CN110692147A - 用于真空蒸镀的掩膜板、蒸镀方法、显示装置及蒸镀设备 - Google Patents

用于真空蒸镀的掩膜板、蒸镀方法、显示装置及蒸镀设备 Download PDF

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Publication number
CN110692147A
CN110692147A CN201780091437.2A CN201780091437A CN110692147A CN 110692147 A CN110692147 A CN 110692147A CN 201780091437 A CN201780091437 A CN 201780091437A CN 110692147 A CN110692147 A CN 110692147A
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China
Prior art keywords
layer
mask plate
evaporation
mask
substrate
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Pending
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CN201780091437.2A
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English (en)
Inventor
廖志富
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Publication of CN110692147A publication Critical patent/CN110692147A/zh
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

用于真空蒸发镀膜的掩膜板、利用掩膜板进行蒸镀的方法、有机发光显示装置以及利用掩膜板进行蒸镀的设备。该掩膜板包括:衬底(100);反射层(200),反射层(200)设置在衬底(100)上,反射层(200)上具有镂空区域;吸热层(300),吸热层(300)设置在衬底(100)具有反射层(200)的一侧且覆盖镂空区域。

Description

PCT国内申请,说明书已公开。

Claims (24)

  1. PCT国内申请,权利要求书已公开。
CN201780091437.2A 2017-12-13 2017-12-13 用于真空蒸镀的掩膜板、蒸镀方法、显示装置及蒸镀设备 Pending CN110692147A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/116005 WO2019113852A1 (zh) 2017-12-13 2017-12-13 用于真空蒸镀的掩膜板、蒸镀方法、显示装置及蒸镀设备

Publications (1)

Publication Number Publication Date
CN110692147A true CN110692147A (zh) 2020-01-14

Family

ID=66818844

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780091437.2A Pending CN110692147A (zh) 2017-12-13 2017-12-13 用于真空蒸镀的掩膜板、蒸镀方法、显示装置及蒸镀设备

Country Status (2)

Country Link
CN (1) CN110692147A (zh)
WO (1) WO2019113852A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113637940A (zh) * 2021-08-30 2021-11-12 重庆翰博显示科技研发中心有限公司 一种能够提高蒸镀品质的oled蒸镀用掩膜板及其应用方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6309799B1 (en) * 1997-11-03 2001-10-30 Schablonentechnik Kufstein Aktiengesellschaft Process for producing a printing form
CN101378107A (zh) * 2008-09-27 2009-03-04 彩虹集团公司 一种oled显示器件有机发光层形成方法
CN103882374A (zh) * 2014-03-03 2014-06-25 京东方科技集团股份有限公司 掩膜版、有机层加工方法、显示基板制备方法
CN104934370A (zh) * 2014-03-18 2015-09-23 三星显示有限公司 掩模、形成有机层图案的方法和制造显示器的方法
CN105714249A (zh) * 2016-04-19 2016-06-29 上海和辉光电有限公司 掩膜板、蒸镀装置及蒸镀方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090041314A (ko) * 2007-10-23 2009-04-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 증착용 기판 및 발광장치의 제조방법
US8574709B2 (en) * 2008-07-21 2013-11-05 Semiconductor Energy Laboratory Co., Ltd. Deposition donor substrate and method for manufacturing light-emitting device
CN103695842B (zh) * 2013-12-31 2015-12-09 信利半导体有限公司 一种掩膜板及其制作方法
CN106521412B (zh) * 2016-11-30 2019-01-29 京东方科技集团股份有限公司 一种蒸镀掩模板及蒸镀方法
CN106591776B (zh) * 2016-12-28 2019-12-03 武汉华星光电技术有限公司 精细掩膜板及其制作方法
CN106876612A (zh) * 2017-02-23 2017-06-20 深圳市华星光电技术有限公司 一种oled器件的封装结构及其制备方法、金属掩膜板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6309799B1 (en) * 1997-11-03 2001-10-30 Schablonentechnik Kufstein Aktiengesellschaft Process for producing a printing form
CN101378107A (zh) * 2008-09-27 2009-03-04 彩虹集团公司 一种oled显示器件有机发光层形成方法
CN103882374A (zh) * 2014-03-03 2014-06-25 京东方科技集团股份有限公司 掩膜版、有机层加工方法、显示基板制备方法
CN104934370A (zh) * 2014-03-18 2015-09-23 三星显示有限公司 掩模、形成有机层图案的方法和制造显示器的方法
CN105714249A (zh) * 2016-04-19 2016-06-29 上海和辉光电有限公司 掩膜板、蒸镀装置及蒸镀方法

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WO2019113852A1 (zh) 2019-06-20

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Address after: Building 43, Dayun software Town, No. 8288 Longgang Avenue, Henggang street, Longgang District, Shenzhen City, Guangdong Province

Applicant after: Shenzhen Ruoyu Technology Co.,Ltd.

Address before: Building 43, Dayun software Town, No. 8288 Longgang Avenue, Henggang street, Longgang District, Shenzhen City, Guangdong Province

Applicant before: SHENZHEN ROYOLE TECHNOLOGIES Co.,Ltd.

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Application publication date: 20200114

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