WO2019021897A1 - 研磨布 - Google Patents

研磨布 Download PDF

Info

Publication number
WO2019021897A1
WO2019021897A1 PCT/JP2018/026805 JP2018026805W WO2019021897A1 WO 2019021897 A1 WO2019021897 A1 WO 2019021897A1 JP 2018026805 W JP2018026805 W JP 2018026805W WO 2019021897 A1 WO2019021897 A1 WO 2019021897A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
forming material
thickness direction
abundance ratio
present
Prior art date
Application number
PCT/JP2018/026805
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
惠司 山本
孝司 岳田
伊藤　栄直
Original Assignee
ニッタ・ハース株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ニッタ・ハース株式会社 filed Critical ニッタ・ハース株式会社
Priority to CN201880037093.1A priority Critical patent/CN110709208A/zh
Priority to KR1020197034585A priority patent/KR102586673B1/ko
Publication of WO2019021897A1 publication Critical patent/WO2019021897A1/ja

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
    • D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
    • D06M15/37—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D06M15/564—Polyureas, polyurethanes or other polymers having ureide or urethane links; Precondensation products forming them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to an abrasive cloth.
  • a polishing cloth provided with a non-woven fabric and a resin impregnated in the non-woven fabric is used as a forming material (for example, Patent Document 1).
  • this invention makes it a subject to provide the abrasive cloth which can suppress clogging and edge part sag in view of the said problem.
  • the polishing pad according to the present invention is a polishing pad provided with a non-woven fabric and a resin impregnated in the non-woven fabric as a forming material,
  • the abundance ratio of the forming material from the thickness direction central portion to one surface is 30 to 60%, and the difference between the maximum value and the minimum value of the abundance ratio in the thickness direction is 10% or less.
  • BRIEF DESCRIPTION OF THE DRAWINGS The schematic of the apparatus used for the measurement of ventilation resistance value (APR). Polishing rate when a wafer is polished using the polishing cloth of the embodiment and the comparative example.
  • the polishing pad according to the present embodiment includes, as a forming material, a non-woven fabric and a resin impregnated in the non-woven fabric.
  • the abundance ratio of the forming material from the central portion in the thickness direction to one surface is 30 to 60%, and the maximum value and the minimum value of the abundance ratio in the thickness direction It is important that the difference with is 10% or less.
  • the abundance ratio of the forming material from the center in the thickness direction to one surface is 30 to 60%.
  • the one surface is a polished surface.
  • the “existence ratio of the forming material from the center in the thickness direction to one surface” and “the difference between the maximum value and the minimum value of the existence ratio of the forming material in the thickness direction” may be determined as follows: it can. That is, cross sections are observed every 100 ⁇ m from one surface to the center in the thickness direction, and the abundance ratio of the forming material is measured in each cross section. Then, the arithmetic mean value of the measured abundance ratio of the forming material is taken as "the abundance ratio of the forming material from the central portion in the thickness direction to one surface", and the minimum value is subtracted from the maximum value in the measured abundance ratio of the forming material This value is taken as "the difference between the maximum value and the minimum value of the abundance ratio of the forming material in the thickness direction".
  • the abundance ratio of the forming material in each cross section means the ratio of the area of the portion in which the forming material exists when the entire area of the portion to be observed is 100% in the portion to be observed in each cross section. Further, the difference between the maximum value and the minimum value of the abundance ratio in the thickness direction may be 0.0% or 0.1 to 10%.
  • the polishing cloth is photographed by CT-scan. Specifically, an image of a cross section is acquired every 100 ⁇ m from one surface of the polishing cloth to the center in the thickness direction. Then, in the image of the cross section, the existence ratio (area ratio) of the forming material in each cross section is measured by performing a binarization process of classifying into a void and a portion other than the void (a portion where the forming material exists). .
  • a CT apparatus a three-dimensional measurement X-ray CT apparatus (TDM1000H-1) manufactured by Yamato Scientific Co., Ltd. can be used.
  • CT image processing software image processing software VGStudio Max 2.1 manufactured by Volume Graphics, Inc. can be used.
  • WinRoof manufactured by Mitani Corporation can be used as image analysis software for calculating the existing ratio (area ratio) of the forming material.
  • the area of each cross section to be observed can be 1,300 ⁇ m ⁇ 1,300 ⁇ m.
  • the abundance ratio (area ratio) of the forming material in each cross section is measured under the following conditions.
  • the cross section of the polishing cloth is continuously measured with the following field of view size.
  • Size of field of view (length ⁇ width ⁇ height): 2,000 ⁇ m ⁇ 2,000 ⁇ m ⁇ thickness direction entire region
  • the conditions of the measurement are as follows.
  • Number of views per rotation 1500
  • Number of frames / view 10
  • the method of determining the thickness direction center of the polishing cloth from the image obtained by the measurement is as follows. First, on the CT image processing software "VGStudio Max", using the coordinate description function (volume coordinate system mode), the coordinate values in the X-axis direction, Y-axis direction and Z-axis direction are displayed in mm units for the polishing cloth Do. Next, using the registration function, the inclination in the software is adjusted so that the thickness direction of the polishing pad coincides with one of the X, Y, and Z axes. Then, from the coordinate value in the thickness direction of one surface of the polishing cloth and the coordinate value in the thickness direction of the other surface, the average value of the coordinate values in the thickness direction is obtained to obtain the central position in the thickness direction of the polishing cloth. Determined.
  • the binarization process of classifying into the void and the part other than the void is as follows.
  • contrast adjustment is performed on the image of the cross section in order to classify into the void and the portion other than the void (the portion where the forming material exists) in VGStudio Max.
  • Contrast adjustment is performed in Ramp mode.
  • contrast adjustment the difference between the void and the portion other than the void (the portion where the forming material is present) is made clear.
  • contrast adjustment is described as "opacity adjustment".
  • the lower limit value of the gray value is set to the peak, and then the upper limit value of the gray value is set to the range of “peak value of the peak + 100 ⁇ 5”.
  • the adjustment range of the contrast is not necessarily limited because the light transmittance varies depending on the material.
  • an image of a cross section is acquired every 100 ⁇ m from one surface of the polishing pad to the central portion in the thickness direction.
  • the material abundance ratio is measured by WinRoof about the acquired image of the cross section every 100 ⁇ m. Assuming that the measurement range in WinRoof is “1,300 ⁇ m ⁇ 1,300 ⁇ m”, “the ratio of the area of the portion where the forming material exists when the entire area of the portion to be observed is 100% in the observation portion in each cross section” The “presence ratio of the forming material in each cross section” is In the binarization process in WinRoof, a portion where the gradation range is in the range of “127” to “255” is a portion other than the void (a portion where the forming material exists).
  • the abundance ratio of the forming material from the central portion in the thickness direction to the other surface is 30 to 60%, and the maximum value and the minimum value of the abundance ratio in the thickness direction Is preferably 10% or less.
  • the Asker-C hardness of the polishing pad according to this embodiment is preferably 80 or more, and more preferably 85 to 95.
  • the polishing cloth according to the present embodiment has an advantage that edge sag of an object to be polished (for example, a wafer etc.) can be suppressed by having an Asker-C hardness of 80 or more.
  • the abrasive cloth according to the present embodiment has an advantage that defects (for example, scratches and the like) of an object to be polished can be suppressed by the Asker-C hardness being 95 or less.
  • Asker-C hardness means a value measured according to the definition of SRIS 0101 (Japan Rubber Association Standard). Also, the Asker-C hardness is measured on the one surface. In other words, Asker-C hardness is measured on the polished surface.
  • the thickness of the polishing pad according to the present embodiment is preferably 0.8 to 2.0 mm, more preferably 1.0 to 1.5 mm.
  • the polishing cloth which concerns on this embodiment has the advantage that it becomes easy to relieve the bad influence on the polishing performance by the state of the surface plate of a polisher because thickness is 0.8 mm or more. This also has the advantage that, for example, the object to be polished can be stably and easily flattened.
  • the polishing cloth according to the present embodiment has a thickness of 2.0 mm or less, so that the amount of deformation of the polishing cloth at the time of polishing can be reduced. Have.
  • the basis weight of the non-woven fabric is preferably 200 to 600 g / m 2 .
  • the polishing cloth according to the present embodiment has an advantage that the hardness tends to be high when the basis weight of the non-woven fabric is 200 g / m 2 or more, and as a result, it is possible to suppress edge sagging of the object to be polished.
  • the polishing cloth according to the present embodiment can easily have void portions at an appropriate ratio on the polishing surface because the basis weight of the non-woven fabric is 200 to 600 g / m 2 .
  • the polishing pad according to the present embodiment has such an advantage that it is easy to suppress variation in polishing performance due to clogging of voids due to polishing debris or the like.
  • a silicon wafer etc. are mentioned as a thing to be grind
  • the polishing pad according to the present embodiment is configured as described above. Next, a method of manufacturing the polishing pad according to the present embodiment will be described.
  • the method for producing a polishing cloth according to the present embodiment will be described by taking, as an example, a method of performing a two-step impregnation process of wet impregnating a urethane resin into nonwoven fabric and dry impregnating a urethane resin into nonwoven fabric.
  • a urethane resin is dissolved in a water-soluble organic solvent to obtain a first impregnation solution.
  • the water-soluble organic solvent include dimethylformamide, dimethylsulfoxide, tetrahydrofuran, dimethylacetamide and the like.
  • the first impregnating solution may contain a filler. Examples of the filler include carbon black and the like.
  • the first impregnating solution may also contain a dispersion stabilizer. The dispersion stabilizer may, for example, be a surfactant.
  • the non-woven fabric is dipped in the first impregnation solution, and the non-woven fabric dipped in the first impregnation solution is dipped in water.
  • the water-soluble organic solvent in the first impregnating solution attached to the non-woven fabric is replaced with water, the urethane resin coagulates, and the urethane resin adheres on the surface of the non-woven fabric.
  • a prepolymer having an isocyanate group as an end group, a curing agent which is an organic compound having active hydrogen, and an organic solvent are mixed to obtain a second impregnating solution.
  • the organic solvent include methyl ethyl ketone, acetone, alcohol and ethyl acetate.
  • polishing pad according to the present embodiment is configured as described above, it has the following advantages.
  • the polishing pad according to the present embodiment is a polishing pad provided with a non-woven fabric and a resin impregnated in the non-woven fabric as a forming material. Further, in the polishing pad according to the present embodiment, the abundance ratio of the forming material from the center in the thickness direction to one surface is 30 to 60%, and the maximum value and the minimum value of the abundance ratio in the thickness direction And 10% or less.
  • Such a polishing cloth has many voids due to the existence ratio of the forming material from the center in the thickness direction to one surface being 60% or less, even if shavings are slightly clogged And the reduction of the polishing rate is suppressed. Further, in the polishing cloth, the proportion of the forming material increases from the center in the thickness direction to the surface in the manufacturing method, but in the polishing cloth according to the present embodiment, the maximum value and the minimum value of the proportion in the thickness direction When the difference of is 10% or less, a large number of voids are easily present on the surface of the polishing pad, and as a result, even if shavings are slightly clogged in the voids, the reduction of the polishing rate is suppressed.
  • such a polishing cloth reduces the change in the abundance ratio from the central portion in the thickness direction to one surface, and even if it is dressed, the change in the polishing rate is suppressed. Furthermore, such a polishing cloth has an abundance ratio of the forming material of 30% or more from the central portion in the thickness direction to one surface, so the number of places where the material is present increases and the hardness becomes high. As a result, edge drop can be suppressed.
  • the abrasive cloth which can control clogging and end drooping can be provided.
  • polishing pad according to the present invention is not limited to the above embodiment. Further, the polishing pad according to the present invention is not limited to the above-described effects. The polishing pad according to the present invention can be variously modified without departing from the scope of the present invention.
  • the polishing cloth is obtained by the method of performing the two-stage impregnation process, but the polishing cloth may be obtained only by wet impregnation or dry impregnation.
  • the thickness of 600 ⁇ m from one surface when cross-sectional observation is performed every 100 ⁇ m from one surface to the central portion in the thickness direction, the thickness of 600 ⁇ m from one surface.
  • the average value of the abundance ratio of the forming material in the thickness 100 ⁇ m to the thickness 600 ⁇ m in Table 1 means “the abundance ratio of the forming material from the central portion in the thickness direction to one surface”;
  • the difference between the maximum value and the minimum value of the abundance ratio of the forming material from 100 ⁇ m to a thickness of 600 ⁇ m means “the difference between the maximum value and the minimum value of the abundance ratio of the forming material in the thickness direction”.
  • the compression rate and the compression elastic modulus were measured by the method of JIS L1096: 2010.
  • the air resistance value (APR) is the loss of pressure when air is allowed to pass in the thickness direction of the polishing cloth using the apparatus shown in FIG. 2 (flow rate of air: 30 L / min, pressure of air: 100 Pa). means.
  • the polishing rate was measured when the wafer was polished using the polishing cloths of the example and the comparative example.
  • the polishing conditions for the measurement of the polishing rate are shown below. Polishing was performed eight times for 40 minutes under the following polishing conditions. The weight of the wafer was measured after each polishing for 40 minutes (per run), and the polishing rate (RR) was determined from the difference between the weight of the wafer before polishing and the weight of the wafer after polishing. The results are shown in FIG. 3 and Table 3.
  • "RR drop rate” shown in Table 3 means the decreasing rate of Removal rate (RR), and was calculated
  • RR drop rate (%) (RR maximum value-RR minimum value) / RR maximum value ⁇ 100 (%)
  • polishing machine Strasbaugh 6CA Wafer: 8 "(P-) Polishing fluid: 20 times diluted NP6502 (manufactured by Nitta Haas Co., Ltd.) Flow rate of polishing fluid: 100 mL / min Polishing time: 40 min / run
  • SEM images of the surface and the cross section of the polishing cloth of Example 1 and Comparative Example 1 are shown in FIGS.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Textile Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
PCT/JP2018/026805 2017-07-25 2018-07-18 研磨布 WO2019021897A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201880037093.1A CN110709208A (zh) 2017-07-25 2018-07-18 研磨布
KR1020197034585A KR102586673B1 (ko) 2017-07-25 2018-07-18 연마포

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-143436 2017-07-25
JP2017143436A JP6951895B2 (ja) 2017-07-25 2017-07-25 研磨布

Publications (1)

Publication Number Publication Date
WO2019021897A1 true WO2019021897A1 (ja) 2019-01-31

Family

ID=65040160

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/026805 WO2019021897A1 (ja) 2017-07-25 2018-07-18 研磨布

Country Status (5)

Country Link
JP (1) JP6951895B2 (zh)
KR (1) KR102586673B1 (zh)
CN (1) CN110709208A (zh)
TW (1) TWI775900B (zh)
WO (1) WO2019021897A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113047056A (zh) * 2019-12-27 2021-06-29 霓达杜邦股份有限公司 研磨布

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102305796B1 (ko) * 2020-02-05 2021-09-28 에스케이실트론 주식회사 웨이퍼 연마 장치용 연마 패드, 그의 제조 장치 및 제조 방법
JP7481143B2 (ja) * 2020-03-27 2024-05-10 富士紡ホールディングス株式会社 研磨パッド、その製造方法、及び研磨加工物の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62140769A (ja) * 1985-12-16 1987-06-24 Toyo Cloth Kk 研磨布の製造法
JP2008207323A (ja) * 2007-02-01 2008-09-11 Kuraray Co Ltd 研磨パッド及び研磨パッドの製造方法
WO2010016486A1 (ja) * 2008-08-08 2010-02-11 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
JP2011009584A (ja) * 2009-06-26 2011-01-13 Nitta Haas Inc 研磨パッド
JP2014139361A (ja) * 2012-12-19 2014-07-31 Kuraray Co Ltd 複合基材シート及び複合基材シートの製造方法
WO2014125797A1 (ja) * 2013-02-12 2014-08-21 株式会社クラレ 硬質シート及び硬質シートの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01193166A (ja) * 1988-01-28 1989-08-03 Showa Denko Kk 半導体ウェハ鏡面研磨用パッド
JP2509870B2 (ja) * 1993-06-30 1996-06-26 千代田株式会社 研磨布
JP3664676B2 (ja) * 2001-10-30 2005-06-29 信越半導体株式会社 ウェーハの研磨方法及びウェーハ研磨用研磨パッド
JP4890751B2 (ja) 2004-08-04 2012-03-07 ニッタ・ハース株式会社 研磨布
CN101612722A (zh) * 2008-06-25 2009-12-30 三芳化学工业股份有限公司 抛光垫及其制造方法
TWI565735B (zh) * 2015-08-17 2017-01-11 Nanya Plastics Corp A polishing pad for surface planarization processing and a process for making the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62140769A (ja) * 1985-12-16 1987-06-24 Toyo Cloth Kk 研磨布の製造法
JP2008207323A (ja) * 2007-02-01 2008-09-11 Kuraray Co Ltd 研磨パッド及び研磨パッドの製造方法
WO2010016486A1 (ja) * 2008-08-08 2010-02-11 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
JP2011009584A (ja) * 2009-06-26 2011-01-13 Nitta Haas Inc 研磨パッド
JP2014139361A (ja) * 2012-12-19 2014-07-31 Kuraray Co Ltd 複合基材シート及び複合基材シートの製造方法
WO2014125797A1 (ja) * 2013-02-12 2014-08-21 株式会社クラレ 硬質シート及び硬質シートの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113047056A (zh) * 2019-12-27 2021-06-29 霓达杜邦股份有限公司 研磨布

Also Published As

Publication number Publication date
JP2019025549A (ja) 2019-02-21
CN110709208A (zh) 2020-01-17
KR20200034952A (ko) 2020-04-01
TWI775900B (zh) 2022-09-01
KR102586673B1 (ko) 2023-10-06
TW201908061A (zh) 2019-03-01
JP6951895B2 (ja) 2021-10-20

Similar Documents

Publication Publication Date Title
WO2019021897A1 (ja) 研磨布
DE112007002066B4 (de) Polierkissen
CN105359258B (zh) 研磨垫及其制造方法
DE112009000334B4 (de) Doppelscheibenschleifvorrichtung für Werkstücke und Doppelscheibenschleifverfahren für Werkstücke
DE112015003214B4 (de) Endpolierverfahren eines Siliziumwafers
DE112015005458T5 (de) Vakuumspannvorrichtung, abschräg-/poliervorrichtung und siliciumwaferabschräg-/polierverfahren
KR101595149B1 (ko) 유지 패드
KR101588925B1 (ko) 유지 패드
JP2007260884A (ja) 研磨布
JP2006075914A (ja) 研磨布
JP2006255828A (ja) 研磨布およびその製造方法
DE102017008998A1 (de) Chemisch-mechanische polierkissen mit einheitlicher kissenoberflächenmikrotextur
JP2004335713A (ja) 仕上げ研磨用研磨布
DE102017007338A1 (de) Konisches poromeres polierkissen
JP5762668B2 (ja) 研磨パッド
JP2021107106A (ja) 研磨布
CN113047056A (zh) 研磨布
JP2004291155A (ja) 仕上げ研磨用研磨布
DE102016001732A1 (de) Verfahren zum Polieren eines Halbleitersubstrats
KR20220092380A (ko) 연마포
EP2899226B1 (en) Method for preparing polyurethane support pad
JP2006231437A (ja) 研磨布および該研磨布の製造方法
JP2007044858A (ja) 研磨布の製造方法および研磨布
JP2011009584A (ja) 研磨パッド
CN118254101A (zh) 研磨垫

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18837715

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18837715

Country of ref document: EP

Kind code of ref document: A1