CN113047056A - Abrasive cloth - Google Patents

Abrasive cloth Download PDF

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Publication number
CN113047056A
CN113047056A CN202011536463.1A CN202011536463A CN113047056A CN 113047056 A CN113047056 A CN 113047056A CN 202011536463 A CN202011536463 A CN 202011536463A CN 113047056 A CN113047056 A CN 113047056A
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CN
China
Prior art keywords
polishing
cloth
polishing cloth
nonwoven fabric
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011536463.1A
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Chinese (zh)
Inventor
川端丈
山本惠司
岳田孝司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nida Dupont Co Ltd
Nitta DuPont Inc
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Nida Dupont Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020168649A external-priority patent/JP2021107106A/en
Application filed by Nida Dupont Co Ltd filed Critical Nida Dupont Co Ltd
Publication of CN113047056A publication Critical patent/CN113047056A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06N—WALL, FLOOR, OR LIKE COVERING MATERIALS, e.g. LINOLEUM, OILCLOTH, ARTIFICIAL LEATHER, ROOFING FELT, CONSISTING OF A FIBROUS WEB COATED WITH A LAYER OF MACROMOLECULAR MATERIAL; FLEXIBLE SHEET MATERIAL NOT OTHERWISE PROVIDED FOR
    • D06N3/00—Artificial leather, oilcloth or other material obtained by covering fibrous webs with macromolecular material, e.g. resins, rubber or derivatives thereof
    • D06N3/0002—Artificial leather, oilcloth or other material obtained by covering fibrous webs with macromolecular material, e.g. resins, rubber or derivatives thereof characterised by the substrate
    • D06N3/0011—Artificial leather, oilcloth or other material obtained by covering fibrous webs with macromolecular material, e.g. resins, rubber or derivatives thereof characterised by the substrate using non-woven fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
    • D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
    • D06M15/37—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D06M15/564—Polyureas, polyurethanes or other polymers having ureide or urethane links; Precondensation products forming them
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06N—WALL, FLOOR, OR LIKE COVERING MATERIALS, e.g. LINOLEUM, OILCLOTH, ARTIFICIAL LEATHER, ROOFING FELT, CONSISTING OF A FIBROUS WEB COATED WITH A LAYER OF MACROMOLECULAR MATERIAL; FLEXIBLE SHEET MATERIAL NOT OTHERWISE PROVIDED FOR
    • D06N3/00—Artificial leather, oilcloth or other material obtained by covering fibrous webs with macromolecular material, e.g. resins, rubber or derivatives thereof
    • D06N3/0086—Artificial leather, oilcloth or other material obtained by covering fibrous webs with macromolecular material, e.g. resins, rubber or derivatives thereof characterised by the application technique
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The present invention is an abrasive cloth as a material for forming the abrasive cloth, the abrasive cloth comprising a nonwoven fabric and a resin impregnated in the nonwoven fabric, the abrasive cloth having an apparent density of 0.30 to 0.50g/cm3The standard deviation of the existence ratio of the forming material is 21.7% or less.

Description

Abrasive cloth
Cross reference to related applications
The priority of Japanese patent application No. 2019-.
Technical Field
The present invention relates to an abrasive cloth.
Background
Conventionally, when polishing an object to be polished such as a silicon wafer, a polishing cloth having a nonwoven fabric and a resin impregnated in the nonwoven fabric as a forming material is used (for example, patent document 1).
Here, it is known that, in the polishing cloth, if the flexibility is too high, the end portions may be sagged.
Although the problem of the end portion sagging or the like can be avoided by increasing the amount of resin impregnated to harden the polishing cloth, in this case, the existence ratio of the forming material forming the polishing cloth increases.
When an object to be polished is polished, since a portion (void) where no material is formed becomes a housing space for chips, if the amount of resin impregnated is excessively increased, clogging is likely to occur, and as a result, the polishing rate is likely to be lowered.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2006-43811
Disclosure of Invention
Problems to be solved by the invention
In view of the above problems, an object of the present invention is to provide a polishing cloth which is less likely to have a reduced polishing rate even if the polishing cloth contains a resin in an appropriate amount.
Means for solving the problems
The polishing cloth of the present invention comprises a nonwoven fabric and a resin impregnated in the nonwoven fabric as a material for forming the polishing cloth,
the apparent density of the powder is 0.30 to 0.50g/cm3，
The standard deviation of the existence ratio of the forming material is 21.7% or less.
Drawings
Fig. 1 is a schematic diagram of an apparatus for measuring an aeration resistance value (APR).
FIG. 2 is an arithmetic average of the presence ratio of the forming material in each cross section of the polishing pads of examples 1-1 and 2-1 and comparative example 1-1.
FIG. 3 is an arithmetic average of the presence ratio of the forming material in each cross section of the polishing pads of examples 5-1 and 6-1 and comparative example 2-1.
FIG. 4 shows the polishing rates of the polishing pads of examples 1-1, 2-1, 3 and 4 and comparative example 1-1 when wafers were polished.
FIG. 5 shows the polishing rates of the polishing cloths of examples 5-1 and 6-1 and comparative example 2-1 when wafers were polished.
FIG. 6 shows the reduction rate of the polishing rate when wafers were polished with the polishing cloths of examples 1-1, 2-1, 3 and 4 and comparative example 1-1.
FIG. 7 shows the reduction rate of the polishing rate when wafers were polished with the polishing cloths of examples 5-1 and 6-1 and comparative example 2-1.
FIG. 8 is an SEM image (50X) of the surface of the abrasive cloth of example 1-1.
FIG. 9 is an SEM image (50X) of a cross-section of the abrasive cloth of example 1-1.
FIG. 10 is an SEM image (50X) of the surface of the polishing pad of comparative example 1-1.
FIG. 11 is an SEM image (50X) of a cross section of the polishing cloth of comparative example 1-1.
FIG. 12 is an SEM image (50X) of the surface of the abrasive cloth of example 5-1.
FIG. 13 is an SEM image (50X) of a cross-section of the abrasive cloth of example 5-1.
FIG. 14 is an SEM image (50X) of the surface of the polishing cloth of comparative example 2-1.
FIG. 15 is an SEM image (50X) of a cross section of the polishing cloth of comparative example 2-1.
Detailed Description
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
The polishing pad of the present embodiment includes a nonwoven fabric and a resin impregnated in the nonwoven fabric as a material for forming the polishing pad.
In addition, in the polishing cloth of the present embodiment, it is important that the apparent density is 0.30 to 0.50g/cm3And a standard deviation of a presence ratio of the forming material is 21.7% or less.
In the polishing cloth of the present embodiment, the average value of the presence ratio of the formation material is preferably 22 to 45%, more preferably 30 to 45%, and still more preferably 35 to 45%.
The apparent density is 0.30-0.50 g/cm3Preferably 0.35 to 0.50g/cm3More preferably 0.35 to 0.45g/cm3。
Further, the apparent density can be based on JIS K7222: 2005.
The "average value of the existence ratio of the forming material" and the "standard deviation of the existence ratio of the forming material" can be obtained in the following manner.
That is, two measurement regions of 2000 μm × 2000 μm are imaged on each thin cut plane parallel to the front surface every 100 μm in the thickness direction from the front surface to the back surface of the polishing pad (the two measurement regions do not overlap), 168 small regions of 100 μm × 100 μm are extracted from each measurement region, and the existence ratio of the forming material in each extracted small region of 100 μm × 100 μm is measured.
Then, the arithmetic mean of the measured existence ratios of the formation materials is defined as "the mean of the existence ratios of the formation materials", and the standard deviation of the measured existence ratios of the formation materials is defined as "the standard deviation of the existence ratios of the formation materials".
The presence ratio of the forming material in each small region of 100 μm × 100 μm is a ratio of an area of a portion where the forming material is present in each small region of 100 μm × 100 μm, where the entire area of each small region is defined as 100%.
For example, when 12 thin cut surfaces ranging from 100 μm to 1200 μm in the thickness direction from the front surface to the back surface are observed, the existence ratio of 168 × 12 × 2 small regions of 100 μm × 100 μm of the forming material is measured.
In the measurement, the abrasive cloth was photographed by CT-scan.
Specifically, two measurement regions of 2000 μm × 2000 μm are imaged on each thin cut plane parallel to the front surface at every 100 μm in the thickness direction from the front surface to the back surface of the polishing cloth (the two measurement regions do not overlap), 168 small regions of 100 μm × 100 μm are extracted from each measurement region, and the presence ratio (area ratio) of the formation material in the observation region is measured by performing binarization processing for classifying the images into voids and portions other than the voids (portions where the formation material is present) in the images of the small regions of 100 μm × 100 μm.
As the CT apparatus, a three-dimensional measuring X-ray CT apparatus (TDM 1000H-1) manufactured by Daihe scientific Co., Ltd. can be used.
Further, as the CT image processing software, image processing software VGStudio max2.1 manufactured by Visual Science Volume Graphics, inc.
Further, as image analysis software for calculating the existence ratio (area ratio) of the formation material, ImageJ (Rasband, w.s., u.s.national Institutes of Health, Bethesda, Maryland, USA) can be used.
For example, the existence ratio (area ratio) of the forming material was measured under the following conditions.
In the measurement, the measurement region of the polishing cloth was continuously measured with the following visual field size.
Visual field size (vertical × horizontal × high): 2,000 μm × 2,000 μm × the whole region in the thickness direction
The measurement conditions are as follows.
Number of views per rotation (view): 1500
Frame number/view: 10
X-ray tube voltage [ KV ]: 28.000
Enlarged shaft position [ mm ]: 7.416
Reconstructed pixel size X [ mm ]: 0.003880
Reconstructed pixel size Y [ mm ]: 0.003880
Reconstructed pixel size Z [ mm ]: 0.003880
The binarization process for classifying the measurement regions into voids and other portions (portions where the forming material exists) is as follows.
In the binarization process, since the image processing software VGStudio Max classifies the image into the void and a portion other than the void (a portion where the forming material exists), the contrast of the image of the measurement region is adjusted.
The adjustment of the contrast is performed by Ramp mode.
By adjusting the contrast, the difference between the void and the portion other than the void (portion where the forming material exists) becomes conspicuous.
In VGStudio Max, the adjustment of the contrast is represented as "opacity adjustment".
Specifically, in the screen for opacity adjustment of VGStudio Max, the lower limit value of the gradation value is set as the peak point, and then the upper limit value of the gradation value is set within the range of "peak +100 ± 5" of the peak point. Since the transmittance of light is different depending on the material, the adjustment range of the contrast is not limited to this range.
An image of the measurement region is acquired for the 2D image with the contrast adjusted.
Next, the image processing software ImageJ measures the presence ratio of the forming material with respect to the obtained image of the measurement area.
Here, the measurement range in ImageJ is 1200. mu. m.times.1400. mu.m. The upper left of the image data is set as the (x, y) — position (0pix ), and the horizontal 312pix (═ 1201.2 μm) and vertical 364pix (═ 1401.4 μm) from the (132, 22) position are set as the measurement ranges. Then, the image type is converted from RGB color to 8bit, and the image is binarized. In this binarization condition, the range of the gradation from "129" to "255" corresponds to the portion where the forming material exists. The image size of the image data is reduced to 12pix in horizontal direction by 14pix in vertical direction. The 1pix × 1pix of the reduced image is a small region of 100 μm × 100 μm. This operation was performed every 100 μm in the thickness direction from the front surface to the back surface.
In addition, by the binarization process in ImageJ, a portion having a gradation range of "129" to "255" is formed as a portion other than a void (a portion where a forming material exists).
The compressibility of the polishing cloth of the present embodiment is preferably 5% or less, and more preferably 3.5% or less.
The compression rate can be determined by the following method.
That is, JIS L1096: 2010 compression elasticity tester (area of pressure element: 50mm2) using a pressure element at 300gf/cm2The thickness T1 of the polishing cloth after holding for 60 seconds was measured by pressing the polishing cloth in the thickness direction, and then the pressure was set to 1800gf/cm by a pressing device2Pressure along the thicknessThe thickness T2 of the polishing pad after holding the polishing pad for 60 seconds was measured while applying pressure to the polishing pad, and the compressibility was determined by the following equation.
Compression ratio (T1-T2) × 100/T1
The hardness (Asker-C) of the polishing cloth of the present embodiment is preferably 80 or more, and more preferably 85 to 95.
The polishing cloth of the present embodiment has an advantage that since the hardness is 80 or more, the object to be polished (e.g., a wafer) is less likely to have edge sag. Further, the polishing cloth of the present embodiment has an advantage that since the hardness is 95 or less, a defect (e.g., a flaw or the like) is less likely to occur in the object to be polished.
The hardness is a value measured according to the specification of SRIS0101 (standard specification of the japan rubber association). In addition, the Asker-C hardness was measured on the surface of the one side. In other words, the hardness was measured on the polished surface.
The thickness of the polishing cloth of the present embodiment is preferably 0.8 to 2.0mm, and more preferably 1.0 to 1.5 mm.
The polishing cloth of the present embodiment has an advantage that it is easy to alleviate an adverse effect on polishing performance due to the fixed disk state of the polishing machine because the thickness is 0.8mm or more. In addition, this also has an advantage that, for example, the object to be polished can be easily stabilized and flattened.
Further, the polishing cloth of the present embodiment has a thickness of 2.0mm or less, and thus can reduce the amount of deformation of the polishing cloth during polishing, and as a result, has an advantage that end sagging of the object to be polished is less likely to occur.
Examples of the fibers constituting the nonwoven fabric include polyester fibers and nylon fibers.
The weight per unit area of the non-woven fabric is preferably 200-600 g/m 2.
Since the polishing cloth of the present embodiment has a basis weight of the nonwoven fabric of 200g/m2 or more, the hardness is easily increased, and as a result, the edge roll of the object to be polished is less likely to occur. Further, the polishing cloth of the present embodiment can easily have a void portion at an appropriate ratio on the polishing surface because the nonwoven fabric has a basis weight of 200 to 600g/m 2. As a result, the polishing cloth according to the present embodiment has an advantage that the polishing performance is easily prevented from being changed due to clogging caused by clogging of the pores with polishing dust or the like.
Examples of the resin include a urethane resin.
Examples of the object to be polished by the polishing cloth of the present embodiment include a silicon wafer.
The polishing pad of the present embodiment is configured as described above, and a method for manufacturing the polishing pad of the present embodiment will be described below.
Hereinafter, a method of performing a two-stage impregnation treatment, in which a polyurethane resin is wet-impregnated into a nonwoven fabric and the polyurethane resin is further dry-impregnated into the nonwoven fabric, will be described as an example of a method of manufacturing a polishing cloth according to the present embodiment.
In the wet impregnation, the urethane resin is dissolved in a water-soluble organic solvent to obtain a first impregnation liquid 1.
Examples of the water-soluble organic solvent include dimethylformamide, dimethylsulfoxide, tetrahydrofuran, and dimethylacetamide.
The first impregnation liquid 1 may further contain a filler. Examples of the filler include carbon black. The first impregnation liquid 1 may further contain a dispersion stabilizer. Examples of the dispersion stabilizer include a surfactant and the like.
Next, the nonwoven fabric was immersed in the 1 st immersion liquid, and the nonwoven fabric immersed in the 1 st immersion liquid was immersed in water. As a result, the water-soluble organic solvent in the 1 st impregnation liquid adhering to the nonwoven fabric is replaced with water, the polyurethane resin solidifies, and the polyurethane resin adheres to the surface of the nonwoven fabric.
In the dry impregnation, a prepolymer having an isocyanate group as a terminal group, a curing agent which is an organic compound having active hydrogen, and an organic solvent are mixed to obtain a 2 nd impregnation liquid.
Examples of the organic solvent include methyl ethyl ketone, acetone, alcohol, and ethyl acetate.
Then, the wet-impregnated nonwoven fabric is immersed in the 2 nd immersion liquid, and the nonwoven fabric immersed in the 2 nd immersion liquid is heated in a drying furnace. As a result, the organic solvent evaporates, the prepolymer and the curing agent undergo a curing reaction to form a polyurethane resin, and as a result, the polyurethane resin further adheres to the surface of the nonwoven fabric.
The polishing cloth of the present embodiment has the following advantages because it is configured as described above.
That is, the polishing cloth of the present embodiment is a polishing cloth having a nonwoven fabric and a resin impregnated in the nonwoven fabric as a forming material. The apparent density of the polishing cloth of the present embodiment is 0.30 to 0.50g/cm3The standard deviation of the existence ratio of the forming material is 21.7% or less.
The apparent density of the abrasive cloth was 0.50g/cm3Since many voids are likely to be contained, even if some voids are clogged with chips, the polishing rate is less likely to decrease.
In the polishing pad of the present embodiment, since the standard deviation of the existence ratio of the formation material is 21.7% or less, the ratio of the voids from the surface to the inside of the polishing pad becomes relatively uniform. Further, the polishing pad is easily connected from the surface of the polishing pad to the inner voids, and as a result, even if some of the voids are clogged with the cutting chips, the polishing rate is hardly lowered.
Further, the apparent density of the polishing cloth was 0.30g/cm3As described above, the portion where the material exists can be increased to form a polishing cloth having high hardness, and as a result, end sagging is less likely to occur.
The polishing pad of the present invention is not limited to the above embodiment. The polishing cloth of the present invention is not limited to the above-described effects. The polishing pad of the present invention can be variously modified within a range not departing from the gist of the present invention.
For example, in the present embodiment, the polishing cloth is obtained by a method of performing two-stage immersion treatment, but the polishing cloth may be obtained by only wet immersion or dry immersion.
[ examples ] A method for producing a compound
The present invention will be described in more detail with reference to examples and comparative examples.
Abrasive cloths of examples of the physical properties shown in tables 1 and 2 were produced. Polishing cloths (commercially available products) having physical properties shown in tables 1 and 2 were prepared.
Further, the hardness, compressibility, apparent density, average value of the existence ratio of the forming material, and standard deviation of the existence ratio of the forming material were measured by the above-described methods.
The air permeation resistance value (hereinafter also referred to as "APR") is a pressure loss when air is passed through the thickness direction of the polishing pad (flow rate of air: 30L/min, pressure of air: 100Pa) by using the apparatus shown in FIG. 1.
FIG. 2 shows the arithmetic mean of the existence ratios of the materials in the respective cross sections of the polishing pads of examples 1-1 and 2-1 and comparative example 1-1.
FIG. 3 shows the arithmetic mean of the existence ratios of the materials in the respective cross sections of the polishing pads of examples 5-1 and 6-1 and comparative example 2-1.
The conditions were changed as follows for a density exceeding 0.4g/cm3And a density of 0.4g/cm3The polishing pad was evaluated as follows.
1) The density exceeds 0.4g/cm3The polishing pad of (1): comparative examples 1-1 to 1-3, examples 2-1 to 2-3, examples 3 and examples 4
The polishing rate when the wafer was polished with the polishing pad was measured.
The measurement was carried out after the polishing cloth was set on the apparatus and after a dressing treatment was carried out under running water for five minutes under the following conditions before polishing.
A trimmer: a pellet (pellet) type dresser #150 (12 pellets 20mm in diameter were placed under a plate) manufactured by Kinik
Loading: 18.7kg
Rotating speed: Head/Platen ═ 100/115rpm
2) The density was 0.4g/cm3The following polishing pad: comparisonExamples 2-1 to 2-3, examples 5-1 to 5-3, and examples 6-1 to 6-3
Except for the case where the polishing rate was measured without carrying out the dressing treatment, the sum density was 0.4g/cm3The polishing pad described above was subjected to the same evaluation.
The polishing conditions for measuring the polishing rate are shown below.
The weight of the wafer was measured for each polishing (each run), and the polishing rate (RR) was determined from the difference between the weight of the wafer before polishing and the weight of the wafer after polishing. Fig. 4 and 5 show a part of the results.
The "polishing rate reduction rate" was obtained by the following equation. The results are shown in tables 1 and 2; fig. 6 and 7.
Polishing rate reduction (%) (maximum value of polishing rate-minimum value of polishing rate)/maximum value of polishing rate × 100 (%)
In addition, during the operation, a treatment for removing clogging (for example, a treatment based on dressing, brush, HPMJ (ultra high pressure micro jet cleaning)), or the like is not performed.
Grinding time: 60 minutes for the first operation and 40 minutes for the second operation
Operation: 7 times (apparent density of 0.40 g/cm)3Polishing pad No. 6 times)
Grinding machine: strasbaugh 6CA
Wafer: 8' (P-)
Grinding fluid: the addition rate of any one of the polishing liquids to DIW (purified water) was 7.14%
Density over 0.4g/cm3The polishing cloth of (2): solution with solid content (115 deg.C) of 36.6%, average particle diameter of 108nm, and pH value of 11.3
Density 0.4g/cm3The following abrasive cloths: NP6503(Nitta, Haas corporation)
Flow rate of polishing liquid: 300mL/min
Grinding time: 40min/run
SEM images of the surface and cross-section of the polishing pads of example 1-1, comparative example 1-1, example 5-1, and comparative example 2-1 are shown in FIGS. 8 to 15.
[ TABLE 1 ]
Figure BDA0002853209060000091
[ TABLE 2 ]
Figure BDA0002853209060000101
As shown in fig. 6 and 7 and tables 1 and 2, the polishing cloth of the example had a smaller reduction rate of the polishing rate than the comparative example.

Claims (3)

1. A polishing cloth is characterized in that,
the polishing cloth is made of a nonwoven fabric and a resin impregnated in the nonwoven fabric,
the apparent density of the grinding cloth is 0.30-0.50 g/cm3，
The standard deviation of the existence ratio of the forming material is 21.7% or less.
2. Abrasive cloth according to claim 1,
the compressibility of the polishing cloth is 5% or less.
3. Abrasive cloth according to claim 1 or 2,
the average value of the existence ratio of the forming material is 22-45%.
CN202011536463.1A 2019-12-27 2020-12-23 Abrasive cloth Pending CN113047056A (en)

Applications Claiming Priority (4)

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JP2019-239184 2019-12-27
JP2019239184 2019-12-27
JP2020-168649 2020-10-05
JP2020168649A JP2021107106A (en) 2019-12-27 2020-10-05 Abrasive cloth

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019021897A1 (en) * 2017-07-25 2019-01-31 ニッタ・ハース株式会社 Polishing cloth

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JP4890751B2 (en) 2004-08-04 2012-03-07 ニッタ・ハース株式会社 Polishing cloth

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019021897A1 (en) * 2017-07-25 2019-01-31 ニッタ・ハース株式会社 Polishing cloth

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