JP5049095B2 - 研削ホイール - Google Patents
研削ホイール Download PDFInfo
- Publication number
- JP5049095B2 JP5049095B2 JP2007281652A JP2007281652A JP5049095B2 JP 5049095 B2 JP5049095 B2 JP 5049095B2 JP 2007281652 A JP2007281652 A JP 2007281652A JP 2007281652 A JP2007281652 A JP 2007281652A JP 5049095 B2 JP5049095 B2 JP 5049095B2
- Authority
- JP
- Japan
- Prior art keywords
- wheel
- grinding wheel
- grinding
- mounting portion
- grindstone mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 235000012489 doughnuts Nutrition 0.000 claims description 3
- 238000003780 insertion Methods 0.000 description 9
- 230000037431 insertion Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 4
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- -1 gallium nitride compound Chemical class 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
- B24D7/063—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental with segments embedded in a matrix which is rubbed away during the grinding process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
5 研削ホイール
6 超音波振動子
12 チャックテーブル
42 回転スピンドル
43 ホイールマウント
51 ホイール基台
52 研削砥石
511 連結部
512 砥石装着部
513 円弧状スリット
W 被加工物
Claims (4)
- チャックテーブルに保持された被加工物を研削する研削手段を構成する回転スピンドルの一端に設けられたホイールマウントに取り付けられるホイール基台と、該ホイール基台に装着された円環状の研削砥石とからなる研削ホイールであって、
前記ホイール基台は、前記ホイールマウントと連結するリング状の連結部と、該連結部の内周部に連結された円盤形状の砥石装着部とからなり、
前記砥石装着部は、
前記ホイールマウント側となる上面は該ホイールマウントに対して相対的に非接触に構成され、
下面側に前記研削砥石が装着され、
前記研削砥石よりも内周側で当該研削ホイールの中心周りに前記研削砥石と同心円をなす位置に配設された円環状の超音波振動子を有し、
前記連結部と当該砥石装着部との境界部に位置させて、周方向に形成された複数の円弧状スリットを備えることを特徴とする研削ホイール。 - 前記砥石装着部は、ドーナツ形状に形成され、
前記超音波振動子は、ドーナツ形状の前記砥石装着部の内周部と前記円弧状スリットとの間の中央位置に配設されていることを特徴とする請求項1に記載の研削ホイール。 - 前記複数の円弧状スリットは、異なる半径による円周上に位置させて互い違いに形成されていることを特徴とする請求項1または2に記載の研削ホイール。
- 前記砥石装着部の上面側は、前記連結部に対して凹形状に形成されることにより前記ホイールマウントに対して非接触に構成されていることを特徴とする請求項1〜3のいずれか一つに記載の研削ホイール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007281652A JP5049095B2 (ja) | 2007-10-30 | 2007-10-30 | 研削ホイール |
KR1020080094033A KR101367737B1 (ko) | 2007-10-30 | 2008-09-25 | 연삭 휠 |
CN2008101713477A CN101422875B (zh) | 2007-10-30 | 2008-10-21 | 磨轮 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007281652A JP5049095B2 (ja) | 2007-10-30 | 2007-10-30 | 研削ホイール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009107065A JP2009107065A (ja) | 2009-05-21 |
JP5049095B2 true JP5049095B2 (ja) | 2012-10-17 |
Family
ID=40613861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007281652A Active JP5049095B2 (ja) | 2007-10-30 | 2007-10-30 | 研削ホイール |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5049095B2 (ja) |
KR (1) | KR101367737B1 (ja) |
CN (1) | CN101422875B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5208630B2 (ja) * | 2008-09-08 | 2013-06-12 | 株式会社ディスコ | 研削ホイール |
JP2011121128A (ja) * | 2009-12-09 | 2011-06-23 | Disco Abrasive Syst Ltd | 研削ホイールの着脱治具および研削ホイールケース |
JP2011148028A (ja) * | 2010-01-20 | 2011-08-04 | Disco Abrasive Syst Ltd | 研削ホイール |
CN102275103B (zh) * | 2011-08-17 | 2014-01-29 | 朝阳博文机床有限公司 | 立轴磨床砂瓦安装定位机构及制作方法 |
JP2015013321A (ja) * | 2013-07-03 | 2015-01-22 | 株式会社ディスコ | 研削ホイール |
JP6707278B2 (ja) * | 2015-09-04 | 2020-06-10 | 株式会社ディスコ | 研削ホイール及び被加工物の研削方法 |
JP6814579B2 (ja) * | 2016-09-20 | 2021-01-20 | 株式会社ディスコ | 研削ホイール及び研削装置 |
JP6878605B2 (ja) * | 2017-09-13 | 2021-05-26 | キヤノンセミコンダクターエクィップメント株式会社 | 加工装置 |
CN108481140A (zh) * | 2018-06-14 | 2018-09-04 | 重庆木头木脑文化创意有限公司 | 木制饰品表面加工用设备 |
JP7216366B2 (ja) * | 2018-11-01 | 2023-02-01 | 荏原環境プラント株式会社 | 超音波探触子およびこれを用いた被検配管厚測定方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5231510Y2 (ja) * | 1972-07-31 | 1977-07-18 | ||
JPS6478764A (en) * | 1987-09-18 | 1989-03-24 | Inoue Japax Res | Grindstone |
JPH0866866A (ja) * | 1994-08-25 | 1996-03-12 | Nakanishi Shika Kikai Seisakusho:Kk | 研削ヘッド |
JPH09168947A (ja) * | 1995-12-18 | 1997-06-30 | Takeshiyou:Kk | 超音波微振動によるワークの周縁研削加工方法 |
CN2294137Y (zh) * | 1997-10-30 | 1998-10-14 | 蔡清源 | 大面积盘式尼龙纤维研磨轮 |
JP2004074348A (ja) * | 2002-08-19 | 2004-03-11 | Nihon Micro Coating Co Ltd | 研磨装置及び方法 |
JP4636905B2 (ja) * | 2005-03-10 | 2011-02-23 | 株式会社ディスコ | 超音波振動用砥石,これを備える超音波振動加工装置および超音波振動用砥石の製造方法 |
US20100197205A1 (en) * | 2005-06-21 | 2010-08-05 | Kazumasa Ohnishi | Grinding device using ultrasonic vibration |
JP4763389B2 (ja) * | 2005-09-05 | 2011-08-31 | 株式会社ディスコ | 切削工具 |
CN100519082C (zh) * | 2006-06-13 | 2009-07-29 | 广东奔朗超硬材料制品有限公司 | 磨边轮制作方法 |
-
2007
- 2007-10-30 JP JP2007281652A patent/JP5049095B2/ja active Active
-
2008
- 2008-09-25 KR KR1020080094033A patent/KR101367737B1/ko active IP Right Grant
- 2008-10-21 CN CN2008101713477A patent/CN101422875B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20090044997A (ko) | 2009-05-07 |
JP2009107065A (ja) | 2009-05-21 |
CN101422875A (zh) | 2009-05-06 |
KR101367737B1 (ko) | 2014-02-26 |
CN101422875B (zh) | 2012-01-11 |
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