WO2019033538A1 - 一种 oled 显示面板的制作方法 - Google Patents

一种 oled 显示面板的制作方法 Download PDF

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Publication number
WO2019033538A1
WO2019033538A1 PCT/CN2017/106803 CN2017106803W WO2019033538A1 WO 2019033538 A1 WO2019033538 A1 WO 2019033538A1 CN 2017106803 W CN2017106803 W CN 2017106803W WO 2019033538 A1 WO2019033538 A1 WO 2019033538A1
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Prior art keywords
glass
glue
manufacturing
zone
sanding
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PCT/CN2017/106803
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English (en)
French (fr)
Inventor
余威
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武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US15/577,123 priority Critical patent/US10340481B2/en
Publication of WO2019033538A1 publication Critical patent/WO2019033538A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method for fabricating an OLED display panel.
  • OLED displays are a new generation of displays through OLEDs
  • An organic film is formed on the substrate, wherein the organic film is sandwiched between the cathode and the anode metal or the conductive layer, and when the voltage is applied to the two electrodes, the organic film emits light.
  • OLED The display has self-illumination, fast response, wide viewing angle, and saturated color with respect to the liquid crystal display.
  • OLED Organic-dielectric
  • the packaging methods mainly include: dry film + UV glue, surface package, frit glue (glass glue) package, film package and so on. Frit The plastic package has a good packaging effect, and the packaging method is flexible and convenient, and can be flexibly handled for different sizes of products, so it is a highly developed packaging method.
  • the diameter of the laser beam 303 should be larger than the frit.
  • the width of the glue 302 is wide, but the laser light wider than the frit glue 302 is irradiated onto the electrode 301 of the OLED substrate through the package cover, which easily causes the electrode 301 on the substrate. Charging causes the electrode 301 to be short-circuited to disable the OLED device.
  • a reticle device is added to the machine. After the alignment system is processed, the opaque area of the reticle blocks the excess light of the laser beam, and only the laser is irradiated onto the frit glue, thereby protecting the OLED. Electrodes on the substrate.
  • this method also has problems: First, it requires precise alignment system support, the equipment is expensive, and it is prone to misalignment; second, the laser line blocked by the opaque area of the reticle is reflected on the laser head, resulting in Laser head burns are damaged.
  • the prior art OLED The manufacturing method of the display panel, in the glass plastic packaging process, in order to ensure that the glass glue is fully cured, the diameter of the laser beam irradiation needs to be larger than the width of the glass glue, but the laser light wider than the glass glue is irradiated through the package cover. OLED On the electrode of the substrate, the electrode on the substrate is easily burned out, which causes the OLED device to fail.
  • the invention provides a method for fabricating an OLED display panel, which can be used in a glass plastic packaging process
  • the excess light of the laser beam is blocked, and the laser is only irradiated onto the glass glue, thereby protecting the electrodes on the OLED substrate, and the laser head is not damaged, thereby ensuring the packaging effect.
  • the invention provides a method for manufacturing an OLED display panel, comprising the following steps:
  • Step S1 performing a sanding treatment on a portion of the inner surface of the package cover plate corresponding to both sides of the glass-coated region,
  • the frosted treated region includes a frame-type first sanding zone located inside the glass glue coating region, and a frame-type second sanding zone located at a periphery of the glass glue coating zone, the first frosting And the second frosting zone is adjacent to the glass glue coating area by a slit;
  • Step S2 Providing a light shielding film in the inner surface of the package cover plate through the sanding treatment region, wherein the light shielding film is a metal film having a light transmittance lower than a first predetermined value or a light transmittance lower than a second predetermined value Non-metallic film;
  • Step S3 applying a glass glue to the glass glue coating area to form a frame-like colloid.
  • the width of the first sanding zone and the second sanding zone are equal, and the widths of the slits between the two and the glass glue coating zone are also equal.
  • a first light shielding film disposed in the first sanding zone, a second light shielding film disposed in the second sanding zone, and the glass paste covering an electrode of the OLED device is a preferred embodiment of the invention.
  • the glass paste is cured at a high temperature
  • a laser beam is emitted by a laser head to illuminate the glass paste to cure the glass glue, and the temperature of the laser beam is greater than 500 °C.
  • the laser beam irradiation range is within a range of the first frosting zone, the second sanding zone, and the glass glue cover.
  • the method further comprises the step of applying a UV glue around the package cover plate coated with the glass glue in an N 2 environment.
  • the method further includes the steps of: aligning the package cover plate with the OLED substrate in an N 2 environment, and irradiating the UV glue with UV light to make the UV glue cures.
  • the method further includes the steps of: scanning the glass glue by using the laser head to emit laser light on the side of the package cover in an atmospheric environment, and melting the glass glue by the high temperature of the laser, then cooling and solidifying So that the package cover plate and the The OLED substrate is sticky.
  • the method further comprises the steps of: cutting along a cutting line around the periphery of the glass glue, The scrap of the UV glue is discarded to obtain the OLED display panel encapsulated by the glass paste.
  • the invention also provides a method for manufacturing an OLED display panel, comprising the following steps:
  • Step S1 performing a sanding treatment on a portion of the inner surface of the package cover plate corresponding to both sides of the glass glue coated region;
  • Step S2 Providing a light shielding film in the inner surface of the package cover plate through the sanding treatment region, wherein the light shielding film is a metal film having a light transmittance lower than a first predetermined value or a light transmittance lower than a second predetermined value Non-metallic film;
  • Step S3 applying a glass glue to the glass glue coating area to form a frame-like colloid.
  • the width of the first sanding zone and the second sanding zone are equal, and the widths of the slits between the two and the glass glue coating zone are also equal.
  • a first light shielding film disposed in the first sanding zone, a second light shielding film disposed in the second sanding zone, and the glass paste covering an electrode of the OLED device is a preferred embodiment of the invention.
  • the glass paste is cured at a high temperature
  • a laser beam is emitted by a laser head to illuminate the glass paste to cure the glass glue, and the temperature of the laser beam is greater than 500 °C.
  • the laser beam irradiation range is within a range of the first frosting zone, the second sanding zone, and the glass glue cover.
  • the method further comprises the step of applying a UV glue around the package cover plate coated with the glass glue in an N 2 environment.
  • the method further includes the steps of: aligning the package cover plate with the OLED substrate in an N 2 environment, and irradiating the UV glue with UV light to make the UV glue cures.
  • the method further includes the steps of: scanning the glass glue by using the laser head to emit laser light on the side of the package cover in an atmospheric environment, and melting the glass glue by the high temperature of the laser, then cooling and solidifying So that the package cover plate and the The OLED substrate is sticky.
  • the method further comprises the steps of: cutting along a cutting line around the periphery of the glass glue, The scrap of the UV glue is discarded to obtain the OLED display panel encapsulated by the glass paste.
  • the beneficial effects of the present invention are: an OLED provided by the present invention compared to the prior art OLED display panel manufacturing method
  • the manufacturing method of the display panel can block the excess light of the laser beam in the glass plastic packaging process, so that the laser only shines on the glass glue, thereby protecting the OLED
  • the electrodes on the substrate are sanded at the same time, and the blocked laser light is not reflected on the laser head and the like, and the laser head is not damaged, thereby ensuring the packaging effect.
  • FIG. 1 is a schematic diagram of a package cover plate of an OLED display panel according to an embodiment of the present invention
  • FIG. 2 is a schematic view showing the OLED ply package of the laser scanning glass glue of the present invention
  • FIG. 3 is a schematic diagram of a OLED ply package completed by a laser scanning glass glue in the prior art
  • FIG. 4 is a flow chart of a method for fabricating an OLED display panel according to the present invention.
  • the present invention is directed to a method for fabricating an existing OLED display panel, and solves the method for fabricating the OLED display panel of the prior art.
  • the laser light wider than the glass paste is irradiated onto the electrodes of the OLED substrate through the package cover plate, which easily causes the electrodes on the substrate to burn out, so that the OLED is
  • the technical problem of device failure can be solved by the embodiment of the present invention.
  • the invention provides a method for manufacturing an OLED display panel, and the manufacturing method comprises the following steps:
  • Step S1 performing a sanding treatment on a portion of the inner surface of the package cover plate corresponding to both sides of the glass glue coated region;
  • Step S2 Providing a light shielding film in the inner surface of the package cover plate through the sanding treatment region, wherein the light shielding film is a metal film having a light transmittance lower than a first predetermined value or a light transmittance lower than a second predetermined value Non-metallic film;
  • Step S3 applying a glass glue to the glass glue coating area to form a frame-like colloid.
  • FIG. 1 a schematic diagram of a package cover plate of an OLED display panel according to an embodiment of the present invention
  • a package cover 100 is used for On one side surface to which the OLED substrate is attached, there is a frame type glass glue coating region 102 for encapsulating an OLED device, and the package cover 100 includes at least one of the glass glue coating regions 102.
  • the package cover 100 further includes a frame type UV glue coating area 104, and the UV glue coating area 104 is located near a surrounding area of the package cover 100, the UV a glue for bonding the package cover 100 and the OLED substrate, temporarily fixing the package cover 100 and the OLED substrate, and temporarily isolating the OLED
  • the device is in contact with the outside air and acts as a dummy package.
  • the inner surface of the package cover 100 and the glass glue coating area 102 The corresponding portions on both sides are subjected to a sanding treatment, which is performed by dry etching or other means to process the package cover 100 to reach the package cover 100 in the area.
  • the frosted treatment region includes a frame-type first sanding zone 103 located inside the glass-gel-coated region 102, and located in the glass-gel-coated region 102 a peripheral frame-shaped second sanding zone 101, the first sanding zone 103 and the second sanding zone 101 are respectively adjacent to the glass-gel-coated region 102 by a slit. So that the subsequent laser can be completely irradiated onto the glass paste through the slit to achieve complete curing.
  • the first frosting zone 103 and the second sanding zone 101 The widths are equal, and the widths of the slits between the two and the glass-coated region 102 are also equal.
  • a light shielding film is disposed in the inner surface of the sanding treatment region, wherein the light shielding film is a metal film having a light transmittance lower than a first predetermined value or a non-metal film having a light transmittance less than a second predetermined value; the non-metal film Is a high temperature resistant film, the first predetermined value and the second predetermined value are different in size
  • the electrode of the OLED device has an adverse effect on the standard; the first sanding zone 103 is provided with a first light-shielding film, the second sanding zone 101 is provided with a second light-shielding film, and in the glass-gel-coated region 102 coating the glass glue to form a frame type colloid.
  • the OLED device includes an electrode, and the first light shielding film, the second light shielding film, and the glass paste cover the OLED The electrode of the device.
  • the manufacturing method further includes the following steps: after coating the glass glue, the glass glue is baked at a high temperature.
  • a laser beam is emitted from a laser head on a machine to irradiate the glass glue to cure the glass glue, and the temperature of the laser beam is greater than 500 °C.
  • Due to the sides of the glass glue a first frosting zone and a second frosting zone, wherein the film is a metal film having a light transmittance lower than a first predetermined value or a non-metal film having a light transmittance lower than a second predetermined value, wherein the non-metal film is resistant
  • the high temperature film so in the process of curing the glass glue, the first light shielding film and the second light shielding film are not damaged.
  • a UV glue is applied around the package cover plate coated with the glass glue. And in the N 2 environment, the package cover plate is aligned with the OLED substrate, and the UV glue is irradiated with UV light to cure the UV glue.
  • the coating and curing method of the UV glue is the same as the coating method and the curing method of the prior art, and will not be described herein.
  • the manufacturing method further includes the following steps: in an atmospheric environment, in the OLED One side of the package cover plate of the plywood is scanned by the laser head to emit laser light, and the glass glue is melted by the high temperature of the laser, and then cooled and solidified, so that the package cover plate and the OLED are sealed.
  • the substrate is sticky.
  • the OLED plywood 210 includes an OLED substrate 201 and an oppositely disposed package cover 202.
  • the OLED substrate 201 and the package cover 202 are bonded together with the UV glue by the glass glue 203, and the OLED laminate 210 after bonding
  • the laser head 207 illuminating the OLED plate 210
  • the laser head 207 is located directly above the package cover 202 corresponding to the glass glue 203 to illuminate the glass glue 203 to make the glass glue 203 is melted under irradiation of the laser beam 208 of greater than 500 °C to provide a close fit between the package cover 202 and the OLED substrate 201.
  • the glass glue 203 The inside of the coating region has a frame-shaped first sanding zone, and outside the coating zone of the glass paste 203, there is a frame-shaped second sanding zone, and the first sanding zone is provided with a first light-shielding film 205.
  • the second frosting zone is provided with a second light shielding film 206.
  • the first light shielding film 205 and the glass paste 203 and the second light shielding film 206 and the glass paste 203 There is a narrow gap between them, and the widths of the two slits are equal, so that the laser beam 208 can completely illuminate the glass paste 203 through the slit.
  • the laser beam 208 is irradiated in the first light shielding film 205, the second light shielding film 206 and the glass glue 203 are covered.
  • the OLED device of the OLED substrate 201 includes an electrode 204, and the electrode 204 Located below the corresponding glass paste 203, the first light shielding film 205, the second light shielding film 206, and the glass paste 203 cover the electrode 204 at the laser beam 208 During the irradiation, excess laser light wider than the width of the glass paste 203 is effectively blocked by the first light shielding film 205 and the second light shielding film 206 without being irradiated to the electrode 204.
  • the electrode 204 is not damaged; because the package cover 202 and the first light shielding film 205 and the second light shielding film 206
  • the bonded area is subjected to a sanding treatment, and the frosted area may be irradiated to the first light shielding film 205 and the second light shielding film 206 during the laser curing process.
  • the laser light is diffusely reflected so that the laser light cannot be directly reflected onto the laser head 207, protecting the laser head 207 from burn damage.
  • the glass paste 203 After the glass paste 203 is melted, it is cooled and solidified to seal the package cover 202 and the OLED substrate 201.
  • the purpose is to achieve a true packaging effect.
  • the manufacturing method further includes the following steps: cutting along a cutting line around the glass glue, with the UV The scrap of the glue is discarded to obtain the OLED display panel encapsulated by the glass paste.
  • the present invention provides an OLED display panel manufacturing method, In the glass plastic packaging process, it can block the excess light of the laser beam, so that the laser only shines on the glass glue, and does not need a precise alignment process to protect the OLED.
  • the electrodes on the substrate are simultaneously engraved on both sides of the glass-coated area of the inner surface of the cover plate, that is, the corresponding areas that are bonded to the light-shielding film, so that the blocked laser light is not reflected on the laser head and the like, nor Will cause laser head damage In order to ensure the packaging effect.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
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Abstract

一种OLED显示面板的制作方法，所述方法包括以下步骤：对封装盖板（100）的内表面中与玻璃胶涂布区域（102）的两侧对应的部位进行磨砂化处理；在所述封装盖板（100）内表面中的所述磨砂化处理区域（101、103）设置遮光膜（205、206），所述遮光膜（205、206）为透光率小于第一预定值的金属薄膜或透光率小于第二预定值的非金属薄膜；在所述玻璃胶涂布区域（102）涂布玻璃胶（203）。

Description

一种 OLED 显示面板的制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种 OLED 显示面板的制作方法。
背景技术
OLED 显示器是新一代的显示器，通过在 OLED 基板上制作有机薄膜，其中有机薄膜被包夹在阴极和阳极金属或导电层之间，给两电极加电压，则有机薄膜会发光。 OLED 显示器相对于液晶显示器有自发光，响应快，视角广，色彩饱和等许多优点。
空气中的水氧会使 OLED 器件阴极的活泼金属被氧化，以及会与有机材料发生化学反应，这些都会引起 OLED 器件失效。因此， OLED 器件的有效封装，使 OLED 器件与水氧充分隔离，对延长 OLED 器件寿命至关重要。目前， OLED 封装方法主要有：干燥片 +UV 胶，面封装， frit 胶 ( 玻璃胶 ) 封装，薄膜封装等。因 Frit 胶封装具有良好的封装效果，且该封装方法灵活方便，对于不同尺寸产品可灵活应对，因此是一种极具发展的封装方法。
如图 3 所示，为了保证 frit 胶 302 全部固化，激光束 303 照射直径需大于所述 frit 胶 302 宽度，然而宽于所述 frit 胶 302 的激光则会透过封装盖板照射到 OLED 基板的电极 301 上，易导致基板上所述电极 301 烧焦，使所述电极 301 短路，使 OLED 器件失效。
也有人为了避免这种情况，在机台中增加光罩装置，经过对位系统处理后，光罩上不透光区挡住激光束多余的光线，只让激光照射到 frit 胶上，从而保护 OLED 基板上的电极。但是此方式也存在问题：一是需精密的对位系统支援，设备昂贵，也容易出现对位异常；二是被光罩不透光区遮挡住的激光线会被反射到激光头上，造成激光头烧伤损毁。
综上所述，现有技术的 OLED 显示面板的制作方法，在玻璃胶封装制程中，为了保证玻璃胶全部固化，激光束照射直径需大于所述玻璃胶宽度，然而宽于所述玻璃胶的激光则会透过封装盖板照射到 OLED 基板的电极上，易导致基板上所述电极烧坏，使 OLED 器件失效。
 技术问题
本发明提供 一种 OLED 显示面板的制作方法 ，所述方法 在玻璃胶封装制程中 能够 挡住激光束多余的光线，让激光只照射到玻璃胶上，从而保护 OLED 基板上的电极，同时也不会造成激光头损毁 ，进而保证封装效果。
技术解决方案
为解决上述问题，本发明提供的技术方案如下：
本发明提供一种 OLED 显示面板的制作方法 ，包括 以下步骤 ：
步骤 S1 、对封装盖板的内表面中与玻璃胶涂布区域的两侧对应的部位进行磨砂化处理 ， 所述磨砂化处理的区域包括位于所述玻璃胶涂布区域内侧的框型第一磨砂化区，以及位于所述玻璃胶涂布区域外围的框型第二磨砂化区，所述第一磨砂化区以及所述第二磨砂化区分别通过窄缝紧邻所述玻璃胶涂布区域；
步骤 S2 、在所述封装盖板的所述内表面中经过所述磨砂化处理区域设置遮光膜，所述遮光膜为透光率小于第一预定值的金属薄膜或透光率小于第二预定值的非金属薄膜；
步骤 S3 、在所述玻璃胶涂布区域涂布玻璃胶，以形成框状的胶体。
根据本发明一优选实施例， 所述第一磨砂化区与所述第二磨砂化区的宽度相等，两者分别与所述玻璃胶涂布区域之间的所述窄缝的宽度也相等。
根据本发明一优选实施例， 设置于所述第一磨砂化区的第一遮光膜、设置于所述第二磨砂化区的第二遮光膜以及所述玻璃胶覆盖 OLED 器件的电极。
根据本发明一优选实施例， 在涂布好所述玻璃胶后，对所述玻璃胶进行高温烘烤固化；
利用激光头发射激光束，以照射所述玻璃胶，使得所述玻璃胶固化，所述激光束的温度大于 500 ℃。
根据本发明一优选实施例， 所述激光束照射范围位于所述第一磨砂化区、所述第二磨砂化区以及所述玻璃胶覆盖的范围内。
根据本发明一优选实施例， 所述方法还包括以下步骤：在 N2 环境中，在涂布有所述玻璃胶的所述封装盖板四周涂布 UV 胶。
根据本发明一优选实施例， 所述方法还包括以下步骤：在 N2 环境中，将所述封装盖板与 OLED 基板对位贴合，并利用 UV 光照射所述 UV 胶，以使所述 UV 胶固化。
根据本发明一优选实施例， 所述方法还包括以下步骤：在大气环境下，在所述封装盖板一侧用所述激光头发射激光扫描所述玻璃胶，通过所述激光的高温使所述玻璃胶融化后再冷却固化，以使所述封装盖板与所述 OLED 基板粘黏。
根据本发明一优选实施例， 所述方法还包括以下步骤：沿所述玻璃胶外围的切割线进行切割，将带有所述 UV 胶的边角料废弃，得到所述玻璃胶封装的 OLED 显示面板。
本发明还提供一种 OLED 显示面板的制作方法 ，包括 以下步骤 ：
步骤 S1 、对封装盖板的内表面中与玻璃胶涂布区域的两侧对应的部位进行磨砂化处理；
步骤 S2 、在所述封装盖板的所述内表面中经过所述磨砂化处理区域设置遮光膜，所述遮光膜为透光率小于第一预定值的金属薄膜或透光率小于第二预定值的非金属薄膜；
步骤 S3 、在所述玻璃胶涂布区域涂布玻璃胶，以形成框状的胶体。
根据本发明一优选实施例， 所述第一磨砂化区与所述第二磨砂化区的宽度相等，两者分别与所述玻璃胶涂布区域之间的所述窄缝的宽度也相等。
根据本发明一优选实施例， 设置于所述第一磨砂化区的第一遮光膜、设置于所述第二磨砂化区的第二遮光膜以及所述玻璃胶覆盖 OLED 器件的电极。
根据本发明一优选实施例， 在涂布好所述玻璃胶后，对所述玻璃胶进行高温烘烤固化；
利用激光头发射激光束，以照射所述玻璃胶，使得所述玻璃胶固化，所述激光束的温度大于 500 ℃。
根据本发明一优选实施例， 所述激光束照射范围位于所述第一磨砂化区、所述第二磨砂化区以及所述玻璃胶覆盖的范围内。
根据本发明一优选实施例， 所述方法还包括以下步骤：在 N2 环境中，在涂布有所述玻璃胶的所述封装盖板四周涂布 UV 胶。
根据本发明一优选实施例， 所述方法还包括以下步骤：在 N2 环境中，将所述封装盖板与 OLED 基板对位贴合，并利用 UV 光照射所述 UV 胶，以使所述 UV 胶固化。
根据本发明一优选实施例， 所述方法还包括以下步骤：在大气环境下，在所述封装盖板一侧用所述激光头发射激光扫描所述玻璃胶，通过所述激光的高温使所述玻璃胶融化后再冷却固化，以使所述封装盖板与所述 OLED 基板粘黏。
根据本发明一优选实施例， 所述方法还包括以下步骤：沿所述玻璃胶外围的切割线进行切割，将带有所述 UV 胶的边角料废弃，得到所述玻璃胶封装的 OLED 显示面板。
 有益效果
本发明的有益效果为：相较于现有的 OLED 显示面板的制作方法 ，本发明所提供的一种 OLED 显示面板的制作方法 ， 在玻璃胶封装制程中 能够 挡住激光束多余的光线，让激光只照射到玻璃胶上，从而保护 OLED 基板上的电极，同时遮挡区域进行磨砂化处理，被遮挡的激光不会反射到激光头等设备上，也不会造成激光头损毁 ，进而保证封装效果。
附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图 1 为本发明实施例提供的 OLED 显示面板的封装盖板示意图；
图 2 为本发明激光扫描玻璃胶完成 OLED 合板封装示意图；
图 3 为现有技术中激光扫描玻璃胶完成 OLED 合板封装示意图；
图 4 为本发明所提供的一种 OLED 显示面板的制作方法流程图 。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如 [ 上 ] 、 [ 下 ] 、 [ 前 ] 、 [ 后 ] 、 [ 左 ] 、 [ 右 ] 、 [ 内 ] 、 [ 外 ] 、 [ 侧面 ] 等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明针对现有的 OLED 显示面板的制作方法，解决了现有技术的 OLED 显示面板的制作方法 ， 在玻璃胶封装制程中，宽于所述玻璃胶的激光会透过封装盖板照射到 OLED 基板的电极上，易导致基板上所述电极烧坏，使 OLED 器件失效的技术问题，本发明实施例能够解决该缺陷。
本发明提供了一种 OLED 显示面板的制作方法，该所述制作方法包括以下步骤：
步骤 S1 、对封装盖板的内表面中与玻璃胶涂布区域的两侧对应的部位进行磨砂化处理；
步骤 S2 、在所述封装盖板的所述内表面中经过所述磨砂化处理区域设置遮光膜，所述遮光膜为透光率小于第一预定值的金属薄膜或透光率小于第二预定值的非金属薄膜；
步骤 S3 、在所述玻璃胶涂布区域涂布玻璃胶，以形成框状的胶体。
具体 如图 1 所示，本发明实施例提供的 OLED 显示面板的封装盖板示意图，封装盖板 100 用于与 OLED 基板贴合的一侧表面上，有用于封装 OLED 器件的框型玻璃胶涂布区域 102 ，所述封装盖板 100 至少包括有一个所述玻璃胶涂布区域 102 ，所述封装盖板 100 还包括一个框型的 UV 胶涂布区域 104 ，所述 UV 胶涂布区域 104 位于靠近所述封装盖板 100 的四周区域，所述 UV 胶用于粘合所述封装盖板 100 与所述 OLED 基板，暂时性的固定所述封装盖板 100 与所述 OLED 基板，以及暂时性的隔绝所述 OLED 器件与外界空气接触，起到假封装的效果。对所述封装盖板 100 的内表面中与所述玻璃胶涂布区域 102 的两侧对应的部位进行磨砂化处理，所述磨砂化处理是以干法刻蚀或者其他方式对所述封装盖板 100 进行处理，以达到该区域的所述封装盖板 100 内表面粗糙化的效果，所述磨砂化处理区域包括位于所述玻璃胶涂布区域 102 内侧的框型第一磨砂化区 103 ，以及位于所述玻璃胶涂布区域 102 外围的框型第二磨砂化区 101 ，所述第一磨砂化区 103 以及所述第二磨砂化区 101 分别通过窄缝紧邻所述玻璃胶涂布区域 102 ，以便于后续激光能透过窄缝完整的照射到所述玻璃胶上，实现完全固化。所述第一磨砂化区 103 与所述第二磨砂化区 101 的宽度相等，两者分别与所述玻璃胶涂布区域 102 之间的所述窄缝的宽度也相等。在所述封装盖板 100 的内表面中在所述磨砂化处理区域设置遮光膜，所述遮光膜为透光率小于第一预定值的金属薄膜或透光率小于第二预定值的非金属薄膜；所述非金属薄膜为耐高温薄膜，所述第一预定值以及所述第二预定值的大小，以不对所述 OLED 器件的电极产生不良影响为标准；所述第一磨砂化区 103 设置有第一遮光膜，所述第二磨砂化区 101 设置有第二遮光膜，并且在所述玻璃胶涂布区域 102 涂布所述玻璃胶，形成框型胶体。在所述 OLED 基板上，所述 OLED 器件包括有电极，所述第一遮光膜、所述第二遮光膜以及所述玻璃胶覆盖所述 OLED 器件的电极。
所述制作方法还包括以下步骤：涂布好所述玻璃胶后，对所述玻璃胶进行高温烘烤固化。在机台上利用激光头发射激光束，以照射所述玻璃胶，使得所述玻璃胶固化，所述激光束的温度大于 500 ℃。因所述玻璃胶的两侧的所述 第一磨砂化区以及所述第二磨砂化区，设置的薄膜为透光率小于第一预定值的金属薄膜或透光率小于第二预定值的非金属薄膜，所述非金属薄膜为耐高温薄膜，所以在固化所述玻璃胶的过程中，对所述第一遮光膜以及所述第二遮光膜不会有损坏。
在 N2 环境中，在涂布有所述玻璃胶的所述封装盖板四周涂布 UV 胶。 并在 N2 环境中，将所述封装盖板与 OLED 基板对位贴合，并利用 UV 光照射所述 UV 胶，以使所述 UV 胶固化。所述 UV 胶的涂布与固化方法与现有技术的涂布方法以及固化方法相同，在此不做赘述。
所述制作方法还包括以下步骤： 在大气环境下，在所述 OLED 合板的所述封装盖板一侧用所述激光头发射激光扫描所述玻璃胶，通过所述激光的高温使所述玻璃胶融化后再冷却固化，以使所述封装盖板与所述 OLED 基板粘黏。如图 2 所示，为本发明激光扫描玻璃胶完成 OLED 合板封装示意图，所述 OLED 合板 210 包括 OLED 基板 201 ，以及相对设置的封装盖板 202 ；所述 OLED 基板 201 与所述封装盖板 202 通过玻璃胶 203 与 UV 胶粘合在一起，贴合后的所述 OLED 合板 210 位于一装置中，所述装置内设有激光头 207 ，所述激光头 207 用以发射激光束 208 ，所述激光头 207 照射所述 OLED 合板 210 的所述封装盖板 202 一侧，所述激光头 207 位于所述封装盖板 202 的正上方对应所述玻璃胶 203 的位置，以照射所述玻璃胶 203 ，以使所述玻璃胶 203 在大于 500 ℃的所述激光束 208 的照射下融化，以使所述封装盖板 202 与所述 OLED 基板 201 之间进行紧密贴合。
其中，在所述封装盖板 202 的内表面上， 所述玻璃胶 203 的涂布区域的内侧有框型第一磨砂化区，在所述玻璃胶 203 的涂布区域外侧，有框型第二磨砂化区，所述第一磨砂化区设置有第一遮光膜 205 ，所述第二磨砂化区设置有第二遮光膜 206 。所述第一遮光膜 205 与所述玻璃胶 203 之间以及所述第二遮光膜 206 与所述玻璃胶 203 之间存在窄缝，且两所述窄缝宽度均相等，以便所述激光束 208 能透过所述窄缝完全照射所述玻璃胶 203 。所述激光束 208 照射范围位于所述第一遮光膜 205 、所述第二遮光膜 206 以及所述玻璃胶 203 覆盖的范围内。所述 OLED 基板 201 的 OLED 器件包括有电极 204 ，所述电极 204 位于所述玻璃胶 203 对应的下方，且所述第一遮光膜 205 、所述第二遮光膜 206 以及所述玻璃胶 203 覆盖所述电极 204 ，在所述激光束 208 照射的过程中，宽于所述玻璃胶 203 宽度的多余的激光会被所述第一遮光膜 205 以及所述第二遮光膜 206 有效遮挡，不会照射到所述电极 204 上，从而不会对所述电极 204 造成损坏；因所述封装盖板 202 与所述第一遮光膜 205 以及所述第二遮光膜 206 贴合的区域进行过磨砂化处理，在镭射固化过程中，磨砂化区域可将照射到所述第一遮光膜 205 以及所述第二遮光膜 206 上的所述激光进行漫反射，使所述激光无法直接反射到所述激光头 207 上，保护所述激光头 207 不被烧伤损坏。
所述玻璃胶 203 融化之后再冷却固化，以达到密封所述封装盖板 202 与所述 OLED 基板 201 的目的，起到真正的封装效果。
所述制作方法还包括以下步骤：沿所述玻璃胶外围的切割线进行切割，将带有所述 UV 胶的边角料废弃，得到所述玻璃胶封装的 OLED 显示面板。
相较于现有的 OLED 显示面板的制作方法 ，本发明所提供的一种 OLED 显示面板的制作方法 ， 在玻璃胶封装制程中 能够 挡住激光束多余的光线，让激光只照射到玻璃胶上，且不需要进行精密对位的过程，从而保护 OLED 基板上的电极，同时封装盖板内表面玻璃胶涂布区域的两侧，即与遮光膜贴合的相应区域进行磨砂化处理，使被遮挡的激光不会反射到激光头等设备上，也不会造成激光头损毁 ，进而保证封装效果。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (18)

  1. 一种 OLED 显示面板的制作方法，其中，所述方法包括以下步骤：
    步骤 S1 、对封装盖板的内表面中与玻璃胶涂布区域的两侧对应的部位进行磨砂化处理，所述磨砂化处理的区域包括位于所述玻璃胶涂布区域内侧的框型第一磨砂化区，以及位于所述玻璃胶涂布区域外围的框型第二磨砂化区，所述第一磨砂化区以及所述第二磨砂化区分别通过窄缝紧邻所述玻璃胶涂布区域；
    步骤 S2 、在所述封装盖板的所述内表面中经过所述磨砂化处理区域设置遮光膜，所述遮光膜为透光率小于第一预定值的金属薄膜或透光率小于第二预定值的非金属薄膜；
    步骤 S3 、在所述玻璃胶涂布区域涂布玻璃胶，以形成框状的胶体。
  2. 根据权利要求 1 所述的制作方法，其中，所述第一磨砂化区与所述第二磨砂化区的宽度相等，两者分别与所述玻璃胶涂布区域之间的所述窄缝的宽度也相等。
  3. 根据权利要求 2 所述的制作方法，其中，设置于所述第一磨砂化区的第一遮光膜、设置于所述第二磨砂化区的第二遮光膜以及所述玻璃胶覆盖 OLED 器件的电极。
  4. 根据权利要求 1 所述的制作方法，其中，所述方法还包括以下步骤：
    在涂布好所述玻璃胶后，对所述玻璃胶进行高温烘烤固化；
    利用激光头发射激光束，以照射所述玻璃胶，使得所述玻璃胶固化，所述激光束的温度大于 500 ℃。
  5. 根据权利要求 4 所述的制作方法，其中，所述激光束照射范围位于所述第一磨砂化区、所述第二磨砂化区以及所述玻璃胶覆盖的范围内。
  6. 根据权利要求 4 所述的制作方法，其中，所述方法还包括以下步骤：在 N2 环境中，在涂布有所述玻璃胶的所述封装盖板四周涂布 UV 胶。
  7. 根据权利要求 6 所述的制作方法，其中，所述方法还包括以下步骤： 在 N2 环境中，将所述封装盖板与 OLED 基板对位贴合，并利用 UV 光照射所述 UV 胶，以使所述 UV 胶固化。
  8. 根据权利要求 7 所述的制作方法，其中，所述方法还包括以下步骤： 在大气环境下，在所述封装盖板一侧用所述激光头发射激光扫描所述玻璃胶，通过所述激光的高温使所述玻璃胶融化后再冷却固化，以使所述封装盖板与所述 OLED 基板粘黏。
  9. 根据权利要求 8 所述的制作方法，其中，所述方法还包括以下步骤：沿所述玻璃胶外围的切割线进行切割，将带有所述 UV 胶的边角料废弃，得到所述玻璃胶封装的 OLED 显示面板。
  10. 一种 OLED 显示面板的制作方法，其中，所述方法包括以下步骤：
    步骤 S1 、对封装盖板的内表面中与玻璃胶涂布区域的两侧对应的部位进行磨砂化处理；
    步骤 S2 、在所述封装盖板的所述内表面中经过所述磨砂化处理区域设置遮光膜，所述遮光膜为透光率小于第一预定值的金属薄膜或透光率小于第二预定值的非金属薄膜；
    步骤 S3 、在所述玻璃胶涂布区域涂布玻璃胶，以形成框状的胶体。
  11. 根据权利要求 10 所述的制作方法，其中，所述第一磨砂化区与所述第二磨砂化区的宽度相等，两者分别与所述玻璃胶涂布区域之间的所述窄缝的宽度也相等。
  12. 根据权利要求 11 所述的制作方法，其中，设置于所述第一磨砂化区的第一遮光膜、设置于所述第二磨砂化区的第二遮光膜以及所述玻璃胶覆盖 OLED 器件的电极。
  13. 根据权利要求 10 所述的制作方法，其中，所述方法还包括以下步骤：
    在涂布好所述玻璃胶后，对所述玻璃胶进行高温烘烤固化；
    利用激光头发射激光束，以照射所述玻璃胶，使得所述玻璃胶固化，所述激光束的温度大于 500 ℃。
  14. 根据权利要求 13 所述的制作方法，其中，所述激光束照射范围位于所述第一磨砂化区、所述第二磨砂化区以及所述玻璃胶覆盖的范围内。
  15. 根据权利要求 13 所述的制作方法，其中，所述方法还包括以下步骤：在 N2 环境中，在涂布有所述玻璃胶的所述封装盖板四周涂布 UV 胶。
  16. 根据权利要求 15 所述的制作方法，其中，所述方法还包括以下步骤：在 N2 环境中，将所述封装盖板与 OLED 基板对位贴合，并利用 UV 光照射所述 UV 胶，以使所述 UV 胶固化。
  17. 根据权利要求 16 所述的制作方法，其中，所述方法还包括以下步骤： 在大气环境下，在所述封装盖板一侧用所述激光头发射激光扫描所述玻璃胶，通过所述激光的高温使所述玻璃胶融化后再冷却固化，以使所述封装盖板与所述 OLED 基板粘黏。
  18. 根据权利要求 17 所述的制作方法，其中，所述方法还包括以下步骤：沿所述玻璃胶外围的切割线进行切割，将带有所述 UV 胶的边角料废弃，得到所述玻璃胶封装的 OLED 显示面板。
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