WO2017221443A1 - プリント基板 - Google Patents
プリント基板 Download PDFInfo
- Publication number
- WO2017221443A1 WO2017221443A1 PCT/JP2016/086526 JP2016086526W WO2017221443A1 WO 2017221443 A1 WO2017221443 A1 WO 2017221443A1 JP 2016086526 W JP2016086526 W JP 2016086526W WO 2017221443 A1 WO2017221443 A1 WO 2017221443A1
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- WIPO (PCT)
- Prior art keywords
- ground wiring
- main frame
- frame ground
- subframe
- circuit board
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Definitions
- the present invention relates to a printed circuit board.
- Patent Document 1 discloses a printed circuit board in which a slit is provided between a frame ground wiring and a signal ground wiring.
- the printed circuit board according to the present invention includes a circuit unit, a first main frame ground wiring, a first subframe ground wiring spaced from the first main frame ground wiring in the first direction, and a first main frame.
- the second outer periphery of the first subframe ground wiring is surrounded by the first outer periphery of the first main frame ground wiring.
- the first subframe ground wiring is connected to the first main frame ground wiring via the first conductive via.
- the second outer periphery of the first subframe ground wiring is surrounded by the first outer periphery of the first main frame ground wiring. Therefore, the electromagnetic noise propagating through the first main frame ground wiring is coupled to the first subframe ground wiring. Most of the electromagnetic noise coupled to the first subframe ground wiring is converted into heat without being spatially coupled to the circuit unit.
- the printed circuit board of the present invention can prevent the circuit portion from malfunctioning.
- FIG. 1 is a perspective view of a printed circuit board according to Embodiment 1 of the present invention.
- FIG. 2 is a schematic partial enlarged plan view of a region II shown in FIG. 1 of the printed circuit board according to Embodiment 1 of the present invention. It is a figure which shows the semilogarithmic graph showing the analysis result of the propagation amount of the electromagnetic noise in the printed circuit board concerning Embodiment 1 of this invention. It is a perspective view of the printed circuit board concerning Embodiment 2 of the present invention. It is a general
- FIG. 1 is a perspective view of a printed circuit board according to Embodiment 1 of the present invention.
- FIG. 2 is a schematic partial enlarged plan view of a region II shown in FIG. 1 of the printed circuit board according to Embodiment
- FIG. 7 is a schematic partial enlarged plan view of a region VII shown in FIG. 6 of a printed circuit board according to Embodiment 3 of the present invention. It is a perspective view of the printed circuit board concerning Embodiment 4 of the present invention.
- FIG. 9 is a schematic partially enlarged plan view of a region IX shown in FIG. 8 of a printed circuit board according to Embodiment 4 of the present invention. It is a perspective view of the printed circuit board concerning Embodiment 5 of the present invention.
- FIG. 11 is a schematic partial enlarged plan view of a region XI shown in FIG. 10 of a printed circuit board according to Embodiment 5 of the present invention. It is a perspective view of the printed circuit board concerning Embodiment 6 of the present invention.
- Embodiment 1 FIG. A printed circuit board 1 according to the first embodiment will be described with reference to FIGS. 1 and 2.
- the printed circuit board 1 of the present embodiment includes a dielectric layer 6, an external interface 8, a case 9, a circuit unit 2, a first main frame ground wiring 10, a first subframe ground wiring 15, and a first
- the conductive via 20 is mainly provided.
- the external interface 8 may be a connector or a switch, for example.
- the case 9 accommodates the external interface 8.
- the circuit unit 2 is electrically connected to the external interface 8. A signal is transmitted from the outside of the printed circuit board 1 to the circuit unit 2 via the external interface 8.
- the circuit unit 2 includes a first circuit portion 3 and a second circuit portion 4.
- the first circuit portion 3 may be provided on the first surface of the dielectric layer 6.
- the second circuit portion 4 may be provided on the second surface of the dielectric layer 6 opposite to the first surface.
- Each of the first circuit portion 3 and the second circuit portion 4 includes signal wiring, power supply wiring, signal ground wiring, and circuit components such as IC components.
- the second circuit portion 4 may be arranged at an interval from the first circuit portion 3 in the first direction (for example, the z direction).
- the first circuit portion 3 and the second circuit portion 4 may extend in a second direction (for example, x direction) and a third direction (for example, y direction), respectively.
- the second direction is a direction that intersects the first direction.
- the second direction is a direction orthogonal to the first direction.
- the third direction is a direction that intersects the first direction and the second direction.
- the third direction is a direction orthogonal to the first direction and the second direction.
- the circuit unit 2 is arranged at a distance from the first main frame ground wiring 10, the first subframe ground wiring 15, and the first conductive via 20 in a second direction intersecting the first direction. In plan view from the first direction, the circuit unit 2 may be disposed in the central region of the printed circuit board 1.
- the first main frame ground wiring 10 is electrically connected to the case 9. Specifically, the first main frame ground wiring 10 is connected to the case 9 at one end of the first main frame ground wiring 10.
- the first main frame ground wiring 10 is connected to a stable potential 12. Specifically, the first main frame ground wiring 10 is connected to a stable potential 12 at the other end of the first main frame ground wiring 10 on the side opposite to the one end.
- the stable potential 12 may be, for example, a ground potential or a potential of a housing (not shown) that accommodates the printed circuit board 1.
- the first main frame ground wiring 10 is arranged with a gap in the second direction (for example, the x direction) intersecting the first direction from the circuit unit 2. As shown in FIG. 2, the first main frame ground wiring 10 is arranged at a distance of d 1 from the circuit unit 2 in a plan view from the first direction.
- the first main frame ground wiring 10 may be provided on the first surface of the dielectric layer 6.
- the first main frame ground wiring 10 may be coplanar with the first circuit portion 3.
- the first main frame ground wiring 10 may be arranged in the peripheral region of the printed circuit board 1.
- the first main frame ground wiring 10 is not particularly limited, but may have an L shape, for example.
- the first subframe ground wiring 15 is arranged at a distance from the first mainframe ground wiring 10 in the first direction so as to face the first mainframe ground wiring 10. As shown in FIG. 2, the first subframe ground wiring 15 is arranged at a distance of d 2 from the circuit unit 2 in a plan view from the first direction. distance d 2 may be greater than the distance d 1.
- the first subframe ground wiring 15 may be provided on the second surface of the dielectric layer 6.
- the first subframe ground wiring 15 may be coplanar with the second circuit portion 4. In a plan view from the first direction, the first subframe ground wiring 15 may be disposed in the peripheral region of the printed circuit board 1.
- first subframe ground wiring 15 overlaps first main frame ground wiring 10 in a plan view from the first direction.
- the second outer circumference of the first subframe ground wiring 15 is surrounded by the first outer circumference of the first main frame ground wiring 10.
- the length L 2 in the longitudinal direction of the first subframe ground wiring 15 may be shorter than the length L 1 in the longitudinal direction of the first main frame ground wiring 10.
- the width w 2 of the first subframe ground wiring 15 may be narrower than the width w 1 of the first main frame ground wiring 10.
- the first subframe ground wiring 15 may have a smaller area than the first main frame ground wiring 10 in a plan view from the first direction.
- the first conductive via 20 connects the first main frame ground wiring 10 and the first subframe ground wiring 15.
- the first conductive via 20 is formed between the first main frame ground wiring 10 between one end (the end on the case 9 side) and the other end (the end on the stable potential 12 side). Connected to the frame ground wiring 10.
- the first conductive via 20 may be formed so as to penetrate the dielectric layer 6.
- the printed circuit board 1 can prevent the electromagnetic noise propagating to the case 9 that accommodates the external interface 8 from being spatially coupled to the circuit unit 2.
- the electromagnetic noise that propagates to the case 9 propagates through the first main frame ground wiring 10 that is electrically connected to the case 9.
- the first subframe ground wiring 15 is connected to the first main frame ground wiring 10 through the first conductive via 20. Therefore, most of the electromagnetic noise propagating from the case 9 housing the external interface 8 through the first main frame ground wiring 10 is coupled to the first subframe ground wiring 15 without being spatially coupled to the circuit unit 2.
- the first subframe ground wiring 15 may be configured such that electromagnetic noise propagating through the first mainframe ground wiring 10 is resonantly coupled to the first subframe ground wiring 15.
- the first subframe ground wiring 15 configured as described above can strongly and electrically couple the electromagnetic noise propagating through the first mainframe ground wiring 10 to the first subframe ground wiring 15, and also the first mainframe ground wiring 15.
- the electromagnetic noise propagating through the ground wiring 10 can be confined more strongly in the first subframe ground wiring 15. Therefore, the first subframe ground wiring 15 configured so that electromagnetic noise propagating through the first mainframe ground wiring 10 is resonantly coupled to the first subframe ground wiring 15 propagates through the first mainframe ground wiring 10. It is possible to further suppress the electromagnetic noise from being spatially coupled to the circuit unit 2.
- the first main frame ground wiring 15 can be configured such that the electromagnetic noise propagating through is resonantly coupled to the first subframe ground wiring 15.
- the length L 2 and width w 2 of the first subframe ground wiring 15, the position of the first subframe ground wiring 15 with respect to the first mainframe ground wiring 10, and the first mainframe ground wiring 10 and the first subframe By appropriately determining the position of the first conductive via 20 with respect to the frame ground wiring 15, the first subframe ground wiring 15 is resonantly coupled to the first subframe ground wiring 15 so that electromagnetic noise propagating through the first main frame ground wiring 10 is resonantly coupled.
- the frame ground wiring 15 can be configured.
- the electromagnetic noise coupled to the first subframe ground wiring 15, preferably resonantly coupled receives the conductor resistance loss in the first subframe ground wiring 15 and the dielectric loss in the dielectric layer 6 around the first subframe ground wiring 15. And converted to heat.
- the printed circuit board 1 according to the present embodiment can prevent the circuit unit 2 from malfunctioning.
- Electromagnetic noise may be static electricity, for example.
- the electromagnetic noise may have a frequency of 1 kHz or more and 10 GHz or less, for example.
- a part of the electromagnetic noise that is not coupled to the first subframe ground wiring 15 propagates to the stable potential 12 through the first mainframe ground wiring 10. It is possible to prevent a part of the electromagnetic noise not coupled to the first subframe ground wiring 15 from being coupled to the circuit unit 2.
- FIG. 3 shows the analysis result of the propagation amount of electromagnetic noise in the printed circuit board 1 of the present embodiment.
- the vertical axis represents the propagation ratio of electromagnetic noise to the circuit unit 2
- the horizontal axis represents the frequency displayed on a logarithmic scale.
- the propagation amount ratio of electromagnetic noise to the circuit unit 2 is the propagation amount of electromagnetic noise to the circuit unit 2 in the printed circuit board 1 of the present embodiment, and does not include the first subframe ground wiring 15 and the first conductive via 20. It is defined as the logarithm of the value divided by the propagation amount of electromagnetic noise to the circuit unit 2 in the printed circuit board of the comparative example.
- the propagation amount of electromagnetic noise to the circuit unit 2 in the printed circuit board 1 of the present embodiment is 0 dB.
- the propagation amount of electromagnetic noise to the circuit unit 2 of the printed circuit board 1 of the present embodiment is that of the comparative example. It means that it is equal to the propagation amount of electromagnetic noise to the circuit unit 2 on the printed board.
- the propagation amount of electromagnetic noise to the circuit unit 2 in the printed circuit board 1 of the present embodiment is the propagation amount of electromagnetic noise to the circuit unit 2 in the printed circuit board of the comparative example over a wide frequency band. Less than.
- the printed circuit board 1 according to the present embodiment can prevent electromagnetic noise such as static electricity from propagating to the circuit unit 2, and thus can prevent malfunction of the circuit unit 2.
- the printed circuit board 1 includes an external interface 8, a case 9 that accommodates the external interface 8, a circuit unit 2, a first main frame ground wiring 10, a first subframe ground wiring 15, a first And a conductive via 20.
- the circuit unit 2 is electrically connected to the external interface 8.
- the first main frame ground wiring 10 is electrically connected to the case 9.
- the first subframe ground wiring 15 is arranged at a distance from the first mainframe ground wiring 10 in the first direction so as to face the first mainframe ground wiring 10.
- the first conductive via 20 connects the first main frame ground wiring 10 and the first subframe ground wiring 15.
- the circuit unit 2 is disposed at a distance from the first main frame ground wiring 10, the first subframe ground wiring 15, and the first conductive via 20 in a second direction that intersects the first direction.
- the second outer circumference of the first subframe ground wiring 15 is surrounded by the first outer circumference of the first main frame ground wiring 10.
- the first subframe ground wiring 15 is connected to the first main frame ground wiring 10 via the first conductive via 20.
- the second outer circumference of the first subframe ground wiring 15 is surrounded by the first outer circumference of the first main frame ground wiring 10. Therefore, most of the electromagnetic noise propagating from the case 9 to the first main frame ground wiring 10 is coupled to the first subframe ground wiring 15 without being spatially coupled to the circuit unit 2.
- the electromagnetic noise coupled to the first subframe ground wiring 15 receives heat due to the conductor resistance loss in the first subframe ground wiring 15 and the dielectric loss in the dielectric layer 6 around the first subframe ground wiring 15, and generates heat. Converted.
- the printed circuit board 1 according to the present embodiment can prevent the circuit unit 2 from malfunctioning.
- the second outer periphery of the first subframe ground wiring 15 is surrounded by the first outer periphery of the first main frame ground wiring 10 in plan view from the first direction. Yes.
- the circuit unit 2, the first main frame ground wiring 10, and the first subframe ground wiring 15 can be arranged in a compact manner.
- the printed circuit board 1 of the present embodiment can be miniaturized.
- the first subframe ground wiring 15 may be configured such that electromagnetic noise propagating through the first main frame ground wiring 10 is resonantly coupled to the first subframe ground wiring 15. .
- the first subframe ground wiring 15 configured as described above can strongly and electrically couple the electromagnetic noise propagating through the first mainframe ground wiring 10 to the first subframe ground wiring 15, and also the first mainframe ground wiring 15.
- the electromagnetic noise propagating through the ground wiring 10 can be confined more strongly in the first subframe ground wiring 15. Therefore, the first subframe ground wiring 15 configured so that electromagnetic noise propagating through the first mainframe ground wiring 10 is resonantly coupled to the first subframe ground wiring 15 propagates through the first mainframe ground wiring 10. It is possible to further suppress the electromagnetic noise from being spatially coupled to the circuit unit 2.
- the printed circuit board 1 according to the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- Embodiment 2 With reference to FIG.4 and FIG.5, the printed circuit board 1a which concerns on Embodiment 2 is demonstrated.
- the printed circuit board 1a of the present embodiment has the same configuration as the printed circuit board 1 of the first embodiment, but mainly differs in the following points.
- the printed circuit board 1a further includes a second conductive via 21 that connects the first main frame ground wiring 10 and the first subframe ground wiring 15a.
- the first subframe ground wiring 15 a is connected to the first main frame ground wiring 10 by the first conductive via 20 and the second conductive via 21.
- the second conductive via 21 may be formed so as to penetrate the dielectric layer 6.
- the first subframe ground wiring 15a of the present embodiment has a different shape from the first subframe ground wiring 15 of the first embodiment. Specifically, the length L 2 in the longitudinal direction of the first subframe ground wiring 15 a of the present embodiment is shorter than the length L 2 in the longitudinal direction of the first subframe ground wiring 15 of the first embodiment. .
- the effects of the printed circuit board 1a of the present embodiment have the following effects in addition to the effects of the printed circuit board 1 of the first embodiment.
- the printed circuit board 1a further includes a second conductive via 21 that connects the first main frame ground wiring 10 and the first subframe ground wiring 15a.
- the second conductive via 21 is coupled to the first subframe ground wiring 15a, preferably to the resonance frequency of electromagnetic noise coupled to the first subframe ground wiring 15a, and is coupled to the first subframe ground wiring 15 in the first embodiment, preferably the frequency of the electromagnetic noise coupled to resonance. Can be different.
- the second conductive via 21 can strongly and electrically couple electromagnetic noise propagating through the first main frame ground wiring 10 to the first subframe ground wiring 15.
- the frequency of electromagnetic noise coupled to the first subframe ground wiring 15a can be adjusted, and electromagnetic noise spatially coupled to the circuit unit 2 can be further reduced.
- the printed circuit board 1a of the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- the first subframe ground wiring 15a of the present embodiment has a different shape from the first subframe ground wiring 15 of the first embodiment.
- the first subframe ground wiring 15a is coupled to the first subframe ground wiring 15a and preferably has a frequency of electromagnetic noise coupled to the first subframe ground wiring 15a.
- the frequency can be different.
- the frequency of electromagnetic noise coupled to the first subframe ground wiring 15a can be adjusted, and electromagnetic noise spatially coupled to the circuit unit 2 can be further reduced.
- the printed circuit board 1a of the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- FIG. 1b according to the third embodiment will be described with reference to FIGS.
- the printed circuit board 1b of the present embodiment has the same configuration as the printed circuit board 1 of the first embodiment, but mainly differs in the following points.
- the printed circuit board 1b further includes a second subframe ground wiring 16 and a third conductive via 22.
- the second subframe ground wiring 16 is disposed at a distance from the first subframe ground wiring 15 in the first direction so as to face the first subframe ground wiring 15.
- the second subframe ground wiring 16 is arranged at a distance from the first mainframe ground wiring 10 in the first direction so as to face the first mainframe ground wiring 10.
- the second subframe ground wiring 16 is disposed with a distance of d 3 from the circuit unit 2 in a plan view from the first direction.
- the interval d 3 may be larger than the interval d 1 .
- distance d 3 may be equal to the spacing d 2, may differ from the spacing d 2.
- the second subframe ground wiring 16 may be provided on the second surface of the dielectric layer 6.
- the second subframe ground wiring 16 may be coplanar with the second circuit portion 4. In a plan view from the first direction, the second subframe ground wiring 16 may be arranged in the peripheral region of the printed circuit board 1b.
- the first subframe ground wiring 15 is disposed between the first main frame ground wiring 10 and the second subframe ground wiring 16.
- the first subframe ground wiring 15 may be disposed between the first main frame ground wiring 10 and the second subframe ground wiring 16 in the first direction.
- the first subframe ground wiring 15 may be embedded in the dielectric layer 6.
- the first subframe ground wiring 15 may be disposed at an intermediate portion of the dielectric layer 6 in the first direction.
- the second subframe ground wiring 16 overlaps the first main frame ground wiring 10 in a plan view from the first direction.
- the third outer periphery of the second subframe ground wiring 16 is surrounded by the first outer periphery of the first main frame ground wiring 10.
- the length L 3 in the longitudinal direction of the second subframe ground wiring 16 may be shorter than the length L 1 in the longitudinal direction of the first main frame ground wiring 10.
- the width w 3 of the second subframe ground wiring 16 may be narrower than the width w 1 of the first main frame ground wiring 10.
- the second subframe ground wiring 16 may have an area smaller than that of the first main frame ground wiring 10 in a plan view from the first direction.
- the second subframe ground wiring 16 may have a different shape from the first subframe ground wiring 15 or the same shape as the first subframe ground wiring 15. May be. In plan view from the first direction, the second subframe ground wiring 16 may have an area different from that of the first subframe ground wiring 15 or the same area as the first subframe ground wiring 15. May be.
- the third conductive via 22 connects the first subframe ground wiring 15 and the second subframe ground wiring 16.
- the third conductive via 22 may overlap the first conductive via 20 in plan view from the first direction.
- the third conductive via 22 may be integrated with the first conductive via 20.
- the effects of the printed circuit board 1b of the present embodiment have the following effects in addition to the effects of the printed circuit board 1 of the first embodiment.
- the printed circuit board 1b further includes a second subframe ground wiring 16 and a third conductive via 22.
- the second subframe ground wiring 16 is disposed at a distance from the first subframe ground wiring 15 in the first direction so as to face the first subframe ground wiring 15.
- the third conductive via 22 connects the first subframe ground wiring 15 and the second subframe ground wiring 16.
- the first subframe ground wiring 15 is disposed between the first main frame ground wiring 10 and the second subframe ground wiring 16.
- the third outer periphery of the second subframe ground wiring 16 is surrounded by the first outer periphery of the first main frame ground wiring 10.
- the first subframe ground wiring 15 is connected to the first main frame ground wiring 10 through the first conductive via 20.
- the second subframe ground wiring 16 is connected to the first main frame ground wiring 10 via the first conductive via 20 and the third conductive via 22.
- the second outer periphery of the first subframe ground wiring 15 and the third outer periphery of the second subframe ground wiring 16 are the first outer periphery of the first main frame ground wiring 10. Surrounded by Therefore, most of the electromagnetic noise propagating from the case 9 to the first main frame ground wiring 10 is coupled to the first subframe ground wiring 15 and the second subframe ground wiring 16 without being spatially coupled to the circuit unit 2.
- the electromagnetic noise coupled to the first subframe ground wiring 15 and the second subframe ground wiring 16 is caused by the conductor resistance loss in the first subframe ground wiring 15 and the second subframe ground wiring 16 and the first subframe ground wiring 15 and The dielectric loss in the dielectric layer 6 around the second subframe ground wiring 16 is received and converted into heat.
- the printed circuit board 1b according to the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- the printed circuit board 1 b according to the present embodiment includes a second subframe ground wiring 16 in addition to the first subframe ground wiring 15.
- the first sub-frame ground wiring 15 and the second sub-frame ground wiring 16 are coupled to the first sub-frame ground wiring 15 and the second sub-frame ground wiring 16 with the frequency of electromagnetic noise that is coupled, preferably resonantly coupled, in the first embodiment.
- the frequency may be different from the frequency of electromagnetic noise coupled to the first subframe ground wiring 15, preferably resonantly coupled.
- the frequency of electromagnetic noise coupled to the first subframe ground wiring 15 and the second subframe ground wiring 16 can be adjusted, and electromagnetic noise spatially coupled to the circuit unit 2 can be adjusted. It can be further reduced.
- the printed circuit board 1b according to the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- the second subframe ground wiring 16 may have a shape different from that of the first subframe ground wiring 15 in a plan view from the first direction.
- the frequency of the electromagnetic noise coupled to the first subframe ground wiring 15 and the second subframe ground wiring 16 can be further increased.
- the electromagnetic noise spatially coupled to the circuit unit 2 can be further reduced.
- the printed circuit board 1b according to the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- the second outer periphery of the first subframe ground wiring 15 and the third outer periphery of the second subframe ground wiring 16 are the first main in the plan view from the first direction.
- the frame ground wiring 10 is surrounded by a first outer periphery.
- the circuit unit 2, the first main frame ground wiring 10, the first subframe ground wiring 15, and the second subframe ground wiring 16 can be arranged in a compact manner.
- the printed circuit board 1b of the present embodiment can be miniaturized.
- FIG. 1c A printed circuit board 1c according to the fourth embodiment will be described with reference to FIGS.
- the printed circuit board 1c of the present embodiment has the same configuration as the printed circuit board 1 of the first embodiment, but mainly differs in the following points.
- the first subframe ground wiring 15c in the present embodiment has a different shape from the first subframe ground wiring 15 in the first embodiment. Specifically, the longitudinal length L 2 of the first sub-frame ground line 15c of the present embodiment is shorter than the longitudinal length L 2 of the first sub-frame ground wiring 15 of the first embodiment .
- the printed circuit board 1c of the present embodiment further includes a second subframe ground wiring 16c and a third conductive via 22c.
- the second sub-frame ground wiring 16 c is arranged at a distance from the first main frame ground wiring 10 in the first direction so as to face the first main frame ground wiring 10.
- the second subframe ground wiring 16c is spaced from the first subframe ground wiring 15c in a third direction (y direction) intersecting the first direction (z direction) and the second direction (x direction). Be placed.
- the second sub-frame ground wiring 16c is arranged with an interval of d 3 from the circuit portion 2.
- the interval d 3 may be larger than the interval d 1 .
- distance d 3 may be equal to the spacing d 2, may differ from the spacing d 2.
- the second subframe ground wiring 16 c may be provided on the second surface of the dielectric layer 6.
- the second subframe ground wiring 16 c may be coplanar with the second circuit portion 4.
- the second subframe ground wiring 16c may be coplanar with the first subframe ground wiring 15c.
- the second sub-frame ground wiring 16c may be disposed in the peripheral region of the printed circuit board 1c.
- the first subframe ground wiring 15 c and the second subframe ground wiring 16 c overlap the first main frame ground wiring 10 in a plan view from the first direction.
- the second outer periphery of the first subframe ground wiring 15c and the third outer periphery of the second subframe ground wiring 16c are connected to the first outer periphery of the first main frame ground wiring 10. being surrounded.
- Width w 3 of width w 2 and a second sub-frame ground line 16c of the first sub-frame ground wire 15c may be narrower than the width w 1 of the first main frame ground wiring 10.
- the first subframe ground wiring 15 c and the second subframe ground wiring 16 c may have an area smaller than that of the first main frame ground wiring 10.
- the second subframe ground wiring 16c may have a different shape from the first subframe ground wiring 15c, or the same shape as the first subframe ground wiring 15c. May be.
- the second sub-frame ground wiring 16 c may have an area different from that of the first main frame ground wiring 10 or the same area as the first main frame ground wiring 10. May be.
- the first conductive via 20 connects the first main frame ground wiring 10 and the first subframe ground wiring 15c.
- the first conductive via 20 is formed between the first main frame ground wiring 10 between one end (the end on the case 9 side) and the other end (the end on the stable potential 12 side). Connected to the frame ground wiring 10.
- the third conductive via 22c connects the first main frame ground wiring 10 and the second subframe ground wiring 16c.
- the third conductive via 22c is formed between the first main frame ground wiring 10 between one end (the end on the case 9 side) and the other end (the end on the stable potential 12 side). Connected to the frame ground wiring 10.
- the third conductive via 22 c may be formed so as to penetrate the dielectric layer 6.
- the effects of the printed circuit board 1c of the present embodiment have the following effects in addition to the effects of the printed circuit board 1 of the first embodiment.
- the printed circuit board 1c of the present embodiment further includes a second subframe ground wiring 16c and a third conductive via 22c.
- the second sub-frame ground wiring 16 c is arranged at a distance from the first main frame ground wiring 10 in the first direction so as to face the first main frame ground wiring 10.
- the third conductive via 22c connects the first main frame ground wiring 10 and the second subframe ground wiring 16c.
- the second subframe ground wiring 16c is arranged at a distance from the first subframe ground wiring 15c in a third direction intersecting the first direction and the second direction. In plan view from the first direction, the third outer periphery of the second subframe ground wiring 16 c is surrounded by the first outer periphery of the first main frame ground wiring 10.
- the first subframe ground wiring 15c is connected to the first main frame ground wiring 10 through the first conductive via 20.
- the second subframe ground wiring 16c is connected to the first main frame ground wiring 10 through the third conductive via 22c.
- the second outer periphery of the first subframe ground wiring 15c and the third outer periphery of the second subframe ground wiring 16c are connected to the first outer periphery of the first main frame ground wiring 10. being surrounded. Therefore, most of the electromagnetic noise propagating from the case 9 to the first main frame ground wiring 10 is coupled to the first subframe ground wiring 15 c and the second subframe ground wiring 16 c without being spatially coupled to the circuit unit 2.
- the electromagnetic noise coupled to the first subframe ground wiring 15c and the second subframe ground wiring 16c is caused by the conductor resistance loss in the first subframe ground wiring 15c and the second subframe ground wiring 16c, the first subframe ground wiring 15c, In response to the dielectric loss in the dielectric layer 6 around the second subframe ground wiring 16c, it is converted into heat. Thus, it is possible to suppress the electromagnetic noise propagating from the case 9 housing the external interface 8 to the first main frame ground wiring 10 from being spatially coupled to the circuit unit 2.
- the printed circuit board 1c of the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- the printed circuit board 1c of the present embodiment includes a second subframe ground wiring 16c in addition to the first subframe ground wiring 15c.
- the first sub-frame ground wiring 15c and the second sub-frame ground wiring 16c are coupled to the first sub-frame ground wiring 15c and the second sub-frame ground wiring 16c, preferably at the frequency of electromagnetic noise that is coupled to the first sub-frame ground wiring 16c.
- the frequency may be different from the frequency of electromagnetic noise coupled to the first subframe ground wiring 15, preferably resonantly coupled.
- the frequency of electromagnetic noise coupled to the first subframe ground wiring 15c and the second subframe ground wiring 16c can be adjusted, and electromagnetic noise spatially coupled to the circuit unit 2 can be adjusted. It can be further reduced.
- the printed circuit board 1c of the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- the second subframe ground wiring 16c may have a shape different from that of the first subframe ground wiring 15c in a plan view from the first direction.
- the frequency of electromagnetic noise coupled to the first subframe ground wiring 15c and the second subframe ground wiring 16c can be further widened.
- the electromagnetic noise spatially coupled to the circuit unit 2 can be further reduced.
- the printed circuit board 1c of the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- the second outer periphery of the first subframe ground wiring 15c and the third outer periphery of the second subframe ground wiring 16c are the first main in the plan view from the first direction.
- the frame ground wiring 10 is surrounded by a first outer periphery.
- the circuit unit 2, the first main frame ground wiring 10, the first subframe ground wiring 15c, and the second subframe ground wiring 16c can be arranged in a compact manner.
- the printed circuit board 1c of the present embodiment can be miniaturized.
- FIG. 5 A printed circuit board 1d according to the fifth embodiment will be described with reference to FIGS.
- the printed circuit board 1d of the present embodiment has the same configuration as the printed circuit board 1 of the first embodiment, but mainly differs in the following points.
- the first subframe ground wiring 15d has a meandering shape in plan view from the first direction.
- first subframe ground wiring 15 d overlaps first main frame ground wiring 10 in a plan view from the first direction.
- the second outer periphery of the first subframe ground wiring 15 d is surrounded by the first outer periphery of the first main frame ground wiring 10.
- the length L 3 in the longitudinal direction of the first subframe ground wiring 15 d may be shorter than the length L 1 in the longitudinal direction of the first main frame ground wiring 10.
- the width w 3 of the first subframe ground wiring 15 d may be narrower than the width w 1 of the first main frame ground wiring 10.
- the effects of the printed circuit board 1d of the present embodiment have the following effects in addition to the effects of the printed circuit board 1 of the first embodiment.
- the first subframe ground wiring 15d has a meandering shape. Making the shape of the first subframe ground wiring 15d of the present embodiment different from the shape of the first subframe ground wiring 15 of the first embodiment is coupled to the first subframe ground wiring 15d, preferably electromagnetically coupled to the first subframe ground wiring 15d.
- the frequency of the noise can be made different from the frequency of the electromagnetic noise coupled to the first subframe ground wiring 15 in the first embodiment, preferably coupled to resonance.
- the frequency of electromagnetic noise coupled to the first subframe ground wiring 15d can be adjusted, and electromagnetic noise spatially coupled to the circuit unit 2 can be further reduced.
- the printed circuit board 1d according to the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- FIG. 6 A printed circuit board 1e according to the sixth embodiment will be described with reference to FIGS.
- the printed circuit board 1e of the present embodiment has the same configuration as the printed circuit board 1 of the first embodiment, but mainly differs in the following points.
- the printed circuit board 1e of the present embodiment further includes a second main frame ground wiring 11, a plurality of fourth conductive vias 25, and a fifth conductive via 26.
- the second main frame ground wiring 11 is disposed at a distance from the first sub frame ground wiring 15 in the first direction so as to face the first sub frame ground wiring 15. As shown in FIG. 13, the second main frame ground wiring 11 is arranged at an interval of d 4 from the circuit unit 2 in a plan view from the first direction. In plan view from the first direction, the distance d 4 may be equal to the spacing d 1, may be different from the distance of d 1.
- the second main frame ground wiring 11 may be provided on the second surface of the dielectric layer 6.
- the second main frame ground wiring 11 may be coplanar with the second circuit portion 4. In a plan view from the first direction, the second main frame ground wiring 11 may be arranged in the peripheral region of the printed circuit board 1e.
- the electromagnetic noise coupling from the first main frame ground wiring 10 to the second main frame ground wiring 11 is weaker than the electromagnetic noise coupling from the first main frame ground wiring 10 to the first subframe ground wiring 15.
- the second main frame ground wiring 11 is configured.
- the electromagnetic noise coupling from the first main frame ground wiring 10 to the second main frame ground wiring 11 can be weaker than the electromagnetic noise coupling from the first main frame ground wiring 10 to the first subframe ground wiring 15.
- the second main frame ground wiring 11 may have a different shape from the first main frame ground wiring 10 or the same shape as the first main frame ground wiring 10. May be.
- the second main frame ground wiring 11 may have an area different from the first main frame ground wiring 10 or the same area as the first main frame ground wiring 10. May be.
- the fourth outer periphery of the second main frame ground wiring 11 may or may not coincide with the first outer periphery of the first main frame ground wiring 10. Good.
- the first subframe ground wiring 15 is disposed between the first main frame ground wiring 10 and the second main frame ground wiring 11. Specifically, the first subframe ground wiring 15 may be disposed between the first main frame ground wiring 10 and the second mainframe ground wiring 11 in the first direction. The first subframe ground wiring 15 may be embedded in the dielectric layer 6. The first subframe ground wiring 15 may be disposed at an intermediate portion of the dielectric layer 6 in the first direction.
- the first subframe ground wiring 15 overlaps the first main frame ground wiring 10 and the second main frame ground wiring 11 in a plan view from the first direction.
- the second outer periphery of the first subframe ground wiring 15 is located on the first outer periphery of the first main frame ground wiring 10 and the fourth outer periphery of the second main frame ground wiring 11. being surrounded.
- the first subframe ground wiring 15 is arranged with a distance of d 2 from the circuit portion 2.
- the interval d 2 may be larger than the interval d 1 and the interval d 4 .
- the length L 2 in the longitudinal direction of the first subframe ground wiring 15 is longer than the length L 1 in the longitudinal direction of the first main frame ground wiring 10 and the length L 4 in the longitudinal direction of the second main frame ground wiring 11. It may be short. Width w 2 of the first sub-frame ground wire 15 may be narrower than the width w 4 of width w 1 and the second main frame ground wiring 11 of the first main frame ground wiring 10.
- the first subframe ground wiring 15 may have a shape different from that of the first main frame ground wiring 10 and the second mainframe ground wiring 11 in plan view from the first direction.
- the first subframe ground wiring 15 may have a smaller area than the first main frame ground wiring 10 and the second mainframe ground wiring 11 in plan view from the first direction.
- the plurality of fourth conductive vias 25 connect the first main frame ground wiring 10 and the second main frame ground wiring 11.
- the plurality of fourth conductive vias 25 are separated from the first subframe ground wiring 15 and the circuit unit 2.
- the plurality of fourth conductive vias 25 may connect the first peripheral portion of the first main frame ground wiring 10 and the second peripheral portion of the second main frame ground wiring 11.
- the plurality of fourth conductive vias 25 may be formed so as to penetrate the dielectric layer 6. In the plan view from the first direction, the plurality of fourth conductive vias 25 may surround the first subframe ground wiring 15 and the first conductive via 20.
- the plurality of fourth conductive vias 25 may further surround the fifth conductive via 26.
- the fifth conductive via 26 connects the first subframe ground wiring 15 and the second main frame ground wiring 11.
- the fifth conductive via 26 may overlap the first conductive via 20 in plan view from the first direction.
- the fifth conductive via 26 may be integrated with the first conductive via 20.
- the effects of the printed circuit board 1e of the present embodiment have the following effects in addition to the effects of the printed circuit board 1 of the first embodiment.
- the printed circuit board 1e of the present embodiment further includes a second main frame ground wiring 11 and a plurality of fourth conductive vias 25.
- the second main frame ground wiring 11 is disposed at a distance from the first sub frame ground wiring 15 in the first direction so as to face the first sub frame ground wiring 15.
- the plurality of fourth conductive vias 25 connect the first main frame ground wiring 10 and the second main frame ground wiring 11.
- the first subframe ground wiring 15 is disposed between the first main frame ground wiring 10 and the second main frame ground wiring 11.
- the second outer periphery of the first subframe ground wiring 15 is located on the first outer periphery of the first main frame ground wiring 10 and the fourth outer periphery of the second main frame ground wiring 11. being surrounded.
- the plurality of fourth conductive vias 25 surround the first subframe ground wiring 15 in a plan view from the first direction.
- the second outer periphery of the first subframe ground wiring 15 is the first outer periphery of the first main frame ground wiring 10 and the second main frame in a plan view from the first direction.
- the frame ground wiring 11 is surrounded by the fourth outer periphery.
- the plurality of fourth conductive vias 25 surround the first subframe ground wiring 15 in a plan view from the first direction. Therefore, the electromagnetic noise coupled to the first subframe ground wiring 15 can be shielded by the first main frame ground wiring 10 and the second main frame ground wiring 11. According to the printed circuit board 1e of the present embodiment, electromagnetic noise that is spatially coupled to the circuit unit 2 can be further reduced.
- the printed circuit board 1e according to the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- the second outer periphery of the first subframe ground wiring 15 is the first outer periphery of the first main frame ground wiring 10 and the second main frame in a plan view from the first direction.
- the frame ground wiring 11 is surrounded by the fourth outer periphery.
- the circuit unit 2, the first main frame ground wiring 10, the first subframe ground wiring 15, and the second main frame ground wiring 11 can be arranged in a compact manner.
- the printed circuit board 1e of the present embodiment can be miniaturized.
- the printed circuit board 1e of the present embodiment further includes a fifth conductive via 26.
- the fifth conductive via 26 connects the first subframe ground wiring 15 and the second main frame ground wiring 11.
- the fifth conductive via 26 may change the frequency of electromagnetic noise coupled to the first subframe ground wiring 15. According to the printed circuit board 1e of the present embodiment, the frequency of electromagnetic noise coupled to the first subframe ground wiring 15 can be adjusted, and electromagnetic noise spatially coupled to the circuit unit 2 can be further reduced.
- the printed circuit board 1e according to the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- Embodiment 7 FIG. A printed circuit board 1f according to the seventh embodiment will be described with reference to FIG.
- the printed circuit board 1f of the present embodiment has the same configuration as the printed circuit board 1 of the first embodiment, but mainly differs in the following points.
- the printed circuit board 1f of the present embodiment further includes a first electronic component 30.
- a varistor or an arrester may be sufficient.
- the first main frame ground wiring 10 is connected to the first conductive via 20 via the first electronic component 30.
- the insulating portion 28 electrically isolates the first conductive via 20 from the first main frame ground wiring 10.
- the insulating portion 28 may be made of air or an insulator, for example.
- the first electronic component 30 is disposed so as to straddle the insulating portion 28.
- the first electronic component 30 electrically connects the first conductive via 20 to the first main frame ground wiring 10.
- the first conductive via 20 is connected to the conductive portion 27.
- the conductive portion 27 may be made of the same material as the first main frame ground wiring 10 such as copper or aluminum.
- the insulating portion 28 electrically isolates the first conductive via 20 and the conductive portion 27 from the first main frame ground wiring 10.
- the first electronic component 30 is disposed so as to straddle the insulating portion 28. The first electronic component 30 may electrically connect the first conductive via 20 and the conductive portion 27 to the first main frame ground wiring 10.
- the effects of the printed circuit board 1f of the present embodiment have the following effects in addition to the effects of the printed circuit board 1 of the first embodiment.
- the printed circuit board 1f of the present embodiment further includes a first electronic component 30.
- the first main frame ground wiring 10 is connected to the first conductive via 20 via the first electronic component 30.
- the first electronic component 30 has a frequency of electromagnetic noise coupled to, preferably resonantly coupled to, the first subframe ground wiring 15, and a frequency of electromagnetic noise coupled to, preferably resonantly coupled to, the first subframe ground wiring 15 in the first embodiment. Can be different.
- the frequency of electromagnetic noise coupled to the first subframe ground wiring 15 can be adjusted, and electromagnetic noise spatially coupled to the circuit unit 2 can be further reduced.
- the printed circuit board 1f of the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- the printed circuit board 1f of the present embodiment further includes a first electronic component 30.
- the first electronic component 30 can change the electrical function of the printed circuit board 1f of the present embodiment.
- the printed circuit board 1f of the present embodiment has an electrical function different from that of the printed circuit board 1 of the first embodiment.
- FIG. 8 A printed circuit board 1g according to the eighth embodiment will be described with reference to FIG.
- the printed circuit board 1g of the present embodiment has the same configuration as that of the printed circuit board 1 of the first embodiment, but mainly differs in the following points.
- the printed circuit board 1g of the present embodiment further includes second electronic components 32 and 33.
- second electronic components 32 and 33 Although there is no restriction
- the second electronic component 33 may be the same as the second electronic component 32 or may be different from the second electronic component 32.
- the first main frame ground wiring 10 includes a first main frame ground wiring portion 41, a second main frame ground wiring portion 42, and a third main frame ground wiring portion 43.
- the first main frame ground wiring portion 41 is electrically connected to the case 9.
- the second main frame ground wiring portion 42 is disposed at a distance from the first main frame ground wiring portion 41.
- the third main frame ground wiring portion 43 is disposed at a distance from the second main frame ground wiring portion 42.
- the third main frame ground wiring portion 43 is electrically connected to a stable potential 12.
- the first main frame ground wiring portion 41 is connected to the second main frame ground wiring portion 42 via the second electronic component 32.
- the second electronic component 32 is located between one end (the end on the case 9 side) of the first main frame ground wiring 10 and a portion of the first main frame ground wiring 10 connected to the first conductive via 20. May be arranged.
- the second main frame ground wiring portion 42 is connected to the third main frame ground wiring portion 43 via the second electronic component 33.
- the second electronic component 33 includes a portion of the first main frame ground wiring 10 connected to the first conductive via 20, and the other end (end on the stable potential 12 side) of the first main frame ground wiring 10. It may be arranged between.
- the effects of the printed circuit board 1g of the present embodiment have the following effects in addition to the effects of the printed circuit board 1 of the first embodiment.
- the printed circuit board 1g of the present embodiment further includes a second electronic component 32 (second electronic component 33).
- the first main frame ground wiring 10 is spaced from the first main frame ground wiring portion 41 (second main frame ground wiring portion 42) and the first main frame ground wiring portion 41 (second main frame ground wiring portion 42).
- a second main frame ground wiring portion 42 (third main frame ground wiring portion 43) which is arranged to be open.
- the first main frame ground wiring portion 41 (second main frame ground wiring portion 42) is connected to the second main frame ground wiring portion 42 (third main frame ground) via the second electronic component 32 (second electronic component 33). It is connected to the wiring part 43).
- the second electronic component 32 (second electronic component 33) is preferably coupled to the first subframe ground wiring 15 in the first embodiment with a frequency of electromagnetic noise coupled to the first subframe ground wiring 15 and preferably coupled to the first subframe ground wiring 15.
- the frequency may be different from the frequency of electromagnetic noise that is resonantly coupled.
- the frequency of electromagnetic noise coupled to the first subframe ground wiring 15 can be adjusted, and electromagnetic noise spatially coupled to the circuit unit 2 can be further reduced.
- the printed circuit board 1g of the present embodiment can further prevent the circuit unit 2 from malfunctioning.
- the printed circuit board 1g of the present embodiment further includes second electronic components 32 and 33.
- the second electronic components 32 and 33 can change the electrical function of the printed circuit board 1g of the present embodiment.
- the printed circuit board 1g of the present embodiment has an electrical function different from that of the printed circuit board 1 of the first embodiment.
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Abstract
Description
図1及び図2を参照して、実施の形態1に係るプリント基板1を説明する。本実施の形態のプリント基板1は、誘電体層6と、外部インターフェース8と、ケース9と、回路部2と、第1メインフレームグランド配線10と、第1サブフレームグランド配線15と、第1導電ビア20とを主に備える。
本実施の形態のプリント基板1は、外部インターフェース8と、外部インターフェース8を収容するケース9と、回路部2と、第1メインフレームグランド配線10と、第1サブフレームグランド配線15と、第1導電ビア20とを備える。回路部2は、外部インターフェース8に電気的に接続される。第1メインフレームグランド配線10は、ケース9に電気的に接続される。第1サブフレームグランド配線15は、第1メインフレームグランド配線10に対向するように、第1メインフレームグランド配線10から第1の方向に間隔をあけて配置される。第1導電ビア20は、第1メインフレームグランド配線10と第1サブフレームグランド配線15とを接続する。回路部2は、第1メインフレームグランド配線10、第1サブフレームグランド配線15及び第1導電ビア20から第1の方向に交差する第2の方向に間隔をあけて配置される。第1の方向からの平面視において、第1サブフレームグランド配線15の第2の外周は、第1メインフレームグランド配線10の第1の外周に囲まれている。
図4及び図5を参照して、実施の形態2に係るプリント基板1aを説明する。本実施の形態のプリント基板1aは、実施の形態1のプリント基板1と同様の構成を備えるが、主に以下の点で異なる。
図6及び図7を参照して、実施の形態3に係るプリント基板1bを説明する。本実施の形態のプリント基板1bは、実施の形態1のプリント基板1と同様の構成を備えるが、主に以下の点で異なる。
図8及び図9を参照して、実施の形態4に係るプリント基板1cを説明する。本実施の形態のプリント基板1cは、実施の形態1のプリント基板1と同様の構成を備えるが、主に以下の点で異なる。
図10及び図11を参照して、実施の形態5に係るプリント基板1dを説明する。本実施の形態のプリント基板1dは、実施の形態1のプリント基板1と同様の構成を備えるが、主に以下の点で異なる。
図12及び図13を参照して、実施の形態6に係るプリント基板1eを説明する。本実施の形態のプリント基板1eは、実施の形態1のプリント基板1と同様の構成を備えるが、主に以下の点で異なる。
図14を参照して、実施の形態7に係るプリント基板1fを説明する。本実施の形態のプリント基板1fは、実施の形態1のプリント基板1と同様の構成を備えるが、主に以下の点で異なる。
図15を参照して、実施の形態8に係るプリント基板1gを説明する。本実施の形態のプリント基板1gは、実施の形態1のプリント基板1と同様の構成を備えるが、主に以下の点で異なる。
Claims (11)
- 外部インターフェースと、
前記外部インターフェースを収容するケースと、
前記外部インターフェースに電気的に接続される回路部と、
前記ケースに電気的に接続される第1メインフレームグランド配線と、
前記第1メインフレームグランド配線に対向するように、前記第1メインフレームグランド配線から第1の方向に間隔をあけて配置される第1サブフレームグランド配線と、
前記第1メインフレームグランド配線と前記第1サブフレームグランド配線とを接続する第1導電ビアとを備え、
前記回路部は、前記第1メインフレームグランド配線、前記第1サブフレームグランド配線及び前記第1導電ビアから前記第1の方向に交差する第2の方向に間隔をあけて配置され、
前記第1の方向からの平面視において、前記第1サブフレームグランド配線の第2の外周は、前記第1メインフレームグランド配線の第1の外周に囲まれている、プリント基板。 - 前記第1サブフレームグランド配線は、前記第1メインフレームグランド配線を伝搬する電磁ノイズが前記第1サブフレームグランド配線に共振結合するように構成されている、請求項1に記載のプリント基板。
- 前記第1メインフレームグランド配線と前記第1サブフレームグランド配線とを接続する第2導電ビアをさらに備える、請求項1または請求項2に記載のプリント基板。
- 前記第1サブフレームグランド配線に対向するように、前記第1サブフレームグランド配線から前記第1の方向に間隔をあけて配置される第2サブフレームグランド配線と、
前記第1サブフレームグランド配線と前記第2サブフレームグランド配線とを接続する第3導電ビアとをさらに備え、
前記第1サブフレームグランド配線は、前記第1メインフレームグランド配線と前記第2サブフレームグランド配線との間に配置され、
前記第1の方向からの前記平面視において、前記第2サブフレームグランド配線の第3の外周は前記第1メインフレームグランド配線の前記第1の外周に囲まれている、請求項1または請求項2に記載のプリント基板。 - 前記第1メインフレームグランド配線に対向するように、前記第1メインフレームグランド配線から前記第1の方向に間隔をあけて配置される第2サブフレームグランド配線と、
前記第1メインフレームグランド配線と前記第2サブフレームグランド配線とを接続する第3導電ビアとをさらに備え、
前記第2サブフレームグランド配線は、前記第1サブフレームグランド配線から前記第1の方向及び前記第2の方向に交差する第3の方向に間隔をあけて配置され、
前記第1の方向からの前記平面視において、前記第2サブフレームグランド配線の第3の外周は前記第1メインフレームグランド配線の前記第1の外周に囲まれている、請求項1または請求項2に記載のプリント基板。 - 前記第1の方向からの前記平面視において、前記第2サブフレームグランド配線は、前記第1サブフレームグランド配線と異なる形状を有する、請求項4または請求項5に記載のプリント基板。
- 前記第1サブフレームグランド配線に対向するように、前記第1サブフレームグランド配線から前記第1の方向に間隔をあけて配置される第2メインフレームグランド配線と、
前記第1メインフレームグランド配線と前記第2メインフレームグランド配線とを接続する複数の第4導電ビアとをさらに備え、
前記第1サブフレームグランド配線は、前記第1メインフレームグランド配線と前記第2メインフレームグランド配線との間に配置され、
前記第1の方向からの前記平面視において、前記第1サブフレームグランド配線の前記第2の外周は前記第2メインフレームグランド配線の第4の外周に囲まれており、
前記第1の方向からの前記平面視において、前記複数の第4導電ビアは、前記第1サブフレームグランド配線を囲んでいる、請求項1または請求項2に記載のプリント基板。 - 前記第1サブフレームグランド配線と前記第2メインフレームグランド配線とを接続する第5導電ビアをさらに備える、請求項7に記載のプリント基板。
- 前記第1サブフレームグランド配線は蛇行した形状を有する、請求項1から請求項8のいずれか1項に記載のプリント基板。
- 第1電子部品をさらに備え、
前記第1メインフレームグランド配線は、前記第1電子部品を介して前記第1導電ビアに接続される、請求項1から請求項9のいずれか1項に記載のプリント基板。 - 第2電子部品をさらに備え、
前記第1メインフレームグランド配線は、第1メインフレームグランド配線部分と、前記第1メインフレームグランド配線部分から間隔をあけて配置される第2メインフレームグランド配線部分とを含み、
前記第1メインフレームグランド配線部分は、前記第2電子部品を介して、前記第2メインフレームグランド配線部分に接続されている、請求項1から請求項10のいずれか1項に記載のプリント基板。
Priority Applications (5)
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KR1020187035729A KR102165964B1 (ko) | 2016-06-24 | 2016-12-08 | 프린트 기판 |
CN201680086934.9A CN109417846B (zh) | 2016-06-24 | 2016-12-08 | 印刷基板 |
DE112016006998.7T DE112016006998T5 (de) | 2016-06-24 | 2016-12-08 | Leiterplattensubstrat |
US16/300,665 US10827603B2 (en) | 2016-06-24 | 2016-12-08 | Printed circuit substrate |
JP2017515256A JP6250229B1 (ja) | 2016-06-24 | 2016-12-08 | プリント基板 |
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JP2016125671 | 2016-06-24 |
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PCT/JP2016/086526 WO2017221443A1 (ja) | 2016-06-24 | 2016-12-08 | プリント基板 |
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US (1) | US10827603B2 (ja) |
KR (1) | KR102165964B1 (ja) |
CN (1) | CN109417846B (ja) |
DE (1) | DE112016006998T5 (ja) |
WO (1) | WO2017221443A1 (ja) |
Citations (5)
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JPH11297875A (ja) * | 1998-04-15 | 1999-10-29 | Canon Inc | 多層プリント配線板及び該配線板を備えた電子機器 |
JP2000269613A (ja) * | 1999-03-18 | 2000-09-29 | Matsushita Electric Ind Co Ltd | 不要輻射対応プリント基板 |
JP2003163467A (ja) * | 2001-05-14 | 2003-06-06 | Fuji Xerox Co Ltd | プリント配線基板及びプリント配線基板設計支援装置 |
WO2013145019A1 (ja) * | 2012-03-30 | 2013-10-03 | 株式会社日立製作所 | 絶縁伝送媒体および絶縁伝送装置 |
JP2014036138A (ja) * | 2012-08-09 | 2014-02-24 | Mitsubishi Electric Corp | プリント基板 |
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JP3385131B2 (ja) | 1995-07-12 | 2003-03-10 | 株式会社 沖情報システムズ | インタフェース構造 |
US6181571B1 (en) | 1998-03-06 | 2001-01-30 | Canon Kabushiki Kaisha | Printed-wiring board and electronic device having the same wiring board |
US6937480B2 (en) | 2001-05-14 | 2005-08-30 | Fuji Xerox Co., Ltd. | Printed wiring board |
CN101212858B (zh) * | 2006-12-27 | 2010-05-12 | 日月光半导体制造股份有限公司 | 线路基板 |
JP5063529B2 (ja) | 2008-08-22 | 2012-10-31 | キヤノン株式会社 | プリント回路板 |
US9698461B2 (en) * | 2013-04-18 | 2017-07-04 | Panasonic Intellectual Property Management Co., Ltd. | Resonant coupler |
-
2016
- 2016-12-08 DE DE112016006998.7T patent/DE112016006998T5/de not_active Withdrawn
- 2016-12-08 US US16/300,665 patent/US10827603B2/en active Active
- 2016-12-08 CN CN201680086934.9A patent/CN109417846B/zh not_active Expired - Fee Related
- 2016-12-08 KR KR1020187035729A patent/KR102165964B1/ko active IP Right Grant
- 2016-12-08 WO PCT/JP2016/086526 patent/WO2017221443A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11297875A (ja) * | 1998-04-15 | 1999-10-29 | Canon Inc | 多層プリント配線板及び該配線板を備えた電子機器 |
JP2000269613A (ja) * | 1999-03-18 | 2000-09-29 | Matsushita Electric Ind Co Ltd | 不要輻射対応プリント基板 |
JP2003163467A (ja) * | 2001-05-14 | 2003-06-06 | Fuji Xerox Co Ltd | プリント配線基板及びプリント配線基板設計支援装置 |
WO2013145019A1 (ja) * | 2012-03-30 | 2013-10-03 | 株式会社日立製作所 | 絶縁伝送媒体および絶縁伝送装置 |
JP2014036138A (ja) * | 2012-08-09 | 2014-02-24 | Mitsubishi Electric Corp | プリント基板 |
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CN109417846A (zh) | 2019-03-01 |
CN109417846B (zh) | 2021-09-07 |
KR102165964B1 (ko) | 2020-10-15 |
US10827603B2 (en) | 2020-11-03 |
US20190394872A1 (en) | 2019-12-26 |
DE112016006998T5 (de) | 2019-02-28 |
KR20190007007A (ko) | 2019-01-21 |
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