WO2018233188A1 - Vehicle-mounted lens production assembly line - Google Patents

Vehicle-mounted lens production assembly line Download PDF

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Publication number
WO2018233188A1
WO2018233188A1 PCT/CN2017/110469 CN2017110469W WO2018233188A1 WO 2018233188 A1 WO2018233188 A1 WO 2018233188A1 CN 2017110469 W CN2017110469 W CN 2017110469W WO 2018233188 A1 WO2018233188 A1 WO 2018233188A1
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WO
WIPO (PCT)
Prior art keywords
front cover
sensor chip
disposed
loading
assembly
Prior art date
Application number
PCT/CN2017/110469
Other languages
French (fr)
Chinese (zh)
Inventor
徐巍
Original Assignee
惠州市德赛自动化技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠州市德赛自动化技术有限公司 filed Critical 惠州市德赛自动化技术有限公司
Publication of WO2018233188A1 publication Critical patent/WO2018233188A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • B23P21/004Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/006Vehicles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the invention relates to the field of automation equipment, and in particular to a vehicle lens assembly assembly line.
  • the existing vehicle lens assembly line manually assembles the first sensor chip and the second sensor chip to the front cover.
  • Such an assembly method requires a large number of assembly personnel, and the productivity of the assembly personnel is high under the production efficiency of the enterprise.
  • the present invention discloses an in-vehicle lens production assembly line including a front cover loading device, a first sensor chip assembly device, and a second sensor chip assembly device sequentially connected by a conveying device;
  • the front cover loading device comprises a front cover assembly frame, a front cover loading device and a front cover grasping device; the front cover assembly frame is connected to the first sensor chip assembly device by a conveying device, and the front cover assembly frame has a front cover placement area
  • the front cover loading device is disposed in the front cover placement area and is located on one side of the conveyor;
  • the front cover grasping device is disposed in the front cover assembly frame, and is located between the front cover loading device and the conveying device, and the front cover is grabbed
  • the device respectively corresponds to the front cover feeding device and the conveying device;
  • the first sensor chip assembly device includes a first sensor chip assembly frame, a first sensor chip loading device, and a first sensor chip grasping device; the first sensor chip assembly frame is respectively connected to the front cover assembly frame by a transfer device and The second sensor chip assembly device has a first sensor chip placement area; the first sensor chip loading device is disposed in the first sensor chip placement area and is located on one side of the transmission device; the first sensor chip is grasped The picking device is disposed in the first sensor chip assembly rack, and is located between the first sensor chip loading device and the transmitting device, and the first sensor chip grabbing device respectively corresponds to the first sensor chip loading device and the transmitting device;
  • the second sensor chip assembly device includes a second sensor chip assembly frame, a second sensor chip loading device, a burning device, and a second sensor chip grab device; the second sensor chip assembly rack passes The transfer device is connected to the first sensor chip assembly rack, the second sensor chip assembly frame has a second sensor chip placement area; the second sensor chip loading device is disposed in the second sensor chip placement area and is located on one side of the transfer device The burning device is disposed in the second sensor chip assembly frame and located at one end of the conveying device; the second sensor chip grasping device is disposed in the second sensor chip assembly frame, and is located in the second sensor chip loading device and the conveying device The second sensor chip grabbing device respectively corresponds to the second sensor chip loading device, the burning device and the transmitting device.
  • the present invention has the following advantages
  • the vehicle lens assembly line of the invention automatically assembles the first sensor chip and the second sensor chip to the front cover, thereby reducing the assembly personnel of the enterprise, improving the production efficiency of the enterprise, and reducing the labor intensity of the assembly personnel.
  • FIG. 1 is a schematic view of a vehicle lens assembly line according to an embodiment of the present invention.
  • FIG. 2 is another schematic view of a vehicle lens assembly line according to an embodiment of the present invention.
  • FIG 3 is a schematic view of a front cover loading device according to an embodiment of the present invention.
  • FIG. 4 is a schematic view of a front cover grasping device according to an embodiment of the present invention.
  • Fig. 5 is a schematic view of a dust removing device according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a first sensor chip assembly apparatus according to an embodiment of the invention.
  • FIG. 7 is a schematic diagram of a first sensor chip grabbing device according to an embodiment of the invention.
  • FIG. 8 is a schematic diagram of a height measuring device according to an embodiment of the present invention.
  • Figure 9 is a schematic view of a tear film device in accordance with an embodiment of the present invention.
  • FIG. 10 is a schematic diagram of a second sensor chip assembly apparatus according to an embodiment of the invention.
  • Figure 11 is a schematic view of a burning apparatus according to an embodiment of the present invention.
  • Figure 12 is a schematic illustration of a conveyor apparatus in accordance with an embodiment of the present invention.
  • Figure 13 is a schematic view of a lock screw device in accordance with an embodiment of the present invention.
  • first sensor chip “second sensor chip” and the like as used herein are not specifically meant to refer to the order or order, nor are they intended to limit the invention, but merely to distinguish between the same technical terms. Component or operation only.
  • FIG. 1 and FIG. 2 are respectively two schematic diagrams of a vehicle lens assembly line according to an embodiment of the invention.
  • the present invention discloses an in-vehicle lens production assembly line for producing an assembled vehicle lens, a front cover loading device automatically feeding a front cover, and a front cover loading device conveying a front cover to a first sensor chip assembly.
  • the first sensor chip assembly device assembles the first sensor chip to a predetermined position of the front cover, the first sensor chip assembly device transmits the front cover and the first sensor chip to the second sensor chip assembly device, and the second sensor chip assembly device
  • the second sensor chip is assembled to a predetermined position of the front cover.
  • the vehicle lens production assembly line includes a front cover loading device 1, a first sensor chip assembly device 2, and a second sensor chip assembly device 3 which are sequentially connected by a conveying device 4. At least one front cover tray 6 is placed on the front cover loading device 1, at least one first sensor chip tray 7 is placed in the first sensor chip assembly device 2, and at least one second sensor chip tray 8 is placed on the second sensor chip After assembling the device 3, the front cover loading device 1 automatically feeds the front cover to the conveying device 4, and the conveying device 4 transfers the front cover to the first sensor chip assembling device 2; then, the first sensor chip assembling device 2 will first sensor The chip is assembled to the front cover; then, the transfer device 4 transfers the front cover and the first sensor chip to the second sensor chip assembly device 3, and the second sensor chip assembly device 3 assembles the second sensor chip to the front cover, and the second sensor chip is located Above the first sensor chip; then, the second sensor chip assembly device 3 burns the first sensor chip and the second sensor chip to complete the work of assembling the vehicle lens.
  • the front cover loading apparatus 1 includes a front cover assembly frame 11, a front cover loading device 12, a front cover gripping device 13, and a dust removing device 14.
  • the front cover assembly frame 11 is connected to the first sensor chip assembly device 2 by a transfer device 4 having a front cover placement area 111.
  • the front cover loading device 12 is disposed in the front cover placement area 111, the front cover loading device 12 is located on one side of the conveyor 4.
  • the front cover gripping device 13 is disposed on the front cover assembly frame 11 , and the front cover gripping device 13 is located between the front cover loading device 12 and the conveying device 4 , and the front cover grasping device 13 respectively corresponds to the front cover loading device 12 and transmits Device 4.
  • the dust removing device 14 is disposed in the front cover assembly frame 11, the dust removing device 14 is located between the front cover loading device 12 and the front cover grasping device 13, the dust removing device 14 is located at one side of the conveying device 4, and the dust removing device 14 is corresponding to the front cover.
  • Device 13
  • At least one front cover tray 6 is placed on the front cover loading device 12; then, the front cover loading device 12 drives a single front cover tray 6 to the corresponding front cover gripping device 13, and the front cover gripping device 13 detects Whether the shape and size of the front cover are qualified, if the shape and size of the front cover are unqualified, the front cover grasping device 13 grabs the bad front cover, and the front cover grasping device 13 places the bad front cover in the defective product placement area; If the shape and size of the front cover are qualified, the front cover grasping device 13 grabs the front cover and moves to the corresponding dust removing device 14; after that, the front cover grasping device 13 places the front cover on the dust removing device 14, and the dust removing device 14 The dust of the front cover is removed; then, the front cover gripping device 13 drives the front cover to the station corresponding to the conveying device 4, the front cover gripping device 13 places the front cover on the conveying device 4, and the conveying device 4 transmits the front cover to the corresponding A sensor chip assembly device 2 station.
  • the front cover loading device 12 includes a front cover loading mount 121, a front cover loading guide 122, a first front cover loading drive member 123, a front cover pull member 124, and a second front cover loading. Drive element 125 and front cover clamp 126.
  • the front cover loading mount 121 is disposed on the front cover assembly frame 11 , and the front cover loading mount 121 is located between the front cover placement area 111 and the front cover gripping device 13 .
  • the front cover loading rail 122 is laid on the front cover loading mount 121.
  • the first front cover loading drive member 123 is disposed on the front cover loading guide 122, and the front cover pull member 124 is disposed on the first front cover loading driving member 123.
  • the front cover loading drive member 125 is disposed on the front cover assembly frame 11 , the front cover loading drive member 125 is located on the front cover loading mount 121 , and the front cover clamping member 126 is disposed on the second front cover loading drive member 125 . Output.
  • At least one front cover tray 6 is placed in the front cover placement area 111; then, the first front cover loading drive element 123 drives the front cover pull member 124 to move along the front cover loading rail 122 to correspond to at least one front cover tray 6
  • the front cover pull member 124 pulls a single front cover tray 6; then, the first front cover loading drive member 123 drives the front cover pull member 124 and the single front cover tray 6 along the front cover loading guide 122 moves to the station corresponding to the front cover gripping device 13, while the second front cover loading drive member 125 drives the front cover clamping member 126 to clamp a single front cover tray 6 to prevent a single front cover tray 6
  • the front cover gripping device 13 grips the front cover
  • the single front cover tray 6 moves; after that, the front cover gripping device 13 grasps the front cover.
  • the front cover loading device 12 further includes a front cover loading sensor 127.
  • the front cover loading sensor 127 is disposed at one end of the front cover loading rail 122, and the front cover loading rail 122 corresponds to a single front cover tray 6.
  • the first front cover loading driving element 123 drives the front cover pulling member 124 and the single front cover tray 6 to move along the front cover loading rail 122 to the corresponding front cover loading sensor 127, the front cover loading sensor 127 senses that a single front cover tray 6 is moved into position, and the first front cover loading drive member 123 stops driving.
  • the second front cover loading driving member 125 drives the front cover clamping member 126 to clamp a single front cover.
  • the front cover is grasped by the front cover gripping device 13 and the front cover loading sensor 127 senses whether the single front cover tray 6 has a front cover. If the front cover loading sensor 127 senses a single front cover tray 6 has The front cover gripping device 13 continues to work; if the front cover loading sensor 127 senses that the single front cover tray 6 has no front cover, the front cover loading device 1 issues an alarm prompting the worker to move away from the empty front cover. Tray 6.
  • the front cover gripping device 13 includes a front cover gripping robot arm 131, a front cover gripping fixture 132, a front cover gripping CCD 133, and a front cover gripping electric gripper 134.
  • the front cover grab robot 131 is disposed on the front cover assembly frame 11 and is located between the conveyor 4 and the front cover loading device 12.
  • the front cover grasping fixture 132 is disposed on the front cover grab robot 131.
  • the front cover grab CCD 133 is disposed on the front cover grab fixing member 132, and the front cover grabs the CCD 133 corresponding to the front cover loading device 12.
  • the front cover gripping electric gripper 134 is disposed on the front cover grip fixing member 132, and is located at a side of the front cover grabbing the CCD 133, the front cover gripping the electric gripper 134 corresponding to the front cover loading device 12, the dust removing device 14 and transmitting Device 4.
  • the front cover loading sensor 127 senses that the single front cover tray 6 has a front cover; then, the front cover grasping robot 131 drives the front cover grasping fixture 132 to move to a station corresponding to a single front cover tray 6, where At the same time, the front cover grab fixing member 132 drives the front cover to grasp the CCD 133 and the front cover grabs the electric gripper 134 to move to the position corresponding to the single front cover tray 6; then, the front cover grabs the CCD 133 to shoot in a single front cover Whether the front cover shape and size of the disc 6 are qualified, the front cover grabs the CCD 133 and photographs the coordinates of the front cover, and the front cover grabs the coordinates, shape and size of the front cover of the CCD 133 to the front cover loading device 1; then, the front cover Grab the mechanical arm 131 to drive the front cover to grab the electric gripper 134 clip The front cover of the single front cover tray 6 is taken; if the shape and size of the front cover are unqualified, the cover grabbing robot 131
  • the dust removing device 14 includes a dust removing and exhausting cylinder 141, a dust removing mounting cylinder 142, a dust removing cover plate 143, a dust removing rodless cylinder 144, a dust removing clamping cylinder 145, and a dust removing inverting cylinder 146.
  • the dust collecting and exhausting cylinder 141 is disposed in the front cover assembly frame 11 , and the dust removing and exhausting cylinder 141 is located between the front cover loading device 12 and the front cover grasping device 13 , and the dust removing and exhausting cylinder 141 is located at one side of the conveying device 4 .
  • the dust removing mounting cylinder 142 is disposed at the top end of the dust removing blower 141.
  • the dust removing cover 143 is movably connected to the top end of the dust removing mounting cylinder 142.
  • the dust removing rodless cylinder 144 is disposed on the side wall of the dust removing mounting cylinder 142, and the output end of the dust removing rodless cylinder 144 is connected to the dust removing cover 143.
  • the dust removing clamp cylinder 145 is disposed on the side wall of the dust removing mounting cylinder 142, and the dust removing clamping cylinder 145 is located on one side of the dust removing rodless cylinder 144.
  • the dust removing cylinder 146 is disposed on the side wall of the dust removing cylinder 142, and the dust removing cylinder 146 is located on the other side of the dust removing cylinder 144.
  • the output end of the dust removing cylinder 146 is connected to the output end of the dust removing cylinder 145.
  • the dust extraction air cylinder 141 and the dust removal installation cylinder 142 are connected to the air source.
  • the initial state of the dust removal device 14 is that the dust removal rodless cylinder 144 drives the dust removal cover 143 to leave the dust removal installation cylinder 142; then, the front cover grabs the electric clamping jaw 134 to cover the front cover.
  • the dust removing clamping cylinder 145 clamps the front cover; after that, the dust removing rodless cylinder 144 drives the dust removing cover 143 to connect the dust removing mounting cylinder 142, and the dust removing cover 143 and the dust removing mounting cylinder 142 form a dust removing space;
  • the dust exhausting cylinder 141 and the dust removing mounting cylinder 142 are connected to the air source to remove the dust on the front surface of the front cover; then, the dust removing cylinder 146 is removed.
  • the driving front cover is turned over to remove the dust on the reverse side of the front cover; after that, the dust removing suction cylinder 141 and the dust removing mounting cylinder 142 stop passing the air source, and the dust removing rodless cylinder 144 drives the dust removing cover 143 to leave the dust removing mounting cylinder 142;
  • the mechanical arm 131 drives the electric gripper 134 to grip the front cover.
  • the first sensor chip assembly apparatus 2 includes a first sensor chip assembly chassis 21, a first sensor chip loading device 22, a first sensor chip gripping device 23, a height measuring device 24, and a tear film device 25.
  • the first sensor chip assembly chassis 21 is respectively connected to the front cover assembly frame 11 and the second sensor chip assembly device 3 by the transfer device 4, and the first sensor chip assembly frame 21 has a first sensor chip placement area 211.
  • the first sensor chip loading device 22 is disposed in the first sensor chip placement area 211, and the first sensor chip loading device 22 is located on one side of the transfer device 4.
  • the first sensor chip gripping device 23 is disposed in the first sensor chip assembly frame 21, and the first sensor chip gripping device 23 is located between the first sensor chip loading device 22 and the transport device 4, and the first sensor chip grabbing device 23 Corresponding to the first sensor chip loading device 22 and the conveying device 4 respectively.
  • the height measuring device 24 is disposed on the first sensor chip assembly frame 21, the height measuring device 24 is located on the other side of the conveying device 4, and the height measuring device 24 corresponds to the conveying device 4.
  • the tear film device 25 is disposed on the first sensor chip assembly frame 21, the tear film device 25 is located on the other side of the transfer device 4, the tear film device 25 is located at one side of the height measuring device 24, and the tear film device 25 corresponds to the first sensor chip. Grab device 23. Referring to FIG.
  • the vehicle lens assembly assembly line further includes a lock screw device 5.
  • the lock screw device 5 is disposed on the first sensor chip assembly frame 21, the lock screw device 5 is located on one side of the tear film device 25, and the lock screw device 5 corresponds to the transfer device 4.
  • the screw feeder 9 is placed in the first sensor chip assembly frame 21, and the screw feeder 9 corresponds to the lock screw device 5.
  • the conveying device 4 transmits the front cover to the station corresponding to the first sensor chip gripping device 23; then, the first sensor chip grabbing device 23 detects the angle and coordinates of the first sensor chip located in the loading device 22 of the first sensor chip, A sensor chip grabbing device 23 grabs the first sensor chip located in the first sensor chip loading device 22; then, the first sensor chip grab device 23 drives the first sensor chip to move to the station corresponding to the tear film device 25.
  • the tear film device 25 tears the adhesive tape on the surface of the first sensor chip; then, the first sensor chip gripping device 23 transfers the first sensor chip to the corresponding transfer device 4, and the first sensor chip catches
  • the taking device 23 detects the angle and coordinates of the front cover of the conveying device 4, and the first sensor chip assembling device 2 matches the angle and coordinates of the first sensor chip with the angle and coordinates of the front cover, and the first sensor chip assembling device 2 controls the first
  • the sensor chip gripping device 23 operates, the first sensor chip gripping device 23 drives the first sensor chip to rotate to the angle and coordinates of the corresponding front cover, and the first sensor chip gripping device 23 assembles the first sensor chip to the front cover.
  • the conveyor 4 transmits the front cover and the first sensor chip to the workstation corresponding to the height measuring device 24, and the height measuring device 24 detects the height of the front cover and the first sensor chip, if the height of the front cover and the first sensor chip If the test fails, the first sensor chip assembly device 2 issues an alarm prompt; if the height of the front cover and the first sensor chip is qualified, the transfer device 4 transmits the front cover and the first sensor chip to the corresponding lock screw device 5;
  • the first sensor chip grabbing device 23 detects the coordinates of the four screw holes of the front cover and the first sensor chip, and the first sensor chip captures
  • the second sensor chip assembly device 2 controls the lock screw device 5 to screw the four screws to the front cover and the first sensor chip assembly device 2 a sensor chip, the front cover and the first sensor chip are fixedly fixed; then, the transfer device 4 transfers the front cover and the first sensor chip to the next station, and at the same time, the first sensor chip grab device 23 moves to the corresponding transfer The station of the device 4, the first sensor chip grabbing device 23
  • first sensor chip loading device 22 and the front cover loading device 12 are the same, and will not be described in detail herein.
  • FIG. 7 is a schematic diagram of a first sensor chip grabbing device 23 according to an embodiment of the invention.
  • the first sensor chip gripping device 23 includes a first gripping robot arm 231, a first gripping fixture 232, a first gripping CCD 233, a scan code gun 234, and a first gripping electric gripper 235.
  • the first gripping robot arm 231 is disposed on the first sensor chip assembly frame 21 and located between the first sensor chip loading device 22 and the transport device 4.
  • the first grasping fixture 232 is disposed on the first grab robot Arm 231.
  • the first grab CCD 233 is disposed on the first grab fixture 232 and corresponds to the first sensor chip loading device 22 .
  • the scan code gun 234 is disposed on the first grasping fixture 232 and located on one side of the first grab CCD 233, and the scan code gun 234 corresponds to the first sensor chip loading device 22.
  • the first grabbing electric gripper 235 is disposed between the first gripping fixture 232 and the first gripping CCD 233 and the scan code gun 234, and the first gripping electric gripper 235 corresponds to the first sensor chip loading device 22 and Transfer device 4.
  • the first sensor chip loading device 22 senses that at least one first sensor chip tray 7 has a first sensor chip; then, the first grab robot 231 drives the first grab fixing member 232 to move to corresponding at least one first sensor chip.
  • the first grasping fixture 232 drives the first grab CCD 233, the scan code gun 234 and the first grab motor jaw 235 to move to a station corresponding to the at least one first sensor chip tray 7; Then, the first grab CCD 233 captures whether the shape and size of the first sensor chip located in the at least one first sensor chip tray 7 are qualified, and the first grab CCD 233 transmits the shape and size of the first sensor chip to the first sensor chip assembly.
  • the first grab robot 231 drives the scan code gun 234 to move to a station corresponding to at least one first sensor chip tray 7, the scan code gun 234 scans the coordinates of the first sensor chip, and the scan code gun 234 will The coordinates of the first sensor chip are transmitted to the first sensor chip assembly device 2; then, the first grab robot 231 drives the first grab motor jaw 235 to move to the corresponding at least one first sensor The first tray grabs the first sensor chip; the first grab robot 231 drives the first grab fixture 232, the first grab CCD 233, and the scan code gun.
  • the first grabbing electric gripper 235 and the first sensor chip are moved to the station corresponding to the tear film device 25, and the tear film device 25 tears the adhesive tape of the first sensor chip; then, the grab robot arm 231 drives the first a grab fixing member 232, a first grab CCD 233, a scan code gun 234, a first grab electric gripper 235, and a first sensor chip are moved to a station corresponding to the transfer device 4; then, the first capture CCD 233 is located at a position
  • the front cover coordinates of the transport device 4, the first grab CCD 233 transmits the front cover coordinates to the first sensor chip assembly device 2, and the first sensor chip assembly device 2 calculates the first sensor chip coordinates and the front cover coordinates, so that the first sensor chip and the first sensor chip
  • the front cover is matched; then, the first grab CCD 233 places the first sensor chip on the front cover; then, the transfer device 4 transfers the front cover and the first sensor chip to the corresponding lock screw device 5, and the lock screw device 5 will Screw screw A front cover
  • the first grab CCD 233 photographs whether the front cover and the first sensor chip are screwed into position, and the first grab CCD 233 transmits whether the four screws are screwed into place to the first sensor chip assembly device 2; if the four screws are not screwed into place, The first sensor chip assembly device 2 issues an alarm prompt; if the four screws are screwed into place, the transfer device 4 transmits the front cover and the first sensor chip to the second sensor chip assembly device 3.
  • the height measuring device 24 includes a height measuring mount 241, a height measuring linear rail 242, a height measuring moving member 243, a height measuring driving element 244, and a height measuring sensor 245.
  • the height measuring mount 241 is a first sensor chip assembly frame 21, and the height measuring mount 241 is located on the other side of the conveyor 4.
  • the altimetry linear slide 242 is disposed on the altimetry mount 241, the altimetry moving member 243 is disposed on the altimetry linear slide 242, and the altimeter shifting member 243 is located above the altimetry mount 241.
  • the altimetry drive component 244 is disposed on the altimetry mount 241, the altimeter drive component 244 is located on one side of the altimetry linear slide 242, and the output of the altimeter drive component 244 is coupled to the altimeter shifter 243.
  • the altimeter sensor 245 is disposed on the altimetry moving member 243, the altimetry sensor 245 is located on one side of the altimetry driving element 244, and the altimeter sensor 245 is corresponding to the conveyor 4.
  • the transport device 4 transmits the front cover and the first sensor chip to the workstation corresponding to the height measuring device 24; after that, the altimetry driving component 244 drives the altimetry moving member 243 to move along the altimetry linear slide 242, and the altimetry moving member 243 drives the test
  • the high sensor 245 moves along the altimetry linear slide 242 to the station corresponding to the transfer device 4; thereafter, the altimeter sensor 245 detects the height of the front cover and the first sensor chip located at the transfer device 4, and the altimeter sensor 245 transmits the front cover Up to the first sensor chip assembly device 2, the first sensor chip assembly device 2 determines whether the heights of the front cover and the first sensor chip are qualified; if the heights of the front cover and the first sensor chip are unqualified, the first sensor chip assembly device 2, an alarm is issued; if the height of the front cover and the first sensor chip is qualified, the conveying device 4 transmits the front cover and the first sensor chip to the station corresponding to the locking screw device 5.
  • the tear film unit 25 includes a tear film mount 251, a tape placement wheel 252, a tape recovery wheel 253, a tear film drive member 254, a tear film timing pulley 255, and an electrostatic ion blowing duct 256.
  • the tear film mount 251 is disposed at The first sensor chip assembly frame 21, the tear film mount 251 is located on the other side of the transfer device 4, and the tear film mount 251 is located on one side of the height measuring device 24.
  • the tape placement wheel 252 is disposed on the tear film mount 251.
  • the tape recovery wheel 253 is disposed on the tear film mount 251, and the tape recovery wheel 253 is located on one side of the tape placement wheel 252.
  • the tear film driving member 254 is disposed on the tear film mount 251, and the tear film driving member 254 is located on one side of the tape recovery wheel 253.
  • the tear film timing pulleys 255 are respectively sleeved on the tape recovery wheel 253 and the tear film driving member 254.
  • the electrostatic ion blowing duct 256 is disposed on the tear film mounting seat 251, and the electrostatic ion blowing duct 256 is located between the tape placing wheel 252 and the tape collecting wheel 253.
  • the adhesive tape is placed on the tape placement wheel 252.
  • the adhesive tape is fixed to the tape recovery wheel 253, and the electrostatic ion blowing pipe 256 is connected to the electrostatic ion wind source.
  • the tear film driving component 254 drives the tear film timing belt wheel 255 to rotate, tearing the film.
  • the timing pulley 255 drives the tape recovery wheel 253 to rotate, and the tape recovery wheel 253 drives the adhesive paper movement at the tape placement wheel 252.
  • the first sensor chip grasping device 23 drives the first sensor chip to move to the corresponding electrostatic ion blowing pipe 256.
  • the station; the electrostatic ion blowing pipe 256 blows the adhesive tape, and the adhesive tape sticks to the adhesive tape of the first sensor chip.
  • FIG. 10 it is a schematic diagram of a second sensor chip assembly apparatus 3 according to an embodiment of the present invention.
  • the second sensor chip assembly apparatus 3 includes a second sensor chip assembly frame 31, a second sensor chip loading device 32, a programming device 33, and a second sensor chip grab device 34.
  • the second sensor chip assembly chassis 31 is connected to the first sensor chip assembly chassis 21 by a transfer device 4, and the second sensor chip assembly chassis 31 has a second sensor chip placement region 311.
  • the second sensor chip loading device 32 is disposed on the second sensor chip placement area 311, and the second sensor chip loading device 32 is located on one side of the transfer device 4.
  • the programming device 33 is disposed in the second sensor chip assembly chassis 31, and the programming device 33 is located at one end of the transfer device 4.
  • the second sensor chip gripping device 34 is disposed in the second sensor chip assembly frame 31, the second sensor chip gripping device 34 is located between the second sensor chip loading device 32 and the transport device 4, and the second sensor chip grabbing device 34 Corresponding to the second sensor chip loading device 32, the burning device 33 and the conveying device 4, respectively.
  • At least one second sensor chip tray 8 is placed in the second sensor chip placement area 311; then, the transfer device 4 transfers the front cover and the first sensor chip to the corresponding second sensor chip grabbing device 34;
  • the sensor chip grabbing device 34 detects that it is located at least A second sensor chip tray 8 is located at the second sensor chip angle and coordinates of the second sensor chip loading device 32, and the second sensor chip grab device 34 transmits the second sensor chip angle and coordinates to the second sensor chip assembly device 3.
  • the second sensor chip grabbing device 34 grabs the second sensor chip; then, the second sensor chip grabbing device 34 drives the second sensor chip to move to the corresponding transfer device 4; then, the second sensor chip catches
  • the taking device 34 captures the angle and coordinates of the front cover of the transfer device 4 and the first sensor chip, and the second sensor chip grabbing device 34 transmits the angle and coordinates of the front cover and the first sensor chip to the second sensor chip assembly device 3,
  • the second sensor chip assembly device 3 matches the second sensor chip and the front cover and the first sensor chip; then, the second sensor chip grab device 34 places the second sensor chip on the front cover and the first sensor chip; then, the transfer device 4 Transmitting the front cover, the first sensor chip and the second sensor chip to the corresponding lock screw device 5; second, second The sensor chip grabbing device 34 captures the hole position and coordinates of the second sensor chip and the front cover lock screw, and the second sensor chip grab device 34 transmits the hole position and coordinates of the second sensor chip and the front cover lock screw to the second The sensor chip assembly device 3
  • the second sensor chip loading device 32 is consistent with the structure and operation principle of the first sensor chip loading device 22 and the front cover loading device 12, and will not be described in detail herein.
  • the structure and operation principle of the second sensor chip grabbing device 34 and the first sensor chip grabbing device 23 are the same, and will not be described in detail herein.
  • the programming device 33 includes a programming mount 331, a four programming guides 332, a programming fixture 333, a programming drive component 334, a programming die 335, and a programming probe 336.
  • the programming mount 331 is disposed on the second sensor chip assembly frame 31, and the programming mount 331 is located at one end of the transfer device 4.
  • the four burn guides 332 are disposed on the burn-in mount 331.
  • the programming holder 333 is disposed at one end of the four burning guides 332, and the programming holder 333 is located above the programming mount 331.
  • the programming driving component 334 is disposed on the programming mounting block 331.
  • the programming driving component 334 is located on one side of the four burning guides 332.
  • the programming pressing block 335 is disposed at the output end of the programming driving component 334, and the programming pressing block 335 is provided.
  • the burn-in probe 336 is disposed in the burn-in mount 331, and the burn-in probe 336 is located between the four burn guides 332.
  • the programming driving component 334 drives the programming pressing block 335 to move up along the four burning guides 332; then, the second sensor chip grasping device 34 grabs the front cover, the first sensor chip and the second sensor chip to move to the programming.
  • the fixing base 333, the second sensor chip grabbing device 34 places the front cover, the first sensor chip and the second sensor chip in the programming holder 333; then, the programming driving component 334 drives the programming pressure block 335 along the four burning
  • the recording guide 332 is moved downward, and the burning block 335 drives the front cover, the first sensor chip and the second sensor chip to move downward, so that the first sensor chip and the second sensor chip contact the burning probe 336; then, the burning device 33 burns the predetermined program to the first sensor chip and the second sensor chip.
  • the transport device 4 includes a transport mount 41, a transport rail 42, at least one carrier 43, a first transplant mechanism 44, a second transplant mechanism 45, a carrier return rail 46, and a carrier reflow drive member 47.
  • the transfer mount 41 is disposed on the front cover assembly frame 11, the first sensor chip assembly frame 21, and the second sensor chip assembly frame 31.
  • the transfer mount 41 is located in the front cover placement area 111, the first sensor chip placement area 211, and The second sensor chip is placed on one side of the area 311.
  • the transfer guide 42 is laid on the transfer mount 41.
  • At least one carrier 43 is movably connected to the transport rail 42 , at least one carrier 43 is located above the transport mount 41 , and at least one carrier 43 corresponds to the front cover gripping device 13 , the first sensor chip gripping device 23 , and the height measuring device 24.
  • the first transplanting mechanism 44 is disposed on the front cover assembly frame 11 , and the first transplanting mechanism 44 is located between the front cover placing area 111 and the front cover grasping device 13 , and the first shifting The planting mechanism 44 is connected to one end of the conveying guide 42.
  • the second transplanting mechanism 45 is disposed in the second sensor chip assembly frame 31, the second transplanting mechanism 45 is located between the two placement areas 311 and the second sensor chip grasping device 34, and the second transplanting mechanism 45 is connected to the transfer rail 42. another side.
  • the carrier return rail 46 is placed on the transport mounting seat 41.
  • the carrier return rail 46 is disposed in parallel with the transport rail 42.
  • the two ends of the carrier return rail 46 are connected to the first transplanting mechanism 44 and the second transplanting mechanism 45, respectively.
  • the carrier reflow driving element 47 is disposed on the front cover assembly frame 11, the first sensor chip assembly frame 21 and the second sensor chip assembly frame 31, and the carrier reflow driving element 47 is located on one side of the transfer mount 41, the carrier The return drive element 47 is movably coupled to at least one carrier 43.
  • At least one front cover tray 6 is placed in the front cover placement area 111, at least one first sensor chip tray 7 is placed in the first sensor chip placement area 211, and at least one second sensor core tray 8 is placed on the second sensor chip placement
  • the front cover gripping device 13 grabs the front cover and places it on at least one carrier 43; at least one carrier 43 drives the front cover to move along the transport rail 42 to correspond to the first sensor chip gripping device 23.
  • the first sensor chip grabbing device 23 grabs the first sensor chip and places it on the front cover; then, at least one carrier 43 drives the front cover and the first sensor chip to move along the transport rail 42 to the corresponding height measuring device 24
  • the height measuring device 24 detects whether the height of the first sensor chip is placed on the front cover; and then the at least one carrier 43 drives the front cover and the first sensor chip to move along the transfer rail 42 to the corresponding locking screw device 5, and locks
  • the screw device 5 screws the four screws to the front cover and the first sensor chip, so that the first sensor chip is fixed to the front cover; then, at least one carrier 43 drives the front cover and the first sensor chip to move along the transfer guide 42 to a second sensor chip grabbing device 34, the second sensor chip grabbing device 34 grabs the second sensor chip and is placed on the front cover; and then, at least one carrier 43 drives the front cover, the first sensor chip and the second
  • the sensor chip moves along the transport rail 42 to the station corresponding to the lock screw device 5, and the lock screw device 5 screws the four screws to the
  • the first transplanting mechanism 44 and the second transplanting mechanism 45 have the same structure and operation principle.
  • the second transplanting mechanism 45 will be taken as an example to illustrate the first transplanting mechanism 44 and the first The structure and operation principle of the second transplanting mechanism 45.
  • the second transplanting mechanism 45 includes a transplanting mount 451, a first transplanting guide 452, a transplanting moving member 453, a transplanting driving member 454, and a second transplanting guide 455.
  • the transplanting mount 451 is disposed on the second sensor chip assembly frame 31, and the transplanting mount 451 is located on one side of the transfer mount 41.
  • the first transplanting guide 452 is disposed on the transplanting mount 451.
  • the transplanting moving member 453 is movably coupled to the first transplanting guide 452.
  • the transplanting drive element 454 is disposed on the transplant mount 451, the transplant drive element 454 is located on one side of the first transfer rail 452, and the output end of the transplant drive element 454 is coupled to the transfer mover 453.
  • the second transplanting guide rails 455 are disposed at the top end of the transplanting moving member 453, and the second transplanting guide rails 455 correspond to the transporting guide rails 42 and the carrier returning rails 46, respectively.
  • At least one carrier 43 is moved along the transport rail 42 to the second transplant rail 455; then, the transplant driving component 454 drives the transplant moving member 453 to move along the first transplant rail 452 to the corresponding carrier return rail 46.
  • the transplanting moving member 453 drives the second transplanting guide 455 and the at least one carrier 43 to move along the first transplanting guide 452 to the corresponding carrier return rail 46. Meanwhile, the second transplanting guide 455 connects the carrier. Reflow guide 46; at least one carrier 43 is moved along the second transfer rail 455 and the carrier return rail 46 to the first transplanting mechanism 44; the first transplanting mechanism 44 repeats the above operation to achieve at least one carrier 43 cycle Purpose of use.
  • the lock screw device 5 includes a lock screw robot 51, a lock screw drive member 52, and an electric screwdriver.
  • the lock screw robot arm 51 is disposed on the first sensor chip assembly frame 21, and the lock screw robot arm 51 is located on one side of the tear film device 25.
  • the lock screw drive member 52 is disposed on the lock screw robot arm 51.
  • the electric screwdriver 5 is disposed at the output end of the lock screw driving member 52, and the electric screwdriver 53 corresponds to the transfer device 4.
  • the first sensor chip grabbing device 23 detects the coordinates of the four screw holes of the front cover and the first sensor chip, and the first sensor chip grabbing device 23 transmits the coordinates of the four screw holes of the front cover and the first sensor chip to the first a sensor chip assembly device 2; then, the lock screw robot 51 drives the lock screw drive
  • the component 52 and the electric screwdriver 5 are moved to the position corresponding to the screw feeder 9; then, the locking screw driving component 52 drives the electric screwdriver 53 to move downward, and the electric screwdriver 53 absorbs a single screw; then, the locking screw robot 51
  • the drive lock screw driving component 52, the electric screwdriver batch 53 and the single screw are moved to the station corresponding to the conveying device 4; then, the locking screw driving component 52 drives the electric screwdriver batch 53 and the single screw to move down; then, the electric screwdriver batch 53
  • the single screw is screwed to the predetermined position of the first sensor chip and the front cover; after that, the locking screw device 5 repeats the above action, and the four screws
  • the planting mechanism 44, the transplanting drive component 454, the carrier reflow drive component 47, the lock screw robot arm 51, the lock screw drive component 52 and the electric screwdriver batch 53 are all electrically connected to the control PLC of the vehicle lens production assembly line, and the vehicle lens production assembly line
  • the control PLC controls the first front cover loading drive component 123, the second front cover loading drive component 125, the front cover loading sensor 127, the front cover grabbing robot 131, the front cover grabbing CCD 133, and the front cover gripping Electric gripper 134, dust removal, no rod gas Cylinder 144, dust-collecting cylinder 145, dust-reversing cylinder 146, first sensor chip loading device 22, first grab robot 231, first Grabbing CCD 233, scanning code gun 234, first grabbing electric gripper 235
  • the vehicle lens assembly line of the present invention automatically assembles the first sensor chip and the second sensor chip to the front cover, thereby reducing assembly personnel of the enterprise, improving production efficiency of the enterprise, and reducing assembly personnel. Labor intensity.

Abstract

A vehicle-mounted lens production assembly line, comprising a front cover feeding device (1), a first sensor chip assembling device (2) and a second sensor chip assembling device (3) which are sequentially connected by means of a conveyer (4). According to the vehicle-mounted lens production assembly line, a first sensor chip and a second sensor chip are automatically assembled to a front cover, and therefore, the number of assemblers of an enterprise is decreased, the production efficiency of the enterprise is improved, and the labor intensity of the assemblers is reduced.

Description

一种车载镜头生产组装线Vehicle lens production assembly line 技术领域Technical field
本发明涉及自动化设备领域,尤其涉及一种车载镜头生产组装线。The invention relates to the field of automation equipment, and in particular to a vehicle lens assembly assembly line.
背景技术Background technique
随着车载设备的应用越来越广泛,车载镜头需求数量也是大大提升。目前,现有的车载镜头组装线采取人工将第一传感器芯片及第二传感器芯片组装至前盖。此种组装方法企业需要较多的组装人员,企业的生产效率底下,组装人员的劳动强度大。With the increasing use of in-vehicle devices, the number of in-vehicle lens requirements has also increased significantly. At present, the existing vehicle lens assembly line manually assembles the first sensor chip and the second sensor chip to the front cover. Such an assembly method requires a large number of assembly personnel, and the productivity of the assembly personnel is high under the production efficiency of the enterprise.
发明内容Summary of the invention
为了解决上述技术问题,本发明揭示了一种车载镜头生产组装线,其包括通过传送装置依序连接的前盖上料设备、第一传感器芯片组装设备及第二传感器芯片组装设备;In order to solve the above technical problem, the present invention discloses an in-vehicle lens production assembly line including a front cover loading device, a first sensor chip assembly device, and a second sensor chip assembly device sequentially connected by a conveying device;
前盖上料设备包括前盖组装机架、前盖上料装置及前盖抓取装置;前盖组装机架通过传送装置连接第一传感器芯片组装设备,前盖组装机架具有前盖放置区;前盖上料装置设置于前盖放置区,并位于传送装置的一侧;前盖抓取装置设置于前盖组装机架,并位于前盖上料装置与传送装置间,前盖抓取装置分别对应前盖上料装置及传送装置;The front cover loading device comprises a front cover assembly frame, a front cover loading device and a front cover grasping device; the front cover assembly frame is connected to the first sensor chip assembly device by a conveying device, and the front cover assembly frame has a front cover placement area The front cover loading device is disposed in the front cover placement area and is located on one side of the conveyor; the front cover grasping device is disposed in the front cover assembly frame, and is located between the front cover loading device and the conveying device, and the front cover is grabbed The device respectively corresponds to the front cover feeding device and the conveying device;
第一传感器芯片组装设备包括第一传感器芯片组装机架、第一传感器芯片上料装置及第一传感器芯片抓取装置;第一传感器芯片组装机架通过传送装置分别连接前盖组装机架及第二传感器芯片组装设备,第一传感器芯片组装机架具有第一传感器芯片放置区;第一传感器芯片上料装置设置于第一传感器芯片放置区,并位于传送装置的一侧;第一传感器芯片抓取装置设置于第一传感器芯片组装机架,并位于第一传感器芯片上料装置与传送装置间,第一传感器芯片抓取装置分别对应第一传感器芯片上料装置及传送装置;以及The first sensor chip assembly device includes a first sensor chip assembly frame, a first sensor chip loading device, and a first sensor chip grasping device; the first sensor chip assembly frame is respectively connected to the front cover assembly frame by a transfer device and The second sensor chip assembly device has a first sensor chip placement area; the first sensor chip loading device is disposed in the first sensor chip placement area and is located on one side of the transmission device; the first sensor chip is grasped The picking device is disposed in the first sensor chip assembly rack, and is located between the first sensor chip loading device and the transmitting device, and the first sensor chip grabbing device respectively corresponds to the first sensor chip loading device and the transmitting device;
第二传感器芯片组装设备包括第二传感器芯片组装机架、第二传感器芯片上料装置、烧录装置及第二传感器芯片抓取装置;第二传感器芯片组装机架通 过传送装置连接第一传感器芯片组装机架,第二传感器芯片组装机架具有第二传感器芯片放置区;第二传感器芯片上料装置设置于第二传感器芯片放置区,并位于传送装置的一侧;烧录装置设置于第二传感器芯片组装机架,并位于传送装置的一端;第二传感器芯片抓取装置设置于第二传感器芯片组装机架,并位于第二传感器芯片上料装置与传送装置间,第二传感器芯片抓取装置分别对应第二传感器芯片上料装置、烧录装置及传送装置。The second sensor chip assembly device includes a second sensor chip assembly frame, a second sensor chip loading device, a burning device, and a second sensor chip grab device; the second sensor chip assembly rack passes The transfer device is connected to the first sensor chip assembly rack, the second sensor chip assembly frame has a second sensor chip placement area; the second sensor chip loading device is disposed in the second sensor chip placement area and is located on one side of the transfer device The burning device is disposed in the second sensor chip assembly frame and located at one end of the conveying device; the second sensor chip grasping device is disposed in the second sensor chip assembly frame, and is located in the second sensor chip loading device and the conveying device The second sensor chip grabbing device respectively corresponds to the second sensor chip loading device, the burning device and the transmitting device.
与现有技术相比,本发明具有以下优点Compared with the prior art, the present invention has the following advantages
本发明的车载镜头生产组装线自动将第一传感器芯片及第二传感器芯片组装至前盖,减少企业的组装人员,提升企业的生产效率,降低组装人员的劳动强度。The vehicle lens assembly line of the invention automatically assembles the first sensor chip and the second sensor chip to the front cover, thereby reducing the assembly personnel of the enterprise, improving the production efficiency of the enterprise, and reducing the labor intensity of the assembly personnel.
附图说明DRAWINGS
图1为本发明一实施例的车载镜头生产组装线的示意图。1 is a schematic view of a vehicle lens assembly line according to an embodiment of the present invention.
图2为本发明一实施例的车载镜头生产组装线的另一示意图。2 is another schematic view of a vehicle lens assembly line according to an embodiment of the present invention.
图3为本发明一实施例的前盖上料设备的示意图。3 is a schematic view of a front cover loading device according to an embodiment of the present invention.
图4为本发明一实施例的前盖抓取装置的示意图。4 is a schematic view of a front cover grasping device according to an embodiment of the present invention.
图5其为本发明一实施例的除尘装置的示意图。Fig. 5 is a schematic view of a dust removing device according to an embodiment of the present invention.
图6为本发明一实施例的第一传感器芯片组装设备的示意图。FIG. 6 is a schematic diagram of a first sensor chip assembly apparatus according to an embodiment of the invention.
图7为本发明一实施例的第一传感器芯片抓取装置的示意图。FIG. 7 is a schematic diagram of a first sensor chip grabbing device according to an embodiment of the invention.
图8为本发明一实施例的测高装置的示意图。FIG. 8 is a schematic diagram of a height measuring device according to an embodiment of the present invention.
图9为本发明一实施例的撕膜装置的示意图。Figure 9 is a schematic view of a tear film device in accordance with an embodiment of the present invention.
图10为本发明一实施例的第二传感器芯片组装设备的示意图。FIG. 10 is a schematic diagram of a second sensor chip assembly apparatus according to an embodiment of the invention.
图11为本发明一实施例的烧录装置的示意图。Figure 11 is a schematic view of a burning apparatus according to an embodiment of the present invention.
图12为本发明一实施例的传送装置的示意图。Figure 12 is a schematic illustration of a conveyor apparatus in accordance with an embodiment of the present invention.
图13为本发明一实施例的锁螺丝设备的示意图。Figure 13 is a schematic view of a lock screw device in accordance with an embodiment of the present invention.
具体实施方式 Detailed ways
以下将以图式揭露本发明的多个实施方式,为明确说明起见,许多实务上的细节将在以下叙述中一并说明。然而,应了解到,这些实务上的细节不应用以限制本发明。In the following, various embodiments of the invention are disclosed in the drawings. However, it should be understood that these practical details are not intended to limit the invention.
关于本文中所使用之“第一传感器芯片”、“第二传感器芯片”等,并非特别指称次序或顺位的意思,亦非用以限定本发明,其仅仅是为了区别以相同技术用语描述的组件或操作而已。The terms "first sensor chip", "second sensor chip" and the like as used herein are not specifically meant to refer to the order or order, nor are they intended to limit the invention, but merely to distinguish between the same technical terms. Component or operation only.
请参阅图1及图2,其分别为本发明一实施例的车载镜头生产组装线的两个示意图。如图所示,本发明揭示了一种车载镜头生产组装线,其用于生产组装车载镜头,前盖上料设备自动上料前盖,前盖上料设备传送前盖至第一传感器芯片组装设备,第一传感器芯片组装设备将第一传感器芯片组装至前盖的预定位置,第一传感器芯片组装设备传送前盖与第一传感器芯片至第二传感器芯片组装设备,第二传感器芯片组装设备将第二传感器芯片组装至前盖的预定位置。车载镜头生产组装线包括通过传送装置4依序连接的前盖上料设备1、第一传感器芯片组装设备2及第二传感器芯片组装设备3。至少一前盖料盘6置于前盖上料设备1,至少一第一传感器芯片料盘7置于第一传感器芯片组装设备2,至少一第二传感器芯片料盘8置于第二传感器芯片组装设备3;尔后,前盖上料设备1自动上料前盖至传送装置4,传送装置4传送前盖至第一传感器芯片组装设备2;尔后,第一传感器芯片组装设备2将第一传感器芯片组装至前盖;尔后,传送装置4传送前盖及第一传感器芯片至第二传感器芯片组装设备3,第二传感器芯片组装设备3将第二传感器芯片组装至前盖,第二传感器芯片位于第一传感器芯片的上方;尔后,第二传感器芯片组装设备3烧录第一传感器芯片及第二传感器芯片,完成组装车载镜头的工作。Please refer to FIG. 1 and FIG. 2 , which are respectively two schematic diagrams of a vehicle lens assembly line according to an embodiment of the invention. As shown in the figure, the present invention discloses an in-vehicle lens production assembly line for producing an assembled vehicle lens, a front cover loading device automatically feeding a front cover, and a front cover loading device conveying a front cover to a first sensor chip assembly. The first sensor chip assembly device assembles the first sensor chip to a predetermined position of the front cover, the first sensor chip assembly device transmits the front cover and the first sensor chip to the second sensor chip assembly device, and the second sensor chip assembly device The second sensor chip is assembled to a predetermined position of the front cover. The vehicle lens production assembly line includes a front cover loading device 1, a first sensor chip assembly device 2, and a second sensor chip assembly device 3 which are sequentially connected by a conveying device 4. At least one front cover tray 6 is placed on the front cover loading device 1, at least one first sensor chip tray 7 is placed in the first sensor chip assembly device 2, and at least one second sensor chip tray 8 is placed on the second sensor chip After assembling the device 3, the front cover loading device 1 automatically feeds the front cover to the conveying device 4, and the conveying device 4 transfers the front cover to the first sensor chip assembling device 2; then, the first sensor chip assembling device 2 will first sensor The chip is assembled to the front cover; then, the transfer device 4 transfers the front cover and the first sensor chip to the second sensor chip assembly device 3, and the second sensor chip assembly device 3 assembles the second sensor chip to the front cover, and the second sensor chip is located Above the first sensor chip; then, the second sensor chip assembly device 3 burns the first sensor chip and the second sensor chip to complete the work of assembling the vehicle lens.
再一并参阅图3,其为本发明一实施例的前盖上料设备1的示意图。如图所示,前盖上料设备1包括前盖组装机架11、前盖上料装置12、前盖抓取装置13及除尘装置14。前盖组装机架11通过传送装置4连接第一传感器芯片组装设备2,前盖组装机架11具有前盖放置区111。前盖上料装置12设置于前盖放置区 111,前盖上料装置12位于传送装置4的一侧。前盖抓取装置13设置于前盖组装机架11,前盖抓取装置13位于前盖上料装置12与传送装置4间,前盖抓取装置13分别对应前盖上料装置12及传送装置4。除尘装置14设置于前盖组装机架11,除尘装置14位于前盖上料装置12及前盖抓取装置13间,除尘装置14位于传送装置4的一侧,除尘装置14对应前盖抓取装置13。至少一前盖料盘6置于前盖上料装置12;尔后,前盖上料装置12驱动单个前盖料盘6至对应前盖抓取装置13的工位,前盖抓取装置13检测前盖的外形及尺寸是否合格,若前盖的外形及尺寸不合格,则前盖抓取装置13将不良前盖抓取,前盖抓取装置13将不良前盖置于不良品放置区;若前盖的外形及尺寸合格,则前盖抓取装置13抓取前盖移动至对应除尘装置14的工位;尔后,前盖抓取装置13将前盖置于除尘装置14,除尘装置14除去前盖的灰尘;尔后,前盖抓取装置13驱动前盖至对应传送装置4的工位,前盖抓取装置13将前盖置于传送装置4,传送装置4传送前盖至对应第一传感器芯片组装设备2的工位。Referring to FIG. 3 again, it is a schematic diagram of a front cover loading device 1 according to an embodiment of the invention. As shown, the front cover loading apparatus 1 includes a front cover assembly frame 11, a front cover loading device 12, a front cover gripping device 13, and a dust removing device 14. The front cover assembly frame 11 is connected to the first sensor chip assembly device 2 by a transfer device 4 having a front cover placement area 111. The front cover loading device 12 is disposed in the front cover placement area 111, the front cover loading device 12 is located on one side of the conveyor 4. The front cover gripping device 13 is disposed on the front cover assembly frame 11 , and the front cover gripping device 13 is located between the front cover loading device 12 and the conveying device 4 , and the front cover grasping device 13 respectively corresponds to the front cover loading device 12 and transmits Device 4. The dust removing device 14 is disposed in the front cover assembly frame 11, the dust removing device 14 is located between the front cover loading device 12 and the front cover grasping device 13, the dust removing device 14 is located at one side of the conveying device 4, and the dust removing device 14 is corresponding to the front cover. Device 13. At least one front cover tray 6 is placed on the front cover loading device 12; then, the front cover loading device 12 drives a single front cover tray 6 to the corresponding front cover gripping device 13, and the front cover gripping device 13 detects Whether the shape and size of the front cover are qualified, if the shape and size of the front cover are unqualified, the front cover grasping device 13 grabs the bad front cover, and the front cover grasping device 13 places the bad front cover in the defective product placement area; If the shape and size of the front cover are qualified, the front cover grasping device 13 grabs the front cover and moves to the corresponding dust removing device 14; after that, the front cover grasping device 13 places the front cover on the dust removing device 14, and the dust removing device 14 The dust of the front cover is removed; then, the front cover gripping device 13 drives the front cover to the station corresponding to the conveying device 4, the front cover gripping device 13 places the front cover on the conveying device 4, and the conveying device 4 transmits the front cover to the corresponding A sensor chip assembly device 2 station.
复参阅图3,前盖上料装置12包括前盖上料安装座121、前盖上料导轨122、第一前盖上料驱动元件123、前盖拉料件124、第二前盖上料驱动元件125及前盖卡紧件126。前盖上料安装座121设置于前盖组装机架11,前盖上料安装座121位于前盖放置区111与前盖抓取装置13间。前盖上料导轨122铺设于前盖上料安装座121。第一前盖上料驱动元件123设置于前盖上料导轨122,前盖拉料件124设置于第一前盖上料驱动元件123。前盖上料驱动元件125设置于前盖组装机架11,前盖上料驱动元件125位于前盖上料安装座121,前盖卡紧件126设置于第二前盖上料驱动元件125的输出端。至少一前盖料盘6置于前盖放置区111;而后,第一前盖上料驱动元件123驱动前盖拉料件124沿前盖上料导轨122移动至对应至少一前盖料盘6的工位,前盖拉料件124拉取单个前盖料盘6;尔后,第一前盖上料驱动元件123驱动前盖拉料件124及单个前盖料盘6沿前盖上料导轨122移动至对应前盖抓取装置13的工位,于此同时,第二前盖上料驱动元件125驱动前盖卡紧件126卡紧单个前盖料盘6,防止单个前盖料盘6在 前盖抓取装置13抓取前盖时,单个前盖料盘6移动;尔后,前盖抓取装置13抓取前盖。Referring to FIG. 3, the front cover loading device 12 includes a front cover loading mount 121, a front cover loading guide 122, a first front cover loading drive member 123, a front cover pull member 124, and a second front cover loading. Drive element 125 and front cover clamp 126. The front cover loading mount 121 is disposed on the front cover assembly frame 11 , and the front cover loading mount 121 is located between the front cover placement area 111 and the front cover gripping device 13 . The front cover loading rail 122 is laid on the front cover loading mount 121. The first front cover loading drive member 123 is disposed on the front cover loading guide 122, and the front cover pull member 124 is disposed on the first front cover loading driving member 123. The front cover loading drive member 125 is disposed on the front cover assembly frame 11 , the front cover loading drive member 125 is located on the front cover loading mount 121 , and the front cover clamping member 126 is disposed on the second front cover loading drive member 125 . Output. At least one front cover tray 6 is placed in the front cover placement area 111; then, the first front cover loading drive element 123 drives the front cover pull member 124 to move along the front cover loading rail 122 to correspond to at least one front cover tray 6 The front cover pull member 124 pulls a single front cover tray 6; then, the first front cover loading drive member 123 drives the front cover pull member 124 and the single front cover tray 6 along the front cover loading guide 122 moves to the station corresponding to the front cover gripping device 13, while the second front cover loading drive member 125 drives the front cover clamping member 126 to clamp a single front cover tray 6 to prevent a single front cover tray 6 In When the front cover gripping device 13 grips the front cover, the single front cover tray 6 moves; after that, the front cover gripping device 13 grasps the front cover.
复参阅图3,前盖上料装置12还包括前盖上料感应器127。前盖上料感应器127设置于前盖上料导轨122的一端,前盖上料导轨122对应单个前盖料盘6。第一前盖上料驱动元件123驱动前盖拉料件124及单个前盖料盘6沿前盖上料导轨122移动至对应前盖上料感应器127的工位,前盖上料感应器127感应单个前盖料盘6移动到位,第一前盖上料驱动元件123停止驱动工作,于此同时,第二前盖上料驱动元件125驱动前盖卡紧件126卡紧单个前盖料盘6;待前盖抓取装置13抓取前盖,前盖上料感应器127感应单个前盖料盘6是否具有前盖,若前盖上料感应器127感应单个前盖料盘6具有前盖,则前盖抓取装置13继续工作;若前盖上料感应器127感应单个前盖料盘6无前盖,则前盖上料设备1发出报警提示,提示工作人员搬离空前盖料盘6。Referring back to FIG. 3, the front cover loading device 12 further includes a front cover loading sensor 127. The front cover loading sensor 127 is disposed at one end of the front cover loading rail 122, and the front cover loading rail 122 corresponds to a single front cover tray 6. The first front cover loading driving element 123 drives the front cover pulling member 124 and the single front cover tray 6 to move along the front cover loading rail 122 to the corresponding front cover loading sensor 127, the front cover loading sensor 127 senses that a single front cover tray 6 is moved into position, and the first front cover loading drive member 123 stops driving. At the same time, the second front cover loading driving member 125 drives the front cover clamping member 126 to clamp a single front cover. The front cover is grasped by the front cover gripping device 13 and the front cover loading sensor 127 senses whether the single front cover tray 6 has a front cover. If the front cover loading sensor 127 senses a single front cover tray 6 has The front cover gripping device 13 continues to work; if the front cover loading sensor 127 senses that the single front cover tray 6 has no front cover, the front cover loading device 1 issues an alarm prompting the worker to move away from the empty front cover. Tray 6.
再一并参阅图4,其为本发明一实施例的前盖抓取装置13的示意图。如图所示,前盖抓取装置13包括前盖抓取机械手臂131、前盖抓取固定件132、前盖抓取CCD133及前盖抓取电动夹爪134。前盖抓取机械手臂131设置于前盖组装机架11,并位于传送装置4与前盖上料装置12间。前盖抓取固定件132设置于前盖抓取机械手臂131。前盖抓取CCD133设置于前盖抓取固定件132,前盖抓取CCD133对应前盖上料装置12。前盖抓取电动夹爪134设置于前盖抓取固定件132,并位于前盖抓取CCD133的一侧,前盖抓取电动夹爪134对应前盖上料装置12、除尘装置14及传送装置4。前盖上料感应器127感应单个前盖料盘6具有前盖;尔后,前盖抓取机械手臂131驱动前盖抓取固定件132移动至对应单个前盖料盘6的工位,于此同时,前盖抓取固定件132带动前盖抓取CCD133及前盖抓取电动夹爪134移动至对应单个前盖料盘6的工位;尔后,前盖抓取CCD133拍摄位于单个前盖料盘6的前盖外形及尺寸是否合格,前盖抓取CCD133一并拍摄前盖的坐标,前盖抓取CCD133传送前盖的坐标、外形及尺寸至前盖上料设备1;尔后,前盖抓取机械手臂131驱动前盖抓取电动夹爪134夹 取位于单个前盖料盘6的前盖;若前盖的外形及尺寸不合格,则盖抓取机械手臂131驱动前盖抓取固定件132、前盖抓取CCD133、前盖抓取电动夹爪134及前盖移动至对应不良品放置区的工位,前盖抓取电动夹爪134将不良品置于不良品放置区;若前盖的外形及尺寸合格,则前盖抓取机械手臂131驱动前盖抓取固定件132、前盖抓取CCD133、前盖抓取电动夹爪134及前盖移动至对应除尘装置14的工位,前盖抓取电动夹爪134将前盖置于除尘装置14,除尘装置14除去前盖的灰尘;尔后,前盖抓取机械手臂131驱动前盖抓取电动夹爪134抓取前盖;尔后,前盖抓取机械手臂131驱动抓取固定件132、前盖抓取CCD133、前盖抓取电动夹爪134及前盖移动至对应传送装置4的工位,前盖抓取电动夹爪134将前盖置于传送装置4。Referring to FIG. 4 again, it is a schematic diagram of a front cover grasping device 13 according to an embodiment of the present invention. As shown, the front cover gripping device 13 includes a front cover gripping robot arm 131, a front cover gripping fixture 132, a front cover gripping CCD 133, and a front cover gripping electric gripper 134. The front cover grab robot 131 is disposed on the front cover assembly frame 11 and is located between the conveyor 4 and the front cover loading device 12. The front cover grasping fixture 132 is disposed on the front cover grab robot 131. The front cover grab CCD 133 is disposed on the front cover grab fixing member 132, and the front cover grabs the CCD 133 corresponding to the front cover loading device 12. The front cover gripping electric gripper 134 is disposed on the front cover grip fixing member 132, and is located at a side of the front cover grabbing the CCD 133, the front cover gripping the electric gripper 134 corresponding to the front cover loading device 12, the dust removing device 14 and transmitting Device 4. The front cover loading sensor 127 senses that the single front cover tray 6 has a front cover; then, the front cover grasping robot 131 drives the front cover grasping fixture 132 to move to a station corresponding to a single front cover tray 6, where At the same time, the front cover grab fixing member 132 drives the front cover to grasp the CCD 133 and the front cover grabs the electric gripper 134 to move to the position corresponding to the single front cover tray 6; then, the front cover grabs the CCD 133 to shoot in a single front cover Whether the front cover shape and size of the disc 6 are qualified, the front cover grabs the CCD 133 and photographs the coordinates of the front cover, and the front cover grabs the coordinates, shape and size of the front cover of the CCD 133 to the front cover loading device 1; then, the front cover Grab the mechanical arm 131 to drive the front cover to grab the electric gripper 134 clip The front cover of the single front cover tray 6 is taken; if the shape and size of the front cover are unqualified, the cover grabbing robot 131 drives the front cover to grasp the fixing member 132, the front cover grabs the CCD 133, and the front cover grabs the electric clamp The claw 134 and the front cover are moved to the working position corresponding to the defective product placement area, and the front cover grabs the electric clamping jaw 134 to place the defective product in the defective product placement area; if the shape and size of the front cover are qualified, the front cover grabs the mechanical arm The 131 front cover grabs the fixing member 132, the front cover grabs the CCD 133, the front cover grabs the electric gripper 134, and the front cover moves to the corresponding dust removing device 14, and the front cover grabs the electric gripper 134 to place the front cover The dust removing device 14 removes the dust of the front cover; then, the front cover grabbing robot 131 drives the front cover to grab the electric gripper 134 to grasp the front cover; then, the front cover grabs the mechanical arm 131 to drive the grasping fixture 132. The front cover grabs the CCD 133, the front cover grabs the electric gripper 134, and the front cover moves to the corresponding conveying device 4, and the front cover grabs the electric gripper 134 to place the front cover on the conveying device 4.
再一并参阅图5,其为本发明一实施例的除尘装置14的示意图。如图所示,除尘装置14包括除尘抽风筒141、除尘安装筒142、除尘盖板143、除尘无杆气缸144、除尘夹紧气缸145及除尘翻转气缸146。除尘抽风筒141设置于前盖组装机架11,除尘抽风筒141位于前盖上料装置12及前盖抓取装置13间,除尘抽风筒141位于传送装置4的一侧。除尘安装筒142设置于除尘抽风筒141的顶端。除尘盖板143活动连接于除尘安装筒142的顶端。除尘无杆气缸144设置于除尘安装筒142的侧壁,除尘无杆气缸144的输出端连接除尘盖板143。除尘夹紧气缸145设置于除尘安装筒142的侧壁,除尘夹紧气缸145位于除尘无杆气缸144的一侧。除尘翻转气缸146设置于除尘安装筒142的侧壁,除尘翻转气缸146位于除尘无杆气缸144的另一侧,除尘翻转气缸146的输出端连接除尘夹紧气缸145的输出端。除尘抽风筒141及除尘安装筒142连接气源,除尘装置14的初始状态为除尘无杆气缸144驱动除尘盖板143离开除尘安装筒142;尔后,前盖抓取电动夹爪134将前盖置于除尘夹紧气缸145,除尘夹紧气缸145夹紧前盖;尔后,除尘无杆气缸144驱动除尘盖板143连接除尘安装筒142,除尘盖板143与除尘安装筒142形成一除尘空间;尔后,除尘抽风筒141及除尘安装筒142通入气源,除去前盖正面的灰尘;尔后,除尘翻转气缸146 驱动前盖翻转,除去前盖反面的灰尘;尔后,除尘抽风筒141及除尘安装筒142停止通入气源,除尘无杆气缸144驱动除尘盖板143离开除尘安装筒142;尔后,前盖抓取机械手臂131驱动电动夹爪134夹取前盖。Referring again to FIG. 5, a schematic diagram of a dust removal device 14 in accordance with an embodiment of the present invention. As shown in the figure, the dust removing device 14 includes a dust removing and exhausting cylinder 141, a dust removing mounting cylinder 142, a dust removing cover plate 143, a dust removing rodless cylinder 144, a dust removing clamping cylinder 145, and a dust removing inverting cylinder 146. The dust collecting and exhausting cylinder 141 is disposed in the front cover assembly frame 11 , and the dust removing and exhausting cylinder 141 is located between the front cover loading device 12 and the front cover grasping device 13 , and the dust removing and exhausting cylinder 141 is located at one side of the conveying device 4 . The dust removing mounting cylinder 142 is disposed at the top end of the dust removing blower 141. The dust removing cover 143 is movably connected to the top end of the dust removing mounting cylinder 142. The dust removing rodless cylinder 144 is disposed on the side wall of the dust removing mounting cylinder 142, and the output end of the dust removing rodless cylinder 144 is connected to the dust removing cover 143. The dust removing clamp cylinder 145 is disposed on the side wall of the dust removing mounting cylinder 142, and the dust removing clamping cylinder 145 is located on one side of the dust removing rodless cylinder 144. The dust removing cylinder 146 is disposed on the side wall of the dust removing cylinder 142, and the dust removing cylinder 146 is located on the other side of the dust removing cylinder 144. The output end of the dust removing cylinder 146 is connected to the output end of the dust removing cylinder 145. The dust extraction air cylinder 141 and the dust removal installation cylinder 142 are connected to the air source. The initial state of the dust removal device 14 is that the dust removal rodless cylinder 144 drives the dust removal cover 143 to leave the dust removal installation cylinder 142; then, the front cover grabs the electric clamping jaw 134 to cover the front cover. In the dust removing clamping cylinder 145, the dust removing clamping cylinder 145 clamps the front cover; after that, the dust removing rodless cylinder 144 drives the dust removing cover 143 to connect the dust removing mounting cylinder 142, and the dust removing cover 143 and the dust removing mounting cylinder 142 form a dust removing space; The dust exhausting cylinder 141 and the dust removing mounting cylinder 142 are connected to the air source to remove the dust on the front surface of the front cover; then, the dust removing cylinder 146 is removed. The driving front cover is turned over to remove the dust on the reverse side of the front cover; after that, the dust removing suction cylinder 141 and the dust removing mounting cylinder 142 stop passing the air source, and the dust removing rodless cylinder 144 drives the dust removing cover 143 to leave the dust removing mounting cylinder 142; The mechanical arm 131 drives the electric gripper 134 to grip the front cover.
再一并参阅图6,其为本发明一实施例的第一传感器芯片组装设备2的示意图。如图所示,第一传感器芯片组装设备2包括第一传感器芯片组装机架21、第一传感器芯片上料装置22、第一传感器芯片抓取装置23、测高装置24及撕膜装置25。第一传感器芯片组装机架21通过传送装置4分别连接前盖组装机架11及第二传感器芯片组装设备3,第一传感器芯片组装机架21具有第一传感器芯片放置区211。第一传感器芯片上料装置22设置于第一传感器芯片放置区211,第一传感器芯片上料装置22位于传送装置4的一侧。第一传感器芯片抓取装置23设置于第一传感器芯片组装机架21,第一传感器芯片抓取装置23位于第一传感器芯片上料装置22与传送装置4间,第一传感器芯片抓取装置23分别对应第一传感器芯片上料装置22及传送装置4。测高装置24设置于第一传感器芯片组装机架21,测高装置24位于传送装置4的另一侧,测高装置24对应传送装置4。撕膜装置25设置于第一传感器芯片组装机架21,撕膜装置25位于传送装置4的另一侧,撕膜装置25位于测高装置24的一侧,撕膜装置25对应第一传感器芯片抓取装置23。复参阅图1,车载镜头生产组装线还包括锁螺丝设备5。锁螺丝设备5设置于第一传感器芯片组装机架21,锁螺丝设备5位于撕膜装置25的一侧,锁螺丝设备5对应传送装置4。螺丝供料机9置于第一传感器芯片组装机架21,螺丝供料机9对应锁螺丝设备5。传送装置4传送前盖至对应第一传感器芯片抓取装置23的工位;尔后,第一传感器芯片抓取装置23检测位于第一传感器芯片上料装置22的第一传感器芯片角度及坐标,第一传感器芯片抓取装置23抓取位于第一传感器芯片上料装置22的第一传感器芯片;尔后,第一传感器芯片抓取装置23驱动第一传感器芯片移动至对应撕膜装置25的工位,撕膜装置25撕开第一传感器芯片表面的胶纸;尔后,第一传感器芯片抓取装置23传送第一传感器芯片至对应传送装置4的工位,第一传感器芯片抓 取装置23检测传送装置4的前盖的角度及坐标,第一传感器芯片组装设备2将第一传感器芯片角度及坐标与前盖的角度及坐标进行匹配,第一传感器芯片组装设备2控制第一传感器芯片抓取装置23工作,第一传感器芯片抓取装置23驱动第一传感器芯片旋转至对应前盖的角度及坐标,第一传感器芯片抓取装置23将第一传感器芯片组装至前盖的预定位置;尔后,传送装置4传送前盖及第一传感器芯片至对应测高装置24的工位,测高装置24检测前盖及第一传感器芯片的高度,若前盖及第一传感器芯片的高度不合格,则第一传感器芯片组装设备2发出报警提示;若前盖及第一传感器芯片的高度合格,则传送装置4传送前盖及第一传感器芯片至对应锁螺丝设备5的工位;尔后,第一传感器芯片抓取装置23检测前盖及第一传感器芯片的四个螺丝孔的坐标,第一传感器芯片抓取装置23将前盖及第一传感器芯片的四个螺丝孔的坐标传送至第一传感器芯片组装设备2,第一传感器芯片组装设备2控制锁螺丝设备5将四颗螺丝螺设于前盖及第一传感器芯片,使得前盖与第一传感器芯片固定稳固;尔后,传送装置4传送前盖及第一传感器芯片至下一工位,于此同时,第一传感器芯片抓取装置23移动至对应传送装置4的工位,第一传感器芯片抓取装置23检测四颗螺丝是否螺设到位,第一传感器芯片抓取装置23传送四颗螺丝是否螺设到位信号至第一传感器芯片组装设备2;若四颗螺丝没有螺设到位,第一传感器芯片组装设备2发出报警提示;若四颗螺丝螺设到位,则传送装置4传送前盖及第一传感器芯片至第二传感器芯片组装设备3。Referring to FIG. 6 again, it is a schematic diagram of a first sensor chip assembly device 2 according to an embodiment of the invention. As shown, the first sensor chip assembly apparatus 2 includes a first sensor chip assembly chassis 21, a first sensor chip loading device 22, a first sensor chip gripping device 23, a height measuring device 24, and a tear film device 25. The first sensor chip assembly chassis 21 is respectively connected to the front cover assembly frame 11 and the second sensor chip assembly device 3 by the transfer device 4, and the first sensor chip assembly frame 21 has a first sensor chip placement area 211. The first sensor chip loading device 22 is disposed in the first sensor chip placement area 211, and the first sensor chip loading device 22 is located on one side of the transfer device 4. The first sensor chip gripping device 23 is disposed in the first sensor chip assembly frame 21, and the first sensor chip gripping device 23 is located between the first sensor chip loading device 22 and the transport device 4, and the first sensor chip grabbing device 23 Corresponding to the first sensor chip loading device 22 and the conveying device 4 respectively. The height measuring device 24 is disposed on the first sensor chip assembly frame 21, the height measuring device 24 is located on the other side of the conveying device 4, and the height measuring device 24 corresponds to the conveying device 4. The tear film device 25 is disposed on the first sensor chip assembly frame 21, the tear film device 25 is located on the other side of the transfer device 4, the tear film device 25 is located at one side of the height measuring device 24, and the tear film device 25 corresponds to the first sensor chip. Grab device 23. Referring to FIG. 1, the vehicle lens assembly assembly line further includes a lock screw device 5. The lock screw device 5 is disposed on the first sensor chip assembly frame 21, the lock screw device 5 is located on one side of the tear film device 25, and the lock screw device 5 corresponds to the transfer device 4. The screw feeder 9 is placed in the first sensor chip assembly frame 21, and the screw feeder 9 corresponds to the lock screw device 5. The conveying device 4 transmits the front cover to the station corresponding to the first sensor chip gripping device 23; then, the first sensor chip grabbing device 23 detects the angle and coordinates of the first sensor chip located in the loading device 22 of the first sensor chip, A sensor chip grabbing device 23 grabs the first sensor chip located in the first sensor chip loading device 22; then, the first sensor chip grab device 23 drives the first sensor chip to move to the station corresponding to the tear film device 25. The tear film device 25 tears the adhesive tape on the surface of the first sensor chip; then, the first sensor chip gripping device 23 transfers the first sensor chip to the corresponding transfer device 4, and the first sensor chip catches The taking device 23 detects the angle and coordinates of the front cover of the conveying device 4, and the first sensor chip assembling device 2 matches the angle and coordinates of the first sensor chip with the angle and coordinates of the front cover, and the first sensor chip assembling device 2 controls the first The sensor chip gripping device 23 operates, the first sensor chip gripping device 23 drives the first sensor chip to rotate to the angle and coordinates of the corresponding front cover, and the first sensor chip gripping device 23 assembles the first sensor chip to the front cover. Position; afterwards, the conveyor 4 transmits the front cover and the first sensor chip to the workstation corresponding to the height measuring device 24, and the height measuring device 24 detects the height of the front cover and the first sensor chip, if the height of the front cover and the first sensor chip If the test fails, the first sensor chip assembly device 2 issues an alarm prompt; if the height of the front cover and the first sensor chip is qualified, the transfer device 4 transmits the front cover and the first sensor chip to the corresponding lock screw device 5; The first sensor chip grabbing device 23 detects the coordinates of the four screw holes of the front cover and the first sensor chip, and the first sensor chip captures The second sensor chip assembly device 2 controls the lock screw device 5 to screw the four screws to the front cover and the first sensor chip assembly device 2 a sensor chip, the front cover and the first sensor chip are fixedly fixed; then, the transfer device 4 transfers the front cover and the first sensor chip to the next station, and at the same time, the first sensor chip grab device 23 moves to the corresponding transfer The station of the device 4, the first sensor chip grabbing device 23 detects whether the four screws are screwed into place, and the first sensor chip grabbing device 23 transmits whether the four screws are screwed into place to the first sensor chip assembly device 2; The four screws are not screwed into place, and the first sensor chip assembly device 2 issues an alarm prompt; if the four screws are screwed into place, the transfer device 4 transmits the front cover and the first sensor chip to the second sensor chip assembly device 3.
具体应用时,上述的第一传感器芯片上料装置22与前盖上料装置12的结构及运行原理一致,于此不再细述。In the specific application, the structure and operation principle of the first sensor chip loading device 22 and the front cover loading device 12 are the same, and will not be described in detail herein.
再一并参阅图7,其为本发明一实施例的第一传感器芯片抓取装置23的示意图。如图所示,第一传感器芯片抓取装置23包括第一抓取机械手臂231、第一抓取固定件232、第一抓取CCD233、扫码枪234及第一抓取电动夹爪235。第一抓取机械手臂231设置于第一传感器芯片组装机架21,并位于第一传感器芯片上料装置22与传送装置4间。第一抓取固定件232设置于第一抓取机械手 臂231。第一抓取CCD233设置于第一抓取固定件232,并对应第一传感器芯片上料装置22。扫码枪234设置于第一抓取固定件232,并位于第一抓取CCD233的一侧,扫码枪234对应第一传感器芯片上料装置22。第一抓取电动夹爪235设置于第一抓取固定件232,并位于第一抓取CCD233与扫码枪234间,第一抓取电动夹爪235对应第一传感器芯片上料装置22及传送装置4。第一传感器芯片上料装置22感应至少一第一传感器芯片料盘7具有第一传感器芯片;尔后,第一抓取机械手臂231驱动第一抓取固定件232移动至对应至少一第一传感器芯片料盘7的工位,第一抓取固定件232带动第一抓取CCD233、扫码枪234及第一抓取电动夹爪235移动至对应至少一第一传感器芯片料盘7的工位;尔后,第一抓取CCD233拍摄位于至少一第一传感器芯片料盘7的第一传感器芯片的外形及尺寸是否合格,第一抓取CCD233传送第一传感器芯片的外形及尺寸至第一传感器芯片组装设备2;尔后,第一抓取机械手臂231驱动扫码枪234移动至对应至少一第一传感器芯片料盘7的工位,扫码枪234扫描第一传感器芯片的坐标,扫码枪234将第一传感器芯片的坐标传送至第一传感器芯片组装设备2;尔后,第一抓取机械手臂231驱动第一抓取电动夹爪235移动至对应至少一第一传感器芯片料盘7的工位,第一抓取电动夹爪235夹取第一传感器芯片;尔后,第一抓取机械手臂231驱动第一抓取固定件232、第一抓取CCD233、扫码枪234、第一抓取电动夹爪235及第一传感器芯片移动至对应撕膜装置25的工位,撕膜装置25撕开第一传感器芯片的胶纸;尔后,一抓取机械手臂231驱动第一抓取固定件232、第一抓取CCD233、扫码枪234、第一抓取电动夹爪235及第一传感器芯片移动至对应传送装置4的工位;尔后,第一抓取CCD233拍摄位于传送装置4的前盖坐标,第一抓取CCD233传送前盖坐标至第一传感器芯片组装设备2,第一传感器芯片组装设备2计算第一传感器芯片坐标与前盖坐标,使得第一传感器芯片与前盖匹配;尔后,第一抓取CCD233将第一传感器芯片置于前盖;尔后,传送装置4传送前盖与第一传感器芯片至对应锁螺丝设备5的工位,锁螺丝设备5将四颗螺丝螺设于前盖及第一传感器芯片;尔后, 第一抓取机械手臂231驱动第一抓取固定件232、第一抓取CCD233、扫码枪234、第一抓取电动夹爪235及第一传感器芯片移动至对应传送装置4的工位,第一抓取CCD233拍摄前盖与第一传感器芯片是否螺设到位,第一抓取CCD233传送四颗螺丝是否螺设到位信号至第一传感器芯片组装设备2;若四颗螺丝没有螺设到位,第一传感器芯片组装设备2发出报警提示;若四颗螺丝螺设到位,则传送装置4传送前盖及第一传感器芯片至第二传感器芯片组装设备3。Referring to FIG. 7, FIG. 7 is a schematic diagram of a first sensor chip grabbing device 23 according to an embodiment of the invention. As shown, the first sensor chip gripping device 23 includes a first gripping robot arm 231, a first gripping fixture 232, a first gripping CCD 233, a scan code gun 234, and a first gripping electric gripper 235. The first gripping robot arm 231 is disposed on the first sensor chip assembly frame 21 and located between the first sensor chip loading device 22 and the transport device 4. The first grasping fixture 232 is disposed on the first grab robot Arm 231. The first grab CCD 233 is disposed on the first grab fixture 232 and corresponds to the first sensor chip loading device 22 . The scan code gun 234 is disposed on the first grasping fixture 232 and located on one side of the first grab CCD 233, and the scan code gun 234 corresponds to the first sensor chip loading device 22. The first grabbing electric gripper 235 is disposed between the first gripping fixture 232 and the first gripping CCD 233 and the scan code gun 234, and the first gripping electric gripper 235 corresponds to the first sensor chip loading device 22 and Transfer device 4. The first sensor chip loading device 22 senses that at least one first sensor chip tray 7 has a first sensor chip; then, the first grab robot 231 drives the first grab fixing member 232 to move to corresponding at least one first sensor chip. The first grasping fixture 232 drives the first grab CCD 233, the scan code gun 234 and the first grab motor jaw 235 to move to a station corresponding to the at least one first sensor chip tray 7; Then, the first grab CCD 233 captures whether the shape and size of the first sensor chip located in the at least one first sensor chip tray 7 are qualified, and the first grab CCD 233 transmits the shape and size of the first sensor chip to the first sensor chip assembly. Device 2; Thereafter, the first grab robot 231 drives the scan code gun 234 to move to a station corresponding to at least one first sensor chip tray 7, the scan code gun 234 scans the coordinates of the first sensor chip, and the scan code gun 234 will The coordinates of the first sensor chip are transmitted to the first sensor chip assembly device 2; then, the first grab robot 231 drives the first grab motor jaw 235 to move to the corresponding at least one first sensor The first tray grabs the first sensor chip; the first grab robot 231 drives the first grab fixture 232, the first grab CCD 233, and the scan code gun. 234, the first grabbing electric gripper 235 and the first sensor chip are moved to the station corresponding to the tear film device 25, and the tear film device 25 tears the adhesive tape of the first sensor chip; then, the grab robot arm 231 drives the first a grab fixing member 232, a first grab CCD 233, a scan code gun 234, a first grab electric gripper 235, and a first sensor chip are moved to a station corresponding to the transfer device 4; then, the first capture CCD 233 is located at a position The front cover coordinates of the transport device 4, the first grab CCD 233 transmits the front cover coordinates to the first sensor chip assembly device 2, and the first sensor chip assembly device 2 calculates the first sensor chip coordinates and the front cover coordinates, so that the first sensor chip and the first sensor chip The front cover is matched; then, the first grab CCD 233 places the first sensor chip on the front cover; then, the transfer device 4 transfers the front cover and the first sensor chip to the corresponding lock screw device 5, and the lock screw device 5 will Screw screw A front cover and a first sensor chip; thereafter, The first grasping robot arm 231 drives the first grab fixing member 232, the first grab CCD 233, the scan code gun 234, the first grabbing electric gripper 235, and the first sensor chip to move to the corresponding conveying device 4. The first grab CCD 233 photographs whether the front cover and the first sensor chip are screwed into position, and the first grab CCD 233 transmits whether the four screws are screwed into place to the first sensor chip assembly device 2; if the four screws are not screwed into place, The first sensor chip assembly device 2 issues an alarm prompt; if the four screws are screwed into place, the transfer device 4 transmits the front cover and the first sensor chip to the second sensor chip assembly device 3.
再一并参阅图8,其为本发明一实施例的测高装置24的示意图。如图所示,测高装置24包括测高安装座241、测高线性滑轨242、测高移动件243、测高驱动元件244及测高传感器245。测高安装座241第一传感器芯片组装机架21,测高安装座241位于传送装置4的另一侧。测高线性滑轨242设置于测高安装座241,测高移动件243设置于测高线性滑轨242,测高移动件243位于测高安装座241的上方。测高驱动元件244设置于测高安装座241,测高驱动元件244位于测高线性滑轨242的一侧,测高驱动元件244的输出端连接测高移动件243。测高传感器245设置于测高移动件243,测高传感器245位于测高驱动元件244的一侧,测高传感器245对应传送装置4。传送装置4传送前盖及第一传感器芯片至对应测高装置24的工位;尔后,测高驱动元件244驱动测高移动件243沿测高线性滑轨242移动,测高移动件243带动测高传感器245沿测高线性滑轨242移动至对应传送装置4的工位;尔后,测高传感器245检测位于传送装置4的前盖及第一传感器芯片的高度,测高传感器245传送前盖的高度至第一传感器芯片组装设备2,第一传感器芯片组装设备2判定前盖及第一传感器芯片的高度是否合格;若前盖及第一传感器芯片的高度不合格,则第一传感器芯片组装设备2发出报警提示;若前盖及第一传感器芯片的高度合格,则传送装置4传送前盖及第一传感器芯片至对应锁螺丝设备5的工位。Referring again to FIG. 8, a schematic diagram of a height measuring device 24 in accordance with an embodiment of the present invention is shown. As shown, the height measuring device 24 includes a height measuring mount 241, a height measuring linear rail 242, a height measuring moving member 243, a height measuring driving element 244, and a height measuring sensor 245. The height measuring mount 241 is a first sensor chip assembly frame 21, and the height measuring mount 241 is located on the other side of the conveyor 4. The altimetry linear slide 242 is disposed on the altimetry mount 241, the altimetry moving member 243 is disposed on the altimetry linear slide 242, and the altimeter shifting member 243 is located above the altimetry mount 241. The altimetry drive component 244 is disposed on the altimetry mount 241, the altimeter drive component 244 is located on one side of the altimetry linear slide 242, and the output of the altimeter drive component 244 is coupled to the altimeter shifter 243. The altimeter sensor 245 is disposed on the altimetry moving member 243, the altimetry sensor 245 is located on one side of the altimetry driving element 244, and the altimeter sensor 245 is corresponding to the conveyor 4. The transport device 4 transmits the front cover and the first sensor chip to the workstation corresponding to the height measuring device 24; after that, the altimetry driving component 244 drives the altimetry moving member 243 to move along the altimetry linear slide 242, and the altimetry moving member 243 drives the test The high sensor 245 moves along the altimetry linear slide 242 to the station corresponding to the transfer device 4; thereafter, the altimeter sensor 245 detects the height of the front cover and the first sensor chip located at the transfer device 4, and the altimeter sensor 245 transmits the front cover Up to the first sensor chip assembly device 2, the first sensor chip assembly device 2 determines whether the heights of the front cover and the first sensor chip are qualified; if the heights of the front cover and the first sensor chip are unqualified, the first sensor chip assembly device 2, an alarm is issued; if the height of the front cover and the first sensor chip is qualified, the conveying device 4 transmits the front cover and the first sensor chip to the station corresponding to the locking screw device 5.
再一并参阅图9,其为本发明一实施例的撕膜装置25的示意图。如图所示,撕膜装置25包括撕膜安装座251、胶带放置轮252、胶带回收轮253、撕膜驱动元件254、撕膜同步带轮255及静电离子吹风管道256。撕膜安装座251设置于 第一传感器芯片组装机架21,撕膜安装座251位于传送装置4的另一侧,撕膜安装座251位于测高装置24的一侧。胶带放置轮252设置于撕膜安装座251。胶带回收轮253设置于撕膜安装座251,胶带回收轮253位于胶带放置轮252的一侧。撕膜驱动元件254设置于撕膜安装座251,撕膜驱动元件254位于胶带回收轮253的一侧。撕膜同步带轮255分别套设于胶带回收轮253与撕膜驱动元件254。静电离子吹风管道256设置于撕膜安装座251,静电离子吹风管道256位于胶带放置轮252与胶带回收轮253间。胶纸置于胶带放置轮252,胶纸的一端固定于胶带回收轮253,静电离子吹风管道256通入静电离子风源;尔后,撕膜驱动元件254驱动撕膜同步带轮255转动,撕膜同步带轮255带动胶带回收轮253转动,胶带回收轮253带动位于胶带放置轮252的胶纸移动;尔后,第一传感器芯片抓取装置23驱动第一传感器芯片移动至对应静电离子吹风管道256的工位;静电离子吹风管道256吹动胶纸,胶纸粘取位于第一传感器芯片的胶纸。Referring again to FIG. 9, a schematic diagram of a tear film device 25 in accordance with an embodiment of the present invention is shown. As shown, the tear film unit 25 includes a tear film mount 251, a tape placement wheel 252, a tape recovery wheel 253, a tear film drive member 254, a tear film timing pulley 255, and an electrostatic ion blowing duct 256. The tear film mount 251 is disposed at The first sensor chip assembly frame 21, the tear film mount 251 is located on the other side of the transfer device 4, and the tear film mount 251 is located on one side of the height measuring device 24. The tape placement wheel 252 is disposed on the tear film mount 251. The tape recovery wheel 253 is disposed on the tear film mount 251, and the tape recovery wheel 253 is located on one side of the tape placement wheel 252. The tear film driving member 254 is disposed on the tear film mount 251, and the tear film driving member 254 is located on one side of the tape recovery wheel 253. The tear film timing pulleys 255 are respectively sleeved on the tape recovery wheel 253 and the tear film driving member 254. The electrostatic ion blowing duct 256 is disposed on the tear film mounting seat 251, and the electrostatic ion blowing duct 256 is located between the tape placing wheel 252 and the tape collecting wheel 253. The adhesive tape is placed on the tape placement wheel 252. One end of the adhesive tape is fixed to the tape recovery wheel 253, and the electrostatic ion blowing pipe 256 is connected to the electrostatic ion wind source. Thereafter, the tear film driving component 254 drives the tear film timing belt wheel 255 to rotate, tearing the film. The timing pulley 255 drives the tape recovery wheel 253 to rotate, and the tape recovery wheel 253 drives the adhesive paper movement at the tape placement wheel 252. Thereafter, the first sensor chip grasping device 23 drives the first sensor chip to move to the corresponding electrostatic ion blowing pipe 256. The station; the electrostatic ion blowing pipe 256 blows the adhesive tape, and the adhesive tape sticks to the adhesive tape of the first sensor chip.
再一并参阅图10,其为本发明一实施例的第二传感器芯片组装设备3的示意图。如图所示,第二传感器芯片组装设备3包括第二传感器芯片组装机架31、第二传感器芯片上料装置32、烧录装置33及第二传感器芯片抓取装置34。第二传感器芯片组装机架31通过传送装置4连接第一传感器芯片组装机架21,第二传感器芯片组装机架31具有第二传感器芯片放置区311。第二传感器芯片上料装置32设置于第二传感器芯片放置区311,第二传感器芯片上料装置32位于传送装置4的一侧。烧录装置33设置于第二传感器芯片组装机架31,烧录装置33位于传送装置4的一端。第二传感器芯片抓取装置34设置于第二传感器芯片组装机架31,第二传感器芯片抓取装置34位于第二传感器芯片上料装置32与传送装置4间,第二传感器芯片抓取装置34分别对应第二传感器芯片上料装置32、烧录装置33及传送装置4。至少一第二传感器芯片料盘8置于第二传感器芯片放置区311;尔后,传送装置4传送前盖与第一传感器芯片至对应第二传感器芯片抓取装置34的工位;尔后,第二传感器芯片抓取装置34检测位于至少 一第二传感器芯片料盘8位于第二传感器芯片上料装置32的第二传感器芯片角度及坐标,第二传感器芯片抓取装置34传送第二传感器芯片角度及坐标至第二传感器芯片组装设备3;尔后,第二传感器芯片抓取装置34抓取第二传感器芯片;尔后,第二传感器芯片抓取装置34驱动第二传感器芯片移动至对应传送装置4的工位;尔后,第二传感器芯片抓取装置34拍摄传送装置4的前盖与第一传感器芯片的角度及坐标,第二传感器芯片抓取装置34传送前盖与第一传感器芯片的角度及坐标至第二传感器芯片组装设备3,第二传感器芯片组装设备3匹配第二传感器芯片与前盖、第一传感器芯片;尔后,第二传感器芯片抓取装置34将第二传感器芯片置于前盖与第一传感器芯片;尔后,传送装置4传送前盖、第一传感器芯片与第二传感器芯片至对应锁螺丝设备5的工位;尔后,第二传感器芯片抓取装置34拍摄第二传感器芯片与前盖锁螺丝的的孔位与坐标,第二传感器芯片抓取装置34传送第二传感器芯片与前盖锁螺丝的的孔位与坐标至第二传感器芯片组装设备3;尔后,锁螺丝设备5将四颗螺丝螺设于第二传感器芯片与前盖,使得第二传感器芯片固定于前盖;尔后,第二传感器芯片抓取装置34拍摄第二传感器芯片与前盖,第二传感器芯片抓取装置34传送拍摄的第二传感器芯片与前盖至第二传感器芯片组装设备3,第二传感器芯片组装设备3判定第二传感器芯片与前盖是否螺设到位;若第二传感器芯片与前盖螺设不到位,则第二传感器芯片组装设备3发出报警提示;若第二传感器芯片与前盖螺设到位,则传送装置4传送前盖、第一传感器芯片与第二传感器芯片至对应烧录装置33的工位;尔后,第二传感器芯片抓取装置34抓取前盖、第一传感器芯片与第二传感器芯片移动至烧录装置33的工位;尔后,烧录装置33将预定程序烧录至第一传感器芯片与第二传感器芯片,完成组装车载镜头的工作。Still referring to FIG. 10, it is a schematic diagram of a second sensor chip assembly apparatus 3 according to an embodiment of the present invention. As shown, the second sensor chip assembly apparatus 3 includes a second sensor chip assembly frame 31, a second sensor chip loading device 32, a programming device 33, and a second sensor chip grab device 34. The second sensor chip assembly chassis 31 is connected to the first sensor chip assembly chassis 21 by a transfer device 4, and the second sensor chip assembly chassis 31 has a second sensor chip placement region 311. The second sensor chip loading device 32 is disposed on the second sensor chip placement area 311, and the second sensor chip loading device 32 is located on one side of the transfer device 4. The programming device 33 is disposed in the second sensor chip assembly chassis 31, and the programming device 33 is located at one end of the transfer device 4. The second sensor chip gripping device 34 is disposed in the second sensor chip assembly frame 31, the second sensor chip gripping device 34 is located between the second sensor chip loading device 32 and the transport device 4, and the second sensor chip grabbing device 34 Corresponding to the second sensor chip loading device 32, the burning device 33 and the conveying device 4, respectively. At least one second sensor chip tray 8 is placed in the second sensor chip placement area 311; then, the transfer device 4 transfers the front cover and the first sensor chip to the corresponding second sensor chip grabbing device 34; The sensor chip grabbing device 34 detects that it is located at least A second sensor chip tray 8 is located at the second sensor chip angle and coordinates of the second sensor chip loading device 32, and the second sensor chip grab device 34 transmits the second sensor chip angle and coordinates to the second sensor chip assembly device 3. Then, the second sensor chip grabbing device 34 grabs the second sensor chip; then, the second sensor chip grabbing device 34 drives the second sensor chip to move to the corresponding transfer device 4; then, the second sensor chip catches The taking device 34 captures the angle and coordinates of the front cover of the transfer device 4 and the first sensor chip, and the second sensor chip grabbing device 34 transmits the angle and coordinates of the front cover and the first sensor chip to the second sensor chip assembly device 3, The second sensor chip assembly device 3 matches the second sensor chip and the front cover and the first sensor chip; then, the second sensor chip grab device 34 places the second sensor chip on the front cover and the first sensor chip; then, the transfer device 4 Transmitting the front cover, the first sensor chip and the second sensor chip to the corresponding lock screw device 5; second, second The sensor chip grabbing device 34 captures the hole position and coordinates of the second sensor chip and the front cover lock screw, and the second sensor chip grab device 34 transmits the hole position and coordinates of the second sensor chip and the front cover lock screw to the second The sensor chip assembly device 3; after that, the locking screw device 5 screws the four screws to the second sensor chip and the front cover, so that the second sensor chip is fixed to the front cover; then, the second sensor chip grasping device 34 takes the second The sensor chip and the front cover, the second sensor chip grabbing device 34 transmits the captured second sensor chip and the front cover to the second sensor chip assembly device 3, and the second sensor chip assembly device 3 determines whether the second sensor chip and the front cover are snail If the second sensor chip and the front cover are not screwed, the second sensor chip assembly device 3 issues an alarm prompt; if the second sensor chip and the front cover are screwed into place, the transfer device 4 transmits the front cover, first The sensor chip and the second sensor chip are connected to the workstation of the corresponding burning device 33; then, the second sensor chip grabbing device 34 grabs the front cover and the first sensing Chip and the second station to move the sensor chip programming device 33; thereafter, programming device 33 to a first predetermined programming in the sensor chip and the second sensor chip, the completion of the assembly of the vehicle-mounted camera.
具体应用时,上述的第二传感器芯片上料装置32与第一传感器芯片上料装置22、前盖上料装置12的结构及运行原理一致,于此不再细述。In the specific application, the second sensor chip loading device 32 is consistent with the structure and operation principle of the first sensor chip loading device 22 and the front cover loading device 12, and will not be described in detail herein.
具体应用时,上述的第二传感器芯片抓取装置34与第一传感器芯片抓取装置23的结构及运行原理一致,于此不再细述。 In the specific application, the structure and operation principle of the second sensor chip grabbing device 34 and the first sensor chip grabbing device 23 are the same, and will not be described in detail herein.
再一并参阅图11,其为本发明一实施例的烧录装置33的示意图。如图所示,烧录装置33包括烧录安装座331、四根烧录导杆332、烧录固定座333、烧录驱动元件334、烧录压块335及烧录探针336。烧录安装座331设置于第二传感器芯片组装机架31,烧录安装座331位于传送装置4的一端。四根烧录导杆332设置于烧录安装座331。烧录固定座333设置于四根烧录导杆332的一端,烧录固定座333位于烧录安装座331的上方。烧录驱动元件334设置于烧录安装座331,烧录驱动元件334位于四根烧录导杆332一侧,烧录压块335设置于烧录驱动元件334的输出端,烧录压块335位于烧录固定座333的上方。烧录探针336设置于烧录安装座331,烧录探针336位于四根烧录导杆332间。烧录驱动元件334驱动烧录压块335沿四根烧录导杆332上移;尔后,第二传感器芯片抓取装置34抓取前盖、第一传感器芯片与第二传感器芯片移动至烧录固定座333,第二传感器芯片抓取装置34将前盖、第一传感器芯片与第二传感器芯片置于烧录固定座333;尔后,烧录驱动元件334驱动烧录压块335沿四根烧录导杆332下移,烧录压块335带动前盖、第一传感器芯片与第二传感器芯片下移,使得第一传感器芯片与第二传感器芯片接触烧录探针336;尔后,烧录装置33将预定程序烧录至第一传感器芯片与第二传感器芯片。Referring again to FIG. 11, a schematic diagram of a programming device 33 according to an embodiment of the present invention is shown. As shown, the programming device 33 includes a programming mount 331, a four programming guides 332, a programming fixture 333, a programming drive component 334, a programming die 335, and a programming probe 336. The programming mount 331 is disposed on the second sensor chip assembly frame 31, and the programming mount 331 is located at one end of the transfer device 4. The four burn guides 332 are disposed on the burn-in mount 331. The programming holder 333 is disposed at one end of the four burning guides 332, and the programming holder 333 is located above the programming mount 331. The programming driving component 334 is disposed on the programming mounting block 331. The programming driving component 334 is located on one side of the four burning guides 332. The programming pressing block 335 is disposed at the output end of the programming driving component 334, and the programming pressing block 335 is provided. Located above the burning fixture 333. The burn-in probe 336 is disposed in the burn-in mount 331, and the burn-in probe 336 is located between the four burn guides 332. The programming driving component 334 drives the programming pressing block 335 to move up along the four burning guides 332; then, the second sensor chip grasping device 34 grabs the front cover, the first sensor chip and the second sensor chip to move to the programming. The fixing base 333, the second sensor chip grabbing device 34 places the front cover, the first sensor chip and the second sensor chip in the programming holder 333; then, the programming driving component 334 drives the programming pressure block 335 along the four burning The recording guide 332 is moved downward, and the burning block 335 drives the front cover, the first sensor chip and the second sensor chip to move downward, so that the first sensor chip and the second sensor chip contact the burning probe 336; then, the burning device 33 burns the predetermined program to the first sensor chip and the second sensor chip.
再一并参阅图12,其为本发明一实施例的传送装置4的示意图。如图所示,传送装置4包括传送安装座41、传送导轨42、至少一载具43、第一移栽机构44、第二移栽机构45、载具回流导轨46及载具回流驱动元件47。传送安装座41设置于前盖组装机架11、第一传感器芯片组装机架21及第二传感器芯片组装机架31,传送安装座41位于前盖放置区111、第一传感器芯片放置区211及第二传感器芯片放置区311的一侧。传送导轨42铺设于传送安装座41。至少一载具43活动连接于传送导轨42,至少一载具43位于传送安装座41的上方,至少一载具43对应前盖抓取装置13、第一传感器芯片抓取装置23、测高装置24、第二传感器芯片抓取装置34及锁螺丝设备5。第一移栽机构44设置于前盖组装机架11,第一移栽机构44位于前盖放置区111与前盖抓取装置13间,第一移 栽机构44连接传送导轨42的一端。第二移栽机构45设置于第二传感器芯片组装机架31,第二移栽机构45位于二放置区311与第二传感器芯片抓取装置34间,第二移栽机构45连接传送导轨42的另一端。载具回流导轨46铺设于传送安装座41,载具回流导轨46与传送导轨42平行设置,载具回流导轨46的两端分别连接第一移栽机构44及第二移栽机构45。载具回流驱动元件47设置于前盖组装机架11、第一传感器芯片组装机架21及第二传感器芯片组装机架31,载具回流驱动元件47位于传送安装座41的一侧,载具回流驱动元件47活动连接至少一载具43。至少一前盖料盘6置于前盖放置区111,至少一第一传感器芯片料盘7放置于第一传感器芯片放置区211,至少一第二传感器芯料盘8放置于第二传感器芯片放置区311;尔后,前盖抓取装置13抓取前盖置于至少一载具43;尔后,至少一载具43带动前盖沿传送导轨42移动至对应第一传感器芯片抓取装置23的工位,第一传感器芯片抓取装置23抓取第一传感器芯片置于前盖;尔后,至少一载具43带动前盖与第一传感器芯片沿传送导轨42移动至对应测高装置24的工位,测高装置24检测第一传感器芯片置于前盖的高度是否合格;尔后,至少一载具43带动前盖与第一传感器芯片沿传送导轨42移动至对应锁螺丝设备5的工位,锁螺丝设备5将四颗螺丝螺设于前盖与第一传感器芯片,使得第一传感器芯片固定于前盖;尔后,至少一载具43带动前盖与第一传感器芯片沿传送导轨42移动至对应第二传感器芯片抓取装置34的工位,第二传感器芯片抓取装置34抓取第二传感器芯片置于前盖;尔后,,至少一载具43带动前盖、第一传感器芯片与第二传感器芯片沿传送导轨42移动至对应锁螺丝设备5的工位,锁螺丝设备5将四颗螺丝螺设于前盖与第二传感器芯片;尔后,至少一载具43带动前盖、第一传感器芯片与第二传感器芯片沿传送导轨42移动至第二移栽机构45,第二传感器芯片抓取装置34将前盖、第一传感器芯片与第二传感器芯片抓取移动至烧录装置33;尔后,第二移栽机构45驱动至少一载具43移动至载具回流导轨46;尔后,载具回流驱动元件47驱动至少一载具43移动至第一移栽机构44,第一移栽机构44驱动至少一载具43移动至传 送导轨42,第一移栽机构44与第二移栽机构45重复上述动作,达到至少一载具43循环使用的目的。Referring again to Figure 12, a schematic diagram of a conveyor 4 in accordance with one embodiment of the present invention is shown. As shown, the transport device 4 includes a transport mount 41, a transport rail 42, at least one carrier 43, a first transplant mechanism 44, a second transplant mechanism 45, a carrier return rail 46, and a carrier reflow drive member 47. . The transfer mount 41 is disposed on the front cover assembly frame 11, the first sensor chip assembly frame 21, and the second sensor chip assembly frame 31. The transfer mount 41 is located in the front cover placement area 111, the first sensor chip placement area 211, and The second sensor chip is placed on one side of the area 311. The transfer guide 42 is laid on the transfer mount 41. At least one carrier 43 is movably connected to the transport rail 42 , at least one carrier 43 is located above the transport mount 41 , and at least one carrier 43 corresponds to the front cover gripping device 13 , the first sensor chip gripping device 23 , and the height measuring device 24. A second sensor chip gripping device 34 and a lock screw device 5. The first transplanting mechanism 44 is disposed on the front cover assembly frame 11 , and the first transplanting mechanism 44 is located between the front cover placing area 111 and the front cover grasping device 13 , and the first shifting The planting mechanism 44 is connected to one end of the conveying guide 42. The second transplanting mechanism 45 is disposed in the second sensor chip assembly frame 31, the second transplanting mechanism 45 is located between the two placement areas 311 and the second sensor chip grasping device 34, and the second transplanting mechanism 45 is connected to the transfer rail 42. another side. The carrier return rail 46 is placed on the transport mounting seat 41. The carrier return rail 46 is disposed in parallel with the transport rail 42. The two ends of the carrier return rail 46 are connected to the first transplanting mechanism 44 and the second transplanting mechanism 45, respectively. The carrier reflow driving element 47 is disposed on the front cover assembly frame 11, the first sensor chip assembly frame 21 and the second sensor chip assembly frame 31, and the carrier reflow driving element 47 is located on one side of the transfer mount 41, the carrier The return drive element 47 is movably coupled to at least one carrier 43. At least one front cover tray 6 is placed in the front cover placement area 111, at least one first sensor chip tray 7 is placed in the first sensor chip placement area 211, and at least one second sensor core tray 8 is placed on the second sensor chip placement After the front cover gripping device 13 grabs the front cover and places it on at least one carrier 43; at least one carrier 43 drives the front cover to move along the transport rail 42 to correspond to the first sensor chip gripping device 23. Position, the first sensor chip grabbing device 23 grabs the first sensor chip and places it on the front cover; then, at least one carrier 43 drives the front cover and the first sensor chip to move along the transport rail 42 to the corresponding height measuring device 24 The height measuring device 24 detects whether the height of the first sensor chip is placed on the front cover; and then the at least one carrier 43 drives the front cover and the first sensor chip to move along the transfer rail 42 to the corresponding locking screw device 5, and locks The screw device 5 screws the four screws to the front cover and the first sensor chip, so that the first sensor chip is fixed to the front cover; then, at least one carrier 43 drives the front cover and the first sensor chip to move along the transfer guide 42 to a second sensor chip grabbing device 34, the second sensor chip grabbing device 34 grabs the second sensor chip and is placed on the front cover; and then, at least one carrier 43 drives the front cover, the first sensor chip and the second The sensor chip moves along the transport rail 42 to the station corresponding to the lock screw device 5, and the lock screw device 5 screws the four screws to the front cover and the second sensor chip; then, at least one carrier 43 drives the front cover and the first sensor The chip and the second sensor chip are moved along the transfer rail 42 to the second transplanting mechanism 45, and the second sensor chip gripping device 34 moves the front cover, the first sensor chip and the second sensor chip to the burning device 33; The second transplanting mechanism 45 drives at least one carrier 43 to move to the carrier return rail 46; then, the carrier reflow driving component 47 drives at least one carrier 43 to move to the first transplanting mechanism 44, and the first transplanting mechanism 44 Driving at least one carrier 43 to move to The guide rails 42, the first transplanting mechanism 44 and the second transplanting mechanism 45 repeat the above-described operations to achieve the purpose of recycling at least one of the carriers 43.
具体应用时,上述的第一移栽机构44与第二移栽机构45的结构及运行原理一致,下面,本发明将以第二移栽机构45为例,说明第一移栽机构44与第二移栽机构45的结构及运行原理。复参阅图12,第二移栽机构45包括移栽安装座451、第一移栽导轨452、移栽移动件453、移栽驱动元件454及第二移栽导轨455。移栽安装座451设置于第二传感器芯片组装机架31,移栽安装座451位于传送安装座41的一侧。第一移栽导轨452设置于移栽安装座451。移栽移动件453活动连接于第一移栽导轨452。移栽驱动元件454设置于移栽安装座451,移栽驱动元件454位于第一移栽导轨452的一侧,移栽驱动元件454的输出端连接移栽移动件453。第二移栽导轨455设置于移栽移动件453的顶端,第二移栽导轨455分别对应传送导轨42与载具回流导轨46。至少一载具43沿传送导轨42移动至第二移栽导轨455;尔后,移栽驱动元件454驱动移栽移动件453沿第一移栽导轨452移动至对应载具回流导轨46的工位,移栽移动件453带动第二移栽导轨455及至少一载具43沿第一移栽导轨452移动至对应载具回流导轨46的工位,于此同时,第二移栽导轨455连接载具回流导轨46;尔后,至少一载具43沿第二移栽导轨455及载具回流导轨46移动至第一移栽机构44;第一移栽机构44重复上述动作,达到至少一载具43循环使用的目的。In the specific application, the first transplanting mechanism 44 and the second transplanting mechanism 45 have the same structure and operation principle. Hereinafter, the second transplanting mechanism 45 will be taken as an example to illustrate the first transplanting mechanism 44 and the first The structure and operation principle of the second transplanting mechanism 45. Referring to FIG. 12, the second transplanting mechanism 45 includes a transplanting mount 451, a first transplanting guide 452, a transplanting moving member 453, a transplanting driving member 454, and a second transplanting guide 455. The transplanting mount 451 is disposed on the second sensor chip assembly frame 31, and the transplanting mount 451 is located on one side of the transfer mount 41. The first transplanting guide 452 is disposed on the transplanting mount 451. The transplanting moving member 453 is movably coupled to the first transplanting guide 452. The transplanting drive element 454 is disposed on the transplant mount 451, the transplant drive element 454 is located on one side of the first transfer rail 452, and the output end of the transplant drive element 454 is coupled to the transfer mover 453. The second transplanting guide rails 455 are disposed at the top end of the transplanting moving member 453, and the second transplanting guide rails 455 correspond to the transporting guide rails 42 and the carrier returning rails 46, respectively. At least one carrier 43 is moved along the transport rail 42 to the second transplant rail 455; then, the transplant driving component 454 drives the transplant moving member 453 to move along the first transplant rail 452 to the corresponding carrier return rail 46. The transplanting moving member 453 drives the second transplanting guide 455 and the at least one carrier 43 to move along the first transplanting guide 452 to the corresponding carrier return rail 46. Meanwhile, the second transplanting guide 455 connects the carrier. Reflow guide 46; at least one carrier 43 is moved along the second transfer rail 455 and the carrier return rail 46 to the first transplanting mechanism 44; the first transplanting mechanism 44 repeats the above operation to achieve at least one carrier 43 cycle Purpose of use.
再一并参阅图13,其为本发明一实施例的锁螺丝设备5的示意图。如图所示,锁螺丝设备5包括锁螺丝机械手臂51、锁螺丝驱动元件52及电动螺丝批53。锁螺丝机械手臂51设置于第一传感器芯片组装机架21,锁螺丝机械手臂51位于撕膜装置25的一侧。锁螺丝驱动元件52设置于锁螺丝机械手臂51。电动螺丝批53设置于锁螺丝驱动元件52的输出端,电动螺丝批53对应传送装置4。第一传感器芯片抓取装置23检测前盖及第一传感器芯片的四个螺丝孔的坐标,第一传感器芯片抓取装置23将前盖及第一传感器芯片的四个螺丝孔的坐标传送至第一传感器芯片组装设备2;尔后,锁螺丝机械手臂51驱动锁螺丝驱动 元件52及电动螺丝批53移动至对应螺丝供料机9的工位;尔后,锁螺丝驱动元件52驱动电动螺丝批53下移,电动螺丝批53吸取单颗螺丝;尔后,锁螺丝机械手臂51驱动锁螺丝驱动元件52、电动螺丝批53及单颗螺丝移动至对应传送装置4的工位;尔后,锁螺丝驱动元件52驱动电动螺丝批53及单颗螺丝下移;尔后,电动螺丝批53将单颗螺丝螺设于第一传感器芯片与前盖的预定位置;尔后,锁螺丝设备5重复上述动作,将四颗螺丝螺设于第一传感器芯片与前盖的预定位置;尔后,第二传感器芯片抓取装置34拍摄第二传感器芯片与前盖锁螺丝的的孔位与坐标,第二传感器芯片抓取装置34传送第二传感器芯片与前盖锁螺丝的的孔位与坐标至第二传感器芯片组装设备3;尔后,锁螺丝机械手臂51驱动锁螺丝驱动元件52、电动螺丝批53及单颗螺丝移动至对应传送装置4的工位;尔后,锁螺丝驱动元件52驱动电动螺丝批53及单颗螺丝下移;尔后,电动螺丝批53将单颗螺丝螺设于第二传感器芯片与前盖的预定位置;尔后,锁螺丝设备5重复上述动作,将四颗螺丝螺设于第二传感器芯片与前盖的预定位置。Referring again to Figure 13, a schematic view of a lock screw device 5 in accordance with one embodiment of the present invention is shown. As shown, the lock screw device 5 includes a lock screw robot 51, a lock screw drive member 52, and an electric screwdriver. The lock screw robot arm 51 is disposed on the first sensor chip assembly frame 21, and the lock screw robot arm 51 is located on one side of the tear film device 25. The lock screw drive member 52 is disposed on the lock screw robot arm 51. The electric screwdriver 5 is disposed at the output end of the lock screw driving member 52, and the electric screwdriver 53 corresponds to the transfer device 4. The first sensor chip grabbing device 23 detects the coordinates of the four screw holes of the front cover and the first sensor chip, and the first sensor chip grabbing device 23 transmits the coordinates of the four screw holes of the front cover and the first sensor chip to the first a sensor chip assembly device 2; then, the lock screw robot 51 drives the lock screw drive The component 52 and the electric screwdriver 5 are moved to the position corresponding to the screw feeder 9; then, the locking screw driving component 52 drives the electric screwdriver 53 to move downward, and the electric screwdriver 53 absorbs a single screw; then, the locking screw robot 51 The drive lock screw driving component 52, the electric screwdriver batch 53 and the single screw are moved to the station corresponding to the conveying device 4; then, the locking screw driving component 52 drives the electric screwdriver batch 53 and the single screw to move down; then, the electric screwdriver batch 53 The single screw is screwed to the predetermined position of the first sensor chip and the front cover; after that, the locking screw device 5 repeats the above action, and the four screws are screwed on the predetermined positions of the first sensor chip and the front cover; then, the second The sensor chip grabbing device 34 captures the hole position and coordinates of the second sensor chip and the front cover lock screw, and the second sensor chip grab device 34 transmits the hole position and coordinates of the second sensor chip and the front cover lock screw to the second The sensor chip assembly device 3; thereafter, the lock screw robot 51 drives the lock screw drive member 52, the electric screwdriver batch 53 and the single screw to move to the corresponding transfer device 4; The lock screw driving component 52 drives the electric screwdriver 5 and the single screw to move downward; after that, the electric screwdriver 53 screws a single screw to the predetermined position of the second sensor chip and the front cover; after that, the lock screw device 5 repeats the above Action, the four screws are screwed to the predetermined positions of the second sensor chip and the front cover.
具体应用时,上述的第一前盖上料驱动元件123、第二前盖上料驱动元件125、前盖上料感应器127、前盖抓取机械手臂131、前盖抓取CCD133、前盖抓取电动夹爪134、除尘无杆气缸144、除尘夹紧气缸145、除尘翻转气缸146、第一传感器芯片上料装置22、第一抓取机械手臂231、第一抓取CCD233、扫码枪234、第一抓取电动夹爪235、测高驱动元件244、测高传感器245、撕膜驱动元件254、第二传感器芯片上料装置32、烧录驱动元件334、传送导轨42、第一移栽机构44、移栽驱动元件454、载具回流驱动元件47、锁螺丝机械手臂51、锁螺丝驱动元件52及电动螺丝批53均电连接车载镜头生产组装线的控制PLC,车载镜头生产组装线的控制PLC控制第一前盖上料驱动元件123、第二前盖上料驱动元件125、前盖上料感应器127、前盖抓取机械手臂131、前盖抓取CCD133、前盖抓取电动夹爪134、除尘无杆气缸144、除尘夹紧气缸145、除尘翻转气缸146、第一传感器芯片上料装置22、第一抓取机械手臂231、第一 抓取CCD233、扫码枪234、第一抓取电动夹爪235、测高驱动元件244、测高传感器245、撕膜驱动元件254、第二传感器芯片上料装置32、烧录驱动元件334、传送导轨42、第一移栽机构44、移栽驱动元件454、载具回流驱动元件47、锁螺丝机械手臂51、锁螺丝驱动元件52及电动螺丝批53作动,以达到车载镜头生产组装线自动化控制之功效。In the specific application, the first front cover loading driving component 123, the second front cover loading driving component 125, the front cover loading sensor 127, the front cover grasping robot 131, the front cover grabbing CCD133, and the front cover Grasping the electric gripper 134, the dust-removing rodless cylinder 144, the dust-removing clamping cylinder 145, the dust-removing inverting cylinder 146, the first sensor chip loading device 22, the first grabbing robot arm 231, the first grabbing CCD233, and the scanning code gun 234. The first grabbing electric gripper 235, the altimetry driving component 244, the altimetry sensor 245, the tear film driving component 254, the second sensor chip loading device 32, the programming drive component 334, the transport rail 42, and the first shift The planting mechanism 44, the transplanting drive component 454, the carrier reflow drive component 47, the lock screw robot arm 51, the lock screw drive component 52 and the electric screwdriver batch 53 are all electrically connected to the control PLC of the vehicle lens production assembly line, and the vehicle lens production assembly line The control PLC controls the first front cover loading drive component 123, the second front cover loading drive component 125, the front cover loading sensor 127, the front cover grabbing robot 131, the front cover grabbing CCD 133, and the front cover gripping Electric gripper 134, dust removal, no rod gas Cylinder 144, dust-collecting cylinder 145, dust-reversing cylinder 146, first sensor chip loading device 22, first grab robot 231, first Grabbing CCD 233, scanning code gun 234, first grabbing electric gripper 235, altimetry driving component 244, altimetry sensor 245, tear film driving component 254, second sensor chip loading device 32, programming drive component 334, The transport rail 42, the first transplanting mechanism 44, the transplanting drive component 454, the carrier reflow drive component 47, the lock screw robot 51, the lock screw drive component 52, and the electric screwdriver 5 are actuated to achieve the vehicle lens assembly line. The power of automated control.
本发明的一或多个实施方式中,本发明的车载镜头生产组装线自动将第一传感器芯片及第二传感器芯片组装至前盖,减少企业的组装人员,提升企业的生产效率,降低组装人员的劳动强度。In one or more embodiments of the present invention, the vehicle lens assembly line of the present invention automatically assembles the first sensor chip and the second sensor chip to the front cover, thereby reducing assembly personnel of the enterprise, improving production efficiency of the enterprise, and reducing assembly personnel. Labor intensity.
综上所述,本发明的一或多个实施方式中,上述仅为本发明的实施方式而已,并不用于限制本发明。对于本领域技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原理的内所作的任何修改、等同替换、改进等,均应包括在本发明的权利要求范围之内。 In the above, in one or more embodiments of the present invention, the above is only an embodiment of the present invention, and is not intended to limit the present invention. It will be apparent to those skilled in the art that various modifications and changes can be made in the present invention. Any modifications, equivalents, improvements, etc. made within the spirit and scope of the invention are intended to be included within the scope of the appended claims.

Claims (10)

  1. 一种车载镜头生产组装线,其特征在于,包括:通过传送装置(4)依序连接的前盖上料设备(1)、第一传感器芯片组装设备(2)及第二传感器芯片组装设备(3);A vehicle lens production assembly line, comprising: a front cover loading device (1), a first sensor chip assembly device (2) and a second sensor chip assembly device (s) sequentially connected by a conveying device (4) 3);
    所述前盖上料设备(1)包括:前盖组装机架(11)、前盖上料装置(12)及前盖抓取装置(13);所述前盖组装机架(11)通过所述传送装置(4)连接所述第一传感器芯片组装设备(2),所述前盖组装机架(11)具有前盖放置区(111);所述前盖上料装置(12)设置于所述前盖放置区(111),并位于所述传送装置(4)的一侧;所述前盖抓取装置(13)设置于所述前盖组装机架(11),并位于所述前盖上料装置(12)与所述传送装置(4)间,所述前盖抓取装置(13)分别对应所述前盖上料装置(12)及传送装置(4);The front cover loading device (1) comprises: a front cover assembly frame (11), a front cover loading device (12) and a front cover grasping device (13); the front cover assembly frame (11) passes The conveying device (4) is connected to the first sensor chip assembly device (2), the front cover assembly frame (11) has a front cover placement area (111); and the front cover loading device (12) is disposed The front cover placement area (111) is located at one side of the conveying device (4); the front cover gripping device (13) is disposed on the front cover assembly frame (11) and located at the Between the front cover loading device (12) and the conveying device (4), the front cover grasping device (13) corresponds to the front cover loading device (12) and the conveying device (4);
    所述第一传感器芯片组装设备(2)包括:第一传感器芯片组装机架(21)、第一传感器芯片上料装置(22)及第一传感器芯片抓取装置(23);所述第一传感器芯片组装机架(21)通过所述传送装置(4)分别连接所述前盖组装机架(11)及第二传感器芯片组装设备(3),所述第一传感器芯片组装机架(21)具有第一传感器芯片放置区(211);所述第一传感器芯片上料装置(22)设置于所述第一传感器芯片放置区(211),并位于所述传送装置(4)的一侧;所述第一传感器芯片抓取装置(23)设置于所述第一传感器芯片组装机架(21),并位于所述第一传感器芯片上料装置(22)与所述传送装置(4)间,所述第一传感器芯片抓取装置(23)分别对应所述第一传感器芯片上料装置(22)及传送装置(4);以及The first sensor chip assembly device (2) includes: a first sensor chip assembly frame (21), a first sensor chip loading device (22), and a first sensor chip grab device (23); The sensor chip assembly frame (21) is respectively connected to the front cover assembly frame (11) and the second sensor chip assembly device (3) by the transfer device (4), and the first sensor chip assembly frame (21) Having a first sensor chip placement area (211); the first sensor chip loading device (22) is disposed in the first sensor chip placement area (211) and located on one side of the transfer device (4) The first sensor chip gripping device (23) is disposed on the first sensor chip assembly frame (21), and is located at the first sensor chip loading device (22) and the transmitting device (4) The first sensor chip gripping device (23) respectively corresponds to the first sensor chip loading device (22) and the transmitting device (4);
    所述第二传感器芯片组装设备(3)包括:第二传感器芯片组装机架(31)、第二传感器芯片上料装置(32)、烧录装置(33)及第二传感器芯片抓取装置(34);所述第二传感器芯片组装机架(31)通过所述传送装置(4)连接所述第一传感器芯片组装机架(21),所述第二传感器芯片组装机架(31)具有第二传感器芯片放置区(311);所述第二传感器芯片上料装置(32)设置于所述第二传感器 芯片放置区(311),并位于所述传送装置(4)的一侧;所述烧录装置(33)设置于所述第二传感器芯片组装机架(31),并位于所述传送装置(4)的一端;所述第二传感器芯片抓取装置(34)设置于所述第二传感器芯片组装机架(31),并位于所述第二传感器芯片上料装置(32)与所述传送装置(4)间,所述第二传感器芯片抓取装置(34)分别对应所述第二传感器芯片上料装置(32)、烧录装置(33)及传送装置(4)。The second sensor chip assembly device (3) includes: a second sensor chip assembly frame (31), a second sensor chip loading device (32), a burning device (33), and a second sensor chip grab device ( 34); the second sensor chip assembly frame (31) is connected to the first sensor chip assembly frame (21) by the transfer device (4), and the second sensor chip assembly frame (31) has a second sensor chip placement area (311); the second sensor chip loading device (32) is disposed on the second sensor a chip placement area (311) located at one side of the transfer device (4); the programming device (33) being disposed on the second sensor chip assembly frame (31) and located at the transfer device ( 4) one end; the second sensor chip gripping device (34) is disposed on the second sensor chip assembly frame (31), and located in the second sensor chip loading device (32) and the transfer Between the devices (4), the second sensor chip gripping device (34) corresponds to the second sensor chip loading device (32), the burning device (33) and the transmitting device (4), respectively.
  2. 根据权利要求1所述的车载镜头生产组装线,其特征在于,所述前盖上料设备(1)还包括除尘装置(14),所述除尘装置(14)设置于所述前盖组装机架(11),并位于所述前盖上料装置(12)及前盖抓取装置(13)间,所述除尘装置(14)位于所述传送装置(4)的一侧,所述除尘装置(14)对应所述前盖抓取装置(13)。The vehicle lens manufacturing assembly line according to claim 1, wherein the front cover loading device (1) further comprises a dust removing device (14), and the dust removing device (14) is disposed on the front cover assembling machine a frame (11) between the front cover loading device (12) and the front cover gripping device (13), the dust removing device (14) being located at one side of the conveying device (4), the dust removing The device (14) corresponds to the front cover gripping device (13).
  3. 根据权利要求2所述的车载镜头生产组装线,其特征在于,所述第一传感器芯片组装设备(2)还包括测高装置(24),所述测高装置(24)设置于所述第一传感器芯片组装机架(21),并位于所述传送装置(4)的另一侧,所述测高装置(24)对应所述传送装置(4)。The vehicle lens assembly assembly line according to claim 2, wherein the first sensor chip assembly device (2) further comprises a height measuring device (24), wherein the height measuring device (24) is disposed in the first A sensor chip assembly frame (21) is located on the other side of the conveyor (4), and the height measuring device (24) corresponds to the conveyor (4).
  4. 根据权利要求3所述的车载镜头生产组装线,其特征在于,所述第一传感器芯片组装设备(2)还包括撕膜装置(25),所述撕膜装置(25)设置于所述第一传感器芯片组装机架(21),并位于所述传送装置(4)的另一侧,所述撕膜装置(25)位于测高装置(24)的一侧,所述撕膜装置(25)对应所述传送装置(4)。The vehicle lens assembly assembly line according to claim 3, wherein the first sensor chip assembly device (2) further comprises a tear film device (25), and the tear film device (25) is disposed in the first A sensor chip assembly frame (21) is located on the other side of the conveyor (4), the tear film device (25) is located on one side of the height measuring device (24), and the tear film device (25) Corresponding to the transfer device (4).
  5. 根据权利要求4所述的车载镜头生产组装线,其特征在于,还包括锁螺丝设备(5);所述锁螺丝设备(5)设置于所述第一传感器芯片组装机架(21),并位于所述撕膜装置(25)的一侧,所述锁螺丝设备(5)对应所述传送装置(4)。The vehicle lens assembly assembly line according to claim 4, further comprising a lock screw device (5); said lock screw device (5) being disposed on said first sensor chip assembly frame (21), and Located on one side of the tear film device (25), the lock screw device (5) corresponds to the transfer device (4).
  6. 根据权利要求5所述的车载镜头生产组装线,其特征在于,所述传送装置(4)包括:传送安装座(41)、传送导轨(42)、至少一载具(43)、第一移栽机构(44)、第二移栽机构(45)、载具回流导轨(46)及载具回流驱动元件(47); 所述传送安装座(41)设置于所述前盖组装机架(11)、第一传感器芯片组装机架(21)及第二传感器芯片组装机架(31),并位于所述前盖放置区(111)、第一传感器芯片放置区(211)及第二传感器芯片放置区(311)的一侧;所述传送导轨(42)铺设于所述传送安装座(41);所述至少一载具(43)活动连接于所述传送导轨(42),并位于所述传送安装座(41)的上方,所述至少一载具(43)对应所述前盖抓取装置(13)、第一传感器芯片抓取装置(23)、测高装置(24)、第二传感器芯片抓取装置(34)及锁螺丝设备(5);所述第一移栽机构(44)设置于所述前盖组装机架(11),并位于所述前盖放置区(111)与所述前盖抓取装置(13)间,所述第一移栽机构(44)连接所述传送导轨(42)的一端;所述第二移栽机构(45)设置于所述第二传感器芯片组装机架(31),并位于所述二放置区(311)与所述第二传感器芯片抓取装置(34)间,所述第二移栽机构(45)连接传送导轨(42)的另一端;所述载具回流导轨(46)铺设于所述传送安装座(41),并与所述传送导轨(42)平行设置,所述载具回流导轨(46)的两端分别连接所述第一移栽机构(44)及第二移栽机构(45);所述载具回流驱动元件(47)设置于所述前盖组装机架(11)、第一传感器芯片组装机架(21)及第二传感器芯片组装机架(31),并位于所述传送安装座(41)的一侧,所述载具回流驱动元件(47)活动连接所述至少一载具(43)。The vehicle lens manufacturing assembly line according to claim 5, wherein the conveying device (4) comprises: a conveying mount (41), a conveying guide (42), at least one carrier (43), and a first shifting a planting mechanism (44), a second transplanting mechanism (45), a carrier return rail (46), and a carrier reflow driving component (47); The transfer mount (41) is disposed on the front cover assembly frame (11), the first sensor chip assembly frame (21), and the second sensor chip assembly frame (31), and is placed on the front cover a side of the area (111), the first sensor chip placement area (211) and the second sensor chip placement area (311); the transfer rail (42) is laid on the transfer mount (41); the at least one a carrier (43) is movably coupled to the transport rail (42) and located above the transport mount (41), the at least one carrier (43) corresponding to the front cover gripping device (13), a first sensor chip gripping device (23), a height measuring device (24), a second sensor chip grabbing device (34) and a locking screw device (5); the first transplanting mechanism (44) is disposed in the The front cover assembly frame (11) is located between the front cover placement area (111) and the front cover gripping device (13), and the first transplanting mechanism (44) is connected to the transfer guide rail (42) One end; the second transplanting mechanism (45) is disposed on the second sensor chip assembly frame (31) and located in the two placement areas (311) and the second sensor chip grabbing device ( 34), between a second transplanting mechanism (45) is coupled to the other end of the transfer rail (42); the carrier return rail (46) is laid on the transfer mount (41) and disposed parallel to the transfer guide (42), The two ends of the carrier return rail (46) are respectively connected to the first transplanting mechanism (44) and the second transplanting mechanism (45); the carrier reflow driving component (47) is disposed on the front cover An assembly rack (11), a first sensor chip assembly rack (21) and a second sensor chip assembly rack (31), and located on one side of the transport mount (41), the carrier reflow drive component (47) movably connecting the at least one carrier (43).
  7. 根据权利要求1所述的车载镜头生产组装线,其特征在于,所述前盖上料装置(12)包括:前盖上料安装座(121)、前盖上料导轨(122)、第一前盖上料驱动元件(123)、前盖拉料件(124)、第二前盖上料驱动元件(125)及前盖卡紧件(126);所述前盖上料安装座(121)设置于所述前盖组装机架(11),并位于所述前盖放置区(111)与所述前盖抓取装置(13)间;所述前盖上料导轨(122)铺设于所述前盖上料安装座(121);所述第一前盖上料驱动元件(123)设置于所述前盖上料导轨(122),所述前盖拉料件(124)设置于所述第一前盖上料驱动元件(123);所述第二前盖上料驱动元件(125)设置于所述前盖组装机架(11),并位于所述前盖上料安装座(121),所述前盖卡紧件(126)设置 于所述第二前盖上料驱动元件(125)的输出端。The vehicle lens assembly assembly line according to claim 1, wherein the front cover loading device (12) comprises: a front cover loading mount (121), a front cover loading guide (122), and a first a front cover loading driving component (123), a front cover pulling member (124), a second front cover loading driving component (125), and a front cover clamping member (126); the front cover loading mounting seat (121) Provided in the front cover assembly frame (11) and located between the front cover placement area (111) and the front cover gripping device (13); the front cover loading rail (122) is laid on The front cover loading device (121); the first front cover loading driving component (123) is disposed on the front cover loading rail (122), and the front cover pulling member (124) is disposed on The first front cover loading drive component (123); the second front cover loading drive component (125) is disposed on the front cover assembly frame (11) and located on the front cover loading mount (121), the front cover clamping member (126) is set The output end of the drive element (125) is fed to the second front cover.
  8. 根据权利要求2所述的车载镜头生产组装线,其特征在于,所述前盖抓取装置(13)包括:前盖抓取机械手臂(131)、前盖抓取固定件(132)、前盖抓取CCD(133)及前盖抓取电动夹爪(134);所述前盖抓取机械手臂(131)设置于所述前盖组装机架(11),并位于所述传送装置(4)与所述前盖上料装置(12)间;所述前盖抓取固定件(132)设置于所述前盖抓取机械手臂(131);所述前盖抓取CCD(133)设置于所述前盖抓取固定件(132),所述前盖抓取CCD(133)对应所述前盖上料装置(12);所述前盖抓取电动夹爪(134)设置于所述前盖抓取固定件(132),并位于所述前盖抓取CCD(133)的一侧,所述前盖抓取电动夹爪(134)对应所述前盖上料装置(12)、除尘装置(14)及传送装置(4)。The vehicle lens manufacturing assembly line according to claim 2, wherein the front cover gripping device (13) comprises: a front cover grabbing robot arm (131), a front cover grabbing fixture (132), and a front cover The cover grabs the CCD (133) and the front cover grips the electric gripper (134); the front cover grabbing robot arm (131) is disposed on the front cover assembly frame (11) and located at the conveying device ( 4) between the front cover loading device (12); the front cover grab fixing member (132) is disposed on the front cover grabbing robot arm (131); the front cover grabs the CCD (133) Provided on the front cover gripping fixture (132), the front cover gripping CCD (133) corresponding to the front cover loading device (12); the front cover gripping electric gripper (134) is disposed on The front cover grips the fixing member (132) and is located at a side of the front cover grabbing CCD (133), and the front cover gripping electric claw (134) corresponds to the front cover loading device (12) ), dust removal device (14) and conveyor device (4).
  9. 根据权利要求1所述的车载镜头生产组装线,其特征在于,所述第一传感器芯片抓取装置(23)包括:第一抓取机械手臂(231)、第一抓取固定件(232)、第一抓取CCD(233)、扫码枪(234)及第一抓取电动夹爪(235);所述第一抓取机械手臂(231)设置于所述第一传感器芯片组装机架(21),并位于所述第一传感器芯片上料装置(22)与所述传送装置(4)间;所述第一抓取固定件(232)设置于所述第一抓取机械手臂(231);所述第一抓取CCD(233)设置于所述第一抓取固定件(232),并对应所述第一传感器芯片上料装置(22);所述扫码枪(234)设置于所述第一抓取固定件(232),并位于所述第一抓取CCD(233)的一侧,所述扫码枪(234)对应所述第一传感器芯片上料装置(22);所述第一抓取电动夹爪(235)设置于所述第一抓取固定件(232),并位于所述第一抓取CCD(233)与所述扫码枪(234)间,所述第一抓取电动夹爪(235)对应所述第一传感器芯片上料装置(22)及传送装置(4)。The vehicle lens assembly assembly line according to claim 1, wherein the first sensor chip gripping device (23) comprises: a first grabbing robot arm (231), and a first gripping fixture (232) a first grabbing CCD (233), a scan code gun (234), and a first grabbing electric gripper (235); the first grabbing robot arm (231) is disposed on the first sensor chip assembly rack (21) and located between the first sensor chip loading device (22) and the conveying device (4); the first grasping fixture (232) is disposed on the first grabbing robot ( 231); the first grab CCD (233) is disposed on the first grab fixing member (232), and corresponds to the first sensor chip loading device (22); the scan code gun (234) Provided on the first grasping fixture (232) and located on one side of the first grab CCD (233), the scanner (234) corresponding to the first sensor chip loading device (22) The first gripping electric gripper (235) is disposed on the first gripping fixture (232) and located between the first gripping CCD (233) and the scan code gun (234) , the first grabbing electric gripper (235) A first sensor chip feeding means (22) and conveying means (4) to be said.
  10. 根据权利要求1所述的车载镜头生产组装线,其特征在于,所述烧录装置(33)包括:烧录安装座(331)、四根烧录导杆(332)、烧录固定座(333)、烧录驱动元件(334)、烧录压块(335)及烧录探针(336);所述烧录安装座(331) 设置于所述第二传感器芯片组装机架(31),并位于所述传送装置(4)的一端;所述四根烧录导杆(332)设置于所述烧录安装座(331);所述烧录固定座(333)设置于所述四根烧录导杆(332)的一端,并位于所述烧录安装座(331)的上方;所述烧录驱动元件(334)设置于所述烧录安装座(331),并位于所述四根烧录导杆(332)一侧,所述烧录压块(335)设置于所述烧录驱动元件(334)的输出端,并位于所述烧录固定座(333)的上方;所述烧录探针(336)设置于所述烧录安装座(331),并位于所述四根烧录导杆(332)间。 The vehicle lens assembly assembly line according to claim 1, wherein the burning device (33) comprises: a burning mount (331), four burning guides (332), and a burning fixture ( 333), burning driving component (334), burning pressure block (335) and burning probe (336); said burning mount (331) The second sensor chip assembly frame (31) is located at one end of the transfer device (4); the four burn guides (332) are disposed in the burn-in mount (331); The programming fixture (333) is disposed at one end of the four programming guides (332) and located above the programming mount (331); the programming driving component (334) is disposed on The programming mount (331) is located on one side of the four burning guides (332), and the programming pressing block (335) is disposed at an output end of the programming driving component (334). And located above the programming fixture (333); the programming probe (336) is disposed on the programming mount (331) and located between the four programming guides (332).
PCT/CN2017/110469 2017-06-21 2017-11-10 Vehicle-mounted lens production assembly line WO2018233188A1 (en)

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