WO2018139125A1 - Film de protection de substrat, élément antiadhésif et procédé de formation d'un élément antiadhésif - Google Patents

Film de protection de substrat, élément antiadhésif et procédé de formation d'un élément antiadhésif Download PDF

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Publication number
WO2018139125A1
WO2018139125A1 PCT/JP2017/045923 JP2017045923W WO2018139125A1 WO 2018139125 A1 WO2018139125 A1 WO 2018139125A1 JP 2017045923 W JP2017045923 W JP 2017045923W WO 2018139125 A1 WO2018139125 A1 WO 2018139125A1
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group
substrate
layer
protective film
adhesion
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PCT/JP2017/045923
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English (en)
Japanese (ja)
Inventor
緒方　四郎
修平 須田
祥太 高宮
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星和電機株式会社
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Priority to CN201780083902.8A priority Critical patent/CN110225895B/zh
Priority to KR1020197022786A priority patent/KR102315145B1/ko
Publication of WO2018139125A1 publication Critical patent/WO2018139125A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/16—Antifouling paints; Underwater paints
    • C09D5/1606—Antifouling paints; Underwater paints characterised by the anti-fouling agent
    • C09D5/1612—Non-macromolecular compounds
    • C09D5/1618—Non-macromolecular compounds inorganic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B17/00—Methods preventing fouling
    • B08B17/02—Preventing deposition of fouling or of dust
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/38—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal at least one coating being a coating of an organic material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/42—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating of an organic material and at least one non-metal coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/16—Antifouling paints; Underwater paints
    • C09D5/1606—Antifouling paints; Underwater paints characterised by the anti-fouling agent
    • C09D5/1612—Non-macromolecular compounds
    • C09D5/1625—Non-macromolecular compounds organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium

Definitions

  • the present invention relates to a substrate protective film that reduces adhesion of a substance to the surface of a substrate (for example, a glass or resin substrate), an adhesion preventing member having such a substrate protective film formed on the surface thereof, And a forming method.
  • a substrate for example, a glass or resin substrate
  • an adhesion preventing member having such a substrate protective film formed on the surface thereof, And a forming method.
  • Patent Documents 1 and 2 As techniques for reducing the adhesion of substances (contaminants etc.) to the surface of a substrate, techniques described in Patent Documents 1 and 2 have been proposed. In the techniques described in Patent Documents 1 and 2, adhesion of a substance is reduced by electrostatic repulsion by holding electric charges on the surface of the substrate.
  • Patent No. 4926176 Japanese Patent No. 5624458
  • the present invention has been made in view of such circumstances, and provides a substrate protective film capable of reducing the adhesion of a substance to the substrate surface more than the effect of reducing the adhesion of the substance due to electrostatic repulsion. It is another object of the present invention to provide an adhesion preventing member having such a substrate protective film formed on the surface and a method of forming the same.
  • the substrate protective film of the present invention is a substrate protective film for reducing the adhesion of a substance to the surface of the substrate, and includes a first layer containing a charged substance and having an electrostatic repulsive force, and a second layer for controlling the surface free energy.
  • the first layer is formed on the surface of the substrate, and the second layer is formed on the surface of the first layer.
  • the second layer is formed of a functional group having a low surface free energy of 50 mJ / m 2 or less, and the thickness of the second layer is less than 1 nm.
  • substance adhesion can be reduced by the electrostatic repulsive force of the first layer formed on the substrate surface.
  • a second layer for controlling the surface free energy is formed on the surface of the first layer, and the second layer is formed by a functional group having a low surface free energy of 50 mJ / m 2 or less, Since the thickness of the second layer is less than 1 nm, the surface free energy can be lowered by this second layer to reduce the adhesion of substances due to intermolecular forces. This makes it possible to reduce the adhesion of substances due to intermolecular forces while maintaining the electrostatic repulsion force due to the first layer on the substrate surface. In addition, the adhesion of the substance to the substrate surface can be reduced.
  • the adhesion preventing member of the present invention is characterized in that a substrate protective film having the above-described characteristics is formed on the surface of a glass or resin substrate. According to such an adhesion preventing member, adhesion of materials (contaminants and the like) to the surface can be effectively reduced.
  • the adhesion of the substance to the substrate surface can be reduced more than the effect of reducing the substance adhesion only by the electrostatic repulsive force.
  • FIG. 1 is an image diagram showing an example of a substrate protective film of the present invention.
  • the substrate protective film 2 in this example includes a charge retention layer (first layer) 3 having electrostatic repulsive force and a functional group layer (second layer) 4 that controls surface free energy, and is made of glass or resin.
  • a charge retention layer 3 is formed on the surface of the substrate (substrate) 1, and a functional group layer 4 is formed on the surface of the charge retention layer 3.
  • the charge retention layer 3 is formed including a charged substance.
  • the functional group layer 4 is a self-assembled monolayer (SAM) formed by methyl groups (functional groups having a low surface free energy of 50 mJ / m 2 or less) and has a thickness of less than 1 nm.
  • the adhesion of substances can be reduced by the electrostatic repulsion of the charge retention layer 3 formed on the surface of the substrate 1. Further, on the surface of the charge retention layer 3, a functional group 4 composed of a functional group (methyl group) having a low surface free energy having a functional group length (thickness) of less than 1 nm and 50 mJ / m 2 or less is formed. Therefore, substance adhesion due to intermolecular force can be reduced.
  • substrate protective film 2 which consists of the electric charge holding layer 3 and the functional group layer 4 on the surface of the base
  • the functional group 4 is not limited to a self-assembled monolayer (SAM), but is a layer (methyl) formed by another forming method (a method for forming a water-repellent group or a water-repellent / oil-repellent group described later). Base layer).
  • FIG. 2 is an image view showing another example of the substrate protective film of the present invention.
  • the substrate protective film 12 in this example has a functional group consisting of a hexyl group (a functional group having a low surface free energy of 50 mJ / m 2 or less) on the surface of a charge retention layer (first layer) 13 having electrostatic repulsion. It is characterized in that a base layer (SAM: second layer) 14 is formed, and the other configuration is the same as the configuration of [Embodiment 1] described above.
  • SAM second layer
  • the substrate protective film 12 of this example it becomes possible to reduce the adhesion of the substance due to the intermolecular force while maintaining the electrostatic repulsive force on the surface of the substrate 11, so that the substance based only on the electrostatic repulsive force More than the adhesion reduction effect, the adhesion of the substance to the surface of the substrate 11 can be reduced.
  • the functional group 14 is not limited to the self-assembled monolayer (SAM), but is a layer (hexyl) formed by another forming method (a method for forming a water-repellent group or a water-repellent / oil-repellent group described later). Base layer).
  • the functional group layer (4, 14) composed of a methyl group or a hexyl group is formed on the surface of the charge retention layer (3, 13), but the present invention is not limited to this, If it is a functional group having a surface length of less than 1 nm and a low surface free energy of 50 mJ / m 2 or less, it consists of other functional groups (see hydrocarbon functional groups and fluoride functional groups described later).
  • a functional group layer may be formed on the surface of the charge retention layer.
  • any combination of a conductor and a dielectric or semiconductor can be used.
  • metal-doped titanium oxide or metal-doped silicon oxide is used. It is preferable to use it.
  • the metal is preferably at least one metal element selected from the group consisting of gold, silver, platinum, copper, zirconium, tin, manganese, nickel, cobalt, iron, zinc, alkali metal, alkaline earth metal, and at least Two are more preferred, especially silver or tin, and copper or iron.
  • Titanium oxide includes various oxides and peroxides such as TiO 2 , TiO 3 , TiO, TiO 3 / nH 2 O, and silicon oxide includes SiO 2 , SiO 3 , SiO, SiO 3 / nH 2 O, etc. Various oxides and peroxides can be used.
  • the thickness of the charge retention layer is not particularly limited, but is preferably in the range of 10 nm to 1 ⁇ m, and more preferably in the range of 10 nm to 100 nm.
  • reducing the surface free energy is equivalent to making the surface water-repellent or water- and oil-repellent.
  • the surface free energy is reduced by forming a water repellent group or a water / oil repellent group on the surface of the charge retention layer.
  • water repellent group examples include a hydrocarbon-based functional group.
  • hydrocarbon-based functional groups include alkyl groups, alkylene groups, phenyl groups, benzyl groups, phenethyl groups, hydroxyphenyl groups, chlorophenyl groups, aminophenyl groups, naphthyl groups, anthrenyl groups, pyrenyl groups, thienyl groups, pyrrolyl groups, Cyclohexyl group, cyclohexenyl group, cyclopentyl group, cyclopentenyl group, pyridinyl group, chloromethyl group, methoxyethyl group, hydroxyethyl group, aminoethyl group, cyano group, mercaptopropyl group, vinyl group, acryloxyethyl group, methacryloxy Examples thereof include an ethyl group, a glycidoxypropyl group, and an acetoxy group.
  • examples of water / oil repellent groups include fluoride functional groups.
  • Fluoride-based functional groups include fluoroalkyl groups, fluoroalkylene groups, fluorophenyl groups, fluorobenzyl groups, fluorophenethyl groups, fluoronaphthyl groups, fluoroanthrenyl groups, fluoropyrenyl groups, fluorothienyl groups, fluoropyrrolyl groups , A fluorocyclohexyl group, a fluorocyclohexenyl group, a fluorocyclopentyl group, a fluorocyclopentenyl group, a fluoropyridinyl group, a fluoromethoxyethyl group, an aminofluoroethyl group, a fluorovinyl group, or a fluoroacetoxy group.
  • a self-assembled monolayer As a method for forming the above water-repellent group or water / oil-repellent group (hydrocarbon functional group or fluoride functional group) on the surface of the charge retention layer, a self-assembled monolayer (SAM) is used. Chemical adsorption, plasma CVD deposition, sol-gel formation, nano-particle coating, method using surface modifiers, thin film formation by alternate lamination, composite plating, electrophoresis, or etching Can do.
  • SAM self-assembled monolayer
  • Example 1 Solution for forming a charge retention layer
  • a solution made by Sustainable Technology Co., Ltd. was used as a solution for forming a charge retention layer.
  • copper-doped anatase-type titanium peroxide, tin-doped anatase-type titanium peroxide, zirconium-doped anatase-type titanium peroxide, and potassium-doped polysilicate were mixed at a mixing ratio (weight ratio) shown in Table 1 below. This was used as a solution for forming a charge retention layer.
  • the solution for charge retention layer formation is applied on the surface of a 100 mm x 100 mm glass substrate (float glass) so that the thickness after formation is 100 nm, and the coating solution is 15 at 200 ° C.
  • the charge retention layer was formed on the surface of the glass substrate (base) by partial curing.
  • Self-assembled monolayer formation (functional group layer formation)
  • the glass substrate on which the charge retention layer was formed and a solution for forming a self-assembled monolayer: 0.5 ml of trimethoxymethylsilane were housed in a sealed container, and the sealed container was placed in a vacuum heating furnace. Then, by heating at 170 ° C. for 2 hours in a reduced pressure atmosphere with a furnace pressure of 0.1 kPa or less, a methyl group was adsorbed on the surface of the charge retention layer to form a self-assembled monolayer (SAM). (See FIG. 1).
  • SAM self-assembled monolayer
  • a self-assembled monolayer (functional group) is formed by forming a charge retention layer on the surface of the glass substrate prepared in [Example 1], and adsorbing methyl groups on the surface of the charge retention layer.
  • the formed substrate was used as the evaluation substrate 1.
  • Example 2 A charge retention layer was formed on the surface of a 100 mm ⁇ 100 mm glass substrate (float glass) by the same treatment as [Example 1].
  • the glass substrate on which the charge retention layer was formed and a solution for forming a self-assembled monolayer 0.5 ml of hexatrimethoxysilane were housed in a sealed container, and the sealed container was placed in a vacuum heating furnace. Then, by heating for 2 hours at 170 ° C. in a reduced pressure atmosphere with a furnace pressure of 0.1 kPa or less, hexyl groups were adsorbed on the surface of the charge retention layer to form a self-assembled monolayer (SAM). (See FIG. 2).
  • a self-assembled monolayer (functional group) is formed by forming a charge retention layer on the surface of the glass substrate prepared in [Example 2], and adsorbing a hexyl group on the surface of the charge retention layer.
  • the formed substrate was used as the evaluation substrate 2.
  • the glass substrate on which the charge retention layer was formed and a solution for forming a self-assembled monolayer: 0.5 ml of octadecyltrimethoxysilane were housed in a sealed container, and the sealed container was placed in a vacuum heating furnace. Then, by heating at 170 ° C. for 2 hours in a reduced pressure atmosphere with a furnace pressure of 0.1 kPa or less, the octadecyl group was adsorbed on the surface of the charge retention layer to form a self-assembled monolayer (SAM). (See FIG. 3).
  • ⁇ S d , ⁇ S p , and ⁇ S h represent a dispersion force component, a polar force component, and a hydrogen bonding force component of the substrate (functional group layer, charge holding layer), respectively.
  • ⁇ L , ⁇ L d , ⁇ L p , and ⁇ L h represent the surface free energy, dispersion force component, polar force component, and hydrogen bonding force component of the solvent, respectively.
  • the surface free energy ⁇ L , dispersion force component ⁇ L d , polar force component ⁇ L p , and hydrogen bonding force component ⁇ L h of each solvent of water, diiodomethane, and n-hexadecane are known.
  • Table 2 below also describes the thickness of the self-assembled monolayer (functional group thickness).
  • the thickness is the length of the self-assembled monolayer (functional group) from the surface of the charge retention layer (see FIGS. 1 to 3).
  • the evaluation substrates 1 and 2 that adsorb each functional group of methyl group and hexyl group on the surface and the comparative substrate 2 that adsorbs octadecyl group (functional group) on the surface adsorb the functional group. It was confirmed that the surface free energy was reduced as compared with the comparative substrate 1 without. Specifically, in the comparative substrate 1 in which the functional group is not adsorbed on the surface, the surface free energy is 100 mJ / m 2 or more, whereas the evaluation substrates 1 and 2 and the comparative substrate 2 in which the functional group is adsorbed on the surface. Then, it has been confirmed that the surface free energy can be set to a low value of 50 mJ / m 2 or less.
  • the apparatus shown in FIG. 4 includes a halogen light 101, a condensing lens 102 that condenses the output light (halogen light) of the halogen light 101 onto a sample S (each substrate for measuring transmittance), and light that has passed through the sample S. And a personal computer 104 to which an output signal of the photodetector 103 is input.
  • the personal computer 104 obtains the transmittance of the halogen light of the sample S (the transmitted light intensity of the sample S / the incident light intensity to the sample S) based on the output signal of the photodetector 103. Furthermore, the personal computer 104 obtains the difference (transmittance change rate) between the transmittance of the sample S before the particle adhesion test and the transmittance of the sample S after the particle adhesion test.
  • the sample S (the one before the particle adhesion test and the one after the particle adhesion test) of each of the evaluation substrate 1, the evaluation substrate 2, the comparison substrate 1, and the comparison substrate 2 are set in such an apparatus.
  • the rate of change in transmittance before and after the particle adhesion test was measured. The results are shown in Table 3 below.
  • Table 3 the change rate (%) of each transmittance of the evaluation substrates 1 and 2 and the comparison substrate 2 is shown with the change rate of the transmittance of the comparison substrate 1 being 100.
  • Table 3 shows that the smaller the rate of change in transmittance (the rate of change in transmittance before and after the particle adhesion test), the lower the amount of substance (particles) attached to the substrate surface.
  • Table 3 also shows the thickness of the self-assembled monolayer (functional group thickness).
  • the evaluation substrate 1 and the evaluation substrate 2 that is, a functional group (methyl group, hexyl group) having a low surface free energy of 50 mJ / m 2 or less is adsorbed on the surface, and the thickness of the functional group layer is less than 1 nm (
  • the substrate having a thickness of 0.19 nm and 0.89 nm has a smaller change rate of transmittance than the comparative substrate 1 that does not adsorb the functional group, and the antifouling performance (the effect of reducing substance adhesion) is improved.
  • the functional group is adsorbed when the functional group layer is thick (2.0 nm). It was confirmed that the change rate of the transmittance was larger than that of the comparative substrate 1 (which reduces the adhesion of the substance only by the electrostatic repulsive force), and the antifouling performance was lowered.
  • the present invention can be effectively used for a substrate protective film that reduces the adhesion of substances to the surface of the substrate, an adhesion preventing member having such a substrate protective film formed on the surface, and a method for forming the same. .

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  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Surface Treatment Of Glass (AREA)
  • Prevention Of Fouling (AREA)

Abstract

Le problème à la base de la présente invention concerne un film de protection de substrat qui peut réduire l'adhérence d'une substance sur la surface d'un substrat de manière plus efficace qu'un effet de réduction d'adhérence d'une substance obtenu par une force de répulsion électrostatique. Selon la solution selon l'invention, une première couche (une couche de rétention de charge 3) contenant une substance chargée et présentant une force de répulsion électrostatique est formée sur la surface d'un substrat 1 puis une deuxième couche (une couche de groupe fonctionnel 4 qui comprend un groupe fonctionnel présentant une longueur de groupe fonctionnel inférieure à 1 nm et présentant une énergie superficielle libre inférieure aussi basse que 50 mJ/m2 ou moins) pour réguler une énergie superficielle libre est formée sur la surface de la première couche. Lorsque le film 2 de protection de substrat est formé de cette manière, il devient possible de réduire l'adhérence d'une substance qui est provoquée par une force intermoléculaire tout en conservant la force de répulsion électrostatique sur la surface du substrat 1 et, par conséquent, il devient possible de réduire l'adhérence d'une substance sur la surface du substrat 1 plus efficacement qu'un effet de réduction d'adhérence de substance obtenu par une force de répulsion électrostatique.
PCT/JP2017/045923 2017-01-24 2017-12-21 Film de protection de substrat, élément antiadhésif et procédé de formation d'un élément antiadhésif WO2018139125A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201780083902.8A CN110225895B (zh) 2017-01-24 2017-12-21 基体保护膜、附着防止构件及附着防止构件的形成方法
KR1020197022786A KR102315145B1 (ko) 2017-01-24 2017-12-21 기체 보호막, 부착 방지 부재 및 부착 방지 부재의 형성 방법

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JP2017-010123 2017-01-24
JP2017010123A JP6441973B2 (ja) 2017-01-24 2017-01-24 基体保護膜及び付着防止部材

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JP (1) JP6441973B2 (fr)
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WO (1) WO2018139125A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5352485A (en) * 1993-04-08 1994-10-04 Case Western Reserve University Synthesis of metal oxide thin films
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