CN112366158A - Solid brilliant equipment of high density LED - Google Patents
Solid brilliant equipment of high density LED Download PDFInfo
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- CN112366158A CN112366158A CN202011308613.3A CN202011308613A CN112366158A CN 112366158 A CN112366158 A CN 112366158A CN 202011308613 A CN202011308613 A CN 202011308613A CN 112366158 A CN112366158 A CN 112366158A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Abstract
The invention discloses high-density LED die bonding equipment.A workbench is provided with an assembling mechanism, a shifting mechanism and a feeding mechanism, wherein the assembling mechanism is positioned below the shifting mechanism, the feeding mechanism is positioned on one side of the shifting mechanism, the assembling mechanism comprises an assembling support frame, an X-axis power part, a Y-axis power part and a bearing plate, the workbench is provided with a slot along the length direction of the workbench, and the assembling support frame is fixed on the lower side surface of the workbench; the X-axis power part is arranged at the bottom of the assembled support frame, the Y-axis power part is composed of two Y-axis driving components, the two Y-axis driving components are respectively arranged at two sides of the working end of the X-axis power part, the working ends of the two Y-axis driving components are respectively connected with the bottom side of the bearing plate through connecting columns, and the bearing plate is positioned above the groove; the scheme has the advantages of simple structure, convenience in use, strong controllability, capability of continuously working, labor saving, meeting production requirements, improving production efficiency and having good market application value.
Description
Technical Field
The invention relates to the field of LED assembly, in particular to high-density LED die bonding equipment.
Background
With the development of the technology, the application of the LED display screen in the indoor display field is wider and wider, and the market share in the advertisement and information release fields and the like is larger and larger; the current LED screen has the defects of not ideal display brightness and unsatisfactory picture contrast, and particularly, the outdoor display screen has unsatisfactory display effect due to insufficient brightness. LED display element is the key in the LED display screen, and LED die bonding is LED display element's key step, at LED die bonding in-process, need counterpoint the colloid, LED chip and LED support, in this process, mostly adopt the manual work to accomplish now, although also have some semi-automatic or automatic equipment to assist the completion, but also need the manual cooperation, and the structure is comparatively complicated moreover, it is not convenient to use, the shaping effect is relatively poor, thereby can't realize the operation standardization of producer's production line and improve the yield of product. Accordingly, the prior art is deficient and needs improvement.
Disclosure of Invention
The invention aims to provide novel high-density LED die bonding equipment.
In order to achieve the purpose, the invention adopts the following technical scheme: a high-density LED die bonder comprises a rack, wherein an electric cabinet is arranged in the rack, an electric control system is arranged in the electric cabinet, a workbench is arranged on the upper side of the rack, an assembling mechanism, a shifting mechanism and a feeding mechanism are arranged on the workbench, the assembling mechanism is positioned below the shifting mechanism, the feeding mechanism is positioned on one side of the shifting mechanism, and the assembling mechanism and the feeding mechanism are both arranged in the stroke range of the shifting mechanism;
the assembling mechanism comprises an assembling support frame, an X-axis power part, a Y-axis power part and a bearing plate, a groove is formed in the workbench along the length direction of the workbench, and the assembling support frame is fixed on the lower side surface of the workbench and located below the groove; the X-axis power part is arranged at the bottom of the assembled support frame, the Y-axis power part is composed of two Y-axis driving components, the two Y-axis driving components are respectively arranged at two sides of the working end of the X-axis power part, the working ends of the two Y-axis driving components are respectively connected with the bottom side of the bearing plate through connecting columns, and the bearing plate is positioned above the grooves.
Preferably, in the high-density LED die bonding apparatus, the displacement mechanism includes a displacement support frame, an X-axis displacement component, a Y-axis displacement component, a Z-axis displacement component, an R-axis displacement component, a CCD alignment component, and a suction component; the aversion support frame is fixed on the workstation, X axle displacement part is installed on the aversion support frame, the stiff end of Y axle displacement part with the work end of X axle displacement part is connected, the stiff end of Z axle displacement part with the work end of Y axle displacement part is connected, the stiff end of R axle displacement part with the work end of Z axle displacement part is connected, CCD counterpoint part is all installed with the absorption part the work end of R axle displacement part.
Preferably, in the high-density LED die bonding apparatus, the shifting mechanism further includes a dispensing component, the dispensing component includes a dispensing head, and the dispensing head is mounted at a working end of the R-axis shifting component.
Preferably, in the high-density LED die bonder, the X-axis displacement assembly includes an X-axis fixing base, an X-axis mounting plate, an X-axis lead screw and a lead screw motor, the X-axis fixing base is fixed on the displacement support frame, the X-axis mounting plate is fixed on the X-axis fixing base, two ends of the X-axis mounting plate are respectively provided with a lead screw bearing seat, two ends of the X-axis lead screw are respectively inserted into the two lead screw bearing seats, the lead screw motor is fixed at one end of the X-axis fixing base, and the lead screw motor is connected with one end of the X-axis lead screw; the X-axis screw rod is provided with a nut seat matched with the X-axis screw rod; the Y-axis displacement component is fixed on the nut seat of the X-axis screw rod.
Preferably, in the high-density LED die bonding apparatus, the Z-axis displacement unit includes a Z-axis fixing plate, a Z-axis lead screw, and a Z-axis motor, and the Z-axis fixing plate is fixed at a working end of the Y-axis displacement unit; the Z-axis screw rod is arranged on the Z-axis fixing plate, and the Z-axis motor is fixed on the upper part of the Z-axis fixing plate and connected with the Z-axis screw rod; and the Z-axis screw rod is provided with a nut connecting seat matched with the Z-axis screw rod, and the R-axis displacement component is fixed on the nut connecting seat of the Z-axis screw rod.
Preferably, in the high-density LED die bonding apparatus, the R-axis displacement component includes an R-axis fixing plate, an R-axis motor and an R-axis connecting plate, the R-axis fixing plate is fixed to the nut connecting seat of the Z-axis displacement component, the R-axis motor is fixed to the R-axis fixing plate, and the R-axis connecting plate is mounted at a working end of the R-axis motor; the CCD aligning part is arranged in the middle of the R-axis connecting plate, and the sucking parts are positioned on two sides of the CCD aligning part.
Preferably, in the high-density LED die bonding apparatus, the structures of the X-axis power component and the Y-axis displacement component are the same as the structure of the X-axis displacement assembly;
and the X-axis power component, the X-axis displacement component, the Y-axis displacement component and the Z-axis displacement component are all provided with auxiliary drag chains.
Preferably, solid brilliant equipment of high density LED in, still set up CCD detection mechanism on the workstation, CCD detection mechanism is located shift mechanism's below, CCD detection mechanism is including detecting support frame, X axle detection part, Z axle detection part and CCD detection part, it fixes to detect the support frame on the workstation, X axle detection part installs detect on the support frame, the stiff end of Z axle detection part with the work end of X axle detection part is connected, CCD detection part installs the work end of Z axle detection part.
Preferably, in the high-density LED die bonder, the CCD detection part includes a CCD camera module and a 3D sensor, the CCD camera module includes a camera fixing base and a camera fixed on the camera fixing base, and the camera fixing base and the 3D sensor are both mounted at the working end of the Z-axis detection part.
Preferably, in the high-density LED die bonder, the feeding mechanism includes a feeding component, a first feeding manipulator and a second feeding manipulator, the feeding component is mounted on the worktable, the first feeding manipulator is disposed at a side of the feeding component, and the second feeding manipulator is disposed at a side of the assembling mechanism.
Compared with the prior art, the automatic control device has the advantages that the automatic control device is simple in structure, convenient to use, strong in controllability, capable of continuously working, saving labor, meeting production requirements, improving production efficiency and having good market application value.
Drawings
FIG. 1 is a schematic view of the overall assembly structure of one embodiment of the present invention;
FIG. 2 is one of the schematic structural diagrams of the displacement mechanism of the embodiment of FIG. 1 of the present invention;
FIG. 3 is a second schematic structural view of the displacement mechanism of the embodiment of FIG. 1 according to the present invention;
FIG. 4 is a schematic diagram of the structure of the X-axis displacement component of the embodiment of FIG. 1 of the present invention;
FIG. 5 is a schematic structural view of the Z-axis displacement component of the embodiment of FIG. 1 of the present invention;
FIG. 6 is a schematic structural view of the R-axis displacement component of the embodiment of FIG. 1 of the present invention;
FIG. 7 is a schematic structural diagram of an assembly mechanism according to the embodiment of FIG. 1;
FIG. 8 is a second schematic structural view of the assembly mechanism of the embodiment of FIG. 1 according to the present invention;
FIG. 9 is a schematic structural diagram of the CCD detecting mechanism of the embodiment of FIG. 1 according to the present invention;
the figures above show: a workbench 1, a shifting mechanism 2, a shifting support frame 21, an X-axis shifting part 22, an X-axis fixing seat 221, an X-axis mounting plate 222, a screw motor 223, a nut seat 224, an X-axis screw 225, a Y-axis shifting part 23, a Z-axis shifting part 24, a Z-axis motor 241, a Z-axis fixing plate 242, a Z-axis screw 243, an R-axis shifting part 25, an R-axis fixing plate 251, an R-axis motor 252, an R-axis connecting plate 253, an R-axis spot gluing motor 254 and a suction part 26, the device comprises a suction nozzle 261, a dispensing part 27, a dispensing head 271, a CCD alignment part 28, an assembling mechanism 3, an assembling support frame 31, an X-axis power part 32, a Y-axis power part 33, a cylinder fixing seat 331, a sliding table cylinder 332, a connecting column 333, a bearing plate 34, a station plate 341, a station seat 342, a CCD detection mechanism 4, a detection support frame 41, an X-axis detection part 42, a Z-axis detection part 43, a CCD detection part 44 and a feeding mechanism 5.
Detailed Description
In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "mounted," "fixed," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 1 to 9, an embodiment of the present invention is that the high-density LED die bonding apparatus includes a frame, an electric cabinet is arranged in the frame, an electric control system is arranged in the electric cabinet, a worktable 1 is arranged on an upper side of the frame, an assembling mechanism 3, a shifting mechanism 2 and a feeding mechanism 5 are arranged on the worktable 1, the assembling mechanism 3 is located below the shifting mechanism 2, the feeding mechanism 5 is located on one side of the shifting mechanism 2, and both the assembling mechanism 3 and the feeding mechanism 5 are arranged within a stroke range of the shifting mechanism 2; preferably, an upper case is arranged on the upper side of the workbench 1, the assembling mechanism 3, the shifting mechanism 2 and the feeding mechanism 5 are arranged in the upper case, an electric cabinet is arranged on the lower side of the rack, and in machining, the electric control system is often required to be assisted and completed, so that the electric control system is common knowledge and the control principle of the electric control system is not excessively explained. Preferably, a side-by-side door is arranged on the front side of the upper case, and a PVC sealing plate is embedded in a door frame of the side-by-side door to form an observation window; preferably, a control panel is disposed at the front side of the upper case, and a plurality of control buttons are disposed at the lower side of the control panel. Preferably, the device is provided with a plurality of photoelectric sensors for sensing and detecting materials, strokes and the like, for example, the selected photoelectric sensor is a loose CX-441 sensor. The equipment is used for completing the LED Die bonding process, the LED Die bonding is also called Die Bond or chip mounting, and the LED Die bonding refers to a process of bonding a wafer in a designated area of a support through colloid (generally conductive adhesive, insulating adhesive or solder) to form a thermal path or an electric path and provide conditions for subsequent routing connection. The supporting plate loaded with the LED chips is conveyed to a feeding part through a first feeding mechanical arm, and the LED chips are sucked and moved to an assembling mechanism 3 by a moving mechanism 2; placing the LED support of the LED unit in the station seat 342 of the assembly mechanism 3 by a second feeding manipulator; absorb and move the LED chip to equipment mechanism 3 through shift mechanism 2 to counterpoint and the point is glued LED support and LED chip, accomplish the solid brilliant process of LED, this scheme simple structure, convenient to use, the nature controlled is strong, but continuous operation saves the manual work, satisfies the production needs and improves production efficiency, has fine market using value.
The displacement mechanism 2 comprises a displacement support frame 21, an X-axis displacement component 22, a Y-axis displacement component 23, a Z-axis displacement component 24, an R-axis displacement component 25, a CCD alignment component 28 and a suction component 26; the utility model discloses a shift support frame 21, including shift support frame 21, X axle displacement part 22, Y axle displacement part 23, shift support frame 21, the stiff end of Y axle displacement part 23 with the work end of X axle displacement part 22 is connected, the stiff end of Z axle displacement part 24 with the work end of Y axle displacement part 23 is connected, the stiff end of R axle displacement part 25 with the work end of Z axle displacement part 24 is connected, CCD counterpoint part 28 and absorption part 26 are all installed the work end of R axle displacement part 25. Preferably, photoelectric sensors are arranged on the stroke paths of the X-axis displacement part 22, the Y-axis displacement part 23 and the Z-axis displacement part 24, the CCD alignment part 28 and the suction part 26 are driven to move left and right by the X-axis displacement part 22, the CCD alignment part 28 and the suction part 26 are driven to move back and forth by the Y-axis displacement part 23, the CCD alignment part 28 and the suction part 26 are driven to move up and down by the Z-axis displacement part 24, the CCD alignment part 28 and the suction part 26 are driven to rotate on the XY plane by the R-axis displacement part 25, and four-way displacement of the CCD alignment part 28 and the suction part 26 is realized. The four-axis displacement mechanism 2 is composed of an X-axis displacement component 22, a Y-axis displacement component 23, a Z-axis displacement component 24 and an R-axis displacement component 25, the CCD alignment component 28 and the suction component 26 are driven to displace in four directions through the matching among the X-axis displacement component 22, the Y-axis displacement component 23, the Z-axis displacement component 24 and the R-axis displacement component 25, the CCD positioning and dispensing movement paths are related through calibrating the relative positions of a rotation center and the mechanisms, and under the control of a movement control system, the axes are linked to realize the alignment and dispensing of the LED support and the LED chip.
The X-axis displacement assembly comprises an X-axis fixing seat 221, an X-axis mounting plate 222, an X-axis lead screw 225 and a lead screw motor 223, the X-axis fixing seat 221 is fixed on the displacement support frame 21, the X-axis mounting plate 222 is fixed on the X-axis fixing seat 221, two ends of the X-axis mounting plate 222 are respectively provided with a lead screw bearing seat, two ends of the X-axis lead screw 225 are respectively arranged in the two lead screw bearing seats in a penetrating manner, the lead screw motor 223 is fixed at one end of the X-axis fixing seat 221, and the lead screw motor 223 is connected with one end of the X-axis lead screw 225; the X-axis screw rod 225 is provided with a nut seat 224 matched with the X-axis screw rod; the Y-axis displacement component 23 is fixed on the nut seat 224 of the X-axis lead screw 225, and the X-axis displacement component drives the Y-axis displacement component 23 to move left and right. Preferably, the lead screw motor 223 is connected to one end of the X-axis lead screw 225 through a coupling. Preferably, the Z-axis displacement unit 24 includes a Z-axis fixing plate 242, a Z-axis lead screw 243 and a Z-axis motor 241, and the Z-axis fixing plate 242 is fixed to the working end of the Y-axis displacement unit 23; the Z-axis lead 243 is arranged on the Z-axis fixing plate 242, and the Z-axis motor 241 is fixed on the upper part of the Z-axis fixing plate 242 and connected with the Z-axis lead 243; the Z-axis lead screw 243 is provided with a nut connecting seat adapted to the Z-axis lead screw, the R-axis displacement component 25 is fixed on the nut connecting seat of the Z-axis lead screw 243, and the Z-axis displacement component 24 is driven to move back and forth by the Y-axis displacement component 23. Preferably, the screw motor 223 is a linear speed reducer, and the model is tch (v) 40-2200-70S; the Z-axis motor 241 is a JSCC60ys180 motor.
The R-axis displacement unit 25 includes an R-axis fixing plate 251, an R-axis motor 252, and an R-axis connecting plate 253, the R-axis fixing plate 251 is fixed to the nut coupling seat of the Z-axis displacement unit 24, the R-axis motor 252 is fixed to the R-axis fixing plate 251, and the R-axis connecting plate 253 is installed at the working end of the R-axis motor 252; the CCD alignment part 28 is installed in the middle of the R-axis connecting plate 253, and the suction parts 26 are located at both sides of the CCD alignment part 28. The R-axis displacement member 25 is moved up and down by the Z-axis displacement member 24. Preferably, the suction unit 26 includes four suction nozzles 261 distributed on the left and right sides of the CCD aligning unit 28. Preferably, the shift mechanism 2 further comprises a dispensing component 27, the dispensing component 27 comprises a dispensing head 271, and the dispensing head 271 is mounted at the working end of the R-axis shift component 25. Preferably, the R-axis displacement unit 25 further includes an R-axis dispensing motor 254, the R-axis dispensing motor 254 is fixed to one side of the R-axis connecting plate 253, and the dispensing head 271 is mounted at a working end of the R-axis dispensing motor 254. Further, the R-axis dispensing motor 254 is fixed to the left end of the R-axis connecting plate 253. Preferably, the R-axis motor 252 is a TMS03 rotary motor. For example, at the beginning of operation, setting the initial working positions of the mechanisms, calibrating the rotation center of the R-axis dispensing motor 254, calibrating the relative positions of the CCD alignment part 28 and the dispensing part 27, and calibrating the relative positions of the CCD alignment part 28 and the four suction nozzles 261; placing the LED bracket of the LED unit in the station seat 342 of the assembling mechanism 3 through the feeding mechanism 5, and moving the station seat 342 to the initial working position of the assembling mechanism 3 by the assembling mechanism 3; the LED chip is sucked by the sucking component 26, the CCD aligning component 28 is moved to the position right above the LED bracket to be assembled through the linkage of all shafts of the shifting mechanism 2, the vision programming is carried out, the centering position of the LED bracket is calibrated, and a vision path, a dispensing path and a corresponding micro-shifting path are generated; the shifting mechanism 2 moves the LED chip right above the LED bracket according to the micro-shifting path generated by the CCD alignment part 28 and aligns with the LED bracket; then, the R-axis dispensing motor 254 rotates the dispensing head 271 by a corresponding angle according to the dispensing path, and the dispensing head 271 performs a dispensing operation. For another example, the four suction nozzles 261 distributed on the left and right sides of the CCD alignment part 28 are respectively a left suction nozzle 261, a right suction nozzle 261, a left second suction nozzle 261, a right first suction nozzle 261, and a right second suction nozzle 261 in a clockwise order; calibrating the relative positions of the CCD alignment part 28 and the four suction nozzles 261 respectively; when the LED chip sucked by the right suction nozzle 261 needs to be placed on the corresponding LED bracket, the CCD alignment component 28 generates a corresponding right micro-shift path; the industrial personal computer calculates the offset of the LED bracket in the front, back, left and right directions by identifying the positioning reference points by the CCD alignment part 28, and calculates a micro-moving path by combining the relative positions of the CCD alignment part 28 and the corresponding suction nozzle 261; the shift mechanism 2 moves the LED chip right above the LED support and aligns with the LED support according to the right micro-shift path generated by the CCD alignment part 28. This equipment sets up four suction nozzles 261, absorbs that four LED chips can be taken to part 26 once, and the equipment of four LED units can be accomplished to the once material that moves of shift mechanism 2, and four suction nozzles 261 counterpoints according to above-mentioned scheme respectively, improves production efficiency.
The assembling mechanism 3 comprises an assembling support frame 31, an X-axis power component 32, a Y-axis power component 33 and a bearing plate 34, a groove is formed in the workbench 1 along the length direction of the workbench, and the assembling support frame 31 is fixed on the lower side surface of the workbench 1 and is positioned below the groove; the X-axis power component 32 is mounted at the bottom of the assembly support frame 31, the Y-axis power component 33 is composed of two Y-axis driving members, the two Y-axis driving members are respectively mounted at two sides of the working end of the X-axis power component 32, the working ends of the two Y-axis driving members are respectively connected with the bottom side of the bearing plate 34 through a connecting column 333, and the bearing plate 34 is located above the slot. Preferably, a station plate 341 is disposed on the bearing plate 34, a plurality of station seats 342 are uniformly disposed on the station plate 341, and the LED bracket of the LED unit is disposed in the station seats 342. Preferably, a plurality of station plates 341 are uniformly disposed on the carrier plate 34. The bearing plate 34 is driven by the X-axis power part 32 and the Y-axis power part 33 to move in the groove in an XY bidirectional mode. Preferably, the X-axis power unit 32 and the Y-axis displacement unit 23 have the same structure as the X-axis displacement assembly; the X-axis power component 32, the X-axis displacement component 22, the Y-axis displacement component 23 and the Z-axis displacement component 24 are all provided with auxiliary drag chains. Preferably, the Y-axis driving member includes a cylinder fixing seat 331, a sliding table cylinder 332 and a connecting column 333, the cylinder fixing seat 331 is installed at the working end of the X-axis power component 32, the sliding table cylinder 332 is installed on the cylinder fixing seat 331, the working end of the sliding table cylinder 332 is fixed with the bottom of the connecting column 333, and the top of the connecting column 333 is connected with the bottom side of the bearing plate 34. Preferably, the slide cylinder 332 is of the type xyrsc 60. Preferably, a plurality of station plates 341 are uniformly arranged on the bearing plate 34, and the station plates 341 bearing the LED brackets are placed on the station plates 341 through the feeding mechanism 5. Alternatively, the work station plate 341 is fixed on the carrier plate 34, and the LED holder of the LED unit of the feeding mechanism 5 is placed in the work station seat 342 of the work station plate 341. The station plate 341 where the LED bracket to be assembled is located is moved to an initial working position by the linkage of the X-axis power part 32 and the Y-axis power part 33 of the assembling mechanism 3; so that the CCD positions the alignment member 28.
Still set up CCD detection mechanism 4 on the workstation 1, CCD detection mechanism 4 is located the below of displacement mechanism 2, CCD detection mechanism 4 is including detecting support frame 41, X axle detection part 42, Z axle detection part 43 and CCD detection part 44, it fixes to detect support frame 41 on the workstation 1, X axle detection part 42 installs detect on the support frame 41, the stiff end of Z axle detection part 43 with the work end of X axle detection part 42 is connected, CCD detection part 44 is installed the work end of Z axle detection part 43. Preferably, the CCD detecting part 44 includes a CCD camera module and a 3D sensor, the CCD camera module includes a camera fixing base and a camera fixed on the camera fixing base, and the camera fixing base and the 3D sensor are both installed at the working end of the Z-axis detecting part 43. Preferably, the structure of the X-axis detecting unit 42 is the same as that of the X-axis displacing unit; the Z-axis detection component 43 is a telescopic cylinder and is a MGPM16-30Z three-axis cylinder with a guide rod. The CCD detection part 44 detects the alignment of the LED support and the LED chip and the position of the dispensing on the LED unit which has completed the die bonding process. When the dispensing head 271 finishes dispensing, the shifting mechanism 2 drives the suction part 26 to move back to the initial working position, the Y-axis power part 33 of the assembling mechanism 3 drives the work position plate 341 to move to the working position of the CCD detection mechanism 4, the CCD detection mechanism 4 moves the CCD detection part 44 to the position right above the LED unit to be detected through the cooperation of the X-axis detection part 42 and the Z-axis detection part 43, detects the LED bracket and the LED chip which have finished die bonding again, and simultaneously drives the 3D sensor to synchronously capture the data of the LED unit which has finished die bonding and upload the data to the terminal; if the CCD detection part 44 detects that the LED units are unqualified in die bonding, the unqualified LED units are moved to a defective product tray by a second feeding manipulator of the feeding mechanism 5; if the CCD detection part 44 detects that the LED units are qualified in die bonding, the qualified LED units are moved to a good product tray by a second feeding mechanical arm of the feeding mechanism 5 and are transmitted to the production line through the good product tray to continue to complete the next procedure. Preferably, a material receiving manipulator is arranged on the side edge of the assembling mechanism 3, the material receiving manipulator receives the LED units detected by the CCD detecting component 44, and the unqualified LED units are moved to a defective product tray; and (4) moving the qualified LED units to a good product tray.
Feed mechanism 5 includes feeding part, first feeding manipulator and second feeding manipulator, feeding part installs on workstation 1, first feeding manipulator sets up feeding part's side, second feeding manipulator sets up the side of equipment mechanism 3. Preferably, the pallet loaded with the LED chips is carried to the feeding member by the first feeding robot, and the LED chips are sucked and moved to the assembling mechanism 3 by the moving mechanism 2; the LED support of the LED unit is placed in the station holder 342 of the assembly mechanism 3 by a second feeding robot. Preferably, the first feeding manipulator and the second feeding manipulator are both carrying manipulators, the carrying manipulator is a four-shaft manipulator with the model of HC1400, and the manipulator is a conventional machine, so that redundant description is not repeated, and the components such as the cylinder, the motor and the like selected in the embodiment are conventional components. Preferably, the feeding part comprises an X-axis feeding part and a feeding plate, the structure of the X-axis feeding part is the same as that of the X-axis displacement assembly, and the feeding plate is mounted at the working end of the X-axis feeding part; the LED chip-loaded carrier is carried onto a supply plate of a supply member by a first supply robot. For example, the feeding component is arranged on the right side of the shifting mechanism 2, when the shifting mechanism 2 is in the initial working position, the lower part of the suction component 26 corresponds to the left side of the pallet loaded with the LED chips, and the suction component 26 sucks the LED chips on the pallet from left to right in sequence; in the process of taking materials by the suction part 26, the feeding plate is driven by the X-axis feeding part to move left gradually, so that the suction part 26 can take materials.
In the high-density LED die bonding apparatus in this embodiment, at the beginning of operation of the apparatus, a worker first adjusts the movement position of each component and the position of the photoelectric switch according to the size of the LED support and the LED chip to be assembled, so as to ensure that the apparatus is suitable for a substitute work, and the apparatus controls each mechanism to work by an industrial personal computer. Firstly, a supporting plate loaded with an LED chip is conveyed to a feeding plate of a feeding part by a first feeding mechanical arm of a feeding mechanism; meanwhile, the LED support of the LED unit is placed in the station seat of the station plate of the assembling mechanism through a second feeding mechanical arm; then, the CCD aligning component, the sucking component and the dispensing component are moved to an initial preset position through the matching of the X-axis shifting component, the Y-axis shifting component, the Z-axis shifting component and the R-axis shifting component; moving the feeding plate bearing the LED chip supporting plate to an initial preset position through an X-axis feeding part of the feeding part; the working position plate where the LED bracket to be assembled is located is moved to an initial working position through linkage of an X-axis power part and a Y-axis power part of the assembling mechanism; moving the CCD detection part to an initial preset position through the matching of an X-axis detection part and a Z-axis detection part of the CCD detection mechanism; namely, at the beginning of operation, each working component is in an initial working position; then, calibrating the rotation center of the R-axis dispensing motor, calibrating the relative positions of the CCD alignment part and the dispensing part, and calibrating the respective relative positions of the four suction nozzles of the CCD alignment part and the suction part; then, the LED chip is sucked by the sucking component, the CCD aligning component is moved to the position right above the LED bracket to be assembled through the linkage of all shafts of the shifting mechanism, visual programming is carried out, the centering position of the LED bracket is calibrated, and a visual path, a dispensing path and a corresponding micro-shifting path are generated; then, the shifting mechanism shifts the relative LED chip to the right above the LED bracket according to a micro-shifting path generated by the CCD alignment part and aligns the LED chip with the LED bracket; then the R-axis dispensing motor rotates the dispensing head by a corresponding angle according to the dispensing path, and the dispensing head performs dispensing action; then, moving the CCD alignment part to be right above the next LED bracket to be assembled through the linkage of all shafts of the shifting mechanism, performing visual programming again, calibrating the centering position of the corresponding LED bracket, and generating a visual path, a dispensing path and a corresponding micro-moving path; then, the shifting mechanism shifts the relative LED chip to the right above the LED bracket according to a micro-shifting path generated by the CCD alignment part and aligns the LED chip with the LED bracket; then the R-axis dispensing motor rotates the dispensing head by a corresponding angle according to the dispensing path, and the dispensing head performs dispensing action; thus, the four LED chips sucked by the sucking component at one time are subjected to glue dispensing assembly one by one; after dispensing is finished, the CCD aligning component, the sucking component and the dispensing component are moved to the initial preset position through the matching of the X-axis shifting component, the Y-axis shifting component, the Z-axis shifting component and the R-axis shifting component, and the next material taking is waited; then, a Y-axis power part of the assembly mechanism drives the station board to move to the working position of a CCD detection mechanism, the CCD detection mechanism moves the CCD detection part to be right above an LED unit to be detected through the matching of the X-axis detection part and the Z-axis detection part, the LED bracket and the LED chip which are subjected to die bonding are detected again, and meanwhile, a 3D sensor is driven to synchronously capture the data of the LED unit which is subjected to the die bonding process and upload the data to a terminal; if the CCD detection part detects that the LED units are unqualified in die bonding, the unqualified LED units are moved to a defective product tray by a second feeding manipulator of the feeding mechanism; if the CCD detection part detects that the LED units are qualified in die bonding, the qualified LED units are moved to a good product tray by a second feeding mechanical arm of the feeding mechanism and are transmitted to the production line through the good product tray, and the next procedure is continuously completed.
The technical features mentioned above are combined with each other to form various embodiments which are not listed above, and all of them are regarded as the scope of the present invention described in the specification; also, modifications and variations may be suggested to those skilled in the art in light of the above teachings, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A high-density LED die bonder comprises a rack, wherein an electric cabinet is arranged in the rack, and an electric control system is arranged in the electric cabinet, and is characterized in that a workbench is arranged on the upper side of the rack, an assembling mechanism, a shifting mechanism and a feeding mechanism are arranged on the workbench, the assembling mechanism is positioned below the shifting mechanism, the feeding mechanism is positioned on one side of the shifting mechanism, and the assembling mechanism and the feeding mechanism are both arranged in the stroke range of the shifting mechanism;
the assembling mechanism comprises an assembling support frame, an X-axis power part, a Y-axis power part and a bearing plate, a groove is formed in the workbench along the length direction of the workbench, and the assembling support frame is fixed on the lower side surface of the workbench and located below the groove; the X-axis power part is arranged at the bottom of the assembled support frame, the Y-axis power part is composed of two Y-axis driving components, the two Y-axis driving components are respectively arranged at two sides of the working end of the X-axis power part, the working ends of the two Y-axis driving components are respectively connected with the bottom side of the bearing plate through connecting columns, and the bearing plate is positioned above the grooves.
2. The high-density LED die bonding equipment according to claim 1, wherein the displacement mechanism comprises a displacement support frame, an X-axis displacement component, a Y-axis displacement component, a Z-axis displacement component, an R-axis displacement component, a CCD alignment component and a suction component; the aversion support frame is fixed on the workstation, X axle displacement part is installed on the aversion support frame, the stiff end of Y axle displacement part with the work end of X axle displacement part is connected, the stiff end of Z axle displacement part with the work end of Y axle displacement part is connected, the stiff end of R axle displacement part with the work end of Z axle displacement part is connected, CCD counterpoint part is all installed with the absorption part the work end of R axle displacement part.
3. The high-density LED die bonding apparatus according to claim 2, wherein the shifting mechanism further comprises a dispensing component, the dispensing component comprises a dispensing head, and the dispensing head is mounted at a working end of the R-axis shifting component.
4. The high-density LED die bonding equipment according to claim 2, wherein the X-axis displacement assembly comprises an X-axis fixing seat, an X-axis mounting plate, an X-axis lead screw and a lead screw motor, the X-axis fixing seat is fixed on the displacement support frame, the X-axis mounting plate is fixed on the X-axis fixing seat, two ends of the X-axis mounting plate are respectively provided with a lead screw bearing seat, two ends of the X-axis lead screw are respectively arranged in the two lead screw bearing seats in a penetrating manner, the lead screw motor is fixed at one end of the X-axis fixing seat, and the lead screw motor is connected with one end of the X-axis lead screw; the X-axis screw rod is provided with a nut seat matched with the X-axis screw rod; the Y-axis displacement component is fixed on the nut seat of the X-axis screw rod.
5. The high-density LED die bonding equipment according to claim 2, wherein the Z-axis displacement component comprises a Z-axis fixing plate, a Z-axis lead screw and a Z-axis motor, and the Z-axis fixing plate is fixed at the working end of the Y-axis displacement component; the Z-axis screw rod is arranged on the Z-axis fixing plate, and the Z-axis motor is fixed on the upper part of the Z-axis fixing plate and connected with the Z-axis screw rod; and the Z-axis screw rod is provided with a nut connecting seat matched with the Z-axis screw rod, and the R-axis displacement component is fixed on the nut connecting seat of the Z-axis screw rod.
6. The high-density LED die bonding equipment according to claim 2, wherein the R-axis displacement component comprises an R-axis fixing plate, an R-axis motor and an R-axis connecting plate, the R-axis fixing plate is fixed on the nut connecting seat of the Z-axis displacement component, the R-axis motor is fixed on the R-axis fixing plate, and the R-axis connecting plate is installed at the working end of the R-axis motor; the CCD aligning part is arranged in the middle of the R-axis connecting plate, and the sucking parts are positioned on two sides of the CCD aligning part.
7. The high-density LED die bonding apparatus according to claim 2, wherein the structure of the X-axis power component and the structure of the Y-axis displacement component are the same as the structure of the X-axis displacement assembly;
and the X-axis power component, the X-axis displacement component, the Y-axis displacement component and the Z-axis displacement component are all provided with auxiliary drag chains.
8. The high-density LED die bonder according to claim 1, wherein a CCD detection mechanism is further arranged on the worktable and located below the shifting mechanism, the CCD detection mechanism comprises a detection support frame, an X-axis detection component, a Z-axis detection component and a CCD detection component, the detection support frame is fixed on the worktable, the X-axis detection component is installed on the detection support frame, a fixed end of the Z-axis detection component is connected with a working end of the X-axis detection component, and the CCD detection component is installed at a working end of the Z-axis detection component.
9. The high-density LED die bonding equipment according to claim 8, wherein the CCD detection part comprises a CCD camera component and a 3D sensor, the CCD camera component comprises a camera fixing seat and a camera fixed on the camera fixing seat, and the camera fixing seat and the 3D sensor are both installed at the working end of the Z-axis detection part.
10. The high-density LED die bonding equipment according to claim 1, wherein the feeding mechanism comprises a feeding part, a first feeding manipulator and a second feeding manipulator, the feeding part is mounted on the workbench, the first feeding manipulator is arranged at the side of the feeding part, and the second feeding manipulator is arranged at the side of the assembling mechanism.
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| CN116435225A (en) * | 2023-04-26 | 2023-07-14 | 华中科技大学 | Pose adjusting equipment and control method for non-contact pick-up chip |
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