WO2017190347A1 - 具有焊球的封装结构及封装结构的制造方法 - Google Patents

具有焊球的封装结构及封装结构的制造方法 Download PDF

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Publication number
WO2017190347A1
WO2017190347A1 PCT/CN2016/081286 CN2016081286W WO2017190347A1 WO 2017190347 A1 WO2017190347 A1 WO 2017190347A1 CN 2016081286 W CN2016081286 W CN 2016081286W WO 2017190347 A1 WO2017190347 A1 WO 2017190347A1
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Prior art keywords
pad
reinforcing
solder ball
package
reinforcing structure
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PCT/CN2016/081286
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English (en)
French (fr)
Inventor
丁海幸
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华为技术有限公司
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to JP2018566623A priority Critical patent/JP6723389B2/ja
Priority to PCT/CN2016/081286 priority patent/WO2017190347A1/zh
Priority to CN201680025157.7A priority patent/CN107592942B/zh
Priority to KR1020187026040A priority patent/KR20180111972A/ko
Publication of WO2017190347A1 publication Critical patent/WO2017190347A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/46—Structure, shape, material or disposition of the wire connectors prior to the connecting process of a plurality of wire connectors

Definitions

  • the present application relates to a package structure having solder balls and a method of fabricating the package structure.
  • the package structure is provided with an array of solder balls, and the soldering is used to fix the package structure with other components such as a circuit board or a chip.
  • BGA Ball GridArray
  • the reliability of electronic products is also increasingly challenged, mainly in the fall resistance, Resistance to temperature cycling and temperature impact strength. That is to say, in the package structure of the prior art, the strength of the solder ball is also lowered due to the miniaturized design of the diameter of the solder ball, and the connection strength between the solder ball and the chip or the solder ball and the substrate is poor, and the solder joint is inferior. The reliability is low, and the solder joint is easily broken and failed, thereby affecting the reliability of the package structure and reducing the service life.
  • the technical problem to be solved by the embodiments of the present application is that the problem of poor solder ball strength is solved, the reliability of the electronic product packaging structure can be ensured, and the service life can be improved.
  • the present application discloses a package structure having a solder ball, including a package body, a pad, a reinforcing structure, and a solder ball.
  • the pad is disposed on a surface of the package body, and the solder ball is fixed at the The pad is connected to the pad and buried in the solder ball to enhance the connection strength between the solder ball and the pad.
  • the application strengthens the structure buried in the solder ball by the reinforcing structure, so that the connection strength between the solder ball and the package body is improved, and the reliability of the package structure is ensured.
  • the solder ball is cracked, most of the area of the reinforcing structure is strengthened. Still able to stay connected to the solder balls. Therefore, the present application solves the problem that the package structure fails after the solder ball is cracked in the prior art, and can maintain the conduction between the package structure and the motherboard pad.
  • the present application can increase the strength of the pad without increasing the size of the pad.
  • the design can satisfy both the miniaturization and high density design and the reliability operation environment.
  • the reinforcing structure is a metal wire structure
  • the reinforcing structure is formed on a surface of the pad by a process of a semiconductor bond alloy wire, and The inside of the solder ball is bent.
  • the metal wire in this embodiment may be a gold wire, that is, a process of soldering a gold wire.
  • the surface of the disc forms a reinforcing structure, and the gold wire not only has good strength, but also ensures the reliability of electrical connection and telecommunication transmission.
  • the reinforcing structure is a columnar structure.
  • the reinforcing structure can be realized by a method of locally thickening the pad or a technique of laser bumping.
  • the pad is disposed on a substrate (or a circuit board) of the package body. During the process of fabricating the substrate or the circuit board, the pad is formed while the pad is partially thickened to form a protrusion. Reinforced structure of the pad surface.
  • the reinforcing structure in the present embodiment may be disposed at a center position of the pad.
  • the number of the reinforcing structures is at least two, and the at least two reinforcing structures are disposed at intervals from each other. Said inside the solder ball. The increase in the number of reinforcing structures has led to an increase in the reliability of the package structure.
  • the reinforcing structure is the same as the material of the pad, and the reinforcing structure and the pad are One-piece structure. That is to say, the reinforcing structure and the pad are formed in the same process, which not only saves the manufacturing process, but also reduces the cost of the package body.
  • the present application provides a method of fabricating a package structure, including the following steps:
  • a ball is implanted on the surface of the pad to form a solder ball, and the reinforcing structure is buried within the solder ball.
  • the reinforcing structure is formed on a surface of the pad by a process of a semiconductor bond alloy wire, and after the step of implanting the ball, the reinforcing structure is The solder ball is bent inside.
  • solder ball is wrapped outside of the reinforcing structure by means of laser balling.
  • At least two of the reinforcing structures are fabricated in the process of making a reinforcing structure on the surface of the pad And causing the at least two of the reinforcing structures to be spaced apart from each other.
  • the reinforcing structure is a gold wire, and the length of the gold wire ranges from 0.2 to 0.3 mm.
  • the pad is locally thickened
  • the method fabricates the reinforcing structure on the surface of the pad.
  • the reinforcing structure is fabricated on the surface of the pad using a technique of laser welding bumps.
  • the reinforcing structure is a columnar structure.
  • At least two of the steps are made in the process of making a reinforcing structure on the surface of the pad
  • the structure is reinforced and the at least two of the reinforcing structures are spaced apart from each other.
  • FIG. 1 is a schematic diagram of a package structure with solder balls provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a package structure with solder balls provided by another embodiment of the present application.
  • FIG. 3 is a schematic view showing a state in which a solder ball is broken by mounting a package structure having a solder ball provided on the main board.
  • a package structure having solder balls includes a package body 10, pads 20, a reinforcing structure 30, and solder balls 40.
  • the package body 10 can be a BGA package chip or other type of chip.
  • the pad 20 is disposed on the surface of the package body 10. It can be understood that the package body 10 includes a substrate or a circuit board.
  • the pad 20 is disposed on the surface of the substrate or the circuit board, and the pad 20 can be protruded on the substrate or the circuit.
  • the surface of the board may also be provided with a groove on the substrate or the circuit board to place the pad 20 in the recess.
  • the surface and the base of the pad 20 The surface of the board or board is flush.
  • the reinforcing structure 30 is disposed on the surface of the pad 20, and the solder ball 40 is fixed to the pad 20, and therefore, the reinforcing structure 30 is connected to the pad 20 and buried in the solder ball 40.
  • the reinforcing structure 30 may be a metal material or a conductive material having electrical conductivity, and the strength and hardness of the reinforcing structure 30 are greater than the strength of the solder ball 40.
  • the connection strength between the solder ball 40 and the package body 10 is improved, and the reliability of the package structure is ensured.
  • the reinforcement is strengthened.
  • Most of the area of structure 30 is still capable of maintaining contact with solder balls 40. Therefore, the present application solves the problem that the package structure fails after the solder ball 40 is cracked in the prior art, and can maintain the conduction between the package structure and the pads on the main board. Moreover, the application does not need to increase the size of the pad 20, and the strength of the pad 20 can be improved. In the application of the high reliability product, both the miniaturization and high density design and the reliability operation environment can be satisfied.
  • the reinforcing structure 30 is a metal wire structure, and the reinforcing structure 30 is formed on a surface of the pad 20 by a process of a semiconductor bond alloy wire, and in the The solder ball 40 is bent inside.
  • the metal wire in this embodiment may be a gold wire, that is, a reinforcing structure 30 is formed on the surface of the pad 20 by a gold wire process, and the gold wire not only has good strength, but also ensures reliability of electrical connection and telecommunication transmission.
  • the reinforcing structure 30 is a columnar structure, and specifically may be a square column shape or a column shape.
  • the reinforcing structure 30 can be realized by a method of locally thickening the pad 20 or a technique of laser bumping.
  • the pad 20 is disposed on a substrate (or a circuit board) of the package body 10.
  • the pad 20 is formed while partially thickening the pad 20 to A reinforcing structure 30 protrudingly provided on the surface of the pad 20 is formed.
  • the reinforcing structure 30 in the present embodiment may be disposed at a center position of the pad 20.
  • the number of the reinforcing structures 30 is at least two, and the at least two reinforcing structures 30 are disposed inside the solder ball 40 at intervals from each other.
  • the increase in the number of reinforcing structures 30 has led to an increase in the reliability of the package structure.
  • the reinforcing structure 30 is the same material as the pad 20, and the reinforcing structure 30 and the pad 20 are of a unitary structure. That is to say, the reinforcing structure 30 and the pad 20 are formed in the same process, which not only saves the manufacturing process, but also helps to reduce the package body 10 . the cost of.
  • the present application also provides a method of fabricating a package structure, and the manufacturing method provided by the present application will be described with reference to the structures of FIGS. 1 and 2.
  • the manufacturing method of the package structure of the present application includes the following steps:
  • a reinforcing structure 30 is formed on the surface of the pad 20.
  • at least two of the reinforcing structures 30 are fabricated in the process of fabricating the reinforcing structure 30 on the surface of the pad 20, and the at least two The reinforcing structures 30 are spaced apart from each other; and
  • Balls are implanted on the surface of the pad 20 to form solder balls 40, and the reinforcing structures 30 are buried within the solder balls 40.
  • the present application fabricates the reinforcing structure 30 on the surface of the pad 20 by a process of a semiconductor bond alloy wire. After the ball implantation step, the reinforcing structure 30 is in the solder ball. 40 inside bends.
  • the reinforcing structure 30 is a gold wire, and the length of the gold wire ranges from 0.2 to 0.3 mm.
  • the present application encapsulates the solder balls 40 outside the reinforcing structure 30 by means of laser balling.
  • the present application uses the method of locally thickening the pad 20 to form the reinforcing structure 30 on the surface of the pad 20, or the technique of laser bumping the bump in the soldering.
  • the reinforcing structure 30 is fabricated on the surface of the disk 20.
  • FIG. 3 is a schematic view showing the mounting of the package structure having the solder ball of the present application to the main board 50.
  • the solder ball 40 is mounted on the surface of the main board 50. It can be understood that the surface of the main board 50 is soldered.
  • a disk (not shown) is used to flip the package structure of the present application with solder balls on the surface of the main board 50, and is connected to the pads on the main board 50 through the solder balls 40 to form an electrical connection between the main board and the package main body 10.
  • the present application improves the influence of cracking of the solder ball 40 on the electrical connection between the package body 10 and the main board 50, and can maintain the conduction between the package body 10 and the main board 50.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

一种具有焊球的封装结构及其制造方法，其中所述封装结构包括封装主体(10)、焊盘(20)、补强结构(30)及焊球(40)，所述焊盘(20)设置于所述封装主体(10)的表面，所述焊球(40)固定于所述焊盘(20)，所述补强结构(30)连接至焊盘(20)且内埋于所述焊球(40)中，以增强所述焊球(40)与所述焊盘(20)之间的连接强度。所述封装结构能够提升焊球与封装主体之间的连接强度，保证封装结构的可靠性。

Description

具有焊球的封装结构及封装结构的制造方法 技术领域
本申请涉及具有焊球的封装结构及封装结构的制造方法。
背景技术
现有技术中封装结构设有焊球阵列，通过焊过实现封装结构与其它元件(例如电路板或芯片)之间的固定。举例而言，BGA(Ball GridArray，焊球阵列封装)大量应用于电子产品。随着电子产品的功能越来越多，体积小型化发展趋势，焊球直径和焊球间距的越来越小，进而电子产品的可靠性也越来越受到挑战，主要表现在抗跌落强度、抗温度循环及温度冲击强度上。也就是说，现有技术中的封装结构中，由于焊球直径的小型化设计，使得焊球的强度也下降了，焊球与芯片或者焊球与基板之间的连接强度较差，焊点的可靠性低，焊点处容易断裂失效，从而影响封装结构的可靠性，降低使用寿命。
发明内容
本申请实施例所要解决的技术问题在于，解决了焊球强度差的问题，能够保证电子产品封装结构的可靠性，提升使用寿命。
第一方面，本申请公开一种具有焊球的封装结构，包括封装主体、焊盘、补强结构及焊球，所述焊盘设置于所述封装主体的表面，所述焊球固定于所述焊盘，所述补强结构连接至所述焊盘且内埋于所述焊球中，以增强所述焊球与所述焊盘之间的连接强度。
本申请通过补强结构内埋在焊球中的结构，使得焊球与封装主体之间的连接强度得到提升，保证封装结构的可靠性，当焊球发生开裂时，补强结构的大部分面积还是能够和焊球保持连接。因此本申请解决了现有技术中焊球开裂后导致封装结构失效的情况，能够保持封装结构和主板焊盘的导通。而且，本申请不需要增加焊盘的尺寸，就可以提升焊盘的强度，在高可靠性产品的应用上，既满足小型化高密的设计，又可以满足可靠性运行环境要求。
结合第一方面，在第一种可能的实施方式中，所述补强结构为金属线结构，所述补强结构通过半导体键合金线的工艺形成在所述焊盘的表面，并在所述焊球内蜿蜒弯折。本实施方式中的金属线可以为金线，即通过打金线的工艺在焊 盘表面形成补强结构，金线不但强度好，也能保证电连接和电信传输的可靠性。
结合第一方面，在第二种可能的实施方式中，所述补强结构为柱状结构。本实施方式中，补强结构可以通过将所述焊盘局部增厚的方法或者采用激光焊打凸点的技术实现。通常所述焊盘设置在封装主体的基板(或称之为电路板)上，在基板或电路板制作的过程中，形成焊盘的同时就将焊盘的局部增厚，以形成突出设置在焊盘表面的补强结构。具体而言，本实施方式中的补强结构可以设置在焊盘的中心位置处。
结合第一方面及上述任意一种可能的实施方式，在第三种可能的实施方式中，所述补强结构的数量为至少两个，所述至少两个补强结构彼此间隔地设置在所述焊球内。补强结构的数量增加有使得封装结构的可靠性得到提升。
结合第一方面及上述任意一种可能的实施方式，在第四种可能的实施方式中，所述补强结构与所述焊盘的材料相同，且所述补强结构与所述焊盘为一体式的结构。也就是说，补强结构与焊盘在同一个工艺过程中形成，不但节约了制作工序，也有利于降低封装主体的成本。
第二方面，本申请这提供一种封装结构的制造方法，包括如下步骤：
在封装主体的表面制作焊盘；
在焊盘的表面制作补强结构；及
在所述焊盘的表面植球，以形成焊球，且使得所述补强结构内埋于所述焊球内。
结合第二方面，在第一种可能的实施方式中，通过半导体键合金线的工艺在所述焊盘的表面制作所述补强结构，完成所述植球步骤后，所述补强结构在所述焊球内蜿蜒弯折。
结合第二方面或第二方面之第一种可能的实施方式，在第二种可能的实施方式中，使用激光植球的方式，将所述焊球包裹在所述补强结构外部。
结合第二方面或第二方面之上述任意一种可能的实施方式，在第三种可能的实施方式中，在焊盘的表面制作补强结构的过程中，制作至少两个所述补强结构，且使得所述至少两个所述补强结构彼此间隔。
结合第二方面或第二方面之上述任意一种可能的实施方式，在第四种可能的实施方式中，所述补强结构为金线，所述金线的长度范围为0.2～0.3mm。
结合第二方面，在第五种可能的实施方式中，采用将所述焊盘局部增厚的 方法在所述焊盘的表面制作所述补强结构。
结合第二方面，在第六种可能的实施方式中，采用激光焊打凸点的技术在所述焊盘的表面制作所述补强结构。
结合第二方面之第五种或第六种可能的实施方式，在第七种可能的实施方式中，所述补强结构为柱状结构。
结合第二方面之第五种或第六种或第七种可能的实施方式，在第八种可能的实施方式中，在焊盘的表面制作补强结构的过程中，制作至少两个所述补强结构，且使得所述至少两个所述补强结构彼此间隔。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请一种实施方式提供的具有焊球的封装结构的示意图。
图2是本申请另一种实施方式提供的具有焊球的封装结构的示意图。
图3是将本申请所提供的具有焊球的封装结构安装在主板上，焊球断裂状态的示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请涉及具有焊球的封装结构，请参阅图1和图2，具有焊球的封装结构包括封装主体10、焊盘20、补强结构30及焊球40。封装主体10可以为BGA封装芯片或其它类型的芯片。所述焊盘20设置于所述封装主体10的表面，可以理解为，封装主体10包括基板或电路板，焊盘20设于基板或电路板的表面，焊盘20可以突出设置在基板或电路板的表面，也可以在基板或电路板上设置凹槽，将焊盘20设置在凹槽中，本实施方式中，焊盘20的表面与基 板或电路板的表面齐平。补强结构30设于焊盘20的表面，所述焊球40固定于所述焊盘20，因此，所述补强结构30连接至所述焊盘20且内埋于所述焊球40中，以增强所述焊球40与所述焊盘20之间的连接强度。具体而言，通过在在焊盘20的表面设置补强结构30，补强结构30可以为金属材质或者具有导电性能的导电材料，补强结构30的强度和硬度均大于焊球40的强度。
本申请通过补强结构30内埋在焊球40中的结构，使得焊球40与封装主体10之间的连接强度得到提升，保证封装结构的可靠性，当焊球40发生开裂时，补强结构30的大部分面积还是能够和焊球40保持连接接触。因此本申请解决了现有技术中焊球40开裂后导致封装结构失效的情况，能够保持封装结构和主板上的焊盘的导通。而且，本申请不需要增加焊盘20的尺寸，就可以提升焊盘20的强度，在高可靠性产品的应用上，既满足小型化高密的设计，又可以满足可靠性运行环境要求。
一种实施方式中，如图1所示，所述补强结构30为金属线结构，所述补强结构30通过半导体键合金线的工艺形成在所述焊盘20的表面，并在所述焊球40内蜿蜒弯折。本实施方式中的金属线可以为金线，即通过打金线的工艺在焊盘20表面形成补强结构30，金线不但强度好，也能保证电连接和电信传输的可靠性。
另一种实施方式中，如图2所示，所述补强结构30为柱状结构，具体可以为方形柱状或圆柱状等。本实施方式中，补强结构30可以通过将所述焊盘20局部增厚的方法或者采用激光焊打凸点的技术实现。通常所述焊盘20设置在封装主体10的基板(或称之为电路板)上，在基板或电路板制作的过程中，形成焊盘20的同时就将焊盘20的局部增厚，以形成突出设置在焊盘20表面的补强结构30。具体而言，本实施方式中的补强结构30可以设置在焊盘20的中心位置处。
一种实施方式中，所述补强结构30的数量为至少两个，所述至少两个补强结构30彼此间隔地设置在所述焊球40内。补强结构30的数量增加有使得封装结构的可靠性得到提升。
一种实施方式中，所述补强结构30与所述焊盘20的材料相同，且所述补强结构30与所述焊盘20为一体式的结构。也就是说，补强结构30与焊盘20在同一个工艺过程中形成，不但节约了制作工序，也有利于降低封装主体10 的成本。
本申请还提供一种封装结构的制造方法，参照图1和图2的结构对本申请提供的制造方法进行描述。本申请封装结构的制造方法包括如下步骤：
在封装主体10的表面制作焊盘20；
在焊盘20的表面制作补强结构30，一种实施方式中，在焊盘20的表面制作补强结构30的过程中，制作至少两个所述补强结构30，且使得所述至少两个所述补强结构30彼此间隔；及
在所述焊盘20的表面植球，以形成焊球40，且使得所述补强结构30内埋于所述焊球40内。
一种实施方式中，本申请通过半导体键合金线的工艺在所述焊盘20的表面制作所述补强结构30，完成所述植球步骤后，所述补强结构30在所述焊球40内蜿蜒弯折。本实施方式中，所述补强结构30为金线，所述金线的长度范围为0.2～0.3mm。
进一步而言，本申请使用激光植球的方式，将所述焊球40包裹在所述补强结构30外部。
另一种实施方式中，本申请采用将所述焊盘20局部增厚的方法在所述焊盘20的表面制作所述补强结构30，或者采用激光焊打凸点的技术在所述焊盘20的表面制作所述补强结构30。
请参阅图3，图3所示为将本申请具有焊球的封装结构安装至主板50上的示意图，焊球40贴装在主板50的表面，可以理解的是，在主板50的表面设置焊盘(未图示)，将本申请具有焊球的封装结构倒装在主板50表面上，并通过焊球40与主板50上的焊盘连接，形成主板与封装主体10之间的电连接。当本申请具有焊球的封装结构遇到破坏性的冲击(例如跌落)时，由于内埋了补强结构30，当焊球40发生开裂时，图中焊球40用黑色表示，焊球中白色断层就是断裂区域A，补强结构30大部分面积还是能够和焊球40保持连接，而焊球40底部(即焊球40与封装主体10连接处)完全开裂的情况较少。因此本申请改善了焊球40开裂对封装主体10与主板50之间电连接的影响，能保持封装主体10与主板50之间的导通。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限 制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (14)

  1. 一种具有焊球的封装结构，其特征在于，包括封装主体、焊盘、补强结构及焊球，所述焊盘设置于所述封装主体的表面，所述焊球固定于所述焊盘，所述补强结构连接至所述焊盘且内埋于所述焊球中，以增强所述焊球与所述焊盘之间的连接强度。
  2. 如权利要求1所述的具有焊球的封装结构，其特征在于，所述补强结构为金属线结构，所述补强结构通过半导体键合金线的工艺形成在所述焊盘的表面，并在所述焊球内蜿蜒弯折。
  3. 如权利要求1所述的具有焊球的封装结构，其特征在于，所述补强结构为柱状结构。
  4. 如权利要求1-3任意一项所述的具有焊球的封装结构，其特征在于，所述补强结构的数量为至少两个，所述至少两个补强结构彼此间隔地设置在所述焊球内。
  5. 如权利要求1-4任意一项所述的具有焊球的封装结构，其特征在于，所述补强结构与所述焊盘的材料相同，且所述补强结构与所述焊盘为一体式的结构。
  6. 一种封装结构的制造方法，其特征在于，包括
    在封装主体的表面制作焊盘；
    在焊盘的表面制作补强结构；及
    在所述焊盘的表面植球，以形成焊球，且使得所述补强结构内埋于所述焊球内。
  7. 如权利要求6所述的封装结构的制造方法，其特征在于，通过半导体键合金线的工艺在所述焊盘的表面制作所述补强结构，完成所述植球步骤后，所述补强结构在所述焊球内蜿蜒弯折。
  8. 如权利要求7所述的封装结构的制造方法，其特征在于，使用激光植球的方式，将所述焊球包裹在所述补强结构外部。
  9. 如权利要求7-8任意一项所述的封装结构的制造方法，其特征在于，在焊盘的表面制作补强结构的过程中，制作至少两个所述补强结构，且使得所述至少两个所述补强结构彼此间隔。
  10. 如权利要求7-9任意一项所述的封装结构的制造方法，其特征在于，所述补强结构为金线，所述金线的长度范围为0.2～0.3mm。
  11. 如权利要求6所述的封装结构的制造方法，其特征在于，采用将所述焊盘局部增厚的方法在所述焊盘的表面制作所述补强结构。
  12. 如权利要求6所述的封装结构的制造方法，其特征在于，采用激光焊打凸点的技术在所述焊盘的表面制作所述补强结构。
  13. 如权利要求12或13所述的封装结构的制造方法，其特征在于，所述补强结构为柱状结构。
  14. 如权利要求11-13任意一项所述的封装结构的制造方法，其特征在于，在焊盘的表面制作补强结构的过程中，制作至少两个所述补强结构，且使得所述至少两个所述补强结构彼此间隔。
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