WO2018230592A1 - 真空処理装置 - Google Patents

真空処理装置 Download PDF

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Publication number
WO2018230592A1
WO2018230592A1 PCT/JP2018/022529 JP2018022529W WO2018230592A1 WO 2018230592 A1 WO2018230592 A1 WO 2018230592A1 JP 2018022529 W JP2018022529 W JP 2018022529W WO 2018230592 A1 WO2018230592 A1 WO 2018230592A1
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WO
WIPO (PCT)
Prior art keywords
transport
substrate holder
substrate
path
unit
Prior art date
Application number
PCT/JP2018/022529
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English (en)
French (fr)
Inventor
淳介 松崎
高橋　明久
優 水島
Original Assignee
株式会社アルバック
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アルバック filed Critical 株式会社アルバック
Priority to JP2018548019A priority Critical patent/JP6442648B1/ja
Priority to KR1020197020549A priority patent/KR102035985B1/ko
Priority to CN202210309507.XA priority patent/CN114709124A/zh
Priority to CN201880036045.0A priority patent/CN110678576B/zh
Priority to US16/489,589 priority patent/US20200002807A1/en
Publication of WO2018230592A1 publication Critical patent/WO2018230592A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G17/00—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface
    • B65G17/30—Details; Auxiliary devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G17/00—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface
    • B65G17/002—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface comprising load carriers resting on the traction element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a technique of a vacuum processing apparatus that performs vacuum processing such as pass film formation on both surfaces of a substrate held in a substrate holder in a vacuum.
  • a vacuum processing apparatus that performs vacuum processing such as passing film formation by placing a plurality of film formation substrates on a substrate holder such as a tray.
  • a substrate to be processed is introduced (loaded) into a vacuum chamber and held in a substrate holder, and the processed substrate is removed from the substrate holder and discharged out of the vacuum chamber. (Unloading).
  • the processing surface of the substrate is kept horizontal from the loading position to the unloading position, and each process is performed while moving on an annular conveyance path configured in a horizontal plane. ing.
  • the present invention has been made in consideration of such problems of the conventional technology, and the object of the present invention is to form a film on both surfaces of a substrate in a pass-through vacuum processing apparatus using a plurality of substrate holders. It is an object of the present invention to provide a technique capable of efficiently performing the above-described processing and achieving the downsizing of the apparatus and the simplification of the configuration.
  • the present invention made to achieve the above object performs a predetermined vacuum process on a vacuum chamber in which a single vacuum atmosphere is formed and a substrate provided in the vacuum chamber and held by a substrate holder.
  • a plurality of first and second processing regions and a plurality of projection paths formed on the vertical plane are formed so as to form a series of rings, and have a conveyance path for conveying the substrate holder, and first and second driven parts.
  • a substrate holder transport mechanism for transporting the substrate holder along the transport path, and the transport path is a first transport along the transport path in a state where the introduced substrate holder is horizontal.
  • a first transport unit that transports in a direction, and a second transport unit that transports and discharges in a second transport direction opposite to the first transport direction along the transport path in a state where the substrate holder is leveled.
  • the substrate holder in front of the first transfer unit A second folding unit that folds toward the second conveyance unit and conveys the second conveyance unit, the first conveyance unit passes through one of the first and second processing regions, and the second conveyance unit A transfer unit is configured to pass through the other of the first and second processing regions, and the substrate holder transfer mechanism is in contact with a first driven part of the substrate holder to hold the substrate
  • a direction changing mechanism having a second direction changing path is provided, and the first driving unit of the substrate holder transport mechanism and the second driving unit of the direction changing mechanism are operated in synchronization to hold the substrate.
  • the vacuum processing apparatus is configured to pass from the first transport unit to the second transport unit in the transport path.
  • the present invention is the vacuum processing apparatus in which the first direction change path and the second direction change path are formed in an equivalent curved shape that protrudes toward the first transport direction.
  • the first direction changing path and the second direction changing path are opposed to each other with a pair of guide members provided with a gap slightly larger than the diameter of the first driven shaft of the substrate holder.
  • the vacuum processing apparatus is provided by being arranged close to each other.
  • the first and second driven parts of the substrate holder are provided so as to extend in a direction orthogonal to the first and second transport directions, and the first and second driven parts are provided. This is a vacuum processing apparatus with different lengths.
  • the present invention is the vacuum processing apparatus, wherein the direction changing mechanism is disposed at a position outside the substrate holder transport mechanism with respect to the first and second transport directions.
  • the present invention is a vacuum processing apparatus in which the first and second processing regions perform film formation in a vacuum.
  • the present invention is a vacuum processing apparatus in which the substrate holder is configured to hold a plurality of deposition target substrates side by side in a direction orthogonal to the first and second transport directions.
  • the transfer path is formed so that the projected shape with respect to the vertical plane is a series of rings, and a plurality of substrate holders are transferred to the transfer path. Since the substrate holder transport mechanism for transporting along the substrate is provided, the space occupied by the transport path can be greatly reduced compared to the prior art, thereby achieving a significant space saving of the apparatus. Therefore, a vacuum processing apparatus having a small and simple configuration can be provided.
  • the first transfer unit that transfers the introduced substrate holder in the first transfer direction along the transfer path in a state where the substrate holder is leveled is the first and second film formation.
  • the second film forming region is configured to pass through the other one of the first and second film forming regions.
  • the first driving unit of the substrate holder transport mechanism and the second driving unit of the direction changing mechanism are operated in synchronization, and the first and second driven parts of the substrate holder are moved to the first direction of the direction changing mechanism.
  • the substrate holder By guiding and transporting along the first and second direction change paths, respectively, the substrate holder is transferred from the first transport section of the transport path to the second transport section while maintaining the vertical relationship. It is configured. According to the present invention having such a configuration, it is possible to provide a pass-through vacuum processing apparatus capable of efficiently processing both surfaces of a substrate.
  • the substrate holder when the substrate holder is configured to hold a plurality of substrates side by side in a direction orthogonal to the transport direction, for example, a plurality of substrates in the substrate transport direction as in the prior art. Compared with the case where the substrate holder that holds the substrates side by side is transported and processed, the length of the substrate holder and the excess space associated with the substrate holder can be reduced. Can be achieved.
  • FIG. 1 is a schematic configuration diagram showing an entire embodiment of a vacuum processing apparatus according to the present invention.
  • FIG. 2 (a) is a plan view and FIG. 2 (b) is a front view.
  • FIG. 3 (a) is a plan view and FIG. 3 (b) is a front view.
  • FIGS. 4A to 4D show the configuration of the first drive unit provided in the transport drive member of the present embodiment.
  • FIG. 4A is a side view seen from the downstream side in the transport direction
  • FIG. b) is a front view
  • FIG. 4C is a side view seen from the upstream side in the transport direction
  • FIG. 4D is a perspective view.
  • the front view which shows the structure of the direction change mechanism in this Embodiment.
  • movement of the vacuum processing apparatus of this Embodiment (the 1) Explanatory drawing which shows operation
  • movement of the substrate holder conveyance mechanism and direction change mechanism in this Embodiment (the 1) (A)-(c): Explanatory drawing which shows operation
  • FIG. 1 is a schematic configuration diagram showing the entirety of an embodiment of a vacuum processing apparatus according to the present invention.
  • 2 (a) and 2 (b) show the basic configuration of the substrate holder transport mechanism and the direction changing mechanism in the present embodiment.
  • FIG. 2 (a) is a plan view and
  • FIG. 2 (b) is a front view.
  • FIG. 1 is a schematic configuration diagram showing the entirety of an embodiment of a vacuum processing apparatus according to the present invention.
  • 2 (a) and 2 (b) show the basic configuration of the substrate holder transport mechanism and the direction changing mechanism in the present embodiment.
  • FIG. 2 (a) is a plan view
  • FIG. 2 (b) is a front view.
  • FIG. 1 is a schematic configuration diagram showing the entirety of an embodiment of a vacuum processing apparatus according to the present invention.
  • 2 (a) and 2 (b) show the basic configuration of the substrate holder transport mechanism and the direction changing mechanism in the present embodiment.
  • FIG. 2 (a) is a plan view
  • FIG. 3A and 3B show the structure of the substrate holder used in the present embodiment.
  • FIG. 3A is a plan view and FIG. 3B is a front view.
  • FIGS. 4A to 4D show the configuration of the first drive unit provided in the transport drive member of the present embodiment, and FIG. 4A is viewed from the downstream side in the transport direction.
  • 4B is a front view
  • FIG. 4C is a side view seen from the upstream side in the transport direction
  • FIG. 4D is a perspective view.
  • FIG. 5 is a front view showing a configuration of the direction changing mechanism in the present embodiment.
  • the vacuum processing apparatus 1 of this Embodiment has the vacuum chamber 2 in which the single vacuum atmosphere connected to the vacuum exhaust apparatus 1a is formed. Inside the vacuum chamber 2 is provided a substrate holder transport mechanism 3 that transports a substrate holder 11 described later along a transport path.
  • the substrate holder transport mechanism 3 is configured to continuously transport a plurality of substrate holders 11 that hold the substrate 10.
  • the substrate holder transport mechanism 3 includes, for example, first and second circular driving wheels 31 and 32 having the same diameter, which are operated by a rotational driving force transmitted from a driving mechanism (not shown) made of a sprocket or the like.
  • the first and second drive wheels 31 and 32 are arranged at a predetermined distance with their respective rotation axes parallel.
  • a series of transport drive members 33 made of, for example, a chain or the like are bridged between the first and second drive wheels 31 and 32. Further, a structure in which a conveyance drive member 33 is bridged between the first and second drive wheels 31 and 32 is arranged in parallel at a predetermined distance (see FIG. 2A), and the pair of conveyances.
  • the drive member 33 forms a series of annular conveyance paths with respect to the vertical plane.
  • the substrate holder 11 is moved from the first drive wheel 31 toward the second drive wheel 32 to the upper part of the transport drive member 33 constituting the transport path, and the substrate holder 11 is transported to the first transport wheel.
  • a forward-side transport unit (first transport unit) 33a that transports in the direction P1 is formed, and the transport direction of the substrate holder 11 is reversed by the transport drive member 33 around the second drive wheel 32.
  • a turn-back portion 33b that changes direction is formed, and the substrate holder 11 is moved to the lower portion of the transport drive member 33 from the second drive wheel 32 toward the first drive wheel 31.
  • a return path side transport section (second transport section) 33c for transporting in the second transport direction P2 is formed.
  • the forward-side transport unit 33 a located above each transport drive member 33 and the return-side transport unit 33 c located below each transport drive member 33 are opposed to each other. However, they are configured to overlap in the vertical direction.
  • the substrate holder transport mechanism 3 includes a substrate holder introduction unit 30A for introducing the substrate holder 11, a transport folding unit 30B for folding and transporting the substrate holder 11, and a substrate holder for discharging the substrate holder 11.
  • a container discharge unit 30C is provided.
  • a direction changing mechanism 40 which will be described later is provided in the vicinity of the conveyance folding portion 30B.
  • regions 4 and 5 are provided.
  • a first processing region 4 having, for example, a sputtering source 4 ⁇ / b> T is provided above the substrate holder transport mechanism 3, and, for example, a sputter is formed below the substrate holder transport mechanism 3.
  • a second processing region 5 having a source 5T is provided.
  • the forward-side transport unit 33a of the above-described transport drive member 33 is configured to linearly pass through the first processing region 4 in the horizontal direction
  • the return-side transport unit 33c is configured to
  • the second processing area 5 is configured to pass linearly in the horizontal direction.
  • a substrate carry-in / out mechanism 6 is provided.
  • the substrate carry-in / carry-out mechanism 6 of the present embodiment has a support portion 62 provided at the tip (upper) end of a drive rod 61 that is driven vertically, for example, by an elevating mechanism 60.
  • a transfer robot 64 is provided on the support unit 62 of the substrate carry-in / out mechanism 6, and the substrate holder 11 is supported on the transfer robot 64 to move the substrate holder 11 in the vertical vertical direction.
  • the substrate holder 11 is transferred to and received from the substrate holder transfer mechanism 3 by the transfer robot 64.
  • the substrate holder 11 is delivered from the substrate carry-in / out mechanism 6 to the substrate holder introduction section 30A of the forward transfer section 33a of the substrate holder conveyance mechanism 3 (this position is referred to as “substrate holder delivery position”). And the substrate holder 11 is taken out from the substrate holder discharge portion 30C of the return path side conveyance unit 33c of the substrate holder conveyance mechanism 3 (this position is referred to as a “substrate holder removal position”).
  • substrate holder discharge portion 30C of the return path side conveyance unit 33c of the substrate holder conveyance mechanism 3 this position is referred to as a “substrate holder removal position”.
  • an upper portion of the vacuum chamber 2 is provided with a substrate loading / unloading chamber 2 ⁇ / b> A for loading the substrate 10 into the vacuum chamber 2 and unloading the substrate 10 from the vacuum chamber 2.
  • the substrate loading / unloading chamber 2A is provided, for example, at a position above the support portion 62 of the above-described substrate loading / unloading mechanism 6 via the communication port 2B.
  • the substrate loading / unloading chamber 2A can be opened and closed at the upper portion of the substrate loading / unloading chamber 2A.
  • a lid 2a is provided.
  • the unprocessed substrate 10a loaded into the substrate loading / unloading chamber 2A is transferred to and held by the substrate holder 11 on the transfer robot 64 of the support unit 62 of the substrate loading / unloading mechanism 6, and
  • the processed substrate 10b is configured to be carried out from the substrate holder 11 on the transfer robot 64 of the support unit 62 of the substrate carry-in / out mechanism 6 to the atmosphere outside the vacuum chamber 2, for example.
  • a sealing member 63 such as an O-ring is provided.
  • the support portion 62 of the substrate loading / unloading mechanism 6 is raised toward the substrate loading / unloading chamber 2A side, and the communication member 2B is closed by bringing the seal member 63 on the support portion 62 into close contact with the inner wall of the vacuum chamber 2.
  • the atmosphere in the substrate loading / unloading chamber 2A is isolated from the atmosphere in the vacuum chamber 2.
  • the pair of transport drive members 33 of the substrate holder transport mechanism 3 of the present embodiment has a plurality of first drive units 36 at predetermined intervals. It is provided so as to protrude outward of the transport drive member 33.
  • the first drive unit 36 has a J hook shape (the height of the first protrusion 36a on the downstream side in the transport direction is the height of the second protrusion 36b on the upstream side in the transport direction).
  • a first driven shaft 12 to be described later
  • the substrate holder 11 is configured to be driven in the first or second transport direction P1, P2.
  • the substrate holder support mechanism 18 is composed of a rotatable member such as a plurality of rollers, for example, and is provided in the vicinity of the transport driving member 33.
  • the forward path side substrate holder support mechanism 18a is provided in the vicinity of the upper side of the forward path side transport part 33a of the transport drive member 33, and the return path side substrate in the vicinity of the lower side of the return path side transport part 33c of the transport drive member 33.
  • a cage support mechanism 18c is provided and arranged and configured to support both edge portions of the lower surface of the substrate holder 11 to be transported.
  • the forward path side substrate holder support mechanism 18a is provided to the vicinity of the entrance of the first direction change path 51 of the direction change mechanism 40 to be described later, and the return path side substrate holder support mechanism 18c is a direction change mechanism to be described later. It is provided up to the vicinity of the discharge port of the 40 second direction change path 52.
  • the substrate holder 11 used in the present embodiment is for performing vacuum processing on both surfaces of the substrate 10 and is made of a tray having an opening. As shown in FIGS. 2A and 3A, the substrate holder 11 of the present embodiment is formed in, for example, a long rectangular flat plate shape, and its longitudinal direction, that is, the first and second transport directions. For example, a plurality of holding portions 14 are provided that hold a plurality of, for example, a plurality of rectangular substrates 10 in a line in a direction orthogonal to P1 and P2.
  • each holding portion 14 is provided with, for example, a rectangular opening having the same size and shape as each substrate 10 so that both surfaces of each substrate 10 are fully exposed, and each substrate 10 is held by a holding member (not shown). Is configured to hold.
  • the substrate holder 11 is in a direction orthogonal to the transport direction as in the present embodiment. It is preferable that the plurality of substrates 10 be arranged in a row and held respectively. However, from the viewpoint of improving the processing efficiency, it is possible to arrange a plurality of substrates 10 in a plurality of rows in a direction orthogonal to the transport direction.
  • first driven shafts (first driven parts) 12 are provided at both ends in the longitudinal direction of the substrate holder 11 at the upstream end in the first transport direction P1, respectively.
  • a second driven shaft (second driven portion) 13 is provided at each end on the downstream side in the transport direction P1.
  • first and second driven shafts 12 and 13 are circular in cross section around a rotation axis extending in the longitudinal direction of the substrate holder 11, that is, in the direction orthogonal to the first and second transport directions P1 and P2, respectively. It is formed in a shape (see FIGS. 3A and 3B). In the present embodiment, the dimension of the second driven shaft 13 is determined such that the length of the second driven shaft 13 is longer than the length of the first driven shaft 12.
  • the first driven shafts 12 on both sides of the substrate holder 11 are substrate holders.
  • the second driven shaft 13 is in contact with a second drive unit 46 described later when the substrate holder 11 is disposed in a direction changing mechanism 40 described later, and is in contact with the first drive unit 36 of the transport mechanism 3.
  • the dimensions of the first and second driven shafts 12 and 13 are determined.
  • a pair of direction changing mechanisms 40 having the same configuration is provided on the downstream side of the pair of transport driving members 33 in the first transport direction P1.
  • the pair of direction changing mechanisms 40 are arranged at positions outside the pair of transport driving members 33 with respect to the first and second transport directions P1 and P2, respectively.
  • the pair of direction changing mechanisms 40 are provided such that the upstream portion in the first transport direction P1 slightly overlaps the downstream portion in the first transport direction P1 of each transport drive member 33. .
  • the first drive unit 36 provided in the transport drive member 33 of the present embodiment has a planar shape of the first protrusion 36a.
  • a direction in which the substrate holder 11 is orthogonal to the transport direction at a side portion (a portion on the side with respect to the transport direction) formed on the front end portion (a portion on the outer side in the transport direction). Is provided with a first tapered portion 36c.
  • the substrate is held at a side portion (a portion on the side in the transport direction) formed in a planar shape of the second protrusion 36b and at the tip portion (a portion on the outer side in the transport direction).
  • a second taper portion 36d for aligning the container 11 in a direction orthogonal to the transport direction is provided.
  • the first and second taper portions 36c and 36d are such that the dimensions of the first and second protrusions 36a and 36b in the width direction, that is, the direction orthogonal to the transport direction are the tip end side, that is, the transport direction outer side It is formed so as to become smaller toward each.
  • the first and second taper portions 36c and 36d are respectively provided on both sides of the first projecting portion 36a and the second projecting portion 36b in the conveying direction. Yes.
  • the size of the first tapered portion 36c provided in the first protrusion 36a in the first driving portion 36 is not particularly limited, but the substrate holder 11 is moved in the transport direction. From the viewpoint of surely performing alignment in the orthogonal direction, it is preferable to form the first protrusion 36a at an angle of 10 to 45 ° with respect to the side portion 360 formed in a planar shape.
  • the length of the first tapered portion 36a in the direction of the first taper portion 36c toward the outer side in the transport direction is preferably set to 1 to 3 mm, respectively.
  • the machining dimensions in the direction perpendicular to the conveying direction of the tapered portion 36c are preferably set to 1 to 15 mm, respectively.
  • the dimension of the second tapered portion 36d provided on the second protrusion 36b is not particularly limited, but the direction in which the substrate holder 11 is orthogonal to the transport direction. From the viewpoint of ensuring alignment, it is preferable to form the second protrusion 36b at an angle of 5 to 45 ° with respect to the side portion 361 formed in a planar shape.
  • the length of the second projecting portion 36b in the direction of the second taper portion 36d toward the outer side in the transport direction is preferably set to 1 to 5 mm.
  • the processing dimensions in the direction orthogonal to the conveying direction of the portion 36d are preferably set to 1 to 50 mm, respectively.
  • the first and second taper portions 36c and 36d are respectively connected to both the first protrusion 36a and the second protrusion 36b.
  • the present invention is not limited to this, the present invention is not limited to this.
  • the substrate holder 11 side is provided.
  • the first and second taper portions 36c and 36d may be provided only in the side portion).
  • the third taper portion 36e is formed such that a portion on the upstream side in the transport direction of the tip of the second protrusion 36b is inclined inward in the transport direction (FIGS. 4B and 4D).
  • the third taper portion 36e is rounded at the upstream and downstream edges in the transport direction, and the central portion is formed in a flat shape.
  • the size of the third taper portion 36e provided on the second protrusion 36b in the first drive portion 36 is not particularly limited, but the substrate holder 11 is mounted as described later.
  • the second protrusion 36b is formed at an angle of 45 to 80 ° with respect to the portion 36f (see FIG. 4B) on the downstream side in the transport direction formed in a planar shape. It is preferable.
  • the direction changing mechanism 40 of the present embodiment includes a first guide member 41, a second guide member 42, and a third guide member 43, and these first to third guides.
  • the members 41 to 43 are arranged in this order from the upstream side in the first transport direction P1.
  • the first to third guide members 41 to 43 are arranged at positions near the outside of the pair of transport driving members 33, respectively, and further outside the first to third guide members 41 to 43.
  • a transport driving member 45 to be described later is arranged at a position in the vicinity.
  • FIG. 2B a part of the direction changing mechanism 40 is omitted, and the positional relationship between the members in the transport direction is clarified by ignoring the overlapping relationship of the members.
  • the first to third guide members 41 to 43 are made of, for example, plate-like members and are provided in the vertical direction.
  • the portion of the first guide member 41 on the downstream side in the first transport direction P1 is formed in a curved surface shape that is convex toward the downstream side in the first transport direction P1, and the second guide.
  • the upstream portion of the member 42 in the first transport direction P1 is formed in a curved surface shape that is concave toward the downstream side in the first transport direction P1.
  • the first and second guide members 41 and 42 are a downstream portion of the first guide member 41 in the first transport direction P1 and a upstream portion of the second guide member 42 in the first transport direction P1. Are formed in an equivalent curved surface shape, and these portions are arranged close to each other with a gap slightly larger than the diameter of the first driven shaft 12 of the substrate holder 11. And the 1st direction change path
  • downstream portion of the second guide member 42 in the first transport direction P1 is formed in a curved surface shape that protrudes toward the downstream side in the first transport direction P1
  • the third guide member The portion of the upstream side 43 in the first transport direction P1 is formed in a curved surface shape that is concave toward the downstream side in the first transport direction P1.
  • the second and third guide members 42 and 43 are the downstream portion of the second guide member 42 in the first transport direction P1 and the upstream portion of the third guide member 43 in the first transport direction P1. Are formed in an equivalent curved surface shape, and these portions are arranged close to each other with a gap slightly larger than the diameter of the second driven shaft 13 of the substrate holder 11. And the 2nd direction change path
  • the downstream portion of the second guide member 42 in the first transport direction P1 has a curved surface shape equivalent to the downstream portion of the first guide member 41 in the first transport direction P1.
  • the upstream portion of the third guide member 43 in the first transport direction P1 has a curved surface shape equivalent to the upstream portion of the second guide member 42 in the first transport direction P1.
  • the 1st direction change path 51 and the 2nd direction change path 52 are formed in the equivalent curved surface shape. Further, in the present embodiment, the distance in the horizontal direction of each part of the first and second direction change paths 51 and 52 is between the first and second driven shafts 12 and 13 of the substrate holder 11. The dimension is determined so as to be equal to the distance.
  • the upper opening of the first direction changing path 51 is the entrance of the first driven shaft 12 of the substrate holder 11, and the height position thereof is the outgoing path side substrate holding.
  • the substrate holder 11 supported by the container support mechanism 18a is configured to be lower than the height position of the second driven shaft 13 (see FIG. 2B).
  • the lower port of the first direction changing path 51 is the discharge port of the first driven shaft 12 of the substrate holder 11, and the height position of the first direction changing path 51 is connected to the return-side substrate holder support mechanism 18 c. It is comprised so that it may become a position higher than the height position of the 2nd driven shaft 13 of the supported substrate holder 11 (refer FIG.2 (b)).
  • the upper opening serves as the entrance of the second driven shaft 13 of the substrate holder 11, and the height position thereof is the forward path side substrate holder support mechanism. It is comprised so that it may become a position equivalent to the height position of the 2nd driven shaft 13 of the board
  • the lower port of the second direction changing path 52 is the discharge port of the second driven shaft 13 of the substrate holder 11, and the height position thereof is on the return path side substrate holder support mechanism 18 c. It is comprised so that it may become a position equivalent to the height position of the 2nd driven shaft 13 of the supported substrate holder 11 (refer FIG.2 (b)).
  • the direction changing mechanism 40 includes, for example, a pair of sprockets and a transport driving member 45 including a chain spanned between the pair of sprockets. It is comprised so that it may become cyclic
  • the conveyance driving member 45 is configured such that the curvature radius of the folded portion is equal to the curvature radius of the folding portion 33 b of the conveyance driving member 33 of the substrate holder conveyance mechanism 3. Further, the upper part of the transport driving member 45 is driven to move in the first transport direction P1, and the lower part is driven to move in the second transport direction P2.
  • the transport driving member 45 is provided with a plurality of second drive units 46 protruding outward from the transport driving member 45 at a predetermined interval.
  • the second drive unit 46 is formed with a recess in an outer portion of the transport drive member 45, and the edge of the recess comes into contact with the second driven shaft 13 of the substrate holder 11 and the substrate holder 11 is supported and driven along the second direction change path 52.
  • the second drive unit 46 of the present embodiment reaches the position of the entrance and the exit of the second direction changing path 52, the end on the recess side is the second end.
  • the path of the transport drive member 45 and the dimensions of the second drive unit 46 are set so as to retract from the direction change path 52 (see FIG. 2B).
  • the transport driving member 33 of the substrate holder transport mechanism 3 so that the second drive section 46 operates in synchronization with the first drive section 36 of the substrate retainer transport mechanism 3. And the operation of the transport driving member 45 of the direction changing mechanism 40 is controlled.
  • the first holder 36 of the substrate holder transport mechanism 3 drives the substrate holder 11 in the first transport direction P1 to move the first and second driven shafts 12 and 13.
  • the first and second driving units 36 and 46 hold the first and second driven parts.
  • the first and second drive units 36 and 46, and the first and second drive units 12 and 13 are supported and moved so that the drive shafts 12 and 13 are smoothly discharged from the first and second direction changing paths 51 and 52.
  • the shapes and dimensions of the second direction changing paths 51 and 52 are set.
  • the substrate holder 11 is moved from the direction change mechanism 40 to the substrate holder support mechanism 18.
  • a delivery member 47 is provided for smooth delivery to the return path side substrate holder support mechanism 18c.
  • the delivery member 47 is made of, for example, an elongated member extending in the horizontal direction, and is centered on a rotation shaft 48 provided at a position below the return path side substrate holder support mechanism 18c at the end portion on the second transport direction P2 side. As shown in FIG. The delivery member 47 is biased upward by an elastic member (not shown) on the first transport direction P1 side.
  • a portion near the discharge port of the first direction changing path 51 on the second transport direction P2 side is continuous with the first direction changing path 51, and the substrate holder support mechanism A transfer portion 47a formed in a curved shape is provided so as to be continuous with the 18 return path side substrate holder support mechanism 18c (see FIG. 2B).
  • an inclined surface 47b is provided at a portion on the first transport direction P1 side so as to incline downward toward the first transport direction P1.
  • the inclined surface 47 b is provided at a height position facing the discharge port of the second direction changing path 52.
  • the sealing member 63 on the support portion 62 of the substrate loading / unloading mechanism 6 is brought into close contact with the inner wall of the vacuum chamber 2 and the substrate is loaded into the atmosphere in the vacuum chamber 2.
  • the lid 2a of the substrate carry-in / out chamber 2A is opened.
  • the substrate 10a before processing is mounted and held on the substrate holder 11 on the transport robot 64 of the support unit 62 of the substrate carry-in / out mechanism 6 using a transport robot (not shown).
  • the lid portion 2a of the substrate loading / unloading chamber 2A is closed and evacuated to a predetermined pressure, and then the support portion 62 of the substrate loading / unloading mechanism 6 is moved to the above-described substrate holder delivery position.
  • the substrate holder 11 is lowered so that the height of the substrate holder 11 is equal to the height of the forward transfer portion 33 a of the transfer drive member 33.
  • the substrate holder 11 is placed on the substrate holder introduction portion 30 ⁇ / b> A of the substrate holder transfer mechanism 3 by the transfer robot 64 provided on the support portion 62 of the substrate carry-in / out mechanism 6.
  • the first driven shaft 12 of the substrate holder 11 is positioned so as to be disposed in the groove of the first driving unit 36, and the forward path side substrate holder is supported. Place on mechanism 18a.
  • the substrate holder 11 is displaced in the direction orthogonal to the first transport direction P1 (see FIG. 9B), and the edge of the substrate holder 11 on the direction side orthogonal to the transport direction. May contact the first drive unit 36, but in the present embodiment, as described above, the first projection 36a and the second projection 36b of the first drive unit 36 are respectively connected to the first projection 36a.
  • the edge portions on the direction side orthogonal to the transport direction of the substrate holder 11 are the first and second protrusions 36a of the first drive portion 36. 36b, whereby the substrate holder 11 is aligned in a direction orthogonal to the transport direction and the positional deviation is corrected.
  • the first driven shaft 12 of the substrate holder 11 is moved to the first It can arrange
  • the forward-side transport unit 33a of the transport driving member 33 of the substrate holder transport mechanism 3 is moved in the first transport direction P1.
  • the first driven shaft 12 of the substrate holder 11 is driven in the first conveyance direction P1 by the first drive unit 36 on the forward-side conveyance unit 33a of the conveyance drive member 33, and the substrate holder 11 is moved. It is conveyed on the forward path side conveyance unit 33a of the conveyance drive member 33 toward the conveyance folding unit 30B.
  • FIGS. 10A to 10C and FIGS. 11A to 11C are explanatory views showing the operations of the substrate holder transport mechanism and the direction changing mechanism in the present embodiment.
  • the first drive unit 36 of the substrate holder transport mechanism 3 is moved in the first transport direction P1, thereby transporting the substrate holder transport mechanism 3 as shown in FIG.
  • the substrate holder 11 that has reached the folded portion 30B is further moved in the first transport direction P1, and the second driven shaft 13 of the substrate holder 11 enters the entrance of the second direction changing path 52 of the direction changing mechanism 40. Place at the position.
  • the operation of the transport driving member 45 is controlled so that the second driving unit 46 of the direction changing mechanism 40 is positioned below the second driven shaft 13 of the substrate holder 11. Then, the transport driving member 33 of the substrate holder transport mechanism 3 is driven to move the first drive unit 36 in the first transport direction P1, and the transport driving member 45 of the direction changing mechanism 40 is driven to perform the second operation. Is moved in the first transport direction P1. In this case, control is performed so that the operations of the first drive unit 36 and the second drive unit 46 are synchronized.
  • the first and second driven shafts 12 and 13 of the substrate holder 11 are supported and driven by the first and second driving units 36 and 46, respectively. And the second direction change paths 51 and 52 respectively move downward.
  • the first driven shaft 12 of the substrate holder 11 does not contact at the same time in the first direction changing path 51, but the first guide member 41 and the second guide member 42
  • the second driven shaft 13 is not in contact with the edge of the second guide member 42 and the third guide member 43 at the same time in the second direction changing path 52. Contact.
  • the substrate holder 11 maintains a vertical relationship.
  • the transport direction is changed to the second transport direction P2 opposite to the first transport direction P1 while maintaining the vertical relationship of the substrate holder 11.
  • the first driven shaft 12 of the substrate holder 11 does not contact at the same time in the first direction changing path 51, but the first guide member 41 and the second guide member 42
  • the second driven shaft 13 is not in contact with the edge of the second guide member 42 and the third guide member 43 at the same time in the second direction changing path 52. Contact.
  • the first driven shaft of the substrate retainer 11 as shown in FIG. 12 is disposed at a position above the transfer member 47 via the discharge port of the first direction changing path 51 and the transfer portion 47a of the transfer member 47, and the second driven shaft 13 of the substrate holder 11 is The substrate holder 11 is disposed at the position of the discharge port of the second direction changing path 52, and then the substrate holder 11 is moved to the return side substrate holder support mechanism 18c of the substrate holder support mechanism 18 as shown in FIG. Delivered.
  • retainer 11 are not contacting at the time shown in FIG.10 (c), and the board
  • the second driven shaft 13 of the substrate holder 11 is brought into contact with the inclined surface 47 b of the delivery member 47 as shown in FIG.
  • the delivery member 47 rotates and moves downward in contact, and the second driven shaft 13 of the substrate holder 11 passes over the delivery member 47 as shown in FIG. Move in the second transport direction P2.
  • the delivery member 47 returns to its original position after this process by the biasing force of an elastic member (not shown).
  • the return path side transport unit 33 c of the transport drive member 33 of the substrate holder transport mechanism 3 is moved in the second transport direction P ⁇ b> 2, and the first drive unit 36 performs the first drive.
  • the substrate holder 11 is transported toward the substrate holder discharge portion 30C.
  • the return path side conveyance portion 33c of the conveyance drive member 33 is moved in the second conveyance direction P2, and the first drive portion 36 performs the first drive.
  • the first drive part 36 is inclined as shown in FIG. The contact between the portion 36 and the first driven shaft 12 is released, whereby the substrate holder 11 loses propulsive force.
  • FIGS. 13A to 13D are explanatory views showing an operation of removing contact between the first driving unit of the transport driving member and the first driven shaft of the substrate holder in the present embodiment.
  • the substrate holder 11 reaches the substrate holder discharge portion 30C, as shown in FIG. 13A, the second protrusion 36b of the first drive portion 36 is oriented in the vertical direction.
  • the downstream portion 36 f in the transport direction is in contact with the first driven shaft 12 of the substrate holder 11.
  • the substrate holder 11 moves on the return path side substrate holder support mechanism 18c in the second transport direction P2, As shown in FIG. 13B, the first drive unit 36 moves upward along the first drive wheel 31 (see FIG. 1), and the second protrusion 36b approaches the horizontal direction. As a result, the first driven shaft 12 of the substrate holder 11 comes into contact with the rounded portion on the downstream side in the transport direction at the tip of the second protrusion 36 b of the first drive unit 36. .
  • the first drive unit 36 follows the first drive wheel 31 as shown in FIG.
  • the tip of the second protrusion 36b of the first drive unit 36 is in contact with the first driven shaft 12 of the substrate holder 11 so that the first driven shaft 12 Get over the top.
  • the third taper portion 36e formed at the distal end portion of the second protrusion 36b so that the upstream portion in the transport direction is inclined inward in the transport direction.
  • the surface of the third tapered portion 36e is provided when the tip of the second protruding portion 36b of the first driving portion 36 gets over the upper portion of the first driven shaft 12 of the substrate holder 11. Becomes almost horizontal.
  • the first taper 36e having the third taper portion 36e is obtained as shown in FIG.
  • the drive unit 36 does not contact (interfere) with the first driven shaft 12, and the contact between the second protrusion 36 b of the first drive unit 36 and the first driven shaft 12 of the substrate holder 11 does not occur.
  • the substrate holder 11 is moved in the second transport direction P2 without coming out of contact with the second protrusion 36b of the first drive unit 36 and the second driven shaft 13 of the substrate holder 11. Will be able to.
  • the upstream portion of the second projecting portion 36b of the first driving portion 36 that is moved by the transport driving member 33 is located on the inner side in the transport direction.
  • the third tapered portion 36e formed so as to be inclined contact between the first driving portion 36 and the first driven shaft 12 can be made as compared with the prior art that does not have the third tapered portion 36e.
  • the moving distance during the removing operation can be shortened and the operation time can be shortened, whereby the timing for delivering the substrate holder 11 to the substrate carry-in / out mechanism 6 can be greatly advanced.
  • the substrate holder 11 is moved in the second transfer direction P2 by the transfer robot 64 of the substrate loading / unloading mechanism 6 shown in FIG.
  • the substrate holder 11 is taken out by using the transfer robot 64 of the substrate carry-in / out mechanism 6, and the substrate holder 11 is arranged on the support unit 62 together with the transfer robot 64 as shown in FIG.
  • the support portion 62 of the substrate loading / unloading mechanism 6 is raised, and the sealing member 63 on the support portion 62 is brought into close contact with the inner wall of the vacuum chamber 2, so that the substrate is kept against the atmosphere in the vacuum chamber 2. Venting to atmospheric pressure is performed with the atmosphere in the loading / unloading chamber 2A isolated.
  • the lid 2a of the substrate loading / unloading chamber 2A is opened, and the processed substrate 10b is taken out from the substrate holder 11 into the atmosphere using a transfer robot (not shown). After that, returning to the state shown in FIG. 6, the above-described vacuum processing is performed on each of the plurality of substrates 10 by repeating the above-described operation.
  • the transfer path is formed so that the projection shape with respect to the vertical plane is a series of annular shapes, and a plurality of Since the substrate holder transport mechanism 3 for transporting the substrate holder 11 along the transport path is provided, the space occupied by the transport path can be greatly reduced as compared with the prior art. Since significant space saving can be achieved, a vacuum processing apparatus having a small and simple configuration can be provided.
  • the forward-side transport unit 33a of the transport driving member 33 that transports the introduced substrate holder 11 in the first transport direction P1 along the transport path in a horizontal state is the first process.
  • the return path conveyance unit 33 c is configured to pass through the second processing region 5.
  • the first driving unit 36 of the substrate holder transport mechanism 3 and the second driving unit 46 of the direction changing mechanism 40 are operated in synchronization, and the first and second driven shafts 12 of the substrate holder 11 are operated.
  • the substrate holder 11 is configured to hold a plurality of substrates 10 in a direction orthogonal to the transport direction, the substrate transport direction as in the prior art is performed. Compared with the case where a substrate holder that holds a plurality of substrates side by side is transported and processed, the length of the substrate holder and the excess space associated therewith can be reduced. Space can be achieved.
  • the present invention is not limited to the above-described embodiment, and various changes can be made.
  • the upper part of the transport driving member 33 is the forward transport part 33a, which is the first transport part
  • the lower part of the transport drive member 33 is the second transport part.
  • the present invention is not limited to this, and it is possible to reverse these vertical relationships.
  • the substrate holder transport mechanism 3 and the direction changing mechanism 40 are configured from a pair of sprockets and a chain spanned between the pair of sprockets. It is also possible to use an annular transport driving mechanism. Further, the substrate holder support mechanism 18 can be configured using a belt or a rail instead of a roller.
  • direction changing mechanism 40 is not limited to the above-described embodiment configured by the first to third guide members 41 to 43 described above, and can be modified as follows.
  • the guide member 44 corresponding to the second guide member 42 and the guide member 43A corresponding to the third guide member 43 are provided, and the pair of guide members 44, 43A is comprised so that the 1st and 2nd direction change path
  • the guide member 44 is formed in, for example, the letter “te” (a shape similar to T) of Hiragana, and the upstream portion 44 a in the first transport direction P 1 is the second guide member 42 of the second guide member 42. 1 is formed in a curved surface shape equivalent to the upstream portion of the conveyance direction P1.
  • the first driven shaft 12 of the substrate holder 11 driven by the first driving unit 36 described above is brought into contact with the portion 44a on the upstream side of the guide member 44 in the first transport direction P1, and this portion. It is comprised so that it may guide below from 44a along 44a.
  • the guide member 43A has an upstream portion 43a in the first transport direction P1 having a curved surface shape equivalent to the upstream portion of the third guide member 43 in the first transport direction P1. .
  • the second driven shaft 13 of the substrate holder 11 driven by the second driving unit 46 described above is brought into contact with the portion 43a on the upstream side in the first transport direction P1 of the guide member 43A. It is comprised so that it may guide below from the upper direction along 43a.
  • the first guide member 41 described above becomes unnecessary, and the material of the guide member 44 corresponding to the second guide member 42 can be reduced. Simplification of the configuration of the conversion mechanism 40 and, in turn, simplification of the device configuration and cost reduction can be achieved.
  • first and second driving units 36 and 46 is not limited to the above embodiment, and the first and second driven shafts 12 and 13 of the substrate holder 11 are reliably in contact with and supported. As long as it can be driven, various shapes can be employed.
  • the sputtering apparatus is described as an example of the processing in vacuum.
  • the present invention is not limited to this, and for example, plasma processing, ion implantation processing, vapor deposition processing, chemical vapor deposition processing, and the like.
  • the present invention can be applied to a vacuum processing apparatus that performs various processes such as a focused ion beam process and an etching process.
  • the first and second processing regions 4 and 5 can be provided with processing sources for performing different processing.
  • the present invention is not limited to the case where the unprocessed substrate 10a is loaded into the vacuum chamber 2 and the processed substrate 10b is unloaded from the vacuum chamber 2 as in the above embodiment, but also the unprocessed substrate 10a.
  • This can also be applied to the case where the substrate 10 is carried into the vacuum chamber 2 together with the substrate holder 11 and the processed substrate 10 b is carried out of the vacuum chamber 2 together with the substrate holder 11.
  • Conveyance drive member (conveyance path) 33a Outward side transport unit (first transport unit) 33b ... Folding part 33c ... Return path side conveyance part (second conveyance part) 36 ... 1st drive part 40 ... Direction change mechanism 41 ... 1st guide member 42 ... 2nd guide member 43 ... 3rd guide member 45 ... Conveyance drive member 46 ... 2nd drive part 51 ... 1st Direction change path 52 ... second direction change path

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Abstract

複数の基板保持器を用いる通過型の真空処理装置において、基板の両面に処理を効率良く行い、装置の小型化及び構成の簡素化を達成する。搬送経路は、基板保持器11をそれぞれ水平状態で第１の搬送方向P1に搬送する往路側搬送部33aと、第1の搬送方向P1と反対の第2の搬送方向P2に搬送する復路側搬送部33cと、往路側搬送部33aから復路側搬送部33cに向かう搬送折り返し部30Bとを有し、基板保持器搬送機構3の第1の駆動部36によって基板保持器11を搬送する。第2の駆動部46を有する方向転換機構40を搬送折り返し部30Bの近傍に設ける。基板保持器搬送機構3の第1の駆動部36と方向転換機構40の第2の駆動部46とを同期して動作させ、基板保持器11を、第1及び第2の被駆動軸12、13を方向転換機構40の第1及び第2の方向転換経路51、52に沿ってそれぞれ案内搬送し、上下関係を維持した状態で往路側搬送部33aから復路側搬送部33cに受け渡す。

Description

真空処理装置
　本発明は、真空中で基板保持器に保持された基板の両面に通過成膜等の真空処理を行う真空処理装置の技術に関する。
　従来より、複数の被成膜基板をそれぞれトレイ等の基板保持器に載置して通過成膜等の真空処理を行う真空処理装置が知られている。
　このような真空処理装置としては、処理対象である基板を真空槽内に導入（ローディング）して基板保持器に保持させ、処理が終了した基板を基板保持器から取り外して真空槽の外へ排出（アンローディング）する。
　従来技術の構成では、基板は、ローディング位置からアンローディング位置まで、その処理面が水平に保たれており、水平面内に構成された環状の搬送経路を移動しながら、各プロセスを行うようになっている。
　その結果、このような従来技術では、成膜装置の大型化及び複雑化が避けられないという問題がある。
　特に、基板の両面に処理を行う装置においては、上述した課題がより深刻になるとともにスループットを向上させることが困難であるという問題がある。
特開２００７－０３１８２１号公報
　本発明は、このような従来の技術の課題を考慮してなされたもので、その目的とするところは、複数の基板保持器を用いる通過型の真空処理装置において、基板の両面に成膜等の処理を効率良く行うことが可能で、装置の小型化及び構成の簡素化を達成しうる技術を提供することにある。
　上記目的を達成するためになされた本発明は、単一の真空雰囲気が形成される真空槽と、前記真空槽内に設けられ、基板保持器に保持された基板上に所定の真空処理を行う第１及び第２の処理領域と、鉛直面に対する投影形状が一連の環状となるように形成され、前記基板保持器を搬送する搬送経路と、第１及び第２の被駆動部を有する複数の前記基板保持器を前記搬送経路に沿って搬送する基板保持器搬送機構とを備え、前記搬送経路は、導入された前記基板保持器を水平にした状態で前記搬送経路に沿って第１の搬送方向に搬送する第１の搬送部と、前記基板保持器を水平にした状態で前記搬送経路に沿って前記第１の搬送方向と反対方向の第２の搬送方向に搬送して排出する第２の搬送部と、前記基板保持器を前記第１の搬送部から前記第２の搬送部に向って折り返して搬送する搬送折り返し部とを有し、前記第１の搬送部が、前記第１及び第２の処理領域のうち一方を通過し、かつ、前記第２の搬送部が、前記第１及び第２の処理領域のうち他方を通過するように構成され、前記基板保持器搬送機構は、前記基板保持器の第１の被駆動部と接触して当該基板保持器を前記搬送経路に沿って駆動する複数の第１の駆動部を有し、前記搬送経路の搬送折り返し部の近傍に、前記基板保持器の第２の被駆動部と接触して当該基板保持器を前記第１及び第２の搬送方向にそれぞれ駆動する複数の第２の駆動部と、前記基板保持器の第１及び第２の被駆動部を当該基板保持器を前記第１の搬送方向から前記第２の搬送方向へ方向転換するようにそれぞれ案内して搬送するための第１及び第２の方向転換経路とを有する方向転換機構が設けられ、前記基板保持器搬送機構の第１の駆動部と前記方向転換機構の第２の駆動部とを同期して動作させ、前記基板保持器の第１及び第２の被駆動部を前記方向転換機構の第１及び第２の方向転換経路に沿ってそれぞれ案内して搬送することにより、前記基板保持器を上下関係を維持した状態で前記搬送経路の第１の搬送部から第２の搬送部に受け渡すように構成されている真空処理装置である。
　本発明は、前記第１の方向転換経路と前記第２の方向転換経路とが、前記第１の搬送方向側に凸となる同等の曲線形状に形成されている真空処理装置である。
　本発明は、前記第１の方向転換経路と前記第２の方向転換経路とが、それぞれ一対のガイド部材を前記基板保持器の第１の被駆動軸の直径より若干大きな隙間を設けて対向するように近接して配置することによって設けられている真空処理装置である。
　本発明は、前記基板保持器の第１及び第２の被駆動部が前記第１及び第２の搬送方向に対して直交する方向に延びるように設けられ、当該第１及び第２の被駆動部の長さが異なる真空処理装置である。
　本発明は、前記方向転換機構が、前記第１及び第２の搬送方向に関して前記基板保持器搬送機構の外側の位置に配置されている真空処理装置である。
　本発明は、前記第１及び第２の処理領域が、真空中で成膜を行うものである真空処理装置である。
　本発明は、前記基板保持器は、前記第１及び第２の搬送方向に対して直交する方向に複数の成膜対象基板を並べて保持するように構成されている真空処理装置である。 
　本発明にあっては、単一の真空雰囲気が形成される真空槽内において、搬送経路が鉛直面に対する投影形状が一連の環状となるように形成されるとともに、複数の基板保持器を搬送経路に沿って搬送する基板保持器搬送機構を備えていることから、従来技術と比較して搬送経路が占有するスペースを大幅に削減することができ、これにより装置の大幅な省スペース化を達成することができるので、小型且つ簡素な構成の真空処理装置を提供することができる。
　また、本発明の搬送経路は、導入された前記基板保持器を水平にした状態で搬送経路に沿って第１の搬送方向に搬送する第１の搬送部が、第１及び第２の成膜領域のうち一方を通過し、かつ、基板保持器を水平にした状態で搬送経路に沿って第１の搬送方向と反対方向の第２の搬送方向に搬送して排出する第２の搬送部が、第１及び第２の成膜領域のうち他方を通過するように構成されている。また、基板保持器搬送機構の第１の駆動部と方向転換機構の第２の駆動部とを同期して動作させ、基板保持器の第１及び第２の被駆動部を方向転換機構の第１及び第２の方向転換経路に沿ってそれぞれ案内して搬送することにより、基板保持器を上下関係を維持した状態で搬送経路の第１の搬送部から第２の搬送部に受け渡すように構成されている。このような構成を有する本発明によれば、基板の両面に効率良く処理が可能な通過型の真空処理装置を提供することができる。
　一方、本発明において、基板保持器が当該搬送方向に対して直交する方向に複数の基板を並べて保持するように構成されている場合には、例えば従来技術のような基板の搬送方向に複数の基板を並べて保持する基板保持器を搬送して処理を行う場合と比較して、基板保持器の長さ及びこれに伴う余剰スペースを削減することができるので、真空処理装置のより省スペース化を達成することができる。
本発明に係る真空処理装置の実施の形態の全体を示す概略構成図 （ａ）（ｂ）：本実施の形態における基板保持器搬送機構及び方向転換機構の基本構成を示すもので、図２（ａ）は平面図、図２（ｂ）は正面図 （ａ）（ｂ）：本実施の形態に用いる基板保持器の構成を示すもので、図３（ａ）は平面図、図３（ｂ）は正面図 （ａ）～（ｄ）：本実施の形態の搬送駆動部材に設けられる第１の駆動部の構成を示すもので、図４（ａ）は搬送方向下流側から見た側面図、図４（ｂ）は正面図、図４（ｃ）は搬送方向上流側から見た側面図、図４（ｄ）は斜視図 本実施の形態における方向転換機構の構成を示す正面図 本実施の形態の真空処理装置の動作を示す説明図（その１） 本実施の形態の真空処理装置の動作を示す説明図（その２） 本実施の形態の真空処理装置の動作を示す説明図（その３） （ａ）（ｂ）：本実施の形態の真空処理装置の動作を示す説明図（その４） （ａ）～（ｃ）：本実施の形態における基板保持器搬送機構及び方向転換機構の動作を示す説明図（その１） （ａ）～（ｃ）：本実施の形態における基板保持器搬送機構及び方向転換機構の動作を示す説明図（その２） （ａ）（ｂ）：本実施の形態の真空処理装置の動作を示す説明図（その５） （ａ）～（ｄ）：本実施の形態における搬送駆動部材の第１の駆動部と基板保持器の第１の被駆動軸との接触を外す動作を示す説明図 本実施の形態の真空処理装置の動作を示す説明図（その６） 本実施の形態の真空処理装置の動作を示す説明図（その７） 本実施の形態の真空処理装置の動作を示す説明図（その８） 本実施の形態における方向転換機構の変形例を示す正面図
　以下、本発明の実施の形態を図面を参照して詳細に説明する。
　図１は、本発明に係る真空処理装置の実施の形態の全体を示す概略構成図である。
　また、図２（ａ）（ｂ）は、本実施の形態における基板保持器搬送機構及び方向転換機構の基本構成を示すもので、図２（ａ）は平面図、図２（ｂ）は正面図である。
　さらに、図３（ａ）（ｂ）は、本実施の形態に用いる基板保持器の構成を示すもので、図３（ａ）は平面図、図３（ｂ）は正面図である。
　さらにまた、図４（ａ）～（ｄ）は、本実施の形態の搬送駆動部材に設けられる第１の駆動部の構成を示すもので、図４（ａ）は搬送方向下流側から見た側面図、図４（ｂ）は正面図、図４（ｃ）は搬送方向上流側から見た側面図、図４（ｄ）は斜視図である。
　さらにまた、図５は、本実施の形態における方向転換機構の構成を示す正面図である。
　図１に示すように、本実施の形態の真空処理装置１は、真空排気装置１ａに接続された単一の真空雰囲気が形成される真空槽２を有している。
　真空槽２の内部には、後述する基板保持器１１を搬送経路に沿って搬送する基板保持器搬送機構３が設けられている。
　この基板保持器搬送機構３は、基板１０を保持する複数の基板保持器１１を連続して搬送するように構成されている。
　ここで、基板保持器搬送機構３は、例えばスプロケット等からなり駆動機構（図示せず）から回転駆動力が伝達されて動作する同一径の円形の第１及び第２の駆動輪３１、３２を有し、これら第１及び第２の駆動輪３１、３２が、それぞれの回転軸線を平行にした状態で所定距離をおいて配置されている。
　そして、第１及び第２の駆動輪３１、３２には例えばチェーン等からなる一連の搬送駆動部材３３が架け渡されている。
　さらに、これら第１及び第２の駆動輪３１、３２に搬送駆動部材３３が架け渡された構造体が所定の距離をおいて平行に配置され（図２（ａ）参照）、これら一対の搬送駆動部材３３により鉛直面に対して一連の環状となる搬送経路が形成されている。
　本実施の形態では、搬送経路を構成する搬送駆動部材３３のうち上側の部分に、第１の駆動輪３１から第２の駆動輪３２に向って移動して基板保持器１１を第１の搬送方向Ｐ１に搬送する往路側搬送部（第１の搬送部）３３ａが形成されるとともに、第２の駆動輪３２の周囲の部分の搬送駆動部材３３によって基板保持器１１の搬送方向を折り返して反対方向に転換する折り返し部３３ｂが形成され、さらに、搬送駆動部材３３のうち下側の部分に、第２の駆動輪３２から第１の駆動輪３１に向って移動して基板保持器１１を第２の搬送方向Ｐ２に搬送する復路側搬送部（第２の搬送部）３３ｃが形成されている。
　本実施の形態の基板保持器搬送機構３は、各搬送駆動部材３３の上側に位置する往路側搬送部３３ａと、各搬送駆動部材３３の下側に位置する復路側搬送部３３ｃとがそれぞれ対向し、鉛直方向に関して重なるように構成されている。
　また、基板保持器搬送機構３には、基板保持器１１を導入する基板保持器導入部３０Ａと、基板保持器１１を折り返して搬送する搬送折り返し部３０Ｂと、基板保持器１１を排出する基板保持器排出部３０Ｃが設けられている。
　ここで、搬送折り返し部３０Ｂの近傍には、後述する方向転換機構４０が設けられている。
　真空槽２内には、第１及び第２の処理領域４、５が設けられている。
　本実施の形態では、真空槽２内において、基板保持器搬送機構３の上部に、例えばスパッタ源４Ｔを有する第１の処理領域４が設けられ、基板保持器搬送機構３の下部に、例えばスパッタ源５Ｔを有する第２の処理領域５が設けられている。
　本実施の形態では、上述した搬送駆動部材３３の往路側搬送部３３ａが、上記第１の処理領域４を直線的に水平方向に通過するように構成され、復路側搬送部３３ｃが、上記第２の処理領域５を直線的に水平方向に通過するように構成されている。
　そして、搬送経路を構成するこれら搬送駆動部材３３の往路側搬送部３３ａ及び復路側搬送部３３ｃを基板保持器１１が通過する場合に、基板保持器１１に保持された複数の基板１０（図２（ａ）参照）が水平状態で搬送されるようになっている。
　真空槽２内の基板保持器搬送機構３の近傍の位置、例えば第１の駆動輪３１に隣接する位置には、基板保持器搬送機構３との間で基板保持器１１を受け渡し且つ受け取るための基板搬入搬出機構６が設けられている。
　本実施の形態の基板搬入搬出機構６は、昇降機構６０によって例えば鉛直上下方向に駆動される駆動ロッド６１の先（上）端部に設けられた支持部６２を有している。
　本実施の形態では、基板搬入搬出機構６の支持部６２上に搬送ロボット６４が設けられ、この搬送ロボット６４上に上述した基板保持器１１を支持して基板保持器１１を鉛直上下方向に移動させ、かつ、搬送ロボット６４によって基板保持器搬送機構３との間で基板保持器１１を受け渡し且つ受け取るように構成されている。
　この場合、後述するように、基板搬入搬出機構６から基板保持器搬送機構３の往路側搬送部３３ａの基板保持器導入部３０Ａに基板保持器１１を受け渡し（この位置を「基板保持器受け渡し位置」という。）、かつ、基板保持器搬送機構３の復路側搬送部３３ｃの基板保持器排出部３０Ｃから基板保持器１１を取り出す（この位置を「基板保持器取り出し位置」という。）ように構成されている。
　真空槽２の例えば上部には、真空槽２内に基板１０を搬入し且つ真空槽２から基板１０を搬出するための基板搬入搬出室２Ａが設けられている。
　この基板搬入搬出室２Ａは、例えば上述した基板搬入搬出機構６の支持部６２の上方の位置に連通口２Ｂを介して設けられており、例えば基板搬入搬出室２Ａの上部には、開閉可能な蓋部２ａが設けられている。
　そして、後述するように、基板搬入搬出室２Ａ内に搬入された処理前の基板１０ａを基板搬入搬出機構６の支持部６２の搬送ロボット６４上の基板保持器１１に受け渡して保持させ、かつ、処理済の基板１０ｂを基板搬入搬出機構６の支持部６２の搬送ロボット６４上の基板保持器１１から例えば真空槽２の外部の大気中に搬出するように構成されている。
　なお、本実施の形態の場合、基板搬入搬出機構６の支持部６２の上部の縁部に、基板１０を搬入及び搬出する際に基板搬入搬出室２Ａと真空槽２内の雰囲気を隔離するための例えばＯリング等のシール部材６３が設けられている。
　この場合、基板搬入搬出機構６の支持部６２を基板搬入搬出室２Ａ側に向って上昇させ、支持部６２上のシール部材６３を真空槽２の内壁に密着させて連通口２Ｂを塞ぐことにより、真空槽２内の雰囲気に対して基板搬入搬出室２Ａ内の雰囲気を隔離するように構成されている。
　図２（ａ）（ｂ）に示すように、本実施の形態の基板保持器搬送機構３の一対の搬送駆動部材３３には、それぞれ所定の間隔をおいて複数の第１の駆動部３６が搬送駆動部材３３の外方側に突出するように設けられている。
　第１の駆動部３６は、例えば図２（ｂ）に示すように、Ｊフック形状（搬送方向下流側の第１の突部３６ａの高さが搬送方向上流側の第２の突部３６ｂの高さより低くなるような溝部が形成された形状）に形成され、以下に説明する基板保持器支持機構１８によって支持された基板保持器１１の後述する第１の被駆動軸１２と接触して当該基板保持器１１を第１又は第２の搬送方向Ｐ１、Ｐ２に駆動するように構成されている。
　一対の搬送駆動部材３３の内側には、搬送する基板保持器１１を支持する一対の基板保持器支持機構１８が設けられている。
　基板保持器支持機構１８は、例えば複数のローラ等の回転可能な部材からなるもので、それぞれ搬送駆動部材３３の近傍に設けられている。
　本実施の形態では、搬送駆動部材３３の往路側搬送部３３ａの上方近傍に往路側基板保持器支持機構１８ａが設けられるとともに、搬送駆動部材３３の復路側搬送部３３ｃの下方近傍に復路側基板保持器支持機構１８ｃが設けられ、搬送される基板保持器１１の下面の両縁部を支持するように配置構成されている。
　なお、往路側基板保持器支持機構１８ａは、後述する方向転換機構４０の第１の方向転換経路５１の進入口の近傍まで設けられ、復路側基板保持器支持機構１８ｃは、後述する方向転換機構４０の第２の方向転換経路５２の排出口の近傍まで設けられている。
　本実施の形態に用いる基板保持器１１は、基板１０の両面上に真空処理を行うためのもので、開口部を有するトレイ状のものからなる。
　図２（ａ）及び図３（ａ）に示すように、本実施の形態の基板保持器１１は、例えば長尺矩形の平板状に形成され、その長手方向即ち第１及び第２の搬送方向Ｐ１、Ｐ２に対して直交する方向に例えば矩形状の複数の基板１０を一列に並べてそれぞれ保持する複数の保持部１４が設けられている。
　ここで、各保持部１４には、各基板１０と同等の大きさ及び形状で各基板１０の両面が全面的に露出する例えば矩形状の開口部が設けられ、図示しない保持部材によって各基板１０を保持するように構成されている。
　本発明では、特に限定されることはないが、設置面積を小さくし且つ処理能力を向上させる観点からは、基板保持器１１について、本実施の形態のように、搬送方向に対して直交する方向に複数の基板１０を一列に並べてそれぞれ保持するように構成することが好ましい。
　ただし、処理効率を向上させる観点からは、搬送方向に対して直交する方向に複数の基板１０を複数列に並べることも可能である。
　一方、基板保持器１１の長手方向の両端部で第１の搬送方向Ｐ１の上流側の端部に第１の被駆動軸（第１の被駆動部）１２がそれぞれ設けられ、また、第１の搬送方向Ｐ１の下流側の端部に第２の被駆動軸（第２の被駆動部）１３がそれぞれ設けられている。
　これら第１及び第２の被駆動軸１２、１３は、それぞれ基板保持器１１の長手方向即ち第１及び第２の搬送方向Ｐ１、Ｐ２に対して直交する方向に延びる回転軸線を中心として断面円形状に形成されている（図３（ａ）（ｂ）参照）。
　本実施の形態では、第２の被駆動軸１３の長さが第１の被駆動軸１２の長さより長くなるようにその寸法が定められている。
　具体的には、図２（ａ）に示すように、基板保持器１１を基板保持器搬送機構３に配置した場合に基板保持器１１の両側部の第１の被駆動軸１２が基板保持器搬送機構３の第１の駆動部３６と接触し、かつ、基板保持器１１を後述する方向転換機構４０に配置した場合に第２の被駆動軸１３が後述する第２の駆動部４６と接触するように第１及び第２の被駆動軸１２、１３の寸法が定められている。
　一対の搬送駆動部材３３の第１の搬送方向Ｐ１の下流側には、同一構成の一対の方向転換機構４０が設けられている。
　本実施の形態の場合、一対の方向転換機構４０は、それぞれ第１及び第２の搬送方向Ｐ１、Ｐ２に関して一対の搬送駆動部材３３の外側の位置に配置されている。
　また、これら一対の方向転換機構４０は、それぞれ第１の搬送方向Ｐ１の上流側の部分が各搬送駆動部材３３の第１の搬送方向Ｐ１の下流側の部分と若干重なるように設けられている。
　図２（ｂ）及び図４（ａ）～（ｄ）に示すように、本実施の形態の搬送駆動部材３３に設けられる第１の駆動部３６には、第１の突部３６ａの平面状に形成された側方部分（搬送方向に対して側方側の部分）で、かつ、その先端部分（搬送方向外方側の部分）に、基板保持器１１を搬送方向に対して直交する方向についてアライメントを行うための第１のテーパ部３６ｃが設けられている。
　また、第２の突部３６ｂの平面状に形成された側方部分（搬送方向に対して側方側の部分）で、かつ、その先端部分（搬送方向外方側の部分）に、基板保持器１１を搬送方向に対して直交する方向についてアライメントを行うための第２のテーパ部３６ｄが設けられている。
　これら第１及び第２のテーパ部３６ｃ、３６ｄは、第１及び第２の突部３６ａ、３６ｂの幅方向即ち搬送方向に対して直交する方向の寸法が、先端部側即ち搬送方向外方側に向ってそれぞれ小さくなるように形成されている。
　本実施の形態では、第１及び第２のテーパ部３６ｃ、３６ｄは、それぞれ第１の突部３６ａ及び第２の突部３６ｂの搬送方向に対して側方側の部分の両方に設けられている。
　本発明の場合、第１の駆動部３６において、第１の突部３６ａに設ける第１のテーパ部３６ｃの寸法については特に限定されることはないが、基板保持器１１を搬送方向に対して直交する方向についてアライメントを確実に行う観点からは、第１の突部３６ａの平面状に形成された側方部分３６０に対してそれぞれ１０～４５°の角度で形成することが好ましい。
　この場合、具体的には、第１の突部３６ａの第１のテーパ部３６ｃの搬送方向外方側に向かう方向の長さは、それぞれ１～３ｍｍに設定することが好ましく、この第１のテーパ部３６ｃの搬送方向に対して直交する方向（図４（ａ）（ｃ）中Ｙ方向で示す方向）についての加工寸法は、それぞれ１～１５ｍｍに設定することが好ましい。
　また、第１の駆動部３６において、第２の突部３６ｂに設ける第２のテーパ部３６ｄの寸法については特に限定されることはないが、基板保持器１１を搬送方向に対して直交する方向についてアライメントを確実に行う観点からは、第２の突部３６ｂの平面状に形成された側方部分３６１に対してそれぞれ５～４５°の角度で形成することが好ましい。
　この場合、具体的には、第２の突部３６ｂの第２のテーパ部３６ｄの搬送方向外方側に向かう方向の長さは、１～５ｍｍに設定することが好ましく、この第２のテーパ部３６ｄの搬送方向に対して直交する方向（図４（ａ）（ｃ）中Ｙ方向で示す方向）についての加工寸法は、それぞれ１～５０ｍｍに設定することが好ましい。
　なお、本実施の形態では、部品の共通化による部分点数の削減のため、それぞれ第１及び第２のテーパ部３６ｃ、３６ｄを、第１の突部３６ａ及び第２の突部３６ｂの両方の側方部分に設けるようにしたが、本発明はこれに限られず、第１及び第２の突部３６ａ、３６ｂの側方部分のうち基板保持器１１側（搬送方向に対して内方側の側方部分）にのみ第１及び第２のテーパ部３６ｃ、３６ｄを設けることもできる。
　一方、本実施の形態では、図４（ｂ）～（ｄ）に示すように、第１の駆動部３６の第２の突部３６ｂの先端部（搬送方向外方側の端部）に、第３のテーパ部３６ｅが設けられている。
　この第３のテーパ部３６ｅは、第２の突部３６ｂの先端部の搬送方向上流側の部分が、搬送方向内方側に傾斜するように形成されている（図４（ｂ）（ｄ）に示す例では第１の搬送方向Ｐ１の上流側の部分）。
　この場合、第３のテーパ部３６ｅは、その搬送方向上流側及び下流側の縁部にアール加工が施され、その中央部分は平面状に形成されている。
　本発明の場合、第１の駆動部３６において、第２の突部３６ｂに設ける第３のテーパ部３６ｅの寸法については特に限定されることはないが、後述するように、基板保持器１１を基板保持器搬送機構３から基板搬入搬出機構６に受け渡す際に、第１の駆動部３６の第２の突部３６ｂと基板保持器１１の第１の被駆動軸１２との接触（係合）状態をできるだけ早く外す観点からは、第２の突部３６ｂの平面状に形成された搬送方向下流側の部分３６ｆ（図４（ｂ）参照）に対して４５～８０°の角度で形成することが好ましい。
　図５に示すように、本実施の形態の方向転換機構４０は、第１のガイド部材４１、第２のガイド部材４２、第３のガイド部材４３を有し、これら第１～第３のガイド部材４１～４３は、第１の搬送方向Ｐ１の上流側からこの順で配置されている。
　本実施の形態では、第１～第３のガイド部材４１～４３は、一対の搬送駆動部材３３の外側近傍の位置にそれぞれ配置され、さらに、第１～第３のガイド部材４１～４３の外側近傍の位置に、後述する搬送駆動部材４５がそれぞれ配置されている。
　なお、図２（ｂ）では、方向転換機構４０の一部を省略するとともに、部材の重なり関係を無視して搬送方向についての部材間の位置関係が明確になるように示されている。
　図２（ａ）及び図５に示すように、第１～第３のガイド部材４１～４３は、例えば板状の部材からなり、それぞれ鉛直方向に向けて設けられている。
　ここで、第１のガイド部材４１の第１の搬送方向Ｐ１の下流側の部分は、第１の搬送方向Ｐ１の下流側に向って凸となる曲面形状に形成され、また、第２のガイド部材４２の第１の搬送方向Ｐ１の上流側の部分は、第１の搬送方向Ｐ１の下流側に向って凹となる曲面形状に形成されている。
　第１及び第２のガイド部材４１、４２は、第１のガイド部材４１の第１の搬送方向Ｐ１の下流側の部分と第２のガイド部材４２の第１の搬送方向Ｐ１の上流側の部分が同等の曲面形状に形成され、これらの部分が基板保持器１１の第１の被駆動軸１２の直径より若干大きな隙間を設けて対向するように近接配置されている。そして、この隙間によって基板保持器１１の第１の被駆動軸１２を案内する第１の方向転換経路５１が設けられている。
　また、第２のガイド部材４２の第１の搬送方向Ｐ１の下流側の部分は、第１の搬送方向Ｐ１の下流側に向って凸となる曲面形状に形成され、また、第３のガイド部材４３の第１の搬送方向Ｐ１の上流側の部分は、第１の搬送方向Ｐ１の下流側に向って凹となる曲面形状に形成されている。
　第２及び第３のガイド部材４２、４３は、第２のガイド部材４２の第１の搬送方向Ｐ１の下流側の部分と第３のガイド部材４３の第１の搬送方向Ｐ１の上流側の部分が同等の曲面形状に形成され、これらの部分が基板保持器１１の第２の被駆動軸１３の直径より若干大きな隙間を設けて対向するように近接配置されている。そして、この隙間によって基板保持器１１の第２の被駆動軸１３を案内する第２の方向転換経路５２が設けられている。
　本実施の形態では、第２のガイド部材４２の第１の搬送方向Ｐ１の下流側の部分が、第１のガイド部材４１の第１の搬送方向Ｐ１の下流側の部分と同等の曲面形状に形成され、さらに、第３のガイド部材４３の第１の搬送方向Ｐ１の上流側の部分が、第２のガイド部材４２の第１の搬送方向Ｐ１の上流側の部分と同等の曲面形状に形成されている。
　そして、このような構成により、第１の方向転換経路５１と第２の方向転換経路５２とが同等の曲面形状に形成されている。
　さらに、本実施の形態では、第１及び第２の方向転換経路５１、５２の各部分の水平方向についての距離が、基板保持器１１の第１及び第２の被駆動軸１２、１３の間の距離と同等となるようにその寸法が定められている。
　また、本実施の形態では、第１の方向転換経路５１の上側の口が基板保持器１１の第１の被駆動軸１２の進入口となっており、その高さ位置が、往路側基板保持器支持機構１８ａに支持された基板保持器１１の第２の被駆動軸１３の高さ位置より低い位置となるように構成されている（図２（ｂ）参照）。
　さらに、第１の方向転換経路５１の下側の口が基板保持器１１の第１の被駆動軸１２の排出口となっており、その高さ位置が、復路側基板保持器支持機構１８ｃに支持された基板保持器１１の第２の被駆動軸１３の高さ位置より高い位置となるように構成されている（図２（ｂ）参照）。
　また、第２の方向転換経路５２については、その上側の口が基板保持器１１の第２の被駆動軸１３の進入口となっており、その高さ位置が、往路側基板保持器支持機構１８ａに支持された基板保持器１１の第２の被駆動軸１３の高さ位置と同等の位置となるように構成されている（図２（ｂ）参照）。
　一方、第２の方向転換経路５２の下側の口が基板保持器１１の第２の被駆動軸１３の排出口となっており、その高さ位置が、復路側基板保持器支持機構１８ｃに支持された基板保持器１１の第２の被駆動軸１３の高さ位置と同等の位置となるように構成されている（図２（ｂ）参照）。
　本実施の形態の方向転換機構４０は、例えば一対のスプロケットと、これら一対のスプロケットに架け渡されたチェーンからなる搬送駆動部材４５を有し、この搬送駆動部材４５は鉛直面に対して一連の環状となるように構成されている。
　この搬送駆動部材４５は、その折り返し部分の曲率半径が、基板保持器搬送機構３の搬送駆動部材３３の折り返し部３３ｂの曲率半径と同等となるように構成されている。
　また、搬送駆動部材４５の上側の部分が第１の搬送方向Ｐ１に移動し、下側の部分が第２の搬送方向Ｐ２に移動するように駆動される。
　搬送駆動部材４５には、所定の間隔をおいて複数の第２の駆動部４６が搬送駆動部材４５の外方側に突出するように設けられている。
　第２の駆動部４６は、搬送駆動部材４５の外方側の部分に凹部が形成され、この凹部の縁部が基板保持器１１の第２の被駆動軸１３と接触して当該基板保持器１１を第２の方向転換経路５２に沿って支持駆動するように構成されている。
　また、本実施の形態の第２の駆動部４６は、後述するように、第２の方向転換経路５２の進入口及び排出口の位置に到達した場合にその凹部側の端部が第２の方向転換経路５２から退避するように搬送駆動部材４５の経路及び第２の駆動部４６の寸法が設定されている（図２（ｂ）参照）。
　本実施の形態では、後述するように、第２の駆動部４６が基板保持器搬送機構３の第１の駆動部３６と同期して動作するように基板保持器搬送機構３の搬送駆動部材３３と方向転換機構４０の搬送駆動部材４５の動作を制御する。
　そして、本実施の形態では、基板保持器搬送機構３の第１の駆動部３６によって基板保持器１１を第１の搬送方向Ｐ１に駆動して第１及び第２の被駆動軸１２、１３を第１及び第２の方向転換経路５１、５２内に進入させた場合に、基板保持器１１が水平状態を保持しつつ第１及び第２の駆動部３６、４６によって第１及び第２の被駆動軸１２、１３が支持されて移動し、円滑に第１及び第２の方向転換経路５１、５２から排出されるように、第１及び第２の駆動部３６、４６、並びに、第１及び第２の方向転換経路５１、５２の形状及び寸法がそれぞれ設定されている。
　一方、第１のガイド部材４１と第２のガイド部材４２の下方で第１の方向転換経路５１の排出口の近傍には、基板保持器１１を方向転換機構４０から基板保持器支持機構１８の復路側基板保持器支持機構１８ｃへ円滑に受け渡すための受け渡し部材４７が設けられている。
　この受け渡し部材４７は、例えば水平方向に延びる細長の部材からなり、その第２の搬送方向Ｐ２側の端部で復路側基板保持器支持機構１８ｃの下方の位置に設けられた回転軸４８を中心として上下方向に回転移動するように構成されている。そして、受け渡し部材４７は、第１の搬送方向Ｐ１側の部分が図示しない弾性部材によって上方に付勢されている。
　受け渡し部材４７の上部には、第１の方向転換経路５１の排出口の第２の搬送方向Ｐ２側の近傍の部分に、第１の方向転換経路５１と連続し、かつ、基板保持器支持機構１８の復路側基板保持器支持機構１８ｃと連続するように曲面形状に形成された受け渡し部４７ａが設けられている（図２（ｂ）参照）。
　また、受け渡し部材４７の上部には、第１の搬送方向Ｐ１側の部分に、第１の搬送方向Ｐ１に向って下側に傾斜する傾斜面４７ｂが設けられている。この傾斜面４７ｂは、第２の方向転換経路５２の排出口と対向する高さ位置に設けられている。
　以下、本実施の形態の真空処理装置１の動作を図６～図１６を参照して説明する。
　本実施の形態では、まず、図６に示すように、基板搬入搬出機構６の支持部６２上のシール部材６３を真空槽２の内壁に密着させて真空槽２内の雰囲気に対して基板搬入搬出室２Ａ内の雰囲気を隔離した状態で、大気圧までベントした後、基板搬入搬出室２Ａの蓋部２ａを開ける。
　その後、図示しない搬送ロボットを用いて処理前の基板１０ａを基板搬入搬出機構６の支持部６２の搬送ロボット６４上の基板保持器１１に装着して保持させる。
　そして、図７に示すように、基板搬入搬出室２Ａの蓋部２ａを閉じて所定の圧力となるまで真空排気した後、基板搬入搬出機構６の支持部６２を上述した基板保持器受け渡し位置まで下降させ、基板保持器１１の高さが搬送駆動部材３３の往路側搬送部３３ａと同等の高さ位置となるようにする。
　さらに、図８に示すように、基板搬入搬出機構６の支持部６２に設けた搬送ロボット６４によって基板保持器１１を基板保持器搬送機構３の基板保持器導入部３０Ａに配置する。
　この場合、図９（ａ）に示すように、基板保持器１１の第１の被駆動軸１２を第１の駆動部３６の溝部内に配置されるように位置決めして往路側基板保持器支持機構１８ａ上に載置する。
　この動作の際、基板保持器１１が第１の搬送方向Ｐ１に対して直交する方向にずれ（図９（ｂ）参照）、基板保持器１１の搬送方向に対して直交する方向側の縁部が第１の駆動部３６に接触する場合があるが、本実施の形態では、上述したように、第１の駆動部３６の第１の突部３６ａ及び第２の突部３６ｂにそれぞれ第１及び第２のテーパ部３６ｃ、３６ｄが設けられているから、基板保持器１１の搬送方向に対して直交する方向側の縁部が第１の駆動部３６の第１及び第２の突部３６ａ、３６ｂに当接し、これにより基板保持器１１が搬送方向に対して直交する方向にアライメントされて位置ずれが補正され、その結果、基板保持器１１の第１の被駆動軸１２を第１の駆動部３６の溝部内に円滑に配置することができる。
　その後、この状態で、図９（ｂ）に示すように、基板保持器搬送機構３の搬送駆動部材３３の往路側搬送部３３ａを第１の搬送方向Ｐ１に移動させる。
　これにより、搬送駆動部材３３の往路側搬送部３３ａ上の第１の駆動部３６によって基板保持器１１の第１の被駆動軸１２が第１の搬送方向Ｐ１に駆動され、基板保持器１１が搬送駆動部材３３の往路側搬送部３３ａ上を搬送折り返し部３０Ｂに向って搬送される。
　この場合、図８に示す第１の処理領域４の位置を通過する際に、基板保持器１１に保持された処理前の基板１０ａ（図６参照）の第１の処理領域４側の第一面に対して所定の真空処理（例えばスパッタリングによる成膜）を行う。
　図１０（ａ）～（ｃ）並びに図１１（ａ）～（ｃ）は、本実施の形態における基板保持器搬送機構及び方向転換機構の動作を示す説明図である。
　本実施の形態では、基板保持器搬送機構３の第１の駆動部３６を第１の搬送方向Ｐ１に移動させることにより、図１０（ａ）に示すように、基板保持器搬送機構３の搬送折り返し部３０Ｂに到達した基板保持器１１を更に第１の搬送方向Ｐ１に移動させ、基板保持器１１の第２の被駆動軸１３を方向転換機構４０の第２の方向転換経路５２の進入口の位置に配置する。
　この場合、方向転換機構４０の第２の駆動部４６が基板保持器１１の第２の被駆動軸１３の下方に位置するように搬送駆動部材４５の動作を制御する。
　そして、基板保持器搬送機構３の搬送駆動部材３３を駆動して第１の駆動部３６を第１の搬送方向Ｐ１に移動させるとともに、方向転換機構４０の搬送駆動部材４５を駆動して第２の駆動部４６を第１の搬送方向Ｐ１に移動させる。この場合、第１の駆動部３６と第２の駆動部４６の動作が同期するように制御する。
　これにより、図１０（ｂ）に示すように、基板保持器１１の第１及び第２の被駆動軸１２、１３が第１及び第２の駆動部３６、４６によってそれぞれ支持駆動され、第１及び第２の方向転換経路５１、５２内を下方に向ってそれぞれ移動する。
　なお、この過程においては、基板保持器１１の第１の被駆動軸１２は第１の方向転換経路５１内において同時に接触することはないが第１のガイド部材４１と第２のガイド部材４２の縁部にも接触し、また第２の被駆動軸１３は第２の方向転換経路５２内において同時に接触することはないが第２のガイド部材４２と第３のガイド部材４３の縁部にも接触する。この場合、基板保持器１１は上下関係を維持している。
　そして、第１及び第２の被駆動軸１２、１３が第１及び第２の方向転換経路５１、５２の中腹部分をそれぞれ通過した付近から、第１及び第２の被駆動軸１２、１３の搬送方向が、基板保持器１１の上下関係を維持した状態で第１の搬送方向Ｐ１と反対方向の第２の搬送方向Ｐ２にそれぞれ転換される。
　なお、この過程においては、基板保持器１１の第１の被駆動軸１２は第１の方向転換経路５１内において同時に接触することはないが第１のガイド部材４１と第２のガイド部材４２の縁部にも接触し、また第２の被駆動軸１３は第２の方向転換経路５２内において同時に接触することはないが第２のガイド部材４２と第３のガイド部材４３の縁部にも接触する。
　さらに、基板保持器搬送機構３の搬送駆動部材３３と方向転換機構４０の搬送駆動部材４５の駆動を継続すると、図１０（ｃ）に示すように、基板保持器１１の第１の被駆動軸１２が第１の方向転換経路５１の排出口並びに受け渡し部材４７の受け渡し部４７ａを経由して受け渡し部材４７の上方の位置に配置されるとともに、基板保持器１１の第２の被駆動軸１３が第２の方向転換経路５２の排出口の位置に配置され、その後、図１１（ａ）に示すように、基板保持器１１は、基板保持器支持機構１８の復路側基板保持器支持機構１８ｃに受け渡される。
　なお、図１０（ｃ）に示す時点で方向転換機構４０の第２の駆動部４６と基板保持器１１の第２の被駆動軸１３は接触しておらず、基板保持器１１は、基板保持器搬送機構３の第１の駆動部３６と第１の被駆動軸１２との接触による駆動によって第２の搬送方向Ｐ２へ移動する。
　そして、更なる基板保持器搬送機構３の搬送駆動部材３３の駆動により、図１１（ｂ）に示すように、基板保持器１１の第２の被駆動軸１３が受け渡し部材４７の傾斜面４７ｂに接触して受け渡し部材４７が下方に回転移動し、図１１（ｃ）に示すように、基板保持器１１の第２の被駆動軸１３が受け渡し部材４７の上方を通過して基板保持器１１が第２の搬送方向Ｐ２へ移動する。
　なお、受け渡し部材４７は、この過程の後に図示しない弾性部材の付勢力によって元の位置に戻る。
　その後、図１２（ａ）に示すように、基板保持器搬送機構３の搬送駆動部材３３の復路側搬送部３３ｃを第２の搬送方向Ｐ２に移動させ、第１の駆動部３６によって第１の被駆動軸１２を同方向に駆動することにより、基板保持器１１を基板保持器排出部３０Ｃに向って搬送する。
　この場合、図８に示す第２の処理領域５の位置を通過する際に、基板保持器１１に保持された処理前の基板１０ａ（図６参照）の第２の処理領域５側の第二面に対して所定の真空処理（例えばスパッタリングによる成膜）を行う。
　そして、基板保持器１１が基板保持器排出部３０Ｃに到達した後、搬送駆動部材３３の復路側搬送部３３ｃを第２の搬送方向Ｐ２に移動させ、第１の駆動部３６によって第１の駆動部３６を同方向に駆動すると、復路側搬送部３３ｃの移動に伴って第１の駆動部３６が鉛直方向から傾斜した状態になるに従い、図１２（ｂ）に示すように、第１の駆動部３６と、第１の被駆動軸１２との接触が外れ、これにより基板保持器１１は推進力を失う。
　図１３（ａ）～（ｄ）は、本実施の形態における搬送駆動部材の第１の駆動部と基板保持器の第１の被駆動軸との接触を外す動作を示す説明図である。
　基板保持器１１が基板保持器排出部３０Ｃに到達した時点では、図１３（ａ）に示すように、第１の駆動部３６の第２の突部３６ｂが、鉛直方向に向けられた状態で、その搬送方向下流側の部分３６ｆが基板保持器１１の第１の被駆動軸１２に接触している。
　この状態から搬送駆動部材３３の復路側搬送部３３ｃを第２の搬送方向Ｐ２に移動させると、基板保持器１１が復路側基板保持器支持機構１８ｃ上を第２の搬送方向Ｐ２に移動し、図１３（ｂ）に示すように、第１の駆動部３６が、第１の駆動輪３１（図１参照）に沿って上方に移動するとともにその第２の突部３６ｂが水平に近づく方向に傾斜し、これにより基板保持器１１の第１の被駆動軸１２は、第１の駆動部３６の第２の突部３６ｂの先端部で搬送方向下流側のアール加工を施した部分に接触する。
　引き続き搬送駆動部材３３の復路側搬送部３３ｃを第２の搬送方向Ｐ２に移動させると、図１３（ｃ）に示すように、第１の駆動部３６は、上記第１の駆動輪３１に沿って更に上方に移動し、これにより第１の駆動部３６の第２の突部３６ｂの先端部が基板保持器１１の第１の被駆動軸１２と接触しながら第１の被駆動軸１２の上部を乗り越える。
　本実施の形態では、上述したように、第２の突部３６ｂの先端部に、その搬送方向上流側の部分が搬送方向内方側に傾斜するように形成された第３のテーパ部３６ｅが設けられており、第１の駆動部３６の第２の突部３６ｂの先端部が基板保持器１１の第１の被駆動軸１２の上部を乗り越える際には、第３のテーパ部３６ｅの表面がほぼ水平になる。
　そして、この状態から搬送駆動部材３３の復路側搬送部３３ｃを第２の搬送方向Ｐ２に僅かに移動させると、図１３（ｄ）に示すように、第３のテーパ部３６ｅを有する第１の駆動部３６は第１の被駆動軸１２と接触（干渉）することはなく第１の駆動部３６の第２の突部３６ｂと基板保持器１１の第１の被駆動軸１２との接触が外れ、また第１の駆動部３６の第２の突部３６ｂと基板保持器１１の第２の被駆動軸１３とを接触させることなく、基板保持器１１を第２の搬送方向Ｐ２へ移動させることができるようになる。
　このような本実施の形態によれば、搬送駆動部材３３によって移動する第１の駆動部３６の第２の突部３６ｂの先端部に、その搬送方向上流側の部分が搬送方向内方側に傾斜するように形成された第３のテーパ部３６ｅを設けることにより、第３のテーパ部３６ｅを有しない従来技術と比べて第１の駆動部３６と第１の被駆動軸１２との接触を外す動作時の移動距離を短くし、また当該動作時間を短縮することができ、これにより基板保持器１１を基板搬入搬出機構６に受け渡すタイミングを大幅に早めることができる。
　以上の動作を行った後、図１４に示す基板搬入搬出機構６の搬送ロボット６４によって基板保持器１１を第２の搬送方向Ｐ２に移動させて第１の駆動部３６に対して離間させる。
　さらに、基板搬入搬出機構６の搬送ロボット６４を用いて基板保持器１１の取り出し動作を行い、図１４に示すように、基板保持器１１を搬送ロボット６４と共に支持部６２上に配置する。
　その後、図１５に示すように、基板搬入搬出機構６の支持部６２を上昇させ、支持部６２上のシール部材６３を真空槽２の内壁に密着させて真空槽２内の雰囲気に対して基板搬入搬出室２Ａ内の雰囲気を隔離した状態で、大気圧までベントを行う。
　そして、図１６に示すように、基板搬入搬出室２Ａの蓋部２ａを開け、図示しない搬送ロボットを用い、処理済の基板１０ｂを基板保持器１１から大気中に取り出す。
　その後、図６に示す状態に戻り、上述した動作を繰り返すことにより、複数の基板１０に対してそれぞれ両面に上述した真空処理を行う。
　以上述べた本実施の形態にあっては、単一の真空雰囲気が形成される真空槽２内において、搬送経路が鉛直面に対する投影形状が一連の環状となるように形成されるとともに、複数の基板保持器１１を搬送経路に沿って搬送する基板保持器搬送機構３を備えていることから、従来技術と比較して搬送経路が占有するスペースを大幅に削減することができ、これにより装置の大幅な省スペース化を達成することができるので、小型且つ簡素な構成の真空処理装置を提供することができる。
　また、本実施の形態では、導入された基板保持器１１を水平にした状態で搬送経路に沿って第１の搬送方向Ｐ１に搬送する搬送駆動部材３３の往路側搬送部３３ａが第１の処理領域４を通過し、かつ、基板保持器１１を水平にした状態で搬送経路に沿って第１の搬送方向Ｐ１と反対方向の第２の搬送方向Ｐ２に搬送して排出する搬送駆動部材３３の復路側搬送部３３ｃが第２の処理領域５を通過するように構成されている。また、基板保持器搬送機構３の第１の駆動部３６と方向転換機構４０の第２の駆動部４６とを同期して動作させ、基板保持器１１の第１及び第２の被駆動軸１２、１３を方向転換機構４０の第１及び第２の方向転換経路５１、５２に沿ってそれぞれ案内して搬送することにより、基板保持器１１を上下関係を維持した状態で搬送駆動部材３３の往路側搬送部３３ａから復路側搬送部３３ｃに受け渡すように構成されているいる。このような構成を有する本実施の形態によれば、基板１０の両面に効率良く処理が可能な通過型の真空処理装置を提供することができる。
　また、本実施の形態においては、基板保持器１１が当該搬送方向に対して直交する方向に複数の基板１０を並べて保持するように構成されていることから、従来技術のような基板の搬送方向に複数の基板を並べて保持する基板保持器を搬送して処理を行う場合と比較して、基板保持器の長さ及びこれに伴う余剰スペースを削減することができるので、真空処理装置のより省スペース化を達成することができる。
　なお、本発明は上述した実施の形態に限られず、種々の変更を行うことができる。
　例えば上記実施の形態においては、搬送駆動部材３３のうち上側の部分を第１の搬送部である往路側搬送部３３ａとするとともに、搬送駆動部材３３のうち下側の部分を第２の搬送部である復路側搬送部３３ｃとするようにしたが、本発明はこれに限られず、これらの上下関係を逆にすることもできる。
　また、上記実施の形態では、基板保持器搬送機構３及び方向転換機構４０について、一対のスプロケットと、これら一対のスプロケットに架け渡されたチェーンから構成するようにしたが、例えばベルトやレールを用いた環状形状の搬送駆動機構を用いることもできる。
　さらに、基板保持器支持機構１８については、ローラではなくベルトやレールを用いて構成することもできる。
　一方、方向転換機構４０については、上述した第１～第３のガイド部材４１～４３によって構成する上記実施の形態のものには限られず、以下のように変形することもできる。
　例えば、図１７に示す変形例では、上記第２のガイド部材４２に対応するガイド部材４４と、上記第３のガイド部材４３に対応するガイド部材４３Ａとを有し、これら一対のガイド部材４４、４３Ａによって第１及び第２の方向転換経路が形成されるように構成されている。
　ここで、ガイド部材４４は、例えば平仮名の「て」（Ｔに類似する形状）字状に形成され、その第１の搬送方向Ｐ１の上流側の部分４４ａが上記第２のガイド部材４２の第１の搬送方向Ｐ１の上流側の部分と同等の曲面形状に形成されている。
　そして、上述した第１の駆動部３６によって駆動される基板保持器１１の第１の被駆動軸１２を、ガイド部材４４の第１の搬送方向Ｐ１の上流側の部分４４ａに接触させて当該部分４４ａに沿って上方から下方に案内するように構成されている。
　一方、ガイド部材４３Ａは、その第１の搬送方向Ｐ１の上流側の部分４３ａが上記第３のガイド部材４３の第１の搬送方向Ｐ１の上流側の部分と同等の曲面形状に形成されている。
　そして、上述した第２の駆動部４６によって駆動される基板保持器１１の第２の被駆動軸１３を、ガイド部材４３Ａの第１の搬送方向Ｐ１の上流側の部分４３ａと接触させて当該部分４３ａに沿って上方から下方に案内するように構成されている。
　このような構成を有する本例によれば、上述した第１のガイド部材４１が不要になるとともに、上記第２のガイド部材４２に対応するガイド部材４４の材料を少なくすることができるので、方向転換機構４０の構成の簡素化ひいては装置構成簡素化及びコストダウンを図ることができる。
　また、第１及び第２の駆動部３６、４６の形状については、上記実施の形態に限られず、基板保持器１１の第１及び第２の被駆動軸１２、１３と確実に接触して支持駆動することができる限り、種々の形状のものを採用することができる。
　さらに、上記実施の形態では、真空中における処理として、スパッタリングを行う装置を例にとって説明したが、本発明はこれに限られず、例えば、プラズマ処理、イオン注入処理、蒸着処理、化学気相成長処理、集束イオンビーム処理、エッチング処理等の種々の処理を行う真空処理装置に適用することができる。
　この場合、第１及び第２の処理領域４、５には、異なる処理を行う処理源を設けることもできる。
　さらに、本発明は、上記実施の形態のように、処理前の基板１０ａを真空槽２内に搬入し、処理済の基板１０ｂを真空槽２から搬出する場合のみならず、処理前の基板１０ａを基板保持器１１と共に真空槽２内に搬入し、処理済の基板１０ｂを基板保持器１１と共に真空槽２から搬出する場合にも適用することができる。
１…真空処理装置
２…真空槽
３…基板保持器搬送機構
４…第１の処理領域
４Ｔ…スパッタ源
５…第２の処理領域
５Ｔ…スパッタ源
６…基板搬入搬出機構
１０…基板
１１…基板保持器
１２…第１の被駆動軸（第１の被駆動部）
１３…第２の被駆動軸（第２の被駆動部）
３０Ａ…基板保持器導入部
３０Ｂ…搬送折り返し部
３０Ｃ…基板保持器排出部
３１…第１の駆動輪
３２…第２の駆動輪
３３…搬送駆動部材（搬送経路）
３３ａ…往路側搬送部（第１の搬送部）
３３ｂ…折り返し部
３３ｃ…復路側搬送部（第２の搬送部）
３６…第１の駆動部
４０…方向転換機構
４１…第１のガイド部材
４２…第２のガイド部材
４３…第３のガイド部材
４５…搬送駆動部材
４６…第２の駆動部
５１…第１の方向転換経路
５２…第２の方向転換経路 

Claims (7)

  1. 　単一の真空雰囲気が形成される真空槽と、
    　前記真空槽内に設けられ、基板保持器に保持された基板上に所定の真空処理を行う第１及び第２の処理領域と、
    　鉛直面に対する投影形状が一連の環状となるように形成され、前記基板保持器を搬送する搬送経路と、
    　第１及び第２の被駆動部を有する複数の前記基板保持器を前記搬送経路に沿って搬送する基板保持器搬送機構とを備え、
    　前記搬送経路は、導入された前記基板保持器を水平にした状態で前記搬送経路に沿って第１の搬送方向に搬送する第１の搬送部と、前記基板保持器を水平にした状態で前記搬送経路に沿って前記第１の搬送方向と反対方向の第２の搬送方向に搬送して排出する第２の搬送部と、前記基板保持器を前記第１の搬送部から前記第２の搬送部に向って折り返して搬送する搬送折り返し部とを有し、前記第１の搬送部が、前記第１及び第２の処理領域のうち一方を通過し、かつ、前記第２の搬送部が、前記第１及び第２の処理領域のうち他方を通過するように構成され、
    　前記基板保持器搬送機構は、前記基板保持器の第１の被駆動部と接触して当該基板保持器を前記搬送経路に沿って駆動する複数の第１の駆動部を有し、
    　前記搬送経路の搬送折り返し部の近傍に、前記基板保持器の第２の被駆動部と接触して当該基板保持器を前記第１及び第２の搬送方向にそれぞれ駆動する複数の第２の駆動部と、前記基板保持器の第１及び第２の被駆動部を当該基板保持器を前記第１の搬送方向から前記第２の搬送方向へ方向転換するようにそれぞれ案内して搬送するための第１及び第２の方向転換経路とを有する方向転換機構が設けられ、
    　前記基板保持器搬送機構の第１の駆動部と前記方向転換機構の第２の駆動部とを同期して動作させ、前記基板保持器の第１及び第２の被駆動部を前記方向転換機構の第１及び第２の方向転換経路に沿ってそれぞれ案内して搬送することにより、前記基板保持器を上下関係を維持した状態で前記搬送経路の第１の搬送部から第２の搬送部に受け渡すように構成されている真空処理装置。
  2. 　前記第１の方向転換経路と前記第２の方向転換経路とが、前記第１の搬送方向側に凸となる同等の曲線形状に形成されている請求項１記載の真空処理装置。
  3. 　前記第１の方向転換経路と前記第２の方向転換経路とが、それぞれ一対のガイド部材を前記基板保持器の第１の被駆動軸の直径より若干大きな隙間を設けて対向するように近接して配置することによって設けられている請求項２記載の真空処理装置。
  4. 　前記基板保持器の第１及び第２の被駆動部が前記第１及び第２の搬送方向に対して直交する方向に延びるように設けられ、当該第１及び第２の被駆動部の長さが異なる請求項１乃至３のいずれか１項記載の真空処理装置。
  5. 　前記方向転換機構が、前記第１及び第２の搬送方向に関して前記基板保持器搬送機構の外側の位置に配置されている請求項１乃至３のいずれか１項記載の真空処理装置。
  6. 　前記第１及び第２の処理領域が、真空中で成膜を行うものである請求項１乃至３のいずれか１項記載の真空処理装置。
  7. 　前記基板保持器は、前記第１及び第２の搬送方向に対して直交する方向に複数の成膜対象基板を並べて保持するように構成されている請求項１乃至３のいずれか１項記載の真空処理装置。 
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