WO2018021049A1 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
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- WO2018021049A1 WO2018021049A1 PCT/JP2017/025573 JP2017025573W WO2018021049A1 WO 2018021049 A1 WO2018021049 A1 WO 2018021049A1 JP 2017025573 W JP2017025573 W JP 2017025573W WO 2018021049 A1 WO2018021049 A1 WO 2018021049A1
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Images
Classifications
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
- C08F220/301—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and one oxygen in the alcohol moiety
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
- C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Definitions
- the present invention relates to a resin composition containing a self-crosslinkable copolymer, an acid generator and a solvent, and a planarizing film and a microlens formed from the resin composition.
- the sensitivity of the CCD / CMOS image sensor has been required to improve the sensitivity of the sensor, so that a cured film is formed on a color filter in order to efficiently collect light from the microlens to the light receiving portion.
- the cured film is also required to be able to flatten the step formed on the base substrate (Patent Document 2 and Patent Document 3).
- a microlens is produced from such a cured film.
- An etch back method is known as one of methods for producing a microlens for a CCD / CMOS image sensor (Patent Documents 4 and 5). That is, a resist pattern is formed on the microlens resin layer formed on the color filter, and the lens pattern is formed by reflowing the resist pattern by heat treatment. Using the lens pattern formed by reflowing the resist pattern as an etching mask, the lower microlens resin layer is etched back, and the lens pattern shape is transferred to the microlens resin layer to produce a microlens.
- Patent Documents 6 to 8 disclose resin compositions used for forming microlenses. However, all of these are photosensitive (radiation sensitive) resin compositions and are not suitable materials for forming microlenses by the above-described etch back method.
- This invention is made
- the objective is providing the resin composition which can form the cured film which has the outstanding solvent resistance, heat resistance, transparency, and planarization property. is there.
- the present invention is a resin composition comprising a self-crosslinking copolymer having a structural unit represented by the following formula (1) and a structural unit represented by the following formula (2), an acid generator, and a solvent. is there.
- R 0 represents a hydrogen atom or a methyl group
- X represents a single bond or an ethyleneoxy group
- R 1 represents a single bond or a methylene group
- a 1 represents a cycloalkyl group having 5 or 6 carbon atoms.
- a 2 represents an epoxycyclohexyl group or an epoxy group.
- the structural unit represented by the formula (1) is, for example, a structural unit represented by the following formula (1-1), formula (1-2), or formula (1-3).
- the structural unit represented by the formula (2) is, for example, a structural unit represented by the following formula (2-1) or formula (2-2). (In the formula, R 0 represents a hydrogen atom or a methyl group.)
- the resin composition is applied to a substrate having a recess or a step, and the pressure is reduced from 1 ⁇ 10 ⁇ 8 Pa to 9 ⁇ 10 4 Pa in the atmosphere at a temperature of 50 ° C. to 200 ° C. for 10 minutes to This is a method for embedding the substrate by baking the substrate coated with the resin composition for 180 minutes under reduced pressure.
- the present invention is also a method for producing a cured film by applying the resin composition onto a substrate, baking the substrate on which the resin composition is applied using a heating unit, and then exposing the substrate. After the exposure, baking may be performed again using a heating means.
- the copolymer contained in the composition is a self-crosslinking type, it is not always necessary to add a crosslinking agent. Moreover, since it contains a latent acid, it is excellent in storage stability. Furthermore, the resin film formed from the resin composition of the present invention has excellent transparency, solvent resistance, and flatness. Therefore, the cured film formed from the resin composition of the present invention can flatten the step formed on the base substrate. Further, when a resist is applied after forming a cured film from the resin composition of the present invention, and when an electrode / wiring forming step is performed after the planarization film or microlens is formed from the resin composition of the present invention, the curing is performed.
- the resin composition of the present invention is suitable as a material for forming a planarizing film and a microlens.
- FIG. 1 is a schematic view showing a cured film formed by applying and baking the resin composition of the present invention on a stepped substrate.
- the solid content obtained by removing the solvent from the resin composition of the present invention is usually 1% by mass to 80% by mass.
- the resin composition of the present invention comprises a self-crosslinkable copolymer having a structural unit represented by the formula (1) and a structural unit represented by the formula (2), an acid generator, and a solvent.
- the content of the structural unit represented by the formula (1) is 10 mol% to 90 mol%.
- the weight average molecular weight of the copolymer is usually 1,000 to 80,000, preferably 3,000 to 50,000.
- the weight average molecular weight is a value obtained by using gel as a standard sample by gel permeation chromatography (GPC).
- the content of the copolymer in the resin composition of the present invention is usually 5% by mass to 99.999% by mass, for example, 80% by mass to 99% based on the content in the solid content of the resin composition. 999 mass%.
- the method for obtaining the copolymer is not particularly limited, but generally, the monomer mixture containing the monomer species used for obtaining the above-mentioned copolymer is usually 50 to 120 ° C. in a polymerization solvent. It can be obtained by polymerizing at a temperature. The copolymer thus obtained is usually in a solution state dissolved in a solvent, and can be used in the resin composition of the present invention without isolation in this state.
- the copolymer solution obtained as described above is poured into a stirred poor solvent such as hexane, diethyl ether, methanol, water and the like to reprecipitate the copolymer, and the generated precipitate is obtained.
- the copolymer can be made into powder by drying at normal temperature or reduced pressure at room temperature or by heating. By such an operation, a polymerization initiator and an unreacted compound that coexist with the copolymer can be removed.
- the powder of the copolymer may be used as it is, or the powder may be redissolved, for example, in a solvent described later and used as a solution.
- the acid generator of the present invention is a catalyst that generates an acid by light or heat and cationically polymerizes the epoxy group by the action of the acid.
- an organic onium salt compound in which a cation component and an anion component are paired or a sulfonate ester is usually used.
- Examples of the cation component include organic cations such as organic sulfonium, organic oxonium, organic ammonium, organic phosphonium, and organic iodonium.
- Examples of the anionic component include B (C 6 F 5 ) 4 ⁇ , SbF 6 ⁇ , AsF 6 ⁇ , PF 6 ⁇ and PF 3 (C 2 F 5 ) 3 ⁇ , BF 4 ⁇ and CF 3 SO. 3 -, C 4 F 9 SO 3 -, C (CF 3 SO 2) 3 - and the like.
- Examples of the sulfonic acid ester include an ester having a CF 3 SO 3 group and an ester having a C 4 F 9 SO 3 group.
- CPI registered trademark
- 110P 110P, 110B, 210S
- 100P 101A, 200K
- TA-60 TA-60B
- TA-100 TA-120
- TA-160 above, San Apro Co., Ltd.
- Irgacure [registered trademark] 250, 270, 290, CGI TPS-C1, GSID-26-1 (above, manufactured by BASF)
- the content of the acid generator in the resin composition of the present invention is usually 0.001% by mass to 20% by mass, preferably 0.001% by mass to 10%, based on the content in the solid content of the resin composition. % By mass.
- the method for preparing the resin composition of the present invention is not particularly limited. For example, a method in which the copolymer is dissolved in a solvent and an acid generator is mixed in this solution at a predetermined ratio to obtain a uniform solution. It is done. Furthermore, in an appropriate stage of this preparation method, there may be mentioned a method in which other additives are further added and mixed as necessary.
- the solvent is not particularly limited as long as it dissolves the copolymer and the acid generator.
- solvents include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, propylene glycol, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate.
- propylene glycol monomethyl ether propylene glycol monomethyl ether acetate, 2-heptanone, ethyl lactate are used from the viewpoint of improving the leveling property of a coating film formed by applying the resin composition of the present invention on a substrate.
- Butyl lactate, cyclopentanone and cyclohexanone are preferred.
- the resin composition of this invention can also contain surfactant for the purpose of improving applicability
- the surfactant include polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, polyoxyethylene alkyl ethers such as polyoxyethylene oleyl ether, polyoxyethylene octyl phenyl ether, polyoxyethylene Polyoxyethylene alkyl aryl ethers such as ethylene nonylphenyl ether, polyoxyethylene / polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, sorbitan Sorbitan fatty acid esters such as tristearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene Nonionic surfactants such as polyoxyethylene sorbitan fatty acid esters such as rubitan monopalmitate, polyoxyethylene
- content in the resin composition of this invention is 3 mass% or less based on content in the solid content of the said resin composition, Preferably it is 1 mass%. Or less, more preferably 0.5% by mass or less.
- the resin composition of the present invention is a cross-linking agent, a curing aid, an ultraviolet absorber, a sensitizer, a plasticizer, an antioxidant, an adhesion aid, as necessary, as long as the effects of the present invention are not impaired. Etc. can be included.
- the crosslinking agent is preferably a compound having at least two epoxy rings or a compound having at least one oxetane ring.
- Examples of the compound having at least two epoxy rings include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, bisphenol type epoxy resin such as bisphenol S type epoxy resin, phenol novolac type epoxy resin, Novolak type epoxy resins such as cresol novolak type epoxy resins, fluorene type epoxy resins, aromatic epoxy resins such as trisphenolmethane triglycidyl ether, and their water additives and bromides, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, glycerin diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane diglycidyl ether, trimethylolpropane triglycidyl Polyoxyalkylene glycol polyglycidyl ether containing an alkylene group having 2 to 9 (preferably
- jER registered trademark
- 825, 827, 828, 828EL, 828US, 828US, 828XA, 834 1001, 1002, 1003, 1055, 1004, 1004AF, 1007, 1009, 1010, 1003F, 1004F, 1005F, 1005F, 1009F, 1004FS, 1006FS, 1007FS, 834X90, 1001B80, 1001X70, 1001X75, 1001T75, 806, 806H, 807, 4004P, 4005P, 4007P, 4010P, 1256, 4250, 4275, 1275B40, 1255HX30, YX8100BH30, YX6954BH30, YX7200B35, 5046B80, 152, 1 4, 157S70, 1031S, 1032H60, 604, 630, 630LSD, 871, 872, 872X75, 168V70
- Examples of the compound having at least one oxetane ring include 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3- (phenoxymethyl) oxetane, and 3-ethyl-3- (2-ethylhexyloxymethyl).
- Examples of commercially available compounds having at least one oxetane ring include Aron Oxetane (registered trademark) OXT-101, OXT-121, OXT-211, OXT-212, OXT-213, OXT-213, and OXT- 221 (above, manufactured by Toagosei Co., Ltd.), ETERNACOLL [registered trademark] EHO, OXBP, OXTP, OXMA (above, manufactured by Ube Industries, Ltd.).
- the crosslinking agent may be used alone or in combination of two or more.
- the content in the resin composition of the present invention is 1% by mass to 200% by mass, preferably 3% by mass to 100% by mass, based on 100% by mass of the copolymer. More preferably, it is 5 to 50% by mass.
- the sensitizer examples include 9-hydroxymethylanthracene, 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-dibutoxyanthracene, 9,10- Dimethoxy-2-ethylanthracene, 9,10-diethoxy-2-ethylanthracene, 9,10-dipropoxy-2-ethylanthracene, 9,10-dimethoxy-2-chloroanthracene, 9,10-bis (octanoyloxy) Anthracene, 9,10-dimethoxyanthracene-2-sulfonic acid methyl ester, 9,10-diethoxyanthracene-2-sulfonic acid methyl ester, 9,10-dimethoxyanthracene-2-carboxylic acid methyl ester, thioxanthone, 2-isopropyl Thioki N, 4-isopropyl
- sensitizers include, for example, Anthracure (registered trademark) UVS-1331, UVS-1101, UVS-581 (manufactured by Kawasaki Kasei Kogyo Co., Ltd.), KAYACURE (registered trademark) DETX- S, and the same EPA (manufactured by Nippon Kayaku Co., Ltd.).
- the sensitizers may be used alone or in combination of two or more.
- the content in the resin composition of the present invention is 50% by mass or less, preferably 30% by mass or less, more preferably 20 based on 100% by mass of the acid generator. It is below mass%.
- Substrate for example, a semiconductor substrate such as silicon covered with a silicon oxide film, a semiconductor substrate such as silicon covered with a silicon nitride film or a silicon oxynitride film, a semiconductor substrate such as silicon provided with a color filter, a silicon nitride substrate , Quartz substrate, glass substrate (including non-alkali glass, low alkali glass, crystallized glass), glass substrate on which ITO film is formed ⁇ on the resin composition of the present invention by an appropriate coating method such as a spinner or coater. Apply. Then, a coating film is formed by prebaking using heating means, such as a hotplate and oven. In addition, when performing the pressure reduction baking mentioned later, it is not necessary to implement prebaking. After applying the resin composition of the present invention on the substrate, vacuum baking may be performed without pre-baking.
- the pre-baking conditions are appropriately selected from a baking temperature of 30 ° C. to 200 ° C. and a baking time of 0.3 minutes to 60 minutes, preferably a baking temperature of 50 ° C. to 180 ° C. and a baking time of 0.5 minutes to 30 minutes. .
- Pre-baking is performed in the atmosphere or in an inert gas such as nitrogen, argon, or helium.
- the thickness of the cured film formed from the resin composition of the present invention is 0.001 ⁇ m to 1000 ⁇ m, preferably 0.01 ⁇ m to 600 ⁇ m.
- vacuum baking is performed as necessary.
- the conditions for the vacuum baking are as follows: 1 ⁇ 10 ⁇ 8 Pa to 9 ⁇ 10 4 Pa or 1 ⁇ 10 ⁇ 7 Pa to 5 ⁇ 10 4 Pa, 50 ° C. to 200 ° C., 10 minutes to 180 minutes. It is appropriately selected from the time.
- the vacuum baking is performed in the atmosphere or in an inert gas such as nitrogen, argon or helium. By this reduced pressure baking, it becomes possible to embed the recess or step of the substrate with the resin composition of the present invention.
- exposure is performed as needed on the film
- ultraviolet rays for example, g-line, h-line, i-line
- post baking is performed using a heating means such as a hot plate or an oven.
- Post bake conditions are appropriately selected from a baking temperature of 100 ° C. to 300 ° C. and a baking time of 0.5 minutes to 180 minutes.
- the post-bake is performed in the atmosphere or in an inert gas such as nitrogen, argon, or helium.
- a resist solution is applied onto the cured film formed from the resin composition of the present invention, exposed through a predetermined mask, and post-exposure heating (PEB) is performed as necessary to perform alkali development and rinsing. And a predetermined resist pattern is formed by drying.
- PEB post-exposure heating
- a predetermined resist pattern is formed by drying.
- ultraviolet rays for example, g-line, h-line, i-line
- KrF excimer laser, ArF excimer laser can be used.
- the resist pattern is reflowed by heat treatment (usually a temperature not exceeding 200 ° C.) to form a lens pattern.
- heat treatment usually a temperature not exceeding 200 ° C.
- the underlying microlens cured film is etched back, and the lens pattern shape is transferred to the microlens resin layer to produce a microlens.
- Example 2 3.00 g of the copolymer obtained in Synthesis Example 2, 0.001180 g of CPI-110B (manufactured by San Apro Co., Ltd.) as a photoacid generator, and DFX-18 (manufactured by Neos Co., Ltd.) as a surfactant.
- a solution was prepared by dissolving 35100 g in 15.1 g of propylene glycol monomethyl ether acetate. Then, it filtered using the polyethylene micro filter with the hole diameter of 0.45 micrometer, and prepared the resin composition.
- Example 3 16.0 g of the copolymer obtained in Synthesis Example 3 and tris ⁇ 2,2-bis [(oxiran-2-ylmethoxy) methyl] butyl ⁇ -3,3 ′, 3 ′′-[1,3 as a crosslinking agent , 5-Triazine-2,4,6 (1H, 3H, 5H) -trione-1,3,5-triyl] tripropanoate (TEPIC [registered trademark] -UC (manufactured by Nissan Chemical Industries, Ltd.)) 4 CPI-210S, an organic onium salt compound in which the cationic component is composed of (4-phenylthiophenyl) diphenylsulfonium and the anionic component is composed of PF 3 (C 2 F 5 ) 3 — as a photoacid generator Sanapro Co., Ltd.) 1.0 g, 9,10-bis (octanoyloxy) anthracene (Anthracure® UVS-581 (manu).
- Example 4 16.0 g of the copolymer obtained in Synthesis Example 4 and 4.0 g of tris (4,5-epoxypentyl) isocyanurate (TEPIC (registered trademark) -VL (manufactured by Nissan Chemical Industries, Ltd.)) as a crosslinking agent, CPI-210S (manufactured by San Apro Co., Ltd.) 1.0 g as a photoacid generator and 9,10-dibutoxyanthracene (Anthracure [registered trademark] UVS-1331 (manufactured by Kawasaki Kasei Kogyo Co., Ltd.)) as a sensitizer 0.20 g and 0.020 g of DFX-18 (manufactured by Neos Co., Ltd.) as a surfactant were dissolved in 89.3 g of propylene glycol monomethyl ether acetate to obtain a solution. Then, it filtered using the polyethylene micro filter with the hole
- Example 5 53.3 g (including 16.0 g of solid content) of the copolymer obtained in Synthesis Example 5 and tris (4,5-epoxypentyl) isocyanurate (TEPIC (registered trademark) -VL (Nissan Chemical Industries) as a crosslinking agent 4.0 g, CPI-210S (manufactured by San Apro Co.) as a photoacid generator, and 0.020 g of DFX-18 (manufactured by Neos) as a surfactant, A solution was prepared by dissolving in 51.1 g of glycol monomethyl ether acetate. Then, it filtered using the polyethylene micro filter with the hole diameter of 0.45 micrometer, and prepared the resin composition.
- TEPIC registered trademark
- VL Vinyl Chemical Industries
- CPI-210S manufactured by San Apro Co.
- DFX-18 manufactured by Neos
- Example 6 8.0 g of the copolymer obtained in Synthesis Example 4, 2.0 g of tris (4,5-epoxypentyl) isocyanurate (TEPIC (registered trademark) -VL (manufactured by Nissan Chemical Industries, Ltd.)) as a crosslinking agent, 0.1 g of Adeka Arkuls (registered trademark) SP-606 (manufactured by ADEKA Co., Ltd.), which is a trifluoromethanesulfonic acid ester as a photoacid generator, and DFX-18 (manufactured by Neos Co., Ltd.) as a surfactant.
- a solution was prepared by dissolving 020 g in 43.0 g of propylene glycol monomethyl ether acetate. Then, it filtered using the polyethylene micro filter with the hole diameter of 0.45 micrometer, and prepared the resin composition.
- Example 7 10.0 g of the copolymer obtained in Synthesis Example 4, 0.1 g of Adeka Arcles (registered trademark) SP-606 (manufactured by ADEKA), which is a trifluoromethanesulfonic acid ester as a photoacid generator, and a surface activity
- Adeka Arcles registered trademark
- SP-606 manufactured by ADEKA
- DFX-18 manufactured by Neos Co., Ltd.
- Example 8 10.0 g of the copolymer obtained in Synthesis Example 1 and 0.0006 g of CPI-110B (manufactured by San Apro Co., Ltd.) as a photoacid generator were dissolved in 15.0 g of propylene glycol monomethyl ether acetate to obtain a solution. Then, it filtered using the polyethylene micro filter with a hole diameter of 5 micrometers, and prepared the resin composition.
- Example 9 10.0 g of the copolymer obtained in Synthesis Example 4 and an organic onium salt compound in which the cation component is composed of organic sulfonium and the anion component is composed of C (CF 3 SO 2 ) 3 — as a photoacid generator.
- a solution was prepared by dissolving 0.0003 g of GSID-26-1 (manufactured by BASF) in 15.0 g of propylene glycol monomethyl ether acetate. Then, it filtered using the polyethylene micro filter with a hole diameter of 5 micrometers, and prepared the resin composition.
- ⁇ Comparative Example 1> 3.13 g of the copolymer obtained in Synthesis Example 1 and 0.000015 g of DFX-18 (manufactured by Neos Co., Ltd.) as a surfactant were dissolved in 16.9 g of propylene glycol monomethyl ether acetate to obtain a solution. Then, it filtered using the polyethylene micro filter with the hole diameter of 0.45 micrometer, and prepared the resin composition.
- the cured film formed from the resin composition of the present invention was highly solvent-resistant and highly transparent. Furthermore, the cured film formed from the resin composition of the present invention had excellent step flatness with a flattening rate of 80% or more.
- the cured film formed from the resin composition prepared in Comparative Example 1 does not contain a photoacid generator, and the cured film formed from the resin composition prepared in Comparative Examples 2 to 4 Is inadequately cured at a baking temperature of 220 ° C., so that the solvent resistance is not satisfied, and it has been found that it is not suitable for either a planarizing film or a cured film for microlenses.
- the cured film formed from the resin composition prepared in Comparative Example 3 and Comparative Example 4 has a planarization rate of less than 80%, compared with the cured film formed from the resin composition of the present invention. As a result, the flatness of the step was inferior.
- Example 8 and Example 9 The resin composition prepared in Example 8 and Example 9 was applied on a silicon wafer having recesses (hole depth of 400 ⁇ m) having a hole width of 200 ⁇ m square, 150 ⁇ m square, and 100 ⁇ m square, and 150 ° C. on a hot plate. And then pre-baking for 10 minutes at 150 ° C. for 20 minutes under a reduced pressure of 3 ⁇ 10 2 Pa in an oven. Subsequently, the whole surface was irradiated with ultraviolet rays having an exposure amount of 1000 mJ / cm 2 at 365 nm by an electrodeless lamp power supply system (manufactured by Oak Manufacturing Co., Ltd.) equipped with a 380 nm enhanced lamp.
- an electrodeless lamp power supply system manufactured by Oak Manufacturing Co., Ltd.
- post-baking was performed at 220 ° C. for 60 minutes in an oven.
- the pre-bake, the vacuum bake and the post-bake were all performed in the atmosphere.
- SEM scanning electron microscope
- Stepped substrate 2 Cured film 3: Line width 4: Line space h1: Stepped substrate step h2: Cured film step
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Abstract
Description
前記共重合体の構造単位において、上記式(1)で表される構造単位の含有量は10mol%乃至90mol%である。
CPI〔登録商標〕110P、同110B、同210S、同100P、同101A、同200K、TA-60、TA-60B、TA-100、TA-120、TA-160(以上、サンアプロ(株)製)、
Irgacure〔登録商標〕250、同270、同290、CGI TPS-C1、GSID-26-1(以上、BASF製)、
サンエイドSI-60L、同SI-80L、同SI-100L、同SI-110L、同SI-150L、同SI-180L、同SI-45、同SI-45L、同SI-60、同SI-80、同SI-100、同SI-110、同SI-150、同SI-180、同SI-B2、同SI-B2A、同SI-B3、同SI-B3A、同SI-B4、同SI-B5、同SI-200、同SI-210、同SI-220、同SI-300、同SI-360(以上、三新化学工業(株)製)、
K-PURE〔登録商標〕TAG-2678、同TAG-2681、同TAG-2689、同TAG-2690、同TAG-2700、同CXC-1612、同CXC-1614、同CXC-1615、同CXC-1616、同CXC-1733、同CXC-1738、同CXC-1742、同CXC-1802、同CXC-1821(以上、King Industries Inc.製)、
DPI-105、DPI-106、DPI-109、DPI-201、BI-105、MPI-105、MPI-106、MPI-109、BBI-102、BBI-103、BBI-105、BBI-106、BBI-109、BBI-110、BBI-200、BBI-201、BBI-300、BBI-301TPS-102,TPS-103、TPS-105、TPS-106、TPS-109、TPS-200、TPS-300、TPS-1000、HDS-109、MDS-103、MDS-105、MDS-205、MDS-209、BDS-109、MNPS-109、DTS-102、DTS-103、DTS-105、DTS-200、NDS-103、NDS-105、NDS-155、NDS-165、SI-105、NDI-105、NDI-109、NAI-105、NAI-109(以上、みどり化学(株)製)、
アデカアークルズ〔登録商標〕SP-056、同SP-066、同SP-140、同SP-141、同SP-082、同SP-601、同SP-606、同SP-701、同SP-150、同SP-170、同SP-171(以上、(株)ADEKA製)
を挙げることができる。これらの酸発生剤は、単独で又は2種以上を組み合わせて用いることができる。
1,4-ブタンジオールジグリシジルエーテル、1,6-へキサンジオールジグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、グリセリンジグリシジルエーテル、グリセリントリグリシジルエーテル、トリメチロールプロパンジグリシジルエーテル、トリメチロールプロパントリグリシジルエーテル、ペンタエリスリトールテトラグリシジルエーテル、ソルビトールテトラグリシジルエーテル、ソルビトールポリグリシジルエーテル、ポリエチレン等の炭素原子数が2乃至9(好ましくは2乃至4)のアルキレン基を含むポリオキシアルキレングリコールポリグリシジルエーテル、1,4-シクロヘキサンジメタノールジグリシジルエーテル、イノシトールトリグリシジルエーテル、イノシトールポリグリシジルエーテル、2,2-ビス(ヒドロキシメチル)-1-ブタノールの1,2-エポキシ-4-(2-オキシラニル)シクロヘキサン付加物等の、脂肪族エポキシ樹脂、
3,4-エポキシシクロヘキシルメチル-3’,4’-エポキシシクロヘキサンカルボキシレート、3,4-エポキシ-2-メチルシクロヘキシルメチル-3’,4’-エポキシ-2’-メチルシクロヘキサンカルボキシレート、ビス(3,4-エポキシシクロヘキシル)アジペート、ビス(3,4-エポキシシクロヘキシルメチルアジペート、ビス(3,4-エポキシ-6-メチルシクロヘキシルメチル)アジペート、2-(3,4-エポキシシクロヘキシル-5,5-スピロ-3,4-エポキシシクロヘキサノン-m-ジオキサン、ビス(2,3-エポキシシクロペンチル)エーテル、ジシクロペンタジエンジエポキシド、1,2:8,9-ジエポキシリモネン、(3,4,3’,4’-ジエポキシ)ビシクロヘキシル、ビシクロノナジエンジエポキシド、ε-カプロラクトン変性3’,4’-エポキシシクロヘキシルメチル3,4-エポキシシクロヘキサンカルボキシレート、ブタンテトラカルボン酸テトラ(3,4-エポキシシクロヘキシルメチル)修飾ε-カプロラクトン、テトラヒドロインデンジエポキシド等の、脂環式エポキシ樹脂、
フタル酸ジグリシジルエステル、テトラヒドロフタル酸ジグリシジルエステル、へキサヒドロフタル酸ジグリシジルエステル、ジグリシジル-p-オキシ安息香酸、サリチル酸のグリシジルエーテル-グリシジルエステル、ダイマー酸グリシジルエステル、フマル酸ジグリシジル、マレイン酸ジグリシジル等の、グリシジルエステル型エポキシ樹脂及びこれらの水素化物、
モノアリルジグリシジルイソシアヌレート、トリグリシジルイソシアヌレート、トリス(4,5-エポキシペンチル)イソシアヌレート、ジ(4,5-エポキシペンチル)ヒダントイン、テトラグリシジルグリコールウリル等の、含窒素環エポキシ樹脂、を挙げることができる。
jER〔登録商標〕825、同827、同828、同828EL、同828US、同828XA、同834、同1001、同1002、同1003、同1055、同1004、同1004AF、同1007、同1009、同1010、同1003F、同1004F、同1005F、同1009F、同1004FS、同1006FS、同1007FS、同834X90、同1001B80、同1001X70、同1001X75、同1001T75、同806、同806H、同807、同4004P、同4005P、同4007P、同4010P、同1256、同4250、同4275、同1256B40、同1255HX30、同YX8100BH30、同YX6954BH30、同YX7200B35、同5046B80、同152、同154、同157S70、同1031S、同1032H60、同604、同630、同630LSD、同871、同872、同872X75、同168V70、同YL6810、同YX7700、同YX8000、同YX8034、同YX8800、同YL980、同YL983U、同YX7105、同YX7110B80、同YX7400、同YX4000、同YX4000H、同YL6121H(以上、三菱化学(株)製)、
NC-3000、NC-3000-L、NC-3000-H、NC-3000-FH-75M、NC-3100、CER-3000-L、NC-2000、NC-2000-L、XD-1000、NC-7000L、NC-7300、NC-7300L、EPPN-501、EPPN-501H、EPPN-501HY、EPPN-502、EPPN-502H、EOCN-1020、EOCN-102S、EOCN-103S、EOCN-104S、CER-1020、EPPN-201、EPPN-202、BREN-S、BREN-105、RE-303S-L、RE-310S、RE-602S、LCE-21(以上、日本化薬(株)製)、
EPICLON〔登録商標〕840、同840-S、同850、同850-S、同850-LC、同EXA-850CRP、同860、同1051、同1050、同1055、同2050、同3050、同4050、同7050、同HM-091、同HM-101、同830、同830-S、同835、同EXA-830CRP、同EXA-830LVP、同EXA-835LV、同152、同153、同N-660、同N-665、同N-670、同N-673、同N-680、同N-690、同N-695、同N-665-EXP、同N-672-EXP、同N-655-EXP-S、同N-662-EXP-S、同N-670-EXP-S、同N-685-EXP-S、同N-730A、同N-740、同N-770、同N-775、同N-865、同HP-4032D、同HP-7200L、同HP-7200H、同HP-7200HH、同HP-7200HHH、同HP-4700、同HP-4770、同HP-5000、同HP-6000、同HP-4710、同EXA-4850-150、同EXA-4850-1000、同EXA-4816、同HP-820(以上、DIC(株)製)、
オグソール〔登録商標〕PG-100、同CG-500、同EG-200、同EG-280、同CG-400(以上、大阪ガスケミカル(株)製)、
エポライト40E、同100E、同200E、同400E、同70P、同200P、同400P、同1500NP、同1600、同80MF、同100MF、同4000、同3002(N)(以上、共栄社化学(株)製)、
デナコール〔登録商標〕EX-211、同EX-212、同EX-252、同EX-810、同EX-811、同EX-850、同EX-851、同EX-821、同EX-830、同EX-832、同EX-841、同EX-861、同EX-911、同EX-941、同EX-920、同EX-931、同EX-313、同EX-314、同EX-321、同EX-411、同EX-421、同EX-512、同EX-521、同EX-612、同EX-614、同EX-614B、同EX-201、同EX-711、同EX-721、同EX-622、同EX-1310、同EX-1410、同EX-1610、同EX-610U、同EX-211L、同EX-212L、同EX-214L、同EX-216L、同EX-321L、同EX-722L、同EX-850L、同EX-946L、同DLC-201、同DLC-202、同DLC-203、同DLC-204、同DLC-205(以上、ナガセケムテックス(株)製)、
エポトート〔登録商標〕YD-127、同YD-128、同YDF-170、同YD-8125、同YDF-8170C、同ZX-1059、同YD-825GS、同YD-825GSH、同YDF-870GS、同YDPN-138、同YDCN-700、同YDC-1312、同YSLV-80XY、同YSLV-120TE、同ST-3000、同ST-4000D、同YD-171、同FX-289BEK75、同FX-305EK70、同ERF-001M30、PG-207GS、ZX-1658GS(以上、新日鉄住金化学(株)製)、
アデカレジン〔登録商標〕EP-4100、同EP-4100G、同EP-4100E、同EP-4100TX、同EP-4100HF、同EP-4300E、同EP-4400、同EP-4520S、同EP-4530、同EP-4901、同EP-4901HF、同EP-5100R、同EP-4000、同EP-4000S、同EP-4000L、同EP-4003S、同EP-4005、同EP-4010S、同EP-4010L、同EP-7001、同EP-4080E、同EP-4082HT、同EP-4088S、同EP-4088L、同EP-3300E、同EP-3300S、同EPU-7N、同EPU-73B、同EPR-1415-1、同EPR-21、同EPR-2000、同EPR-4030、同EPR-49-23、同EP-49-10N、同ED-503、同ED-503G、同ED-506、同ED-523T、同ED-505(以上、(株)ADEKA製)、
セロキサイド〔登録商標〕2021P、同2081、同2083、同2085、同3000、同8000、EHPE〔登録商標〕3150、同3150CE、エポリード〔登録商標〕PB3600、同PB4700、同GT-401、同GT-403(以上、(株)ダイセル製)、
TEPIC〔登録商標〕-G、同-S、同-SP、同-SS、同-HP、同-L、同-PAS B26L、同-PAS B22、同-VL、同-FL、同-UC(以上、日産化学工業(株)製)、
エピオール〔登録商標〕G-100、同E-100LC、同E-400、同E-1000、同TMP(以上、日油(株)製)、
リカレジン〔登録商標〕HBE-100、同DME-100、同BPO-20E、同BEO-60E(以上、新日本理化(株)製)、
CY175、CY177、CY179、CY182、CY184、CY192(以上、BASFジャパン(株)製)、
THI-DE(JXTGエネルギー(株)製)
を挙げることができる。
基板{例えば、酸化珪素膜で被覆されたシリコン等の半導体基板、窒化珪素膜又は酸化窒化珪素膜で被覆されたシリコン等の半導体基板、カラーフィルターが形成されたシリコン等の半導体基板、窒化珪素基板、石英基板、ガラス基板(無アルカリガラス、低アルカリガラス、結晶化ガラスを含む)、ITO膜が形成されたガラス基板}上にスピナー、コーター等の適当な塗布方法により本発明の樹脂組成物を塗布する。その後、ホットプレート、オーブン等の加熱手段を用いてプリベークすることにより、塗膜が形成される。なお、後述する減圧ベークを行う場合、必ずしもプリベークを実施する必要はない。前記基板上に本発明の樹脂組成物を塗布後、プリベーク無しに減圧ベークを行ってもよい。
〔下記合成例で得られた共重合体の重量平均分子量の測定〕
装置:日本分光(株)製GPCシステム
カラム:Shodex〔登録商標〕KF-804L及び803L
カラムオーブン:40℃
流量:1mL/分
溶離液:テトラヒドロフラン
<合成例1>
3,4-エポキシシクロヘキシルメチルメタクリレート(サイクロマー〔登録商標〕M100((株)ダイセル製))7.61g、シクロヘキシルアクリレート40.0g、及び2,2’-アゾビスイソブチロニトリル1.96gをプロピレングリコールモノメチルエーテルアセテート74.3gに溶解させた後、この溶液を、プロピレングリコールモノメチルエーテルアセテート41.3gを70℃に保持したフラスコ中に3時間かけて滴下した。滴下終了後、18時間反応させ、メタノールを用いて再沈殿させることにより、前記式(1-1)で表される構造単位及び前記式(2-1)(式中、R0はメチル基を表す。)で表される構造単位を有する共重合体を得た。得られた共重合体の重量平均分子量Mwは27,000(ポリスチレン換算)であった。
グリシジルメタクリレート4.72g、シクロヘキシルアクリレート25.0g、及び2,2’-アゾビスイソブチロニトリル1.28gをプロピレングリコールモノメチルエーテルアセテート57.6gに溶解させた後、この溶液を、プロピレングリコールモノメチルエーテルアセテート35.4gを70℃に保持したフラスコ中に3時間かけて滴下した。滴下終了後、18時間反応させ、メタノールを用いて再沈殿させることにより、前記式(1-1)で表される構造単位及び前記式(2-2)(式中、R0はメチル基を表す。)で表される構造単位を有する共重合体を得た。得られた共重合体の重量平均分子量Mwは30,000(ポリスチレン換算)であった。
3,4-エポキシシクロヘキシルメチルメタクリレート(サイクロマー〔登録商標〕M100((株)ダイセル製))12.5g、シクロヘキシルアクリレート20.0g、及び2,2’-アゾビスイソブチロニトリル1.27gをプロピレングリコールモノメチルエーテルアセテート62.8gに溶解させた後、この溶液を、プロピレングリコールモノメチルエーテルアセテート38.6gを80℃に保持したフラスコ中に3時間かけて滴下した。滴下終了後、18時間反応させ、メタノールを用いて再沈殿させることにより、前記式(1-1)で表される構造単位及び前記式(2-1)(式中、R0はメチル基を表す。)で表される構造単位を有する共重合体を得た。得られた共重合体の重量平均分子量Mwは11,000(ポリスチレン換算)であった。
3,4-エポキシシクロヘキシルメチルメタクリレート(サイクロマー〔登録商標〕M100((株)ダイセル製))19.7g、エトキシ化オルトフェニルフェノールアクリレート(NKエステル〔登録商標〕A-LEN-10(新中村化学工業(株)製))40.0g、及び2,2’-アゾビスイソブチロニトリル3.7gをプロピレングリコールモノメチルエーテルアセテート148.0gに溶解させた後、この溶液を、プロピレングリコールモノメチルエーテルアセテート105.7gを70℃に保持したフラスコ中に3時間かけて滴下した。滴下終了後、18時間反応させ、メタノールを用いて再沈殿させることにより、前記式(1-3)で表される構造単位及び前記式(2-1)(式中、R0はメチル基を表す。)で表される構造単位を有する共重合体を得た。得られた共重合体の重量平均分子量Mwは15,000(ポリスチレン換算)であった。
3,4-エポキシシクロヘキシルメチルメタクリレート(サイクロマー〔登録商標〕M100((株)ダイセル製))43.9g、エトキシ化オルトフェニルフェノールアクリレート(NKエステル〔登録商標〕A-LEN-10(新中村化学工業(株)製))15.0g、及び2,2’-アゾビスイソブチロニトリル2.9gをプロピレングリコールモノメチルエーテルアセテート92.7gに溶解させた後、この溶液を、プロピレングリコールモノメチルエーテルアセテート51.5gを80℃に保持したフラスコ中に3時間かけて滴下した。滴下終了後、18時間反応させることにより、前記式(1-3)で表される構造単位及び前記式(2-1)(式中、R0はメチル基を表す。)で表される構造単位を有する共重合体の溶液(固形分濃度30質量%)を得た。得られた共重合体の重量平均分子量Mwは8,000(ポリスチレン換算)であった。
3,4-エポキシシクロヘキシルメチルメタクリレート7.00g、メチルアクリレート15.0g、及び2,2’-アゾビスイソブチロニトリル1.38gをプロピレングリコールモノメチルエーテルアセテート43.4gに溶解させた後、この溶液を、プロピレングリコールモノメチルエーテルアセテート26.7gを70℃に保持したフラスコ中に3時間かけて滴下した。滴下終了後、18時間反応させることにより、共重合体の溶液(固形分濃度25質量%)を得た。得られた共重合体の重量平均分子量Mwは18,000(ポリスチレン換算)であった。
3,4-エポキシシクロヘキシルメチルメタクリレート11.4g、1-アクリロイルオキシ-3-ヒドロキシアダマンタン24.0g、及び2,2’-アゾビスイソブチロニトリル1.09gをプロピレングリコールモノメチルエーテルアセテート67.9gに溶解させた後、この溶液を、プロピレングリコールモノメチルエーテルアセテート41.7gを70℃に保持したフラスコ中に3時間かけて滴下した。滴下終了後、18時間反応させることにより、共重合体の溶液(固形分濃度25質量%)を得た。得られた共重合体の重量平均分子量Mwは11,000(ポリスチレン換算)であった。
3,4-エポキシシクロヘキシルメチルメタクリレート7.72g、イソボルニルアクリレート40.0g、及び2,2’-アゾビスイソブチロニトリル1.52gをプロピレングリコールモノメチルエーテルアセテート91.4gに溶解させた後、この溶液を、プロピレングリコールモノメチルエーテルアセテート56.3gを70℃に保持したフラスコ中に3時間かけて滴下した。滴下終了後、18時間反応させることにより、共重合体の溶液(固形分濃度25質量%)を得た。得られた共重合体の重量平均分子量Mwは24,000(ポリスチレン換算)であった。
<実施例1>
合成例1で得られた共重合体3.49g、光酸発生剤としてカチオン成分が(4-フェニルチオフェニル)ジフェニルスルホニウムで構成されアニオン成分がB(C6F5)4 -で構成される有機オニウム塩化合物であるCPI-110B(サンアプロ(株)製)0.000204g、及び界面活性剤としてDFX-18(ネオス(株)製)0.00170gを、プロピレングリコールモノメチルエーテルアセテート16.7gに溶解させて溶液とした。その後、孔径0.45μmのポリエチレン製ミクロフィルターを用いてろ過して樹脂組成物を調製した。
合成例2で得られた共重合体3.00g、光酸発生剤としてCPI-110B(サンアプロ(株)製)0.000180g、及び界面活性剤としてDFX-18(ネオス(株)製)0.00150gを、プロピレングリコールモノメチルエーテルアセテート15.1gに溶解させて溶液とした。その後、孔径0.45μmのポリエチレン製ミクロフィルターを用いてろ過して樹脂組成物を調製した。
合成例3で得られた共重合体16.0g、架橋剤としてトリス{2,2-ビス[(オキシラン-2-イルメトキシ)メチル]ブチル}-3,3’,3’’-[1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオン-1,3,5-トリイル]トリプロパノエート(TEPIC〔登録商標〕-UC(日産化学工業(株)製))4.0g、光酸発生剤としてカチオン成分が(4-フェニルチオフェニル)ジフェニルスルホニウムで構成されアニオン成分がPF3(C2F5)3 -で構成される有機オニウム塩化合物であるCPI-210S(サンアプロ(株)製)1.0g、増感剤として9,10-ビス(オクタノイルオキシ)アントラセン(アントラキュアー〔登録商標〕UVS-581(川崎化成工業(株)製))0.20g、及び界面活性剤としてDFX-18(ネオス(株)製)0.020gを、プロピレングリコールモノメチルエーテルアセテート89.3gに溶解させて溶液とした。その後、孔径0.45μmのポリエチレン製ミクロフィルターを用いてろ過して樹脂組成物を調製した。
合成例4で得られた共重合体16.0g、架橋剤としてトリス(4,5-エポキシペンチル)イソシアヌレート(TEPIC〔登録商標〕-VL(日産化学工業(株)製))4.0g、光酸発生剤としてCPI-210S(サンアプロ(株)製)1.0g、増感剤として9,10-ジブトキシアントラセン(アントラキュアー〔登録商標〕UVS-1331(川崎化成工業(株)製))0.20g、及び界面活性剤としてDFX-18(ネオス(株)製)0.020gを、プロピレングリコールモノメチルエーテルアセテート89.3gに溶解させて溶液とした。その後、孔径0.45μmのポリエチレン製ミクロフィルターを用いてろ過して樹脂組成物を調製した。
合成例5で得られた共重合体の溶液53.3g(固形分16.0g含む)、架橋剤としてトリス(4,5-エポキシペンチル)イソシアヌレート(TEPIC〔登録商標〕-VL(日産化学工業(株)製))4.0g、光酸発生剤としてCPI-210S(サンアプロ(株)製)1.0g、及び界面活性剤としてDFX-18(ネオス(株)製)0.020gを、プロピレングリコールモノメチルエーテルアセテート51.1gに溶解させて溶液とした。その後、孔径0.45μmのポリエチレン製ミクロフィルターを用いてろ過して樹脂組成物を調製した。
合成例4で得られた共重合体8.0g、架橋剤としてトリス(4,5-エポキシペンチル)イソシアヌレート(TEPIC〔登録商標〕-VL(日産化学工業(株)製))2.0g、光酸発生剤としてトリフルオロメタンスルホン酸エステルであるアデカアークルズ〔登録商標〕SP-606((株)ADEKA製)0.1g、及び界面活性剤としてDFX-18(ネオス(株)製)0.020gを、プロピレングリコールモノメチルエーテルアセテート43.0gに溶解させて溶液とした。その後、孔径0.45μmのポリエチレン製ミクロフィルターを用いてろ過して樹脂組成物を調製した。
合成例4で得られた共重合体10.0g、光酸発生剤としてトリフルオロメタンスルホン酸エステルであるアデカアークルズ〔登録商標〕SP-606((株)ADEKA製)0.1g、及び界面活性剤としてDFX-18(ネオス(株)製)0.020gを、プロピレングリコールモノメチルエーテルアセテート43.0gに溶解させて溶液とした。その後、孔径0.45μmのポリエチレン製ミクロフィルターを用いてろ過して樹脂組成物を調製した。
合成例1で得られた共重合体10.0g及び光酸発生剤としてCPI-110B(サンアプロ(株)製)0.0006gを、プロピレングリコールモノメチルエーテルアセテート15.0gに溶解させて溶液とした。その後、孔径5μmのポリエチレン製ミクロフィルターを用いてろ過して樹脂組成物を調製した。
合成例4で得られた共重合体10.0g、及び光酸発生剤としてカチオン成分が有機スルホニウムで構成されアニオン成分がC(CF3SO2)3 -で構成される有機オニウム塩化合物であるGSID-26-1(BASF社製)0.0003gを、プロピレングリコールモノメチルエーテルアセテート15.0gに溶解させて溶液とした。その後、孔径5μmのポリエチレン製ミクロフィルターを用いてろ過して樹脂組成物を調製した。
合成例1で得られた共重合体3.13g、及び界面活性剤としてDFX-18(ネオス(株)製)0.00150gを、プロピレングリコールモノメチルエーテルアセテート16.9gに溶解させて溶液とした。その後、孔径0.45μmのポリエチレン製ミクロフィルターを用いてろ過して樹脂組成物を調製した。
合成例6で得られた共重合体の溶液13.0g(固形分3.25g含む)、光酸発生剤としてCPI-110B(サンアプロ(株)製)0.000191g、及び界面活性剤としてDFX-18(ネオス(株)製)0.00160gを、プロピレングリコールモノメチルエーテルアセテート6.13gに溶解させて溶液とした。その後、孔径0.45μmのポリエチレン製ミクロフィルターを用いてろ過して樹脂組成物を調製した。
合成例7で得られた共重合体の溶液13.0g(固形分3.25g含む)、光酸発生剤としてCPI-110B(サンアプロ(株)製)0.000192g、及び界面活性剤としてDFX-18(ネオス(株)製)0.00160gを、プロピレングリコールモノメチルエーテル9.72gに溶解させて溶液とした。その後、孔径0.45μmのポリエチレン製ミクロフィルターを用いてろ過して樹脂組成物を調製した。
合成例8で得られた共重合体の溶液13.0g(固形分3.25g含む)、光酸発生剤としてCPI-110B(サンアプロ(株)製)0.000195g、及び界面活性剤としてDFX-18(ネオス(株)製)0.00171gを、プロピレングリコールモノメチルエーテルアセテート6.28gに溶解させて溶液とした。その後、孔径0.45μmのポリエチレン製ミクロフィルターを用いてろ過して樹脂組成物を調製した。
実施例1乃至実施例7及び比較例1乃至比較例4で調製した樹脂組成物をそれぞれ、シリコンウエハー上にスピンコーターを用いて塗布し、ホットプレート上において100℃で1分間プリベークした。次いで、380nm強化ランプを備えた無電極ランプ電源システム((株)オーク製作所製)により、365nmにおける露光量が1000mJ/cm2の紫外線を全面照射した。次いで、ホットプレート上において220℃で10分間ポストベークを行い、膜厚1.0μmの膜を形成した。前記プリベーク及びポストベークはいずれも、大気中で実施した。これらの硬化膜に対して、プロピレングリコールモノメチルエーテル、プロピレングリコールモノメチルエーテルアセテート、シクロペンタノン、乳酸エチル、酢酸ブチル、3-メトキシプロピオン酸メチル、及び2.38質量%濃度の水酸化テトラメチルアンモニウム(TMAH)水溶液に、それぞれ23℃の温度条件下、5分間浸漬する試験を行った。浸漬前後において膜厚変化を測定し、浸漬溶剤のうち1つでも、浸漬前の膜厚に対して5%以上の膜厚増減があった場合は“×”、全ての溶剤について膜厚増減が5%未満であった場合は“○”として耐溶剤性を評価した。評価結果を表1に示す。
実施例1乃至実施例7及び比較例1乃至比較例4で調製した樹脂組成物をそれぞれ、石英基板上にスピンコーターを用いて塗布し、ホットプレート上において100℃で1分間プリベークした。次いで、380nm強化ランプを備えた無電極ランプ電源システム((株)オーク製作所製)により、365nmにおける露光量が1000mJ/cm2の紫外線を全面照射した。次いで、ホットプレート上において220℃で10分間ポストベークを行い、膜厚1.0μmの膜を形成した。前記プリベーク及びポストベークはいずれも、大気中で実施した。これらの硬化膜に対し、紫外線可視分光光度計UV-2600((株)島津製作所製)を用いて、波長400nmの透過率を測定した。評価結果を表1に示す。
実施例1乃至実施例7及び比較例1乃至比較例4で調製した樹脂組成物を、それぞれ高さ0.5μm、ライン幅10μm、ライン間スペース10μmの段差基板(図1参照)上にスピンコーターを用いて塗布し、ホットプレート上において100℃で1分間プリベークした。次いで、380nm強化ランプを備えた無電極ランプ電源システム((株)オーク製作所製)により、365nmにおける露光量が1000mJ/cm2の紫外線を全面照射した。次いで、ホットプレート上において220℃で10分間ポストベークを行い、膜厚1.0μmの膜を形成した。前記プリベーク及びポストベークはいずれも、大気中で実施した。図1に示すh1(段差基板1の段差)とh2(硬化膜2の段差、即ちライン上の硬化膜の高さとスペース上の硬化膜の高さとの高低差)から、“式:(1-(h2/h1))×100”を用いて平坦化率を求めた。評価結果を表1に示す。
実施例8及び実施例9で調製した樹脂組成物を、ホール幅が200μm四方、150μm四方、及び100μm四方の凹部(ホール深さ400μm)を有するシリコンウエハー上に塗布し、ホットプレート上において150℃で10分間プリベークした後、オーブンにより3×102Paの減圧下にて150℃で20分間減圧ベークした。次いで、380nm強化ランプを備えた無電極ランプ電源システム((株)オーク製作所製)により、365nmにおける露光量が1000mJ/cm2の紫外線を全面照射した。次いで、オーブンにより常圧にて220℃で60分間ポストベークを行った。前記プリベーク、減圧ベーク及びポストベークはいずれも、大気中で実施した。走査型電子顕微鏡(SEM)を用いて、実施例8及び実施例9で調製した樹脂組成物を塗布した凹部を有するシリコンウエハーの断面を観察した結果、ホール内部にボイド及びスリットの発生は観察されず、均一に埋め込まれていた。
2:硬化膜
3:ライン幅
4:ライン間スペース
h1:段差基板の段差
h2:硬化膜の段差
Claims (17)
- 前記自己架橋性共重合体の重量平均分子量は1,000乃至80,000である、請求項1乃至請求項3のいずれか一項に記載の樹脂組成物。
- 前記酸発生剤は光酸発生剤である請求項1乃至請求項4のいずれか一項に記載の樹脂組成物。
- 前記自己架橋性重合体に対し前記光酸発生剤を0.001質量%乃至20質量%含む請求項5に記載の樹脂組成物。
- さらに界面活性剤を含有する請求項1乃至請求項6のいずれか一項に記載の樹脂組成物。
- さらに架橋剤を含有する請求項1乃至請求項7のいずれか一項に記載の樹脂組成物。
- 前記架橋剤は、エポキシ環を少なくとも2つ有する化合物及びオキセタン環を少なくとも1つ有する化合物からなる群から選ばれる少なくとも1種を含有する請求項8に記載の樹脂組成物。
- さらに増感剤を含有する請求項1乃至請求項9のいずれか一項に記載の樹脂組成物。
- 平坦化膜形成用である請求項1乃至請求項10のいずれか一項に記載の樹脂組成物。
- マイクロレンズ形成用である請求項1乃至請求項10のいずれか一項に記載の樹脂組成物。
- 凹部又は段差を有する基板に請求項1乃至請求項10のいずれか一項に記載の樹脂組成物を塗布し、1×10-8Pa乃至9×104Paの減圧下、50℃乃至200℃の温度で10分乃至180分間該樹脂組成物が塗布された基板を減圧ベークすることによる、該基板の埋め込み方法。
- 前記減圧ベークは大気中又は不活性ガス中で行われる、請求項13に記載の埋め込み方法。
- 前記樹脂組成物が塗布された基板を大気中又は不活性ガス中で30℃乃至200℃の温度で0.3分乃至60分間プリベークした後、前記減圧ベークを行う、請求項13又は請求項14に記載の埋め込み方法。
- 請求項1乃至請求項10のいずれか一項に記載の樹脂組成物を基板上に塗布後、加熱手段を用いて前記樹脂組成物が塗布された基板をベークし、その後露光することによる、硬化膜の作製方法。
- 前記露光後、加熱手段を用いて再びベークすることによる、請求項16に記載の硬化膜の作製方法。
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TW201817754A (zh) | 2018-05-16 |
CN109476898A (zh) | 2019-03-15 |
KR102411927B1 (ko) | 2022-06-22 |
CN109476898B (zh) | 2021-07-06 |
KR20190035615A (ko) | 2019-04-03 |
TWI744365B (zh) | 2021-11-01 |
JP6963215B2 (ja) | 2021-11-05 |
JPWO2018021049A1 (ja) | 2019-05-09 |
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