WO2018210100A1 - 一种计算散热结构以及包括该结构的计算设备、矿场 - Google Patents

一种计算散热结构以及包括该结构的计算设备、矿场 Download PDF

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Publication number
WO2018210100A1
WO2018210100A1 PCT/CN2018/083956 CN2018083956W WO2018210100A1 WO 2018210100 A1 WO2018210100 A1 WO 2018210100A1 CN 2018083956 W CN2018083956 W CN 2018083956W WO 2018210100 A1 WO2018210100 A1 WO 2018210100A1
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WO
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Prior art keywords
heat dissipation
heat
computing device
fan
circuit board
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PCT/CN2018/083956
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English (en)
French (fr)
Inventor
张宁
张楠赓
Original Assignee
北京嘉楠捷思信息技术有限公司
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Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=59984512&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2018210100(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 北京嘉楠捷思信息技术有限公司 filed Critical 北京嘉楠捷思信息技术有限公司
Priority to US16/614,054 priority Critical patent/US11425839B2/en
Publication of WO2018210100A1 publication Critical patent/WO2018210100A1/zh
Priority to US17/872,172 priority patent/US11895802B2/en
Priority to US18/301,380 priority patent/US11882669B2/en
Priority to US18/544,346 priority patent/US20240121910A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
    • F04D27/004—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids by varying driving speed
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/30—Monitoring
    • G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks

Definitions

  • the present invention relates to the field of heat dissipation technologies, and in particular, to a computing device and a computing heat dissipation structure thereof, and to a mine formed by a plurality of the computing devices.
  • the heat dissipation method generally adopts air-cooling, and a heat-dissipating heat-dissipating material is mounted on the high-heat-generating component, and then the fan is actively radiated.
  • the Chinese utility model patent with the patent number ZL201520353408.7 discloses a chip heat sink, a virtual digital coin mining machine and a computing device.
  • the chip heat sink comprises a chip soldered on the front side of the printed circuit board, a first heat sink and a second.
  • the heat sink, the first heat sink is connected to the top of the chip for heat dissipation
  • the second heat sink is connected to the back of the printed circuit board and the corresponding part of the bottom of the chip for heat dissipation.
  • the electric fan is located on both sides of the chassis of the virtual digital coin mining machine to take away the chip work. The heat ensures the normal operation of the mining machine.
  • the technical problem to be solved by the present invention is to provide a computing heat dissipation structure and a computing device and a mine field including the structure, which can balance the heat dissipation efficiency of each heat generating component and reduce the load of the fan.
  • the computing heat dissipation structure of the present invention comprises a circuit board and a heat sink, the circuit board includes a plurality of heat generating components, and the heat sink is disposed corresponding to the circuit board, wherein a spacing between adjacent heat generating components and the phase The heat dissipation efficiency of the area where the adjacent heating components are located is negatively correlated.
  • the circuit board includes a first side and a second side, wherein when the circuit board is in an operating state, the first side has a heat output greater than the second The amount of heat output from the side.
  • the heat sink includes a main body heat sink and an auxiliary heat sink, and the main body heat sink carries the circuit board, and the auxiliary heat sink presses the circuit board onto the main body heat sink.
  • the auxiliary heat sink presses the circuit board onto the main body heat sink by elastic pressing.
  • a heat conductive material is filled between the auxiliary heat sink and the gap of the circuit board.
  • the heat conductive material is a thermal grease or a thermal pad.
  • the heat dissipation efficiency of the main body heat sink is higher than the heat dissipation efficiency of the auxiliary heat sink, and the main body heat sink is disposed corresponding to the first side surface, and the auxiliary heat sink corresponds to the heat dissipation sheet.
  • the second side setting is described.
  • the main body heat sink includes a first heat dissipation body and a first heat dissipation fin
  • the first heat dissipation body includes a first surface and a second surface
  • the first surface and the first surface A heat sink fin is connected
  • the second surface is connected to the first side.
  • the auxiliary heat sink includes a second heat dissipation body and a second heat dissipation fin
  • the second heat dissipation body includes a third surface and a fourth surface
  • the third surface is connected to the second heat dissipation fin, the fourth surface Connected to the second side.
  • the auxiliary heat sink is provided in plurality, and each of the auxiliary heat sinks is disposed corresponding to one or more of the heat generating components.
  • the computing device of the present invention includes a device housing that encloses a closed heat dissipation air duct.
  • the computing device further includes the above-described computing heat dissipation structure, wherein the computing heat dissipation structure is located in the heat dissipation air duct.
  • a temperature detecting unit for measuring a temperature in the heat dissipating air passage is installed in the heat dissipating air passage.
  • the controller further includes a controller and a fan, the controller includes a fan control module, and the temperature detecting unit and the fan are respectively electrically connected to the fan control module, wherein the fan control module is configured according to the The real-time temperature in the heat dissipation air passage detected by the temperature detecting unit dynamically adjusts the rotation speed of the fan.
  • the heat dissipation air duct includes an air inlet and an air outlet, and the first panel assembly is installed at the air inlet, and the second panel assembly is installed at the air outlet, wherein the first panel assembly And the second panel assembly is configured to fix the heat sink in the heat dissipation air duct.
  • the fan includes a first fan, and the first fan is disposed at the air inlet and connected to the first panel assembly.
  • the fan includes a second fan, and the second fan is disposed at the air outlet and connected to the second panel assembly.
  • the heat dissipation air channel includes a plurality of temperature zones, and the temperature detecting units are plurality and are respectively disposed in each of the temperature zones.
  • the controller further includes a chip control module, wherein the chip control module is electrically connected to each of the temperature detecting units, wherein the chip control module detects according to each of the temperature detecting units
  • the real-time temperature of each temperature zone dynamically adjusts the operating frequency of the heating components in each temperature zone.
  • the computing heat dissipation structure is at least one.
  • the mine of the present invention includes at least one rack on which at least one computing device is disposed, wherein the computing device is the computing device described above.
  • the present invention has the following advantages: using the calculation heat dissipation structure and the computing device provided by the present invention, since the spacing of adjacent heating components is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, that is, the phase The greater the heat dissipation efficiency of the area where the adjacent heating element is located, the smaller the spacing between adjacent heating elements in the area. Thereby, the heat dissipation efficiency of each heat generating component is balanced, and the load of the fan is reduced. Furthermore, with the mine provided by the present invention, even if a large number of computing devices are gathered in the same space, the problem of overheating damage of the heat generating components does not occur.
  • the invention dynamically controls the power of the fan and the operating frequency of the heating components in different temperature zones by the temperature data fed back by the temperature detecting unit, further balances the heat dissipation efficiency of different regions in the heat dissipation air channel, and improves the heat generating component and the whole. The life of the circuit and the fan.
  • FIG. 1 is a schematic structural view of an embodiment of a heat dissipation structure of the present invention
  • FIG. 2 is a schematic structural diagram of an embodiment of a computing device of the present invention.
  • FIG. 3 is a schematic diagram of deployment of a heat generating component on a circuit board in the prior art
  • FIG. 4 is a working effect diagram of a heat generating component on the circuit board of FIG. 3;
  • FIG. 5 is a schematic view showing the deployment of a heat generating component on a circuit board of the present invention
  • FIG. 6 is a working effect diagram of a heat generating component on the circuit board of FIG. 5;
  • FIG. 7 is a schematic structural diagram of an embodiment of a computing device of the present invention.
  • FIG. 8 is a schematic structural diagram of an embodiment of a computing device of the present invention.
  • FIG. 9 is a schematic structural view of an embodiment of a computing heat dissipation structure according to the present invention.
  • FIG. 10 is a schematic structural diagram of an embodiment of a computing device of the present invention.
  • Figure 11 is a schematic view showing the structure of an embodiment of the mine of the present invention.
  • the heat dissipation structure 100 includes a circuit board 110 and a heat sink 120.
  • the circuit board 110 includes a plurality of heat generating components 111.
  • the pitch of the adjacent heat generating components 111 is negatively correlated with the heat dissipation efficiency of the region where the adjacent heat generating component 111 is located.
  • FIG. 2 is a schematic structural diagram of an embodiment of a computing device according to the present invention, wherein the computing device includes a computing heat dissipation structure as described in FIG.
  • the computing device 10 includes a device housing 11 and a computing heat dissipation structure 100 that encloses a closed heat dissipation air duct 12, wherein the calculated heat dissipation structure 100 is located in the enclosed heat dissipation air duct 12.
  • FIG. 3 and FIG. 4 are schematic diagrams showing the deployment of the heating components on the circuit board in the prior art, wherein, as shown in the figure, the left side of the circuit board 110A is close to the air outlet, and the right side is close to the air inlet, as shown in FIG.
  • the plurality of heat generating components 111A deployed are equally spaced, and the temperature difference between the air outlet and the air inlet is large.
  • the temperature of the heat generating component at the air inlet is 87 degC, and the highest temperature has reached 104 degC at a position close to the air outlet. It can be seen that the heat generating component 111A has uneven heat dissipation. When some of the heat-generating components 111A have a high temperature due to low heat dissipation efficiency, the overall circuit operation may be unstable, the working life may be shortened, and the performance may be degraded.
  • FIG. 5 and FIG. 6 are schematic diagrams showing the deployment of the heat generating components on the circuit board of the computing device of the present invention.
  • the left side of the circuit board 110 proposed by the present invention is close to the air outlet, and the right side is close to the air inlet.
  • a plurality of heat generating components 111 are disposed on the circuit board 110, and the heat generating components 111 are disposed unequally, and the spacing between adjacent heat generating components and the heat dissipation efficiency of the area where the adjacent heat generating components are located are shown. Negative correlation, therefore, the spacing of adjacent heating components at the air inlet is small, and the spacing of adjacent heating components at the air outlet is large. Thereby, the temperature of each of the heat generating components 111 on the circuit board can be equalized.
  • the calculated heat dissipation structure of the heat-generating components provided by the unequal distance provided in the present invention is the same as the structure of the equally-spaced arrangement shown in FIG. 3 and FIG. 4, and the maximum temperature is 98.7 deg C. The lowest temperature is 96.9degC. It can be seen that, in the case of the same fan rotation speed, the structure of the unequal-spaced heat-generating component provided by the present invention can maintain the temperature of the heat-dissipating components in each area substantially balanced.
  • the deployment pitch of the heating components in each area of the circuit board can be obtained through a large number of simulation experiments.
  • the beneficial effects of the present invention are as follows: since the spacing between adjacent heating components is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, that is, the heat dissipation efficiency of the region where the adjacent heating components are located is larger, the region is adjacent The smaller the spacing of the heating components. Thereby, the heat dissipation efficiency of each heat generating component is balanced, and the load of the fan is reduced.
  • the circuit board 110 that calculates the heat dissipation structure 100 includes a first side 1101 and a second side 1102. As shown in FIG. 2, when the circuit board 110 is in an operating state, the amount of heat output of the first side 1101 is greater than the amount of heat output of the second side 1102.
  • the heat sink 120 includes a main body fin 121 and an auxiliary fin 122 , wherein the main body fin 121 has a higher heat dissipation efficiency than the auxiliary fin 122 .
  • the main body fins 121 are used to carry the circuit board 110, so as to play the role of heat dissipation and support the air duct structure, and at the same time, play the role of heat dissipation and support.
  • the auxiliary heat sink 122 is used to press the circuit board 110 onto the main body heat sink 121, thereby functioning as a heat sink and fixing the circuit board 110.
  • the beneficial effect of the embodiment is that the main body heat sink not only plays a heat dissipation function, but also can carry the circuit board, thereby eliminating the need to additionally provide other structures for carrying the circuit board, thereby saving cost.
  • the auxiliary heat sink 122 presses the circuit board 110 to the main body heat sink 121 by elastic pressing.
  • a pressing method it is possible to perform a fixing function, and at the same time, since the pressure applied to the heat generating component 111 is small, the heat generating component 111 is not easily damaged.
  • the heat dissipation material 130 is filled between the auxiliary heat sink 122 and the gap of the circuit board 110, and the heat conductive material 130 is, for example, a thermal grease or a thermal pad.
  • auxiliary heat sink 122 presses the circuit board 110 to the main body heat sink 121 by elastic pressing, there is an inevitable gap between the auxiliary heat sink 122 and the circuit board 110, which affects the heat dissipation effect.
  • a thermal grease or a thermal pad is filled between the auxiliary fins 122 and the gap of the circuit board 110.
  • the gap between the auxiliary heat sink 122 and the circuit board 110 is filled by the thermal grease or the thermal pad to increase the heat dissipation area of the circuit board 110 in a disguised manner, thereby further enhancing the heat dissipation effect of the circuit board 110.
  • the beneficial effect of the embodiment is that the heat conductive material is filled between the auxiliary heat sink and the gap of the circuit board, thereby further enhancing the heat dissipation effect of the circuit board.
  • the first heat sink 121 can be disposed corresponding to the heat output of the circuit board 110 .
  • the side surface 1101 is disposed, and the auxiliary heat sink 122 is disposed corresponding to the second side surface 1102 of the circuit board 110 having a small heat output amount, which contributes to uniform heat dissipation of the circuit board 110.
  • the main body heat sink 121 includes a first heat dissipation body 1211 and a first heat dissipation fin 1212.
  • the first heat dissipation body 1211 includes opposite first and second faces, and the first surface of the first heat dissipation body 1211 is first and first.
  • the heat dissipation fins 1212 are connected, and the second surface of the first heat dissipation body 1211 is connected to the first side surface 1101 of the circuit board 110.
  • the auxiliary heat sink 122 includes a second heat dissipation body 1221 and a second heat dissipation fin 1222.
  • the second heat dissipation body 1221 includes opposite third and fourth faces, the third surface of the second heat dissipation body 1221 is connected to the second heat dissipation fin 1222, and the fourth surface of the second heat dissipation body 1221 and the second surface of the circuit board 110 Side 1102 is connected.
  • the beneficial effects of the embodiment are: connecting the main heat sink with high heat dissipation efficiency to the first side with a large heat output in the circuit board, and the heat output of the auxiliary heat sink with low heat dissipation efficiency and the circuit board is small.
  • the second side of the connection is connected to balance the heat on both sides of the board, thereby further balancing the heat in various areas of the heat dissipation duct.
  • computing device 20 includes a device housing 21 and a computing heat dissipation structure 100 that encloses a closed heat dissipation air duct 22 that is located in the heat dissipation air duct 22.
  • the temperature detecting unit 23 is installed in the heat dissipating air passage 22, and the temperature detecting unit 23 is used to measure the temperature in the heat dissipating air passage 22.
  • the computing device 30 includes a device housing 31 and a computing heat dissipation structure 100 that encloses a closed heat dissipation air duct 32 that is located in the heat dissipation air duct 32.
  • a plurality of temperature detecting units 33 for measuring the temperature in the heat dissipating air passages 32 are installed in the heat dissipating air passages 32.
  • the plurality of temperature detecting units 33 are disposed in different areas in the heat dissipating air passages 32 to detect the temperatures of the different areas in real time.
  • a temperature detecting unit is installed in the heat dissipating air passage for recording the temperature in the heat dissipating air passage. Therefore, during the operation of the computing device, the user can know the temperature in the heat dissipation air channel, and then adjust the fan speed.
  • the computing device 20 further includes a controller and a fan 24.
  • the controller includes a fan control module, and the temperature detecting unit 23 and the fan 24 are electrically connected to the fan control module, respectively.
  • the fan control module dynamically adjusts the rotation speed of the fan 24 according to the temperature in the heat dissipation air passage 22 detected by the temperature detecting unit 23, so as to prevent the fan 24 from maintaining a high rotation speed for a long time, thereby reducing power consumption.
  • the fan control module automatically adjusts or gives an instruction to manually adjust the rotational speed of the fan.
  • the heat dissipation air duct 22 includes an air inlet 221 and an air outlet 222 .
  • the first panel assembly 25 is mounted at the air inlet 221
  • the second panel assembly 26 is mounted at the air outlet 222 .
  • the first panel assembly 25 and the second panel assembly 26 are used to fix the heat sink 120, that is, the main body fins 121 and the auxiliary fins 122, in parallel in the heat dissipation air duct 22.
  • the fan 24 described above is fixed to the first panel assembly 25 at the air inlet 221, for example.
  • the computing device 20 further includes a fan 27 disposed at the air outlet 222 and coupled to the second panel assembly 26.
  • the fan 24 and the fan 27 are respectively disposed at two ends of the computing device 20, the fan 24 at the air inlet 221 is blown, the fan 27 at the air outlet 222 is sucked, and the heat dissipation air duct 22 forms a faster and smoother heat dissipation. The airflow and heat dissipation effect are further improved.
  • the position and number of the fan arrangement of the present invention can be adjusted as needed.
  • the fan 27 can be disposed only at the air outlet 222 to suck air, and can be set only at the air outlet 221.
  • the fan 24 is provided with a fan, and a fan may be disposed at both the air outlet 222 and the air inlet 221 to enhance the airflow.
  • the present invention does not limit this.
  • the heat dissipation air channel 32 is divided into three temperature zones, for example, a first temperature zone A, a second temperature zone B, and a third temperature zone C, and the temperature detecting unit is set, for example, to Three, respectively temperature detecting units 33A, 33B, and 33C, and temperature detecting units 33a, 33B, and 33c detect the temperatures of the first temperature zone A, the second temperature zone B, and the third temperature zone C of the heat dissipation air passage 32, respectively.
  • each temperature zone can also correspond to more than one temperature detecting unit.
  • the first temperature zone A, the second temperature zone B, and the third temperature zone C respectively correspond to a part of the heat generating component on the circuit board 110.
  • the controller of the computing device 30 further includes a chip control module electrically coupled to the temperature detecting units 33A, 33B, and 33C, wherein the chip control module detects the heat radiation channels 32 detected by the temperature detecting unit 33A, 33B, and 33C.
  • the temperatures of the different temperature zones A, B, and C dynamically adjust the operating frequency of the heat generating components in the temperature zones in which the temperature detecting units 23A, 23B, and 23C are located.
  • the chip control module controls the operating frequency of the portion of the heat generating component 111C corresponding to the third temperature zone C to decrease, thereby reducing the portion of the heat generating component.
  • the heat generation of the 111C further equalizes the heat dissipation efficiency of each of the heat generating components.
  • the life of the heat-generating component can be prolonged by reducing the operating frequency of the heat-generating component in the overheated region, and the excessive noise caused by the fan being overloaded for a long time is avoided, and the damage of the fan and the circuit affects the overall working efficiency. problem.
  • FIG. 9 is a schematic structural view of an embodiment of a computing heat dissipation structure of the present invention.
  • the heat dissipation structure 200 includes a circuit board 210 and a heat sink.
  • the circuit board 210 is provided with a plurality of heat generating components 211.
  • the heat generating components 211 are disposed at different intervals, and the spacing between the adjacent heat generating components 211 and the adjacent heat generating elements.
  • the heat dissipation efficiency of the region in which the device 211 is located is inversely correlated.
  • the heat sink includes a main body heat sink (not shown) and an auxiliary heat sink 222 respectively disposed on two sides of the circuit board 210, wherein the auxiliary heat sink 222 is a plurality, and each of the auxiliary heat sinks 222 corresponds to one heat generating component. 211 settings.
  • each of the auxiliary heat sinks 222a may also be disposed corresponding to the plurality of heat generating components 211. It should be noted that, in different embodiments, the number of the circuit boards 210 may be one or more, and the present invention is not limited thereto.
  • the computing device shown in Figures 1, 7, and 8 may include only one computational heat dissipation structure in the heat dissipation air duct.
  • the computing device 40 as shown in FIG. 10, may also be included, including two computing heat dissipation structures 100a, 100b within the heat dissipation air duct 42, and the two computing heat dissipation structures 100a, 100b may be symmetrically disposed.
  • more computational heat dissipation structures can also be included.
  • the computing device of the present invention may be a computing device for a mining machine for virtual currency mining, and the mine of the present invention refers to a location where a large number of mining machines are gathered for virtual currency mining.
  • the structure of an embodiment of the mine of the present invention is shown in Fig. 11.
  • the mine site 1 includes at least one rack 1A on which at least one computing device of the present invention, such as computing device 10, is disposed.
  • the computing device can be disposed on the support frame 1A in a plurality of manners, such as side by side, stacking, and the like.
  • the structure and form of the support frame 1A are not limited to the drawings.
  • the spacing between adjacent heating components is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, that is, the heat dissipation efficiency of the region where the adjacent heating components are located is larger.
  • the smaller the pitch of adjacent heat-generating components in the region the lower the heat dissipation efficiency of each heat-generating component and the lower the load of the fan.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
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  • Computer Hardware Design (AREA)
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  • Quality & Reliability (AREA)
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Abstract

本发明涉及一种计算散热结构以及包括该结构的计算设备、矿场，计算散热结构包括电路板和对应电路板设置的散热器，电路板包括多个发热元器件，相邻发热元器件的间距与相邻发热元器件所处区域的散热效率负相关。本发明的计算设备包括设备外壳和上述的计算散热结构，设备外壳围合形成封闭的散热风道，计算散热结构位于封闭散热风道中。由于本发明相邻发热元器件的间距与相邻发热元器件所处区域的散热效率负相关，即相邻发热元器件所处区域的散热效率越大，则该区域相邻发热元器件的间距越小。从而均衡了各发热元器件的散热效率，降低了风扇的负荷。进而，本发明提供的矿场虽然在同一空间聚集了大量的计算设备也不会出现发热元器件过热损坏的问题。

Description

一种计算散热结构以及包括该结构的计算设备、矿场 技术领域
本发明涉及散热技术领域，特别涉及一种计算设备及其计算散热结构，本发明还涉及一种由多个该计算设备形成的矿场。
背景技术
现代计算设备中，元器件集成度越来越高，设备上部署的元器件个数也越来越多，在设备运行时，发热量也越来越大。在高温环境下，元器件散热不好或不同位置的元器件散热不均匀，就会导致整体电路工作不稳定，性能降低，且工作寿命变短。因此，现代计算设备对于散热有着极高的要求。
目前采用的散热方式一般为风冷，在高发热元器件上贴装高导热效率材质的散热片，再通过风扇主动散热。如专利号为ZL201520353408.7的中国实用新型专利公开了一种芯片散热装置、虚拟数字币挖矿机及计算设备，芯片散热装置包括焊接在印刷电路板正面的芯片、第一散热器和第二散热器，第一散热器与芯片顶部连接散热，第二散热器与印刷电路板背面和芯片底部对应部分连接散热，电风扇位于虚拟数字币挖矿机的机箱两侧，以带走芯片工作产生的热量，保证挖矿机的正常工作。
然而，现有技术中，由于芯片元器件是等间距部署在电路板上，且相对风道的位置不同，所以，进、出风口的温度差距较大，均温效果差，基于此，现通常通过增大风扇的转速来增加空气流动速度，从而保证最热的区域的温度满足使用需要，但是这样的做法又增加了风扇的负荷。
发明公开
本发明所要解决的技术问题是：提供一种计算散热结构以及包括该结构的计算设备、矿场，能够均衡各发热元器件的散热效率，降低风扇的负荷。
为了解决上述技术问题，本发明的计算散热结构包括电路板以及散热器，电路板包括多个发热元器件，散热器对应所述电路板设置，其中，相邻发热元 器件的间距与所述相邻发热元器件所处区域的散热效率负相关。
上述的计算散热结构的一实施方式中，所述电路板包括第一侧面和第二侧面，其中，当所述电路板处于工作状态时，所述第一侧面的热量输出量大于所述第二侧面的热量输出量。
上述的计算散热结构的一实施方式中，所述散热器包括主体散热片以及辅助散热片，主体散热片承载所述电路板，辅助散热片将所述电路板压紧到所述主体散热片上。
上述的计算散热结构的一实施方式中，所述辅助散热片通过弹性压紧方式将所述电路板压紧到所述主体散热片上。
上述的计算散热结构的一实施方式中，所述辅助散热片与所述电路板的空隙之间填充有导热材料。
上述的计算散热结构的一实施方式中，所述导热材料为导热硅脂或导热胶垫。
上述的计算散热结构的一实施方式中，所述主体散热片的散热效率高于所述辅助散热片的散热效率，所述主体散热片对应所述第一侧面设置，所述辅助散热片对应所述第二侧面设置。
上述的计算散热结构的一实施方式中，所述主体散热片包括第一散热主体以及第一散热鳍片，第一散热主体包括第一面和第二面，所述第一面与所述第一散热鳍片连接，所述第二面与所述第一侧面连接。所述辅助散热片包括第二散热主体以及第二散热鳍片，第二散热主体包括第三面和第四面，所述第三面与所述第二散热鳍片连接，所述第四面与所述第二侧面连接。
上述的计算散热结构的一实施方式中，所述辅助散热片为多个，每一个所述辅助散热片对应一个或多个所述发热元器件设置。
本发明的计算设备包括设备外壳，所述设备外壳围合形成封闭的散热风道，该计算设备还包括上述的计算散热结构，其中，所述计算散热结构位于所述散热风道中。
上述的计算设备的一实施方式中，所述散热风道内安装有用于测量所述散热风道内温度的温度检测单元。
上述的计算设备的一实施方式中，还包括控制器以及风扇，控制器包括风 扇控制模块，所述温度检测单元以及风扇分别与所述风扇控制模块电连接，其中，所述风扇控制模块根据所述温度检测单元检测的所述散热风道内的实时温度动态调整所述风扇的转速。
上述的计算设备的一实施方式中，所述散热风道包括入风口以及出风口，入风口处安装有第一面板组件，出风口处安装有第二面板组件，其中，所述第一面板组件和所述第二面板组件用于将所述散热器固定于所述散热风道内。
上述的计算设备的一实施方式中，所述风扇包括第一风扇，所述第一风扇设置于所述入风口处，并连接在所述第一面板组件上。
上述的计算设备的一实施方式中，所述风扇包括第二风扇，所述第二风扇设置于所述出风口处，并连接在所述第二面板组件上。
上述的计算设备的一实施方式中，所述散热风道包括多个温区，所述温度检测单元为多个且分别设置于各所述温区内。
上述的计算设备的一实施方式中，所述控制器还包括芯片控制模块，所述芯片控制模块与各所述温度检测单元电连接，其中，所述芯片控制模块根据各所述温度检测单元检测的各温区的实时温度，动态调整各温区内的发热元器件的工作频率。
上述的计算设备的一实施方式中，所述计算散热结构至少为一个。
本发明的矿场包括至少一个设置架，所述设置架上至少设置一个计算设备，其中，所述计算设备为上述的计算设备。
本发明与现有技术相比具有以下优点：采用本发明所提供的计算散热结构以及计算设备，由于相邻发热元器件的间距与相邻发热元器件所处区域的散热效率负相关，即相邻发热元器件所处区域的散热效率越大，则该区域相邻发热元器件的间距越小。从而均衡了各发热元器件的散热效率，降低了风扇的负荷。进而，采用本发明提供的矿场，即使在同一空间聚集了大量的计算设备也不会出现发热元器件过热损坏的问题。
进一步地，本发明通过温度检测单元反馈的温度数据，动态控制风扇的功率以及不同温区内发热元器件的工作频率，进一步均衡了散热风道内不同区域的散热效率，提高了发热元器件、整体电路以及风扇的使用寿命。
以下结合附图和具体实施例对本发明进行详细描述，但不作为对本发明的 限定。
附图简要说明
图1为本发明的计算散热结构的一实施例的结构示意图；
图2为本发明的计算设备的一实施例的结构示意图；
图3为现有技术中电路板上发热元器件的部署示意图；
图4为图3所述电路板上发热元器件工作效果图；
图5为本发明中电路板上发热元器件的部署示意图；
图6为图5所述电路板上发热元器件工作效果图；
图7为本发明的计算设备的一实施例的结构示意图；
图8为本发明的计算设备的一实施例的结构示意图；
图9为本发明的计算散热结构的一实施例的结构示意图；
图10为本发明的计算设备的一实施例的结构示意图；
图11为本发明的矿场的一实施例的结构示意图。
实现本发明的最佳方式
下面结合附图和具体实施例对本发明技术方案进行详细的描述，以更进一步了解本发明的目的、方案及功效，但并非作为本发明所附权利要求保护范围的限制。
本说明书公开了一个或多个包含本发明特点的实施例。公开的实施例仅仅用于举例说明。本发明的保护范围并不限于所公开的实施例。本发明由所附权利要求来限定。
说明书中针对“一个实施例”、“实施例”、“示例实施例”等的引用，指的是描述的该实施例可包括特定的特征、结构或特性，但是不是每个实施例必须包含这些特定特征、结构或特性。此外，这样的表述并非指的是同一个实施例。进一步，在结合实施例描述特定的特征、结构或特性时，不管有没有明确的描述，已经表明将这样的特征、结构或特性结合到其它实施例中是在本领域技术人员的知识范围内的。
在说明书及后续的权利要求书中使用了某些词汇来指称特定组件或部件， 本领域普通技术的员应可理解，技术使用者或制造商可以不同的名词或术语来称呼同一个组件或部件。本说明书及后续的权利要求书并不以名称的差异来作为区分组件或部件的方式，而是以组件或部件在功能上的差异来作为区分的准则。在通篇说明书及后续的权利要求项中所提及的“包括”和“包含”为一开放式的用语，故应解释成“包含但不限定于”。以外，“连接”一词在此包含任何直接及间接的电性连接手段。间接的电性连接手段包括通过其它装置进行连接。
需要说明的是，在本发明的描述中，术语“横向”、“纵向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，并不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
图1为本发明的计算散热结构的一实施例的结构示意图，如图1所示，计算散热结构100包括电路板110以及散热器120，电路板110包括多个发热元器件111。其中，相邻发热元器件111的间距与相邻发热元器件111所处区域的散热效率负相关。
图2为本发明的计算设备的一实施例的结构示意图，其中，计算设备包括如图1所述的计算散热结构。
如图2所示，计算设备10包括设备外壳11和计算散热结构100，设备外壳11围合形成封闭的散热风道12，其中，计算散热结构100位于封闭的散热风道12中。
图3以及图4为现有技术中电路板上发热元器件的部署示意图，其中，如图所示，电路板110A左侧靠近出风口，右侧靠近入风口，如图3所示，设备上部署的多个发热元器件111A是等间距的，而出风口和入风口的温差较大。结合图3以及图4，在入风口处的发热元器件的温度为87degC，而到了距离出风口较近位置处，最高温度已达到104degC，可见，发热元器件111A散热不均匀。而当某些发热元器件111A由于散热效率较低而导致温度过高，就可能导致整体电路工作不稳定，工作寿命变短，性能降低。
如图5和图6所示，图5和图6为本发明的计算设备的电路板上的发热元器件的部署示意图。如图所示，本发明提出的电路板110的左侧靠近出风口，右侧靠近入风口。如图所示，电路板110上部署了多个发热元器件111，而这些发热元器件111是不等距部署的，相邻发热元器件的间距与相邻发热元器件所处区域的散热效率负相关，因此，在入风口处相邻发热元器件的间距较小，在出风口处相邻发热元器件的间距较大。从而能够均衡电路板上各个发热元器件111的温度。
从图可见，通过本发明中所提供的不等距部署发热元器件的计算散热结构，与图3和图4所示的等间距部署的结构在风扇转速相同的情况下，最高温度为98.7degC，最低温度为96.9degC。可见，在风扇转速相同的情况下，本发明所提供的不等距部署发热元器件的结构能够使各区域散热元器件的温度保持基本均衡。
本实施例中电路板各个区域发热元器件的部署间距可以通过大量的仿真实验得到。
本发明的有益效果在于：由于相邻发热元器件的间距与相邻发热元器件所处区域的散热效率负相关，即相邻发热元器件所处区域的散热效率越大，则该区域相邻发热元器件的间距越小。从而均衡了各发热元器件的散热效率，降低了风扇的负荷。
在一个实施例中，如图1所示，计算散热结构100的电路板110包括第一侧面1101和第二侧面1102。如图2所示，当所述电路板110处于工作状态时，第一侧面1101的热量输出量大于第二侧面1102的热量输出量。
在一个实施例中，如图1所示，散热器120包括主体散热片121和辅助散热片122，其中主体散热片121的散热效率高于辅助散热片122。
本实施例中，主体散热片121用来承载电路板110，从而既可以起到散热作用，又承担风道结构的支撑作用，同时起到了散热和支撑两个作用。
而辅助散热片122用来将电路板110压紧到主体散热片121上，既可以起到散热作用，又可以起到将电路板110固定的作用。
本实施例的有益效果在于：主体散热片既起到了散热作用，又能够承载电路板，从而，无需额外设置其他承载电路板的结构，节省了成本。
为避免对发热元器件111的损坏，本实施例中，辅助散热片122通过弹性压紧的方式将电路板110压紧到主体散热片121上。通过这样的压紧方式，既可以起到固定作用，同时，由于发热元器件111受到的压力较小，使得发热元器件111不易损坏。
在一个实施例中，如图1所示，辅助散热片122与电路板110的空隙之间填充有导热材料130，导热材料130例如为导热硅脂或导热胶垫。
本实施例中，由于辅助散热片122通过弹性压紧方式将电路板110压紧到主体散热片121上，因此，辅助散热片122与电路板110之间不可避免的存在空隙，影响散热效果。考虑到这样的情况，在辅助散热片122与电路板110的空隙之间填充导热硅脂或者导热胶垫。而通过导热硅脂或导热胶垫填充辅助散热片122与电路板110之间的空隙，变相地增大了电路板110的散热面积，进一步增强了电路板110的散热效果。
本实施例的有益效果在于：在辅助散热片和电路板空隙之间填充导热材料，进一步增强了电路板的散热效果。
在一个实施例中，如图1所示，由于设置主体散热片121的散热效率高于辅助散热片122的散热效率，可设置主体散热片121对应电路板110的热量输出量较大的第一侧面1101设置，辅助散热片122对应电路板110的热量输出量较小的第二侧面1102设置，有助于电路板110的均匀散热。
具体地，主体散热片121包括第一散热主体1211和第一散热鳍片1212，第一散热主体1211的包括相对的第一面和第二面，第一散热主体1211的第一面与第一散热鳍片1212连接，第一散热主体1211的第二面与电路板110的第一侧面1101连接。辅助散热片122包括第二散热主体1221和第二散热鳍片1222。第二散热主体1221包括相对的第三面和第四面，第二散热主体1221的第三面与第二散热鳍片1222连接，第二散热主体1221的第四面与电路板110的第二侧面1102连接。
本实施例的有益效果在于：将散热效率较高的主体散热片与电路板中热量输出量较大的第一侧面连接，将散热效率较低的辅助散热片与电路板中热量输出量较小的第二侧面连接，从而均衡了电路板两面的热量，进而进一步均衡了散热风道内各个区域的热量。
在一个实施例中，如图7所示，计算设备20包括设备外壳21和计算散热结构100，设备外壳21围合形成封闭的散热风道22，计算散热结构100位于散热风道22中。其中，散热风道22内安装有温度检测单元23，温度检测单元23用于测量散热风道22内的温度。
在一个实施例中，如图8所示，计算设备30包括设备外壳31和计算散热结构100，设备外壳31围合形成封闭的散热风道32，计算散热结构100位于散热风道32中。散热风道32内安装有多个用于测量散热风道32内温度的温度检测单元33，多个温度检测单元33设置于散热风道32内的不同区域，以实时检测不同区域的温度。
本实施例中，在散热风道内安装了温度检测单元，用来记录散热风道中的温度。从而，在计算设备工作过程中，能够使用户获知散热风道内的温度，进而对风扇转速进行调整。
在一实施例中，如图7所示，计算设备20还包括控制器和风扇24，控制器包括风扇控制模块，温度检测单元23以及风扇24分别与风扇控制模块电连接。其中，风扇控制模块根据温度检测单元23检测的散热风道22内的温度动态调整风扇24的转速，避免风扇24长时间保持较高转速，进而减少了电能损耗。
本实施例中，根据温度检测单元反馈的温度，通过风扇控制模块自动调整或下达指令手动调节风扇的转速。
在一个实施例中，如图7所示，散热风道22包括入风口221和出风口222，入风口221处安装有第一面板组件25，出风口222处安装有第二面板组件26。第一面板组件25和第二面板组件26用于将散热器120，即主体散热片121和辅助散热片122平行固定于散热风道22内。
其中，上述的风扇24例如固定在入风口221处的第一面板组件25上。
在一个实施例中，如图7所示，计算设备20还包括风扇27，风扇27设置于出风口222处，并连接在第二面板组件26上。
本实施例中，计算设备20的两端分别设置风扇24和风扇27，入风口221处的风扇24吹风，出风口222处的风扇27吸风，散热风道22内形成更快更流畅的散热气流，散热效果进一步提升。
根据上述各实施例，需说明的是，本发明的风扇设置的位置和数量是可以根据需要调整的，例如可以仅在出风口222处设置风扇27以吸风，可以仅在出风口221处设置风扇24以吹风，亦可以在出风口222与入风口221均设置风扇以增强气流，本发明对此不予以限制。
在一个实施例中，如图8所示，散热风道32例如分为三个温区，分别为第一温区A、第二温区B以及第三温区C，温度检测单元例如设置为三个，分别为温度检测单元33A、33B以及33C，温度检测单元33a、33B以及33c分别检测散热风道32的第一温区A、第二温区B以及第三温区C的温度。当然，每一温区亦可对应不止一个温度检测单元。
其中，第一温区A、第二温区B以及第三温区C内分别对应电路板110上的一部分的发热元器件。
计算设备30的控制器还包括芯片控制模块，芯片控制模块与温度检测单元33A、33B以及33C电连接，其中，芯片控制模块根据温度检测单元检测33A、33B以及33C检测的散热风道32内的不同温区A、B、C的温度，动态调整该温度检测单元23A、23B以及23C所处温区内的发热元器件的工作频率。
例如，当温度检测单元33C检测到其所在第三温区C的温度过高时，芯片控制模块控制第三温区C所对应部分发热元器件111C的工作频率降低，以减少该部分发热元器件111C的发热量，进而均衡各发热元器件的散热效率。
本实施例中，通过降低部分处于过热区域的发热元器件的工作频率能够延长发热元器件寿命，且避免了风扇长时间超负荷工作造成的噪音过大，以及风扇、电路损坏影响整体工作效率的问题。
在一个实施例中，如图9所示，图9为本发明的计算散热结构的一实施例的结构示意图。其中，计算散热结构200包括电路板210和散热器，电路板210上设置有多个发热元器件211，各发热元器件211不等间距部署，相邻发热元器件211的间距与相邻发热元器件211所处区域的散热效率负相关。
散热器包括分别设置于电路板210的两个侧面的主体散热片(图未示)和辅助散热片222，其中，辅助散热片222为多个，且每一个辅助散热片222对应一个发热元器件211设置。当然，每一个辅助散热片222a亦可以对应多个发热元器件211设置。需说明的是，在不同实施例中，电路板210的数量可为一 个或多个，本发明对此没有限制。
本发明中，既可以如图1、图7以及图8中所示出的计算设备，在散热风道内只包含一个计算散热结构。也可以如图10所示出的计算设备40，在散热风道42内包含两个计算散热结构100a、100b，两个计算散热结构100a、100b可对称设置。当然，也可以包括更多的计算散热结构。
本发明的计算设备可以是用于虚拟货币挖矿的矿机的计算设备，本发明的矿场指的是聚集了大量矿机以进行虚拟货币挖矿的场所。
本发明的矿场的一实施例的结构如图11所示，矿场1包括至少一个设置架1A，设置架1A上至少设置一个本发明的计算设备，例如计算设备10。需说明的是，支撑架1A上可以并排、层叠等多种方式设置计算设备，支撑架1A的结构以及形式不以图示为限。
当然，本发明还可有其它多种实施例，在不背离本发明精神及其实质的情况下，熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形，但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。
工业应用性
采用本发明所提供的计算散热结构以及计算设备，由于相邻发热元器件的间距与相邻发热元器件所处区域的散热效率负相关，即相邻发热元器件所处区域的散热效率越大，则该区域相邻发热元器件的间距越小，从而均衡了各发热元器件的散热效率，降低了风扇的负荷。进而，采用本发明提供的矿场，即使在同一空间聚集了大量的计算设备也不会出现发热元器件过热损坏的问题。

Claims (20)

  1. 一种计算散热结构，其特征在于，包括：
    电路板，包括多个发热元器件；以及
    散热器，对应所述电路板设置；
    其中，相邻发热元器件的间距与所述相邻发热元器件所处区域的散热效率负相关。
  2. 根据权利要求1所述的计算散热结构，其特征在于，所述电路板包括第一侧面和第二侧面，其中，当所述电路板处于工作状态时，所述第一侧面的热量输出量大于所述第二侧面的热量输出量。
  3. 根据权利要求2所述的计算散热结构，其特征在于，所述散热器包括：
    主体散热片，承载所述电路板；以及
    辅助散热片，将所述电路板压紧到所述主体散热片上。
  4. 根据权利要求3所述的计算散热结构，其特征在于，所述辅助散热片通过弹性压紧方式将所述电路板压紧到所述主体散热片上。
  5. 根据权利要求3或4所述的计算散热结构，其特征在于，所述辅助散热片与所述电路板的空隙之间填充有导热材料。
  6. 根据权利要求5所述的计算散热结构，其特征在于，所述导热材料为导热硅脂或导热胶垫。
  7. 根据权利要求3所述的计算散热结构，其特征在于，所述主体散热片的散热效率高于所述辅助散热片的散热效率，所述主体散热片对应所述第一侧面设置，所述辅助散热片对应所述第二侧面设置。
  8. 根据权利要求7所述的计算散热结构，其特征在于，
    所述主体散热片包括：
    第一散热主体，包括第一面和第二面；以及
    第一散热鳍片，所述第一面与所述第一散热鳍片连接，所述第二面与所述第一侧面连接；
    所述辅助散热片包括：
    第二散热主体，包括第三面和第四面；以及
    第二散热鳍片，所述第三面与所述第二散热鳍片连接，所述第四面与所述第二侧面连接。
  9. 根据权利要求3所述的计算散热结构，其特征在于，所述辅助散热片为多个，每一个所述辅助散热片对应一个所述发热元器件设置。
  10. 根据权利要求3所述的计算散热结构，其特征在于，所述辅助散热片为多个，每一个所述辅助散热片对应多个所述发热元器件设置。
  11. 一种计算设备，包括设备外壳，所述设备外壳围合形成封闭的散热风道，其特征在于，还包括如权利要求1至10任一项所述的计算散热结构，其中，所述计算散热结构位于所述散热风道中。
  12. 根据权利要求11所述的计算设备，其特征在于，所述散热风道内安装有用于测量所述散热风道内温度的温度检测单元。
  13. 根据权利要求12所述的计算设备，其特征在于，还包括：
    控制器，包括风扇控制模块，所述温度检测单元与所述风扇控制模块电连接；以及
    风扇，与所述风扇控制模块电连接；
    其中，所述风扇控制模块根据所述温度检测单元检测的所述散热风道内的实时温度动态调整所述风扇的转速。
  14. 根据权利要求13所述的计算设备，其特征在于，所述散热风道包括：
    入风口，所述入风口处安装有第一面板组件；以及
    出风口，所述出风口处安装有第二面板组件；
    其中，所述第一面板组件和所述第二面板组件用于将所述散热器固定于所述散热风道内。
  15. 根据权利要求14所述的计算设备，其特征在于，所述风扇包括第一风扇，所述第一风扇设置于所述入风口处，并连接在所述第一面板组件上。
  16. 根据权利要求14所述的计算设备，其特征在于，所述风扇包括第二风扇，所述第二风扇设置于所述出风口处，并连接在所述第二面板组件上。
  17. 根据权利要求12所述的计算设备，其特征在于，所述散热风道包括多个温区，所述温度检测单元为多个且分别设置于各所述温区内。
  18. 根据权利要求17所述的计算设备，其特征在于，所述控制器还包括 芯片控制模块，所述芯片控制模块与各所述温度检测单元电连接，其中，所述芯片控制模块根据各所述温度检测单元检测的所述温区的实时温度，动态调整各温区内的发热元器件的工作频率。
  19. 根据权利要求11所述的计算设备，其特征在于，所述计算散热结构为一个或多个。
  20. 一种矿场，包括至少一个设置架，所述设置架上至少设置一个计算设备，其特征在于，所述计算设备为权利要求11至19任一项所述的计算设备。
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