WO2018218966A1 - 显示面板、显示装置及显示面板的制作方法 - Google Patents

显示面板、显示装置及显示面板的制作方法 Download PDF

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Publication number
WO2018218966A1
WO2018218966A1 PCT/CN2018/071790 CN2018071790W WO2018218966A1 WO 2018218966 A1 WO2018218966 A1 WO 2018218966A1 CN 2018071790 W CN2018071790 W CN 2018071790W WO 2018218966 A1 WO2018218966 A1 WO 2018218966A1
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WIPO (PCT)
Prior art keywords
display
display substrate
flip chip
terminal
substrate
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Application number
PCT/CN2018/071790
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English (en)
French (fr)
Inventor
董向丹
高永益
胡明
刘庭良
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/078,472 priority Critical patent/US10993330B2/en
Publication of WO2018218966A1 publication Critical patent/WO2018218966A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a display panel, a display device, and a method of fabricating the display panel.
  • Display products with narrow bezels eg, cell phones (especially full-screen phones) or wearable devices (eg, smart watches) attract a large number of consumers because they enable users to have a better viewing experience.
  • connection terminals are bent (Pad Bending), thereby realizing a display product having a narrow bezel.
  • a display product produced by a bending process using a connection terminal (hereinafter, also referred to as a terminal) has many yield problems, and there is a display failure phenomenon caused by cracks in the inorganic insulating layer.
  • the prior art terminal bending technology also increases process difficulty and manufacturing cost, and reduces production efficiency.
  • the formation of the terminal bending region P requires an increase in space, and the display product produced by the connection terminal bending process has a low utilization ratio to the substrate.
  • Embodiments of the present disclosure provide a display panel, a display device, and a method of fabricating the display panel. .
  • a display panel includes: a display substrate having a display surface and a connection hole extending through at least the display substrate in an edge portion of the display surface; and an electrical connector disposed at the And a flip-chip assembly disposed on a surface of the display substrate opposite to the display surface, the flip-chip assembly comprising a flip chip and an integrated circuit chip on the flip chip, wherein Electrical connection to the display substrate is provided at least by the electrical connector.
  • the display panel further includes a bonding layer for attaching the flip chip to a surface of the display substrate opposite to the display surface.
  • the display substrate further includes a first terminal at the edge portion, the electrical connection to the first terminal being provided by at least the electrical connector, wherein the edge portion is not bent.
  • the electrical connection between the integrated circuit chip and the display substrate is provided by at least the electrical connector.
  • connection hole and the electrical connector only penetrate the display substrate; the bonding layer is formed of an anisotropic conductive paste; and the flip chip further includes a flip chip a second terminal facing one side of the display substrate, the second terminal being configured to be electrically connected to the electrical connector through the bonding layer.
  • connection hole and the electrical connector penetrate the display substrate and the bonding layer; the flip chip further includes a side of the flip chip facing the display substrate a second terminal, wherein the second terminal is configured to be electrically connected to the electrical connector.
  • connection hole and the electrical connector penetrate the display substrate, the bonding layer, and the flip chip; the flip chip further includes a spacer disposed on the flip chip A second terminal that displays one side of the substrate, wherein the second terminal is configured to be electrically connected to the electrical connector.
  • connection aperture has a pore size greater than or equal to 25 [mu]m.
  • the display substrate is an electroluminescent display substrate or a quantum dot display substrate.
  • the flip chip is disposed to partially overlap a face of the display substrate opposite the display surface.
  • the display panel further includes: a flexible circuit board attached and electrically connected to a portion of the flip chip; and a polarizer disposed in association with a display area of the display surface, wherein The electrical connector provides an electrical connection between the flexible circuit board and the display substrate, and wherein the edge portion is outside of the display area.
  • the edge portion is located at one end of the display substrate, and the edge portion is sized such that the display substrate can also provide a narrowness at the one end when used in a display device Border configuration.
  • a method of fabricating a display panel includes: providing a display substrate having a display surface and a connection hole penetrating the display substrate in an edge portion of the display surface; a flip chip is disposed on a surface of the display substrate opposite to the display surface, thereby disposing a flip chip assembly on the display substrate, the flip chip assembly including the flip chip and the flip chip An integrated circuit chip on a side remote from the display substrate; an electrical connection is formed in the connection hole, wherein an electrical connection to the display substrate is provided at least by the electrical connection.
  • a method of fabricating a display panel includes: providing a display substrate having a display surface; and providing a flip chip to a surface of the display substrate opposite to the display surface, the flip chip The film is adapted to attach an integrated circuit chip on a side remote from the display substrate; forming a connection hole, the connection hole extending at least through the display substrate, the connection hole penetrating through the display surface edge portion of the display substrate Displaying a substrate; forming an electrical connection in the connection hole, wherein an electrical connection to the display substrate is provided at least by the electrical connection.
  • providing the flip chip to the surface of the display substrate opposite to the display surface includes attaching the flip chip to the surface of the display substrate opposite to the display surface by the bonding layer.
  • the display substrate further includes a first terminal at the edge portion, wherein an electrical connection to the first terminal is provided by at least the electrical connector, wherein the edge portion is not bent .
  • the electrical connection between the integrated circuit chip and the display substrate is provided by at least the electrical connector.
  • providing the flip chip to the surface of the display substrate opposite to the display surface includes: disposing the flip chip assembly to a surface of the display substrate opposite to the display surface through the bonding layer.
  • the connection hole and the electrical connector may penetrate the display substrate and the bonding layer.
  • the flip chip may further include a second terminal disposed on a side of the flip chip facing the display substrate, wherein the second terminal is configured to be electrically connected to the electrical connector.
  • providing the flip chip to the surface of the display substrate opposite to the display surface includes: providing the flip chip to the surface of the display substrate opposite to the display surface by the bonding layer.
  • the connection hole and the electrical connector may penetrate the display substrate, the bonding layer, and the flip chip.
  • the flip chip may further include a second terminal disposed on a side of the flip chip that faces away from the display substrate, wherein the second terminal is configured to be electrically connected to the electrical connector.
  • an integrated circuit chip is attached on a side of the flip chip that is remote from the display substrate.
  • the electrical connection between the integrated circuit chip and the display substrate is provided by at least the electrical connector.
  • the fabricating method further includes: attaching and electrically connecting the flexible circuit board to a portion of the flip chip; and providing a polarizer in association with the display area of the display surface, wherein The electrical connector provides an electrical connection between the flexible circuit board and the display substrate, and wherein the edge portion is outside the display area.
  • a display panel includes: a display substrate having a first surface and a second surface opposite to the first surface, and in the first surface, the display substrate includes a display area And a non-display area; a flip-chip assembly disposed on the second surface, the flip-chip assembly comprising a flip chip and an integrated circuit chip on the flip chip; a connection hole, the connection hole being located In the non-display area, and at least extending through the display substrate and the flip chip; the electrical connector is disposed in the connection hole, and the display substrate and the flip chip assembly are electrically connected through the electrical connector .
  • the display panel may further include a bonding layer disposed between the flip chip and the second surface of the display substrate.
  • the display substrate may further include a first terminal in the non-display area, the flip chip further includes a second terminal, and the first terminal and the second terminal pass the electrical connector Electric connection.
  • connection hole and the electrical connector penetrate the display substrate, the bonding layer, and the flip chip;
  • the display substrate further includes a first terminal in the non-display area;
  • the flip chip further includes a second terminal disposed on a side of the flip chip that faces away from the display substrate; and the second terminal is electrically connected to the first terminal through the electrical connection.
  • connection aperture has a pore size greater than or equal to 25 [mu]m.
  • the display substrate is an electroluminescent display substrate or a quantum dot display substrate.
  • the flip chip is disposed to at least partially overlap the non-display area of the display substrate.
  • the display substrate is a flexible display substrate.
  • the display panel further includes: a flexible circuit board attached to a side of the flip chip facing the display substrate.
  • a method of fabricating a display panel includes providing a display substrate having a first face and a second face opposite the first face, and the first face
  • the display substrate includes a display area and a non-display area; and a flip chip assembly is disposed on the display substrate, wherein the flip chip assembly comprises a flip chip and an integrated circuit chip, wherein the flip chip is attached to the On the second side of the display substrate, the integrated circuit chip is disposed on a side of the flip chip that is away from the display substrate; forming a connection hole formed in the non-display area and penetrating the display a substrate and the flip chip; and forming an electrical connection in the connection hole, wherein the flip chip is electrically connected to the display substrate through the electrical connection.
  • providing a flip chip assembly on the display substrate includes: attaching a flip chip to a second side of the display substrate through a bonding layer, wherein the connection hole and the electrical connector It also runs through the bonding layer.
  • the bonding layer is an anisotropic conductive paste.
  • the display substrate further includes a first terminal in the non-display area
  • the flip chip further includes a second terminal
  • the first terminal and the ground are provided at least through the electrical connector The electrical connection of the second terminal is described.
  • connection holes are formed by a laser puncturing process.
  • the display substrate is a flexible display substrate.
  • the display device including any of the above-described display panels as will be described below.
  • the display device can have a narrow bezel.
  • FIG. 1 is a schematic structural view of a display panel in the prior art
  • FIGS. 2a to 2f are schematic structural views of a display panel according to an embodiment of the present disclosure.
  • connection hole and a connection terminal are schematic structural views of a connection hole and a connection terminal according to an embodiment of the present disclosure
  • connection terminal 4 is a schematic diagram showing a connection relationship between a connection terminal of a display surface edge of a display substrate and a connection terminal disposed on a flip chip according to an embodiment of the present disclosure
  • 5a and 5b are respectively a flowchart of a method of fabricating a display panel according to an embodiment of the present disclosure
  • FIG. 6 is a schematic structural diagram of a display panel corresponding to steps in a method for fabricating a display panel according to an embodiment of the present disclosure
  • Figure 7 is a cross-sectional view along line AA of the display panel of Figure 6b;
  • Figure 8 is a schematic cross-sectional view of the display panel of Figure 6c taken along line BB.
  • connection means that one element/node/feature may be mechanically, electrically, logically or indirectly or indirectly with another element/node/feature, unless otherwise explicitly stated. Linked in other ways to allow interaction. That is, "connected” is intended to include both direct and indirect connections of the elements or other features, including the connection of one or more intermediate elements.
  • ordinal numbers such as “first”, “second”, “third”, etc. are used to avoid confusion of constituent elements, and are not used in any order of priority.
  • FIG. 1 is a schematic view showing the structure of a display panel prepared by a terminal bending technique according to the prior art.
  • the substrate terminal portion is bent to achieve a reduced frame (relative to the case where it is not bent).
  • the bending also causes terminals (not shown) on the substrate to face the flip chip (COF) for electrical connection.
  • COF flip chip
  • the inorganic insulating layer may cause cracks, resulting in display failure.
  • an inorganic insulating layer connecting the bent portion P of the terminal is removed by adding a mask process; and then an organic insulating layer is formed in the bent portion P of the connecting terminal by adding another Mask process;
  • an organic insulating layer is formed in the bent portion P of the connecting terminal by adding another Mask process;
  • the two Mask processes are added, which increases the process difficulty and the manufacturing cost, and reduces the production efficiency.
  • the formation of the bent portion P of the connection terminal requires an increase in space, and the display product produced by the connection terminal bending process has a low utilization ratio to the base substrate.
  • the display panel 200 includes a display substrate 201.
  • the display substrate 201 may have a first side, an upper surface 2011 as shown in FIG. 2a, and a second side opposite the first side, a lower surface 2013 as shown in FIG. 2a.
  • a display area and a non-display area exist in the first side 2011 of the display substrate 201. Therefore, the first side is also often referred to as a display surface.
  • the non-display area may be located at an edge portion of the display area.
  • a polarizer 210 may be formed on the display area. .
  • connection holes 205 penetrating the display substrate 201 is formed in the non-display area.
  • the connection holes 205 may be filled with a conductive material 206.
  • a member formed of a conductive material filled in the connection hole 205 is referred to as an electrical connector (also indicated by 206).
  • the electrical connector 206 can fill the connection aperture 205; however, it should be understood that the present disclosure is not limited thereto.
  • the connection aperture 205 will best be seen from Figure 7; in other figures, the connection aperture is schematically indicated using a dashed box due to the presence of the electrical connector 206.
  • Display panel 200 also includes a flip chip assembly (COF assembly) (not labeled).
  • the flip chip assembly may be disposed on a face (ie, second face) 2013 of the display substrate opposite to the first face.
  • the flip chip assembly may include a flip chip and an integrated circuit chip on the flip chip.
  • the flip chip 202 may be disposed on a second surface of the display substrate 201 opposite to the first surface.
  • the integrated circuit chip 204 may be attached to a side of the flip chip 202 that faces away from the display substrate 201.
  • the flip chip 202 (or, the flip chip assembly) may be attached to the side (face) of the display substrate 201 opposite to the first side by the bonding layer 203.
  • the bonding layer 203 may be formed of an insulating paste or an anisotropic conductive paste (ACF). It will be apparent to those skilled in the art that electrical conduction in a particular direction and electrical insulation in other directions can be achieved by an anisotropic conductive paste.
  • the display substrate 201 may further include a terminal (first terminal) 211 on the first side (illustrated exemplarily as shown in FIG. 2d). It should be understood that the first face 211 may include a display area (eg, a portion corresponding to the polarizer 210) and a non-display area located outside the display area. Display substrate 201 may also include wiring (e.g., conductive traces) 207 to connect corresponding terminals 211 and corresponding components (not shown) in the display area.
  • the term "terminal” is intended to include any electrically conductive component suitable for providing or receiving electrical connections, including but not limited to pads, wires, taps, and the like.
  • the electrical connection to the display substrate may be provided at least through the electrical connector 206, such as but not limited to, between the integrated circuit chip and the display substrate. Electrical connection.
  • the terminal 211 of the display substrate 201 and the connection terminal 208 (second terminal) provided on the flip chip 202 can be realized by the electrical connection 206 and the anisotropic conductive paste 203 (if any) (see FIG. 3). Electrical connection.
  • An anisotropic conductive paste 203 may be disposed between the flip chip and the second side of the display substrate. It should be understood that the present disclosure is not limited thereto, and more other implementations will be described later.
  • connection hole 205 (correspondingly, the electrical connector 206) may be disposed to penetrate only the display substrate 201.
  • a connection terminal (for example, as indicated by 208 in FIG. 4) may be disposed on a side of the flip chip 202 facing the display substrate 201; for example, the connection terminal 208 may be located directly under the connection hole 205.
  • the second terminal 208 can be configured to be electrically connected to the electrical connector.
  • the first terminal 211 may be connected to the connection terminal 208 of the flip chip 202 through a conductive material (electrical connection) 206 and an anisotropic conductive paste 203.
  • the edge portion of the first surface of the display substrate 201 (that is, in the non-display region) can be perforated before the flip chip 202 is bonded to the display substrate 201.
  • the operation required to separately punch the display substrate 201 is simple, and the production cost is low. High production efficiency.
  • the aperture of the obtained connection hole 205 and the size of the terminal 208 to be subsequently connected to each other are mutually No effect between. That is, the aperture of each of the connection holes 205 may be larger than, equal to, or smaller than the size of the connection terminal 208 to which it is subsequently connected, as long as a reliable electrical connection can be achieved.
  • the present disclosure is not limited to the above embodiment.
  • the display substrate 201 may be punctured.
  • connection hole 205 (correspondingly, the electrical connection 206) may also be disposed to penetrate the display substrate 201 and the bonding layer 203.
  • the connection terminal 208 may be disposed on a side of the flip chip 202 facing the display substrate 201.
  • the connection terminal 208 may be located directly below the connection hole 205.
  • the anisotropic conductive paste 203 may not be used to display the electrical connection of the substrate to the flip chip component (eg, an integrated circuit chip therein).
  • the anisotropic conductive paste 203 may only function to fix the flip chip 202 to the side of the first surface of the display substrate 201; therefore, other insulating bonding materials (eg, insulating glue) may be used instead of the different materials.
  • a square conductive paste is used as the bonding layer 203.
  • conductive paste 203 can also be used to electrically connect electrical components on the back side of the display substrate (the side opposite the first side) to the COF assembly, as desired.
  • other bonding agents may be used instead of the anisotropic conductive paste such as, but not limited to, an insulating paste or the like to form the bonding layer 203.
  • connection hole 205 is disposed to penetrate the display substrate 201 and the bonding layer 203
  • the surface between the metal material 206 and the flip chip 202 can be realized by forming the electrical connection member 206 by forming a conductive material in the connection hole 205. Contact, thereby effectively reducing the contact resistance.
  • connection hole 205 (correspondingly, the electrical connector 206) may also be disposed through the display substrate 201, the anisotropic conductive adhesive 203, and the cover. Crystal film 202.
  • the connection terminal 208 may be disposed on a side of the flip chip 202 facing away from the display substrate 201; for example, the connection terminal 208 may be located directly under the connection hole 205.
  • the anisotropic conductive paste 203 is also not used to display the electrical connection of the substrate to the flip chip component (e.g., the integrated circuit chip therein).
  • the anisotropic conductive paste 203 can only function to fix the flip chip 202 to the second surface side of the display substrate 201.
  • other bonding agents may be used instead of the anisotropic conductive paste, for example, an insulating paste or the like, to form the bonding layer 203.
  • the display panel is perforated on the side of the flip chip 202 to form the through-display substrate 201 and the anisotropic conduction.
  • the display substrate 201 can be directly placed on the device platform, thereby avoiding special processing on the device platform.
  • manufacturing precision can be improved compared to a bonding process.
  • connection hole 205 in the case where the connection hole 205 is disposed to penetrate the display substrate 201 and the bonding layer 203, and/or in the case where the connection hole 205 is disposed to penetrate the display substrate 201, the bonding layer 203, and the flip chip 202
  • the connection hole 205 may be disposed to correspond one-to-one with the connection terminal 208, as shown in FIGS. 3 and 4.
  • the size a of the connection terminal 208 may be set to be larger than the aperture d of the connection hole 205.
  • connection terminal bending process is omitted, and there is no terminal bending region at the edge of the display panel, thereby making the frame of the display panel narrower.
  • an edge portion of the display substrate in which the terminal is formed is not bent.
  • the edge portion is located at one end of the display substrate; of course, the present disclosure is not limited thereto.
  • the edge portion is sized such that when used in a display device, the display substrate can also provide a narrow bezel configuration at the one end.
  • connection terminals 211 / 208 may be any shape, such as a triangle, a square, a circle, or the like.
  • the diameter of the connection terminal 211/208 can be set larger than the aperture d of the connection hole 205.
  • the side length a of the connection terminal 208 can be set larger than the aperture d of the connection hole 205. This is also true for the terminal 211.
  • FIG. 3 illustrates a structural schematic view of a connection hole and a connection terminal according to some embodiments of the present disclosure.
  • 4 is a top plan view showing a connection relationship of electrical connection members provided in a connection terminal of a flip chip and a connection hole according to some embodiments of the present disclosure.
  • the flip chip may further include a terminal (PAD) connected to the pin of the integrated circuit chip 204 (shown in hatched portions in the figure).
  • a terminal M connected to the connection terminal 208 by a wire (which may be provided, for example, in the same layer as the connection terminal 208), and a terminal N not connected to the connection terminal 208 (which may be, for example, disposed in the same layer as the connection terminal 208) are shown in FIG. It is also possible to provide a different layer from the connection terminal 208. It should be understood that the embodiments/implementations shown herein are merely exemplary and not limiting.
  • connection holes 205 corresponding to the connection terminals 208
  • a laser drilling process may be employed.
  • the connection hole 205 having the desired aperture and hole depth can be obtained by controlling the diameter and energy of the laser.
  • the present disclosure is not limited thereto, and the connection hole 205 may be fabricated by other punching processes known to those skilled in the art.
  • the aperture d of the connection hole 205 may be greater than or equal to 25 ⁇ m, that is, the minimum value of the aperture d of each connection hole 205 may be 25 ⁇ m.
  • the connection terminals 208 may be configured to cover the connection holes 205, that is, cover the electrical connectors 206 to provide a reliable electrical connection. This can also be the case for the connection terminal 211.
  • the conductive material 206 may be a material having a small resistivity and a good electrical conductivity, for example, a metal material.
  • the conductive material 206 is not limited thereto, and may be other materials having electrical conductivity, such as indium tin oxide, indium zinc oxide or graphene.
  • the display substrate 201 may be a flexible display substrate or a rigid display substrate.
  • the display substrate 201 is a flexible display substrate, such as an Organic Light Emitting Diodes (OLED) display substrate, or a Quantum Dot Light Emitting Diodes (QLED) display substrate.
  • OLED Organic Light Emitting Diodes
  • QLED Quantum Dot Light Emitting Diodes
  • the flip chip 202 may be disposed on an edge region of the display substrate 201 facing away from the first surface (ie, the second surface opposite the first surface).
  • the edge region may correspond to a non-display region of the display substrate 201.
  • the flip chip may be disposed to overlap at least a portion of the non-display area of the display substrate, as shown in the figure.
  • the display panel may further include a flexible circuit board 209.
  • a flexible circuit board 209 can be attached and electrically connected to a portion of the flip chip.
  • the power, charge, control signals, and the like required for pixel driving in the display panel can be provided by an external flexible printed circuit (FPC).
  • FPC flexible printed circuit
  • power and control signals, etc. can be transmitted to the display panel, such as to terminal 211 of the display panel, through flip chip 202 and electrical connectors 206 (and ACF, if desired).
  • the electrical connection between the flexible circuit board and the display substrate can be provided by the electrical connector (first electrical connector) or another electrical connector (second electrical connector).
  • a display area with the first side of the display substrate 201 may also be disposed in the display panel.
  • a polarizer (Polar) 210 is provided in association.
  • the polarizer 210 can be any suitable polarizer known in the art or developed in the future, and can be attached to the display area using any attachment technique known in the art or developed in the future. Here, further detailed description thereof is omitted.
  • a method of fabricating a display panel is also provided.
  • 5a and 5b respectively illustrate a flow chart of a method of fabricating a display panel in accordance with some embodiments of the present disclosure.
  • a display substrate 201 is provided.
  • the display substrate 201 may have a display area 2011 and a connection hole 205 penetrating the display substrate in an edge portion of the first surface.
  • a flip chip assembly is disposed on a surface of the display substrate opposite to the first surface.
  • the flip chip assembly may include a flip chip 202 and an integrated circuit chip 204 on the flip chip.
  • the flip chip may be attached to the side of the display substrate opposite to the first side by a bonding layer (eg, an anisotropic conductive paste) 203.
  • the integrated circuit chip can be located on the side of the flip chip that faces away from the display substrate.
  • an electrical connector 206 is formed in the connection hole.
  • the electrical connector 206 can be formed by filling a conductive material in the connection hole. In this way, the electrical connection between the electrical connector and the corresponding terminal can be reliably achieved.
  • an electrical connection to the display substrate such as an electrical connection between the integrated circuit chip and the display substrate, can be provided at least by the electrical connector.
  • an electrical connection between the first terminal 211 on the display panel and the second terminal 208 on the COF can be provided at least by the electrical connector 206 and the anisotropic conductive paste 203, if any.
  • a method of fabricating a display panel in accordance with further embodiments of the present disclosure is described below in conjunction with FIGS. 5b and 2c and 2e.
  • a display substrate 201 is provided.
  • the display substrate 201 may have a display area 2011.
  • a flip chip assembly is disposed on the display substrate.
  • a flip chip may be disposed on a face of the display substrate opposite the first side.
  • the flip chip is suitable for attaching an integrated circuit chip.
  • a flip chip component may be attached to a face of the display substrate opposite the first face by a bonding layer (eg, an anisotropic conductive paste) 203.
  • connection hole 205 is formed.
  • the connection hole 205 penetrates at least the display substrate and the flip chip.
  • the connection hole may penetrate the display substrate in a non-display area of the display substrate. If a bonding layer (for example, the anisotropic conductive paste 203) is present, the connection holes will also penetrate the bonding layer.
  • an electrical connector 206 is formed in the connection hole.
  • an electrical connection to the display substrate such as an electrical connection between the flip chip (or an integrated circuit chip therein) and the display substrate, may be provided at least by the electrical connector.
  • the step of forming the connection holes through the display substrate may be performed before or after bonding the flip chip (or the flip chip assembly).
  • the step of forming the electrical connector can be performed before or after the step of setting up the COF assembly.
  • the connection holes after forming a plurality of connection holes through the display substrate in the non-display area (for example, the first surface edge or the peripheral portion) of the display substrate, the connection holes are filled with a conductive material, and then facing away from the display substrate.
  • the one side (ie, the second side) of the first side is bonded to the flip chip by an anisotropic conductive paste.
  • a plurality of connection holes extending through at least the display substrate may be formed in the non-display area of the display substrate by forming a through display substrate and an anisotropic conductive paste in the non-display area of the display substrate.
  • the plurality of connection holes are such that the signal line is connected to the connection terminal disposed on the side of the flip chip facing the display substrate through the conductive material.
  • a plurality of connection holes penetrating through the display substrate may be formed in the non-display area of the display substrate by forming a through-display substrate, an anisotropic conductive paste, and flip chip in the non-display area of the display substrate.
  • the plurality of connection holes of the film are such that the signal wires are connected to the connection terminals disposed on the side of the flip chip opposite to the display substrate through the conductive material.
  • the method may further include: bonding the flexible circuit board on a side of the flip chip that faces away from the integrated circuit chip.
  • providing the flip chip assembly to the second side of the display substrate opposite the first side can include a variety of implementations.
  • an integrated circuit chip may be mounted on the flip chip; thereafter, the flip chip is attached to a side (face) of the display substrate away from the first face, for example, by a conductive paste.
  • the manner in which the flip chip module is disposed to the display substrate is not limited thereto as long as the integrated circuit chip is finally attached to the flip chip and the flip chip is attached to the display substrate.
  • the display substrate further includes a first terminal at an edge portion of the display surface (which may correspond to a non-display region), the first terminal being electrically connected to the integrated circuit chip at least through the electrical connector .
  • the edge portion is not bent, and the size of the edge portion can be reduced.
  • connection holes extend through the display substrate and the bonding layer (eg, an anisotropic conductive paste).
  • the flip chip further includes a second terminal disposed on a side of the flip chip facing the display substrate. The second terminal is configured to be electrically connected to the electrical connector.
  • a connection hole may penetrate the display substrate, the bonding layer, and the flip chip.
  • the flip chip further includes a second terminal disposed on a side of the flip chip that faces away from the display substrate.
  • the second terminal is configured to be electrically connected to the electrical connector.
  • an electrical connection of the second terminal to a respective first terminal can be provided by the electrical connector.
  • the method may further include attaching and electrically connecting the flexible circuit board to a portion of the flip chip.
  • a flexible circuit board can be used to provide the power, control signals, etc. required for pixel drive or display.
  • the method may further include: providing a polarizer in association with the display area of the first side. The edge portion may be outside the display area. An electrical connection between the flexible circuit board and the display substrate can be provided by the electrical connector.
  • the flexible circuit board in order to improve production efficiency, may be bonded to the side of the flip chip on which the integrated circuit chip is mounted while the integrated circuit chip is mounted on the flip chip.
  • the step of bonding the flexible circuit board on the side where the flip chip is mounted with the integrated circuit chip may be performed before or after the integrated circuit chip is mounted on the flip chip.
  • FIGS. 6a to 6d respectively illustrate structural diagrams of display panels corresponding to certain steps in a method of fabricating a display panel according to some embodiments of the present disclosure.
  • Figure 7 is a schematic cross-sectional view of the display panel of Figure 6b taken along line AA.
  • Figure 8 is a schematic cross-sectional view of the display panel of Figure 6c taken along line BB.
  • a method of fabricating a display panel in accordance with some embodiments of the present disclosure is described below in conjunction with FIGS. 6a-6d, 7-8, and 2a-2b.
  • a display substrate 201 is provided.
  • the polarizer 210 may be attached to the display area of the first side of the display substrate 201.
  • the display substrate 201 may be formed with a polarizer 210 corresponding to the display region.
  • a connection hole 205 penetrating the display substrate 201 may be formed in a non-display area (for example, an edge portion outside the display area) of the first side of the display substrate 201 by, for example, a laser drilling process.
  • connection holes 205 of the display substrate 201 are filled with a conductive material to form an electrical connection 206.
  • an integrated circuit chip 204 is mounted on the flip chip 202, and a flexible circuit board 209 is attached to the side of the flip chip 202 facing away from the integrated circuit chip 204. As shown, the flexible circuit board 209 can overlap a portion of the COF 202.
  • the flip chip 202 is bonded by the anisotropic conductive paste 203 on the side facing away from the first surface of the display substrate 201 (i.e., the second surface).
  • the integrated circuit chip 204 is located on a side of the flip chip 202 facing away from the display substrate 201.
  • several of the electrical connectors are used to provide an electrical connection of the FPC to the display substrate.
  • connection holes 205 may extend through the display substrate 201 and the COF 202 and the bonding layer therebetween (if there is a bonding layer).
  • the display panel according to an embodiment of the present disclosure can be applied to a wide variety of display devices including, but not limited to, mobile phones, tablet computers, televisions, displays, notebook computers, digital photo frames, navigators, smart watches, fitness wristbands, individuals. Any product or component that has a display function, such as a digital assistant.
  • a narrow bezel display product having a larger first area for example, a narrow bezel mobile phone
  • the connection terminal bending process is omitted, so that the connection terminal bending region does not exist at the edge of the display panel, thereby making the frame of the display panel narrower.
  • the substrate utilization efficiency can be improved, the yield can be improved, the manufacturing process can be simplified, and/or the manufacturing cost can be reduced.

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Abstract

一种显示面板（200）、显示装置及显示面板制作方法，显示面板（200）包括：显示基板（201），具有第一面（2011）以及与第一面（2011）相对的第二面（2013），以及在第一面（2011），显示基板（201）包括显示区以及非显示区；覆晶薄膜组件，设置于第二面（2013）上，覆晶薄膜组件包括覆晶薄膜（202）和在覆晶薄膜（202）上的集成电路芯片（204）；连接孔（205），连接孔（205）位于非显示区中，且至少贯穿显示基板（201）和覆晶薄膜（202）；电连接件（206），设置于连接孔（205）中，显示基板（201）与覆晶薄膜组件通过电连接件（206）电连接。

Description

显示面板、显示装置及显示面板的制作方法
相关申请的交叉引用
本申请要求于2017年5月27日提交的中国申请CN201710393763.0的优先权，并通过引用将其全文包括权利要求、说明书和附图等并入在此。
技术领域
本公开涉及显示技术领域，尤其涉及显示面板、显示装置及显示面板的制作方法。
背景技术
随着显示技术的不断进步，显示面板在电子产品中的运用越来越广泛。具有窄边框(Narrow Bezel)的显示产品(比如，手机(特别是全面屏手机)或穿戴设备(例如，智能手表)因其可以使用户获得较好的观看体验，吸引了大量的消费者。
目前，多是将连接端子弯折(Pad Bending)，从而实现具有窄边框的显示产品。但是采用连接端子(以下，也称作端子)弯折工艺制作的显示产品的良率问题较多，存在无机绝缘层产生裂纹导致的显示失效现象。另外，现有技术的端子弯折技术还增加工艺难度和制造成本，降低了生产效率。此外，端子弯折区域P的形成需要增加空间，并且采用连接端子弯折工艺制作的显示产品对衬底基板的利用率较低。
因此，存在对新颖性的具有窄边框的显示产品及其制造方法的需求。
发明内容
本公开实施例提供一种显示面板、显示装置及显示面板的制作方法。。
根据本公开的一个方面，提供了一种显示面板，包括：显示基板，具有显示面以及在所述显示面的边缘部分中的至少贯穿所述显示基板的连接孔；电连接件，设置于所述连接孔中；以及覆晶薄膜组件，设置于所述显示基板的与所述显示面相反的面上，所述覆晶薄膜组件包括覆晶薄膜和在覆晶薄膜上的集成电路芯片，其中，至少通过所述电连接件提供到所述显示基板的电连接。
在一个实现方式中，所述显示面板还包括接合层，用于将所述覆晶薄膜附接到所述显示基板的与所述显示面相反的面上。在一个实现方式中，所述显示基板还包括在所述边缘 部分的第一端子，至少通过所述电连接件提供到所述第一端子的电连接，其中所述边缘部分未被弯折。在一个实现方式中，至少通过所述电连接件提供所述集成电路芯片与所述显示基板之间的电连接。
在一个实现方式中，所述连接孔和所述电连接件仅贯穿所述显示基板；所述接合层由异方性导电胶形成；以及所述覆晶薄膜还包括设置于所述覆晶薄膜的面向所述显示基板的一侧的第二端子，所述第二端子被配置为通过所述接合层与所述电连接件电连接。在一个实现方式中，所述连接孔和所述电连接件贯穿所述显示基板和所述接合层；所述覆晶薄膜还包括设置于所述覆晶薄膜面向所述显示基板的一侧的第二端子，其中，所述第二端子被配置为与所述电连接件电连接。
在一个实现方式中，所述连接孔和所述电连接件贯穿所述显示基板、所述接合层和所述覆晶薄膜；所述覆晶薄膜还包括设置于所述覆晶薄膜的背离所述显示基板的一侧的第二端子，其中，所述第二端子被配置为与所述电连接件电连接。
在一个实现方式中，所述连接孔的孔径大于或等于25μm。在一个实现方式中，所述显示基板为电致发光显示基板或量子点显示基板。在一个实现方式中，所述覆晶薄膜被设置为与所述显示基板的与所述显示面相反的面部分重叠。
在一个实现方式中，所述显示面板还包括：附接并电连接到所述覆晶薄膜的一部分的柔性电路板；以及偏光片，与所述显示面的显示区域关联地设置，其中，通过所述电连接件提供所述柔性电路板与所述显示基板之间的电连接，并且其中，所述边缘部分在所述显示区域外。在一个实现方式中，所述边缘部分位于所述显示基板的一端，并且所述边缘部分的尺寸被设置为使得所述显示基板在被用于显示装置时，能够在所述一端处也提供窄边框配置。
根据本公开一个方面，提供了一种显示面板的制作方法，包括：提供显示基板，所述显示基板具有显示面以及在所述显示面的边缘部分中的贯穿所述显示基板的连接孔；将覆晶薄膜设置到所述显示基板的与显示面相反的面上，从而将覆晶薄膜组件设置到所述显示基板上，所述覆晶薄膜组件包括所述覆晶薄膜以及在覆晶薄膜的远离显示基板的一侧上的集成电路芯片；在所述连接孔中形成电连接件，其中，至少通过所述电连接件提供到所述显示基板的电连接。
根据本公开一个方面，提供了一种显示面板的制作方法，包括：提供显示基板，其具有显示面；将覆晶薄膜设置到所述显示基板的与显示面相反的面上，所述覆晶薄膜适于在 远离显示基板的一侧上附接集成电路芯片；形成连接孔，所述连接孔至少贯穿所述显示基板，所述连接孔在所述显示基板的显示面边缘部分中贯穿所述显示基板；在所述连接孔中形成电连接件，其中，至少通过所述电连接件提供到所述显示基板的电连接。
在一个实现方式中，将覆晶薄膜设置到所述显示基板的与显示面相反的面上包括：通过接合层将覆晶薄膜附接到所述显示基板的与显示面相反的面上。在一个实现方式中，所述显示基板还包括在所述边缘部分的第一端子，其中至少通过所述电连接件提供到所述第一端子的电连接，其中所述边缘部分不被弯折。在一个实现方式中，至少通过所述电连接件提供所述集成电路芯片与所述显示基板之间的电连接。
在一个实现方式中，将覆晶薄膜设置到所述显示基板的与显示面相反的面上包括：通过接合层将覆晶薄膜组件设置到所述显示基板的与显示面相反的面上。所述连接孔和所述电连接件可以贯穿所述显示基板和所述接合层。所述覆晶薄膜可以还包括设置于所述覆晶薄膜面向所述显示基板的一侧的第二端子，其中，所述第二端子被配置为与所述电连接件电连接。
在一个实现方式中，将覆晶薄膜设置到所述显示基板的与显示面相反的面上包括：通过接合层将覆晶薄膜设置到所述显示基板的与显示面相反的面上。所述连接孔和所述电连接件可以贯穿所述显示基板、所述接合层和所述覆晶薄膜。所述覆晶薄膜可以还包括设置于所述覆晶薄膜的背离所述显示基板的一侧的第二端子，其中，所述第二端子被配置为与所述电连接件电连接。
在一个实现方式中，在所述覆晶薄膜的远离显示基板的一侧上附接有集成电路芯片。在一个实现方式中，至少通过所述电连接件提供所述集成电路芯片与所述显示基板之间的电连接。
在一个实现方式中，所述制作方法还包括：将柔性电路板附接并电连接到所述覆晶薄膜的一部分；以及与所述显示面的显示区域关联地设置偏光片，其中，通过所述电连接件提供所述柔性电路板与所述显示基板之间的电连接，并且其中，所述边缘部分在所述显示区域外。
根据本公开一个方面，提供了一种显示面板，包括：显示基板，具有第一面以及与所述第一面相对的第二面，以及在所述第一面，所述显示基板包括显示区以及非显示区；覆晶薄膜组件，设置于所述第二面上，所述覆晶薄膜组件包括覆晶薄膜和在覆晶薄膜上的集成电路芯片；连接孔，所述连接孔位于所述非显示区中，且至少贯穿所述显示基板以及所 述覆晶薄膜；电连接件，设置于所述连接孔中，所述显示基板与所述覆晶薄膜组件通过所述电连接件电连接。
在一个实现方式中，所述显示面板还可以包括接合层，设置在所述覆晶薄膜和所述显示基板的第二面之间。
在一个实现方式中，所述显示基板还可以包括在所述非显示区的第一端子，所述覆晶薄膜还包括第二端子，所述第一端子和第二端子通过所述电连接件电连。
在一个实现方式中，所述连接孔和所述电连接件贯穿所述显示基板、所述接合层和所述覆晶薄膜；所述显示基板还包括在所述非显示区的第一端子；所述覆晶薄膜还包括设置于所述覆晶薄膜的背离所述显示基板的一侧的第二端子；并且所述第二端子通过所述电连接件与所述第一端子电连接。
在一个实现方式中，所述连接孔的孔径大于或等于25μm。在一个实现方式中，所述显示基板为电致发光显示基板或量子点显示基板。
在一个实现方式中，所述覆晶薄膜被设置为与所述显示基板的非显示区至少部分重叠。在一个实现方式中，所述显示基板是柔性显示基板。
在一个实现方式中，所述显示面板还包括：附接于所述覆晶薄膜面向所述显示基板一侧的柔性电路板。
根据本公开另一个方面，提供了一种显示面板的制作方法，包括：提供显示基板，其具有第一面以及与所述第一面相对的第二面，以及所述在所述第一面，显示基板包括显示区以及非显示区；在所述显示基板上设置覆晶薄膜组件，其中所述覆晶薄膜组件包括覆晶薄膜和集成电路芯片，其中所述覆晶薄膜被附接到所述显示基板的第二面上，所述集成电路芯片设置在覆晶薄膜的远离显示基板的一侧上；形成连接孔，所述连接孔被形成在所述非显示区中并贯穿所述显示基板和所述覆晶薄膜；以及在所述连接孔中形成电连接件，其中，所述覆晶薄膜通过所述电连接件与所述显示基板的电连接。
在一个实现方式中，在所述显示基板上设置覆晶薄膜组件包括：通过接合层将覆晶薄膜附接到所述显示基板的第二面上，其中所述连接孔以及所述电连接件还贯穿所述接合层。
在一个实现方式中，所述接合层为异方性导电胶。
在一个实现方式中，所述显示基板还包括在所述非显示区中的第一端子，所述覆晶薄膜还包括第二端子，至少通过所述电连接件提供所述第一端子和所述第二端子的电连接。
在一个实现方式中，通过激光打孔工艺形成所述连接孔。在一个实现方式中，所述显 示基板是柔性显示基板。
根据本公开一个方面，提供了一种显示装置，其包括任意上述的以及下面将描述的显示面板。在一个实现方式中，所述显示装置可以具有窄边框。
应理解，根据本公开的实施例，提供了如上所述的以及如下面将更详细说明的显示面板及制造方法以及显示装置。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
附图构成本说明书的一部分，其描述了本公开的示例性实施例，并且连同说明书一起用于解释本发明的原理，在附图中：
图1为现有技术中显示面板的结构示意图；
图2a至图2f分别为本公开实施例的显示面板的结构示意图；
图3为本公开实施例的连接孔与连接端子的结构示意图；
图4为本公开实施例的显示基板的显示面边缘的连接端子与设置在覆晶薄膜的连接端子的连接关系示意图；
图5a和图5b分别为本公开实施例的显示面板的制作方法的流程图；
图6a至图6d分别为实施本公开实施例的显示面板的制作方法中的步骤对应的显示面板的结构示意图；
图7为图6b中显示面板的沿AA线的截面示意图；以及
图8为图6c中显示面板的沿BB线的截面示意图。
注意，在以下说明的实施方式中，有时在不同的附图之间共同使用同一附图标记来表示相同部分或具有相同功能的部分，而省略其重复说明。在本说明书中，使用相似的标号和字母表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
具体实施方式
下面，参照附图对本说明书所公开的发明的实施方式进行详细说明。但应理解，对各种实施例的描述仅仅是说明性的，在任何意义上都不是对本申请所要求保护的发明的限制。 除非另有具体说明或者上下文或其原理明示或者暗示，在示例性实施例中的组件和步骤的相对布置、表达式和数值等不作为对本申请所要保护的发明的限制。在本说明书中，对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
本文中所用的术语，仅仅是为了描述特定的实施例，而不意图限制本公开。应理解的是，“包括/包含”一词在本文中使用时，说明存在所指出的特征、整体、步骤、操作、单元和/或组件，但是并不排除存在或增加一个或多个其它特征、整体、步骤、操作、单元和/或组件以及/或者它们的组合。
如在此所使用的，除非另外明确说明，术语“连接”意指一个元件/节点/特征可以与另一元件/节点/特征以直接的或间接的方式在机械上、电学上、逻辑上或以其它方式连结以允许相互作用。也就是说，“连接”意图包含元件或其它特征的直接连接和间接连接，包括利用一个或多个中间元件的连接。
在本公开中，诸如“第一”、“第二”、“第三”等的序数词是为了避免构成要素的混淆而标记的，而不用于在任何方面上的优先次序。
应理解，附图中各膜/层仅出于示意性的目的而示出，其尺寸和形状并不表示其实际尺寸和形状。
图1示出了根据现有技术的端子弯折技术制备的显示面板的结构示意图。如图1所示，将基板端子部弯折以实现减小的边框(相对于不弯折的情况)。弯折还使得基板上的端子(未示出)面对覆晶薄膜(COF)来进行电连接。然而，在端子弯折区域P，无机绝缘层会产生裂纹，导致显示失效。现有技术中通过增加一道掩膜(Mask)工艺，以去除连接端子弯折区域P的无机绝缘层；之后再通过增加另一道Mask工艺，在连接端子弯折区域P形成一有机绝缘层；从而来避免在弯折过程中端子弯折区域P的无机绝缘层产生裂纹导致的显示失效现象。虽然这在一定程度上避免无机绝缘层产生裂纹导致的显示失效现象，但增加了两道Mask工艺，增加了工艺难度和制造成本，降低了生产效率。此外，连接端子弯折区域P的形成需要增加空间，并且采用连接端子弯折工艺制作的显示产品对衬底基板的利用率较低。
图2a至图2f示出了根据本公开一些实施例的显示面板的结构示意图。如图2a和图2b 所示，显示面板200包括显示基板201。显示基板201可以具有第一面，如图2a所示的上表面2011，以及与所述第一面相对的第二面，如图2a所示的下表面2013。在显示基板201的第一面2011中存在显示区和非显示区。因此，第一面也往往被称作显示面。非显示区可以位于显示区的边缘部分。如图2a所示，在显示区上可以形成有偏光片210。。
如图2a所示，在非显示区形成有至少贯穿显示基板201的一个或多个连接孔205。连接孔205可以填充有导电材料206。这里，将填充在连接孔205中的导电材料所形成的部件称作电连接件(也以206来标示)。优选地，电连接件206可以填满连接孔205；但应理解，本公开不限于此。连接孔205从图7将最佳地看到；在其他的图中，由于电连接件206的存在，因此使用虚线框来示意性地标示连接孔。
显示面板200还包括覆晶薄膜组件(COF组件)(未标示)。覆晶薄膜组件可以设置于所述显示基板的与所述第一面相对的面(即，第二面)2013上。覆晶薄膜组件可以包括覆晶薄膜和在覆晶薄膜上的集成电路芯片。覆晶薄膜202可以设置于显示基板201的与第一面相对的第二面上。集成电路芯片204可以附接到覆晶薄膜202的背离显示基板201的一侧。对于覆晶薄膜202和集成电路芯片204的机械耦接和/或电连接的方式没有任何限制，本领域技术人员可以根据需要适当地应用相关领域中已知的或者将来开发的任何技术。
在本公开的一些实施例中，覆晶薄膜202(或者，覆晶薄膜组件)可以通过接合层203附接到显示基板201的与第一面相对的一侧(面)。在不同实现方式中，接合层203可以由绝缘胶或者异方性导电胶(ACF)形成。本领域技术人员将明了，可以通过异方性导电胶实现特定方向上的导电和其它方向上的电绝缘。
显示基板201还可以包括位于第一面上的端子(第一端子)211(如图2d所示例性地示出的)。应理解，第一面211可以包括显示区域(例如，与偏光片210对应的部分)以及位于显示区域之外的非显示区。显示基板201还可以包括布线(例如，导电迹线)207以连接对应的端子211和显示区域中的相应部件(未示出)。在本申请文件中，术语“端子”意图包括任何适于提供或者接收电连接的导电部件，包括但不限于焊盘、导线、抽头(tap)等等。
在本公开上述实施例提供的上述显示面板中，可以至少通过所述电连接件206提供到所述显示基板的电连接，例如但不限于，所述集成电路芯片与所述显示基板之间的电连接。例如，可以通过电连接件206以及异方性导电胶203(如果有的话)，实现显示基板201的端子211与设置在覆晶薄膜202的连接端子208(第二端子)(见图3)的电连接。异方性 导电胶203可以设置在所述覆晶薄膜和所述显示基板的第二面之间。应理解，本公开不限于此，稍后将描述更多的其他实现方式。
在一个其他具体实施方式中，例如，由于异方性导电胶203可以仅在沿连接孔205的延伸方向上导电，因此，在本公开一些实施例提供的上述显示面板中，如图2a和图2b所示，连接孔205(相应地，电连接件206)可以设置为仅贯穿显示基板201。连接端子(例如，如图4中的208所指示的)可以设置于覆晶薄膜202面向显示基板201的一侧；例如，连接端子208可以位于连接孔205的正下方。第二端子208可以被配置为与所述电连接件电连接。第一端子211可以通过导电材料(电连接件)206和异方性导电胶203连接于覆晶薄膜202的连接端子208。
利用这样的配置，可以在将覆晶薄膜202与显示基板201贴合之前，对显示基板201第一面的边缘部分(也即，在非显示区中)进行打孔。相比较对贴合了覆晶薄膜202的显示基板201进行打孔的实现方式，在实际制作过程中，单独对显示基板201进行打孔的实现方式所需的操作较简单，生产成本较低，生产效率较高。
此外，在将覆晶薄膜202与显示基板201贴合之前对显示基板201第一面的边缘部分进行打孔的情况下，所获得的连接孔205的孔径与其后续将连接的端子208的尺寸相互之间不影响。也即，各连接孔205的孔径可以大于、等于或小于后续与其连接的连接端子208的尺寸，只要能实现可靠电连接即可。
当然，本公开不限于上述实施方式。例如，在其他实施例中，也可以在将覆晶薄膜202与显示基板201贴合之后，对显示基板201进行打孔。
又如，在根据本公开一些实施例的显示面板中，如图2c和图2d所示，连接孔205(相应地，电连接件206)还可以设置为贯穿显示基板201和接合层203。在此情况下，连接端子208可以设置于覆晶薄膜202面向显示基板201的一侧。例如，连接端子208可以位于连接孔205的正下方。
利用这样的配置，在某些实施例中，异方性导电胶203可以不用于显示基板到覆晶薄膜组件(例如，其中的集成电路芯片)的电连接。例如，异方性导电胶203可以仅起到将覆晶薄膜202固定粘结到显示基板201的与第一面一侧的作用；因此可以用其他绝缘接合材料(如，绝缘胶)来替代异方性导电胶作为接合层203。然而，本公开不限于。例如，在需要时，导电胶203也可以用于将显示基板背面(与第一面相对的面)上的电部件电连接到COF组件。替代地，可以采用其他胶黏剂代替异方性导电胶，例如但不限于，绝缘胶等， 来形成接合层203。
这里，在连接孔205设置为贯穿显示基板201和接合层203的情况下，通过在连接孔205中形成导电材料来形成电连接件206，可以实现金属材料206与覆晶薄膜202之间的面接触，从而有效减小了接触电阻。
再如，在本公开的另外实施例中，如图2e和图2f所示，连接孔205(相应地，电连接件206)还可以设置为贯穿显示基板201、异方性导电胶203和覆晶薄膜202。连接端子208可以设置于覆晶薄膜202背离显示基板201的一侧；例如，连接端子208可以位于连接孔205的正下方。
在这种情况下，异方性导电胶203也不用于显示基板到覆晶薄膜组件(例如，到其中的集成电路芯片)的电连接。例如，异方性导电胶203可以仅起到将覆晶薄膜202固定粘结到显示基板201的第二面一侧的作用。此时，可以采用其他胶黏剂代替异方性导电胶，例如，绝缘胶等，来形成接合层203。
这里，可以在将覆晶薄膜202与显示基板201背离第一面的第二面贴合后，在覆晶薄膜202一侧对显示面板进行打孔，从而形成贯穿显示基板201、异方性导电胶203和覆晶薄膜202的连接孔205。这样操作时，可以将显示基板201直接放置在设备平台上，从而避免了对设备平台进行特殊处理。另一方面，相比于贴合(bonding)工艺，能够提高制造精度。
在一具体实施方式中，在连接孔205设置为贯穿显示基板201和接合层203的情况下，和/或在连接孔205设置为贯穿显示基板201、接合层203和覆晶薄膜202的情况下，为了便于实现显示基板201的非显示区的端子211与覆晶薄膜202上的连接端子208的连接，可以将连接孔205设置为与连接端子208一一对应，如图3和图4所示。另外，连接端子208的尺寸a可以设置为大于连接孔205的孔径d。
如此，根据本公开的实施例，省去了连接端子弯折工艺，在显示面板的边缘不会存在端子弯折区域，从而使得显示面板的边框更窄。换而言之，根据本公开的实施例，显示基板的边缘部分(其中形成端子)不被弯折。
这里，如图中所示的，边缘部分位于所述显示基板的一端；当然本公开不限于此。在一些实施例中，边缘部分的尺寸被设置为使得所述显示基板在被用于显示装置时，能够在所述一端处也提供窄边框配置。
需要说明的是，在本公开实施例提供的上述显示面板中，连接端子211/208可以为任意形状，例如三角形、方形或圆形等。当连接端子208的形状为基本圆形时，可以将连接 端子211/208的直径设置为大于连接孔205的孔径d。而当连接端子208的形状为基本方形时，如图3所示，可以将连接端子208的边长a设置为大于连接孔205的孔径d。对于端子211也可以如此。
图3示出了根据本公开一些实施例的连接孔与连接端子的结构示意图。图4从俯视的角度示出了根据本公开一些实施例的设置在覆晶薄膜的连接端子与连接孔中电连接件的连接关系示意图。
如图3所示，覆晶薄膜还还可以包括与集成电路芯片204的管脚连接的端子(PAD)(如图中阴影线部分所示)。图3中示出了通过导线与连接端子208相连的端子M(其例如可以与连接端子208同层设置)，以及未与连接端子208相连的端子N(其例如可以与连接端子208同层设置，也可以与连接端子208异层设置。应理解，本文中所示的实施例/实现方式仅仅是示例性，而不是限制性的。
一般地，覆晶薄膜202的连接端子208的数量多、密度高，为了高效快速地制作与连接端子208一一对应的连接孔205，在本公开一些实施例中，可以采用激光打孔工艺。可以通过控制激光的直径和能量，获得具有所需孔径和孔深的连接孔205。然而本公开不限于此，也可以通过本领域技术人员已知的其他打孔工艺制作连接孔205。
在本公开一些实施例中，如图3所示，连接孔205的孔径d可以为大于或等于25μm，即各连接孔205的孔径d的最小值可以为25μm。这里，如图4所示，在俯视图中，连接端子208可以被配置为覆盖连接孔205，也即，覆盖电连接件206，以提供可靠的电连接。对于连接端子211也可以如此。
在本公开一些实施例中，导电材料206可以为电阻率较小、导电性能较好的材料，例如，金属材料。当然，导电材料206不限于此，还可以为其他具有导电性能的材料，例如氧化铟锡、氧化铟锌或石墨烯等。
在具体实施时，在本公开一些实施例中，显示基板201可以为柔性显示基板或刚性显示基板。在一些实施例中，显示基板201为柔性显示基板，例如有机发光二极管(Organic Light Emitting Diodes，OLED)显示基板，或量子点发光二极管(Quantum Dot Light Emitting Diodes，QLED)显示基板等。
在本公开一些实施例中，覆晶薄膜202可以设置于显示基板201背离所述第一面的一侧(也即，与第一面相对的第二面)的边缘区域。例如，边缘区域可以与显示基板201的非显示区域相对应。在一些示例中，覆晶薄膜可以被设置为与所述显示基板的非显示区至 少部分重叠，如图中所示。
在本公开一些实施例中，显示面板还可以包括柔性电路板209。如图2b、图2d和图2f所示，柔性电路板209可以附接并电连接到所述覆晶薄膜的一部分。可以通过外接的柔性电路板(Flexible Printed Circuit，FPC)来提供显示面板中像素驱动所需要的电源、电荷以及控制信号等。例如，可以通过覆晶薄膜202和电连接件206(以及ACF，如果需要的话)传输电源和控制信号等至显示面板，例如至显示面板的端子211。在一些实施例中，还构思了可以通过所述电连接件(第一电连接件)或者另外的电连接件(第二电连接件)来提供柔性电路板和显示基板之间的电连接。
在本公开一些实施例中，为了能使显示面板更好成像，如图2a、图2c、图2d和图2e所示，还可以在显示面板中设置与显示基板201的第一面的显示区域关联地设置的偏光片(Polarizer，简写为Pol)210。偏光片210可以采用本领域已知或者将来开发的任何适当偏光片，并可以利用本领域已知或者将来开发的任何附接技术附接到显示区域。这里，省略了对其进一步详细说明。
根据本公开一些实施例，还提供了显示面板的制作方法。图5a和图5b分别示出了根据本公开一些实施例的显示面板的制作方法的流程图。
下面结合图5a和图2a说明根据本公开一些实施例的显示面板的制作方法。如图5a所示，在步骤S501，提供显示基板201。显示基板201可以具有显示区2011以及在所述第一面的边缘部分中的贯穿所述显示基板的连接孔205。
在步骤S502，将覆晶薄膜组件设置到所述显示基板的与第一面相对的面上.覆晶薄膜组件可以包括覆晶薄膜202以及在覆晶薄膜上的集成电路芯片204。在一个具体实现方式中，可以通过接合层(例如，异方性导电胶)203将覆晶薄膜贴合到显示基板的与第一面相对的一侧。集成电路芯片可以位于覆晶薄膜背离显示基板的一侧。
在步骤S503，在所述连接孔中形成电连接件206。例如，可以通过在连接孔中填充导电材料来形成电连接件206。如此，可以可靠地实现电连接件和对应的端子之间的电连接。
从而，可以至少通过所述电连接件提供到所述显示基板的电连接，例如所述集成电路芯片与所述显示基板之间的电连接。例如，可以至少通过电连接件206以及异方性导电胶203(如果有的话)提供显示面板上的第一端子211和COF上的第二端子208之间的电连接。
下面结合图5b和图2c和2e说明根据本公开另外一些实施例的显示面板的制作方法。 如图5b所示，在步骤S601，提供显示基板201。显示基板201可以具有显示区2011。
在步骤S602，在所述显示基板上设置覆晶薄膜组件。在一个实施例中，可以将覆晶薄膜设置到所述显示基板的与第一面相对的面上。覆晶薄膜适于附接集成电路芯片。例如，可以通过接合层(例如，异方性导电胶)203将覆晶薄膜组件附接到所述显示基板的与第一面相对的面上。
在步骤S603，形成连接孔205。连接孔205至少贯穿显示基板和所述覆晶薄膜。连接孔可以在所述显示基板的非显示区中贯穿所述显示基板。如果存在接合层(例如，异方性导电胶203)的话，连接孔还将贯穿该接合层。
在步骤S604，在连接孔中形成电连接件206。这里，可以至少通过所述电连接件提供到所述显示基板的电连接，例如覆晶薄膜(或其中的集成电路芯片)与所述显示基板之间的电连接。
应理解，对于上面所说明的方法实施例的步骤的执行顺序没有限制，除非明确相反说明，或者其上下文暗示或者明示了特定的顺序。例如，根据不同的实施例，形成贯穿显示基板的连接孔的步骤，可以在贴合覆晶薄膜(或覆晶薄膜组件)之前或之后执行。又例如，在图5a所示的示例中，形成电连接件的步骤可以在可以在设置COF组件的步骤之前或之后进行。在其他实施例中，可以在显示基板的非显示区(例如，第一面边缘或周边部分)形成贯穿显示基板的多个连接孔之后，在各连接孔内填充导电材料，然后在背离显示基板的第一面的一侧(也即，第二面)通过异方性导电胶贴合覆晶薄膜。
在本公开的其他实施例中，可以通过以下方式来在显示基板的非显示区形成至少贯穿显示基板的多个连接孔：在显示基板的的非显示区形成贯穿显示基板和异方性导电胶的多个连接孔，以使信号线通过导电材料连接于设置在覆晶薄膜面向显示基板一侧的连接端子。
在本公开的其他实施例中可以通过以下方式在显示基板的非显示区形成至少贯穿显示基板的多个连接孔：在显示基板的非显示区形成贯穿显示基板、异方性导电胶和覆晶薄膜的多个连接孔，以使信号线通过导电材料连接于设置在覆晶薄膜背离显示基板一侧的连接端子。
在本公开的其他实施例中，还可以包括：在覆晶薄膜的背离集成电路芯片的一侧绑定柔性电路板。
还应理解，将覆晶薄膜组件设置到所述显示基板的与第一面相反的第二面上可以包括多种实现方式。例如，可以在覆晶薄膜上安装集成电路芯片；之后，例如，通过导电胶将 所述覆晶薄膜附接到所述显示基板的远离第一面的一侧(面)。然而将覆晶薄膜组件设置到显示基板的方式不限于此，只要最终形成了集成电路芯片附接到覆晶薄膜而覆晶薄膜附接到显示基板即可。
在一些实现方式中，显示基板还包括在显示面的边缘部分(其可以对应于非显示区)的第一端子，所述第一端子至少通过所述电连接件电连接到所述集成电路芯片。根据本公开的实施例，所述边缘部分不被弯折，并且可以减小所述边缘部分的尺寸。
根据本公开一些实施例，如前所述的，所述连接孔(相应地，电连接件)贯穿所述显示基板和所述接合层(例如，异方性导电胶)。所述覆晶薄膜还包括设置于所述覆晶薄膜面向所述显示基板的一侧的第二端子。所述第二端子被配置为与所述电连接件电连接。
根据本公开一些实施例，连接孔(相应地，电连接件)可以贯穿所述显示基板、所述接合层和所述覆晶薄膜。所述覆晶薄膜还包括设置于所述覆晶薄膜的背离所述显示基板的一侧的第二端子。所述第二端子被配置为与所述电连接件电连接。例如，可以通过所述电连接件提供所述第二端子与相应的第一端子的电连接。
根据本公开一些实施例，所述方法还可以包括：将柔性电路板附接并电连接到所述覆晶薄膜的一部分。柔性电路板可以用于提供像素驱动或显示所需的电源、控制信号等。根据本公开一些实施例，所述方法还可以包括：与所述第一面的显示区域关联地设置偏光片。所述边缘部分可以在所述显示区域外。可以通过所述电连接件提供所述柔性电路板与所述显示基板之间的电连接。
在一些实施例中，为提高生产效率，可以在覆晶薄膜上安装集成电路芯片的同时，在覆晶薄膜安装有集成电路芯片的一侧绑定柔性电路板。当然，也可以在覆晶薄膜上安装集成电路芯片之前或之后，执行在覆晶薄膜安装有集成电路芯片的一侧绑定柔性电路板的步骤。
图6a至图6d分别示出了根据本公开一些实施例的显示面板的制作方法中的某些步骤对应的显示面板的结构示意图。图7为图6b中显示面板沿AA线的截面示意图。图8为图6c中显示面板沿BB线的截面示意图。下面结合图6a-6d、图7-8以及图2a-2b来说明根据本公开一些实施例的显示面板的制作方法。
如图6a所示，提供显示基板201。可选地，可以在显示基板201的第一面的显示区域贴合偏光片210。替代地，显示基板201可以形成有与显示区域对应的偏光片210。
如图6b和图7所示，可以通过例如激光打孔工艺，在显示基板201的第一面的非显示区(例如，显示区外的边缘部分)形成贯穿显示基板201的连接孔205。
如图6c和图8所示，在显示基板201的多个连接孔205内填充导电材料，形成电连接件206。
如图6d所示，在覆晶薄膜202上安装集成电路芯片204，以及在覆晶薄膜202的背离集成电路芯片204的一侧附接柔性电路板209。如图所示，柔性电路板209可以与COF 202的一部分重叠。
之后，如图2a和图2b所示，在背离显示基板201的第一面的一侧(即，第二面)通过异方性导电胶203贴合覆晶薄膜202。集成电路芯片204位于覆晶薄膜202背离显示基板201的一侧。如前所述的，可以构思将电连接件中的若干用于提供FPC到显示基板的电连接。
至此，制作出了具有如图2a和图2b所示结构的显示面板。注意，如前所述的，在其他实施例中，连接孔205可以贯穿显示基板201和COF 202以及其间的接合层(如果有接合层的话)。
根据本公开实施例的显示面板可以应用于多种多样的显示装置，包括但不限于：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪、智能手表、健身腕带、个人数字助理等任何具有显示功能的产品或部件。
根据本公开的实施例，与根据现有技术的端子弯折技术相比，可以基于相同尺寸的显示基板制造具有更大第一面积的窄边框显示产品，例如，窄边框的手机。根据本公开的实施例，省去了连接端子弯折工艺，以致在显示面板的边缘不会存在连接端子弯折区域，从而使得显示面板的边框更窄。根据本公开的实施例，可以提高基板利用效率，可以提高良品率，可以简化制造工艺，和/或可以降低制造成本。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这里所公开的实施例的特征可以自由地适当组合，而不脱离本发明的精神和范围。因此，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。本发明的范围由所附权利要求来限定。

Claims (16)

  1. 一种显示面板，包括：
    显示基板，具有第一面以及与所述第一面相对的第二面，以及在所述第一面，所述显示基板包括显示区以及非显示区；
    覆晶薄膜组件，设置于所述第二面上，所述覆晶薄膜组件包括覆晶薄膜和在覆晶薄膜上的集成电路芯片；
    连接孔，所述连接孔位于所述非显示区中，且至少贯穿所述显示基板以及所述覆晶薄膜；
    电连接件，设置于所述连接孔中，所述显示基板与所述覆晶薄膜组件通过所述电连接件电连接。
  2. 如权利要求1所述的显示面板，还包括接合层，设置在所述覆晶薄膜和所述显示基板的第二面之间。
  3. 如权利要求1所述的显示面板，其中：
    所述显示基板还包括在所述非显示区的第一端子，所述覆晶薄膜还包括第二端子，所述第一端子和第二端子通过所述电连接件电连。
  4. 如权利要求2所述的显示面板，其中：
    所述连接孔和所述电连接件贯穿所述显示基板、所述接合层和所述覆晶薄膜；
    所述显示基板还包括在所述非显示区的第一端子；
    所述覆晶薄膜还包括设置于所述覆晶薄膜的背离所述显示基板的一侧的第二端子；并且
    所述第二端子通过所述电连接件与所述第一端子电连接。
  5. 如权利要求1所述的显示面板，其中，所述连接孔的孔径大于或等于25μm。
  6. 如权利要求1所述的显示面板，其中，所述显示基板为电致发光显示基板或量子点 显示基板。
  7. 如权利要求1所述的显示面板，其中，所述覆晶薄膜被设置为与所述显示基板的非显示区至少部分重叠。
  8. 如权利要求1所述的显示面板，其中，所述显示基板是柔性显示基板。
  9. 如权利要求1-8中任一项所述的显示面板，还包括：
    附接于所述覆晶薄膜面向所述显示基板一侧的柔性电路板。
  10. 如权利要求1-8中任一项所述的显示面板，所述接合层为异方性导电胶。
  11. 一种显示装置，包括如权利要求1-10中任一项所述的显示面板。
  12. 一种显示面板的制作方法，包括：
    提供显示基板，其具有第一面以及与所述第一面相对的第二面，以及所述在所述第一面，显示基板包括显示区以及非显示区；
    在所述显示基板上设置覆晶薄膜组件，其中所述覆晶薄膜组件包括覆晶薄膜和集成电路芯片，其中所述覆晶薄膜被附接到所述显示基板的第二面上，所述集成电路芯片设置在覆晶薄膜的远离显示基板的一侧上；
    形成连接孔，所述连接孔被形成在所述非显示区中并贯穿所述显示基板和所述覆晶薄膜；以及
    在所述连接孔中形成电连接件，
    其中，所述覆晶薄膜通过所述电连接件与所述显示基板的电连接。
  13. 如权利要求12所述的制作方法，其中在所述显示基板上设置覆晶薄膜组件包括：
    通过接合层将覆晶薄膜附接到所述显示基板的第二面上，
    其中所述连接孔以及所述电连接件还贯穿所述接合层。
  14. 如权利要求12所述的制作方法，其中：
    所述显示基板还包括在所述非显示区中的第一端子，
    所述覆晶薄膜还包括第二端子，
    至少通过所述电连接件提供所述第一端子和所述第二端子的电连接。
  15. 如权利要求12所述的制作方法，其中：
    通过激光打孔工艺形成所述连接孔。
  16. 如权利要求12所述的制作方法，其中，所述显示基板是柔性显示基板。
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Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107037647B (zh) 2017-05-27 2022-06-17 京东方科技集团股份有限公司 一种显示面板、显示装置及显示面板的制作方法
CN106973520A (zh) 2017-05-27 2017-07-21 京东方科技集团股份有限公司 一种显示面板、显示装置及显示面板的制作方法
CN109559643A (zh) * 2017-09-26 2019-04-02 上海和辉光电有限公司 一种显示面板
CN109727534A (zh) * 2017-10-27 2019-05-07 京东方科技集团股份有限公司 绑定方法和显示装置
CN107833907B (zh) * 2017-11-21 2020-05-12 武汉华星光电半导体显示技术有限公司 一种柔性oled显示装置及封胶方法
CN108153069B (zh) * 2017-12-28 2020-04-10 惠州市华星光电技术有限公司 一种液晶面板及其制作方法、显示装置
CN108447891B (zh) * 2018-05-07 2021-03-16 京东方科技集团股份有限公司 一种显示面板的制作方法、显示面板及移印装置
CN108681119A (zh) * 2018-05-23 2018-10-19 Oppo广东移动通信有限公司 一种显示面板、显示装置以及显示装置的制作方法
US10692799B2 (en) * 2018-06-01 2020-06-23 Innolux Corporation Semiconductor electronic device
CN108811324A (zh) * 2018-08-27 2018-11-13 惠科股份有限公司 电路板组件、显示面板及显示装置
CN109244113B (zh) * 2018-09-18 2020-09-08 武汉华星光电半导体显示技术有限公司 阵列基板及其制造方法
CN109461382B (zh) 2018-12-03 2020-08-11 武汉华星光电半导体显示技术有限公司 可弯折面板及其制作方法
CN109679515B (zh) * 2018-12-24 2021-08-24 武汉华星光电半导体显示技术有限公司 各向异性导电胶膜及显示面板
CN110047899B (zh) * 2019-04-26 2021-10-22 京东方科技集团股份有限公司 显示面板、显示装置及制造方法
CN110164936B (zh) * 2019-05-28 2021-06-22 武汉华星光电半导体显示技术有限公司 显示面板及其制备方法
CN110391200B (zh) * 2019-08-09 2021-10-01 京东方科技集团股份有限公司 显示结构及其制备方法、显示装置
KR20210111381A (ko) * 2020-03-02 2021-09-13 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
KR20210145025A (ko) 2020-05-22 2021-12-01 삼성디스플레이 주식회사 전자 장치
CN111725265B (zh) * 2020-05-29 2022-05-31 武汉天马微电子有限公司 显示模组和显示装置
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CN114080686A (zh) * 2020-06-22 2022-02-22 京东方科技集团股份有限公司 显示面板及显示装置
CN113299184A (zh) * 2021-05-21 2021-08-24 维沃移动通信有限公司 显示模组和电子设备
CN113871435B (zh) * 2021-09-18 2023-05-02 武汉华星光电半导体显示技术有限公司 显示面板及其制备方法
CN114613827A (zh) * 2022-03-14 2022-06-10 苏州清越光电科技股份有限公司 一种显示面板及其显示装置
CN115032807B (zh) * 2022-08-11 2022-11-29 成都理工大学工程技术学院 一种立体成像装置及其制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130342099A1 (en) * 2012-06-25 2013-12-26 Apple Inc. Displays with Vias
CN103594485A (zh) * 2012-08-17 2014-02-19 苹果公司 窄边框有机发光二极管显示器
CN104035253A (zh) * 2014-05-26 2014-09-10 京东方科技集团股份有限公司 阵列基板及其制备方法、显示面板
CN104133307A (zh) * 2013-05-03 2014-11-05 启耀光电股份有限公司 显示面板及显示装置
CN104904327A (zh) * 2013-01-03 2015-09-09 苹果公司 电子设备的窄边框显示器
CN106973520A (zh) * 2017-05-27 2017-07-21 京东方科技集团股份有限公司 一种显示面板、显示装置及显示面板的制作方法
CN107039377A (zh) * 2017-06-16 2017-08-11 京东方科技集团股份有限公司 一种显示面板、其制作方法及显示装置
CN107037647A (zh) * 2017-05-27 2017-08-11 京东方科技集团股份有限公司 一种显示面板、显示装置及显示面板的制作方法
CN107093606A (zh) * 2017-03-31 2017-08-25 京东方科技集团股份有限公司 一种显示面板、显示装置及显示面板的制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7139060B2 (en) * 2004-01-27 2006-11-21 Au Optronics Corporation Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film
KR101633373B1 (ko) * 2012-01-09 2016-06-24 삼성전자 주식회사 Ｃｏｆ 패키지 및 이를 포함하는 반도체 장치
US9947739B2 (en) * 2014-09-16 2018-04-17 Boe Technology Group Co., Ltd. Display device array substrate without frame

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130342099A1 (en) * 2012-06-25 2013-12-26 Apple Inc. Displays with Vias
CN103594485A (zh) * 2012-08-17 2014-02-19 苹果公司 窄边框有机发光二极管显示器
CN104904327A (zh) * 2013-01-03 2015-09-09 苹果公司 电子设备的窄边框显示器
CN104133307A (zh) * 2013-05-03 2014-11-05 启耀光电股份有限公司 显示面板及显示装置
CN104035253A (zh) * 2014-05-26 2014-09-10 京东方科技集团股份有限公司 阵列基板及其制备方法、显示面板
CN107093606A (zh) * 2017-03-31 2017-08-25 京东方科技集团股份有限公司 一种显示面板、显示装置及显示面板的制作方法
CN106973520A (zh) * 2017-05-27 2017-07-21 京东方科技集团股份有限公司 一种显示面板、显示装置及显示面板的制作方法
CN107037647A (zh) * 2017-05-27 2017-08-11 京东方科技集团股份有限公司 一种显示面板、显示装置及显示面板的制作方法
CN107039377A (zh) * 2017-06-16 2017-08-11 京东方科技集团股份有限公司 一种显示面板、其制作方法及显示装置

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