CN203588986U - Automatic alignment mechanism of die bonder and die bonder provided with same - Google Patents
Automatic alignment mechanism of die bonder and die bonder provided with same Download PDFInfo
- Publication number
- CN203588986U CN203588986U CN201320711406.1U CN201320711406U CN203588986U CN 203588986 U CN203588986 U CN 203588986U CN 201320711406 U CN201320711406 U CN 201320711406U CN 203588986 U CN203588986 U CN 203588986U
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- chip
- loader
- die bonder
- substrate
- automatic aligning
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- 230000007246 mechanism Effects 0.000 title claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000005538 encapsulation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000010358 mechanical oscillation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009462 micro packaging Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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Abstract
The utility model discloses an automatic alignment mechanism of a die bonder. The mechanism comprises an alignment platform that is provided with positions for holding a chip and a substrate, and a first drive unit, a second drive unit and a third drive unit. The three drive units are connected with the alignment platform and respectively drive the alignment platform to move along the X axis, the Y axis and the Z axis. The mechanism further comprises a fourth drive unit that is connected with the alignment platform and drives the alignment platform to rotate. The above-mentioned four drive units are in electric connection with a control device to be controlled to move. The control device is further in electric connection with a camera structure used for observing chip and substrate positions. The utility model further discloses a die bonder provided with the above-mentioned automatic alignment mechanism. The automatic alignment mechanism of the die bonder and the die bonder provided with the above-mentioned automatic alignment mechanism are utilized to improve alignment precision, so that qualified product rate is ensured.
Description
Technical field
The utility model relates to loader, particularly a kind of automatic aligning mechanism of loader and comprise its loader.
Background technology
Loader is the key equipment in semiconductor packing producing line, and it has application very widely in chip package.Along with the progress of technology, the load precision of loader is just towards submicron order development, and then supported at present alleged in the industry micro-packaging technology.
At loader, in the process of submicron order precision development, how to guarantee the accurate of chip load position, the automaticity that improves load when reducing error is the problem that these those skilled in the art need to constantly research and develop.
Loader is all generally first chip to be moved to and get sheet position at present, and then will be with suctorial manipulator motion to getting sheet position absorption chip, in the process of absorption chip, the center of sucker is likely because the reasons such as motion control, mechanical oscillation cannot be aimed at chip center.Mechanical arm is drawn to after chip, and loader can be moved to the load position top of substrate, finally by chip package to substrate.Among this load process, may there is deviation because of reasons such as motion control, mechanical oscillation in the chip on sucker and the center of substrate too.Therefore,, in this packaged type, the encapsulation precision of chip and substrate is difficult to reach submicron order.Thereby, can see, there is following shortcoming: sucker and chip, and the precision of contraposition between substrate and chip cannot measure and proofread and correct, thereby cannot guarantee that last encapsulation forms the yield of semiconductor device.
Utility model content
The purpose of this utility model is exactly for the problems referred to above, thereby provide a kind of, can improve the automatic aligning mechanism that alignment precision guarantees the loader of product yield, and a kind of loader that comprises it is also provided simultaneously.
To achieve these goals, the utility model provides following technical scheme: the automatic aligning mechanism of loader, and it comprises:
To bit platform, on it, be arranged with the position of chip placement and substrate;
Connect respectively above-mentioned to bit platform first, second, and third driver element that drives respectively this to move along X, Y and Z axis to bit platform;
Connect above-mentioned to bit platform and drive this 4 wheel driven moving cell to bit platform rotation;
Wherein, above-mentioned first, second, third and 4 wheel driven moving cell be electrically connected to respectively control appliance, by above-mentioned control appliance control its motion, this control appliance is also electrically connected on loader for observing the phase machine mechanism of chip and substrate position.
Preferably, first, second, third above-mentioned and 4 wheel driven moving cell all comprises servomotor.
Preferably, the spectroscope that above-mentioned phase machine mechanism comprises camera and is arranged at the camera lens place of described camera.
Loader, it comprises support, be arranged at this support top for observing the phase machine mechanism of chip and substrate position and for pick-up chip and be put in the manipulator on substrate, it also comprises automatic aligning mechanism as above, and it is arranged on this support, the below of this phase machine mechanism.
Preferably, above-mentioned loader also comprises a second camera mechanism, and it is arranged at a side of above-mentioned automatic aligning mechanism.
Adopt the beneficial effect of above technical scheme to be:
(1) automatic aligning mechanism of the present utility model mainly comprises bit platform, first, second, the third and fourth driver element, wherein first, second, the third and fourth driver element is controlled by control appliance, by control appliance, can realize from the contraposition of trend encapsulation station, improved the operating efficiency of contraposition, control appliance is connected with phase machine mechanism again, during load, the image of phase machine mechanism acquisition chip and substrate also sends control appliance to, thereby control appliance can comparison chart picture on chip and basic center whether overlap, the words that do not overlap can be measured the side-play amount at Liang Ge center, according to side-play amount, control each driver element certain distance of moving and reach the object of adjustment, alignment precision is high, thereby guaranteed the yield of product,
(2) loader of the present utility model, owing to having adopted the related automatic aligning mechanism of the utility model, has obtained outstanding alignment precision than prior art.
Accompanying drawing explanation
Fig. 1 is the structural representation (comprising automatic aligning mechanism) of loader of the present utility model.
Fig. 2 is the stereogram (comprising automatic aligning mechanism) of loader of the present utility model.
Wherein, 1. pair bit platform 2. first driver element 3. second driver element 4. the 3rd driver element 5. 4 wheel driven moving cell 6. phase machine mechanism 7. position 8. support 9. manipulator 10. second camera mechanisms.
Embodiment
Below in conjunction with accompanying drawing, describe preferred implementation of the present utility model in detail.
As shown in Figure 1-2, in the first execution mode of automatic aligning mechanism of the present utility model, this automatic aligning mechanism comprises: to bit platform 1, be arranged with the position 7 of chip placement and substrate on it; Connect respectively bit platform 1 the first driver element 2, the second driver element 3 and the 3rd driver element 4 that drive respectively this to move along X, Y and Z axis to bit platform 1; Connection is to bit platform 1 and drive this 4 wheel driven moving cell 5 to bit platform 1 rotation; Wherein, the first driver element 2, the second driver element 3, the 3rd driver element 4 and 4 wheel driven moving cell 5 are electrically connected to respectively control appliance (not shown), by this control appliance, control the motion of these driver elements, this control appliance is also electrically connected on loader for observing the phase machine mechanism 6 of chip and substrate position, and the order producing for the image gathering according to this phase machine mechanism 6 is controlled accordingly to this first driver element 2, the second driver element 3, the 3rd driver element 4 and 4 wheel driven moving cell 5.The first driver element 2, the second driver element 3, the 3rd driver element 4 and 4 wheel driven moving cell 5 are controlled by control appliance, by control appliance, can realize from the contraposition of trend encapsulation station, improved the operating efficiency of contraposition, control appliance is connected with phase machine mechanism 6 again, during load, the image of phase machine mechanism 6 acquisition chips and substrate also sends control appliance to, thereby control appliance can comparison chart picture on chip and basic center whether overlap, the words that do not overlap can be measured the side-play amount at Liang Ge center, according to side-play amount, control each driver element certain distance of moving and reach the object of adjustment, alignment precision is high, thereby guaranteed the yield of product.
In the second execution mode of automatic aligning mechanism of the present utility model, for convenience is to the control to bit platform 1 amount of movement, above-mentioned the first driver element 2, the second driver element 3, the 3rd driver element 4 and 4 wheel driven moving cell 5 can comprise servomotor, and in order to realize its different direction of motion, servomotor can adopt straight-line and servomotor that rotatablely move.The 3rd above-mentioned driver element 4 and 4 wheel driven moving cell 5 can also be merged into a driver element and implement, and as adopted the form of ball-screw, can realize rotation and move up and down.
In the third execution mode of automatic aligning mechanism of the present utility model, in order can conveniently to observe the position of substrate and chip, and improve alignment result, the spectroscope that above-mentioned phase machine mechanism 6 comprises camera and is arranged at the camera lens place of this camera, two observed images can be apparent on same picture simultaneously, for follow-up control appliance is for providing information to the control of bit platform contraposition operation.
As shown in Figure 1-2, in the first execution mode of loader of the present utility model, it comprises support 8, be arranged at these support 8 tops for observing the phase machine mechanism 6 of chip and substrate position and being normally to carry out absorption chip by the sucker on it for pick-up chip the manipulator 9(manipulator 9 that is put on substrate), it also comprises automatic aligning mechanism as above, and it is arranged on this support 8, the below of this phase machine mechanism 6.Owing to having adopted the related automatic aligning mechanism of the utility model, than prior art, obtained outstanding alignment precision.
As shown in Figure 1-2, in the second execution mode of loader of the present utility model, in order to guarantee the precision of encapsulation, this loader can also comprise a second camera mechanism 10, it is arranged at a side of above-mentioned automatic aligning mechanism, for going to monitor from the side encapsulation process, thereby form the supervision of multi-angles with above-mentioned phase machine mechanism 6, this second camera mechanism 10 also can adopt CCD camera lens to implement.
Above-described is only preferred implementation of the present utility model; it should be pointed out that for the person of ordinary skill of the art, do not departing under the prerequisite of the utility model creation design; can also make some distortion and improvement, these all belong to protection range of the present utility model.
Claims (5)
1. the automatic aligning mechanism of loader, is characterized in that: comprising:
To bit platform, on it, be arranged with the position of chip placement and substrate;
Connect respectively described to bit platform and drive respectively described first, second, and third driver element that bit platform is moved along X, Y and Z axis;
Connect described to bit platform and drive the described 4 wheel driven moving cell to bit platform rotation;
Wherein, described first, second, third and 4 wheel driven moving cell be electrically connected to respectively control appliance, by described control appliance control its motion, described control appliance is also electrically connected on loader for observing the phase machine mechanism of chip and substrate position.
2. the automatic aligning mechanism of loader according to claim 1, is characterized in that: described first, second, third and 4 wheel driven moving cell all comprise servomotor.
3. the automatic aligning mechanism of loader according to claim 1, is characterized in that: the spectroscope that described phase machine mechanism comprises camera and is arranged at the camera lens place of described camera.
4. loader, it comprises support, be arranged at described support top for observing the phase machine mechanism of chip and substrate position and for pick-up chip and be put in the manipulator on substrate, it is characterized in that: also comprise the automatic aligning mechanism as described in as arbitrary in claim 1-3, it is arranged on described support, the below of described phase machine mechanism.
5. loader according to claim 4, is characterized in that: also comprise a second camera mechanism, it is arranged at a side of described automatic aligning mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320711406.1U CN203588986U (en) | 2013-11-12 | 2013-11-12 | Automatic alignment mechanism of die bonder and die bonder provided with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320711406.1U CN203588986U (en) | 2013-11-12 | 2013-11-12 | Automatic alignment mechanism of die bonder and die bonder provided with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203588986U true CN203588986U (en) | 2014-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320711406.1U Expired - Lifetime CN203588986U (en) | 2013-11-12 | 2013-11-12 | Automatic alignment mechanism of die bonder and die bonder provided with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203588986U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545236A (en) * | 2013-11-12 | 2014-01-29 | 江苏艾科瑞思封装自动化设备有限公司 | Automatic aligning mechanism of chip packing machine, chip packing machine including automatic aligning mechanism and automatic aligning method |
| WO2018233188A1 (en) * | 2017-06-21 | 2018-12-27 | 惠州市德赛自动化技术有限公司 | Vehicle-mounted lens production assembly line |
| CN112366158A (en) * | 2020-11-20 | 2021-02-12 | 深圳中科精工科技有限公司 | Solid brilliant equipment of high density LED |
-
2013
- 2013-11-12 CN CN201320711406.1U patent/CN203588986U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545236A (en) * | 2013-11-12 | 2014-01-29 | 江苏艾科瑞思封装自动化设备有限公司 | Automatic aligning mechanism of chip packing machine, chip packing machine including automatic aligning mechanism and automatic aligning method |
| WO2018233188A1 (en) * | 2017-06-21 | 2018-12-27 | 惠州市德赛自动化技术有限公司 | Vehicle-mounted lens production assembly line |
| CN112366158A (en) * | 2020-11-20 | 2021-02-12 | 深圳中科精工科技有限公司 | Solid brilliant equipment of high density LED |
| CN112366158B (en) * | 2020-11-20 | 2021-12-03 | 深圳中科精工科技有限公司 | Solid brilliant equipment of high density LED |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215513 Room 102, Jiangsu science and Technology Development Zone, Changshou City Changshu economic and Technological Development Zone, Suzhou Patentee after: SUZHOU ACCURACY ASSEMBLY AUTOMATION Co.,Ltd. Address before: 215513 Room 102, Jiangsu science and Technology Development Zone, Changshou City Changshu economic and Technological Development Zone, Suzhou Patentee before: ACCURACY ASSEMBLY AUTOMATION LTD.,JIANGSU |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140507 |