WO2018180441A1 - 太陽電池用ペースト組成物 - Google Patents
太陽電池用ペースト組成物 Download PDFInfo
- Publication number
- WO2018180441A1 WO2018180441A1 PCT/JP2018/009621 JP2018009621W WO2018180441A1 WO 2018180441 A1 WO2018180441 A1 WO 2018180441A1 JP 2018009621 W JP2018009621 W JP 2018009621W WO 2018180441 A1 WO2018180441 A1 WO 2018180441A1
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- WO
- WIPO (PCT)
- Prior art keywords
- aluminum
- silicon
- paste composition
- solar cell
- powder
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 64
- 239000000843 powder Substances 0.000 claims abstract description 71
- 239000010703 silicon Substances 0.000 claims abstract description 68
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 68
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims abstract description 56
- 229910000676 Si alloy Inorganic materials 0.000 claims abstract description 52
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000004020 conductor Substances 0.000 claims abstract description 33
- 238000002161 passivation Methods 0.000 claims abstract description 33
- 239000013078 crystal Substances 0.000 claims abstract description 32
- 239000011521 glass Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims description 34
- 238000000576 coating method Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 67
- 238000006243 chemical reaction Methods 0.000 abstract description 31
- 230000003068 static effect Effects 0.000 abstract description 11
- 238000012360 testing method Methods 0.000 abstract description 11
- 239000000758 substrate Substances 0.000 description 32
- 239000004065 semiconductor Substances 0.000 description 22
- 238000010304 firing Methods 0.000 description 14
- 238000009689 gas atomisation Methods 0.000 description 14
- 229910052782 aluminium Inorganic materials 0.000 description 13
- -1 ester compound Chemical class 0.000 description 13
- 238000011156 evaluation Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- 239000012535 impurity Substances 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 238000005215 recombination Methods 0.000 description 4
- 230000006798 recombination Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- XUMBMVFBXHLACL-UHFFFAOYSA-N Melanin Chemical compound O=C1C(=O)C(C2=CNC3=C(C(C(=O)C4=C32)=O)C)=C2C4=CNC2=C1C XUMBMVFBXHLACL-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- BSPSZRDIBCCYNN-UHFFFAOYSA-N phosphanylidynetin Chemical compound [Sn]#P BSPSZRDIBCCYNN-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Inorganic materials [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- ZFZQOKHLXAVJIF-UHFFFAOYSA-N zinc;boric acid;dihydroxy(dioxido)silane Chemical compound [Zn+2].OB(O)O.O[Si](O)([O-])[O-] ZFZQOKHLXAVJIF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1868—Passivation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a solar cell paste composition, and more particularly to a solar cell intended to form a p + layer on a crystalline solar cell having a passivation film provided with an opening using laser irradiation or the like.
- the present invention relates to a paste composition. More specifically, the solar cell is applied to a crystalline solar cell in which the diameter of the opening is 100 ⁇ m or less and the total area of the opening is 0.5 to 5% of the area of the crystalline solar cell.
- the present invention relates to a paste composition.
- PERC Passivated emitter and rear cell
- the PERC type high conversion efficiency cell has a structure including an electrode layer mainly composed of aluminum, for example.
- This electrode layer (especially the back electrode layer) is formed, for example, by applying a paste composition mainly composed of aluminum in a pattern shape so as to cover the opening of the passivation film, and drying and baking as necessary. Is done.
- Patent Document 1 discloses a paste composition containing aluminum powder, aluminum-silicon alloy powder, silicon powder, glass powder, and an organic vehicle. It is known that the conversion efficiency of the PERC type high conversion efficiency cell can be increased by appropriately designing the configuration of the electrode layer.
- the diameter of the opening is 100 ⁇ m or less, and the total area of the opening is 0.5 to 5% of the area of the crystalline solar cell.
- the rate of decrease in conversion efficiency after a static mechanical load test is 3% or more.
- the present invention has been made in view of the above, and a crystal having a passivation film having an opening with a diameter of 100 ⁇ m or less and a total area of the opening of 0.5 to 5% of the area of the crystalline solar cell. Excellent conversion efficiency can be achieved even when applied to solar cells, suppresses the generation of voids at the electrode layer interface after firing, and further suppresses the rate of decrease in conversion efficiency after static mechanical load testing It aims at providing the paste composition for solar cells which can be performed. Another object of the present invention is to provide a method for forming a back electrode using the solar cell paste composition.
- this invention relates to the following paste composition for solar cells.
- a solar cell paste composition containing a glass powder, an organic vehicle, and a conductive material for use in forming a p + layer for a crystalline solar cell having a passivation film provided with an opening, (1) The opening has a diameter of 100 ⁇ m or less, and the total area of the opening is 0.5 to 5% of the area of the crystalline solar cell, (2) The conductive material contains an aluminum powder and an aluminum-silicon alloy powder having a primary crystal of silicon having a major axis of 5 ⁇ m or less.
- a solar cell paste composition characterized by the above. 2.
- the above item 1 contains 40 to 700 parts by mass of the aluminum-silicon alloy powder, 0.1 to 15 parts by mass of the glass powder, and 20 to 45 parts by mass of the organic vehicle with respect to 100 parts by mass of the aluminum powder.
- the paste composition for solar cells as described. 3.
- Item 3 The solar cell paste composition according to Item 1 or 2, wherein the opening has a diameter of 20 to 100 ⁇ m. 4).
- Step 1 for forming a coating film, and Step 2 for baking the coating film at 700 to 900 ° C. A method for forming a back electrode of a crystalline solar cell, comprising: (1) The opening has a diameter of 100 ⁇ m or less, and the total area of the opening is 0.5 to 5% of the area of the crystalline solar cell, (2) The conductive material contains an aluminum powder and an aluminum-silicon alloy powder having a primary crystal of silicon having a major axis of 5 ⁇ m or less. A method for forming a back electrode. 5). Item 4.
- the above item 4 contains 40 to 700 parts by mass of the aluminum-silicon alloy powder, 0.1 to 15 parts by mass of the glass powder, and 20 to 45 parts by mass of the organic vehicle with respect to 100 parts by mass of the aluminum powder.
- the paste composition for a solar cell of the present invention has a diameter of an opening of a passivation film of 100 ⁇ m or less among crystalline solar cells (particularly PERC type high conversion efficiency cells), and the total area of the openings is a crystalline solar cell. Even when applied to a crystalline solar cell having a cell area of 0.5 to 5%, excellent conversion efficiency can be achieved, generation of voids at the electrode layer interface after firing is suppressed, and static electricity is further reduced. The rate of decrease in conversion efficiency after a dynamic mechanical load test can be suppressed.
- FIG. 1 It is a schematic diagram which shows an example of the cross-section of a PERC type
- the solar cell paste composition of the present invention can be used, for example, to form electrodes of crystalline solar cells. Although it does not specifically limit as a crystalline solar cell, For example, a PERC (Passivated * emitter * and * rear * cell) type high conversion efficiency cell (henceforth a "PERC type solar cell”) is mentioned.
- the solar cell paste composition of the present invention can be used, for example, to form a back electrode of a PERC solar cell.
- the paste composition of the present invention is also simply referred to as “paste composition”.
- FIGS. 1A and 1B are schematic views of a general cross-sectional structure of a PERC type solar cell.
- the PERC type solar cell includes a silicon semiconductor substrate 1, an n-type impurity layer 2, an antireflection film (passivation film) 3, a grid electrode 4, an electrode layer (back electrode layer) 5, an alloy layer 6, and a p + layer 7. Can be provided as an element.
- the silicon semiconductor substrate 1 is not particularly limited.
- a p-type silicon substrate having a thickness of 180 to 250 ⁇ m is used.
- the n-type impurity layer 2 is provided on the light receiving surface side of the silicon semiconductor substrate 1.
- the thickness of the n-type impurity layer 2 is, for example, 0.3 to 0.6 ⁇ m.
- the antireflection film 3 and the grid electrode 4 are provided on the surface of the n-type impurity layer 2.
- the antireflection film 3 is formed of, for example, a silicon nitride film and is also referred to as a passivation film.
- the antireflection film 3 acts as a so-called passivation film, so that recombination of electrons on the surface of the silicon semiconductor substrate 1 can be suppressed, and as a result, the recombination rate of the generated carriers can be reduced. Thereby, the conversion efficiency of a PERC type photovoltaic cell is increased.
- the antireflection film (passivation film) 3 is also provided on the back surface side of the silicon semiconductor substrate 1, that is, the surface opposite to the light receiving surface. Further, a contact hole (opening in the present invention) formed so as to penetrate through the antireflection film (passivation film) 3 on the back surface side and scrape a part of the back surface of the silicon semiconductor substrate 1 is a silicon semiconductor. It is formed on the back side of the substrate 1.
- the electrode layer 5 is formed in contact with the silicon semiconductor substrate 1 through the contact hole.
- the electrode layer 5 is a member formed by the paste composition of the present invention, and is formed in a predetermined pattern shape.
- the electrode layer 5 may be formed so as to cover the entire back surface of the PERC type solar battery cell as in the form of FIG. 1A, or the contact hole and the electrode layer 5 as in the form of FIG. You may form so that the vicinity may be covered. Since the main component of the electrode layer 5 is aluminum, the electrode layer 5 is an aluminum electrode layer.
- the electrode layer 5 is formed, for example, by applying a paste composition in a predetermined pattern shape and baking it.
- the coating method is not particularly limited, and examples thereof include known methods such as screen printing. After applying the paste composition and drying it as necessary, the electrode layer 5 is formed by firing for a short time at a temperature exceeding the melting point of aluminum (about 660 ° C.), for example.
- the firing temperature may be a temperature exceeding the melting point of aluminum (about 660 ° C.), but is preferably about 700 to 900 ° C., more preferably about 780 to 900 ° C.
- the firing time can be appropriately set according to the firing temperature within the range in which the desired electrode layer 5 is formed.
- an aluminum-silicon (Al—Si) alloy layer (alloy layer 6) is formed between the electrode layer 5 and the silicon semiconductor substrate 1, and at the same time, by diffusion of aluminum atoms, p as an impurity layer is formed. A + layer 7 is formed.
- the p + layer 7 can prevent recombination of electrons and improve the collection efficiency of generated carriers, that is, a so-called BSF (Back Surface Field) effect.
- BSF Back Surface Field
- the electrode formed by the electrode layer 5 and the alloy layer 6 is the back electrode 8 shown in FIG. Accordingly, the back electrode 8 is formed using a paste composition, and is applied, for example, so as to cover the contact hole 9 (opening) provided in the antireflection film (passivation film) 3 on the back side. Accordingly, the back electrode 8 can be formed by baking after drying.
- the diameter of the opening of the passivation film is 100 ⁇ m or less (preferably 20 to 100 ⁇ m), and the total area of the opening is crystalline solar. Excellent conversion efficiency can be achieved even when applied to crystalline solar cells that are 0.5 to 5% (especially 2 to 4%, more preferably 2.5 to 3.5%) of the battery cell area. At the same time, generation of voids at the electrode layer interface after firing can be suppressed, and further, the rate of decrease in conversion efficiency after the static mechanical load test can be suppressed.
- the paste composition of the present invention contains a glass powder, an organic vehicle and a conductive material used for forming a p + layer for a crystalline solar cell having a passivation film provided with an opening.
- a solar cell paste composition comprising: (1) The opening has a diameter of 100 ⁇ m or less, and the total area of the opening is 0.5 to 5% of the area of the crystalline solar cell, (2)
- the conductive material contains an aluminum powder and an aluminum-silicon alloy powder having a primary crystal of silicon having a major axis of 5 ⁇ m or less. It is characterized by that.
- the back electrode of a solar battery cell such as a PERC solar battery cell can be formed by using the paste composition. That is, the paste composition of the present invention is used to form a back electrode for a solar cell that is in electrical contact with a silicon substrate through an opening (contact hole) provided in a passivation film formed on the silicon substrate. it can. And according to the paste composition of this invention, the diameter of the opening part of a passivation film is 100 micrometers or less among crystal type solar cells (especially PERC type solar cell), and the total area of an opening part is a crystal type solar cell.
- the paste composition includes glass powder, an organic vehicle, and a conductive material (metal particles) as constituent components. And since the paste composition contains a conductive material (metal particles), the sintered body formed by baking the coating film of the paste composition exhibits electrical conductivity that is electrically connected to the silicon substrate. .
- the conductive material contains aluminum powder and aluminum-silicon alloy powder having a primary crystal of silicon having a major axis of 5 ⁇ m or less.
- the above-mentioned aluminum powder refers to aluminum in which an alloy is not formed, but does not exclude the presence of inevitable impurities and trace amounts of additive elements derived from raw materials.
- the aluminum-silicon alloy powder used in the present invention is an alloy powder of aluminum and silicon, but does not exclude the inevitable impurities in aluminum and silicon and the presence of a trace amount of additive elements derived from raw materials.
- the silicon content in the aluminum-silicon alloy is preferably 12 to 30 atomic%, and more preferably 17 to 25 atomic%.
- the aluminum-silicon alloy powder used in the present invention is characterized by having a primary crystal of silicon having a major axis of 5 ⁇ m or less (that is, more than 0 ⁇ m and 5 ⁇ m or less).
- the major axis of the primary crystal may be 5 ⁇ m or less. Among them, 1 to 5 ⁇ m is preferable, and 2 to 5 ⁇ m is more preferable.
- the presence or absence of the primary crystal of the aluminum-silicon alloy powder and the shape of the primary crystal can be specified by observing the cross section of the aluminum-silicon alloy powder with an optical microscope.
- FIG. 1 An observation image by an optical microscope of an example of aluminum powder and aluminum-silicon alloy powder is shown in FIG.
- the primary crystal of silicon can be confirmed as an irregular gray point.
- the observation image of the cross section of the aluminum powder (not including silicon) shown in (b) and the aluminum-silicon alloy powder having a silicon content of 15 atomic% shown in (c) shows the primary crystal of silicon. Cannot be confirmed.
- the method for obtaining an aluminum-silicon alloy powder having a primary crystal having a major axis of 5 ⁇ m or less is not limited.
- P phosphorus
- Other examples include a method of atomizing aluminum-silicon alloy powder with an inert gas such as helium (He) or argon (Ar).
- the content of the aluminum-silicon alloy powder with respect to the aluminum powder is not limited, but the content of the aluminum-silicon alloy powder is preferably 40 to 700 parts by mass, more preferably 40 to 250 parts by mass with respect to 100 parts by mass of the aluminum powder.
- the shape of the conductive material is not particularly limited, and may be any of spherical, elliptical, indeterminate, scaly, fibrous, and the like. If the shape of the conductive material is spherical, in the electrode layer 5 formed of the paste composition, the filling property of the conductive material can be increased and the electrical resistance can be effectively reduced.
- the contact between the silicon semiconductor substrate 1 and the conductive material is increased in the electrode layer 5 formed of the paste composition, so that a good BSF layer can be easily formed.
- the average particle diameter measured by a laser diffraction method is preferably in the range of 1 to 10 ⁇ m.
- any of these conductive materials can be produced by a known method such as a gas atomizing method. (Glass powder) It is said that the glass powder has an effect of assisting the reaction between the conductive material and silicon and the sintering of the conductive material itself.
- glass powder it can be set as the well-known glass component contained in the paste composition currently used in order to form the electrode layer of a photovoltaic cell.
- the glass powder include lead (Pb), bismuth (Bi), vanadium (V), boron (B), silicon (Si), tin (Sn), phosphorus (P), and zinc (Zn). And at least one selected from.
- glass powder containing lead, or lead-free glass powder such as bismuth, vanadium, tin-phosphorus, zinc borosilicate, or alkali borosilicate can be used. In view of the influence on the human body, it is desirable to use lead-free glass powder.
- a glass frit having a molar ratio (B 2 O 3 / Bi 2 O 3 ) of B 2 O 3 component to Bi 2 O 3 component of 0.8 or more and 4.0 or less, and V 2 O 5 molar ratio of the component and the BaO component (V 2 O 5 / BaO) may be combined with the glass frit is 1.0 to 2.5.
- the softening point of the glass powder can be, for example, 750 ° C. or less.
- the average particle size of the particles contained in the glass powder can be, for example, 1 to 3 ⁇ m.
- the content of the glass powder contained in the paste composition is preferably, for example, 0.5 to 40 parts by mass with respect to 100 parts by mass of the conductive material, and in particular 0 with respect to 100 parts by mass of the aluminum powder. It is preferably 1 to 15 parts by mass. In this case, the adhesion between the silicon semiconductor substrate 1 and the antireflection film 3 (passivation film) is good, and the electrical resistance is hardly increased.
- Organic vehicle a material in which various additives and resins are dissolved in a solvent as required can be used. Alternatively, the resin itself may be used as the organic vehicle without containing the solvent.
- solvent known types can be used, and specific examples include diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether, and the like.
- an antioxidant for example, an antioxidant, a corrosion inhibitor, an antifoaming agent, a thickener, a tack fire, a coupling agent, an electrostatic imparting agent, a polymerization inhibitor, a thixotropic agent, an antisettling agent, etc.
- an antioxidant for example, an antioxidant, a corrosion inhibitor, an antifoaming agent, a thickener, a tack fire, a coupling agent, an electrostatic imparting agent, a polymerization inhibitor, a thixotropic agent, an antisettling agent, etc.
- polyethylene glycol ester compound polyethylene glycol ether compound, polyoxyethylene sorbitan ester compound, sorbitan alkyl ester compound, aliphatic polycarboxylic acid compound, phosphate ester compound, amide amine salt of polyester acid, polyethylene oxide Series compounds, fatty acid amide waxes and the like can be used.
- Known resins can be used, such as ethyl cellulose, nitrocellulose, polyvinyl butyral, phenolic resin, melanin resin, urea resin, xylene resin, alkyd resin, unsaturated polyester resin, acrylic resin, polyimide resin, furan resin, Thermosetting resin such as urethane resin, isocyanate compound, cyanate compound, polyethylene, polypropylene, polystyrene, ABS resin, polymethyl methacrylate, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, polyvinyl alcohol, polyacetal, polycarbonate, polyethylene terephthalate, Polybutylene terephthalate, polyphenylene oxide, polysulfone, polyimide, polyethersulfone, polyarylate, polyetherether Tons, polytetrafluoroethylene, can be used in combination of two or more kinds of such as silicon resin.
- the ratio of the resin, solvent, and various additives contained in the organic vehicle can be arbitrarily adjusted.
- the component ratio can be the same as that of a known organic vehicle.
- the content ratio of the organic vehicle is not particularly limited, for example, from the viewpoint of having good printability, it is preferably 10 to 500 parts by weight, and 20 to 45 parts by weight with respect to 100 parts by weight of the conductive material. It is particularly preferred. In particular, the amount is preferably 10 to 500 parts by weight, and more preferably 20 to 45 parts by weight with respect to 100 parts by weight of the aluminum powder.
- the paste composition of the present invention is suitable for use, for example, for forming an electrode layer of a solar battery cell (in particular, a back electrode 8 of a PERC type solar battery cell as shown in FIG. 1). Therefore, the paste composition of this invention can be used also as a solar cell back surface electrode formation agent.
- the method for forming the back electrode (back electrode 8 in FIG. 1) of the crystalline solar cell of the present invention is as follows.
- a solar cell paste composition containing glass powder, an organic vehicle and a conductive material to the crystalline solar cell having a passivation film provided with an opening so as to cover the opening.
- Step 1 for forming a coating film, and Step 2 of baking the coating film at 700 to 900 ° C. (1)
- the opening has a diameter of 100 ⁇ m or less, and the total area of the opening is 0.5 to 5% of the area of the crystalline solar cell
- the conductive material contains an aluminum powder and an aluminum-silicon alloy powder having a primary crystal of silicon having a major axis of 5 ⁇ m or less. It is characterized by that.
- the crystalline solar battery cell and the solar battery paste composition are basically as described above, but the diameter of the opening provided in the passivation film is preferably 20 to 100 ⁇ m, even within 100 ⁇ m or less.
- the opening can usually be formed by laser irradiation or the like.
- Step 1 a solar cell paste composition is applied to a crystalline solar cell having a passivation film provided with an opening so as to cover the opening. Thus, a coating film is formed.
- the thickness of the coating film can be set according to the thickness of the back electrode after firing, but is preferably about 5 to 40 ⁇ m on the basis of the flat portion (other than the opening) of the passivation film.
- the coating film is baked at 700 to 900 ° C.
- the firing temperature may be 700 to 900 ° C., but preferably about 780 to 900 ° C.
- the aluminum contained in the paste composition diffuses into the silicon semiconductor substrate 1, and an aluminum-silicon (Al—Si) alloy layer (alloy layer 6) is formed between the electrode layer 5 and the silicon semiconductor substrate 1.
- an aluminum-silicon (Al—Si) alloy layer alloy layer 6
- a p + layer 7 as an impurity layer is formed by diffusion of aluminum atoms.
- the aluminum-silicon alloy powder having a primary crystal of silicon having a major axis of 2.0 ⁇ m is atomized by adding 0.01% P (phosphorus) to a molten aluminum-silicon alloy having a silicon content of 20 atomic%. It was prepared by doing. (Preparation of a fired substrate that is a solar cell) A fired substrate as a solar cell for evaluation was produced as follows.
- a silicon semiconductor substrate 1 having a thickness of 160 ⁇ m (resistance value: 3 ⁇ ⁇ cm, including a passivation film on the back side) was prepared.
- a YAG laser having a wavelength of 532 nm as a laser oscillator, contacts having a diameter of 50 ⁇ m at intervals of 500 ⁇ m so that the total area of the opening is 3.1% of the entire cell. Hole 9 was formed. The total area of the openings in the entire cell was calculated by multiplying the square of the radius of each opening by ⁇ and dividing this by the distance (pitch) between adjacent openings.
- the passivation film is not shown and is handled as being included in the silicon semiconductor substrate 1, and the passivation film is a laminate of a 30 nm aluminum oxide layer and a 100 nm silicon nitride layer on the back side of the silicon semiconductor substrate 1. Included as a body.
- the paste composition 10 obtained above is applied to the surface of the silicon semiconductor substrate 1 so as to cover the entire back surface (the surface on the side where the contact holes 9 are formed). On the top, printing was carried out at 1.0 to 1.1 g / pc using a screen printer. Next, although not shown, an Ag paste prepared by a known technique was printed on the light receiving surface.
- a static load of 2400 Pa is applied to the front and back surfaces of a horizontally installed module for 1 hour, this is repeated 3 cycles, and then conversion efficiency is measured using a solar simulator, and the rate of decrease before and after the test is calculated. Calculated.
- the module was manufactured by sandwiching a sealing material between glass and a back sheet and arranging solar cells in series in the sealing material.
- Example 2 Evaluation was performed in the same manner as in Example 1 except that a cell in which contact holes 9 having a diameter of 30 ⁇ m were formed at intervals of 300 ⁇ m so that the total area of the opening was 3.1% of the whole cell was used.
- Example 3 Evaluation was performed in the same manner as in Example 1 except that a cell in which contact holes having a diameter of 70 ⁇ m were formed at intervals of 700 ⁇ m so that the total area of the opening was 3.1% of the entire cell was used.
- Example 4 Implementation was performed except that the aluminum powder produced by the gas atomization method and the aluminum-silicon alloy powder having the primary crystal of silicon having a major axis of 4.0 ⁇ m produced by the gas atomization method were adjusted to 30 mass%: 70 mass%.
- a paste composition was prepared and evaluated in the same manner as in Example 1.
- the aluminum-silicon alloy powder having a primary crystal of silicon having a major axis of 4.0 ⁇ m was prepared by atomizing into a molten aluminum-silicon alloy having a silicon content of 23 atomic% at a cooling rate of 103 K / Sec. .
- Example 5 Implementation was carried out except that the aluminum powder produced by the gas atomization method and the aluminum-silicon alloy powder having the primary crystal of the major axis of 5.0 ⁇ m produced by the gas atomization method were adjusted to 50 mass%: 50 mass%.
- a paste composition was prepared and evaluated in the same manner as in Example 1.
- the aluminum-silicon alloy powder having a primary crystal of silicon having a major axis of 5.0 ⁇ m was prepared by atomizing with He gas using a molten aluminum-silicon alloy having a silicon content of 25 atomic%.
- Comparative Example 1 A paste was prepared and evaluated in the same manner as in Example 1 except that only the aluminum powder produced by the gas atomization method was used. That is, in Comparative Example 1, an aluminum-silicon alloy powder having a primary crystal of silicon is not used.
- Comparative Example 2 Implementation was performed except that the aluminum powder produced by the gas atomization method and the aluminum-silicon alloy powder having the primary crystal of the major axis of 7.0 ⁇ m produced by the gas atomization method were adjusted to 50 mass%: 50 mass%.
- a paste was prepared and evaluated in the same manner as in Example 1.
- the aluminum-silicon alloy powder having the primary crystal of silicon having a major axis of 7.0 ⁇ m is atomized by adding 0.005% P (phosphorus) to a molten aluminum-silicon alloy having a silicon content of 35 atomic%. It was prepared by doing.
- Comparative Example 3 Implementation was performed except that the aluminum powder produced by the gas atomization method and the aluminum-silicon alloy powder having the primary crystal of the major axis of 10.0 ⁇ m produced by the gas atomization method were adjusted so as to be 50% by mass: 50% by mass.
- a paste was prepared and evaluated in the same manner as in Example 1.
- the aluminum-silicon alloy powder having a primary crystal of silicon having a major axis of 10.0 ⁇ m was prepared by atomizing a molten aluminum-silicon alloy having a silicon content of 40 atomic%.
- Comparative Example 4 Implementation was performed except that the aluminum powder produced by the gas atomization method and the aluminum-silicon alloy powder having the primary crystal of silicon having a major axis of 6.0 ⁇ m produced by the gas atomization method were adjusted to 50 mass%: 50 mass%.
- a paste was prepared and evaluated in the same manner as in Example 1.
- the aluminum-silicon alloy powder having a primary crystal of silicon having a major axis of 6.0 ⁇ m was prepared by atomizing a molten aluminum-silicon alloy having a silicon content of 35 atomic%.
- Comparative Example 5 Evaluation was performed in the same manner as in Example 1 except that a cell in which contact holes 9 having a diameter of 110 ⁇ m were formed at intervals of 1100 ⁇ m so that the total area of the opening was 3.1% of the whole cell was used.
- Comparative Example 6 Evaluation was performed in the same manner as in Example 1 except that a cell in which contact holes 9 having a diameter of 50 ⁇ m were formed at equal intervals of 1400 ⁇ m so that the total area of the opening was 0.4% of the entire cell was used.
- Comparative Example 7 Evaluation was performed in the same manner as in Example 1 except that a cell in which contact holes 9 having a diameter of 50 ⁇ m were formed at equal intervals of 360 ⁇ m so that the total area of the opening was 6.1% of the whole cell.
- the diameter of the opening of the passivation film is 100 ⁇ m or less, and the total area of the opening is 0.5% of the area of the crystalline solar cell. Even when applied to a crystalline solar cell of ⁇ 5%, excellent conversion efficiency can be achieved (Eff is 22.0% or more), and the generation of voids at the electrode layer interface after firing is suppressed, Further, it can be seen that the rate of decrease in conversion efficiency after the static mechanical load test can be suppressed (a rate of decrease of less than 3%).
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Abstract
Description
1.開口部を設けたパッシベーション膜を有する結晶系太陽電池セルに対してp+層を形成する用途に用いる、ガラス粉末、有機ビヒクル及び導電性材料を含有する太陽電池用ペースト組成物であって、
(1)前記開口部は直径が100μm以下であり、前記開口部の総面積は前記結晶系太陽電池セルの面積の0.5~5%であり、
(2)前記導電性材料は、アルミニウム粉末と、長径が5μm以下のシリコンの初晶を有するアルミニウム-シリコン合金粉末とを含有する、
ことを特徴とする太陽電池用ペースト組成物。
2.前記アルミニウム粉末100質量部に対して、前記アルミニウム-シリコン合金粉末40~700質量部、前記ガラス粉末0.1~15質量部、及び前記有機ビヒクル20~45質量部を含有する、上記項1に記載の太陽電池用ペースト組成物。
3.前記開口部の直径が20~100μmである、上記項1又は2に記載の太陽電池用ペースト組成物。
4.開口部を設けたパッシベーション膜を有する結晶系太陽電池セルに対して、前記開口部を被覆するように、ガラス粉末、有機ビヒクル及び導電性材料を含有する太陽電池用ペースト組成物を塗布することにより塗膜を形成する工程1、並びに、
前記塗膜を700~900℃で焼成する工程2、
を有する、結晶系太陽電池セルの裏面電極の形成方法であって、
(1)前記開口部は直径が100μm以下であり、前記開口部の総面積は前記結晶系太陽電池セルの面積の0.5~5%であり、
(2)前記導電性材料は、アルミニウム粉末と、長径が5μm以下のシリコンの初晶を有するアルミニウム-シリコン合金粉末とを含有する、
ことを特徴とする裏面電極の形成方法。
5.前記アルミニウム粉末100質量部に対して、前記アルミニウム-シリコン合金粉末40~700質量部、前記ガラス粉末0.1~15質量部、及び前記有機ビヒクル20~45質量部を含有する、上記項4に記載の裏面電極の形成方法。
6.前記開口部の直径が20~100μmである、上記項4又は5に記載の裏面電極の形成方法。
図1(a)、(b)は、PERC型太陽電池セルの一般的な断面構造の模式図である。PERC型太陽電池セルは、シリコン半導体基板1、n型不純物層2、反射防止膜(パッシベーション膜)3、グリッド電極4、電極層(裏面電極層)5、合金層6、p+層7を構成要素として備えることができる。
本発明のペースト組成物は、開口部を設けたパッシベーション膜を有する結晶系太陽電池セルに対してp+層を形成する用途に用いる、ガラス粉末、有機ビヒクル及び導電性材料を含有する太陽電池用ペースト組成物であって、
(1)前記開口部は直径が100μm以下であり、前記開口部の総面積は前記結晶系太陽電池セルの面積の0.5~5%であり、
(2)前記導電性材料は、アルミニウム粉末と、長径が5μm以下のシリコンの初晶を有するアルミニウム-シリコン合金粉末とを含有する、
ことを特徴とする。
(導電性材料)
本発明において、導電性材料は、アルミニウム粉末と、長径が5μm以下のシリコンの初晶を有するアルミニウム-シリコン合金粉末とを含有する。
(ガラス粉末)
ガラス粉末は、導電性材料とシリコンとの反応、及び、導電性材料自身の焼結を助ける作用があるとされている。
(有機ビヒクル)
有機ビヒクルとしては、溶剤に、必要に応じて各種添加剤及び樹脂を溶解した材料を使用できる。又は、溶剤を含まず、樹脂そのものを有機ビヒクルとして使用してもよい。
本発明の結晶系太陽電池セルの裏面電極(図1の裏面電極8)の形成方法は、
開口部を設けたパッシベーション膜を有する結晶系太陽電池セルに対して、前記開口部を被覆するように、ガラス粉末、有機ビヒクル及び導電性材料を含有する太陽電池用ペースト組成物を塗布することにより塗膜を形成する工程1、並びに、
前記塗膜を700~900℃で焼成する工程2、を有し、
(1)前記開口部は直径が100μm以下であり、前記開口部の総面積は前記結晶系太陽電池セルの面積の0.5~5%であり、
(2)前記導電性材料は、アルミニウム粉末と、長径が5μm以下のシリコンの初晶を有するアルミニウム-シリコン合金粉末とを含有する、
ことを特徴とする。
(ペースト組成物の調製)
ガスアトマイズ法により生成したアルミニウム粉末と、同じくガスアトマイズ法により生成した長径が2.0μmのシリコンの初晶を有するアルミニム-シリコン合金粉末を、40質量%:60質量%となるように調整した導電性材料100質量部と、B2O3-Bi2O3-SrO-BaO-Sb2O3=40/40/10/5/5(mol%)のガラス粉末1.5質量部を、エチルセルロースをブチルジグリコールに溶解した樹脂液35質量部に、既知の分散装置(ディスパー)を用いてペースト化した。
(太陽電池セルである焼成基板の作製)
評価用の太陽電池セルである焼成基板を次のように作製した。
(太陽電池セルの評価)
得られた太陽電池セルの評価においては、ワコム電創のソーラーシュミレータ:WXS-156S-10、I-V測定装置:IV15040-10を用いて、I-V測定を実施した。Effが21.5%以上で合格とした。
(ボイド「Void」の評価)
ボイドの評価については、焼成基板の断面を光学顕微鏡(200倍)で観察し、シリコン半導体基板1と電極層5との界面におけるボイドの有無を評価した。ボイドが確認されなかったものを合格(○)、ボイドが確認されたものを不合格(×)と評価した。
(静的機械荷重試験後の変換効率の低下率)
静的機械荷重試験後の変換効率の低下率は、IEC61215に従い特定した。具体的には、2400Paの静荷重を水平に設置したモジュールの表面及び裏面に1時間行い、これを3サイクル繰り返し、その後ソーラーシュミレータを用いて変換効率の測定を行い、試験前後での低下率を計算した。なお、モジュールは、ガラス及びバックシートの間に封止材を挟持し、封止材中に太陽電池セルを直列に配列することで作製した。
開口部の総面積がセル全体の3.1%となるように300μm間隔で直径30μmのコンタクト孔9を形成したセルを用いた以外は、実施例1と同様にして評価を行った。
開口部の総面積がセル全体の3.1%となるように700μm間隔で直径70μmのコンタクト孔を形成したセルを用いた以外は、実施例1と同様にして評価を行った。
ガスアトマイズ法により生成したアルミニウム粉末と、同じくガスアトマイズ法により生成した長径が4.0μmのシリコンの初晶を有するアルミニウム-シリコン合金粉末を、30質量%:70質量%となるように調整した以外は実施例1と同様にしてペースト組成物を調製し、評価を行った。
ガスアトマイズ法により生成したアルミニウム粉末と、同じくガスアトマイズ法により生成した長径が5.0μmのシリコンの初晶を有するアルミニウム-シリコン合金粉末を、50質量%:50質量%となるように調整した以外は実施例1と同様にしてペースト組成物を調製し、評価を行った。
ガスアトマイズ法により生成したアルミニウム粉末のみを用いた以外は、実施例1と同様にしてペーストを作成し、評価を行った。つまり、比較例1ではシリコンの初晶を有するアルミニウム-シリコン合金粉末は用いていない。
ガスアトマイズ法により生成したアルミニウム粉末と、同じくガスアトマイズ法により生成した長径が7.0μmのシリコンの初晶を有するアルミニウム-シリコン合金粉末を、50質量%:50質量%となるように調整した以外は実施例1と同様にしてペーストを作成し、評価を行った。
ガスアトマイズ法により生成したアルミニウム粉末と、同じくガスアトマイズ法により生成した長径が10.0μmのシリコンの初晶を有するアルミニウム-シリコン合金粉末を、50質量%:50質量%となるように調整した以外は実施例1と同様にしてペーストを作成し、評価を行った。
ガスアトマイズ法により生成したアルミニウム粉末と、同じくガスアトマイズ法により生成した長径が6.0μmのシリコンの初晶を有するアルミニウム-シリコン合金粉末を、50質量%:50質量%となるように調整した以外は実施例1と同様にしてペーストを作成し、評価を行った。
開口部の総面積がセル全体の3.1%となるように1100μm間隔で直径110μmのコンタクト孔9を形成したセルを用いた以外は、実施例1と同様にして評価を行った。
開口部の総面積がセル全体の0.4%となるように1400μm等間隔で直径50μmのコンタクト孔9を形成したセルを用いた以外は、実施例1と同様にして評価を行った。
開口部の総面積がセル全体の6.1%となるように360μm等間隔で直径50μmのコンタクト孔9を形成したセルを用いた以外は、実施例1と同様にして評価を行った。
2:n型不純物層
3:反射防止膜(パッシベーション膜)
4:グリッド電極
5:電極層
6:合金層
7:p+層
8:裏面電極
9:コンタクト孔(開口部)
10:ペースト組成物
Claims (6)
- 開口部を設けたパッシベーション膜を有する結晶系太陽電池セルに対してp+層を形成する用途に用いる、ガラス粉末、有機ビヒクル及び導電性材料を含有する太陽電池用ペースト組成物であって、
(1)前記開口部は直径が100μm以下であり、前記開口部の総面積は前記結晶系太陽電池セルの面積の0.5~5%であり、
(2)前記導電性材料は、アルミニウム粉末と、長径が5μm以下のシリコンの初晶を有するアルミニウム-シリコン合金粉末とを含有する、
ことを特徴とする太陽電池用ペースト組成物。 - 前記アルミニウム粉末100質量部に対して、前記アルミニウム-シリコン合金粉末40~700質量部、前記ガラス粉末0.1~15質量部、及び前記有機ビヒクル20~45質量部を含有する、請求項1に記載の太陽電池用ペースト組成物。
- 前記開口部の直径が20~100μmである、請求項1又は2に記載の太陽電池用ペースト組成物。
- 開口部を設けたパッシベーション膜を有する結晶系太陽電池セルに対して、前記開口部を被覆するように、ガラス粉末、有機ビヒクル及び導電性材料を含有する太陽電池用ペースト組成物を塗布することにより塗膜を形成する工程1、並びに、
前記塗膜を700~900℃で焼成する工程2、
を有する、結晶系太陽電池セルの裏面電極の形成方法であって、
(1)前記開口部は直径が100μm以下であり、前記開口部の総面積は前記結晶系太陽電池セルの面積の0.5~5%であり、
(2)前記導電性材料は、アルミニウム粉末と、長径が5μm以下のシリコンの初晶を有するアルミニウム-シリコン合金粉末とを含有する、
ことを特徴とする裏面電極の形成方法。 - 前記アルミニウム粉末100質量部に対して、前記アルミニウム-シリコン合金粉末40~700質量部、前記ガラス粉末0.1~15質量部、及び前記有機ビヒクル20~45質量部を含有する、請求項4に記載の裏面電極の形成方法。
- 前記開口部の直径が20~100μmである、請求項4又は5に記載の裏面電極の形成方法。
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