WO2019021897A1 - Polishing cloth - Google Patents
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- WO2019021897A1 WO2019021897A1 PCT/JP2018/026805 JP2018026805W WO2019021897A1 WO 2019021897 A1 WO2019021897 A1 WO 2019021897A1 JP 2018026805 W JP2018026805 W JP 2018026805W WO 2019021897 A1 WO2019021897 A1 WO 2019021897A1
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- polishing
- forming material
- thickness direction
- abundance ratio
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
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- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
- D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
- D06M15/37—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D06M15/564—Polyureas, polyurethanes or other polymers having ureide or urethane links; Precondensation products forming them
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
The present invention is a polishing cloth provided with, as forming materials: a nonwoven fabric; and a resin impregnating the nonwoven fabric, wherein the existence rate of the forming materials in an area from the center portion in the thickness direction to one surface is 30-60%, and the difference between the maximum value and the minimum value of the existence rate in the thickness direction is 10% or lower.
Description
本願は、日本国特願２０１７－１４３４３６号の優先権を主張し、引用によって本願明細書の記載に組み込まれる。
The present application claims the priority of Japanese Patent Application No. 201-143436 and is incorporated by reference into the description of the present specification.
本発明は、研磨布に関する。
The present invention relates to an abrasive cloth.
従来、シリコンウェハなどの被研磨物を研磨するのに、形成材料として、不織布と、該不織布に含浸された樹脂とを備えた研磨布が用いられている（例えば、特許文献１）。
Conventionally, in order to polish an object to be polished such as a silicon wafer, a polishing cloth provided with a non-woven fabric and a resin impregnated in the non-woven fabric is used as a forming material (for example, Patent Document 1).
ここで、研磨布においては、端部ダレが生じることが知られている。
樹脂の含浸量を増やして研磨布を硬くすると端部ダレを防ぐことができるが、その場合は、研磨布を形成する形成材料の存在比率が研磨面において高くなる。
被研磨物の研磨時には、形成材料の存在していない部分（空隙）が削り屑の収容スペースとなるため、樹脂の含浸量を増やしすぎると目詰まりし易くなる。 Here, in the polishing cloth, it is known that end sag occurs.
If the amount of resin impregnation is increased to make the polishing pad hard, it is possible to prevent edge sag, but in that case, the proportion of the forming material forming the polishing pad is high on the polishing surface.
At the time of polishing of the object to be polished, the portion (void) where the forming material is not present becomes a storage space for shavings, so if the amount of resin impregnation is increased too much, clogging tends to occur.
樹脂の含浸量を増やして研磨布を硬くすると端部ダレを防ぐことができるが、その場合は、研磨布を形成する形成材料の存在比率が研磨面において高くなる。
被研磨物の研磨時には、形成材料の存在していない部分（空隙）が削り屑の収容スペースとなるため、樹脂の含浸量を増やしすぎると目詰まりし易くなる。 Here, in the polishing cloth, it is known that end sag occurs.
If the amount of resin impregnation is increased to make the polishing pad hard, it is possible to prevent edge sag, but in that case, the proportion of the forming material forming the polishing pad is high on the polishing surface.
At the time of polishing of the object to be polished, the portion (void) where the forming material is not present becomes a storage space for shavings, so if the amount of resin impregnation is increased too much, clogging tends to occur.
そこで、本発明は、上記問題点に鑑み、目詰まり及び端部ダレを抑制し得る研磨布を提供することを課題とする。
Then, this invention makes it a subject to provide the abrasive cloth which can suppress clogging and edge part sag in view of the said problem.
本発明に係る研磨布は、形成材料として、不織布と、該不織布に含浸された樹脂とを備えた研磨布であって、
厚み方向中央部から一方の表面までの前記形成材料の存在比率が３０～６０％であり、且つ、前記厚み方向における前記存在比率の最大値と最小値との差が１０％以下である。 The polishing pad according to the present invention is a polishing pad provided with a non-woven fabric and a resin impregnated in the non-woven fabric as a forming material,
The abundance ratio of the forming material from the thickness direction central portion to one surface is 30 to 60%, and the difference between the maximum value and the minimum value of the abundance ratio in the thickness direction is 10% or less.
厚み方向中央部から一方の表面までの前記形成材料の存在比率が３０～６０％であり、且つ、前記厚み方向における前記存在比率の最大値と最小値との差が１０％以下である。 The polishing pad according to the present invention is a polishing pad provided with a non-woven fabric and a resin impregnated in the non-woven fabric as a forming material,
The abundance ratio of the forming material from the thickness direction central portion to one surface is 30 to 60%, and the difference between the maximum value and the minimum value of the abundance ratio in the thickness direction is 10% or less.
以下、添付図面を参照しつつ、本発明の一実施形態について説明する。
Hereinafter, an embodiment of the present invention will be described with reference to the attached drawings.
本実施形態に係る研磨布は、形成材料として、不織布と、該不織布に含浸された樹脂とを備える。
また、本実施形態に係る研磨布では、厚み方向中央部から一方の表面までの前記形成材料の存在比率が３０～６０％であり、且つ、前記厚み方向における前記存在比率の最大値と最小値との差が１０％以下であることが重要である。
前記厚み方向中央部から一方の表面までの前記形成材料の存在比率は、３０～６０％である。
なお、前記一方の表面は、研磨面となる。 The polishing pad according to the present embodiment includes, as a forming material, a non-woven fabric and a resin impregnated in the non-woven fabric.
In addition, in the polishing pad according to the present embodiment, the abundance ratio of the forming material from the central portion in the thickness direction to one surface is 30 to 60%, and the maximum value and the minimum value of the abundance ratio in the thickness direction It is important that the difference with is 10% or less.
The abundance ratio of the forming material from the center in the thickness direction to one surface is 30 to 60%.
The one surface is a polished surface.
また、本実施形態に係る研磨布では、厚み方向中央部から一方の表面までの前記形成材料の存在比率が３０～６０％であり、且つ、前記厚み方向における前記存在比率の最大値と最小値との差が１０％以下であることが重要である。
前記厚み方向中央部から一方の表面までの前記形成材料の存在比率は、３０～６０％である。
なお、前記一方の表面は、研磨面となる。 The polishing pad according to the present embodiment includes, as a forming material, a non-woven fabric and a resin impregnated in the non-woven fabric.
In addition, in the polishing pad according to the present embodiment, the abundance ratio of the forming material from the central portion in the thickness direction to one surface is 30 to 60%, and the maximum value and the minimum value of the abundance ratio in the thickness direction It is important that the difference with is 10% or less.
The abundance ratio of the forming material from the center in the thickness direction to one surface is 30 to 60%.
The one surface is a polished surface.
「厚み方向中央部から一方の表面までの形成材料の存在比率」、及び、「前記厚み方向における形成材料の存在比率の最大値と最小値との差」は、以下のようにして求めることができる。
すなわち、一方の表面から厚み方向中央部まで１００μｍごとに断面観察し、各断面において形成材料の存在比率を測定する。
そして、測定した形成材料の存在比率の算術平均値を、「厚み方向中央部から一方の表面までの形成材料の存在比率」とし、測定した形成材料の存在比率における、最大値から最小値を引いた値を「前記厚み方向における形成材料の存在比率の最大値と最小値との差」とする。
なお、各断面における形成材料の存在比率とは、各断面における観察する部分において、観察する部分の面積全体を１００％としたときにおける、形成材料が存在する部分の面積の割合を意味する。
また、前記厚み方向における前記存在比率の最大値と最小値との差は、０．０％でもよく、０．１～１０％でもよい。 The “existence ratio of the forming material from the center in the thickness direction to one surface” and “the difference between the maximum value and the minimum value of the existence ratio of the forming material in the thickness direction” may be determined as follows: it can.
That is, cross sections are observed every 100 μm from one surface to the center in the thickness direction, and the abundance ratio of the forming material is measured in each cross section.
Then, the arithmetic mean value of the measured abundance ratio of the forming material is taken as "the abundance ratio of the forming material from the central portion in the thickness direction to one surface", and the minimum value is subtracted from the maximum value in the measured abundance ratio of the forming material This value is taken as "the difference between the maximum value and the minimum value of the abundance ratio of the forming material in the thickness direction".
In addition, the abundance ratio of the forming material in each cross section means the ratio of the area of the portion in which the forming material exists when the entire area of the portion to be observed is 100% in the portion to be observed in each cross section.
Further, the difference between the maximum value and the minimum value of the abundance ratio in the thickness direction may be 0.0% or 0.1 to 10%.
すなわち、一方の表面から厚み方向中央部まで１００μｍごとに断面観察し、各断面において形成材料の存在比率を測定する。
そして、測定した形成材料の存在比率の算術平均値を、「厚み方向中央部から一方の表面までの形成材料の存在比率」とし、測定した形成材料の存在比率における、最大値から最小値を引いた値を「前記厚み方向における形成材料の存在比率の最大値と最小値との差」とする。
なお、各断面における形成材料の存在比率とは、各断面における観察する部分において、観察する部分の面積全体を１００％としたときにおける、形成材料が存在する部分の面積の割合を意味する。
また、前記厚み方向における前記存在比率の最大値と最小値との差は、０．０％でもよく、０．１～１０％でもよい。 The “existence ratio of the forming material from the center in the thickness direction to one surface” and “the difference between the maximum value and the minimum value of the existence ratio of the forming material in the thickness direction” may be determined as follows: it can.
That is, cross sections are observed every 100 μm from one surface to the center in the thickness direction, and the abundance ratio of the forming material is measured in each cross section.
Then, the arithmetic mean value of the measured abundance ratio of the forming material is taken as "the abundance ratio of the forming material from the central portion in the thickness direction to one surface", and the minimum value is subtracted from the maximum value in the measured abundance ratio of the forming material This value is taken as "the difference between the maximum value and the minimum value of the abundance ratio of the forming material in the thickness direction".
In addition, the abundance ratio of the forming material in each cross section means the ratio of the area of the portion in which the forming material exists when the entire area of the portion to be observed is 100% in the portion to be observed in each cross section.
Further, the difference between the maximum value and the minimum value of the abundance ratio in the thickness direction may be 0.0% or 0.1 to 10%.
前記測定では、ＣＴ－ｓｃａｎにより研磨布を撮影する。
具体的には、研磨布の一方の表面から厚み方向中央部まで１００μｍごとに断面の画像を取得する。そして、断面の画像において、空隙と空隙以外の部分（形成材料が存在する部分）とに分類する二値化処理をすることにより、各断面における前記形成材料の存在比率（面積比率）を測定する。
ＣＴ装置としては、ヤマト科学株式会社製の三次元計測Ｘ線ＣＴ装置（ＴＤＭ１０００Ｈ－１）を用いることができる。
また、ＣＴ画像処理ソフトとしては、ボリュームグラフィックス株式会社製の画像処理ソフトＶＧＳｔｕｄｉｏ Ｍａｘ ２．１を用いることができる。
さらに、形成材料の存在比率（面積比率）を算出する画像解析ソフトとしては、三谷商事株式会社製のＷｉｎＲｏｏｆを用いることができる。
観察する各断面の面積は、１，３００μｍ×１，３００μｍとすることができる。 In the measurement, the polishing cloth is photographed by CT-scan.
Specifically, an image of a cross section is acquired every 100 μm from one surface of the polishing cloth to the center in the thickness direction. Then, in the image of the cross section, the existence ratio (area ratio) of the forming material in each cross section is measured by performing a binarization process of classifying into a void and a portion other than the void (a portion where the forming material exists). .
As a CT apparatus, a three-dimensional measurement X-ray CT apparatus (TDM1000H-1) manufactured by Yamato Scientific Co., Ltd. can be used.
Moreover, as CT image processing software, image processing software VGStudio Max 2.1 manufactured by Volume Graphics, Inc. can be used.
Furthermore, WinRoof manufactured by Mitani Corporation can be used as image analysis software for calculating the existing ratio (area ratio) of the forming material.
The area of each cross section to be observed can be 1,300 μm × 1,300 μm.
具体的には、研磨布の一方の表面から厚み方向中央部まで１００μｍごとに断面の画像を取得する。そして、断面の画像において、空隙と空隙以外の部分（形成材料が存在する部分）とに分類する二値化処理をすることにより、各断面における前記形成材料の存在比率（面積比率）を測定する。
ＣＴ装置としては、ヤマト科学株式会社製の三次元計測Ｘ線ＣＴ装置（ＴＤＭ１０００Ｈ－１）を用いることができる。
また、ＣＴ画像処理ソフトとしては、ボリュームグラフィックス株式会社製の画像処理ソフトＶＧＳｔｕｄｉｏ Ｍａｘ ２．１を用いることができる。
さらに、形成材料の存在比率（面積比率）を算出する画像解析ソフトとしては、三谷商事株式会社製のＷｉｎＲｏｏｆを用いることができる。
観察する各断面の面積は、１，３００μｍ×１，３００μｍとすることができる。 In the measurement, the polishing cloth is photographed by CT-scan.
Specifically, an image of a cross section is acquired every 100 μm from one surface of the polishing cloth to the center in the thickness direction. Then, in the image of the cross section, the existence ratio (area ratio) of the forming material in each cross section is measured by performing a binarization process of classifying into a void and a portion other than the void (a portion where the forming material exists). .
As a CT apparatus, a three-dimensional measurement X-ray CT apparatus (TDM1000H-1) manufactured by Yamato Scientific Co., Ltd. can be used.
Moreover, as CT image processing software, image processing software VGStudio Max 2.1 manufactured by Volume Graphics, Inc. can be used.
Furthermore, WinRoof manufactured by Mitani Corporation can be used as image analysis software for calculating the existing ratio (area ratio) of the forming material.
The area of each cross section to be observed can be 1,300 μm × 1,300 μm.
例えば、以下のような条件で、各断面における前記形成材料の存在比率（面積比率）を測定する。
For example, the abundance ratio (area ratio) of the forming material in each cross section is measured under the following conditions.
前記測定においては、以下の視野の大きさで研磨布の断面を連続測定する。
視野の大きさ（縦×横×高さ） ： ２，０００μｍ × ２，０００μｍ × 厚み方向全域
また、前記測定の条件は、以下の通りである。
１回転あたりのビュー数 : 1500
フレーム数／ビュー : 10
Ｘ線管電圧〔ＫＶ〕 : 25.000
拡大軸位置〔ｍｍ〕 : 10.000
再構成の画素サイズＸ〔ｍｍ〕 : 0.003880
再構成の画素サイズＹ〔ｍｍ〕 : 0.003880
再構成の画素サイズＺ〔ｍｍ〕 : 0.003880 In the measurement, the cross section of the polishing cloth is continuously measured with the following field of view size.
Size of field of view (length × width × height): 2,000 μm × 2,000 μm × thickness direction entire region Further, the conditions of the measurement are as follows.
Number of views per rotation: 1500
Number of frames / view: 10
X-ray tube voltage [KV]: 25.000
Magnification axis position [mm]: 10.000
Pixel size for reconstruction X [mm]: 0.003880
Pixel size for reconstruction Y [mm]: 0.003880
Pixel size for reconstruction Z [mm]: 0.003880
視野の大きさ（縦×横×高さ） ： ２，０００μｍ × ２，０００μｍ × 厚み方向全域
また、前記測定の条件は、以下の通りである。
１回転あたりのビュー数 : 1500
フレーム数／ビュー : 10
Ｘ線管電圧〔ＫＶ〕 : 25.000
拡大軸位置〔ｍｍ〕 : 10.000
再構成の画素サイズＸ〔ｍｍ〕 : 0.003880
再構成の画素サイズＹ〔ｍｍ〕 : 0.003880
再構成の画素サイズＺ〔ｍｍ〕 : 0.003880 In the measurement, the cross section of the polishing cloth is continuously measured with the following field of view size.
Size of field of view (length × width × height): 2,000 μm × 2,000 μm × thickness direction entire region Further, the conditions of the measurement are as follows.
Number of views per rotation: 1500
Number of frames / view: 10
X-ray tube voltage [KV]: 25.000
Magnification axis position [mm]: 10.000
Pixel size for reconstruction X [mm]: 0.003880
Pixel size for reconstruction Y [mm]: 0.003880
Pixel size for reconstruction Z [mm]: 0.003880
前記測定で得られた画像から研磨布の厚み方向中央を定める方法は、以下の通りである。
まず、ＣＴ画像処理ソフト“ＶＧＳｔｕｄｉｏ Ｍａｘ”上において、座標表記機能（ボリューム座標系モード）を用いて、研磨布について、Ｘ軸方向、Ｙ軸方向及びＺ軸方向それぞれの座標値をｍｍ単位で表示する。
次に、レジストレーション機能を用いて、研磨布の厚み方向が、Ｘ、Ｙ、及びＺ軸の何れかの一の方向と一致するように、前記ソフトにおける傾きを調整する。
そして、研磨布の一方の表面の厚み方向の座標値と、他方の表面の厚み方向の座標値とから、厚み方向の座標値の平均値を求めることで、研磨布の厚み方向中央の位置を定める。 The method of determining the thickness direction center of the polishing cloth from the image obtained by the measurement is as follows.
First, on the CT image processing software "VGStudio Max", using the coordinate description function (volume coordinate system mode), the coordinate values in the X-axis direction, Y-axis direction and Z-axis direction are displayed in mm units for the polishing cloth Do.
Next, using the registration function, the inclination in the software is adjusted so that the thickness direction of the polishing pad coincides with one of the X, Y, and Z axes.
Then, from the coordinate value in the thickness direction of one surface of the polishing cloth and the coordinate value in the thickness direction of the other surface, the average value of the coordinate values in the thickness direction is obtained to obtain the central position in the thickness direction of the polishing cloth. Determined.
まず、ＣＴ画像処理ソフト“ＶＧＳｔｕｄｉｏ Ｍａｘ”上において、座標表記機能（ボリューム座標系モード）を用いて、研磨布について、Ｘ軸方向、Ｙ軸方向及びＺ軸方向それぞれの座標値をｍｍ単位で表示する。
次に、レジストレーション機能を用いて、研磨布の厚み方向が、Ｘ、Ｙ、及びＺ軸の何れかの一の方向と一致するように、前記ソフトにおける傾きを調整する。
そして、研磨布の一方の表面の厚み方向の座標値と、他方の表面の厚み方向の座標値とから、厚み方向の座標値の平均値を求めることで、研磨布の厚み方向中央の位置を定める。 The method of determining the thickness direction center of the polishing cloth from the image obtained by the measurement is as follows.
First, on the CT image processing software "VGStudio Max", using the coordinate description function (volume coordinate system mode), the coordinate values in the X-axis direction, Y-axis direction and Z-axis direction are displayed in mm units for the polishing cloth Do.
Next, using the registration function, the inclination in the software is adjusted so that the thickness direction of the polishing pad coincides with one of the X, Y, and Z axes.
Then, from the coordinate value in the thickness direction of one surface of the polishing cloth and the coordinate value in the thickness direction of the other surface, the average value of the coordinate values in the thickness direction is obtained to obtain the central position in the thickness direction of the polishing cloth. Determined.
断面の画像において、空隙と空隙以外の部分（形成材料が存在する部分）とに分類する二値化処理は、以下の通りである。
二値化処理では、ＶＧＳｔｕｄｉｏ Ｍａｘで、空隙と空隙以外の部分（形成材料が存在する部分）とに分類するために、断面の画像に関して、コントラストの調整を行う。
コントラストの調整は、Ｒａｍｐモードで行う。
コントラストの調整では、空隙と空隙以外の部分（形成材料が存在する部分）との違いが明確になるようにする。
ＶＧＳｔｕｄｉｏ Ｍａｘでは、コントラストの調整が“不透明度調整”と表記されている。
具体的には、ＶＧＳｔｕｄｉｏ Ｍａｘの不透明度調整の画面において、グレイバリューの下限値をピークに設定し、次にグレイバリューの上限値を「該ピークのピーク値＋１００±５」の範囲に設定する。なお、材料によって光の透過率が異なるので、コントラストの調整範囲は必ずしもこの限りではない。 In the image of the cross section, the binarization process of classifying into the void and the part other than the void (the part where the forming material exists) is as follows.
In the binarization process, contrast adjustment is performed on the image of the cross section in order to classify into the void and the portion other than the void (the portion where the forming material exists) in VGStudio Max.
Contrast adjustment is performed in Ramp mode.
In contrast adjustment, the difference between the void and the portion other than the void (the portion where the forming material is present) is made clear.
In VGStudio Max, contrast adjustment is described as "opacity adjustment".
Specifically, in the opacity adjustment screen of VG Studio Max, the lower limit value of the gray value is set to the peak, and then the upper limit value of the gray value is set to the range of “peak value of the peak + 100 ± 5”. The adjustment range of the contrast is not necessarily limited because the light transmittance varies depending on the material.
二値化処理では、ＶＧＳｔｕｄｉｏ Ｍａｘで、空隙と空隙以外の部分（形成材料が存在する部分）とに分類するために、断面の画像に関して、コントラストの調整を行う。
コントラストの調整は、Ｒａｍｐモードで行う。
コントラストの調整では、空隙と空隙以外の部分（形成材料が存在する部分）との違いが明確になるようにする。
ＶＧＳｔｕｄｉｏ Ｍａｘでは、コントラストの調整が“不透明度調整”と表記されている。
具体的には、ＶＧＳｔｕｄｉｏ Ｍａｘの不透明度調整の画面において、グレイバリューの下限値をピークに設定し、次にグレイバリューの上限値を「該ピークのピーク値＋１００±５」の範囲に設定する。なお、材料によって光の透過率が異なるので、コントラストの調整範囲は必ずしもこの限りではない。 In the image of the cross section, the binarization process of classifying into the void and the part other than the void (the part where the forming material exists) is as follows.
In the binarization process, contrast adjustment is performed on the image of the cross section in order to classify into the void and the portion other than the void (the portion where the forming material exists) in VGStudio Max.
Contrast adjustment is performed in Ramp mode.
In contrast adjustment, the difference between the void and the portion other than the void (the portion where the forming material is present) is made clear.
In VGStudio Max, contrast adjustment is described as "opacity adjustment".
Specifically, in the opacity adjustment screen of VG Studio Max, the lower limit value of the gray value is set to the peak, and then the upper limit value of the gray value is set to the range of “peak value of the peak + 100 ± 5”. The adjustment range of the contrast is not necessarily limited because the light transmittance varies depending on the material.
前記コントラストの調整をした２Ｄ画像に対し、研磨布の一方の表面から厚み方向中央部まで１００μｍごとに断面の画像を取得する。
With respect to the 2D image whose contrast has been adjusted, an image of a cross section is acquired every 100 μm from one surface of the polishing pad to the central portion in the thickness direction.
次に、前記取得した１００μｍごとの断面の画像について、ＷｉｎＲｏｏｆで材料存在率を測定する。
ＷｉｎＲｏｏｆにおける測定範囲を「１，３００μｍ×１，３００μｍ」とし、「各断面における観察する部分において、観察する部分の面積全体を１００％としたときにおける、形成材料が存在する部分の面積の割合」を、「各断面における形成材料の存在比率」とする。
なお、ＷｉｎＲｏｏｆにおける二値化処理では、階調範囲が“１２７”～“２５５”の範囲となる部分を、空隙以外の部分（形成材料が存在する部分）とする。 Next, the material abundance ratio is measured by WinRoof about the acquired image of the cross section every 100 μm.
Assuming that the measurement range in WinRoof is “1,300 μm × 1,300 μm”, “the ratio of the area of the portion where the forming material exists when the entire area of the portion to be observed is 100% in the observation portion in each cross section” The “presence ratio of the forming material in each cross section” is
In the binarization process in WinRoof, a portion where the gradation range is in the range of “127” to “255” is a portion other than the void (a portion where the forming material exists).
ＷｉｎＲｏｏｆにおける測定範囲を「１，３００μｍ×１，３００μｍ」とし、「各断面における観察する部分において、観察する部分の面積全体を１００％としたときにおける、形成材料が存在する部分の面積の割合」を、「各断面における形成材料の存在比率」とする。
なお、ＷｉｎＲｏｏｆにおける二値化処理では、階調範囲が“１２７”～“２５５”の範囲となる部分を、空隙以外の部分（形成材料が存在する部分）とする。 Next, the material abundance ratio is measured by WinRoof about the acquired image of the cross section every 100 μm.
Assuming that the measurement range in WinRoof is “1,300 μm × 1,300 μm”, “the ratio of the area of the portion where the forming material exists when the entire area of the portion to be observed is 100% in the observation portion in each cross section” The “presence ratio of the forming material in each cross section” is
In the binarization process in WinRoof, a portion where the gradation range is in the range of “127” to “255” is a portion other than the void (a portion where the forming material exists).
なお、存在比率については、一方の面について述べたが、他方の面についても、一方の面と同様な存在比率となっていることが好ましい。
すなわち、本実施形態に係る研磨布では、厚み方向中央部から他方の表面までの前記形成材料の存在比率が３０～６０％であり、且つ、前記厚み方向における前記存在比率の最大値と最小値との差が１０％以下であることが好ましい。 In addition, about an abundance ratio, although one side was described, it is preferable that it is the same abundance ratio as one surface also about the other side.
That is, in the polishing pad according to the present embodiment, the abundance ratio of the forming material from the central portion in the thickness direction to the other surface is 30 to 60%, and the maximum value and the minimum value of the abundance ratio in the thickness direction Is preferably 10% or less.
すなわち、本実施形態に係る研磨布では、厚み方向中央部から他方の表面までの前記形成材料の存在比率が３０～６０％であり、且つ、前記厚み方向における前記存在比率の最大値と最小値との差が１０％以下であることが好ましい。 In addition, about an abundance ratio, although one side was described, it is preferable that it is the same abundance ratio as one surface also about the other side.
That is, in the polishing pad according to the present embodiment, the abundance ratio of the forming material from the central portion in the thickness direction to the other surface is 30 to 60%, and the maximum value and the minimum value of the abundance ratio in the thickness direction Is preferably 10% or less.
本実施形態に係る研磨布のＡｓｋｅｒ－Ｃ硬度は、好ましくは８０以上、より好ましくは８５～９５である。
本実施形態に係る研磨布は、Ａｓｋｅｒ－Ｃ硬度が８０以上であることにより、被研磨物（例えば、ウェハ等）の端部ダレを抑制できるという利点を有する。また、本実施形態に係る研磨布は、Ａｓｋｅｒ－Ｃ硬度が９５以下であることにより、被研磨物の欠陥（例えば、傷など）を抑制できるという利点を有する。
なお、Ａｓｋｅｒ－Ｃ硬度は、ＳＲＩＳ０１０１（日本ゴム協会標準規格）の規定に従って測定した値を意味する。また、Ａｓｋｅｒ－Ｃ硬度は、前記一方の表面で測定する。言い換えれば、Ａｓｋｅｒ－Ｃ硬度は、研磨面で測定する。 The Asker-C hardness of the polishing pad according to this embodiment is preferably 80 or more, and more preferably 85 to 95.
The polishing cloth according to the present embodiment has an advantage that edge sag of an object to be polished (for example, a wafer etc.) can be suppressed by having an Asker-C hardness of 80 or more. In addition, the abrasive cloth according to the present embodiment has an advantage that defects (for example, scratches and the like) of an object to be polished can be suppressed by the Asker-C hardness being 95 or less.
Asker-C hardness means a value measured according to the definition of SRIS 0101 (Japan Rubber Association Standard). Also, the Asker-C hardness is measured on the one surface. In other words, Asker-C hardness is measured on the polished surface.
本実施形態に係る研磨布は、Ａｓｋｅｒ－Ｃ硬度が８０以上であることにより、被研磨物（例えば、ウェハ等）の端部ダレを抑制できるという利点を有する。また、本実施形態に係る研磨布は、Ａｓｋｅｒ－Ｃ硬度が９５以下であることにより、被研磨物の欠陥（例えば、傷など）を抑制できるという利点を有する。
なお、Ａｓｋｅｒ－Ｃ硬度は、ＳＲＩＳ０１０１（日本ゴム協会標準規格）の規定に従って測定した値を意味する。また、Ａｓｋｅｒ－Ｃ硬度は、前記一方の表面で測定する。言い換えれば、Ａｓｋｅｒ－Ｃ硬度は、研磨面で測定する。 The Asker-C hardness of the polishing pad according to this embodiment is preferably 80 or more, and more preferably 85 to 95.
The polishing cloth according to the present embodiment has an advantage that edge sag of an object to be polished (for example, a wafer etc.) can be suppressed by having an Asker-C hardness of 80 or more. In addition, the abrasive cloth according to the present embodiment has an advantage that defects (for example, scratches and the like) of an object to be polished can be suppressed by the Asker-C hardness being 95 or less.
Asker-C hardness means a value measured according to the definition of SRIS 0101 (Japan Rubber Association Standard). Also, the Asker-C hardness is measured on the one surface. In other words, Asker-C hardness is measured on the polished surface.
本実施形態に係る研磨布の厚みは、好ましくは０．８～２．０ｍｍ、より好ましくは１．０～１．５ｍｍである。
本実施形態に係る研磨布は、厚みが０．８ｍｍ以上であることにより、研磨機の定盤の状態による研磨性能への悪影響を緩和しやすくなるという利点を有する。また、これにより、例えば、被研磨物を安定的に平坦にしやすくなるという利点もある。
また、本実施形態に係る研磨布は、厚みが２．０ｍｍ以下であることにより、研磨時の研磨布の変形量を少なくでき、その結果、被研磨物の端部ダレを抑制できるという利点を有する。 The thickness of the polishing pad according to the present embodiment is preferably 0.8 to 2.0 mm, more preferably 1.0 to 1.5 mm.
The polishing cloth which concerns on this embodiment has the advantage that it becomes easy to relieve the bad influence on the polishing performance by the state of the surface plate of a polisher because thickness is 0.8 mm or more. This also has the advantage that, for example, the object to be polished can be stably and easily flattened.
In addition, the polishing cloth according to the present embodiment has a thickness of 2.0 mm or less, so that the amount of deformation of the polishing cloth at the time of polishing can be reduced. Have.
本実施形態に係る研磨布は、厚みが０．８ｍｍ以上であることにより、研磨機の定盤の状態による研磨性能への悪影響を緩和しやすくなるという利点を有する。また、これにより、例えば、被研磨物を安定的に平坦にしやすくなるという利点もある。
また、本実施形態に係る研磨布は、厚みが２．０ｍｍ以下であることにより、研磨時の研磨布の変形量を少なくでき、その結果、被研磨物の端部ダレを抑制できるという利点を有する。 The thickness of the polishing pad according to the present embodiment is preferably 0.8 to 2.0 mm, more preferably 1.0 to 1.5 mm.
The polishing cloth which concerns on this embodiment has the advantage that it becomes easy to relieve the bad influence on the polishing performance by the state of the surface plate of a polisher because thickness is 0.8 mm or more. This also has the advantage that, for example, the object to be polished can be stably and easily flattened.
In addition, the polishing cloth according to the present embodiment has a thickness of 2.0 mm or less, so that the amount of deformation of the polishing cloth at the time of polishing can be reduced. Have.
前記不織布を構成する繊維としては、ポリエステル繊維、ナイロン繊維などが挙げられる。
前記不織布の目付けは、好ましくは２００～６００ｇ／ｍ２である。
本実施形態に係る研磨布は、不織布の目付けが２００ｇ／ｍ２以上であることにより、硬度が高くなりやすくなり、その結果、被研磨物の端部ダレを抑制できるという利点を有する。また、本実施形態に係る研磨布は、不織布の目付けが２００～６００ｇ／ｍ２であることにより、研磨面に空隙部分を適度な割合で有しやすくなる。その結果、本実施形態に係る研磨布は、斯かる構成により、研磨屑等による空隙の目詰まりによって研磨性能が変動するのを、抑制しやすくなるといった利点を有する。 Examples of fibers constituting the non-woven fabric include polyester fibers and nylon fibers.
The basis weight of the non-woven fabric is preferably 200 to 600 g / m 2 .
The polishing cloth according to the present embodiment has an advantage that the hardness tends to be high when the basis weight of the non-woven fabric is 200 g / m 2 or more, and as a result, it is possible to suppress edge sagging of the object to be polished. In addition, the polishing cloth according to the present embodiment can easily have void portions at an appropriate ratio on the polishing surface because the basis weight of the non-woven fabric is 200 to 600 g / m 2 . As a result, the polishing pad according to the present embodiment has such an advantage that it is easy to suppress variation in polishing performance due to clogging of voids due to polishing debris or the like.
前記不織布の目付けは、好ましくは２００～６００ｇ／ｍ２である。
本実施形態に係る研磨布は、不織布の目付けが２００ｇ／ｍ２以上であることにより、硬度が高くなりやすくなり、その結果、被研磨物の端部ダレを抑制できるという利点を有する。また、本実施形態に係る研磨布は、不織布の目付けが２００～６００ｇ／ｍ２であることにより、研磨面に空隙部分を適度な割合で有しやすくなる。その結果、本実施形態に係る研磨布は、斯かる構成により、研磨屑等による空隙の目詰まりによって研磨性能が変動するのを、抑制しやすくなるといった利点を有する。 Examples of fibers constituting the non-woven fabric include polyester fibers and nylon fibers.
The basis weight of the non-woven fabric is preferably 200 to 600 g / m 2 .
The polishing cloth according to the present embodiment has an advantage that the hardness tends to be high when the basis weight of the non-woven fabric is 200 g / m 2 or more, and as a result, it is possible to suppress edge sagging of the object to be polished. In addition, the polishing cloth according to the present embodiment can easily have void portions at an appropriate ratio on the polishing surface because the basis weight of the non-woven fabric is 200 to 600 g / m 2 . As a result, the polishing pad according to the present embodiment has such an advantage that it is easy to suppress variation in polishing performance due to clogging of voids due to polishing debris or the like.
前記樹脂としては、ウレタン樹脂等が挙げられる。
Urethane resin etc. are mentioned as said resin.
本実施形態に係る研磨布で研磨する被研磨物としては、シリコンウェハなどが挙げられる。
A silicon wafer etc. are mentioned as a thing to be grind | polished with the abrasive cloth which concerns on this embodiment.
本実施形態に係る研磨布は、上記の如く構成されているが、次に、本実施形態に係る研磨布の製造方法について説明する。
The polishing pad according to the present embodiment is configured as described above. Next, a method of manufacturing the polishing pad according to the present embodiment will be described.
以下、本実施形態に係る研磨布の製造方法について、ウレタン樹脂を不織布に湿式含浸し、更に、ウレタン樹脂を不織布に乾式含浸するといった二段階含浸処理を行う方法を例に挙げて説明する。
Hereinafter, the method for producing a polishing cloth according to the present embodiment will be described by taking, as an example, a method of performing a two-step impregnation process of wet impregnating a urethane resin into nonwoven fabric and dry impregnating a urethane resin into nonwoven fabric.
湿式含浸では、ウレタン樹脂を水溶性有機溶媒に溶解させて第１の含浸液を得る。
水溶性有機溶媒としては、ジメチルホルムアミド、ジメチルスルホキシド、テトラヒドロフラン、ジメチルアセトアミドなどが挙げられる。
なお、第１の含浸液は、充填剤を含有してもよい。該充填剤としてはカーボンブラック等が挙げられる。また、第１の含浸液は、分散安定剤を含有してもよい。該分散安定剤としては、界面活性剤等が挙げられる。
次に、第１の含浸液に不織布を漬け、第１の含浸液に漬けた不織布を水に漬ける。これにより、不織布に付着した第１の含浸液のうち水溶性有機溶媒が水に置換されて、ウレタン樹脂が凝固し、不織布の表面でウレタン樹脂が付着する。 In wet impregnation, a urethane resin is dissolved in a water-soluble organic solvent to obtain a first impregnation solution.
Examples of the water-soluble organic solvent include dimethylformamide, dimethylsulfoxide, tetrahydrofuran, dimethylacetamide and the like.
The first impregnating solution may contain a filler. Examples of the filler include carbon black and the like. The first impregnating solution may also contain a dispersion stabilizer. The dispersion stabilizer may, for example, be a surfactant.
Next, the non-woven fabric is dipped in the first impregnation solution, and the non-woven fabric dipped in the first impregnation solution is dipped in water. Thus, the water-soluble organic solvent in the first impregnating solution attached to the non-woven fabric is replaced with water, the urethane resin coagulates, and the urethane resin adheres on the surface of the non-woven fabric.
水溶性有機溶媒としては、ジメチルホルムアミド、ジメチルスルホキシド、テトラヒドロフラン、ジメチルアセトアミドなどが挙げられる。
なお、第１の含浸液は、充填剤を含有してもよい。該充填剤としてはカーボンブラック等が挙げられる。また、第１の含浸液は、分散安定剤を含有してもよい。該分散安定剤としては、界面活性剤等が挙げられる。
次に、第１の含浸液に不織布を漬け、第１の含浸液に漬けた不織布を水に漬ける。これにより、不織布に付着した第１の含浸液のうち水溶性有機溶媒が水に置換されて、ウレタン樹脂が凝固し、不織布の表面でウレタン樹脂が付着する。 In wet impregnation, a urethane resin is dissolved in a water-soluble organic solvent to obtain a first impregnation solution.
Examples of the water-soluble organic solvent include dimethylformamide, dimethylsulfoxide, tetrahydrofuran, dimethylacetamide and the like.
The first impregnating solution may contain a filler. Examples of the filler include carbon black and the like. The first impregnating solution may also contain a dispersion stabilizer. The dispersion stabilizer may, for example, be a surfactant.
Next, the non-woven fabric is dipped in the first impregnation solution, and the non-woven fabric dipped in the first impregnation solution is dipped in water. Thus, the water-soluble organic solvent in the first impregnating solution attached to the non-woven fabric is replaced with water, the urethane resin coagulates, and the urethane resin adheres on the surface of the non-woven fabric.
乾式含浸では、末端基としてイソシアネート基を有するプレポリマーと、活性水素を有する有機化合物たる硬化剤と、有機溶媒とを混合して、第２の含浸液を得る。
前記有機溶媒としては、メチルエチルケトン、アセトン、アルコール、酢酸エチルなどが挙げられる。
そして、湿式含浸した不織布を第２の含浸液に漬け、第２の含浸液に漬けた不織布を乾燥炉で加熱する。これにより、有機溶媒が蒸発され、プレポリマーと硬化剤とが硬化反応してウレタン樹脂が形成され、その結果、不織布の表面にさらなるウレタン樹脂が付着する。 In dry impregnation, a prepolymer having an isocyanate group as an end group, a curing agent which is an organic compound having active hydrogen, and an organic solvent are mixed to obtain a second impregnating solution.
Examples of the organic solvent include methyl ethyl ketone, acetone, alcohol and ethyl acetate.
Then, the wet-impregnated non-woven fabric is dipped in a second impregnating solution, and the non-woven fabric dipped in the second impregnating solution is heated in a drying furnace. As a result, the organic solvent is evaporated, and the prepolymer and the curing agent cure to form a urethane resin. As a result, the additional urethane resin adheres to the surface of the non-woven fabric.
前記有機溶媒としては、メチルエチルケトン、アセトン、アルコール、酢酸エチルなどが挙げられる。
そして、湿式含浸した不織布を第２の含浸液に漬け、第２の含浸液に漬けた不織布を乾燥炉で加熱する。これにより、有機溶媒が蒸発され、プレポリマーと硬化剤とが硬化反応してウレタン樹脂が形成され、その結果、不織布の表面にさらなるウレタン樹脂が付着する。 In dry impregnation, a prepolymer having an isocyanate group as an end group, a curing agent which is an organic compound having active hydrogen, and an organic solvent are mixed to obtain a second impregnating solution.
Examples of the organic solvent include methyl ethyl ketone, acetone, alcohol and ethyl acetate.
Then, the wet-impregnated non-woven fabric is dipped in a second impregnating solution, and the non-woven fabric dipped in the second impregnating solution is heated in a drying furnace. As a result, the organic solvent is evaporated, and the prepolymer and the curing agent cure to form a urethane resin. As a result, the additional urethane resin adheres to the surface of the non-woven fabric.
本実施形態に係る研磨布は、上記のように構成されているので、以下の利点を有するものである。
Since the polishing pad according to the present embodiment is configured as described above, it has the following advantages.
即ち、本実施形態に係る研磨布は、形成材料として、不織布と、該不織布に含浸された樹脂とを備えた研磨布である。また、本実施形態に係る研磨布は、厚み方向中央部から一方の表面までの前記形成材料の存在比率が３０～６０％であり、且つ、前記厚み方向における前記存在比率の最大値と最小値との差が１０％以下である。
That is, the polishing pad according to the present embodiment is a polishing pad provided with a non-woven fabric and a resin impregnated in the non-woven fabric as a forming material. Further, in the polishing pad according to the present embodiment, the abundance ratio of the forming material from the center in the thickness direction to one surface is 30 to 60%, and the maximum value and the minimum value of the abundance ratio in the thickness direction And 10% or less.
斯かる研磨布は、前記厚み方向中央部から一方の表面までの前記形成材料の存在比率が６０％以下であることにより、空隙を多く有することになるので、削り屑が多少空隙に詰まっても、研磨レートの低下が抑制される。
また、研磨布は、製法上、厚み方向中央部から表面にかけて、形成材料の存在比率が大きくなるが、本実施形態に係る研磨布は、前記厚み方向における前記存在比率の最大値と最小値との差が１０％以下であることにより、研磨布の表面に空隙が多く存在しやすくなり、その結果、削り屑が多少空隙に詰まっても、研磨レートの低下が抑制される。さらに、斯かる研磨布は、斯かる構成により、厚み方向中央部から一方の表面にかけて前記存在比率の変化が小さくなり、ドレスされても、研磨レートの変化が抑制される。
さらに、斯かる研磨布は、前記厚み方向中央部から一方の表面までの前記形成材料の存在比率が３０％以上であることにより、材料が存在する箇所が多くなり、硬度が高いものとなり、その結果、端部ダレを抑制できる。
以上より、本実施形態によれば、目詰まり及び端部ダレを抑制できる研磨布を提供し得る。 Such a polishing cloth has many voids due to the existence ratio of the forming material from the center in the thickness direction to one surface being 60% or less, even if shavings are slightly clogged And the reduction of the polishing rate is suppressed.
Further, in the polishing cloth, the proportion of the forming material increases from the center in the thickness direction to the surface in the manufacturing method, but in the polishing cloth according to the present embodiment, the maximum value and the minimum value of the proportion in the thickness direction When the difference of is 10% or less, a large number of voids are easily present on the surface of the polishing pad, and as a result, even if shavings are slightly clogged in the voids, the reduction of the polishing rate is suppressed. Furthermore, with such a configuration, such a polishing cloth reduces the change in the abundance ratio from the central portion in the thickness direction to one surface, and even if it is dressed, the change in the polishing rate is suppressed.
Furthermore, such a polishing cloth has an abundance ratio of the forming material of 30% or more from the central portion in the thickness direction to one surface, so the number of places where the material is present increases and the hardness becomes high. As a result, edge drop can be suppressed.
As mentioned above, according to this embodiment, the abrasive cloth which can control clogging and end drooping can be provided.
また、研磨布は、製法上、厚み方向中央部から表面にかけて、形成材料の存在比率が大きくなるが、本実施形態に係る研磨布は、前記厚み方向における前記存在比率の最大値と最小値との差が１０％以下であることにより、研磨布の表面に空隙が多く存在しやすくなり、その結果、削り屑が多少空隙に詰まっても、研磨レートの低下が抑制される。さらに、斯かる研磨布は、斯かる構成により、厚み方向中央部から一方の表面にかけて前記存在比率の変化が小さくなり、ドレスされても、研磨レートの変化が抑制される。
さらに、斯かる研磨布は、前記厚み方向中央部から一方の表面までの前記形成材料の存在比率が３０％以上であることにより、材料が存在する箇所が多くなり、硬度が高いものとなり、その結果、端部ダレを抑制できる。
以上より、本実施形態によれば、目詰まり及び端部ダレを抑制できる研磨布を提供し得る。 Such a polishing cloth has many voids due to the existence ratio of the forming material from the center in the thickness direction to one surface being 60% or less, even if shavings are slightly clogged And the reduction of the polishing rate is suppressed.
Further, in the polishing cloth, the proportion of the forming material increases from the center in the thickness direction to the surface in the manufacturing method, but in the polishing cloth according to the present embodiment, the maximum value and the minimum value of the proportion in the thickness direction When the difference of is 10% or less, a large number of voids are easily present on the surface of the polishing pad, and as a result, even if shavings are slightly clogged in the voids, the reduction of the polishing rate is suppressed. Furthermore, with such a configuration, such a polishing cloth reduces the change in the abundance ratio from the central portion in the thickness direction to one surface, and even if it is dressed, the change in the polishing rate is suppressed.
Furthermore, such a polishing cloth has an abundance ratio of the forming material of 30% or more from the central portion in the thickness direction to one surface, so the number of places where the material is present increases and the hardness becomes high. As a result, edge drop can be suppressed.
As mentioned above, according to this embodiment, the abrasive cloth which can control clogging and end drooping can be provided.
なお、本発明に係る研磨布は、上記実施形態に限定されるものではない。また、本発明に係る研磨布は、上記した作用効果に限定されるものでもない。本発明に係る研磨布は、本発明の要旨を逸脱しない範囲で種々の変更が可能である。
The polishing pad according to the present invention is not limited to the above embodiment. Further, the polishing pad according to the present invention is not limited to the above-described effects. The polishing pad according to the present invention can be variously modified without departing from the scope of the present invention.
例えば、本実施形態では、二段階含浸処理を行う方法で研磨布を得ているが、湿式含浸或いは乾式含浸のみで研磨布を得てもよい。
For example, in the present embodiment, the polishing cloth is obtained by the method of performing the two-stage impregnation process, but the polishing cloth may be obtained only by wet impregnation or dry impregnation.
次に、実施例および比較例を挙げて本発明についてさらに具体的に説明する。
Next, the present invention will be more specifically described by way of examples and comparative examples.
図１及び表１に示す形成材料の存在比率となっており、表２に示す物性を示す実施例１、２の研磨布を作製した。また、図１及び表１に示す形成材料の存在比率となっており、表２に示す物性を示す比較例１の研磨布（市販品）を用意した。
なお、形成材料の存在比率、及び、硬度は上述した方法で測定した。
また、図１の「表面」は、「一方の表面（後述する研磨面）」を意味する。また、実施例及び比較例の研磨布の形成材料の存在比率の測定では、一方の表面から厚み方向中央部まで１００μｍごとに断面観察したところ、一方の表面からの厚み６００μｍまで観察することになった。
さらに、表１の「厚み１００μｍから厚み６００μｍまでにおける形成材料の存在比率の平均値」は、「厚み方向中央部から一方の表面までの形成材料の存在比率」を意味し、表１の「厚み１００μｍから厚み６００μｍまでにおける形成材料の存在比率の最大値と最小値との差」は、「厚み方向における形成材料の存在比率の最大値と最小値との差」を意味する。
また、圧縮率及び圧縮弾性率は、ＪＩＳ Ｌ１０９６：２０１０に記載の方法で測定した。
また、通気抵抗値（ＡＰＲ）は、図２に示す装置を用い、空気を研磨布の厚み方向に通過させた際（空気の流量：３０Ｌ／ｍｉｎ、空気の圧力：１００Ｐａ）の損失した圧力を意味する。 Abrasive cloths of Examples 1 and 2 were produced which had the proportions of the forming materials shown in FIG. 1 and Table 1 and exhibited the physical properties shown in Table 2. Further, the polishing cloth (commercially available product) of Comparative Example 1 was prepared, which has the proportions of the forming materials shown in FIG. 1 and Table 1 and shows the physical properties shown in Table 2.
In addition, the existing ratio of the forming material and the hardness were measured by the method described above.
Moreover, "surface" of FIG. 1 means "one surface (polished surface mentioned later)". Moreover, in the measurement of the abundance ratio of the forming material of the polishing cloth of the example and the comparative example, when cross-sectional observation is performed every 100 μm from one surface to the central portion in the thickness direction, the thickness of 600 μm from one surface The
Furthermore, “the average value of the abundance ratio of the forming material in thethickness 100 μm to the thickness 600 μm” in Table 1 means “the abundance ratio of the forming material from the central portion in the thickness direction to one surface”; The difference between the maximum value and the minimum value of the abundance ratio of the forming material from 100 μm to a thickness of 600 μm means “the difference between the maximum value and the minimum value of the abundance ratio of the forming material in the thickness direction”.
Moreover, the compression rate and the compression elastic modulus were measured by the method of JIS L1096: 2010.
The air resistance value (APR) is the loss of pressure when air is allowed to pass in the thickness direction of the polishing cloth using the apparatus shown in FIG. 2 (flow rate of air: 30 L / min, pressure of air: 100 Pa). means.
なお、形成材料の存在比率、及び、硬度は上述した方法で測定した。
また、図１の「表面」は、「一方の表面（後述する研磨面）」を意味する。また、実施例及び比較例の研磨布の形成材料の存在比率の測定では、一方の表面から厚み方向中央部まで１００μｍごとに断面観察したところ、一方の表面からの厚み６００μｍまで観察することになった。
さらに、表１の「厚み１００μｍから厚み６００μｍまでにおける形成材料の存在比率の平均値」は、「厚み方向中央部から一方の表面までの形成材料の存在比率」を意味し、表１の「厚み１００μｍから厚み６００μｍまでにおける形成材料の存在比率の最大値と最小値との差」は、「厚み方向における形成材料の存在比率の最大値と最小値との差」を意味する。
また、圧縮率及び圧縮弾性率は、ＪＩＳ Ｌ１０９６：２０１０に記載の方法で測定した。
また、通気抵抗値（ＡＰＲ）は、図２に示す装置を用い、空気を研磨布の厚み方向に通過させた際（空気の流量：３０Ｌ／ｍｉｎ、空気の圧力：１００Ｐａ）の損失した圧力を意味する。 Abrasive cloths of Examples 1 and 2 were produced which had the proportions of the forming materials shown in FIG. 1 and Table 1 and exhibited the physical properties shown in Table 2. Further, the polishing cloth (commercially available product) of Comparative Example 1 was prepared, which has the proportions of the forming materials shown in FIG. 1 and Table 1 and shows the physical properties shown in Table 2.
In addition, the existing ratio of the forming material and the hardness were measured by the method described above.
Moreover, "surface" of FIG. 1 means "one surface (polished surface mentioned later)". Moreover, in the measurement of the abundance ratio of the forming material of the polishing cloth of the example and the comparative example, when cross-sectional observation is performed every 100 μm from one surface to the central portion in the thickness direction, the thickness of 600 μm from one surface The
Furthermore, “the average value of the abundance ratio of the forming material in the
Moreover, the compression rate and the compression elastic modulus were measured by the method of JIS L1096: 2010.
The air resistance value (APR) is the loss of pressure when air is allowed to pass in the thickness direction of the polishing cloth using the apparatus shown in FIG. 2 (flow rate of air: 30 L / min, pressure of air: 100 Pa). means.
実施例及び比較例の研磨布を用いてウェハを研磨した時の研磨レートを測定した。
研磨レートの測定の際の研磨条件を以下に示す。以下の研磨条件で４０分間の研磨を８回実施した。４０分間の研磨ごとに（ランごとに）ウェハの重量を測定し、研磨前のウェハの重量と研磨後のウェハの重量との差から研磨レート（Ｒｅｍｏｖａｌ ｒａｔｅ（ＲＲ））を求めた。結果を図３及び表３に示す。
なお、表３に示す「ＲＲ ｄｒｏｐ ｒａｔｅ」は、Ｒｅｍｏｖａｌ ｒａｔｅ（ＲＲ）の低下率を意味し、下記式で求めた。
ＲＲ ｄｒｏｐ ｒａｔｅ（％） ＝ （ＲＲ最大値－ＲＲ最小値）／ＲＲ最大値 × １００（％）
また、ラン間では、目詰まりを解消させるような処理（例えば、ブラシによる処理）などは行わなかった。
さらに、研磨レートの測定では、前記一方の表面を研磨面とした。
研磨機：Ｓｔｒａｓｂａｕｇｈ ６ＣＡ
ウェハ：８”（Ｐ－）
研磨液：ＮＰ６５０２（ニッタ・ハース株式会社製）を２０倍希釈したもの
研磨液の流量：１００ｍＬ／ｍｉｎ
研磨時間：４０ｍｉｎ／ｒｕｎ
また、実施例１及び比較例１の研磨布の表面及び断面のＳＥＭ画像を図４～７に示す。 The polishing rate was measured when the wafer was polished using the polishing cloths of the example and the comparative example.
The polishing conditions for the measurement of the polishing rate are shown below. Polishing was performed eight times for 40 minutes under the following polishing conditions. The weight of the wafer was measured after each polishing for 40 minutes (per run), and the polishing rate (RR) was determined from the difference between the weight of the wafer before polishing and the weight of the wafer after polishing. The results are shown in FIG. 3 and Table 3.
In addition, "RR drop rate" shown in Table 3 means the decreasing rate of Removal rate (RR), and was calculated | required by the following formula.
RR drop rate (%) = (RR maximum value-RR minimum value) / RR maximum value × 100 (%)
In addition, between the runs, no treatment (for example, treatment with a brush) for eliminating clogging was performed.
Furthermore, in the measurement of the polishing rate, the one surface was used as the polishing surface.
Polishing machine: Strasbaugh 6CA
Wafer: 8 "(P-)
Polishing fluid: 20 times diluted NP6502 (manufactured by Nitta Haas Co., Ltd.) Flow rate of polishing fluid: 100 mL / min
Polishing time: 40 min / run
In addition, SEM images of the surface and the cross section of the polishing cloth of Example 1 and Comparative Example 1 are shown in FIGS.
研磨レートの測定の際の研磨条件を以下に示す。以下の研磨条件で４０分間の研磨を８回実施した。４０分間の研磨ごとに（ランごとに）ウェハの重量を測定し、研磨前のウェハの重量と研磨後のウェハの重量との差から研磨レート（Ｒｅｍｏｖａｌ ｒａｔｅ（ＲＲ））を求めた。結果を図３及び表３に示す。
なお、表３に示す「ＲＲ ｄｒｏｐ ｒａｔｅ」は、Ｒｅｍｏｖａｌ ｒａｔｅ（ＲＲ）の低下率を意味し、下記式で求めた。
ＲＲ ｄｒｏｐ ｒａｔｅ（％） ＝ （ＲＲ最大値－ＲＲ最小値）／ＲＲ最大値 × １００（％）
また、ラン間では、目詰まりを解消させるような処理（例えば、ブラシによる処理）などは行わなかった。
さらに、研磨レートの測定では、前記一方の表面を研磨面とした。
研磨機：Ｓｔｒａｓｂａｕｇｈ ６ＣＡ
ウェハ：８”（Ｐ－）
研磨液：ＮＰ６５０２（ニッタ・ハース株式会社製）を２０倍希釈したもの
研磨液の流量：１００ｍＬ／ｍｉｎ
研磨時間：４０ｍｉｎ／ｒｕｎ
また、実施例１及び比較例１の研磨布の表面及び断面のＳＥＭ画像を図４～７に示す。 The polishing rate was measured when the wafer was polished using the polishing cloths of the example and the comparative example.
The polishing conditions for the measurement of the polishing rate are shown below. Polishing was performed eight times for 40 minutes under the following polishing conditions. The weight of the wafer was measured after each polishing for 40 minutes (per run), and the polishing rate (RR) was determined from the difference between the weight of the wafer before polishing and the weight of the wafer after polishing. The results are shown in FIG. 3 and Table 3.
In addition, "RR drop rate" shown in Table 3 means the decreasing rate of Removal rate (RR), and was calculated | required by the following formula.
RR drop rate (%) = (RR maximum value-RR minimum value) / RR maximum value × 100 (%)
In addition, between the runs, no treatment (for example, treatment with a brush) for eliminating clogging was performed.
Furthermore, in the measurement of the polishing rate, the one surface was used as the polishing surface.
Polishing machine: Strasbaugh 6CA
Wafer: 8 "(P-)
Polishing fluid: 20 times diluted NP6502 (manufactured by Nitta Haas Co., Ltd.) Flow rate of polishing fluid: 100 mL / min
Polishing time: 40 min / run
In addition, SEM images of the surface and the cross section of the polishing cloth of Example 1 and Comparative Example 1 are shown in FIGS.
図３及び表３に示すように、実施例の研磨布では、比較例に比べて研磨レート（ＲＲ）の低下が抑制されていた。
また、表３に示すように、比較例１の研磨布では、「ＲＲ最大値－ＲＲ最小値」が０．５３μｍ／ｍｉｎであったのに対し、実施例１、２の研磨布では、「ＲＲ最大値－ＲＲ最小値」が０．０６μｍ／ｍｉｎ、０．０９μｍ／ｍｉｎとかなり小さい値であった。
さらに、表３に示すように、比較例１の研磨布では、「ＲＲ ｄｒｏｐ ｒａｔｅ」が５９％であったのに対し、実施例１、２の研磨布では、「ＲＲ ｄｒｏｐ ｒａｔｅ」が８％、１１％とかなり小さい値であった。 As shown in FIG. 3 and Table 3, in the polishing pad of the example, the reduction of the polishing rate (RR) was suppressed as compared with the comparative example.
Further, as shown in Table 3, in the polishing cloth of Comparative Example 1, "RR maximum value-RR minimum value" was 0.53 μm / min, while in the polishing cloths of Examples 1 and 2, " “RR maximum value−RR minimum value” was a fairly small value of 0.06 μm / min and 0.09 μm / min.
Furthermore, as shown in Table 3, while the "RR drop rate" was 59% in the polishing cloth of Comparative Example 1, the "RR drop rate" was 8% in the polishing cloths of Examples 1 and 2. , 11% was a fairly small value.
また、表３に示すように、比較例１の研磨布では、「ＲＲ最大値－ＲＲ最小値」が０．５３μｍ／ｍｉｎであったのに対し、実施例１、２の研磨布では、「ＲＲ最大値－ＲＲ最小値」が０．０６μｍ／ｍｉｎ、０．０９μｍ／ｍｉｎとかなり小さい値であった。
さらに、表３に示すように、比較例１の研磨布では、「ＲＲ ｄｒｏｐ ｒａｔｅ」が５９％であったのに対し、実施例１、２の研磨布では、「ＲＲ ｄｒｏｐ ｒａｔｅ」が８％、１１％とかなり小さい値であった。 As shown in FIG. 3 and Table 3, in the polishing pad of the example, the reduction of the polishing rate (RR) was suppressed as compared with the comparative example.
Further, as shown in Table 3, in the polishing cloth of Comparative Example 1, "RR maximum value-RR minimum value" was 0.53 μm / min, while in the polishing cloths of Examples 1 and 2, " “RR maximum value−RR minimum value” was a fairly small value of 0.06 μm / min and 0.09 μm / min.
Furthermore, as shown in Table 3, while the "RR drop rate" was 59% in the polishing cloth of Comparative Example 1, the "RR drop rate" was 8% in the polishing cloths of Examples 1 and 2. , 11% was a fairly small value.
Claims (3)
- 形成材料として、不織布と、該不織布に含浸された樹脂とを備えた研磨布であって、
厚み方向中央部から一方の表面までの前記形成材料の存在比率が３０～６０％であり、且つ、前記厚み方向における前記存在比率の最大値と最小値との差が１０％以下である、研磨布。 An abrasive cloth comprising a non-woven fabric and a resin impregnated in the non-woven fabric as a forming material,
The polishing is performed such that the abundance ratio of the forming material from the thickness direction central portion to one surface is 30 to 60%, and the difference between the maximum value and the minimum value of the abundance ratio in the thickness direction is 10% or less cloth. - 厚みが０．８～２．０ｍｍである、請求項１に記載の研磨布。 The polishing pad according to claim 1, wherein the thickness is 0.8 to 2.0 mm.
- Ａｓｋｅｒ－Ｃ硬度が８０以上である、請求項１又は２に記載の研磨布。 The abrasive cloth of Claim 1 or 2 whose Asker-C hardness is 80 or more.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020197034585A KR102586673B1 (en) | 2017-07-25 | 2018-07-18 | polishing cloth |
| CN201880037093.1A CN110709208A (en) | 2017-07-25 | 2018-07-18 | Abrasive cloth |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017143436A JP6951895B2 (en) | 2017-07-25 | 2017-07-25 | Abrasive cloth |
| JP2017-143436 | 2017-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2019021897A1 true WO2019021897A1 (en) | 2019-01-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2018/026805 WO2019021897A1 (en) | 2017-07-25 | 2018-07-18 | Polishing cloth |
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| Country | Link |
|---|---|
| JP (1) | JP6951895B2 (en) |
| KR (1) | KR102586673B1 (en) |
| CN (1) | CN110709208A (en) |
| TW (1) | TWI775900B (en) |
| WO (1) | WO2019021897A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113047056A (en) * | 2019-12-27 | 2021-06-29 | 霓达杜邦股份有限公司 | Abrasive cloth |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102305796B1 (en) * | 2020-02-05 | 2021-09-28 | 에스케이실트론 주식회사 | Wafer polishing pad, apparatus and manufacturing method thereof |
| JP7481143B2 (en) * | 2020-03-27 | 2024-05-10 | 富士紡ホールディングス株式会社 | Polishing pad, its manufacturing method, and manufacturing method of polished workpiece |
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- 2018-07-18 CN CN201880037093.1A patent/CN110709208A/en active Pending
- 2018-07-18 WO PCT/JP2018/026805 patent/WO2019021897A1/en active Application Filing
- 2018-07-20 TW TW107125084A patent/TWI775900B/en active
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| JP2008207323A (en) * | 2007-02-01 | 2008-09-11 | Kuraray Co Ltd | Polishing pad and manufacturing method for the polishing pad |
| WO2010016486A1 (en) * | 2008-08-08 | 2010-02-11 | 株式会社クラレ | Polishing pad and method for manufacturing the polishing pad |
| JP2011009584A (en) * | 2009-06-26 | 2011-01-13 | Nitta Haas Inc | Polishing pad |
| JP2014139361A (en) * | 2012-12-19 | 2014-07-31 | Kuraray Co Ltd | Composite substrate sheet and method for producing composite substrate sheet |
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| CN113047056A (en) * | 2019-12-27 | 2021-06-29 | 霓达杜邦股份有限公司 | Abrasive cloth |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20200034952A (en) | 2020-04-01 |
| CN110709208A (en) | 2020-01-17 |
| JP2019025549A (en) | 2019-02-21 |
| TWI775900B (en) | 2022-09-01 |
| JP6951895B2 (en) | 2021-10-20 |
| KR102586673B1 (en) | 2023-10-06 |
| TW201908061A (en) | 2019-03-01 |
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