WO2019054280A1 - 加工装置 - Google Patents

加工装置 Download PDF

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Publication number
WO2019054280A1
WO2019054280A1 PCT/JP2018/033112 JP2018033112W WO2019054280A1 WO 2019054280 A1 WO2019054280 A1 WO 2019054280A1 JP 2018033112 W JP2018033112 W JP 2018033112W WO 2019054280 A1 WO2019054280 A1 WO 2019054280A1
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WO
WIPO (PCT)
Prior art keywords
inclination
magnetic coupling
magnet
driven
adjusting means
Prior art date
Application number
PCT/JP2018/033112
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
沢口　一也
学 奥田
Original Assignee
キヤノンセミコンダクターエクィップメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by キヤノンセミコンダクターエクィップメント株式会社 filed Critical キヤノンセミコンダクターエクィップメント株式会社
Priority to JP2019542019A priority Critical patent/JP6878605B2/ja
Priority to CN201880058804.3A priority patent/CN111065488B/zh
Priority to KR1020207010396A priority patent/KR102352534B1/ko
Publication of WO2019054280A1 publication Critical patent/WO2019054280A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C32/00—Bearings not otherwise provided for
    • F16C32/06—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H49/00—Other gearings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a processing apparatus having a rotating processing tool and a rotating stage for holding a workpiece.
  • the present invention relates to a processing apparatus including a rotary stage for holding a workpiece such as a semiconductor wafer and a rotary tool for grinding the workpiece, and capable of adjusting the attitude of the rotary shaft.
  • Patent Document 1 discloses a grinding machine provided with a grinding tool that is rotated by transmission of the rotational force of a motor through a belt, an air spindle that pivotally supports the grinding tool, and a magnetic bearing that controls the posture of the grinding tool.
  • the displacement sensor is used to calculate the inclination state of the object to be ground and the grinding tool, and based on the calculated inclination state, the excitation of the electromagnetic coil of the magnetic bearing is controlled to control the relative attitude of the object to be ground and the grinding tool Is adjusted.
  • a rotatable chuck plate for holding a workpiece, a chuck for holding a processing tool, and the chuck attached with the chuck and provided with a magnetic coupling follower magnet.
  • a transmitting means for transmitting to the side magnet.
  • FIG. 1 The top view which shows an example of arrangement
  • FIG. 5 is a cross-sectional view for explaining the attitude of the rotary stage in the initial state of Embodiment 1;
  • FIG. 7 is a cross-sectional view for explaining the attitude of the rotary stage at the time of inclination adjustment in Embodiment 1.
  • FIG. 2 is a plan view of a magnet unit of Embodiment 1; 5 is a plan view of a magnet unit of Embodiment 2.
  • FIG. FIG. 7 is a cross-sectional view showing a rotary stage of Embodiment 2; The top view of the magnet part of Embodiment 3.
  • FIG. 5 is a cross-sectional view for explaining the attitude of the rotary stage in the initial state of Embodiment 1
  • FIG. 7 is a cross-sectional view for explaining the attitude of the rotary stage at the time of inclination adjustment
  • FIG. 1 is a cross-sectional view schematically showing a schematic configuration of a processing apparatus for grinding a semiconductor wafer according to the first embodiment.
  • the present apparatus is an apparatus that lowers while rotating a grindstone arranged above, brings it into contact with a rotating semiconductor wafer held by a chuck plate of a rotating stage, and grinds the semiconductor wafer to a predetermined thickness. It will be described in order from the rotary stage.
  • W is a semiconductor wafer as a workpiece
  • 1 is a chuck plate for holding the semiconductor wafer W.
  • the chuck plate 1 is a disk larger than the semiconductor wafer W, and made of ceramic such as alumina.
  • a plurality of concentric grooves 25 are provided on the upper surface of the chuck plate 1, that is, the surface on which the semiconductor wafer W is held.
  • the groove 25 is connected to a communication passage (not shown) penetrating to a predetermined position on the bottom surface or the side surface of the chuck plate 1, and a negative pressure is supplied to the communication passage from a vacuum pump (not shown).
  • a static pressure gas bearing 2 rotatably supports the chuck plate 1.
  • the static pressure gas bearing 2 includes a rotor portion and a bearing housing portion, and can support the rotor portion in a noncontact manner rotatably by ejecting gas from the porous throttle of the bearing housing portion to the gap with the rotor portion. it can.
  • a material of the porous squeeze a copper alloy, a cemented carbide, a carbon-based material, or a porous ceramic is used.
  • the rotor unit includes a hollow shaft 4, a thrust plate 5, a thrust plate 6, a magnet holding unit 12, and a driven magnet unit 13.
  • A1 in a figure is a central axis of a rotor part.
  • the hollow shaft 4, the thrust plate 5 and the thrust plate 6 are made of a metal material.
  • the chuck plate 1 is mounted above the thrust plate 5, and the chuck plate 1 rotates integrally with the rotor portion. Further, a hollow magnet holding portion 12 is provided below the thrust plate 6, and the driven side magnet portion 13 is fixed to the outer side surface thereof.
  • the driven side magnet unit 13 constitutes an in-out type magnetic coupling together with a driving side magnet unit 16 described later. That is, in the magnet holding portion 12, the driven side magnet portion 13 which is a part of the magnetic coupling is held concentrically around the central axis A1.
  • the driven-side magnet unit 13 a plurality of magnets magnetized in advance to the N pole and magnets magnetized in advance to the same number as the S pole are alternately arranged at equal angular intervals.
  • the housing portion includes a main body 7, a radial bearing pad 8, a thrust bearing pad 9, and a thrust bearing pad 10.
  • the radial bearing pad 8, the thrust bearing pad 9, and the thrust bearing pad 10 are made of a porous material, and are fixed to the main body 7 of the housing portion by shrink fitting, bonding or the like.
  • the main body 7 of the housing portion has an annular shape, and a pressurized gas supply hole 11 is provided on the side surface thereof, and is connected to a pressurized gas supply source (not shown).
  • the pressurized gas supplied from the pressurized gas supply source to the pressurized gas supply hole 11 is distributed to the radial bearing pad 8, the thrust bearing pad 9, and the thrust bearing pad 10 through the distribution flow path 11a, and from each pad The gas spouts out.
  • the radial bearing pad 8 is annularly provided so as to surround the hollow shaft 4 of the rotor portion, and is opposed to the bearing surface 3 which is the outer surface of the hollow shaft 4.
  • the thrust bearing pad 9 is provided in an annular shape surrounding the central axis A1 of the rotor portion, and is opposed to the bearing surface 5a which is the lower surface of the thrust plate 5.
  • the thrust bearing pad 10 is provided in an annular shape so as to surround the central axis A1 of the rotor portion, and is opposed to the bearing surface 6a which is the upper surface of the thrust plate 6.
  • the rotor portion is rotatably supported at a distance from the housing portion by the pressure of the gas ejected from each pad.
  • Carbon graphite is preferably used for each bearing pad, and alumina (Al 2 O 3 ) is preferably used for surface coating of each bearing surface.
  • alumina Al 2 O 3
  • Carbon graphite is excellent in self-lubricity and wear resistance due to the slip of crystal planes, and has the advantage that the occurrence of friction can be significantly reduced.
  • FIG. 2 is a plan view of the lower surface of the annular main body 7 along the Z direction in order to show the arrangement of the main body 7 and the support column 26 and the inclination adjustment mechanism 19, and the support column 26 and the two inclination adjustment mechanisms 19 , Are arranged at an angle of 120 degrees with respect to the center of the torus.
  • the main body 7 is supported by a column 26 of a fixed height and two tilt adjustment mechanisms 19 that can extend and contract in the Z direction, and by independently adjusting the extension and contraction of the two tilt adjustment mechanisms 19 in the Z direction, The attitude of the main body 7 with respect to the rotation stage housing 20 can be controlled.
  • An electric cylinder is used as the inclination adjustment mechanism 19.
  • the supporting method capable of adjusting the attitude of the main body 7 of the housing part is not limited to the example of the present embodiment, and for example, four inclination adjusting mechanisms may be arranged in a square.
  • the tilt adjustment mechanism may be any mechanism capable of controlling the length in the Z direction.
  • a piezoelectric element is used, or a ball screw is rotated by an electric motor to advance and retract a movable pin supporting the static pressure bearing main body. It is also possible to adopt a scheme.
  • the reference point of the inclination adjustment is not limited to the tip position of the support column 26 illustrated, and may be provided at another place.
  • a pulley 14, a bearing 15, a driving magnet unit 16, a belt 17, and a motor 18 are installed in the rotation stage housing 20 as a drive mechanism for applying a rotational force to the rotor unit.
  • the pulley 14 is a hollow shaft member, and the driving side magnet unit 16 is fixed to the inner diameter side thereof.
  • the bearing 15 is, for example, a deep groove ball bearing, and rotatably supports the pulley 14 at a position where the driving magnet unit 16 is at a height facing the driven magnet unit 13.
  • FIG. 5A is a plan view showing the arrangement of magnets.
  • the driving side magnet unit and the driven side magnet unit are magnets in which N poles and S poles are alternately arranged along the side surfaces of cylinders having different diameters.
  • the driving side magnet unit 16 is disposed such that a magnet having a magnetic pole opposite to that of the driven side magnet unit 13 is opposed and exerts a coupling function by the action of the magnetic force, and the pulley 14 rotates.
  • the drive side magnet unit 16 and the driven side magnet unit 13 constitute an in-out type magnetic coupling.
  • the lengths in the thrust direction (Z direction) of the driven side magnet unit 13 and the driving side magnet unit 16 are shown as the same length in FIG. 1 but may not necessarily be the same. In the case of a processing apparatus for grinding a semiconductor wafer, it is necessary to adjust and stabilize the attitude of the rotary stage in order to planarize the semiconductor wafer with high accuracy.
  • a motor 18 is fixed to the rotation stage housing 20, and an endless belt 17 for transmitting the rotational driving force of the motor 18 to the pulley 14 is wound around the rotation shaft of the motor 18 and the pulley 14.
  • the pulley 14, the belt 17, and the motor 18 form a belt drive mechanism.
  • the processing tool can lower the grinding wheel while rotating the grinding wheel, and can bring the grinding wheel into contact with the semiconductor wafer W held and rotated by the chuck plate 1 of the rotation stage.
  • the processing tool unit includes a built-in motor 21, a bearing 22, a chuck 23, and a grindstone 24.
  • the rotation of the built-in motor 21 is transmitted to the grinding wheel 24 via the bearing 22.
  • A2 in the figure is a rotation axis of the built-in motor 21.
  • a diamond wheel with a diameter of 300 mm is used as the grinding wheel 24 and rotates at a speed of 1000 to 4000 revolutions per minute.
  • the grindstone 24 is supported by the chuck 23 and can be rotated about the rotation axis A2 while applying a force on the opposite side to the Z direction to the semiconductor wafer W when it is lowered toward the semiconductor wafer W. .
  • the bearing 22 is used to transmit the rotational force of the motor to the grinding stone 24 which is a processing tool, but the present invention is not limited to this.
  • a combination of a belt and a pulley, or a gear may be used to transmit the rotational force.
  • the processing apparatus of the present embodiment provided with the above-described rotation stage and processing tool portion performs in-feed processing for thinning the semiconductor wafer, but the flatness of the semiconductor wafer is determined by the grinding stone 24 and the semiconductor wafer W during processing.
  • the relative angle between the grindstone 24 and the semiconductor wafer W is detected using a sensor (not shown), and the tilt adjustment mechanism is driven and controlled so that both are at an appropriate angle. Adjust the tilt of the rotor.
  • the pulley 14 is supported by the bearing 15 so that the rotational axis direction is parallel to the Z axis, and the direction T in which the endless belt 17 for transmitting the rotational force of the motor 18 to the pulley 14 is stretched is , Horizontal or parallel to the XY plane.
  • C in the figure represents the distance between the pulley 14 and the rotor when the central axis A1 of the rotor portion is vertical, ie parallel to the Z axis, ie, the driving magnet portion 16 and the driven magnet portion 13 of the magnetic coupling.
  • H in the figure is the distance in the Z direction from the tip of the support 26 which is a reference point at the time of inclination adjustment to the magnetic coupling which is the lowest point of the rotor.
  • FIG. 4 shows a state in which the inclination adjusting mechanism 19 is operated so that the housing portion is inclined by ⁇ with respect to the horizontal plane.
  • the main surface of the rotor portion rotatably supported away from the housing portion is naturally inclined by ⁇ from the horizontal plane, ie, the XY plane, and the central axis A1 of the rotor portion is inclined by ⁇ from the Z axis There is.
  • the pulley 14 is supported by the bearing 15 so that the rotational axis direction is parallel to the Z axis, and the direction in which the endless belt 17 for transmitting the rotational force of the motor 18 to the pulley 14 is stretched.
  • T is parallel to the horizontal or XY plane.
  • the pulley 14 which is a drive mechanism for applying a rotational force to the rotor unit even when the inclination of the rotor of the rotation stage is adjusted, the bearing 15, the driving magnet unit 16,
  • the arrangement of the belt 17 and the motor 18 is not affected. Therefore, even if the rotation axis of the rotor portion is inclined, the tension of the belt transmitting the rotational force of the motor does not change. For this reason, the tension of the belt does not change each time the attitude of the grinding tool is adjusted, and the rotational force can be stably transmitted to the rotation shaft, and the rotation of the semiconductor wafer becomes unstable. Absent.
  • the cyclic expansion and contraction motion of the belt acts on the rotation shaft, so that there is no risk of inducing unnecessary vibration on the rotation shaft. Therefore, the processing accuracy of the semiconductor wafer can be made extremely high.
  • C [m] is the distance between the pulley 14 and the rotor in a state in which the central axis A1 of the rotor portion is in the vertical direction, ie parallel to the gravity direction (Z axis), ie, the motive side magnet portion 16 of the magnetic coupling This is the distance of the driven magnet unit 13.
  • the state in which the central axis A1 of the rotor portion is in the vertical direction, that is, in parallel with the direction of gravity (Z axis) can be reworded to be the state in which the angle adjusted by the inclination adjusting mechanism is 0 degrees.
  • the tip end of the support column 26 which is a reference point at the time of inclination adjustment is G point.
  • U [m] is the distance in the horizontal direction (X direction) between point G and point P.
  • V [m] is the distance between points G and P in the vertical direction (Z direction).
  • D [m] is the distance between the point P and the point Q in the Z direction.
  • the tilt adjusting means increases the tilt angle from 0 ° to an angle at which the torque transmitted by the magnetic coupling decreases by 30%, the distance by which the driven magnet moves in the vertical direction is D [m ].
  • Tq ( ⁇ 0) [N ⁇ m] represents the torque transmitted by the magnetic coupling when the inclination angle of the inclination adjustment mechanism is 0 [degrees]
  • Tq ( ⁇ MAX) [N ⁇ m] is the inclination adjustment mechanism Represents the torque transmitted by the magnetic coupling when the inclination angle of ⁇ is ⁇ MAX [degrees].
  • Tq ( ⁇ 0) [N ⁇ m] and Tq ( ⁇ MAX) [N ⁇ m] respectively have torques of the same magnitude at the inclination angle of 0 [degree] and ⁇ MAX [degree], respectively, and are used as the motor-side magnet The torque transmitted to the rotor when input to the unit.
  • the apparatus of the present embodiment is configured to satisfy at least one of the pair of Equation 1 and Equation 2 or the pair of Equation 1 and Equation 3. For this reason, the rotor portion and the pulley of the drive mechanism do not contact each other, and the drive force can be stably transmitted regardless of the drive state of the inclination adjustment mechanism. Furthermore, since there is no contact between the rotor portion and the pulley of the drive mechanism, no excessive load is applied to the bearing mechanism of the static pressure air bearing, and the operation of the static pressure air bearing is also stable and the life is extended. Can.
  • an in-out type magnetic coupling is used as a drive mechanism for applying a rotational force to the rotor portion of the rotation stage, but in the second embodiment, a disk type magnetic coupling is used. .
  • FIG. 6 is a cross-sectional view showing the rotary stage of the second embodiment, and includes the same rotor portion and housing portion as the first embodiment.
  • the same parts as those of the rotary stage of the first embodiment shown in FIG. 3 are denoted by the same reference numerals in FIG. 6 as well, and detailed description will be omitted.
  • reference numeral 61 denotes a disk-shaped driven-side magnet unit
  • 62 denotes a disk-shaped driving-side magnet unit, both of which are provided with magnets 51 as shown in the plan view of FIG. 5B. That is, in the driven-side magnet unit 61, a plurality of magnets magnetized in advance to the N pole and magnets magnetized in the same number in advance to the S pole are alternately alternated at equal angular intervals around the central axis A1. Is located in Also, in the driving side magnet unit 62, a plurality of magnets magnetized in advance to the N pole and magnets of the same number as those magnetized in advance to the S pole are alternately alternately arranged at equal angular intervals around the rotation axis.
  • the driven magnet unit 61 and the driving magnet unit 62 are disposed such that the N pole and the S pole of each other face each other, and exert a coupling function by the action of the magnetic force. When it rotates, the rotor part also follows and rotates.
  • the driving magnet unit 62 and the driven magnet unit 61 constitute a disk type magnetic coupling.
  • the pulley 14 as a drive mechanism for applying a rotational force to the rotor unit, the bearing 15, the driving magnet unit 62, and the belt 17 even when the inclination of the rotor of the rotation stage is adjusted.
  • the arrangement of the motor 18 is not affected.
  • DS [m] is the distance between the driving magnet unit 62 and the driven magnet unit 61 in a state in which the central axis A1 of the rotor unit is in the vertical direction, that is, parallel to the gravity direction (Z axis).
  • the state in which the central axis A1 of the rotor portion is in the vertical direction, that is, in parallel with the direction of gravity (Z axis) can be reworded to be the state in which the angle adjusted by the inclination adjusting mechanism is 0 degrees.
  • the tip end of the support 26 which is the reference point at the time of inclination adjustment is G point.
  • E [m] is the distance in the horizontal direction (X direction) between the point G and the point P.
  • F [m] is the distance between the point G and the point P in the vertical direction (Z direction).
  • XS [m] is the distance between the point P and the point Q in the X direction.
  • Tq ( ⁇ 0) [N ⁇ m] represents the torque transmitted by the magnetic coupling when the inclination angle of the inclination adjustment mechanism is 0 [degrees]
  • Tq ( ⁇ MAX) [N ⁇ m] is the inclination adjustment mechanism Represents the torque transmitted by the magnetic coupling when the inclination angle of ⁇ is ⁇ MAX [degrees].
  • Tq ( ⁇ 0) [N ⁇ m] and Tq ( ⁇ MAX) [N ⁇ m] respectively have torques of the same magnitude at the inclination angle of 0 [degree] and ⁇ MAX [degree], respectively, and are used as the motor-side magnet The torque transmitted to the rotor when input to the unit.
  • the apparatus of the present embodiment is configured to satisfy at least one of the pair of Equation 4 and Equation 5 or the pair of Equation 4 and Equation 6. Therefore, the driving magnet 62 and the driven magnet 61 do not come in contact with each other, and the driving force can be stably transmitted regardless of the driving state of the inclination adjusting mechanism. Furthermore, the bearing mechanism of the static pressure air bearing is not excessively loaded, and the operation of the static pressure air bearing can also be stabilized and the life can be extended.
  • the disk type magnetic coupling shown in FIG. 5B is used as a drive mechanism for applying a rotational force to the rotor portion of the rotation stage.
  • the rotary stage of Embodiment 3 also includes a disk-shaped driven side magnet unit and a disk-shaped driving side magnet unit. The cross-sectional view of the rotary stage is the same as that of FIG.
  • the driven side magnet unit and the driving side magnet unit according to the third embodiment both include the planar magnet 71 shown in FIG. 7.
  • a plurality of magnets magnetized in advance to the N pole and magnets of the same number as those magnetized in advance to the S pole are alternately arranged radially at equal angular intervals around the rotation axis. It is the same as 2 except that the N pole is arranged at the rotation axis.
  • the driven magnet and the driving magnet are coupled to each other with their N and S poles facing each other in the circumferential part, but magnetic poles of the same polarity face each other in the rotary shaft, a repulsive force is generated. It acts to support the load applied in the thrust direction. For this reason, the space
  • the pulley 14 as a drive mechanism for applying a rotational force to the rotor unit, the bearing 15, the driving magnet unit 62, and the belt 17 even when the inclination of the rotor of the rotation stage is adjusted.
  • the arrangement of the motor 18 is not affected.
  • the driving magnet unit 62 and the driven magnet unit 61 are not in contact with each other in the apparatus of the present embodiment, and the drive of the inclination adjustment mechanism is performed.
  • the driving force can be stably transmitted regardless of the state.
  • the bearing mechanism of the static pressure air bearing is not excessively loaded, and the operation of the static pressure air bearing can also be stabilized and the life can be extended.
  • FIG. 8 is a cross-sectional view schematically showing a schematic configuration of a processing apparatus for grinding the semiconductor wafer of the fourth embodiment.
  • the present apparatus is an apparatus that lowers while rotating a grindstone arranged above, brings it into contact with a rotating semiconductor wafer held by a chuck plate of a rotating stage, and grinds the semiconductor wafer to a predetermined thickness. It will be described in order from the rotary stage.
  • W is a semiconductor wafer as a workpiece
  • 1 is a chuck plate for holding the semiconductor wafer W.
  • the chuck plate 1 has a disk shape larger than the semiconductor wafer W, and is made of a porous material such as alumina.
  • a plurality of concentric grooves 25 are provided on the upper surface of the chuck plate 1, that is, the surface on which the semiconductor wafer W is held.
  • the groove 25 is connected to a communication passage (not shown) penetrating to a predetermined position on the bottom surface or the side surface of the chuck plate 1, and a negative pressure is supplied to the communication passage from a vacuum pump (not shown).
  • a vacuum pump not shown
  • the processing tool can lower the grinding wheel while rotating the grinding wheel, and can bring the grinding wheel into contact with the semiconductor wafer W held and rotated by the chuck plate 1 of the rotation stage.
  • a diamond wheel with a diameter of 300 mm is used as the grinding wheel 24 and rotates at a speed of 1000 to 4000 revolutions per minute.
  • the rotor unit includes a hollow shaft 4, a thrust plate 5, a thrust plate 6, a magnet holding unit 12, and a driven magnet unit 13.
  • A1 in a figure is a central axis of a rotor part.
  • the hollow shaft 4, the thrust plate 5 and the thrust plate 6 are made of a metal material.
  • a grindstone 24 is mounted below the thrust plate 5 via a chuck 23, and the grindstone 24 rotates integrally with the rotor portion. Further, a hollow magnet holding portion 12 is provided above the thrust plate 6, and the driven side magnet portion 13 is fixed to the outer surface thereof.
  • the driven magnet unit 13 and the drive magnet unit 16 constitute an in-out type magnetic coupling. That is, in the magnet holding portion 12, the driven side magnet portion 13 which is a part of the magnetic coupling is held concentrically around the central axis A1.
  • the driven-side magnet unit 13 a plurality of magnets magnetized in advance to the N pole and magnets magnetized in advance to the same number as the S pole are alternately arranged at equal angular intervals.
  • the housing portion includes a main body 7, a radial bearing pad 8, a thrust bearing pad 9, and a thrust bearing pad 10.
  • the radial bearing pad 8, the thrust bearing pad 9, and the thrust bearing pad 10 are made of a porous material, and are fixed to the main body 7 of the housing portion by shrink fitting, bonding or the like.
  • the main body 7 of the housing portion has an annular shape, and a pressurized gas supply hole 11 is provided on the side surface thereof, and is connected to a pressurized gas supply source (not shown).
  • the pressurized gas supplied from the pressurized gas supply source to the pressurized gas supply hole 11 is distributed to the radial bearing pad 8, the thrust bearing pad 9, and the thrust bearing pad 10 through the distribution flow path 11a, and from each pad The gas spouts out.
  • the radial bearing pad 8 is annularly provided so as to surround the hollow shaft 4 of the rotor portion, and is opposed to the bearing surface 3 which is the outer surface of the hollow shaft 4.
  • the thrust bearing pad 9 is annularly provided so as to surround the central axis A1 of the rotor portion, and is opposed to the upper surface of the thrust plate 5.
  • the thrust bearing pad 10 is provided in an annular shape so as to surround the central axis A1 of the rotor portion, and is opposed to the lower surface of the thrust plate 6.
  • the rotor portion is rotatably supported at a distance from the housing portion by the pressure of the gas ejected from each pad.
  • Carbon graphite is preferably used for each bearing pad, and alumina (Al 2 O 3 ) is preferably used for surface coating of each bearing surface.
  • alumina Al 2 O 3
  • Carbon graphite is excellent in self-lubricity and wear resistance due to the slip of crystal planes, and has the advantage that the occurrence of friction can be significantly reduced.
  • the main body 7 of the housing portion is suspended on the processing tool housing 80 by a plurality of tilt adjustment mechanisms 19.
  • the attitude of the main body 7 with respect to the processing tool housing 80 can be controlled.
  • an electric cylinder is used as the inclination adjustment mechanism 19.
  • a pulley 14, a bearing 15, a driving magnet unit 16, a belt 17, and a motor 18 are provided inside the processing tool case 80 as a drive mechanism for applying a rotational force to the rotor unit.
  • the pulley 14 is a hollow shaft member, and the driving side magnet unit 16 is fixed to the inner diameter side thereof.
  • the bearing 15 is, for example, a deep groove ball bearing, and rotatably supports the pulley 14 at a position where the driving magnet unit 16 is at a height facing the driven magnet unit 13.
  • FIG. 5A is a plan view showing the arrangement of magnets. A magnet having a magnetic pole opposite to that of the driven side magnet unit 13 is disposed opposite to the driving side magnet unit 16 so that the coupling function is exhibited by the action of the magnetic force, and the pulley 14 If it rotates, a rotor part will also follow and rotate.
  • the drive side magnet unit 16 and the driven side magnet unit 13 constitute an in-out type magnetic coupling. Although the lengths in the thrust direction (Z direction) of the driven magnet unit 13 and the driving magnet unit 16 are shown as the same length in FIG. 8, they may not necessarily be the same.
  • a motor 18 is fixed to the processing tool housing 80, and an endless belt 17 for transmitting the rotational driving force of the motor 18 to the pulley 14 is wound around the rotational shaft of the motor 18 and the pulley 14.
  • the pulley 14, the belt 17, and the motor 18 form a belt drive mechanism.
  • the pulley 14, the bearing 15, the driving magnet unit 16, and the belt which are drive mechanisms for applying the rotational force to the rotor unit even when the inclination of the rotor of the processing tool unit is adjusted. 17.
  • the arrangement of the motor 18 is not affected.
  • the tension of the belt transmitting the rotational force of the motor does not change. Therefore, the tension of the belt does not change every time the attitude of the grinding tool 24 is adjusted, and the rotational force can be stably transmitted to the rotating shaft, and the rotation of the grinding wheel 24 becomes unstable. It will never be.
  • the cyclic expansion and contraction motion of the belt acts on the rotation shaft, so that there is no risk of inducing unnecessary vibration on the rotation shaft.
  • the apparatus is configured to satisfy the relationship of Formula 1 described above, the driving magnet and the driven magnet do not contact each other in the apparatus of the present embodiment, and the driving state of the inclination adjustment mechanism is obtained.
  • the driving force can be stably transmitted regardless of the condition.
  • the bearing mechanism of the static pressure air bearing is not excessively loaded, and the operation of the static pressure air bearing can also be stabilized and the life can be extended.
  • the in-out type shown in FIG. 5A is used as the magnetic coupling, but it is also possible to use the disk type shown in FIG. 5B or FIG.
  • Embodiments of the present invention are not limited to the above-described embodiments, and can be appropriately modified or combined.
  • the rotational force in the path for transmitting the rotational force of the motor to the rotational stage, is transmitted to the motive force side magnet unit using a belt and a pulley.
  • the rotational force may be transmitted from the motor to the driving magnet of the magnetic coupling via the gear or the decelerator, and in some cases, the motor and the driving magnet may be directly coupled.
  • the transmission system is separated by the action of the magnetic coupling, the adjustment of the inclination of the rotor does not affect the driving side.
  • the position of the reference point for tilt adjustment is not limited to the example illustrated in the above-described embodiment, and may be provided at another place.
  • a stopper for limiting the inclination may be provided so that the driven magnet of the magnetic coupling does not contact the driving magnet.
  • the implementation of the present invention is not limited to a grinding apparatus using a semiconductor wafer as a workpiece.
  • the holding mechanism of the workpiece is not limited to the vacuum chuck, and another holding mechanism such as an electrostatic chuck may be used according to the nature of the workpiece.
  • the processing performed by the processing apparatus according to the present invention is not limited to grinding for the purpose of planarization, and may be, for example, drilling, cutting, curved surface polishing, or the like. That is, the present invention can be suitably used for pivotal support of the rotation shaft if the processing tool and the holding mechanism of the workpiece are appropriately selected according to the target processing.
  • a rotor provided with a magnet on the driven side of the magnetic coupling, a static pressure gas bearing for pivotally supporting the rotor, an inclination adjusting means for adjusting the attitude of the static pressure gas bearing, a motor, and rotation of the motor
  • the object to be rotated is not limited to the workpiece or the processing tool. That is, using the rotation device similar to the mechanism included in the processing device described in the embodiment allows the held object to be rotated with high accuracy, so the rotation device of the present invention can be used for industrial equipment such as a measuring device. Can also be applied.
  • the present invention can be implemented in a processing apparatus having a rotating processing tool and a rotating stage for holding a workpiece.
  • the present invention can be suitably implemented in a processing apparatus that includes a rotary stage that holds a workpiece such as a semiconductor wafer and a rotary tool for grinding the workpiece, and that can adjust the attitude of the rotary shaft.
  • the present invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the present invention. Accordingly, the following claims are attached to disclose the scope of the present invention.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
PCT/JP2018/033112 2017-09-13 2018-09-06 加工装置 WO2019054280A1 (ja)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020196100A (ja) * 2019-06-04 2020-12-10 株式会社ディスコ 圧電アクチュエータで構成したチャックテーブル傾き調整機構
JP2020202268A (ja) * 2019-06-07 2020-12-17 東京エレクトロン株式会社 基板処理装置
CN112303121A (zh) * 2020-10-27 2021-02-02 浙江大学 一种具有三自由度磁轴承的磁悬浮泵
JP2021125660A (ja) * 2020-02-10 2021-08-30 東京エレクトロン株式会社 基板位置決め装置、基板位置決め方法および接合装置
US20210346679A1 (en) * 2018-10-02 2021-11-11 Berlin Heart Gmbh Bearing assembly and rotary fluid pump
WO2022115019A1 (en) 2020-11-27 2022-06-02 Climeon Ab Turbine-generator assembly with magnetic coupling
WO2022153737A1 (ja) * 2021-01-14 2022-07-21 Ntn株式会社 スピンドル装置
US11858092B2 (en) * 2017-06-21 2024-01-02 Tokyo Electron Limited Substrate processing system, substrate processing method and computer-readable recording medium
WO2024084988A1 (ja) * 2022-10-19 2024-04-25 株式会社フェローテックマテリアルテクノロジーズ 回転伝達装置

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08229759A (ja) * 1995-02-24 1996-09-10 Canon Inc 位置決め装置並びにデバイス製造装置及び方法
JP2008264913A (ja) * 2007-04-18 2008-11-06 Disco Abrasive Syst Ltd 研削加工装置
JP2009095913A (ja) * 2007-10-15 2009-05-07 Nisshin Seisakusho:Kk 工作機械の加工ツール保護装置およびホーニング盤
JP2009195994A (ja) * 2008-02-19 2009-09-03 Okamoto Machine Tool Works Ltd ワークチャックロータリーテーブル機構
JP2010188433A (ja) * 2009-02-16 2010-09-02 Disco Abrasive Syst Ltd 回転工具を備えた加工装置
JP2013013216A (ja) * 2011-06-29 2013-01-17 Prospine:Kk 磁気カップリング及び撹拌装置
JP2013038952A (ja) * 2011-08-09 2013-02-21 Hitachi Metals Ltd 磁気カップリング装置
JP2016504549A (ja) * 2013-01-30 2016-02-12 ポッホハマー、グレゴールＰＵＣＨＨＡＭＭＥＲ， Ｇｒｅｇｏｒ ウォブル機構

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000074066A (ja) * 1998-08-26 2000-03-07 Disco Abrasive Syst Ltd 回転体支持装置
JP4335425B2 (ja) * 2000-08-28 2009-09-30 住友重機械工業株式会社 ステージ装置
JP4124977B2 (ja) * 2001-04-04 2008-07-23 キヤノン株式会社 回転装置
JP2005022059A (ja) 2003-07-02 2005-01-27 Ebara Corp 研削盤及び研削方法
JP2008142782A (ja) * 2006-12-06 2008-06-26 Okamoto Machine Tool Works Ltd 静圧水軸受の平坦化装置
JP5049095B2 (ja) * 2007-10-30 2012-10-17 株式会社ディスコ 研削ホイール
JP5184910B2 (ja) * 2008-02-13 2013-04-17 株式会社岡本工作機械製作所 基板の平面研削装置
JP2009208212A (ja) * 2008-03-06 2009-09-17 Okamoto Machine Tool Works Ltd 基板の薄厚平坦化加工装置
CN201235486Y (zh) * 2008-08-07 2009-05-13 无锡开源机床集团有限公司 立式磨床用工作台结构
JP5976522B2 (ja) 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
CN103831712B (zh) * 2014-03-07 2016-02-10 宇环数控机床股份有限公司 一种用于双面精密磨削、研磨组合机床的下盘装置
JP2015230734A (ja) 2014-06-03 2015-12-21 旭硝子株式会社 磁気記録媒体用のガラス基板の加工方法、磁気記録媒体用のガラス基板の製造方法、および磁気記録媒体用のガラス基板の加工装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08229759A (ja) * 1995-02-24 1996-09-10 Canon Inc 位置決め装置並びにデバイス製造装置及び方法
JP2008264913A (ja) * 2007-04-18 2008-11-06 Disco Abrasive Syst Ltd 研削加工装置
JP2009095913A (ja) * 2007-10-15 2009-05-07 Nisshin Seisakusho:Kk 工作機械の加工ツール保護装置およびホーニング盤
JP2009195994A (ja) * 2008-02-19 2009-09-03 Okamoto Machine Tool Works Ltd ワークチャックロータリーテーブル機構
JP2010188433A (ja) * 2009-02-16 2010-09-02 Disco Abrasive Syst Ltd 回転工具を備えた加工装置
JP2013013216A (ja) * 2011-06-29 2013-01-17 Prospine:Kk 磁気カップリング及び撹拌装置
JP2013038952A (ja) * 2011-08-09 2013-02-21 Hitachi Metals Ltd 磁気カップリング装置
JP2016504549A (ja) * 2013-01-30 2016-02-12 ポッホハマー、グレゴールＰＵＣＨＨＡＭＭＥＲ， Ｇｒｅｇｏｒ ウォブル機構

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11858092B2 (en) * 2017-06-21 2024-01-02 Tokyo Electron Limited Substrate processing system, substrate processing method and computer-readable recording medium
US20210346679A1 (en) * 2018-10-02 2021-11-11 Berlin Heart Gmbh Bearing assembly and rotary fluid pump
JP2020196100A (ja) * 2019-06-04 2020-12-10 株式会社ディスコ 圧電アクチュエータで構成したチャックテーブル傾き調整機構
JP2020202268A (ja) * 2019-06-07 2020-12-17 東京エレクトロン株式会社 基板処理装置
JP7333715B2 (ja) 2019-06-07 2023-08-25 東京エレクトロン株式会社 基板処理装置
JP2021125660A (ja) * 2020-02-10 2021-08-30 東京エレクトロン株式会社 基板位置決め装置、基板位置決め方法および接合装置
JP7370271B2 (ja) 2020-02-10 2023-10-27 東京エレクトロン株式会社 基板位置決め装置、基板位置決め方法および接合装置
CN112303121A (zh) * 2020-10-27 2021-02-02 浙江大学 一种具有三自由度磁轴承的磁悬浮泵
CN112303121B (zh) * 2020-10-27 2021-09-28 浙江大学 一种具有三自由度磁轴承的磁悬浮泵
WO2022115019A1 (en) 2020-11-27 2022-06-02 Climeon Ab Turbine-generator assembly with magnetic coupling
WO2022153737A1 (ja) * 2021-01-14 2022-07-21 Ntn株式会社 スピンドル装置
WO2024084988A1 (ja) * 2022-10-19 2024-04-25 株式会社フェローテックマテリアルテクノロジーズ 回転伝達装置

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JP6878605B2 (ja) 2021-05-26
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KR20200052929A (ko) 2020-05-15
KR102352534B1 (ko) 2022-01-19

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