WO2019015303A1 - 封装结构、封装方法及显示装置 - Google Patents

封装结构、封装方法及显示装置 Download PDF

Info

Publication number
WO2019015303A1
WO2019015303A1 PCT/CN2018/075470 CN2018075470W WO2019015303A1 WO 2019015303 A1 WO2019015303 A1 WO 2019015303A1 CN 2018075470 W CN2018075470 W CN 2018075470W WO 2019015303 A1 WO2019015303 A1 WO 2019015303A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
sealing
sealing structure
hole
peripheral region
Prior art date
Application number
PCT/CN2018/075470
Other languages
English (en)
French (fr)
Inventor
蒋志亮
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/097,665 priority Critical patent/US11165040B2/en
Publication of WO2019015303A1 publication Critical patent/WO2019015303A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Definitions

  • the present disclosure relates to the field of display device packaging, and in particular, to a package structure, a packaging method, and a display device.
  • OLED display device is an emerging flat panel display device with wide solid-state structure, high brightness, full viewing angle, fast response and flexible display.
  • the main display device of the OLED display device is an OLED device, and the OLED device is easily eroded by oxygen, water and other components in the air, which seriously affects the service life of the OLED device. Therefore, it is usually required to package the OLED device by using a package structure to make the OLED
  • the device is isolated from oxygen, water and other components in the air, extending the life of the OLED device.
  • the package structure includes: a relatively disposed base substrate and a package cover, and a support post and a sealing structure disposed between the base substrate and the package cover, the base substrate, the package cover and the sealing structure form a seal
  • the cavity, the OLED device is located within the sealed cavity.
  • the sealing structure comprises a sealing structure formed by using a frit glue sprayed between the base substrate and the package cover plate, and an ultraviolet (UltraViolet; abbreviated as: UV) glue sprayed between the base substrate and the package cover plate.
  • UV ultraviolet
  • the present disclosure provides a package structure, a packaging method, and a display device.
  • a package structure in a first aspect, includes: a first substrate and a second substrate disposed opposite to each other, and disposed between the first substrate and the second substrate and located on the first substrate a first sealing structure of the peripheral region, a peripheral portion of the first substrate and the second substrate is provided with a sealing hole, and the sealing hole is provided with a second sealing structure, the first sealing The structure is bonded to the second sealing structure.
  • peripheral region of the first substrate and the peripheral region of the second substrate are both provided with uniformly distributed sealing holes.
  • the sealing holes on the first substrate are in one-to-one correspondence with the sealing holes on the second substrate, and the orthographic projections of the one-to-one corresponding sealing holes on the plane of the first substrate overlap. region.
  • all of the sealing holes have the same structure, and a shape of a longitudinal axis section of any of the sealing holes through a central axis thereof is a rectangle or a trapezoid, and a shape of a transverse axis section perpendicular to the longitudinal axis section In a rectangular shape, a circular shape, or a triangular shape, a central axis of the one of the two sealing holes of the first substrate and the second substrate is collinear.
  • the sealing hole is a circular hole, and the sealing hole has a diameter ranging from 0.5 mm to 2 mm.
  • the package structure further includes: a third sealing structure disposed between the first substrate and the second substrate and located in a peripheral region of the first substrate, where the first sealing structure is located Around the third sealing structure.
  • the package structure further includes: a support pillar disposed between the first substrate and the second substrate, the first substrate, the second substrate, the support pillar, and the first A sealing structure forms a sealed cavity for encapsulating the device to be packaged.
  • the forming material of the first sealing structure comprises an ultraviolet UV glue
  • the forming material of the third sealing structure comprises a frit glue
  • the elasticity of the UV glue is greater than the elasticity of the glass frit glue
  • a method of packaging comprising:
  • the first substrate and the second substrate are disposed opposite to each other, and a device to be packaged and a first sealing structure are formed between the first substrate and the second substrate, and the first sealing structure is located on the first substrate a peripheral portion of the first substrate and the second substrate, wherein a sealing hole is formed, and a sealing structure is formed in the sealing hole, the first sealing structure and the first sealing structure Two sealing structure bonding.
  • the first substrate is disposed opposite to the second substrate, and a device to be packaged and a first sealing structure are formed between the first substrate and the second substrate, the first sealing structure Located in a peripheral region of the first substrate, a peripheral portion of the first substrate and the second substrate is provided with a sealing hole, and a second sealing structure is formed in the sealing hole, the first The sealing structure is bonded to the second sealing structure, including:
  • the forming a sealing hole in a peripheral region of the at least one of the first substrate and the second substrate comprises:
  • a uniformly distributed sealing hole is formed in a peripheral region of the first substrate and a peripheral region of the second substrate, respectively.
  • the forming a sealing hole in a peripheral region of the at least one of the first substrate and the second substrate comprises:
  • a sealing hole is formed in a peripheral region of at least one of the first substrate and the second substrate by a laser hole puncher.
  • the first substrate is disposed opposite to the second substrate, and the device to be packaged is formed between the first substrate and the second substrate, including:
  • the first substrate and the second substrate are disposed opposite to each other, so that a device to be packaged and the support column are formed between the first substrate and the second substrate;
  • the forming material of the first sealing structure comprises an ultraviolet UV glue
  • the forming material of the third sealing structure comprises a frit glue
  • the elasticity of the UV glue is greater than the elasticity of the glass frit glue
  • a display device comprising an organic light emitting diode OLED device, and the package structure of any of the first aspect or the first aspect.
  • a package structure includes: a first substrate and a second substrate disposed opposite to each other, and a peripheral region of at least one of the first substrate and the second substrate is provided with a sealing hole; a first sealing structure disposed between the first substrate and the second substrate and located in a peripheral region of the first substrate; and a second sealing structure disposed in the sealing hole, wherein the first A sealing structure is bonded to the second sealing structure.
  • the peripheral region of the first substrate and the peripheral region of the second substrate are each provided with a uniformly distributed sealing aperture.
  • the sealing holes on the first substrate are in one-to-one correspondence with the sealing holes on the second substrate, and the sealing holes on the first substrate and the second substrate are corresponding to each other. There is an overlapping area of the orthographic projection of the sealing hole on the plane of the first substrate.
  • the shape of the longitudinal axis section of any of the sealing holes is rectangular or trapezoidal, and the shape of the horizontal axis section is rectangular, circular or triangular, the sealing holes of the first substrate corresponding to each other and the The central axis of the sealing aperture of the second substrate is substantially collinear.
  • the sealing aperture is a circular aperture, and the aperture of the sealing aperture ranges from 0.5 mm to 2 mm.
  • the package structure further includes: a third sealing structure disposed between the first substrate and the second substrate and located in a peripheral region of the first substrate, the first sealing structure Located around the third sealing structure, wherein the first substrate, the second substrate, and the third sealing structure form a sealed cavity for encapsulating a device to be packaged therein.
  • the package structure further includes: a support pillar disposed between the first substrate and the second substrate, the first substrate, the second substrate, the support pillar, and the The first sealing structure forms a sealed cavity for encapsulating the device to be packaged therein.
  • the forming material of the first sealing structure comprises an ultraviolet UV glue
  • the forming material of the third sealing structure comprises a frit glue
  • the elasticity of the UV glue is set to be larger than the glass frit glue The degree of flexibility.
  • a packaging method comprising: providing a first substrate and a second substrate, wherein a peripheral region of at least one of the first substrate and the second substrate is provided with a sealing hole; The first substrate is disposed opposite to the second substrate, and the device to be packaged is disposed between the first substrate and the second substrate; formed between the first substrate and the second substrate a first sealing structure and a second sealing structure formed in the sealing hole, wherein the first sealing structure is located in a peripheral region of the first substrate and disposed around the device to be packaged, and wherein the first A sealing structure is bonded to the second sealing structure.
  • a packaging method includes: providing a first substrate and a second substrate; disposing the first substrate opposite to the second substrate, and disposing a device to be packaged in the Forming a sealing hole between a substrate and the second substrate; forming a sealing hole in a peripheral region of at least one of the first substrate and the second substrate; forming a gap between the first substrate and the second substrate a first sealing structure and a second sealing structure formed in the sealing hole, wherein the first sealing structure is located in a peripheral region of the first substrate and disposed around the device to be packaged, and wherein the first A sealing structure is bonded to the second sealing structure.
  • forming a first sealing structure between the first substrate and the second substrate and forming a second sealing structure in the sealing hole includes: at the first substrate and the second Spraying a first sealant between the substrates, and causing the first sealant to enter the sealing hole under the action of capillary force; curing the first sealant to thereby form the first substrate and the first sealant
  • the first sealing structure is formed between the second substrates, and a second sealing structure is formed in the sealing holes.
  • the sealing hole is formed to be evenly distributed at a peripheral region of the first substrate and a peripheral region of the second substrate.
  • the sealing hole is formed by using a laser hole puncher in a peripheral region of at least one of the first substrate and the second substrate.
  • the method further includes: spraying a second sealant on a peripheral region of the at least one of the first substrate and the second substrate; wherein the first substrate and the second The substrate is disposed oppositely such that the second sealant and the device to be packaged are between the first substrate and the second substrate; and the second sealant is cured to cause the first substrate to be A third sealing structure is formed between the second substrates, wherein the first sealing structure is located around the third sealing structure.
  • the method further includes forming a support pillar on at least one of the first substrate and the second substrate, wherein the first substrate is disposed opposite to the second substrate such that The support pillar is between the first substrate and the second substrate.
  • the forming material of the first sealing structure comprises an ultraviolet UV glue
  • the forming material of the third sealing structure comprises a frit glue
  • the elasticity of the UV glue is set to be larger than the glass frit glue The degree of flexibility.
  • a display device comprising: the package structure as described above and in any of the aspects or embodiments below; and an organic light emitting diode OLED device packaged in the package structure.
  • 1A is a schematic diagram of a package structure provided by the related art
  • FIG. 1B is a schematic view showing the sealing structure of the package structure shown in FIG. 1A separated from the substrate substrate;
  • FIG. 1C is a schematic view showing the sealing structure of the package structure shown in FIG. 1A broken;
  • FIG. 1D is a schematic view showing the substrate substrate and the package cover of the package structure shown in FIG. 1A being broken;
  • FIG. 2 is a schematic diagram of a package structure according to an embodiment of the present disclosure
  • FIG. 3 is a schematic diagram of another package structure provided by an embodiment of the present disclosure.
  • FIG. 4 is a top plan view of a package structure according to an embodiment of the present disclosure.
  • FIG. 5 is a flowchart of a method for packaging a method according to an embodiment of the present disclosure
  • 6A is a flowchart of a method for another packaging method according to an embodiment of the present disclosure.
  • FIG. 6B is a flowchart of a method for disposing a first substrate and a second substrate according to an embodiment of the present disclosure
  • FIG. 7A is a schematic structural diagram of a support post formed on a first substrate according to an embodiment of the present disclosure.
  • FIG. 7B is a schematic structural view of a second sealant after curing treatment according to an embodiment of the present disclosure.
  • FIG. 7C is a schematic structural view showing a sealing hole formed in a peripheral region of a substrate according to an embodiment of the present disclosure
  • Figure 7D is a plan view of Figure 7C
  • FIG. 7E is a schematic structural view of the embodiment of the present disclosure after the first sealant is sprayed between the first substrate and the second substrate.
  • OLED devices As an emerging flat panel display device, OLED devices have attracted wide attention. However, components such as water vapor and oxygen in the air easily enter the OLED device, which erodes the electrode layer and the organic light-emitting layer in the OLED device, deteriorating the performance of the OLED device and seriously affecting the service life of the OLED. If the OLED device is sealed in an anhydrous, oxygen-free environment, the lifetime of the OLED device can be significantly extended.
  • the OLED device can usually be packaged in a package structure to seal the OLED device in an anhydrous and oxygen-free environment. Therefore, the packaging technology of the OLED device is a key technology for improving the service life of the OLED device.
  • the conventional package structure may be a cover package structure to protect the OLED device from outside air.
  • FIG. 1A illustrates a schematic diagram of a package structure 00 provided by the related art, which may be a cover package structure.
  • the package structure 00 includes a relatively disposed substrate 001 and a package cover 002, and a sealing structure 003 disposed between the base substrate 001 and the package cover 002.
  • the OLED device 01 is disposed on the base substrate 001 and is located in a sealed cavity formed by the substrate 001, the package cover 002, and the sealing structure 003.
  • Sealing structure 003 is typically formed using UV glue or Frit glue.
  • the package structure 00 shown in FIG. 1A may also be referred to as a glass package structure.
  • FIG. 1A shows the case where the sealing structure 003 is separated from the base substrate 001. Shown in Figure 1C is the case where the sealing structure 003 is broken. FIG. 1D shows a case where the base substrate 001 and the package cover 002 are broken.
  • the related art proposes another package structure.
  • a sealing structure including a UV glue and disposed outside the sealing structure 003 is added. Since the elasticity of the UV glue is usually large, the mechanical strength of the package structure can be enhanced to some extent.
  • the mechanical strength of the package structure is still low, and the sealing structure is separated from the base substrate 001 and/or the package cover, the sealing structure is broken, and the base substrate is still formed. And / or the package cover is broken.
  • the present invention has been made. According to the package structure, the packaging method, and the display device provided by the embodiments of the present disclosure, the mechanical strength of the package structure can be effectively enhanced.
  • the package structure, the packaging method, and the display device provided by the embodiments of the present disclosure are specifically described below.
  • the package structure 02 includes: a first substrate 021 and a second substrate 022 disposed opposite to each other, and disposed between the first substrate 021 and the second substrate 022 and located on the first substrate 021 and/or the second substrate 022.
  • the first sealing structure 023 of the peripheral region (not shown in FIG. 2).
  • a peripheral region of at least one of the first substrate 021 and the second substrate 022 is provided with a sealing hole (not shown in FIG. 2, as best seen from FIG. 7C).
  • a second sealing structure 024 is disposed in the sealing hole.
  • the first sealing structure 023 is bonded to the second sealing structure 024.
  • the device to be packaged 03 may be disposed on the first substrate 021; it is apparent that the present disclosure is not limited thereto.
  • the device 03 is disposed within a sealed cavity surrounded by the first substrate 021, the second substrate 022, and the first sealing structure 023.
  • the device to be packaged 03 may be disposed away from the edge of the sealed cavity by a predetermined distance, such as at the center of the cavity, to facilitate formation of a sealing structure surrounding the device 30.
  • the orthographic projection of the device to be packaged 03 (or the area to be mounted thereof) on the first substrate or the second substrate (or its "footprint") may also be set to be away from the edge of the corresponding substrate.
  • the distance, and the sealing hole (and the sealing structure or the like) may be disposed in a peripheral region between the orthographic projection on the first substrate or the second substrate and the edge of the corresponding substrate on the device to be packaged 03 (or a region to be mounted thereof) (eg, In the case indicated by 401 in Fig. 4.
  • the size (lateral dimension) of the first sealing structure 023 is larger than the size of the sealing hole.
  • An embodiment of the present disclosure provides a package structure including: a first substrate and a second substrate disposed opposite to each other, wherein a peripheral region of at least one of the first substrate and the second substrate is provided with a sealing hole; a first sealing structure between the first substrate and the second substrate and located in a peripheral region of the first substrate; and a second sealing structure disposed in the sealing hole, wherein the first sealing The structure is bonded to the second sealing structure. Since the first sealing structure is bonded to the second sealing structure, the mechanical strength of the package structure can be enhanced. In addition, since the first sealing structure is bonded to the second sealing structure in the sealing hole, the influence of the transverse shear stress can be reduced, thereby facilitating the reduction of the probability of the substrate being broken as shown in FIG. 1D.
  • the peripheral region of the first substrate 021 and the peripheral region of the second substrate 022 are both provided with uniformly distributed sealing holes.
  • the sealing holes on the substrate can be arranged to be separated from each other by an equal distance.
  • the sealing holes on the substrate may be arranged to be equidistantly distributed around the mounting area of the device to be packaged.
  • the sealing holes on the first substrate 021 and the sealing holes on the second substrate 022 may correspond one-to-one. There are overlapping regions of the orthographic projections of the two sealing holes (the sealing holes on the first substrate 021 and the sealing holes on the second substrate 022) on the plane of the first substrate 021.
  • the second sealing structure 024 disposed in the sealing hole of the first substrate 021 and the second sealing structure 024 disposed in the sealing hole of the second substrate 022 One-to-one correspondence.
  • the orthographic projection of the second sealing structure 024 disposed in the sealing hole of the first substrate 021 on the plane of the first substrate 021 and the second sealing structure 024 disposed in the sealing hole of the second substrate 022 may have overlapping regions.
  • the structures of all the sealing holes may be identical to each other.
  • the axis of any of the sealing holes may include a longitudinal axis (including a central axis) along an extending direction (or length direction) of the sealing hole and a transverse axis perpendicular to the longitudinal axis.
  • the longitudinal axis of any of the sealing apertures can be disposed perpendicular to the face of the substrate on which the sealing aperture is located (or the plane in which the substrate is located).
  • the transverse axis of any of the sealing apertures can be disposed parallel to the face of the substrate on which the sealing aperture is located.
  • the longitudinal axis of the sealing hole on the first substrate 021 may be perpendicular to the plate surface of the first substrate 021, and the transverse axis of the sealing hole on the first substrate 021 may be parallel to the plate surface of the first substrate 021.
  • the shape of the longitudinal axis section of any of the sealing holes through its central axis may be rectangular or trapezoidal.
  • the shape of the cross-sectional axis of the sealing hole perpendicular to the longitudinal axis section may be rectangular, circular or triangular.
  • the two sealing holes corresponding to each other in the sealing holes of the first substrate 021 and the second substrate 022 may be disposed to be collinear with their central axes.
  • the longitudinal axis section of the sealing bore is parallel to the longitudinal axis of the sealing bore, and the cross section of the sealing bore is perpendicular to the longitudinal axis of the sealing bore.
  • the longitudinal axis section of the sealing hole may be trapezoidal.
  • the sealing holes on the first substrate 021 and the sealing holes on the second substrate 022 may correspond one-to-one, as shown in FIG. 2 .
  • the longitudinal axes (not shown) of the two sealing holes corresponding to each other may be arranged to be substantially collinear.
  • the sealing aperture may be a circular aperture.
  • the pore diameter of the sealing hole may range, for example, from 0.5 mm to 2 mm.
  • the sealing aperture is a through hole.
  • FIG. 3 is a schematic structural diagram of another package structure 02 provided by some embodiments of the present disclosure.
  • FIG. 2 a portion different from the package structure shown in FIG. 2 and the package structure shown in FIG. 2 will be mainly described.
  • the same components in the package structure shown in FIG. 3 as those of the package structure shown in FIG. 2 are denoted by the same reference numerals, and repeated explanation thereof is omitted here.
  • the package structure 02 further includes a third sealing structure 025 disposed between the first substrate 021 and the second substrate 022 and located in a peripheral region of the first substrate 021 .
  • the first sealing structure 023 can be located around the third sealing structure 025.
  • the first sealing structure 023 can be located at the periphery of the third sealing structure 025.
  • the third sealing structure 025 can be in contact with the first sealing structure 023.
  • the package structure 02 may further include: a support post 026 disposed between the first substrate 021 and the second substrate 022 .
  • the first substrate 021, the second substrate 022, the support post 026, and the first sealing structure 023 collectively form a sealed cavity for encapsulating the device to be packaged 03. It is apparent that the present disclosure is not limited thereto, and in some embodiments, the first substrate 021, the second substrate 022, and the first sealing structure 023 may collectively form a sealed cavity for encapsulating the device to be packaged 03, as shown in FIG.
  • the sealing structure (the first sealing structure 023 and/or the third sealing structure 025) is formed by curing the sealing glue, and the supporting column 026 can be opposite to the first substrate 021 and the second substrate 022. Supporting is performed to prevent the second substrate 022 from applying pressure to the device to be packaged 03 before the curing of the sealant, damaging the device to be packaged 03.
  • the device to be packaged 03 can be an OLED device.
  • the mechanical strength of the package structure can be further enhanced and a better seal can be provided.
  • FIG. 4 is a top plan view of a package structure according to an embodiment of the present disclosure.
  • a first sealing structure 023 and a third sealing structure 025 are disposed between the first substrate (not shown in Fig. 4) and the second substrate 022.
  • the first sealing structure 023 may be located outside of the third sealing structure 025.
  • Uniformly distributed sealing holes (not shown in Fig. 4) are provided in the peripheral region of the first substrate and the peripheral region of the second substrate 022.
  • the sealing aperture is shown as a circular aperture.
  • a second sealing structure 024 is formed in the sealing hole.
  • the second sealing structure disposed in the sealing hole of the first substrate and the second sealing structure 024 disposed in the sealing hole of the second substrate 022 may be disposed in a one-to-one correspondence.
  • An orthographic projection can have overlapping regions. It should be noted that, in FIG. 4, the structure indicated by the broken line is located below the second substrate 022, and the support column is not shown in FIG.
  • the forming material of the first sealing structure 023 includes a UV glue.
  • the forming material of the third sealing structure 025 comprises a frit glue.
  • the elasticity of the UV glue can be set to be greater than the elasticity of the glass frit.
  • the material forming the second sealing structure 024 may be the same as the material forming the first sealing structure 023. According to some embodiments of the present disclosure, by forming the first sealing structure 023 and the second sealing structure 024 using UV glue, the toughness and bonding force of the first sealing structure 021 and the second sealing structure 024 can be improved, thereby enhancing the mechanism of the package structure 02. strength.
  • the package structure provided by this embodiment can further enhance the mechanical strength of the package structure.
  • a packaging method according to an embodiment of the present disclosure will be described below with reference to the accompanying drawings.
  • the packaging methods described below and above may be combined with the package structures provided by the embodiments of the present disclosure as appropriate.
  • FIG. 5 illustrates a method flow diagram of a packaging method according to an embodiment of the present disclosure.
  • the packaging method can form the package structure shown in FIG. 2 or FIG. 3 to package the device to be packaged.
  • the device to be packaged can be an OLED device. Referring to Figure 5, the method includes:
  • Step 501 Providing a first substrate and a second substrate.
  • Step 502 The first substrate and the second substrate are disposed opposite to each other, and the device to be packaged and the first sealing structure are formed between the first substrate and the second substrate, and the first sealing structure is located in a peripheral region of the first substrate, the first substrate and the first substrate A peripheral portion of at least one of the two substrates is provided with a sealing hole, and a second sealing structure is formed in the sealing hole, and the first sealing structure is bonded to the second sealing structure.
  • the mechanical strength of the package structure formed thereof can be improved.
  • the first substrate and the second substrate may be disposed opposite to each other such that the device to be packaged is between the first substrate and the second substrate; forming a sealing hole in a peripheral region of at least one of the first substrate and the second substrate; Spraying a first sealant between the substrate and the second substrate, the first sealant can enter the sealing hole under the action of capillary force; curing the first sealant to form a first gap between the first substrate and the second substrate.
  • the sealing structure forms a second sealing structure in the sealing hole, and the first sealing structure is bonded to the second sealing structure.
  • a packaging method may include providing a first substrate and a second substrate, and a peripheral region of the at least one of the first substrate and the second substrate is provided with a sealing hole.
  • the method further includes: arranging the first substrate opposite to the second substrate, and disposing a device to be packaged between the first substrate and the second substrate.
  • the method further includes forming a first sealing structure between the first substrate and the second substrate and forming a second sealing structure in the sealing hole.
  • the first sealing structure may be located in a peripheral region of the first substrate and disposed around the device to be packaged. The first sealing structure is bonded to the second sealing structure.
  • a packaging method may include providing a first substrate and a second substrate.
  • the packaging method may further include: disposing the first substrate opposite to the second substrate, and disposing a device to be packaged between the first substrate and the second substrate.
  • the packaging method may further include forming a sealing hole in a peripheral region of at least one of the first substrate and the second substrate.
  • the encapsulation method may include forming a first sealing structure between the first substrate and the second substrate and forming a second sealing structure in the sealing hole.
  • the first sealing structure may be located in a peripheral region of the first substrate and disposed around the device to be packaged.
  • the first sealing structure is bonded to the second sealing structure.
  • the first sealing structure may be integrally formed from the same material (eg, UV glue) as the second sealing structure.
  • forming a sealing hole in a peripheral region of the at least one of the first substrate and the second substrate comprises: forming a uniformly distributed sealing hole in a peripheral region of the first substrate and a peripheral region of the second substrate, respectively. That is, in the peripheral region of the first substrate, the sealing holes may be formed to be evenly distributed. Similarly, in the peripheral region of the second substrate, the sealing holes may also be formed to be evenly distributed.
  • a laser hole punch is used to form a sealing hole in a peripheral region of at least one of the first substrate and the second substrate.
  • the packaging method may further include: forming a support pillar on at least one of the first substrate and the second substrate.
  • the first substrate and the second substrate are disposed opposite to each other such that the support pillar is between the first substrate and the second substrate. That is, the support pillar is formed between the first substrate and the second substrate.
  • the packaging method may further include: spraying a second sealant on a peripheral region of the at least one of the first substrate and the second substrate;
  • the first substrate and the second substrate are disposed opposite to each other, such that the second sealant (and the device to be packaged) is between the first substrate and the second substrate; and the second sealant is cured to make the first substrate A third sealing structure is formed between the second substrate.
  • the first sealant is subjected to a curing treatment (for example, by irradiating ultraviolet rays (UV)) to form a first sealing structure between the first substrate and the second substrate, and forming a second seal in the sealed hole. structure. Thereby, the first sealing structure is bonded to the second sealing structure. In some embodiments, the first sealing structure is located around the third sealing structure.
  • a curing treatment for example, by irradiating ultraviolet rays (UV)
  • UV ultraviolet rays
  • the forming material of the first sealing structure may include an ultraviolet UV glue.
  • the forming material of the third sealing structure may include a frit paste.
  • the degree of elasticity of the UV glue is set to be greater than the degree of elasticity of the frit.
  • the mechanical strength of the formed package structure can be improved.
  • FIG. 6A is a flowchart of a method for another packaging method provided by an embodiment of the present disclosure.
  • the packaging method can form the package structure 02 shown in FIG. 2 or FIG. 3 to package the device to be packaged.
  • the device to be packaged may be an OLED device.
  • the package method will be described below by taking the package structure 02 shown in FIG. 3 as an example.
  • the method includes a step 601 at which a first substrate and a second substrate are provided.
  • each of the first substrate and the second substrate may be a transparent substrate.
  • the first substrate and the second substrate may be substrates made of a light-guided and non-metallic material having a certain firmness such as glass, quartz, or transparent resin.
  • step 602 the first substrate and the second substrate are disposed opposite to each other, and the device to be packaged is disposed between the first substrate and the second substrate.
  • the first substrate and the second substrate may be disposed opposite to each other, and the device to be packaged may be disposed between the first substrate and the second substrate.
  • the device to be packaged can be disposed on the first substrate, for example, on a non-peripheral region.
  • the device to be packaged may be an OLED device.
  • a sealing hole is formed in a peripheral region of at least one of the first substrate and the second substrate.
  • a laser hole punch may be used to form a sealing hole in a peripheral region of at least one of the first substrate and the second substrate.
  • the sealing holes on the first substrate are evenly distributed in the peripheral region of the first substrate, and the sealing holes on the second substrate are evenly distributed in the peripheral region of the second substrate.
  • FIG. 7C shows a structural schematic view after forming a sealing hole in a peripheral region of at least one of the first substrate and the second substrate.
  • the peripheral region of the first substrate 021 and the peripheral region of the second substrate 022 are both formed with a sealing hole k.
  • the sealing holes k on the first substrate 021 correspond one-to-one with the sealing holes k on the second substrate 022.
  • there are overlapping regions of the orthographic projections of the two sealing holes k (the sealing holes k on the first substrate 021 and the sealing holes on the second substrate 022) corresponding to each other on the plane of the first substrate 021.
  • the longitudinal axes of the two sealed apertures k that correspond to each other can be set to be substantially collinear.
  • the longitudinal axis of any of the sealing holes k may be disposed perpendicular to the face of the substrate on which the sealing hole k is located.
  • 7D is a plan view of FIG. 7C.
  • the sealing holes k on the first substrate 021 are uniformly distributed in the peripheral region of the first substrate 021, and the sealing holes k on the second substrate 022 are evenly distributed on the first substrate.
  • Fig. 7C the support post 026 and the third seal structure 025 are also shown in Fig. 7C, which will be described in detail later.
  • a first sealant is sprayed between the first substrate and the second substrate, and the first sealant can enter the sealing hole under the action of capillary force.
  • a first sealant may be sprayed between the first substrate and the second substrate, the first sealant being capable of being subjected to capillary force Enter the sealed hole.
  • the first sealant may be a UV glue, which is typically more elastic than the frit glue.
  • the sealing aperture may be a circular aperture having a bore diameter of between 0.5 mm and 2 mm.
  • a first sealant may be sprayed between the first substrate and the second substrate by a spraying process.
  • FIG. 7E is a schematic structural view after spraying a first sealant between the first substrate and the second substrate. Referring to FIG. 7E , spraying between the first substrate 021 and the second substrate 022 After the first sealant J, the first sealant J enters the seal hole under the action of capillary force and is filled in the seal hole.
  • the first sealant J in the seal hole is fused with the first sealant J between the first substrate 021 and the second substrate 022 (that is, may be integrated).
  • step 605 the first sealant is subjected to a curing process to form a first sealing structure 023 between the first substrate and the second substrate, and a second sealing structure 024 is formed in the sealing hole.
  • the first sealing structure and the second sealing structure can be joined together.
  • the first sealing structure is located around the third sealing structure, such as outside of the third sealing structure.
  • the first sealant may be a UV glue.
  • the first sealant between the first substrate and the second substrate and the first sealant as the UV glue in the sealing hole may be irradiated with ultraviolet rays, so that the photoinitiator in the first sealant absorbs ultraviolet rays to generate active freedom.
  • the base or cation initiates a chemical reaction of the monomer in the first sealant to cure the first sealant.
  • FIG. 3 for a schematic diagram of the structure after the first sealant is cured. Referring to FIG.
  • a first sealing structure 023 is formed between the first substrate 021 and the second substrate 022, and a second sealing structure 024 is formed in the sealing hole, and the first sealing structure 023 and the first sealing structure The second sealing structure 024 is bonded, and the first sealing structure 023 is located outside the third sealing structure 025.
  • FIG. 6B is a flow chart showing a partial encapsulation method provided by another embodiment of the present disclosure. Description will be made below with reference to Figs. 6A and 6B. The content described above with respect to Figure 6A and other figures and embodiments may be equally or adaptively applicable thereto.
  • a first substrate and a second substrate are provided.
  • a support post is formed on at least one of the first substrate and the second substrate.
  • Embodiments of the present disclosure are described by taking a support pillar formed on a first substrate as an example.
  • FIG. 7A is a schematic structural view after forming a support pillar on the first substrate.
  • a central region of the first substrate 021 is formed with a device to be packaged 03
  • a support pillar 026 is formed on the first substrate 021 .
  • the peripheral region, and the support post 026 may be a cylindrical structure.
  • the forming material of the support post 026 may be an organic resin material.
  • an organic resin layer may be formed on the first substrate 021 on which the device 03 to be packaged is formed using an organic resin material, and then the organic resin layer is processed by one patterning process to obtain a support pillar 026.
  • the one-time patterning process may include: photoresist coating, exposure, development, etching, and photoresist stripping.
  • processing the organic resin layer by one patterning process may include: forming a photoresist layer on the organic resin layer by a coating process, and exposing the photoresist layer with a mask to make the photoresist The layer forms a fully exposed region and a non-exposed region, and then the exposed photoresist layer is processed by a developing process to remove the photoresist in the completely exposed region, the photoresist in the non-exposed region is retained, and then the etching process is performed. A region on the organic resin layer corresponding to the fully exposed region is etched, and then the photoresist in the non-exposed region is peeled off, thereby obtaining a support pillar 026.
  • the embodiment of the present disclosure is described by taking the formation of the support column 026 by a patterning process, but the disclosure is not limited thereto.
  • the support post 026 may be formed at other locations, and then the support post 026 is pasted on the peripheral region of the first substrate 021 to form a support post 026 on the first substrate 021 to avoid the first step by the patterning process.
  • the process of forming the support pillars 026 on the substrate 021 has an effect on the packaged device 03.
  • a second sealant is sprayed on a peripheral region of at least one of the first substrate and the second substrate.
  • the second sealant may be sprayed on a peripheral region of at least one of the first substrate and the second substrate.
  • the second sealant may be a frit glue.
  • the second sealant may be sprayed on a peripheral region of at least one of the first substrate and the second substrate by a spraying process, a coating process, or the like.
  • a second sealant may be sprayed on the peripheral region of the first substrate by a spraying process, the second sealant and the support post are on the same plate surface of the first substrate, and the second sealant is located outside the support column.
  • the first substrate and the second substrate are disposed opposite to each other such that a device to be packaged and a support pillar are formed between the first substrate and the second substrate.
  • the first substrate and the second substrate may be oppositely disposed to form a device to be packaged between the first substrate and the second substrate.
  • the pillar is supported, and the second sealant is located between the first substrate and the second substrate.
  • the second substrate may be placed on the support column such that the first substrate and the second substrate are disposed opposite to each other, and the device to be packaged, the support post and the second sealant are located between the first substrate and the second substrate.
  • the support column can support the second substrate to prevent the second substrate from contacting the device to be packaged to apply pressure to the device to be packaged, thereby damaging the device to be packaged.
  • Sub-step 6024 curing the second sealant to form a third sealing structure 025 between the first substrate and the second substrate.
  • the second sealant may be cured to form a third sealing structure, and the third sealing structure is located between the first substrate and the second substrate.
  • the second sealant may be heated and baked to cure the second sealant, or the second sealant may be allowed to stand for a predetermined period of time to cure the second sealant.
  • FIG. 7B is a schematic structural diagram of a second sealant between a first substrate and a second substrate after curing according to an embodiment of the present disclosure. Referring to FIG. 7B , After the second sealant is subjected to the curing process, the second sealant forms a third seal structure 025.
  • the third seal structure 025 is located between the first substrate 021 and the second substrate 022, and the third seal structure 025 is located outside the support post 026.
  • a sealing hole is formed in a peripheral region of at least one of the first substrate and the second substrate.
  • a laser hole punch may be used to form a sealing hole in a peripheral region of at least one of the first substrate and the second substrate.
  • the sealing holes on the first substrate are evenly distributed in the peripheral region of the first substrate, and the sealing holes on the second substrate are evenly distributed in the peripheral region of the second substrate.
  • FIG. 7C is a schematic structural view after forming a sealing hole in a peripheral region of at least one of the first substrate and the second substrate.
  • the peripheral region of the first substrate 021 and the peripheral region of the second substrate 022 are both formed with a sealing hole k.
  • the sealing holes k on the first substrate 021 correspond one-to-one with the sealing holes k on the second substrate 022.
  • the longitudinal axes of the two sealing holes k corresponding to each other are collinear.
  • the longitudinal axis of any of the sealing holes k is perpendicular to the plate surface of the substrate on which the sealing hole k is located.
  • 7D is a plan view of FIG. 7C.
  • the sealing holes k on the first substrate 021 are uniformly distributed in the peripheral region of the first substrate 021, and the sealing holes k on the second substrate 022 are evenly distributed on the first substrate. The surrounding area of 021.
  • step 604 a first sealant is sprayed between the first substrate and the second substrate, and the first sealant can enter the sealing hole under the action of capillary force.
  • a first sealant may be sprayed between the first substrate and the second substrate, the first sealant being capable of being subjected to capillary force Enter the sealed hole.
  • the first sealant can be a UV glue, which is typically more elastic than the frit glue.
  • the sealing aperture may be a circular aperture having a bore diameter of between 0.5 mm and 2 mm. Since the sealing hole has a small aperture, it is convenient for the first sealant to enter the sealing hole under the action of capillary force.
  • a first sealant may be sprayed between the first substrate and the second substrate by a spraying process. For example, please refer to FIG.
  • FIG. 7E which is a schematic structural view after spraying the first sealant between the first substrate and the second substrate.
  • the first sealant J is sprayed between the first substrate 021 and the second substrate 022
  • the first sealant J enters the sealing hole under the action of the capillary force, and is filled in the sealing hole, and the sealing hole is sealed.
  • the first sealant J is fused with the first sealant J between the first substrate 021 and the second substrate 022.
  • step 605 the first sealant is cured to form a first sealing structure between the first substrate and the second substrate, a second sealing structure is formed in the sealing hole, and the first sealing structure is bonded to the second sealing structure.
  • the first sealant may be cured to cure the first sealant, and the first sealant between the first substrate and the second substrate is formed.
  • the first sealing structure, the first sealant in the sealing hole forms a second sealing structure.
  • the first sealing structure is bonded to the second sealing structure.
  • the first sealing structure is located around the third sealing structure.
  • the first sealant may be a UV glue
  • the first sealant between the first substrate and the second substrate and the first sealant in the seal hole may be irradiated with ultraviolet rays to make the first sealant
  • the photoinitiator absorbs ultraviolet rays to generate active radicals or cations, which initiates a chemical reaction of the monomers in the first sealant, thereby curing the first sealant.
  • FIG. 3 for a schematic diagram of the structure after the first sealant is cured.
  • a first sealing structure 023 is formed between the first substrate 021 and the second substrate 022, and a second sealing structure 024 is formed in the sealing hole.
  • the first sealing structure 023 is bonded to the second sealing structure 024.
  • the first sealing structure 023 is located outside the third sealing structure 025.
  • the mechanical strength of the formed package structure can be improved.
  • Embodiments of the present disclosure also provide a display device that can include a package structure and a device to be packaged according to any embodiment of the present disclosure (eg, the embodiment described in connection with FIG. 2 or FIG. 3, etc.) , OLED devices, etc.).

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种封装结构（02）、封装方法以及显示装置。该封装结构包括：相对设置的第一基板（021）和第二基板（022），第一基板与第二基板中的至少一个基板的周边区域设置有密封孔；设置在第一基板与第二基板之间且位于第一基板的周边区域的第一密封结构（023）；以及设置于密封孔内的第二密封结构（024），其中，第一密封结构与第二密封结构粘接。

Description

封装结构、封装方法及显示装置
相关申请的交叉引用
本申请要求于2017年7月21日提交的中国申请No.201710605623.5的优先权，通过引用将其全文包括说明书、权利要求书以及附图等并入在此。
技术领域
本公开涉及显示器件封装领域，特别涉及一种封装结构、封装方法以及显示装置。
背景技术
有机发光二极管(英文：Organic Light-Emitting Diode；简称：OLED)显示装置是一种新兴的平板显示装置，具有全固态结构、高亮度、全视角、响应速度快以及可柔性显示等优点，广泛应用于显示行业。OLED显示装置的主要显示器件为OLED器件，而OLED器件容易受到空气中的氧气、水等成分的侵蚀，严重影响OLED器件的使用寿命，因此，通常需要采用封装结构对OLED器件进行封装，使OLED器件与空气中的氧气、水等成分隔离，从而延长OLED器件的使用寿命。
相关技术中，封装结构包括：相对设置的衬底基板和封装盖板，以及设置在衬底基板与封装盖板之间的支撑柱和密封结构，衬底基板、封装盖板和密封结构形成密封腔体，OLED器件位于该密封腔体内。密封结构包括采用喷涂在衬底基板与封装盖板之间的玻璃料(Frit)胶形成的密封结构，以及采用喷涂在衬底基板与封装盖板之间的紫外线(UltraViolet；简称：UV)胶形成的密封结构，并且UV胶喷涂在Frit胶的周围。
发明内容
本公开提供一种封装结构及封装方法、显示装置。
第一方面，提供一种封装结构，所述封装结构包括：相对设置的第一基板和第二基板，以及设置在所述第一基板与所述第二基板之间且位于所述第一基板的周边区域的第一密封结构，所述第一基板与所述第二基板中的至少一个基板的周边区域设置有密封孔，所述密封孔内设置有第二密封结构，所述第一密封结构与所述第二密封结构粘接。
可选地，所述第一基板的周边区域和所述第二基板的周边区域都设置有均匀分布的密封孔。
可选地，所述第一基板上的密封孔与所述第二基板上的密封孔一一对应，且一一对应的两个密封孔在所述第一基板所在平面上的正投影存在重叠区域。
可选地，所有的所述密封孔的结构相同，任一所述密封孔的经过其中心轴线的纵轴截面的形状为矩形或梯形，其与所述纵轴截面垂直的横轴截面的形状为矩形、圆形或三角形，所述第一基板和所述第二基板的密封孔中，一一对应的两个密封孔的中心轴线共线。
可选地，所述密封孔为圆形孔，所述密封孔的孔径的取值范围为0.5毫米～2毫米。
可选地，所述封装结构还包括：设置在所述第一基板与所述第二基板之间且位于所述第一基板的周边区域的第三密封结构，所述第一密封结构位于所述第三密封结构的周围。
可选地，所述封装结构还包括：设置在所述第一基板与所述第二基板之间的支撑柱，所述第一基板、所述第二基板、所述支撑柱和所述第一密封结构形成用于封装待封装器件的密封腔体。
可选地，所述第一密封结构的形成材料包括紫外线UV胶，所述第三密封结构的形成材料包括玻璃料胶，所述UV胶的弹性度大于所述玻璃料胶的弹性度。
第二方面，提供一种封装方法，所述方法包括：
提供第一基板和第二基板；
将所述第一基板与所述第二基板相对设置，所述第一基板与所述第二基板之间形成有待封装器件和第一密封结构，所述第一密封结构位于所述第一基板的周边区域，所述第一基板与所述第二基板中的至少一个基板的周边区域设置有密封孔，所述密封孔内形成有第二密封结构，所述第一密封结构与所述第二密封结构粘接。
可选地，所述将所述第一基板与所述第二基板相对设置，所述第一基板与所述第二基板之间形成有待封装器件和第一密封结构，所述第一密封结构位于所述第一基板的周边区域，所述第一基板与所述第二基板中的至少一个基板的周边区域设置有密封孔，所述密封孔内形成有第二密封结构，所述第一密封结构与所述第二密封结构粘接，包括：
将第一基板与第二基板相对设置，使所述第一基板与所述第二基板之间形成有待封装器件；
在所述第一基板与所述第二基板中的至少一个基板的周边区域形成密封孔；
在所述第一基板与所述第二基板之间喷涂第一密封胶，所述第一密封胶能够在毛细力的作用下进入所述密封孔；
对所述第一密封胶进行固化处理，使所述第一基板与所述第二基板之间形成所述第一密封结构，所述密封孔内形成第二密封结构，且所述第一密封结构与所述第二密封结构粘接。
可选地，所述在所述第一基板和所述第二基板中的至少一个基板的周边区域形成密封孔，包括：
在所述第一基板的周边区域和所述第二基板的周边区域分别形成均匀分布的密封孔。
可选地，所述在所述第一基板和所述第二基板中的至少一个基板的周边区域形成密封孔，包括：
采用激光打孔器在所述第一基板和所述第二基板中的至少一个基板的周边区域形成密封孔。
可选地，所述将第一基板与第二基板相对设置，使所述第一基板与所述第二基板之间形成有待封装器件，包括：
在所述第一基板和所述第二基板中的至少一个基板上形成支撑柱；
在所述第一基板与所述第二基板中的至少一个基板的周边区域喷涂第二密封胶；
将所述第一基板与所述第二基板相对设置，使所述第一基板与所述第二基板之间形成有待封装器件和所述支撑柱；
对所述第二密封胶进行固化处理，使所述第一基板与所述第二基板之间形成有第三密封结构；
所述对所述第一密封胶进行固化处理，使所述第一基板与所述第二基板之间形成所述第一密封结构，所述密封孔内形成第二密封结构，且所述第一密封结构与所述第二密封结构粘接，包括：
对所述第一密封胶进行固化处理，使所述第一基板与所述第二基板之间形成所述第一密封结构，所述密封孔内形成第二密封结构，且所述第一密封结构与所述第二密封结构粘接，所述第一密封结构位于所述第三密封结构的周围。
可选地，所述第一密封结构的形成材料包括紫外线UV胶，所述第三密封结构的形成材料包括玻璃料胶，所述UV胶的弹性度大于所述玻璃料胶的弹性度。
第三方面，提供一种显示装置，所述显示装置包括有机发光二极管OLED器件，和，第一方面或第一方面的任一可选方式所述的封装结构。
根据本公开一个方面，提供了一种封装结构，包括：相对设置的第一基板和第二基板，所述第一基板与所述第二基板中的至少一个基板的周边区域设置有密封孔；设置在所述第一基板与所述第二基板之间且位于所述第一基板的周边区域的第一密封结构；以及设置于所述密封孔内的第二密封结构，其中，所述第一密封结构与所述第二密封结构粘接。
在一些实施例中，所述第一基板的周边区域和所述第二基板的周边区域都设置有均匀分 布的密封孔。
在一些实施例中，所述第一基板上的密封孔与所述第二基板上的密封孔一一对应，且彼此对应的所述第一基板上的密封孔与所述第二基板上的密封孔在所述第一基板所在平面上的正投影存在重叠区域。
在一些实施例中，任一所述密封孔的纵轴截面的形状为矩形或梯形，横轴截面的形状为矩形、圆形或三角形，彼此对应的所述第一基板的密封孔和所述第二基板的密封孔的中心轴线基本共线。
在一些实施例中，所述密封孔为圆形孔，所述密封孔的孔径的取值范围为0.5毫米～2毫米。
在一些实施例中，所述封装结构还包括：设置在所述第一基板与所述第二基板之间且位于所述第一基板的周边区域的第三密封结构，所述第一密封结构位于所述第三密封结构的周围，其中，所述第一基板、所述第二基板、所述第三密封结构形成用于将待封装器件封装于其中的密封腔体。
在一些实施例中，所述封装结构还包括：设置在所述第一基板与所述第二基板之间的支撑柱，所述第一基板、所述第二基板、所述支撑柱和所述第一密封结构形成用于将待封装器件封装于其中的密封腔体。
在一些实施例中，所述第一密封结构的形成材料包括紫外线UV胶，所述第三密封结构的形成材料包括玻璃料胶，所述UV胶的弹性度被设置为大于所述玻璃料胶的弹性度。
根据本公开另一方面，提供了一种封装方法，包括：提供第一基板和第二基板，所述第一基板与所述第二基板中的至少一个基板的周边区域设置有密封孔；将所述第一基板与所述第二基板相对设置，并将待封装器件设置在所述第一基板与所述第二基板之间；在所述第一基板与所述第二基板之间形成第一密封结构并在所述密封孔内形成第二密封结构，其中，所述第一密封结构位于所述第一基板的周边区域，并围绕所述待封装器件设置，并且其中，所述第一密封结构与所述第二密封结构粘接。
根据本公开又一方面，提供了一种封装方法，包括：提供第一基板和第二基板；将所述第一基板与所述第二基板相对设置，并将待封装器件设置在所述第一基板与所述第二基板之间；在所述第一基板与所述第二基板中的至少一个基板的周边区域形成密封孔；在所述第一基板与所述第二基板之间形成第一密封结构并在所述密封孔内形成第二密封结构，其中，所述第一密封结构位于所述第一基板的周边区域，并围绕所述待封装器件设置，并且其中，所述第一密封结构与所述第二密封结构粘接。
在一些实施例中，在所述第一基板与所述第二基板之间形成第一密封结构并在所述密封孔内形成第二密封结构包括：在所述第一基板与所述第二基板之间喷涂第一密封胶，并使所述第一密封胶在毛细力的作用下进入所述密封孔；对所述第一密封胶进行固化处理，从而在所述第一基板与所述第二基板之间形成所述第一密封结构，并在所述密封孔内形成第二密封结构。
在一些实施例中，所述密封孔被形成为在所述第一基板的周边区域和所述第二基板的周边区域均匀分布。
在一些实施例中，密封孔是通过采用激光打孔器在所述第一基板和所述第二基板中的至少一个基板的周边区域形成的。
在一些实施例中，所述方法还包括：在所述第一基板与所述第二基板中的至少一个基板的周边区域喷涂第二密封胶；其中将所述第一基板与所述第二基板相对设置使得所述第二密封胶和所述待封装器件在所述第一基板与所述第二基板之间；以及对所述第二密封胶进行固化处理，使所述第一基板与所述第二基板之间形成第三密封结构，其中，所述第一密封结构位于所述第三密封结构的周围。
在一些实施例中，所述方法还包括：在所述第一基板和所述第二基板中的至少一个基板上形成支撑柱，其中将所述第一基板与所述第二基板相对设置使得所述支撑柱在所述第一基板与所述第二基板之间。
在一些实施例中，所述第一密封结构的形成材料包括紫外线UV胶，所述第三密封结构的形成材料包括玻璃料胶，所述UV胶的弹性度被设置为大于所述玻璃料胶的弹性度。
根据本公开再一方面，提供了一种显示装置，包括：如前面以及下面任意方面或实施例所述的封装结构；以及有机发光二极管OLED器件，其被封装在所述封装结构中。
根据应当理解的是，以上的一般描述和后文的细节描述仅是示例性的，而不是对本发明的限制。
附图说明
为了更清楚地说明本公开实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图或实施例获得其他的附图或实施例。
图1A是相关技术提供的一种封装结构的示意图；
图1B是图1A所示的封装结构的密封结构与衬底基板分离的示意图；
图1C是图1A所示的封装结构的密封结构发生断裂的示意图；
图1D是图1A所示的封装结构的衬底基板和封装盖板发生破裂的示意图；
图2是本公开实施例提供的一种封装结构的示意图；
图3是本公开实施例提供的另一种封装结构的示意图；
图4是本公开实施例提供的一种封装结构的俯视图；
图5是本公开实施例提供的一种封装方法的方法流程图；
图6A是本公开实施例提供的另一种封装方法的方法流程图；
图6B是本公开实施例提供的一种将第一基板与第二基板相对设置的方法流程图；
图7A是本公开实施例提供的一种在第一基板上形成支撑柱后的结构示意图；
图7B是本公开实施例提供的一种对第二密封胶进行固化处理之后的结构示意图；
图7C本公开实施例提供的一种在基板的周边区域形成密封孔后的结构示意图；
图7D是图7C的俯视图；
图7E是本公开实施例提供的一种在第一基板与第二基板之间喷涂第一密封胶之后的结构示意图。
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。
具体实施方式
为了使本公开的目的、技术方案和优点更加清楚，下面将结合附图对本公开作进一步地详细描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本公开保护的范围。
OLED器件作为一种新兴的平板显示器件，被引起广泛的关注。然而，空气中水汽、氧气等成分很容易进入OLED器件，对OLED器件中的电极层和有机发光层进行侵蚀，使OLED器件的性能劣化，严重影响OLED的使用寿命。如果将OLED器件密封于无水无氧的环境中，那么OLED器件的使用寿命可以得到显著延长。通常可以采用封装结构对OLED器件进行封装，以将OLED器件密封于无水无氧的环境中，因此，OLED器件的封装技术成为提高OLED器件使 用寿命的关键技术。传统的封装结构可以为盖板封装结构，以保护OLED器件不受外界空气影响。
请参考图1A，其示出了相关技术提供的一种封装结构00的示意图，该封装结构可以为盖板封装结构。参见图1A，该封装结构00包括：相对设置的衬底基板001和封装盖板002，以及设置在衬底基板001和封装盖板002之间的密封结构003。OLED器件01设置在衬底基板001上，且位于有衬底基板001、封装盖板002和密封结构003形成的密封腔体内。密封结构003通常采用UV胶或Frit胶形成。当密封结构003采用Frit胶形成时，图1A所示的封装结构00也可以称为玻璃封装结构。
通常，在采用封装结构对OLED器件进行封装之后，需要对封装结构进行拉伸强度测试。当密封结构003采用Frit胶形成时，在对封装结构00进行拉伸强度测试时，通常会发生下列情况中的一种或多种：密封结构003与衬底基板001和/或封装盖板002分离，密封结构003断裂，衬底基板001和/或封装盖板002破裂等。因此，图1A所示的封装结构的机械强度较低。图1B示出的是密封结构003与衬底基板001分离的情况。如图1C示出的是密封结构003断裂的情况。图1D示出的是衬底基板001和封装盖板002发生破裂的情况。
为了增强封装结构00的机械强度，相关技术提出了另一种封装结构。在图1A所示的封装结构00的基础上，增加了包括采用UV胶形成且设置在密封结构003外侧的密封结构。由于UV胶的弹性度通常较大，因此，可以在一定程度上增强封装结构机械强度。但是，在对这样的封装结构进行拉伸强度测试时，该封装结构的机械强度仍然较低，仍然会发生密封结构与衬底基板001和/或封装盖板分离、密封结构断裂、衬底基板和/或封装盖板破裂等情况。
针对此，提出了本发明。根据本公开实施例提供的封装结构、封装方法以及显示装置，可以有效的增强封装结构的机械强度。下面对本公开实施例提供的封装结构、封装方法以及显示装置进行具体描述。
请参考图2，其示出了本公开一些实施例提供的一种封装结构02的示意图。参见图2，该封装结构02包括：相对设置的第一基板021和第二基板022，以及设置在第一基板021与第二基板022之间且位于第一基板021和/或第二基板022的周边区域(图2中未标出)的第一密封结构023。第一基板021与第二基板022中的至少一个基板的周边区域设置有密封孔(图2中未标出，如从图7C最佳地看出的)。密封孔内设置有第二密封结构024。第一密封结构023与第二密封结构024粘接。待封装器件03可以设置在第一基板021上；显然本公开不限于此。器件03被设置位于第一基板021、第二基板022和第一密封结构023围成的 密封腔体内。
通常，在本公开的一些实施例中，待封装器件03可以设置为与密封腔体的边缘离开预定距离，例如设置于腔体的中央，以便于形成围绕器件30的密封结构。对应地，待封装器件03(或其要被安装的区域)在第一基板或第二基板上的正投影(或其“覆盖面积(footprint)”)也可以被设置为离开相应基板的边缘预定距离，而密封孔(以及密封结构等)可以设置在待封装器件03(或其要被安装的区域)在第一基板或第二基板上的正投影与对应基板边缘之间的周边区域(如图4中的401所指示的)中。
在一些实施例中，如图2所示，第一密封结构023的尺寸(横向尺寸)大于密封孔的尺寸。
本公开实施例提供了一种封装结构，包括：相对设置的第一基板和第二基板，所述第一基板与所述第二基板中的至少一个基板的周边区域设置有密封孔；设置在所述第一基板与所述第二基板之间且位于所述第一基板的周边区域的第一密封结构；以及设置于所述密封孔内的第二密封结构，其中，所述第一密封结构与所述第二密封结构粘接。由于第一密封结构与第二密封结构粘接在一起，因此，可以增强封装结构的机械强度。另外，由于第一密封结构与密封孔中的第二密封结构粘接在一起，可以降低横向切应力的影响，从而有利于降低如图1D所示的基板破裂的几率。
可选地，第一基板021的周边区域和第二基板022的周边区域都设置有均匀分布的密封孔。例如，在一些实施例中，基板上的密封孔可以被设置为彼此以相等的距离分离开。在示例性的实施例中，如图中所示，基板上的密封孔可以被设置为围绕待封装器件的安装区域等距离分布。在一些实施例中，第一基板021上的密封孔与第二基板022上的密封孔可以一一对应。彼此对应的两个密封孔(第一基板021上的密封孔与第二基板022上的密封孔)在第一基板021所在平面上的正投影存在重叠区域。由于密封孔内设置有第二密封结构，因此，如图3所示，第一基板021的密封孔内设置的第二密封结构024与第二基板022的密封孔内设置的第二密封结构024可以一一对应。第一基板021的密封孔内设置的第二密封结构024在第一基板021所在平面上的正投影与第二基板022的密封孔内设置的第二密封结构024可以存在重叠区域。
可选地，所有的密封孔的结构可以彼此相同。任一密封孔的轴线可以包括沿着该密封孔的延伸方向(或长度方向)的纵轴线(包括中心轴线)和与纵轴线垂直的横轴线。在一些实施例中，任一密封孔的纵轴线可以被设置为与该密封孔所在的基板的板面(或者基板所在的平面)垂直。在一些实施例中，任一密封孔的横轴线可以被设置为与该密封孔所在的基板的 板面平行。示例地，第一基板021上的密封孔的纵轴线可以与第一基板021的板面垂直，第一基板021上的密封孔的横轴线可以与第一基板021的板面平行。在一些实施例中，任一密封孔的经过其中心轴线的纵轴截面的形状可以为矩形或梯形。在一些实施例中，密封孔的与所述纵轴截面垂直的横轴截面的形状可以为矩形、圆形或三角形。在一些实施例中，第一基板021和第二基板022的密封孔中彼此对应的两个密封孔可以被设置为其中心轴线共线。
密封孔的纵轴截面与该密封孔的纵轴线平行，密封孔的横截面与该密封孔的纵轴线垂直。在本公开的一些示例实施例中，如图2所示，密封孔的纵轴截面可以为梯形。另外，第一基板021上的密封孔与第二基板022上的密封孔可以一一对应，如图2所示。此外，彼此对应的两个密封孔的纵轴线(图中未示出)可以被设置为基本共线。
在本公开的一些实施例中，密封孔可以为圆形孔。密封孔的孔径的取值范围可以为例如0.5毫米～2毫米。在一些实施例中，密封孔为贯通孔。
进一步地，请参考图3，其示出了本公开一些实施例提供的另一种封装结构02的结构示意图。这里在图2的基础上，主要对图3所示的封装结构与图2所示的封装结构不同的部分进行说明。图3所示的封装结构中与图2所示的封装结构相同的部件被以相同的附图标记指示，并且这里省略对其重复说明。
参见图3，在图2的基础上，该封装结构02还包括：设置在第一基板021与第二基板022之间且位于第一基板021的周边区域的第三密封结构025。第一密封结构023可以位于第三密封结构025的周围。在一些实施例中，第一密封结构023可以位于第三密封结构025的外围。另外，在一些实施例中，第三密封结构025可以与第一密封结构023相接触。
请继续参考图3，在一些实施例中，该封装结构02还可以包括：设置在第一基板021与第二基板022之间的支撑柱026。在一些实施例中，第一基板021、第二基板022、支撑柱026和第一密封结构023共同形成用于封装待封装器件03的密封腔体。显然本公开不限于此，在一些实施例中，第一基板021、第二基板022和第一密封结构023可以共同形成用于封装待封装器件03的密封腔体，如图2所示。需要说明的是，实际应用中，密封结构(第一密封结构023和/或第三密封结构025)是通过对密封胶进行固化形成的，支撑柱026可以对第一基板021和第二基板022进行支撑，避免在对密封胶进行固化之前，第二基板022向待封装器件03施加压力，损坏待封装器件03。在一些实施例中，待封装器件03可以为OLED器件。
根据这些实施例，可以进一步增强封装结构的机械强度，并提供更好的密封。
图4是本公开实施例提供的一种封装结构的俯视图。参见图4，第一基板(图4中未示 出)与第二基板022之间设置有第一密封结构023和第三密封结构025。在图4所示的实施例中，第一密封结构023可以位于第三密封结构025的外侧。在第一基板的周边区域和第二基板022的周边区域都设置有均匀分布的密封孔(图4中未标出)。在该实施例中，密封孔被示出为圆形孔。密封孔内形成有第二密封结构024。第一基板的密封孔内设置的第二密封结构与第二基板022的密封孔内设置的第二密封结构024可以被设置为一一对应。第一基板的密封孔内设置的第二密封结构024在第一基板021所在平面上的正投影与第二基板022的密封孔内设置的第二密封结构024在第一基板021所在平面上的正投影可以具有重叠区域。需要说明的是，在图4中，虚线表示的结构位于第二基板022的下方，且该图4中未示出支撑柱。
可选地，第一密封结构023的形成材料包括UV胶。可选地，第三密封结构025的形成材料包括玻璃料胶。UV胶的弹性度可以设置为大于玻璃料胶的弹性度。第二密封结构024的形成材料与第一密封结构023的形成材料可以相同。根据本公开一些实施例，通过采用UV胶形成第一密封结构023和第二密封结构024，可以提高第一密封结构021和第二密封结构024的韧性和结合力，从而增强封装结构02的机械强度。
应理解，该实施例提供的封装结构可以进一步增强封装结构的机械强度。
下面结合附图说明根据本公开实施例提供的封装方法。下文中以及上面所说明的封装方法可以适当地与本公开实施例提供的封装结构结合。
请参考图5，其示出了根据本公开实施例提供的一种封装方法的方法流程图。该封装方法可以形成图2或图3所示的封装结构，从而对待封装器件进行封装。在一些实施例中，待封装器件可以为OLED器件。参见图5，该方法包括：
步骤501、提供第一基板和第二基板。
步骤502、将第一基板与第二基板相对设置，第一基板与第二基板之间形成有待封装器件和第一密封结构，第一密封结构位于第一基板的周边区域，第一基板与第二基板中的至少一个基板的周边区域设置有密封孔，密封孔内形成有第二密封结构，第一密封结构与第二密封结构粘接。
根据本公开实施例提供的封装方法，，可以提高其所形成的封装结构的机械强度。
可选地，在一些实施例中，
可以将第一基板与第二基板相对设置，使待封装器件在第一基板与第二基板之间；在第 一基板与第二基板中的至少一个基板的周边区域形成密封孔；在第一基板与第二基板之间喷涂第一密封胶，第一密封胶能够在毛细力的作用下进入密封孔；对第一密封胶进行固化处理，使第一基板与第二基板之间形成第一密封结构，密封孔内形成第二密封结构，且第一密封结构与第二密封结构粘接。
根据本公开的一些实施例，还提供了一种封装方法。所述封装方法可以包括：提供第一基板和第二基板，所述第一基板与所述第二基板中的至少一个基板的周边区域设置有密封孔。所述方法还包括：将所述第一基板与所述第二基板相对设置，并将待封装器件设置在所述第一基板与所述第二基板之间。所述方法还包括：在所述第一基板与所述第二基板之间形成第一密封结构并在所述密封孔内形成第二密封结构。所述第一密封结构可以位于所述第一基板的周边区域，并围绕所述待封装器件设置。所述第一密封结构与所述第二密封结构粘接。
根据本公开的另一实施例，还提供了一种封装方法。所述封装方法可以包括：提供第一基板和第二基板。所述封装方法还可以包括：将所述第一基板与所述第二基板相对设置，并将待封装器件设置在所述第一基板与所述第二基板之间。所述封装方法还可以包括：在所述第一基板与所述第二基板中的至少一个基板的周边区域形成密封孔。所述封装方法可以包括：在所述第一基板与所述第二基板之间形成第一密封结构并在所述密封孔内形成第二密封结构。所述第一密封结构可以位于所述第一基板的周边区域，并围绕所述待封装器件设置。所述第一密封结构与所述第二密封结构粘接。
如前所述的，第一密封结构可以与所述第二密封结构由相同的材料(例如UV胶)一体地形成。
可选地，在第一基板和第二基板中的至少一个基板的周边区域形成密封孔，包括：在第一基板的周边区域和第二基板的周边区域分别形成均匀分布的密封孔。也即，在第一基板的周边区域中，密封孔可以被形成为均匀分布。类似地，在第二基板的周边区域中，密封孔也可以被形成为均匀分布。
在一些实施例中，采用激光打孔器在第一基板和第二基板中的至少一个基板的周边区域形成密封孔。
可选地，在一些实施例中，封装方法还可以包括：在第一基板和第二基板中的至少一个基板上形成支撑柱。在这种情况下，将所述第一基板与所述第二基板相对设置还使得所述支撑柱在所述第一基板与所述第二基板之间。也就是说，支撑柱形成在第一基板和第二基板之间。
在一些实施例中，封装方法还可以包括：在第一基板与第二基板中的至少一个基板的周 边区域喷涂第二密封胶；
将第一基板与第二基板相对设置，使得所述第二密封胶(以及所述待封装器件)在第一基板与第二基板之间；对第二密封胶进行固化处理，使第一基板与第二基板之间形成有第三密封结构。
在一些实施例中，对第一密封胶进行固化处理(例如，通过照射紫外线(UV))，使第一基板与第二基板之间形成第一密封结构，并在密封孔内形成第二密封结构。从而，第一密封结构与第二密封结构粘接。在一些实施例中，第一密封结构位于第三密封结构的周围。
可选地，第一密封结构的形成材料可以包括紫外线UV胶。可选地，第三密封结构的形成材料可以包括玻璃料胶。在一些实施例中，UV胶的弹性度被设置为大于玻璃料胶的弹性度。
根据本公开实施例提供的封装方法，可以提高所形成的封装结构的机械强度。
请参考图6A，其示出了本公开实施例提供的另一种封装方法的方法流程图。该封装方法可以形成图2或图3所示的封装结构02，来对待封装器件进行封装。待封装器件可以为OLED器件。下面还将以形成图3所示的封装结构02为例来说明该封装方法。
参见图6A，该方法包括步骤601，在该步骤，提供第一基板和第二基板。在一些实施例中，第一基板和第二基板均可以为透明基板。具体地，第一基板和第二基板可以是采用玻璃、石英、透明树脂等具有一定坚固性的导光且非金属材料制成的基板。
在步骤602，将第一基板与第二基板相对设置，待封装器件设置在第一基板与第二基板之间。
在本公开实施例中，可以将第一基板与第二基板相对设置，待封装器件可以设置在第一基板与第二基板之间。在一些实施例中，待封装器件可以设置在第一基板上，例如，在非周边区域上。待封装器件可以为OLED器件。
在步骤603，在第一基板与第二基板中的至少一个基板的周边区域形成密封孔。可选地，可以采用激光打孔器在第一基板和第二基板中的至少一个基板的周边区域形成密封孔。在一些实施例中，第一基板上的密封孔均匀分布在第一基板的周边区域，第二基板上的密封孔均匀分布在第二基板的周边区域。
示例地，请参考图7C，其示出了在第一基板与第二基板中的至少一个基板的周边区域形成密封孔后的结构示意图。参见图7C，第一基板021的周边区域和第二基板022的周边区域都形成有密封孔k。在一些实施例中，第一基板021上的密封孔k与第二基板022上的密封孔k一一对应。在一些实施例中，彼此对应的两个密封孔k(第一基板021上的密封孔k与 第二基板022上的密封孔)在第一基板021所在平面上的正投影存在重叠区域。在一些实施例中，彼此对应的两个密封孔k的纵轴线可以被设置为基本共线。任一密封孔k的纵轴线可以被设置为与该任一密封孔k所在的基板的面垂直。图7D是图7C的俯视图，结合图7C和图7D，第一基板021上的密封孔k均匀分布在第一基板021的周边区域，第二基板022上的密封孔k均匀分布在第一基板021的周边区域。
这里，在图7C中还示出了支撑柱026和第三密封结构025，稍后将详细说明。
在步骤604，在第一基板与第二基板之间喷涂第一密封胶，第一密封胶能够在毛细力的作用下进入密封孔。在第一基板与第二基板中的至少一个基板的周边区域形成密封孔之后，可以在第一基板与第二基板之间喷涂第一密封胶，该第一密封胶能够在毛细力的作用下进入密封孔。第一密封胶可以为UV胶，该UV胶的弹性度通常大于玻璃料胶的弹性度。
在本公开的一些实施例中，密封孔可以为孔径在0.5毫米～2毫米的圆形孔。密封孔的孔径较小时，便于第一密封胶在毛细力的作用下进入密封孔。可选地，可以采用喷涂工艺在第一基板与第二基板之间喷涂第一密封胶。示例地，请参考图7E，其示出的是在第一基板与第二基板之间喷涂第一密封胶之后的结构示意图，参见图7E，在第一基板021与第二基板022之间喷涂第一密封胶J之后，该第一密封胶J在毛细力的作用下进入密封孔，并充填在密封孔内。密封孔中的第一密封胶J与第一基板021和第二基板022之间的第一密封胶J融合(也即，可以成为一体)。
在步骤605，对第一密封胶进行固化处理，使第一基板与第二基板之间形成第一密封结构023，并在密封孔内形成第二密封结构024。如此，第一密封结构与第二密封结构可以接合在一起。在一些实施例中，第一密封结构位于第三密封结构的周围，例如在第三密封结构的外侧。
可选地，第一密封胶可以为UV胶。可以采用紫外线对第一基板与第二基板之间的第一密封胶以及密封孔内的作为UV胶的第一密封胶进行照射，使第一密封胶中的光引发剂吸收紫外线后产生活性自由基或阳离子，引发第一密封胶中的单体发生化学反应，从而使第一密封胶固化。对第一密封胶进行固化处理后的结构示意图可以参考图3。参见图3，对第一密封胶进行固化处理后，第一基板021与第二基板022之间形成第一密封结构023，密封孔内形成第二密封结构024，且第一密封结构023与第二密封结构024粘接，且第一密封结构023位于第三密封结构025的外侧。
图6B示出了本公开另外的实施例提供的一种的部分封装方法的流程图。下面结合图6A 和图6B进行说明。上面就图6A以及其他附图和实施例所描述的内容可以同样地或适应性地适用于此。
在步骤601，提供第一基板和第二基板。
在步骤6021，在第一基板和第二基板中的至少一个基板上形成支撑柱。本公开实施例以在第一基板上形成支撑柱为例进行说明。请参考图7A，其示出的是在第一基板上形成支撑柱后的结构示意图，参见图7A，第一基板021的中央区域形成有待封装器件03，支撑柱026形成在第一基板021的周边区域，且支撑柱026可以为圆柱状结构。
在本公开实施例中，支撑柱026的形成材料可以为有机树脂材料。可选地，可以采用有机树脂材料在形成有待封装器件03的第一基板021上形成有机树脂层，然后通过一次构图工艺对有机树脂层进行处理得到支撑柱026。在一些实施例中，所述一次构图工艺可以包括：光刻胶涂覆、曝光、显影、刻蚀和光刻胶剥离。在一些实施例中，通过一次构图工艺对有机树脂层进行处理可以包括：采用涂覆工艺在有机树脂层上形成光刻胶层，采用掩膜版对光刻胶层进行曝光，使光刻胶层形成完全曝光区域和非曝光区域，之后采用显影工艺对曝光后的光刻胶层进行处理，使完全曝光区域的光刻胶去除，非曝光区域的光刻胶保留，然后采用刻蚀工艺对有机树脂层上与完全曝光区域对应的区域进行刻蚀，之后剥离非曝光区域的光刻胶，从而得到支撑柱026。需要说明的是，本公开实施例是以通过构图工艺形成支撑柱026为例进行说明的，但本公开并不限于此。在实际应用中，还可以先在其他位置形成支撑柱026，然后将支撑柱026粘贴在第一基板021的周边区域，以在第一基板021上形成支撑柱026，避免通过构图工艺在第一基板021上形成支撑柱026的过程对待封装器件03产生影响。
在子步骤6022，在第一基板与第二基板中的至少一个基板的周边区域喷涂第二密封胶。
在第一基板和第二基板中的至少一个基板上形成支撑柱之后，可以在第一基板与第二基板中的至少一个基板的周边区域喷涂第二密封胶。其中，第二密封胶可以为玻璃料胶。可选地，可以采用喷涂工艺、涂覆工艺等在第一基板与第二基板中的至少一个基板的周边区域喷涂第二密封胶。
示例地，可以采用喷涂工艺在第一基板的周边区域喷涂第二密封胶，该第二密封胶与支撑柱位于第一基板的同一板面上，并且第二密封胶位于支撑柱的外侧。
在子步骤6023，将第一基板与第二基板相对设置，使第一基板与第二基板之间形成有待封装器件和支撑柱。
在第一基板与第二基板中的至少一个基板的周边区域喷涂第二密封胶之后，可以将第一基板与第二基板相对设置，使第一基板与第二基板之间形成有待封装器件和支撑柱，且第二 密封胶位于第一基板与第二基板之间。具体地，可以将第二基板放置在支撑柱上，使第一基板与第二基板相对设置，且待封装器件、支撑柱和第二密封胶位于第一基板与第二基板之间。其中，支撑柱可以对第二基板进行支撑，避免第二基板与待封装器件接触向待封装器件施加压力，损坏待封装器件。
子步骤6024、对第二密封胶进行固化处理，使第一基板与第二基板之间形成有第三密封结构025。
将第一基板与第二基板相对设置之后，可以对第二密封胶进行固化处理，使第二密封胶形成第三密封结构，且第三密封结构位于第一基板与第二基板之间。在本公开实施例中，可以对第二密封胶进行加温烘烤使第二密封胶固化，或者，将第二密封胶静置预设时长，使第二密封胶固化。示例地，请参考图7B，其示出的是本公开实施例提供的一种对第一基板与第二基板之间的第二密封胶进行固化处理之后的结构示意图，参见图7B，对第二密封胶进行固化处理之后，第二密封胶形成第三密封结构025，第三密封结构025位于第一基板021与第二基板022之间，且第三密封结构025位于支撑柱026的外侧。
之后，可以进行与图6A中步骤603-605类似的操作。
在步骤603，在第一基板与第二基板中的至少一个基板的周边区域形成密封孔。
可选地，可以采用激光打孔器在第一基板和第二基板中的至少一个基板的周边区域形成密封孔。在一些实施例中，第一基板上的密封孔均匀分布在第一基板的周边区域，第二基板上的密封孔均匀分布在第二基板的周边区域。
示例地，请参考图7C，其示出的是在第一基板与第二基板中的至少一个基板的周边区域形成密封孔后的结构示意图。参见图7C，第一基板021的周边区域和第二基板022的周边区域都形成有密封孔k。第一基板021上的密封孔k与第二基板022上的密封孔k一一对应。彼此对应的两个密封孔k在第一基板021所在平面上的正投影存在重叠区域。彼此对应的两个密封孔k的纵轴线共线。在一些实施例中，任一密封孔k的纵轴线与该任一密封孔k所在的基板的板面垂直。图7D是图7C的俯视图，结合图7C和图7D，第一基板021上的密封孔k均匀分布在第一基板021的周边区域，第二基板022上的密封孔k均匀分布在第一基板021的周边区域。
在步骤604，在第一基板与第二基板之间喷涂第一密封胶，第一密封胶能够在毛细力的作用下进入密封孔。
在第一基板与第二基板中的至少一个基板的周边区域形成密封孔之后，可以在第一基板与第二基板之间喷涂第一密封胶，该第一密封胶能够在毛细力的作用下进入密封孔。第一密 封胶可以为UV胶，该UV胶的弹性度通常大于玻璃料胶的弹性度。在本公开一些实施例中，密封孔可以为孔径在0.5毫米～2毫米的圆形孔。由于该密封孔的孔径较小，便于第一密封胶在毛细力的作用下进入密封孔。可选地，可以采用喷涂工艺在第一基板与第二基板之间喷涂第一密封胶。示例地，请参考图7E，其示出的是在第一基板与第二基板之间喷涂第一密封胶之后的结构示意图。参见图7E，在第一基板021与第二基板022之间喷涂第一密封胶J之后，该第一密封胶J在毛细力的作用下进入密封孔，并充填在密封孔内，且密封孔的第一密封胶J与第一基板021和第二基板022之间的第一密封胶J融合。
在步骤605，对第一密封胶进行固化处理，使第一基板与第二基板之间形成第一密封结构，密封孔内形成第二密封结构，且第一密封结构与第二密封结构粘接。
在第一基板与第二基板之间喷涂第一密封胶之后，可以对第一密封胶进行固化处理，使第一密封胶固化，且第一基板与第二基板之间的第一密封胶形成第一密封结构，密封孔内的第一密封胶形成第二密封结构。第一密封结构与第二密封结构粘接。第一密封结构位于第三密封结构的周围。
可选地，第一密封胶可以为UV胶，可以采用紫外线对第一基板与第二基板之间的第一密封胶以及密封孔内的第一密封胶进行照射，使第一密封胶中的光引发剂吸收紫外线后产生活性自由基或阳离子，引发第一密封胶中的单体发生化学反应，从而使第一密封胶固化。对第一密封胶进行固化处理后的结构示意图可以参考图3。参见图3，对第一密封胶进行固化处理后，第一基板021与第二基板022之间形成第一密封结构023，并在密封孔内形成第二密封结构024。第一密封结构023与第二密封结构024粘接。第一密封结构023位于第三密封结构025的外侧。
根据本公开实施例提供的封装方法，可以提高所形成的封装结构的机械强度。
本公开实施例还提供了一种显示装置，该显示装置可以包括根据本公开任意实施例(例如，结合图2或图3所描述的实施例等)所述的封装结构以及待封装器件(例如，OLED器件等)。
本公开中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。
本领域技术人员应当意识到，在上述实施例中描述操作(或步骤)之间的边界仅仅是说明性的。多个操作可以结合成单个操作，单个操作可以分布于附加的操作中，并且操作可以在时间上至少部分重叠地执行。而且，另选的实施例可以包括特定操作的多个实例，并且在其他各种实施例中可以改变操作顺序。但是，其它的修改、变化和替换同样是可能的。因此，本说明书和附图应当被看作是说明性的，而非限制性的。
虽然已经通过示例对本公开的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本公开的范围。在此公开的各实施例在适当时可以自由组合，而不脱离本公开的精神和范围。本领域的技术人员还应理解，可以对实施例进行多种修改而不脱离本公开的范围和精神。本公开的范围由所附权利要求来限定。

Claims (17)

  1. 一种封装结构，包括：
    相对设置的第一基板和第二基板，所述第一基板与所述第二基板中的至少一个基板的周边区域设置有密封孔；
    设置在所述第一基板与所述第二基板之间且位于所述第一基板的周边区域的第一密封结构；以及
    设置于所述密封孔内的第二密封结构，
    其中，所述第一密封结构与所述第二密封结构粘接。
  2. 根据权利要求1所述的封装结构，其中，所述第一基板的周边区域和所述第二基板的周边区域都设置有均匀分布的密封孔。
  3. 根据权利要求2所述的封装结构，其中，所述第一基板上的密封孔与所述第二基板上的密封孔一一对应，且彼此对应的所述第一基板上的密封孔与所述第二基板上的密封孔在所述第一基板所在平面上的正投影存在重叠区域。
  4. 根据权利要求3所述的封装结构，其中，
    任一所述密封孔的经过其中心轴线的纵轴截面的形状为矩形或梯形，其与所述纵轴截面垂直的横轴截面的形状为矩形、圆形或三角形，
    彼此对应的所述第一基板的密封孔和所述第二基板的密封孔的中心轴线基本共线。
  5. 根据权利要求1所述的封装结构，其中，所述密封孔为圆形孔，所述密封孔的孔径的取值范围为0.5毫米～2毫米。
  6. 根据权利要求1至5任一所述的封装结构，还包括：
    设置在所述第一基板与所述第二基板之间且位于所述第一基板的周边区域的第三密封结构，所述第一密封结构位于所述第三密封结构的周围，
    其中，所述第一基板、所述第二基板、所述第三密封结构形成用于将待封装器件封装于其中的密封腔体。
  7. 根据权利要求1至5任一所述的封装结构，还包括：
    设置在所述第一基板与所述第二基板之间的支撑柱，所述第一基板、所述第二基板、所述支撑柱和所述第一密封结构形成用于将待封装器件封装于其中的密封腔体。
  8. 根据权利要求6所述的封装结构，其中，所述第一密封结构的形成材料包括紫外线UV胶，所述第三密封结构的形成材料包括玻璃料胶，所述UV胶的弹性度被设置为大于所述玻璃料胶的弹性度。
  9. 一种封装方法，包括：
    提供第一基板和第二基板，所述第一基板与所述第二基板中的至少一个基板的周边区域设置有密封孔；
    将所述第一基板与所述第二基板相对设置，并将待封装器件设置在所述第一基板与所述第二基板之间，
    在所述第一基板与所述第二基板之间形成第一密封结构并在所述密封孔内形成第二密封结构，
    其中，所述第一密封结构位于所述第一基板的周边区域，并围绕所述待封装器件设置，并且
    其中，所述第一密封结构与所述第二密封结构粘接。
  10. 一种封装方法，包括：
    提供第一基板和第二基板；
    将所述第一基板与所述第二基板相对设置，并将待封装器件设置在所述第一基板与所述第二基板之间，
    在所述第一基板与所述第二基板中的至少一个基板的周边区域形成密封孔，
    在所述第一基板与所述第二基板之间形成第一密封结构并在所述密封孔内形成第二密封结构，
    其中，所述第一密封结构位于所述第一基板的周边区域，并围绕所述待封装器件设置，并且
    其中，所述第一密封结构与所述第二密封结构粘接。
  11. 根据权利要求9或10所述的方法，其中，在所述第一基板与所述第二基板之间形成第一密封结构并在所述密封孔内形成第二密封结构包括：
    在所述第一基板与所述第二基板之间喷涂第一密封胶，并使所述第一密封胶在毛细力的作用下进入所述密封孔；
    对所述第一密封胶进行固化处理，从而在所述第一基板与所述第二基板之间形成所述第一密封结构，并在所述密封孔内形成第二密封结构。
  12. 根据权利要求9或10所述的方法，其中：
    所述密封孔被形成为在所述第一基板的周边区域和所述第二基板的周边区域均匀分布。
  13. 根据权利要求9或10所述的方法，其中
    密封孔是通过采用激光打孔器在所述第一基板和所述第二基板中的至少一个基板的周边区域形成的。
  14. 根据权利要求9或10所述的方法，还包括：
    在所述第一基板与所述第二基板中的至少一个基板的周边区域喷涂第二密封胶；
    其中将所述第一基板与所述第二基板相对设置使得所述第二密封胶和所述待封装器件在所述第一基板与所述第二基板之间；以及
    对所述第二密封胶进行固化处理，使所述第一基板与所述第二基板之间形成第三密封结构，其中，所述第一密封结构位于所述第三密封结构的周围。
  15. 根据权利要求14所述的方法，还包括：
    在所述第一基板和所述第二基板中的至少一个基板上形成支撑柱，
    其中将所述第一基板与所述第二基板相对设置使得所述支撑柱在所述第一基板与所述第二基板之间。
  16. 根据权利要求14所述的方法，所述第一密封结构的形成材料包括紫外线UV胶，所述第三密封结构的形成材料包括玻璃料胶，所述UV胶的弹性度被设置为大于所述玻璃料胶的弹性度。
  17. 一种显示装置，包括：
    如权利要求1至8任一所述的封装结构；以及
    有机发光二极管OLED器件，其被密封在所述封装结构中。
PCT/CN2018/075470 2017-07-21 2018-02-06 封装结构、封装方法及显示装置 WO2019015303A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/097,665 US11165040B2 (en) 2017-07-21 2018-02-06 Package structure, packaging method and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710605623.5A CN107403871A (zh) 2017-07-21 2017-07-21 封装结构及封装方法、显示装置
CN201710605623.5 2017-07-21

Publications (1)

Publication Number Publication Date
WO2019015303A1 true WO2019015303A1 (zh) 2019-01-24

Family

ID=60402453

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/075470 WO2019015303A1 (zh) 2017-07-21 2018-02-06 封装结构、封装方法及显示装置

Country Status (3)

Country Link
US (1) US11165040B2 (zh)
CN (1) CN107403871A (zh)
WO (1) WO2019015303A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107403871A (zh) * 2017-07-21 2017-11-28 京东方科技集团股份有限公司 封装结构及封装方法、显示装置
CN109003951A (zh) * 2018-08-10 2018-12-14 云谷（固安）科技有限公司 封装结构、显示装置及封装结构制备方法
CN110109578A (zh) * 2019-04-22 2019-08-09 惠州市华星光电技术有限公司 封装结构及显示装置
CN114822229A (zh) * 2021-01-28 2022-07-29 鄂尔多斯市源盛光电有限责任公司 一种显示面板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106299154A (zh) * 2016-10-31 2017-01-04 昆山国显光电有限公司 显示装置及其封装工艺
CN106489301A (zh) * 2014-06-30 2017-03-08 夏普株式会社 电致发光装置
CN107403871A (zh) * 2017-07-21 2017-11-28 京东方科技集团股份有限公司 封装结构及封装方法、显示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035536A (ja) * 2005-07-29 2007-02-08 Rohm Co Ltd フラットパネルディスプレイ
KR101135542B1 (ko) * 2009-11-30 2012-04-17 삼성모바일디스플레이주식회사 유기전계 발광표시장치
KR101830271B1 (ko) * 2011-03-15 2018-02-21 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
US9368748B2 (en) * 2013-05-09 2016-06-14 Shenzhen China Star Optoelectronics Technology Co., Ltd. Display device and manufacturing method thereof
CN103367658B (zh) * 2013-07-17 2016-08-31 深圳市华星光电技术有限公司 一种玻璃封装结构和封装方法
CN203850302U (zh) * 2014-05-28 2014-09-24 京东方科技集团股份有限公司 一种有机发光显示装置
CN104882556B (zh) * 2015-06-08 2017-06-27 京东方科技集团股份有限公司 一种封装件及其封装方法、oled装置
CN105161512B (zh) * 2015-08-03 2019-02-19 京东方科技集团股份有限公司 显示用基板及其制作方法、显示面板及其制作方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106489301A (zh) * 2014-06-30 2017-03-08 夏普株式会社 电致发光装置
CN106299154A (zh) * 2016-10-31 2017-01-04 昆山国显光电有限公司 显示装置及其封装工艺
CN107403871A (zh) * 2017-07-21 2017-11-28 京东方科技集团股份有限公司 封装结构及封装方法、显示装置

Also Published As

Publication number Publication date
US11165040B2 (en) 2021-11-02
CN107403871A (zh) 2017-11-28
US20200259114A1 (en) 2020-08-13

Similar Documents

Publication Publication Date Title
US11165040B2 (en) Package structure, packaging method and display device
KR100716488B1 (ko) Ｅｌ 장치 기판의 박형화 방법
TWI593098B (zh) 有機發光顯示設備及其製造方法
US8323066B2 (en) Method of manufacturing flexible display device
US9391294B1 (en) OLED device, packaging method thereof and display device
US10153329B2 (en) Method of manufacturing display panel
US10026635B2 (en) Packaging apparatus and packaging device
JP2011124160A (ja) 表示装置
US9349997B2 (en) Display panel and method for fabrication thereof
US8236126B2 (en) Encapsulation method of environmentally sensitive electronic element
US10573832B2 (en) Flexible substrate and manufacturing method thereof, and flexible display device
WO2015100797A1 (zh) 柔性oled面板的制作方法
WO2018119886A1 (zh) 一种oled显示面板及oled显示面板的封装方法
JP7127566B2 (ja) 液晶デバイスの製造方法
WO2014205925A1 (zh) 封装基板、oled显示面板及其制造方法和显示装置
JP2007073285A (ja) 有機ｅｌ装置の製造方法、及び電子機器
CN114093902A (zh) 一种显示面板及其制作方法
JP2005302605A (ja) 半導体装置
JP2003187966A (ja) 発光装置
JP2003149649A (ja) スペーサー、画像表示装置、間隔保持方法、素子の転写方法、及び素子の配列方法
KR20140012347A (ko) 유기전계 발광소자의 제조방법
JP2015011763A (ja) Ｏｌｅｄ表示パネル及びその製造方法
JP6043675B2 (ja) ウェーハの加工方法
KR101794550B1 (ko) 지지기판과 그 제조방법 및 디스플레이 장치용 기판의 제조방법
JP2006343515A (ja) 液晶表示装置の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18834319

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 15/06/2020)

122 Ep: pct application non-entry in european phase

Ref document number: 18834319

Country of ref document: EP

Kind code of ref document: A1