WO2017206531A1 - 制造oled面板的方法 - Google Patents

制造oled面板的方法 Download PDF

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Publication number
WO2017206531A1
WO2017206531A1 PCT/CN2017/072182 CN2017072182W WO2017206531A1 WO 2017206531 A1 WO2017206531 A1 WO 2017206531A1 CN 2017072182 W CN2017072182 W CN 2017072182W WO 2017206531 A1 WO2017206531 A1 WO 2017206531A1
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Prior art keywords
substrate
oled
oled panel
glass
manufacturing
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PCT/CN2017/072182
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English (en)
French (fr)
Inventor
杨涛
宋伟
李增红
陈芃
刘琳
张永红
佟玲
刘耀荣
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/550,755 priority Critical patent/US10476041B2/en
Priority to EP17746363.5A priority patent/EP3279965A4/en
Publication of WO2017206531A1 publication Critical patent/WO2017206531A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the present disclosure relates to a method of fabricating an OLED (Organic Light-Emitting Device) panel, and more particularly to a method of fabricating a narrow bezel OLED panel.
  • OLED Organic Light-Emitting Device
  • OLED display panel As a new type of display panel, OLED display panel has the advantages of active illumination, good temperature characteristics, low power consumption, fast response, flexibility, ultra-thin and low cost, and has been widely used in display devices.
  • the process of fabricating an OLED panel includes: firstly fabricating a larger-sized OLED motherboard, the OLED motherboard including a plurality of OLED panel regions spaced apart from each other, each OLED panel region including a display region and a glass located at a periphery of the display region The glue package area; the motherboard is then cut along a cutting line between the respective OLED panel areas to obtain an OLED panel of the desired size.
  • the resulting OLED panel includes a display area and a bezel area other than the display area.
  • the frame area is mainly used for implementing auxiliary functions such as panel packaging. Therefore, for the sake of aesthetics, cost, etc., it is theoretically desirable that the smaller the frame is, the better the narrow bezel design is achieved.
  • the above conventional method of fabricating an OLED panel cannot further reduce the width of the frame region of the finally obtained OLED panel.
  • the narrow border is also encountered by reducing the width of the glass plastic package area.
  • a method of fabricating an OLED panel comprising the steps of:
  • OLED mother board Forming an OLED mother board, the OLED mother board comprising a plurality of OLED panel regions spaced apart from each other, each OLED panel region comprising a display area and a glass glue package area located at a periphery of the display area;
  • the OLED motherboard is diced along a dicing line to obtain a separate OLED panel, wherein the dicing line is located within the glazing sealing region and at a predetermined distance inward from a peripheral edge of the glazing encapsulation region.
  • the predetermined distance is not more than 150 ⁇ m.
  • the predetermined distance is 100 ⁇ m.
  • the thickness of the glass paste at 100 ⁇ m inward from the peripheral edge of the glass paste package region is 5 to 6.5 ⁇ m.
  • the thickness of the glass paste at 100 ⁇ m inward from the peripheral edge of the glass paste package region is 5.5 ⁇ m.
  • the glass paste package region has a width of 350 to 600 ⁇ m.
  • step S2 the OLED mother board is cut using a cutter wheel to obtain a separated OLED panel.
  • the speed of the cutter wheel cutting is in the range of 100-300 mm/s.
  • the method further includes the steps of:
  • the glass glue is preheated along the cutting line.
  • the glass paste is preheated using a laser.
  • the step of fabricating an OLED motherboard includes:
  • first substrate and a second substrate wherein one of the first substrate and the second substrate is an OLED substrate, and the other of the first substrate and the second substrate is a package substrate, and both the first substrate and the second substrate All are provided with a glass plastic packaging area;
  • the cured glass paste bonds the first substrate and the second substrate together to produce an OLED mother board.
  • FIG. 1 is a schematic view showing a cutting step of a method of fabricating an OLED panel
  • FIG. 2 is a flow chart of a method of fabricating an OLED panel, in accordance with one embodiment of the present disclosure
  • 3(a) is a schematic view showing a portion of a step of fabricating an OLED motherboard of a method of fabricating an OLED panel, in accordance with an embodiment of the present disclosure
  • 3(b) is a schematic view showing another portion of a step of fabricating an OLED motherboard of a method of fabricating an OLED panel according to an embodiment of the present disclosure
  • FIG. 4 is a schematic structural view of an OLED mother board fabricated according to a method of an embodiment of the present disclosure
  • FIG. 5 is a schematic view showing a cutting step of a method of fabricating an OLED panel according to an embodiment of the present disclosure
  • FIG. 6 is a flow chart of a method of fabricating an OLED panel, in accordance with another embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram showing preheating and cutting steps of a method of fabricating an OLED panel, in accordance with an embodiment of the present disclosure.
  • FIG. 1 is a schematic view showing a cutting step of a method of fabricating an OLED panel. It should be understood that only a portion of the larger sized OLED motherboard is shown in FIG.
  • the OLED motherboard generally includes a plurality of OLED panel regions spaced apart from each other, each OLED panel region including a display region and a glass-glue encapsulation region located at a periphery of the display region. In the embodiment shown in Figure 1, only one OLED panel region of an OLED motherboard is shown schematically.
  • one OLED panel area of the OLED mother board 4 includes a glass glue package area 1 and a display area 2, and the glass glue package area 1 is located at the periphery of the display area 2.
  • the OLED mother board 4 can be cut along the cutting line L, and the distance of the cutting line L from the glass glue package area 1 of the display panel is X. Specifically, the cutting line L is located outside the glass glue package area 1 and the distance from the peripheral edge 6 of the glass glue package area 1 is X.
  • one solution is to reduce the distance X between the cutting line L and the glass paste package area 1.
  • the distance X between the cutting line L and the glass-encapsulated area 1 is already small, reaching the limit of the device, and the narrower frame cannot be realized by further reducing the distance X.
  • Another solution is to reduce the width of the glass glue package 1 itself.
  • the width of the glass plastic packaging area is too narrow, which may cause the reliability of the OLED panel to be unsatisfactory. Therefore, the narrow border is also encountered by reducing the width of the glass plastic packaging area.
  • FIG. 2 is a flow chart of a method of fabricating an OLED panel according to an embodiment of the present disclosure
  • FIG. 3(a) is a diagram showing a portion of a step of fabricating an OLED motherboard of a method of fabricating an OLED panel according to an embodiment of the present disclosure.
  • 3(b) is a schematic view showing another part of the step of fabricating an OLED motherboard in a method of fabricating an OLED panel according to an embodiment of the present disclosure
  • FIG. 4 is a structure of an OLED mother board fabricated according to a method of an embodiment of the present disclosure. Schematic; and FIG.
  • FIG. 5 is a schematic diagram showing a cutting step of a method of fabricating an OLED panel in accordance with an embodiment of the present disclosure. A method of fabricating an OLED panel in accordance with an exemplary embodiment of the present disclosure is described below with reference to FIGS. 2-5.
  • the method of fabricating an OLED panel may include the steps of:
  • the OLED mother board includes a plurality of OLED panel areas spaced apart from each other, each OLED panel area including a display area and a glass glue package area located at a periphery of the display area;
  • step S1 the step of fabricating the OLED motherboard may include:
  • the cured glass paste bonds the first substrate and the second substrate together to produce an OLED mother board.
  • the first substrate may be an OLED substrate
  • the second substrate may be a package substrate.
  • the glass paste may be applied to the package area of the OLED substrate other than the display area by printing or the like, or may be coated in a corresponding package area on the package substrate.
  • the first substrate and the second substrate are aligned and bonded together.
  • the laser is irradiated on the first substrate or the second substrate at a position corresponding to the glass-glue encapsulation region, so that the glass paste is melt-solidified, thereby bonding the first substrate and the second substrate together, thereby realizing the first substrate and the second substrate.
  • the substrate is packaged and formed into an OLED mother board.
  • step S1 the first substrate 31 and the second substrate 32 are formed.
  • One of the first substrate 31 and the second substrate 32 may be an OLED substrate, and the other of the first substrate 31 and the second substrate 32 may be a package substrate, and both the first substrate 31 and the second substrate 32 are provided with Glass glue package area 10.
  • a glass paste 34 is coated on the glass paste package region 10 on one of the first substrate 31 and the second substrate 32.
  • the first substrate 31 and the second substrate 32 are aligned and bonded together, and then the glass paste 34 is melt-solidified to bond the first substrate 31 and the second substrate 32 together to form an OLED. Mother board 30.
  • the OLED motherboard 30 includes a plurality of OLED panel regions 40 spaced apart from each other, each OLED panel region 40 including a display region 20 and a glass-glue encapsulation region 10 located at the periphery of the display region, as shown in FIG.
  • the OLED motherboard may be cut using a cutter wheel to obtain a separate OLED panel.
  • the speed of the cutter wheel cutting can be selected in the range of 100-300 mm/s.
  • FIG. 5 is a schematic view showing a cutting step of a method of fabricating an OLED panel according to an embodiment of the present disclosure.
  • the display panel region 40 includes a glass glue package area 10 and a display area 20.
  • the OLED mother board 30 is cut along the cutting line L1, and the cutting line L1 is located in the glass-glue encapsulating area 10 and at a predetermined distance d from the peripheral edge 12 of the glass-glue encapsulating area 10.
  • "Inward” herein means in the direction toward the display area 20.
  • the glass glue package area 10 is shown on both sides of the display area 20 in FIGS. 4 and 5, the glass glue package area 10 may surround the display area 20.
  • the degree of curing between the glass glue and the glass substrate is different at different positions of the glass glue package area, and the thickness of the glass glue is also different, resulting in different stress levels at different positions on the glass substrate. Therefore, by selecting the cutting at the predetermined position of the glass paste, the cutting failure and the package failure can be avoided.
  • the inventors have found that when the predetermined distance d is not more than 150 ⁇ m, it is possible to satisfy the requirements of the package performance of the OLED panel while achieving a good cutting effect.
  • the thickness of the glass paste at 100 ⁇ m inward from the peripheral edge 12 of the glass paste package region 10 is between 5 and 6.5 ⁇ m, particularly at a thickness of 5.5 ⁇ m, a desired cutting effect can be obtained and Packaging effect.
  • the width of the glass-glue package region 10 may be selected to be 350-600 ⁇ m.
  • the OLED panel manufactured in the above embodiment was subjected to a reliability test, and the test results are shown in Table 1 below.
  • the PCT test refers to testing the water vapor packaging performance of the OLED panel under the specific conditions of high temperature, humidity and high pressure.
  • the THS test refers to testing the moisture sealing performance of the OLED panel under the specific conditions of high temperature and humidity, and the peeling test (peel off test) It is to test the maximum load (kgf) when the upper and lower substrates of the OLED panel are peeled off simultaneously by applying a special device to the upper and lower sides of the OLED panel after the adhesive is applied to the four corners of the OLED panel and waiting for 24 hours.
  • the cutting is performed on the glass-glue encapsulation area, the size of the bezel area of the display panel can be greatly reduced, and the requirement of the narrow bezel can be realized; meanwhile, the cutting line is located The peripheral edge of the glass glue package area is at a predetermined distance inward, which can effectively reduce the cutting defects and meet the reliability requirements of the display panel.
  • the degree of curing of the edge portion and the central portion of the glass-adhesive encapsulation area is different, the edge portion is less cured, the thickness of the glass paste is thinner, and the stress in the glass substrate is small. Therefore, the glass-glue encapsulation area can be selected.
  • the peripheral edge is cut at a predetermined distance inward. Moreover, the predetermined distance may vary depending on the manner in which the glass glue is applied, the curing method, and the like.
  • the method may further include the step of: S12: preheating the glass glue along the cutting line L1.
  • the glass paste can be preheated by a laser.
  • the internal stress generated in the glass substrate at the time of curing the glass paste can be eliminated in advance, so that the cutting defects can be effectively reduced at the time of cutting, and the reliability of the display panel can be satisfied.
  • 6 is a flow chart of a method of fabricating an OLED panel according to this embodiment of the present disclosure
  • FIG. 7 is a schematic view showing a preheating and cutting step of a method of fabricating an OLED panel according to this embodiment of the present disclosure.
  • the method of fabricating an OLED panel can include the steps of:
  • OLED mother board includes a plurality of OLED panel areas spaced apart from each other, each OLED panel area comprising a display area and a glass glue package area located at a periphery of the display area;
  • S12 pre-heating the glass glue along the cutting line, wherein the cutting line is located in the glass glue package area and is at a predetermined distance inward from a peripheral edge of the glass glue package area;
  • Figure 7 shows a partial cross-sectional view of an OLED mother board cut along a glass glue package area.
  • the glass glue 73 is preheated by a laser along the cutting line from the side of the first substrate 71 under the OLED mother board 70, and the arrow H indicates the direction of laser heating.
  • the OLED panel is cut along the cutting line by the cutter wheel 76 on the second substrate 72 above the OLED mother board 70, and the arrow C indicates the direction in which the cutter wheel 76 is cut.
  • the first substrate 71 is, for example, an OLED substrate
  • the second substrate 72 is, for example, a package substrate, or the first substrate 71 is a package substrate
  • the second substrate 72 is an OLED substrate.
  • the OLED panel produced by the above method was subjected to PCT test, THS test and peel test similar to Table 1. It was verified that the OLED panel can meet the package performance requirements, and the cutting effect is good, therefore, the product reliability meets the requirements.
  • FIG. 6 and FIG. 7 may be the same as the embodiment shown in FIG. 2-5, and details are not described herein again.
  • the method for fabricating an OLED display panel according to various embodiments of the present disclosure can meet the reliability requirements such as product packaging performance and cutting performance while achieving a narrow bezel.

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Abstract

一种制造OLED面板的方法，包括步骤：制作OLED母板（4），OLED母板包括相互间隔开的多个OLED面板区，每个OLED面板区包括显示区（2）和位于显示区外围的玻璃胶封装区（1）；以及沿切割线（L）对OLED母板进行切割以得到分离的OLED面板，其中，切割线位于玻璃胶封装区上且距离玻璃胶封装区的外围边缘向内预定距离（d）处。

Description

制造OLED面板的方法
本申请要求于2016年6月3日递交中国专利局的、申请号为201610390929.9的中国专利申请的权益，该申请的全部公开内容以引用方式并入本文。
技术领域
本公开涉及一种制造OLED(Organic Light-Emitting Device)面板的方法，尤其涉及一种制造窄边框OLED面板的方法。
背景技术
OLED显示面板作为一种新型的显示面板，具备主动发光、温度特性好、功耗小、响应快、可弯曲、超轻薄和成本低等优点，已广泛应用于显示设备中。
通常，制作OLED面板的过程包括：首先制作较大尺寸的OLED母板，所述OLED母板包括相互间隔开的多个OLED面板区，每个OLED面板区包括显示区和位于显示区外围的玻璃胶封装区；然后沿各个OLED面板区之间的切割线对母板进行切割以得到所需尺寸的OLED面板。最终得到的OLED面板包括显示区和除显示区以外的边框区。
由于OLED面板的显示功能主要通过显示区来实现，边框区主要用于实现面板封装等辅助功能。因此，出于美观、成本等考虑，理论上希望边框越小越好，即实现窄边框设计。但是，由于设备的局限性，上述常规的制作OLED面板的方法无法进一步减小最终得到的OLED面板的边框区的宽度。并且，为了保证OLED面板的信赖性达标，通过减小玻璃胶封装区的宽度来实现窄边框也遇到了障碍。
发明内容
根据本公开的一方面，提供一种制造OLED面板的方法，包括步骤：
制作OLED母板，所述OLED母板包括相互间隔开的多个OLED面板区，每个OLED面板区包括显示区和位于显示区外围的玻璃胶封装区；以及
沿切割线对所述OLED母板进行切割以得到分离的OLED面板，其中，所述切割线位于所述玻璃胶封装区内且距离所述玻璃胶封装区的外围边缘向内预定距离处。
根据本公开的一个实施例，在上述制造OLED面板的方法中，所述预定距离不大于150μm。
根据本公开的一个具体实施例，在上述制造OLED面板的方法中，所述预定距离为100μm。
根据本公开的一个实施例，在上述制造OLED面板的方法中，在距离所述玻璃胶封装区的外围边缘向内100μm处的玻璃胶的厚度为5-6.5μm。
根据本公开的一个实施例，在上述制造OLED面板的方法中，在距离所述玻璃胶封装区的外围边缘向内100μm处的玻璃胶的厚度为5.5μm。
根据本公开的一个实施例，在上述制造OLED面板的方法中，玻璃胶封装区的宽度为350-600μm。
根据本公开的一个实施例，在上述制造OLED面板的方法中，在步骤S2中，采用刀轮对所述OLED母板进行切割以得到分离的OLED面板。
根据本公开的一个实施例，在上述制造OLED面板的方法中，刀轮切割的速度在100-300mm/s范围内。
根据本公开的一个实施例，在上述制造OLED面板的方法中，在沿切割线对所述OLED母板进行切割的步骤之前，还包括步骤：
沿切割线对玻璃胶进行预加热。
根据本公开的一个实施例，在上述制造OLED面板的方法中，采用激光对玻璃胶进行预加热。
根据本公开的一个实施例，在上述制造OLED面板的方法中，所述制作OLED母板的步骤包括：
制作第一基板和第二基板，其中，第一基板和第二基板中的一个为OLED基板，第一基板和第二基板中的另一个为封装基板，并且第一基板和第二基板两者都设置有玻璃胶封装区；
在第一基板和第二基板至少之一上的玻璃胶封装区上涂布玻璃胶；
将第一基板和第二基板对位贴合在一起；以及
固化玻璃胶将第一基板和第二基板结合在一起，以制出OLED母板。
附图说明
为了使本公开的目的、特征及优点能更加明显易懂，下面结合附图和具体实施例对本公开作进一步说明。
图1是示出一种制作OLED面板的方法的切割步骤的示意图；
图2是根据本公开的一个实施例的制作OLED面板的方法的流程图；
图3(a)是示出根据本公开的实施例的制作OLED面板的方法的制作OLED母板步骤的一部分的示意图；
图3(b)是示出根据本公开的实施例的制作OLED面板的方法的制作OLED母板步骤的另一部分的示意图；
图4是根据本公开的实施例的方法制作的OLED母板的结构示意图；
图5是示出根据本公开实施例的制作OLED面板的方法的切割步骤的示意图；
图6是根据本公开的另一个实施例的制作OLED面板的方法的流程图；以及
图7是示出根据本公开实施例的制作OLED面板的方法的预热和切割步骤的示意图。
具体实施方式
在下面的详细描述中，为便于解释，阐述了许多具体的细节以提供对本披露实施例的全面理解。然而明显地，一个或多个实施例在没有这些具体细节的情况下也可以被实施。在其他情况下，公知的结构和装置以图示的方式体现以简化附图。另外，说明书中所采用的表述“……设置在……上”可以是一部件设置在另一部件的直接上方，也可能是一部件设置在另一部件的上方，并且在两个部件之间存在中间层。
需要注意的是，附图中各个部件并不是按照真实比例绘制的，其仅用于示意说明本公开的技术方案。
图1是示出了一种制作OLED面板的方法的切割步骤的示意图。应该理解的是，图1中仅示出了较大尺寸的OLED母板的一部分。OLED母板一般包括相互间隔开的多个OLED面板区，每个OLED面板区包括显示区和位于显示区外围的玻璃胶封装区。在图1示出的实施例中，仅示意性地示出了OLED母板的一个OLED面板区。如图1所示，OLED母板4的一个OLED面板区包括玻璃胶封装区1和显示区2，玻璃胶封装区1位于显示区2的外围。可以沿切割线L对OLED母板4进行切割，切割线L距离显示面板的玻璃胶封装区1的距离为X。具体地，切割线L位于玻璃胶封装区1外，且距离玻璃胶封装区1的外围边缘6的距离为X。
通常，为了减小最终制作的OLED面板的边框区，一种方案是减小切割线L与玻璃胶封装区1之间的距离X。但是，由于设备的局限性，目前切割线L与玻璃胶封装区1之间的距离X已经很小，达到了设备的极限，无法通过进一步减小距离X来实现更窄的边框。另一种方案是减小玻璃胶封装区1本身的宽度。但是，玻璃胶封装区宽度太窄，会导致OLED面板的信赖性不达标，因此通过减小玻璃胶封装区的宽度来实现窄边框也遇到了障碍。
为此，本公开提出了另一种制作OLED面板的方法，如图2-5所示。图2是根据本发明本公开的一个实施例的制作OLED面板的方法的流程图；图3(a)是示出根据本公开实施例的制作OLED面板的方法的制作OLED母板步骤的一部分的示意图；图3(b)是示出根据本公开实施例的制作OLED面板的方法的制作OLED母板步骤的另一部分的示意图；图4是根据本公开实施例的方法制作的OLED母板的结构示意图；并且图5是示出根据本公开实施例的制作OLED面板的方法的切割步骤的示意图。以下参照图2-5说明根据本公开的一个示例性实施例的制作OLED面板的方法。
如图2所示，制作OLED面板的方法可以包括步骤：
S1：制作OLED母板，所述OLED母板包括相互间隔开的多个OLED面板区，每个OLED面板区包括显示区和位于显示区外围的玻璃胶封装区；以及
S2：沿切割线对所述OLED母板进行切割以得到分离的OLED面板，其中，所述切割线位于所述玻璃胶封装区内且距离所述玻璃胶封装区的外围边缘向内预定距离处。
在一个示例中，在步骤S1中，制作OLED母板的步骤可以包括：
制作第一基板和第二基板；
在第一基板和第二基板之一上的玻璃胶封装区上涂布玻璃胶，
将第一基板和第二基板对位贴合在一起；以及
固化玻璃胶将第一基板和第二基板结合在一起，以制出OLED母板。
这里，第一基板可以是OLED基板，第二基板可以是封装基板。玻璃胶可以通过印刷等方式涂覆在OLED基板上除显示区以外的封装区域中，也可以涂覆在封装基板上的对应封装区域中。涂覆好玻璃胶之后，将第一基板和第二基板对准并贴合在一起。之后，在第一基板或第二基板上对应玻璃胶封装区的位置照射激光，使得玻璃胶熔融固化，从而将第一基板和第二基板结合在一起，这样就实现了第一基板和第二基板的封装，并形成OLED母板。
如图3(a)所示，在步骤S1中，制作第一基板31和第二基板32。第一基板31和第二基板32中的一个可以为OLED基板，第一基板31和第二基板32中的另一个可以为封装基板，并且第一基板31和第二基板32两者都设置有玻璃胶封装区10。在第一基板31和第二基板32之一上的玻璃胶封装区10上涂布玻璃胶34。如图3(b)所示，将第一基板31和第二基板32对位贴合在一起，然后熔融固化玻璃胶34将第一基板31和第二基板32结合在一起，以制出OLED母板30。这样，OLED母板30包括相互间隔开的多个OLED面板区40，每个OLED面板区40包括显示区20和位于显示区外围的玻璃胶封装区10，如图4所示。
在步骤S2中，可以采用刀轮对OLED母板进行切割以得到分离的OLED面板。刀轮切割的速度可以在100-300mm/s范围内选择。
图5是示出根据本公开实施例的制作OLED面板的方法的切割步骤的示意图。结合图4和图5，显示面板区40包括玻璃胶封装区10和显示区20。在步骤S2中，沿切割线L1对OLED母板30进行切割，切割线L1位于玻璃胶封装区10内并且距离玻璃胶封装区10的外围边缘12向内预定距离d处。此处的“向内”意指沿朝向显示区20的方向。虽然图4和5中示出玻璃胶封装区10位于显示区20两侧，但是，玻璃胶封装区10可以围绕在显示区20的周围。
经实验发现，对切割线L1位置的选择将极大地影响切割效果和封装效果。当在距离玻璃胶封装区10的外围边缘12向内预定距离d处进行切割时，能够保证切割效果 和封装效果。而在其它位置进行切割则会在例如玻璃基板的第一基板和/或第二基板上出现严重裂纹、破损、无法切断等现象，并且不能满足封装测试要求。
可能的原因是，在玻璃胶封装区的不同位置处，玻璃胶与玻璃基板之间的固化程度不同，并且玻璃胶的厚度也不同，从而导致玻璃基板上不同位置处的应力大小不同。因此，通过选择在玻璃胶的预定位置处进行切割，能够避免切割失败和封装失败。
根据一个实施例，发明人发现，当所述预定距离d不大于150μm时，能够在实现良好的切割效果的同时，满足OLED面板封装性能的要求。
根据另一个实施例，在距离玻璃胶封装区10的外围边缘12向内100μm处进行切割时，即当所述预定距离d为100μm时，能够获得更好的切割效果和封装效果。
进一步地，在距离所述玻璃胶封装区10的外围边缘12向内100μm处的玻璃胶的厚度在5-6.5μm之间时，特别是在厚度为5.5μm时，能够获得理想的切割效果和封装效果。
根据另一个实施例，玻璃胶封装区10的宽度(在图5中由“W”示出)可以选择为350-600μm。
对上述实施例制造的OLED面板进行信赖性测试，测试结果如下表1所示。
其中，PCT测试是指在高温、潮湿、高压的特定条件下测试OLED面板的水汽封装性能，THS测试是指在高温、潮湿的特定条件下测试OLED面板的水汽封装性能，剥离测试(peel off测试)是测试在OLED面板的四角上下粘胶并且等待24h后，使用专用装置在OLED面板上下方向上同时施力，OLED面板的上下基板剥离时的最大载荷(kgf)。
表1 OLED面板信赖性测试
Figure PCTCN2017072182-appb-000001
通过上述表1可以看出，在所有测试中，OLED面板的封装性能良好，信赖性满足要求。同时，切割过程中OLED面板切断性好，切割断面肋状纹均匀，无明显裂纹。
因此，根据本公开的上述各实施例的制造OLED面板的方法，由于在玻璃胶封装区上进行切割，能够大幅减小显示面板的边框区的尺寸，实现窄边框的要求；同时，切割线位于所述玻璃胶封装区的外围边缘向内预定距离处，能够有效地减小切割缺陷，满足显示面板的信赖性要求。
应该理解的是，玻璃胶封装区的边缘部分和中心部分固化程度差别较大，边缘部分固化程度较小，玻璃胶厚度较薄，玻璃基板中应力较小，因此，可以选择从玻璃胶封装区的外围边缘向内预定距离处进行切割。并且，根据不同的玻璃胶涂覆方式和固化方式等，上述预定距离可能会有所不同。
根据本公开的另一个实施例，为了进一步保证切割效果和封装效果，在图2所示的OLED母板切割步骤S2之前，还可以包括步骤：S12：沿切割线L1对玻璃胶进行预加热。
具体地，可以采用激光对玻璃胶进行预加热。这样，能够预先消除在固化玻璃胶时在玻璃基板中产生的内应力，从而在切割时能够有效地减小切割缺陷，满足显示面板的信赖性要求。图6是根据本公开的该实施例的制作OLED面板的方法的流程图；以及图7是示出根据本公开的该实施例的制作OLED面板的方法的预热和切割步骤的示意图。
这样，如图6所示，制作OLED面板的方法可以包括步骤：
S1：制作OLED母板，所述OLED母板包括相互间隔开的多个OLED面板区，每个OLED面板区包括显示区和位于显示区外围的玻璃胶封装区；
S12：沿切割线对玻璃胶进行预加热，其中，所述切割线位于所述玻璃胶封装区内且距离所述玻璃胶封装区的外围边缘向内预定距离处；以及
S2：沿所述切割线对所述OLED母板进行切割以得到分离的OLED面板。
图7示出了沿玻璃胶封装区切割的OLED母板的部分截面图。如图7所示，在制作好OLED母板之后，首先，在OLED母板70的下方从第一基板71一侧沿切割线采用激光对玻璃胶73进行预加热，箭头H表示激光加热的方向。然后，在OLED母板70的上方在第二基板72上采用刀轮76沿切割线对OLED面板进行切割，箭头C表示刀轮76切割的方向。第一基板71例如为OLED基板，第二基板72例如为封装基板，或者第一基板71为封装基板，第二基板72为OLED基板。这样，通过在切割之前对玻璃胶进行预加热，可以预先消除在玻璃基板中可能存在的内应力，从而在切割时能够有效地减小切割缺陷，满足显示面板的信赖性要求。
对通过上述方法制作的OLED面板进行类似表1的PCT测试、THS测试和剥离测试，经验证OLED面板均能满足封装性能要求，并且切割效果良好，因此，产品信赖性满足要求。
图6和图7的实施例的其它方面可以与图2-5所示的实施例相同，在此不再赘述。
综上所述，根据本公开各实施例的OLED显示面板的制作方法，在实现窄边框的同时，能够满足产品封装性能、切割性能等信赖性要求。
上述实施例仅例示性的说明了本公开的原理及构造，而非用于限制本公开，本领域的技术人员应明白，在不偏离本公开的总体构思的情况下，对本公开所作的任何改变和改进都在本发明的范围内。本发明的保护范围，应如本申请的权利要求书所界定的范围为准。应注意，措词“包括”不排除其它元件或步骤，措词“一”或“一个”不排除多个。另外，权利要求的任何元件标号不应理解为限制本发明的范围。

Claims (11)

  1. 一种制造OLED面板的方法，包括步骤：
    制作OLED母板，所述OLED母板包括相互间隔开的多个OLED面板区，每个OLED面板区包括显示区和位于显示区外围的玻璃胶封装区；以及
    沿切割线对所述OLED母板进行切割以得到分离的OLED面板，其中，所述切割线位于所述玻璃胶封装区内且距离所述玻璃胶封装区的外围边缘向内预定距离处。
  2. 根据权利要求1所述的制造OLED面板的方法，其中，所述预定距离不大于150μm。
  3. 根据权利要求1所述的制造OLED面板的方法，其中，所述预定距离为100μm。
  4. 根据权利要求3所述的制造OLED面板的方法，其中，在距离所述玻璃胶封装区的外围边缘向内100μm处的玻璃胶的厚度为5-6.5μm。
  5. 根据权利要求3所述的制造OLED面板的方法，其中，在距离所述玻璃胶封装区的外围边缘向内100μm处的玻璃胶的厚度为5.5μm。
  6. 根据权利要求1-5任一项所述的制造OLED面板的方法，其中，玻璃胶封装区的宽度为350-600μm。
  7. 根据权利要求1所述的制造OLED面板的方法，其中，采用刀轮对所述OLED母板进行切割以得到分离的OLED面板。
  8. 根据权利要求7所述的制造OLED面板的方法，其中，刀轮切割的速度在100-300mm/s范围内。
  9. 根据权利要求1-5中任一项所述的制造OLED面板的方法，在沿切割线对所述OLED母板进行切割的步骤之前，还包括步骤：
    沿所述切割线对玻璃胶进行预加热。
  10. 根据权利要求9所述的制造OLED面板的方法，其中，采用激光对玻璃胶进行预加热。
  11. 根据权利要求1-10中任一项所述的制造OLED面板的方法，其中，所述制作OLED母板的步骤包括：
    制作第一基板和第二基板，其中，第一基板和第二基板中的一个为OLED基板，第一基板和第二基板中的另一个为封装基板，并且第一基板和第二基板两者都设置有玻璃胶封装区；
    在第一基板和第二基板至少之一上的玻璃胶封装区上涂布玻璃胶；
    将第一基板和第二基板对位贴合在一起；以及
    固化玻璃胶将第一基板和第二基板结合在一起，以制出OLED母板。
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