WO2014180044A1 - 显示装置及其制造方法 - Google Patents

显示装置及其制造方法 Download PDF

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Publication number
WO2014180044A1
WO2014180044A1 PCT/CN2013/078084 CN2013078084W WO2014180044A1 WO 2014180044 A1 WO2014180044 A1 WO 2014180044A1 CN 2013078084 W CN2013078084 W CN 2013078084W WO 2014180044 A1 WO2014180044 A1 WO 2014180044A1
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Prior art keywords
display device
display
cover body
manufacturing
sintered block
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PCT/CN2013/078084
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English (en)
French (fr)
Inventor
吴泰必
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深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US14/129,994 priority Critical patent/US9368748B2/en
Publication of WO2014180044A1 publication Critical patent/WO2014180044A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display device and a method of fabricating the same.
  • the glass paste (Frit) on the cover plate needs to be sintered at a high temperature of 500 degrees Celsius or higher to encapsulate the cover plate and the display substrate.
  • An object of the present invention is to provide a method of manufacturing a display device capable of preventing damage of a display auxiliary member of a cover plate in a packaging process of the display device.
  • Another object of the present invention is to provide a display device capable of preventing damage of a display auxiliary member of a cover plate in a packaging process of the display device.
  • a manufacturing method of a display device comprising a display substrate and a cover plate, the cover plate comprising a cover body, a sintered block and a display auxiliary component, the method comprising the steps of: a recessed portion is provided on an edge of the cover body facing the surface of the display substrate; a glass paste is applied to a partial region or all of the recessed portion; and the glass paste is sintered to form the sintered block Providing the display auxiliary member on the cover main body on which the sintered block has been formed; and irradiating the sintered block by laser light such that the sintered block engages the cover plate and the display substrate; The depressed portion is formed by etching; and the average depth of the depressed portion is smaller than the height of the sintered block.
  • the shape of the projection of the recessed portion on the plane in which the cover body is located is any one of a circle, a rectangle, a triangle, a polygon, and an irregular shape;
  • the minimum circumscribed circle has a radius of 1 micron to 200 microns.
  • the projected minimum circumscribed circle has a radius of 50 ⁇ m to 150 ⁇ m.
  • the projected minimum circumscribed circle has a radius of 80 ⁇ m to 120 ⁇ m.
  • the depressed portions are arranged in an array form at an edge of the cover body.
  • Another object of the present invention is to provide a method of manufacturing a display device capable of preventing damage of a display auxiliary member of a cover plate during a packaging process of the display device.
  • a manufacturing method of a display device comprising a display substrate and a cover plate, the cover plate comprising a cover body, a sintered block and a display auxiliary component, the method comprising the steps of: a recessed portion is provided on an edge of the cover body facing the surface of the display substrate; a glass paste is applied to a partial region or all of the recessed portion; and the glass paste is sintered to form the sintered block Providing the display auxiliary member on the cover main body on which the sintered block has been formed; and irradiating the sintered block by laser light so that the sintered block engages the cover plate and the display substrate.
  • the depressed portion is formed by etching.
  • the average depth of the depressed portion is smaller than the height of the sintered block.
  • the shape of the projection of the recessed portion on the plane in which the cover body is located is any one of a circle, a rectangle, a triangle, a polygon, and an irregular shape;
  • the minimum circumscribed circle has a radius of 1 micron to 200 microns.
  • the projected minimum circumscribed circle has a radius of 50 ⁇ m to 150 ⁇ m.
  • the projected minimum circumscribed circle has a radius of 80 ⁇ m to 120 ⁇ m.
  • the depressed portions are arranged in an array form at an edge of the cover body.
  • Another object of the present invention is to provide a display device capable of preventing damage of a display auxiliary member of a cover plate in a packaging process of the display device.
  • a display device comprising: a display substrate for generating a display image; and a cover plate integrated with the display substrate, wherein the cover plate comprises: a cover body, a recessed portion is disposed at an edge of the cover body facing the surface of the display substrate; a sintered block is disposed on a partial area or an entire area of the recess for engaging the display substrate and the cover
  • the sintered block is formed by coating a glass paste in a partial or full area of the depressed portion and sintering the glass paste; and a display auxiliary member disposed on the sintered block that has been formed
  • the cover body is configured to assist the display substrate to provide a display image.
  • the depressed portion is formed by etching.
  • the average depth of the depressed portion is smaller than the height of the sintered block.
  • the shape of the projection of the recess on the plane of the cover body is any one of a circle, a rectangle, a triangle, a polygon, and an irregular shape; the minimum circumscribed circle of the projection The radius is from 1 micron to 200 microns.
  • the projected minimum circumscribed circle has a radius of 50 micrometers to 150 micrometers.
  • the projected minimum circumscribed circle has a radius of 80 ⁇ m to 120 ⁇ m.
  • the depressed portions are arranged in an array at an edge of the cover body.
  • the present invention forms the sintered block on the cover plate before the display auxiliary member is disposed on the cover plate, instead of forming the sintering after forming the display auxiliary member
  • the block therefore, the display auxiliary member is not damaged by high temperature during sintering of the glass paste at a high temperature.
  • FIG. 1 is a schematic cross-sectional view showing a first embodiment of a display device of the present invention
  • Figure 2 is a plan view of the cover of Figure 1;
  • Figure 3 is a plan view of a cover plate of a second embodiment of the display device of the present invention.
  • FIG. 4 is a flow chart of a method of manufacturing a display device of the present invention.
  • the display device of the present invention may include a display substrate and a cap plate, wherein the display substrate may include a substrate body (not shown), a first electrode (not shown), an organic light emitting layer (not shown in the drawing) And a second electrode (not shown).
  • the first electrode, the organic light emitting layer and the second electrode are sequentially formed on the substrate body.
  • the substrate body may be, for example, a glass substrate, a flexible plastic substrate, a wafer substrate or a heat dissipation substrate, and the display substrate may include a plurality of pixel regions (not shown) and a plurality of signal lines (not shown) And a switch component (not shown), the signal line can be used to transmit a signal, such as a scan signal, a data signal, or a test signal.
  • the signal lines may be, for example, vertically arranged data lines and horizontally arranged gate lines, which are alternately arranged to form a matrix arrangement of the pixel regions for displaying images.
  • the switch component can be, for example, a thin film transistor (TFT) disposed in each of the pixel regions and electrically connected to adjacent signal lines.
  • TFT thin film transistor
  • the first electrode may function as an anode and the second electrode may serve as a cathode.
  • the organic light-emitting layer may include a hole (hole) injection layer, a hole (hole) transport layer, a light-emitting material layer (for example, white light or a different color organic light-emitting material layer), and an electron transport layer, which may be stacked in sequence On the first electrode.
  • the organic light emitting layer can drive the light through the current provided by the switch component, and then emit light to the outside via the second electrode that transmits light.
  • FIG. 1 is a schematic cross-sectional view of a display device 100 of the present invention
  • FIG. 2 is a plan view of the cover plate 102 of FIG.
  • the display device 100 of the present invention includes a display substrate 101 and a cover plate 102.
  • the display substrate 101 is configured to generate a display image
  • the cover plate 102 is overlapped with the display substrate 101, and the display substrate 101 and the cover plate 102 are combined into one body by a packaging process.
  • the cover plate 102 includes a cover body 1021, a sintered block 1023, and a display auxiliary member 1024, wherein a recess portion 1022 is disposed at an edge of the cover body 1021 facing the surface of the display substrate 1024.
  • the recess 1022 is formed by etching.
  • the sintered block 1023 is disposed in a partial area or a whole area of the recessed portion 1022 for bonding the display substrate 101 and the cover plate 102 after laser irradiation.
  • the sintered block 1023 is formed by coating a glass paste in a partial region or a whole region of the depressed portion 1022 and pre-sintering the glass paste.
  • the display auxiliary member 1024 is disposed on the cover body 1021 and is located between at least two of the sintered blocks 1023 formed by pre-sintering. Specifically, in the embodiment, as shown in FIG. 2, the recessed portions 1022 are arranged in an array at the edge of the cover body 1021, and the display auxiliary component 1024 is located on the cover body 1021. The enclosing portion 1022 is surrounded.
  • the display auxiliary part 1024 is for assisting the display substrate 101 to provide a display image, for example, the display auxiliary part 101 may be, for example, a color filter part or a touch sensing part or the like.
  • the recessed portion 1022 is disposed on the cover body 1021, the glass paste coated thereon may be hidden in the recessed portion 1022, when the display substrate 101 and the When the cover plate 102 is packaged, the laser-irradiated agglomerate 1023 can cause the cover plate 102 and the display substrate 101 to be in close contact with each other, and the glass paste does not expose the display substrate 101 and the cover plate. 102 separated.
  • the depressed portion 1022 can effectively control the distribution position of the glass paste coated thereon (the glass paste does not move freely), and the glass paste coated thereon can be accurately and standardizedly controlled.
  • the amount of the glass paste on the cover body 1021 is not excessive or too small, thereby preventing the display substrate 101 and the cover 102 from being flatly packaged (flat, parallel bonding).
  • the sintered block 1023 is formed on the cover plate 102 in advance before the display auxiliary member 1024 is disposed on the cover plate 102, instead of forming the display auxiliary member 1024 The sintered block 1023 is then formed, and therefore, the display auxiliary member 1024 is not damaged by high temperature during sintering of the glass paste at a high temperature.
  • the average depth of the depressed portion 1022 is smaller than the height of the sintered block 1023, which is advantageous for ensuring that the sintered block 1023 on the cover plate 102 can be combined with the display substrate after being irradiated with laser light. 101 is joined together.
  • the shape of the projection of the recessed portion 1022 on the plane of the cover body 1021 is a rectangle, as shown in FIG. 2, and may of course be in a regular shape such as a circle, a triangle, or a polygon. Any one.
  • the minimum circumscribed circle of the projection has a radius of 1 micrometer to 200 micrometers, for example, the radius may be 1 micrometer, 5 micrometers, 8 micrometers, 15 micrometers, 29 micrometers, 46 micrometers, 77 micrometers, 98 micrometers, 133 microns, 165 microns, 182 microns, 200 microns, and the like.
  • FIG. 3 is a plan view of a cover plate 102 of a second embodiment of the display device 100 of the present invention.
  • This embodiment is similar to the first embodiment described above, except that the shape of the projection is an irregular shape.
  • the shape of the projection is an "L" shape, and two recesses 102 of the "L" shape.
  • Disposed at the edge of the cover body 1021 to form a nearly rectangular shape, the "L"-shaped recessed portion 1022 is provided with a sintered block 1023 formed by pre-sintering, and the display auxiliary member 1024 is disposed on The cover plate 102 of the sintered block 1023 has been formed.
  • the third embodiment of the display device 100 of the present invention is similar to the first or second embodiment described above, except that the projected minimum circumscribed circle has a radius of 50 micrometers to 150 micrometers, for example, the radius is taken Values can be 50 microns, 56 microns, 73 microns, 88 microns, 96 microns, 107 microns, 123 microns, 135 microns, 144 microns, 150 microns.
  • a fourth embodiment of the display device 100 of the present invention is similar to the first, second or third embodiment described above, except that the projected minimum circumscribed circle has a radius of 80 microns to 120 microns, for example, The radius may be 80 microns, 86 microns, 83 microns, 98 microns, 100 microns, 106 microns, 113 microns, 115 microns, 120 microns.
  • FIG. 4 is a flow chart of a method of manufacturing the display device 100 of the present invention.
  • the display device of this embodiment includes a display substrate including a cover main body, a sintered block, and a display auxiliary member, and a cover plate.
  • the manufacturing method of the display device 100 of the embodiment includes the following steps:
  • a recess portion 1022 is disposed at an edge of the cover main body 1021 of the cover plate 102 facing the surface of the display substrate 101, specifically, the display substrate 1024 is faced on the cover main body 1021 by an etching process.
  • the recess 1022 is provided at the edge of the surface.
  • a glass paste is applied to a partial region or all of the depressed portion 1022.
  • the glass paste is sintered to form the agglomerate 1023 for bonding the display substrate 101 and the cap plate 102 after laser irradiation.
  • the display auxiliary member 1024 is disposed on the cover main body 1021 on which the sintered block 1023 is formed, and the display auxiliary member 1024 may be located between at least two of the sintered blocks 1023 formed by pre-sintering. Specifically, in the embodiment, as shown in FIG. 2, the recessed portions 1022 are arranged in an array at the edge of the cover body 1021, and the display auxiliary component 1024 is located on the cover body 1021. The enclosing portion 1022 is surrounded.
  • the display auxiliary part 1024 is for assisting the display substrate 101 to provide a display image, for example, the display auxiliary part 101 may be, for example, a color filter part or a touch sensing part or the like.
  • the sintered block 1023 is irradiated with laser light such that the sintered block 1023 joins the cap plate 102 and the display substrate 101.
  • the recessed portion 1022 is disposed on the cover body 1021, the glass paste coated thereon may be hidden in the recessed portion 1022, when the display substrate 101 and the When the cover plate 102 is packaged, the laser-irradiated agglomerate 1023 can cause the cover plate 102 and the display substrate 101 to be in close contact with each other, and the glass paste does not expose the display substrate 101 and the cover plate. 102 separated.
  • the depressed portion 1022 can effectively control the distribution position of the glass paste coated thereon (the glass paste does not move freely), and the glass paste coated thereon can be accurately and standardizedly controlled.
  • the amount of the glass paste on the cover body 1021 is not excessive or too small, thereby preventing the display substrate 101 and the cover 102 from being flatly packaged (flat, parallel bonding).
  • the sintered block 1023 is formed on the cover plate 102 in advance before the display auxiliary member 1024 is disposed on the cap plate 102, the glass paste is sintered at a high temperature.
  • the display accessory 1024 is not damaged by high temperatures during the process.
  • the average depth of the depressed portion 1022 is smaller than the height of the sintered block 1023, which is advantageous for ensuring that the sintered block 1023 on the cover plate 102 can be combined with the display substrate after being irradiated with laser light. 101 is joined together.
  • the shape of the projection of the recessed portion 1022 on the plane of the cover body 1021 is a rectangle, as shown in FIG. 2, and may of course be in a regular shape such as a circle, a triangle, or a polygon. Any one.
  • the minimum circumscribed circle of the projection has a radius of 1 micrometer to 200 micrometers, for example, the radius may be 1 micrometer, 5 micrometers, 8 micrometers, 15 micrometers, 29 micrometers, 46 micrometers, 77 micrometers, 98 micrometers, 133 microns, 165 microns, 182 microns, 200 microns, and the like.
  • the second embodiment of the manufacturing method of the display device 100 of the present invention is similar to the first embodiment described above, except that the shape of the projection is an irregular shape, and specifically, the shape of the projection is "L" type.
  • Two “L"-shaped recessed portions 1022 are distributed toward the edge of the cover plate main body 1021 to form a nearly rectangular shape, and the "L"-shaped depressed portion 1022 is provided with a sintering formed by pre-sintering.
  • the display assisting member 1024 is disposed on the cover plate 102 on which the sintered block 1023 has been formed.
  • a third embodiment of the method of fabricating the display device 100 of the present invention is similar to the first or second embodiment described above, except that the projected minimum circumscribed circle has a radius of 50 micrometers to 150 micrometers, for example, The radius may be 50 microns, 56 microns, 73 microns, 88 microns, 96 microns, 107 microns, 123 microns, 135 microns, 144 microns, 150 microns.
  • a fourth embodiment of the method of fabricating the display device 100 of the present invention is similar to the first, second or third embodiment described above, except that the radius of the smallest circumscribed circle of the projection is from 80 micrometers to 120 micrometers, for example The radius may be 80 microns, 86 microns, 83 microns, 98 microns, 100 microns, 106 microns, 113 microns, 115 microns, 120 microns.

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Abstract

一种显示装置（100）及其制造方法，该方法包括：在盖板主体（1021）上设置凹陷部（1022），在凹陷部（1022）涂布玻璃浆料，对玻璃浆料进行烧结以形成烧结块（1023），在已经形成有烧结块（1023）的盖板主体（1021）上设置显示辅助部件（1024），通过激光照射烧结块（1023），使得烧结块（1023）接合盖板（102）和显示基板（101）。该方法能防止在显示装置（100）的封装制程中盖板（102）的显示辅助部件（1024）受损。

Description

显示装置及其制造方法 技术领域
本发明涉及显示技术领域，特别涉及一种显示装置及其制造方法。
 背景技术
传统的有机发光二极管显示装置（Organic Light-Emitting Diode，OLED）的封装制程中，盖板上的玻璃浆料（Frit）需要在500摄氏度以上的高温下进行烧结，以对该盖板和显示基板进行封装。
在实践中，发明人发现现有技术至少存在以下问题：
受限于上述需要在500摄氏度以上高温下对玻璃浆料进行烧结的制程的限制，传统的有机发光二极管显示装置的盖板上无法进行其它显示辅助部件的制程，例如彩色滤光部件（Color Filter）制程或者触摸感应部件（Touch Sensing）制程，原因是高温会损坏上述显示辅助部件，从而导致显示装置成品不良。
故，有必要提出一种新的技术方案，以解决上述技术问题。
 技术问题
本发明的一个目的在于提供一种显示装置的制造方法，其能防止在显示装置的封装制程中盖板的显示辅助部件受损。
本发明的另一个目的在于提供一种显示装置，其能防止在显示装置的封装制程中盖板的显示辅助部件受损。
 技术解决方案
一种显示装置的制造方法，所述显示装置包括一显示基板以及一盖板，所述盖板包括一盖板主体、一烧结块和一显示辅助部件，所述方法包括以下步骤：在所述盖板主体上面向于所述显示基板的表面的边缘处设置凹陷部；在所述凹陷部的局部区域或全部区域涂布玻璃浆料；对所述玻璃浆料进行烧结以形成所述烧结块；在已经形成有所述烧结块的所述盖板主体上设置所述显示辅助部件；以及通过激光照射所述烧结块，使得所述烧结块接合所述盖板和所述显示基板；所述凹陷部是通过蚀刻形成的；以及所述凹陷部的平均深度小于所述烧结块的高度。
在上述显示装置的制造方法中，所述凹陷部在所述盖板主体所在的平面上的投影的形状为圆形、矩形、三角形、多边形、不规则形状中的任意一者；所述投影的最小外接圆的半径为1微米至200微米。
在上述显示装置的制造方法中，所述投影的最小外接圆的半径为50微米至150微米。
在上述显示装置的制造方法中，所述投影的最小外接圆的半径为80微米至120微米。
在上述显示装置的制造方法中，所述凹陷部以阵列形式排列于所述盖板主体的边缘处。
本发明的另一个目的在于提供一种显示装置的制造方法，其能防止在显示装置的封装制程中盖板的显示辅助部件受损。
为解决上述问题，本发明的技术方案如下：
一种显示装置的制造方法，所述显示装置包括一显示基板以及一盖板，所述盖板包括一盖板主体、一烧结块和一显示辅助部件，所述方法包括以下步骤：在所述盖板主体上面向于所述显示基板的表面的边缘处设置凹陷部；在所述凹陷部的局部区域或全部区域涂布玻璃浆料；对所述玻璃浆料进行烧结以形成所述烧结块；在已经形成有所述烧结块的所述盖板主体上设置所述显示辅助部件；以及通过激光照射所述烧结块，使得所述烧结块接合所述盖板和所述显示基板。
在上述显示装置的制造方法中，所述凹陷部是通过蚀刻形成的。
在上述显示装置的制造方法中，所述凹陷部的平均深度小于所述烧结块的高度。
在上述显示装置的制造方法中，所述凹陷部在所述盖板主体所在的平面上的投影的形状为圆形、矩形、三角形、多边形、不规则形状中的任意一者；所述投影的最小外接圆的半径为1微米至200微米。
在上述显示装置的制造方法中，所述投影的最小外接圆的半径为50微米至150微米。
在上述显示装置的制造方法中，所述投影的最小外接圆的半径为80微米至120微米。
在上述显示装置的制造方法中，所述凹陷部以阵列形式排列于所述盖板主体的边缘处。
本发明的另一个目的在于提供一种显示装置，其能防止在显示装置的封装制程中盖板的显示辅助部件受损。
为解决上述问题，本发明的技术方案如下：
一种显示装置，所述显示装置包括：一显示基板，用于生成显示图像；以及一盖板，与所述显示基板叠合于一体，其中，所述盖板包括：一盖板主体，所述盖板主体上面向于所述显示基板的表面的边缘处设置有凹陷部；一烧结块，设置于所述凹陷部的局部区域或全部区域，用于接合所述显示基板与所述盖板，所述烧结块是通过在所述凹陷部的局部区域或全部区域涂布玻璃浆料并对所述玻璃浆料进行烧结形成的；以及一显示辅助部件，设置于已经形成有所述烧结块的所述盖板主体上，用于辅助所述显示基板提供显示图像。
在上述显示装置中，所述凹陷部是通过蚀刻形成的。
在上述显示装置中，所述凹陷部的平均深度小于所述烧结块的高度。
在上述显示装置中，所述凹陷部在所述盖板主体所在的平面上的投影的形状为圆形、矩形、三角形、多边形、不规则形状中的任意一者；所述投影的最小外接圆的半径为1微米至200微米。
在上述显示装置中，所述投影的最小外接圆的半径为50微米至150微米。
在上述显示装置中，所述投影的最小外接圆的半径为80微米至120微米。
在上述显示装置中，所述凹陷部以阵列形式排列于所述盖板主体的边缘处。
 有益效果
相对现有技术，本发明由于在将所述显示辅助部件设置于所述盖板之前预先在所述盖板上形成所述烧结块，而不是在形成所述显示辅助部件之后再形成所述烧结块，因此，在高温烧结所述玻璃浆料的过程中所述显示辅助部件不会因为高温而损坏。
 附图说明
图1为本发明的显示装置的第一实施例的截面示意图；
图2为图1中的盖板的俯视图；
图3为本发明的显示装置的第二实施例的盖板的俯视图；
图4为本发明的显示装置的制造方法的流程图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
本发明的显示装置可包括显示基板和盖板，其中所述显示基板可包括基板主体（图中未示出）、第一电极（图中未示出）、有机发光层（图中未示出）及第二电极（图中未示出）。所述第一电极、所述有机发光层及所述第二电极依序形成于所述基板主体上。所述基板主体可例如为玻璃基板、可挠性塑料基板、晶圆基板或散热基板，所述显示基板可包括多个像素区（图中未示出）、多条信号线（图中未示出）及开关组件（图中未示出），所述信号线可用以传送信号，例如扫描信号、数据信号或测试信号。所述信号线可例如为垂直配置的数据线和水平配置的栅极线，其相互交错地配置，而形成矩阵式排列的所述像素区，用以显示影像。所述开关组件可例如为薄膜晶体管（TFT），其设置于每一所述像素区中，并电性连接于相邻的信号线。
在发明中，所述第一电极可以作为阳极，而所述第二电极可以作为阴极。所述有机发光层可包括空穴（电洞）注入层、空穴（电洞）传输层、发光材料层（例如白光或不同色的有机发光材料层）、电子传输层，其可依序堆栈于第一电极上。其中，所述有机发光层可经由所述开关组件所提供的电流来驱动发光，再经由透光的所述第二电极向外部发光。
参考图1和图2，图1为本发明的显示装置100的截面示意图，图2为图1中的盖板102的俯视图。
本发明的显示装置100包括显示基板101和盖板102。其中，所述显示基板101用于生成显示图像，所述
盖板102与所述显示基板101叠合在一起，所述显示基板101与所述盖板102通过封装工艺组合为一体。
所述盖板102包括盖板主体1021、烧结块1023以及显示辅助部件1024，其中，所述盖板主体1021上面向于所述显示基板1024的表面的边缘处设置有凹陷部1022，在本实施例中，所述凹陷部1022是通过蚀刻形成的。
所述烧结块1023设置于所述凹陷部1022的局部区域或全部区域，用于在经过激光照射后接合所述显示基板101与所述盖板102。所述烧结块1023是通过在所述凹陷部1022的局部区域或全部区域涂布玻璃浆料并对所述玻璃浆料进行预先烧结形成的。所述显示辅助部件1024设置于所述盖板主体1021上，并且位于经过预先烧结所形成的至少两个所述烧结块1023之间。具体地，在本实施例中，如图2所示，所述凹陷部1022以阵列形式排列于所述盖板主体1021的边缘处，所述显示辅助部件1024位于所述盖板主体1021上的凹陷部1022的包围中。所述显示辅助部件1024用于辅助所述显示基板101提供显示图像，例如，所述显示辅助部件101可以是诸如彩色滤光部件或者触摸感应部件等。
在本实施例中，由于在所述盖板主体1021上设置所述凹陷部1022，涂布于其上的玻璃浆料可以藏于所述凹陷部1022中，当所述显示基板101与所述盖板102封装时，经过激光照射的烧结块1023便可以使得所述盖板102和所述显示基板101紧贴于一起，并且该玻璃浆料不会将所述显示基板101和所述盖板102隔开。
此外，所述凹陷部1022可以有效的控制涂布于其上的玻璃浆料的分布位置（玻璃浆料不会随意移动），并且可以精确地和标准化地控制涂布于其上的玻璃浆料的量，而不会使得位于所述盖板主体1021上的玻璃浆料局部过多或过少，从而防止显示基板101和盖板102无法平整地封装（平整、平行地结合）。
此外，在本实施例中，由于在将所述显示辅助部件1024设置于所述盖板102之前预先在所述盖板102上形成所述烧结块1023，而不是在形成所述显示辅助部件1024之后再形成所述烧结块1023，因此，在高温烧结所述玻璃浆料的过程中所述显示辅助部件1024不会因为高温而损坏。
在本实施例中，所述凹陷部1022的平均深度小于所述烧结块1023的高度，这样有利于确保所述盖板102上的所述烧结块1023在经过激光照射后能够与所述显示基板101接合为一体。
在本实施例中，所述凹陷部1022在所述盖板主体1021所在的平面上的投影的形状为矩形，如图2所示，当然也可以是圆形、三角形、多边形等规则形状中的任意一者。
所述投影的最小外接圆的半径为1微米至200微米，例如，所述半径的取值可以是1微米、5微米、8微米、15微米、29微米、46微米、77微米、98微米、133微米、165微米、182微米、200微米等等。
参考图3，图3为本发明的显示装置100的第二实施例的盖板102的俯视图。本实施例与上述第一实施例相似，不同之处在于：所述投影的形状为不规则形状，具体地，所述投影的形状为“L”型，两个“L”型的凹陷部1022相向地分布于所述盖板主体1021的边缘处，构成接近矩形的形状，所述“L”型的凹陷部1022上设置有经过预先烧结形成的烧结块1023，所述显示辅助部件1024设置于已经形成有烧结块1023的所述盖板102上。
本发明的显示装置100的第三实施例与上述第一或第二实施例相似，不同之处在于：所述投影的最小外接圆的半径为50微米至150微米，例如，所述半径的取值可以是50微米、56微米、73微米、88微米、96微米、107微米、123微米、135微米、144微米、150微米。
本发明的显示装置100的第四实施例与上述第一、第二或第三实施例相似，不同之处在于：所述投影的最小外接圆的半径为80微米至120微米，例如，所述半径的取值可以是80微米、86微米、83微米、98微米、100微米、106微米、113微米、115微米、120微米。
参考图4，图4为本发明的显示装置100的制造方法的流程图。
本实施例的显示装置包括显示基板以及盖板，所述盖板包括盖板主体、烧结块和显示辅助部件。
本实施例的显示装置100的制造方法包括以下步骤：
在所述盖板102的盖板主体1021上面向于所述显示基板101的表面的边缘处设置凹陷部1022，具体地，通过蚀刻工艺在所述盖板主体1021上面向于所述显示基板1024的表面的边缘处设置所述凹陷部1022。
在所述凹陷部1022的局部区域或全部区域涂布玻璃浆料。
对所述玻璃浆料进行烧结以形成所述烧结块1023，所述烧结块1023用于在经过激光照射后接合所述显示基板101与所述盖板102。
在形成有所述烧结块1023的所述盖板主体1021上设置所述显示辅助部件1024，所述显示辅助部件1024可以位于经过预先烧结所形成的至少两个所述烧结块1023之间。具体地，在本实施例中，如图2所示，所述凹陷部1022以阵列形式排列于所述盖板主体1021的边缘处，所述显示辅助部件1024位于所述盖板主体1021上的凹陷部1022的包围中。所述显示辅助部件1024用于辅助所述显示基板101提供显示图像，例如，所述显示辅助部件101可以是诸如彩色滤光部件或者触摸感应部件等。
通过激光照射所述烧结块1023，使得所述烧结块1023接合所述盖板102和所述显示基板101。
在本实施例中，由于在所述盖板主体1021上设置所述凹陷部1022，涂布于其上的玻璃浆料可以藏于所述凹陷部1022中，当所述显示基板101与所述盖板102封装时，经过激光照射的烧结块1023便可以使得所述盖板102和所述显示基板101紧贴于一起，并且该玻璃浆料不会将所述显示基板101和所述盖板102隔开。
此外，所述凹陷部1022可以有效的控制涂布于其上的玻璃浆料的分布位置（玻璃浆料不会随意移动），并且可以精确地和标准化地控制涂布于其上的玻璃浆料的量，而不会使得位于所述盖板主体1021上的玻璃浆料局部过多或过少，从而防止显示基板101和盖板102无法平整地封装（平整、平行地结合）。
此外，在本实施例中，由于在将所述显示辅助部件1024设置于所述盖板102之前预先在所述盖板102上形成所述烧结块1023，因此，在高温烧结所述玻璃浆料的过程中所述显示辅助部件1024不会因为高温而损坏。
在本实施例中，所述凹陷部1022的平均深度小于所述烧结块1023的高度，这样有利于确保所述盖板102上的所述烧结块1023在经过激光照射后能够与所述显示基板101接合为一体。
在本实施例中，所述凹陷部1022在所述盖板主体1021所在的平面上的投影的形状为矩形，如图2所示，当然也可以是圆形、三角形、多边形等规则形状中的任意一者。
所述投影的最小外接圆的半径为1微米至200微米，例如，所述半径的取值可以是1微米、5微米、8微米、15微米、29微米、46微米、77微米、98微米、133微米、165微米、182微米、200微米等等。
本发明的显示装置100的制造方法的第二实施例与上述第一实施例相似，不同之处在于：所述投影的形状为不规则形状，具体地，所述投影的形状为“L”型，两个“L”型的凹陷部1022相向地分布于所述盖板主体1021的边缘处，构成接近矩形的形状，所述“L”型的凹陷部1022上设置有经过预先烧结形成的烧结块1023，所述显示辅助部件1024设置于已经形成有烧结块1023的所述盖板102上。
本发明的显示装置100的制造方法的第三实施例与上述第一或第二实施例相似，不同之处在于：所述投影的最小外接圆的半径为50微米至150微米，例如，所述半径的取值可以是50微米、56微米、73微米、88微米、96微米、107微米、123微米、135微米、144微米、150微米。
本发明的显示装置100的制造方法的第四实施例与上述第一、第二或第三实施例相似，不同之处在于：所述投影的最小外接圆的半径为80微米至120微米，例如，所述半径的取值可以是80微米、86微米、83微米、98微米、100微米、106微米、113微米、115微米、120微米。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。
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Claims (19)

  1. 一种显示装置的制造方法，其中所述显示装置包括一显示基板以及一盖板，所述盖板包括一盖板主体、一烧结块和一显示辅助部件，所述方法包括以下步骤：
    在所述盖板主体上面向于所述显示基板的表面的边缘处设置凹陷部；
    在所述凹陷部的局部区域或全部区域涂布玻璃浆料；
    对所述玻璃浆料进行烧结以形成所述烧结块；
    在已经形成有所述烧结块的所述盖板主体上设置所述显示辅助部件；以及
    通过激光照射所述烧结块，使得所述烧结块接合所述盖板和所述显示基板；
    所述凹陷部是通过蚀刻形成的；以及
    所述凹陷部的平均深度小于所述烧结块的高度。
  2. 根据权利要求1所述的显示装置的制造方法，其中所述凹陷部在所述盖板主体所在的平面上的投影的形状为圆形、矩形、三角形、多边形、不规则形状中的任意一者；
    所述投影的最小外接圆的半径为1微米至200微米。
  3. 根据权利要求2所述的显示装置的制造方法，其中所述投影的最小外接圆的半径为50微米至150微米。
  4. 根据权利要求3所述的显示装置的制造方法，其中所述投影的最小外接圆的半径为80微米至120微米。
  5. 根据权利要求2所述的显示装置的制造方法，其中所述凹陷部以阵列形式排列于所述盖板主体的边缘处。
  6. 一种显示装置的制造方法，其中所述显示装置包括一显示基板以及一盖板，所述盖板包括一盖板主体、一烧结块和一显示辅助部件，所述方法包括以下步骤：
    在所述盖板主体上面向于所述显示基板的表面的边缘处设置凹陷部；
    在所述凹陷部的局部区域或全部区域涂布玻璃浆料；
    对所述玻璃浆料进行烧结以形成所述烧结块；
    在已经形成有所述烧结块的所述盖板主体上设置所述显示辅助部件；以及
    通过激光照射所述烧结块，使得所述烧结块接合所述盖板和所述显示基板。
  7. 根据权利要求6所述的显示装置的制造方法，其中所述凹陷部是通过蚀刻形成的。
  8. 根据权利要求6所述的显示装置的制造方法，其中所述凹陷部的平均深度小于所述烧结块的高度。
  9. 根据权利要求6所述的显示装置的制造方法，其中所述凹陷部在所述盖板主体所在的平面上的投影的形状为圆形、矩形、三角形、多边形、不规则形状中的任意一者；
    所述投影的最小外接圆的半径为1微米至200微米。
  10. 根据权利要求9所述的显示装置的制造方法，其中所述投影的最小外接圆的半径为50微米至150微米。
  11. 根据权利要求10所述的显示装置的制造方法，其中所述投影的最小外接圆的半径为80微米至120微米。
  12. 根据权利要求9所述的显示装置的制造方法，其中所述凹陷部以阵列形式排列于所述盖板主体的边缘处。
  13. 一种显示装置，其中所述显示装置包括：
    一显示基板，用于生成显示图像；以及
    一盖板，与所述显示基板叠合于一体，其中，所述盖板包括：
    一盖板主体，所述盖板主体上面向于所述显示基板的表面的边缘处设置有凹陷部；
    一烧结块，设置于所述凹陷部的局部区域或全部区域，用于接合所述显示基板与所述盖板，所述烧结块是通过在所述凹陷部的局部区域或全部区域涂布玻璃浆料并对所述玻璃浆料进行烧结形成的；以及
    一显示辅助部件，设置于已经形成有所述烧结块的所述盖板主体上，用于辅助所述显示基板提供显示图像。
  14. 根据权利要求13所述的显示装置，其中所述凹陷部是通过蚀刻形成的。
  15. 根据权利要求13所述的显示装置，其中所述凹陷部的平均深度小于所述烧结块的高度。
  16. 根据权利要求13所述的显示装置，其中所述凹陷部在所述盖板主体所在的平面上的投影的形状为圆形、矩形、三角形、多边形、不规则形状中的任意一者；
    所述投影的最小外接圆的半径为1微米至200微米。
  17. 根据权利要求16所述的显示装置，其中所述投影的最小外接圆的半径为50微米至150微米。
  18. 根据权利要求17所述的显示装置，其中所述投影的最小外接圆的半径为80微米至120微米。
  19. 根据权利要求16所述的显示装置，其中所述凹陷部以阵列形式排列于所述盖板主体的边缘处。
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