WO2018120382A1 - 精细掩膜板及其制作方法 - Google Patents

精细掩膜板及其制作方法 Download PDF

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Publication number
WO2018120382A1
WO2018120382A1 PCT/CN2017/073882 CN2017073882W WO2018120382A1 WO 2018120382 A1 WO2018120382 A1 WO 2018120382A1 CN 2017073882 W CN2017073882 W CN 2017073882W WO 2018120382 A1 WO2018120382 A1 WO 2018120382A1
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WIPO (PCT)
Prior art keywords
mask
organic material
carrier
side pressure
material film
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/CN2017/073882
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English (en)
French (fr)
Inventor
沐俊应
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US15/506,244 priority Critical patent/US20180355466A1/en
Publication of WO2018120382A1 publication Critical patent/WO2018120382A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0005—Separation of the coating from the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Definitions

  • the present invention relates to the field of fabrication of organic light emitting diode displays, and more particularly to a fine mask and a method of fabricating the same.
  • OLED Organic Light Emitting Diode
  • the OLED has an anode, an organic light-emitting layer, and a cathode which are sequentially formed on a substrate.
  • each layer of the material in the OLED needs to be evaporated onto the array substrate by an evaporation process, and in the evaporation process, a corresponding Fine Metal Mask (FMM) is required.
  • the OLED material is vapor-deposited to the designed position through the opening on the FMM. Specifically, by heating the OLED material, the OLED material is slowly changed into a gaseous sublimation, and then a film is formed on the surface of the substrate through the opening of the FMM.
  • the color display OLED display devices currently put into commercial production mainly include RGB three-color OLED display devices and white light OLEDs with color filter (CF) display devices.
  • RGB three-color OLED display devices are widely used in mobile display devices, and their FMM technology is the determining factor of display device resolution.
  • a mask consists of a Mask Frame and a Mask Sheet fixed by laser spot welding on the mask frame.
  • the conventional FMM mask (FMM Sheet) is mainly made of Invar material and subjected to double-sided photolithography and etching processes.
  • 1 is a schematic structural view of a conventional FMM.
  • a strip-shaped fine mask 200 having a plurality of pixel openings 210 is aligned with a metal frame 100 by a mask tension. Thereafter, they are welded together by laser, and then an integral FMM is applied to the vapor deposition process.
  • the resolution of traditional FMM is generally difficult to use for the preparation of display devices with resolutions exceeding 250 ppi.
  • the hole wall of the pixel opening 210 has a certain slope.
  • the incident angle of the OLED material passing through the pixel opening 210 at the edge of the pixel opening 210 is too large.
  • a shadow area is formed outside the set coating area to further reduce the resolution of the display device.
  • the object of the present invention is to provide a method for fabricating a fine mask, which has a simple manufacturing method, and has a small pixel opening size of the fine mask, and can reduce the shadow area of the coating during the vacuum evaporation process. Significantly improve the resolution of OLED display products.
  • the present invention provides a fine mask comprising a mask frame, a first mask fixed on the mask frame, and a mask disposed between the mask frame and the first mask.
  • Second mask Second mask
  • the first mask is provided with a plurality of first pixel openings
  • One or more second pixel openings are disposed in the region of the second mask corresponding to each of the first pixel openings;
  • the first mask is a metal mask
  • the second mask is an organic material mask
  • the material of the second mask is polyimide or polyamide, and the thickness of the second mask is 50 ⁇ m or less.
  • the material of the first mask is Invar, and the thickness of the first mask is 200 ⁇ m or less.
  • the invention also provides a method for manufacturing a fine mask, comprising the following steps:
  • Step 1 providing a first mask, a netting machine, and a carrier, wherein the first mask is provided with a plurality of first pixel openings; the netting machine has a plurality of grippers; Hand fixing the first mask on the carrier to ensure that the first mask is fully extended;
  • Step 2 providing a substrate, coating a substrate to form a film of an organic material, and curing the organic material film once;
  • Step 3 aligning the substrate with the first mask, bonding the substrate from the side of the organic material film to the first mask; performing secondary curing on the organic material film, and bonding the organic material film The first mask is bonded together;
  • Step 4 separating the substrate from the organic material film, wherein the organic material film exposes an edge region of the first mask on the first mask to subsequently face the first mask in the region
  • the film is laser welded
  • Step 5 providing a mask frame, and putting the mask frame into the netting machine; transferring the carrier plate to the top of the mask frame, and performing coarse alignment on the first mask and the mask frame;
  • Step 6 fixing the two ends of the first mask by the gripper of the netting machine to separate the carrier from the first mask;
  • Step 7 The first mask is flipped by the gripper so that the organic material film attached to the first mask is located at the uppermost position, and then the first mask and the mask frame are roughly aligned, and then passed.
  • the netting machine accurately positions the first mask and the mask frame, and fixes the first mask on the mask frame by laser welding;
  • Step 8 Laser ablation of a plurality of second pixel openings on the organic material film by using a laser device, the specific process is: precisely aligning the laser head of the laser device, and positioning the laser beam from the laser hair to the first Forming the first pixel opening in the region of the organic material film corresponding to each of the first pixel openings on the organic material film exposed by the first pixel opening of the mask Two masks.
  • the carrier board provided in the step 1 includes a carrier board body, two elastic modules respectively mounted on opposite sides of the carrier board body, and pressure members on both sides of the two elastic modules respectively disposed at the side a top fixing plate movably connected to the two side pressure members above the carrier body, a pressure member driving mechanism for driving the side pressure members to move left and right, and a fixing plate driving mechanism for driving the top fixing plate to move downward;
  • Each side pressure member comprises a side pressure plate and two connecting plates respectively perpendicularly connected to the two ends of the side pressure plate, so as to be U-shaped as a whole; each of the connecting plates has a downwardly extending fixing hole on the upper surface thereof ;
  • the two sides of the supporting plate body provided with the elastic module are respectively provided with two connecting grooves corresponding to the two connecting plates of the corresponding side pressure members on both sides of the corresponding elastic module;
  • Each of the fixing holes on the lower surface of the top fixing plate is provided with a downwardly extending fixing rod.
  • the process of fixing the first mask on the carrier board in the step 1 includes:
  • Step 11 The first mask is integrally formed in a strip shape, and includes a main body portion located at an intermediate portion and a connecting portion located at two sides of the main body portion, and grasping both ends of the first mask by using a gripper of the netting machine, The first mask is stretched toward both ends by the gripper, and after mechanically aligning, the main portion of the first mask is attached to the lower surface of the carrier substrate, and then the first mask is lifted up by the gripper. The two ends of the first mask are bent upward and then respectively attached to the elastic modules on both sides of the carrier body;
  • Step 12 driving the side pressure members through the pressure member driving mechanism, inserting the two connecting plates of each side pressure member into the corresponding connecting grooves, and causing each side pressure member to apply pressure to the corresponding elastic module. So that the fixing holes on each connecting plate reach a position below the corresponding fixing rod;
  • Step 13 inserting the fixing rod of the top fixing plate into the corresponding fixing hole by the fixing plate driving mechanism
  • Step 14 Remove the pressure member driving mechanism and the fixing plate driving mechanism. At this time, each side pressure member is subjected to the elastic force of being pressed outward by the corresponding elastic module, and the fixing on each side pressure member The hole is blocked by the corresponding fixing rod, so that the side pressure member is fixed, and at the same time, the connecting portion of the first mask is sandwiched between the side pressure plate and the elastic module, and is fixed by being pressed by the two.
  • the process of separating the carrier from the first mask in the step 6 specifically includes:
  • Step 61 The pressure member driving mechanism is configured to apply pressure to each of the side pressure members to the corresponding elastic module, so that the hole wall of the fixing hole and the corresponding fixing rod are separated from each other without being separated;
  • Step 62 moving the top fixing plate and the fixing rod thereof upward by the fixing plate driving mechanism, and separating the top fixing plate from the carrier body;
  • Step 63 the pressure member driving mechanism is slowly released to the pressure of the corresponding elastic module, so that the connecting portion of the first mask is separated from the elastic module;
  • Step 64 Grasp the grippers at both ends of the first mask to apply a certain pulling force to the first mask to maintain the extended state, so that the gripper maintains the pulling force and moves to both sides until the entire first mask is in a plane. Inside, and separating the first mask from the carrier matrix.
  • the material of the second mask is polyimide or polyamide, and the thickness of the second mask is 50 ⁇ m or less.
  • the material of the first mask is Invar, and the thickness of the first mask is 200 ⁇ m or less.
  • the organic material film is cured once by heat curing or UV curing;
  • the organic material film is subjected to secondary curing by means of thermal curing or UV curing;
  • step 3 and step 5 the CCD alignment or mechanical alignment is used to perform alignment
  • step 7 the CCD alignment or mechanical alignment is used for coarse alignment.
  • CCD alignment method for accurate alignment
  • step 8 the CCD is used to align the bit.
  • the invention also provides a method for manufacturing a fine mask, comprising the following steps:
  • Step 1 providing a first mask, a netting machine, and a carrier, wherein the first mask is provided with a plurality of first pixel openings; the netting machine has a plurality of grippers; Hand fixing the first mask on the carrier to ensure that the first mask is fully extended;
  • Step 2 providing a substrate, coating a substrate to form a film of an organic material, and curing the organic material film once;
  • Step 3 aligning the substrate with the first mask, bonding the substrate from the side of the organic material film to the first mask; performing secondary curing on the organic material film, and bonding the organic material film The first mask is bonded together;
  • Step 4 separating the substrate from the organic material film, wherein the organic material film exposes an edge region of the first mask on the first mask to subsequently face the first mask in the region
  • the film is laser welded
  • Step 5 providing a mask frame, and putting the mask frame into the netting machine; transferring the carrier plate to the top of the mask frame, and performing coarse alignment on the first mask and the mask frame;
  • Step 6 Fix the two ends of the first mask by the gripper of the netting machine, and separate the carrier from the first mask;
  • Step 7 The first mask is flipped by the gripper so that the organic material film attached to the first mask is located at the uppermost position, and then the first mask and the mask frame are roughly aligned, and then passed.
  • the netting machine accurately positions the first mask and the mask frame, and fixes the first mask on the mask frame by laser welding;
  • Step 8 Laser ablation of a plurality of second pixel openings on the organic material film by using a laser device, the specific process is: precisely aligning the laser head of the laser device with the first mask, and laser beam emitted from the laser hair Positioning on the organic material film exposed by the first pixel opening of the first mask, laser ablation of more than one second pixel in the area corresponding to each first pixel opening on the organic material film a hole forming the second mask;
  • the carrier board provided in the step 1 includes a carrier board body, two elastic modules respectively mounted on opposite sides of the carrier board body, and pressure members on both sides of the two elastic modules respectively, and are disposed on the carrier board a top fixing plate movably connected to the two side pressure members above the carrier body, a pressure member driving mechanism for driving the side pressure members to move left and right, and a fixing plate driving mechanism for driving the top fixing plate to move up and down ;
  • Each side pressure member comprises a side pressure plate and two connecting plates respectively perpendicularly connected to the two ends of the side pressure plate, so as to be U-shaped as a whole; each of the connecting plates has a downward extension on the upper surface thereof Fixed hole
  • the carrier body is provided on both sides of the elastic module, and two connecting grooves corresponding to the two connecting plates of the corresponding side pressure members are respectively disposed on two sides of the corresponding elastic module;
  • Each of the fixing holes on the lower surface of the top fixing plate is provided with a downwardly extending fixing rod
  • the material of the second mask is polyimide or polyamide, and the thickness of the second mask is 50 ⁇ m or less;
  • the material of the first mask is Invar, and the thickness of the first mask is 200 ⁇ m or less.
  • the present invention provides a fine mask comprising a mask frame, a first mask of a metal material, and a second mask of an organic material; the first mask is provided with a plurality of a pixel opening; one or more second pixel openings are disposed in the second mask corresponding to each of the first pixel openings, and the second pixel opening is corresponding to the corresponding first pixel opening
  • the region compared with the existing FMM, it can provide smaller pixel opening, which can be used to make smaller OLED devices in the vacuum evaporation process, and improve the resolution of the OLED display product;
  • the slope of the wall of the two-pixel opening can be controlled to be smaller, and the angle of incidence of the vapor-deposited material at the edge of the opening of the second pixel can be made smaller during the vacuum evaporation process, thereby reducing the shadow area of the coating and further improving OLED display product resolution.
  • the method for fabricating the fine mask of the present invention has a simple manufacturing method, and the prepared fine mask comprises a second mask of organic material, and the second mask is provided with a second pixel opening of a smaller size, and The slope of the hole wall of the second pixel opening can be controlled to be smaller, and the fine mask plate can be used in the vacuum evaporation process to make the evaporation material have a smaller incident angle at the edge of the second pixel opening, and the coating can be reduced.
  • the shaded area significantly improves the resolution of OLED display products.
  • FIG. 1 is a schematic structural view of a conventional FMM
  • FIG. 2 is a schematic structural view of a fine mask according to the present invention.
  • FIG. 3 is a schematic flow chart of a method for fabricating a fine mask according to the present invention.
  • step 1 of a method for fabricating a fine mask according to the present invention is a schematic view of step 1 of a method for fabricating a fine mask according to the present invention
  • Figure 5 is a bottom plan view of a carrier used in the method of fabricating the fine mask of the present invention.
  • step 2 is a schematic view of step 2 of a method for fabricating a fine mask according to the present invention.
  • Figure 7 is a schematic view showing the step 3 of the method for fabricating the fine mask of the present invention.
  • Figure 8 is a schematic view showing the step 4 of the method for fabricating the fine mask of the present invention.
  • Figure 9 is a schematic view showing the step 5 of the method for fabricating the fine mask of the present invention.
  • Figure 10 is a schematic view showing the step 7 of the method for fabricating the fine mask of the present invention.
  • FIG. 11 is a schematic cross-sectional view showing a first mask and an organic material film corresponding to a first pixel opening before laser ablation in step 8 of the method for fabricating a fine mask according to the present invention
  • FIG. 12 is a schematic cross-sectional view showing a first mask and a second mask at a corresponding opening of a first pixel after laser ablation in step 8 of the method for fabricating a fine mask according to the present invention
  • FIG. 13 is a schematic view showing the first mask and the organic material film at the first pixel opening of the corresponding portion before the laser ablation in the step 8 of the method for fabricating the fine mask according to the present invention
  • FIG 14 is a schematic view showing the first mask and the second mask at the first pixel opening of the corresponding portion after laser ablation in the step 8 of the method for fabricating the fine mask according to the present invention.
  • the present invention provides a fine mask comprising a mask frame 15, a first mask 11 fixed on the mask frame 15, and a first layer 11 disposed on the first mask 11.
  • the first mask 11 is provided with a plurality of first pixel openings 111;
  • the second mask 12 is provided with one or more second pixel openings 121 in a region corresponding to each of the first pixel openings 111;
  • the first mask 11 is a metal mask
  • the second mask 12 is an organic material mask.
  • the material of the second mask 12 is polyimide or polyamide, and the thickness of the second mask 12 is 50 ⁇ m or less, preferably 20 ⁇ m or less, and the second pixel is opened thereon.
  • 121 can be formed by laser ablation.
  • the first mask 11 may be an existing fine metal mask (FMM sheet), and the material may be Invar, and the thickness thereof is 200 ⁇ m or less, preferably 50 ⁇ m or less.
  • FMM sheet existing fine metal mask
  • the material may be Invar, and the thickness thereof is 200 ⁇ m or less, preferably 50 ⁇ m or less.
  • two second pixel openings 121 are disposed in the first mask opening 111 corresponding to each of the first pixel openings 111.
  • the fine mask of the present invention also includes a second mask of organic material compared with the existing FMM.
  • the film 12 as shown in FIG. 12 has a width w2 of the second pixel opening 121 on the second mask 12 that is smaller than a width w1 of the first pixel opening 111, that is, the fine mask of the present invention is adjacent to the existing FMM.
  • a pixel opening of a smaller size can be provided, so that a smaller size OLED device can be used in the vacuum evaporation process to improve the resolution of the OLED display product; and the second pixel opening 121 can be ablated by laser ablation
  • the method is formed such that the slope of the hole wall can be controlled to be smaller, and then the fine mask of the present invention can be used in the vacuum evaporation process to make the angle of incidence of the vapor deposition material at the edge of the second pixel opening 121 ⁇ 2, compared with The incident angle ⁇ 1 emitted from the edge of the first pixel opening 111 is smaller, so that the shadow area of the coating can be reduced, and the resolution of the OLED display product is remarkably improved.
  • the present invention further provides a method for fabricating the above fine mask, comprising the following steps:
  • Step 1 as shown in FIG. 4, a first mask 11, a netting machine, and a carrier 50 are provided, and the first mask 11 is provided with a plurality of first pixel openings 111; a grip 71; the first mask 11 is fixed on the carrier 50 by the grip 71 of the screen machine to ensure that the first mask 11 is fully extended.
  • the material of the first mask 11 is Invar, and the thickness of the first mask 11 is 50 ⁇ m or less.
  • the carrier board 50 provided in the step 1 includes a carrier board body 51, and two elastic modules 52 respectively mounted on opposite sides of the carrier board body 51, respectively disposed on the two elastic modules.
  • the two side pressure members 53 on both sides of the 52, the top fixing plate 54 movably connected to the two side pressure members 53 above the carrier body 51, and the pressure member for driving the side pressure members 53 to move left and right a driving mechanism 55, and a fixed plate driving mechanism 56 for driving the top fixing plate 54 to move up and down;
  • Each of the side pressure members 53 includes a side pressure plate 531 and two connecting plates 532 respectively perpendicularly connected to the two ends of the side pressure plate 531, so as to be U-shaped as a whole; each of the connecting plates 532 has an upper surface a lower extending fixing hole 535; two sides of the carrier body 51 provided with the elastic module 52 are respectively provided on the two sides of the corresponding elastic module 52 with two connecting plates 532 corresponding to the corresponding side pressure members 53
  • the fixing groove 511 is disposed on the lower surface of the top fixing plate 54 corresponding to each fixing hole 535.
  • the process of fixing the first mask 11 on the carrier 50 in the step 1 includes:
  • Step 11 The first mask 11 is integrally formed in a strip shape, and includes a main body portion 115 located at the middle and a connecting portion 116 located at two sides of the main body portion 115.
  • the first mask 11 is grasped by the grip 71 of the netting machine. At both ends, the first mask 11 is stretched toward both ends by the grip 71, and after mechanically aligning, the main body portion 115 of the first mask 11 is bonded to the lower surface of the carrier substrate 51. Then, the two ends of the first mask 11 are lifted upward by the grip 71, so that the connecting portion 116 of the first mask 11 is bent upward and then attached to the elastic module 52 on both sides of the carrier mother 51.
  • Step 12 driving the side pressure members 53 through the pressure member driving mechanism 55, inserting the two connecting plates 532 of each side pressure member 53 into the corresponding connecting grooves 511, and causing each side pressure member 53 to correspond accordingly.
  • the elastic module 52 applies pressure such that the fixing holes 535 on each of the connecting plates 532 reach a position below the corresponding fixing rod 545.
  • Step 13 The fixing rod 545 of the top fixing plate 54 is inserted into the corresponding fixing hole 535 by the fixing plate driving mechanism 56.
  • Step 14 removing the pressure member driving mechanism 55 and the fixing plate driving mechanism 56.
  • each side pressure member 53 is subjected to the elastic force of being pressed outward under the action of the corresponding elastic module 52, and the pressure of each side portion
  • the fixing hole 535 of the member 53 is blocked by the corresponding fixing rod 545, so that the side pressure member 53 is fixed, and the connecting portion 116 of the first mask 11 is sandwiched between the side pressure plate 531 and the elastic module 52, It is fixed by the squeeze of both.
  • Step 2 as shown in FIG. 6, a substrate 60 is provided, which is coated on the substrate 60 to form a layer of organic material by means of slit coating, spray coating, or spin-coating.
  • the film 12' is cured once by the organic material film 12' by heat curing or UV curing.
  • the material of the organic material film 12' is polyimide or polyamide, and the thickness of the organic material film 12' is 20 ⁇ m or less.
  • Step 3 as shown in FIG. 7, the substrate 60 is aligned with the first mask 11 by means of CCD alignment or mechanical alignment, and the alignment accuracy is about 200 ⁇ m or better, and the substrate 60 is removed from the organic material film 12.
  • the organic material film 12' is secondarily cured by heat curing or UV curing, and the organic material film 12' is adhered to the first mask 11 put them together.
  • Step 4 the substrate 60 is separated from the organic material film 12' by laser lift off (LLO) or other techniques. At this time, the organic material film 12' is at the first An edge region of the first mask 11 is exposed on the mask 11 to subsequently laser-weld the first mask 11 in the region.
  • LLO laser lift off
  • Step 5 as shown in FIG. 9, providing a mask frame 15 to put the mask frame 15 into the netting machine; transferring the carrier plate 50 to the top of the mask frame 15, using CCD alignment or mechanical alignment
  • the first mask 11 and the mask frame 15 are roughly aligned, and the alignment accuracy is about 200 ⁇ m or better.
  • Step 6 Fix the two ends of the first mask 11 by the grip 71 of the netting machine, and separate the carrier 50 from the first mask 11.
  • the process of separating the carrier 50 from the first mask 11 in the step 6 specifically includes:
  • Step 61 The pressure member driving mechanism 55 causes each side pressure member 53 to apply pressure to the corresponding elastic module 52, respectively, so that the hole wall of the fixing hole 535 and the corresponding fixing rod 545 are separated from each other without contact.
  • Step 62 the top fixing plate 54 and its fixing rod 545 are moved upward by the fixing plate driving mechanism 56, and the top fixing plate 54 is separated from the carrier main body 51.
  • Step 63 The pressure member driving mechanism 55 is slowly released from the pressure of the corresponding elastic module 52, so that the connecting portion 116 of the first mask 11 is separated from the elastic module 52.
  • Step 64 Grasp the grip 71 of the first mask 11 to apply a certain pulling force to the first mask 11 to maintain the extended state, so that the grip 71 maintains the pulling force and moves to both sides until the entire first mask
  • the film 11 is in a plane and the first mask 11 is separated from the carrier substrate 51.
  • Step 7 as shown in FIG. 10, the first mask 11 is flipped by the grip 71 so that the organic material film 12' attached to the first mask 11 is located at the top, and then the CCD is used, or mechanically In the manner of alignment, the first mask 11 and the mask frame 15 are coarsely aligned, the alignment precision is 1 mm or better, and the first mask 11 is passed through the screen machine by means of CCD alignment.
  • the first mask 11 is fixed to the mask frame 15 by laser welding by precisely aligning the mask frame 15 with a registration accuracy of 1 ⁇ m or better.
  • Step 8 As shown in FIG. 11-14, a plurality of second pixel openings 121 are laser ablated on the organic material film 12' by using a laser device.
  • the specific process is to use a CCD alignment method to the laser head of the laser device. Accurate alignment, alignment accuracy of 2 ⁇ m or better, positioning the laser beam from the laser hair onto the organic material film 12' exposed by the first pixel opening 111 of the first mask 11, in the organic material film One or more second pixel openings 121 are laser-ablated in the region corresponding to each of the first pixel openings 111 on the 12' to form the second mask 12, resulting in a fine mask as shown in FIG.
  • the present invention provides a fine mask comprising a mask frame, a first mask of a metal material, and a second mask of an organic material; the first mask is provided with a plurality of first a pixel opening; wherein the second mask has one or more second pixel openings in a region corresponding to each of the first pixel openings, and the second pixel opening corresponds to the region corresponding to the first pixel opening
  • the existing FMM it can provide a pixel opening of a smaller size, so that it can be used to make a smaller-sized OLED device in the vacuum evaporation process, and improve the resolution of the OLED display product;
  • the slope of the hole wall of the pixel opening can be controlled to be smaller, and the angle of incidence of the vapor deposition material at the edge of the opening of the second pixel can be made smaller during the vacuum evaporation process, thereby reducing the shadow area of the coating and further improving the OLED.
  • the method for fabricating the fine mask of the present invention has a simple manufacturing method, and the prepared fine mask comprises a second mask of organic material, and the second mask is provided with a second pixel opening of a smaller size, and The slope of the hole wall of the second pixel opening can be controlled to be smaller, and the fine mask plate can be used in the vacuum evaporation process to make the evaporation material in the second The incident angle at the edge of the pixel opening is smaller, which can reduce the shadow area of the coating and significantly improve the resolution of the OLED display product.

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Abstract

一种精细掩膜板及其制作方法。精细掩膜板包括掩膜边框(15)、金属材料的第一掩膜(11)、及有机材料的第二掩膜(12)；第一掩膜(11)上设有数个第一像素开孔(111)；第二掩膜(12)上对应每一第一像素开孔(111)的区域内设有一个以上的第二像素开孔(121)，由于第二像素开孔(121)对应设于对应第一像素开孔(111)的区域内，与现有的FMM相比，能够提供更小尺寸的像素开孔，从而能够用于真空蒸镀过程中制作更小尺寸的OLED器件，提高OLED显示产品的解析度；同时由于该第二像素开孔(121)的孔壁坡度可控制的更小，用于真空蒸镀过程中可使得蒸镀材料在第二像素开孔(121)边缘处的入射角度更小，从而能够减小镀膜阴影区域，进一步提高OLED显示产品的解析度。

Description

精细掩膜板及其制作方法 技术领域
本发明涉及有机发光二极管显示器的制作领域，尤其涉及一种精细掩膜板及其制作方法。
背景技术
有机发光二级管显示器(Organic Light Emitting Diode，OLED)是一种极具发展前景的平板显示技术，它具有十分优异的显示性能，特别是自发光、结构简单、超轻薄、响应速度快、宽视角、低功耗及可实现柔性显示等特性，被誉为“梦幻显示器”，再加上其生产设备投资远小于TFT-LCD，得到了各大显示器厂家的青睐，已成为显示技术领域中第三代显示器件的主力军。目前OLED已处于大规模量产的前夜，随着研究的进一步深入，新技术的不断涌现，OLED显示器件必将有一个突破性的发展。
OLED具有依次形成于基板上的阳极、有机发光层和阴极。在制备OLED显示器件时，需要将OLED中的各层材料通过蒸镀工艺蒸镀到阵列基板上，而且在蒸镀过程中，需要使用到相应的精细金属掩膜板(Fine Metal Mask，FMM)，通过FMM上的开孔使OLED材料蒸镀到设计的位置，具体地，通过加热OLED材料，使得OLED材料慢慢变成气态升华，然后穿过FMM的开孔沉积在基板表面形成薄膜。当前投入商业化生产的进行彩色显示的OLED显示器件主要有RGB三色OLED显示器件和白光OLED搭配彩色滤光片(color filter，CF)的显示器件。其中，RGB三色OLED显示器件当前广泛应用于移动显示设备，其FMM技术是显示器件解析度的决定因素。
通常掩膜板(Mask)由掩膜框架(Mask Frame)和通过激光点焊固定在掩膜框架上的掩膜(Mask Sheet)所组成。传统FMM的掩膜(FMM Sheet)主要使用因瓦合金(Invar)材料，经过双面光刻、蚀刻工艺制造而成。图1为传统FMM的结构示意图，如图1所示，现有技术中通过张网机(mask tension)将条状的具有多个像素开孔210的精细掩膜200与一个金属框架100对位后，通过激光焊接在一起，然后构成一整体的FMM再应用于蒸镀工艺。传统FMM的解析度一般难以用于制备解析度超过250ppi的显示器件，随着对显示器件解析度需求的日益提高(如300ppi以上)，现有FMM制造技术已经难以满足需求，另外，由于制作工艺的原因，精细掩膜200 上的像素开孔210的孔壁具有一定的坡度，那么用于真空蒸镀过程中时，OLED材料穿过像素开孔210在像素开孔210边缘处的入射角度(Incident angle)过大，就会在设定的镀膜区域外延伸形成阴影(shadow)区域，会进一步降低显示器件的解析度。
因此，有必要设计一种新的精细掩膜板及其制作方法，以解决上述问题。
发明内容
本发明的目的在于提供一种精细掩膜板，能够提供更小尺寸像素开孔，且用于真空蒸镀过程中可减小镀膜阴影区域，显著提高OLED显示产品的解析度。
本发明的目的还在于提供一种精细掩膜板的制作方法，制作方法简单，所制得的精细掩膜板的像素开孔尺寸小，且用于真空蒸镀过程中可降低镀膜阴影区域，显著提高OLED显示产品的解析度。
为实现上述目的，本发明提供一种精细掩膜板，包括掩膜边框、固定于所述掩膜边框上的第一掩膜、及设于所述掩膜边框与第一掩膜之间的第二掩膜；
所述第一掩膜上设有数个第一像素开孔；
所述第二掩膜上对应每一第一像素开孔的区域内均设有一个以上的第二像素开孔；
所述第一掩膜为金属掩膜，所述第二掩膜为有机材料掩膜。
所述第二掩膜的材料为聚酰亚胺、或聚酰胺，所述第二掩膜的厚度为50μm以下。
所述第一掩膜的材料为因瓦合金，所述第一掩膜的厚度为200μm以下。
本发明还提供一种精细掩膜板的制作方法，包括如下步骤：
步骤1、提供第一掩膜、张网机、及载板，所述第一掩膜上设有数个第一像素开孔；所述张网机具有多个抓手；利用张网机的抓手将所述第一掩膜固定在载板上，确保所述第一掩膜充分延展；
步骤2、提供基板，在基板上涂覆形成一层有机材料膜，对有机材料膜进行一次固化；
步骤3、对基板与第一掩膜进行对位，将基板从有机材料膜一侧与所述第一掩膜进行贴合；对所述有机材料膜进行二次固化，将有机材料膜与所述第一掩膜粘合在一起；
步骤4、将基板与有机材料膜分离，此时，所述有机材料膜在所述第一掩膜上露出所述第一掩膜的边缘区域，以在后续在该区域对所述第一掩膜进行激光焊接；
步骤5、提供掩膜边框，将掩膜边框投入至张网机中；将载板转移到掩膜边框上方，对所述第一掩膜与掩膜边框进行粗对位；
步骤6、然后通过张网机的抓手固定所述第一掩膜的两端，将载板与所述第一掩膜分离；
步骤7、通过抓手将第一掩模翻转，使得附着在所述第一掩模上的有机材料膜位于最上方，然后对所述第一掩膜与掩膜边框进行粗对位，再通过张网机对所述第一掩膜与掩膜边框进行精确对位，通过激光焊接将所述第一掩膜固定在掩膜边框上；
步骤8、利用激光设备在有机材料膜上激光烧蚀出数个第二像素开孔，具体过程为，对激光设备的激光头精确对位，将激光头发出的激光光束定位到所述第一掩膜的第一像素开孔所露出的有机材料膜上，在有机材料膜上对应每一第一像素开孔的区域内均激光烧蚀出一个以上的第二像素开孔，形成所述第二掩膜。
所述步骤1中提供的载板包括载板母体、分别安装在载板母体两相对侧面上的两弹性模块、分别设于所述两弹性模块两侧的两侧部压力件、设于所述载板母体上方与所述两侧部压力件活动连接的顶部固定板、驱动所述侧部压力件左右移动的压力件驱动机构、及驱动所述顶部固定板上下移动的固定板驱动机构；
每一侧部压力件均包括一侧面压力板、及分别垂直连接于侧面压力板两端的两连接板，从而整体呈U形；每一连接板的上表面上均设有向下延伸的固定孔；
所述载板母体的设有弹性模块的两侧面上，均在相应弹性模块的两侧分别设有对应相应侧部压力件的两连接板的两连接凹槽；
所述顶部固定板的下表面上对应每一固定孔均设有一向下延伸的固定杆。
所述步骤1中将所述第一掩膜固定在载板上的过程具体包括：
步骤11、所述第一掩膜整体成条状，包括位于中间的主体部、及位于主体部两侧的连接部，使用张网机的抓手抓住第一掩膜的两端，所述第一掩膜在抓手的作用下向两端拉伸，经机械对位后，使第一掩膜的主体部与载板母体的下表面贴合，再由抓手向上提起第一掩膜的两端，使得第一掩膜的连接部向上弯曲后分别贴合在载板母体两侧的弹性模块上；
步骤12、通过压力件驱动机构驱动侧部压力件，将每一侧部压力件的两连接板均插入相应的连接凹槽中，并使得每一侧部压力件向相应的弹性模块施加压力，使得每一连接板上的固定孔达到位于对应固定杆下方的位置；
步骤13、通过固定板驱动机构将顶部固定板的固定杆插入相应的固定孔中；
步骤14、移开压力件驱动机构、及固定板驱动机构，此时，每一侧部压力件在相应弹性模块的作用下受到到往外挤压的弹力，并且每一侧部压力件上的固定孔受到相应固定杆的阻挡，从而侧部压力件被固定，同时，所述第一掩膜的连接部夹于侧面压力板和弹性模块之间，受到二者的挤压而固定。
所述步骤6中将载板与所述第一掩膜分离的过程具体包括：
步骤61、通过压力件驱动机构使得每一侧部压力件分别向相应的弹性模块施加压力，使得固定孔的孔壁与相应的固定杆之间不接触而分离；
步骤62、通过固定板驱动机构将顶部固定板及其固定杆往上移动，将顶部固定板与载板母体分离；
步骤63、使压力件驱动机构缓慢释放对相应弹性模块的压力，使得所述第一掩膜的连接部与弹性模块分离；
步骤64、抓住第一掩膜两端的抓手对第一掩膜施加一定拉力，使之保持伸展状态，使抓手保持该拉力并向两侧移动，直至整条第一掩膜处于一个平面内，并使得第一掩膜与载板母体分离。
所述第二掩膜的材料为聚酰亚胺、或聚酰胺，所述第二掩膜的厚度为50μm以下。
所述第一掩膜的材料为因瓦合金，所述第一掩膜的厚度为200μm以下。
所述步骤2中采用狭缝涂布、喷涂、或旋涂的方式在基板上涂覆形成有机材料膜；
所述步骤2中采用热固化、或UV固化的方式对所述有机材料膜进行一次固化；
所述步骤3中采用热固化、或UV固化的方式对所述有机材料膜进行二次固化；
所述步骤4中采用激光剥离技术将基板与有机材料膜分离；
所述步骤3和步骤5中均采用CCD对位、或机械对位的方式进行对位；
所述步骤7中采用CCD对位、或机械对位的方式进行粗对位，采用 CCD对位的方式进行精确对位；
所述步骤8中采用CCD对位的方式进行对位。
本发明还提供一种精细掩膜板的制作方法，包括如下步骤：
步骤1、提供第一掩膜、张网机、及载板，所述第一掩膜上设有数个第一像素开孔；所述张网机具有多个抓手；利用张网机的抓手将所述第一掩膜固定在载板上，确保所述第一掩膜充分延展；
步骤2、提供基板，在基板上涂覆形成一层有机材料膜，对有机材料膜进行一次固化；
步骤3、对基板与第一掩膜进行对位，将基板从有机材料膜一侧与所述第一掩膜进行贴合；对所述有机材料膜进行二次固化，将有机材料膜与所述第一掩膜粘合在一起；
步骤4、将基板与有机材料膜分离，此时，所述有机材料膜在所述第一掩膜上露出所述第一掩膜的边缘区域，以在后续在该区域对所述第一掩膜进行激光焊接；
步骤5、提供掩膜边框，将掩膜边框投入至张网机中；将载板转移到掩膜边框上方，对所述第一掩膜与掩膜边框进行粗对位；
步骤6、通过张网机的抓手固定所述第一掩膜的两端，将载板与所述第一掩膜分离；
步骤7、通过抓手将第一掩模翻转，使得附着在所述第一掩模上的有机材料膜位于最上方，然后对所述第一掩膜与掩膜边框进行粗对位，再通过张网机对所述第一掩膜与掩膜边框进行精确对位，通过激光焊接将所述第一掩膜固定在掩膜边框上；
步骤8、利用激光设备在有机材料膜上激光烧蚀出数个第二像素开孔，具体过程为，对激光设备的激光头与第一掩膜进行精确对位，将激光头发出的激光光束定位到所述第一掩膜的第一像素开孔所露出的有机材料膜上，在有机材料膜上对应每一第一像素开孔的区域内均激光烧蚀出一个以上的第二像素开孔，形成所述第二掩膜；
其中，所述步骤1中提供的载板包括载板母体、分别安装在载板母体两相对侧面上的两弹性模块、分别设于所述两弹性模块两侧的两侧部压力件、设于所述载板母体上方与所述两侧部压力件活动连接的顶部固定板、驱动所述侧部压力件左右移动的压力件驱动机构、及驱动所述顶部固定板上下移动的固定板驱动机构；
每一侧部压力件均包括一侧面压力板、及分别垂直连接于侧面压力板两端的两连接板，从而整体呈U形；每一连接板的上表面上均设有向下延 伸的固定孔；
所述载板母体设有弹性模块的两侧面上，均在相应弹性模块的两侧分别设有对应相应侧部压力件的两连接板的两连接凹槽；
所述顶部固定板的下表面上对应每一固定孔均设有一向下延伸的固定杆；
其中，所述第二掩膜的材料为聚酰亚胺、或聚酰胺，所述第二掩膜的厚度为50μm以下；
其中，所述第一掩膜的材料为因瓦合金，所述第一掩膜的厚度为200μm以下。
本发明的有益效果：本发明提供的一种精细掩膜板，包括掩膜边框、金属材料的第一掩膜、及有机材料的第二掩膜；所述第一掩膜上设有数个第一像素开孔；所述第二掩膜上对应每一第一像素开孔的区域内设有一个以上的第二像素开孔，由于第二像素开孔对应设于对应第一像素开孔的区域内，与现有的FMM相比，能够提供更小尺寸的像素开孔，从而能够用于真空蒸镀过程中制作更小尺寸的OLED器件，提高OLED显示产品的解析度；同时由于该第二像素开孔的孔壁坡度可控制的更小，用于真空蒸镀过程中可使得蒸镀材料在第二像素开孔边缘处的入射角度更小，从而能够减小镀膜阴影区域，进一步提高OLED显示产品的解析度。本发明的精细掩膜板的制作方法，制作方法简单，所制得的精细掩膜板包括有机材料的第二掩膜，第二掩膜上设有较小尺寸的第二像素开孔，且该第二像素开孔的孔壁坡度可控制的更小，该精细掩膜板用于真空蒸镀过程中可使得蒸镀材料在第二像素开孔边缘处的入射角度更小，可降低镀膜阴影区域，显著提高OLED显示产品的解析度。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为一传统FMM的结构示意图；
图2为本发明的精细掩膜板的结构示意图；
图3为本发明的精细掩膜板的制作方法的流程示意图；
图4为本发明的精细掩膜板的制作方法的步骤1的示意图；
图5为本发明的精细掩膜板的制作方法中所使用的载板的仰视示意图；
图6为本发明的精细掩膜板的制作方法的步骤2的示意图；
图7为本发明的精细掩膜板的制作方法的步骤3的示意图；
图8为本发明的精细掩膜板的制作方法的步骤4的示意图；
图9为本发明的精细掩膜板的制作方法的步骤5的示意图；
图10为本发明的精细掩膜板的制作方法的步骤7的示意图；
图11为本发明的精细掩膜板的制作方法的步骤8中进行激光烧蚀前第一掩膜与有机材料膜在对应一第一像素开孔处的剖面示意图；
图12为本发明的精细掩膜板的制作方法的步骤8中进行激光烧蚀后第一掩膜与第二掩膜在对应一第一像素开孔处的剖面示意图；
图13为本发明的精细掩膜板的制作方法的步骤8中进行激光烧蚀前第一掩膜与有机材料膜在对应部分第一像素开孔处的附视示意图；
图14为本发明的精细掩膜板的制作方法的步骤8中进行激光烧蚀后第一掩膜与第二掩膜在对应部分第一像素开孔处的附视示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2，本发明提供一种精细掩膜板，包括掩膜边框15、固定于所述掩膜边框15上的第一掩膜11、及设于所述第一掩膜11上的第二掩膜12；
所述第一掩膜11上设有数个第一像素开孔111；
所述第二掩膜12上对应每一第一像素开孔111的区域内均设有一个以上的第二像素开孔121；
所述第一掩膜11为金属掩膜，所述第二掩膜12为有机材料掩膜。
具体地，所述第二掩膜12的材料为聚酰亚胺、或聚酰胺，所述第二掩膜12的厚度为50μm以下，优选为20μm或更薄，其上的第二像素开孔121可通过激光烧蚀的方法形成。
具体地，所述第一掩膜11可采用现有的精细金属掩膜(FMM sheet)，其材料可选用因瓦合金，其厚度为为200μm以下，优选为50μm或更薄。
具体地，在本实施例中，所述第二掩膜12上对应每一第一像素开孔111内设有两个第二像素开孔121。
本发明的精细掩膜板，与现有的FMM相比，还包括有机材料的第二掩 膜12，如图12所示，第二掩膜12上的第二像素开孔121的宽度w2小于第一像素开孔111的宽度w1，即本发明的精细掩膜板与现有的FMM相比，可提供更小尺寸的像素开孔，从而能够用于真空蒸镀过程中制作更小尺寸的OLED器件，提高OLED显示产品的解析度；另外该第二像素开孔121可通过激光烧蚀的方法形成，其孔壁坡度可控制的更小，那么本发明的精细掩膜板用于真空蒸镀过程中可使得蒸镀材料在第二像素开孔121边缘处的入射角度Θ2，相较于单从第一像素开孔111边缘处射出的入射角度Θ1更小，从而能够减小镀膜阴影区域，显著提高OLED显示产品的解析度。请参阅图3，本发明还一种上述精细掩膜板的制作方法，包括如下步骤：
步骤1、如图4所示，提供第一掩膜11、张网机、及载板50，所述第一掩膜11上设有数个第一像素开孔111；所述张网机具有多个抓手71；利用张网机的抓手71将所述第一掩膜11固定在载板50上，确保所述第一掩膜11充分延展。
具体地，所述第一掩膜11的材料为因瓦合金，所述第一掩膜11的厚度为50μm以下。
具体地，如图5所示，所述步骤1中提供的载板50包括载板母体51、分别安装在载板母体51两相对侧面上的两弹性模块52、分别设于所述两弹性模块52两侧的两侧部压力件53、设于所述载板母体51上方与所述两侧部压力件53活动连接的顶部固定板54、驱动所述侧部压力件53左右移动的压力件驱动机构55、及驱动所述顶部固定板54上下移动的固定板驱动机构56；
每一侧部压力件53均包括一侧面压力板531、及分别垂直连接于侧面压力板531两端的两连接板532，从而整体呈U形；每一连接板532的上表面上均设有向下延伸的固定孔535；所述载板母体51的设有弹性模块52的两侧面上，均在相应弹性模块52的两侧分别设有对应相应侧部压力件53的两连接板532的两连接凹槽511；所述顶部固定板54的下表面上对应每一固定孔535均设有一向下延伸的固定杆545。
所述步骤1中将所述第一掩膜11固定在载板50上的过程具体包括：
步骤11、所述第一掩膜11整体成条状，包括位于中间的主体部115、及位于主体部115两侧的连接部116，使用张网机的抓手71抓住第一掩膜11的两端，所述第一掩膜11在抓手71的作用下向两端拉伸，经机械对位后，使第一掩膜11的主体部115与载板母体51的下表面贴合，再由抓手71向上提起第一掩膜11的两端，使得第一掩膜11的连接部116向上弯曲后分别贴合在载板母体51两侧的弹性模块52上。
步骤12、通过压力件驱动机构55驱动侧部压力件53，将每一侧部压力件53的两连接板532均插入相应的连接凹槽511中，并使得每一侧部压力件53向相应的弹性模块52施加压力，使得每一连接板532上的固定孔535达到位于对应固定杆545下方的位置。
步骤13、通过固定板驱动机构56将顶部固定板54的固定杆545插入相应的固定孔535中。
步骤14、移开压力件驱动机构55、及固定板驱动机构56，此时，每一侧部压力件53在相应弹性模块52的作用下受到到往外挤压的弹力，并且每一侧部压力件53上的固定孔535受到相应固定杆545的阻挡，从而侧部压力件53被固定，同时，所述第一掩膜11的连接部116夹于侧面压力板531和弹性模块52之间，受到二者的挤压而固定。
步骤2、如图6所示，提供基板60，采用狭缝涂布(Slit-coating)、喷涂(Spray)、或旋涂(Spin-coating)等方式在基板60上涂覆形成一层有机材料膜12’，并采用热固化、或UV固化等方式对有机材料膜12’进行一次固化。
具体地，所述有机材料膜12’的材料为聚酰亚胺、或聚酰胺，有机材料膜12’的厚度为20μm以下。
步骤3、如图7所示，采用CCD对位、或机械对位的方式对基板60与第一掩膜11进行对位，对位精度约200μm或更佳，将基板60从有机材料膜12’一侧与所述第一掩膜11进行贴合；采用热固化、或UV固化对所述有机材料膜12’进行二次固化，将有机材料膜12’与所述第一掩膜11粘合在一起。
步骤4、如图8所示，采用激光剥离技术(Laser lift off，LLO)或其他技术，将基板60与有机材料膜12’分离，此时，所述有机材料膜12’在所述第一掩膜11上露出所述第一掩膜11的边缘区域，以在后续在该区域对所述第一掩膜11进行激光焊接。
步骤5、如图9所示，提供掩膜边框15，将掩膜边框15投入至张网机中；将载板50转移到掩膜边框15上方，采用CCD对位、或机械对位的方式对所述第一掩膜11与掩膜边框15进行粗对位，对位精度约200μm或更佳。
步骤6、通过张网机的抓手71固定所述第一掩膜11的两端，将载板50与所述第一掩膜11分离。
具体地，所述步骤6中将载板50与所述第一掩膜11分离的过程具体包括：
步骤61、通过压力件驱动机构55使得每一侧部压力件53分别向相应的弹性模块52施加压力，使得固定孔535的孔壁与相应的固定杆545之间不接触而分离。
步骤62、通过固定板驱动机构56将顶部固定板54及其固定杆545往上移动，将顶部固定板54与载板母体51分离。
步骤63、使压力件驱动机构55缓慢释放对相应弹性模块52的压力，使得所述第一掩膜11的连接部116与弹性模块52分离。
步骤64、抓住第一掩膜11两端的抓手71对第一掩膜11施加一定拉力，使之保持伸展状态，使抓手71保持该拉力并向两侧移动，直至整条第一掩膜11处于一个平面内，并使得第一掩膜11与载板母体51分离。
步骤7、如图10所示，通过抓手71将第一掩模11翻转，使得附着在所述第一掩模11上的有机材料膜12’位于最上方，然后采用CCD对位、或机械对位的方式对所述第一掩膜11与掩膜边框15进行粗对位，对位精度为1mm或更佳，再采用CCD对位的方式通过张网机对所述第一掩膜11与掩膜边框15进行精确对位，对位精度为1μm或更佳，通过激光焊接将所述第一掩膜11固定在掩膜边框15上。步骤8、如图11-14所示，利用激光设备在有机材料膜12’上激光烧蚀出数个第二像素开孔121，具体过程为，采用CCD对位的方式对激光设备的激光头精确对位，对位精度为2μm或更佳，将激光头发出的激光光束定位到所述第一掩膜11的第一像素开孔111所露出的有机材料膜12’上，在有机材料膜12’上对应每一第一像素开孔111的区域内均激光烧蚀出一个以上的第二像素开孔121，形成所述第二掩膜12，得到如图2所示精细掩膜板。
综上所述，本发明提供的一种精细掩膜板，包括掩膜边框、金属材料的第一掩膜、及有机材料的第二掩膜；所述第一掩膜上设有数个第一像素开孔；所述第二掩膜上对应每一第一像素开孔的区域内设有一个以上的第二像素开孔，由于第二像素开孔对应设于对应第一像素开孔的区域内，与现有的FMM相比，能够提供更小尺寸的像素开孔，从而能够用于真空蒸镀过程中制作更小尺寸的OLED器件，提高OLED显示产品的解析度；同时由于该第二像素开孔的孔壁坡度可控制的更小，用于真空蒸镀过程中可使得蒸镀材料在第二像素开孔边缘处的入射角度更小，从而能够减小镀膜阴影区域，进一步提高OLED显示产品的解析度。本发明的精细掩膜板的制作方法，制作方法简单，所制得的精细掩膜板包括有机材料的第二掩膜，第二掩膜上设有较小尺寸的第二像素开孔，且该第二像素开孔的孔壁坡度可控制的更小，该精细掩膜板用于真空蒸镀过程中可使得蒸镀材料在第二 像素开孔边缘处的入射角度更小，可降低镀膜阴影区域，显著提高OLED显示产品的解析度。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (14)

  1. 一种精细掩膜板，包括掩膜边框、固定于所述掩膜边框上的第一掩膜、及设于所述第一掩膜上的第二掩膜；
    所述第一掩膜上设有数个第一像素开孔；
    所述第二掩膜上对应每一第一像素开孔的区域内均设有一个以上的第二像素开孔；
    所述第一掩膜为金属掩膜，所述第二掩膜为有机材料掩膜。
  2. 如权利要求1所述的精细掩膜板，其中，所述第二掩膜的材料为聚酰亚胺、或聚酰胺，所述第二掩膜的厚度为50μm以下。
  3. 如权利要求1所述的精细掩膜板，其中，所述第一掩膜的材料为因瓦合金，所述第一掩膜的厚度为200μm以下。
  4. 一种精细掩膜板的制作方法，包括如下步骤：
    步骤1、提供第一掩膜、张网机、及载板，所述第一掩膜上设有数个第一像素开孔；所述张网机具有多个抓手；利用张网机的抓手将所述第一掩膜固定在载板上，确保所述第一掩膜充分延展；
    步骤2、提供基板，在基板上涂覆形成一层有机材料膜，对有机材料膜进行一次固化；
    步骤3、对基板与第一掩膜进行对位，将基板从有机材料膜一侧与所述第一掩膜进行贴合；对所述有机材料膜进行二次固化，将有机材料膜与所述第一掩膜粘合在一起；
    步骤4、将基板与有机材料膜分离，此时，所述有机材料膜在所述第一掩膜上露出所述第一掩膜的边缘区域，以在后续在该区域对所述第一掩膜进行激光焊接；
    步骤5、提供掩膜边框，将掩膜边框投入至张网机中；将载板转移到掩膜边框上方，对所述第一掩膜与掩膜边框进行粗对位；
    步骤6、通过张网机的抓手固定所述第一掩膜的两端，将载板与所述第一掩膜分离；
    步骤7、通过抓手将第一掩模翻转，使得附着在所述第一掩模上的有机材料膜位于最上方，然后对所述第一掩膜与掩膜边框进行粗对位，再通过张网机对所述第一掩膜与掩膜边框进行精确对位，通过激光焊接将所述第一掩膜固定在掩膜边框上；
    步骤8、利用激光设备在有机材料膜上激光烧蚀出数个第二像素开孔， 具体过程为，对激光设备的激光头与第一掩膜进行精确对位，将激光头发出的激光光束定位到所述第一掩膜的第一像素开孔所露出的有机材料膜上，在有机材料膜上对应每一第一像素开孔的区域内均激光烧蚀出一个以上的第二像素开孔，形成所述第二掩膜。
  5. 如权利要求4所述的精细掩膜板的制作方法，其中，所述步骤1中提供的载板包括载板母体、分别安装在载板母体两相对侧面上的两弹性模块、分别设于所述两弹性模块两侧的两侧部压力件、设于所述载板母体上方与所述两侧部压力件活动连接的顶部固定板、驱动所述侧部压力件左右移动的压力件驱动机构、及驱动所述顶部固定板上下移动的固定板驱动机构；
    每一侧部压力件均包括一侧面压力板、及分别垂直连接于侧面压力板两端的两连接板，从而整体呈U形；每一连接板的上表面上均设有向下延伸的固定孔；
    所述载板母体设有弹性模块的两侧面上，均在相应弹性模块的两侧分别设有对应相应侧部压力件的两连接板的两连接凹槽；
    所述顶部固定板的下表面上对应每一固定孔均设有一向下延伸的固定杆。
  6. 如权利要求5所述的精细掩膜板的制作方法，其中，所述步骤1中将所述第一掩膜固定在载板上的过程具体包括：
    步骤11、所述第一掩膜整体成条状，包括位于中间的主体部、及位于主体部两侧的连接部，使用张网机的抓手抓住第一掩膜的两端，所述第一掩膜在抓手的作用下向两端拉伸，经机械对位后，使第一掩膜的主体部与载板母体的下表面贴合，再由抓手向上提起第一掩膜的两端，使得第一掩膜的连接部向上弯曲后分别贴合在载板母体两侧的弹性模块上；
    步骤12、通过压力件驱动机构驱动侧部压力件，使每一侧部压力件的两连接板均插入相应的连接凹槽中，并使得每一侧部压力件向相应的弹性模块施加压力，使得每一连接板上的固定孔达到位于对应固定杆下方的位置；
    步骤13、通过固定板驱动机构将顶部固定板的固定杆插入相应的固定孔中；
    步骤14、移开压力件驱动机构、及固定板驱动机构，此时，每一侧部压力件在相应弹性模块的作用下受到到往外挤压的弹力，并且每一侧部压力件上的固定孔受到相应固定杆的阻挡，从而侧部压力件被固定，同时，所述第一掩膜的连接部夹于侧面压力板和弹性模块之间，受到二者的挤压 而固定。
  7. 如权利要求5所述的精细掩膜板的制作方法，其中，所述步骤6中将载板与所述第一掩膜分离的过程具体包括：
    步骤61、通过压力件驱动机构使得每一侧部压力件分别向相应的弹性模块施加压力，使得固定孔的孔壁与相应的固定杆之间不接触而分离；
    步骤62、通过固定板驱动机构将顶部固定板及其固定杆往上移动，将顶部固定板与载板母体分离；
    步骤63、使压力件驱动机构缓慢释放对相应弹性模块的压力，使得所述第一掩膜的连接部与弹性模块分离；
    步骤64、抓住第一掩膜两端的抓手对第一掩膜施加一定拉力，使之保持伸展状态，使抓手保持该拉力并向两侧移动，直至整条第一掩膜处于一个平面内，并使得第一掩膜与载板母体分离。
  8. 如权利要求4所述的精细掩膜板的制作方法，其中，所述第二掩膜的材料为聚酰亚胺、或聚酰胺，所述第二掩膜的厚度为50μm以下。
  9. 如权利要求4所述的精细掩膜板的制作方法，其中，所述第一掩膜的材料为因瓦合金，所述第一掩膜的厚度为200μm以下。
  10. 如权利要求4所述的精细掩膜板的制作方法，其中，所述步骤2中采用狭缝涂布、喷涂、或旋涂的方式在基板上涂覆形成有机材料膜；
    所述步骤2中采用热固化、或UV固化的方式对所述有机材料膜进行一次固化；
    所述步骤3中采用热固化、或UV固化的方式对所述有机材料膜进行二次固化；
    所述步骤4中采用激光剥离技术将基板与有机材料膜分离；
    所述步骤3和步骤5中均采用CCD对位、或机械对位的方式进行对位；
    所述步骤7中采用CCD对位、或机械对位的方式进行粗对位，采用CCD对位的方式进行精确对位；
    所述步骤8中采用CCD对位的方式进行对位。
  11. 一种精细掩膜板的制作方法，包括如下步骤：
    步骤1、提供第一掩膜、张网机、及载板，所述第一掩膜上设有数个第一像素开孔；所述张网机具有多个抓手；利用张网机的抓手将所述第一掩膜固定在载板上，确保所述第一掩膜充分延展；
    步骤2、提供基板，在基板上涂覆形成一层有机材料膜，对有机材料膜进行一次固化；
    步骤3、对基板与第一掩膜进行对位，将基板从有机材料膜一侧与所述 第一掩膜进行贴合；对所述有机材料膜进行二次固化，将有机材料膜与所述第一掩膜粘合在一起；
    步骤4、将基板与有机材料膜分离，此时，所述有机材料膜在所述第一掩膜上露出所述第一掩膜的边缘区域，以在后续在该区域对所述第一掩膜进行激光焊接；
    步骤5、提供掩膜边框，将掩膜边框投入至张网机中；将载板转移到掩膜边框上方，对所述第一掩膜与掩膜边框进行粗对位；
    步骤6、通过张网机的抓手固定所述第一掩膜的两端，将载板与所述第一掩膜分离；
    步骤7、通过抓手将第一掩模翻转，使得附着在所述第一掩模上的有机材料膜位于最上方，然后对所述第一掩膜与掩膜边框进行粗对位，再通过张网机对所述第一掩膜与掩膜边框进行精确对位，通过激光焊接将所述第一掩膜固定在掩膜边框上；
    步骤8、利用激光设备在有机材料膜上激光烧蚀出数个第二像素开孔，具体过程为，对激光设备的激光头与第一掩膜进行精确对位，将激光头发出的激光光束定位到所述第一掩膜的第一像素开孔所露出的有机材料膜上，在有机材料膜上对应每一第一像素开孔的区域内均激光烧蚀出一个以上的第二像素开孔，形成所述第二掩膜；
    其中，所述步骤1中提供的载板包括载板母体、分别安装在载板母体两相对侧面上的两弹性模块、分别设于所述两弹性模块两侧的两侧部压力件、设于所述载板母体上方与所述两侧部压力件活动连接的顶部固定板、驱动所述侧部压力件左右移动的压力件驱动机构、及驱动所述顶部固定板上下移动的固定板驱动机构；
    每一侧部压力件均包括一侧面压力板、及分别垂直连接于侧面压力板两端的两连接板，从而整体呈U形；每一连接板的上表面上均设有向下延伸的固定孔；
    所述载板母体设有弹性模块的两侧面上，均在相应弹性模块的两侧分别设有对应相应侧部压力件的两连接板的两连接凹槽；
    所述顶部固定板的下表面上对应每一固定孔均设有一向下延伸的固定杆；
    其中，所述第二掩膜的材料为聚酰亚胺、或聚酰胺，所述第二掩膜的厚度为50μm以下；
    其中，所述第一掩膜的材料为因瓦合金，所述第一掩膜的厚度为200μm以下。
  12. 如权利要求11所述的精细掩膜板的制作方法，其中，所述步骤1中将所述第一掩膜固定在载板上的过程具体包括：
    步骤11、所述第一掩膜整体成条状，包括位于中间的主体部、及位于主体部两侧的连接部，使用张网机的抓手抓住第一掩膜的两端，所述第一掩膜在抓手的作用下向两端拉伸，经机械对位后，使第一掩膜的主体部与载板母体的下表面贴合，再由抓手向上提起第一掩膜的两端，使得第一掩膜的连接部向上弯曲后分别贴合在载板母体两侧的弹性模块上；
    步骤12、通过压力件驱动机构驱动侧部压力件，使每一侧部压力件的两连接板均插入相应的连接凹槽中，并使得每一侧部压力件向相应的弹性模块施加压力，使得每一连接板上的固定孔达到位于对应固定杆下方的位置；
    步骤13、通过固定板驱动机构将顶部固定板的固定杆插入相应的固定孔中；
    步骤14、移开压力件驱动机构、及固定板驱动机构，此时，每一侧部压力件在相应弹性模块的作用下受到到往外挤压的弹力，并且每一侧部压力件上的固定孔受到相应固定杆的阻挡，从而侧部压力件被固定，同时，所述第一掩膜的连接部夹于侧面压力板和弹性模块之间，受到二者的挤压而固定。
  13. 如权利要求11所述的精细掩膜板的制作方法，其中，所述步骤6中将载板与所述第一掩膜分离的过程具体包括：
    步骤61、通过压力件驱动机构使得每一侧部压力件分别向相应的弹性模块施加压力，使得固定孔的孔壁与相应的固定杆之间不接触而分离；
    步骤62、通过固定板驱动机构将顶部固定板及其固定杆往上移动，将顶部固定板与载板母体分离；
    步骤63、使压力件驱动机构缓慢释放对相应弹性模块的压力，使得所述第一掩膜的连接部与弹性模块分离；
    步骤64、抓住第一掩膜两端的抓手对第一掩膜施加一定拉力，使之保持伸展状态，使抓手保持该拉力并向两侧移动，直至整条第一掩膜处于一个平面内，并使得第一掩膜与载板母体分离。
  14. 如权利要求11所述的精细掩膜板的制作方法，其中，所述步骤2中采用狭缝涂布、喷涂、或旋涂的方式在基板上涂覆形成有机材料膜；
    所述步骤2中采用热固化、或UV固化的方式对所述有机材料膜进行一次固化；
    所述步骤3中采用热固化、或UV固化的方式对所述有机材料膜进行 二次固化；
    所述步骤4中采用激光剥离技术将基板与有机材料膜分离；
    所述步骤3和步骤5中均采用CCD对位、或机械对位的方式进行对位；
    所述步骤7中采用CCD对位、或机械对位的方式进行粗对位，采用CCD对位的方式进行精确对位；
    所述步骤8中采用CCD对位的方式进行对位。
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