CN112428138B - 单面抛光装置及方法 - Google Patents
单面抛光装置及方法 Download PDFInfo
- Publication number
- CN112428138B CN112428138B CN202011309493.9A CN202011309493A CN112428138B CN 112428138 B CN112428138 B CN 112428138B CN 202011309493 A CN202011309493 A CN 202011309493A CN 112428138 B CN112428138 B CN 112428138B
- Authority
- CN
- China
- Prior art keywords
- wafer
- control pin
- polishing
- polishing head
- initial position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011309493.9A CN112428138B (zh) | 2020-11-20 | 2020-11-20 | 单面抛光装置及方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011309493.9A CN112428138B (zh) | 2020-11-20 | 2020-11-20 | 单面抛光装置及方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112428138A CN112428138A (zh) | 2021-03-02 |
CN112428138B true CN112428138B (zh) | 2022-07-29 |
Family
ID=74693053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011309493.9A Active CN112428138B (zh) | 2020-11-20 | 2020-11-20 | 单面抛光装置及方法 |
Country Status (1)
Country | Link |
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CN (1) | CN112428138B (zh) |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW491750B (en) * | 2000-10-04 | 2002-06-21 | Speedfam Ipec Corp | Method and apparatus for electrochemical planarization of a workpiece |
JP4937807B2 (ja) * | 2006-03-31 | 2012-05-23 | 株式会社荏原製作所 | 基板保持回転機構、基板処理装置 |
CN102174295B (zh) * | 2011-03-25 | 2013-11-20 | 江南大学 | 适用于精细雾化cmp的一种碱性二氧化硅抛光液 |
CN102950536B (zh) * | 2011-08-30 | 2015-08-05 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨装置及化学机械研磨方法 |
JP6157229B2 (ja) * | 2013-06-10 | 2017-07-05 | 株式会社ディスコ | 研削装置及び研削方法 |
SG10201810852TA (en) * | 2014-10-03 | 2019-01-30 | Ebara Corp | Substrate processing apparatus and processing method |
CN104551871B (zh) * | 2014-12-31 | 2017-09-05 | 浙江工业大学 | 一种钽酸锂晶片的磨削加工方法 |
JP6878605B2 (ja) * | 2017-09-13 | 2021-05-26 | キヤノンセミコンダクターエクィップメント株式会社 | 加工装置 |
JP2019091746A (ja) * | 2017-11-13 | 2019-06-13 | 株式会社荏原製作所 | 基板の表面を処理する装置および方法 |
JP7148349B2 (ja) * | 2017-11-14 | 2022-10-05 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
JP7074607B2 (ja) * | 2018-08-02 | 2022-05-24 | 株式会社荏原製作所 | 研磨装置用の治具 |
CN110842676B (zh) * | 2019-11-27 | 2022-04-29 | 湖南大合新材料有限公司 | 一种半导体打磨设备 |
CN111730430B (zh) * | 2020-07-30 | 2021-10-15 | 华海清科(北京)科技有限公司 | 具有可调节的吸盘转台的磨削设备 |
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2020
- 2020-11-20 CN CN202011309493.9A patent/CN112428138B/zh active Active
Also Published As
Publication number | Publication date |
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CN112428138A (zh) | 2021-03-02 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220620 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |