WO2019026675A1 - Élément de conversion photoélectrique et adhésif - Google Patents

Élément de conversion photoélectrique et adhésif Download PDF

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Publication number
WO2019026675A1
WO2019026675A1 PCT/JP2018/027563 JP2018027563W WO2019026675A1 WO 2019026675 A1 WO2019026675 A1 WO 2019026675A1 JP 2018027563 W JP2018027563 W JP 2018027563W WO 2019026675 A1 WO2019026675 A1 WO 2019026675A1
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WO
WIPO (PCT)
Prior art keywords
light
optical filter
resin
photoelectric conversion
adhesive
Prior art date
Application number
PCT/JP2018/027563
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English (en)
Japanese (ja)
Inventor
大吾 一戸
拓也 三浦
Original Assignee
Jsr株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr株式会社 filed Critical Jsr株式会社
Priority to KR1020207002773A priority Critical patent/KR20200027962A/ko
Priority to CN201880044902.1A priority patent/CN110832852A/zh
Priority to JP2019534051A priority patent/JP7060018B2/ja
Publication of WO2019026675A1 publication Critical patent/WO2019026675A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • H04N23/12—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths with one sensor only
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith

Definitions

  • the present invention relates to a photoelectric conversion element and an adhesive that absorb light in the near infrared region.
  • photoelectric conversion elements are used in various situations.
  • a solid-state imaging device represented by an image sensor is mounted in a mobile communication terminal such as a smartphone.
  • a solid-state imaging device represented by an image sensor is mounted.
  • an image sensor By using a solid-state imaging device, it is possible to easily acquire still images and moving images.
  • an illuminance sensor or an ambient light sensor is mounted on the portable information terminal. Similarly to the solid-state imaging device, the illuminance sensor or the ambient light sensor also acquires light, and acquires ambient brightness. Based on this information, the brightness of the image of the mobile communication terminal is controlled.
  • a solid-state image sensor, an illumination intensity sensor, and an ambient light sensor are photoelectric conversion elements which convert light into an electric signal, respectively.
  • the sensitivity of the obtained electrical signal may be reduced due to the influence of light other than the visible light region. For this reason, it is necessary to block light other than the visible light region.
  • light near the near infrared region eg, 700 to 1100 nm
  • the near infrared cut filter has a function of absorbing near infrared light and selectively transmitting visible light.
  • Patent Document 1 discloses a technique for absorbing near-infrared light.
  • an infrared cut filter is generally provided on the upper portion of the solid-state imaging device, but the infrared ray from the side does not have a sufficient blocking function. Therefore, the image may become reddish due to the infrared light incident from the side of the photoelectric conversion element, and the color reproducibility of the image may be deteriorated.
  • an object of the present invention is to provide a photoelectric conversion element which has a blocking function to light in a near infrared region not only above but also laterally.
  • a semiconductor device provided with a light receiving unit, an optical filter provided on the semiconductor device, and superimposed on the light receiving unit, provided on the semiconductor device and superimposed on the light receiving unit and the optical filter
  • the optical filter and the adhesive include a lens, a protective member provided on the periphery of the semiconductor element, and an adhesive that surrounds the light receiving unit and is provided between the protective member and the optical filter and the lens.
  • a photoelectric conversion element is provided, which contains at least one compound having an absorption maximum wavelength in a wavelength region of 1100 nm.
  • the optical filter and the adhesive have (A) an average value of transmittance in a wavelength range of 430 to 580 nm of 75% or more and (B) transmittance in a wavelength range of 700 to 800 nm.
  • the average value may be 20% or less, and the average value of the transmittances in the range of (C) wavelength 800 to 1100 nm may be 5% or less.
  • the optical filter may have a light-transmitting substrate, and the substrate may contain a compound.
  • the base material may be a translucent resin.
  • the optical filter has a first surface and a second surface opposite to the first surface, and a compound having a light-transmitting base material and at least one of the first surface and the second surface. And a resin layer containing
  • the optical filter may further have a dielectric layer.
  • At least one of the optical filter and the adhesive may have light diffusing particles.
  • the light diffusing particle may absorb light in the near infrared region.
  • the light diffusion particle may be cesium-containing tungsten oxide.
  • an adhesive containing the light diffusing particle is provided.
  • a photoelectric conversion element having a blocking function to light in the near infrared region not only above but also laterally.
  • FIG. 1 is a top view of an information communication terminal (in this example, a smartphone 300) having a solid-state imaging device 700 according to an embodiment of the present invention.
  • the smartphone 300 includes a housing 302, a display panel 304, a microphone unit 306, a speaker unit 308, an ambient light sensor 400, and a solid-state imaging device 700.
  • a touch panel is adopted as the display panel 304, and the display panel 304 has an input function in addition to the display function.
  • the ambient light sensor 400 and the solid-state imaging device 700 are one of photoelectric conversion devices.
  • the solid-state imaging device 700 will be described in detail with reference to FIG.
  • FIG. 2 is a cross-sectional view of the solid-state imaging device 700.
  • the solid-state imaging device 700 includes a chipped semiconductor device 710 including a transistor, a lens 730, an optical filter 100, an optical element such as a color filter 200, an adhesive 125, a protective member 740 and a package substrate 770.
  • a chipped semiconductor device 710 including a transistor, a lens 730, an optical filter 100, an optical element such as a color filter 200, an adhesive 125, a protective member 740 and a package substrate 770.
  • the semiconductor element 710 has a function as a central processing unit (CPU: Central Processing Unit), a function as a storage device, and a function to receive light.
  • the semiconductor element 710 is arranged as a chip including a transistor.
  • a light receiving unit 720 is provided in the semiconductor element 710.
  • the semiconductor element 710 and the package substrate 770 are connected using a bump electrode containing tin, silver or the like.
  • a relay substrate may be provided between the semiconductor element 710 and the package substrate 770.
  • the optical filter 100 and the color filter 200 are provided on the semiconductor element 710.
  • the optical filter 100 is superimposed on the light receiving unit 720.
  • the optical filter 100 has a function of blocking light in the near infrared region (for example, light in a wavelength band of 700 to 1100 nm).
  • the color filter 200 has a function of transmitting light in a specific wavelength band of the visible light range. Specifically, the color filter 200 can transmit light in wavelength bands of red (R), green (G), and blue (B).
  • the color filter 200 is provided on the optical filter, the optical filter 100 may be disposed on the color filter 200. Details of the optical filter 100 will be described later.
  • the lens 730 is provided on the semiconductor element 710 and the optical filter 100.
  • the lens 730 is disposed to overlap the light receiving unit 720 and the optical filter 100.
  • the lens 730 has a function of focusing light.
  • a large number of minute lenses are arranged in a lattice.
  • the lens 730 is referred to as a microlens array.
  • the protective member 740 is provided on the periphery of the semiconductor element 710.
  • the protective member 740 is disposed to surround the light receiving unit 720.
  • the protective member 740 has a function of protecting the semiconductor element 710.
  • an inorganic material such as a glass substrate, a silicon substrate, or ceramic, or an organic resin material such as acrylic or vinyl chloride is used.
  • the adhesive 125 is disposed around the light receiving unit 720.
  • the adhesive 125 is provided between the protection member 740 and the optical filter 100, the color filter 200, and the lens 730.
  • the adhesive 125 has a function of bonding the respective members.
  • the adhesive 125 may be supported by the protective member 740.
  • the protective member 740 may not necessarily be provided.
  • the protective member may be bonded to the package substrate using an adhesive 125.
  • FIG. 3 is a cross-sectional view of the optical filter 100. As shown in FIG. 3, in the optical filter 100, the absorption layer 110, the adhesive layer 120, and the protective layer 130 are laminated in this order.
  • the absorbing layer 110 dissolves or disperses a near infrared absorbing dye, a transparent resin or a raw material component of a transparent resin, and each component to be blended as needed, to prepare a coating liquid, It can be formed by coating on a substrate, drying, and curing as necessary.
  • a method of melt-molding pellets obtained by melt-kneading a transparent resin and an absorbent, melting pellets obtained by removing a solvent from a liquid resin composition containing a transparent resin, an absorbent, and a solvent It can manufacture by the method of shape
  • the above-mentioned molding method is preferable because it has good solubility in both the transparent resin and the solvent used for the coating liquid, so that the uniformity of the film can be secured. It can also be formed by mixing a near infrared absorbing dye with a transparent resin component and forming a film.
  • the near infrared absorbing dye for example, metal complex compounds, dyes, and pigments that act as dyes absorbing near infrared rays can be used, and phthalocyanine compounds, cyanine compounds, naphthalocyanine compounds, squarylium dyes, dithiol metals Examples thereof include at least one compound selected from the group consisting of complex compounds, croconium compounds, porphyrin compounds and metal dithiolate compounds, diimmonium compounds, and azo compounds.
  • Lumogen IR 765 Lumogen IR 788 (manufactured by BASF), ABS 643, ABS 654, ABS 667, ABS 670 T, IRA 693 N, IRA 735 (manufactured by Exciton), SDA 3598, SDA 6075, SDA 8030, SDA 8030, SDA 8470, SDA 3039, SDA 3040, SDA 3922, SDA 7257
  • Commercial products such as H. W. SANDS, TAP-15, and IR-706 (Yamada Chemical Co., Ltd.) can also be used.
  • polyester resin such as polyethylene terephthalate and polybutylene terephthalate, polyolefin resin such as polyethylene, polypropylene and ethylene vinyl acetate copolymer, cyclic olefin resin, acrylic resin such as norbornene resin, polyacrylate and polymethyl methacrylate, urethane Resin, vinyl chloride resin, fluorocarbon resin, polycarbonate resin, polyvinyl butyral resin, polyvinyl alcohol resin, polyimide resin, polyetherimide resin, polyamide resin, polyamideimide resin, cycloolefin resin, polyvinyl alcohol resin and the like can be used.
  • polyester resin such as polyethylene terephthalate and polybutylene terephthalate
  • polyolefin resin such as polyethylene, polypropylene and ethylene vinyl acetate copolymer
  • cyclic olefin resin acrylic resin such as norbornene resin, polyacrylate and polymethyl methacrylate
  • urethane Resin vinyl chlor
  • the solvent used for preparation of the coating liquid is not particularly limited as long as it is a dispersion medium or solvent capable of stably dispersing the dye, the transparent resin or the raw material component of the transparent resin, and each component blended as necessary.
  • the term "solvent" is used in the concept including both the dispersion medium and the solvent.
  • the solvent examples include alcohols such as isopropyl alcohol, n-butyl alcohol, ethyl cellosolve, methyl cellosolve, glycols such as ethylene glycol, diethylene glycol and propylene glycol, and ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone and cyclohexanone , Amides such as N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone, ethylene glycol monomethyl ether, ethylene glycol monoethylene ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol mono Ethyl ether, diethylene glycol butyl ether, ethylene glycol monomethyl ether acetate Ethers such as ethylene glycol monoethyl ether acetate and ethylene glycol monobutyl ether acetate, esters such as methyl acetate
  • the amount of the solvent is preferably 10 to 5,000 parts by mass, and more preferably 30 to 2,000 parts by mass with respect to 100 parts by mass of the transparent resin or the raw material component of the transparent resin.
  • the content of the non-volatile component (solid content) in the coating liquid is preferably 2 to 50 parts by mass, and more preferably 5 to 40 parts by mass in 100 parts by mass of the coating liquid.
  • the coating liquid can also contain a surfactant.
  • a surfactant By including the surfactant, it is possible to improve the appearance, in particular, a void due to a fine bubble, a dent due to adhesion of foreign matter and the like, and a repelling during a drying step.
  • the surfactant is not particularly limited, and known ones such as cationic, anionic and nonionic surfactants can be optionally used.
  • stirring devices such as a magnetic stirrer, a rotation / revolution mixer, a bead mill, a planetary mill, an ultrasonic homogenizer and the like can be used.
  • the stirring may be performed continuously or intermittently.
  • the coating liquid for example, dip coating method, cast coating method, spray coating method, spinner coating method, bead coating method, wire bar coating method, blade coating method, roller coating method, roller coating method, curtain coating method, slit die coating
  • a coating method such as a tere method, a gravure coater method, a slit reverse coater method, a microgravure method, an inkjet method, or a comma coater method can be used.
  • a bar coater method, a screen printing method, a flexographic printing method and the like can also be used.
  • a structure is formed by making it dry.
  • known methods such as heat drying and hot air drying can be used.
  • curing treatment is further performed.
  • the reaction is heat curing, drying and curing can be carried out simultaneously, but in the case of light curing, a curing step is provided separately from drying.
  • the structure formed on the peelable substrate is peeled off and used for the production of the present filter.
  • transparent resin it can manufacture in a film form by extrusion molding, and it may be made to laminate
  • the absorption layer 110 has a function of absorbing the light of a predetermined wavelength range among the incident light and transmitting the light of a necessary wavelength range. Specifically, in the absorption layer 110, the average value of the transmittance in the range of (A) wavelength 430 to 580 nm is 75% or more, and the average value of the transmittance in the range of (B) wavelength 700 to 800 nm is 20%.
  • the feature (C) is that the average value of the transmittance in the wavelength range of 800 to 1100 nm is 5% or less.
  • a light transmitting substrate 111 and a compound 113 are used.
  • the material to be formed is not particularly limited as long as it transmits visible light as the light-transmitting substrate 111, and an inorganic material such as glass or crystal, or an organic material such as a light-transmitting resin is usable. It can be mentioned.
  • polyester resins such as polyethylene terephthalate and polybutylene terephthalate
  • polyolefin resins such as polyethylene, polypropylene and ethylene vinyl acetate copolymer
  • cyclic olefin resin norbornene resin
  • polyacrylate and poly Acrylic resin such as methyl methacrylate, urethane resin, vinyl chloride resin, fluorine resin, polycarbonate resin, polyvinyl butyral resin, polyvinyl alcohol resin, polyimide resin, polyetherimide resin, polyamide resin, polyamideimide resin and the like can be mentioned.
  • the glass that can be used for the visible light transmissive substrate include soda lime glass, borosilicate glass, crown glass, alkali-free glass, quartz glass, and tempered glass obtained by ion exchange.
  • Tempered glass is used for the cover glass of a smart phone or a tablet terminal in order to protect a touch panel screen.
  • the cover glass may be subjected to decorative printing such as black or white on the outer peripheral portion thereof by screen printing or the like.
  • decorative printing such as black or white on the outer peripheral portion thereof by screen printing or the like.
  • an opening is provided in advance in addition to the portion to which the decorative printing is applied, and the coating liquid can be directly applied to the opening by the coating method.
  • high productivity can be obtained by directly coating the coating liquid.
  • crystal materials that can be used for the visible light transmitting base include birefringent crystals such as quartz, lithium niobate, and sapphire.
  • the transparent resin to be used is a resin that is easy to mix with the near infrared absorbing dye. More specifically, a cyclic (poly) olefin resin is used for the substrate 111.
  • the base material 111 contains the compound 113 (dye).
  • the thickness of the substrate 111 is not particularly limited, but is preferably 10 ⁇ m to 210 ⁇ m, more preferably 20 ⁇ m to 150 ⁇ m, still more preferably 20 ⁇ m to 110 ⁇ m, and particularly preferably 30 ⁇ m to 80 ⁇ m.
  • the compound 113 has one or more absorption maximum wavelengths in a wavelength band of 700 nm to 1100 nm.
  • a phthalocyanine compound is used as the compound 113.
  • the content of the compound 113 may be appropriately set so as to satisfy the above conditions.
  • Adhesive layer 120 In the present specification, “adhesion” is used in a concept including “adhesion”.
  • the adhesive layer 120 is provided on the first surface 111 ⁇ / b> A of the base 111 of the absorbent layer 110.
  • the adhesive layer is, for example, an adhesive layer between the ⁇ / 4 plate and the reflective polarizer, between the light reflective layer in the reflective polarizer, between the polarizing plate or the polarizer and the ⁇ / 4 plate, etc. It may be included.
  • the pressure-sensitive adhesive that can be used in the present invention include, but are not limited to, acrylic pressure-sensitive adhesives and polyvinyl alcohol-based adhesives.
  • a boron compound aqueous solution a curable adhesive of an epoxy compound which does not contain an aromatic ring in the molecule as disclosed in JP-A-2004-245925, 360 described in JP-A-2008-174667.
  • An active energy ray curable adhesive comprising a photopolymerization initiator having a molar absorption coefficient of 400 or more at a wavelength of 450 nm or more and an ultraviolet curable compound as essential components, (meth) acrylic as described in JP-A 2008-174667.
  • the method for adjusting the refractive index of the adhesive layer is not particularly limited, and for example, the method described in JP-A-11-223712 can be used. Among the methods described in JP-A-11-223712, the following embodiments are particularly preferable.
  • resin such as polyester resin, an epoxy resin, a polyurethane resin, silicone resin, acrylic resin
  • adhesive such as polyester resin, an epoxy resin, a polyurethane resin, silicone resin, acrylic resin
  • acrylic resins are preferable for their reliability such as water resistance, heat resistance, light resistance and the like, adhesion strength, transparency and the like.
  • Acrylic pressure-sensitive adhesives include acrylic acid and esters thereof, methacrylic acid and esters thereof, homopolymers of acrylic monomers such as acrylamide and acrylonitrile, and copolymers thereof, and at least one of the above-mentioned acrylic monomers, Copolymers with aromatic vinyl monomers such as vinyl acetate, maleic anhydride and styrene can be mentioned.
  • main monomers such as ethylene acrylate, butyl acrylate and 2-ethylhexyl acrylate which develop adhesiveness
  • monomers such as vinyl acetate, acrylonitrile, acrylamide, styrene, methacrylate and methyl acrylate which become cohesive components, and adhesion improvement
  • Functional groups containing functional groups such as methacrylic acid, acrylic acid, itaconic acid, hydroxyethyl methacrylate, hydroxypropyl methacrylate, dimethylaminoethyl methacrylate, dimethylaminoethyl methacrylate, acrylamide, methylol acrylamide, glycidyl methacrylate, maleic anhydride, etc.
  • Tg glass transition temperature
  • weight average molecular weight in the range of 200,000 to 1,000,000
  • the protective layer 130 has a function of protecting, in particular, the light receiving unit 720 among the semiconductor elements 710 provided under the optical filter 100.
  • the protective layer 130 is provided with a light-transmitting substrate.
  • a cover glass having a planar light transmitting surface is disposed on the protective layer.
  • the cover glass is sealed with a package of a ceramic material such as alumina, a metal material, or a plastic material with various adhesives to protect the semiconductor element housed inside the package and to transmit visible light and the like. It functions as a light window.
  • a colorless and transparent glass substrate is used for the protective layer 130.
  • the cover glass described in JP-A-2004-221541, JP-A-2006-149458, etc. can be used.
  • the protective layer 130 is not limited to the glass substrate, and a transparent organic resin may be used.
  • the transparent resin described in the said absorption layer can be used.
  • the thickness of the protective layer 130 is not particularly limited, but is preferably 10 ⁇ m to 210 ⁇ m, more preferably 20 ⁇ m to 150 ⁇ m, still more preferably 20 ⁇ m to 110 ⁇ m, and particularly preferably 30 ⁇ m to 80 ⁇ m.
  • FIG. 4 is a cross-sectional view of the adhesive 125.
  • the adhesive 125 includes the resin 121 and the compound 114.
  • the resin 121 is made of the same material as the adhesive layer 120.
  • resin 121 is not limited to transparent curable resin. That is, the resin 121 may be a colored or opaque material.
  • Acrylic resin is used in this example.
  • the resin 121 is not limited to an acrylic resin, and an epoxy resin may be used.
  • the same material as the compound 113 is used.
  • a phthalocyanine compound is used as the compound 114.
  • the content of the compound 114 may be appropriately set so as to satisfy the above conditions.
  • the content of the compound 114 may be larger than the content of the compound 113 in the optical filter 100. This can increase the absorptivity for near-infrared light from the side direction.
  • the light 690 includes light emitted from the LED, a fluorescent lamp, sunlight, or the like.
  • the light 690A incident from above the solid-state imaging device 700 first enters the lens 730. At this time, the light is converged by the lens 730. Next, the light 690 A enters the optical filter 100.
  • the light 690 A absorbs light in the near infrared region and transmits visible light due to the effect of the absorption layer 110 in the optical filter 100.
  • light 690A has an average value of transmittance of 75% or more in a wavelength range of 430 to 580 nm and an average value of transmittance in a wavelength range of 700 to 800 nm of 20% or less.
  • the average value of the transmittance in the wavelength range of 800 to 1100 nm is 5% or less.
  • the light 690A passes through the color filter 200 to transmit light of predetermined wavelengths (red (R), green (G), blue (B)).
  • predetermined wavelengths red (R), green (G), blue (B)
  • R red
  • G green
  • B blue
  • the adhesive agent 125 is provided on the side surface of the solid-state imaging device 700 to block light in the near infrared region of 700 nm or more and 1100 nm or less with respect to light 690B incident from the side. Absorbed That is, in the conventional photoelectric conversion element, it has the ability to block the infrared rays from the side which was insufficient. Therefore, the sensitivity of the light receiving unit 720 can be increased, and an image with high color reproducibility can be obtained.
  • the solid-state imaging device 700 includes a charge-coupled device (CCD) image sensor or a complementary metal oxide semiconductor (CMOS) image sensor.
  • CCD charge-coupled device
  • CMOS complementary metal oxide semiconductor
  • the absorption layer 110 is formed.
  • the absorbing layer 110 is formed by, for example, a cast molding method.
  • the resin composition containing the resin to be the substrate 111 and the compound 113 is cast (casted) on a suitable support, and the solvent is removed to obtain the absorbent layer 110. It is formed.
  • a suitable support for example, a support made of a glass plate, a steel belt, an inorganic material of a steel drum and a support made of an organic resin (for example, a polyester film, a cyclic olefin resin film) are used.
  • the absorbent layer 110 is obtained by peeling it from the support after casting.
  • the adhesive layer 120 is formed on the first surface 111 ⁇ / b> A of the base 111 of the absorbent layer 110.
  • the adhesive layer 120 is formed by a spin coating method, a spray method, an inkjet method, a printing method, a dipping method, or a vapor deposition method.
  • the adhesive layer 120 is formed by spin coating.
  • the protective layer 130 is formed on the adhesive layer 120.
  • a curing process may be performed.
  • the curing treatment may be heat treatment or light irradiation treatment. In this example, heat treatment is performed.
  • the optical filter 100 is manufactured by the above.
  • FIG. 6 is a cross-sectional view of the electronic device 1000.
  • the electronic device 1000 includes a solid-state imaging device 700, a solid-state imaging device 700-1, and a light emitting element 800.
  • the solid-state imaging device 700, the solid-state imaging device 700-1 and the light emitting device 800 are provided in a housing 1010 of the electronic device 1000.
  • the basic configuration of the solid-state imaging device 700 and the solid-state imaging device 700-1 is the same as that shown in the first embodiment.
  • the solid-state imaging device 700-1 may not have the optical filter 100.
  • the light emitting element 800 has a function of irradiating light to an object.
  • the light emitting element 800 includes a light emitting unit 810 and a lens 820.
  • the light emitting element 800 emits light (light 890) in a near infrared region (eg, a wavelength of 700 nm or more and 1100 nm or less).
  • the light emitting element 800 emits the light 890 to the object 900
  • the light 890 is reflected by the object 900.
  • the reflected light (light 891) is incident on the solid-state imaging device 700-1, and an image is acquired.
  • face authentication can also be performed by using light in the near infrared region.
  • the optical filter 100 and the adhesive 125 are used in the solid-state imaging device 700. Therefore, the solid-state imaging device 700 can block light incident not only from above but also from the side. For example, as shown in FIG. 6, light 892, which is part of the light 891 incident on the solid-state imaging device 700-1, is generated as leaked light. At this time, the light 892 travels from the side of the solid-state imaging device 700 to the solid-state imaging device 700.
  • the adhesive 125 provided on the solid-state imaging device 700 can block light in the near infrared region. Therefore, the solid-state imaging device 700 can acquire an image with high color reproducibility without being affected by the light 892.
  • the solid-state imaging device 700 and the solid-state imaging device 700-1 may be arranged on different planes.
  • the solid-state imaging device 700 is provided on different surfaces of the housing 1010. This is similar to the relationship between the main camera and the sub camera provided in the smartphone.
  • the sub camera corresponding to the solid-state imaging device 700-1
  • the main camera can acquire an image with high color reproducibility without being affected by leaked light.
  • the optical filter 100 has been described as blocking and absorbing light of wavelengths in the near infrared region, but is not limited thereto.
  • the optical filter 100 may absorb light in the near-ultraviolet region in addition to light in the near-infrared region.
  • the near ultraviolet light absorber include azomethine compounds, indole compounds, benzotriazole compounds and triazine compounds.
  • near-infrared light or near-ultraviolet regions may be combined and blocked.
  • FIG. 8 is a cross-sectional view of the optical filter 100-1.
  • the optical filter 100-1 can absorb more light in the near infrared region by including the adhesive 125.
  • FIG. 9 is a cross-sectional view of the optical filter 100-2.
  • the adhesive 125 may be provided on both sides of the absorbent layer 110 (the second surface 111B opposite to the first surface 111A of the base 111).
  • the protective layer 130 may be used as the protective member 740. Thereby, the light incident from the side is absorbed more efficiently.
  • FIG. 10 is a cross-sectional view of the optical filter 110-3.
  • the absorbing layer 110-3 has a light transmitting resin layer 115 on the second surface 111 B opposite to the first surface 111 A of the base 111.
  • a glass support or a transparent resin substrate is used for the substrate 111.
  • the resin layer 115 has translucency.
  • an acrylic resin is provided in the resin layer 115 in this example, the present invention is not limited to this, and the above-described resin material is used.
  • the resin layer 115 containing the compound 113 is formed on the second surface 111B of the base 111 by a cast molding method.
  • a resin solution corresponding to the resin layer 115 is applied using a method such as spin coating, slit coating, or inkjet. Thereafter, the solvent contained in the resin solution is dried and removed to produce the absorbent layer 110-1.
  • the base material 111 can be used as a support body at the time of resin layer 115 formation.
  • the resin layer 115 does not need to be peeled off from the base 111. That is, the manufacturing process is simplified.
  • FIG. 11 is a cross-sectional view of the optical filter 100-4.
  • the optical filter 100-4 may be provided with a dielectric layer 140.
  • the adhesive layer 120 is provided on the second surface 111 ⁇ / b> B side of the base 111 among the absorbing layer 110.
  • the dielectric layer 140 has a function of reflecting light of unnecessary wavelength bands and selectively transmitting light of necessary wavelength bands.
  • the dielectric layer 140 reflects near infrared light and transmits visible light.
  • the dielectric layer 140 may reflect light in the same wavelength band as the absorption layer 110 or may reflect light in a different wavelength band. By using the dielectric layer 140, light can be selectively transmitted through the optical filter 100.
  • the dielectric layer 140 a layer in which high refractive index material layers and low refractive index material layers are alternately stacked is used.
  • a material forming the high refractive index material layer a material having a refractive index of 1.7 or more can be used, and a material having a refractive index of usually 1.7 to 2.5 is selected.
  • Such materials include, for example, titanium oxide, zirconium oxide, tantalum pentoxide, niobium pentoxide, lanthanum oxide, yttrium oxide, zinc oxide, zinc sulfide or indium oxide, etc., and titanium oxide, tin oxide and / or Alternatively, those containing a small amount of cerium oxide or the like (for example, 0 to 10% by weight with respect to the main component) can be mentioned.
  • a material having a refractive index of 1.6 or less can be used, and a material having a refractive index of 1.2 to 1.6 is usually selected.
  • Such materials include, for example, silica, alumina, lanthanum fluoride, magnesium fluoride and sodium aluminum hexafluoride.
  • the physical film thickness of each of the high refractive index material layer and the low refractive index material layer depends on the refractive index of each layer, but it is usually preferably 5 to 500 nm, and the total film thickness of the dielectric layer 140 is 1 The thickness may be appropriately set in the range of 0 to 8.0 ⁇ m.
  • the dielectric layer 140 is formed by laminating a high refractive index material layer and a low refractive index material layer.
  • the dielectric layer 140 is a dielectric in which high refractive index material layers and low refractive index material layers are alternately laminated by performing a CVD method, a sputtering method, a vacuum evaporation method, an ion assisted deposition method, an ion plating method or the like. Layer 140 can be formed.
  • the optical filter 100 and the adhesive 125 are used for the solid-state imaging device 700, but may be used for an ambient light sensor or an illuminance sensor.
  • light diffusing particles may be included in at least one of the optical filter 100 and the adhesive 125.
  • FIG. 12 is a cross-sectional view of the optical filter 100-5.
  • FIG. 13 is a cross-sectional view of the adhesive 125-5.
  • the optical filter 100-5 and the adhesive 125-5 include light diffusing particles 123.
  • the light diffusion particles 123 are provided in the absorption layer 110.
  • the light diffusing particles 123 are provided in the resin 121.
  • the light diffusion particle 123 may absorb light in the near infrared region.
  • the refractive index of the light diffusion particle 123 may be appropriately set in the range of 1.2 or more and 3.0 or less.
  • titanium oxide (TiO 2 ) is used as the light diffusion particle 123 in this example.
  • the size of the light diffusion particle 123 is 10 nm or more and less than 500 nm, more preferably 20 nm or more and less than 200 nm.
  • the light diffusing particles 123 preferably have a spherical shape, but is not limited thereto.
  • the smaller the particle diameter of the fine particles the higher the transparency of the resin material.
  • the particle diameter is preferably 100 nm or less, more preferably 50 nm or less, still more preferably 20 nm or less.
  • These high refractive index inorganic fine particle materials can be used by being mixed with ordinary resins, and the refractive index of the curable resin can be further enhanced by mixing with the above high refractive index resins. It becomes possible.
  • an organic particle containing a structural unit derived from at least one of an aromatic vinyl monomer and a (meth) acrylic acid ester monomer can be used.
  • particles described in JP-A-2010-77243, JP-A-2017-50276, JP-A-2011-248104, etc. can be used.
  • the amount of the light diffusion particles dispersed in the adhesive layer-forming resin is about 1 to about 20 parts by weight, preferably about 1 to about 10 parts by weight. If the amount is less than 1 part by weight, the selective absorptivity is not sufficient, and if it exceeds 20 parts by weight, the light transmission is insufficient and the impact resistance of the material is lowered. For example, it can be dispersed by a known method described in JP-A-11-310717 and the like.
  • FIG. 14 is a cross-sectional view of the ambient light sensor 400.
  • the ambient light sensor 400 includes a semiconductor element 710 having a light receiving portion 720, a lens 730, an adhesive 125, a protection member 740, a package substrate 770, and a front panel 780.
  • the optical filter 100 or the adhesive 125 for the ambient light sensor 400 the illuminance and the color of the display panel 304 shown in FIG. 1 can be controlled.
  • the absorbing layer 110 is formed by casting a curable composition containing a photocurable resin and / or a thermosetting resin and, if necessary, the compound 113 on a suitable support. After removing the solvent, it may be formed by curing according to an appropriate method such as ultraviolet irradiation or heating if necessary.
  • the absorbent layer 110 may be formed by a melt molding method. Specifically, a method of melt-molding a pellet obtained by melt-kneading a resin and, if necessary, the compound 113, a method of melt-molding a resin composition containing a resin and, if necessary, the compound 113, or a resin And a method of melt-molding pellets obtained by removing the solvent from the resin composition containing the solvent and, if necessary, the compound 113.
  • Melt molding methods include injection molding, melt extrusion molding or blow molding.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Filters (AREA)
  • Color Television Image Signal Generators (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

Un élément de conversion photoélectrique comprend : un élément semi-conducteur qui est pourvu d'une partie de réception de lumière ; un filtre optique qui est disposé sur l'élément semi-conducteur de façon à être superposé sur la partie de réception de lumière ; une lentille qui est disposée sur l'élément semi-conducteur de façon à être superposée sur la partie de réception de lumière et le filtre optique ; un élément de protection qui est disposé sur la périphérie de l'élément semi-conducteur ; et un adhésif qui est disposé entre l'élément de protection et le filtre optique et la lentille, le filtre optique et l'adhésif contenant au moins un composé qui a une longueur d'onde maximale d'absorption se situant dans la région de longueur d'onde de 700 nm à 1100 nm.
PCT/JP2018/027563 2017-07-31 2018-07-23 Élément de conversion photoélectrique et adhésif WO2019026675A1 (fr)

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KR1020207002773A KR20200027962A (ko) 2017-07-31 2018-07-23 광전 변환 소자 및 접착제
CN201880044902.1A CN110832852A (zh) 2017-07-31 2018-07-23 光电转换元件及接着剂
JP2019534051A JP7060018B2 (ja) 2017-07-31 2018-07-23 光電変換素子および接着剤

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Cited By (1)

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WO2020040123A1 (fr) * 2018-08-21 2020-02-27 Jsr株式会社 Filtre optique et détecteur de lumière ambiante

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JP2006032886A (ja) * 2004-06-15 2006-02-02 Fuji Photo Film Co Ltd 固体撮像装置及びその製造方法及びカメラモジュール
JP2016200771A (ja) * 2015-04-14 2016-12-01 Jsr株式会社 光学フィルターおよび光学フィルターを用いた装置
JP2016206558A (ja) * 2015-04-27 2016-12-08 Jsr株式会社 ポジ型感放射線性樹脂組成物、赤外線遮蔽膜、その形成方法、及び固体撮像素子、照度センサー

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TW201339657A (zh) * 2012-03-29 2013-10-01 Hon Hai Prec Ind Co Ltd 光學元件、鏡頭模組及光學元件製造方法
JP6329638B2 (ja) * 2014-10-28 2018-05-23 富士フイルム株式会社 近赤外線吸収性組成物、近赤外線カットフィルタ、固体撮像素子、カメラモジュール

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JP2006032886A (ja) * 2004-06-15 2006-02-02 Fuji Photo Film Co Ltd 固体撮像装置及びその製造方法及びカメラモジュール
JP2016200771A (ja) * 2015-04-14 2016-12-01 Jsr株式会社 光学フィルターおよび光学フィルターを用いた装置
JP2016206558A (ja) * 2015-04-27 2016-12-08 Jsr株式会社 ポジ型感放射線性樹脂組成物、赤外線遮蔽膜、その形成方法、及び固体撮像素子、照度センサー

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020040123A1 (fr) * 2018-08-21 2020-02-27 Jsr株式会社 Filtre optique et détecteur de lumière ambiante
JPWO2020040123A1 (ja) * 2018-08-21 2021-08-26 Jsr株式会社 光学フィルターおよび環境光センサー
JP7251551B2 (ja) 2018-08-21 2023-04-04 Jsr株式会社 光学フィルターおよび環境光センサー

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JPWO2019026675A1 (ja) 2020-08-20
JP7060018B2 (ja) 2022-04-26
TW201910476A (zh) 2019-03-16
CN110832852A (zh) 2020-02-21

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