CN211361305U

CN211361305U - Mainboard assembly line

Info

Publication number: CN211361305U
Application number: CN201922492029.7U
Authority: CN
Inventors: 王俊文; 付佳星; 黄金淼; 郑才福; 陈德
Original assignee: Guangdong Lyric Robot Intelligent Automation Co Ltd
Current assignee: Guangdong Lyric Robot Automation Co Ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-08-28
Anticipated expiration: 2029-12-30

Abstract

The application provides a mainboard assembly line, relates to mainboard assembly technical field. Mainboard assembly line includes: the device comprises a backflow jig line, and a mainboard feeding station, a memory bank assembling station, a radiator assembling station and a finished product blanking station which are sequentially distributed at intervals from the upstream to the downstream of the backflow jig line. And is completed by a manipulator: delivering the mainboard from a mainboard conveying line of a mainboard feeding station to a reflow jig line; delivering and assembling the memory bank to a main board from a memory bank conveying line of a memory bank assembling station; delivering and assembling the radiator to the main board from a radiator conveying line of a radiator assembling station; and the assembled main board finished product is delivered to a finished product conveying line of a finished product blanking station from the reflow jig line. The mainboard assembly line can rely on the backward flow tool line to establish ties each work link to through automatic mainboard, memory bank, radiator material loading, the assembly and the unloading of manipulator have realized the assembly to the mainboard, have reduced artifical intensity of labour.

Description

Mainboard assembly line

Technical Field

The application relates to the technical field of mainboard assembly, in particular to a mainboard assembly line.

Background

Among the prior art, lack a production line that carries out equipment on the whole to the mainboard, the link that needs manual intervention is more, if go up unloading, DRAM, radiator assembly etc. these can reduce the assembly efficiency of mainboard to artifical intensity of labour has been increased.

SUMMERY OF THE UTILITY MODEL

An object of this application is to provide a mainboard assembly line, it can improve the not high and big problem of artifical intensity of labour of mainboard assembly efficiency.

The embodiment of the application is realized as follows:

an embodiment of the application provides a mainboard assembly line, includes: the device comprises a backflow jig line, and a main board feeding station, a memory bank assembling station, a radiator assembling station and a finished product blanking station which are sequentially distributed at intervals from the upstream to the downstream of the backflow jig line;

the following operations are performed by the manipulator:

delivering the main board to the reflow jig line from the main board conveying line of the main board loading station;

delivering and assembling the memory bank to a main board from a memory bank conveying line of the memory bank assembling station;

delivering and assembling a heat sink from a heat sink transfer line of the heat sink assembly station to a motherboard;

and the assembled finished mainboard is delivered to a finished product conveying line of the finished product blanking station from the reflow jig line.

The backflow jig line can link the mainboard assembly processes of loading, assembling and unloading, different work is realized through the mechanical arm at different stations, the link of manual operation is greatly reduced, the overall assembly effect is higher, the labor intensity is reduced, and due to less manual intervention, the error condition during assembly is less, and the overall cost is reduced.

In addition, the main board assembly line provided by the embodiment of the application can also have the following additional technical characteristics:

in an optional embodiment of the application, the mainboard feeding station further comprises a collet conveying line, and the collet is conveyed to a jig on the backflow jig line from the collet conveying line by the first manipulator, and then the mainboard is conveyed to the collet on the backflow jig line.

Through setting up the collet transfer chain, can further avoid the artifical step of placing the collet, further reduce artificial intensity of labour.

In an optional embodiment of the present application, a first actuator is connected to the end of the first robot, and the first actuator includes a collet transferring mechanism for taking and placing a collet and a motherboard clamping mechanism for taking and placing a motherboard.

Because the collet transferring mechanism and the mainboard clamping mechanism are arranged on the first executing mechanism, the first manipulator can have different service objects, and a manipulator or other transfer mechanisms do not need to be additionally arranged for the collet, so that the equipment cost is reduced.

In an optional embodiment of the present application, the memory bank assembling station is provided with a second manipulator, an end of the second manipulator is connected with a second executing mechanism, and the second executing mechanism includes an opening mechanism and a memory bank clamping mechanism;

the opening mechanism is used for opening a hippocampus head used for clamping a memory bank on the mainboard, the memory bank clamping mechanism is used for grabbing the memory bank, and the second mechanical arm can drive the memory bank clamping mechanism to insert the memory bank into a memory bank clamping groove on the mainboard after the opening mechanism opens the hippocampus head.

Through integrated opening mechanism, DRAM fixture on the second manipulator for to the transfer and the assembly of DRAM, can both accomplish, need not to add the structure separately, overall structure is simple and practical.

In an optional embodiment of the present application, the second manipulator drives and presses the memory bank, so as to eject the memory bank out of the memory bank slot.

Through the press assembly for many times, the diaphragm of the memory bank can be damaged, and therefore the contact performance of the memory bank and the memory bank clamping groove is improved.

In an optional embodiment of the application, the memory bank assembly station further comprises a memory bank positive and negative detection mechanism, the second manipulator delivers the memory bank on the memory bank conveying line to the memory bank positive and negative detection mechanism, and the detected memory bank is delivered and assembled to the main board.

The positive and negative detection mechanism of DRAM can help discerning whether positive and negative when the DRAM material loading is correct, and the guarantee assembles the DRAM direction on the mainboard correct.

In an optional embodiment of the application, the memory bank assembly station further comprises a dust removal device, and the dust removal device is arranged beside the reflow jig line and used for removing dust from the memory bank clamping groove on the main board.

Through dust collector's work, can be before the assembly DRAM clean the DRAM draw-in groove, avoid impurity such as dust to influence the normal work after the installation of DRAM.

In an optional embodiment of the application, a third manipulator is arranged at the radiator assembling station, a third execution mechanism is connected to the tail end of the third manipulator, and the third execution mechanism comprises a radiator clamping mechanism and a screw locking mechanism;

radiator fixture is used for the centre gripping radiator, the third manipulator drives radiator fixture delivers the radiator to the radiator installation department of mainboard after, screw locking mechanism passes through the screw and fixes the radiator in the radiator installation department.

The third manipulator can drive the radiator clamping mechanism to clamp and transfer the radiator and place the radiator in place. Then can directly take the screw through screw locking mechanism to lock the radiator on the mainboard, realized the assembly of radiator.

In an optional embodiment of the application, the radiator assembling station is provided with a pressing device, the pressing device is arranged beside the backflow jig line, and when the screw locking mechanism works, the pressing device pre-fixes the radiator on the radiator mounting part.

The pressing device can temporarily fix the radiator before screwing the screw, so that the screw is prevented from driving the radiator to move in the screw screwing process, the screwing position of the screw is correct, and the radiator is stably fixed on the main board.

In the optional embodiment of this application, still be equipped with between radiator assembly station and the finished product unloading station and reprocess the station, backward flow tool line is equipped with the transfer device, reprocess the station and be equipped with and reprocess the transfer chain, the transfer device is used for will accomplishing the mainboard that needs reprocess of radiator assembly and transmit to reprocess the transfer chain.

Through set up the station of reprocessing before the unloading, can avoid unqualified product to flow into the unloading station and finally be transported with other qualified products together, ensured product quality, still eliminated unqualified product and flowed into the hidden danger in other production links or consumption links in the later stage.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

FIG. 1 is a top view of a motherboard assembly line;

FIG. 2 is a schematic view of a reflow tool line;

FIG. 3 is a schematic view of a double AGV connection line;

FIG. 4 is a schematic view of a first actuator;

FIG. 5 is a schematic view of an empty tray transfer mechanism;

FIG. 6 is a schematic diagram of a memory bank assembly station;

FIG. 7 is a schematic view of a second actuator from one perspective;

FIG. 8 is a schematic view of the second actuator from another perspective;

FIG. 9 is a schematic diagram of a memory bank positive and negative detection mechanism;

FIG. 10 is a schematic view of a dust removing apparatus;

FIG. 11 is a schematic view of a heat sink assembly station;

FIG. 12 is a schematic view of a third actuator;

FIG. 13 is a schematic view of a pressing device;

FIG. 14 is a schematic view of a reflow tool line transfer device;

fig. 15 is a schematic view of a finished motherboard.

Icon: 100-a main board conveying line; 110-a first manipulator; 120-a shoe transfer mechanism; 130-a motherboard clamping mechanism; 131-a clamping jaw; 132-a bidirectional cylinder; 133-stroke cylinder; 200-a memory bank conveying line; 210-a second manipulator; 220-an opening mechanism; 221-opening the claw; 222-a guide slot; 223-a guide rod; 224-open cylinder; 225-open head; 230-memory bank clamping mechanism; 231-a clamping block; 2311-clamping groove; 232-a buffer structure; 240-memory bank positive and negative detection mechanism; 241-a light source; 242-correlation sensor; 250-a dust removal device; 251-coordinate manipulator; 252-a suction mechanism; 260-a tray taking mechanism; 300-a radiator conveying line; 310-a third manipulator; 321-a finger cylinder; 322-a clamping part; 330-electric batch; 340-a pressing device; 341-sliding table cylinder; 342-a slide rail; 343-a press-down part; 400-a collet conveyor line; 500-reflow tool line; 510-gear stop; 520-a lifting device; 600-finished product conveying line; 610-a blanking manipulator; 700-repairing the conveyor line; 710-a scanner; 720-synchronous belt; 730-maintenance workbench; 800-jig; 900-CCD lens; 910-empty tray transfer mechanism; 911-single axis robot; 912-a material taking part; 913-an opening and closing cylinder; 1000-mainboard finished product; 1100-main board raw material; 1200-finished memory bank; 1300-finished product radiator; 1400-hippocampus japonicus; 1500-code scanner; 1600-a lifting mechanism; 1700 — correction table.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the product conventionally places when used, and are only used for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Examples

Referring to fig. 1 to 14, the present application provides a motherboard assembly line, which can assemble a motherboard into the finished motherboard 1000 shown in fig. 15. The motherboard raw material 1100 is provided with a memory bank slot (i.e., a position where a finished memory bank 1200 is inserted in the motherboard raw material 1100 in fig. 15), and a heat sink mounting portion (i.e., a position where a finished heat sink 1300 is fixed on the motherboard raw material 1100 in fig. 15), and both ends of the memory bank slot are provided with a hippocampus 1400 to fix the memory bank. These are conventional structures and will not be described in detail below.

As shown in fig. 1, in particular, the main board assembly line includes: the reflow jig line 500 and a main board feeding station, a memory bank assembling station, a radiator assembling station and a finished product blanking station which are sequentially distributed at intervals from the upstream to the downstream of the reflow jig line 500;

the following operations are performed by the manipulator:

delivering a main board (i.e. a main board raw material 1100) from a main board conveying line 100 of a main board loading station to a reflow jig line 500;

delivering and assembling the memory banks to the main board from the memory bank conveying line 200 of the memory bank assembling station;

delivering and assembling the heat sink from the heat sink transfer line 300 of the heat sink assembling station to the main board;

the assembled finished motherboard 1000 is delivered from the reflow jig line 500 to the finished product transfer line 600 of the finished product blanking station.

The main board conveying line 100, the memory bank conveying line 200, the radiator conveying line 300, and the below-mentioned bottom tray conveying line 400 of the present embodiment all adopt a double-layer AGV connection line shown in fig. 3, which can be connected with an AGV (automated guided Vehicle, which is equipped with an electromagnetic or optical automatic guiding device, and can travel along a specified guiding path, and has safety protection and various transport vehicles with transfer functions), receive a material box conveyed at an upper layer receiving position and scan and recognize the material box of an incoming material through a code scanner 1500, and convey an empty material box which finishes feeding from a lower layer, so that the AGV trolley can convey the empty material box away. Wherein, dispose elevating system 1600 in the one end that is close to backward flow tool line 500 of double-deck AGV connection line, realize shifting empty magazine to the lower floor from the upper strata.

Of course, the finished product blanking station of this embodiment also uses a double-layer AGV connection line as the rework transportation line 700, and after the main board finished product 1000 is filled with the magazine, the main board finished product may be sent out, for example, may be delivered to an AGV cart to be transported to a storage area or other working areas, such as a chassis assembly area. The double-layer AGV docking line used in this embodiment, the corresponding lifting mechanism 1600, the code scanner 1500, and the like can refer to the general technologies, and are not described herein again.

The backflow jig line 500 can link the mainboard assembly processes of loading, assembling and unloading, different work is realized through the mechanical arm at different stations, the link of manual operation is greatly reduced, the overall assembly effect is higher, the labor intensity is reduced, and due to less manual intervention, the error condition during assembly is less, and the overall cost is reduced.

Specifically, as shown in fig. 1, in this embodiment, the motherboard loading station further includes a collet conveyor line 400, and the first manipulator 110 first delivers the collet from the collet conveyor line 400 to the jig 800 on the reflow jig line 500, and then delivers the motherboard to the collet on the reflow jig line 500. Through setting up collet transfer chain 400, can further avoid the manual work to place the step of collet, further reduce artificial intensity of labour.

The end of the first manipulator 110 is connected with a first executing mechanism, and the first executing mechanism includes a bottom support transferring mechanism 120 for taking and placing a bottom support and a main board clamping mechanism 130 for taking and placing a main board. Because the collet transferring mechanism 120 and the main board clamping mechanism 130 are arranged on the first executing mechanism, the first manipulator 110 can have different service objects, and a manipulator or other transfer mechanisms do not need to be additionally arranged for the collet, so that the equipment cost is reduced.

In detail, the main board clamping mechanism 130 has two opposite clamping jaws 131, and the clamping jaws 131 are driven to move toward or away from each other by a bidirectional air cylinder 132 to clamp or release the main board. The collet transfer mechanism 120 is provided with a suction cup, which can suck the collet by generating negative pressure through air suction, and can loosen the collet when stopping air suction. Of course, the shoe transferring mechanism 120 and the main board clamping mechanism 130 are respectively provided with a stroke cylinder 133, so that when the first manipulator 110 moves in place, the stroke cylinder 133 further drives the corresponding mechanism to approach the taken main board or shoe.

In addition, when collet and mainboard of taking, can judge positive and negative through the detection function of shooing, prevent that the material on the tool 800 from being put conversely. And can also sweep the sign indicating number through the scanner 710 that lays on the backward flow tool line 500 after feeding tool 800, bind tool 800 sign indicating number and mainboard sign indicating number to convenient statistics product volume, yield, defective percentage etc. or when going wrong, know that is the product on which tool 800 has a problem accurately. The photographing detection may be implemented by using a CCD (charge coupled Device) lens and a matched detection circuit, which are all the prior art, and the scanning and binding of the scanner 710 are also mature technologies, and are not described herein again. It should be noted that the CCD lens 900 used in this embodiment is the prior art, and the difference in structure can be selected according to the functional requirements, and it should not be construed as a limitation that the structure must be the same or different.

Referring to fig. 6 to 10, in the present embodiment, a second manipulator 210 is disposed at the memory bank assembling station, and a second executing mechanism is connected to an end of the second manipulator 210, and includes an opening mechanism 220 and a memory bank clamping mechanism 230;

the opening mechanism 220 is used for opening the hippocampus head 1400 on the main board, which is used for clamping the memory bank, the memory bank clamping mechanism 230 is used for grabbing the memory bank, and the second mechanical arm 210 can drive the memory bank clamping mechanism 230 to insert the memory bank into the memory bank clamping groove on the main board after the opening mechanism 220 opens the hippocampus head 1400. By integrating the opening mechanism 220 and the memory stick clamping mechanism 230 into the second robot arm 210, the transfer and assembly of the memory sticks can be completed without adding a separate structure, and the overall structure is simple and practical.

The memory bank clamping mechanism 230 has two clamping blocks 231 and is driven by a bidirectional cylinder (not shown) to open and close. The clamping slot 2311 is formed in the clamping block 231, so that the memory bank can be prevented from laterally moving when being clamped. The buffer structure 232 is arranged in the area between the two clamping blocks 231, so that the memory bank is prevented from being damaged in the process of pressing down the memory bank, and meanwhile, the main board is also buffered to avoid being pressed and damaged.

The opening mechanism 220 is provided with two opening claws 221, two guide grooves 222 corresponding to the opening claws 221 are formed in a substrate on which the opening mechanism 220 is mounted, a guide rod 223 is arranged on one side of each opening claw 221, an opening cylinder 224 is arranged at one end of an opening head 225 hinged to each opening claw 221, when the opening cylinder 224 drives the opening head 225 to move, the opening head 225 can drive the opening claws 221 to move, due to the effect of the guide rod 223 and the guide grooves 222, the two opening claws 221 are far away from each other, and when the opening claws 221 are respectively contacted with the hippocampus head 1400, the hippocampus head 1400 can be pulled off through the movement of the mutual separation, so that the hippocampus head 1400 is opened.

In detail, after the second manipulator 210 drives the memory bank to enter and exit the memory bank slot for multiple times, the memory bank is assembled into the memory bank slot of the motherboard. In this embodiment, after the second manipulator 210 drives the memory bank to be inserted into the memory bank slot for the first time, the hippocampus head 1400 is automatically locked;

the second manipulator 210 presses the memory bank clamping mechanism 230 again to eject the memory bank and unlock the hippocampus head 1400;

after the second manipulator 210 presses the memory bank for the third time, the memory bank is assembled to the motherboard.

In detail, the memory bank assembly station further includes a memory bank positive and negative detection mechanism 240, the second manipulator 210 delivers the memory bank on the memory bank conveying line 200 to the memory bank positive and negative detection mechanism 240, and then delivers and assembles the detected memory bank to the motherboard. The positive and negative detection mechanism 240 of memory bank can help to identify whether the positive and negative of the memory bank during loading is correct, and the direction of the memory bank assembled on the mainboard is correct. The positive and negative detection mechanism 240 of memory bank has CCD camera lens 900 to ensure to sweep sign indicating number and accurate location to the memory bank that second actuating mechanism snatched to dispose light source 241, rethread correlation sensor 242 comes to carry out positive and negative detection to the memory bank, these are comparatively current mode, and this place is no longer repeated.

In this embodiment, the memory bank assembly station further includes a dust removing device 250, and the dust removing device 250 is disposed beside the reflow jig line 500 and used for removing dust from the memory bank slot on the motherboard. Through dust collector 250's work, can be before the assembly DRAM clean the DRAM draw-in groove, avoid impurity such as dust to influence the normal work after the installation of DRAM. Generally, the dust removing device 250 is provided with a coordinate robot 251, a CCD lens 900 for positioning the memory card slot, and a suction mechanism 252 for sucking dust. The coordinate manipulator 251 can drive the CCD lens 900 to move to determine the position of the memory bank slot, and then the suction mechanism 252 is driven by a linear driving structure such as an air cylinder to approach the memory bank slot and suck dust in the memory bank slot, so as to achieve the purpose of cleaning the memory bank slot. The specific structure of the dust removing device 250 can also refer to the equipment used in the device for cleaning the memory bank card slot, and is not described herein again.

Referring to fig. 11 to 14, in the present embodiment, a third manipulator 310 is disposed at the heat sink assembling station, and a third actuator is connected to an end of the third manipulator 310, where the third actuator includes a heat sink clamping mechanism and a screw locking mechanism;

the radiator clamping mechanism is used for clamping the radiator, the third mechanical arm 310 drives the radiator clamping mechanism to deliver the radiator to the radiator mounting portion of the mainboard, and the screw locking mechanism fixes the radiator on the radiator mounting portion through screws.

The third executing mechanism is also provided with a CCD lens 900 to photograph and position the radiator, the radiator clamping mechanism comprises a finger cylinder 321 and a clamping part 322, and the finger cylinder 321 can drive the clamping part 322 to clamp and loosen the radiator. An inductor may be further disposed on the clamping portion 322 to detect whether the heat sink is effectively clamped.

Wherein, the screw locking mechanism is a common electric screwdriver 330, which is not described in detail herein.

In general, the third robot 310 can drive the heat sink clamping mechanism to clamp and transfer the heat sink, and place the heat sink in place. Then can directly take the screw through screw locking mechanism to lock the radiator on the mainboard, realized the assembly of radiator.

In detail, the pressing device 340 is arranged at the assembling station of the heat sink, the pressing device 340 is arranged beside the reflow jig line 500, and when the screw locking mechanism works, the pressing device 340 pre-fixes the heat sink to the heat sink mounting portion. The pressing device 340 can temporarily fix the radiator before screwing the screws, so that the screws are prevented from driving the radiator to move in the screw screwing process, the screwing position of the screws is correct, and the radiator is stably fixed on the main board.

The pressing device 340 is provided with a sliding table cylinder 341, and the position of the pressing portion 343 can be adjusted by matching with the sliding rail 342, so that the radiator can be pressed stably.

As shown in fig. 5, in this embodiment, optionally, an empty tray transfer mechanism 910 is further disposed at the main board loading station and the heat sink assembly station, and is capable of transferring empty trays that do not carry materials into empty trays on the lifting mechanism 1600, so that the empty trays and the empty trays loaded inside are conveniently carried out at the lower layer of the double-layer AGV connection line. Because the time consumed by the second manipulator 210 of the bank assembly station is shorter than the time consumed by the motherboard loading station and the heat sink assembly station, the empty tray can be transferred in the bank assembly station by the second manipulator 210, and the tray taking mechanism 260 (such as a suction cup device) is correspondingly configured in the second actuator on the second manipulator 210 to complete the tray grabbing.

In detail, empty charging tray transfer mechanism 910 is equipped with slip table cylinder 341 and drives unipolar manipulator 911 at the motion of horizontal direction, is equipped with on the unipolar manipulator 911 and gets material portion 912 and open and shut cylinder 913, and open and shut cylinder 913 can drive and get material portion 912 and open and shut to the realization is got to the clamp of empty charging tray, and the one-hand manipulator can make and get material portion 912 up-and-down motion, thereby satisfies getting to empty charging tray and put. It should be noted that, although the sliding table air cylinders 341 mentioned in this embodiment have different specific structures, they are all the existing one type of air cylinder, and here, the air cylinder itself is not changed, and those skilled in the art can select the air cylinder according to the needs.

Referring to fig. 1 and 14, a repair station is further disposed between the heat sink assembly station and the finished product blanking station, the reflow jig line 500 is provided with a transfer device, the repair station is provided with a repair conveyor line 700, and the transfer device is configured to transfer the to-be-repaired motherboard on which the heat sink assembly is completed to the repair conveyor line 700. The transfer device used in this embodiment is a timing belt 720, which can drive the jig 800 to move, so as to transfer the defective product (NG product) detected by the scanner 710 from the reflow jig line 500 to the rework transportation line 700. The rework delivery line 700 may deliver the problematic product to a repair station 730 for repair. Through set up the station of reprocessing before the unloading, can avoid unqualified product to flow into the unloading station and finally be transported with other qualified products together, ensured product quality, still eliminated unqualified product and flowed into the hidden danger in other production links or consumption links in the later stage.

In addition, it can be understood that corresponding correction workbench 1700 can be arranged at the motherboard loading station and the radiator assembly station, so that when NG (problematic raw material) in the raw material is detected by scanning, the correction workbench 1700 is taken in time for maintenance, and only OK (qualified raw material) can be continuously used for assembly.

Of course, the corresponding control can be completed by a unified system, or as in the present application, besides a system with main control, a control box can be separately arranged at a station with more complicated and diversified operation steps, such as a memory bank assembly station and a radiator assembly station, so as to facilitate more accurate control, and simultaneously, the working condition can be fed back to the main control system. These are all relatively existing control methods, and are not described herein again.

The principle of the embodiment is as follows:

first manipulator 110 of mainboard material loading station can place the collet earlier in the tool 800 of backward flow tool line 500, then place the correct mainboard with qualified and positive and negative and place in the collet, backward flow tool line 500 takes the mainboard to remove to DRAM assembly station.

At the DRAM assembly station, dust collector 250 removes dust to the DRAM draw-in groove of mainboard earlier, then second manipulator 210 snatchs the DRAM according to correct positive and negative to install in the DRAM draw-in groove of mainboard, and through the back and forth press, make the diaphragm of DRAM break open, promote the contact performance of mainboard and DRAM. The reflow tool line 500 then carries the motherboard to the heat sink assembly station.

At the heat sink assembly station, the third manipulator 310 drives the qualified heat sink to be placed into the heat sink mounting portion of the motherboard in the correct direction, and then screws the screws tightly with the electric screwdriver 330 under the positioning action of the pressing device 340.

Then the reflow jig line 500 carries the main board to pass through the repair station, if the scanner 710 scans that the product is qualified, the finished product is continuously conveyed to the finished product blanking station, the blanking manipulator 610 transfers the finished main board 1000 into the material box, and the finished product is conveyed away from the reflow jig line 500 through the finished product conveying line 600. If the product is not qualified, the product is transferred to the repair conveying line 700 of the repair station by the transfer device of the reflow jig line 500, and then the repair is performed.

Wherein, be provided with on the backward flow tool line 500 and keep off stopper 510, conveniently stop tool 800 at corresponding station to assemble or go up unloading. After the jig 800 finishes transporting the motherboard finished product 1000, the empty jig 800 moves along with the reflow jig line 500 and is moved to the lower layer of the reflow jig line 500 at the lifting device 520 shown in fig. 2, and then flows back to the motherboard loading station for circular loading. The reflow jig line 500 and the lifting device 520 are also conventional structures, and the functions thereof are only used without improving the structures thereof, and thus are not described in detail.

Due to the fact that various kinds of identification and positioning are achieved, assembly can be more accurate, the error rate in manual operation is reduced, the rate of finished products can be improved to a certain degree, and the problem of cost increase caused by unqualified products is solved.

To sum up, the mainboard assembly line of this application can rely on backward flow tool line 500 to establish ties each work link to through automatic mainboard, memory bank, radiator material loading, the assembly and the unloading of manipulator have realized the assembly to the mainboard, have reduced artifical intensity of labour.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A motherboard assembly line, comprising: the device comprises a backflow jig line, and a main board feeding station, a memory bank assembling station, a radiator assembling station and a finished product blanking station which are sequentially distributed at intervals from the upstream to the downstream of the backflow jig line;

the following operations are performed by the manipulator:

2. The motherboard assembly line of claim 1, wherein the motherboard loading station further comprises a collet delivery line, and the first manipulator delivers the collet from the collet delivery line to a jig on the reflow jig line and then delivers the motherboard to the collet on the reflow jig line.

3. The motherboard assembly line of claim 2, wherein the first robot end is connected to a first actuator, and the first actuator comprises a collet transfer mechanism for taking and placing a collet and a motherboard clamping mechanism for taking and placing a motherboard.

4. The main board assembly line of claim 1, wherein the memory bank assembly station is provided with a second manipulator, a second execution mechanism is connected to the end of the second manipulator, and the second execution mechanism comprises an opening mechanism and a memory bank clamping mechanism;

5. The main board assembly line of claim 4, wherein the second manipulator is driven to press the memory bank for ejecting the memory bank out of the memory bank slot.

6. The motherboard assembly line of claim 1, wherein the memory bank assembly station further comprises a memory bank positive and negative detection mechanism, the second manipulator delivers the memory bank on the memory bank conveying line to the memory bank positive and negative detection mechanism, and then delivers and assembles the detected memory bank to the motherboard.

7. The main board assembly line of claim 1, wherein the memory bank assembly station further comprises a dust removal device, and the dust removal device is disposed beside the reflow jig line and used for removing dust from the memory bank clamping groove on the main board.

8. The main board assembly line of claim 1, wherein the radiator assembly station is provided with a third manipulator, a third actuator is connected to the end of the third manipulator, and the third actuator comprises a radiator clamping mechanism and a screw locking mechanism;

9. The main board assembly line of claim 8, wherein the heat sink assembly station is provided with a pressing device, the pressing device is arranged beside the reflow jig line, and when the screw locking mechanism works, the pressing device pre-fixes the heat sink to the heat sink mounting portion.

10. The main board assembly line of claim 1, wherein a repair station is further arranged between the radiator assembly station and the finished product blanking station, the reflow jig line is provided with a transfer device, the repair station is provided with a repair conveyor line, and the transfer device is used for transferring the main board to be repaired, which is subjected to radiator assembly, to the repair conveyor line.