WO2017208646A1 - Dispositif capteur et procédé de correction de capteur - Google Patents

Dispositif capteur et procédé de correction de capteur Download PDF

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Publication number
WO2017208646A1
WO2017208646A1 PCT/JP2017/015349 JP2017015349W WO2017208646A1 WO 2017208646 A1 WO2017208646 A1 WO 2017208646A1 JP 2017015349 W JP2017015349 W JP 2017015349W WO 2017208646 A1 WO2017208646 A1 WO 2017208646A1
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WO
WIPO (PCT)
Prior art keywords
sensor
correction
unit
measurement object
processing unit
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PCT/JP2017/015349
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English (en)
Japanese (ja)
Inventor
大泉晶
澁谷康祐
浅村統央
Original Assignee
株式会社テイエルブイ
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Application filed by 株式会社テイエルブイ filed Critical 株式会社テイエルブイ
Priority to JP2017544683A priority Critical patent/JP6276484B1/ja
Publication of WO2017208646A1 publication Critical patent/WO2017208646A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H17/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the preceding groups

Definitions

  • the technology disclosed herein relates to a sensor device and a sensor correction method.
  • the piezoelectric element has a specific frequency characteristic (for example, a resonance frequency), and the specific frequency characteristic depends on the mass of the piezoelectric element. If the frequency characteristics of the piezoelectric elements are different, the detection accuracy of the sensor varies. Therefore, the piezoelectric element is required to be manufactured with high accuracy so that individual differences are reduced.
  • a specific frequency characteristic for example, a resonance frequency
  • the detection accuracy of the sensor may vary due to other factors.
  • the technology disclosed herein has been made in view of such a point, and its object is to reduce the variation in detection accuracy of each sensor.
  • the sensor device disclosed herein includes a sensor that is attached to a measurement object and detects vibration of the measurement object, and a correction unit that corrects a detection result from the sensor, and the correction unit includes the detection result. Is corrected according to the mounting method of the sensor.
  • the sensor correction method disclosed herein includes a step of detecting vibration of a measurement object by a sensor attached to the measurement object, and a detection result from the sensor is corrected according to the sensor attachment method. And the process of carrying out.
  • the “sensor detection result” includes not only a detection signal output from the sensor but also a detection signal processed after that and a value obtained from the detection signal.
  • FIG. 1 is a front view showing a schematic configuration of the sensor device.
  • FIG. 2 is a longitudinal sectional view of the sensor body.
  • FIG. 3 is a longitudinal sectional view of the sensor attached by the first attachment method.
  • FIG. 4 is a front view of the sensor attached by the second attachment method.
  • FIG. 5 is a front view of the sensor attached by the third attachment method.
  • FIG. 6 is a block diagram of the processing unit.
  • FIG. 7 is a front view illustrating a schematic configuration of the sensor device according to the second embodiment.
  • FIG. 8 is a block diagram of a processing unit and a server in the sensor device according to the third embodiment.
  • FIG. 1 is a front view illustrating a schematic configuration of the sensor device 100.
  • the sensor device 100 is a so-called contact-type sensor that detects a physical quantity of a measurement object in contact with the measurement object.
  • the measurement object is a steam trap
  • the physical quantity is vibration and temperature of the steam trap.
  • the sensor device 100 includes a sensor 2, a processing unit 5, and a connecting pipe 4 that connects the sensor 2 and the processing unit 5.
  • the sensor 2, the processing unit 5, and the connecting pipe 4 are arranged along a predetermined axis X, and the sensor device 100 is formed in a rod shape as a whole.
  • the sensor 2 and the connection pipe 4 are connected by a union nut 42.
  • the processing unit 5 and the connection pipe 4 are connected by a union nut 41.
  • the sensor device 100 is usually installed such that the axis X is oriented vertically, the sensor 2 is located below, and the processing unit 5 is located above.
  • the processing unit 5 is referred to as the upper side
  • the sensor 2 is referred to as the lower side.
  • FIG. 2 is a longitudinal sectional view of the sensor 2.
  • the sensor 2 has a piezoelectric element and detects the vibration of the measurement object.
  • the sensor 2 includes a casing 10, a vibration detection mechanism 20 that detects (measures) the vibration of the measurement object, and a temperature detection mechanism 30 that detects (measures) the temperature of the measurement object.
  • the vibration detection mechanism 20 and the temperature detection mechanism 30 are accommodated in the casing 10.
  • the casing 10 is formed in a substantially cylindrical shape, and is arranged so that the axis coincides with the axis X.
  • a step 10f is provided inside the casing 10, and the inner diameter of the upper portion 10a of the casing 10 is larger than the inner diameter of the lower portion 10b.
  • a male screw 10 c into which the union nut 42 is screwed is formed on the outer peripheral surface of the upper portion 10 a of the casing 10.
  • a male screw 10 e is formed on the outer peripheral surface of the lower portion 10 b of the casing 10.
  • a lower end 10 g that is one end in the axis X direction of the casing 10 is in contact with the measurement object when the sensor device 100 is installed.
  • the vibration detection mechanism 20 includes a detection needle 21, a holder 22, a first piezoelectric element 25a, a second piezoelectric element 25b, a first electrode plate 26a, a second electrode plate 26b, a weight 27, and a disc spring 28. And a cap 29.
  • the detection needle 21 is an elongated rod-like member.
  • the detection needle 21 is arranged so that the axis coincides with the axis X.
  • the tip (lower end) of the detection needle 21 protrudes downward from the lower end 10 g of the casing 10.
  • the detection needle 21 transmits the vibration of the measurement object to the first piezoelectric element 25a and the second piezoelectric element 25b.
  • the detection needle 21 is an example of a transmission unit.
  • the holder 22 includes an inner metal holder 23 and an outer resin holder 24 that accommodates the metal holder 23. Both the metal holder 23 and the resin holder 24 are formed in a substantially cylindrical shape, and are arranged so that the axis coincides with the axis X.
  • the metal holder 23 is opened upward, while a bottom wall 23 a is provided at the lower part of the metal holder 23.
  • An insertion hole 23b is formed in the bottom wall 23a.
  • the detection needle 21 is inserted into the insertion hole 23 b, and the detection needle 21 protrudes downward from the metal holder 23.
  • the upper end of the detection needle 21 is locked to the bottom wall 23 a so that the detection needle 21 does not fall out of the metal holder 23.
  • the first piezoelectric element 25a, the first electrode plate 26a, the second piezoelectric element 25b, the second electrode plate 26b, the weight 27, the disc spring 28, and the cap 29 are in contact with each other in order from the bottom. Is arranged in.
  • the first piezoelectric element 25 a is in contact with the upper end of the detection needle 21.
  • two signal lines (not shown) are connected to the first electrode plate 26a and the second electrode plate 26b.
  • the two signal lines are wired from the sensor 2 through the connection pipe 4 to the processing unit 5.
  • the cap 29 is a disk-shaped member having a male screw formed on the outer peripheral surface. On the inner peripheral surface of the upper end portion of the metal holder 23, a female screw is formed. The cap 29 is screwed to the upper end portion of the metal holder 23. The cap 29 presses the disc spring 28 downward by the tightening force, and the disc spring 28 presses the first piezoelectric element 25a, the second piezoelectric element 25b, and the like to the detection needle 21 through the weight 27 by the biasing force.
  • the first piezoelectric element 25a and the second piezoelectric element 25b are pressed against the detection needle 21 with a predetermined force (initial pressing force) by the weight 27, the disc spring 28, and the like.
  • a predetermined force initial pressing force
  • the disturbances can be absorbed and the influence of the disturbances can be reduced.
  • the resin holder 24 is opened upward, while a bottom wall 24 a is provided at the lower part of the resin holder 24.
  • An insertion hole 24b is formed in the bottom wall 24a.
  • a metal holder 23 is press-fitted into the resin holder 24.
  • the detection needle 21 is inserted into the insertion hole 24b, and the detection needle 21 protrudes downward from the resin holder 24.
  • the holder 22 is accommodated in the upper part 10 a of the casing 10, and the detection needle 21 protruding downward from the holder 22 is accommodated in the lower part 10 b of the casing 10.
  • the coil spring 11 is disposed above the holder 22.
  • the holder 22 is urged downward by the coil spring 11.
  • a groove 10d is formed on the inner peripheral surface of the upper end portion of the casing 10, and a snap ring 12 is fitted in the groove 10d.
  • One end of the coil spring 11 is supported by the snap ring 12.
  • the other end of the coil spring 11 is in contact with the upper end surface of the resin holder 24.
  • the coil spring 11 urges the resin holder 24 (holder 22) downward, and presses the resin holder 24 against the step 10f in the casing 10. In this state, the tip of the detection needle 21 slightly protrudes from the lower end 10 g of the casing 10.
  • the temperature detection mechanism 30 includes a contact plate 31 (heat transfer plate) and a holding member 32.
  • the contact plate 31 is a substantially annular plate member having an opening at the center.
  • the holding member 32 is formed in a substantially cylindrical shape having a through hole 33 in the center, and is inserted into the lower end portion of the casing 10. The contact plate 31 is held at the tip of the holding member 32.
  • the holding member 32 is formed with two arrangement holes 34 and 35 for arranging a thermocouple so as to extend in the axial direction.
  • a thermocouple (not shown) is arranged in each of the arrangement holes 34 and 35. One end of each thermocouple is connected to the contact plate 31, and the other end is connected to the processing unit 5 through the connection pipe 4.
  • the coil spring 13 is disposed above the holding member 32.
  • One end of the coil spring 13 is held by a holder 22 (resin holder 24).
  • the other end of the coil spring 13 is in contact with the holding member 32.
  • the coil spring 13 biases the holding member 32 downward, so that the contact plate 31 protrudes slightly below the lower end 10 g of the casing 10. That is, the contact plate 31 protrudes from the lower end 10 g of the casing 10, and the detection needle 21 further protrudes from the contact plate 31.
  • the contact plate 31 contacts the measurement object.
  • the sensor 2 is attached to the measurement object by various methods. Hereinafter, a method for attaching the sensor 2 will be described.
  • FIG. 3 is a longitudinal sectional view of the sensor 2 attached by the first attachment method.
  • the sensor 2 is attached to the attachment seat 91 of the measurement object 90.
  • the mounting seat 91 is formed, for example, in a steam trap casing.
  • the mounting seat 91 is formed in a boss shape and has a bottomed installation hole 92. On the inner peripheral surface of the installation hole 92, a female screw is formed.
  • the sensor 2 is screwed to the measuring object 90 by screwing the lower part 10b of the casing 10 into the installation hole 92. At this time, the casing 10 is tightened with a predetermined tightening torque by a torque wrench or the like.
  • the tip of the detection needle 21 and the contact plate 31 protrude below the lower end 10g.
  • the detection needle 21 can move upward with respect to the casing 10 against the biasing force of the coil spring 11, and the contact plate 31 moves upward with respect to the casing 10 against the biasing force of the coil spring 13. Is possible. Therefore, when the lower end 10 g of the casing 10 contacts the bottom of the installation hole 92, the tip of the detection needle 21 and the contact plate 31 are flush with the lower end 10 g of the casing 10 and contact the bottom of the installation hole 92. Yes.
  • the detection needle 21 and the contact plate 31 are in contact with the bottom of the installation hole 92, and the vibration and temperature of the measurement object 90 are detected.
  • FIG. 4 is a front view of the sensor 2 attached by the second attachment method.
  • the sensor 2 is attached to the measurement object 90 via the clamp 6.
  • the clamp 6 includes a holding member 61 that holds the sensor 2, a pair of holding members 62 and 62 connected to the holding member 61, and a fastening member 63 that fastens the holding members 62 and 62.
  • a mounting hole 64 is formed through the center of the holding member 61.
  • a female screw is formed in the mounting hole 64.
  • the sensor 2 is screwed to the holding member 61 when the lower portion 10 b of the casing 10 is screwed into the mounting hole 64.
  • the lower part 10 b penetrates the holding member 61.
  • the holding members 62 and 62 are connected to both ends of the holding member 61 in a rotatable state.
  • the pair of sandwiching members 62 and 62 are configured such that the distance between the end connected to the holding member 61 and the end opposite to the end (hereinafter referred to as “free end”) can be changed.
  • Each holding member 62 is formed with a contact portion 62a that comes into contact with the measurement object 90 when attached.
  • the fastening member 63 has a bolt 63a inserted into an insertion hole formed in the free ends of the pair of holding members 62, 62, and a nut 63b screwed into the bolt 63a.
  • the distance between the free ends of the holding members 62 and 62 is adjusted by the tightening degree of the nut 63b.
  • the clamp 6 is attached to an inlet portion of a steam trap as the measurement object 90.
  • the inlet portion is formed in a circular tube shape.
  • the sensor 2 is screwed to the holding member 61.
  • the clamping member 63 removed from the sandwiching members 62, 62, the measurement object 90 is sandwiched between the sandwiching members 62, 62.
  • the lower end 10g of the sensor 2 and the contact portions 62a and 62a of the holding members 62 and 62 are in contact with the inlet portion.
  • the fastening member 63 is attached to the holding members 62 and 62, and the nut 63b is fastened.
  • the clamp 6 is fixed in a state where the lower end 10g and the contact portions 62a and 62a are in contact with the inlet portion. At this time, the nut 63b is tightened with a predetermined tightening torque by a torque wrench or the like. Thus, the sensor 2 is attached to the measurement object 90 via the clamp 6.
  • FIG. 5 is a front view of the sensor 2 attached by the third attachment method.
  • the sensor 2 is attached to the measurement object 90 via the band 7.
  • the band 7 includes a band main body 71, a mounting nut 72 provided on the band main body 71 to which the sensor device 100 is attached, and a fastening member 73 that tightens the band main body 71.
  • the band body 71 has a divided structure of a first divided body 74 and a second divided body 75.
  • Each of the first divided body 74 and the second divided body 75 is a metal plate-like member, and is curved in a substantially semicircular shape.
  • One end of the first divided body 74 and one end of the second divided body 75 are connected.
  • the other end of the first divided body 74 and the other end of the second divided body 75 are free ends.
  • the first divided body 74 and the second divided body 75 are formed in a substantially annular shape as a whole.
  • the mounting nut 72 is fixed to the first divided body 74.
  • the mounting nut 72 is formed with a through hole 72a having a female screw.
  • a through hole communicating with the through hole 72a is formed in a portion of the first divided body 74 where the mounting nut 72 is provided.
  • the sensor 2 is screwed to the mounting nut 72 by screwing the lower part 10b of the casing 10 into the through hole 72a.
  • the lower part 10 b passes through the mounting nut 72 and the first divided body 74.
  • the fastening member 73 has a bolt 73a inserted into an insertion hole formed in the free ends of the first divided body 74 and the second divided body 75, and a nut 73b screwed into the bolt 73a. The distance between the free ends of the first divided body 74 and the second divided body 75 is adjusted by the tightening degree of the nut 73b.
  • the band 7 is attached to, for example, an inlet portion of a steam trap as the measurement object 90.
  • the inlet portion is formed in a circular tube shape.
  • the sensor 2 is screwed to the mounting nut 72. With the fastening member 73 removed from the first divided body 74 and the second divided body 75, the measurement object 90 is sandwiched between the first divided body 74 and the second divided body 75. Thereafter, the fastening member 73 is attached to the first divided body 74 and the second divided body 75, and the nut 73b is tightened. At this time, the nut 73b is tightened with a predetermined tightening torque by a torque wrench or the like. Thereby, the band 7 is fixed to the measuring object 90 with the lower end 10g of the sensor 2 in contact with the inlet. Thus, the sensor 2 is attached to the measurement object 90 via the band 7.
  • FIG. 6 is a block diagram of the processing unit 5.
  • the processing unit 5 processes the detection signal from the sensor 2 and transmits / receives a signal to / from an external device.
  • the processing unit 5 determines the vibration processing unit 51 that processes the detection signal from the vibration detection mechanism 20, the temperature processing unit 52 that processes the detection signal from the temperature detection mechanism 30, the memory 53, and the state of the measurement object.
  • the vibration processing unit 51 includes a filter 57, an amplifier 58, an A / D conversion unit 59, an output calculation unit 510, and a correction unit 511.
  • the filter 57 is a band-pass filter, and cuts frequency components other than a predetermined frequency band in the output signal from the vibration detection mechanism 20.
  • the predetermined frequency band is set according to the vibration that can occur in the measurement object.
  • the amplifier 58 amplifies the signal processed by the filter 57.
  • the A / D converter 59 converts the signal amplified by the amplifier 58 into a digital signal.
  • the output calculation unit 510 performs various processes on the digital signal from the A / D conversion unit 59 to calculate an index indicating the magnitude of vibration (hereinafter referred to as “vibration level”). Any index can be adopted as the vibration level as long as it indicates the magnitude of vibration.
  • the vibration level may simply be the maximum amplitude of the digital signal, and may be a maximum amplitude, an average amplitude, an integral value, or the like after the digital signal is subjected to rectification processing, root mean square processing, or the like. Also good.
  • the correction unit 511 corrects the vibration level using the correction data.
  • the correction data is stored in the memory 53. Details of the correction by the correction unit 511 will be described later.
  • the temperature processing unit 52 appropriately processes the detection signal from the temperature detection mechanism 30 so that the determination unit 54 can process it. In the present disclosure, details thereof are omitted.
  • the memory 53 stores programs and data necessary for processing in the processing unit 5.
  • the memory 53 stores correction data.
  • the memory 53 is an example of a storage unit.
  • the determination unit 54 determines the state of the measurement object based on the signal processed by the vibration processing unit 51 and / or the signal processed by the temperature processing unit 52.
  • the determination unit 54 determines the state of the steam trap that is the measurement target based on the vibration level obtained by the vibration processing unit 51. Specifically, the vibration level is low when steam trap steam leakage has not occurred, and the vibration level increases when steam trap steam leak occurs. Therefore, the determination unit 54 determines that there is no steam leak in the steam trap when the vibration level is equal to or lower than the predetermined determination level, and determines that there is steam leak in the steam trap when the vibration level is higher than the determination level.
  • the determination unit 54 determines the state of the steam trap based on the signal processed by the temperature processing unit 52. Specifically, the temperature of the steam trap becomes a value close to the saturation temperature of the vapor pressure when the drain is appropriately distributed, and decreases when the drain is retained. The determination unit 54 determines that there is no retention of drain when the temperature of the steam trap is equal to or higher than a predetermined determination temperature, and determines that there is retention of drain when the temperature of the steam trap is lower than the determination temperature.
  • the communication unit 55 transmits and receives signals to and from external devices by wireless communication. For example, the communication unit 55 transmits the determination result by the determination unit 54 to the external device.
  • the input unit 56 inputs various settings necessary for the processing of the processing unit 5.
  • the input unit 56 stores setting information received from an external device via the communication unit 55 in the memory 53.
  • ⁇ Sensor correction method> Hereinafter, the correction of the sensor 2 will be described in detail.
  • the detection result (for example, vibration level) of the sensor 2 may vary depending on the mounting method. Specifically, since the pressing force and stability of the sensor 2 with respect to the measurement object 90 differ depending on the attachment method, the detection result of the sensor 2 may vary even if the magnitude of the vibration of the measurement object 90 is the same. For example, among the first to third attachment methods described above, the first attachment method can attach the sensor 2 most firmly and stably, and the detected vibration level is the smallest. On the other hand, since the pressing force of the third attachment method is the smallest and the attachment stability is low, the detected vibration level is the largest.
  • the correction unit 511 corrects the vibration level of the sensor 2 according to the mounting method.
  • the memory 53 stores correction data corresponding to the attachment method.
  • the correction data is a coefficient that is multiplied by the vibration level. For example, the coefficient C1 of the first attachment method is the largest, the coefficient C3 of the third attachment method is the smallest, and the coefficient of the second attachment method is between them.
  • the processing unit 5 receives an actual mounting method (including data indicating the mounting method; the same applies hereinafter) of the sensor 2 from the server 8 as an external device.
  • the server 8 manages the mounting method of the sensor 2.
  • the processing unit 5 receives the mounting method of the sensor 2 from the server 8 at the time of initial setting or the like and stores it in the memory 53.
  • Processing unit 5 reads the detection signal from sensor 2. This step corresponds to a step of detecting the vibration of the measurement object with a sensor attached to the measurement object. Then, the processing unit 5 performs filter processing, amplification processing, and A / D conversion on the detection signal to obtain a vibration level.
  • the correction unit 511 selects the corresponding correction data from the memory 53 according to the mounting method of the sensor 2 stored in the memory 53.
  • the correction unit 511 corrects the vibration level by multiplying the selected correction data by the vibration level obtained by the output calculation unit 510.
  • This step corresponds to the step of correcting the detection signal from the sensor in accordance with the sensor mounting method. Thereby, the variation of the vibration level resulting from the attachment method is reduced. As a result, the accuracy of determination by the determination unit 54 can also be improved.
  • the actual mounting method of the sensor 2 is input from the server 8 to the processing unit 5.
  • the input of the attachment method is not limited from the server 8.
  • the input unit 56 may be configured such that a PC or the like can be connected, and an attachment method may be input from the PC or the like via the input unit 56 by a user input operation or the like when the sensor device 100 is initially set.
  • the input unit 56 is a user interface that can be input by the user, and the attachment method may be input by the user operating the input unit 56.
  • the input unit 56 is a switch capable of selecting an attachment method, and the user may input the attachment method by switching the switch to a state corresponding to the attachment method. That is, any input method can be adopted as long as the attachment method of the sensor 2 can be input to the processing unit 5.
  • the sensor device 100 includes the sensor 2 that is attached to the measurement object 90 and detects the vibration of the measurement object 90, and the correction unit 511 that corrects the detection result from the sensor 2, and the correction unit 511. Corrects the detection result in accordance with the mounting method of the sensor 2.
  • the vibration of the measurement object 90 is detected by the sensor 2 attached to the measurement object 90, and the detection result from the sensor 2 is corrected according to the attachment method of the sensor 2. Process.
  • the correction unit 511 corrects the detection result with correction data set according to the attachment method of the sensor 2.
  • the sensor device 100 holds correction data corresponding to the mounting method of the sensor 2. Therefore, the detection result of the sensor 2 of various attachment methods can be corrected by changing the correction data.
  • the sensor device 100 further includes a memory 53 that stores a plurality of correction data corresponding to different mounting methods of the sensor 2, and the correction unit 511 includes the correction data of the sensor 2 among the plurality of correction data stored in the memory 53. Select the correction data corresponding to the mounting method.
  • the memory 53 stores a plurality of correction data corresponding to different mounting methods of the sensor 2. Therefore, by changing the selection of the correction data, the detection signal of the sensor 2 can be easily corrected corresponding to various attachment methods of the sensor 2.
  • FIG. 7 is a front view illustrating a schematic configuration of the sensor device 200 according to the second embodiment.
  • the sensor device 200 is different from the sensor device 100 in that it includes a server 208. That is, in the sensor device 100, all the elements are packaged into one and physically integrated, whereas the sensor device 200 includes some elements (specifically, the server 208). It is physically separated from other elements packaged in one (specifically, sensor 2, connecting pipe 4 and processing unit 5). Therefore, the sensor device 200 will be described mainly with respect to parts different from the sensor device 100, and the same reference numerals are given to the same components as the sensor device 100, and the description thereof will be omitted.
  • the sensor device 200 includes a sensor 2, a processing unit 5, a connecting pipe 4 that connects the sensor 2 and the processing unit 5, and a server 208.
  • the server 208 stores correction data corresponding to the mounting method of the sensor 2. That is, the aforementioned correction coefficients C1, C2, and C3 are stored in the server 208.
  • the memory 53 of the processing unit 5 stores the sensor 2 mounting method (including data indicating the mounting method; the same applies hereinafter). This attachment method is input to the processing unit 5 at the time of shipment or initial setting.
  • the process part 5 transmits the attachment method memorize
  • the server 208 receives the attachment method from the processing unit 5, the server 208 returns correction data corresponding to the attachment method, that is, any one of the correction coefficients C 1, C 2, and C 3 to the processing unit 5.
  • the processing unit 5 stores the correction data in the memory 53.
  • the correction unit 511 corrects the vibration level obtained by the output calculation unit 510 with the correction data stored in the memory 53.
  • a plurality of correction data corresponding to various attachment methods of the sensor 2 are stored in the memory 53.
  • amendment part 511 selects the correction data corresponding to the attachment method of the sensor 2 from the inside.
  • a plurality of correction data corresponding to various attachment methods of the sensor 2 are stored in the server 208.
  • the server 208 transmits correction data corresponding to the attachment method to the processing unit 5. That is, the memory 53 stores only correction data corresponding to the mounting method of the sensor 2 among the plurality of correction data.
  • the sensor device 200 can correct the detection result from the sensor 2 in accordance with the mounting method of the sensor 2, and as a result, variation in the detection result due to the mounting method can be reduced. it can.
  • the correction data is collectively managed by the server 208. Therefore, when the correction data is updated, the data held by the server 208 may be updated, and the update process is simplified.
  • FIG. 8 is a block diagram of the processing unit 305 and the server 308 in the sensor device 300 according to the third embodiment.
  • the sensor device 300 is the same as the sensor device 200 in that it includes a server 308, and is different from the sensor device 100.
  • the sensor device 300 is different from the sensor device 200 in that the server 308 corrects the detection signal from the sensor 2. Therefore, the sensor device 300 will be described mainly with respect to parts different from the sensor device 100 and the sensor device 200, and the same reference numerals are given to the same components as the sensor device 100 and the sensor device 200, and the description thereof will be omitted.
  • the sensor device 300 includes a sensor 2, a processing unit 305, a connecting pipe 4 that connects the sensor 2 and the processing unit 305, and a server 308.
  • a sensor 2 a processing unit 305
  • a connecting pipe 4 that connects the sensor 2 and the processing unit 305
  • server 308 a server 308.
  • illustration of the sensor 2 and the connecting pipe 4 is omitted.
  • the appearances of the sensor 2, the processing unit 305, and the connecting pipe 4 are the same as those in the first and second embodiments.
  • the processing unit 305 includes a vibration processing unit 351, a temperature processing unit 52, a memory 53, a communication unit 55 that communicates with an external device, and an input unit 56 that inputs various settings.
  • the vibration processing unit 351 includes a filter 57, an amplifier 58, an A / D conversion unit 59, and an output calculation unit 510.
  • the processing unit 305 does not include the determination unit 54 and the correction unit 511.
  • the memory 53 stores programs and data necessary for processing by the processing unit 305, but does not store correction data. In other words, the processing unit 305 performs only the calculation of the vibration level.
  • the processing unit 305 transmits the obtained vibration level to the server 308 via the communication unit 55. Note that the processing unit 305 also transmits a signal processed by the temperature processing unit 52 to the server 308 via the communication unit 55.
  • the server 308 includes a communication unit 381, a storage 382, a correction unit 383, and a determination unit 384.
  • the communication unit 381 transmits and receives signals by wireless communication with an external device. For example, the communication unit 381 receives the vibration level transmitted from the processing unit 305.
  • the storage 382 stores programs and data necessary for processing by the server 308. For example, the storage 382 stores a plurality of correction data corresponding to a plurality of attachment methods of the sensor 2. Further, the storage 382 stores the actual attachment method of each of the plurality of sensors 2.
  • the storage 382 is an example of a storage unit.
  • the correction unit 383 has the same function as the correction unit 511. That is, the correction unit 383 corrects the vibration level using the correction data.
  • the correction unit 383 receives the vibration level from the processing unit 305, the correction unit 383 reads out the mounting method of the sensor 2 corresponding to the vibration level (including data indicating the mounting method; the same applies hereinafter) from the storage 382, and the mounting method is used.
  • Corresponding correction data ie, correction coefficient
  • the correction unit 383 corrects the vibration level with the read correction data.
  • the determination unit 384 has the same function as the determination unit 54. That is, the determination unit 384 determines the state of the measurement object based on the corrected vibration level and / or the signal processed by the temperature processing unit 52.
  • the server 308 holds the correction data, and the server 308 corrects the detection signal of the sensor 2 using the correction data. Thereby, the process of the process part 305 is simplified.
  • the processing unit 305 calculates the vibration level, but the server 308 may calculate the vibration level. That is, the processing unit 305 may perform processing until the detection signal from the sensor 2 is A / D converted, and output the processed digital signal to the server 308.
  • the measurement object 90 is not limited to a steam trap.
  • the configuration of the sensor device 100 is not limited to the above-described configuration.
  • the sensor 2 and the processing unit 5 may be coupled without using the connection pipe 4.
  • the sensor device 100 detects temperature and vibration, but may not detect the temperature detection mechanism 30 and may detect only vibration.
  • the attachment of the sensor device 100 to the measurement object is not limited to the first to third attachment methods. Any attachment method can be adopted as long as the sensor 2 can be attached to the measurement object.
  • the configuration of the sensor 2 is not limited to the configuration described above.
  • the number of piezoelectric elements need not be two, but may be one, or three or more.
  • the detection needle 21, the weight 27, the disc spring 28, and the like are not essential, and any configuration can be adopted as long as the vibration of the measurement target is input to the piezoelectric element.
  • the sensor devices 100, 200, and 300 determine the state of the measurement object, but are not limited thereto. That is, the sensor devices 100, 200, and 300 may be configured to correct the detection result from the sensor 2 in accordance with the attachment method of the sensor 2.
  • the processing units 5 and 305 may be connected to an external device (for example, the servers 8, 208, and 308) by wire instead of wirelessly.
  • an external device for example, the servers 8, 208, and 308
  • the correction of the detection result (for example, vibration level) of the sensor 2 is not limited to the multiplication of the correction coefficient.
  • any correction method can be adopted.
  • the detection result of the sensor 2 may be corrected using a correction formula set for each attachment method.
  • the correction coefficient described above is constant regardless of the magnitude of the vibration level, but the correction formula is a function with the vibration level as a variable (for example, it increases as the vibration level increases), and the value of the correction formula is It fluctuates according to the vibration level. That is, the value of the correction formula is determined by the vibration level from the sensor 2, and the vibration level is corrected by multiplying the value of the correction formula by the vibration level.
  • the technique disclosed herein is useful for the sensor device and the sensor correction method.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)

Abstract

La présente invention concerne un dispositif capteur 100 comprenant : un capteur 2 qui est fixé à un objet à mesurer 90 et qui détecte les vibrations de l'objet à mesurer 90 ; et une unité de correction 511 qui corrige un résultat de détection provenant du capteur 2. L'unité de correction 511 corrige le résultat de détection en fonction d'un procédé de fixation du capteur 2.
PCT/JP2017/015349 2016-06-03 2017-04-14 Dispositif capteur et procédé de correction de capteur WO2017208646A1 (fr)

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JPS5561258A (en) * 1978-10-30 1980-05-08 Toshiba Corp Apparatus for monitoring vibration at end of stator winding for rotary electric machine
JPS59190473A (ja) * 1983-04-11 1984-10-29 Nissan Motor Co Ltd デイ−ゼル機関の燃料噴射時期検出装置
JPS6284719U (fr) * 1985-11-15 1987-05-29
JPH05187604A (ja) * 1992-01-14 1993-07-27 Kyushu Electric Power Co Inc ボイラーのチューブリーク検査方法及び検査装置
JPH11316881A (ja) * 1998-03-06 1999-11-16 Omron Corp 防犯センサ
JP2000121425A (ja) * 1998-10-15 2000-04-28 Tlv Co Ltd 振動状態検出装置
JP2003042835A (ja) * 2001-07-30 2003-02-13 Nsk Ltd センサ及びセンサ付軸受装置
JP2010043951A (ja) * 2008-08-12 2010-02-25 Tlv Co Ltd 弁類の作動状態検出装置
JP2010043950A (ja) * 2008-08-12 2010-02-25 Tlv Co Ltd 弁類の作動状態検出装置
JP2012208083A (ja) * 2011-03-30 2012-10-25 Anritsu Sanki System Co Ltd 計量装置
JP2014228471A (ja) * 2013-05-24 2014-12-08 能美防災株式会社 構造物劣化診断システム

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JPH0755553A (ja) * 1993-08-12 1995-03-03 Toshiba Corp 測定器
JPH11173833A (ja) * 1997-12-09 1999-07-02 Canon Inc 部品の自動認識装置およびこれを用いた電子機器

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5135151U (fr) * 1974-09-06 1976-03-16
JPS5561258A (en) * 1978-10-30 1980-05-08 Toshiba Corp Apparatus for monitoring vibration at end of stator winding for rotary electric machine
JPS59190473A (ja) * 1983-04-11 1984-10-29 Nissan Motor Co Ltd デイ−ゼル機関の燃料噴射時期検出装置
JPS6284719U (fr) * 1985-11-15 1987-05-29
JPH05187604A (ja) * 1992-01-14 1993-07-27 Kyushu Electric Power Co Inc ボイラーのチューブリーク検査方法及び検査装置
JPH11316881A (ja) * 1998-03-06 1999-11-16 Omron Corp 防犯センサ
JP2000121425A (ja) * 1998-10-15 2000-04-28 Tlv Co Ltd 振動状態検出装置
JP2003042835A (ja) * 2001-07-30 2003-02-13 Nsk Ltd センサ及びセンサ付軸受装置
JP2010043951A (ja) * 2008-08-12 2010-02-25 Tlv Co Ltd 弁類の作動状態検出装置
JP2010043950A (ja) * 2008-08-12 2010-02-25 Tlv Co Ltd 弁類の作動状態検出装置
JP2012208083A (ja) * 2011-03-30 2012-10-25 Anritsu Sanki System Co Ltd 計量装置
JP2014228471A (ja) * 2013-05-24 2014-12-08 能美防災株式会社 構造物劣化診断システム

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