CN211361305U - Mainboard assembly line - Google Patents

Abstract

The present application provides a motherboard assembly line, which relates to the technical field of motherboard assembly. The motherboard assembly line includes: a reflow jig line and a motherboard loading station, a memory bar assembly station, a radiator assembly station and a finished product unloading station which are spaced from the upstream to the downstream of the reflow jig line. And the robot completes: delivering the motherboard from the motherboard conveyor line of the motherboard loading station to the reflow jig line; delivering the memory bar from the memory bar conveyor line of the memory bar assembly station and assembling it to the motherboard; delivering the radiator from the radiator conveyor line of the radiator assembly station and assembling it to the motherboard; delivering the assembled motherboard finished product from the reflow jig line to the finished product conveyor line of the finished product unloading station. The motherboard assembly line can connect various work links in series by relying on the reflow jig line, and realize the assembly of the motherboard through automated loading of the motherboard, memory bar, and radiator, assembly and unloading of the robot, thereby reducing the intensity of manual labor.

Description

Mainboard assembly line

technical field

The present application relates to the technical field of mainboard assembly, and in particular, to a mainboard assembly line.

Background technique

In the prior art, there is a lack of a production line for the overall assembly of the motherboard, and there are many links that require manual intervention, such as loading and unloading, memory stick, radiator assembly, etc., which will reduce the assembly efficiency of the motherboard and increase manual labor. strength.

Utility model content

The purpose of the present application is to provide a main board assembly line, which can improve the problems of low main board assembly efficiency and high labor intensity.

The embodiments of the present application are implemented as follows:

An embodiment of the present application provides a main board assembly line, including: a reflow jig line, and a main board feeding station, a memory module assembly station, and a heat sink assembly tool distributed in sequence from upstream to downstream of the reflow jig line. position and finished product blanking station;

The following operations are performed by the robot:

delivering the mainboard from the mainboard conveying line of the mainboard loading station to the reflow jig line;

delivering and assembling the memory stick to the motherboard from the memory stick conveying line of the memory stick assembling station;

delivering and assembling the heat sink from the heat sink conveyor line of the heat sink assembly station to the motherboard;

The assembled mainboard finished product is delivered from the reflow jig line to the finished product conveying line of the finished product unloading station.

The reflow jig line can connect the main board assembly process of feeding, assembling and unloading, and realize different work through the manipulator in different stations, which greatly reduces the manual operation links, makes the overall assembly effect higher, and reduces manual labor. Strength, and due to less manual intervention, there are fewer errors in assembly, which is also beneficial to overall cost reduction.

In addition, the motherboard assembly line provided according to the embodiments of the present application may also have the following additional technical features:

In an optional embodiment of the present application, the main board loading station further includes a bottom bracket conveying line, and the first robot first delivers the bottom bracket from the bottom bracket conveying line to the fixture on the return jig line. on the jig, and then deliver the main board to the bottom bracket located on the line of the reflow jig.

By setting the bottom bracket conveying line, the step of manually placing the bottom bracket can be further eliminated, and the labor intensity of labor can be further reduced.

In an optional embodiment of the present application, the end of the first manipulator is connected with a first actuator, and the first actuator includes a bottom bracket transfer mechanism for picking up and placing a bottom bracket and a main board clip for picking up and placing a main board. holding institution.

Since the first actuator is provided with a bottom bracket transfer mechanism and a main board clamping mechanism, the first manipulator can have different service objects, and there is no need to additionally provide a manipulator or other transfer mechanism for the bottom bracket, which reduces equipment costs.

In an optional embodiment of the present application, the memory module assembly station is provided with a second manipulator, the end of the second manipulator is connected with a second actuator, and the second actuator includes an opening mechanism, a memory module clamping mechanism mechanism;

The opening mechanism is used to open the hippocampus on the motherboard for clamping the memory stick, the memory stick clamping mechanism is used to grab the memory stick, and the second manipulator can open the hippocampus by the opening mechanism. The memory stick clamping mechanism is driven to insert the memory stick into the memory stick slot on the motherboard.

By integrating the opening mechanism and the memory stick clamping mechanism on the second manipulator, the transfer and assembly of the memory stick can be completed without additional structures, and the overall structure is simple and practical.

In an optional embodiment of the present application, the second manipulator drives and presses the memory stick, so as to eject the memory stick from the memory stick slot.

By pressing and assembling multiple times, the diaphragm of the memory module can be damaged, thereby improving the contact performance between the memory module and the memory module card slot.

In an optional embodiment of the present application, the memory module assembly station further includes a memory module positive and negative detection mechanism, and a second manipulator delivers the memory module on the memory module conveying line to the memory module positive and negative detection mechanism. mechanism, and then deliver and assemble the detected memory modules to the motherboard.

The memory stick front and back detection mechanism can help identify whether the memory stick is correct when feeding, and ensure the correct orientation of the memory stick assembled on the motherboard.

In an optional embodiment of the present application, the memory module assembly station further includes a dedusting device, and the dedusting device is arranged beside the return jig line for dedusting the memory module slot on the motherboard.

Through the work of the dust removal device, the memory module card slot can be cleaned before the memory module is assembled, so as to prevent impurities such as dust from affecting the normal operation of the memory module after installation.

In an optional embodiment of the present application, the radiator assembly station is provided with a third manipulator, the end of the third manipulator is connected with a third actuator, and the third actuator includes a radiator clamping mechanism, a screw locking mechanism;

The radiator clamping mechanism is used to clamp the radiator, and after the third manipulator drives the radiator clamping mechanism to deliver the radiator to the radiator mounting part of the motherboard, the screw locking mechanism dissipates heat through the screws. The radiator is fixed on the radiator mounting part.

The third manipulator can drive the radiator clamping mechanism to clamp and transfer the radiator and place it in place. Then, the screws can be taken directly through the screw locking mechanism, and the radiator can be locked on the motherboard, so as to realize the assembly of the radiator.

In an optional embodiment of the present application, the radiator assembly station is provided with a pressing device, the pressing device is arranged beside the return jig line, and when the screw locking mechanism works, the pressing device will The radiator is pre-fixed to the radiator mounting portion.

The pressing device can temporarily fix the radiator before screwing, avoiding the screw driving the radiator to move during the screwing process, ensuring that the screw is screwed in the correct position and stably fixing the radiator on the motherboard.

In an optional embodiment of the present application, a repair station is further provided between the radiator assembly station and the finished product blanking station, the reflow jig line is provided with a transfer device, and the repair station A repair conveying line is provided, and the transfer device is used to transfer the main board to be repaired after the radiator assembly is completed to the repair conveying line.

By setting up a rework station before unloading, it can prevent unqualified products from flowing into the unloading station and finally being transported together with other qualified products, which ensures product quality and eliminates unqualified products from flowing into other production links or consumption in the later stage. link hazards.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application more clearly, the following drawings will briefly introduce the drawings that need to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore do not It should be regarded as a limitation of the scope, and for those of ordinary skill in the art, other related drawings can also be obtained according to these drawings without any creative effort.

Figure 1 is a top view of the main board assembly line;

Figure 2 is a schematic diagram of a reflow fixture line;

3 is a schematic diagram of a double-layer AGV connecting line;

4 is a schematic diagram of a first actuator;

Fig. 5 is the schematic diagram of empty material tray transfer mechanism;

FIG. 6 is a schematic diagram of a memory module assembly station;

FIG. 7 is a schematic diagram of the second actuator from a viewing angle;

8 is a schematic diagram of the second actuator from another perspective;

Fig. 9 is the schematic diagram of the front and back detection mechanism of the memory stick;

Figure 10 is a schematic diagram of a dust removal device;

11 is a schematic diagram of a radiator assembly station;

Figure 12 is a schematic diagram of a third actuator;

13 is a schematic diagram of a pressing device;

FIG. 14 is a schematic diagram of a reflow jig line transfer device;

FIG. 15 is a schematic diagram of a finished motherboard.

Icons: 100-Mainboard conveyor line; 110-First manipulator; 120-Bottom bracket transfer mechanism; 130-Mainboard clamping mechanism; 131-Gripper; 132-Two-way cylinder; 133-Stroke cylinder; 210-second manipulator; 220-opening mechanism; 221-claw opening; 222-guide groove; 223-guide rod; 224-opening cylinder; 225-opening head; 230-memory stick clamping mechanism; 231-clamping block; 2311 -Clamping slot; 232-Buffer structure; 240-Memory stick positive and negative detection mechanism; 241-Light source; ;300-radiator conveying line;310-third manipulator;321-finger cylinder;322-clamping part;330-electric batch;340-pressing device;341-slide cylinder;342-slide rail;343-press down Department; 400- bottom support conveying line; 500- return fixture line; 510- stopper; 520- lifting device; 600- finished product conveying line; 610- unloading manipulator; 700- repair conveying line; 710- scanner; 720-synchronous belt; 730-maintenance workbench; 800-fixture; 900-CCD lens; 910-empty tray transfer mechanism; 911-single-axis manipulator; 912-reclaimer; 913-opening and closing cylinder; Finished product; 1100-mainboard raw material; 1200-finished memory stick; 1300-finished radiator; 1400-hippocampus; 1500-scanning machine; 1600-lifting mechanism; 1700-correction table.

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of the present application, but not all of the embodiments. The components of the embodiments of the present application generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

Thus, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the application as claimed, but is merely representative of selected embodiments of the application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

It should be noted that like numerals and letters refer to like items in the following figures, so once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

In the description of this application, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation that the product is usually placed in when it is used. Or the positional relationship is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present application. Furthermore, the terms "first", "second", etc. are only used to differentiate the description and should not be construed to indicate or imply relative importance.

In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "arrangement" and "connection" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection, or It can be connected in one piece; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood in specific situations.

Example

Referring to FIGS. 1 to 14 , the present application provides a mainboard assembly line, which can assemble the mainboard into a finished mainboard 1000 shown in FIG. 15 . Among them, the motherboard material 1100 is provided with a memory card slot (that is, the position where the finished memory stick 1200 is inserted on the motherboard material 1100 in FIG. 15 ), and a heat sink installation part (that is, the motherboard material 1100 in FIG. 15 is fixed on the finished product to dissipate heat. The position of the memory stick 1300), there are hippocampal heads 1400 at both ends of the memory stick slot to fix the memory stick. These are all existing structures and will not be described in detail below.

As shown in FIG. 1 , specifically, the main board assembly line includes: a reflow jig line 500 and a main board feeding station, a memory module assembly station, and a radiator assembly station distributed in sequence from the upstream to the downstream of the reflow jig line 500 And finished product blanking station;

The following operations are performed by the robot:

delivering the main board (ie the main board raw material 1100) from the main board conveying line 100 of the main board feeding station to the reflow jig line 500;

delivering and assembling the memory stick from the memory stick conveying line 200 of the memory stick assembly station to the motherboard;

delivering and assembling the heat sink from the heat sink conveyor line 300 of the heat sink assembly station to the motherboard;

The assembled main board finished product 1000 is delivered from the reflow jig line 500 to the finished product conveying line 600 of the finished product unloading station.

Among them, the main board conveying line 100, the memory module conveying line 200, the radiator conveying line 300, and the bottom bracket conveying line 400 mentioned below in this embodiment all use the double-layer AGV connection line shown in FIG. 3, which can Connect with AGV (AutomatedGuided Vehicle, refers to a transport vehicle equipped with automatic guidance devices such as electromagnetic or optical, which can travel along a specified guidance path, with safety protection and various transfer functions), and receive and transport at the upper receiving point. The incoming material box is scanned and identified by the code scanner 1500, and the empty material box after feeding is transported out from the lower layer, which is convenient for the AGV car to transport the empty material box away. Among them, a lifting mechanism 1600 is arranged at one end of the double-layer AGV connection line close to the return jig line 500, so as to realize the transfer of the empty material box from the upper layer to the lower layer.

Of course, the finished product blanking station in this embodiment also uses a double-layer AGV connection line as the repair conveyor line 700. After the main board finished product 1000 is filled with the material box, it can be sent out, for example, it can be delivered to the AGV trolley and transported to the storage area Or other work areas, such as chassis assembly area, etc. The double-layer AGV connecting line, the corresponding lifting mechanism 1600, the code scanner 1500, etc. used in this embodiment can all refer to the general technology, and will not be repeated here.

The reflow jig line 500 can connect the main board assembly process of feeding, assembling and unloading, and realize different work through the manipulator at different stations, which greatly reduces the manual operation links, makes the overall assembly effect higher, and reduces labor It is labor-intensive, and due to less manual intervention, there are fewer errors in assembly, and it is also beneficial to reduce the overall cost.

Specifically, as shown in FIG. 1 , in this embodiment, the main board feeding station further includes a bottom bracket conveying line 400 , and the first manipulator 110 first delivers the bottom bracket from the bottom bracket conveying line 400 to the return jig line 500 On the jig 800 , the main board is then delivered to the bottom bracket located on the reflow jig line 500 . By arranging the bottom bracket conveying line 400, the step of manually placing the bottom bracket can be further eliminated, and the labor intensity of labor can be further reduced.

The end of the first manipulator 110 is connected with a first actuator, and the first actuator includes a bottom bracket transfer mechanism 120 for picking up and placing a bottom bracket and a main board clamping mechanism 130 for picking up and placing a main board. Since the bottom bracket transfer mechanism 120 and the main board clamping mechanism 130 are provided on the first actuator, the first manipulator 110 can serve different objects, and there is no need to provide a robot arm or other transfer mechanism for the bottom bracket, which reduces equipment costs.

In detail, the main board clamping mechanism 130 has two opposite clamping claws 131, and the clamping claws 131 are driven to close or move away by the bidirectional air cylinder 132, so as to realize the clamping or releasing of the main board. The bottom bracket transfer mechanism 120 is provided with a suction cup, and the bottom bracket can be sucked by generating a negative pressure through air extraction, and when the air extraction is stopped, the bottom bracket can be released. Of course, the bottom bracket transfer mechanism 120 and the main board clamping mechanism 130 are each equipped with a stroke cylinder 133. When the first manipulator 110 is moved in place, the stroke cylinder 133 can further drive the corresponding mechanism to approach the taken main board or bottom bracket. .

In addition, when taking the bottom bracket and the main board, the photo detection function will be used to judge the positive and negative, so as to prevent the materials on the fixture 800 from being placed backwards. In addition, after the fixture 800 is loaded, the code can be scanned by the scanner 710 arranged on the reflow fixture line 500, and the fixture 800 code and the motherboard code can be bound to facilitate the statistics of product quantity, yield and defective products. rate, etc., or when a problem occurs, it is precisely known which product on the fixture 800 has a problem. The photographing detection can be realized by using a CCD (Charge Coupled Device, charge-coupled device) lens and a matching detection circuit, which are all existing technologies, and the scanning and binding of the scanner 710 are also mature technologies, which will not be repeated here. It should be noted that the CCD lenses 900 used in this embodiment are all in the prior art, and the similarities and differences in structure can be selected according to functional requirements, and should not be construed as being the same or different in structure.

Please refer to FIG. 6 to FIG. 10 . Specifically, in this embodiment, the memory module assembly station is provided with a second manipulator 210 , the end of the second manipulator 210 is connected with a second actuator, and the second actuator includes an opening mechanism 220 , a memory stick clamping mechanism 230;

The opening mechanism 220 is used to open the hippocampus head 1400 on the motherboard for clamping the memory stick, the memory stick clamping mechanism 230 is used to grab the memory stick, and the second manipulator 210 can drive the memory after the opening mechanism 220 opens the hippocampus head 1400 . The stick clamping mechanism 230 inserts the memory stick into the memory stick slot on the motherboard. By integrating the opening mechanism 220 and the memory stick clamping mechanism 230 on the second manipulator 210 , the transfer and assembly of the memory stick can be completed without additional structures, and the overall structure is simple and practical.

The memory module clamping mechanism 230 has two clamping blocks 231 and is driven by a bidirectional air cylinder (not shown in the figure) to perform opening and closing. The clamping block 231 has a clamping groove 2311, which can prevent the memory stick from shifting sideways when clamping the memory stick. A buffer structure 232 is arranged in the area between the two clamping blocks 231 to avoid damage to the memory module during the process of pressing down the memory module, and it is also a buffer for the main board to avoid crushing the main board.

Among them, the opening mechanism 220 has two opening claws 221, and two guide grooves 222 corresponding to the opening claws 221 are opened on the base plate on which the opening mechanism 220 is installed. One side of the opening claw 221 is provided with a guide rod 223. One end of the hinged opening head 225 is provided with an opening cylinder 224. When the opening cylinder 224 drives the opening head 225 to move, the opening head 225 can drive the opening claw 221 to move. 221 are away from each other. When the opening claws 221 are in contact with the hippocampal head 1400 respectively, such a movement away from each other can move the hippocampal head 1400 so that the hippocampal head 1400 is opened.

In detail, after the second manipulator 210 drives the memory stick into and out of the memory stick slot for many times, the memory stick is assembled into the memory stick slot of the motherboard. In this embodiment, after the second manipulator 210 drives the memory module to be inserted into the memory module slot for the first time, the hippocampus head 1400 is automatically locked;

The second manipulator 210 presses the memory stick clamping mechanism 230 again so that the memory stick is ejected and the hippocampus head 1400 is unlocked;

After the second manipulator 210 presses the memory stick for the third time, the assembly of the memory stick to the motherboard is completed.

By pressing and assembling multiple times, the diaphragm of the memory module can be damaged, thereby improving the contact performance between the memory module and the memory module card slot.

In detail, the memory module assembly station also includes a memory module positive and negative detection mechanism 240. The second manipulator 210 delivers the memory modules on the memory module conveying line 200 to the memory module positive and negative detection mechanism 240, and then detects the memory modules. Delivered and assembled to the motherboard. The memory stick front and back detection mechanism 240 can help identify whether the memory stick is correct when feeding, and ensure the correct orientation of the memory stick assembled on the motherboard. The memory stick positive and negative detection mechanism 240 is provided with a CCD lens 900 to ensure the scanning and precise positioning of the memory stick captured by the second actuator, and a light source 241 is configured. Anti-detection, these are relatively existing methods, and will not be repeated here.

In this embodiment, the memory module assembly station further includes a dust removal device 250, and the dust removal device 250 is arranged beside the return jig line 500 for removing dust from the memory module card slot on the motherboard. Through the operation of the dust removal device 250, the memory module card slot can be cleaned before the memory module is assembled, so as to prevent impurities such as dust from affecting the normal operation of the memory module after installation. Generally speaking, the dust removal device 250 is provided with a coordinate manipulator 251, a CCD lens 900 for positioning the memory stick slot, and a suction mechanism 252 for removing dust. The coordinate manipulator 251 can drive the CCD lens 900 to move to determine the position of the memory card slot, and then the suction mechanism 252 is driven by a linear drive structure such as an air cylinder to approach the memory card slot, and absorb the dust in the memory card slot. In order to achieve the purpose of cleaning the memory card slot. For the specific structure of the dust removal device 250, reference may also be made to equipment generally used in devices for cleaning memory card slots, which will not be repeated here.

11 to 14, specifically, in this embodiment, the radiator assembly station is provided with a third manipulator 310, the end of the third manipulator 310 is connected with a third actuator, and the third actuator includes a radiator clamp mechanism, screw locking mechanism;

The radiator clamping mechanism is used to clamp the radiator. After the third manipulator 310 drives the radiator clamping mechanism to deliver the radiator to the radiator mounting part of the motherboard, the screw locking mechanism fixes the radiator on the radiator mounting part through screws. .

The third actuator is also provided with a CCD lens 900 to take pictures and position the radiator. The radiator clamping mechanism includes a finger cylinder 321 and a clamping part 322. The finger cylinder 321 can drive the clamping part 322 to realize heat dissipation. clamp and release. A sensor may be further provided in the clamping portion 322 to detect whether the heat sink is effectively clamped.

Among them, the screw locking mechanism is a commonly used electric batch 330, which will not be repeated here.

In general, the third manipulator 310 can drive the radiator clamping mechanism to clamp and transfer the radiator and place it in place. Then, the screws can be taken directly through the screw locking mechanism, and the radiator can be locked on the motherboard, so as to realize the assembly of the radiator.

In detail, the radiator assembly station is provided with a pressing device 340, and the pressing device 340 is arranged beside the return jig line 500. When the screw locking mechanism works, the pressing device 340 pre-fixes the radiator to the radiator mounting part. The pressing device 340 can temporarily fix the radiator before screwing, to avoid the screw driving the radiator to move during the screwing process, to ensure that the screw is screwed in the correct position and stably fix the radiator to the motherboard.

Wherein, the pressing device 340 is provided with a slide cylinder 341, and the position of the pressing portion 343 can be adjusted in cooperation with the slide rail 342, so as to stabilize the pressure of the radiator.

As shown in FIG. 5 , optionally, in this embodiment, the main board feeding station and the radiator assembly station are further provided with an empty tray transfer mechanism 910 , which can transfer the empty tray without carrying materials to The empty material box on the lifting mechanism 1600 is convenient for the lower layer of the double-layer AGV connection line to transport the empty material box and the empty material tray loaded inside together. Since the working time of the second manipulator 210 of the memory module assembly station is shorter than that of the main board feeding station and the heat sink assembly station, the second manipulator 210 can be used to complete the memory module assembly station. For the transfer of the empty tray, the second actuator on the second manipulator 210 is also correspondingly configured with a tray taking mechanism 260 (eg, a suction cup device) to complete the grasping of the tray.

In detail, the empty tray transfer mechanism 910 is provided with a sliding table cylinder 341 to drive the single-axis manipulator 911 to move in the horizontal direction. The material part 912 is opened and closed to realize the clamping of the empty material tray, and the single-handed manipulator can move the material taking part 912 up and down, so as to satisfy the picking and placing of the empty material tray. It should be noted that although the specific structure of the sliding table cylinder 341 mentioned in this embodiment is different, they are all existing types of cylinders, and the cylinder itself has not been changed here, and those in the art can use it according to their needs. to select.

Please refer to Fig. 1 and Fig. 14. There is also a rework station between the radiator assembly station and the finished product blanking station. The reflow jig line 500 is provided with a transfer device, and the repair station is provided with a repair conveyor line 700. The transfer device It is used to transfer the main board to be repaired after the heat sink assembly is completed to the repair conveying line 700 . The transfer device used in this embodiment is the synchronous belt 720 , which can drive the jig 800 to move, so as to transfer the defective product (NG product) detected by the scanner 710 from the return jig line 500 to the repair conveyor line 700 superior. The repair conveyor line 700 can deliver the faulty product to the repair station 730 for easy repair. By setting up a rework station before unloading, it can prevent unqualified products from flowing into the unloading station and finally being transported together with other qualified products, which ensures product quality and eliminates unqualified products from flowing into other production links or consumption in the later stage. Hazards of the link.

In addition, it can be understood that the corresponding correction workbench 1700 can also be set at the main board feeding station and the radiator assembly station, so that when the NG products (problematic raw materials) in the raw materials are detected by scanning, they can be obtained in time. Repair workbench 1700 for maintenance, only OK products (qualified raw materials) will continue to be used for assembly.

Of course, the corresponding control can be completed by a unified system, or as in the present application, in addition to the main control system, the operation steps such as the memory module assembly station and the radiator assembly station can also be more complex and diverse. The control box is set up separately at the station for more precise control, and the working conditions can be fed back to the main control system. These are relatively existing control methods, which will not be repeated here.

The principle of this embodiment is:

The first manipulator 110 of the main board feeding station can first place the bottom bracket into the fixture 800 of the reflow jig line 500, and then place the qualified motherboard with the correct front and back in the bottom bracket, and the reflow jig line 500 takes Move the motherboard to the memory module assembly station.

In the memory module assembly station, the dust removal device 250 first removes dust from the memory module card slot of the main board, and then the second manipulator 210 grabs the memory module according to the correct front and back, and installs it into the memory module slot of the main board, and passes Press back and forth to break the diaphragm of the memory stick and improve the contact performance between the motherboard and the memory stick. The reflow jig line 500 then moves with the motherboard to the heat sink assembly station.

In the radiator assembly station, the third manipulator 310 drives the qualified radiator into the radiator mounting part of the main board in the correct direction, and then under the positioning action of the pressing device 340, the electric batch 330 is used to tighten the screws.

Then the reflow jig line 500 takes the main board through the rework station. If the scanner 710 finds that the product is qualified after scanning, it will continue to be transported to the finished product blanking station. The return jig line 500 is transported away by the product conveyor line 600 . If the product is not qualified, it will be transferred to the repair conveying line 700 of the repair station by the transfer device of the return jig line 500, and then repaired.

A stopper 510 is provided on the return jig line 500 to facilitate stopping the jig 800 at a corresponding station for assembly or loading and unloading. After the jig 800 completes the transportation of the finished motherboard 1000 , the empty jig 800 will continue to move with the reflow jig line 500 and is moved to the lower layer of the reflow jig line 500 at the lifting device 520 as shown in FIG. 2 . , and then back to the main board loading station for circulating loading. Among them, the reflow jig line 500 and the lifting device 520 are also existing structures, and the present application only uses their functions without improving their structures, so they will not be described in detail.

Due to various identification and positioning, the assembly can be made more accurate, and the error rate during manual operation can be reduced, which can also improve the yield to a certain extent and avoid the problem of increased costs due to unqualified products.

To sum up, the main board assembly line of the present application can rely on the reflow jig line 500 to connect various working links in series, and through the automatic feeding of the main board, memory sticks, and heat sinks, as well as the assembly and unloading of the robot arm, the main board is realized. Assembly, reducing labor intensity.

The above descriptions are only preferred embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the protection scope of this application.

Claims (10)

1. A motherboard assembly line, comprising: the device comprises a backflow jig line, and a main board feeding station, a memory bank assembling station, a radiator assembling station and a finished product blanking station which are sequentially distributed at intervals from the upstream to the downstream of the backflow jig line;

the following operations are performed by the manipulator:

delivering the main board to the reflow jig line from the main board conveying line of the main board loading station;

delivering and assembling the memory bank to a main board from a memory bank conveying line of the memory bank assembling station;

delivering and assembling a heat sink from a heat sink transfer line of the heat sink assembly station to a motherboard;

and the assembled finished mainboard is delivered to a finished product conveying line of the finished product blanking station from the reflow jig line.

2. The motherboard assembly line of claim 1, wherein the motherboard loading station further comprises a collet delivery line, and the first manipulator delivers the collet from the collet delivery line to a jig on the reflow jig line and then delivers the motherboard to the collet on the reflow jig line.

3. The motherboard assembly line of claim 2, wherein the first robot end is connected to a first actuator, and the first actuator comprises a collet transfer mechanism for taking and placing a collet and a motherboard clamping mechanism for taking and placing a motherboard.

4. The main board assembly line of claim 1, wherein the memory bank assembly station is provided with a second manipulator, a second execution mechanism is connected to the end of the second manipulator, and the second execution mechanism comprises an opening mechanism and a memory bank clamping mechanism;

the opening mechanism is used for opening a hippocampus head used for clamping a memory bank on the mainboard, the memory bank clamping mechanism is used for grabbing the memory bank, and the second mechanical arm can drive the memory bank clamping mechanism to insert the memory bank into a memory bank clamping groove on the mainboard after the opening mechanism opens the hippocampus head.

5. The main board assembly line of claim 4, wherein the second manipulator is driven to press the memory bank for ejecting the memory bank out of the memory bank slot.

6. The motherboard assembly line of claim 1, wherein the memory bank assembly station further comprises a memory bank positive and negative detection mechanism, the second manipulator delivers the memory bank on the memory bank conveying line to the memory bank positive and negative detection mechanism, and then delivers and assembles the detected memory bank to the motherboard.

7. The main board assembly line of claim 1, wherein the memory bank assembly station further comprises a dust removal device, and the dust removal device is disposed beside the reflow jig line and used for removing dust from the memory bank clamping groove on the main board.

8. The main board assembly line of claim 1, wherein the radiator assembly station is provided with a third manipulator, a third actuator is connected to the end of the third manipulator, and the third actuator comprises a radiator clamping mechanism and a screw locking mechanism;

radiator fixture is used for the centre gripping radiator, the third manipulator drives radiator fixture delivers the radiator to the radiator installation department of mainboard after, screw locking mechanism passes through the screw and fixes the radiator in the radiator installation department.

9. The main board assembly line of claim 8, wherein the heat sink assembly station is provided with a pressing device, the pressing device is arranged beside the reflow jig line, and when the screw locking mechanism works, the pressing device pre-fixes the heat sink to the heat sink mounting portion.

10. The main board assembly line of claim 1, wherein a repair station is further arranged between the radiator assembly station and the finished product blanking station, the reflow jig line is provided with a transfer device, the repair station is provided with a repair conveyor line, and the transfer device is used for transferring the main board to be repaired, which is subjected to radiator assembly, to the repair conveyor line.

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