KR100562498B1 - 씨엠피 설비의 패드 컨디셔너 - Google Patents
씨엠피 설비의 패드 컨디셔너 Download PDFInfo
- Publication number
- KR100562498B1 KR100562498B1 KR1020030008792A KR20030008792A KR100562498B1 KR 100562498 B1 KR100562498 B1 KR 100562498B1 KR 1020030008792 A KR1020030008792 A KR 1020030008792A KR 20030008792 A KR20030008792 A KR 20030008792A KR 100562498 B1 KR100562498 B1 KR 100562498B1
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- KR
- South Korea
- Prior art keywords
- magnetic field
- field generating
- generating portion
- conditioner
- conditioner head
- Prior art date
Links
- 230000006698 induction Effects 0.000 claims abstract description 3
- 238000005498 polishing Methods 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 8
- 230000003750 conditioning effect Effects 0.000 claims description 3
- 230000003028 elevating effect Effects 0.000 description 7
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
Claims (6)
- 연마패드의 표면을 컨디셔닝하기 위한 평탄화 설비의 컨디셔너에 있어서,연마 디스크를 보유하고, 상기 연마패드의 표면에 접하여 회전하는 디스크 홀더;상기 디스크 홀더가 결합되고, 상기 디스크 홀더를 회전시키는 구동장치를 구비한 컨디셔너 헤드를 포함하되;상기 디스크 홀더는 제1자계발생부를 구비하고, 상기 컨디셔너 헤드는 상기 제1자계발생부와 대향하는 위치에 상기 제1자계발생부에 대하여 자력을 발생하는 제2자계발생부를 구비하여, 상기 제1자계발생부와 제2자계발생부간의 자력에 의해 상기 디스크 홀더가 상기 컨디셔너 헤드로부터 업/다운되며;상기 컨디셔너 헤드는 환형의 내부공간을 갖는 회전축을 구비하고,상기 디스크 홀더는 상기 회전축의 환경의 내부공간에 수용되도록 결합되어 회전됨과 아울러 상기 회전축을 따라 상하 이동가능한 환형의 구동 슬리브를 구비하는 것을 특징으로 하는 평탄화 설비의 컨디셔너.
- 제 1 항에 있어서,상기 제2자계발생부와 상기 제1자계발생부 사이에 척력 또는 인력이 작용하도록, 상기 제2자계발생부는 인가되는 전원에 따라 극성이 전환되는 것을 특징으로 하는 평탄화 설비의 컨디셔너.
- 제 1 항에 있어서,상기 제1자계발생부는 상기 구동 슬리브 상에 설치되고,상기 제2자계발생부는 상기 구동 슬리브와 인접한 상기 회전축 상단에 설치되는 것을 특징으로 하는 평탄화 설비의 컨디셔너.
- 제 1 항에 있어서,상기 제1자계발생부는 상기 디스크 홀더의 상면에 설치되고,상기 제2자계발생부는 상기 컨디셔너 헤드를 이루는 하우징의 저면에 설치되는 것을 특징으로 하는 평탄화 설비의 컨디셔너.
- 제 1 항에 있어서,상기 제1자계발생부는 영구자석이고,상기 제2자계발생부는 전류에 의해 유도 자계를 발생하는 전자석인 것을 특징으로 하는 평탄화 설비의 컨디셔너.
- 연마패드의 표면을 컨디셔닝하기 위한 평탄화 설비의 컨디셔너에 있어서,연마 디스크를 보유하고, 상기 연마패드의 표면에 접하여 회전하는 디스크 홀더;상기 디스크 홀더가 결합되고, 상기 디스크 홀더를 회전시키는 구동장치를 구비한 컨디셔너 헤드를 포함하되;상기 디스크 홀더는 제1자계발생부를 구비하고, 상기 컨디셔너 헤드는 상기 제1자계발생부와 대향하는 위치에 상기 제1자계발생부에 대하여 자력을 발생하는 제2자계발생부를 구비하여, 상기 제1자계발생부와 제2자계발생부간의 자력에 의해 상기 디스크 홀더가 상기 컨디셔너 헤드로부터 업/다운되며;상기 제1자계발생부는 상기 디스크 홀더의 상면에 설치되고,상기 제2자계발생부는 상기 컨디셔너 헤드를 이루는 하우징의 저면에 설치되는 것을 특징으로 하는 평탄화 설비의 컨디셔너.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030008792A KR100562498B1 (ko) | 2003-02-12 | 2003-02-12 | 씨엠피 설비의 패드 컨디셔너 |
US10/766,485 US6960114B2 (en) | 2003-02-12 | 2004-01-29 | Pad conditioner of CMP equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030008792A KR100562498B1 (ko) | 2003-02-12 | 2003-02-12 | 씨엠피 설비의 패드 컨디셔너 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040072343A KR20040072343A (ko) | 2004-08-18 |
KR100562498B1 true KR100562498B1 (ko) | 2006-03-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020030008792A KR100562498B1 (ko) | 2003-02-12 | 2003-02-12 | 씨엠피 설비의 패드 컨디셔너 |
Country Status (2)
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US (1) | US6960114B2 (ko) |
KR (1) | KR100562498B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101951186B1 (ko) | 2017-11-07 | 2019-02-25 | 한국생산기술연구원 | 연마패드의 마모를 균일화시키는 화학기계적 연마장치의 컨디셔너 |
KR20190136184A (ko) | 2018-05-30 | 2019-12-10 | 한국생산기술연구원 | 연마패드에 대한 가압력 조절이 가능한 씨엠피장치의 컨디셔너 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7201633B2 (en) * | 2005-02-22 | 2007-04-10 | Lsi Logic Corporation | Systems and methods for wafer polishing |
US20060189257A1 (en) * | 2005-02-22 | 2006-08-24 | Lsi Logic Corporation | Systems and methods for wafer polishing |
EP2159304A1 (en) * | 2008-08-27 | 2010-03-03 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Apparatus and method for atomic layer deposition |
US8550876B2 (en) * | 2011-08-08 | 2013-10-08 | Apple Inc. | Force-controlled surface finishing through the use of a passive magnetic constant-force device |
JP5919157B2 (ja) * | 2012-10-01 | 2016-05-18 | 株式会社荏原製作所 | ドレッサー |
US20150158143A1 (en) * | 2013-12-10 | 2015-06-11 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and method for chemically mechanically polishing |
KR101665438B1 (ko) * | 2014-06-16 | 2016-10-12 | 주식회사 케이씨텍 | 화학 기계적 연마 장치의 저압 컨디셔너 |
US11766758B2 (en) * | 2021-01-27 | 2023-09-26 | Taiwan Semiconductor Manufacturing Company Limited | Chemical mechanical polishing apparatus using a magnetically coupled pad conditioning disk |
CN115401550A (zh) * | 2022-10-14 | 2022-11-29 | 河北盛可居装饰材料有限公司 | 砂光装置及砂光设备 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3633580A (en) * | 1967-01-18 | 1972-01-11 | Knox Lab Inc | Hypodermic needle |
US3645268A (en) * | 1969-12-10 | 1972-02-29 | Dagoberto Capote | Disposable, presterilized, self-locating and piercing evacuator with ejector tube |
US4228373A (en) * | 1979-09-10 | 1980-10-14 | Funderburg William S | Electromagnetic motor |
EP0390481B1 (en) * | 1989-03-23 | 1996-02-28 | Sanyo Chemical Industries Ltd. | Surgical adhesive sheet |
US5279544A (en) * | 1990-12-13 | 1994-01-18 | Sil Medics Ltd. | Transdermal or interdermal drug delivery devices |
US5250067A (en) * | 1992-11-30 | 1993-10-05 | Ala Gelfer | Body treatment pad having a multiple number of sharpened skin-penetration protuberances |
EP0893834B1 (en) * | 1993-11-02 | 2004-04-07 | Matsushita Electric Industrial Co., Ltd | Semiconductor device comprising an aggregate of semiconductor micro-needles |
US5457041A (en) * | 1994-03-25 | 1995-10-10 | Science Applications International Corporation | Needle array and method of introducing biological substances into living cells using the needle array |
US5591139A (en) * | 1994-06-06 | 1997-01-07 | The Regents Of The University Of California | IC-processed microneedles |
US5607341A (en) * | 1994-08-08 | 1997-03-04 | Leach; Michael A. | Method and structure for polishing a wafer during manufacture of integrated circuits |
US5968022A (en) * | 1995-04-28 | 1999-10-19 | Saito; Yoshikuni | Medical hollow needle and method of production |
US5634913A (en) * | 1996-01-23 | 1997-06-03 | Stinger; Florence | Softening conduit for carrying fluids into and out of the human body |
US5809157A (en) * | 1996-04-09 | 1998-09-15 | Victor Lavrov | Electromagnetic linear drive |
US5951368A (en) * | 1996-05-29 | 1999-09-14 | Ebara Corporation | Polishing apparatus |
US5899915A (en) * | 1996-12-02 | 1999-05-04 | Angiotrax, Inc. | Apparatus and method for intraoperatively performing surgery |
US5911363A (en) * | 1997-03-10 | 1999-06-15 | Spratronics, Inc. | Vehicle mounted spray apparatus and method |
US6036583A (en) * | 1997-07-11 | 2000-03-14 | Applied Materials, Inc. | Conditioner head in a substrate polisher and method |
US5904615A (en) * | 1997-07-18 | 1999-05-18 | Hankook Machine Tools Co., Ltd. | Pad conditioner for chemical mechanical polishing apparatus |
US6503231B1 (en) * | 1998-06-10 | 2003-01-07 | Georgia Tech Research Corporation | Microneedle device for transport of molecules across tissue |
JP4071361B2 (ja) | 1998-07-01 | 2008-04-02 | 永大産業株式会社 | 電気式床暖房フロアの施工方法及び電気式床暖房フロア並びに床材 |
US6217554B1 (en) * | 1999-02-12 | 2001-04-17 | Pharmaspec Corporation | Methods and apparatus for delivering substances into extravascular tissue |
JP3772946B2 (ja) * | 1999-03-11 | 2006-05-10 | 株式会社荏原製作所 | ドレッシング装置及び該ドレッシング装置を備えたポリッシング装置 |
US6234868B1 (en) * | 1999-04-30 | 2001-05-22 | Lucent Technologies Inc. | Apparatus and method for conditioning a polishing pad |
US6379324B1 (en) * | 1999-06-09 | 2002-04-30 | The Procter & Gamble Company | Intracutaneous microneedle array apparatus |
US6312612B1 (en) * | 1999-06-09 | 2001-11-06 | The Procter & Gamble Company | Apparatus and method for manufacturing an intracutaneous microneedle array |
US6629949B1 (en) * | 2000-05-08 | 2003-10-07 | Sterling Medivations, Inc. | Micro infusion drug delivery device |
EP1345646A2 (en) * | 2000-12-14 | 2003-09-24 | Georgia Tech Research Corporation | Microneedle devices and production thereof |
-
2003
- 2003-02-12 KR KR1020030008792A patent/KR100562498B1/ko active IP Right Grant
-
2004
- 2004-01-29 US US10/766,485 patent/US6960114B2/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101951186B1 (ko) | 2017-11-07 | 2019-02-25 | 한국생산기술연구원 | 연마패드의 마모를 균일화시키는 화학기계적 연마장치의 컨디셔너 |
KR20190136184A (ko) | 2018-05-30 | 2019-12-10 | 한국생산기술연구원 | 연마패드에 대한 가압력 조절이 가능한 씨엠피장치의 컨디셔너 |
KR102064855B1 (ko) | 2018-05-30 | 2020-01-10 | 한국생산기술연구원 | 연마패드에 대한 가압력 조절이 가능한 씨엠피장치의 컨디셔너 |
Also Published As
Publication number | Publication date |
---|---|
US20040198200A1 (en) | 2004-10-07 |
US6960114B2 (en) | 2005-11-01 |
KR20040072343A (ko) | 2004-08-18 |
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