WO2019130946A1 - Composition de caoutchouc semi-électroconductrice - Google Patents

Composition de caoutchouc semi-électroconductrice Download PDF

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Publication number
WO2019130946A1
WO2019130946A1 PCT/JP2018/043539 JP2018043539W WO2019130946A1 WO 2019130946 A1 WO2019130946 A1 WO 2019130946A1 JP 2018043539 W JP2018043539 W JP 2018043539W WO 2019130946 A1 WO2019130946 A1 WO 2019130946A1
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Prior art keywords
copper
rubber composition
semiconductive
mass
semiconductive rubber
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PCT/JP2018/043539
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English (en)
Japanese (ja)
Inventor
和樹 宇野
真一 宇渡
尚也 矢嶋
和敬 安田
勇磨 河戸
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株式会社大阪ソーダ
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Priority to JP2019562867A priority Critical patent/JP7167943B2/ja
Publication of WO2019130946A1 publication Critical patent/WO2019130946A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/39—Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern

Definitions

  • a semiconductive rubber material comprising the semiconductive rubber composition and the semiconductive rubber composition according to the present invention has, due to its semiconductive properties, development, charging, transfer, etc. of an electrophotographic process in a copier, a printer, etc. Is used for members used for semiconductive rollers or belts.
  • semiconductive rubber materials such as a rubber charging roll and a transfer roll of an electrophotographic copying machine are required to satisfy the following conditions.
  • the measurement environment has semiconductive properties under low temperature low humidity and high temperature high humidity.
  • the environmental dependence of the volume resistivity is reduced (improved) because it is preferable that the printing characteristics do not change even under low temperature and low humidity and high temperature and high humidity.
  • the contamination of the photosensitive member should be less with regard to members that come into direct contact with the photosensitive member, charging rolls, transfer rolls, etc.
  • the semiconductive rubber material obtained by crosslinking with an organic peroxide is a semiconductive compound obtained by vulcanization with sulfur It is generally known that the contamination of the photosensitive member is smaller than that of the rubber material (Patent Document 2). However, the volume resistivity is higher (exacerbated) than the semiconductive rubber material formed by crosslinking with sulfur.
  • the applicant of the present invention is examining the compounding using a copper compound in the examination on a semiconductive rubber material formed by crosslinking with an organic peroxide (Patent Document 3).
  • Patent No. 3489384 Japanese Patent Laid-Open No. 6-208289 International Publication No. 2013/051689
  • the present invention has been made against the background described above, and it is an object of the present invention to provide a semiconductive rubber composition as a raw material of a semiconductive rubber material having improved volume resistivity and its environmental dependency. .
  • the present inventors consider (a) a polyether polymer, (b) a copper compound, (c) an organic peroxide as the rubber component, and (c) examining the blending amount of the organic peroxide.
  • the present inventors have found that the above-mentioned problems can be solved by the semiconductive rubber composition and the semiconductive rubber material obtained by using the semiconductive rubber composition, and the present invention has been completed.
  • the present invention relates to the following.
  • Item 1 (a) As a rubber component, it contains a polyether polymer, (b) a copper compound, and (c) an organic peroxide, The semiconductive rubber composition characterized by containing 1.5 mass parts or more of (c) organic peroxides with respect to 100 mass parts of said (a) rubber components.
  • Item 2 The semiconductive material according to Item 1, wherein the polyether polymer includes at least two units selected from ethylene oxide, propylene oxide, epichlorohydrin, and allyl glycidyl ether as a constituent unit. Rubber composition.
  • the (b) copper compound is selected from an inorganic copper compound selected from copper oxide, copper hydroxide, copper carbonate, copper chloride, copper sulfide, copper sulfate, copper salt of carboxylic acid and copper salt of dithiocarbamic acid Item 3.
  • the semiconductive rubber composition according to item 1 or 2 which is at least one of Item 4
  • Item 5 The semiconductive rubber composition according to any one of Items 1 to 4, further comprising (d) a crosslinking assistant.
  • Item 6 is characterized in that the (d) crosslinking aid is at least one selected from trimethylolpropane trimethacrylate, triallyl isocyanate, o, o′-dibenzoyl, p-quinone dioxime, and m-phenylene dimaleimide.
  • Item 7 The compounding amount of the (c) organic peroxide is 1.5 to 10 parts by mass with respect to 100 parts by mass of the (a) rubber component.
  • Item 8 The semiconductive rubber composition according to any one of Items 1 to 7, wherein the amount of active oxygen X (%) of the organic peroxide (c) is 2 to 10%.
  • Item 9 The semiconductive rubber composition according to any one of Items 1 to 8, further comprising (e) a conductive agent.
  • Item 10 The semiconductive rubber composition according to any one of Items 1 to 9, further comprising (f) a filler.
  • the filler (f) is selected from calcium carbonate, talc, silica, clay, carbon fiber, glass fiber, carbon black, titanium oxide, magnesium oxide, hydrotalcite, magnesium hydroxide, antimony oxide, zinc oxide 11.
  • the semiconductive rubber composition according to item 10 which is at least one of Item 12
  • the semiconductive rubber composition according to item 10 or 11 wherein the compounding amount of the filler is 15 to 80 parts by mass with respect to 100 parts by mass of the rubber component (a). .
  • Item 13 The semiconductive rubber composition according to item 13
  • a semiconductive rubber material comprising the semiconductive rubber composition according to any one of items 1 to 12.
  • Item 14 A semiconductive rubber roll or a semiconductive endless rubber belt using the semiconductive rubber material according to item 14.
  • An electrophotographic apparatus comprising the semiconductive rubber roll or the semiconductive endless rubber belt according to item 15.
  • the semiconductive rubber material obtained by the semiconductive rubber composition of the present invention is less polluting because an organic peroxide is used as a crosslinking agent, and the volume resistivity and its environmental dependence are improved. . For this reason, such semiconductive rubber materials are very useful for semiconductive rubber rolls and belts of copying machines, printers and the like.
  • the volume resistivity of the resulting semiconductive rubber material and its environmental dependency tend to increase, but (a) rubber
  • the amount of the organic peroxide (c) is set to 1.5 parts by mass or more with respect to 100 parts by mass of the component, the effect of improving the volume resistivity and its environmental dependence can be favorably maintained.
  • the semiconductive rubber composition of the present invention comprises (a) a polyether polymer, (b) a copper compound, and (c) an organic peroxide as a rubber component. It is a thing.
  • alkylene oxides such as ethylene oxide, propylene oxide, n-butylene oxide, methyl glycidyl ether, ethyl glycidyl ether, n-glycidyl ether, allyl glycidyl ether
  • homopolymers or copolymers of compounds selected from glycidyls such as phenyl glycidyl ether, epihalohydrins such as epichlorohydrin and epibromohydrin, and styrene oxide, etc., and homopolymers or copolymers thereof.
  • the combination can be used singly or in combination of two or more.
  • the polyether polymer preferably contains two units selected from epichlorohydrin, propylene oxide, ethylene oxide and allyl glycidyl ether as a constituent unit, and units of ethylene oxide and allyl glycidyl ether may be used as a constituent unit. It is more preferable to include, and it is particularly preferable to include a unit of epichlorohydrin, ethylene oxide and allyl glycidyl ether as a constituent unit.
  • the polyether polymer preferably contains 50 to 85 mol%, more preferably 58 to 80 mol%, and more preferably 65 to 75 mol% of constituent units based on ethylene oxide based on all the polymerization units. Is particularly preferred.
  • the polyether-based polymer is preferably 1 to 15 mol%, more preferably 2 to 12 mol%, and more preferably 3 to 10 mol based on the total polymerization units of constituent units based on allyl glycidyl ether. % Is particularly preferred.
  • the polyether-based polymer preferably contains 10 to 45 mol%, more preferably 15 to 35 mol%, of structural units based on epichlorohydrin, based on all the polymerization units, and more preferably 20 to 30 Particularly preferred is mol%.
  • the polyether polymer when the total amount of the (a) rubber component is 100 parts by mass, is preferably contained in an amount of 10% by mass or more, and 30% by mass or more. Is more preferable, containing 70% by mass or more is particularly preferable, and containing 90% by mass or more is most preferable.
  • polyether polymer of the present invention examples include epichlorohydrin homopolymer, epichlorohydrin-ethylene oxide copolymer, epichlorohydrin-propylene oxide copolymer, epichlorohydrin- Ethylene oxide-allyl glycidyl ether terpolymer, epichlorohydrin-propylene oxide-allyl glycidyl ether terpolymer, ethylene oxide-propylene oxide-allyl glycidyl ether terpolymer, epichlorohydrin-ethylene It is an oxide-propylene oxide-allyl glycidyl ether quaternary copolymer or the like, and may be constituted by blending a plurality of polymers.
  • the polyether polymer can be produced by a solution polymerization method, a slurry polymerization method or the like at a temperature of ⁇ 20 to 100 ° C. using a catalyst capable of ring-opening polymerization of an oxirane compound.
  • a catalyst capable of ring-opening polymerization of an oxirane compound include, for example, a catalyst system mainly composed of organic aluminum, which is reacted with water, an oxo acid compound of phosphorus, an acetylacetone or the like, a catalyst system mainly composed of organic zinc, which is reacted with water, A phosphoric acid ester condensate catalyst system etc. are mentioned.
  • the organotin-phosphate ester condensate catalyst system described in the applicant's US Pat. No. 3,773,694 can be used to produce the polyether polymers of the present invention.
  • the semiconductive rubber composition of the present invention may contain only a polyether-based polymer as the rubber component (a), and may further contain a rubber species other than the polyether-based polymer.
  • rubbers other than polyether polymers obtained by polymerizing an oxirane compound include natural rubber and synthetic rubber, and synthetic rubbers include isoprene rubber (IR), 1,2-polybutadiene (VBR), and styrene butadiene rubber (SBR), butyl rubber (IIR), ethylene propylene rubber (EPM), ethylene propylene diene rubber (EPDM), chloroprene rubber (CR), chlorosulfonated polyethylene (CSM), chlorinated polyethylene (CPE), acrylic rubber (ACM) And at least one selected from ethylene propylene rubber (EPDM), chloroprene rubber (CR) and acrylonitrile butadiene rubber (NBR), including acrylonitrile butadiene rubber (NBR) and hydrogenated acrylonitrile butadiene rubber (H-
  • the polyether polymer is contained in an amount of 10 to 90% by mass in the rubber component. It is preferable to contain 90 to 10% by mass of rubber species other than ether-based polymers, and to contain 30 to 90% by mass of the polyether-based polymers and 70 to 10% by mass of rubber species other than the polyether-based polymers. It is more preferable to contain 70 to 90% by mass of the polyether polymer and 30 to 10% by mass of a rubber species other than the polyether polymer.
  • the (b) copper compound can be used without limiting the inorganic copper compound and the organic copper compound, and as specific examples of these, copper copper thiocyanate (rhodan copper) and copper cyanide can be used as the inorganic copper compound.
  • Copper cyanide copper soda cyanide, copper cyanide cyanide, copper sulfate, copper nitrate, copper carbonate, copper iodide, copper iodate, copper acetoarsenate, copper pyrophosphate, copper borofluoride, copper oxide, copper hydroxide
  • Examples include copper peroxide, copper chloride, copper iodide, copper bromide, copper fluoride, copper carbide, copper sulfide, cupric ammonium chloride, copper azide and the like
  • organic copper compounds include copper acetate and copper octylate , Copper naphthenate, copper stearate, copper benzoate, copper laurate, copper terephthalate of carboxylic acid such as copper terephthalate, copper dimethyldithiocarbamate, copper diethyl carbamate, copper dibutyldithiocarbamate, N-ethyl-N-pheny Dithiocarbamates, N- pent
  • the copper compound (b) of the present invention is an inorganic copper compound selected from copper oxide, copper hydroxide, copper carbonate, copper chloride, copper sulfide, copper sulfate, copper salt of carboxylic acid and copper salt of dithiocarbamic acid Copper oxide, copper stearate and copper dimethyldithiocarbamate are preferable.
  • the lower limit of the (b) copper compound is preferably 0.01 parts by mass or more, and more preferably 0.1 parts by mass or more with respect to 100 parts by mass of the rubber component (a).
  • the content is further preferably 0.2 parts by mass or more, particularly preferably 0.25 parts by mass or more, and the upper limit is preferably 20 parts by mass or less, more preferably 15 parts by mass or less, and 10 It is particularly preferred that the amount is at most parts by mass.
  • organic peroxide (c) used to crosslink the semiconductive rubber composition in the present invention include tert-butyl hydroperoxide and 1,1,3,3-tetramethylbutyl hydroperoxide.
  • the lower limit of (c) organic peroxide is 1.5 parts by mass or more, 2.5 parts by mass or more, and 3 parts by mass with respect to 100 parts by mass of the rubber component (a).
  • the upper limit may be 10 parts by mass or less, more preferably 8 parts by mass or less, and particularly preferably 6 parts by mass or less.
  • the lower limit of the amount of active oxygen X (%) of the organic peroxide (c) is preferably 1% or more, more preferably 2% or more, and the upper limit is 10, in accordance with the above-mentioned blending amount. % Or less is preferable, 8% or less is more preferable, and 7% or less is more preferable.
  • the amount of active oxygen X (%) of the organic peroxide can be calculated from the theoretical amount of active oxygen Y (%) of the compound and the purity (%) of the compound used. The theoretical amount of active oxygen is calculated by the following formula (1).
  • Theoretical active oxygen content (%) ⁇ (number of peroxide bonds in molecule ⁇ 16) / molecular weight ⁇ ⁇ 100 (1)
  • the semiconductive rubber composition of the present invention may further contain (d) a crosslinking aid in addition to the components (a), (b) and (c).
  • crosslinking aid examples include sulfur, sulfur compounds such as dipentamethylenethiuram tetrasulfide, ethylene di (meth) acrylate, polyethylene di (meth) acrylate, divinyl benzene, diallyl phthalate, triallyl cyanurate, tri Multifunctional monomers such as allyl isocyanurate, trimethylolpropane trimethacrylate, m-phenylenedimaleimide, toluylene bismaleimide, p-quinone oxime, p, p'-benzoylquinone oxime, o, o'- An oxime compound such as dibenzoyl-p-quinone dioxime is exemplified.
  • crosslinking assistant (d) of the present invention is at least one selected from trimethylolpropane trimethacrylate, triallyl isocyanurate, o, o'-dibenzoyl-p-quinone dioxime, and m-phenylene dimaleimide. Is preferred.
  • the lower limit is preferably 0.01 parts by mass or more, and more preferably 0.05 parts by mass or more, with respect to 100 parts by mass of the rubber component (a), as the compounding amount of the (d) crosslinking aid.
  • the content is more preferably 0.1 parts by mass or more, still more preferably 0.2 parts by mass or more, particularly preferably 0.3 parts by mass or more, and the upper limit is 10 parts by mass or less Is preferable, 5 parts by mass or less is more preferable, and 3 parts by mass or less is particularly preferable.
  • a conductive agent may be further added.
  • the (e) conductive agent in the present invention include quaternary ammonium salts, borates, perchlorates, potassium salts, surfactants, lithium salts and the like.
  • tetrabutylammonium bromide tetrabutylammonium perchlorate, ethyltributylammonium ethosulfate, sodium perchlorate, lithium perchlorate, calcium perchlorate, lauryltrimethylammonium chloride, stearyltrimethylammonium chloride, octadecyl Trimethyl ammonium chloride, dodecyl trimethyl ammonium chloride, hexadecyl trimethyl ammonium chloride, trioctyl propyl ammonium bromide, dimethyl alkyl lauryl betaine, lithium trifluoromethane sulfonate etc. are mentioned, and it is preferable to include at least one.
  • the content of the (e) conductive agent is preferably 0.1 to 10 parts by mass, and more preferably 0.2 to 8 parts by mass with respect to 100 parts by mass of the (a) rubber component. And particularly preferably 0.3 to 5 parts by mass.
  • the semiconductive rubber composition of the present invention may further contain (f) a filler.
  • a filler As the filler (f) in the present invention, organic fillers and inorganic fillers can be exemplified, and inorganic fillers are preferable, and oxides, hydroxides of metals such as titanium, magnesium, zinc, calcium and the like And carbonates. Specifically, calcium carbonate, talc, silica, clay, carbon fiber, glass fiber, carbon black, titanium oxide, magnesium oxide, hydrotalcite, magnesium hydroxide, antimony oxide, zinc oxide and the like can be exemplified.
  • the lower limit of the content of the (f) filler may be 5 parts by mass or more, 15 parts by mass or more, and 20 parts by mass or more with respect to 100 parts by mass of the (a) rubber component.
  • the amount may be 25 parts by mass or more, and the upper limit may be 80 parts by mass or less, 60 parts by mass or less, and 50 parts by mass or less.
  • anti-aging agents used in the present invention known anti-aging agents can be used, and examples thereof include phenyl- ⁇ -naphthylamine, p-toluenesulfonylamido-diphenylamine, 4,4- ⁇ , ⁇ -dimethylbenzyl diphenylamine , High temperature reaction product of diphenylamine and acetone, Low temperature reaction product of diphenylamine and acetone, diphenylamine, aniline, low temperature reaction product of acetone, reaction product of diphenylamine and diisobutylene, octylated diphenylamine, substituted diphenylamine, alkylated diphenylamine, diphenylamine Derivatives, N, N'-diphenyl-p-phenylenediamine, N-isopropyl-N'-phenyl-p-phenylenediamine, N, N'-di-2-naphthyl-p-phenylened
  • the semiconductive rubber composition of the present invention in addition to the above, various acid acceptors, reinforcing agents, plasticizers, processing aids, difficult to carry out in the relevant technical field as long as the effects of the present invention are not impaired.
  • a flame retardant, a pigment, a vulcanization accelerator and the like can be optionally blended.
  • any means conventionally used in the field of polymer processing can be used, and for example, mixing rolls, Banbury mixers, various kneaders, etc. can be used.
  • As a molding method compression molding with a metal mold, extrusion molding, injection molding and the like can be exemplified, but extrusion molding and injection molding using the semiconductive rubber composition of the present invention are preferable.
  • the rubber material using the semiconductive rubber composition of the present invention is not particularly limited in the production method, but is preferably obtained by crosslinking. Specifically, it is usually obtained by heating to 100 to 200 ° C., and the crosslinking time is usually from 0.5 to 300 minutes although it varies depending on the temperature.
  • any method such as compression molding with a mold, injection molding, air bath, heating by infrared rays or microwave can be used.
  • each compounding agent shown in Tables 1 and 2 was kneaded in a pressure kneader at 120 ° C. to prepare A-mixing compound.
  • the A-mixing compound was kneaded with an open roll to prepare a B-mixing compound.
  • a in the table is a raw material of the A mixing compound
  • B is a raw material to be mixed with the A mixing compound when the B mixing compound is formed.
  • ⁇ Volume resistivity> The sheeting of the B mixing compound prepared above was press vulcanized at 160 ° C. for 15 minutes.
  • the resulting crosslinked sheet is conditioned in a 10 ° C./15% RH environment, in a 23 ° C./50% RH environment, and in a 35 ° C./85% RH environment, respectively, and then doubled according to JIS K6271.
  • the volume resistivity after 1 minute of application of 10 V is measured using a high restor manufactured by Mitsubishi Yuka Co., Ltd. using a ring electrode.
  • ⁇ Environmental variation of volume resistivity> Based on the respective volume resistivities in a 35 ° C./85% RH environment under a 10 ° C./15% RH environment obtained by measurement of the volume resistivity, the environmental fluctuation of the volume resistivity was determined. The smaller the numerical value of the environmental fluctuation of the volume resistivity, the smaller the environmental dependency of the volume resistivity.
  • the environmental fluctuation of volume resistivity in this application is the logarithm of volume resistivity in low temperature and low humidity environment (in 10 ° C / 15% RH environment) and volume resistance in high temperature and high humidity environment (in 35 ° C / 85% RH environment) It is calculated from the difference between logarithms of rates, and more specifically, it is calculated by the following formula. log 10 (10 ° C. ⁇ 15% RH volume resistivity) ⁇ log 10 (35 ° C. ⁇ 85% RH volume resistivity)
  • ⁇ Resilience modulus> The measurement of the impact resilience was performed by a pendulum test method according to JIS K 6255, using a measuring apparatus "table-top impact resilience tester made by Polymer Instruments Co., Ltd.” RT-90.
  • the semiconductive rubber composition targeted by the present invention is excellent in environmental dependency of volume resistivity while maintaining semiconductivity, and as development, charging and transfer roll in a laser printer and a copier. It is widely applicable.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Un matériau de caoutchouc semi-électroconducteur, dont la dépendance environnementale de la résistivité volumique est réduite, est souhaité, ce matériau de caoutchouc étant destiné à être utilisé comme rouleaux de caoutchouc semi-électroconducteur et comme courroies sans fin semi-électroconductrices, ou dans de tels rouleaux et courroies destinés au développement électrophotographique, à la charge, au transfert, etc. dans des copieurs, imprimantes, etc. La présente invention aborde le problème de l'examen de nouvelles compositions. La présente invention concerne : une composition de caoutchouc semi-électroconductrice caractérisée en ce qu'elle comprend (a) un polymère à base de polyéther en tant qu'ingrédient de caoutchouc, (b) un composé de cuivre, et (c) un peroxyde organique, ce peroxyde organique (c) étant contenu dans une quantité de 1,5 parties en masse pour 100 parties en masse de l'ingrédient de caoutchouc (a) ; ainsi qu'un matériau de caoutchouc semi-électroconducteur obtenu à partir de la composition de caoutchouc semi-conductrice.
PCT/JP2018/043539 2017-12-27 2018-11-27 Composition de caoutchouc semi-électroconductrice WO2019130946A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000015714A (ja) * 1998-07-02 2000-01-18 Sumitomo Rubber Ind Ltd 導電性シームレスベルト
JP2006084573A (ja) * 2004-09-14 2006-03-30 Fuji Xerox Co Ltd 電子写真装置の弾性部材用エラストマー組成物、電子写真装置の弾性部材、電子写真装置
JP2007224215A (ja) * 2006-02-24 2007-09-06 Nippon Zeon Co Ltd 半導電性ゴム組成物、架橋性ゴム組成物およびゴム架橋物
WO2013051689A1 (fr) * 2011-10-07 2013-04-11 ダイソー株式会社 Composition de caoutchouc semi-conductrice

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000015714A (ja) * 1998-07-02 2000-01-18 Sumitomo Rubber Ind Ltd 導電性シームレスベルト
JP2006084573A (ja) * 2004-09-14 2006-03-30 Fuji Xerox Co Ltd 電子写真装置の弾性部材用エラストマー組成物、電子写真装置の弾性部材、電子写真装置
JP2007224215A (ja) * 2006-02-24 2007-09-06 Nippon Zeon Co Ltd 半導電性ゴム組成物、架橋性ゴム組成物およびゴム架橋物
WO2013051689A1 (fr) * 2011-10-07 2013-04-11 ダイソー株式会社 Composition de caoutchouc semi-conductrice

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