造を示しているが、電源用端子12a、12bは、基板10のおもて面10aに限らず基板10の端面10cあるいは側面10dに設けられてもよい。
次に、実施形態の各種変形例について、図2~図7Bを参照しながら説明する。なお、以降の説明においては、上述の実施形態と共通の構成については同一の符号を付して、詳細な説明は省略する。
次に、実施形態に係る発光素子搭載用基板A1の製造方法について、図8~図11を参照しながら説明する。なお、図8~10は、前半の各工程をそれぞれ上方から見た平面図であり、図11は、後半の各工程をそれぞれ側面から断面視した断面図である。
10 基板
10a おもて面
10b 裏面
11a、11b 素子用端子
12a、12b 電源用端子
13 封止用金属膜
14a、14b 配線部
15a、15b 第1導体
16a、16b 第2導体
17a、17b 第1ビア導体
18a、18b 第2ビア導体
19a、19b 第3ビア導体
20a、20b 第4ビア導体
22a、22b 第3導体
30 発光素子
30a 放射面
40 キャップ
41 横窓
Claims (11)
- セラミックスで構成される基板と、
前記基板のおもて面に設けられ、発光素子が搭載される素子用端子と、
前記基板に設けられ、外部電源が接続される電源用端子と、
前記基板の内部に設けられ、前記素子用端子と前記電源用端子を電気的に接続する配線部と、
を備え、
前記配線部は、
前記基板の面方向に延びる第1導体と、
前記第1導体に対して前記おもて面とは反対側に略平行に延び、前記第1導体と並列に接続される第2導体と、
を有する発光素子搭載用基板。 - 前記配線部は、
前記基板の厚み方向に延び、前記素子用端子と前記第1導体とを接続する第1ビア導体と、
前記基板の厚み方向に延び、前記電源用端子と前記第1導体とを接続する第2ビア導体と、
前記基板の厚み方向に延び、前記第1導体と前記第2導体とを接続する第3ビア導体および第4ビア導体と、を有する請求項1に記載の発光素子搭載用基板。 - 前記基板を上面視した場合に、前記第1ビア導体と前記第3ビア導体は略同じ位置に配置され、前記第2ビア導体と前記第4ビア導体は略同じ位置に配置される、請求項2に記載の発光素子搭載用基板。
- 前記基板を上面視した場合に、前記第1ビア導体と前記第3ビア導体とは異なる位置に配置され、前記第2ビア導体と前記第4ビア導体とは異なる位置に配置される、請求項2に記載の発光素子搭載用基板。
- 前記配線部は、
前記基板の厚み方向に延び、前記素子用端子と前記第1導体および前記第2導体のうち一方とを接続する第1ビア導体と、
前記基板の厚み方向に延び、前記電源用端子と前記第1導体および前記第2導体のうち他方とを接続する第2ビア導体と、
前記基板の厚み方向に延び、前記第1導体と前記第2導体とを接続する第3ビア導体および第4ビア導体と、を有する請求項1に記載の発光素子搭載用基板。 - 前記第3ビア導体と前記第4ビア導体との間に延びる前記第1導体と、前記第3ビア導体と前記第4ビア導体との間に延びる前記第2導体とは長さが略等しい、請求項5に記載の発光素子搭載用基板。
- 前記配線部は、
前記基板の厚み方向に延び、前記素子用端子と前記第2導体とを接続する第1ビア導体と、
前記基板の厚み方向に延び、前記電源用端子と前記第2導体とを接続する第2ビア導体と、
前記基板の厚み方向に延び、前記第1導体と前記第2導体とを接続する第3ビア導体および第4ビア導体と、を有する請求項1に記載の発光素子搭載用基板。 - 前記第2導体は、前記第1導体より幅が広い、請求項1~7のいずれか一つに記載の発光素子搭載用基板。
- 前記第1導体と前記第2導体とは、前記基板を厚み方向に2等分した場合に、いずれも前記おもて面側に配置される、請求項1~8のいずれか一つに記載の発光素子搭載用基板。
- 前記配線部は、
前記第2導体に対して前記おもて面とは反対側に略平行に延び、前記第2導体と並列に接続される第3導体を有する、請求項1~9のいずれか一つに記載の発光素子搭載用基板。 - 請求項1~10のいずれか一つに記載の発光素子搭載用基板と、
前記発光素子搭載用基板の前記素子用端子に搭載される発光素子と、を備える、発光装置。
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JP2022137726A JP7366214B2 (ja) | 2018-03-08 | 2022-08-31 | 発光素子搭載用基板および発光装置 |
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JP7366214B2 (ja) | 2023-10-20 |
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US20210044084A1 (en) | 2021-02-11 |
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