WO2018190346A1 - Composition de résine thermodurcissable, film durci, substrat avec film durci, composant électronique, et encre pour jet d'encre - Google Patents
Composition de résine thermodurcissable, film durci, substrat avec film durci, composant électronique, et encre pour jet d'encre Download PDFInfo
- Publication number
- WO2018190346A1 WO2018190346A1 PCT/JP2018/015134 JP2018015134W WO2018190346A1 WO 2018190346 A1 WO2018190346 A1 WO 2018190346A1 JP 2018015134 W JP2018015134 W JP 2018015134W WO 2018190346 A1 WO2018190346 A1 WO 2018190346A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cured film
- thermosetting resin
- weight
- resin composition
- compound
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/36—Inkjet printing inks based on non-aqueous solvents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Ink Jet (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
La composition de résine thermodurcissable de l'invention comprend : un acide de polyesteramide (A) ; un composé époxy (B) ayant un squelette de fluorène ; un colorant (D) ; et un composé thiol (E) possédant une pluralité de groupes thiol dans chaque molécule. Ainsi, cette composition de résine thermodurcissable permet de former un film durci qui présente une adhérence satisfaisante vis-à-vis d'un PET sous l'effet d'un durcissement à basse température à 120°C ou moins, tout en préservant de manière satisfaisante une stabilité de conservation avant durcissement à basse température. De préférence, la teneur en composé thiol (E) est comprise entre 0,1 et 20 parties en masse pour 100 parties en masse de la teneur en matière solide (matière après retrait des solvants de l'ensemble de la solution) contenue dans ladite composition de résine thermodurcissable.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-079799 | 2017-04-13 | ||
JP2017079799A JP2020105232A (ja) | 2017-04-13 | 2017-04-13 | 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板、電子部品およびインクジェット用インク |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018190346A1 true WO2018190346A1 (fr) | 2018-10-18 |
Family
ID=63792481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2018/015134 WO2018190346A1 (fr) | 2017-04-13 | 2018-04-10 | Composition de résine thermodurcissable, film durci, substrat avec film durci, composant électronique, et encre pour jet d'encre |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2020105232A (fr) |
TW (1) | TW201842065A (fr) |
WO (1) | WO2018190346A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112745770A (zh) * | 2019-10-31 | 2021-05-04 | 味之素株式会社 | 固化性组合物 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190132636A (ko) * | 2017-04-13 | 2019-11-28 | 제이엔씨 주식회사 | 열경화성 수지 조성물, 경화막, 경화막 부착 기판, 전자 부품 및 잉크젯용 잉크 |
CN112521892B (zh) * | 2020-11-11 | 2022-03-22 | 烟台德邦科技股份有限公司 | 一种低温快速固化的阻抗阻燃结构胶的制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0776658A (ja) * | 1990-01-19 | 1995-03-20 | Minnesota Mining & Mfg Co <3M> | 熱硬化性組成物 |
JPH0931306A (ja) * | 1995-07-21 | 1997-02-04 | Minnesota Mining & Mfg Co <3M> | 耐熱性靱性化エポキシ樹脂系組成物 |
WO2012176694A1 (fr) * | 2011-06-24 | 2012-12-27 | 東京応化工業株式会社 | Composition de résine photosensible de type négatif, procédé de formation de motif, film durci, film isolant, filtre coloré et dispositif d'affichage |
JP2015078253A (ja) * | 2013-10-15 | 2015-04-23 | 東レ株式会社 | 樹脂組成物、それを用いたポリイミド樹脂膜、それを含むカラーフィルタ、tft基板、表示デバイスおよびそれらの製造方法 |
WO2017027482A1 (fr) * | 2015-08-08 | 2017-02-16 | Designer Molecules, Inc. | Compositions durcissables anioniques |
-
2017
- 2017-04-13 JP JP2017079799A patent/JP2020105232A/ja active Pending
-
2018
- 2018-04-10 WO PCT/JP2018/015134 patent/WO2018190346A1/fr active Application Filing
- 2018-04-12 TW TW107112529A patent/TW201842065A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0776658A (ja) * | 1990-01-19 | 1995-03-20 | Minnesota Mining & Mfg Co <3M> | 熱硬化性組成物 |
JPH0931306A (ja) * | 1995-07-21 | 1997-02-04 | Minnesota Mining & Mfg Co <3M> | 耐熱性靱性化エポキシ樹脂系組成物 |
WO2012176694A1 (fr) * | 2011-06-24 | 2012-12-27 | 東京応化工業株式会社 | Composition de résine photosensible de type négatif, procédé de formation de motif, film durci, film isolant, filtre coloré et dispositif d'affichage |
JP2015078253A (ja) * | 2013-10-15 | 2015-04-23 | 東レ株式会社 | 樹脂組成物、それを用いたポリイミド樹脂膜、それを含むカラーフィルタ、tft基板、表示デバイスおよびそれらの製造方法 |
WO2017027482A1 (fr) * | 2015-08-08 | 2017-02-16 | Designer Molecules, Inc. | Compositions durcissables anioniques |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112745770A (zh) * | 2019-10-31 | 2021-05-04 | 味之素株式会社 | 固化性组合物 |
Also Published As
Publication number | Publication date |
---|---|
TW201842065A (zh) | 2018-12-01 |
JP2020105232A (ja) | 2020-07-09 |
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