KR20040072343A - 씨엠피 설비의 패드 컨디셔너 - Google Patents
씨엠피 설비의 패드 컨디셔너 Download PDFInfo
- Publication number
- KR20040072343A KR20040072343A KR1020030008792A KR20030008792A KR20040072343A KR 20040072343 A KR20040072343 A KR 20040072343A KR 1020030008792 A KR1020030008792 A KR 1020030008792A KR 20030008792 A KR20030008792 A KR 20030008792A KR 20040072343 A KR20040072343 A KR 20040072343A
- Authority
- KR
- South Korea
- Prior art keywords
- magnetic field
- field generating
- conditioner
- generating portion
- polishing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims description 8
- 230000003750 conditioning effect Effects 0.000 claims description 2
- 230000006698 induction Effects 0.000 claims description 2
- 230000003028 elevating effect Effects 0.000 description 7
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
Claims (5)
- 연마패드의 표면을 컨디셔닝하기 위한 평탄화 설비의 컨디셔너에 있어서:연마 디스크를 보유하는 그리고 상기 연마패드의 표면에 접하여 회전하는 디스크 홀더;상기 디스크 홀더가 결합되는 그리고 상기 디스크 홀더를 회전시키는 구동장치를 구비한 컨디셔너 헤드를 포함하되;상기 디스크 홀더는 제1자계발생부를 구비하고,상기 컨디셔너 헤드는 상기 제1자계발생부와 대향하는 위치에 상기 제1자계발생부에 대하여 자력을 발생하는 제2자계발생부를 구비하여, 상기 제1자계발생부와 제2자계발생부간의 자력에 의해 상기 디스크 홀더가 상기 컨디셔너 헤드로부터 업/다운되는 것을 특징으로 하는 평탄화 설비의 컨디셔너.
- 제 1 항에 있어서,상기 제2자계발생부와 상기 제1자계발생부 사이에 척력 또는 인력이 작용하도록, 상기 제2자계발생부는 인가되는 전원에 따라 극성이 전환되는 것을 특징으로 하는 평탄화 설비의 컨디셔너.
- 제 1 항에 있어서,상기 컨디셔너 헤드는 회전축을 구비하고,상기 디스크 홀더는 상기 회전축에 결합되어 회전됨과 아울러 상기 회전축을 따라 상하 이동가능한 슬리브를 구비하되;상기 제1자계발생부는 상기 슬리브상에 설치되고,상기 제2자계발생부는 상기 슬리브와 인접한 상기 회전축 상단에 설치되는 것을 특징으로 하는 평탄화 설비의 컨디셔너.
- 제 1 항에 있어서,상기 제1자계발생부는 상기 디스크 홀더의 상면에 설치되고,상기 제2자계발생부는 상기 컨디셔너 헤드를 이루는 하우징의 저면에 설치되는 것을 특징으로 하는 평탄화 설비의 컨디셔너.
- 제 1 항에 있어서,상기 제1자계발생부는 영구자석이고,상기 제2자계발생부는 전류에 의해 유도 자계를 발생하는 전자석인 것을 특징으로 하는 평탄화 설비의 컨디셔너.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030008792A KR100562498B1 (ko) | 2003-02-12 | 2003-02-12 | 씨엠피 설비의 패드 컨디셔너 |
US10/766,485 US6960114B2 (en) | 2003-02-12 | 2004-01-29 | Pad conditioner of CMP equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030008792A KR100562498B1 (ko) | 2003-02-12 | 2003-02-12 | 씨엠피 설비의 패드 컨디셔너 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040072343A true KR20040072343A (ko) | 2004-08-18 |
KR100562498B1 KR100562498B1 (ko) | 2006-03-21 |
Family
ID=33095535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030008792A KR100562498B1 (ko) | 2003-02-12 | 2003-02-12 | 씨엠피 설비의 패드 컨디셔너 |
Country Status (2)
Country | Link |
---|---|
US (1) | US6960114B2 (ko) |
KR (1) | KR100562498B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150143991A (ko) * | 2014-06-16 | 2015-12-24 | 주식회사 케이씨텍 | 화학 기계적 연마 장치의 저압 컨디셔너 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7201633B2 (en) * | 2005-02-22 | 2007-04-10 | Lsi Logic Corporation | Systems and methods for wafer polishing |
US20060189257A1 (en) * | 2005-02-22 | 2006-08-24 | Lsi Logic Corporation | Systems and methods for wafer polishing |
EP2159304A1 (en) * | 2008-08-27 | 2010-03-03 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Apparatus and method for atomic layer deposition |
US8550876B2 (en) * | 2011-08-08 | 2013-10-08 | Apple Inc. | Force-controlled surface finishing through the use of a passive magnetic constant-force device |
JP5919157B2 (ja) * | 2012-10-01 | 2016-05-18 | 株式会社荏原製作所 | ドレッサー |
US20150158143A1 (en) * | 2013-12-10 | 2015-06-11 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and method for chemically mechanically polishing |
KR101951186B1 (ko) | 2017-11-07 | 2019-02-25 | 한국생산기술연구원 | 연마패드의 마모를 균일화시키는 화학기계적 연마장치의 컨디셔너 |
KR102064855B1 (ko) | 2018-05-30 | 2020-01-10 | 한국생산기술연구원 | 연마패드에 대한 가압력 조절이 가능한 씨엠피장치의 컨디셔너 |
US11766758B2 (en) * | 2021-01-27 | 2023-09-26 | Taiwan Semiconductor Manufacturing Company Limited | Chemical mechanical polishing apparatus using a magnetically coupled pad conditioning disk |
CN115401550A (zh) * | 2022-10-14 | 2022-11-29 | 河北盛可居装饰材料有限公司 | 砂光装置及砂光设备 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3633580A (en) * | 1967-01-18 | 1972-01-11 | Knox Lab Inc | Hypodermic needle |
US3645268A (en) * | 1969-12-10 | 1972-02-29 | Dagoberto Capote | Disposable, presterilized, self-locating and piercing evacuator with ejector tube |
US4228373A (en) * | 1979-09-10 | 1980-10-14 | Funderburg William S | Electromagnetic motor |
EP0390481B1 (en) * | 1989-03-23 | 1996-02-28 | Sanyo Chemical Industries Ltd. | Surgical adhesive sheet |
US5279544A (en) * | 1990-12-13 | 1994-01-18 | Sil Medics Ltd. | Transdermal or interdermal drug delivery devices |
US5250067A (en) * | 1992-11-30 | 1993-10-05 | Ala Gelfer | Body treatment pad having a multiple number of sharpened skin-penetration protuberances |
EP0893834B1 (en) * | 1993-11-02 | 2004-04-07 | Matsushita Electric Industrial Co., Ltd | Semiconductor device comprising an aggregate of semiconductor micro-needles |
US5457041A (en) * | 1994-03-25 | 1995-10-10 | Science Applications International Corporation | Needle array and method of introducing biological substances into living cells using the needle array |
US5591139A (en) * | 1994-06-06 | 1997-01-07 | The Regents Of The University Of California | IC-processed microneedles |
US5607341A (en) * | 1994-08-08 | 1997-03-04 | Leach; Michael A. | Method and structure for polishing a wafer during manufacture of integrated circuits |
US5968022A (en) * | 1995-04-28 | 1999-10-19 | Saito; Yoshikuni | Medical hollow needle and method of production |
US5634913A (en) * | 1996-01-23 | 1997-06-03 | Stinger; Florence | Softening conduit for carrying fluids into and out of the human body |
US5809157A (en) * | 1996-04-09 | 1998-09-15 | Victor Lavrov | Electromagnetic linear drive |
US5951368A (en) * | 1996-05-29 | 1999-09-14 | Ebara Corporation | Polishing apparatus |
US5899915A (en) * | 1996-12-02 | 1999-05-04 | Angiotrax, Inc. | Apparatus and method for intraoperatively performing surgery |
US5911363A (en) * | 1997-03-10 | 1999-06-15 | Spratronics, Inc. | Vehicle mounted spray apparatus and method |
US6036583A (en) * | 1997-07-11 | 2000-03-14 | Applied Materials, Inc. | Conditioner head in a substrate polisher and method |
US5904615A (en) * | 1997-07-18 | 1999-05-18 | Hankook Machine Tools Co., Ltd. | Pad conditioner for chemical mechanical polishing apparatus |
US6503231B1 (en) * | 1998-06-10 | 2003-01-07 | Georgia Tech Research Corporation | Microneedle device for transport of molecules across tissue |
JP4071361B2 (ja) | 1998-07-01 | 2008-04-02 | 永大産業株式会社 | 電気式床暖房フロアの施工方法及び電気式床暖房フロア並びに床材 |
US6217554B1 (en) * | 1999-02-12 | 2001-04-17 | Pharmaspec Corporation | Methods and apparatus for delivering substances into extravascular tissue |
JP3772946B2 (ja) * | 1999-03-11 | 2006-05-10 | 株式会社荏原製作所 | ドレッシング装置及び該ドレッシング装置を備えたポリッシング装置 |
US6234868B1 (en) * | 1999-04-30 | 2001-05-22 | Lucent Technologies Inc. | Apparatus and method for conditioning a polishing pad |
US6379324B1 (en) * | 1999-06-09 | 2002-04-30 | The Procter & Gamble Company | Intracutaneous microneedle array apparatus |
US6312612B1 (en) * | 1999-06-09 | 2001-11-06 | The Procter & Gamble Company | Apparatus and method for manufacturing an intracutaneous microneedle array |
US6629949B1 (en) * | 2000-05-08 | 2003-10-07 | Sterling Medivations, Inc. | Micro infusion drug delivery device |
EP1345646A2 (en) * | 2000-12-14 | 2003-09-24 | Georgia Tech Research Corporation | Microneedle devices and production thereof |
-
2003
- 2003-02-12 KR KR1020030008792A patent/KR100562498B1/ko active IP Right Grant
-
2004
- 2004-01-29 US US10/766,485 patent/US6960114B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150143991A (ko) * | 2014-06-16 | 2015-12-24 | 주식회사 케이씨텍 | 화학 기계적 연마 장치의 저압 컨디셔너 |
Also Published As
Publication number | Publication date |
---|---|
US20040198200A1 (en) | 2004-10-07 |
KR100562498B1 (ko) | 2006-03-21 |
US6960114B2 (en) | 2005-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4660505B2 (ja) | 基板キャリアシステムおよび基板を研磨する方法 | |
US6059638A (en) | Magnetic force carrier and ring for a polishing apparatus | |
KR100562498B1 (ko) | 씨엠피 설비의 패드 컨디셔너 | |
US20100190417A1 (en) | Apparatus for dressing a polishing pad, chemical mechanical polishing apparatus and method | |
US6213855B1 (en) | Self-powered carrier for polishing or planarizing wafers | |
JP2024507525A (ja) | 非接触型プラテンエッジ制御付き研磨システム | |
KR100801368B1 (ko) | 화학 기계적 연마기용 다이어프램 | |
CN109623629A (zh) | 一种用于硬质材料自动化抛光生产线 | |
JP2004518270A (ja) | 化学的機械研磨(cmp)ヘッド、装置及び方法、並びにそれによって製造された平坦化された半導体ウエハ | |
JP2001087995A (ja) | 半導体ウェーハの表面を研削する装置および方法 | |
CN219945748U (zh) | 一种用于cmp设备的电化学机械抛光及平坦化系统 | |
US6439981B1 (en) | Arrangement and method for polishing a surface of a semiconductor wafer | |
CN210210001U (zh) | 研磨垫修整装置 | |
KR100469363B1 (ko) | 반도체장치 제조용 씨엠피설비 | |
US6506099B1 (en) | Driving a carrier head in a wafer polishing system | |
KR20070069780A (ko) | 반도체용 연마장치 | |
JP5115839B2 (ja) | 研磨装置 | |
CN114871941B (zh) | 一种抛光头及抛光机 | |
KR20040077009A (ko) | 씨엠피 설비의 패드 컨디셔너 | |
JP2009255184A (ja) | ウェーハ研磨装置 | |
KR20070080512A (ko) | 화학적 기계적 연마 설비의 패드 컨디셔너 | |
CN116000817A (zh) | 一种研磨垫调整器及研磨垫的调整方法 | |
US6350188B1 (en) | Drive system for a carrier head support structure | |
KR20220033621A (ko) | 연마패드 컨디셔닝 장치 | |
KR100548555B1 (ko) | 화학적기계연마 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130228 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20140228 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20150302 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20170228 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20180228 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20190228 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20200228 Year of fee payment: 15 |