WO2018121526A1 - 小型零件的电镀装置 - Google Patents
小型零件的电镀装置 Download PDFInfo
- Publication number
- WO2018121526A1 WO2018121526A1 PCT/CN2017/118615 CN2017118615W WO2018121526A1 WO 2018121526 A1 WO2018121526 A1 WO 2018121526A1 CN 2017118615 W CN2017118615 W CN 2017118615W WO 2018121526 A1 WO2018121526 A1 WO 2018121526A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plating
- cylinder
- disposed
- electroplating
- engaging portion
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/22—Apparatus for electrolytic coating of small objects in bulk having open containers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
Definitions
- the present invention relates to a plating apparatus, and more particularly to a plating apparatus for a small part.
- Hanging plating is a plating method in which parts are mounted on a hanger for plating deposition, and is generally used for plating of large-sized parts.
- barrel plating is generally used for small parts that cannot be or are not suitable for hanging due to factors such as shape and size.
- Barrel plating also known as roller plating, is to place a certain number of small parts in a special roller and deposit various metal or alloy coatings on the surface of the part in an indirect conductive manner to achieve surface protection, decoration or functionality. the goal of.
- the plating method of the barrel plating parts has undergone a large change, in which the hanging plating is performed in a state in which the parts are separately packaged, and the barrel plating is performed in a state where the parts are concentrated and separated from each other, in this state.
- the mixing cycle of the parts is generated during the process; in addition, the plating is performed in a state where the parts are completely exposed, and the barrel plating is performed in a closed drum (having a hole in the wall plate) and a solution having a low concentration of the solution.
- the change in the way the part is plated brings two major defects to the barrel plating, namely the defects caused by the mixing cycle and the structural defects of the barrel plating.
- the above defects have a serious impact on the production efficiency of the barrel plating and the improvement of the product quality, so that the superiority of the barrel plating cannot be fully exerted.
- the current barrel plating technique is to connect the drum to a driving device. After loading the workpiece to be plated in the drum, the driving device is operated in the plating tank, and the workpiece to be plated is turned over to promote the electrolysis. The liquid is in sufficient contact to produce an electrochemical action. Since many of the needle-like or flaky microelectronic product parts are surface-plated, usually in a plating cylinder, there are many kinds of plating cylinders in the prior art, and most of the plating cylinders are Driven by horizontal drive units, these plating drums generally have problems of complicated structure, difficulty in solution replacement, low plating efficiency, and high maintenance cost.
- a plating drum is disposed at a lower end of the drive shaft for enabling the electroplating tank provided with the anode to be rotationally driven, and flowing from the inside of the plating drum to the outside by the centrifugal force acting when the plating drum is rotationally driven. Further, the inside of the plating drum flows into the inside, but the plating drum is fixed to the lower end of the drive shaft, and cannot be moved and exchanged, so that the plating process of the automatic shifting and changing groove cannot be achieved.
- the main object of the present invention is to provide a plating apparatus for a small-sized component, which is configured to dispose the driver under the plating tank and to rotate the plating cylinder by engaging the engaging portion and the driving motor to make the plating cylinder easy. Moving from one plating tank to another plating tank to carry out the shifting operation of the shifting and replacing, and the forced vortex blade at the bottom of the plating drum makes the plating liquid exchange fast, overcomes the defects caused by the mixing cycle and the structural defects of the barrel plating, and further Improve the plating speed and efficiency of the small parts.
- the present invention provides a plating apparatus for small parts, comprising at least one plating unit; each plating unit comprises a moving frame, a plating cylinder, a plating tank and a driver; the plating cylinder has a cylinder a shaft, a rotating shaft and a engaging portion, wherein a first end of the rotating shaft is disposed on the cylindrical body, the engaging portion is disposed at a bottom of the cylindrical body; and the plating tank is provided with a plating The liquid is used to soak the plating drum; the driver is disposed in the plating tank for driving the engaging portion to rotate to drive the plating drum to rotate to generate centrifugal force.
- the driver has a driving motor for engaging with the engaging portion of the plating drum to drive the cylinder to rotate.
- the moving frame has a fixed plate, two side plates, two auxiliary rods and a rotary joint, the side plates are combined on two sides of the fixed plate, and the auxiliary rod is disposed at Between the side plates, the cylinder is located above the auxiliary rod, and the rotary joint is pivotally connected to the fixing plate for combining with the second end of the rotating shaft.
- the moving frame further has two cathode seats, and the cathode seats are disposed on two sides of a bottom of the fixing plate for electrically connecting with a cathode ring.
- the cylinder has a base, a surrounding wall and an upper cover, the base is combined with the surrounding wall, and the cathode ring is formed in the surrounding wall, the rotating shaft
- the upper cover is coupled from the base and extends outward.
- the plating apparatus further has a leakage plate disposed on the driving motor for receiving the liquid leaked from the plating tank.
- the plating cylinder by rotating the plating cylinder by disposing the driver under the plating tank and by engaging the engaging portion and the driving motor, not only the plating cylinder is easily moved and replaced.
- the plating speed and efficiency of the small parts can also be improved, and the structure of the electroplating apparatus of the small parts is simple, so that the subsequent maintenance cost is low.
- FIG. 1 and 2 are schematic views showing a partial structure of a first preferred embodiment of a plating apparatus for a small part according to the present invention.
- Figure 3 is a perspective view showing a partial structure of a second preferred embodiment of the electroplating apparatus for small parts according to the present invention.
- Figure 4 is a cross-sectional view taken along line A-A of Figure 3;
- Figure 5 is a schematic view showing a second plating bath according to a second preferred embodiment of the electroplating apparatus for small parts according to the present invention.
- a first preferred embodiment of a plating apparatus for a small part of the present invention is used for electroplating or electroless plating of a plurality of small parts, such as chip type resistors, inductors, capacitors, and connections. Instruments, precision parts, etc.
- the electroplating apparatus of the small part includes a body 101 and at least one or more plating units 102. The detailed construction, assembly relationship, and operation principle of each component will be described in detail below.
- the electroplating apparatus of the small part is provided with a plating unit 102 on the base body 101, and each plating unit 102 includes a plating cylinder 2, a plating tank 3, and a driver. 4 and a mobile rack 5. It should be noted that, in other embodiments, a plurality of plating units 102 may be disposed on the body 101, which is not limited to the embodiment.
- the plating drum 2 has a cylinder 21, a rotating shaft 22, an engaging portion 23 and a current carrying layer 24, wherein a first end 221 of the rotating shaft 22 is disposed at the The engaging portion 23 is provided at a bottom portion of the cylindrical body 21 on the cylindrical body 21.
- the cylinder 21 has a base 211, a surrounding wall 212 and an upper cover 213. The tenon of the base 211 is engaged with the surrounding wall 212, and a cathode is formed in the surrounding wall 212.
- the upper cover 213 covers the surrounding wall 212 to define an internal space (not shown), and the current transmission layer 24 is disposed on the base 211 of the cylinder 21, and the rotating shaft 22
- the base 211 is coupled to the upper cover 213 and extends outward.
- the plating tank 3 is a rectangular container in which a partition 103 is disposed.
- the upper portion of the partition 103 is used for accommodating a plating solution, and the plating drum 2 can be immersed in the chamber.
- one or more anode baskets 103 can be immersed.
- the driver 4 is disposed below the bottom of the plating tank 3 for driving the engaging portion 23 to rotate to drive the plating drum 2 to rotate; and the driver 4 has a driving motor 41 and an electrode joint 42.
- the driving motor 41 is a DC driving motor for engaging with the engaging portion 23 of the plating drum 2, so that the tubular body 21 is engaged by the engaging portion. 23 is rotated and rotated, for example, a jaw of the engaging portion 23 is engaged with a groove of the driving motor 41; the electrode connector 42 is disposed on the driving motor 41 for The cathode is electrically connected.
- the plating drum 2 further has a cathode conductor 25 which is disposed in the engaging portion 23 for electrically contacting the electrode tab 42.
- the moving frame 5 is combined on the seat body 101 and used to move on the seat body 101, and is located at a top of the plating tank 3, and by moving the The moving frame 5 can pull the plating drum 2 away from the plating tank 3 and place it in another plating tank (not shown); in addition, a second end 222 of the rotating shaft 22 is pivotally connected to the The frame 5 is moved, and the engaging portion 23 is located below the first end 221.
- the moving frame 5 has a fixing plate 51, two side plates 52, two alignment blocks 53, two auxiliary rods 54 and a cover body 55, wherein the fixing plate 51 is used for the rotating shaft 22 The second end 222 is pivotally connected, and the two side plates 52 are combined on two sides of the fixing plate 51.
- the two pairs of the positioning blocks 53 are disposed on two sides of the fixing plate 51, and are located on the two side plates. 52, the two pairs of blocks 53 are respectively fixed on the side plate 52 for alignment; the two auxiliary rods 54 are disposed between the side plates 52, so that the cylinder 21 is located at the side Above the auxiliary lever 54, the cover 55 is screwed to the first end 221 of the rotating shaft 22 to be fixed on the fixing plate 51.
- the base 101 has a lifting base 7, wherein the moving frame 5 is disposed on the lifting base 7, and the moving frame 5 is driven by the lifting base 7 Moving between a soaking position of the plating tank 3 and a preparation position away from the plating tank 3.
- an inner wall surrounding the wall 212 of the cylinder 21 of the plating drum 2 may be provided with the cathode ring 210, and the cathode ring 210 may be connected to a cathode conductor in the engaging portion 23. 25, and electrically connected to the electrode joint 42, and the small part in the cylinder 21 is driven onto the surface of the cathode ring by the centrifugal force of the plating drum 2 during rotation.
- the current transport layer 24 is made of titanium metal or titanium-plated, titanium-sprayed material
- the cylinder 21 is made of a plastic material
- the current transport layer 24 and the cylinder An intermediate layer (not shown) is disposed between the bodies 21, and the intermediate layer is made of a plastic material.
- the plating drum 2 is intermittently driven by the engaging portion 23 and the driving motor 41 by being disposed under the bottom of the plating tank 3. Rotating and electrically connecting to the electrode joint 42 through the surface of the cathode ring, while the small part in the barrel 21 is driven to the side by the centrifugal force of the plating drum 2 during rotation On the surface of the cathode ring, the effect of uniform plating on the surface of the small part is achieved.
- FIG. 3, FIG. 4 and FIG. 5, are a second preferred embodiment of the electroplating apparatus for the small parts of the present invention, and substantially follow the same component names and drawing numbers of the above preferred embodiment, but the difference between the two.
- the moving frame 5 can be moved by an external device, such as a robot arm, so that one of the plating drums 2 can be moved to another plating tank 3'; further, the plating drum 2
- Another power line guide ring 26 is disposed in the barrel 21 and spaced apart from the surrounding wall 212.
- the moving frame 5 has a fixing plate 51, two side plates 52, two auxiliary rods 54, and two grips.
- a holding member 56 a rotary joint 57 and two cathode seats 58, wherein the side plates 52 are combined on both sides of the fixing plate 51, and the auxiliary rod 54 is disposed between the side plates 52, so that the tube
- the body 21 is located on the auxiliary rod 54.
- the holding members 56 are respectively disposed on two sides of a top surface of the fixing plate 51.
- the rotary joint 57 is pivotally connected to the fixing plate 51 for Combined with the second end 222 of the rotating shaft 22, the cathode seat 58 is disposed at a bottom of the fixing plate 51
- the two sides, a cathode lead for passing through the shaft 5922 is connected to the cathode 210 is electrically ring.
- the bottom of the cylinder 21 has a forced vortex blade for exchanging the plating solution therein
- the drive motor 41 is disposed below the bottom of the plating tank 3
- the plating apparatus has another
- the draining disk 43 is disposed between the driving motor 41 and the bottom of the plating tank 3 for receiving the liquid leaked from the plating tank 3.
- the rotation of the rotary joint 57 allows the cylinder 21 to be separated from the rotating shaft 22 from the moving frame 5, and the cathode holder 58 on both sides of the bottom of the fixing plate 51 is
- the cathode ring 210 can be electrically connected, and when the fixing plate 51 is removed, a power failure is formed.
- the cathode ring 210 is rotationally accelerated to a specified rotational speed, the small part (the object to be plated) in the cylindrical body 21 is pressed against the cathode ring 210 by centrifugal force, and is supplied with electricity for electroplating.
- the cathode ring 210 After the time is turned off and the cathode ring 210 is decelerated to a low rotation speed, the small parts (the object to be plated) in the cylinder 21 are mixed by gravity on the bottom of the barrel 21, and then the After the small parts (the objects to be plated) are mixed, the cathode ring 210 is rotated and accelerated to a predetermined rotation speed, so that the small parts (the object to be plated) are intermittently mixed at a low speed and accelerated, and the mixture is mixed at a low speed and accelerated, thereby further The surface of the small part (the object to be plated) can have a more uniform plating effect.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (6)
- 一种小型零件的电镀装置,其特征在于:所述电镀装置包含:至少一个电镀单元,每一个电镀单元包含:一移动架;一电镀滚筒,具有一筒体、一转轴及一卡合部,其中所述转轴的一第一端设置在所述筒体上,所述卡合部设置在所述筒体的一底部;一电镀槽,容置一电镀液以浸泡所述电镀滚筒;及一驱动器,用以驱动所述卡合部转动而带动所述电镀滚筒旋转。
- 如权利要求1所述的小型零件的电镀装置,其特征在于:所述驱动器具有一驱动马达,用以与所述电镀滚筒的卡合部相卡合,而带动所述筒体间歇地旋转。
- 如权利要求1所述的小型零件的电镀装置,其特征在于:所述移动架具有:一固定板;二侧板,组合在所述固定板的二侧;二辅助杆,设置在所述侧板之间,使所述筒体位于所述辅助杆之上;及一旋转接头,枢接所述固定板上,用以与所述转轴的一第二端组合在一起。
- 如权利要求3所述的小型零件的电镀装置,其特征在于:所述移动架另具有二阴极座,设置在所述固定板的一底部的二侧,用以与一阴极环电性连接。
- 如权利要求1所述的小型零件的电镀装置,其特征在于:所述筒体具有一底座、一围绕壁及一上盖,所述底座与所述围绕壁相结合,所述围绕壁内形成所述阴极环,所述转轴自所述底座连接所述上盖并向外延伸。
- 如权利要求1所述的小型零件的电镀装置,其特征在于:所述电镀装置另具有一漏接盘,设置在所述驱动马达上,用以承装由所述电镀槽漏出的液体。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019524505A JP6768953B2 (ja) | 2016-12-28 | 2017-12-26 | 小型部品用の電気めっき装置 |
CN201780045165.2A CN110139949B (zh) | 2016-12-28 | 2017-12-26 | 小型零件的电镀装置 |
KR1020197007693A KR102244497B1 (ko) | 2016-12-28 | 2017-12-26 | 소형부품 전기도금 장치 |
EP17887748.6A EP3578694A4 (en) | 2016-12-28 | 2017-12-26 | ELECTRIC PLATING DEVICE FOR SMALL COMPONENTS |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662439606P | 2016-12-28 | 2016-12-28 | |
US62/439,606 | 2016-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018121526A1 true WO2018121526A1 (zh) | 2018-07-05 |
Family
ID=62707932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2017/118615 WO2018121526A1 (zh) | 2016-12-28 | 2017-12-26 | 小型零件的电镀装置 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3578694A4 (zh) |
JP (1) | JP6768953B2 (zh) |
KR (1) | KR102244497B1 (zh) |
CN (1) | CN110139949B (zh) |
TW (1) | TWI648434B (zh) |
WO (1) | WO2018121526A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112553676A (zh) * | 2020-11-16 | 2021-03-26 | 李明祥 | 一种循环式微型零件电镀烘干一体机 |
CN114908401A (zh) * | 2022-05-27 | 2022-08-16 | 安徽东欧电子科技有限公司 | 一种自动化线路板加工用电镀设备 |
CN115478317A (zh) * | 2022-09-21 | 2022-12-16 | 浙江泰恒新能源有限公司 | 太阳能电池片电镀夹具 |
CN115558975A (zh) * | 2022-11-17 | 2023-01-03 | 临沭县旭坤五金制造有限公司 | 一种不规则五金配件电镀设备 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112626595B (zh) * | 2020-12-01 | 2021-11-30 | 东莞市琢器机械设备科技有限公司 | 一种模组化连续电镀生产线 |
CN114150361B (zh) * | 2021-11-30 | 2023-06-20 | 江苏柏斯克石油机械有限公司 | 一种石油管道防腐处理用电镀装置及其处理方法 |
CN116988131B (zh) * | 2023-09-28 | 2023-12-15 | 江苏台祥自动化科技有限公司 | 一种用于电镀生产的滚镀设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5487824A (en) * | 1993-08-31 | 1996-01-30 | Uemura Kogyo Kabushiki Kaisha | Electroplating apparatus and electroplating method of small articles |
JPH08239799A (ja) * | 1995-02-28 | 1996-09-17 | C Uyemura & Co Ltd | 小物の回転めっき装置 |
JP2002322591A (ja) * | 2001-04-25 | 2002-11-08 | Sekisui Chem Co Ltd | 微粒子のめっき方法及び導電性微粒子及び接続構造体 |
CN1576400A (zh) * | 2003-07-18 | 2005-02-09 | 釜屋电机株式会社 | 电子部件的电镀装置和电镀方法、以及该电子部件 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3359195A (en) * | 1963-10-29 | 1967-12-19 | Hojyo Kazuya | Automatic chromium plating apparatus |
US3601134A (en) * | 1968-04-29 | 1971-08-24 | Clinton Supply Co | Automatic and manual plating machine |
US5879520A (en) * | 1994-08-26 | 1999-03-09 | Griego; Thomas P. | Rotary electrodeposition apparatus |
JP5038024B2 (ja) * | 2007-06-06 | 2012-10-03 | 上村工業株式会社 | ワークの表面処理システム |
JP5514591B2 (ja) * | 2010-03-15 | 2014-06-04 | 孝志 上市 | メッキ装置 |
CN102851726B (zh) * | 2011-06-30 | 2016-08-10 | 扬州市金杨电镀设备有限公司 | 小零件电镀装置 |
CN202297831U (zh) * | 2011-09-09 | 2012-07-04 | 汉玛科技股份有限公司 | 电镀滚筒的电镀液交换装置 |
JP5462907B2 (ja) * | 2012-05-17 | 2014-04-02 | 上村工業株式会社 | 水洗装置 |
CN203960381U (zh) * | 2014-05-27 | 2014-11-26 | 张军 | 逐级传递全自动滚镀生产线 |
CN204825092U (zh) * | 2015-07-28 | 2015-12-02 | 浙江工贸职业技术学院 | 一种分段式自动滚镀生产设备 |
CN205501442U (zh) * | 2016-02-22 | 2016-08-24 | 东莞市希锐自动化科技股份有限公司 | 水中下料移送机构 |
CN205893444U (zh) * | 2016-06-29 | 2017-01-18 | 盐城中航自动化装备有限公司 | 一种倾斜式小型滚镀设备 |
-
2017
- 2017-11-14 TW TW106139399A patent/TWI648434B/zh active
- 2017-12-26 WO PCT/CN2017/118615 patent/WO2018121526A1/zh unknown
- 2017-12-26 JP JP2019524505A patent/JP6768953B2/ja active Active
- 2017-12-26 EP EP17887748.6A patent/EP3578694A4/en active Pending
- 2017-12-26 KR KR1020197007693A patent/KR102244497B1/ko active IP Right Grant
- 2017-12-26 CN CN201780045165.2A patent/CN110139949B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5487824A (en) * | 1993-08-31 | 1996-01-30 | Uemura Kogyo Kabushiki Kaisha | Electroplating apparatus and electroplating method of small articles |
JPH08239799A (ja) * | 1995-02-28 | 1996-09-17 | C Uyemura & Co Ltd | 小物の回転めっき装置 |
JP2002322591A (ja) * | 2001-04-25 | 2002-11-08 | Sekisui Chem Co Ltd | 微粒子のめっき方法及び導電性微粒子及び接続構造体 |
CN1576400A (zh) * | 2003-07-18 | 2005-02-09 | 釜屋电机株式会社 | 电子部件的电镀装置和电镀方法、以及该电子部件 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3578694A4 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112553676A (zh) * | 2020-11-16 | 2021-03-26 | 李明祥 | 一种循环式微型零件电镀烘干一体机 |
CN114908401A (zh) * | 2022-05-27 | 2022-08-16 | 安徽东欧电子科技有限公司 | 一种自动化线路板加工用电镀设备 |
CN114908401B (zh) * | 2022-05-27 | 2023-06-23 | 安徽东欧电子科技有限公司 | 一种自动化线路板加工用电镀设备 |
CN115478317A (zh) * | 2022-09-21 | 2022-12-16 | 浙江泰恒新能源有限公司 | 太阳能电池片电镀夹具 |
CN115558975A (zh) * | 2022-11-17 | 2023-01-03 | 临沭县旭坤五金制造有限公司 | 一种不规则五金配件电镀设备 |
CN115558975B (zh) * | 2022-11-17 | 2023-03-28 | 临沭县旭坤五金制造有限公司 | 一种不规则五金配件电镀设备 |
Also Published As
Publication number | Publication date |
---|---|
JP2019522733A (ja) | 2019-08-15 |
EP3578694A4 (en) | 2021-01-13 |
JP6768953B2 (ja) | 2020-10-14 |
KR20190039284A (ko) | 2019-04-10 |
TWI648434B (zh) | 2019-01-21 |
TW201825720A (zh) | 2018-07-16 |
CN110139949B (zh) | 2021-12-21 |
EP3578694A1 (en) | 2019-12-11 |
CN110139949A (zh) | 2019-08-16 |
KR102244497B1 (ko) | 2021-04-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2018121526A1 (zh) | 小型零件的电镀装置 | |
CN112481681B (zh) | 一种镍电镀件表面处理装置 | |
CN112695372B (zh) | 一种旋转式电解抛光清洗设备 | |
CN107022777B (zh) | 电沉积设备 | |
CN111630210B (zh) | 电镀组合机构 | |
US7108776B2 (en) | Plating apparatus and plating method | |
JP6704267B2 (ja) | 電鋳装置 | |
TW202108829A (zh) | 陽極固持器、鍍覆裝置、及鍍覆方法 | |
TWI648433B (zh) | 電鍍組合機構 | |
JP2020193358A (ja) | 湿式基板処理装置 | |
CN111472037B (zh) | 一种单面电镀装置及其电镀工艺 | |
CN214271103U (zh) | 一种主动式旋转电解抛光设备 | |
CN211170945U (zh) | 一种电镀加工用的固定夹具 | |
TWI827069B (zh) | 多滾筒電鍍裝置 | |
US6306269B1 (en) | Method and apparatus for efficiently wet plating and processing small parts | |
CN113882007B (zh) | 一种全自动电镀系统及其电镀方法 | |
KR101408461B1 (ko) | 배럴 장치, 배럴 도금 장치 및 방법 | |
CN217443261U (zh) | 一种中链甘油三酯的快速检测自动化前处理设备 | |
JP2011190492A (ja) | メッキ装置 | |
CN209774683U (zh) | 一种行车机械臂 | |
KR200228346Y1 (ko) | 바렐 연속도금기 | |
KR20160137209A (ko) | 바스켓 요동장치 | |
JP2017008361A (ja) | 電気めっき装置 | |
KR20110051040A (ko) | 기판도금장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17887748 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2019524505 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20197007693 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 2017887748 Country of ref document: EP Effective date: 20190729 |