WO2019127014A1 - 电镀组合机构 - Google Patents

电镀组合机构 Download PDF

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Publication number
WO2019127014A1
WO2019127014A1 PCT/CN2017/118619 CN2017118619W WO2019127014A1 WO 2019127014 A1 WO2019127014 A1 WO 2019127014A1 CN 2017118619 W CN2017118619 W CN 2017118619W WO 2019127014 A1 WO2019127014 A1 WO 2019127014A1
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WO
WIPO (PCT)
Prior art keywords
cathode
electroplating
disposed
plating
assembly mechanism
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PCT/CN2017/118619
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English (en)
French (fr)
Inventor
黄愽道
刘耀崇
Original Assignee
汉玛科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 汉玛科技股份有限公司 filed Critical 汉玛科技股份有限公司
Priority to PCT/CN2017/118619 priority Critical patent/WO2019127014A1/zh
Priority to CN201780045216.1A priority patent/CN111630210B/zh
Priority to EP17936813.9A priority patent/EP3733934A4/en
Priority to KR1020197007654A priority patent/KR102221652B1/ko
Priority to JP2019503564A priority patent/JP6800308B2/ja
Publication of WO2019127014A1 publication Critical patent/WO2019127014A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/22—Apparatus for electrolytic coating of small objects in bulk having open containers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks

Definitions

  • the present invention relates to an electroplating assembly mechanism, and more particularly to an electroplating assembly mechanism for electroplating or electroless plating of a plurality of small parts.
  • Hanging plating is a plating method in which parts are mounted on a hanger for plating deposition, and is generally used for plating of large-sized parts.
  • barrel plating is generally used for small parts that cannot be or are not suitable for hanging due to factors such as shape and size.
  • Barrel plating also known as roller plating, is to place a certain number of small parts in a special roller and deposit various metal or alloy coatings on the surface of the part in an indirect conductive manner to achieve surface protection, decoration or functionality. the goal of.
  • the plating method of the barrel plating parts has undergone a large change, in which the hanging plating is performed in a state in which the parts are separately packaged, and the barrel plating is performed in a state where the parts are concentrated and separated from each other, in this state.
  • the mixing cycle of the parts is generated during the process; in addition, the plating is performed in a state where the parts are completely exposed, and the barrel plating is performed in a closed drum (having a hole in the wall plate) and a solution having a low concentration of the solution.
  • the change in the way the part is plated brings two major defects to the barrel plating, namely the defects caused by the mixing cycle and the structural defects of the barrel plating.
  • the above defects have a serious impact on the production efficiency of the barrel plating and the improvement of the product quality, so that the superiority of the barrel plating cannot be fully exerted.
  • the current barrel plating technique is to connect the drum to a driving device. After loading the workpiece to be plated in the drum, the driving device is operated in the plating tank, and the workpiece to be plated is turned over to promote the electrolysis. The liquid is in sufficient contact to produce an electrochemical action. Since many of the needle-like or flaky microelectronic product parts are surface-plated, usually in a plating cylinder, there are many kinds of plating cylinders in the prior art, and most of the plating cylinders are Driven by a horizontal drive unit, these plating drums generally have problems of complicated structure, difficulty in solution replacement, low plating efficiency, unevenness, and high maintenance cost.
  • a plating drum is disposed at a lower end of a driving shaft for enabling the plating tank provided with the anode to be rotationally driven, and is discharged from the inside of the plating cylinder by the centrifugal force acting when the plating cylinder is rotationally driven. External and external to the inside.
  • the plating drum is fixed to the lower end of the drive shaft and cannot be removed by the transfer, so that the plating process of the automatic transfer change can not be achieved.
  • the main object of the present invention is to provide an electroplating assembly mechanism for forming a vortex into a plating solution in an annular cylinder by using a vortex blade, so that the plating solution is rapidly exchanged, and the flow direction of the plating solution is stabilized by the power line guide ring.
  • the plating solution can uniformly soak the small parts to achieve uniform plating effect on the surface of the small parts.
  • the present invention provides an electroplating assembly mechanism for electroplating a plurality of small parts, the electroplating assembly mechanism comprising a plating cylinder for receiving the small parts, wherein the electroplating cylinder has a ring shape a cylinder, a rotating shaft, an engaging portion and a plurality of vortex blades.
  • a first end of the rotating shaft is disposed on the annular cylinder, the engaging portion is disposed at a bottom of the annular cylinder for being rotated by a driver, and the vortex blade is disposed at the ring The bottom of the barrel.
  • the electroplating assembly mechanism further includes a moving frame, the plating drum is combined on the moving frame, the moving frame has a fixing plate, two side plates, two auxiliary rods and a a rotary joint, the side plates are combined on two sides of the fixed plate, the auxiliary rod is disposed between the side plates, the annular cylinder is located above the auxiliary rod, and the rotary joint is pivotally connected
  • the fixing plate is configured to be combined with a second end of the rotating shaft.
  • the moving frame further has two cathode seats respectively disposed on two sides of a bottom of the fixing plate for electrically connecting with a cathode ring.
  • the moving frame further has a cathode lead connecting the two cathode blocks for electrically connecting to the cathode ring.
  • the annular cylinder has a base, a surrounding wall, an upper cover and a cathode ring, the base is combined with the surrounding wall, and the upper cover covers the surrounding An inner space is formed in the wall, the rotating shaft is connected to the upper cover from the base and extends outward, and the cathode ring is disposed in the surrounding wall.
  • the plating drum further has a power wire guide ring disposed in the annular cylinder and spaced apart from the surrounding wall.
  • the plating drum further includes a current transport layer disposed on the base of the annular cylinder.
  • the annular cylinder further has a plurality of cathode discs and a plurality of sloping flow guiding slopes, and the cathode disc and the slanting flow guiding slope are alternately arranged at the current transmission layer Above, and the cathode disc is located between adjacent two deflection flow guides.
  • the cathode ring surrounding the wall of the annular cylinder can be electrically connected to the cathode seat through the cathode wire via the rotating shaft, and the ring is generated when the plating drum starts to rotate to generate centrifugal force.
  • the small parts in the cylinder are driven to move toward the cathode ring, and at the same time, the vortex blades form a vortex to the plating solution in the annular cylinder, so that the plating solution is quickly exchanged and transmitted through the power line guide.
  • the design of the ring can stabilize the flow direction of the plating solution, so that the plating solution can uniformly soak the small parts to achieve uniform plating effect on the surface of the small parts.
  • Figure 1 is a cross-sectional view of a preferred embodiment of an electroplating assembly in accordance with the present invention.
  • FIG. 2 is an exploded view of a preferred embodiment of an electroplating assembly in accordance with the present invention.
  • Figure 3 is an exploded view of another preferred embodiment of the electroplating assembly mechanism in accordance with the present invention.
  • a preferred embodiment of a plating assembly mechanism for mounting a plurality of small parts for electroplating or electroless plating is, for example, a chip type resistor, Inductors, capacitors, connectors, precision parts, etc.
  • the electroplating assembly mechanism includes a moving frame 2 and a plating drum 3. The detailed construction, assembly relationship, and operation principle of each component will be described in detail below.
  • the moving frame 2 has a fixing plate 21, two side plates 22, two auxiliary levers 24, two holding members 26, a rotary joint 27, two cathode seats 28 and a cathode wire. 29; wherein the side plates 22 are combined on both sides of the fixing plate 21, the auxiliary rods 24 are disposed between the side plates 22, and the holding members 26 are respectively disposed at intervals of the fixing plate 21 Two sides of a top surface for being lifted and moved, the rotary joint 27 is pivotally connected to the fixing plate 21 for combining with a second end 322 of the rotating shaft 32, the cathode The seat 28 is disposed on two sides of a bottom portion of the fixing plate 21, and the cathode wire 29 connects the two cathode holders 28.
  • the plating drum 3 is for receiving the small parts (not shown), and the plating drum 3 may be combined on the moving frame 2, wherein the plating drum 3 has an annular cylinder 31, a rotating shaft 32, an engaging portion 33, a current transmission layer 34, a power line guide ring 36 and a plurality of vortex blades 37, a first end 321 of the rotating shaft 32 is disposed at the The annular cylinder 31 is disposed, and the engaging portion 33 is located below the first end 321 .
  • the vortex blades 37 are disposed on the disk body 38 at intervals around the rotating shaft 32.
  • the engaging portion 33 is disposed at a bottom of the annular cylinder 31, wherein an end surface of the second end 322 is in the shape of a claw, and the auxiliary rod 24 is disposed on the side plate 22
  • the annular cylinder 31 is located above the auxiliary lever 24.
  • the engaging portion 33 is for mounting a driver (not shown) and receiving the driver. The drive wheel is rotated and rotated.
  • the current transport layer 34 is made of titanium metal or titanium-plated, titanium-sprayed material
  • the annular cylinder 21 is made of a plastic material
  • the current transport layer 34 and the An intermediate layer (not shown) is disposed between the annular cylinders 21, and the intermediate layer is made of a plastic material.
  • the annular cylinder 31 has a base 311, a surrounding wall 312, an upper cover 313 and a cathode ring 314.
  • the base 311 is combined with the surrounding wall 312.
  • An upper cover 313 covers the surrounding wall 312 and defines an internal space (not shown) for accommodating the small part, and the rotating shaft 32 is connected to the upper cover 313 from the base 311.
  • the cathode ring 314 is disposed on an inner surface of the surrounding wall 312, and the cathode wire 29 is electrically connected to the cathode ring 314 via the rotating shaft 22.
  • the disk body 38 is combined on the base 311 such that the vortex blades 37 are located above the base 311.
  • the rotation of the rotary joint 27 can cause the annular cylinder 31 to be separated from the rotating shaft 32 from the moving frame 2, and the cathode holder 28 on both sides of the bottom of the fixing plate 21
  • the cathode ring 314 can be electrically connected to the power supply contact, and the power supply is cut off when the fixing plate 21 is moved away.
  • the cathode ring 314 is rotationally accelerated to a predetermined rotational speed, the small part (the object to be plated) in the annular cylinder 31 is pressed against the cathode ring 314 by centrifugal force, and is supplied with electricity for electroplating.
  • the power is turned off and the cathode ring 314 is decelerated to a low rotational speed, and the small part (the object to be plated) in the annular cylinder 31 is mixed by gravity at the bottom of the annular cylinder 31 to be mixed.
  • the cathode ring 314 is rotated and accelerated to a predetermined rotation speed, so that the small parts (the object to be plated) are intermittently mixed at a low speed and accelerated, and then mixed at a low speed and accelerated.
  • the surface of the small component (the object to be plated) can have a more uniform plating effect.
  • the cathode ring 314 of the annular cylinder 31 surrounding the wall 312 can be electrically connected to the cathode seat 28 through the cathode wire 29 via the rotating shaft 22, when the plating drum 3 starts to rotate.
  • the centrifugal force is generated, the small part in the annular cylinder 21 is driven to move toward the cathode ring 314, and at the same time, the vortex blade 37 forms a vortex on the plating solution in the annular cylinder 21.
  • the plating solution is quickly exchanged, and through the design of the power line guide ring 36, the flow direction of the plating solution can be stabilized, so that the plating solution can uniformly soak the small parts to reach the small parts. The effect of uniform plating on the surface.
  • the driver can be easily engaged and rotated by the driver.
  • the rotary joint 27 is designed such that the plating drum 3 can be easily mounted on or detached from the moving frame 2, thereby shortening the speed of the plating drum 3, and Improve the efficiency of plating operations.
  • the annular cylinder 31 is rotated by the engaging portion 33, and the small component in the annular cylinder 21 is driven to the cathode ring by centrifugal force during rotation. The movement of 314 allows the small part to move tumbling efficiently in the plating solution.
  • FIG. 3 is another preferred embodiment of the electroplating assembly mechanism of the present invention, and generally uses the same component names and drawings as the above preferred embodiment, but the difference between the two is characterized by: the annular cylinder 31 has a plurality of cathode discs 317 and a plurality of sloping flow guides 318, and the cathode discs 317 and the sloping flow guides 318 are alternately spaced on the current transport layer 34, and the cathode wafer 317 Located between adjacent two deflection flow guides 318. Therefore, the preferred embodiment can also make the plating drum 3 easy to move and replace, and can achieve the effect of uniformly plating the surface of the small part according to the requirement that different types of small parts are plated.
  • the cathode ring 314 of the annular cylinder 31 surrounding the wall 312 can be electrically connected to the cathode holder 28 through the cathode wire 29 via the rotating shaft 22, when the plating drum 3 starts to rotate.
  • the centrifugal force is generated, the small part in the annular cylinder 21 is driven to move toward the cathode ring 314.
  • the vortex vanes 37 form a vortex to the plating solution in the annular cylinder 21, so that the plating solution is quickly exchanged, and the design of the power line guide ring 36 can stabilize the flow of the plating solution.
  • the direction enables the plating solution to uniformly soak the small parts to achieve uniform plating effect on the surface of the small parts.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

一种电镀组合机构，包含一电镀滚筒（3）；所述电镀滚筒（3）具有一环形筒体（31）、一转轴（32）、一卡合部（33）及多个涡流叶片（37），所述转轴（32）的一第一端（321）设置在所述环形筒体（31）上，所述卡合部（33）设置在所述环形筒体（31）的一底部，用以被一驱动器带动旋转，所述涡流叶片（37）设置在所述环形筒体（31）的底部。

Description

电镀组合机构 技术领域
本发明是涉及一种电镀组合机构，特别是关于使用于电镀或化学镀多个小型零件的一种电镀组合机构。
背景技术
通常情况下电镀有两种方式，一种是挂镀，另一种是滚镀。挂镀是将零件装在挂具上进行镀层沈积处理的一种电镀方式，一般用于大尺寸零件的电镀。而对于因形状、大小等因素影响无法或不宜装挂的小零件，则一般采用滚镀。滚镀亦称滚筒电镀，它是将一定数量的小零件置于专用滚筒内、在滚动状态下以间接导电方式在零件表面沈积各种金属或合金镀层，以达到表面防护、装饰或功能性的目的。与挂镀相比，滚镀零件的受镀方式发生了较大改变，其中挂镀在零件单独分装的状态下进行，而滚镀在零件集中且时合时离的状态下进行，在这个过程中产生了零件的混合周期；另外，挂镀在零件完全暴露的状态下进行，而滚镀在封闭的(虽然壁板上有孔)、溶液浓度较低的滚筒内进行。零件受镀方式的改变给滚镀带来两个最主要缺陷，即混和周期带来的缺陷和滚镀的结构缺陷。上述的缺陷对滚镀生产效率和产品质量的提高造成严重影响，使滚镀的优越性不能得以充分发挥。
进一步来说，目前的滚镀技术是将滚筒连接于一驱动装置，当滚筒内加载待镀工件后，接着置于电镀槽内运转所述驱动装置，而使待镀工件翻转，促使其与电解液充分接触而产生电化学作用，由于许多针状或薄片状的微小电子产品零件的表面电镀，通常在电镀滚筒中进行，现有技术中有很多种电镀滚筒，大部分的电镀滚筒都是由水平的驱动装置进行驱动，这些电镀滚筒普遍存在结构复杂、溶液置换不易、电镀效率低且不均匀及维护成本较高的问题。
另外，还有一种电镀滚筒是设置在一驱动轴的下端，用以使装设有阳极的电镀槽能够被旋转驱动，并且利用电镀滚筒旋转驱动时所作用的离心力，从电镀滚筒的内部流出到外部并且从外部流入到内部。但是，所述电镀滚筒是固定在驱动轴的下端，无法被搬移抽换，因而无法达成自动搬移换槽的电镀流程。
因此，有必要提供改良的一种电镀组合机构，以解决上述现有技术所存在的问题。
发明内容
有鉴于此，本发明的主要目的在于提供一种电镀组合机构，利用涡流叶片对环形筒体内的电镀液形成涡流，使得电镀液被快速交换，并且透过电力线导环稳定电镀液的流动方向，使电镀液能够均匀地浸泡所述小型零件，而达到小型零件的表面均匀电镀的效果。
为达上述的目的，本发明提供一种电镀组合机构，用以电镀多个小型零件，所述电镀组合机构包括一电镀滚筒，用以承装所述小型零件，其中所述电镀滚筒具有一环形筒体、一转轴、一卡合部及多个涡流叶片。所述转轴的一第一端设置在所述环形筒体上，所述卡合部设置在所述环形筒体的一底部，用以被一驱动器带动旋转，所述涡流叶片设置在所述环形筒体的底部。
在本发明的一实施例中，所述电镀组合机构还包含一移动架，所述电镀滚筒组合在所述移动架上，所述移动架具有一固定板、二侧板、二辅助杆及一旋转接头，所述侧板组合在所述固定板的二侧，所述辅助杆设置在所述侧板之间，使所述环形筒体位于所述辅助杆之上，所述旋转接头枢接所述固定板上，用以与所述转轴的一第二端组合在一起。
在本发明的一实施例中，所述移动架还具有二阴极座，分别设置在所述固定板的一底部的二侧，用以与一阴极环电性连接。
在本发明的一实施例中，所述移动架还具有一阴极导线，连接所述两阴 极座，用以与所述阴极环电性连接。
在本发明的一实施例中，所述环形筒体具有一底座、一围绕壁、一上盖及一阴极环，所述底座与所述围绕壁相结合，所述上盖覆盖在所述围绕壁上并形成一内部空间，所述转轴自所述底座连接所述上盖并向外延伸，所述阴极环设置在所述围绕壁内。
在本发明的一实施例中，所述电镀滚筒还具有一电力线导环，设置在所述环形筒体内且与所述围绕壁相间隔。
在本发明的一实施例中，所述电镀滚筒还包含一电流传输层，所述电流传输层设置在所述环形筒体的底座上。
在本发明的一实施例中，所述环形筒体还具有多个阴极圆片及多个挠流导坡，所述阴极圆片及所述挠流导坡交替间隔设置在所述电流传输层上，而且所述阴极圆片位于相邻二挠流导坡之间。
如上所述，所述环形筒体的围绕壁的阴极环可经所述转轴透过所述阴极导线与所述阴极座电性连接，当所述电镀滚筒开始旋转而产生离心力时，所述环形筒体内的所述小型零件被带动往所述阴极环移动，同时，所述涡流叶片会对所述环形筒体内的电镀液形成涡流，而使得电镀液被快速交换，并且透过所述电力线导环的设计，能够稳定所述电镀液的流动方向，使所述电镀液能够均匀地浸泡所述小型零件，而达到所述小型零件的表面均匀电镀的效果。
附图说明
图1是根据本发明电镀组合机构的一较佳实施例的一剖视图。
图2是根据本发明电镀组合机构的一较佳实施例的一分解图。
图3是根据本发明电镀组合机构的另一较佳实施例的一分解图。
实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的 特定实施例。再者，本发明所提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧面、周围、中央、水平、横s向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参照图1及2所示，为本发明一种电镀组合机构的一较佳实施例，用以承装多个小型零件以进行电镀或化学镀，所述小型零件为例如：芯片型电阻、电感、电容、连接器、精密零件等。其中所述电镀组合机构包括一移动架2及一电镀滚筒3。本发明将于下文详细说明各组件的细部构造、组装关系及其运作原理。
续参照图1及2所示，所述移动架2具有一固定板21、二侧板22、二辅助杆24、二个握持件26、一旋转接头27、二阴极座28及一阴极导线29；其中所述侧板22组合在所述固定板21的二侧，所述辅助杆24设置在所述侧板22之间，所述握持件26分别间隔设置在所述固定板21的一顶面的二侧，用以被提拉而进行移动，所述旋转接头27枢接所述固定板21上，用以与所述转轴32的一第二端322组合在一起，所述阴极座28设置在所述固定板21的一底部的二侧，所述阴极导线29连接所述两阴极座28。
续参照图1及2所示，所述电镀滚筒3是用以承装所述小型零件(未绘示)，而且所述电镀滚筒3可以组合在所述移动架2上，其中所述电镀滚筒3具有一环形筒体31、一转轴32、一卡合部33、一电流传输层34、一电力线导环36及多个涡流叶片37，所述转轴32的一第一端321设置在所述环形筒体31上，而且所述卡合部33位于所述第一端321的下方，所述涡流叶片37是围绕所述转轴32间隔排列地设置在一盘体38上。另外，所述卡合部33设置在所述环形筒体31的一底部，其中所述第二端322的一端面是呈夹爪状，而且所述辅助杆24是设置在所述侧板22之间，使所述环形筒体31位于所述辅助杆24之上，要说明的是，所述卡合部33是用以安装一驱动器(未绘示)上， 而受到所述驱动器的一驱动轮带动而转动。
要说明的是，所述电流传输层34是由钛金属或镀钛、喷钛物质所制成，所述环形筒体21是由塑料类材质所制成，所述电流传输层34及所述环形筒体21之间设置一中间层(未绘示)，所述中间层由塑料类材质所制成。
续参照图1及2所示，所述环形筒体31具有一底座311、一围绕壁312及一上盖313及一阴极环314，所述底座311与所述围绕壁312相结合，所述上盖313覆盖在所述围绕壁312上并形成一内部空间(未标示)，所述内部空间用以容置所述小型零件，所述转轴32自所述底座311连接所述上盖313并向上延伸，所述阴极环314设置在所述围绕壁312的一内表面，所述阴极导线29可经所述转轴22而与所述阴极环314电性连接。另外，所述盘体38组合是所述底座311上，使所述涡流叶片37位于所述底座311的上方。
依据上述的结构，松开所述旋转接头27可以使所述环形筒体31与所述转轴32一并脱离所述移动架2，所述固定板21的底部的二侧的所述阴极座28在通电接触时能够与所述阴极环314电性连接，当所述固定板21搬离时形成断电。另外，当所述阴极环314旋转加速至一指定转速时，所述环形筒体31内的所述小型零件(被镀物)因离心力紧贴于所述阴极环314，并且供电进行电镀，在一段时间后断电并使所述阴极环314减速至一低转速，所述环形筒体31内的所述小型零件(被镀物)因重力落于所述环形筒体31底部而进行混合，接着所述小型零件(被镀物)混合之后再将所述阴极环314旋转加速至指定转速，如此间歇进行所述小型零件(被镀物)低速混合及加速电镀，再低速混合及加速电镀，进而使所述小型零件(被镀物)的表面能够有更均匀的电镀效果。
通过上述的设计，所述环形筒体31的围绕壁312的阴极环314可经所述转轴22透过所述阴极导线29与所述阴极座28电性连接，当所述电镀滚筒3开始旋转而产生离心力时，所述环形筒体21内的所述小型零件被带动往所述 阴极环314移动，同时，所述涡流叶片37会对所述环形筒体21内的电镀液形成涡流，而使得电镀液被快速交换，并且透过所述电力线导环36的设计，能够稳定所述电镀液的流动方向，使所述电镀液能够均匀地浸泡所述小型零件，而达到所述小型零件的表面均匀电镀的效果。
进一步地，利用所述所述卡合部33的设计，能够能够轻易地卡合驱动器上，并且由所述驱动器带动旋转。另外，所述旋转接头27的设计，使所述电镀滚筒3能够轻易地安装在所述移动架2上或从所述移动架2拆卸，进而能够缩短所述电镀滚筒3的拆换速度，并提高电镀作业的效率。另外，透过所述卡合部33被带动而使所述环形筒体31旋转，藉由在旋转时的离心力，使所述环形筒体21中的所述小型零件被带动往所述阴极环314移动，而使所述小型零件在电镀液中能够有效率地移动翻滚。
请参照图3所示，为本发明电镀组合机构的另一较佳实施例，并大致沿用上述较佳实施例相同组件名称及图号，但两者间差异之特征在于：所述环形筒体31具有多个阴极圆片317及多个挠流导坡318，所述阴极圆片317及所述挠流导坡318交替间隔设置在所述电流传输层34上，而且所述阴极圆片317位于相邻二挠流导坡318之间。因此，本较佳实施例同样可以使所述电镀滚筒3容易移动置换，而且能够依据不同种类的小型零件被电镀的需求，而达到使所述小型零件的表面均匀电镀的效果。
如上所述，所述环形筒体31的围绕壁312的阴极环314可经所述转轴22透过所述阴极导线29与所述阴极座28电性连接，当所述电镀滚筒3开始旋转而产生离心力时，所述环形筒体21内的所述小型零件被带动往所述阴极环314移动。同时，所述涡流叶片37会对所述环形筒体21内的电镀液形成涡流，而使得电镀液被快速交换，并且透过所述电力线导环36的设计，能够稳定所述电镀液的流动方向，使所述电镀液能够均匀地浸泡所述小型零件，而达到所述小型零件的表面均匀电镀的效果。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反的，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。

Claims (8)

  1. 一种电镀组合机构，用以电镀多个小型零件，其特征在于：所述电镀组合机构包含：
    一电镀滚筒，用以承装所述小型零件，其中所述电镀滚筒具有：
    一环形筒体；
    一转轴，所述转轴的一第一端设置在所述环形筒体上；
    一卡合部，设置在所述环形筒体的一底部，用以被一驱动器带动旋转；及
    多个涡流叶片，设置在所述环形筒体的底部。
  2. 如权利要求1所述的电镀组合机构，其特征在于：所述电镀组合机构还包含一移动架，所述电镀滚筒组合在所述移动架上，所述移动架具有：
    一固定板；
    二侧板，组合在所述固定板的二侧；
    二辅助杆，设置在所述侧板之间，使所述环形筒体位于所述辅助杆之上；及
    一旋转接头，枢接所述固定板上，用以与所述转轴的一第二端组合在一起。
  3. 如权利要求2所述的电镀组合机构，其特征在于：所述移动架还具有二阴极座，分别设置在所述固定板的一底部的二侧，用以与一阴极环电性连接。
  4. 如权利要求3所述的电镀组合机构，其特征在于：所述移动架还具有一阴极导线，连接所述两阴极座，用以与所述阴极环电性连接。
  5. 如权利要求1所述的电镀组合机构，其特征在于：所述环形筒体具有一底座、一围绕壁、一上盖及一阴极环，所述底座与所述围绕壁相结合，所述上盖覆盖在所述围绕壁上并形成一内部空间，所述转轴自所述底座连接所述上盖并向外延伸，所述阴极环设置在所述围绕壁内。
  6. 如权利要求5所述的电镀组合机构，其特征在于：所述电镀滚筒还具有一电力线导环，设置在所述环形筒体内且与所述围绕壁相间隔。
  7. 如权利要求1所述的电镀组合机构，其特征在于：所述电镀滚筒还包含一电流传输层，所述电流传输层设置在所述环形筒体的一底座上。
  8. 如权利要求7所述的电镀组合机构，其特征在于：所述环形筒体还具有多个阴极圆片及多个挠流导坡，所述阴极圆片及所述挠流导坡交替间隔设置在所述电流传输层上，而且所述阴极圆片位于相邻二挠流导坡之间。
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