WO2005108458A1 - 硬化性樹脂組成物、保護膜およびその形成方法 - Google Patents
硬化性樹脂組成物、保護膜およびその形成方法 Download PDFInfo
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- WO2005108458A1 WO2005108458A1 PCT/JP2005/003076 JP2005003076W WO2005108458A1 WO 2005108458 A1 WO2005108458 A1 WO 2005108458A1 JP 2005003076 W JP2005003076 W JP 2005003076W WO 2005108458 A1 WO2005108458 A1 WO 2005108458A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/20—Manufacture of shaped structures of ion-exchange resins
- C08J5/22—Films, membranes or diaphragms
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a curable resin composition, in particular, a curable resin composition suitable as a material for forming a protective film used for an optical device such as a liquid crystal display (LCD), a charge coupled device (CCD) or a CMOS sensor.
- a curable resin composition suitable as a material for forming a protective film used for an optical device such as a liquid crystal display (LCD), a charge coupled device (CCD) or a CMOS sensor.
- the present invention relates to a protective film formed from the composition and a method for forming the protective film.
- the display element In the process of manufacturing an optical device such as LCD or CCD, the display element is subjected to immersion treatment with a solvent, alkali or the like, and when forming the wiring electrode layer by sputtering, the element surface becomes locally hot. In order to prevent exposure or deterioration of the display element by such treatment, a protective film having resistance to such treatment is provided on the surface of the display element. .
- Such a protective film is required to have high adhesion to a substrate or a lower layer on which the protective film is to be formed, and a layer formed on the protective film.
- the protective film itself is smooth and strong, has transparency, has high heat resistance and light resistance, does not cause deterioration such as coloring, yellowing, whitening, etc. over a long period of time, water resistance It is required to have high resistance to solvents, solvents, acid resistance and alkali resistance.
- a thermosetting composition containing a polymer having a glycidyl group see JP-A-5-78453
- Color liquid crystal display device for example STN (Sup er Twi sted Nema In a color liquid crystal display device of the tic) type or TFT (Thin F lm Tr ans sister) type
- a bead-like spacer is dispersed on the protective film in order to keep the cell gap of the liquid crystal layer uniform. Then, the panels are bonded together, and then the liquid crystal cell is sealed by thermocompression bonding of the sealing material.
- the portion where the spacer is present The phenomenon that the protective film is recessed is seen, and the problem is that the cell gap goes wrong.
- the bonding accuracy between the color film and the opposing substrate has to be performed extremely strictly, and the protective film has an extremely high level of level difference flattening performance and Heat and pressure resistant performance is required.
- I TO indium tin oxide
- I ⁇ ⁇ is patterned with a strong acid, a strong alkali or the like.
- the protective film is exposed to a high temperature locally at the time of sputtering or subjected to numerous chemical treatments. Therefore, it is also required to endure these treatments and to adhere to the wiring electrodes so that the ITO does not come off from the protective film during chemical treatment.
- a panel for the purpose of high brightness, a panel has been developed in which a transparent electrode such as ITO and a TFT element are laminated through an interlayer insulating film with high transparency, and the opening area is enlarged.
- color filters and TFT elements have been manufactured using different substrates, but when an interlayer insulating film is used, a method for forming a color filter on a TFT element has also been developed.
- development of a protective film having high heat resistance and excellent performance (planarizing ability) to flatten a step of a color filter formed on a base substrate is desired.
- a protective film excellent in surface hardness is simply formed. It is convenient to use a curable resin composition having the following advantages, but it is a protective film that can meet the various requirements as described above while meeting the general performance requirements as a protective film such as transparency. There is no known material that is capable of forming and excellent in storage stability as a composition. Disclosure of the invention
- the present invention has been made based on the above circumstances, and the object is to satisfy the required transparency, heat resistance, surface hardness and adhesion, and to have excellent load resistance even under heating, and to be fired.
- Hard resin composition capable of forming a protective film for an optical device, which is less likely to be sublimed at that time, and which is excellent in the ability to flatten a step of a color filter formed on an underlying substrate, and the composition It is an object of the present invention to provide a protective film formed therefrom, and a method of forming the protective film.
- the problem is firstly:
- a curable resin composition comprising a polymer (hereinafter sometimes referred to as "polymer (A)") and (B) a cationically polymerizable compound different from the component (A). (Hereinafter referred to as “one-component curable resin composition ( ⁇ )”.)
- said task is secondly:
- A) Component (A1) (a) Epoxy group-containing polymerizable unsaturated compound and (b.1) polymerizable unsaturated carboxylic acid and Z or polymerizable unsaturated polyvalent carboxylic acid anhydride and (b2) A one-component curable resin composition (which is preferably solved by a copolymer with a polymerizable unsaturated compound other than the (a) component and the (bl) component.
- the third problem is:
- the component (A) contains, in the molecule (A 2), at least one epoxy group and at least one structure selected from the group consisting of an acetal structure, a ketal structure, and a t-butoxycarponyl structure.
- One-component curable resin composition (H) which is a polymer Is preferably solved by
- the fourth problem is:
- the component (A) is a copolymer of (A3) (a) an epoxy group-containing polymerizable unsaturated compound, and (b 5) a polymerizable unsaturated compound other than the component (a).
- 1-component curable resin composition (H) which is a copolymer having no propoxyl group, 5 carboxylic acid anhydride group, acetal structure, ketal structure and t-butoxycarboxyl group structure,
- the problem is:
- the component (A) is achieved by a curable resin composition which is a polymer obtained by living radical polymerization using a thiochlorosulfonyl compound as a control agent.
- (A3) A copolymer of (a) an epoxy group-containing polymerizable unsaturated compound and (b 5) a polymerizable unsaturated compound other than the component (a), which is a molecule having a hydroxyl group, a carboxylic acid, in the molecule Curables containing (A) a cationically polymerizable compound different from the (A3) component and (C) a curing agent, and a copolymer having none of an anhydride group, an acetal structure, a ketal structure and a t-butoxycarbonyl structure Resin composition (hereinafter referred to as "one-component curable resin composition (1)”),
- the seventh object is the seventh object.
- two-component curable resin composition means that the combination 5 of the first component and the second component is treated as one article unit, but before being used for final use, the first component It means a composition which is not mixed with the second component and used by mixing the first component and the second component at the time of end use.
- the problem is At least one member selected from the group consisting of the (Al) component and the (A2) component, (B) a cationically polymerizable compound different from the (A1) component and the (A2) component, and (D) irradiation and / or radiation
- a curable resin composition containing a compound capable of generating an acid upon heating hereinafter, referred to as “one-component curable resin composition ( ⁇ 2)” is preferably solved.
- the object is tenthly:
- each one-component curable resin composition ( ⁇ ), one-component curable resin composition ( ⁇ 1) or two-component curable resin is used to form a film, which is then heat-treated to achieve a protective film formation method.
- the above-mentioned subject is eleventhly:
- the polymer ( ⁇ ) used in the present invention can be advantageously obtained by living radical polymerization of a monomer mixture containing an epoxy group-containing polymerizable unsaturated compound.
- an initiator system for living radical polymerization for example, the TEMPO system discovered by Ge or ge s et al., And the substance proposed by Matyjaszewski et al.
- a combination of a thiocarboxyl thio compound and a radical initiator described in JP-A 2000-515181, JP-A 2002-500251 and JP-A 2004-518773 is preferably used.
- a suitable living polymerization initiator system for obtaining the polymer (A) of the present invention a system in which the growth terminal is not inactivated by one kind of monomer used is appropriately selected, but in consideration of the polymerization efficiency etc. And preferably a combination of a thiocarbothio compound and a radical initiator.
- examples of the thiocarboxylthio compounds include dithioesters, dithioproponates, trithiocarponates, xanthates and the like.
- radical initiator what is generally known as a radical polymerization initiator can be used.
- a radical polymerization initiator what is generally known as a radical polymerization initiator can be used.
- These polymerization initiators can be used alone or in combination of two or more.
- the amount of the thiocarbothio compound to be used is preferably 1 to 100 parts by weight, more preferably 10 to 1 parts by weight, per 100 parts by weight of the polymerization initiator. .
- the amount of the radical polymerization initiator used is preferably 0.01 to 100 parts by weight per 100 parts by weight of the monomer mixture containing the epoxy group-containing polymerizable unsaturated compound, and more preferably Is 0.1 to 10 parts by weight.
- Above living radical There are no particular limitations on the polymerization temperature during polymerization, but it is preferably 0 ° C. to 10 ° C., more preferably 10 to 85 ° C.
- polymer (A2) at least one selected from the group consisting of (A2-1) unsaturated compound (a) and (b3) an asphalt structure, a ketal structure and a t-butoxycarbonyl structure And (b 4) polymerizable compounds other than unsaturated compound (a) and unsaturated compound (b 3), and polymerizable unsaturated compound (hereinafter referred to as “unsaturated compound (b 3) J”) containing a structure of a species A copolymer with an unsaturated compound (hereinafter referred to as "unsaturated compound (b4)") (hereinafter referred to as "copolymer (referred to as A2-DJ)" is more preferable.
- the copolymer (A1) can further contain an asetar structure, a ketal structure or a t-butoxycarbonyl structure, and the polymer (A2) further contains a carboxyl group or a carboxylic acid anhydride group. be able to.
- glycidyl (meth) acrylate for example, glycidyl (meth) acrylate, glycidyl monoethyl acrylate, glycidyl ⁇ - ⁇ -propyl acrylate, glycidyl di- ⁇ ⁇ ⁇ -butyl acrylate, (meth) acrylic acid 3, 4— Epoxypeptyl, 2-ethylaphthalic acid 3, 4-epoxypeptyl, (meth) acrylic acid 6, 7-epoxyheptyl, monoethylacrylic acid 6, 7-epoxyheptyl, 0-bierbenzyl glycidyl ether, Examples thereof include m-vinylbenzyl glycidyl ether, ⁇ -vinylbenzyl glycidyl ether and the like.
- unsaturated compounds (a) glycidyl (meth) acrylate, (meth) acrylic acid 6,7 1-epoxyheptyl, o-vinyl benzyl dalysidyl ether, m-hiniri levendi J reglycyri le ter, p- vini Preferred is relevis leucricin release ether and the like.
- These preferred unsaturated compounds (a) have high copolymerization reactivity and are effective for enhancing the heat resistance and surface hardness of the resulting protective film.
- the unsaturated compounds (a) may be used alone or in combination of two or more.
- examples of the unsaturated compound (b 1) include
- Unsaturated polyvalent anhydride such as maleic anhydride, itaconic anhydride, citraconic anhydride, cis-1,2,3,4-tetrahydrophthalic anhydride
- unsaturated carboxylic acids are preferably acrylic acid and methacrylic acid, and unsaturated polycarboxylic acid anhydrides are particularly preferably anhydrous. Maleic acid is preferred.
- unsaturated carboxylic acids are preferably acrylic acid and methacrylic acid, and unsaturated polycarboxylic acid anhydrides are particularly preferably anhydrous. Maleic acid is preferred.
- unsaturated compounds (b 1) have high copolymerization reactivity and are effective in enhancing the heat resistance and surface hardness of the resulting protective film.
- the unsaturated compounds (bl) can be used alone or in combination of two or more.
- unsaturated compound (b 2) for example,
- (Meth) acrylic acid aryl ester such as phenyl (meth) acrylate, benzyl (meth) acrylate;
- Unsaturated dicarboxylic acid diesters such as jetyl maleate, jetyl fumarate, jetyl diconate;
- Vinyl cyanide compounds such as (meth) acrylonitrile, single hole acrylonitrile, vinylidene cyanide;
- Unsaturated amide compounds such as (meth) acrylamide, N, N-dimethyl (meth) acrylamide;
- Styrene ⁇ -methylstyrene, m-methylstyrene, ⁇ -methylstyrene, vinyltoluene, aromatic vinyl compound such as p-methoxystyrene; Inden derivatives, such as 1-methylindene;
- conjugated diene compounds such as 1, 3-butadiene, isoprene and 2, 3-dimethyl-1, 3-butadiene,
- unsaturated compounds (b 2) methyl methacrylate, t-butyl methacrylate, cyclohexyl acrylate, dicyclopentenyl methacrylate, 2-methylcyclohexyl methacrylate, and N-phenylmaleimide N-cyclohexylmaleimide, styrene, p-methoxystyrene, 1,3-butadiene and the like are preferable.
- These preferred unsaturated compounds (b 2) have high copolymerization reactivity, and the heat resistance of the resulting protective film (except in the case of 1,3-butadiene) and the surface hardness ( ⁇ , 1, 2 It is effective to increase (except in the case of 3-butadiene).
- the unsaturated compounds (b 2) can be used alone or in combination of two or more.
- Methacrylic acid glycidyl methacrylate Z methacrylate acrylic acid methyl methacrylate / styrene copolymer,-,,,--:---Daricidyl methacrylate / methacrylic acid / hydroxyethyl methacrylate Z p-methoxystyrene copolymer,
- Methacrylic acid 6 7-Epoxy heptyl Z Methacrylic acid Z Methacrylic acid dibasic opening Pentanyl N-styrene copolymer,
- Methacrylic acid 6 7-epoxyheptyl Z-acrylic acid Z maleic anhydride styrene copolymer
- Methacrylic acid 6 7-epoxyheptyl Z acrylic acid / maleic anhydride Z methacrylic acid t-butyl copolymer
- the content of the repeating unit derived from the unsaturated compound (a) is preferably 10 to 70% by weight, particularly preferably 20 to 6% with respect to all the repeating units. It is 0% by weight.
- the total content of repeating units derived from polymerizable unsaturated carboxylic acid and polymerizable unsaturated polyvalent anhydride is, based on all repeating units. It is preferably 5 to 40% by weight, particularly preferably 10 to 30% by weight.
- the content of repeating units derived from other polymerizable unsaturated compounds is preferably 10 to 70% by weight, particularly preferably 20 to 50% by weight, based on all repeating units.
- the content of the repeating unit derived from the unsaturated compound (a) is less than 10% by weight, the heat resistance and the surface hardness of the protective film tend to decrease, while if it exceeds 70% by weight, the composition is preserved Stability tends to decrease.
- the total content of repeating units derived from the polymerizable unsaturated carboxylic acid and the polymerizable unsaturated polyvalent carboxylic acid anhydride is less than 5% by weight, the heat resistance and the surface hardness of the protective film are excellent. If it exceeds 40% by weight, the storage stability of the composition tends to decrease.
- the storage stability of the composition tends to decrease, while if it exceeds 70% by weight, the protective film The heat resistance and the surface hardness tend to decrease.
- the polymer (A 2) is not particularly limited as long as the above requirements are satisfied, and may be any of an addition polymer, a polyaddition polymer, a polycondensation polymer, and the like.
- the acetal structure or ketal structure in the polymer (A 2) is a polymer (A 2) having an acetal-forming functional group or a ketal-forming functional group as described below, either directly or via a bond such as a carboxyl group. It can be introduced by bonding to a carbon atom inside.
- aceether forming functional group examples include, for example,
- 1-methoxyethoxy group 1 ethoxyethoxy group, 1-n-propoxytoxy group, 1-i-propoxyethoxy group, 1-n-butoxyethoxy group, 1-i-butoxyethoxy group, 1-sec — Butoxyethoxy group, 1 t 1 butoxyethoxy group, 1-cyclopentyloxyethoxy group, 1-cyclohexyloxy ethoxy group, 1 _ norbornyloxy ethoxy group, 1-portyloxyethoxy group, 1 Phenylethoxy ethoxy group, 1- (1-naphthyloxy) ethoxy group, 1-benzyloxy group, 1-phenylethyloxy group,
- one ethoxyethoxy group, one n-propoxyethoxy group, one-cyclohexyloxy ethoxy group, a 2-tetrahydridopyranyloxy group, a 2-tetrahydropyranyloxy group, etc. preferable.
- a functional group capable of forming a ketal structure for example, 1-methyl-1-methoxymethoxy group, 1-methyl-1-ethoxyethoxy group 1-Methyl-1-n-propoxyethoxy, 1-methyl-1-i-propoxyethoxy, 1-methyl-1-n-butoxyethoxy, 1-methyl-1-i-butoxyethoxy, ⁇ 1-methyl-1- 1 s ex -Butoxyethoxy group, 1-methyl-1-t-butoxyethoxy group, 1-methyl-1-cyclopentyloxyethoxy group, 1-methyl-1-cyclohexyloxy shetoxy group, 1-methyl-1-hydroxyl group Porunyloxy ethoxy group, 1-methyl-1-monobutyl ethoxy group, 1-methyl-1-phenoxy ethoxy group, 1-methyl-1-one (1-naphthyloxy group Ethoxy, 1-methyl - 1 one Benjir
- 1-i-propoxyethoxy group 1-benzimidazole 1-cyclohexyloxyethoxy group, 1-benzimidazole 1-phenylethoxyethoxy group, 1-benzyl-1-benzyloxyethoxy group, 1-methoxy cyclopentylo And xy, 1-methoxycyclohexyloxy, 2- (2-methyltetrahydrofuranyl) oxy, 2- (2-methyltetrahydropyranyl) oxy and the like.
- alkali-forming functional groups 1-methyl-1-methoxymethoxy, 1-methyl-1-cyclohexylethoxy and the like are preferable.
- the polymer (A 2) has better storage stability than the copolymer (A 1), and has a one-part curable resin composition which is also excellent in the flattening ability of the resulting protective film. It can bring you things.
- the unsaturated compound (b-3) for example, at least one member selected from the group consisting of a complete setal structure, a ketal structure and a t-butoxycarbonyl structure
- Norbornene compounds having a structure hereinafter referred to as “specific norbornene compounds”
- (meth) acrylic acid ester compounds having an acetar structure and Z or ketal structure hereinafter referred to as “specific (meth) acrylic acid ester compounds And (meth) acrylic acid, t-butyl and the like.
- specific norbornene compounds are examples of the specific norbornene compounds.
- Specific examples of the specific (meth) acrylic acid ester compound include (meth) acrylic acid 1 ethoxyethyl, (meth) acrylic acid 1 n-proboxytyl, (meth) acrylic acid 1-n-butoxyethyl, (meth) acrylic acid Acids 1-i-Butoxyethyl, (meth) -acrylic acid 1- (cyclopentyloxy) -ethyl, (meth) -acrylic acid 1- (cyclohexyloxy) -ethyl, (meth) -acrylic acid 1- (1,1-dimethyl-modified toxi) And ethyl, (meth) -acrylic acid tetrahydro-2H-pyran, 2-yl and the like.
- specific (meth) acrylic acid ester compounds and t-butyl (meth) acrylate are preferable, and in particular, methacrylic acid 1-ethoxyethyl, methacrylic acid 1-i-butoxyethyl, Methacrylic acid 1- (cyclopentyloxy) ethyl, methacrylic acid 1- (cyclohexyloxy) ethyl, methacrylic acid 1- (1,1-dimethylethoxy) ethyl, methacrylic acid tetrahydromono H-pyran-1 -yl, Particularly preferred is t-butyl methacrylate and the like.
- These preferred unsaturated compounds (b 3) are one-component curable resin compositions ( ⁇ ) having high copolymerization reactivity and excellent storage stability and flattening ability of protective film and one-component hard resin
- the resin composition (2) is effective to increase the heat resistance and surface hardness of the resulting protective film as well as to obtain the
- the unsaturated compounds (b 3) can be used alone or in combination of two or more.
- the unsaturated compound (b4) for example, the same compounds as the compounds exemplified for the unsaturated compound (b 1) and the unsaturated compound (b2) can be mentioned.
- methyl methacrylate, methyl acrylate, hexyl methacrylate, dicyclopentanyl methacrylate, 2-methylcyclohexyl methacrylate, N-phenylmaleimide, N-cyclo Xylmaleimide, styrene, P-methoxystyrene, 1, 3-butadiene and the like are preferable.
- These preferred unsaturated compounds (b4) have high copolymerization reactivity, and the heat resistance of the resulting protective film (except in the case of 1, 3-butadiene) and the surface hardness (i.e., 1, It is effective to increase (except in the case of 3-butadiene).
- the unsaturated compounds (b4) can be used alone or in combination of two or more.
- Methacrylic acid glycidyl methacrylate / acrylic acid 1-(cyclohexyloxy) hydroxyethyl Z dicyclopentanyl methacrylate styrene copolymer
- Methacrylic acid glycidyl methacrylic acid 1- (cyclohexyloxy) ethyl 7 methacrylic acid dicyclic phosphonic anhydride Z styrene copolymer,
- Methacrylic acid glycidyl Z 2 3-di (tetrahydropyran-1-1 alkoxy group sulfonyl)-5-norbornene N Z methacrylate viconic acid opening pennyl Z styrene copolymer,
- Glycidyl methacrylate Z Tetrahydro methacrylate-2 H-pyran 1 2-yl Z acrylic acid cyclohexyl / p-methoxystyrene copolymer,
- Methacrylic acid 6 7-epoxyheptynoacrylic acid tetrahydro-2H-pyran-one 2-yl Z-methyl methacrylate t-butyl Z-maleic anhydride copolymer,
- Methacrylic acid 6 7-epoxyheptyl / methacrylic acid t-butyl Z anhydride maleic anhydride Z styrene copolymer
- Methacrylic acid glycidyl Z-acrylic acid 1- (cyclohexyloxy) ethyl ZN-cyclohexylmaleimide Z-styrene copolymer,
- the content of repeating units derived from the unsaturated compound (a) is preferably 10 to 70% by weight, particularly preferably 20 to 70% by weight, based on all repeating units. 60 wt%. If the content of the repeating unit derived from the unsaturated compound (a) is less than 10% by weight, the heat resistance and the surface hardness of the protective film tend to decrease, while if it exceeds 70% by weight, the composition is preserved Stability tends to decrease.
- the content of the repeating unit derived from the unsaturated compound (b 3) is preferably 5 to 60% by weight, particularly preferably 10 to 50% by weight. By making the content of the repeating unit derived from the unsaturated compound (b 3) in this range, it is possible to realize good heat resistance and surface hardness of the protective film.
- the content of repeating units derived from unsaturated compound (b 4) is the total content of repeating units derived from unsaturated compound (a) and unsaturated compound (b 3) from 100% by weight. Reduced amount of force s unsaturated carbon as unsaturated compound (b 4) In the case of using an acid or unsaturated polyvalent anhydride, if the total content of repeating units derived therefrom exceeds 40% by weight, the storage stability of the composition may be impaired. Therefore, it is preferable not to exceed this value.
- examples of the unsaturated compound (b 5) include the same as the compounds exemplified for the unsaturated compound (b 2). .
- unsaturated compounds (b 5) methyl methacrylate, t-butyl methacrylate, cyclohexyl acrylate, dicyclopentenyl methacrylate, 2-methylcyclohexyl, acrylic acid, N-phenyl maleimide, N -Cyclohexylmaleimide, styrene, P-methoxystyrene, 1,3-butadiene and the like are preferable.
- These preferred unsaturated compounds (b 5) have high copolymerization reactivity, and the heat resistance (except in the case of 1,3-butadiene) of the resulting protective film and the surface hardness ( ⁇ , 1, It is effective to increase (except in the case of 3-butadiene).
- the unsaturated compounds (b 5) can be used alone or in combination of two or more.
- Methacrylic acid 6, 7-epoxyheptyl / N-cyclohexyl maleimide / styrene copolymer Etc. can be mentioned.
- copolymers (A 3) more preferred are a methacrylic acid Z styrene copolymer, a methacrylic acid daricidyl Z resin, a methacrylic acid bisicic opening penicunil copolymer, a methacrylic acid methacrylic acid Z copolymer
- methacrylic acid methacrylic acid Z copolymer Specific examples thereof include acrylic acid dicyl-opening pennil dasylene copolymer, glycidyl methacrylate ZN-cyclohexylmaleimide / styrene copolymer, and the like.
- the content of repeating units derived from the unsaturated compound (a) is preferably 1 to 90% by weight, particularly preferably 40 to 90% by weight, based on all repeating units. It is weight%.
- the content of the repeating unit derived from the unsaturated compound (a) is less than 1% by weight, the heat resistance and the surface hardness of the protective film tend to decrease, while if it exceeds 90% by weight, the composition Storage stability tends to decrease.
- the copolymer (A 1), the copolymer (A 2-1) and the copolymer (A 3) can be synthesized by living radical polymerization of each unsaturated compound in the presence of a suitable solvent and a polymerization initiator. Can.
- solvent used for the polymerization for example, alcohol, ether, glycol ether, ethylene glycol alkyl ether acetate, diethylene glycol, propylene glycol monoalkyl ether, propylene glycol alkyl ether acetate, propylene glycol alkyl ether
- monoterpropionate aromatic hydrocarbon, ketone, ester and the like.
- al al :: le, such as methanol, ethanol, benzyl alcohol, 2-phenylethyl alcohol, 3-phenyl-1-propanol and the like;
- glycol ether for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether and the like;
- ethylene glycol alkyl ether acetate for example, methyl sequeste sorbitol acetate, ether sequeste sorbitol acetate, ethylene glycol monobutyl ether — Teracetate, ethylene glycol monoethyl ether acetate, etc .; as dimethylene glycol, for example, dimethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylenediaryl dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol Such as ethyl methyl ether;
- propylene daryl monoalkyl ether for example, propylene daryl monomethyl ether, propylene glycol monoethyl ether, propylene daryl monopropyl ether, propylene daryl monobutyl ether, etc .;
- propylene glycol alkyl ether propionate for example, propylene glycol methyl ether acetate, propylene glycol ethyl: I monoacetate, propylene glycol monoether acetate, propylene glycol butyl ether acetate and the like;
- propylene daryl alkyl ether acetate for example, propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate, propylidene glycol butyl ether propioneate, etc .;
- aromatic hydrocarbons for example, toluene, xylene etc .
- ketones for example, methyl ethyl ketone, cyclohexanone, 4-hydroxy-14-methyl-2-pentanone and the like;
- esters for example methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-2-methylpropionate, methyl hydroxyacetate, hydroxy Acetyhyl acetate, Butyl hydroxyacetate, Methyl lactate, Ethyl lactate, Propyl lactate, Butyl lactate, Methyl 3-hydroxypropionate, Ethyl 3-hydroxypropionate, Propyl 3-hydroxypropionate, Butyl 3-hydroxypropionate, 2 -Hydroxy- methyl 3-methylbutanoate, methyl methoxyacetate, ethyl methoxyacetate, propyl methoxyacetate, butyl methoxyacetate, Methyl ethoxyacetate, ethyl ethoxyacetate, propyl ethoxyacetate, butyl eth
- Ethyl 3-propoxypropionate, propyl 3-propoxypropionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, ethyl 3-butyoxypropionate, propyl 3-butoxypropionate, 3-butoxypropionate oral butyl pionate Etc. can be mentioned respectively.
- ethylene glycol alkyl ether acetate diethylene glycol mono, propylene glycol monoalkyl ether, and propylene glycol alkyl ether acetate are preferable, and diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, propylene Particularly preferred are dacomethyl ether and propylene glycol ether.
- the said solvent can be used individually or in mixture of 2 or more types.
- the polymer (A) used in the present invention is a ratio of polystyrene equivalent weight average molecular weight (hereinafter referred to as "Mw") and polystyrene equivalent number average molecular weight (hereinafter referred to as "Mn”) measured by gel permeation chromatography. (MwZMn) is at most 1.7, preferably at most 1.5. Heat resistance when Mw / Mn exceeds 1 ⁇ 7 It may be inferior to sex. Further, Mw is preferably, 2X 10 3 ⁇ 1X 10 5, yo Ri is preferably 5 X 10 3 ⁇ 5 X 10 4 .
- Mn is, preferably, 1. is a 2X 10 3 ⁇ 1X 10 5, good Ri is preferably 2. a 9X 10 3 ⁇ 5X 10 4.
- the amount of residual monomer measured by gel permeation chromatography of the polymer (A) used in the present invention is preferably less than 5.0%, more preferably less than 3.%, particularly preferably 2%. Less than 0%.
- the polymer (A) can be used alone or as a mixture of two or more, and in the one-component curable resin composition (2), the copolymer (A1) and the weight can be used. At least one of the groups of coalescing (A2) can be used.
- the component (B) in the present invention comprises a cationically polymerizable compound different from the polymer (A).
- the chiral polymerizable compound is not particularly limited as long as it can be polymerized under acidic conditions, but, for example, it is at least selected from the group consisting of oxetane ring skeleton, 3, 4-epoxycyclohexane skeleton and epoxy group Examples thereof include a compound having a group capable of undergoing an addition reaction with an epoxy group in the polymer (A), such as a compound having one or more two or more in its molecule.
- Polydaricidyl ethers of polyester polyols obtained by the reaction of aliphatic polyhydric alcohols such as ethylene glycol, propylene glycol and glycerin with one or more alkylene oxides;
- bivissuophe enorol type AA eopupokikish tree resin fats it is as epepipicochitototo 882288, the same 11000011, the same 11 1155 000022, the same 1100 0033, the same 1100 0044, the same Same as 11000077, same as 11000099, same as 11001100 ((more than this, oil-based oil-based cichelelle epopoxyxi (made in (stock))) etc .;
- Bibiss sulf eno enol lehr FF type Eepopoxysi tree resin oil and it is made of ⁇ Pepi Pico Coat 880077 ((oil oiled ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ((( ⁇ ⁇ ))) Made in Japan )) And so on;;
- the fueenonor rnono popola rack type eepopoxyxii resin resin it can be used as a resin, and it can be used as an oil, oil, oil, oil, oil, oil, etc.
- Chemical Industries, Ltd. made by KK (Co., Ltd.)
- DD PP PP NN 220011 DD PP PP NN 220011
- 220022 (The above, Nippon-Nippon Chemical Co., Ltd. (Corporation) ) Made in)) etc .;
- crepe resorce rnonopoporarakkku type eepopokikish tree resin fat as DD CC CCNN 11 0022, the same as 11 0033 SS, the same
- phenol novolac epoxy resin polyphenol phenol resin and the like are preferable.
- the cationically polymerizable compounds can be used alone or in combination of two or more.
- the curing agent in the one-component curable resin composition (1) and the two-component curable resin composition ( ⁇ ) has a functional group capable of reacting with the epoxy group in the copolymer (A 3). It consists of a compound with more than species.
- curing agents examples include polyvalent carboxylic acids, polyvalent carboxylic acid anhydrides, and copolymers of unsaturated polyvalent carboxylic acid anhydrides with other olefinic unsaturated compounds (such as two or more).
- the copolymer which has an epoxy group of these is remove
- excluded.) (Hereinafter, it is called "a carboxylic anhydride group containing copolymer.") Etc. can be mentioned.
- polyvalent carboxylic acids examples include: succinic acid, dartalic acid, adipic acid, 1, 2, 3, 4-butanetetracarboxylic acid, aliphatic polyvalent carboxylic acids such as maleic acid and itaconic acid; Alicyclic polybasic carboxylic acids such as acid, 1,2-cyclohexanedicarboxylic acid, 1,2,4-cyclohexanetricarboxylic acid, cyclopentene tetrabasic acid; phthalic acid, isophthalic acid, terephthalic acid, Examples thereof include aromatic polybasic carboxylic acids such as trimellitic acid, pyromellitic acid and 1,2,5,8-naphthalene tetracarboxylic acid.
- aromatic polyvalent carboxylic acids are preferable from the viewpoint of the reactivity of the curable resin composition, the heat resistance of the protective film to be formed, and the like.
- polyvalent carboxylic acid anhydride for example, itaconic acid anhydride, succinic acid anhydride, Aliphatic dicarboxylic acid anhydrides such as citraconic anhydride, dodecenyl succinic anhydride, tricarbanilic anhydride, maleic anhydride, maleic anhydride, hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, hemimic anhydride; 1, 2, 3, 4 Aliphatic polyhydric polyvalent dianhydrides such as monobutanetetrafulc acid rubonic acid dianhydride, thirculous pendent tetracarboxylic acid dianhydride; phthalic anhydride, pyromellitic anhydride, trimellitic anhydride, Aromatic polyvalent carboxylic acid anhydrides such as benzozophenone anhydride tetracarboxylic acid; and ester group-containing acid anhydrides such as ethy lene rederyc
- polyvalent carboxylic acid anhydrides aromatic polyvalent carboxylic acid anhydrides are preferred, and in particular, trimellitic anhydride is preferred in that a highly heat-resistant protective film can be obtained.
- examples of unsaturated polyvalent carboxylic acid anhydride include maleic anhydride, itaconic acid anhydride, citraconic acid anhydride, cis-1, 2, 3, 4-tetrahydrophthalic acid. Anhydride etc. can be mentioned. These unsaturated polyvalent carboxylic acid anhydrides can be used alone or in combination of two or more.
- olefin-based unsaturated compounds for example, styrene, P-methylstyrene, p-methoxystyrene, methyl (meth) acrylate, cetyl (meth) T acrylate, n-propyl (meth) acrylate (Meth) acrylic acid i-propyl, (meth) acrylic acid n-butyl, (meth) acrylic acid t 1 pylyl, (meth) acrylic acid 2-methylcyclohexyl, (meth) acrylic acid dicyclopentynyl, N —Phenylmaleimide, N—cyclohexylmaleimide and the like can be mentioned.
- allephine unsaturated compounds can be used alone or in combination of two or more.
- carboxylic acid anhydride group-containing copolymer maleic anhydride Z styrene copolymer, citraconic anhydride Z methacrylate acrylic acid dicyclopentene copolymer and the like can be mentioned.
- the copolymerization ratio of unsaturated polyvalent carboxylic acid anhydride in the carboxylic acid anhydride group-containing copolymer is preferably 1 to 80 parts by weight, more preferably 10 to 60 parts by weight. This By using a copolymer having such a copolymerization ratio, a protective film excellent in planarization ability can be obtained.
- the Mw of the carboxylic acid anhydride group-containing copolymer is preferably 500 to 50, 00, and more preferably 500 to 100, 00.
- the curing agents may be used alone or in combination of two or more.
- the first component consisting of a one-component curable resin composition (a) wherein the component (A) is a copolymer (A 3) is combined with a second component containing a curing agent.
- the two-part curable resin composition () can be obtained.
- acid generators capable of generating an acid upon irradiation and / or heating of the one-component curable resin composition (H)
- the acid is generated upon irradiation.
- the product is called “radiation-sensitive acid generator”, and the one that generates acid by heating is called “heat-sensitive acid generator”.
- the radiation-sensitive acid generator examples include, for example, diarylidomium salt, triarylsulfonium salt, and diarylphosphonium salt, and any of these can be preferably used.
- heat-sensitive acid generator for example, sulfodinium salt (excluding the above-mentioned triarylsulfonium salt), benzothiaznium salt, ammonium salt, phosphonium salt (such as persimmon, as described above). Phosphonium salts are excluded.) Among these, sulfonium salts and benzothiazolium salts are preferred.
- diaryleodymium salts include, for example, diphenolylone tetrafluoroether, diphenolyl disodium bicarbonate, safluorocarbonate, Diphenyl iodonium Hexa Fluoro Arsenate, Di fenio triburi night foliage sulfone 1 ⁇ Diphenyl eo rydonio um trifluoroacetate, Diphenyle dio nium p-Toluene sulfoneate, 4-Methoxyphenyle Two-thorpedonium tetrafluoroporate, 4 _ methoxy-phenioriodhonium hexafluorophosphonate, 4-meth X-Ray Phenyl Fluorine Arsenate, 4-Methoxy Phenyl trifluoromethane Sulfonate, 4-Methoxy Phenyl Fluorinated Sodium Trifluoroacetate, 4-Meth
- difluorodiphenium hexafluorosulfonate is preferred.
- triarylsulfonium salt for example, trifenylsulfonium tetrafluoride, trifenylsulfonium hexafluorophosphate, trifenylsulfonium hexafluoroarsenate, trifenylsulfonyl Mutrifluoromethanesulfonate, Trifenylsulfonium Trifluoroacetate, Triphenylsulfonium P-Toluenesulfonate,
- diaryle phosphonium salt for example, (1-6-?-Cumene)
- UV 1-6950, UV 1-6970, UV 1-6974, and UV I- 699 as a salt of diazolyonium.
- Adeka Obtomer SP-150 Adeka Optoma-1 SP-151
- Adeka Optoma-1 SP-170 Adka Optoma-1 SP-171 (all, manufactured by Asahi Denka Kogyo Co., Ltd.); 2481, C
- diallyl phosphonium salt for example, Irgacure-I 261 (Ciba Specialty Chemicals Co., Ltd.); PCI- 061 T, PCI- 062, PC I- 020 T, PC I- 022 And Nippon Kayaku Co., Ltd.) and the like.
- the resulting protective film has high surface hardness.
- the radiation-sensitive acid generators can be used alone or in combination of two or more.
- Benzyl-4-hydroxyphenylmethylsulfonium hexathioantimonate benzyl-4-hydroxyphenylmethylsulfonium hexafluorophosphate, 4-acetoxyphenyl benzylmethyl sulfonium hexahydroxyantimonate, benzyl-4-methoxypheny Dimethyl methyl sulfonium hexafluoroantimonate, benzyl 2-methyl 4-hydroxyphenyl methyl sulfonate sodium hexachloroantimonate, benzyl 3-chloro-4 monohydroxyphenyl methyl sulfonium Benzyl sulfonium salts such as xafluoro arsenate, 4-methoxybenzyl-4-hydroxyphenyl methyl sulfonium sulfate, and the like;
- sulfonium salts 4-acetoxyphenyl dimethyl sulfonium hexafluoroarsenate, benzyl 4-hydroxyphenyl methyl sulfonium hexafluoroantimonate salt, 4-acetoxyfuel Benzylmethylsulfonium hexafluoroantimonate, dibenzyl-4-hydroxyphenylsulfonium hexaphoroantimonate, dibenzyl-4-asphatophenyl phenylsulfonium hexafluoranoantimonate, etc. Is preferred.
- examples of the benzothiozonium salt include 3-benzylbenzothiazone hexahydrate, 3-benzylbenzothiazole hemifaurophosphate, 3-benzylbenzothiazoline. 3- (4-methoxybenzyl) benzothiazolium hexafluoroantimonate, 3-benzimidazole 2-methylthiobenzothiazole hexamide, 3- (4-methoxybenzyl) benzothiazole, 3- Examples thereof include benzylbenzothiazonium salts such as benzyl-5-chlorobenzimidazolium hexafluoroamonmonate and the like. Among these benzothiazoline salts, preference is given, in particular, to 3-benzyl iminothiazole ammonium salts.
- alkyl sulfonium salt examples include, for example, adechaopone CP-66, Adekaopton CP-77 (manufactured by Asahi Denka Kogyo Co., Ltd.) and the like.
- benzyl sulfonium salt for example, SI-60, SI-80, SI-100, SI-110, SI-145, SI-150, SI-80L, SI-100L, SI-110L (or more, Name Sanshin Chemical Industries Co., Ltd.) Can.
- SI-80, SI-100, SI-110 and the like are preferable in that the resulting protective film has high surface hardness.
- the heat-sensitive acid generators may be used alone or in combination of two or more.
- each curable resin composition of the present invention includes the following (I) to (IV).
- polymer (A) (preferably containing at least one member of the group consisting of copolymer (Al), copolymer (A2) and copolymer (A3), and (B) a cationically polymerizable compound
- the composition may further optionally contain the following optional additive components, and the amount of the cationically polymerizable compound used is 3 to 100 parts by weight, more preferably 5 to 50 parts by weight based on 100 parts by weight of the polymer (A).
- the one-component curable resin composition (H) by setting the amount of the cationically polymerizable compound in the above range, a protective film having sufficient surface hardness can be obtained.
- This one-component curable resin composition (H) is particularly excellent in long-term storage stability.
- the amount of the cationically polymerizable compound used is 3 to 100 parts by weight, more preferably 5 to 50 parts by weight, and the amount of the curing agent used is 20 to 60 parts by weight, preferably 20 to 50 parts by weight. It is a part by weight (referred to as one-component hard resin composition (1)).
- one-component hard resin composition (1) In the one-component curable resin composition (1), when the amount of the curing agent used falls within the above range, it exhibits good curing characteristics and does not impair various properties of the protective film.
- the one-component curable resin composition ( ⁇ ) is preferably used within 24 hours after preparation.
- the amount of the cationically polymerizable compound used is 3 to 100 parts by weight, more preferably 5 to 50 parts by weight, per 100 parts by weight of the polymer, and the amount of the curing agent used is 20 to 60 parts by weight Part, more preferably 20 to 50 parts by weight
- the two-part curable resin composition ( ⁇ ) is preferably used within 24 hours after mixing of the first component and the second component.
- the curing agent is usually a solution dissolved in a suitable solvent Used as The concentration of the curing agent in the solution is preferably 5 to 50% by weight, more preferably 10 to 40% by weight.
- a suitable solvent used as the concentration of the curing agent in the solution is preferably 5 to 50% by weight, more preferably 10 to 40% by weight.
- the solvent used here the same solvents as those exemplified as the solvents used for the synthesis of the copolymer (Al), the copolymer (A2-1) and the copolymer (A3) can be used. .
- Parts of the copolymer (A1) and the polymer (A2), and the dose of the cationically polymerizable compound is 3 to 100.
- the acid generator is preferably used in an amount of not more than 20 parts by weight, more preferably 0.05 to 20 parts by weight, particularly preferably 0.1 to 10 parts by weight.
- Part 1 is a one-part curable resin composition ( ⁇ 2).
- this one-component curable resin composition ( ⁇ 2) by using an acid generator in the above range, good curing characteristics are exhibited, and various properties of the protective film are not impaired.
- These one-component curable resin composition ( ⁇ ), one-component curable resin composition ( ⁇ 1), one-component curable resin composition ( ⁇ 2) and two-component curable resin composition ( ⁇ ) are those
- the protective film formed from the film satisfies the required transparency, heat resistance, surface hardness, and adhesion, is excellent in load resistance even under heating, and has a step difference of the color filter formed on the base substrate. Excellent in flattening performance.
- an optional additive component other than the above for example, a surfactant, an adhesion auxiliary agent, etc. may be blended within the range that does not impair the effects of the present invention.
- the surfactant is added to improve the coatability of the composition.
- surfactant preferably, for example, fluorosurfactant, silicone surfactant, polyoxyethylene alkyl ether, polyoxyethylene ethylene aryl ether, polyoxyethylene dialkyl ester, etc.
- fluorosurfactant preferably, for example, fluorosurfactant, silicone surfactant, polyoxyethylene alkyl ether, polyoxyethylene ethylene aryl ether, polyoxyethylene dialkyl ester, etc.
- silicone surfactant preferably, for example, fluorosurfactant, silicone surfactant, polyoxyethylene alkyl ether, polyoxyethylene ethylene aryl ether, polyoxyethylene dialkyl ester, etc.
- surfactant can be mentioned.
- polyoxyethylene alkyl ether examples include polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleyl ether.
- polyoxyethylene alkyl ether examples include polyoxyethylene alkyl ether.
- Ethylene n-octylphenyl ether, polyoxyethylene n-nophenyl ether and the like can be mentioned.
- polyoxyethylene dialkyl ester examples include polyoxyethylene dilaurate, polyoxyethylene ethylene distearate and the like.
- fluorinated surfactants for example, BM-1 000, BM-1100 (above, manufactured by BM CH IMID); Megafuck F 14 2D, Megafuck F 172, Megafuck F 173, Megafuck F 183 (more, Dainippon Ink and Chemicals, Inc.); Floraid FC-135, Floraid FC-170C, Floraid FC-430, Florard FC-431 (above, Sumitomo SREEM Co., Ltd.); Surfron S-112, Saflon S-113, Saflon S-131, Caflon S-141, Caflon S-145, Saflon S-382, Caflon SC-101 Saflon SC-102, Saflon SC-1 03, Saflon SC-104, Caflon SC-105, Saflon SC-1 06 (above, manufactured by Asahi Glass Co., Ltd.) and the like.
- fluorinated surfactants for example, BM-1 000, BM-1100 (above, manufactured
- silicone type surfactant for example, SH-28PA, SH-190, SH-193, SZ-6032, SF-8428, DC57, DC-90 (or more, Toray Dow Corning silicone) KP 341 (Shin-Etsu Kagaku Kogyo Co., Ltd.); F-top DF 301, F-top DF 303, F-top DF 352 (all available from Shin-Akita Kasei Co., Ltd.), etc. it can.
- Polyflo No. 57 or Polyflo No. 90 (all manufactured by Kyoeisha Chemical Co., Ltd.), which are (meth) acrylic acid copolymers, may be mentioned. it can.
- the compounding amount of the surfactant is preferably 5 parts by weight or less, more preferably 2 parts by weight or less, with respect to 100 parts by weight of the polymer (A).
- the content of the surfactant exceeds 5 parts by weight, the coating tends to be roughened.
- the adhesion aiding agent is added to improve the adhesion between the protective film to be formed and the substrate and the like.
- an adhesion assistant for example, a silane coupling agent having a reactive group such as an epoxy group, a methacryloyl group, a biphenyl group, an isocyanato group, or an epoxy group is preferable.
- adhesion promoter examples include trimethoxysilyl benzoic acid, methacryloxy ciprovir trimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, isocyanatopropyltriethoxysilane, aglycidoxypropyltrimethoxysilane, i8- (3,4-epoxycyclohexyl) hydroxyethyltrimethoxysilane etc. can be mentioned.
- the compounding amount of the adhesion promoter is preferably 30 parts by weight or less, more preferably 25 parts by weight or less, based on 100 parts by weight of the polymer (A). When the amount of the adhesion promoter exceeds 30 parts by weight, the heat resistance of the resulting protective film may be insufficient.
- the resin composition of the present invention is prepared by uniformly dissolving or dispersing the above components, preferably in a suitable solvent.
- a solvent to be used each of the compositions It is preferable to use one that dissolves or disperses the components and does not react with each component.
- solvents which can be used for producing the above-mentioned copolymer (A 1), copolymer (A 2) and copolymer (A 3). Can.
- solvents from the viewpoint of solubility of each component, reactivity with each component, easiness of coating formation, etc., for example, alcohol, glycol ether, ethylene glycol alkyl ether acetate, ester and diethylene glycol are preferable. Used.
- benzyl alcohol, 2-phenylethyl alcohol, 3-phenyl-1-propanol, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, cetylene redetrichyl ether, Diethylene diallyl ethyl ether, diethylene glycol dimethyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, methyl methoxypropionate, and ethyl ethoxypropionate can be particularly preferably used.
- a high boiling point solvent can be used in combination.
- high-boiling solvents that can be used in combination include N-methylformamide, N, N-dimethylformamide, N-methylformanilide, N-methylacetamide, N, N-dimethylacetoamide, N-methylpyrrolidone, Dimethyl sulfoxide, Benzyl ether, Dihydroxy ether, Acetonyl acetate, Isophorone, Cabronic acid, Forced purilic acid, One-year-old Kantanol, Nano-one, Benzyl acetate,-Ethyl benzoate, Jetyl oxalate, Maleic acid Examples include jetyl, monobutyrolactone, ethylene carbonate, propylene carbonate, solvose acetate and the like. Among these, N-methyl pyrrolidone, phthalic acid, N,
- the amount thereof used is preferably 50% by weight or less, more preferably 40% by weight or less, more preferably Can be less than 30% by weight. If the amount of high-boiling solvent used exceeds this amount, the film thickness uniformity, sensitivity and residual film rate decrease. May.
- the amount of the solvent used is preferably 1 to 50% by weight, based on the total solid content (the total amount of the composition including the solvent excluding the amount of the solvent) in the composition of the present invention.
- the preferred range is 5 to 40% by weight.
- composition prepared as described above has a pore size of 0.2 to 3.0 m, preferably? After filtration using Millipore filter, which has a diameter of about 0.2 to 0.5 m, it can be used for use.
- the composition solution is applied onto a substrate, prebaked to form a film by removing the solvent, and then heat treatment is performed to form a desired protective film.
- the two-component curable resin composition () is prepared by mixing the first component and the second component in use and then preparing the composition solution, preferably within 24 hours after preparation of the composition solution.
- the solution is applied onto a substrate, prebaked to form a film by removing the solvent, and then heat treatment is performed to form a target protective film.
- the substrate on which the protective film is formed for example, those made of glass, quartz, silicon, transparent resin and the like can be used.
- transparent resin examples include polyethylene terephthalate, polypropylene terephthalate, polyether sulfone, polycarbonate, polyimide, ring-opened polymer of cyclic olefin and hydrogenated product thereof.
- a coating method for example, an appropriate method such as a spray method, a roll coating method, a spin coating method, a per coating method, an ink jet method can be adopted, and in particular, spin coating, spinless coating, slit coating, etc. Application using one is preferably used it can.
- the conditions of the above-mentioned pre-baking vary depending on the kind and blending ratio of each component, but preferably it is about 1 to 15 minutes at 70 to 90 ° C.
- the heat treatment after the film formation can be carried out by a suitable heating device such as a hot plate or an oven.
- the heat treatment temperature is preferably about 150 ° C. to about 250 ° C., and the treatment time is about 5 minutes to about 30 minutes when using a hot plate as a heating device, and about 30 minutes when using an oven. About 90 minutes are preferable.
- the composition solution is applied on a substrate and prebaked to remove the solvent.
- radiation irradiation treatment exposure treatment
- heat treatment is performed as necessary, whereby a target protective film can be formed.
- the same substrate as described above can be used as the substrate, and the method of forming the coating film can be carried out in the same manner as described above.
- UV light containing light of wavelength 190 to 45 nm is preferable .
- the exposure dose is preferably 100 to 2 0, 0 0 0 J / m 2 , more preferably 1 5 0 to 10 0, 0 0 0 J / m 2 .
- the processing temperature at the time of heat treatment after the exposure processing is preferably about 150 to 250 ° C., and the processing time is about 5 to 3 when a hot plate is used as a heating device. When using an oven for about 0 minutes, about 30 to 90 minutes is preferable.
- the thickness of the protective film thus formed is preferably 0.1 to 8 m, more preferably 0.1 to 6 m, and still more preferably 0.1 to 4 m.
- the film thickness means the thickness from the top of the color filter.
- the protective film of the present invention satisfies the required transparency, heat resistance, surface hardness, adhesion, etc., and is excellent in load resistance even under heating, and the generation of sublimate during firing is reduced.
- the color filter formed on the base substrate is excellent in the ability to planarize the level difference, and is particularly suitable as a protective film for optical devices.
- GPC-KF-801 Columns: GPC-KF-801, GPC-KF-802, GPC-KF-803 and GPC-KF-804
- Mobile phase Tetrahydrofuran containing 0.5% by weight phosphoric acid.
- the polystyrene equivalent weight average molecular weight (Mw) of the copolymer (A-1) was; L0, 1 000, the molecular weight distribution (Mw / Mn) was 1.3, and the residual monomer was 1.7% by weight.
- the solid content concentration of the polymer solution was 29.7% by weight.
- a solution of a copolymer (A-4) was obtained according to Synthesis Example 1 except that S-cyanomethyl-S-dodecyltrithiocarponate was used in place of cumyldithiobenzoate in Synthesis Example 1.
- the polystyrene reduced weight average molecular weight of the copolymer (A-4) was 25 000 (Mw), the molecular weight distribution (Mw / Mn) was 1.2, and the residual monomer was 1.5% by weight.
- the solid concentration of the polymer solution was 30.1% by weight.
- Synthesis Example 2 instead of cumyl dithiobenzoate, pyrazole 1-di was used.
- a polymer solution containing the copolymer (A-5) was obtained according to Synthesis Example 2 except that thiocarboxylic acid diphenyl ester was used.
- the polystyrene equivalent weight average molecular weight (Mw) of the copolymer (A-5) was 12,000, the molecular weight distribution (Mw / Mn) was 1.3, and the residual monomer was 1.4% by weight.
- the solid content concentration of the polymer solution was 29.2% by weight.
- a polymer solution containing the copolymer (A-6) was obtained according to Synthesis Example 1 except that the following dithioester was used in place of cumyl dithiobenzene in Synthesis Example 1.
- the polystyrene reduced weight average molecular weight (Mw) of the copolymer (A-6) was 12,000, the molecular weight distribution (Mw / Mn) was 1.3, and the residual monomer was 1.4% by weight.
- the solids concentration of the polymer solution was 29.2% by weight.
- a polymer solution containing a copolymer (A-7) was obtained according to Synthesis Example 2 except that the following xanthate was used in place of cumyl dithiobenzoate in Synthesis Example 2.
- the polystyrene equivalent weight average molecular weight (Mw) of the copolymer (A-7) was 10, 500, the molecular weight distribution (Mw / Mn) was 1.2, and the residual monomer was 1.3% by weight.
- the solids concentration of the polymer solution was 29.5% by weight.
- the polystyrene equivalent weight average molecular weight (Mw) of the copolymer (a-1) was 20,000, the molecular weight distribution (Mw / Mn) was 2.4, and the residual monomer was 7.1% by weight.
- the solid concentration of the polymer solution was 32.9% by weight.
- Composition solution using a spinner scratch, S I_ ⁇ 2 was coated dip a glass substrate and prebaked for 5 minutes on a hot plate at 8 0 ° C, the coating film is formed, is et in an oven
- the substrate was heat-treated at 230 ° C. for 60 minutes to form a protective film having a thickness of 2.0 m on the substrate. .
- the transmittance (%) in the wavelength range of 400 to 800 nm was measured using a spectrophotometer type 150-2 double beam (manufactured by Hitachi, Ltd.). It measured and evaluated by the minimum value. When this value is 95% or more, the transparency of the protective film can be said to be good.
- the substrate on which the protective film was formed was heated in an oven at 250 ° C. for 1 hour, the film thickness before and after heating was measured, and the value calculated by the following formula was evaluated. When this value is 95% or more, it can be said that the heat resistant dimensional stability is good.
- the substrate on which the protective film was formed was heated in an oven at 250 ° C. for 1 hour, and the transmittance in the wavelength range of 400 to 800 nm before and after heating was measured, and the minimum value was used. It evaluated by the value calculated by the following formula. When this value is 5% or less, it can be said that the heat discoloration resistance is good.
- the substrate on which the protective film was formed was evaluated by performing the 84.1 pencil scratching test of J I S K-5400-1990. When this value is 4H or harder, the surface hardness is considered to be good.
- the substrate on which the protective film was formed was measured using a Shimadzu Dynamic Microhardness Tester DUH- 201 (manufactured by Shimadzu Corporation) according to a indentation test using a triangular indenter (helcovitch type) with an angle of 115 °, a load of 0.18 and a velocity of 0. 0145 gf Z seconds, holding time 5 seconds, temperature 23 (Assessed with: and 140 ° C.
- the numbers in Table 1 are the number of remaining grids out of 100 grids.
- the S I_ ⁇ 2 Dip a glass substrate, the pigment-based color resists (trade name "J CR R ED 689", “J CR GREEN, 706” or “CR 8200 B; - or, J SR (Ltd.)) spinner the
- the film is developed using a 0.05% aqueous potassium hydroxide solution, washed with ultrapure water for 60 seconds, and heat-treated in an oven at 230 ° C. for 30 minutes to obtain red and green. And A stripe of three colors of blue and blue (stripe width 10 0 ⁇ ) was formed.
- the surface roughness of the substrate on which this color filter is formed is measured using a surface roughness tester ⁇ -step (manufactured by Tencor Japan Co., Ltd.), and the measurement length is 2,000 pi, measurement range 2, OOO / ⁇ m square
- a composition solution prepared in the same manner as described above is coated on a substrate on which a color filter is formed in the same manner as described above using a spinner, and then the substrate is coated with hot plate at 80 ° C. for 5 minutes.
- the film thickness from the upper surface of the color filter is 2. O ⁇ m on the top of the color filter.
- a protective film was formed.
- the composition solution was applied onto a silicon substrate using a spinner, and then prebaked on a hot plate at 90 ° C. for 2 minutes to form a coating having a film thickness of 3.0 m.
- the silicon substrate was heated at 220 ° C. for 1 hour in a clean oven to obtain a hard coating.
- a bare silicon wafer for cooling was attached at an interval of 1 cm above the obtained cured film, and was heated on a hot plate at 230 ° C. for 1 hour.
- the silicon substrate on which the above cured film is separately formed without replacing the bare silicon wafer for cooling After the 0 sheets were continuously processed, the presence or absence of the sublimate adhering to the bare silicon was visually inspected. When no sublimate is confirmed, it can be said that the sublimate evaluation is good.
- the evaluation results are shown in Table 1. ⁇
- a solution of the first component and a solution of the second component were prepared in the same manner as in Example 1 except that each component shown in Table 1 was used to prepare a composition solution.
- a protective film was formed on a substrate and evaluated in the same manner as in Example 1 for each composition solution obtained. The evaluation results are shown in Table 1.
- composition solution was prepared in the same manner as in Example 1 except that each component shown in Table 1 was used.
- a protective film was formed on a substrate and evaluated in the same manner as in Example 1 for each composition solution obtained. The evaluation results are shown in Table 2.
- Type epoxy resin (trade name: Apico 1 157 S 65, manufactured by Yuka Shell Epoxy Co., Ltd.) 10 parts, Bendileu 2-methyl-4-hydroxyphenyl methyl sulfonium hexafoxide as component (D) 1 part of loantimonate, 15 parts of aglycidoxypropyltrimethoxysilane as adhesion promoter, and 0.1 part of SH-28PA (made by Toray 'Daiko Onening' silicone Co., Ltd.) as a surfactant.
- propylene daryl monomethyl ether acetate so that the solid content concentration becomes 20%
- filter with a 0.5 m pore diameter Millipore filter A composition solution was prepared. The appearance of this composition solution was clear and colorless.
- a protective film was formed in the same manner as described above on the substrate on which the color filter was formed in the same manner as in the method described in Example 1.
- composition solution was prepared in the same manner as in Example 5 except that each component shown in Table 2 was used.
- B-1 Bisphenol A nopolac type epoxy resin (trade name: Epico 1 5 7 S 6 5, manufactured by Yuka Shell Epoxy Co., Ltd.)
- B-2 Bisphenol A type epoxy resin (trade name: Epico 1 8 2 8; manufactured by Yuka Shiel Epoxy Co., Ltd.)
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- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Epoxy Resins (AREA)
- Optical Filters (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
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JP2006519377A JP5163847B2 (ja) | 2004-05-06 | 2005-02-18 | 硬化性樹脂組成物、保護膜およびその形成方法 |
KR1020067023103A KR101087309B1 (ko) | 2004-05-06 | 2005-02-18 | 경화성 수지 조성물, 보호막 및 그의 형성 방법 |
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KR (1) | KR101087309B1 (ja) |
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Cited By (6)
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JP2007238646A (ja) * | 2006-03-03 | 2007-09-20 | Toyo Gosei Kogyo Kk | ジチオエステル誘導体及び連鎖移動剤並びにこれを用いたラジカル重合性重合体の製造方法 |
JP2008150453A (ja) * | 2006-12-15 | 2008-07-03 | Fuji Seal International Inc | プラスチックフィルム用活性エネルギー線硬化性樹脂組成物及びプラスチックラベル |
US7696292B2 (en) | 2003-09-22 | 2010-04-13 | Commonwealth Scientific And Industrial Research Organisation | Low-polydispersity photoimageable acrylic polymers, photoresists and processes for microlithography |
JP2014037480A (ja) * | 2012-08-15 | 2014-02-27 | Idemitsu Kosan Co Ltd | エポキシ系共重合体 |
JP2021167396A (ja) * | 2020-04-10 | 2021-10-21 | 東京応化工業株式会社 | 積層体の製造方法、マイクロレンズの製造方法、cmosイメージセンサーの製造方法、及び硬化性組成物 |
US11332634B2 (en) * | 2017-08-30 | 2022-05-17 | Boe Technology Group Co., Ltd. | Composition for overcoat layer, preparation method for the same, overcoat layer material, display substrate and display device |
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JP5224030B2 (ja) * | 2007-03-22 | 2013-07-03 | Jsr株式会社 | 熱硬化性樹脂組成物、保護膜および保護膜の形成方法 |
WO2013035206A1 (ja) * | 2011-09-09 | 2013-03-14 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 電子装置用シール剤組成物 |
KR101748409B1 (ko) * | 2014-07-30 | 2017-06-16 | 주식회사 엘지화학 | 편광자 보호 필름용 수지 조성물, 편광자 보호 필름, 및 이를 포함하는 편광판 |
JP6963215B2 (ja) * | 2016-07-28 | 2021-11-05 | 日産化学株式会社 | 樹脂組成物 |
JP7236812B2 (ja) * | 2017-04-27 | 2023-03-10 | 日本化薬株式会社 | 反応性ポリカルボン酸化合物、それを用いた活性エネルギー線硬化型樹脂組成物、その硬化物及びその用途 |
CN107390420A (zh) * | 2017-08-02 | 2017-11-24 | 京东方科技集团股份有限公司 | 一种彩膜基板及显示装置 |
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- 2005-02-18 JP JP2006519377A patent/JP5163847B2/ja not_active Expired - Fee Related
- 2005-02-18 WO PCT/JP2005/003076 patent/WO2005108458A1/ja active Application Filing
- 2005-02-18 KR KR1020067023103A patent/KR101087309B1/ko active IP Right Grant
- 2005-02-18 CN CNB200580001415XA patent/CN100506877C/zh not_active Expired - Fee Related
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JP2000290348A (ja) * | 1999-04-12 | 2000-10-17 | Toagosei Co Ltd | 硬化性樹脂組成物 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US7696292B2 (en) | 2003-09-22 | 2010-04-13 | Commonwealth Scientific And Industrial Research Organisation | Low-polydispersity photoimageable acrylic polymers, photoresists and processes for microlithography |
JP2007238646A (ja) * | 2006-03-03 | 2007-09-20 | Toyo Gosei Kogyo Kk | ジチオエステル誘導体及び連鎖移動剤並びにこれを用いたラジカル重合性重合体の製造方法 |
JP4688697B2 (ja) * | 2006-03-03 | 2011-05-25 | 東洋合成工業株式会社 | ジチオエステル誘導体及び連鎖移動剤並びにこれを用いたラジカル重合性重合体の製造方法 |
JP2008150453A (ja) * | 2006-12-15 | 2008-07-03 | Fuji Seal International Inc | プラスチックフィルム用活性エネルギー線硬化性樹脂組成物及びプラスチックラベル |
JP2014037480A (ja) * | 2012-08-15 | 2014-02-27 | Idemitsu Kosan Co Ltd | エポキシ系共重合体 |
US11332634B2 (en) * | 2017-08-30 | 2022-05-17 | Boe Technology Group Co., Ltd. | Composition for overcoat layer, preparation method for the same, overcoat layer material, display substrate and display device |
JP2021167396A (ja) * | 2020-04-10 | 2021-10-21 | 東京応化工業株式会社 | 積層体の製造方法、マイクロレンズの製造方法、cmosイメージセンサーの製造方法、及び硬化性組成物 |
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Publication number | Publication date |
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TWI385192B (zh) | 2013-02-11 |
TW200604238A (en) | 2006-02-01 |
JP5163847B2 (ja) | 2013-03-13 |
KR20070012451A (ko) | 2007-01-25 |
JPWO2005108458A1 (ja) | 2008-03-21 |
CN1898291A (zh) | 2007-01-17 |
KR101087309B1 (ko) | 2011-11-25 |
CN100506877C (zh) | 2009-07-01 |
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